Bitmap processing method and laser processing equipment

Through the bitmap processing method, the bitmap dot matrix information of the image is obtained and the processing time of the laser at each processing point is controlled, which solves the problem of inaccurate laser power control, and realizes the precise control of the depth of laser processing traces and the improvement of image resolution.

CN120228388APending Publication Date: 2025-07-01SHENZHEN MAKER WORKS TECH CO LTD
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Patent Information

Application Number
CN202411682943.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-12-29
Filing Date
2024-11-22
Publication Date
2025-07-01

AI Technical Summary

Technical Problem

In the prior art, when processing traces of different depths are achieved by controlling the power magnitude of the laser emitted by the laser, there is a problem of poor power linearity and consistency, resulting in inaccurate control of the depth of the processing trace.

Method used

The bitmap processing method is used to obtain the bitmap dot matrix information of the image to be processed, including the position and depth information of each processing point, and the laser processing time of each processing point is determined based on the depth information, so that the laser outputs laser at each processing point with constant power, and controls the laser processing time to achieve accurate depth control.

Benefits of technology

The processing control accuracy of laser processing trace depth can better show the grayscale changes in the processing materials, improve image resolution, reduce the difficulty of controlling the laser movement speed, and improve the processing effect.

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Abstract

The invention provides a bitmap processing method and laser processing equipment, and the bitmap processing method comprises the following steps: obtaining bitmap dot matrix information of an image to be processed, the bitmap dot matrix information comprising position information and depth information of each processing point; determining the laser processing duration of each processing point according to the depth information of each processing point; and moving the laser to each processing point, and outputting laser at constant power to process each processing point in the corresponding laser processing duration. And the processing control precision of the laser processing trace depth can be improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to a bitmap processing method and a laser processing device. Background Art

[0002] With the development of laser processing technology, the application scope of laser processing is becoming more and more extensive, and the requirements for laser processing are also becoming more and more complex; for example, it is necessary to process processing traces with different depths on the processing material. In the related art, different depths of processing traces are processed by controlling the power of the laser emitted by the laser. However, when the power linearity and consistency of the laser are relatively poor, there is a problem that the output light power cannot be accurately controlled, and the depth of the processing trace cannot be accurately controlled. Summary of the Invention

[0003] The main object of the present invention is to provide a bitmap processing method and a laser processing device, aiming to improve the processing control accuracy of the depth of the laser processing trace.

[0004] To achieve the above object, a bitmap processing method proposed by the present invention includes the following steps:

[0005] Obtain the bitmap dot matrix information of the image to be processed, where the bitmap dot matrix information includes the position information and depth information of each processing point;

[0006] Determine the laser processing duration of each processing point according to the depth information of each processing point;

[0007] Move the laser to each processing point, and output laser at a constant power to process each processing point for the corresponding laser processing duration.

[0008] In an embodiment of the present application, the step of moving the laser to each processing point and outputting laser at a constant power to process each processing point for the corresponding laser processing duration includes:

[0009] Move the laser to each processing point and stay at each processing point for a constant time. During the stay of the laser, turn on the laser at a constant power for the corresponding laser processing duration to process the current processing point;

[0010] Wherein, the laser processing duration required for the laser to process the maximum processing depth of the image to be processed does not exceed the constant stay time.

[0011] In an embodiment of the present application, the step of moving the laser to each processing point and staying at each processing point for a constant time, and turning on the laser at a constant power for the corresponding laser processing duration to process the current processing point during the stay of the laser includes:

[0012] After the laser stays stably at the current processing point, turn on the laser at a constant power for the corresponding laser processing duration to process the current processing point;

[0013] After the laser stays at the current processing point for a constant residence time, move the laser to the next processing point for processing until all processing points are processed.

[0014] In an embodiment of the present application, before the step of turning on the laser to output laser at a constant power to process the current processing point after the laser stays stably at the current processing point, it further includes:

[0015] Obtain the residence time of the laser at the current processing point, and determine that the laser stays stably when the residence time reaches the preset stable time.

[0016] In an embodiment of the present application, the step of moving the laser to each processing point and staying at each processing point for a constant time includes:

[0017] Move the laser to each processing point at a uniform speed and stay at each processing point for a constant time.

[0018] In an embodiment of the present application, after the step of obtaining the bitmap dot matrix information of the image to be processed, it further includes:

[0019] Determine the laser processing duration when processing the maximum processing depth according to the preset power of the laser emitted by the laser and the maximum processing depth of the image to be processed;

[0020] Determine the constant residence time of the laser according to the laser processing duration and the preset stable time;

[0021] Determine the laser processing speed according to the constant residence time and the number information of the processing points;

[0022] In an embodiment of the present application, after the step of obtaining the bitmap dot matrix information of the image to be processed, it further includes:

[0023] Obtain the constant residence time of the laser at each processing point according to the number information of the processing points and the preset processing speed;

[0024] Determine the longest processing time of the laser at the processing point according to the constant residence time of the laser and the preset stable time;

[0025] Determine the constant power of the laser emitted by the laser according to the longest processing time and the maximum processing depth of the image to be processed.

[0026] In an embodiment of the present application, the step of determining the laser processing duration of each processing point according to the depth information of each processing point includes;

[0027] Obtain the depth ratio between the processing depth of the target processing point and the standard depth;

[0028] Determine the laser processing duration of the target processing point according to the depth ratio and the standard processing time of the standard processing depth, and the product of the depth ratio and the standard processing time is positively correlated with the laser processing duration.

[0029] In an embodiment of the present application, before the step of obtaining the depth ratio between the processing depth of the target processing point and the standard depth, the following steps are further included:

[0030] Obtain the maximum processing depth of the to-be-processed image as the standard depth, and use the processing time for processing the maximum processing depth as the standard processing time.

[0031] The present application also proposes a laser processing device, and the laser processing device applies the bitmap processing method described in any of the foregoing embodiments.

[0032] The technical solution of the present application uses the bitmap processing method to process and form a to-be-processed image on the processing material. The to-be-processed image is divided into multiple processing points to form a bitmap dot matrix image, and the laser is emitted by the laser at a constant power to process each processing point; wherein, the laser processing duration of the laser at each processing point is adjusted according to the depth information of each processing point, so that processing traces with the required depth can be processed at each processing point. When the laser processing power is constant, the laser energy emitted by the laser at the processing point changes approximately linearly with time, and it is more convenient to control by controlling the laser processing duration, so as to process processing traces with different depths, improve the processing accuracy of the laser processing device when processing processing traces with different depths on the processing material, and improve the processing control accuracy of the depth of the laser processing traces. It can better display the gray-scale change of the processed image formed on the processing material and improve the image resolution. Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0034] Figure 1 It is a flowchart of the first embodiment of the bitmap processing method of the present application;

[0035] Figure 2 It is a flowchart of the second embodiment of the bitmap processing method of the present application;

[0036] Figure 3 It is a flowchart of the third embodiment of the bitmap processing method of the present application;

[0037] Figure 4 It is a flowchart of the fourth embodiment of the bitmap processing method of the present application;

[0038] Figure 5 It is a flowchart of the fifth embodiment of the bitmap processing method of the present application;

[0039] Figure 6 It is a flowchart of the sixth embodiment of the bitmap processing method of the present application;

[0040] Figure 7 It is a flowchart of the seventh embodiment of the bitmap processing method of the present application;

[0041] Figure 8 It is a flowchart of the eighth embodiment of the bitmap processing method of the present application;

[0042] Figure 9 It is a flowchart of the ninth embodiment of the bitmap processing method of the present application;

[0043] Figure 10 It is a schematic diagram showing the relationship between the residence time at each point and the light emission time in some embodiments of the bitmap processing method according to the present application.

[0044] The realization of the object of the present invention, functional features and advantages will be further described in conjunction with the embodiments with reference to the accompanying drawings. Detailed Embodiments

[0045] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0046] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0047] In the present invention, unless otherwise clearly defined and limited, the terms "connection", "fixation", etc. shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0048] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments may be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0049] The present invention provides a bitmap processing method, which can be applied to laser processing equipment such as laser engraving equipment or laser drilling equipment to improve the processing accuracy when processing different depths of processing marks on a processing material.

[0050] Please refer to Figure 1 , in some embodiments of the present application, the bitmap processing method includes the following steps:

[0051] Step S10, obtaining bitmap dot matrix information of an image to be processed, where the bitmap dot matrix information includes position information and depth information of each processing point.

[0052] Specifically, in the embodiments of the present application, a bitmap image is formed on a processing material by using a bitmap processing method. Among them, a bitmap image is also called a dot matrix image or a raster image and is composed of many pixel points. When a bitmap is enlarged, countless individual squares that make up the entire image can be seen. The effect of enlarging the bitmap size is to increase the individual pixels, making the lines and shapes appear jagged. However, if the bitmap image is reduced or viewed from a slightly farther position, the color and shape of the bitmap image appear continuous. When the gray level change of each pixel point of the bitmap image is smoother, the display effect of the bitmap image is better.

[0053] The bitmap processing method is to perform dot matrix marking on the processing material according to the characteristics of the bitmap, and process processing marks corresponding to each pixel point on the processing material according to the arrangement of the pixel points of the bitmap image. When using laser processing to process a bitmap image on a processing material, the gray level of each pixel point of the bitmap image directly corresponds to the depth of each processing point. Therefore, it is necessary to accurately control the processing depth of each processing point on the processing material to improve the image processing effect and resolution.

[0054] In the embodiments of the present application, an image to be processed on a processing material is obtained and converted into a bitmap image. Then, the bitmap dot matrix information of the image to be processed can be obtained according to the bitmap image. The bitmap dot matrix information includes the positions of each processing point to be processed on the processing material and the processing depth of each processing point.

[0055] Step S30: Determine the laser processing duration of each processing point according to the depth information of each processing point.

[0056] Step S50: Move the laser to each processing point, and output laser at a constant power to process each processing point for the corresponding laser processing duration.

[0057] In the embodiment of the present application, the processing depth of each processing point is controlled by controlling the laser processing time of the laser at each processing point. In this process, the laser emits laser at a constant power; with such a setting, it is not necessary to continuously adjust the laser output power during the laser processing process, thus avoiding the problems of inconvenient control and inaccurate control of the depth of the processing marks caused by poor linearity and consistency of the laser output power.

[0058] When the laser output power is constant, the laser energy used to process the processing point changes approximately linearly with time. By controlling the laser processing duration at the processing point, it is more convenient to control the processing depth at the processing point, so that the processing control accuracy of the processing depth can be improved, the required depth can be better processed, and the processing effect can be improved.

[0059] After obtaining the bitmap dot matrix information of the image to be processed, that is, the positions and processing depths of each processing point, the laser processing duration of each processing point can be determined in advance according to the obtained bitmap dot matrix information. The method for obtaining the laser processing duration of each processing point can be, for example, to first determine the laser power, and then obtain the laser processing duration according to the laser power and the processing depth of the processing point; it can also be to first determine the processing time that can be used to process the processing point when processing the maximum processing depth according to the required laser processing speed and the maximum processing depth of the image to be processed, and then determine the laser power and construct the mapping relationship between the processing depth or depth interval and the laser processing time based on this, so as to obtain the laser processing duration of the processing points with different processing depths.

[0060] When moving the laser to move the laser to the positions of each processing point to emit laser to process each processing point, process each processing point according to the determined laser processing duration of each processing point, so as to obtain the required depth. Among them, the control of the laser processing duration of each processing point can be such that the laser stays at each processing point for a certain time, and the laser is turned on for processing according to the required laser processing duration of the current processing point during the stay; with the development of laser technology, it can be such that the laser continues to move, and the moving speed changes continuously according to the laser processing time at each processing point. For example, the laser is continuously turned on, and the speed at which the laser moves through the processing point is controlled to control the time required for the laser to pass through the processing point, so that the time for the laser to pass through the processing point matches the laser processing time at the processing point, and the laser processes the required depth at the processing point during the process of passing through the processing point.

[0061] Therefore, it can be understood that in the technical solution of the present application, the to-be-processed image is processed and formed on the processing material by means of bitmap processing. The to-be-processed image is divided into multiple processing points to form a bitmap dot matrix image, and the laser is kept emitting laser at a constant power to process each processing point; wherein, according to the depth information of each processing point, the laser processing duration of the laser at this processing point is adjusted, so that processing traces with the required depth can be processed at each processing point. When the laser processing power is constant, the laser energy emitted by the laser at the processing point changes approximately linearly with time. By controlling the laser processing duration, it is more convenient to control, so that processing traces with different depths can be processed, the processing accuracy of the laser processing equipment when processing processing traces with different depths on the processing material is improved, and the processing control accuracy of the depth of the laser processing traces is improved. The gray-scale change of the processed image formed on the processing material can be better displayed, and the image resolution is improved.

[0062] It should be noted that the step numbers in the embodiments of the present application do not represent the sequence of step execution, but are only for convenience of description.

[0063] With reference to Figure 2 and Figure 10 , in some embodiments of the present application, the step of moving the laser to each processing point and outputting laser at a constant power to process each processing point for the corresponding laser processing duration includes:

[0064] Step S51, moving the laser to each processing point and staying at each processing point for a constant time, and during the stay of the laser, turning on the corresponding laser processing duration at a constant power to process the current processing point.

[0065] Among them, the laser processing duration required for the maximum processing depth of the to-be-processed image by the laser does not exceed the constant stay time.

[0066] It should be noted that for the embodiment of controlling the moving speed of the laser to pass through the processing point so that the laser processes the corresponding duration at this processing point during the process of passing through the processing point; since the stay time of the laser at each processing point is related to the moving speed of the laser, and the moving speed of the laser cannot change suddenly, it can only be accelerated and decelerated through a fixed acceleration. For example, if the processing time of the current processing point is 100 and the processing time of the next processing point is 1, then the moving speed of the laser needs to be immediately accelerated to 100 times, which is obviously difficult to achieve. Therefore, it is difficult to directly control the moving speed of the laser to control the processing time length of the laser at each processing point. And if the laser is always kept in a moving state during the processing of the processing point, it is also easy to affect the processing effect at the processing point.

[0067] In this embodiment, when the laser moves to each processing point, it stays at each processing point for a certain period of time. That is, the laser adopts a one-step-one-stop movement mode during the process of moving to each processing point. When the laser stays, the laser is controlled to emit light to process the current processing point for the corresponding laser processing duration. Such a setting avoids affecting the processing effect due to the movement of the laser during the processing; and only the staying time of the laser at each processing point needs to be controlled. The moving speed of the laser between moving from one processing point to the next processing point can be kept constant, and there is no need to repeatedly adjust the moving speed of the laser; the moving speed of the laser between moving from one processing point to the next processing point can also be different, but there is no need to adjust it according to the laser processing duration, so there is no problem that the speed of the laser needs to change stepwise rapidly, which can reduce the control difficulty and the performance requirements for the laser processing equipment.

[0068] In some embodiments, the movement of the laser can be driven by a servo motor, and the servo motor is driven to make the laser achieve one-step-one-stop through a controller, an encoder, etc. The laser can also be driven by a stepper motor in the following embodiments.

[0069] In addition, when the laser moves to the current processing point, the laser is turned on to process the current processing point. It can be that the laser emits laser light when it reaches the processing point. After the laser emission time reaches the laser processing time of the current processing point, the laser output is stopped until the stepper motor receives the next pulse to drive the laser to move to the next processing point. It can also be that the laser emits laser light to process the current processing point after a period of time after reaching the processing point, so as to process the processing point after the laser stays stably; during this process, it can be by judging the remaining staying duration of the laser at the current processing point. When the remaining staying duration is the same as the laser processing duration of the current processing point, the laser is turned on for processing, so that the laser is driven by the stepper motor to move to the next processing point at the same time as the processing is completed; or, the laser is turned on immediately or after a period of time after staying stably. After the laser emission time reaches the laser processing time of the current processing point, the laser output is stopped until the stepper motor receives the next pulse to drive the laser to move to the next processing point.

[0070] In addition, the staying time of the laser at each processing point is the same. Among them, the constant staying time of the laser at the processing point is not less than the laser processing duration when the laser processes at the maximum processing depth, so that the laser has sufficient time to process the processing point during the staying process at each processing point.

[0071] Refer to in combination Figure 3 and Figure 10, in some embodiments of the present application, the step of moving the laser to each processing point and staying at each processing point for a constant time, and during the stay of the laser, turning on the laser at a constant power for the corresponding laser processing duration to process the current processing point includes:

[0072] Step S512, when the laser stays stably at the current processing point, turn on the laser at a constant power for the corresponding laser processing duration to process the current processing point.

[0073] Step S514, when the laser stays at the current processing point for the constant stay time, move the laser to the next processing point for processing until all processing points are processed.

[0074] When the stepper motor drives the laser to move to the processing point, the laser and the stepper motor may have a jittery and unstable situation. Ensure that the laser stays stably at the current processing point before turning on the laser to process the processing point, so as to improve the processing quality of the current processing point. Among them, to determine whether the laser stays stably, it can be to use a vision device or a vibration sensor, etc. to detect the stay state of the laser. It can also be by judging the stay time of the laser. For example, the stay time required for the laser to stay stably is determined in advance and written into the control program. When the stay time of the laser reaches the determined stay time, it is determined that the laser has stayed stably at the current processing point, so that the laser can start emitting laser to process the current processing point.

[0075] Please refer to Figure 4 , in some embodiments of the present application, before the step of when the laser stays stably at the current processing point, turning on the laser at a constant power for the corresponding laser processing duration to process the current processing point, further includes:

[0076] Step S511, obtain the stay time of the laser at the current processing point, and judge that the laser stays stably when the stay time reaches the preset stable time.

[0077] In the embodiments of the present application, it is judged whether the laser stays stably at the current processing point by judging the stay time of the laser. Among them, the stable time T1 required for the laser to reach a stable stay state after reaching the processing point is determined in advance, and the determined stable time is written into the control program as the preset stable time. When the stepper motor drives the laser to move to the current processing point and has stayed for the preset stable time, it is judged that the laser has stayed stably at the current processing point, and then the laser starts emitting laser to process the current processing point. Among them, the stable time of the laser can be determined by the parameter characteristics of the selected stepper motor, etc., or can be determined according to the experimental results. The technical solution of this embodiment is used to judge the stay state of the laser, so that there is no need to set sensors, etc. in the laser processing equipment to detect the stay state of the laser.

[0078] Please refer to Figure 5 , in some embodiments of the present application, the step of moving the laser to each processing point and staying at each processing point for a constant time, and during the stay of the laser, turning on the laser at a constant power for the corresponding laser processing duration to process the current processing point includes:

[0079] Step S515, move the laser to each processing point at a uniform speed and stay at each processing point for a constant time, and during the stay of the laser, turn on the laser at a constant power for the corresponding laser processing duration to process the current processing point.

[0080] In this embodiment, a stepper motor can be used to drive the laser to move at a uniform speed. Although the stepper motor also runs continuously, the driving mode of the stepper motor is to give a pulse and the motor takes one step; that is, the movement of the stepper motor driving the laser is "stop-and-go". When the stepper motor drives the laser to move to a processing point, before receiving the next pulse, the stepper motor and the laser stay at the current processing point, so that the laser can be turned on to process the current processing point during the stay before the stepper motor receives the next pulse. Only by setting the frequency of the pulse can the laser stay at each laser point for a constant time, which is convenient to control. In addition, compared with the method of using a servo motor to drive the laser to move, the running load can be reduced, and the problem that the motor is easily damaged due to repeated starting and stopping of the motor can be avoided.

[0081] Please refer to Figure 6 , in some embodiments of the present application, after the step of obtaining the bitmap dot matrix information of the image to be processed, the following steps are further included:

[0082] Step S11, obtain the constant stay time of the laser at each processing point according to the number information of the processing points and the preset processing speed.

[0083] In this embodiment, first determine the preset processing speed of this laser processing task. The preset processing speed is the preset laser processing speed, that is, the speed at which the laser moves on the surface of the workpiece; when starting the laser processing task, obtain the number information of the processing points of the image to be processed and the position information of each processing point. Determine the movement path of the laser according to the position information of each processing point. According to the preset processing speed and the number information of the processing points, the number of processing points passed by the laser per unit time can be determined; since the stay time of the laser at each processing point is the same, the constant stay time of the laser at each processing point can be determined accordingly, and then the output power of the laser can be determined according to the constant stay time and the like.

[0084] Step S13, determine the longest processing time of the laser at the processing point according to the constant stay time of the laser and the preset stable time;

[0085] Step S15: Determine the constant power of the laser emitted by the laser according to the longest processing time and the maximum processing depth of the image to be processed.

[0086] In a laser processing device, the greater the laser power of the laser, the stronger the output laser energy, and the greater the processing depth on the processed material per unit time. In the embodiments of the present application, the laser is used to process each processing point with a constant power, so as to facilitate controlling the processing depth of each processing point by controlling the laser processing duration of the laser at each processing point. When the laser moves to the processing point, in order to improve the processing effect, it is necessary to make the laser stay stable before emitting laser. Therefore, the longest time for the laser to emit laser at the processing point is (T0 - T1), where T0 is the residence time of the laser at the processing point, and T1 is the residence time required for the laser to stay in a stable state. In this embodiment, the longest processing time P for the laser to process the processing point does not exceed (T0 - T1); the longest processing time when the laser processes at the maximum processing depth is preset, and then the constant power output by the laser can be determined according to the laser processing duration when processing the processing point with the maximum processing depth, so as to ensure that the laser can process each processing point to the required processing depth within the residence period, and has good processing quality and effect.

[0087] Please refer to Figure 7 , in some embodiments of the present application, after the step of obtaining the bitmap dot matrix information of the image to be processed, the following steps are further included:

[0088] Step S12: Determine the laser processing duration when processing at the maximum processing depth according to the preset power of the laser emitted by the laser and the maximum processing depth of the image to be processed;

[0089] Step S14: Determine the constant residence time of the laser according to the laser processing duration and the preset stable time;

[0090] Step S16: Determine the laser processing speed according to the constant residence time and the number information of the processing points.

[0091] Different from the previous embodiment, in this embodiment, the constant power of the laser emitted by the laser is first determined, and the laser processing duration required for the laser to process the maximum processing depth of the image to be processed on the processed material with this constant power is judged. Then, the residence time of the laser at the processing point is determined according to the laser processing duration and the preset stable time when the laser stays stable; and the laser is driven by a stepping motor to move at a constant speed. Therefore, the laser processing speed, that is, the speed at which the laser moves on the surface of the workpiece, can be determined accordingly, and the stepping motor is used to drive the laser to move at the determined laser processing speed, so as to ensure that the laser has sufficient time to emit laser when processing each processing point with the current constant power to obtain the required processing depth.

[0092] Please refer to Figure 8 , in some embodiments of the present application, the step of determining the laser processing duration of each processing point according to the depth information of each processing point includes;

[0093] Step S31, obtaining the depth ratio between the processing depth of the target processing point and the standard depth;

[0094] Step S33, determining the laser processing duration of the target processing point according to the depth ratio and the standard processing time of the standard processing depth, and the product of the depth ratio and the standard processing time is positively correlated with the laser processing duration.

[0095] In the embodiments of the present application, the processing depth of each processing point is controlled by controlling the laser processing time of the laser at each processing point. In this process, the laser emits laser at a constant power. When the laser emission power is constant, the laser energy used for processing the processing point changes approximately linearly with time. Therefore, the depth of processing at the processing point can be controlled by controlling the laser processing duration at the processing point. In the embodiments of the present application, a standard depth can be set, and the standard processing duration T for processing this standard depth is obtained according to the laser emission power; then, the depth ratio △h between the processing depth of the target processing point to be determined and the standard depth can be obtained, and the laser processing duration t of this processing point is obtained by multiplying the standard processing duration T by the depth ratio △h (T * △h). It is also possible to first determine the standard depth and the standard processing duration, then determine the laser emission power, and according to the depth ratio between the processing depth of the target processing point to be determined and the standard depth, the laser processing duration t of this processing point is obtained by multiplying the standard processing duration T by the depth ratio △h (T * △h).

[0096] Please refer to Figure 9 , in some embodiments of the present application, before the step of obtaining the depth ratio between the processing depth of the target processing point and the standard depth, it further includes:

[0097] Step S20, obtaining the maximum processing depth of the to-be-processed image as the standard depth, and taking the processing time of processing the maximum processing depth as the standard processing time.

[0098] In this embodiment, after obtaining the bitmap dot matrix information of the image to be processed, the maximum processing depth of each processing point of the image to be processed is obtained, and the maximum processing depth is used as the standard depth. Then, the processing time for processing the maximum processing depth can be determined according to the processing speed requirement or processing power, etc., and this processing time is used as the standard processing time. For example, the laser processing speed of this processing task can be determined first according to the processing requirement, so that the preset processing time for setting the maximum processing depth can be used as the standard processing time for the constant residence time at each processing point; alternatively, the constant power of the laser for this processing task is determined first, and the processing time for processing the maximum processing depth is determined according to the constant power as the standard processing time. Then, when judging the processing time of each processing point, the maximum processing depth and the processing time for processing the maximum processing depth can be used as the judgment basis to determine the required laser processing duration for the processing points with different processing depths.

[0099] The present application also proposes a laser processing device, and the laser processing device applies the bitmap processing method as described in any of the foregoing embodiments. The laser processing device proposed by the present application can be a laser engraving machine, and when using this laser processing device for bitmap processing, it executes the bitmap processing method in any of the foregoing embodiments. Of course, other control methods can also be set in the control program of the laser processing device. For example, a vector processing control method or other bitmap processing control methods can be set to improve the flexibility of use of the laser processing device, enable users to have more processing method options, and meet the processing requirements of more materials and more scenarios.

[0100] Since the laser processing device proposed by the present application applies all the technical solutions of all the foregoing embodiments, it at least has all the beneficial effects brought by all the foregoing technical solutions, which are not limited herein.

[0101] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A bitmap processing method, characterized in that: The steps include: Acquire bitmap dot matrix information of the image to be processed, wherein the bitmap dot matrix information includes position information and depth information of each processing point; Determine the laser processing time of each processing point according to the depth information of each processing point; The laser is moved to each processing point, and the laser is output at a constant power to process each processing point for a corresponding laser processing time.

2. The bitmap processing method according to claim 1, characterized in that: The steps of moving the laser to each processing point and outputting laser at a constant power to process each processing point for a corresponding laser processing time include: The laser is moved to each processing point and stays at each processing point for a constant time. During the laser stay, the laser is turned on at a constant power for a corresponding laser processing time to process the current processing point; The laser processing time required for the laser to process the maximum processing depth of the image to be processed does not exceed the constant dwell time.

3. The bitmap processing method according to claim 2, characterized in that: The steps of moving the laser to each processing point and staying at each processing point for a constant time, and turning on the laser at a constant power for a corresponding laser processing time to process the current processing point during the laser stay process include: When the laser stays stable at the current processing point, the laser is turned on at a constant power for a corresponding laser processing time to process the current processing point; When the laser stays at the current processing point for a constant dwell time, the laser moves to the next processing point for processing until all processing points are completed.

4. The bitmap processing method according to claim 3, characterized in that: Before the step of starting the laser at a constant power for a corresponding laser processing time to process the current processing point after the laser stays stable at the current processing point, the method further includes: Get the laser's dwell time at the current processing point, and determine that the laser is stable when the dwell time reaches the preset stabilization time.

5. The bitmap processing method according to claim 4, characterized in that: The step of moving the laser to each processing point and staying at each processing point for a constant time comprises: The laser moves to each processing point at a constant speed and stays at each processing point for a constant time.

6. The bitmap processing method according to claim 5, characterized in that: After the step of obtaining the bitmap dot matrix information of the image to be processed, the method further includes: Determine the laser processing time at the maximum processing depth according to the preset power of the laser emitted by the laser and the maximum processing depth of the image to be processed; Determine the constant dwell time of the laser according to the laser processing time and the preset stabilization time; The laser processing speed is determined based on the constant dwell time and the number of processing points.

7. The bitmap processing method according to claim 5, characterized in that: After the step of obtaining the bitmap dot matrix information of the image to be processed, the method further includes: According to the number information of the processing points and the preset processing speed, the constant dwell time of the laser at each processing point is obtained; Determine the maximum processing time of the laser at the processing point based on the constant dwell time of the laser and the preset stabilization time; The constant power of the laser emitted by the laser is determined according to the longest processing time and the maximum processing depth of the image to be processed.

8. The bitmap processing method according to any one of claims 1 to 7, characterized in that: The step of determining the laser processing time of each processing point according to the depth information of each processing point comprises: Obtaining the depth ratio between the processing depth of the target processing point and the standard depth; The laser processing time of the target processing point is determined according to the depth ratio and the standard processing time for processing the standard depth, and the product of the depth ratio and the standard processing time is positively correlated with the laser processing time.

9. The bitmap processing method according to claim 8, characterized in that: Before the step of obtaining the depth ratio between the processing depth of the target processing point and the standard depth, the method further includes: The maximum processing depth of the image to be processed is obtained as the standard depth, and the processing time of processing the maximum processing depth is used as the standard processing time.

10. A laser processing device, characterized in that: The laser processing equipment applies the bitmap processing method as described in any one of claims 1 to 9.