Electroplating liquid disturbance device, operation method thereof and electroplating bath device

Abstract

The invention discloses an electroplating liquid disturbance device. The electroplating liquid disturbance device comprises a first supporting plate, a linkage piece, a spraying pipe and a pivoting piece. The first supporting plate is provided with a pivoting part. The linkage piece is provided with a first part. The first part of the linkage piece is close to the pivoting part of the first supporting plate. The spray pipe is located on the linkage piece. The nozzle has a nozzle. The nozzle is configured to be soaked by a plating solution. One end of the pivoting piece is pivoted to the pivoting part of the first supporting plate. The other end of the pivoting piece is connected with the spraying pipe and the first part of the linkage piece. When the first part of the linkage piece moves, the pivoting piece rotates relative to the pivoting part, and the spraying pipe moves along with the first part of the linkage piece, so that a nozzle of the spraying pipe swings to disturb the electroplating liquid.

Description

Technical Field

[0001] The present invention relates to an electroplating solution perturbation device, an operation method of an electroplating solution perturbation device, and an electroplating tank device. Background Art

[0002] Generally speaking, in the process of manufacturing a circuit board, electroplating treatment is an important process, and the jet electroplating method is one of the currently more common electroplating methods. The jet electroplating method mainly directly sprays the electroplating solution containing metal ions in the electroplating tank onto the circuit board to be electroplated. However, the nozzles of the current jet electroplating method are in a straight-line facing jet during operation, and their jet range is limited. Therefore, some dead corners of the circuit board cannot be accurately sprayed with the electroplating solution, resulting in a blind area for jet electroplating and affecting the overall electroplating quality of the circuit board. Summary of the Invention

[0003] One technical embodiment of the present invention is an electroplating solution perturbation device.

[0004] According to an embodiment of the present invention, an electroplating solution perturbation device includes a first support plate, a linkage member, a spray pipe, and a pivot member. The first support plate has a pivot portion. The linkage member has a first portion. The first portion of the linkage member is close to the pivot portion of the first support plate. The spray pipe is located on the linkage member. The spray pipe has a nozzle. The nozzle is configured to be immersed in the electroplating solution. The first end of the pivot member is pivotally connected to the pivot portion of the first support plate. A second end of the pivot member relative to the first end connects the spray pipe and the first portion of the linkage member. When the first portion of the linkage member moves, the pivot member rotates relative to the pivot portion and the spray pipe moves with the first portion of the linkage member, causing the nozzle of the spray pipe to swing to perturb the electroplating solution.

[0005] In an embodiment of the present invention, the number of the pivot portion, the spray pipe, the nozzle, and the pivot member is at least one respectively.

[0006] In an embodiment of the present invention, the pivot portion is located on a side of the spray pipe away from the nozzle, and when the first portion of the linkage member is driven, the pivot member drives the second end to rotate with the first end as the axis, so that the nozzle immersed in the electroplating solution L on the spray pipe swings back and forth in a fan shape.

[0007] In an embodiment of the present invention, the above nozzle has an initial ejection direction, the nozzle swing causes the nozzle to have a first predetermined ejection direction, the first included angle between the initial ejection direction and the first predetermined ejection direction is less than 30 degrees, the nozzle swing causes the nozzle to have a second predetermined ejection direction relative to the first predetermined ejection direction, and the second included angle between the initial ejection direction and the second predetermined ejection direction is less than 30 degrees.

[0008] In an embodiment of the present invention, the linkage member has an initial position, a first limit position and a second limit position on both sides relative to the initial position, and the period of the linkage member from the initial position to the first limit position, from the first limit position to the second limit position, and from the second limit position back to the initial position is between 3 seconds and 5 seconds.

[0009] In an embodiment of the present invention, the above nozzle has an opening. The opening of the nozzle is configured to suck in the electroplating solution. The nozzle of the nozzle is configured to eject the electroplating solution. The nozzle is a plurality of nozzles, and the nozzle is a plurality of nozzles.

[0010] In an embodiment of the present invention, the number of the above pivot joints corresponds to the number of the pivot members.

[0011] In an embodiment of the present invention, the above first support plate has a first slide rail. The first part of the linkage member is located in the first slide rail.

[0012] In an embodiment of the present invention, the above electroplating solution disturbance device further includes a second support plate. The second support plate has a second slide rail. The second part of the linkage member is located in the second slide rail. The nozzle is located between the first part and the second part of the linkage member.

[0013] In an embodiment of the present invention, the above pivot joints are a plurality of pivot joints, and the arrangement direction of these pivot joints is parallel to the length direction of the first part of the linkage member.

[0014] Another technical embodiment of the present invention is an electroplating tank device.

[0015] According to an embodiment of the present invention, an electroplating tank device includes the above electroplating solution disturbance device and a push rod. The push rod extends into the electroplating solution disturbance device. The third part of the linkage member is connected to one end of the push rod. The third part of the linkage member is located between the first part and the second part of the linkage member.

[0016] In an embodiment of the present invention, the above electroplating tank device further includes an actuating assembly. The actuating assembly is located outside the electroplating solution disturbance device. The actuating assembly is connected to the other end of the push rod.

[0017] One technical embodiment of the present invention is an operation method of an electroplating solution disturbance device.

[0018] According to an embodiment of the present invention, an operation method of an electroplating solution disturbance device includes: immersing the nozzle of the nozzle in the electroplating solution; moving the first part of the linkage member to rotate the pivot member relative to the pivot joint of the first support plate, wherein one end of the pivot member is pivotally connected to the pivot joint of the first support plate, the other end thereof is connected to the nozzle and the first part of the linkage member, and the first part of the linkage member is close to the pivot joint of the first support plate; and when the pivot member rotates relative to the pivot joint, the nozzle follows the first part of the linkage member to move, so that the nozzle of the nozzle swings to disturb the electroplating solution.

[0019] In an embodiment of the present invention, the above method further includes ejecting an electroplating solution from a nozzle of a nozzle pipe, wherein the electroplating solution enters the nozzle pipe through an opening of the nozzle pipe.

[0020] In an embodiment of the present invention, the above nozzle pipe moves along with a first part of a linkage member so that the nozzle has an initial ejection direction, and the nozzle swings so that the nozzle has a first predetermined ejection direction. A first included angle between the initial ejection direction and the first predetermined ejection direction is less than 30 degrees. The nozzle swings so that the nozzle has a second predetermined ejection direction relative to the first predetermined ejection direction. A second included angle between the initial ejection direction and the second predetermined ejection direction is less than 30 degrees.

[0021] In an embodiment of the present invention, the above nozzle pipe moves along with a first part of a linkage member so that the linkage member has an initial position and first and second extreme positions on both sides relative to the initial position. The period of the linkage member from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position is between 3 seconds and 5 seconds.

[0022] In the above embodiment of the present invention, the electroplating tank device can drive a pivot member to rotate relative to a pivot portion through a linkage member of an electroplating solution disturbing device, so that the nozzle pipe can move along with a first part of the linkage member, and the nozzle of the nozzle pipe can thus swing. In this way, the nozzle of the electroplating tank device can swingingly eject the electroplating solution to disturb the electroplating solution in the electroplating solution disturbing device, so that metal ions in the electroplating solution can be evenly distributed to improve the overall electroplating quality. In addition, the movement of the nozzle of the nozzle pipe makes the ejected electroplating solution form an oblique jet, which can expand the jet range of the nozzle, so that some dead corners that are not easily sprayed by the circuit board can be sprayed, enabling jet electroplating to fully cover the circuit board to improve the overall electroplating quality. Description of the Drawings

[0023] Figure 1 Three-dimensional view of an electroplating tank device according to an embodiment of the present invention.

[0024] Figure 2 is Figure 1 Cross-sectional view of the electroplating tank device along line segment 2-2.

[0025] Figure 3 Schematic diagram of an electroplating solution entering a nozzle pipe according to an embodiment of the present invention.

[0026] Figure 4 is Figure 1 Partial enlarged view of the electroplating tank device on the second slide rail.

[0027] Figure 5 Flowchart of an operation method of an electroplating solution disturbing device according to an embodiment of the present invention.

[0028] Figure 6 、 Figure 7 and Figure 8 Schematic diagrams of the spray pipe at different positions during the operation of the electroplating bath device according to an embodiment of the present invention.

[0029] Symbol description: 100: Electroplating solution agitation device 110: First support plate 112: Pivoting portion 114: First slide rail 120: Linking member 122: First part 124: Second part 126: Third part 130: Spray pipe 132: Nozzle 134: Opening 140: Pivoting member 150: Second support plate 154: Second slide rail 200: Electroplating bath device 210: Push rod 220: Actuating assembly 2-2: Line segment D1: Arrangement direction D2: Length direction D3: Initial spraying direction D4: First predetermined spraying direction D5: Second predetermined spraying direction L: Electroplating solution W: Circuit board S1: Step S2: Step S3: Step θ1: First included angle θ2: Second included angle. Detailed implementation manner

[0030] Figure 1 Three-dimensional view of the electroplating bath device 200 according to an embodiment of the present invention. Figure 2 is Figure 1 The cross-sectional view of the electroplating bath device 200 along the line segment 2-2. Refer to Figure 1 and Figure 2, the electroplating bath device 200 can be applied to the electroplating process. The electroplating bath device 200 includes an electroplating solution disturbing device 100. The electroplating solution disturbing device 100 includes a first support plate 110, a linkage 120, a spray pipe 130, and a pivot member 140. The first support plate 110 has a pivot portion 112, where the pivot portion 112 is fixed to the first support plate 110. For example, the outer shape of the pivot portion 112 of the first support plate 110 can be circular, but it is not limited thereto. The linkage 120 has a first portion 122. The first portion 122 of the linkage 120 is close to the pivot portion 112 of the first support plate 110. In this embodiment, the first portion 122 of the linkage 120 can be located on one side of the pivot portion 112 and does not contact the pivot portion 112.

[0031] In some embodiments, the spray pipe 130 is located on the first portion 122 of the linkage 120. The spray pipe 130 has a nozzle 132. The nozzle 132 is configured to be immersed in the electroplating solution L (described in Figure 6 detail). One end (which can also be called the first end) of the pivot member 140 is pivotally connected to the pivot portion 112 of the first support plate 110. The other end (which can also be called the second end relative to the first end) of the pivot member 140 connects the spray pipe 130 and the first portion 122 of the linkage 120. When the first portion 122 of the linkage 120 moves, it can drive the pivot member 140 to rotate relative to the pivot portion 112, and the spray pipe 130 can move along with the first portion 122 of the linkage 120, causing the nozzle 132 of the spray pipe 130 to swing, which can disturb the electroplating solution L in the electroplating solution disturbing device 100, so that the metal ions in the electroplating solution L can be evenly distributed to improve the overall electroplating quality.

[0032] In some embodiments, the number of spray pipes 130 of the electroplating solution disturbing device 100 can be plural. For example, the electroplating solution disturbing device 100 has eleven spray pipes 130, and the eleven spray pipes 130 are oppositely arranged on the first portion 122 of the linkage 120. In addition, the number of nozzles 132 of the spray pipe 130 can be plural. For example, the number of nozzles 132 on a single spray pipe 130 can be eight or nine, but it is not limited thereto. The numbers of the spray pipe 130 and the nozzle 132 are not limited. The nozzles 132 can be evenly distributed on the spray pipe 130 to increase the disturbance area of the nozzles 132. In addition, the linkage 120 has a second portion 124, and the second portion 124 of the linkage 120 is parallel to the first portion 122 of the linkage 120. The spray pipe 130 is located between the first portion 122 and the second portion 124 of the linkage 120.

[0033] In some embodiments, the number of pivoting portions 112 of the first support plate 110 may correspond to the number of pivoting members 140, and the number of pivoting portions 112 may be plural. For example, the number of pivoting portions 112 of the first support plate 110 is eleven, and these pivoting portions 112 are arranged opposite to each other. The number of pivoting members 140 is also eleven, and these pivoting members 140 are arranged opposite to each other. Specifically, a single nozzle tube 130 is paired with one pivoting member 140 and one pivoting portion 112 to form a mechanism for moving the nozzle tube 130. In addition, the arrangement direction D1 of these pivoting portions 112 is parallel to the length direction D2 of the first part 122 of the linkage member 120.

[0034] Specifically, the electroplating solution disturbing device 100 of the electroplating tank device 200 can drive the pivoting member 140 to rotate relative to the pivoting portion 112 by means of the linkage member 120, and the nozzle tube 130 can move along with the first part 122 of the linkage member 120, so that the nozzle 132 of the nozzle tube 130 can swing accordingly. In this way, the nozzle 132 of the electroplating solution disturbing device 100 can spray the electroplating solution L in a swinging manner to disturb the electroplating solution L in the electroplating solution disturbing device 100, so that the metal ions in the electroplating solution L can be evenly distributed to improve the overall electroplating quality. In addition, the movement of the nozzle 132 of the nozzle tube 130 causes the sprayed electroplating solution L to form an oblique jet, which can expand the disturbance range of the nozzle 132, so that it can be sprayed to some dead corners (described in detail Figure 6 below) of the circuit board W that are not easily sprayed, so that the jet electroplating can fully cover the circuit board W.

[0035] In some embodiments, the pivoting portion 112 is located on the side of the nozzle tube 130 away from the nozzle 132, and when the first part 122 of the linkage member 120 is driven, the pivoting member 140 drives the second end to rotate with the first end as the axis, so that the nozzle 132 immersed in the electroplating solution L on the nozzle tube 130 swings back and forth in a fan shape.

[0036] In some embodiments, the electroplating tank device 200 further includes a push rod 210. The push rod 210 extends into the electroplating solution disturbing device 100. One end of the push rod 210 is connected to the third part 126 of the linkage member 120. The third part 126 of the linkage member 120 is located between the first part 122 and the second part 124 of the linkage member 120. The electroplating tank device 200 further includes an actuating assembly 220. The actuating assembly 220 is located outside the electroplating solution disturbing device 100. The actuating assembly 220 is connected to the other end of the push rod 210.

[0037] Figure 3 Schematic diagram of the electroplating solution entering the nozzle tube according to an embodiment of the present invention. Referring simultaneously to Figure 2 and Figure 3, the first support plate 110 of the electroplating solution disturbing device 100 has a first slide rail 114. The first slide rail 114 of the first support plate 110 is close to the pivoting portion 112 of the first support plate 110. In this embodiment, the first portion 122 of the linkage 120 is located in the first slide rail 114 of the first support plate 110. The first portion 122 of the linkage 120 can move in the first slide rail 114. The spray pipe 130 can move back and forth in the first slide rail 114. In addition, the spray pipe 130 also has an opening 134. The electroplating solution L can enter the spray pipe 130 through the opening 134 of the spray pipe 130 by an external pump, and the sucked electroplating solution L can be ejected from the nozzle 132 of the spray pipe 130 to disturb the electroplating solution L outside the spray pipe 130.

[0038] Figure 4 Is Figure 1 Partial enlarged view of the electroplating tank device 200 on the second slide rail 154. Refer to Figure 2 And Figure 4 , the electroplating solution disturbing device 100 further includes a second support plate 150. The second support plate 150 has a second slide rail 154. The second portion 124 of the linkage 120 is located in the second slide rail 154 of the second support plate 150. The second portion 124 of the linkage 120 can move in the second slide rail 154. The spray pipe 130 can move back and forth in the second slide rail 154 to disturb the electroplating solution L located in the electroplating solution disturbing device 100. The spray pipe 130 is located between the first portion 122 of the linkage 120 and the second portion 124 of the linkage 120. The first portion 122 of the linkage 120 is perpendicular to the third portion 126 of the linkage 120, and the second portion 124 of the linkage 120 is perpendicular to the third portion 126 of the linkage 120. That is to say, the third portion 126 of the linkage 120 is located between the first portion 122 of the linkage 120 and the second portion 124 of the linkage 120. The third portion 126 of the linkage 120 is connected to the push rod 210. When the actuating assembly 220 pushes the push rod 210 to move, the linkage 120 connected to the push rod 210 can drive the pivot member 140 to rotate relative to the pivoting portion 112, and the spray pipe 130 can move along with the first portion 122 of the linkage 120 on the first slide rail 114, and the spray pipe 130 can move along with the second portion 124 of the linkage 120 on the second slide rail 154 to disturb the electroplating solution L located in the electroplating solution disturbing device 100.

[0039] In the following description, the manufacturing method of the electroplating solution disturbing device will be described. The connection relationships, materials, and functions of the components that have been described will not be repeated.

[0040] Figure 5Flowchart of the operating method of the electroplating liquid disturbance device according to one embodiment of the present invention. The operating method of the electroplating liquid disturbance device includes the following steps. First, in step S1, the nozzle of the nozzle is immersed in the electroplating liquid. Then, in step S2, the first part of the connecting member is moved to rotate the pivotal member relative to the pivotal part of the first support plate, wherein one end of the pivotal member is pivotally connected to the pivotal part of the first support plate, and the other end thereof connects the nozzle and the first part of the connecting member, and the first part of the connecting member is close to the pivotal part of the first support plate. Then, in step S3, when the pivotal member rotates relative to the pivotal part, the nozzle moves with the first part of the connecting member, so that the nozzle of the nozzle swings to disturb the electroplating liquid. In the following description, the above steps will be described in detail.

[0041] Figure 6 , Figure 7 as well as Figure 8 A schematic diagram of the electroplating tank device 200 in different positions during operation according to an embodiment of the present invention. Figure 2 and Figures 6 to 8 First, the linkage 120 has an initial position, and the nozzle 132 of the nozzle 130 has an initial ejection direction D3, that is, when the linkage 120 is at the initial position, the nozzle 132 of the nozzle 130 ejects the electroplating solution L directly toward the workpiece W, as shown in FIG. Figure 6 As shown. Then, the plating liquid L can be filled into the entire tank of the plating liquid agitation device 100 by means of a pump. Therefore, the nozzle 132 of the nozzle 130 can be immersed in the plating liquid L. After the nozzle 132 of the nozzle 130 is immersed in the plating liquid L, the push rod 210 can be pushed forward by the actuating assembly 220, so that the third part 126 of the linkage 120 connected to the push rod 210 can drive the first part 122 and the second part 124 to move forward (the linkage 120 leaves the initial position and moves to the first extreme position). The first part 122 of the linkage 120 can drive the pivot 140 to rotate relative to the pivot 112 of the first support plate 110. One end of the pivoting member 140 is pivotally connected to the pivoting portion 112 of the first supporting plate 110 . The other end of the pivoting member 140 connects the nozzle 130 and the first portion 122 of the linking member 120 . The first portion 122 of the linking member 120 is close to the pivoting portion 112 of the first supporting plate 110 .

[0042] When the first part 122 of the linkage 120 drives the pivot member 140 to rotate relative to the pivot portion 112 of the first support plate 110, the nozzle pipe 130 located between the first part 122 and the second part 124 of the linkage 120 can move forward following the first part 122 and the second part 124, so that the nozzle 132 of the nozzle pipe 130 can face to the right. The nozzle 132 facing to the right makes the nozzle 132 of the nozzle pipe 130 have a first predetermined ejection direction D4, and the first angle θ1 between the initial ejection direction D3 and the first predetermined ejection direction D4 is less than 30 degrees. The forward-moving linkage 120 moves to the first limit position relative to the initial position. The electroplating solution L can enter through the opening 134 of the nozzle pipe 130 (see Figure 3 ), so that the nozzle 132 of the nozzle pipe 130 ejects the electroplating solution L to the right to disturb the electroplating solution L in the electroplating solution disturbing device 100. The electroplating solution L can enter the nozzle pipe 130 through the opening 134 of the nozzle pipe 130 by an external pump, but it is not limited thereto. The electroplating solution L can be ejected through the nozzle 132 to disturb the electroplating solution L outside the nozzle pipe, so as to evenly distribute the metal ions in the electroplating solution L. Figure 6 The nozzle 132 of Figure 6 ejects obliquely to the right, which can expand the disturbance area of the nozzle 132. Therefore, the metal ions in the electroplating solution L can be sprayed to the right dead corner of the circuit board W that is not easily sprayed.

[0043] Then, after the nozzle 132 ejects to the right (the first predetermined ejection direction D4), the actuating assembly 220 can pull back the push rod 210, so that the third part 126 of the linkage 120 connected to the push rod 210 can drive the first part 122 and the second part 124 to move backward (the linkage 120 leaves the first limit position and moves to the second limit position). The first part 122 of the linkage 120 can drive the pivot member 140 to rotate relative to the pivot portion 112 of the first support plate 110. When the first part 122 of the linkage 120 drives the pivot member 140 to rotate relative to the pivot portion 112 of the first support plate 110, the nozzle pipe 130 located between the first part 122 and the second part 124 of the linkage 120 can move backward following the first part 122 and the second part 124, so that the nozzle 132 of the nozzle pipe 130 can face to the left. The nozzle 132 facing to the left makes the nozzle 132 of the nozzle pipe 130 have a second predetermined ejection direction D5 relative to the first predetermined ejection direction D4, and the second angle θ2 between the initial ejection direction D3 and the second predetermined ejection direction D5 is less than 30 degrees. The backward-moving linkage 120 passes through the initial position and moves to the second limit position relative to the first limit position. The electroplating solution L can enter through the opening 134 of the nozzle pipe 130 (see Figure 3 ), so that the nozzle 132 of the nozzle pipe 130 ejects the electroplating solution L to the left to disturb the electroplating solution L in the electroplating solution disturbing device 100. Figure 8The nozzle 132 injects obliquely to the left, which can expand the disturbance area of the nozzle 132. Therefore, the metal ions in the electroplating solution L can be sprayed onto the left dead corner of the circuit board W that is not easily sprayed.

[0044] In some embodiments, the actuating assembly 220 can push the push rod 210 back and forth, so that the third part 126 of the linkage 120 connecting the push rod 210 can drive the first part 122 and the second part 124 to move back and forth. Therefore, the nozzle pipe 130 located between the first part 122 and the second part 124 can move back and forth, so that the nozzle 132 of the nozzle pipe 130 can spray the electroplating solution L in a swinging manner (that is, back and forth towards the initial spraying direction D3, the first predetermined spraying direction D4, and the second predetermined spraying direction D5), and can be sprayed onto the dead corners of the entire circuit board W that are not easily sprayed, so that the jet electroplating can fully cover the circuit board W. In this way, the metal ions in the electroplating solution L can be evenly distributed on the circuit board W, thereby improving the electroplating quality of the circuit board W. In addition, the cycle of the linkage 120 from the initial position to the first limit position, from the first limit position to the second limit position, and from the second limit position back to the initial position is between 3 seconds and 5 seconds, for example, 4 seconds. In other words, the time required to complete one swing of the nozzle 132 of the nozzle pipe 130 is approximately 4 seconds.

Claims

1. A plating liquid disturbance device, characterized in that: Include: A first support plate (110) having at least one pivoting portion (112), wherein the at least one pivoting portion (112) is fixed on the first support plate (110); A linkage member (120) having a first portion (122), wherein the first portion (122) is close to the at least one pivoting portion (112) of the first support plate (110); At least one spray pipe (130) is located on the linkage (120) and has at least one nozzle (132), wherein the at least one nozzle (132) is configured to be immersed in an electroplating liquid (L); as well as At least one pivot member (140), a first end of which is pivotally connected to the at least one pivot portion (112) of the first support plate (110), and a second end of which, relative to the first end, connects the at least one nozzle (130) and the first portion (122) of the linkage (120), wherein when the first portion (122) of the linkage (120) moves, the at least one pivot member (140) rotates relative to the at least one pivot portion (112) and the at least one nozzle (130) moves with the first portion (122) of the linkage (120), so that the at least one nozzle (132) of the at least one nozzle (130) swings to disturb the electroplating liquid (L); The at least one pivoting portion (112) is located on a side of the at least one nozzle (130) away from the at least one nozzle (132), and when the first portion (122) of the linkage (120) is driven, the at least one pivoting member (140) drives the second end to rotate with the first end as the axis, so that the at least one nozzle (132) on the at least one nozzle (130) swings back and forth in a fan-shaped manner.

2. The plating liquid disturbance device according to claim 1, characterized in that: The at least one nozzle (132) has an initial ejection direction (D3), the at least one nozzle (132) swings so that the at least one nozzle (132) has a first predetermined ejection direction (D4), a first angle (θ1) between the initial ejection direction (D3) and the first predetermined ejection direction (D4) is less than 30 degrees, the at least one nozzle (132) swings so that the at least one nozzle (132) has a second predetermined ejection direction (D5) relative to the first predetermined ejection direction (D4), and a second angle (θ2) between the initial ejection direction (D3) and the second predetermined ejection direction (D5) is less than 30 degrees.

3. The plating liquid disturbance device according to claim 1, characterized in that: The linking member (120) has an initial position and a first extreme position and a second extreme position on both sides relative to the initial position. The cycle of the linking member (120) from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position is between 3 seconds and 5 seconds.

4. The plating liquid disturbance device according to claim 1, characterized in that: The at least one nozzle (130) has an opening (134), and the opening (134) is configured to draw in the electroplating liquid (L). The at least one nozzle (132) of the at least one nozzle (130) is configured to spray out the electroplating liquid (L). The at least one nozzle (130) is a plurality of nozzles (130), and the at least one nozzle (132) is a plurality of nozzles (132).

5. The plating liquid disturbance device according to claim 1, characterized in that: The number of the at least one pivotal portion (112) corresponds to the number of the at least one pivotal member (140).

6. The plating solution disturbance device as claimed in claim 1, characterized in that: The first support plate (110) has a first slide rail (114), and the first part (122) of the linkage member (120) is located in the first slide rail (114).

7. The plating liquid disturbance device according to claim 1, characterized in that: It further comprises: a second support plate (150) having a second slide rail (154), wherein a second portion (124) of the linkage (120) is located in the second slide rail (154), and the at least one nozzle (130) is located between the first portion (122) and the second portion (124) of the linkage (120).

8. The plating liquid disturbance device according to claim 1, characterized in that: The at least one pivoting portion (112) is a plurality of pivoting portions (112), and an arrangement direction (D1) of the pivoting portions (112) is parallel to a length direction (D2) of the first portion (122) of the linkage member (120).

9. An electroplating tank device, characterized in that: Include: The plating liquid agitation device (100) according to any one of claims 1 to 8; and A push rod (210) extends into the electroplating liquid agitation device (100), wherein a third portion (126) of the linkage (120) is connected to one end of the push rod (210), and the third portion (126) of the linkage (120) is located between the first portion (122) and a second portion (124) of the linkage (120).

10. The electroplating tank device according to claim 9, characterized in that: Also includes: An actuating component (220) is located outside the electroplating liquid agitation device (100) and is connected to the other end of the push rod (210).

11. A method for operating a plating liquid disturbance device, characterized in that: Include: Allowing at least one nozzle (132) of at least one nozzle pipe (130) to be immersed in an electroplating liquid (L); Moving a first portion (122) of a linkage (120) to rotate at least one pivot member (140) relative to at least one pivot portion (112) of a first support plate (110), wherein the at least one pivot portion (112) is fixed to the first support plate (110), a first end of the at least one pivot member (140) is pivotally connected to the at least one pivot portion (112) of the first support plate (110), a second end of the at least one pivot member (140) opposite to the first end connects the at least one nozzle (130) and the first portion (122) of the linkage (120), and the first portion (122) of the linkage (120) is close to the at least one pivot portion (112) of the first support plate (110); and When the at least one pivot member (140) rotates relative to the at least one pivot portion (112), the at least one nozzle (130) moves along with the first portion (122) of the linkage member (120), so that the at least one nozzle (132) of the at least one nozzle (130) swings to disturb the electroplating liquid (L), wherein the at least one pivot portion (112) is located on a side of the at least one nozzle (130) away from the at least one nozzle (132), and when the first portion (122) of the linkage member (120) is driven, the at least one pivot member (140) drives the second end to rotate with the first end as the axis, so that the at least one nozzle (132) on the at least one nozzle (130) immersed in the electroplating liquid (L) swings back and forth in a fan-shaped manner.

12. The method for operating the electroplating liquid agitation device according to claim 11, characterized in that: It further comprises: spraying the electroplating liquid (L) from the at least one nozzle (132) of the at least one nozzle (130), wherein the electroplating liquid (L) enters the at least one nozzle (130) from the opening (134) of the at least one nozzle (130).

13. The method for operating the electroplating liquid agitation device according to claim 11, characterized in that: The at least one nozzle (130) moves along with the first part (122) of the linkage (120) so that the at least one nozzle (132) has an initial spraying direction (D3); the at least one nozzle (132) swings so that the at least one nozzle (132) has a first predetermined spraying direction (D4); a first angle (θ1) between the initial spraying direction (D3) and the first predetermined spraying direction (D4) is less than 30 degrees; the at least one nozzle (132) swings so that the at least one nozzle (132) has a second predetermined spraying direction (D5) relative to the first predetermined spraying direction (D4); a second angle (θ2) between the initial spraying direction (D3) and the second predetermined spraying direction (D5) is less than 30 degrees.

14. The method for operating the electroplating liquid agitation device according to claim 11, characterized in that: The at least one nozzle (130) moves along with the first part (122) of the linkage (120), so that the linkage (120) is moved so that the linkage (120) has an initial position and a first extreme position and a second extreme position on both sides relative to the initial position. The cycle of the linkage (120) from the initial position to the first extreme position, from the first extreme position to the second extreme position, and from the second extreme position back to the initial position is between 3 seconds and 5 seconds.

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