Silicon-based organic light-emitting semiconductor display screen and manufacturing method and device thereof

Abstract

The invention discloses a silicon-based organic light-emitting semiconductor display screen and a manufacturing method and device thereof, and the method comprises the steps: manufacturing a plurality of modules on a silicon wafer, and sequentially stacking a circuit layer, an anode layer, a light-emitting layer, a packaging layer and a color film layer on each module from bottom to top; the silicon wafer is etched along the cutting channels between the circuit layers based on a preset appearance shape, a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same appearance as the preset appearance shape are obtained, and each silicon-based organic light-emitting semiconductor screen body comprises a corresponding module; based on the preset shape and the size of the silicon-based organic light-emitting semiconductor screen body, cutting the cover plate to obtain a plurality of cover plate layers with the same shape as the preset shape and the size corresponding to the silicon-based organic light-emitting semiconductor screen body; for each silicon-based organic light-emitting semiconductor screen body, the cover plate layer is attached to the color film layer of the silicon-based organic light-emitting semiconductor screen body, and the silicon-based organic light-emitting semiconductor display screen is obtained; according to the invention, the product requirements can be better met.

Description

Technical Field

[0001] The present invention relates to the technical field of organic light-emitting semiconductors, and particularly to a silicon-based organic light-emitting semiconductor display screen, a manufacturing method, a device, and a head-mounted display device thereof. Background Art

[0002] Silicon-based OLED (Organic Light-Emitting Diode) has excellent display effects due to its high resolution and high refresh rate, and is widely used in AR (Augmented Reality) & VR (Virtual Reality) devices. Among them, the existing silicon-based OLED screens are all rectangular or square in shape. For example, Figure 1 as shown, multiple rectangular or square screens are cut out from the silicon wafer. Since the cutting route of the existing silicon-based OLED screen is cut by a dicing wheel, and the dicing wheel cutting method can only cut out rectangles or squares, while the rear lens is circular in shape due to optical design and production process limitations. Therefore, when used in combination with the silicon-based OLED screen, there are many problems caused by the mismatch of their shapes. For example, it may lead to the loss of imaging effects (as Figure 2 shown) or waste of the silicon-based OLED screen (as Figure 3 shown), etc., which seriously restricts the industrial application of the silicon-based OLED screen in AR & VR devices and is difficult to meet the market demand.

[0003] In view of this, how to provide a silicon-based OLED display screen that can be made into other shapes such as circular and polygonal to better meet the market demand has become a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide a silicon-based organic light-emitting semiconductor display screen, a manufacturing method, and a device thereof, which can better meet the product requirements.

[0005] To solve the above technical problems, the embodiments of the present invention provide a manufacturing method of a silicon-based organic light-emitting semiconductor display screen, including:

[0006] Manufacturing a plurality of modules on a silicon wafer, and sequentially stacking a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer from bottom to top on the modules;

[0007] Etching the silicon wafer along the dicing channels between the circuit layers based on a preset external shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same external shape as the preset external shape, and each silicon-based organic light-emitting semiconductor screen body includes a corresponding module;

[0008] Based on the preset external shape and the size of the silicon-based organic light-emitting semiconductor screen body, the cover plate is cut to obtain a plurality of cover plate layers with the same external shape as the preset external shape and dimensions corresponding to the silicon-based organic light-emitting semiconductor screen body;

[0009] For each silicon-based organic light-emitting semiconductor screen body, the cover plate layer is attached to the color film layer of the silicon-based organic light-emitting semiconductor screen body to obtain a silicon-based organic light-emitting semiconductor display screen.

[0010] In one embodiment, the etching of the silicon wafer along the scribe lanes between the circuit layers based on the preset external shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same external shape as the preset external shape includes:

[0011] Manufacturing a plurality of isolation protection layers based on the preset external shape and the size of the circuit layer;

[0012] Respectively attach each of the isolation protection layers above each of the color film layers, and expose the scribe lanes between the circuit layers to obtain a silicon-based organic light-emitting semiconductor module;

[0013] Etch the silicon-based organic light-emitting semiconductor module to obtain a plurality of independent silicon-based organic light-emitting semiconductor sub-modules with the same external shape as the preset external shape;

[0014] Remove the isolation protection layers on each of the silicon-based organic light-emitting semiconductor sub-modules to obtain a plurality of silicon-based organic light-emitting semiconductor screen bodies.

[0015] In one embodiment, the isolation protection layer is a water-soluble protective film.

[0016] In one embodiment, the step of respectively attaching each of the isolation protection layers above each of the color film layers includes:

[0017] Under vacuum conditions, respectively attach each of the water-soluble protective films above each of the color film layers.

[0018] In one embodiment, the step of removing the isolation protection layers on each of the silicon-based organic light-emitting semiconductor sub-modules includes:

[0019] Adopt a two-fluid cleaning method to remove the water-soluble protective films on each of the silicon-based organic light-emitting semiconductor sub-modules;

[0020] Dry each of the silicon-based organic light-emitting semiconductor sub-modules after removing the water-soluble protective films.

[0021] In one embodiment, the step of cutting the cover plate includes:

[0022] Cut the cover plate by means of laser cutting.

[0023] In one embodiment, attaching the cover plate layer to the color film layer of the silicon-based organic light-emitting semiconductor screen body includes:

[0024] Applying frame glue to the silicon-based organic light-emitting semiconductor screen body;

[0025] Applying optical glue within the frame glue;

[0026] Under vacuum conditions, aligning and attaching the cover plate layer with the silicon-based organic light-emitting semiconductor screen body coated with the optical glue.

[0027] In one embodiment, the preset outer shape is circular, quasi-circular or polygonal.

[0028] An embodiment of the present invention further provides a manufacturing apparatus for a silicon-based organic light-emitting semiconductor display screen, including:

[0029] A preparation module for fabricating a plurality of modules on a silicon wafer, where a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer are stacked in sequence from bottom to top on the modules;

[0030] An etching module for etching the silicon wafer along the scribe lanes between the circuit layers based on a preset outer shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same outer shape as the preset outer shape, and each silicon-based organic light-emitting semiconductor screen body includes a corresponding module;

[0031] A cutting module for cutting a cover plate based on the preset outer shape and the size of the silicon-based organic light-emitting semiconductor screen body to obtain a plurality of cover plate layers with the same outer shape as the preset outer shape and sizes corresponding to the silicon-based organic light-emitting semiconductor screen bodies;

[0032] An attaching module for attaching the cover plate layer to the color film layer of each silicon-based organic light-emitting semiconductor screen body to obtain a silicon-based organic light-emitting semiconductor display screen.

[0033] An embodiment of the present invention further provides a silicon-based organic light-emitting semiconductor display screen, including: a silicon-based organic light-emitting semiconductor screen body with a preset outer shape and a cover plate layer attached to the silicon-based organic light-emitting semiconductor screen body; the silicon-based organic light-emitting semiconductor screen body includes a silicon substrate layer, a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer in sequence from bottom to top.

[0034] In one embodiment, the preset outer shape is circular, quasi-circular or polygonal.

[0035] The present invention also provides a head-mounted display device, and the head-mounted display device includes the silicon-based organic light-emitting semiconductor display screen as described above.

[0036] An embodiment of the present invention provides a silicon-based organic light-emitting semiconductor display screen, a manufacturing method thereof, and a device. The method includes: manufacturing a plurality of modules on a silicon wafer, and sequentially stacking a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer from bottom to top on the modules; etching the silicon wafer along the scribe lanes between the circuit layers based on a preset outer shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same outer shape as the preset outer shape, and each silicon-based organic light-emitting semiconductor screen body includes a corresponding module; cutting a cover plate based on the preset outer shape and the size of the silicon-based organic light-emitting semiconductor screen body to obtain a plurality of cover plate layers with the same outer shape as the preset outer shape and corresponding to the size of the silicon-based organic light-emitting semiconductor screen body; for each silicon-based organic light-emitting semiconductor screen body, attaching the cover plate layer to the color film layer of the silicon-based organic light-emitting semiconductor screen body to obtain a silicon-based organic light-emitting semiconductor display screen.

[0037] It can be seen that in the embodiment of the present invention, by first manufacturing a plurality of modules on a silicon wafer, and sequentially stacking a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer from bottom to top on each module, and leaving scribe lanes between the circuit layers (i.e., the modules), determining the preset outer shape according to the required outer shape of the product, and then etching the scribe lanes by etching to form a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the preset outer shape, and then cutting the cover plate into a cover plate layer with the preset outer shape and corresponding to the size of the silicon-based organic light-emitting semiconductor screen body, so as to obtain a plurality of cover plate layers, and then attaching the cover plate layer to the color film layer on the outermost layer of the silicon-based organic light-emitting semiconductor screen body, thereby forming a silicon-based organic light-emitting semiconductor display screen. In the present application, the silicon wafer can be divided into a plurality of silicon-based organic light-emitting semiconductors with a preset outer shape by etching, and the preset outer shape can be not limited to a rectangle or a square, but can also be other shapes, so as to better meet the product requirements. Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the prior art and the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 It is a schematic diagram of the outer shape of an existing silicon-based OLED screen;

[0040] Figure 2 It is a schematic diagram of the matching between an existing silicon-based OLED screen and a lens;

[0041] Figure 3 It is a schematic diagram of the matching between another existing silicon-based OLED screen and a lens;

[0042] Figure 4 Schematic flow chart of a manufacturing method of a silicon-based organic light-emitting semiconductor display screen provided by an embodiment of the present invention;

[0043] Figure 5 Schematic structural diagram of a COMS circuit layer to a color film layer in a display screen provided by an embodiment of the present invention;

[0044] Figure 6 Schematic top view structure diagram of a silicon-based OLED product provided by an embodiment of the present invention;

[0045] Figure 7 Schematic top view structure diagram of an isolation protection layer provided by an embodiment of the present invention;

[0046] Figure 8 Schematic overall top view structure diagram after an isolation protection layer is attached to a silicon-based OLED product provided by an embodiment of the present invention;

[0047] Figure 9 Schematic structure diagram after etching of a silicon-based OLED product provided by an embodiment of the present invention is completed;

[0048] Figure 10 Schematic top view structure diagram of a silicon-based OLED screen body after removing the isolation protection layer provided by an embodiment of the present invention;

[0049] Figure 11 Schematic top view structure diagram of a silicon-based OLED display screen provided by an embodiment of the present invention;

[0050] Figure 12 Schematic diagram of the matching situation between a silicon-based OLED display screen and a lens provided by an embodiment of the present invention;

[0051] Figure 13 Schematic structure diagram of a manufacturing device of a silicon-based organic light-emitting semiconductor display screen provided by an embodiment of the present invention. Detailed implementation manners

[0052] Embodiments of the present invention provide a silicon-based organic light-emitting semiconductor display screen, its manufacturing method and device, which can better meet product requirements.

[0053] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] Please refer to Figure 4 , Figure 4 , which is a schematic flow chart of a manufacturing method of a silicon-based organic light-emitting semiconductor display screen provided by an embodiment of the present invention. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen includes:

[0055] S110: Fabricate a plurality of modules on a silicon wafer, and a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer are sequentially stacked from bottom to top on the module;

[0056] It should be noted that in practical applications, the incoming wafer (i.e., the silicon wafer) can be first cleaned and detected by AOI (Automated Optical Inspection) to ensure no scratches or foreign matter contamination. Then, a plurality of CMOS (Complementary Metal Oxide Semiconductor) circuits are fabricated on the silicon wafer. In the embodiment of the present invention, the structure from one circuit layer to the color film layer is as Figure 5 shown, and the preparation process from the circuit layer to the color film layer is as follows:

[0057] Specifically, an anode can be fabricated on the circuit layer through a PVD (Physical Vapor Deposition) device to connect the light-emitting layer OLED to the CMOS circuit, complete the conduction function, and provide an anode circuit for the light-emitting layer OLED. The anode structure can be, but is not limited to, a stack of Ti / Al / TiN / ITO, and the thickness can be, but is not limited to, 15nm / 80nm / 2nm / 13nm, and patterning is achieved through a dry etching process. Then, the light-emitting layer (i.e., the OLED layer) can be fabricated through an evaporation machine, and the thickness can be, but is not limited to, 110nm. Further, the packaging layer TFE is fabricated. The TFE film layer structure can be, but is not limited to, AlO / SiN, and the thickness of the packaging layer can be, but is not limited to, 50nm / 1000nm. The packaging layer can also be TiO, SiO, SiON, etc. and their composite film layers. Further, a color film layer is fabricated on the packaging layer. The thicknesses of the R, G, and B color film layers can be equal, for example, all 2um. For details, please refer to Figure 5 .

[0058] S120: Etch the silicon wafer along the dicing streets between the circuit layers based on a preset outer shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same outer shape as the preset outer shape, and each silicon-based organic light-emitting semiconductor screen body includes a corresponding module;

[0059] It should be noted that the external shape and size of the screen can be determined in advance according to product requirements. When preparing each circuit layer, the dicing streets between the circuit layers can meet the desired external shape and size requirements. Specifically, the size of the dicing streets between the circuit layers can be 300 μm to 800 μm. Therefore, an etching process can be used to etch the silicon wafer along the dicing streets between the circuit layers according to the preset external shape, and independent silicon-based organic light-emitting semiconductor screen bodies with external shapes meeting the design requirements can be obtained.

[0060] The preset external shape in the embodiments of the present invention can be circular, quasi-circular, polygonal, etc. For example, the silicon-based OLED product is an octagon, and the distance between opposite sides is 25 mm. Specifically, as shown in Figure 6 the top view of multiple silicon-based organic light-emitting semiconductor screen bodies.

[0061] Specifically, the specific implementation process of the above S120 is as follows:

[0062] Manufacture multiple isolation protection layers based on the preset external shape and the size of the circuit layer;

[0063] Attach each isolation protection layer above each color film layer respectively, and expose the dicing streets between the circuit layers to obtain a silicon-based organic light-emitting semiconductor module;

[0064] Use a plasma cutter to etch the silicon-based organic light-emitting semiconductor module to obtain multiple independent silicon-based organic light-emitting semiconductor sub-modules with external shapes the same as the preset external shape;

[0065] Remove the isolation protection layers on each silicon-based organic light-emitting semiconductor sub-module to obtain multiple silicon-based organic light-emitting semiconductor screen bodies.

[0066] It should be noted that in the embodiments of the present invention, the isolation protection film can be cut according to the product design and the dicing street design. Specifically, multiple isolation protection layers can be obtained by cutting the isolation protection film according to information such as the preset external shape, the size of the circuit layer, the design shape and position of the dicing street. Among them, the isolation protection layer can be a water-soluble protection film (such as a PVA water-soluble film). In practical applications, the dicing street distance can be 100 to 1000 um, for example, specifically 800 um, and the thickness can be 1 to 50 um, specifically 10 um. Of course, the actual size can be determined according to actual needs, and the embodiments of the present invention do not make special limitations in this regard. For example, in the case where the silicon-based OLED product is an octagon and the distance between opposite sides is 25 mm, the shape of the cut water-soluble protection film is also an octagon, and the distance between opposite sides can be 25.4 mm. Specifically, please refer to Figure 7 the top view of each water-soluble protection film.

[0067] Specifically, after obtaining multiple water-soluble protective films, each water-soluble protective film can be respectively attached above each color film layer of the silicon-based OLED product under vacuum conditions. Among them, the attachment accuracy can be ±50um. The top view after attaching the water-soluble protective film is specifically as shown in Figure 8 shown.

[0068] Specifically, the entire silicon-based OLED module with the water-soluble protective film attached is placed in a plasma cutting machine for etching. Among them, the plasma source used in the plasma cutting machine can be selected but is not limited to SF6 or C4F8, etc. In the embodiments of the present invention, two etching gases, C4F8 and SF6, can be used alternately. Among them, C4F8 is used for passivation and SF6 is used for etching. The etching temperature can be 40-80°C. For example, the temperature can be selected as 50°C. After etching is completed according to the above conditions, as shown in Figure 9 shown.

[0069] Specifically, after etching is completed, the water-soluble protective film on each silicon-based organic light-emitting semiconductor sub-module can be removed by two-fluid cleaning, and each silicon-based organic light-emitting semiconductor sub-module after removing the water-soluble protective film is dried. Specifically, the silicon-based OLED wafer can be baked at 80°C for 40 minutes with a dryer, and then sliced to completion to form small silicon-based OLED products, that is, each silicon-based organic light-emitting semiconductor screen body is obtained, as shown in Figure 10 shown.

[0070] S130: Based on the preset outer shape and the size of the silicon-based organic light-emitting semiconductor screen body, the cover plate is cut to obtain multiple cover plate layers with the same outer shape as the preset outer shape and the size corresponding to the silicon-based organic light-emitting semiconductor screen body;

[0071] It should be noted that the cover plate in the embodiments of the present invention can be a glass cover plate. Combining the preset outer shape (such as a circle or a polygon) and the size of the silicon-based organic light-emitting semiconductor screen body, the glass cover plate is cut by laser to obtain multiple cover plate layers with a circular or polygonal outer shape. The size of the cover plate layer can be greater than or equal to the silicon-based OLED screen. In the embodiments of the present invention, in order to be relative to the above, the cover plate layer can be an octagon with a size of 26mm.

[0072] Specifically, after cutting is completed, each cover plate layer can be cleaned and inspected by AOI to ensure that the glass is clean, without scratches or foreign matter contamination.

[0073] S140: For each silicon-based organic light-emitting semiconductor screen body, the cover plate layer is attached to the color film layer of the silicon-based organic light-emitting semiconductor screen body to obtain a silicon-based organic light-emitting semiconductor display screen.

[0074] It should be noted that after obtaining multiple cover layers and multiple silicon-based organic light-emitting semiconductor screens, frame glue can be coated on the silicon-based organic light-emitting semiconductor screens. The coating width can specifically be 300 - 500 um. After the frame glue is coated, optical glue (OCR) can be coated inside the frame glue, and the coating thickness can be 1 - 4 um. Then, under vacuum conditions, the cover layer is aligned and bonded to the silicon-based organic light-emitting semiconductor screen coated with optical glue, specifically as Figure 11 shown. Thus, the module process is completed, and a nearly circular or circular silicon-based OLED screen that can be used in AR or VR devices can be formed, which can be highly matched with the optical machine lens in the subsequent stage. The specific matching situation is as Figure 12 shown

[0075] It can be seen that in the embodiment of the present invention, by first sequentially fabricating multiple circuit layers, anode layers, light-emitting layers, encapsulation layers, and color film layers on a silicon wafer, cutting channels are left between the circuit layers, and a preset shape is determined according to the required shape of the product. Then, the cutting channels are etched by an etching method to form multiple independent silicon-based organic light-emitting semiconductor screens with the preset shape. Then, the cover plate is cut into cover layers with the preset shape and dimensions corresponding to those of the silicon-based organic light-emitting semiconductor screens, thereby obtaining multiple cover layers. Then, the cover layers are attached to the color film layer on the uppermost layer of the silicon-based organic light-emitting semiconductor screen, thereby forming a silicon-based organic light-emitting semiconductor display screen. In this application, the silicon wafer can be divided into multiple silicon-based organic light-emitting semiconductors with a preset shape by an etching method. The preset shape can be not limited to rectangles or squares, but can also be other shapes, so that the product requirements can be better met.

[0076] That is to say, adopting the manufacturing method provided in the embodiment of the present invention can make the cut silicon-based OLED screen circular or polygonal, with a higher matching degree with the optical machine lens in the subsequent stage, resulting in a better imaging effect, avoiding problems such as waste of the silicon-based OLED display screen or lack of imaging effect, and greatly meeting the requirements of AR or VR devices for silicon-based OLEDs.

[0077] Based on the above embodiments, the embodiment of the present invention further provides a manufacturing apparatus for a silicon-based organic light-emitting semiconductor display screen. Specifically, please refer to Figure 13 , and the apparatus includes:

[0078] A preparation module 11, configured to sequentially fabricate multiple circuit layers, multiple anode layers, multiple light-emitting layers, multiple encapsulation layers, and multiple color film layers on a silicon wafer from bottom to top, with the circuit layers, anode layers, light-emitting layers, encapsulation layers, and color film layers corresponding one by one;

[0079] The etching module 12 is used to etch a silicon wafer along the scribe lines between each circuit layer based on a preset outer shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor panels with the same outer shape as the preset outer shape, and each silicon-based organic light-emitting semiconductor panel includes a corresponding module;

[0080] The cutting module 13 is used to cut a cover plate based on the preset outer shape and the size of the silicon-based organic light-emitting semiconductor panel to obtain a plurality of cover plate layers with the same outer shape as the preset outer shape and corresponding to the silicon-based organic light-emitting semiconductor panel in size;

[0081] The laminating module 14 is used to laminate a cover plate layer on the color film layer of each silicon-based organic light-emitting semiconductor panel to obtain a silicon-based organic light-emitting semiconductor display screen. It should be noted that the manufacturing device of the silicon-based organic light-emitting semiconductor display screen provided in the embodiments of the present invention has the same beneficial effects as the manufacturing method of the silicon-based organic light-emitting semiconductor display screen involved in the above embodiments, and for the specific introduction of the manufacturing method of the silicon-based organic light-emitting semiconductor display screen involved in the embodiments of the present invention, please refer to the above embodiments, and the present application will not elaborate here.

[0082] Based on the above embodiments, the embodiments of the present invention further provide a silicon-based organic light-emitting semiconductor display screen, including: a silicon-based organic light-emitting semiconductor panel with a preset outer shape and a cover plate layer attached to the silicon-based organic light-emitting semiconductor panel; the silicon-based organic light-emitting semiconductor panel sequentially includes a silicon substrate layer, a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer from bottom to top.

[0083] In practical applications, the preset outer shape in the embodiments of the present invention is circular, quasi-circular or polygonal, so as to realize the preparation of products with shapes other than rectangular or square, and better meet the product requirements.

[0084] Based on the above embodiments, the present invention further provides a head-mounted display device, and the head-mounted display device includes the silicon-based organic light-emitting semiconductor display screen as described above.

[0085] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0086] It should also be noted that in this specification, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0087] The foregoing description of the disclosed embodiments enables those skilled in the art to practice or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A manufacturing method of a silicon-based organic light-emitting semiconductor display screen, characterized in that, Including: Manufacturing a plurality of modules on a silicon wafer, with a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer stacked in sequence from bottom to top on the module; Etching the silicon wafer along the dicing streets between the circuit layers based on a preset external shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same external shape as the preset external shape, and each silicon-based organic light-emitting semiconductor screen body includes a corresponding module; Cutting a cover plate based on the preset external shape and the size of the silicon-based organic light-emitting semiconductor screen body to obtain a plurality of cover plate layers with the same external shape as the preset external shape and corresponding to the silicon-based organic light-emitting semiconductor screen body in size; For each silicon-based organic light-emitting semiconductor screen body, attaching the cover plate layer to the color film layer of the silicon-based organic light-emitting semiconductor screen body to obtain a silicon-based organic light-emitting semiconductor display screen.

2. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 1, characterized in that The etching the silicon wafer along the dicing streets between the circuit layers based on a preset external shape to obtain a plurality of independent silicon-based organic light-emitting semiconductor screen bodies with the same external shape as the preset external shape includes: Manufacturing a plurality of isolation protection layers based on the preset external shape and the size of the circuit layer; Respectively attaching each of the isolation protection layers above each of the color film layers and exposing the dicing streets between the circuit layers to obtain a silicon-based organic light-emitting semiconductor module; Etching the silicon-based organic light-emitting semiconductor module to obtain a plurality of independent silicon-based organic light-emitting semiconductor sub-modules with the same external shape as the preset external shape; Removing the isolation protection layers on each of the silicon-based organic light-emitting semiconductor sub-modules to obtain a plurality of silicon-based organic light-emitting semiconductor screen bodies.

3. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 2, characterized in that, The isolation protection layer is a water-soluble protective film.

4. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 3, characterized in that, The respectively attaching each of the isolation protection layers above each of the color film layers includes: Under a vacuum condition, respectively attaching each of the water-soluble protective films above each of the color film layers.

5. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 3, characterized in that, The removing the isolation protection layers on each of the silicon-based organic light-emitting semiconductor sub-modules includes: Removing the water-soluble protective films on each of the silicon-based organic light-emitting semiconductor sub-modules by using a two-fluid cleaning method; Performing a drying treatment on each of the silicon-based organic light-emitting semiconductor sub-modules after removing the water-soluble protective films.

6. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 3, wherein, The cutting the cover plate includes: Cutting the cover plate by using a laser cutting method.

7. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 3, characterized in that, The attaching the cover plate layer to the color film layer of the silicon-based organic light-emitting semiconductor screen body includes: Applying a frame adhesive to the silicon-based organic light-emitting semiconductor screen body; Coating an optical adhesive in the frame adhesive; Under a vacuum condition, aligning and attaching the cover plate layer with the silicon-based organic light-emitting semiconductor screen body coated with the optical adhesive.

8. The manufacturing method of the silicon-based organic light-emitting semiconductor display screen according to claim 3, characterized in that, The preset external shape is a circle, a quasi-circle, or a polygon.

9. A manufacturing apparatus for a silicon-based organic light-emitting semiconductor display screen, characterized in that, Including: A preparation module for manufacturing a plurality of modules on a silicon wafer, with a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer stacked in sequence from bottom to top on the module; An etching module, configured to etch the silicon wafer along the dicing streets between the circuit layers based on a preset outer shape, so as to obtain a plurality of independent silicon-based organic light-emitting semiconductor screens with the same outer shape as the preset outer shape, and each silicon-based organic light-emitting semiconductor screen includes a corresponding module; A cutting module, configured to cut the cover plate based on the preset outer shape and the size of the silicon-based organic light-emitting semiconductor screen, so as to obtain a plurality of cover plate layers with the same outer shape as the preset outer shape and sizes corresponding to the silicon-based organic light-emitting semiconductor screens; A bonding module, configured to bond the cover plate layer to the color film layer of each silicon-based organic light-emitting semiconductor screen to obtain a silicon-based organic light-emitting semiconductor display screen.

10. A silicon-based organic light-emitting semiconductor display screen, characterized in that, Comprising: A silicon-based organic light-emitting semiconductor screen with a preset outer shape and a cover plate layer attached to the silicon-based organic light-emitting semiconductor screen; The silicon-based organic light-emitting semiconductor screen sequentially includes a silicon substrate layer, a circuit layer, an anode layer, a light-emitting layer, a packaging layer, and a color film layer from bottom to top.

11. The silicon-based organic light-emitting semiconductor display screen according to claim 10, characterized in that, The preset outer shape is circular, quasi-circular or polygonal.

12. A head-mounted display device, characterized in that, The head-mounted display device includes the silicon-based organic light-emitting semiconductor display screen according to any one of claims 10 to 11.

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