Heat dissipation device of head-mounted equipment and head-mounted equipment with same

Abstract

The invention discloses a heat dissipation device of head-mounted equipment and the head-mounted equipment with the heat dissipation device. The heat dissipation device comprises a heat dissipation piece provided with a first medium channel; the heat absorbing piece is provided with a second medium channel; two ends of the first connecting pipe are respectively connected with the first medium channel and the second medium channel; two ends of the second connecting pipe are respectively connected with the first medium channel and the second medium channel; wherein the first medium channel, the first connecting pipe, the second medium channel and the second connecting pipe form a circulating flow path for flowing a cooling working medium; at least part of at least one of the first connecting pipe and the second connecting pipe is a telescopic or bendable adjusting section. The heat dissipation device provided by the embodiment of the invention can adapt to multiple times of reversible motion adjustment of the heat dissipation device, can be applied to different positions of the head-mounted equipment or head-mounted equipment of different models after batch production, is beneficial to reducing the production cost of the heat dissipation device, and can meet the adjustable design of the head-mounted equipment.

Description

Technical Field

[0001] The present invention relates to the field of wearable devices, and more particularly to a heat dissipation device for a head-mounted device and a head-mounted device having the same. Background Art

[0002] With the development of the technology of head-mounted devices, the heat dissipation density of many components has been increasing continuously, resulting in an increasingly severe heat dissipation problem for the components. Taking the screen as an example, in the process of technology development, not only the heat dissipation density of the screen is increasing, but also its temperature specification is decreasing significantly. Therefore, it is urgent to improve the heat dissipation problem of the screen.

[0003] Generally, for the heat dissipation of the screen, a graphite sheet temperature equalization scheme is mostly used, that is, a graphite sheet is attached behind the screen for temperature equalization. This scheme can improve the temperature uniformity of the same screen, but the effect of cooling the screen is limited.

[0004] In the prior art, a loop is also proposed to reduce the temperature of the component by using the flow of the medium. However, this way of cooling the component still remains in the theoretical concept stage and no structural design scheme for implementation has been given.

[0005] In addition, in the scheme of using a loop for cooling in a head-mounted device, the positions of the heat absorption part and the heat dissipation part on the loop are fixed. After the device is installed, the heat-generating components need to be arranged corresponding to the heat absorption part. The fixed positions of the heat absorption part and the heat dissipation part make it difficult to adjust the relative positions of the corresponding components in the device, and the applicability of the loop is limited. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a heat dissipation device for a head-mounted device and a head-mounted device having the same, so that after the heat dissipation device is installed and fixed, the relative position between the heat absorption part and the heat dissipation part can be adjusted, making the layout of the components in the head-mounted device more flexible, and it can also be used to cool and protect the components with adjustable positions.

[0007] According to an embodiment of the present invention, a heat dissipation device for a head-mounted device includes: a heat dissipation member having a first medium channel therein; a heat absorption member having a second medium channel therein; a first connecting pipe, both ends of which are respectively connected to the first medium channel and the second medium channel; a second connecting pipe, both ends of which are respectively connected to the first medium channel and the second medium channel; wherein, the first medium channel, the first connecting pipe, the second medium channel, and the second connecting pipe form a circulating flow path for flowing a cooling working medium; at least one of the first connecting pipe and the second connecting pipe has at least a part thereof as an adjustable section that can be telescoped or bent.

[0008] The heat dissipation device of the head-mounted device according to an embodiment of the present invention is used to improve the wearing comfort of the head-mounted device, improve the performance of internal components, and extend the service life. By providing a telescopic or bendable adjustment section, the relative positions of the heat dissipation member and the heat absorption member can be adjusted by the telescoping or bending of the adjustment section, and it can adapt to multiple reversible movement adjustments of the heat dissipation device. This heat dissipation device of the present invention can be applied to different positions of the head-mounted device or different models of head-mounted devices after mass production, which is beneficial to reducing the production cost of the heat dissipation device. It can be applied to head-mounted devices where the heat absorption or heat dissipation position needs to be adjusted to meet the adjustable design of the head-mounted device, such as a head-mounted device with adjustable width or a head-mounted device with adjustable interpupillary distance, etc.

[0009] In some embodiments, there are at least two of the heat absorption members; the first connecting pipe includes: a first main pipe and at least two first branch pipes, one end of the first main pipe is connected to the heat dissipation member, and all the first branch pipes are connected in parallel to the first main pipe, and the first branch pipes are connected to the heat absorption members one by one; the second connecting pipe includes: a second main pipe and at least two second branch pipes, one end of the second main pipe is connected to the heat dissipation member, and all the second branch pipes are connected in parallel to the second main pipe, and the second branch pipes are connected to the heat absorption members one by one.

[0010] Specifically, the upper and lower ends of the heat dissipation member are respectively connected to the first main pipe and the second main pipe;

[0011] There are at least a pair of the heat absorption members, and the two heat absorption members in a pair are located on the horizontal two sides of the heat dissipation member;

[0012] The upper and lower ends of each heat absorption member are respectively connected to the first branch pipe and the second branch pipe, and both the first branch pipe and the second branch pipe include the adjustment section.

[0013] Furthermore, the heat dissipation device further includes: a liquid storage device, and the liquid storage device is connected in series between the second connecting pipe and the heat absorption member.

[0014] In some embodiments, both the heat dissipation member and the heat absorption member are high thermal conductivity material members, and at least one of the first medium channel and the second medium channel includes: a capillary structure composed of capillary pipes.

[0015] In some specific embodiments, when the first medium channel includes the capillary structure, the capillary structure is integrally sintered in the heat dissipation member; when the second medium channel includes the capillary structure, the capillary structure is integrally sintered in the heat absorption member.

[0016] In some other specific embodiments, when the first medium channel includes the capillary structure, the heat dissipation member includes a heat dissipation plate and a first capillary network connected to the heat dissipation plate, and the first capillary network is the capillary structure; when the second medium channel includes the capillary structure, the heat absorption member includes a heat absorption plate and a second capillary network connected to the heat absorption plate, and the second capillary network is the capillary structure.

[0017] In some embodiments, the adjustment section satisfies at least one of the following conditions: the adjustment section is a flexible hose; the adjustment section is an elastic tube; the tube wall of the adjustment section is a corrugated wall.

[0018] In some embodiments, the heat dissipation device further includes at least one of a radiator and a fan. When the heat dissipation device includes a radiator, the radiator is connected to the heat dissipation member. When the heat dissipation device includes a fan, the airflow driven by the fan flows through the heat dissipation member.

[0019] In some embodiments, the heat dissipation member includes a plurality of heat dissipation fins.

[0020] The head-mounted device according to an embodiment of the present invention includes: a heat dissipation device, which is the heat dissipation device of the head-mounted device in the above embodiment; a lens barrel module, and the heat generating member of the lens barrel module is connected to the heat absorption member of the heat dissipation device.

[0021] For such a head-mounted device, the heat dissipation device can be used to dissipate heat from the heat generating member of the lens barrel module, improve the operational performance stability of the lens barrel module, and also utilize the adjustable positions of the heat dissipation member and the heat absorption member in the heat dissipation device, so that good heat dissipation can still be achieved when the lens barrel module moves relative to the main body of the head-mounted device. Especially in some embodiments where the head-mounted device has an interpupillary distance adjustment function, the heat dissipation device can also adapt well. Of course, such a heat dissipation device is not limited to the application scenario of adjusting the interpupillary distance in the head-mounted device. In the heat dissipation device according to the embodiment of the present invention, the adopted circulation flow path abandons the traditional rigid pipeline and adopts a retractable or bendable structure, which can achieve many reversible movements.

[0022] In some embodiments, the heat generating member is a screen, and the back surface of the screen is connected to the heat absorption member.

[0023] Optionally, the heat generating member and the heat absorption member are connected through a heat conducting layer.

[0024] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0025] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0026] Figure 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;

[0027] Figure 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present invention;

[0028] Figure 3 is a schematic structural diagram of a heat dissipation device according to still another embodiment of the present invention;

[0029] Figure 4 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention when there are two heat absorption elements;

[0030] Figure 5 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention when there are multiple heat absorption elements;

[0031] Figure 6 is a schematic internal structure diagram of a head-mounted device according to an embodiment of the present invention.

[0032] Reference numerals:

[0033] head-mounted device 1000,

[0034] heat dissipation device 100,

[0035] heat dissipation member 1, first medium channel 11, heat dissipation plate 12, heat dissipation fins 121, first capillary network 13,

[0036] heat absorption member 2, second medium channel 21, heat absorption plate 22, second capillary network 23,

[0037] first connecting pipe 3, first main pipe 31, first branch pipe 32,

[0038] second connecting pipe 4, second main pipe 41, second branch pipe 42,

[0039] adjusting section 51, hose section 52,

[0040] reservoir 6,

[0041] capillary structure 7, capillary pipes 71,

[0042] driving pump 91, driving impeller 92,

[0043] lens barrel module 600, heating element 610, screen 611, heat conducting layer 620, Detailed implementation manners

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "axial" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] Reference below Figures 1-5 A heat dissipation device 100 for a head mounted device according to an embodiment of the present invention is described.

[0048] The heat dissipation device 100 of the head mounted device according to an embodiment of the present invention is as follows: Figure 1 As shown, it includes: a heat sink 1, a heat absorber 2, a first connecting pipe 3 and a second connecting pipe 4. The heat sink 1 has a first medium channel 11, and the heat absorber 2 has a second medium channel 21. The two ends of the first connecting pipe 3 are respectively connected to the first medium channel 11 and the second medium channel 21, and the two ends of the second connecting pipe 4 are respectively connected to the first medium channel 11 and the second medium channel 21. Among them, the first medium channel 11, the first connecting pipe 3, the second medium channel 21, and the second connecting pipe 4 constitute a circulation flow path for flowing cooling medium.

[0049] It is understandable that there are inevitably some heating elements 610 in the head-mounted device 1000 that generate a lot of heat during operation. If the heat generated by the heating element 610 cannot be discharged in time, the temperature of the heating element 610 or parts around the heating element 610 may rise rapidly, affecting the user's wearing comfort, and it is also easy to reduce the performance of the components and shorten their service life.

[0050] Although the head-mounted device 1000 is equipped with multiple functional components or modules, the main heat sources are concentrated on individual components, such as the main board or chipset. These components not only generate a large amount of heat, but also have a high density of surrounding components, resulting in difficult heat dissipation. After the heat is concentrated, the temperature of these components will rise rapidly, affecting performance.

[0051] In view of the above problems, an embodiment of the present invention provides a heat dissipation device 100. The heat absorption member 2 is installed at a position where heat is concentrated and difficult to export in the head-mounted device 1000, and the heat dissipation member 1 is installed at a position where heat is easily dissipated in the head-mounted device 1000. With the flow of the cooling medium in the circulation flow path, the cooling medium quickly absorbs heat and heats up in the heat absorption member 2, flows to the heat dissipation member 1 through the first connecting pipe 3 to export heat and cool down, and then flows back to the heat absorption member 2 through the second connecting pipe 4 to absorb heat and heat up again. In this way, a large amount of heat absorbed at the heat absorption member 2 can be transferred to the heat dissipation member 1 for rapid export, and the cooling medium absorbs or releases heat to achieve cross-region heat transfer.

[0052] Moreover, in the head-mounted device 1000, the heat absorption member 2 and the heat dissipation member 1 are connected by pipes. The pipes occupy a small space and can be bent to avoid other surrounding components, avoiding interference with other components. Therefore, the design difficulty of the temperature reduction structure of the head-mounted device 1000 is reduced.

[0053] In the present invention, the cooling medium uses the first connecting pipe 3 and the second connecting pipe 4 to flow between the heat dissipation member 1 and the heat absorption member 2, so as to achieve the transfer and dissipation of heat. Compared with the heat dissipating in place around the heat generating member 610, the heat dissipation member 1 of the present invention can flexibly select a suitable position, such as a position far from the heat generating member 610, not in contact with the skin or having good ventilation. Here, the cooling medium is a material with high specific heat capacity and thermal conductivity. In the circulation flow path, the cooling medium can be pure water, methanol, propanol or other phase change media, or common coolants used in air conditioners.

[0054] In the present invention, referring to Figure 1 , at least one of the first connecting pipe 3 and the second connecting pipe 4 has at least a part thereof as an adjustable section 51 that can be telescopic or bendable. That is to say, the entire section or a partial section of the first connecting pipe 3 can be the adjustable section 51 and the second connecting pipe 4 does not include the adjustable section 51, or the entire section or a partial section of the second connecting pipe 4 can be the adjustable section 51 and the first connecting pipe 3 does not include the adjustable section 51, or both the first connecting pipe 3 and the second connecting pipe 4 include the adjustable section 51. The adjustable section 51 can be telescopic or bendable. With such a setting, the relative positions of the heat dissipation member 1 and the heat absorption member 2 can be adjusted by the telescoping or bending of the adjustable section 51.

[0055] It can be understood that when one of the first connecting pipe 3 and the second connecting pipe 4 has an adjustment section 51 and the other does not, although the connecting pipe without the adjustment section 51 cannot be significantly stretched or bent, it has a small amount of deformation after reaching a certain length. Therefore, it does not prevent the stretching or bending of the adjustment section 51 to significantly change the relative positions of the heat dissipation member 1 and the heat absorption member 2. Moreover, even if the connecting pipe cannot be significantly stretched or bent, it has a certain toughness, so it can adapt to the multiple reversible movement adjustments of the heat dissipation device 1000.

[0056] This heat dissipation device 100 of the present invention can be applied to different positions of the head-mounted device 1000 or different models of the head-mounted device 1000 after mass production, which is beneficial to reducing the production cost of the heat dissipation device 100. For example, the same heat dissipation device 100 can be installed on both the small-sized head-mounted device 1000 and the large-sized head-mounted device 1000, and the stretching amount or bending degree of the adjustment section 51 can be adjusted according to the positions of the heat absorption part and the heat dissipation part.

[0057] This heat dissipation device 100 of the present invention can be applied to the head-mounted device 1000 where the heat absorption or heat dissipation position needs to be adjusted, such as the head-mounted device 1000 with adjustable width, or the head-mounted device 1000 with adjustable interpupillary distance, etc.

[0058] In the heat dissipation device 100 of the present invention, various methods can be adopted to promote the flow of the cooling working fluid in the circulation flow path. For example, in some embodiments, as Figure 1 shown, a driving pump 91 is provided in the circulation flow path. The driving pump 91 can be a micro pump, which can drive the cooling working fluid to flow and supports rotational speed adjustment to achieve the flow control of the cooling working fluid. The micro pump has the characteristics of good heat conduction and low noise, and the micro pump can adopt a piezoelectric ceramic pump, etc.

[0059] Another example is as Figure 2 shown, a driving impeller 92 is provided outside the circulation flow path. There is a hose section 52 in the circulation flow path. When the driving impeller 92 rotates, the blades contact the hose section 52, so that the blades squeeze the cooling working fluid in the hose section 52 towards a specific direction, thereby driving the cooling working fluid to circulate. Here, the position of the hose section 52 is not limited. It can be serially arranged on the first connecting pipe 3 or the second connecting pipe 4, or connected between the heat dissipation member 1 and the first connecting pipe 3, etc. Among them, the driving impeller 92 can be only used for driving the flow of the cooling working fluid, and the driving impeller 92 can also shoulder other functions. For example, the air outlet side of the driving impeller 92 faces the radiator or other parts to drive the air flow and improve the heat dissipation efficiency.

[0060] In still other embodiments, as Figure 3As shown, there is neither a driving pump 91 on the circulation path, nor a driving impeller 92 is provided outside it. Instead, other methods are adopted to promote the circulation of the cooling working fluid. For example, a one-way valve (not shown in the figure) is provided to ensure the one-way flow of the cooling working fluid in the circulation path.

[0061] In some embodiments, as Figure 3 shown, the heat dissipation device 100 further includes: a liquid storage device 6, and the liquid storage device 6 is connected in series between the second connecting pipe 4 and the heat absorption member 2. The setting of the liquid storage device 6 is used to increase the total capacity of the cooling working fluid in the circulation path and improve the reliability of the circulation of the cooling working fluid. It can be understood that if the total capacity of the cooling working fluid in the circulation path is set to be relatively small, and due to certain factors during liquid injection, the injection is not full, resulting in possible interruption of the flow at some positions in the circulation flow, affecting heat transfer. Therefore, after adding the liquid storage device 6 to increase the total capacity of the cooling working fluid, the liquid storage device 6 can supply more cooling working fluid to flow, which is beneficial to maintaining the continuity of the flow of the cooling working fluid. Moreover, some liquid storage devices 6 have a liquid filling port, which can facilitate the addition or reduction of the cooling working fluid to the circulation path by using the liquid storage device 6.

[0062] In the embodiment of the present invention, the liquid storage device 6 is connected in series between the second connecting pipe 4 and the heat absorption member 2, and the liquid storage device 6 stores a certain amount of liquid cooling working fluid. When the cooling working fluid in the second medium channel 21 of the heat absorption member 2 absorbs more heat and expands, or even the cooling working fluid in the second medium channel 21 absorbs heat and vaporizes, the expanded cooling working fluid easily flows through the first connecting pipe 3 to the heat dissipation member 1. And the cooling working fluid in the first medium channel 11 of the heat dissipation member 1 dissipates heat and contracts, or even the cooling working fluid in the first medium channel 11 dissipates heat and liquefies, and the contracted cooling working fluid flows through the second connecting pipe 4 to the liquid storage device 6.

[0063] In the embodiment of the present invention, the liquid storage device 6 can select the liquid storage device structure disclosed in the prior art, and the structure of the liquid storage device 6 will not be described in detail here.

[0064] In some embodiments of the present invention, the adjustment section 51 can meet at least one of the following conditions: the adjustment section 51 is a flexible pipe; the adjustment section 51 is an elastic pipe; the tube wall of the adjustment section 51 is a corrugated wall. Here, the material of the adjustment section 51 is not limited and can be a metal pipe, a plastic pipe, etc.

[0065] For example, the adjustment section 51 is a flexible pipe, and the flexible pipe has a smooth wall but no elasticity. Since the flexible pipe can be deformed, the adjustment section 51 can be bent into the required shape. Moreover, when the adjustment section 51 adopts a flexible pipe, the length of the flexible pipe can be adjusted to have a certain redundancy, increasing the adjustment range of the relative positions of the heat dissipation member 1 and the heat absorption member 2. When the adjustment section 51 is a flexible pipe, it can also be an elastic pipe, so that the length of the adjustment section 51 can be stretched and shortened.

[0066] For another example, the material of the adjusting section 51 is a rigid pipe, but the adjusting section 51 is formed as a bellows pipe. Therefore, the adjusting section 51 can be called an elastic pipe with adjustable length. Such an adjusting section 51 can not only be stretched and changed according to needs in terms of length, but also be bent conveniently.

[0067] For still another example, the pipe wall of the adjusting section 51 is a corrugated wall, and the corrugated wall here can be a visible corrugated structure (such as a bellows pipe) or a microscopic corrugated structure. For such an adjusting section 51, its length can also be adjusted according to needs.

[0068] Of course, the solution of the present application is not limited to the above embodiments. The length of some adjusting sections 51 is adjustable in that the adjusting section 51 includes an outer sleeve and an inner sleeve. The outer sleeve is sleeved outside the inner sleeve, and the two are slidably connected, and the telescopic amount can be adjusted according to the length requirement.

[0069] Regarding the first connecting pipe 3 and the second connecting pipe 4 in the embodiments of the present invention, they can include but are not limited to copper pipes, aluminum pipes, stainless steel pipes, titanium alloy pipes, etc., and can also include polymer material metal-coated pipes, etc. The connection between the components of the entire circulation flow path can be bonding, welding, etc., which is not limited here.

[0070] In the embodiments of the present invention, there are at least two heat absorbing members 2, which can be arranged at two heat generating members 610 or on both sides of the same heat generating member 610, etc. Figure 4 There are two heat absorbing members 2 Figure 5 There are multiple heat absorbing members 2. In some embodiments, there are at least two heat dissipating members 1, which can be arranged at at least two well-ventilated positions.

[0071] Specifically, as Figure 4 and Figure 5 shown, there are at least two heat absorbing members 2. The first connecting pipe 3 includes: a first main pipe 31 and at least two first branch pipes 32. One end of the first main pipe 31 is connected to the heat dissipating member 1, and all the first branch pipes 32 are connected in parallel to the first main pipe 31, and the first branch pipes 32 are connected to the heat absorbing members 2 one by one. The second connecting pipe 4 includes: a second main pipe 41 and at least two second branch pipes 42. One end of the second main pipe 41 is connected to the heat dissipating member 1, and all the second branch pipes 42 are connected in parallel to the second main pipe 41, and the second branch pipes 42 are connected to the heat absorbing members 2 one by one. With such an arrangement, all the heat absorbing members 2 are arranged in parallel, and the position of each heat absorbing member 2 relative to the heat dissipating member 1 can be flexibly adjusted, improving the temperature uniformity of all the heat absorbing members 2.

[0072] More specifically, as Figure 4As shown, the upper and lower ends of the heat sink 1 are respectively connected to the first main pipe 31 and the second main pipe 41. The heat sink 2 includes at least one pair, and the two pairs of heat sinks 2 are located on both horizontal sides of the heat sink 1. The upper and lower ends of each heat sink 2 are respectively connected to the first branch pipe 32 and the second branch pipe 42, and the first branch pipe 32 and the second branch pipe 42 both include an adjustment section 51. It can be understood that the head-mounted device 1000 is mainly worn on the human body or animals, and the heads of the human body and animals are generally bilaterally symmetrical structures, and many heating elements 610 on the head-mounted device 1000 are bilaterally symmetrically distributed. Therefore, this heat dissipation device 100 is more convenient to assemble in the head-mounted device 1000.

[0073] Of course, the present application is not limited thereto. Figure 5 In the embodiment, multiple heat absorption elements 2 are arranged on the same side of the heat sink 1. The heat sink 1 can be installed in a well-ventilated position of the head-mounted device 1000, and then the adjustment section 51 can be used to flexibly arrange each heat absorption element 2 at a high temperature.

[0074] In addition, when the area of ​​the heating element 610 is large, a heat dissipation device 100 with at least two heat absorbing elements 2 can be used. By arranging the heat absorbing elements 2 at different positions of the heating element 610, the temperatures at different positions of the heating element 610 are facilitated to converge under the flow of the circulating flow path, thereby improving the temperature consistency at different positions of the heating element 610.

[0075] In some embodiments, the heat sink 1 and the heat absorber 2 can both be rigid components that are not easily deformed, ensuring that the heat transfer path is unobstructed. In addition, the heat sink 1 and the heat absorber 2 are rigid components that have a certain impact resistance. After the heat sink 1 and the heat absorber 2 are fixed, they can support the entire circulation flow path.

[0076] Optionally, to improve the heat dissipation efficiency of the heat sink 1, the heat sink 1 is made of a high thermal conductivity material to facilitate rapid heat dissipation of the cooling medium in the first medium channel 11, especially when there is flowing air around, the heat can be quickly dissipated into the air.

[0077] Optionally, in order to improve the heat absorption efficiency of the heat absorption element 2 , the heat absorption element 2 is made of a high thermal conductivity material, so that the surrounding high temperature is quickly guided to the cooling medium in the second medium channel 21 through the heat absorption element 2 .

[0078] Optionally, the heat sink 1 and the heat absorber 2 are both made of high thermal conductivity materials, thereby further improving the heat transfer efficiency.

[0079] Specifically, the material of the high thermal conductivity material piece includes but is not limited to copper, aluminum, stainless steel, titanium alloy, etc.

[0080] In some embodiments, Figure 2As shown, at least one of the first medium channel 11 and the second medium channel 21 includes a capillary structure 7 composed of a plurality of capillary tubes 71.

[0081] Here, the capillary structure 7 uses a plurality of capillary tubes 71 to divide the cooling working fluid into multiple strands, increasing the distribution range of the capillary structure 7 and significantly increasing the contact area between the cooling working fluid and the flow-through wall. Moreover, the flow rate of the cooling working fluid in a single capillary tube 71 is reduced, and the cooling working fluid is prone to contact with the flow-through wall during flow. Therefore, the capillary structure 7 can significantly improve the heat exchange efficiency.

[0082] Specifically, there are various forms of forming the capillary structure 7. Taking the second medium channel 21 including the capillary structure 7 as an example, the capillary structure 7 can be formed on the heat absorber 1 by sintering.

[0083] The so-called sintering is a process of heating powder or powder compact to a certain temperature and then cooling it to room temperature. The result of sintering is that the powder particles bond together, and the strength of the structure increases. A series of physical and chemical changes occur during sintering, turning the aggregate of powder particles into an aggregate of grains. During sintering, in addition to the connection of powder particles, densification, alloying, etc. may also occur. During the process of sintering the heat absorber 1 formed from powder or powder compact, multiple pores are formed inside the heat absorber 1 due to the connection and densification of powder particles. Most of the pores are interconnected. After these interconnected pores connect the inlet and outlet of the heat absorber 1, they can serve as the second medium channel 21 to circulate the cooling working fluid. Each of these pores can be called a capillary tube 71, and all the pores that can circulate the cooling working fluid are called the capillary structure 7. By using sintering to form the capillary tubes 71, capillary tubes 7 may be formed at every place inside the heat absorber 1, and the distribution of the capillary tubes 7 is more dense.

[0084] In another solution, the capillary structure 7 itself is an independently processed pipe network, which can be a metal pipe network or a network of other high thermal conductivity materials, and the pipe network is embedded on the main component of the heat absorber 1. By using the pipe network to form the capillary structure 7, there is no restriction on the processing form of the main component of the heat absorber 1, and the structural form of the main component of the heat absorber 1 is more diverse.

[0085] In another solution, the capillary structure 7 can be a hybrid structure, which can be partially formed on the heat absorber 1 by sintering and partially be a pipe network.

[0086] Certainly, in the embodiments of the present invention, when the capillary tubes 71 are formed by sintering, the capillary tubes 71 can be integrally sintered inside the heat dissipation member 1 to make the first medium channel 11 include the capillary structure 7. Or the capillary tubes 71 can be integrally sintered inside the heat absorber 2 to make the second medium channel 21 include the capillary structure 7.

[0087] In the embodiments of the present invention, as Figure 3As shown, when the first medium channel 11 includes the capillary structure 7, the heat dissipation member 1 includes a heat dissipation plate 12 and a first capillary network 13 connected to the heat dissipation plate 12, and the first capillary network 13 forms the capillary structure 7. In this way, the internal cooling working fluid uses the first capillary network 13 to quickly dissipate heat to the heat dissipation plate 12, enabling the flowing air to carry away a large amount of heat.

[0088] When the second medium channel 21 includes the capillary structure 7, the heat absorption member 2 includes a heat absorption plate 22 and a second capillary network 23 connected to the heat absorption plate 22, and the second capillary network 23 forms the capillary structure 7. In this way, the heat absorbed by the heat absorption plate 22 can be quickly transferred to the internal cooling working fluid through the second capillary network 23.

[0089] Furthermore, as Figure 3 shown, the heat dissipation member 1 includes a plurality of heat dissipation fins 121. Specifically, the heat dissipation plate 12 includes a plurality of heat dissipation fins 121, which can increase the contact area with the surrounding air and improve the heat dissipation efficiency.

[0090] In Figure 3 the example, the heat dissipation plate 12 includes a plurality of heat dissipation fins 121, and each heat dissipation fin 121 is square. It can also be circular, triangular or other shapes.

[0091] In some embodiments, the heat dissipation device 100 further includes at least one of a radiator and a fan. When the heat dissipation device 100 includes a radiator, the radiator is connected to the heat dissipation member 1. When the heat dissipation device 100 includes a fan, the airflow driven by the fan flows through the heat dissipation member 1. That is to say, the heat dissipation member 1 can be used in cooperation with a radiator or a fan to further improve its heat dissipation capacity, achieve rapid heat dissipation, and ensure that the temperature of the heat source is within the allowable range.

[0092] Next, refer to Figures 1-6 to describe the head-mounted device 1000 according to an embodiment of the present invention.

[0093] In the solution of the embodiment of the present invention, the type of the head-mounted device 1000 is not limited, and it can be an AR glasses (AR: Augmented Reality, augmented reality) or VR glasses (VR: Virtual Reality, virtual reality), MR glasses (MR: Mixed Reality, mixed reality), VR all-in-one machine and other extended reality devices. These devices are intelligent linking devices between the virtual world and the real world, capable of seeing the real world and virtual content, and can perform information interaction such as vision and hearing.

[0094] The head-mounted device 1000 according to an embodiment of the present invention, as Figure 6As shown in the figure, it includes: a heat dissipation device 100 and a lens barrel module 600. The heat dissipation device 100 is the heat dissipation device 100 described in the above embodiments, and the heating element 610 of the lens barrel module 600 is connected to the heat absorption element 2 of the heat dissipation device 100.

[0095] For such a head-mounted device 1000, the heat dissipation device 100 can be used to dissipate heat from the heating element 610 of the lens barrel module 600, improving the operational performance stability of the lens barrel module 600. Moreover, due to the adjustable positions of the heat dissipation element 1 and the heat absorption element 2 in the heat dissipation device 100, good heat dissipation can still be achieved when the lens barrel module 600 moves relative to the main body of the head-mounted device 1000. In particular, in some embodiments, the head-mounted device 1000 has an interpupillary distance adjustment function, and the heat dissipation device 100 can also adapt well. Of course, such a heat dissipation device 100 is not limited to the application scenario of adjusting the interpupillary distance in the head-mounted device 1000. In the heat dissipation device 100 of the embodiments of the present invention, the adopted circulation flow path abandons the traditional rigid pipeline and adopts a retractable or bendable structure, which can achieve many reversible movements.

[0096] In Figure 6 the embodiments of, the head-mounted device 1000 includes: two lens barrel modules 600, and the distance between the two lens barrel modules 600 is adjustable. In the heat dissipation device 100, there are two heat absorption elements 2. The first connecting pipe 3 includes a first main pipe 31 and two first branch pipes 32, and the second connecting pipe 4 includes a second main pipe 41 and two second branch pipes 42. The upper and lower ends of the heat dissipation element 1 are respectively connected to the first main pipe 31 and the second main pipe 41, and the two heat absorption elements 2 are located on the horizontal sides of the heat dissipation element 1. The upper and lower ends of each heat absorption element 2 are respectively connected to the first branch pipe 32 and the second branch pipe 42, and both the first branch pipe 32 and the second branch pipe 42 include an adjustment section 51. The two heat absorption elements 2 are respectively connected to the heating element 610 of the lens barrel module 600. When adjusting the interpupillary distance, the lengths of the adjustment sections 51 on the first branch pipe 32 and the second branch pipe 42 change.

[0097] It can be understood that with the development of the screen technology of intelligent devices, the heat dissipation density of the screen is continuously increasing, and the temperature specification has also been greatly reduced. The heat dissipation problem of the screen is becoming more and more serious. In the industry, the heat dissipation of the screen mostly uses the graphite sheet temperature equalization scheme, that is, a graphite sheet is pasted behind the screen for temperature equalization. However, this scheme may be applicable when the temperature specification of the MicroOLED is very low, and the reliability of the screen heat dissipation problem is limited in other cases.

[0098] Therefore, in the embodiments of the present invention, by setting the heat dissipation device 100, when the heating element 610 of the lens barrel module 600 is the screen 611, the back surface of the screen 611 is connected to the heat absorption element 2. Thereby, the temperature of the screen 611 can be reduced, the operational performance of the screen 611 can be improved, and its temperature life can meet the requirements.

[0099] When there are two lens barrel modules 600, the heat dissipation device 100 uses two heat absorption elements 2 to connect the screens 611 of the two lens barrel modules 600, which can reduce the temperature of the two screens 611. Moreover, the cooling working fluid in the heat dissipation device 100 flows into the heat dissipation element 1 for mixing, so the temperatures of the two screens 611 can be promoted to reach uniformity. For example, the temperature difference between the two screens 611 can be controlled within 2 degrees.

[0100] Specifically, the screen 611 of the embodiment of the present invention includes, but is not limited to, LCD, Mini LCD, Micro LED, and MicroOLED screens, and the heat dissipation device 100 of the embodiment of the present invention can be well adapted to the above various screens 611.

[0101] Optionally, the heating element 610 and the heat absorption element 2 are connected through a heat conduction layer 620, thereby ensuring that there is no relative displacement between the heating element 610 and the heat absorption element 2, and keeping the heat absorption element 2 in the best heat absorption position.

[0102] Optionally, the connection between the heating element 610 and the heat absorption element 2 includes, but is not limited to, thermal conductive glue, thermal conductive pad, thermal conductive gel, thermal conductive silicone grease, phase change thermal conductive film, etc.

[0103] In Figure 6 In the shown embodiment, when assembling the heat dissipation device 100, it is necessary to first evacuate the circulation flow path of the heat dissipation device 100 and then fill it with a cooling working fluid. The two heat absorption elements 2 are respectively attached to the heating elements 610 of the two lens barrel modules 600. During operation, the two heat absorption elements 2 respectively absorb the heat of the heating elements 610 of the two lens barrel modules 600, and the internal cooling working fluid evaporates into steam, which converges into the first main pipe 31 through the two first branch pipes 32 and flows to the heat dissipation element 1. The heat dissipation element 1 is provided with heat dissipation fins 121. The material of the heat dissipation fins 121 includes, but is not limited to, copper, aluminum alloy, etc. The first medium channel 11 can pass through the heat dissipation fins 121 and be in close cooperation with the heat dissipation fins 121. The cooperation method can be welding, bonding, interference fit, etc. The steam condenses in the heat dissipation element 1 to become a liquid, and then is dispersed into the two second branch pipes 42 through the second main pipe 41, and flows to the two side liquid storage devices 6 respectively, and enters the heat absorption elements 2 on both sides to form a cycle.

[0104] This heat dissipation device 100 can not only cooperate with the pupil distance adjustment function of the head-mounted device 1000, but also ensure the temperature consistency of the heating elements 610 of the two lens barrel modules 600, which is beneficial to maintaining the performance consistency of the two lens barrel modules 600.

[0105] Other components of the head-mounted device 1000 according to the embodiment of the present invention, such as batteries and controllers, and operations are known to those of ordinary skill in the art, and will not be described in detail here.

[0106] In the description of this specification, the descriptions referring to terms such as "embodiment", "example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0107] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation device for a head-mounted device, characterized in that, Comprising: A heat dissipation component, within which there is a first medium channel; A heat absorption component, within which there is a second medium channel; A first connecting pipe, with both ends thereof respectively connecting the first medium channel and the second medium channel; A second connecting pipe, with both ends thereof respectively connecting the first medium channel and the second medium channel; Wherein, the first medium channel, the first connecting pipe, the second medium channel, and the second connecting pipe form a circulation flow path for flowing a cooling working medium; At least one of the first connecting pipe and the second connecting pipe has at least a part thereof being an adjustable section that can be telescopic or bendable.

2. The heat dissipation device of the head-mounted device according to claim 1, characterized in that, There are at least two of the heat absorption components; The first connecting pipe includes: a first main pipe and at least two first branch pipes. One end of the first main pipe is connected to the heat dissipation component, and all the first branch pipes are connected in parallel to the first main pipe, and the first branch pipes are connected to the heat absorption components one by one; The second connecting pipe includes: a second main pipe and at least two second branch pipes. One end of the second main pipe is connected to the heat dissipation component, and all the second branch pipes are connected in parallel to the second main pipe, and the second branch pipes are connected to the heat absorption components one by one.

3. The heat dissipation device of the head-mounted device according to claim 2, characterized in that, The upper and lower ends of the heat dissipation component are respectively connected to the first main pipe and the second main pipe; The heat absorption component includes at least a pair, and the two heat absorption components in the pair are located on the horizontal two sides of the heat dissipation component; The upper and lower ends of each heat absorption component are respectively connected to the first branch pipe and the second branch pipe, and both the first branch pipe and the second branch pipe include the adjustable section.

4. The heat dissipation device of the head-mounted device according to claim 1, wherein, Further comprising: A liquid storage device, which is connected in series between the second connecting pipe and the heat absorption component.

5. The heat dissipation device of the head-mounted device according to claim 1, characterized in that, Both the heat dissipation component and the heat absorption component are high thermal conductivity material components, and at least one of the first medium channel and the second medium channel includes: a capillary structure composed of a plurality of capillary pipes.

6. The heat dissipation device of the head-mounted device according to claim 5, characterized in that, When the first medium channel includes the capillary structure, the capillary pipes are integrally sintered in the heat dissipation component; When the second medium channel includes the capillary structure, the capillary pipes are integrally sintered in the heat absorption component.

7. The heat dissipation device of the head-mounted device according to claim 5, characterized in that, When the first medium channel includes the capillary structure, the heat dissipation component includes a heat dissipation plate and a first capillary network connected to the heat dissipation plate, and the first capillary network forms the capillary structure; When the second medium channel includes the capillary structure, the heat absorption component includes a heat absorption plate and a second capillary network connected to the heat absorption plate, and the second capillary network forms the capillary structure.

8. The heat dissipation device of the head-mounted device according to claim 1, characterized in that, The adjustable section satisfies at least one of the following conditions: The adjustable section is a flexible pipe; The adjustable section is an elastic pipe; The pipe wall of the adjustable section is a corrugated wall.

9. The heat dissipation device of the head-mounted device according to any one of claims 1-8, characterized in that Further comprising at least one of a radiator and a fan. When the cooling device includes a radiator, the radiator is connected to the heat dissipation component, and when the cooling device includes a fan, the air flow driven by the fan flows through the heat dissipation component.

10. The heat dissipation device of the head-mounted device according to any one of claims 1-8, characterized in that, The heat dissipation component includes a plurality of heat dissipation fins.

11. A head-mounted device, characterized in that, Comprising: A cooling device, which is the cooling device of the head-mounted device according to any one of claims 1-10; A lens barrel module, and the heating component of the lens barrel module is connected to the heat absorption component of the cooling device.

12. The head-mounted device according to claim 11, wherein The heating element is a screen, and the back surface of the screen is connected to the heat absorption element.

13. The head-mounted device according to claim 11, wherein, The heating element and the heat absorption element are connected through a heat conduction layer.

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