A double-layer liquid cooling plate for a data center server

Abstract

The present invention proposes a double-layer liquid cooling plate for a data center server, which relates to the field of liquid cooling and heat dissipation technology for data centers. The double-layer liquid cooling plate for a data center server comprises a housing, a cooling chamber formed within the housing, and a temperature equalizer disposed within the cooling chamber. The temperature equalizer divides the cooling chamber into a first cooling channel and a second cooling channel. The housing is provided with a liquid inlet and a liquid outlet. One end of the first cooling channel is connected to the liquid inlet, and the other end of the first cooling channel is connected to one end of the second cooling channel via a connecting port. The other end of the second cooling channel is connected to the liquid outlet. The first cooling channel is provided with a flow distribution structure and a microchannel structure. The flow distribution structure is connected to the liquid inlet, and the microchannel structure is disposed between the flow distribution structure and the connecting port. The second cooling channel is provided with a temperature equalizer. The double-layer liquid cooling plate for a data center server has greater heat exchange efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation of data centers, and in particular to a double-layer liquid cooling plate for a data center server. Background Art

[0002] Data centers house IT equipment such as computing, storage, and networking. These devices generate significant heat during operation, and to maintain proper operation, liquid cooling plates are now commonly used to cool servers. Currently, high-performance chips are widely used in data centers. These chips operate at higher speeds, but the high heat flux generated by these higher speeds poses challenges to chip thermal management and data center liquid cooling technology.

[0003] Microchannel liquid cooling plates have a high heat transfer coefficient and a significant cooling effect on electronic chips with high heat flux density. Therefore, they have been widely used in the liquid cooling field of data centers. However, traditional microchannel liquid cooling plates have problems such as high pressure drop and uneven temperature. Some patents have proposed some microchannel liquid cooling plate structures for use in the field of electronic component cooling. For example, patent CN219016929U designs a server liquid cooling plate structure, including a main body, a plurality of flow channels are provided on the main body, and the plurality of flow channels are arranged in parallel, and the flow channels pass through the main body from the end of the main body, and a partition rib is provided between two adjacent flow channels. However, the flow resistance of the flow channel of this cold plate structure is relatively large, and the flow channel turbulence effect is poor, and the heat dissipation efficiency is low. Patent CN212209693U also designs a liquid cold plate structure in the form of a stamped cold plate, comprising a lower base plate, an upper base plate, and a copper tube. The lower base plate has an S-shaped trough at the top and a long, partitioning hole on the right side. The copper tube is located within the S-shaped trough and the heating trough. The left end of the copper tube extending from the lower base plate is provided with a liquid inlet fitting, while the right end of the copper tube extending from the lower base plate is provided with a liquid outlet fitting. However, the flow channel length of this cold plate structure is relatively long, resulting in relatively high flow resistance, poor temperature uniformity of the cold plate, and weak flow disturbance effect, resulting in poor heat transfer performance.

[0004] In view of this, the inventor has designed a double-layer liquid cooling plate for a data center server based on many years of production and design experience in this field and related fields and after repeated experiments, in order to solve the problems existing in the prior art. Summary of the Invention

[0005] The object of the present invention is to provide a double-layer liquid cooling plate for a data center server, which has greater heat exchange efficiency and stronger heat exchange effect.

[0006] To achieve the above-mentioned objectives, the present invention proposes a double-layer liquid cooling plate for a data center server, wherein the double-layer liquid cooling plate for a data center server has a shell, a cooling cavity is formed in the shell, a temperature equalizing plate is provided in the cooling cavity, and the temperature equalizing plate divides the cooling cavity into a first cooling channel and a second cooling channel; a liquid inlet and a liquid outlet are provided on the shell, one end of the first cooling channel is connected to the liquid inlet, the other end of the first cooling channel is connected to one end of the second cooling channel through a connecting port, and the other end of the second cooling channel is connected to the liquid outlet, a flow distribution structure and a microchannel structure are provided in the first cooling channel, the flow distribution structure is connected to the liquid inlet, the microchannel structure is arranged between the flow distribution structure and the connecting port, and a temperature equalizing structure is provided in the second cooling channel.

[0007] Compared with the prior art, the present invention has the following characteristics and advantages:

[0008] The double-layer liquid cooling plate for data center servers proposed in this invention uses a temperature vapor chamber to divide the cooling chamber within the shell into a first and second parallel cooling channel, thus forming a double-layer structure. The cooling medium first flows through the first cooling channel and then returns to flow into the second cooling channel, effectively increasing the cooling medium's flow path and heat exchange efficiency. Heat in the first cooling channel is quickly transferred to the second cooling channel via the temperature vapor chamber, enhancing the heat dissipation of the double-layer liquid cooling plate for data center servers. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the various components in the drawings are merely illustrative and are used to help understand the present invention, and are not intended to specifically limit the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art can select various possible shapes and proportional dimensions to implement the present invention according to specific circumstances under the guidance of the present invention.

[0010] Figure 1 This is a working diagram of the double-layer liquid cooling plate for a data center server proposed by the present invention;

[0011] Figure 2 This is a schematic diagram of the assembly of a double-layer liquid cooling plate for a data center server in the present invention;

[0012] Figure 3 Schematic diagram of the structure of the upper cover plate of the present invention;

[0013] Figure 4 Schematic diagram of the structure of the temperature equalizing plate in the present invention;

[0014] Figure 5 Schematic diagram of the structure of the bottom substrate in the present invention.

[0015] Description of Reference Numerals

[0016] 100. Double-layer liquid cooling plate for data center servers;

[0017] 10. Housing;

[0018] 11. Liquid inlet;

[0019] 12. Liquid outlet;

[0020] 13. Bottom substrate;

[0021] 131. First arc structure;

[0022] 14. Upper cover;

[0023] 141. Second arc structure;

[0024] 20. Temperature distribution board;

[0025] 30. First cooling channel;

[0026] 31. Traffic distribution structure;

[0027] 311. Bionic flow distribution structure;

[0028] 312. First flow distribution structure;

[0029] 313. Second flow distribution structure;

[0030] 32. Microchannel structure;

[0031] 321, microchannel rib wall;

[0032] 3211, rib wall body;

[0033] 322. Cooling microchannel;

[0034] 40. Second cooling channel;

[0035] 41. Uniform temperature structure;

[0036] 411, fin;

[0037] 200. Heat-generating electronic components. DETAILED DESCRIPTION

[0038] The details of the present invention can be more clearly understood by referring to the accompanying drawings and the description of the specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention and are not to be construed as limiting the present invention in any way. Based on the teachings of the present invention, a skilled person can conceive of any possible variations based on the present invention, and such variations should be considered to fall within the scope of the present invention.

[0039] like Figures 1 to 5 As shown, the present invention proposes a double-layer liquid cooling plate 100 for a data center server. The double-layer liquid cooling plate 100 for a data center server has a shell 10. A cooling cavity is formed in the shell 10. A temperature equalizing plate 20 is provided in the cooling cavity. The temperature equalizing plate 20 divides the cooling cavity into a first cooling channel 30 and a second cooling channel 40. A liquid inlet 11 and a liquid outlet 12 are provided on the shell 10. One end of the first cooling channel 30 is connected to the liquid inlet 11, and the other end of the first cooling channel 30 is connected to one end of the second cooling channel 40 through a connecting port. The other end of the second cooling channel 40 is connected to the liquid outlet 12. A flow distribution structure 31 and a microchannel structure 32 are provided in the first cooling channel 30. The flow distribution structure 31 is connected to the liquid inlet 11, the microchannel structure 32 is arranged between the flow distribution structure 31 and the connecting port, and a temperature uniformity structure 41 is provided in the second cooling channel 40. The microchannel structure 32 includes a plurality of microchannel ribs 321 arranged in parallel and spaced apart. Two adjacent microchannel ribs 321 form a cooling microchannel 322. The cooling microchannel 322 is arranged along the length direction of the first cooling channel 30. Each microchannel rib 321 is composed of a plurality of rib wall bodies 3211 arranged intermittently in sequence. Along the length direction of the microchannel rib 321 (that is, the length direction of the first cooling channel 30), the length of the rib wall body 3211 decreases linearly, and the end of the intermittently arranged rib wall body 3211 is provided with an arc-shaped guide structure.

[0040] The double-layer liquid cooling plate 100 for data center servers proposed in this invention uses a vapor chamber 20 to divide the cooling chamber within the housing 10 into parallel first and second cooling channels 30 and 40, thus forming a double-layer structure. The cooling medium first flows through the first cooling channel 30 and then returns to flow into the second cooling channel 40, effectively increasing the cooling medium's flow path and heat exchange efficiency. Heat within the first cooling channel 30 is quickly transferred to the second cooling channel 40 via the vapor chamber 20, enhancing the heat dissipation of the double-layer liquid cooling plate 100 for data center servers.

[0041] The double-layer liquid cooling plate 100 for a data center server proposed in the present invention turbules and distributes the cooling medium flowing in through the liquid inlet 11 through the flow distribution structure 31, thereby enhancing the heat transfer performance and making the flow distribution more uniform. The cooling medium is further distributed through the microchannel structure 32, making the flow distribution of the cooling medium more uniform. In addition, the temperature equalizing structure 41 can quickly transfer the heat in the first cooling channel 30 to the second cooling channel 40, so that the temperature of the double-layer liquid cooling plate 100 of the data center server can be more evenly distributed.

[0042] The double-layer liquid cooling plate 100 for a data center server proposed by the present invention has a plurality of rib wall bodies 3211 that gradually decrease in length, forming gradually denser rib wall bodies 3211. When the cooling medium flows through the microchannel structure 32, it fully contacts the temperature equalizing plate 20, and can fully transfer heat to the temperature equalizing plate 20. The heat is then transferred to the cooling medium in the second cooling channel 40 through the temperature equalizing plate 20 and the temperature equalizing structure 41, thereby improving the heat exchange efficiency of the cooling medium.

[0043] In an optional embodiment of the present invention, the linear decreasing gradient of the length of the rib wall body 3211 is 10% per section.

[0044] In an optional embodiment of the present invention, the ratio of the curvature radius of the arc-shaped flow-guiding structure to the height of the rib wall 3211 is 1:1.

[0045] In an optional embodiment of the present invention, the flow distribution structure 31 includes a bionic flow distribution structure 311, a first flow distribution structure 312 and two second flow distribution structures 313. The bionic flow distribution structure 311 is connected to the liquid inlet 11, and the two second flow distribution structures 313 are symmetrically arranged on both sides of the bionic flow distribution structure 311. The first flow distribution structure 312 is arranged between the bionic flow distribution structure 311 and the microchannel structure 32.

[0046] In an optional example of this embodiment, the cooling medium entering from the liquid inlet 11 passes through the bionic flow distribution structure 311, and a part of the cooling medium is evenly distributed to both sides along the bionic flow distribution structure 311, flowing to the two second flow distribution structures 313 respectively, and the other part flows to the first flow distribution structure 312 through the bionic flow distribution structure 311. The cooling medium completes the preliminary flow distribution when flowing through the bionic flow distribution structure 311, and generates a turbulence effect after flowing to the two second flow distribution structures 313, thereby achieving the effect of further flow distribution.

[0047] In an optional example, the bionic flow distribution structure 311 is a willow-leaf-shaped flow distribution structure having a plurality of branched slots and good streamlines. The cooling medium experiences less flow resistance when flowing through the plurality of branched slots.

[0048] Furthermore, the willow-leaf-shaped flow distribution structure has a length of 27 mm, a width of 5.5 mm, and a height of 4 mm; and an initial distance between the willow-leaf-shaped flow distribution structure and the microchannel rib wall is 3 mm.

[0049] In an optional example, the first flow distribution structure 312 and the second flow distribution structure 313 each include at least one cylindrical structure. When the cooling medium flows through the cylindrical structure, a turbulent flow effect is generated, thereby achieving further flow distribution.

[0050] Furthermore, the first flow distribution structure 312 has two cylindrical structures arranged at intervals, and the second flow distribution structure 313 has three cylindrical structures arranged at intervals.

[0051] In an optional embodiment of the present invention, the cylinders in the first flow distribution structure 312 have a diameter of 0.5 mm, a height of 5 mm, and a spacing of 12.5 mm; the cylinders in the second flow distribution structure 313 have a diameter of 0.5 mm, a height of 3 mm, and a spacing of 3 mm.

[0052] In an optional embodiment of the present invention, the inlet flow rates of the first flow distribution structure 312 and the second flow distribution structure 313 match the decreasing gradient of the length of the rib wall 3211, so that the Reynolds number of the cooling medium is maintained in the range of 800-1000.

[0053] In an optional embodiment of the present invention, the temperature-averaging structure 41 includes a plurality of fins 411 arranged in parallel and spaced apart. Two adjacent fins 411 form a temperature-averaging channel, which is arranged along the length of the second cooling channel 40. Each fin 411 has a heat dissipation function, which can quickly transfer the temperature of the temperature-averaging plate 20 to the second cooling channel 40, further improving the heat exchange efficiency of the cooling medium.

[0054] In an optional example of this embodiment, each fin 411 is welded to the temperature homogenizing plate 20 .

[0055] In an optional embodiment of the present invention, the housing 10 includes a bottom substrate 13 and an upper cover plate 14 , and the upper cover plate 14 and the bottom substrate 13 are sealed and fixedly connected to enclose and form a cooling cavity.

[0056] In an optional example of this embodiment, the bottom substrate 13 has a downwardly concave lower chamber, and the upper cover plate 14 has an upwardly concave upper chamber. After the bottom substrate 13 and the upper cover plate 14 are sealed and connected, the lower chamber and the upper chamber constitute a cooling chamber.

[0057] In an optional example of this embodiment, a temperature vapor chamber 20 is placed above the bottom substrate 13, with the bottom substrate 13 and the temperature vapor chamber 20 sealed together. An upper cover plate 14 is placed above the temperature vapor chamber 20 and the bottom substrate 13 and is sealed together. With this structure, the space between the temperature vapor chamber 20 and the bottom substrate 13 forms a first cooling channel 30, while the temperature vapor chamber 20 and the upper cover plate 14 form a second cooling channel 40.

[0058] Furthermore, one end of the temperature homogenizing plate 20 is spaced apart from the bottom substrate 13 and the upper cover plate 14 to form a communication port for the cooling medium to flow from the first cooling channel 30 into the second cooling channel 40 .

[0059] In an optional example, the flow distribution structure 31 and the microchannel structure 32 are integrally formed with the bottom substrate 13 .

[0060] In an optional example, a heat-generating electronic component 200 is disposed on the outer wall of the bottom substrate 13 , and the bottom substrate 13 can dissipate heat and quickly cool the heat-generating electronic component 200 .

[0061] In an optional example, the bottom substrate 13 has a first arc structure 131 that is aligned with the connecting port, and the upper cover plate 14 has a second arc structure 141 that is aligned with the connecting port. The first arc structure 131 and the second arc structure 141 have a guiding effect on the cooling medium, further reducing the flow resistance of the cooling medium.

[0062] Specifically, the first arc structure 131 has the function of guiding the cooling medium upwards, thereby guiding the cooling medium to the second arc structure 141 , and then the second arc structure 141 guides the cooling medium to the second cooling channel 40 .

[0063] In an optional example, the length direction of the first cooling channel 30 is also the length direction of the lower chamber of the bottom substrate 13 , and the liquid inlet 11 and the communication port are located at both ends of the length direction of the lower chamber.

[0064] Furthermore, the lower chamber of the bottom substrate 13 has a depth of 5 mm, a length of 80 mm, and a width of 60 mm.

[0065] Preferably, the flow distribution structure 31 and the microchannel structure 32 are located in the lower chamber. The height of the bionic flow distribution structure 311 is 4 mm, and the depth of the branched grooves of the bionic flow distribution structure 311 is 1.5 mm; the height of the second flow distribution structure 313 is 3 mm; and the height of the first flow distribution structure 312 is 4 mm.

[0066] Preferably, the height of the microchannel rib 321 of the microchannel structure 32 is 5 mm.

[0067] In an optional example, the thickness of the temperature homogenizing plate 20 is 0.5 mm, the length is 75 mm, and the width is 60 mm; the height of the fin 411 is 3 mm.

[0068] In an optional example, the arc of the first arc structure 131 is a 1 / 4 arc, and the arc radius is 5 mm; the arc of the second arc structure 141 is a 1 / 4 arc, and the arc radius is 4.5 mm.

[0069] In an optional embodiment of the present invention, the inner diameter of the liquid inlet 11 is 4 mm.

[0070] In an optional example of the present invention, the liquid outlet 12 includes a first liquid outlet and a second liquid outlet. The inner diameter of the first liquid outlet and the inner diameter of the second liquid outlet are the same, both 3 mm, and are distributed on both sides of the upper cover plate 14.

[0071] In an optional embodiment of the present invention, the cooling medium is liquid water.

[0072] In an optional embodiment of the present invention, the housing 10 and the temperature homogenizing plate 20 are made of copper with good thermal conductivity.

[0073] Furthermore, the housing 10 and the temperature homogenizing plate 20 may also be made of other heat-conducting materials known to those skilled in the art, which will not be described in detail here.

[0074] The detailed explanations of the above-mentioned embodiments are intended only to explain the present invention so as to facilitate a better understanding of the present invention. However, these descriptions cannot be interpreted as limiting the present invention for any reason. In particular, the various features described in different embodiments may also be arbitrarily combined with each other to form other embodiments. Unless otherwise clearly described, these features should be understood to be applicable to any embodiment and are not limited to the described embodiments.

Claims

1. A double-layer liquid cooling plate for a data center server, characterized in that: The data center server double-layer liquid cooling plate has a shell, a cooling cavity is formed in the shell, a temperature averaging plate is provided in the cooling cavity, and the temperature averaging plate divides the cooling cavity into a first cooling channel and a second cooling channel; a liquid inlet and a liquid outlet are provided on the shell, one end of the first cooling channel is connected to the liquid inlet, the other end of the first cooling channel is connected to one end of the second cooling channel through a connecting port, and the other end of the second cooling channel is connected to the liquid outlet, a flow distribution structure and a microchannel structure are provided in the first cooling channel, the flow distribution structure is connected to the liquid inlet, the microchannel structure is provided between the flow distribution structure and the connecting port, and a temperature averaging structure is provided in the second cooling channel; The microchannel structure includes a plurality of microchannel ribs arranged in parallel and at intervals, two adjacent microchannel ribs forming a cooling microchannel, the cooling microchannel being arranged along the length direction of the first cooling flow channel, each microchannel rib being formed by a plurality of ribs arranged in sequence and intermittently, and the length of the ribs decreasing linearly along the flow direction of the fluid; an arc-shaped flow guide structure being provided at the end of the intermittently arranged ribs; The flow distribution structure includes a bionic flow distribution structure, a first flow distribution structure and two second flow distribution structures. The bionic flow distribution structure is connected to the liquid inlet, and the two second flow distribution structures are symmetrically arranged on both sides of the bionic flow distribution structure. The first flow distribution structure is arranged between the bionic flow distribution structure and the microchannel structure.

2. The double-layer liquid cooling plate for a data center server according to claim 1, wherein: The linear decreasing gradient of the rib wall length is 10% per section.

3. The double-layer liquid cooling plate for a data center server according to claim 1, wherein: The bionic flow distribution structure is a bionic willow-leaf-shaped flow distribution structure.

4. The double-layer liquid cooling plate for a data center server according to claim 3, wherein: The first flow distribution structure and the second flow distribution structure each include at least one cylindrical structure.

5. The double-layer liquid cooling plate for a data center server according to claim 3, wherein: The inlet flow rate of the first flow distribution structure and the inlet flow rate of the second flow distribution structure are set to keep the Reynolds number of the cooling medium within the range of 800-1000.

6. The double-layer liquid cooling plate for a data center server according to claim 1, wherein: The temperature-averaging structure includes a plurality of fins arranged in parallel and at intervals, and two adjacent fins form a temperature-averaging channel, which is arranged along the length direction of the second cooling channel.

7. The double-layer liquid cooling plate for a data center server according to claim 1, wherein: The shell includes a bottom substrate and an upper cover plate, and the upper cover plate and the bottom substrate are sealed and fixedly connected to enclose and form the cooling cavity.

8. The double-layer liquid cooling plate for a data center server according to claim 7, wherein: Heat-generating electronic components are arranged on the outer wall of the bottom substrate.

9. The double-layer liquid cooling plate for a data center server according to claim 7, wherein: The flow distribution structure and the microchannel structure are integrally formed with the bottom substrate.

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