Packaging process reliability evaluation method and device, computer equipment and storage medium

Abstract

The invention relates to a packaging process reliability evaluation method and device, computer equipment and a computer readable storage medium. The method comprises the following steps: dividing a plurality of device samples into at least three groups; the device sample is an integrated circuit packaged by adopting a to-be-evaluated packaging process; performing a bonding wire evaluation test on the first group of device samples to obtain a first group of test results; the bonding wire evaluation is used for evaluating the reliability of the bonding wire in the device sample; performing an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results; the electrochemical corrosion evaluation test is used for evaluating the electrochemical corrosion resistance of the device sample; performing a welding spot evaluation test on the third group of device samples to obtain a third group of test results; the welding spot evaluation test is used for evaluating the welding spot reliability of the device sample; and determining the reliability of the to-be-evaluated packaging process according to the first group of test results, the second group of test results and the third group of test results. By adopting the method, the reliability evaluation of the packaging process can be realized.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor packaging, and particularly to a method, device, computer equipment, and computer-readable storage medium for evaluating the reliability of a packaging process. Background Art

[0002] The packaging reliability of semiconductor integrated circuits is an important indicator to ensure the quality and reliability of semiconductor products. Currently, life tests and environmental tests are mostly performed on semiconductor chips to estimate the service life of the semiconductor chips and verify the stability of the semiconductor chips in different environments. There is a lack of a method for evaluating the reliability of the packaging process. Summary of the Invention

[0003] Based on this, in view of the above technical problems, it is necessary to provide a method, device, computer equipment, and computer-readable storage medium for evaluating the reliability of a packaging process.

[0004] In a first aspect, this application provides a method for evaluating the reliability of a packaging process, the method including:

[0005] Obtain a plurality of device samples; the device samples are integrated circuits packaged using the packaging process to be evaluated;

[0006] Divide the plurality of device samples into at least three groups;

[0007] Conduct a bonding wire evaluation test on the first group of device samples to obtain a first group of test results; the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples;

[0008] Conduct an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results; the electrochemical corrosion evaluation test is used to evaluate the anti-electrochemical corrosion ability of the device samples;

[0009] Conduct a solder joint evaluation test on the third group of device samples to obtain a third group of test results; the solder joint evaluation test is used to evaluate the solder joint reliability of the device samples;

[0010] Determine the reliability of the packaging process to be evaluated according to the first group of test results, the second group of test results, and the third group of test results.

[0011] In one embodiment, the first test results include the internal moisture content, wire bonding strength, and wire profile of the device samples;

[0012] The conducting a bonding wire evaluation test on the first group of device samples to obtain a first group of test results includes:

[0013] When the encapsulation process to be evaluated includes an airtight encapsulation process, perform an appearance inspection on the device sample to obtain a defect-free device sample;

[0014] After placing the device sample at a first preset temperature for a first preset time, obtain the internal water vapor content, wire bonding strength, and wire profile of the device sample.

[0015] In one embodiment, the first test result includes the wire bonding strength;

[0016] Perform a wire bonding evaluation test on the first group of device samples to obtain a first group of test results, including:

[0017] When the encapsulation process to be evaluated includes a plastic encapsulation process, after placing the device sample at a first preset humidity and a second preset temperature for a second preset time, obtain the wire bonding strength of the device sample.

[0018] In one embodiment, the second group of test results includes the wire bonding strength;

[0019] Perform an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results, including:

[0020] Place the device sample at a second preset humidity and a third preset temperature for a third preset time;

[0021] Determine the test method for the bonding strength test according to the wire bonding method in the encapsulation process to be evaluated;

[0022] Perform a bonding strength test on the device sample according to the test method to obtain the wire bonding strength.

[0023] In one embodiment, the third group of test results includes the solder joint impedance;

[0024] Perform a solder joint evaluation test on the third group of device samples to obtain a third group of test results, including:

[0025] Send a test electrical signal to the device sample and correspondingly obtain a reflected electrical signal;

[0026] Obtain the solder joint impedance of each solder joint in the device sample according to the test electrical signal and the reflected electrical signal.

[0027] In one embodiment, the multiple device samples are divided into at least four groups; the method further includes:

[0028] In the case where the encapsulation process to be evaluated includes a plastic encapsulation process, a plastic encapsulation device delamination test is performed on the fourth group of device samples to obtain the test results of the fourth group; the fourth group of tests is used to evaluate the reliability of the plastic encapsulant in the device samples;

[0029] Correspondingly, determining the reliability of the encapsulation process to be evaluated according to the test results of the first group, the test results of the second group, and the test results of the third group includes:

[0030] Determining the reliability of the encapsulation process to be evaluated according to the test results of the first group, the test results of the second group, the test results of the third group, and the test results of the fourth group.

[0031] In one embodiment, the test results of the fourth group include the delamination condition of the plastic encapsulant in the device samples;

[0032] Performing the plastic encapsulation device delamination test on the fourth group of device samples to obtain the test results of the fourth group includes:

[0033] Performing at least one of high-accelerated stress testing, humidity sensitivity testing, temperature cycle testing, and high-pressure steam aging testing on the device samples;

[0034] Obtaining ultrasonic detection images of the device samples;

[0035] Determining the delamination condition of the plastic encapsulant in the device samples according to the ultrasonic detection images.

[0036] In a second aspect, the present application provides an encapsulation process reliability evaluation device, and the device includes:

[0037] A sample acquisition module, configured to acquire a plurality of device samples; the device samples are integrated circuits encapsulated by the encapsulation process to be evaluated; the plurality of device samples are divided into at least three groups;

[0038] A test module, configured to perform a bonding wire evaluation test on the first group of device samples to obtain the test results of the first group; the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples; performing an electrochemical corrosion evaluation test on the second group of device samples to obtain the test results of the second group; the electrochemical corrosion evaluation test is used to evaluate the anti-electrochemical corrosion ability of the device samples; performing a solder joint evaluation test on the third group of device samples to obtain the test results of the third group; the solder joint evaluation test is used to evaluate the solder joint reliability of the device samples;

[0039] A reliability evaluation module, configured to determine the reliability of the encapsulation process to be evaluated according to the test results of the first group, the test results of the second group, and the test results of the third group.

[0040] In a third aspect, the present application provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the reliability evaluation method for the packaging process provided in any of the above embodiments are implemented.

[0041] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the reliability evaluation method for the packaging process provided in any of the above embodiments are implemented.

[0042] In the above reliability evaluation method, device, computer device, and readable storage medium for the packaging process, by obtaining a plurality of device samples, where the device samples are integrated circuits packaged using the packaging process to be evaluated; dividing the plurality of device samples into at least three groups, performing a bonding wire evaluation test on the first group of device samples to obtain a first test result, where the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples, performing an electrochemical corrosion evaluation test on the second group of device samples to obtain a second test result; the electrochemical corrosion evaluation test is used to evaluate the anti-electrochemical corrosion ability of the device samples, performing a solder joint evaluation test on the third group of device samples to obtain a third test result, where the solder joint evaluation test is used to evaluate the reliability of the solder joints in the device samples, and determining the reliability of the packaging process to be evaluated according to the first test result, the second test result, and the third test result. By designing multiple groups of tests based on the failure mechanisms of the failure modes that are likely to occur in the packaging process, performing tests on different groups of device samples respectively, and determining the reliability of the packaging process to be evaluated according to the results of multiple groups of tests, it provides technical support for the QML (Qualified manufacturer listing) packaging certification of semiconductor integrated circuits. That is, when the integrated circuits packaged by the packaging process to be evaluated pass the bonding wire evaluation test, the electrochemical corrosion evaluation test, and the solder joint evaluation test, the packaging process to be evaluated can be included in the QML. Description of the Drawings

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments of the present application or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0044] Figure 1 It is a schematic flowchart of the reliability evaluation method for the packaging process in an embodiment;

[0045] Figure 2Schematic diagram of the process for evaluating the electrochemical corrosion of the second group of device samples and obtaining the test results of the second group in an embodiment;

[0046] Figure 3 Graph of solder joint impedance in an embodiment;

[0047] Figure 4 Block diagram of the structure of the encapsulation process reliability evaluation device in an embodiment;

[0048] Figure 5 Internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0049] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0050] In one embodiment, as Figure 1 shown, the present application provides an encapsulation process reliability evaluation method, including step 102-step 112.

[0051] Step 102, obtaining a plurality of device samples; the device samples are integrated circuits encapsulated by the encapsulation process to be evaluated.

[0052] The encapsulation process to be evaluated is the evaluation object of the encapsulation process reliability evaluation provided by the present application. The semiconductor structure can be first encapsulated by the encapsulation process to be evaluated, and the reliability of the encapsulation process to be evaluated can be evaluated by testing the encapsulated integrated circuit.

[0053] Step 104, dividing the plurality of device samples into at least three groups.

[0054] The failure sites and failure modes that occur during integrated circuit encapsulation are shown in Table 1. The failure sites that are prone to failure during integrated circuit encapsulation are the bonding area and the encapsulation area. Among them, for the hermetic encapsulation process, the failure modes of the bonding area are manifested as open leads, high impedance state, shorted leads, intermittent conduction of leads, chip detachment, etc., and the failure modes of the encapsulation area are manifested as aluminum film corrosion, open or short circuit of metal interconnections, chip cracks, etc. For the plastic encapsulation process, the failure modes of the bonding area are manifested as open leads, high impedance state, intermittent conduction of leads, chip detachment, etc., and the failure modes of the encapsulation area are manifested as aluminum film corrosion, open or short circuit of metal interconnections, damage to the chip by the encapsulation material, etc.

[0055] Table 1-Failure sites and failure modes that occur during integrated circuit encapsulation

[0056]

[0057] The principles of the above-mentioned failure modes occurring in integrated circuit packaging are shown in Table 2. For hermetic packaging processes, the main mechanisms causing bonding area failures are: (1) poor bonding, (2) intermetallic compound growth and the generation of Kirkendall voids at the bonding interface, (3) adhesion fatigue, etc. The main mechanisms causing package area failures are: (1) surface leakage due to poor sealing, open or short circuits caused by corrosion of metal interconnects, (2) cracking of the ceramic base cover, resulting in surface leakage, open or short circuits caused by corrosion of metal interconnects, (3) thermal stress causing cracks in the package case, cracks at the lead seals, and damage to the solder layer, etc. For plastic packaging processes, the main mechanisms causing bonding area failures are: (1) poor bonding, (2) intermetallic compound growth and the generation of Kirkendall voids at the bonding interface, (3) adhesion fatigue, (4) open circuit due to pad corrosion, etc. The main mechanisms causing package area failures are: (1) voids in the package, resulting in poor heat dissipation, (2) popcorning effect caused by moisture, (3) open or short circuits caused by corrosion of metal interconnects due to moisture, (4) solder joint short circuits, etc.

[0058] Table 2 - Failure Mechanisms of Failures Occurring in Integrated Circuit Packaging

[0059]

[0060] For the above-mentioned failure mechanisms, different tests need to be set up to evaluate the reliability of the packaging process to be evaluated. Therefore, multiple device samples need to be divided into multiple portions.

[0061] Step 106, conduct a bonding lead evaluation test on the first group of device samples to obtain the first group of test results; the bonding lead evaluation is used to evaluate the reliability of the bonding leads in the device samples.

[0062] Step 108, conduct an electrochemical corrosion evaluation test on the second group of device samples to obtain the second group of test results; the electrochemical corrosion evaluation test is used to evaluate the electrochemical corrosion resistance of the device samples.

[0063] Step 110, conduct a solder joint evaluation test on the third group of device samples to obtain the third group of test results; the solder joint evaluation test is used to evaluate the solder joint reliability of the device samples.

[0064] Step 112, determine the reliability of the packaging process to be evaluated based on the first group of test results, the second group of test results, and the third group of test results.

[0065] Specifically, when the device samples pass the bonding lead evaluation test, the electrochemical corrosion evaluation test, and the solder joint evaluation test respectively, it can be considered that the reliability of the packaging process to be evaluated is high.

[0066] In the embodiments of the present application, by grouping multiple device samples, multiple groups of tests are designed based on the failure mechanisms of the failure modes that are prone to occur in the packaging process, and the device samples in different groups are tested respectively. The reliability of the packaging process to be evaluated is determined according to the results of multiple groups of tests, which also provides technical support for the QML (Qualified manufacturer listing) packaging certification of semiconductor integrated circuits. That is, when the integrated circuits packaged by the packaging process to be evaluated all pass the bonding wire evaluation test, the electrochemical corrosion evaluation test, and the solder joint evaluation test, the packaging process to be evaluated can be included in the QML.

[0067] In one embodiment, the first test result includes the internal moisture content, the bonding strength of the bonding wire, and the cross-sectional shape of the bonding wire of the device sample.

[0068] Perform a bonding wire evaluation test on the first group of device samples to obtain the first group of test results, including, in the case where the packaging process to be evaluated includes an airtight packaging process, performing an appearance inspection on the device samples to obtain defect-free device samples, and after placing the device samples at a first preset temperature for a first preset time, obtaining the internal moisture content, the bonding strength of the bonding wire, and the cross-sectional shape of the bonding wire of the device samples.

[0069] For the airtight packaging process, gold wire is currently commonly used as the bonding wire. The failure mechanism of the bonding wire is as follows: In the early stage of bonding, a very thin diffusion layer is formed between Au and Al, and its composition is AuAl2 (purple spot); further heating causes the Au-Al diffusion to continue. As Au continuously diffuses into the Al film, the pure Al layer disappears; at the same time, a Au5Al2 compound layer is formed on the side of the Au wire ball, forming Kirkendall voids, and the contact resistance of the bonding wire increases; under high-temperature environmental conditions, as the Kirkendall voids expand, the contact area between the bonding wire and the pad decreases, and finally the bonding wire solder joint is de-soldered and open-circuited, and finally fails. Based on the fact that the generation of the gold-aluminum compound is related to temperature, therefore, the bonding wire evaluation test mainly observes the tensile force and physical morphology of the bonding wire of the device sample after the high-temperature test.

[0070] Specifically, first perform an appearance inspection on the device samples. The device samples can be inspected under a magnifying glass with a magnification of 1.5 to 10 times to observe whether there are obvious appearance defects in the device samples, such as unclear marking signs, obvious secondary coating materials in the sealing area, and whether there are obvious structural defects. Defect-free device samples can be screened out through the appearance inspection. Place the screened device samples at a first preset temperature for a first preset time. Among them, the first preset temperature can be 125 °C, and the first preset time can be 1000 h.

[0071] After that, some device samples can be sampled from the first group of device samples for internal water vapor content testing. Specifically, the sampled device samples can be baked in an environment of 100±5 degrees Celsius until the background pressure reaches a level that does not interfere with the specified measurement accuracy and sensitivity, and a mass spectrometer can be used to measure the internal water content of the device samples. After the internal water vapor content test, the bond strength test is then carried out on the sampled device samples to obtain the tensile force when the bonding wire fails, and the wire bond strength is determined according to the tensile force. Finally, the wire profile is obtained through an electron beam to observe whether there are voids at the bonding interface.

[0072] In the embodiment of the present application, in the case where the packaging process to be evaluated includes an airtight packaging process, by performing an appearance inspection on the device samples to obtain defect-free device samples, and after placing the device samples at a first preset temperature for a first preset time, obtaining the internal water vapor content, wire bond strength, and wire profile of the device samples, the reliability of the bonding wires encapsulated by the packaging process to be evaluated can be determined according to the internal water vapor content, wire bond strength, and wire profile.

[0073] In one embodiment, the first test result includes the wire bond strength.

[0074] For the bonding wire evaluation test on the first group of device samples, to obtain the first group of test results, including in the case where the packaging process to be evaluated includes a plastic packaging process, after placing the device samples at a first preset humidity and a second preset temperature for a second preset time, the step of obtaining the wire bond strength of the device samples is included.

[0075] For an integrated circuit encapsulated by a plastic packaging process, when moisture reaches the chip surface, a conductive water film will form on the chip surface. At the same time, in the presence of impurity ions Cl - , K + , P 4+ etc. in the packaging material, the following reactions occur:

[0076] 2Al + 6HCl → 2AlCl3 + 3H2↑

[0077] Al + 3Cl – → AlCl3 + 3e –

[0078] AlCl3 + 3H2O → Al(OH)3 + 3HCl

[0079] Al + NaO + H2O → NaAlO2 + 3 / 2H2↑

[0080] Al + 3OH – → Al(OH)3 + 3e –

[0081] 2Al(OH)3 → Al2O3 + 3H2O

[0082] 2AlO2 – + 2H + → Al2O3 + H2O

[0083] This leads to corrosion inside the device. Therefore, the first group of device samples are placed at the first preset humidity and the second preset temperature for the second preset time, and it is checked whether the device samples will corrode in the damp heat environment. Among them, the first preset humidity can be 85%RH, the second preset temperature can be 85 degrees Celsius, the second preset time can be 1000h, and the number of the first group of device samples is greater than or equal to 3.

[0084] After the first group of device samples are placed at the first preset humidity and the second preset temperature for the second preset time, a bonding strength test is performed on the device samples, the tensile force when the leads of the device samples fail is tested, and the lead bonding strength is determined according to the tensile force, so that the reliability of the bonding leads encapsulated by the packaging process to be evaluated can be determined.

[0085] In one embodiment, the test results of the second group include the lead bonding strength.

[0086] An electrochemical corrosion evaluation test is performed on the second group of device samples to obtain the test results of the second group, including steps 202 - step 206.

[0087] Step 202, place the device samples at the second preset humidity and the third preset temperature for the third preset time.

[0088] Among them, the second preset humidity can be 85%RH, the third preset temperature can be 85 degrees Celsius, and the third preset time can be 1000h.

[0089] Step 204, determine the test method for the bonding strength test according to the lead bonding method in the packaging process to be evaluated.

[0090] The lead bonding methods include thermocompression bonding, ultrasonic bonding, flip chip bonding, and beam lead. For thermocompression bonding and ultrasonic bonding, the test method is a tensile test. For flip chip bonding, the test method is a bonding shear force test. For beam lead, the test method is a push test or a pull test.

[0091] Step 206, perform a bonding strength test on the device samples according to the test method to obtain the lead bonding strength.

[0092] Whether for the hermetic packaging process or the plastic packaging process, the metal inside the device will be corroded due to the influence of the surrounding humid atmosphere and the water vapor inside the cavity. By placing the device sample in a damp heat environment for a third preset time and selecting the corresponding test method according to the wire bonding method to obtain the wire bonding strength, the test of the anti-electrochemical corrosion ability of the device sample packaged by the packaging process to be evaluated can be realized.

[0093] In one embodiment, the test results of the third group include the solder joint impedance.

[0094] Perform a solder joint evaluation test on the device samples of the third group to obtain the test results of the third group, including the steps of sending a test electrical signal to the device sample, correspondingly obtaining the reflected electrical signal, and obtaining the solder joint impedance of each solder joint in the device sample according to the test electrical signal and the reflected electrical signal.

[0095] The test electrical signal can be a pulse signal or a step signal. By sending an electrical signal into the transmission path, when there is an impedance change in the transmission path, part of the energy will be reflected and the rest of the energy will continue to be transmitted. When the amplitude of the transmitted wave is known and the amplitude of the reflected wave is measured, the impedance change in the path can be calculated. And by measuring the time difference between the transmitted wave and the reflected wave returning to the transmitting point, the phase of the impedance change can also be calculated. Therefore, the solder joint impedance of each solder joint in the device sample can be obtained by sending a test electrical signal to the device sample, obtaining the corresponding reflected electrical signal, and according to the test electrical signal and the reflected electrical signal:

[0096] Z = Z ref (1 + ρ) / (1 - ρ),

[0097] where ρ is the reflection coefficient, ρ = V reflected / V incident ; V incident is the amplitude of the test electrical signal, V reflected is the amplitude of the reflected electrical signal.

[0098] As Figure 3 shown in the above formula, when ρ = 1, the impedance at the position to be measured is ∞, and the solder joint is open. When ρ = -1, the impedance at the position to be measured is 0, indicating that the solder joint is short-circuited.

[0099] In some embodiments, the solder joint impedance can be obtained by a TDR (Time Domain Reflectometry) network analyzer.

[0100] In this embodiment, by performing a solder joint evaluation test on the device samples of the third group to obtain the solder joint impedance of each solder joint in the device sample, it is possible to judge whether there are cases of solder joint voids, open solder joints or short-circuited solder joints inside the device sample, and realize the reliability judgment of the solder joint connection.

[0101] In one embodiment, when the encapsulation process to be evaluated includes a plastic encapsulation process, a delamination test of plastic encapsulated devices is performed on the fourth group of device samples to obtain the test results of the fourth group. The fourth group of tests is used to evaluate the reliability of the plastic encapsulant in the device samples. The test results of the fourth group include the delamination condition of the plastic encapsulant in the device samples.

[0102] Correspondingly, determining the reliability of the encapsulation process to be evaluated based on the test results of the first group, the second group, and the third group includes the step of determining the reliability of the encapsulation process to be evaluated based on the test results of the first group, the second group, the third group, and the fourth group.

[0103] For an integrated circuit encapsulated with a plastic encapsulation process, another failure mode that easily occurs is delamination of the plastic encapsulant. Therefore, the device samples can be divided into at least four groups, and a delamination test of plastic encapsulated devices is performed on the fourth group of device samples to observe the delamination condition of the plastic encapsulant.

[0104] Specifically, the device samples can be sequentially subjected to highly accelerated stress testing, moisture sensitivity testing, temperature cycling testing, and autoclave testing to obtain ultrasonic detection images of the device samples. Then, based on the ultrasonic detection images, the delamination condition of the plastic encapsulant in the device samples is determined.

[0105] Highly Accelerated Temperature And Humidity Stress Testing (HAST) is a test method for accelerating the aging of products by applying high temperature, high humidity, and high pressure to the samples. The temperature of the highly accelerated stress testing can be 130 °C, the humidity can be 85%RH, and the test time can be 500 h.

[0106] Moisture Sensitivity Level (MSL): First, the device samples are placed in an environment of 30 °C and 65%RH for 168 hours, and then subjected to three reflow soldering tests. The temperature of the reflow soldering test is 219 °C.

[0107] Temperature Cycling: The device samples are placed in an environmental chamber, and the temperature of the environmental chamber is changed from -65 °C to 150 °C, and then from 150 °C to -65 °C, for 1000 cycles.

[0108] Autoclave testing: The device samples are placed in a high-temperature and high-pressure environment of 121 °C and 15 ± 1 psig for 168 hours.

[0109] In this embodiment, high-accelerated stress tests, humidity sensitivity tests, temperature cycle tests, and high-pressure cooking tests can be sequentially performed on device samples. An ultrasonic detection image of the device samples after the high-pressure cooking test is obtained by ultrasonic detection. Whether delamination occurs in the encapsulant is observed based on the ultrasonic detection image. If there is delamination, it indicates that the reliability of the encapsulant is low.

[0110] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are sequentially shown according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment, but can be executed at different moments. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0111] Based on the same inventive concept, an embodiment of the present application further provides a device for evaluating the reliability of a packaging process for implementing the above-mentioned packaging process reliability evaluation method. The implementation solution provided by this device to solve problems is similar to the implementation solution described in the above method. Therefore, the specific limitations in one or more embodiments of the device for evaluating the reliability of a packaging process provided below can refer to the limitations on the packaging process reliability evaluation method in the above text, and will not be repeated here.

[0112] In an exemplary embodiment, as Figure 4 shown, a device for evaluating the reliability of a packaging process is provided, including: a sample acquisition module 402, a test module 404, and a reliability evaluation module 406, where:

[0113] The sample acquisition module 402 is used to acquire multiple device samples; the device samples are integrated circuits encapsulated by the packaging process to be evaluated; the multiple device samples are divided into at least three groups.

[0114] The test module 404 is used to perform a bonding wire evaluation test on the first group of device samples to obtain a first group of test results; the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples; perform an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results; the electrochemical corrosion evaluation test is used to evaluate the anti-electrochemical corrosion ability of the device samples; perform a solder joint evaluation test on the third group of device samples to obtain a third group of test results; the solder joint evaluation test is used to evaluate the solder joint reliability of the device samples.

[0115] The reliability evaluation module 406 is used to determine the reliability of the packaging process to be evaluated according to the first group of test results, the second group of test results, and the third group of test results.

[0116] In one embodiment, the test module is further configured to, when the packaging process to be evaluated includes an airtight packaging process, perform an appearance inspection on the device sample to obtain a defect-free device sample; after placing the device sample at a first preset temperature for a first preset time, obtain the internal water vapor content, the wire bonding strength, and the wire profile of the device sample.

[0117] In one embodiment, the test module is further configured to, when the packaging process to be evaluated includes a plastic packaging process, place the device sample at a first preset humidity and a second preset temperature for a second preset time, and then obtain the wire bonding strength of the device sample.

[0118] In one embodiment, the test module is further configured to place the device sample at a second preset humidity and a third preset temperature for a third preset time; determine the test method for the bonding strength test according to the wire bonding method in the packaging process to be evaluated; perform a bonding strength test on the device sample according to the test method to obtain the wire bonding strength.

[0119] In one embodiment, the test module is further configured to send a test electrical signal to the device sample and correspondingly obtain a reflected electrical signal; obtain the solder joint impedance of each solder joint in the device sample according to the test electrical signal and the reflected electrical signal.

[0120] In one embodiment, the test module is further configured to, when the packaging process to be evaluated includes a plastic packaging process, perform a delamination test on a fourth group of device samples to obtain a fourth group of test results; the fourth group of tests is used to evaluate the reliability of the plastic encapsulant in the device samples.

[0121] The reliability evaluation module is further configured to determine the reliability of the packaging process to be evaluated according to the first group of test results, the second group of test results, the third group of test results, and the fourth group of test results.

[0122] In one embodiment, the test module is further configured to perform at least one of a high-acceleration stress test, a moisture sensitivity test, a temperature cycle test, and a pressure cooker test on the device sample; obtain an ultrasonic detection image of the device sample; and determine the delamination condition of the plastic encapsulant in the device sample according to the ultrasonic detection image.

[0123] Each module in the above packaging process reliability evaluation device can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above respective modules.

[0124] In an exemplary embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as shown in Figure 5 . The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be implemented through WIFI, a mobile cellular network, near field communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a method for evaluating the reliability of a packaging process. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0125] Those skilled in the art can understand that Figure 5 the structure shown in

[0126] is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0127] In an embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, it implements the method for evaluating the reliability of a packaging process provided in any of the above embodiments.

[0128] In one embodiment, a computer program product is provided, including a computer program which, when executed by a processor, implements the encapsulation process reliability evaluation method provided in any of the above embodiments.

[0129] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., and are not limited thereto. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logic devices, data processing logics based on quantum computing, artificial intelligence (AI) processors, etc., and are not limited thereto.

[0130] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope recorded in the present application.

[0131] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A packaging process reliability evaluation method, characterized in that: The method comprises: Acquire a plurality of device samples; the device samples are integrated circuits packaged using a packaging process to be evaluated; dividing the plurality of device samples into at least three groups; Performing a bonding wire evaluation test on the first group of device samples to obtain a first group of test results; the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples; Performing an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results; the electrochemical corrosion evaluation test is used to evaluate the electrochemical corrosion resistance of the device samples; Performing a solder joint evaluation test on the third group of device samples to obtain a third group of test results; the solder joint evaluation test is used to evaluate the reliability of the solder joints of the device samples; The reliability of the packaging process to be evaluated is determined according to the first group of test results, the second group of test results and the third group of test results.

2. The method according to claim 1, characterized in that The first test results include the internal water vapor content, wire bonding strength and wire cross-sectional shape of the device sample; The step of performing a bonding wire evaluation test on the first group of device samples to obtain a first group of test results includes: In the case where the packaging process to be evaluated includes an airtight packaging process, performing a visual inspection on the device sample to obtain a defect-free device sample; After the device sample is placed at a first preset temperature for a first preset time, the internal water vapor content, wire bonding strength and wire cross-sectional shape of the device sample are obtained.

3. The method according to claim 1, characterized in that The first test result includes wire bonding strength; The step of performing a bonding wire evaluation test on the first group of device samples to obtain a first group of test results includes: In the case that the packaging process to be evaluated includes a plastic packaging process, after the device sample is placed at a first preset humidity and a second preset temperature for a second preset time, the wire bonding strength of the device sample is obtained.

4. The method according to claim 1, characterized in that: The second set of test results includes wire bond strength; The step of performing an electrochemical corrosion evaluation test on the second group of device samples to obtain a second group of test results includes: placing the device sample at a second preset humidity and a third preset temperature for a third preset time; Determine a test method for bonding strength test according to the wire bonding method in the packaging process to be evaluated; The bonding strength test of the device sample is performed according to the test method to obtain the wire bonding strength.

5. The method according to claim 1, characterized in that The third set of test results includes solder joint impedance; The step of performing a solder joint evaluation test on the third group of device samples to obtain a third group of test results includes: Sending a test electrical signal to the device sample, and correspondingly acquiring a reflected electrical signal; The solder joint impedance of each solder joint in the device sample is obtained according to the test electrical signal and the reflected electrical signal.

6. The method according to any one of claims 1 to 5, characterized in that: The plurality of device samples are divided into at least four groups; the method further comprising: In the case where the packaging process to be evaluated includes a plastic packaging process, performing a plastic packaging device delamination test on the fourth group of device samples to obtain a fourth group of test results; the fourth group of tests is used to evaluate the reliability of the plastic packaging material in the device samples; Correspondingly, determining the reliability of the packaging process to be evaluated according to the first group of test results, the second group of test results, and the third group of test results includes: The reliability of the packaging process to be evaluated is determined according to the first group of test results, the second group of test results, the third group of test results and the fourth group of test results.

7. The method according to claim 6, characterized in that The fourth group of test results includes the delamination of the molding compound in the device samples; The step of performing the plastic package device delamination test on the fourth group of device samples to obtain the fourth group of test results includes: The device samples are sequentially subjected to a highly accelerated stress test, a humidity sensitivity test, a temperature cycle test, and a high pressure cooking test; Acquire ultrasonic detection images of device samples; The delamination status of the molding compound in the device sample is determined according to the ultrasonic detection image.

8. A packaging process reliability evaluation device, characterized in that: The device comprises: A sample acquisition module is used to acquire a plurality of device samples; the device samples are integrated circuits packaged using a packaging process to be evaluated; and the plurality of device samples are divided into at least three groups; A test module, used to perform a bonding wire evaluation test on a first group of device samples to obtain a first group of test results; the bonding wire evaluation is used to evaluate the reliability of the bonding wires in the device samples; perform an electrochemical corrosion evaluation test on a second group of device samples to obtain a second group of test results; the electrochemical corrosion evaluation test is used to evaluate the anti-electrochemical corrosion ability of the device samples; perform a solder joint evaluation test on a third group of device samples to obtain a third group of test results; the solder joint evaluation test is used to evaluate the reliability of the solder joints of the device samples; A reliability evaluation module is used to determine the reliability of the packaging process to be evaluated based on the first group of test results, the second group of test results and the third group of test results.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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