Continuous wire electroplating method and die wiping system

Abstract

The invention provides a high-speed running wire electroplating method and a mold wiping system with adjustable mold height.

Description

Technical Field

[0001] The present invention relates to a method for electroplating wire in continuous operation. Background Art

[0002] Methods for electroplating wire or strip in continuous operation are known, in which a wire or strip is fed through a bath of molten metal to an electroplating bath. Usually, the wire or strip is formed of a ferrous material such as steel.

[0003] Electroplating can be carried out using a bath of aluminum or zinc, or sometimes other metals or alloys such as tin or tin-based alloys. Thus, electroplating involves applying an outer coating to the wire or strip to impart it with specific properties, such as corrosion resistance of the underlying ferrous material.

[0004] Controlling the thickness of the molten coating has presented a long-term technical challenge, as without means to control it, it can be too thick, uneven, or both. Over the years, wiping techniques using gases (usually inert or reducing) have been developed to standardize and / or reduce the weight or thickness of the coating.

[0005] Thus, after the electroplating bath, the wire is guided through a wiping die to remove the excess molten metal used to electroplate the wire. The wiping die can thus be arranged above the electroplating bath to collect the excess molten metal that is wiped off.

[0006] For example, document EP 38975 is known. Various wiping devices have been used to wipe the coating while it is still in the molten state. This document solves the problem of non-uniform coating of the wire by proposing to vary the flow rate of the inert or reducing wiping gas and using certain parameters of the wiping die (instead of varying the wire travel speed to control the coating of the wire).

[0007] The key parameters of the wiping die according to this document are as follows:

[0008] - A downward wiping gas outlet hole angle of about 10 degrees to 45 degrees, preferably 15 degrees to 30 degrees, relative to the perpendicular to the surface of the wire passing through the die,

[0009] - A wiping gas outlet hole width that is about 0.254 mm to 2.032 mm, preferably 0.508 mm to 1.27 mm, parallel to the direction of travel of the wire through the die,

[0010] - Substantially parallel sides of the wiping gas outlet hole,

[0011] - A minimum length of the wiping gas outlet hole along the wiping gas channel line of not less than 0.635 cm.

[0012] Again according to this document, the height of the wiping gas outlet hole above the molten coating bath should be from 1.27 cm to 38.1 cm, preferably about 1.27 cm to 25.4 cm, and more specifically 1.27 cm to 10.16 cm. Analysis of the drawings shows that in the absence of a hood containing an atmosphere that protects the coating from oxidation, the height of the wiping gas outlet hole is very close to the molten metal bath, while if such a hood is present, the die can be further away.

[0013] Therefore, document EP 38975 concludes that the combination of all key parameters is crucial for obtaining a satisfactory coating thickness. Thus, in the Figure 1 embodiment of this document, the wiping die includes a lower cavity integrated into the wiping die under a protective atmosphere. In this embodiment, for a 1 mm thick wiping gas outlet hole, a downward inclination angle of 25°, and a die lumen of 2.54 cm, the wiping gas outlet hole must be arranged 10.16 cm from the electroplating bath, and then the bottom of the lower cavity is gravity - shifted 2.54 cm from the molten metal bath. In Figure 2 the embodiment, in the presence of a protective hood, the wiping gas outlet hole has a thickness of 0.762 cm and an inclination angle of 30°. The wiping gas outlet hole is thus positioned 12.7 cm above the molten metal bath. Finally, in the embodiment described in Figure 3, there is no hood or protective cavity, and in this case, for a 1 mm thick wiping gas outlet hole, a 25° downward inclination angle, and a die lumen of 2.54 cm, the wiping gas outlet hole must be arranged 3.81 cm from the electroplating bath.

[0014] As can be seen from this document, it is only possible to separate the die in the presence of a protective hood because in the absence of such protection, the molten metal will undergo oxidation, which may negatively affect the quality of the coating. Additionally, although this document does not disclose the diameter of the wire to be coated, the key parameters described are very likely to apply to a single - wire diameter because the diameter of the die lumen is always the same. However, this depends on the diameter of the wire to be wiped.

[0015] In any case, identifying the parameters of the wiping die is a complex operation that is subject to many limitations.

[0016] Currently, the wire running speed is getting higher and higher, and electroplating facilities must be more flexible. In fact, in wire electroplating, it is usually necessary to produce wires with different diameters simultaneously, which involves using wiping dies with different geometries in the same facility.

[0017] However, with increasing running speeds, when passing through the electroplating bath, the wire carries a meniscus of molten metal, which increases with the speed of the wire. The increase in the size of this meniscus also results in a higher incidence of carrying large amounts of partially oxidized molten metal, which thus has a greater viscosity and forms a kind of lump. However, the demand for the coating quality desired by customers has not decreased. On the contrary, the industry is expected to provide consistent coating quality. Summary of the Invention

[0018] The present invention aims to address these technical challenges and at least partially overcome the disadvantages of the prior art by providing an electroplating method that makes it possible to maintain consistent coating quality, where said quality is independent of the diameter of the wire to be processed, thus providing the required flexibility in terms of production while handling increasing running speeds.

[0019] To solve this problem, the present invention provides a method for electroplating a wire at high speed, comprising:

[0020] (i) feeding a series of running wires to an electroplating bath comprising at least one molten metal bed, wherein each wire in the series has a D.v. value between 140 mm.m / minute and 400 mm.m / minute,

[0021] (ii) electroplating by passing each wire in the series of wires through the electroplating bath,

[0022] (iii) guiding each wire in the series of running wires from the electroplating direction to the wiping direction,

[0023] (iv) wiping each wire in the series of running wires by passing it through a wiping lumen of a wiping die, the wiping lumen being traversed by a blade of wiping gas discharged from a peripheral groove of the wiping lumen, the wiping gas flow rate being between 0.6 m 3 / hour and 9 m 3 / hour, more specifically between 1 m 3 / hour and 6 m 3 / hour, the peripheral groove being located at an adjustable distance X between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm from the molten metal bed,

[0024] (v) guiding each wire in the series of running wires towards a collecting device.

[0025] As can be seen, in the method according to the invention, the method comprises a number of wire rods which are fed in parallel. Each wire rod runs parallel to one another and has a high D.v. value which is the product of its diameter D and its running speed v. Thus, a wire rod with a large diameter has the same D.v. value as a wire rod with a smaller diameter. However, for these equal D.v. values, this means that the running speed v of the wire rod with the large diameter is lower than the running speed v of the wire rod with the smaller diameter. Thus, these different types of wire rods are processed in parallel in the same electroplating / wiping facility.

[0026] Each of these wire rods is successively dipped into the electroplating bath and then guided through its wiping die by a guiding wedge. Thus, each wire rod is brought from bottom to top in the wiping direction (usually in the vertical direction).

[0027] When passing through the wiping die, each wire rod is wiped by the peripheral edge of the gas generated, or in other words is scraped completely around by the peripheral edge of the gas generated, the said edge of the gas coming into contact with the wire rod to be wiped. Then, the excess coating flows down along the wire rod by gravity, i.e. in the direction opposite to the wiping direction. The excess molten metal thus returns to the electroplating bath.

[0028] As previously pointed out, molten metal is sensitive to oxidation and cooling, which causes an increase in the viscosity of the molten metal and the appearance of lumps. When running at the indicated D.v. value, the wire rod carries a meniscus of molten metal having dimensions proportional to the running speed of the wire rod and its diameter. When the meniscus is large and the wiping die is arranged close to the upper surface of the molten metal bed, the molten metal splashes onto the die, which can block its inlet or partially block the inlet, which can prevent the gas from flowing. In addition, due to the contact between the excess molten metal and the molten metal meniscus carried by the running wire rod, the excess molten metal flowing in the reverse direction also creates a relatively turbulent zone close to the bath. Thus, it appears that in the case of the electroplating process, where the wire rod has a high running speed, it is advantageous to be able to arrange the peripheral groove of the wiping die at an increased distance d from the metal melt bath and between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm, and this increased distance does not negatively affect the quality of the coating, which is unexpected.

[0029] In fact, depending on the state of knowledge, it is impossible to separate the wiping die from the electroplating bath without forming a protective atmosphere around the wiping system. However, according to the present invention, it seems possible to increase the distance between the inlet of the wiping die and the surface of the molten metal bed without the aid of an enclosure under a protective atmosphere and without significantly increasing the amount of oxidation of the molten metal and the formation of lumps. In addition, since several wires of different diameters are usually electroplated simultaneously, it also seems very advantageous to be able to adjust the height of each wiping die and thus to move the wiping die for thin wires further away from the electroplating bath (increasing the distance d) and to move the wiping die for wires with a larger diameter closer to the electroplating bath (decreasing the distance d), provided that d remains between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm. However, since thin wires carry less material, it can be expected that the excess molten metal is more easily oxidized due to its larger contact surface with the ambient atmosphere. However, in the case where the applicant cannot guarantee the accuracy of this theory, it seems that the flow rate is between 0.6 m 3 / h and 10 m 3 / h, more specifically between 1 m 3 / h and 6 m 3 / h of wiping gas (the wiping gas leaving the peripheral groove to form a gas blade and then leaving the die from the top (carried by the wire) and from the bottom (carried by the excess molten metal)) is sufficient to produce a protective sheath such that a satisfactory coating quality can be maintained without the need for frequent replacement or cleaning of the wiping die.

[0030] For the purposes of the present invention, the term "wire" means a metal wire, a metal cable and any other equivalent elongated metal shape with a substantially circular cross-section to be electroplated. The possibility of electroplating metal strips is also considered, but in this case, the shape of the peripheral groove must be adjusted in order to coat the surface of the strip uniformly.

[0031] Preferably, each wire of the series has a diameter D, a speed v and a D.v. value between 140 m.mm / min and 400 m.mm / min.

[0032] Preferably, the blade of the wiping gas points from the peripheral groove towards the central axis of the wiping lumen at an angle between 0 and 75° downwards measured with respect to a vertical plane perpendicular to the wiping direction or with respect to a transverse plane of the wiping lumen.

[0033] Preferably, the peripheral groove is positioned at an adjustable distance X from the molten metal bed by height adjustment means, the adjustable distance X being between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm.

[0034] Preferably, the height adjustment device enables the adjustable distance X to be changed according to the D.v. value of each wire in the series of running wires in such a way that the adjustable distance X is between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, even more specifically between 4.5 cm and 11 cm, and even more specifically between 5 cm and 8 cm.

[0035] Advantageously, the gas blade points from the periphery of the wiping lumen towards the central axis of the wiping lumen and preferably points from the entire periphery of the wiping lumen towards the central axis, more specifically being oriented at an angle α of between 20° and 40°, more specifically between 25° and 35°, and even more specifically between 27° and 32° measured downwards with respect to the vertical plane P of the wiping direction.

[0036] Preferably, the angle is measured with respect to the vertical plane of the wiping direction or with respect to the transverse plane of the wiping lumen.

[0037] In one embodiment according to the invention, each wire has a running speed between 20 m / minute and 200 m / minute.

[0038] In another advantageous embodiment of the invention, the molten metal bed in the electroplating bath contains at least zinc.

[0039] More specifically, according to the invention, the molten metal bed in the electroplating bath has a temperature between 445 °C and 480 °C.

[0040] Preferably, according to the invention, the wiping gas is nitrogen.

[0041] Other embodiments of the high-speed running wire electroplating method according to the invention are indicated in the appended claims.

[0042] The present invention also relates to a gas wiping die system for an electroplating production line, the electroplating production line comprising an electroplating bath, the gas wiping die system preferably having nitrogen for electroplating a wire, the gas wiping die system including a body provided with a first block and a second block, the first block including a through-hole defining a first part of a wiping lumen, and the second block including a through-hole defining a second part of the wiping lumen, the first block having an annular groove and a hollow channel arranged around the through-hole of the first block, the hollow channel terminating on the one hand in the outer wall of the first block and on the other hand in the annular groove, the first block and the second block being arranged in a juxtaposed position such that the through-hole of the first block and the through-hole of the second block are aligned together to form a wiping lumen formed by the first part of the wiping lumen and the second part of the wiping lumen, and such that the second block closes the annular groove to form a receiving chamber for the gas and closes the hollow channel to form a gas supply pipe for the wiping die, the receiving chamber being in fluid communication with the wiping lumen through a fluid communication device, the second block being arranged to be held in the juxtaposed position by a fastening device and being connected via a mounting plate to a vertical wall of the electroplating production line above an electrogalvanizing bath, characterized in that the mounting plate is connected to the vertical wall of the electroplating production line by a fastening system including a height adjustment device, and the die is fastened to the height adjustment device above the electroplating bath.

[0043] The wiping die includes a body formed by two blocks, the two blocks being fastened by fastening devices adjacent to each other. Using a two-part wiping die means that in the case of excessive splashing, only the lower part needs to be replaced. The wiping die system is connected to the electroplating production line by a fastening system including a height adjustment device for the wiping die and thus makes it possible to place several dies from a series of wiping dies at different heights depending on the diameter of the wire, while spacing them from the molten metal bath so as not to block the wiping die due to the above-mentioned turbulence.

[0044] In a particular embodiment of the present invention, the first block including the through-hole defining the first part of the wiping lumen is formed by a first half-block and a second half-block, the first half-block having a part of the through-hole and the second half-block having the other part of the through-hole complementary to the part of the through-hole of the first half-block, such that when the first half-block and the second half-block are juxtaposed to form a juxtaposed position, the through-hole of the first block is formed.

[0045] Similarly, the first block has an annular groove disposed around the through hole of the first block. The annular groove can be formed by joining the first and second half-blocks (if they exist) that form the first block. In other words, a part of the annular groove can be present in the first half-block and another part complementary to this part of the annular groove of the first half-block can be present in the second half-block.

[0046] When there are two half-blocks to form the first and / or second block of the wiping die, the clamping system also holds these half-blocks in a juxtaposed position. Using the first and / or second block to form the wiping die in several parts (at least two) makes it possible to replace only one half-block in case of excessive splashing, but first makes it possible not to remove the running wire from the electroplating production line when a part needs to be replaced.

[0047] The wiping die system is connected to the electroplating production line by a fastening system that includes height adjustment devices for the wiping die and thus makes it possible to place several dies in a series of wiping dies at different heights depending on the diameter of the wire, while keeping it separated from the molten metal bath so as not to obstruct the wiping die due to the above-mentioned turbulence.

[0048] More specifically, the present invention also provides that the second block including the through hole defining the second part of the wiping lumen is formed by a first half-block and a second half-block, the first half-block having a part of the through hole and the second half-block having the other part of the through hole complementary to the part of the through hole of the first half-block, such that when the first half-block and the second half-block are juxtaposed to form a juxtaposed position, the through hole of the second block is formed.

[0049] Advantageously, in the gas wiping die system for an electroplating production line including an electroplating bath according to the present invention, the gas wiping die system preferably has nitrogen for the electroplating wire, and the fluid communication device is formed by a groove around the periphery of the wiping lumen, the groove extending between the wiping gas receiving chamber and the wiping lumen and thus allowing the formation of a blade of the wiping gas.

[0050] In a specific embodiment of the present invention, the peripheral groove is inclined downward at an angle α between 20° and 40°, more specifically between 25° and 35°, and even more specifically between 27° and 32° with respect to the vertical plane P of the running direction of the electroplating wire.

[0051] Even more advantageously, the peripheral groove has an upper wall formed by a part of the outer face of the first block, which upper wall may optionally be formed by a part of the outer faces of the first half-block and the second half-block of the first block. Optionally, the peripheral groove has a lower wall formed by a part of the outer face of the second block, which lower wall may optionally be formed by a part of the outer faces of the first half-block and the second half-block of the second block.

[0052] Advantageously, in the gas wiping die system for an electroplating production line comprising an electroplating bath according to the present invention, the gas wiping die system preferably has nitrogen for electroplating wire, the wiping lumen being cylindrical in shape and having a constant diameter d over a height h, which height h is between 80% and 100% of the height H of the body of the wiping die, preferably between 85% and 95% of said height H, more specifically between 90% and 95% of said height H.

[0053] More specifically, according to the present invention, the wiping lumen has an upper nozzle and a lower nozzle, the upper nozzle and the lower nozzle each preferably terminating in the surrounding environment, the lower nozzle being arranged to allow the entry of the electroplating wire and the counter-current exit of the wiping gas, and the upper nozzle being arranged to allow the wiped electroplating wire and the wiping gas to exit in a co-current manner, the upper nozzle extending over a predetermined height h1 between the end connected to the lumen of constant diameter and the free end of the outlet made in the outer face of the die body, and the upper nozzle having an increasing diameter in the range from diameter d to diameter D1 over said height h1, diameter D1 being the diameter of the outlet, the lower nozzle extending over a predetermined height h2 between the end connected to the lumen of constant diameter and the free end of the outlet made in the outer face of the die body, and the lower nozzle having an increasing diameter in the range from diameter d to diameter D2 over said height h2, diameter D2 being the diameter of the outlet, where D2 > D1.

[0054] Even more advantageously, according to the present invention, the lower nozzle has a first part and a second part, the first part extending over a predetermined height h3, the first part being juxtaposed with the lumen of constant diameter d, the first part having an increasing diameter in the range from diameter d to diameter D2 over the height h3, the second part extending over a predetermined height h4, the second part being juxtaposed with the first part, the second part having the diameter D2 over the height h4.

[0055] In a particular embodiment, the upper nozzle has a wall formed by a part of the outer faces of the first half-block and the second half-block of the first block forming the wiping die.

[0056] In a particular embodiment, the lower lip has a wall formed by a portion of the outer faces of the first and second half-blocks that form the wiping die.

[0057] Preferably, according to the present invention, the first block has a perimeter and the second block has a perimeter complementary to the perimeter of the first block.

[0058] More preferably, in a gas wiping die system for an electroplating production line including an electroplating bath according to the present invention, the gas wiping die system preferably has nitrogen for electroplating wire, and the peripheral groove extends over a distance F between the wiping gas receiving chamber and the wiping lumen, where the distance F is between 1 mm and 4 mm.

[0059] More specifically, the peripheral groove has a height forming the thickness of the edge of the wiping gas, which height is between 0.3 mm and 0.5 mm, more specifically between 0.35 mm and 0.45 mm, and more specifically about 0.4 mm.

[0060] In an advantageous embodiment of the present invention, the wiping gas receiving chamber has a volume between 1.2 cm 3 and 8 cm 3 more specifically between 1.35 cm 3 and 7 cm 3 and preferably between 1.5 cm 3 and 6 cm 3

[0061] In yet another advantageous embodiment of the present invention, the wiping gas receiving chamber is spaced from the wiping lumen by a distance between 1 mm and 4 mm.

[0062] ​In a gas wiping die system for an electroplating production line according to the present invention, the electroplating production line includes an electroplating bath, the gas wiping die system preferably has nitrogen for electroplating wire, the electroplating bath is arranged to include a molten metal bed, the molten metal bed is provided with an upper surface of the molten metal bed, and the height adjusting device to which the die is fastened above the electroplating bath is selected from fixed lugs, notched guide rails, rack and pinion systems and the like, the fixed lug has holes for fastening the wiping die at different heights above the electroplating bath, and the guide fastened to the wiping die slides within the notched guide rail; the rack and pinion system is used to adjust the height of the wiping die above the electroplating bath, and the adjusting device is arranged to allow the wiping die to be fastened at a height such that the peripheral groove is at a height of 3 cm to 20 cm, more particularly between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm, above the upper surface of the molten metal bed, corresponding to the adjustable distance X.

[0063] In a particular embodiment, the fixed lug having holes is selected as the height adjusting device, and the wiping die is fastened to the height adjusting device above the electroplating bath.

[0064] Preferably, the fixed lug having holes is a fixed lug including a downwardly directed longitudinal hole, and the bolt rod can move vertically within the longitudinal hole, allowing the wiping die to be fastened at different heights above the electroplating bath.

[0065] Alternatively, the fixed lug having holes is a fixed lug including a plurality of holes, and the bolt rod engages in these holes at a desired height, allowing the wiping die to be fastened at different heights above the electroplating bath.

[0066] The longitudinal hole has the advantage of allowing continuous height adjustment, not limited to stepped positions, thus providing great flexibility in precisely selecting the height of the die within the limits of the longitudinal hole.

[0067] More specifically, the height adjusting device to which the die is fastened above the electroplating bath is arranged to allow contact between the edge of the wiping gas and the running wire at a height between 2.5 cm and 19.5 cm, more specifically between 3.5 cm and 14.5 cm, and even more specifically between 4 cm and 10.5 cm.

[0068] Advantageously, according to the present invention, a clamping system is provided, the clamping system includes the mounting plate, preferably a back mounting plate, and the mounting plate is connected to the vertical wall of the electroplating production line through the fastening system.

[0069] The "clamping system" according to the present invention is a system that allows a part to be held by clamping or fastening.

[0070] Preferably, the fastening system further comprises a set of bolt rods.

[0071] More specifically, according to the present invention, a part of the bolt rod is arranged to assemble the back mounting plate to the height adjusting device, and another part of the bolt rod enables the height adjusting device to be assembled to the vertical wall of the electroplating production line.

[0072] In a particularly preferred manner according to the present invention, the fastening system further comprises a compressible element arranged between the back mounting plate and the height adjusting device.

[0073] The compressible element allows the die lumen to be centered around the wire.

[0074] Other embodiments of the gas wiping die system for an electroplating production line according to the present invention are pointed out in the appended claims. The electroplating production line includes an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating the wire.

[0075] The present invention finally relates to an electroplating production line, which includes:

[0076] a. A series of feeding devices for a series of wires to be electroplated. The feeding devices are arranged to drive the series of wires from a series of wire sources and feed the wires to be electroplated. Each feeding device in the series of feeding devices for the wires is independent or synchronous.

[0077] b. An electroplating bath, which is arranged to contain at least one molten electroplating metal. The electroplating bath is provided with heating devices and is fed by the series of feeding devices for a series of wires to be electroplated. The electroplating bath is arranged to form a series of electroplated wires.

[0078] c. At least one first guiding device, which is arranged to guide the wires of a series of electroplated wires out of the bath and place them in the wiping position.

[0079] d. A series of gas wiping die systems for an electroplating production line, the electroplating production line including an electroplating bath, the gas wiping die system preferably having nitrogen for electroplating wires, the gas wiping die system including a body provided with a first block and a second block, the first block including a through-hole defining a first part of a wiping lumen, and the second block including a through-hole defining a second part of the wiping lumen, the first block having an annular groove and a hollow channel arranged around the through-hole of the first block, the hollow channel terminating on the one hand in the outer wall of the first block and on the other hand in the annular groove, the first block and the second block being arranged in a juxtaposed position such that the through-hole of the first block and the through-hole of the second block are aligned together to form a wiping lumen formed by the first part of the wiping lumen and the second part of the wiping lumen, and such that the second block closes the annular groove to form a receiving chamber for the gas and closes the hollow channel to form a gas supply pipe for the wiping die, the receiving chamber being in fluid communication with the wiping lumen through a fluid communication device, the first block and the second block being arranged to be held in the juxtaposed position by a fastening device and connected to a vertical wall of the electroplating production line above the electrogalvanizing bath via a mounting plate, characterized in that the mounting plate is connected to the vertical wall of the electroplating production line by a fastening system including a height adjustment device, the die being fastened to the height adjustment device above the electroplating bath, each wiping die system being arranged to wipe a wire in the series of electroplated wires by running upward through the wiping lumen, the wiping lumen being further traversed by a wiping gas having a wiping direction different from the direction of travel,

[0080] e. At least one second guiding device arranged to guide a wire in a series of wiped wires towards a wire collecting step.

[0081] For the purposes of the present invention, the step of guiding the wires of the series of wiped wires to a wire collecting step means that there may be one or more intermediate steps between the wiping and the collecting of the electroplated wires. Thus, a second electroplating, heat treatment, finishing treatment (which may be physical, chemical or physico-chemical), drying, winding of the wires, etc., identical or different from the first electroplating, may be provided.

[0082] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating wires, wherein the fluid communication device is formed by a groove around the wiping lumen, the groove extending between the wiping gas receiving chamber and the wiping lumen and thus allowing the formation of a wiping gas blade.

[0083] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line containing an electroplating bath. Preferably, the gas wiping die system has nitrogen for electroplating wire. Wherein, the peripheral groove is inclined downward at an angle between 20° and 40°, more specifically between 25° and 35°, and even more specifically between 27° and 32° with respect to the vertical plane of the running direction of the electroplating wire.

[0084] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line containing an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating wire. Wherein, the wiping lumen is of a cylindrical shape and has a constant diameter d at a height h, and the height h is between 80% and 100% of the height H of the body of the wiping die, preferably between 85% and 95% of the height H, and more specifically between 90% and 95% of the height H.

[0085] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line containing an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating wire. Wherein, the wiping lumen has an upper nozzle and a lower nozzle. The lower nozzle is arranged to allow the entry of the electroplating wire and the countercurrent departure of the wiping gas, and the upper nozzle is arranged to allow the co-current departure of the wiped electroplating wire and the wiping gas. The upper nozzle extends at a predetermined height h1 between the end connected to the lumen with a constant diameter and the free end of the outlet made in the outer surface of the die body, and the upper nozzle has an increasing diameter in the range from diameter d to diameter D1 at the height h1, where D1 is the diameter of the outlet. The lower nozzle extends at a predetermined height h2 between the end connected to the lumen with a constant diameter and the free end of the outlet made in the outer surface of the die body, and the lower nozzle has an increasing diameter in the range from diameter d to diameter D2 at the height h2, where D2 is the diameter of the outlet, and D2 > D1.

[0086] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line containing an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating wire. Wherein, the lower nozzle has a first part and a second part. The first part extends at a predetermined height h3 and is juxtaposed with the lumen having a constant diameter d. The first part has an increasing diameter in the range from diameter to diameter D2 at the height h3. The second part extends at a predetermined height h4 and is juxtaposed with the first part. The second part has the diameter D2 at the height h4.

[0087] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line that contains an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating a wire. Wherein, the first block has a perimeter and the second block has a perimeter complementary to the perimeter of the first block.

[0088] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line that contains an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating a wire. Wherein, the peripheral groove extends a distance between 1 mm and 4 mm between the wiping gas receiving chamber and the wiping lumen.

[0089] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line that contains an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating a wire. Wherein, the peripheral groove has a height that forms the thickness of the blade of the wiping gas, and the height is between 0.3 mm and 0.5 mm, more specifically between 0.35 mm and 0.45 mm, and more specifically about 0.4 mm.

[0090] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line that contains an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating a wire. Wherein, the receiving chamber for the wiping gas has a volume between 1.2 cm 3 and 8 cm 3 more specifically between 1.35 cm 3 and 7 cm 3 more preferably between 1.5 cm 3 and 6 cm 3 and.

[0091] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line that contains an electroplating bath. The gas wiping die system preferably has nitrogen for electroplating a wire. Wherein, the wiping gas receiving chamber and the wiping lumen are spaced apart by a distance between 1 mm and 4 mm.

[0092] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating the wire. Among them, the height adjustment device to which the die is fastened above the electroplating bath is selected from fixed lugs, notched guide rails, rack and pinion systems and the like. The fixed lug has holes for fixing the wiping die at different heights above the electroplating bath. The guide member fastened to the wiping die slides within the notched guide rail. The rack and pinion system is used to adjust the height of the wiping die above the electroplating bath. The adjustment device is arranged to allow the wiping die to be fastened at a height such that the peripheral groove is at a height between 3 cm and 20 cm, more particularly between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm, corresponding to the adjustable distance X, relative to the upper surface of the molten metal bed.

[0093] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating the wire. Among them, the height adjustment device to which the die is fastened above the electroplating bath is arranged to allow contact between the wiping gas blade and the running wire at a height between 2.5 cm and 19.5 cm, more specifically between 3.5 cm and 14.5 cm, and even more specifically between 4 cm and 10.5 cm.

[0094] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating the wire. Among them, a clamping system is provided, and the clamping system includes the mounting plate, preferably the back mounting plate, and the mounting plate is connected to the vertical wall of the electroplating production line via the fastening system.

[0095] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating the wire. Among them, the fastening system further includes a set of bolt rods.

[0096] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including the electroplating bath, the gas wiping die system preferably having nitrogen for electroplating the wire. Among them, a part of the bolt rod is arranged to assemble the back mounting plate to the height adjustment device, and another part of the bolt rod enables the height adjustment device to be assembled to the vertical wall of the electroplating production line.

[0097] Advantageously, the electroplating production line includes a gas wiping die system for the electroplating production line including an electroplating bath, the gas wiping die system preferably having nitrogen for electroplating wire, wherein the fastening system further includes a compressible element disposed between the back mounting plate and the height adjusting device.

[0098] Other embodiments of the electroplating production line according to the present invention are pointed out in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0099] Other features, details and advantages of the present invention will be discussed in the following description in a non-limiting manner and with reference to the drawings.

[0100] In the drawings, Figure 1 is a cross-sectional view of the wiping die system according to the present invention.

[0101] Figure 2 is Figure 1 a perspective view of the die body of the wiping die system of

[0102] Figure 3a and Figure 3b is Figure 1 a perspective view of the system shown, in which the blocks of the wiping die body are shown in an exploded view.

[0103] Figures 4A to 4E is a cross-sectional view of different embodiments of the wiping die body according to the present invention.

[0104] Figure 5 is a perspective view of a part of the electroplating production line, in which the wiping die system according to the present invention can be seen integrated on the electroplating bath. DETAILED DESCRIPTION

[0105] In the drawings, the same or similar elements have the same reference numerals.

[0106] As pointed out above, the object of the present invention is to provide an electroplating method for maintaining a consistent coating quality, which method does not depend on the diameter of the wire to be processed and provides the required flexibility in terms of production for increasingly high running speeds.

[0107] Accordingly, the method according to the invention is a method for electroplating a wire running at high speed, the method comprising supplying a bath containing at least one molten metal for electroplating a series of running wires, wherein each wire in the series has a D.v. value between 140 mm.m / and 400 mm.m / min. Once electroplated by running through the electroplating bath, each of the wires in the run is guided while running so as to be transferred from the electroplating direction to the wiping direction, typically the vertical direction from bottom to top. Thus, each wire in the series of running wires passes through a wiping die traversed by a wiping gas blade before being collected (possibly after having undergone other subsequent treatments).

[0108] The wiping in the method according to the invention is effected by means of a gas wiping die system, for example using nitrogen as shown in Figure 1 FIG.

[0109] As Figure 1 can be seen, the gas wiping die system comprises a die which includes a body 1 which is provided with a first block 2 and a second block 3. The first block 2 includes a through hole 4 which defines a first part of a wiping lumen 5, and the second block 3 also includes a through hole 6 which defines a second part of the wiping lumen 5.

[0110] In Figure 2 the body 1 is shown in more detail. It can be seen that the first block 2 is formed by a first half block 7 and a second half block 8. The first half block 7 has a part of the through hole 4, and the second half block 8 has another part of the through hole 4. The other part of the through hole 4 of the second half block 8 is complementary to the part of the through hole 4 of the first half block 7. Thus, once assembled to form the first block 2, i.e., when the first and second half blocks (7, 8) are juxtaposed (juxtaposed position), the through hole 4 of the first block 2 is formed.

[0111] The second block 3 is also formed by a first half block 9 and a second half block 10. The first half block 9 has a part of a through hole (not shown) and the second half block has another part of the through hole (not shown). The other part of the through hole (not shown) of the second half block is complementary to the part of the through hole of the first half block. Thus, once assembled into the second block 3, i.e., when the first half block 9 and the second half block 10 are juxtaposed (juxtaposed position), the through hole 6 of the second block 3 is formed. The through hole 4 of the first block 2 and the through hole 6 of the second block 3 together form the wiping lumen 5 of the die. In other words, the first block 2 and the second block 3 are arranged to be positioned in a juxtaposed (superposed) position such that the through hole 4 of the first block 2 and the through hole 6 of the second block 3 are aligned together to form the wiping lumen 5 formed by the first part of the wiping lumen and the second part of the wiping lumen.

[0112] Referring again toFigure 1 The first block 2 for wiping the mold includes an annular groove 11 and a hollow channel 12. The annular groove 11 is arranged around the through hole 4 of the first block 2. The hollow channel 12 terminates on the one hand in the outer wall 13 of the first block 2 and on the other hand in the annular groove 11.

[0113] When the first block 2 and the second block 3 are stacked to form a wiping lumen 5, the second block 3 closes the annular groove 11 to form a wiping gas receiving chamber and closes the hollow channel 12 to form a wiping gas supply pipe for wiping the mold. The receiving chamber is in fluid communication with the wiping lumen 5 via a peripheral groove 20 through a fluid communication device.

[0114] The peripheral groove 20 is arranged between the receiving chamber and the wiping lumen across a distance F and allows the formation of a wiping gas blade that points from the periphery of the wiping lumen 5 towards the central axis of the wiping lumen 5 and preferably from the entire periphery of the wiping lumen 5 towards the central axis, more specifically oriented at a downward angle α measured with respect to a plane P perpendicular to the wiping direction.

[0115] The second block 3 and the first block 2 are held in juxtaposed (stacked) positions by fastening means 14 (see Figure 2 )(such as by a series of screws) and are connected to the vertical wall 16 of the electroplating production line via a mounting plate 15 above the electroplating bath.

[0116] The mounting plate 15 is preferably a back mounting plate that is connected to the vertical wall 16 of the electroplating production line by a fastening system 17 that includes height adjustment means 17, 18 to which the mold is fastened above the electroplating bath.

[0117] In Figure 1 the embodiment shown, a clamping system 19 is provided that includes the back mounting plate 15 which is connected to the vertical wall 16 of the electroplating production line via a fastening system.

[0118] The clamping system is described, for example, in document CN109666880 which also discusses its operation and which is incorporated herein by reference.

[0119] In the embodiment shown, the first block 2 of the wiping mold includes an annular groove 11 arranged around the through hole 4 of the first block 2. The annular groove 11 can be formed by bringing together a first half-block 7 and a second half-block 8 that form the first block 2. In other words, a part of the annular groove can be present in the first half-block 7 and another part complementary to this part of the annular groove in the first half-block 7 is present in the second half-block 8.

[0120] The clamping system 19 also holds these half - blocks 7, 8 in juxtaposed positions. Using the first block 2 and / or the second block 3 in multiple parts (at least two) to form the wiping die makes it possible to replace only one half - block in case of excessive splashing, but most importantly makes it possible not to remove the running wire from the electroplating production line when a part needs to be replaced.

[0121] In the illustrated embodiment, the height - adjusting devices 17, 18 for fastening the die above the electroplating bath are formed by fixing lugs 17 having holes 18 to allow the wiping die to be fastened at different heights above the electroplating bath. The height - adjusting devices 17, 18 are arranged and dimensioned to allow the wiping die to be fastened at a height such that the peripheral groove 20 is at an adjustable distance X between 3 cm and 20 cm, more specifically between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm from the upper surface of the molten metal bed 21.

[0122] Preferably, the fastening system further includes a set of bolt rods 22.

[0123] More specifically, according to the present invention, a part of the bolt rod 22 is arranged to assemble the back mounting plate 15 to the height - adjusting devices 17, 18, and another part of the bolt rod enables the height - adjusting devices to be assembled to the vertical wall 16 of the electroplating production line.

[0124] Particularly preferably, according to the present invention, the fastening system further includes a compressible element 23 arranged between the back mounting plate 15 of the clamping system 19 and the height - adjusting devices 17, 18.

[0125] As can be seen in more detail in Figure 3a and Figure 3b (which is a perspective view of the clamping system and the die blocks), some elements have been removed to aid visualization, especially the half - blocks. The fixing lug 17 is also shown, and the fixing lug 17 has a generally straight upper part, a similarly straight lower part, and an inclined middle part for easy access. It can also be seen in those figures that the second block 3 or the first half - block 9 and the second half - block 10 forming the second block 3 are fitted with side shoulders that assist in mounting in the clamping system 19. In a variant according to the present invention, the clamping system 19 can hold two first half - blocks 7, 9 stacked on top of each other and two second half - blocks 8, 10 stacked on top of each other, or the first block 2 and the second block 3 stacked on top of each other.

[0126] In Figure 3a and Figure 3bIt can also be seen that, according to a particular embodiment, the fixing lug 17 having the hole 18 is selected as the height adjustment devices 17, 18, and the wiping die is fixed to the height adjustment devices 17, 18 above the electroplating bath 28.

[0127] Preferably, as Figure 3a seen in , the fixing lug 17 having the hole 18 is a fixing lug including a downwardly directed longitudinal hole in which the bolt rod 22 can move vertically, thereby allowing the wiping die to be fastened at different heights above the electroplating bath 28.

[0128] Alternatively, as Figure 3b seen in , the fixing lug 17 having the hole 18 is a fixing lug including a plurality of holes in which the bolt rod 22 engages at a desired height, thereby allowing the wiping die to be fixed at different heights above the electroplating bath 28.

[0129] The longitudinal hole has the advantage of allowing continuous height adjustment, not limited to stepped positions, thus providing great flexibility in precisely selecting the height of the die within the limits of the longitudinal hole.

[0130] Figures 4A to 4E Different internal geometries of the body 1 of the die are shown. Thus, for wire diameters from 14 mm to 22 mm or greater, a wider wiping lumen 5 ( Figure 4A and Figure 4C ) will be used, while the supply tube will be shorter or the wiping gas receiving chamber will be smaller. For wire diameters between 6 mm and 10 mm, geometries such as those shown in Figure 4B , Figure 4D or Figure 4E will generally be used.

[0131] Figures 4A to 4E Different geometries of the fluid communication device are also shown, which is formed by the peripheral groove 20 at the wiping lumen 5, and the peripheral groove 20 extends between the wiping gas receiving chamber and the wiping lumen 5. The peripheral groove 20 thus allows the formation of a blade of wiping gas.

[0132] In the embodiment shown in Figure 4D , the peripheral groove 20 is inclined downward at an angle between 20° and 40° with respect to the vertical plane of the running direction of the electroplating production line, more particularly at an angle between 25° and 35° downward, and even more particularly at an angle between 27° and 32° downward.

[0133] The peripheral groove 20 has an upper wall formed by a part of the outer face of the first block 2, and this upper wall is formed by a part of the outer faces of the first half-block 7 and the second half-block 8. The peripheral groove 20 has a lower wall formed by a part of the outer face of the second block 3, and this lower wall is formed by a part of the outer face of the first half-block 9 and the outer face of the second half-block 10.

[0134] The wiping lumen is of cylindrical shape and has a constant diameter d over a height h which is between 80% and 100% of the height H of the body 1 of the wiping die, preferably between 85% and 95% of said height H, more specifically between 90% and 95% of said height H.

[0135] More specifically, according to the invention, the wiping lumen has an upper mouth 24 and a lower mouth 25, each mouth preferably terminating in the surrounding environment.

[0136] The lower mouth 25 is arranged to allow the entry of the electroplated wire and the countercurrent departure of the wiping gas, and the upper mouth 24 is arranged to allow the wiped electroplated wire and the wiping gas to depart in a co-current manner.

[0137] The upper mouth 24 extends over a predetermined height h1 between the end connected to the wiping lumen 5 of constant diameter d and the free end of the outlet made in the outer face 26 of the die body 1, and has an increasing diameter in the range from diameter d to diameter D1 (which is the diameter of the outlet) at this height h1.

[0138] The lower mouth 25 extends over a predetermined height h2 between the end connected to the wiping lumen 5 of constant diameter d and the free end of the outlet made in the outer face 27 of the die body 1, and has an increasing diameter in the range from diameter d to diameter D2 (which is the diameter of the outlet) at this height h2, where D2 > D1.

[0139] In certain variants, the lower mouth 25 has a first part extending over a predetermined height h3 and a second part extending over a predetermined height h4, the first part being juxtaposed with the wiping lumen of constant diameter d which has an increasing diameter in the range from diameter d to diameter D2 at this height h3, the second part being juxtaposed with the first part and having the diameter D2 at this height h4.

[0140] In Figures 4A to 4EIn the [description], the upper lip portion 24 has a wall formed by a part of the outer surfaces of the first half 7 and the second half 8 of the first block 2 forming the wiping die. The lower lip portion 25 has a wall formed by a part of the outer surfaces of the first half 9 and the second half 10 of the second block 3 forming the wiping die.

[0141] Figure 5 A part of an electroplating production line is shown, in which the electroplating bath 28 is located below the wiping die system. The guiding device arranged to guide the wires of the electroplating wire series out of the bath and into the wiping position is the guiding wedge 29. According to Figure 3a the embodiment shown in [description], there is a series of wiping die systems, and each wiping die system is arranged to wipe the wire 30 in the series of electroplating wires by passing through the wiping lumen 5 in the traveling direction.

[0142] It should be understood that the present invention is in no way limited to the above embodiments, and many modifications can be made thereto without departing from the scope of the appended claims.

Claims

1. A high-speed wire electroplating method, comprising: (i) supplying a series of wire runs to an electroplating bath (28), the electroplating bath comprising at least one bed of molten metal (21), the molten metal preferably comprising at least zinc, wherein each wire (30) of the series of wire runs has a Dv value between 140 mm.m / min and 400 mm.m / min, (ii) electroplating by running each of the wires (30) in the series of wires through the electroplating bath (28), (iii) directing each of the wires (30) of the series of running wires from a plating direction to a wiping direction, (iv) wiping each wire (30) in the series of running wires by passing through a wiping lumen (5) of a wiping die, the wiping lumen (5) being traversed by a blade of wiping gas, preferably the wiping lumen (5) being traversed by a blade of wiping gas at 0.6 m 3 / h and 9m 3 / h, more particularly between 1m 3 / h and 6m 3 a nitrogen blade exiting from a peripheral groove (20) at the wiping lumen (5) with a wiping gas flow rate of between 100 and 200 rpm, said peripheral groove (20) being positioned at an adjustable distance X of between 3 cm and 20 cm, more particularly between 4 cm and 15 cm, and even more preferably between 4.5 cm and 11 cm from the molten metal bed (21), (v) directing each of the wires (30) in the series of wire runs towards a collecting device.

2. The electroplating method for high-speed wire according to claim 1, wherein: The blade of the gas is directed from the periphery of the wiping lumen (5) towards the central axis of the wiping lumen (5), and preferably from the entire periphery of the wiping lumen (5) towards the central axis, more specifically oriented at an angle α measured downwards relative to a vertical plane P of the wiping direction of between 20° and 40°, more specifically between 25° and 35°, even more specifically between 27° and 32°.

3. A gas wiping mold system for an electroplating production line, the electroplating production line comprising an electroplating bath, the gas wiping mold system preferably having nitrogen for electroplating wire, the gas wiping mold system comprising a body (1), the body being provided with a first block (2) and a second block (3), the first block (2) comprising a through hole (4) defining a first portion of a wiping tube cavity, and the second block (3) comprising a through hole (6) defining a second portion of the wiping tube cavity, the first block (2) having an annular groove (11) and a hollow channel (12) arranged around the through hole (4) of the first block (2), the hollow channel (12) terminating in an outer wall of the first block (13) on the one hand and terminating in the annular groove (11) on the other hand, the first block (2) and the second block ( 3) is arranged to be positioned in a juxtaposed position so that the through hole (4) of the first block (2) and the through hole (6) of the second block (3) are aligned together to form a wiping tube cavity (5) formed by the first part of the wiping tube cavity and the second part of the wiping tube cavity, and so that the second block (3) closes the annular groove (11) to form a receiving chamber for the gas and closes the hollow channel (12) to form a gas supply pipe for the wiping mold, the receiving chamber is fluidly connected to the wiping tube cavity (5) through a fluid communication device, the first block (2) and the second block (3) are arranged to be held in a juxtaposed position by a fastening device (14) and connected to a vertical wall (16) above the electrogalvanizing bath (28) of the electroplating production line via a mounting plate (15), characterized in that The mounting plate (15) is connected to the vertical wall (16) of the electroplating line by means of a fastening system comprising height adjustment means (17, 18) to which the mould is fixed above the electroplating bath (28).

4. The gas-wiped mold system for an electroplating production line according to claim 3, wherein the electroplating production line comprises an electroplating bath, and the gas-wiped mold system preferably has nitrogen gas for electroplating wire, wherein: The fluid communication device is formed by a peripheral groove (20) at the wiping tube cavity (5), which extends between the wiping gas receiving chamber and the wiping tube cavity (5) and thus allows the formation of a wiping gas blade, and the peripheral groove (20) is preferably inclined downward at an angle α between 20° and 40°, more particularly between 25° and 35°, and even more particularly between 27° and 32° relative to a plane P perpendicular to the running direction of the electroplating wire (30).

5. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 4, wherein the electroplating production line comprises an electroplating bath, and the gas-wiped mold system preferably has nitrogen gas for electroplating wire, wherein: The wiper lumen (5) is cylindrical in shape and has a constant diameter d over a height h, said height h being comprised between 80% and 100% of the height H of the body of the wiper mold, preferably between 85% and 95% of said height H, more particularly between 90% and 95% of said height H.

6. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 5, wherein the electroplating production line comprises an electroplating bath, the gas-wiped mold system preferably having nitrogen for electroplating wire, wherein: The wiping lumen (5) has an upper nozzle (24) and a lower nozzle (25), the lower nozzle (25) being arranged to allow the entry of the electroplating wire (30) and the counter-current discharge of the wiping gas, and the upper nozzle (24) being arranged to allow the wiped electroplating wire (30) and the wiping gas to be discharged in a parallel flow manner, the upper nozzle (24) extending at a predetermined height h1 between an end connected to the lumen (5) having a constant diameter and a free end formed at an outlet made in an outer face (26) of the mold body (1), and The upper nozzle has an increasing diameter ranging from diameter d to diameter D1 at the height h1, wherein the diameter D1 is the diameter of the outlet, and the lower nozzle (25) extends at a predetermined height h2 between the end connected to the tubular cavity (5) having a constant diameter and the free end of the outlet manufactured in the outer surface (27) of the mold body (1), and the lower nozzle has an increasing diameter ranging from diameter d to diameter D2 at the height h2, wherein D2>D1.

7. The gas-wiped mold system for an electroplating production line according to claim 6, wherein the electroplating production line comprises an electroplating bath, and the gas-wiped mold system preferably has nitrogen gas for electroplating wire, wherein: The lower mouth (25) has a first portion and a second portion, the first portion extending at a predetermined height h3, the first portion being juxtaposed with the tubular cavity (5) having a constant diameter, the first portion having an increasing diameter ranging from diameter d to diameter D2 at the height h3, and the second portion extending at a predetermined height h4, the second portion being juxtaposed with the first portion, the second portion having the diameter D2 at the height h4.

8. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 7, wherein the electroplating production line comprises an electroplating bath, the gas-wiped mold system preferably having nitrogen gas for electroplating wire, wherein: The first block (2) has a perimeter and the second block (3) has a perimeter complementary to the perimeter of the first block.

9. A gas wiped die system for an electroplating line according to claim 4 or any one of claims 5 to 8 when dependent on claim 4, the electroplating line comprising an electroplating bath, the gas wiped die system preferably having nitrogen for electroplating wire, wherein, The peripheral groove (20) is at a distance F between the wiping gas receiving chamber and the wiping tube cavity (5), wherein F is between 1 mm and 4 mm, or wherein The peripheral groove (20) has a height of between 0.3 mm and 0.5 mm, more particularly between 0.35 mm and 0.45 mm and more particularly about 0.4 mm, of the thickness of the blade forming the wiping gas.

10. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 9, wherein the electroplating production line comprises an electroplating bath, the gas-wiped mold system preferably having nitrogen gas for electroplating wires, wherein: The wiping gas receiving chamber has a volume of 1.2 cm 3 With 8cm 3 between, more particularly between 1.35 cm 3 With 7cm 3 between, and preferably between 1.5 cm 3 With 6cm 3 between, or among, The wiping gas receiving chamber is spaced apart from the wiping lumen (5) by a distance between 1 mm and 4 mm.

11. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 10, wherein the electroplating production line comprises an electroplating bath, the gas-wiped mold system preferably having nitrogen gas for electroplating wires, wherein: The electroplating bath (28) is arranged to contain a molten metal bed (21), the molten metal bed (21) being provided with an upper surface of the molten metal bed (21), and the height adjustment means (17, 18) to which the mould is fastened above the electroplating bath (28) is selected from fixing lugs (17), guide rails with notches, rack and pinion systems and the like, the fixing lugs (17) having holes (18) for fixing the wiping mould at different heights above the electroplating bath (28), guide rails fastened to the wiping mould The wiping die is arranged to slide in the notched guide rails, the rack and pinion system being used to adjust the height of the wiping die above the electroplating bath, the adjusting means (17, 18) being arranged to allow the wiping die to be fastened at a height such that the peripheral groove (20) is located at a height between 3 cm and 20 cm relative to the upper surface of the molten metal bed (21), more particularly, at a height between 4 cm and 15 cm, and even more preferably at a height between 4.5 cm and 11 cm, corresponding to an adjustable distance X.

12. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 11, wherein the electroplating production line comprises an electroplating bath, the gas-wiped mold system preferably having nitrogen gas for electroplating wire, wherein: The height adjustment device (17, 18) to which the mold is fixed above the electroplating bath (28) is arranged to allow contact between the blade of the wiping gas and the running wire (30) at a height between 2.5 cm and 19.5 cm, more particularly between 3.5 cm and 14.5 cm, even more particularly between 4 cm and 10.5 cm.

13. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 12, the electroplating production line comprising an electroplating bath, the gas-wiped mold system preferably having nitrogen for electroplating wire, wherein, A clamping system (19) is provided, comprising the mounting plate (15), preferably a back mounting plate (15), which is connected to the vertical wall (16) of the electroplating line by means of the fastening system.

14. A gas-wiped mold system for an electroplating production line according to any one of claims 3 to 13, the electroplating production line comprising an electroplating bath, the gas-wiped mold system preferably having nitrogen for electroplating wire, wherein: The fastening system further comprises a set of bolt rods (22), wherein preferably, a portion of the bolt rods (22) is arranged to assemble the back mounting plate (15) to the height adjustment device (17, 18), and another portion of the bolt rods (22) enables the height adjustment device (17, 18) to be assembled to the vertical wall (16) of the electroplating line, and the fastening system further comprises a compressible element (23), which is arranged between the back mounting plate (15) and the height adjustment device (17, 18).

15. An electroplating production line, comprising: a. a series of feeding devices for a series of wires to be plated, said feeding devices being arranged to drive said series of wires from a series of wire sources and to feed said wires to be plated, each feeding device in said series of feeding devices for said wires being independent or synchronized, b. a plating bath (28) arranged to contain at least one molten plating metal, said plating bath being provided with heating means and being fed by said series of feeding means for said series of wires to be plated, said plating bath (28) being arranged to form a series of plated wires, c. at least one first guiding means arranged to guide said wire (3) of said series of electroplated wires out of said bath (28) and to place said wire in said wiping position, d. a series of wiping die systems according to any one of claims 3 to 14, each wiping die system being arranged to wipe the wires in the series of electroplated wires (30) by passing through a wiping lumen (5) in a running direction, the wiping lumen (5) being further traversed by a wiping gas having a wiping direction different from the running direction, e. At least one second guiding means arranged to guide said wire (3) of the series of wiped wires towards a wire collecting step.

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