Focusing and leveling sensor, working method thereof and electronic equipment

Abstract

The invention relates to the technical field of sensors, and discloses a focusing and leveling sensor, a working method thereof and electronic equipment, and the focusing and leveling sensor comprises a laser assembly, a controller and a detector. The laser assembly comprises a lens, a multiple optical filter and an optical fiber circuit; the controller is used for determining a target wavelength according to the current film thickness data of the wafer surface film layer; the lens is used for converging the laser beams; the multiple light filters are electrically connected with the controller and used for conducting corresponding light filtering processing on the laser beams converged by the lens through rotation, and light beams with the target wavelength are reserved; and the optical fiber circuit is used for transmitting the light beam with the target wavelength to the surface of the wafer, so that the detector receives the reflected beam spot. Therefore, the laser of the focusing and leveling sensor can be suitable for wafer products with various film thicknesses, the wavelength of the light is changed into the target wavelength, so that the light emitted on a wafer surface film layer is reflected as much as possible, and the measurement accuracy and the adaptability to different processes are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a focus and leveling sensor, its working method, and an electronic device. Background Art

[0002] There are multiple layers of different photoresists on a wafer, and different film thicknesses have different absorption capabilities for reflected light. The degree of this absorption is related to the film thickness and the wavelength of light. With the progress of semiconductor technology, the types and layers of photoresists applied to wafers have both increased, and it often occurs that the film thicknesses of the photoresists on wafers are different when the machine processes different wafer lots.

[0003] A leveling sensor is used to measure the flatness of the wafer surface. However, currently, the laser wavelength of the leveling sensor is fixed, which results in the laser of the leveling sensor being unable to adapt to products with multiple layers and layer thicknesses. It often leads to insufficient reflection of the laser on the film layer of the wafer surface and excessive reflection on other film layers, interfering with the measurement results. At the same time, since the laser wavelength of the leveling sensor is close to or even coincides with the laser wavelength range used for lithography exposure of the lithography machine, there is also a possibility of misexposure due to the photosensitivity of the photoresist. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a focus and leveling sensor, its working method, and an electronic device, which can improve the measurement accuracy and adaptability to different processes, and are applicable to wafer products with multiple film thicknesses.

[0005] To solve the above technical problems, the present invention provides a focus and leveling sensor, including: a laser component, a controller, and a detector; the laser component includes a lens, a multi-filter, and an optical fiber line;

[0006] The controller is configured to determine a target wavelength according to the current film thickness data of the film layer on the wafer surface;

[0007] The lens is used to converge the laser beam;

[0008] The multi-filter is electrically connected to the controller and is used to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving a beam with the target wavelength;

[0009] The optical fiber line is used to transmit the beam with the target wavelength to the wafer surface so that the detector receives the reflected beam spot.

[0010] In a first aspect, in the above focus and leveling sensor provided by an embodiment of the present invention, a plurality of filter films with different spectral bands are arranged inside the multi-filter.

[0011] On the other hand, in the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, all the filters are located on the same horizontal plane.

[0012] On the other hand, in the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, the distance between each filter and the axis of the multi-filter is equal.

[0013] On the other hand, in the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, the multi-filter rotates about the axis of the laser assembly.

[0014] On the other hand, in the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, the outer shape of the multi-filter is a cylinder.

[0015] On the other hand, in the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, the controller is configured to select the filter corresponding to the target wavelength in the multi-filter and control the rotation of the multi-filter so that the selected filter is placed on the laser light path.

[0016] To solve the above technical problems, the present invention also provides a working method of the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, including:

[0017] Determine the target wavelength by using a controller according to the current film thickness data of the film layer on the wafer surface;

[0018] Converge the laser beam by a lens;

[0019] Use the multi-filter to perform corresponding filtering on the laser beam converged by the lens through rotation, leaving the beam with the target wavelength;

[0020] Transmit the beam with the target wavelength to the wafer surface through an optical fiber line so that the detector receives the reflected beam spot.

[0021] On the other hand, in the working method of the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention, after determining the target wavelength by using the controller, it further includes:

[0022] Use the controller to select the filter corresponding to the target wavelength in the multi-filter and control the rotation of the multi-filter so that the selected filter is placed on the laser light path.

[0023] To solve the above technical problems, the present invention also provides an electronic device including the above-mentioned focusing and leveling sensor provided by the embodiment of the present invention.

[0024] As can be seen from the above technical solution, a focus and leveling sensor provided by the present invention includes: a laser assembly, a controller, and a detector; the laser assembly includes a lens, a multiple filter, and an optical fiber line; the controller is configured to determine a target wavelength according to the current film thickness data of the film layer on the wafer surface; the lens is configured to converge the laser beam; the multiple filter is electrically connected to the controller and is configured to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving a beam with the target wavelength; the optical fiber line is configured to transmit the beam with the target wavelength to the wafer surface so that the detector receives the reflected beam spot.

[0025] The beneficial effect of the present invention is that the above-mentioned focus and leveling sensor provided by the present invention can first determine the corresponding target wavelength based on the current film thickness data of the film layer on the wafer surface, and then when the laser enters the laser assembly, the lens converges the laser beam, and the multiple filter performs filtering processing on the converged laser beam to leave a beam with the target wavelength, and then it is transmitted to the wafer surface for reflection. In this way, the laser used by the focus and leveling sensor can be suitable for wafers with multiple film thicknesses. By changing the wavelength of the light to the target wavelength, as much light as possible incident on the film layer on the wafer surface is reflected, and as much light as possible incident on the film layer closest to the surface of the wafer is absorbed, avoiding interference with the test results of the wafer flatness, thereby improving the measurement accuracy and adaptability to different processes, and reducing the possibility of misexposure caused by the photosensitivity of the photoresist.

[0026] In addition, the present invention also provides a corresponding working method and electronic device for the focus and leveling sensor, which have the same or corresponding technical features as the above-mentioned focus and leveling sensor, further making the above-mentioned focus and leveling sensor more practical, and the working method and electronic device have corresponding advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of the focus and leveling sensor provided by the embodiment of the present invention;

[0029] Figure 2 It is a schematic diagram of the implementation principle of the focus and leveling sensor provided by the embodiment of the present invention;

[0030] Figure 3 It is a schematic structural diagram of the multiple filter provided by the embodiment of the present invention;

[0031] Figure 4 Schematic diagram of the optical path between the multiple filters and the lens provided by the embodiment of the present invention;

[0032] Figure 5 Flowchart of the working method of the focus and leveling sensor provided by the embodiment of the present invention. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0035] Figure 1 Shows the schematic structural diagram of the focus and leveling sensor provided by the embodiment of the present invention, Figure 2 Shows the schematic diagram of the implementation principle of the focus and leveling sensor provided by the embodiment of the present invention. As Figure 1 and Figure 2 shown, it includes: a laser assembly (LampModule) 1, a controller, and a detector 2; the laser assembly 1 includes a lens 11, a multiple filter 12, and an optical fiber line (Lightguide) 13;

[0036] The controller is configured to determine a target wavelength according to the current film thickness data of the film layer on the wafer surface;

[0037] The lens 11 is configured to converge the laser beam;

[0038] The multiple filter 12 is electrically connected to the controller and is configured to perform corresponding filtering processing on the laser beam converged by the lens 11 by rotation, leaving a beam with the target wavelength;

[0039] The optical fiber line 13 is configured to transmit the beam with the target wavelength to the wafer surface so that the detector 2 receives the reflected beam spot.

[0040] It should be noted that, as Figure 2 shown, the main implementation principle of the focus and leveling sensor is: the laser beam irradiates the wafer surface at a certain incident angle, and its reflected light is received by the detector 2. The diameter range of the laser beam spot is generally from 1 mm to 2 mm, which can make the reflected beam spot show a large movement on the receiving surface of the detector 2 when there is a small deviation in the Z direction on the wafer surface.

[0041] The generation principle of the above laser beam is to split the light from a laser. As Figure 1 shown, a split beam of light enters the laser assembly 1, is converged by the lens 11, and then enters the multiple filter 12. The multiple filter 12 can perform corresponding filtering on the laser beam converged by the lens 11 by rotating, leaving a beam with the target wavelength. The beam with the target wavelength enters the optical fiber line 13 (Light guide), and then can pass through the optical illumination system (Illuminationoptics) and the projection grating respectively, changing the beam path and direction, and then irradiating the wafer surface at a certain angle.

[0042] It should be noted that, as Figure 2 shown, the film layer on the wafer surface of the present invention refers to the film layer located on the outermost surface among the multiple film layers of the wafer, which can be understood as the rear layer A of the wafer; the film layer closest to the surface film layer among the other film layers of the wafer except the surface film layer can be understood as the front layer B of the wafer. The film thicknesses of the rear layer A and the front layer B of the wafer are different. The determined target wavelength corresponds to the current film thickness data of the rear layer A of the wafer. The following will describe in terms of the rear layer and the front layer of the wafer.

[0043] In the above focus and leveling sensor provided by the embodiments of the present invention, the corresponding target wavelength can be determined based on the current film thickness data of the rear layer A of the wafer first. Then, when the laser enters the laser assembly 1, the laser beam is converged by the lens 11, and the multiple filter 12 is used to filter the converged laser beam, leaving a beam with the target wavelength, and then it is transmitted to the wafer surface for reflection. In this way, the laser used by the focus and leveling sensor can be applicable to wafers with various film thicknesses. By changing the wavelength of the light to the target wavelength, the light incident on the rear layer A of the wafer can be reflected as much as possible, and at the same time, the light incident on the front layer B of the wafer can be absorbed as much as possible, avoiding interference with the wafer flatness test results, thereby improving the measurement accuracy and adaptability to different processes, and reducing the possibility of misexposure caused by the photosensitivity of the photoresist.

[0044] It can be understood that since there are multiple different photoresists on the wafer, and different film thicknesses have different absorption capabilities for the reflected light. The degree of this absorption is related to the film thickness and the wavelength of the light. The basic formula for describing it is:

[0045]

[0046] where d is the film thickness, n is the refractive index, λ is the wavelength of the light, and k is a coefficient.

[0047] The focusing during exposure uses the photoresist on the wafer surface as a reference. In order to pursue higher-precision wafer flatness testing, it is desired that the incident laser be reflected as much as possible on the back layer A of the wafer and absorbed as much as possible on the front layer B of the wafer to avoid interference with the wafer flatness test results. Also, the wafer surface flatness is first completed at the measurement position of the dual stage and recorded in the system, and no longer measured at the exposure position. Therefore, the accuracy of wafer surface flatness measurement is even more important.

[0048] In the present invention, the laser beam is filtered by the multiple filter 12 before entering the optical fiber line 13, that is, the purpose of selecting the most suitable wavelength (i.e., the target wavelength) of light is achieved, thereby improving the accuracy of wafer surface flatness measurement.

[0049] According to the above formula (1), the present invention can calculate the target wavelength by using the controller, and the specific calculation formula is as follows:

[0050]

[0051] Wherein, λ0 is the target wavelength, and d0 is the current film thickness data of the film layer on the wafer surface, that is, the current film thickness data of the back layer A of the wafer.

[0052] It should be noted that the current film thickness data of the back layer A of the wafer can be entered into the focus leveling sensor of the present invention before the wafer arrives at the measurement position, and the controller can determine the target wavelength corresponding to the current film thickness data of the back layer A of the wafer through calculation. The multiple filter 12 is an optical instrument, and its function is to allow light of a specific wavelength to pass through while blocking light of other wavelengths. Therefore, the present invention uses the multiple filter 12 to allow the light of the target wavelength determined by the controller to pass through and block light of other wavelengths, so as to change the wavelength of the light, so that the incident laser is reflected as much as possible on the back layer A of the wafer and absorbed as much as possible on the front layer B of the wafer.

[0053] In specific implementation, in the above-mentioned focus leveling sensor provided by the embodiment of the present invention, multiple filters with different spectral bands can be arranged inside the multiple filter 12.

[0054] In implementation, Figure 3 shows a schematic structural diagram of the multiple filter provided by the embodiment of the present invention. As Figure 3 shown, the multiple filter 12 has a rotating shaft 120 and can be internally composed of multiple different types of filters 121. Each filter has a different spectral band, that is, each filter only allows light within a specific wavelength range to pass through. By adjusting the number and arrangement of the filters, the multiple filter can be used to filter and select light of different wavelengths.

[0055] It should be noted that the performance and effects of the multiple filter 12 are affected by various factors, such as the material, thickness, coating, temperature, and environmental factors of the filter. Therefore, when using the multiple filter 12, it can be selected and adjusted according to specific application scenarios and requirements.

[0056] Furthermore, in specific implementation, in the above-mentioned focus and leveling sensor provided by the embodiments of the present invention, all the filters can be located on the same horizontal plane.

[0057] In implementation, as Figure 1 and Figure 3 shown, all the filters 121 can be embedded on the same horizontal plane, so that it is convenient to select the most suitable filter 121 during the rotation of the multiple filter 12.

[0058] Furthermore, in specific implementation, in the above-mentioned focus and leveling sensor provided by the embodiments of the present invention, the outer shape of the multiple filter can be cylindrical.

[0059] In implementation, as Figure 1 and Figure 3 shown, the outer shape of the multiple filter 12 can be cylindrical, and the filters 121 are inside the cylinder. Preferably, the same horizontal plane where multiple filters 121 are located can be parallel to the upper and lower surfaces of the cylinder.

[0060] Furthermore, in specific implementation, in the above-mentioned focus and leveling sensor provided by the embodiments of the present invention, the distance between each filter and the axis of the multiple filter can be equal.

[0061] In implementation, as Figure 1 and Figure 3 shown, the distance length between each filter 121 and the axis of the multiple filter 12 can be determined and can be equal. In this way, during the measurement, only by rotating the multiple filter 12, the appropriate filter 121 can be selected without adjusting the positions of each filter 121.

[0062] Furthermore, in specific implementation, in the above-mentioned focus and leveling sensor provided by the embodiments of the present invention, the multiple filter rotates around the axis of the laser component.

[0063] In implementation, as Figure 1 and Figure 3 shown, the multiple filter 12 can rotate around the axis of the laser component 1, that is, the rotation axis of the multiple filter 12 can be the same straight line as the axis of the laser component, so that the rotation operation of the multiple filter can be well controlled.

[0064] Further, in specific implementation, in the above-mentioned focus and leveling sensor provided by the embodiments of the present invention, the controller is configured to select a filter corresponding to the target wavelength from the multiple filters, and control the multiple filters to rotate so that the selected filter is placed on the laser light path.

[0065] In implementation, Figure 4 FIG. shows the optical path schematic diagram between the multiple filters and the lens provided by the embodiments of the present invention. As Figure 4 shown, the controller can select a suitable filter 121 in the multiple filters 12 according to the target wavelength. The multiple filters 12 are rotated under the control of the controller so that the selected filter 121 is placed on the laser light path, so that the laser passing through the lens 11 in the laser assembly passes through the selected filter 121 and is filtered, leaving only the light with the most suitable wavelength (i.e., the target wavelength).

[0066] It should be added that multiple filters in the multiple filters of the present invention can provide various wavelength selections from ultraviolet light (200nm to 400nm) to infrared light (820nm). Considering that the refractive index of the photoresist is about 1.5, it is calculated that the focus and leveling sensor of the present invention can be applicable to the film thickness range from 33nm to 546nm.

[0067] In the above embodiments, the focus and leveling sensor is described in detail. Based on the same inventive concept, the embodiments of the present invention also provide an operating method of the focus and leveling sensor and corresponding embodiments of an electronic device.

[0068] Figure 5 FIG. is a flowchart of the operating method of the focus and leveling sensor provided by the embodiments of the present invention. The operating method of the focus and leveling sensor provided by this embodiment, as Figure 5 shown, specifically includes the following steps:

[0069] S501. According to the current film thickness data of the film layer on the wafer surface, use the controller to determine the target wavelength.

[0070] S502. Converge the laser beam by the lens.

[0071] S503. Use the multiple filters to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving the beam with the target wavelength.

[0072] S504. Transmit the beam with the target wavelength to the wafer surface through the optical fiber line so that the detector receives the reflected beam spot.

[0073] In the working method of the focus and leveling sensor provided in the embodiments of the present invention, by performing the above steps S501 to S504, the corresponding target wavelength can be determined based on the current film thickness data of the film layer on the wafer surface. Then, the laser beam is converged by the lens, and the converged laser beam is filtered by the multiple filter, leaving the beam with the target wavelength, and then transmitted to the wafer surface for reflection. This can make the laser used by the focus and leveling sensor applicable to wafer products with various film thicknesses. By changing the wavelength of the light to the target wavelength, the light incident on the film layer on the wafer surface can be reflected as much as possible, while the light incident on the film layer closest to the surface of the wafer can be absorbed as much as possible, avoiding interference with the wafer flatness test result, thereby improving the measurement accuracy and adaptability to different processes, and reducing the possibility of misexposure caused by the photosensitivity of the photoresist.

[0074] Since the embodiments in the working method part correspond to the embodiments in the focus and leveling sensor part, please refer to the description of the embodiments in the focus and leveling sensor part for the embodiments in the working method part, and will not be elaborated here. And it has the same beneficial effects as the above-mentioned focus and leveling sensor.

[0075] Further, in specific implementation, in the working method of the focus and leveling sensor provided in the embodiments of the present invention, after performing step S501 to determine the target wavelength by the controller, it may further include: the controller selects the filter corresponding to the target wavelength in the multiple filter, and controls the multiple filter to rotate so that the selected filter is placed on the laser light path.

[0076] For the more specific working processes of the above steps, reference can be made to the corresponding content disclosed in the foregoing embodiments, and will not be elaborated here.

[0077] Based on the same inventive concept, the embodiments of the present invention further provide an electronic device including the above-mentioned focus and leveling sensor. Since the principle of solving problems by this electronic device is similar to that of the foregoing focus and leveling sensor, the implementation of this electronic device can refer to the implementation of the focus and leveling sensor, and the repeated parts will not be elaborated.

[0078] In this specification, the embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0079] In summary, a focus and leveling sensor provided by an embodiment of the present invention includes: a laser assembly, a controller, and a detector; the laser assembly includes a lens, a multiple filter, and an optical fiber line; the controller is configured to determine a target wavelength according to the current film thickness data of the film layer on the wafer surface; the lens is configured to converge a laser beam; the multiple filter is electrically connected to the controller and is configured to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving a beam with the target wavelength; the optical fiber line is configured to transmit the beam with the target wavelength to the wafer surface so that the detector receives a reflected beam spot. The above focus and leveling sensor can first determine the corresponding target wavelength based on the current film thickness data of the film layer on the wafer surface, and then when the laser enters the laser assembly, the lens converges the laser beam, and the multiple filter performs filtering processing on the converged laser beam to leave a beam with the target wavelength, and then it is transmitted to the wafer surface for reflection. In this way, the laser used by the focus and leveling sensor can be applicable to wafer products with multiple film thicknesses. By changing the wavelength of the light to the target wavelength, the light incident on the film layer on the wafer surface can be reflected as much as possible, and at the same time, the light incident on the film layer closest to the surface film layer of the wafer can be absorbed as much as possible, avoiding interference with the wafer flatness test result, thereby improving the measurement accuracy and adaptability to different processes, and reducing the possibility of misexposure caused by photoresist photosensitivity. In addition, the present invention also provides a corresponding working method and an electronic device for the focus and leveling sensor, which have the same or corresponding technical features as the above-mentioned focus and leveling sensor, further making the above focus and leveling sensor more practical, and the working method and the electronic device have corresponding advantages.

[0080] Finally, it should be noted that unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including", "comprising" and "having" and any other variants thereof in this application are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the element. In this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0081] For the foregoing embodiments, for the sake of simple description, they are all expressed as a series of combinations of actions. However, those skilled in the art should be aware that the present invention is not limited by the described order of actions, because according to the present invention, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0082] Obviously, the described embodiments are only partial embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict and without creative efforts, combine, add, delete or make other adjustments to the features in the embodiments of the present invention according to the circumstances, so as to obtain different technical solutions that do not essentially depart from the concept of the present invention. These technical solutions also belong to the scope of protection of the present invention.

[0083] The above has introduced in detail the focusing and leveling sensor, its working method, and the electronic device provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention, rather than to limit the protection scope of the invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A focusing and leveling sensor, characterized in that, Comprising: a laser component, a controller, and a detector; the laser component includes a lens, a multi-filter, and an optical fiber line; The controller is configured to determine a target wavelength according to the current film thickness data of the film layer on the wafer surface; The lens is configured to converge the laser beam; The multi-filter, electrically connected to the controller, is configured to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving a beam with the target wavelength; The optical fiber line is configured to transmit the beam with the target wavelength to the wafer surface so that the detector receives the reflected beam spot.

2. The focus and leveling sensor according to claim 1, wherein A plurality of filters with different spectral bands are provided inside the multi-filter.

3. The focus and leveling sensor according to claim 2, characterized in that, All the filters are located on the same horizontal plane.

4. The focus and leveling sensor according to claim 3, characterized in that The distance between each filter and the axis of the multi-filter is equal.

5. The focus and leveling sensor according to claim 1, wherein The multi-filter rotates about the axis of the laser component.

6. The focus and leveling sensor according to claim 1, wherein The outer shape of the multi-filter is cylindrical.

7. The focusing and leveling sensor according to claim 2, wherein The controller is configured to select the filter corresponding to the target wavelength in the multi-filter and control the multi-filter to rotate so that the selected filter is placed on the laser optical path.

8. A working method of the focus and leveling sensor according to any one of claims 1 to 7, characterized in that, Comprising: According to the current film thickness data of the film layer on the wafer surface, a controller is used to determine the target wavelength; The laser beam is converged by a lens; The multi-filter is used to perform corresponding filtering processing on the laser beam converged by the lens by rotation, leaving a beam with the target wavelength; The optical fiber line transmits the beam with the target wavelength to the wafer surface so that the detector receives the reflected beam spot.

9. The working method of the focusing and leveling sensor according to claim 8, characterized in that, After determining the target wavelength by using the controller, it further includes: The controller is used to select the filter corresponding to the target wavelength in the multi-filter and control the multi-filter to rotate so that the selected filter is placed on the laser optical path.

10. An electronic device, characterized in that, Comprising the focusing and leveling sensor according to any one of claims 1 to 7.

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