Electronic component mounting apparatus and method with solder paste detection and compensation

Abstract

The application relates to an electronic component pasting device and method with tin paste detection and compensation, which comprises a limiting plate, a through hole is formed in the limiting plate, a pressing plate, a turnover motor and a first lifting unit are arranged above the limiting plate, a scraping tin paste part is arranged at the edge of the pressing plate, a horizontal moving unit is further arranged above the limiting plate, a positioning groove is arranged on the surface of the pressing plate, the bottom surface of the positioning groove is a mirror surface, the depth of the positioning groove is smaller than the thickness of the shell of the electronic component, a vacuum adsorption unit is arranged on the pressing plate, a visual recognition unit is arranged on one side of the pressing plate, and a tin paste compensation unit is arranged on the other side of the pressing plate; the tin paste state can be more accurately obtained by photographing from the front and side angles, tin paste compensation is arranged for the tin paste state not meeting the conditions, the electronic component is positioned for the second time, the height position of the pressing and pasting is accurately limited, and the consistency of the electronic component pasting is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component patching, in particular to an electronic component patching device and method with solder paste detection and compensation. BACKGROUND

[0002] The general process of SMT patching process is solder paste printing-component patching-reflow soldering-detection and repair. In order to guarantee the product yield, a solder paste detection process is added in some production lines. At present, the detection of solder paste is usually carried out by image recognition after photographing by a visual camera. Due to the photographing angle, the surface flatness of the non-edge part of the solder paste is not easy to identify. If the part is not flat, it is easy to cause false welding. In addition, the part with missing solder paste needs to be manually supplemented with solder paste or the solder paste printing process needs to be re-performed, which involves multiple material moving operations, time-consuming and laborious. Moreover, in the subsequent component patching process, the angle and height of patching are not easy to control. Therefore, an electronic component patching device and method with solder paste detection and compensation are needed to solve the above problems. SUMMARY

[0003] The technical problem to be solved by the present application is to provide an electronic component patching device and method with solder paste detection and compensation to solve the above problems of the prior art.

[0004] The technical scheme adopted by the present application to solve the technical problem is:

[0005] The application discloses an electronic component mounting device with tin paste detection and compensation, which comprises a limiting plate, the thickness of the limiting plate is the height value of the normal mounting of the electronic component, a through hole corresponding to the tin paste block printed on the circuit board is formed in the limiting plate, the length and width of the through hole are matched with the length and width of the corresponding tin paste block, and a plurality of overflow holes are arranged on the edge of the through hole; a pressing plate, a turnover motor driving the longitudinal turnover of the pressing plate and a first lifting unit driving the longitudinal lifting of the turnover motor are arranged above the limiting plate; a tin paste scraping part is arranged on the edge of the pressing plate, a horizontal moving unit driving the horizontal movement of the first lifting unit is further arranged above the limiting plate; a positioning groove for the secondary positioning of the electronic component is arranged on the surface of the pressing plate, the bottom surface of the positioning groove is a mirror surface, the depth of the positioning groove is smaller than the thickness of the shell of the electronic component, and a vacuum adsorption unit for adsorbing the electronic component in the positioning groove is arranged on the pressing plate; a visual identification unit for collecting the tin paste block image reflected by the mirror surface and performing image recognition is arranged on one side of the pressing plate, and a tin paste compensation unit is arranged on the other side; the device further comprises a control host, the control host receives the data of the visual identification unit and controls the operation of the turnover motor, the first lifting unit, the horizontal moving unit, the vacuum adsorption unit and the tin paste compensation unit.

[0006] The electronic component mounting device with tin paste detection and compensation further comprises a support, the horizontal moving unit is arranged on the support, and a second lifting unit driving the lifting of the limiting plate is further arranged on the support.

[0007] The electronic component mounting device with tin paste detection and compensation further comprises a processing table, the support is fixed on the processing table, and a mounting station for positioning the circuit board on which the tin paste has been printed is arranged on the processing table.

[0008] The electronic component mounting device with tin paste detection and compensation further comprises a positioning table for the primary positioning of the electronic component and a material moving manipulator for taking the material from the positioning table and moving the material to the positioning groove.

[0009] The vacuum adsorption unit comprises a plurality of capillary tubes penetrating through the pressing plate and a vacuum generator providing negative pressure for the plurality of capillary tubes.

[0010] The tin paste compensation unit comprises a tin paste extrusion pump and a compensation manipulator driving the movement of the tin paste extrusion pump.

[0011] The electronic component mounting device with tin paste detection and compensation provided by the application, wherein the tin paste scraping part comprises a tin paste scraping slope arranged on the edge of the pressing plate, and the tin paste scraping slope is provided with a storage groove for temporarily storing the scraped tin paste.

[0012] The electronic component mounting method with tin paste detection and compensation, which applies the electronic component mounting device with tin paste detection and compensation provided by the application, and the method comprises the following steps.

[0013] The circuit board with the printed tin paste is moved to the mounting position, the limiting plate is lowered to press the circuit board, and the through holes on the limiting plate correspond to the printed tin paste blocks on the circuit board one by one.

[0014] The control host controls the first lifting unit to operate, so that the pressing plate is lowered to the first height position, controls the turning motor to operate, drives the pressing plate to be longitudinally turned to the first inclined state with an inclination angle of 45 degrees, and the vision recognition unit acquires the overhead image of the tin paste block reflected on the mirror surface.

[0015] The control host controls the first lifting unit and the horizontal moving unit to operate, so that the pressing plate is lowered to the second height position and horizontally moved by a set distance, controls the turning motor to operate, drives the pressing plate to be longitudinally turned to the inclined state with an inclination angle of 60 degrees, and the vision recognition unit acquires the inclined image of the tin paste block reflected on the mirror surface.

[0016] The control host receives the two image data collected by the vision recognition unit, identifies and analyzes whether the tin paste has surface unevenness or defects, if not, directly enters the next step, if yes, moves the limiting plate upward to the position where the limiting plate is flush with the upper surface of the tin paste block, controls the tin paste compensation unit to compensate the tin paste on the uneven or defective position of the tin paste block, controls the turning motor and the first lifting unit to operate so that the tin paste scraping part of the pressing plate is attached to the limiting plate, and controls the horizontal moving unit to operate to drive the tin paste scraping part to horizontally move to perform the tin paste scraping action.

[0017] The control host controls the turning motor to operate so that the pressing plate is turned to the position where the positioning groove faces upward, the positioning groove receives the incoming electronic component and performs secondary positioning on the electronic component, controls the vacuum adsorption unit to operate to adsorb the electronic component, and then controls the turning motor to operate so that the pressing plate is turned to the position where the positioning groove faces downward.

[0018] The control host controls the first lifting unit to operate, drives the pressing plate to move downward and contact the limiting plate, and completes the mounting action of the electronic component, controls the vacuum adsorption unit to release the electronic component, and controls the turning motor, the first lifting unit and the horizontal moving unit to reset the pressing plate, and the limiting plate is moved upward to reset.

[0019] The beneficial effects of the present application are that the circuit board on which the tin paste has been printed is transferred to a patching station, the limiting plate is lowered to press the circuit board, the through holes on the limiting plate correspond to the tin paste blocks printed on the circuit board one by one; the control host controls the first lifting unit to operate, so that the pressing plate is lowered to a set first height position, the control host controls the turnover motor to operate, drives the pressing plate to be longitudinally turned to a first inclined state with an inclination angle of 45 degrees, and the visual recognition unit obtains the plan view image of the tin paste block reflected on the mirror surface; the control host controls the first lifting unit and the horizontal moving unit to operate, so that the pressing plate is lowered to a second height position and horizontally moved by a set distance, the control host controls the turnover motor to operate, drives the pressing plate to be longitudinally turned to an inclined state with an inclination angle of 60 degrees, and the visual recognition unit obtains the inclined image of the tin paste block reflected on the mirror surface;

[0020] The control host receives the two image data collected by the visual recognition unit, identifies and analyzes whether the tin paste has surface unevenness or defects, if not, directly enters the next step, if yes, moves the limiting plate upward to be flush with the upper surface of the tin paste block, the control host controls the tin paste compensation unit to compensate the tin paste on the uneven or defective part of the tin paste block, the control host controls the turnover motor and the first lifting unit to operate, so that the tin paste scraping part of the pressing plate is attached to the limiting plate, the control host controls the horizontal moving unit to operate, drives the tin paste scraping part to horizontally move to perform the tin paste scraping action; the control host controls the turnover motor to operate, so that the pressing plate is turned to the positioning groove upward, the positioning groove receives the incoming electronic component and performs secondary positioning on the electronic component, the control host controls the vacuum adsorption unit to operate to adsorb the electronic component, and then the control host controls the turnover motor to operate, so that the pressing plate is turned to the positioning groove downward; the control host controls the first lifting unit to operate, drives the pressing plate to move downward and contact the limiting plate, completes the mounting action of the electronic component, the control host controls the vacuum adsorption unit to release the electronic component, and controls the turnover motor, the first lifting unit and the horizontal moving unit to reset the pressing plate, and the limiting plate moves upward to reset;

[0021] By the way and method of the present application, more accurate tin paste state can be obtained by taking pictures from two angles of front and side, tin paste compensation is set for tin paste state not meeting the conditions, secondary positioning is performed on the electronic component, and the height position of pressing and mounting is accurately limited to ensure the consistency of electronic component mounting. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the present application will be further described below with reference to the drawings and embodiments. The drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any inventive labor:

[0023] Figure 1It is the schematic structural diagram of the electronic component mounting device with tin paste detection and compensation of the preferred embodiment of the present application;

[0024] Figure 2 It is the partial sectional view of the limiting plate of the electronic component mounting device with tin paste detection and compensation of the preferred embodiment of the present application;

[0025] Figure 3 It is the sectional view of the pressing plate of the electronic component mounting device with tin paste detection and compensation of the preferred embodiment of the present application;

[0026] Figure 4 It is the flow chart of the electronic component mounting method with tin paste detection and compensation of the preferred embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the technical scheme in the embodiments of the present application to make a clear and complete description. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by the person of ordinary skill in the art without creative labor are within the protection scope of the present application.

[0028] The electronic component mounting device with tin paste detection and compensation of the preferred embodiment of the present application, as shown in Figure 1 , simultaneously referring to Figure 2 and Figure 3 , includes the limiting plate 1, the thickness of the limiting plate 1 is the height value after the normal mounting of the electronic component 2, the limiting plate 1 is provided with the through hole 10 corresponding to the tin paste block 30 printed on the circuit board 3, the length and width size of the through hole 10 matches the length and width size of the corresponding tin paste block, and the edge of the through hole 10 is provided with the overflow hole 11; the limiting plate 1 is provided with the pressing plate 4, the overturning motor 40 driving the longitudinal overturning of the pressing plate 4 and the first lifting unit 41 driving the longitudinal lifting of the overturning motor; the edge of the pressing plate 4 is provided with the tin paste scraping part 43, and the limiting plate 1 is further provided with the horizontal moving unit 42 driving the horizontal moving of the first lifting unit 41; the surface of the pressing plate 4 is provided with the positioning groove 44 for the secondary positioning of the electronic component 2, and the bottom surface of the positioning groove 44 is the mirror surface 440, the depth of the positioning groove 44 is less than the thickness of the shell of the electronic component 2, and the pressing plate 4 is provided with the vacuum adsorption unit 45 for the vacuum adsorption of the electronic component in the positioning groove 44; one side of the pressing plate 4 is provided with the visual identification unit 5 for collecting the tin paste block image reflected by the mirror surface 440 and performing image recognition, and the other side is provided with the tin paste compensation unit 6; the device further includes the control host 7, the control host 7 receives the data of the visual identification unit 5 and controls the operation of the overturning motor 40, the first lifting unit 41, the horizontal moving unit 42, the vacuum adsorption unit 45 and the tin paste compensation unit 6;

[0029] The circuit board 3 on which the tin paste has been printed is moved to the patching station, the limiting plate 1 is lowered to press the circuit board 3 to prevent the circuit board from moving, the through holes 10 on the limiting plate 1 correspond to the tin paste blocks 30 that have been printed on the circuit board 3 one by one; the control host 7 controls the first lifting unit 41 to operate, so that the pressing plate 4 is lowered to a first height position, the control host 7 controls the turnover motor 40 to operate, so that the pressing plate 4 is longitudinally turned to a first inclined state with an inclination angle of 45 degrees, and the vision recognition unit 5 acquires the overhead image of the tin paste block reflected on the mirror surface; the control host 7 controls the first lifting unit 41 and the horizontal moving unit 42 to operate, so that the pressing plate 4 is lowered to a second height position and horizontally moved by a set distance, the control host 7 controls the turnover motor 40 to operate, so that the pressing plate 4 is longitudinally turned to an inclined state with an inclination angle of 60 degrees, and the vision recognition unit 5 acquires the inclined image of the tin paste block reflected on the mirror surface; after the acquisition is completed, the control host 7 controls the pressing plate 4 to return to the position directly opposite to the tin paste block;

[0030] The control host 7 receives the two image data collected by the vision recognition unit 5, and performs identification analysis on whether the tin paste has surface unevenness or defects, if not, it directly enters the next step, if yes, the limiting plate 1 is moved upward to be flush with the upper surface of the tin paste block 30, the control host 7 controls the tin paste compensation unit 6 to compensate the tin paste on the uneven or defective part of the tin paste block 30, the control host 7 controls the turnover motor 40 and the first lifting unit 41 to operate, so that the tin paste scraping part 43 of the pressing plate 4 is attached to the limiting plate 1, the control host 7 controls the horizontal moving unit 42 to operate, so that the tin paste scraping part 43 is horizontally moved to perform the tin paste scraping action; after the tin paste compensation action is completed, the control host 7 controls the limiting plate 1 to be lowered and reset;

[0031] The control host 7 controls the turnover motor 40 to operate, so that the pressing plate 4 is turned to the position with the positioning groove 44 facing upward, the positioning groove 44 receives the electronic component 2 sent in (the back surface of the electronic component is attached to the mirror surface, and the pin is directed to the outside of the positioning groove 44) and performs secondary positioning on the electronic component 2, the control host 7 controls the vacuum suction unit 45 to operate to suction the electronic component 2, and then the control host 7 controls the turnover motor 40 to operate, so that the pressing plate 4 is turned to the position with the positioning groove 44 facing downward; the control host 7 controls the first lifting unit 41 to operate, so that the pressing plate 4 is lowered and contacts the limiting plate 1, and the mounting action of the electronic component 2 is completed, the control host 7 controls the vacuum suction unit 45 to release the electronic component 2, and controls the turnover motor 40, the first lifting unit 41 and the horizontal moving unit 42 to reset the pressing plate 4, and the limiting plate 1 is raised and reset;

[0032] The method of the application can obtain clear profile images and upper surface images by taking pictures from two angles, i.e., front and side, so that the state of the solder paste can be more accurately judged. Moreover, the camera is not moved during the shooting, and the mirror surface at the bottom of the positioning groove of the pressing plate is used to obtain the images. The two-angle image acquisition operation can be quickly completed by quickly adjusting the position of the pressing plate, which is convenient and fast. In addition, according to the need, a single camera is arranged to collect images reflected by multiple mirror surfaces to improve the utilization rate of the device. In addition, the solder paste compensation mechanism is arranged for the solder paste state that does not meet the requirements. According to the mechanism, the scraping operation of the solder paste can be completed by using the limiting plate and the pressing plate without moving the circuit board, so that the processing efficiency is significantly improved. Moreover, the positioning groove also performs secondary positioning on the electronic component, and the limiting plate is combined to accurately limit the height position of the pressing and mounting, so that the mounting efficiency and consistency can be effectively ensured.

[0033] It should be noted that the method of the application can be implemented by arranging multiple stations, and each station mounts a limited number of components. For example, if 8 components need to be mounted on a circuit board, the circuit board can be divided into 4-8 stations, and each station mounts 1-2 components to ensure full-automatic batch mounting operation and provide sufficient space for the device.

[0034] Preferably, the device further comprises a support 8, the horizontal moving unit 42 is arranged on the support 8, and the support 8 further comprises a second lifting unit 80 for lifting the limiting plate 1. The second lifting unit 80 is controlled by the control host 7 to adjust the height of the limiting plate 1. The second lifting unit 80 is preferably implemented by a precision lead screw assembly to ensure the adjustment accuracy. The device further comprises a processing table 9, the support 8 is fixed on the processing table 9, and the processing table 9 comprises a mounting station 90 for positioning the circuit board 3 on which the solder paste has been printed. The processing table 9 further comprises a positioning table 91 for positioning the electronic component and a material moving manipulator 92 for taking the material from the positioning table and moving the material to the positioning groove. The circuit board 3 can be positioned, and the electronic component can be positioned and moved.

[0035] Preferably, the vacuum adsorption unit 45 comprises a plurality of capillary tubes 450 arranged on the pressing plate 4 and a vacuum generator 451 for providing negative pressure to the plurality of capillary tubes 450. The structure is simple and convenient to operate.

[0036] Preferably, the solder paste compensation unit 6 comprises a solder paste extrusion pump 60 and a compensation manipulator 61 for moving the solder paste extrusion pump. The structure is simple, and it can be understood that other existing structures for compensating the solder paste can also be used.

[0037] Preferably, the tin paste scraping part 43 comprises a tin paste scraping slope 430 arranged at the edge of the pressing plate 4, and the tin paste scraping slope 430 is provided with a storage groove 431 for temporarily storing the scraped tin paste.

[0038] An electronic component mounting method with tin paste detection and compensation, which applies the electronic component mounting device with tin paste detection and compensation as above, as shown in the figure, the method comprises the steps of: Figure 4

[0039] S01: moving the circuit board with printed tin paste to the mounting position, lowering the limiting plate to press the circuit board, and making the through holes on the limiting plate correspond to the printed tin paste blocks on the circuit board one by one;

[0040] S02: controlling the host computer to control the first lifting unit to operate, so that the pressing plate is lowered to a first height position, controlling the host computer to control the turnover motor to operate, so that the pressing plate is longitudinally turned to a first inclined state with an inclination angle of 45 degrees, and the vision recognition unit acquires the overhead image of the tin paste block reflected on the mirror surface;

[0041] S03: controlling the host computer to control the first lifting unit and the horizontal moving unit to operate, so that the pressing plate is lowered to a second height position and horizontally moved by a set distance, controlling the host computer to control the turnover motor to operate, so that the pressing plate is longitudinally turned to an inclined state with an inclination angle of 60 degrees, and the vision recognition unit acquires the inclined image of the tin paste block reflected on the mirror surface;

[0042] S04: controlling the host computer to receive the two image data collected by the vision recognition unit, to identify and analyze whether the tin paste has surface unevenness or defects, if not, directly entering the next step, if yes, moving the limiting plate up to the upper surface of the tin paste block, controlling the host computer to control the tin paste compensation unit to compensate the tin paste on the uneven or defective part of the tin paste block, controlling the host computer to control the turnover motor and the first lifting unit to operate, so that the tin paste scraping part of the pressing plate is attached to the limiting plate, and controlling the host computer to control the horizontal moving unit to operate, so that the tin paste scraping part is horizontally moved to perform the tin paste scraping action;

[0043] S05: controlling the host computer to control the turnover motor to operate, so that the pressing plate is turned to the position that the positioning groove faces upward, the positioning groove receives the incoming electronic component and performs secondary positioning on the electronic component, controlling the host computer to control the vacuum suction unit to operate to suction the electronic component, and then controlling the host computer to control the turnover motor to operate, so that the pressing plate is turned to the position that the positioning groove faces downward;

[0044] S06: controlling the host computer to control the first lifting unit to operate, so that the pressing plate is lowered and contacts the limiting plate, completing the mounting action of the electronic component, controlling the host computer to control the vacuum suction unit to release the electronic component, and controlling the turnover motor, the first lifting unit and the horizontal moving unit to reset the pressing plate, and the limiting plate is raised to reset;

[0045] ​The application can obtain more accurate solder paste state through front and side angle shooting, and set solder paste compensation for solder paste state not meeting the condition, carry out secondary positioning for electronic components, and accurately limit the height position of press mounting, thereby ensuring the consistency of electronic component mounting.

[0046] It should be understood that the above description is intended to be illustrative and not restrictive. Many modifications and variations of the application can be made without departing from its spirit.

Claims

1. An electronic component placement device with solder paste detection and compensation, characterized in that, The system includes a limiting plate, the thickness of which is the set height value of the electronic component after normal mounting. The limiting plate has through holes corresponding one-to-one with the solder paste blocks printed on the circuit board. The length and width dimensions of the through holes match the length and width dimensions of the corresponding solder paste blocks. Multiple overflow holes are provided along the edges of the through holes. Above the limiting plate are a pressure plate, a flip motor that drives the pressure plate to rotate longitudinally, and a first lifting unit that drives the flip motor to move longitudinally. The edge of the pressure plate has a solder paste scraping part, and above the limiting plate is a lateral movement unit that drives the first lifting unit to move laterally. The surface of the pressure plate is provided with... The device includes a positioning groove for secondary positioning of electronic components, with a mirror-like bottom surface and a depth less than the thickness of the electronic component's housing. A vacuum adsorption unit for vacuum adsorption of the electronic components within the positioning groove is provided on the holding plate. A visual recognition unit is provided on one side of the holding plate to capture and recognize images of the solder paste reflected from the mirror surface, and a solder paste compensation unit is provided on the other side. The device also includes a control host that receives data from the visual recognition unit and controls the operation of the flip motor, the first lifting unit, the lateral movement unit, the vacuum adsorption unit, and the solder paste compensation unit.

2. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that, The device also includes a support frame, the transverse unit is mounted on the support frame, and a second lifting unit is mounted on the support frame to drive the limit plate to rise and fall.

3. The electronic component placement device with solder paste detection and compensation according to claim 2, characterized in that, The device also includes a processing table, the bracket is fixed on the processing table, and the processing table is provided with a placement station for positioning the circuit board that has been printed with solder paste.

4. The electronic component placement device with solder paste detection and compensation according to claim 3, characterized in that, The processing table is also equipped with a positioning table for positioning electronic components and a material transfer robot for picking up materials from the positioning table and transferring them to the positioning slot.

5. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that, The vacuum adsorption unit includes multiple capillaries passing through the pressure plate and a vacuum generator that provides negative pressure to the multiple capillaries.

6. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that, The solder paste compensation unit includes a solder paste extrusion pump and a compensation robot that moves the solder paste extrusion pump.

7. The electronic component placement device with solder paste detection and compensation according to claim 1, characterized in that, The solder paste scraping section includes a solder paste scraping slope disposed on the edge of the pressure plate, and a storage groove is provided on the solder paste scraping slope for temporary storage of the scraped solder paste.

8. A method for surface mount technology (SMT) of electronic components with solder paste detection and compensation, using the SMT apparatus for surface mount technology (SMT) of electronic components with solder paste detection and compensation as described in any one of claims 1-7, characterized in that, The method includes the following steps: The circuit board with solder paste already printed is transferred to the surface mount station. The limiting plate moves down to hold the circuit board, and the through holes on the limiting plate correspond one-to-one with the solder paste blocks printed on the circuit board. The control host controls the operation of the first lifting unit, causing the pressure plate to descend to the set first height position. The control host controls the operation of the flipping motor, driving the pressure plate to flip longitudinally to the first inclined state with a 45-degree tilt angle. The visual recognition unit obtains a top view image of the solder paste block reflected on the mirror surface. The control host controls the operation of the first lifting unit and the lateral moving unit, so that the pressure plate is lowered to the second height position and laterally moved a set distance. The control host controls the operation of the flipping motor, which drives the pressure plate to flip longitudinally to an oblique state with a 60-degree tilt angle. The visual recognition unit obtains the oblique image of the solder paste block reflected on the mirror surface. The control host receives two image data collected by the vision recognition unit and analyzes whether there are surface unevenness or defects in the solder paste. If not, it directly proceeds to the next step; if so, the limit plate is moved up until it is flush with the upper surface of the solder paste block. The control host controls the solder paste compensation unit to fill the uneven or defective areas on the solder paste block with solder paste. The control host controls the flipping motor and the first lifting unit to make the solder paste scraping part of the pressure plate fit against the limit plate. The control host controls the transverse unit to move and drive the solder paste scraping part to move laterally to perform the solder paste scraping action. The control host controls the operation of the flipping motor to flip the pressure plate so that the positioning slot faces upward. The positioning slot receives the fed electronic components and performs secondary positioning on the electronic components. The control host controls the operation of the vacuum adsorption unit to adsorb the electronic components. Then the control host controls the operation of the flipping motor to flip the pressure plate so that the positioning slot faces downward. The control host controls the operation of the first lifting unit, which drives the pressure plate downward and contacts the limit plate to complete the placement of electronic components. The control host controls the vacuum adsorption unit to release the electronic components and controls the flip motor, the first lifting unit and the horizontal movement unit to reset the pressure plate, and the limit plate to reset upward.

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