Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including dielectric layers and internal electrodes alternately arranged in a first direction; the extension part is arranged on the main body; and an external electrode disposed on the extension portion, in which the extension portion includes a plurality of extraction electrodes spaced apart in a second direction perpendicular to the first direction, a plurality of via electrodes connecting the plurality of extraction electrodes, and an insulating portion covering the plurality of extraction electrodes.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0196566, filed with the Korean Intellectual Property Office on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), a type of multi-layer electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products, including display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc., for charging or discharging.

[0004] The MLCC, which has advantages such as small size, high capacitance, and easy installation, can be used as a component in various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher outputs, the demand for miniaturization and high capacitance of the MLCC has increased.

[0005] In the prior art, in order to minimize the ratio (e.g., volume ratio) of the external electrode in the entire multi-layer ceramic capacitor and minimize the area where the external electrode is exposed to the outside of the multi-layer ceramic capacitor, a structure has been attempted in which a separate lead-out electrode is formed on the surface of the main body where one end of the internal electrode is exposed, the lead-out electrode is covered with a ceramic layer, and the lead-out electrode is exposed only on one surface in the thickness direction of the ceramic layer. In the case of having such a structure, the ratio of the external electrode in the multi-layer ceramic capacitor can be minimized and the moisture resistance reliability can be improved, but it may be difficult to sufficiently ensure the electrical connectivity between the internal electrode and the lead-out electrode and between the lead-out electrode and the external electrode. Therefore, the ESR of the multi-layer ceramic capacitor may increase.

[0006] Therefore, a structural improvement is needed such that even when a separate lead-out electrode is formed on the surface of the main body where one end of the internal electrode is exposed, a decrease in ESR characteristics (i.e., prevention of an increase in ESR) can be prevented. Summary of the Invention

[0007] One aspect of the present disclosure is to reduce the ESR of a multi-layer electronic component in a structure in which a separate lead-out electrode is formed on the surface of the main body where one end of the internal electrode is exposed.

[0008] However, the object of the present disclosure is not limited to the foregoing, and can be more easily understood during the description of specific exemplary embodiments of the present disclosure.

[0009] According to one aspect of the present disclosure, a multi-layer electronic component includes: a main body including dielectric layers and inner electrodes alternately arranged in a first direction; an extension portion provided on a surface of the main body in a second direction perpendicular to the first direction; and an outer electrode provided on a surface of the extension portion in the first direction (e.g., one of the surfaces facing each other in the first direction), wherein the extension portion includes a plurality of lead-out electrodes spaced apart in the second direction, a plurality of via electrodes connecting the plurality of lead-out electrodes, and an insulating portion covering the plurality of lead-out electrodes. One of the plurality of lead-out electrodes contacts the inner electrode in the second direction.

[0010] According to another aspect of the present disclosure, a multi-layer electronic component includes: a main body including inner electrodes stacked in a thickness direction, and dielectric layers are provided between the inner electrodes; extension portions provided on end surfaces of the main body opposite to each other in a length direction; and outer electrodes provided on bottom surfaces of the extension portions. Each of the extension portions includes: a lead-out electrode provided parallel to a corresponding end surface of the main body, one of the lead-out electrodes contacts the inner electrode at the corresponding end surface of the main body, the lead-out electrode contacts the outer electrode at the bottom surface of the extension portion and is spaced apart from the top surface of the extension portion; and a via electrode provided between adjacent lead-out electrodes among the lead-out electrodes to form an electrical contact between the lead-out electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Aspects, features, and advantages of the present disclosure will be more clearly understood by combining the accompanying drawings and the following detailed description, in which: Figure 1 is a schematic perspective view of a multi-layer electronic component according to an exemplary embodiment in the present disclosure; Figure 2 is a sectional view taken along line I-I' of Figure 1 ; Figure 3 is a sectional view taken along line II-II' of Figure 1 ; Figure 4 is a schematic perspective view of the main body of a multi-layer electronic component according to an exemplary embodiment; Figure 5 is a schematic exploded perspective view of a multi-layer electronic component according to an exemplary embodiment; Figure 6 is Figure 2 an enlarged view of the P region of Figure 7 is corresponding to Figure 2 a schematic sectional view of a multi-layer electronic component according to another exemplary embodiment; and Figure 8 Yes Figure 7 An enlarged view of the P' region of Detailed implementation manners

[0012] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. However, the inventive concept may be illustrated in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, for clarity, the shapes and sizes of elements may be exaggerated, and the same or similar reference numerals will always be used to denote the same or similar elements.

[0013] To clarify this disclosure, portions irrelevant to the description are omitted throughout the specification, and the same reference numerals refer to the same elements, and in the drawings, for clarity, the thicknesses of layers, films, panels, regions, etc. are exaggerated. Further, in the drawings, the same reference numerals denote the same elements even though shown in different drawings. Throughout the specification, unless explicitly described to the contrary, the words "comprise", "include" or "contain" will be understood to imply the inclusion of the stated elements without excluding any other elements.

[0014] In the drawings, the first direction may be defined as the stacking direction or the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0015] Figure 1 Is a schematic perspective view of a multi-layer electronic component according to an exemplary embodiment of the present disclosure.

[0016] Figure 2 Is along Figure 1 Cross-sectional view taken along line I-I' of

[0017] Figure 3 Is along Figure 1 Cross-sectional view taken along line II-II' of

[0018] Figure 4 Is a schematic perspective view of the body of a multi-layer electronic component according to an exemplary embodiment.

[0019] Figure 5 Is a schematic exploded perspective view of a multi-layer electronic component according to an exemplary embodiment.

[0020] Figure 6 Is Figure 2 An enlarged view of the P region of

[0021] Hereinafter, will refer to Figures 1 to 6Describe in detail a multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure. In addition, in each drawing, the number of inner electrodes and the number of dielectric layers are schematically shown, but the number of inner electrodes and the number of dielectric layers are not limited to the numbers shown in the drawings.

[0022] The multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a main body 110 including dielectric layers 111 and inner electrodes 121 and 122 alternately stacked in a first direction with the dielectric layers 111 interposed therebetween; extensions 141 and 142 provided on the main body 110; and outer electrodes 131 and 132 provided on one of the surfaces of the extensions 141 and 142 that face each other in the first direction. The extensions may include lead-out electrodes and via electrodes, and optionally, the extensions may include insulating portions. Specifically, the extension 141 may include: a plurality of lead-out electrodes 141a spaced apart in a second direction perpendicular to the first direction of the main body 110; a plurality of via electrodes 141b connecting the plurality of lead-out electrodes 141a; and an insulating portion 141c covering the plurality of lead-out electrodes 141a. The extension 142 may include: a plurality of lead-out electrodes 142a spaced apart in a second direction perpendicular to the first direction of the main body 110; a plurality of via electrodes 142b connecting the plurality of lead-out electrodes 142a; and an insulating portion 142c covering the plurality of lead-out electrodes 142a. In addition, one of the plurality of lead-out electrodes contacts an inner electrode in the second direction. Specifically, one of the plurality of lead-out electrodes 141a and one of the plurality of lead-out electrodes 142a respectively contact the inner electrodes 121 and 122 exposed through the surfaces of the main body that face each other in the second direction.

[0023] Referring to Figure 2 and Figure 3 , the main body 110 may include dielectric layers 111 and inner electrodes 121 and 122.

[0024] The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated such that their boundaries may not be easily distinguishable without using a scanning electron microscope (SEM).

[0025] There is no particular limitation on the raw material for forming the dielectric layer 111 as long as the raw material can obtain sufficient capacitance. For example, a barium titanate (BaTiO3)-based dielectric material, a CaZrO3-based paraelectric dielectric material, etc. may be used. For example, the barium titanate (BaTiO3)-based dielectric material may be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Cax )(Ti 1- y Zr y )O3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the CaZrO3-based paraelectric dielectric material may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0026] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. may be added to the dielectric layer 111 according to the purpose of the present disclosure.

[0027] The average thickness of the dielectric layer 111 is not particularly limited.

[0028] To achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be less than or equal to 0.35 μm, and to improve the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness td of the dielectric layer 111 may be greater than or equal to 3 μm.

[0029] The average thickness of the dielectric layer 111 can be measured by scanning an image of a cross-section of the main body 110 in the third direction and the first direction or a cross-section in the second direction and the first direction using a scanning electron microscope (SEM).

[0030] For example, the average thickness td of the dielectric layer 111 is measured as follows. In an image of a cross-section of the main body 110 taken at the center in the width direction of the main body 110 in the length direction and the thickness direction scanned by a scanning electron microscope, a total of five dielectric layers 111 are taken in the dielectric layer (the five dielectric layers 111 include one dielectric layer closest to the intersection point of the center line of the main body in the length direction and the center line of the main body in the thickness direction, and two dielectric layers above the one dielectric layer and two dielectric layers below the one dielectric layer in the thickness direction), and then five points are determined at equal intervals along the length direction based on the reference points where the center line of the main body in the thickness direction intersects each dielectric layer (the five points include the reference point and two points on the left side of the reference point and two points on the right side of the reference point in the length direction), and thereafter, the thickness of each dielectric layer at each point is measured and the average value is taken.

[0031] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122.

[0032] The first internal electrode 121 and the second internal electrode 122 may be alternately arranged to face each other, and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. The first internal electrode 121 may be exposed on one surface of the main body 110 in the second direction, and the second internal electrode 122 may be exposed on the other surface of the main body 110 in the second direction.

[0033] Referring Figure 2 , the first internal electrode 121 may be arranged at a certain distance from the other surface of the main body 110 in the second direction, and the second internal electrode 122 may be arranged at a certain distance from one surface of the main body 110 in the second direction. At this time, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 provided therebetween.

[0034] The main body 110 may be formed by alternately stacking green ceramic sheets printed with conductive paste for the first internal electrode 121 and green ceramic sheets printed with conductive paste for the second internal electrode 122, and then sintering them.

[0035] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0036] In addition, the internal electrodes 121 and 122 may be formed by printing internal electrode conductive paste on green ceramic sheets. The internal electrode conductive paste includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys. As a printing method of the internal electrode conductive paste, a screen printing method or a gravure printing method may be used, but the present disclosure is not limited thereto.

[0037] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary according to the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be less than or equal to 0.35 μm, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness te of the internal electrodes 121 and 122 may be greater than or equal to 3 μm.

[0038] The average thickness te of the inner electrodes 121 and 122 is obtained as follows. In an image of a cross-section of the main body 110 taken at the center in the width direction of the main body 110 and scanned with a scanning electron microscope, a total of five inner electrodes are taken in the inner electrodes (the five inner electrodes include one inner electrode closest to the point where the center line of the main body in the length direction and the center line of the main body in the thickness direction intersect, and two inner electrodes above the one inner electrode and two inner electrodes below the one inner electrode in the thickness direction). Then, five points are determined at equal intervals in the length direction based on the reference points where the center line of the main body in the thickness direction intersects each inner electrode (the five points include the reference point and two points on the left side of the reference point and two points on the right side of the reference point in the length direction). Thereafter, the thickness of each inner electrode at each point is measured and its average value is taken.

[0039] Referring Figure 2 and Figure 3 In the main body 110, the region where the inner electrodes 121 and 122 overlap in the first direction can be defined as the capacitance forming portion Ac.

[0040] Since the first inner electrode 121 and the second inner electrode 122 are arranged to overlap in the first direction, the capacitance forming portion Ac can function to form a capacitance.

[0041] In addition, the covering portions 112 and 113 can be provided on one surface and the other surface of the capacitance forming portion Ac in the first direction.

[0042] The covering portions 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitance forming portion Ac in the thickness direction, and can mainly function to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0043] The covering portions 112 and 113 do not include inner electrodes and can include the same material as the material of the dielectric layer 111.

[0044] That is, the covering portions 112 and 113 can include a ceramic material, and for example, can include the same material as the material of the dielectric layer 111.

[0045] In addition, the thickness of each of the covering portions 112 and 113 is not particularly limited. For example, the thickness of each of the covering portions 112 and 113 can be less than or equal to 20 μm respectively.

[0046] The average thickness of the covering parts 112 and 113 may refer to the dimension of the covering parts 112 and 113 in the first direction, and may be the average value obtained by measuring the dimensions of the covering parts 112 and 113 in the first direction at five equally spaced points above and below the capacitor forming part Ac.

[0047] The edge parts 114 and 115 may be arranged on one surface and the other surface of the capacitor forming part Ac in the third direction.

[0048] As Figure 3 shown, the edge parts 114 and 115 may refer to the regions between the ends of the first inner electrode 121 and the second inner electrode 122 and the surfaces of the main body 110 in the third direction.

[0049] The edge parts 114 and 115 may function to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0050] The edge parts 114 and 115 may be formed by applying a conductive paste to regions of the green ceramic sheet other than the regions where the edge parts are to be formed to form the inner electrodes.

[0051] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, the stack may be cut after stacking the green ceramic sheets on which the inner electrodes are formed, so that the inner electrodes are exposed on two surfaces of the cut stack in the third direction, and then a single dielectric layer or two or more dielectric layers may be stacked on two surfaces of the cut stack in the third direction (width direction) to form the edge parts 114 and 115.

[0052] In addition, the widths of the edge parts 114 and 115 are not particularly limited. For example, the average widths of the edge parts 114 and 115 may be less than or equal to 20 μm, respectively.

[0053] The average widths of the edge parts 114 and 115 may refer to the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from one surface of the main body in the third direction (for example, the fifth surface described later) and the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from the other surface of the main body in the third direction (for example, the sixth surface described later), and may be the average values of the dimensions of the edge parts 114 and 115 in the third direction measured at five equally spaced points on the surfaces of the capacitor forming part Ac in the third direction.

[0054] Refer to Figure 4When the direction perpendicular to the first direction is the second direction and the direction perpendicular to the first and second directions is the third direction, the main body 110 may include a first surface 1 and a second surface 2 that face each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in the second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in the third direction.

[0055] Although the specific shape of the main body 110 is not particularly limited, as shown in the figure, the main body 110 may have a hexahedron shape or a similar shape. Due to the shrinkage of the ceramic powder included in the main body 110 during the sintering process, the main body 110 may not have a perfect hexahedron shape but may have a basic hexahedron shape.

[0056] Referring to Figure 5 , extension portions 141 and 142 may be arranged on the main body 110. The extension portion 141 may be arranged on the third surface 3 to cover the end portion of the inner electrode 121 in the second direction, and the extension portion 142 may be arranged on the fourth surface 4 to cover the end portion of the inner electrode 122 in the second direction. The third surface 3 and the fourth surface 4 are the surfaces of the main body that face each other in the second direction. Hereinafter, for the sake of simplicity and convenience of description, the two extension portions 141 and 142 will be described together.

[0057] Referring to Figure 1 and Figure 6 , in an exemplary embodiment of the present disclosure, the extension portions 141 and 142 may include a plurality of lead-out electrodes 141a and 142a that are spaced apart in the second direction, a plurality of via electrodes 141b and 142b that connect the plurality of lead-out electrodes 141a and 142a, and insulating portions 141c and 142c that cover the plurality of lead-out electrodes 141a and 142a.

[0058] In the exemplary embodiment, the extension portions 141 and 142 are arranged on the third surface 3 and the fourth surface 4 of the main body 110 that face each other in the second direction, and the plurality of lead-out electrodes 141a and 142a may be in contact with the inner electrodes 121 and 122 on the third surface 3 and the fourth surface 4 of the main body 110. In addition, the lead-out electrodes 141a and 142a may be arranged parallel to the third surface 3 and the fourth surface 4. Therefore, the inner electrodes 121 and 122 are not in direct contact with the outer electrodes 131 and 132 described below and may be in direct contact with the plurality of lead-out electrodes 141a and 142a.

[0059] The plurality of lead-out electrodes 141a and 142a may be in direct contact with the inner electrodes to ensure electrical connectivity.

[0060] The plurality of lead-out electrodes 141a and 142a may include a conductive metal. There is no particular limitation on the type of conductive metal included in the plurality of lead-out electrodes 141a and 142a. However, in an exemplary embodiment, the plurality of lead-out electrodes 141a and 142a may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0061] The plurality of via electrodes 141b and 142b may connect the plurality of lead-out electrodes 141a and 142a. Specifically, the plurality of via electrodes 141b may be arranged between a pair of adjacent lead-out electrodes 141a among the plurality of lead-out electrodes 141a, and the plurality of via electrodes 142b may be arranged between a pair of adjacent lead-out electrodes 142a among the plurality of lead-out electrodes 142a.

[0062] The plurality of via electrodes 141b and 142b may include a conductive metal. There is no particular limitation on the type of conductive metal included in the plurality of via electrodes 141b and 142b. However, in an exemplary embodiment, the plurality of via electrodes 141b and 142b may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0063] The insulating portions 141c and 142c may cover the plurality of lead-out electrodes 141a and 142a. In addition, the insulating portions 141c and 142c may also cover the plurality of via electrodes 141b and 142b. Specifically, the insulating portion 141c may be arranged to fill the region between the plurality of lead-out electrodes 141a where the plurality of via electrodes 141b are not formed and cover the surfaces of the plurality of lead-out electrodes 141a, and the insulating portion 142c may be arranged to fill the region between the plurality of lead-out electrodes 142a where the plurality of via electrodes 142b are not formed and cover the surfaces of the plurality of lead-out electrodes 142a. Therefore, the moisture resistance reliability of the multilayer electronic component 100 can be ensured.

[0064] The insulating portions 141c and 142c may include the same dielectric material as the dielectric layer 111, but are not limited thereto, and the insulating portions 141c and 142c may include materials having excellent insulation or rigidity.

[0065] As an example of a method for forming the extensions 141 and 142 on the body 110, the extensions may be formed by pressing and adhering a sheet for forming the extensions on the body 110 and then sintering it. The sheet for forming the extensions is formed by printing a plurality of lead-out electrode patterns on a ceramic sheet and sandwiching another ceramic sheet therebetween. At this time, the formation regions of the plurality of lead-out electrodes 141a and 142a may be adjusted by adjusting the printing regions of the lead-out electrode patterns, and a separate ceramic sheet may be printed on a region of the ceramic sheet where the plurality of lead-out electrodes 141a and 142a are not formed. In addition, the via electrodes 141b and 142b may be formed by forming via holes with a laser drill or a perforator each time two layers of lead-out electrode patterns are printed, and applying a conductive paste to the via holes or filling the via holes with a conductive material using a method such as plating. In addition, the via electrodes 141b and 142b may also be formed by forming via holes passing through all of the plurality of lead-out electrode patterns after printing all of the plurality of lead-out electrode patterns, and then filling the via holes with a conductive material. In the prior art, in order to minimize the ratio of the external electrodes in the entire multilayer ceramic capacitor and minimize the area where the external electrodes are exposed to the outside of the multilayer ceramic capacitor, a structure has been attempted to be introduced in which separate lead-out electrodes are formed on the surface of the body where one end of the internal electrode is exposed, the lead-out electrodes are covered with a ceramic layer, and the lead-out electrodes are exposed only on one surface of the ceramic layer in the thickness direction. In the case of having such a structure, the ratio of the external electrodes in the multilayer ceramic capacitor can be minimized and the moisture resistance reliability can be improved, but it may be difficult to sufficiently ensure the electrical connectivity between the internal electrode and the lead-out electrode and the electrical connectivity between the lead-out electrode and the external electrode, which may cause an increase in the ESR of the multilayer ceramic capacitor.

[0066] According to an exemplary embodiment of the present disclosure, since the plurality of lead-out electrodes are formed to be spaced apart from each other in the second direction, the contact areas between the external electrodes 131 and 132 and the plurality of lead-out electrodes 141a and 142a may be increased. Accordingly, the ESR of the multilayer electronic component 100 may be reduced.

[0067] According to an exemplary embodiment of the present disclosure, since the plurality of lead-out electrodes 141a and 142a are connected by the plurality of via electrodes 141b and 142b, the connectivity between the plurality of lead-out electrodes 141a and 142a may be ensured, and the total area (e.g., total surface area) of the plurality of lead-out electrodes 141a and 142a may be increased. Accordingly, the ESR of the multilayer electronic component 100 may be reduced.

[0068] That is, according to an exemplary embodiment in the present disclosure, when the extension parts 141 and 142 include a plurality of lead-out electrodes 141a and 142a spaced apart from each other in the second direction and a plurality of via electrodes 141b and 142b connecting the plurality of lead-out electrodes 141a and 142a, the contact area between the outer electrodes 131 and 132 and the plurality of lead-out electrodes 141a and 142a can be increased, the connectivity between the plurality of lead-out electrodes 141a and 142a can be ensured, and the total area of the plurality of lead-out electrodes 141a and 142a in contact with the outer electrodes 131 and 132 can be increased, such that the effect of reducing the ESR of the multilayer electronic component 100 can be significant.

[0069] In an exemplary embodiment, the plurality of lead-out electrodes 141a and 142a can be in contact with the outer electrodes 131 and 132 on one surface of the extension parts 141 and 142 in the first direction. By doing so, the proportion of the outer electrodes 131 and 132 in the entire multilayer electronic component 100 can be minimized. At this time, the outer electrodes 131 and 132 can be arranged only on one surface of the extension parts 141 and 142 in the first direction, and can not be arranged on the two surfaces of the extension parts 141 and 142 in the second direction and the two surfaces of the extension parts 141 and 142 in the third direction.

[0070] In an exemplary embodiment, one end of the plurality of lead-out electrodes 141a and 142a in the first direction can be exposed on one surface of the extension parts 141 and 142 in the first direction, and the other end of the plurality of lead-out electrodes 141a and 142a in the first direction can not be exposed on the other surface of the extension parts 141 and 142 in the first direction. Therefore, the thickness of the multilayer electronic component 100 in the first direction can be minimized. In addition, when the other end of the plurality of lead-out electrodes 141a and 142a in the first direction is not exposed on the other surface of the extension parts 141 and 142 in the first direction, the plurality of lead-out electrodes 141a and 142a can only cover a part of each of one surface and the other surface of the main body 110 in the second direction. At this time, preferably, the plurality of lead-out electrodes 141a and 142a are arranged to cover the ends of the inner electrodes in the second direction, and the portions of the two surfaces of the main body 110 in the second direction not covered by the plurality of lead-out electrodes 141a and 142a can be covered by the insulating parts 141c and 142c.

[0071] In an exemplary embodiment, the plurality of via electrodes 141b and 142b can be arranged between a pair of adjacent lead-out electrodes among the plurality of lead-out electrodes 141a and 142a, and the diameters of the plurality of via electrodes 141b and 142b can have a maximum value on the surface in contact with the lead-out electrodes closer to the main body 110 among a pair of adjacent lead-out electrodes.

[0072] Referring to Figure 6 , a plurality of via electrodes 141b and 142b can be arranged between a pair of adjacent lead electrodes among the plurality of lead electrodes 141a and 142a. Specifically, a plurality of via electrodes 141b-1 can be arranged between a pair of adjacent lead electrodes 141a-1 and 141a-2, and a plurality of via electrodes 141b-2 can be arranged between a pair of adjacent lead electrodes 141a-2 and 141a-3. At this time, the diameters of the plurality of via electrodes 141b and 142b can have a maximum value on the surfaces of the plurality of via electrodes 141b and 142b that are in contact with the lead electrode set closer to the main body 110 among the pair of adjacent lead electrodes. For example, the diameter of the plurality of via electrodes 141b-1 on the surface where the plurality of via electrodes 141b-1 and the lead electrode 141a-1 are in contact with each other can be greater than the diameter of the plurality of via electrodes 141b-1 on the surface where the plurality of via electrodes 141b-1 and the lead electrode 141a-2 are in contact with each other, and the diameter of the plurality of via electrodes 141b-1 can have a maximum value on the surface where the plurality of via electrodes 141b-1 and the lead electrode 141a-1 are in contact with each other.

[0073] In an exemplary embodiment, in a cross-section of the multilayer electronic component 100 in the first direction and the second direction, the plurality of via electrodes 141b and 142b can have a trapezoidal shape. At this time, two bottom sides R1 and R2 of the trapezoid (as Figure 6 shown) can be formed at the boundary between the plurality of via electrodes 141b and 142b and the lead electrodes 141a and 142a.

[0074] In addition, referring to Figure 6 , the plurality of lead electrodes 141a can include a first lead electrode 141a-1 in contact with the inner electrode 121, a second lead electrode 141a-2 spaced apart from the first lead electrode 141a-1 in the second direction, and a third lead electrode 141a-3 spaced apart from the second lead electrode 141a-2 in the second direction.

[0075] In Figure 6 , the plurality of lead electrodes 141a of the present disclosure are shown as three layers, but the number of lead electrodes 141a in the present disclosure is not limited to three.

[0076] At this time, the plurality of via electrodes 141b can include a first via electrode 141b-1 connecting the first lead electrode 141a-1 and the second lead electrode 141a-2 and a second via electrode 141b-2 connecting the second lead electrode 141a-2 and the third lead electrode 141a-3.

[0077] In an exemplary embodiment, at least a portion of the first via electrode 141b-1 and at least a portion of the second via electrode 141b-2 may be overlapped in position in the second direction. Accordingly, the connectivity between the plurality of lead electrodes 141a and 142a may be improved.

[0078] In an exemplary embodiment, the plurality of lead electrodes 141a and 142a may be arranged to pass (e.g., extend through) both ends of the inner electrodes 121 and 122 in the first direction. Specifically, the plurality of lead electrodes 141a and 142a may be arranged to pass (e.g., extend through) the ends of the inner electrodes respectively exposed on two surfaces of the body in the second direction. Accordingly, a sufficient contact area may be ensured between the plurality of lead electrodes 141a and 142a and the inner electrodes 121 and 122.

[0079] Referring to Figure 6 , the maximum length of the extensions 141 and 142 in the second direction is denoted as LM, the maximum length of the plurality of lead electrodes 141a and 142a in the second direction is denoted as LC, the maximum thickness of the extensions 141 and 142 in the first direction is denoted as TM, and the maximum thickness of the plurality of lead electrodes 141a and 142a in the first direction is denoted as TC. In addition, the maximum thickness of the outer electrodes 131 and 132 in the first direction is denoted as TB.

[0080] At this time, in an exemplary embodiment, LM and LC may satisfy 0.01 ≤ LC / LM ≤ 0.9.

[0081] If LC / LM is less than 0.01, the connectivity between the inner electrodes 121 and 122 and the plurality of lead electrodes 141a and 142a may be reduced or the ESR of the multilayer electronic component 100 may increase. If LC / LM exceeds 0.9, the multilayer electronic component 100 may become vulnerable to external shocks.

[0082] Accordingly, in an exemplary embodiment, by making LM and LC satisfy 0.01 ≤ LC / LM ≤ 0.9, the problems of increased ESR and vulnerability to external shocks of the multilayer electronic component 100 may be alleviated.

[0083] In addition, in an exemplary embodiment, TM and TC may satisfy 0.85 ≤ TC / TM ≤ 0.95.

[0084] There is no specific limitation on the lower limit value of TC / TM, but when TC / TM exceeds 0.85, it may be more advantageous for capacitance implementation. If TC / TM exceeds 0.95, the penetration path of external moisture may be shortened, which may deteriorate the moisture resistance reliability of the multilayer electronic component 100.

[0085] Thus, in an exemplary embodiment, by making TM and TC satisfy 0.85 ≤ TC / TM ≤ 0.95, sufficient capacitance of the multilayer electronic component 100 can be achieved while preventing deterioration of moisture resistance reliability.

[0086] LM, LC, TM, and TC can be measured in a cross-section in the first and second directions that is polished to the center of the multilayer electronic component 100 in the third direction. LM is the maximum length of the extensions 141 and 142 in the second direction, LC is the maximum length of the plurality of lead electrodes 141a and 142a in the second direction, TM is the maximum thickness of the extensions 141 and 142 in the first direction, and TC is the maximum thickness of the plurality of lead electrodes 141a and 142a in the first direction. LM can be measured as the maximum length from one end to the other end of the extensions 141 and 142 in the second direction, LC can be measured as the maximum length from one end to the other end of the plurality of lead electrodes 141a and 142a in the second direction (for example, the maximum length from the surface of the lead electrode closest to the main body facing the main body to the surface of the lead electrode farthest from the main body facing away from the main body, and this maximum length includes the length of the plurality of via electrodes in the second direction), TM can be measured as the maximum thickness from one end to the other end of the extensions 141 and 142 in the first direction, and TC can be measured as the maximum thickness from one end to the other end of the plurality of lead electrodes 141a and 142a in the first direction.

[0087] The external electrodes 131 and 132 can be arranged on the extensions 141 and 142, and the external electrodes 131 and 132 can be in contact with one end of the plurality of lead electrodes 141a and 142a in the first direction.

[0088] The external electrodes 131 and 132 can be formed using any material with conductivity (such as a metal), and the specific material can be determined by considering electrical properties, structural stability, etc. The external electrodes 131 and 132 can also have a multilayer structure.

[0089] For example, the external electrodes 131 and 132 can include an electrode layer provided on the extensions 141 and 142 and a plating layer formed on the electrode layer.

[0090] In addition, the external electrodes 131 and 132 can be formed by a method of attaching a sheet including a conductive metal to the main body 110, a method of printing a paste including a conductive metal, etc., but is not limited thereto.

[0091] The external electrodes 131 and 132 can use a material with excellent conductivity as the conductive metal, and there is no particular limitation. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), palladium (Pd), and their alloys.

[0092] The size of the multilayer electronic component 100 is not particularly limited. For example, in order to achieve miniaturization and high capacitance simultaneously, the multilayer electronic component 100 may have a size of 0201 (length × width: 0.2 mm × 0.1 mm) or smaller. And in the case of products where reliability in high-temperature and high-voltage environments is important for it, the multilayer electronic component 100 may have a size of 3216 (length × width: 3.2 mm × 1.6 mm) or larger, but not limited thereto.

[0093] In addition, when the maximum thickness of the multilayer electronic component 100 in the first direction is less than or equal to 120 μm, it may be difficult to ensure the ESR characteristics because the contact areas between the internal electrodes 121 and 122, the lead-out electrodes 141a and 142a, and the external electrodes 131 and 132 are reduced. However, in the exemplary embodiments in the present disclosure, by providing extensions on the main body 110 and allowing the extensions to include a plurality of lead-out electrodes spaced apart in the second direction, a plurality of via electrodes connecting the plurality of lead-out electrodes, and an insulating portion covering the plurality of lead-out electrodes, the ESR characteristics can be improved. Therefore, even when the maximum thickness of the multilayer electronic component 100 in the first direction is less than or equal to 120 μm, a decrease in the ESR characteristics can be prevented.

[0094] Figure 7 corresponds to Figure 2 is a cross-sectional view of a multilayer electronic component according to another exemplary embodiment.

[0095] Figure 8 is Figure 7 an enlarged view of the P' region of.

[0096] Referring to Figure 7 and Figure 8 According to an exemplary embodiment, the multilayer electronic component 100' may include extensions 141' and 142' disposed on the main body 110 and external electrodes 131 and 132 disposed on the extensions 141' and 142'. And the extensions 141' and 142' may include: a plurality of lead-out electrodes 141a and 142a arranged to be spaced apart in the second direction; a plurality of via electrodes 141b' and 142b' connecting the plurality of lead-out electrodes 141a and 142a; and insulating portions 141c and 142c covering the plurality of lead-out electrodes 141a and 142a, and the plurality of via electrodes 141b' and 142b' may be continuously arranged in the second direction. Therefore, the connectivity between the plurality of lead-out electrodes 141a and 142a can be further improved.

[0097] In the case where a plurality of via electrodes 141b' and 142b' are sequentially arranged in the second direction as in the exemplary embodiment, the plurality of via electrodes 141b' and 142b' may be arranged to penetrate, in the second direction, the lead electrodes located between the lead electrodes arranged at both ends among the plurality of lead electrodes 141a and 142a. Refer to Figure 8 , the plurality of via electrodes 141b' may be arranged to penetrate, in the second direction, the lead electrode 141a-2 located between the lead electrodes 141a-3 and 141a-1 arranged at both ends among the plurality of lead electrodes 141a.

[0098] One of the various effects of the present disclosure is to reduce the equivalent series resistance (ESR) of the multilayer electronic component by improving the connectivity between the internal electrode and the lead electrode.

[0099] Although the exemplary embodiments in the present disclosure have been described in detail above, the present disclosure is not limited to the exemplary embodiments and the drawings described above, but is intended to be limited by the appended claims. Therefore, within the scope not departing from the technical concept of the present disclosure described in the claims, those skilled in the art can make various forms of substitution, modification, and change, and this will also be considered to fall within the scope of the present disclosure.

[0100] The expressions "exemplary embodiment" or "an example" used in the present disclosure do not refer to the same example, and are provided to emphasize the different unique features between each example. However, the examples provided in the above description do not exclude being associated with the features of other examples and being implemented after them. For example, even if the content described in a specific example is not described in another example different from it, unless otherwise mentioned in the description of the other example, the content can be understood as being related to the other example.

[0101] The terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to limit the examples or exemplary embodiments. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form.

Claims

1. A multilayer electronic component comprising: a body including dielectric layers and inner electrodes alternately arranged in a first direction; an extension portion, disposed on a surface of the main body in a second direction perpendicular to the first direction; as well as an external electrode disposed on a surface of the extension portion in the first direction, The extension portion includes a plurality of extraction electrodes spaced apart in the second direction, a plurality of via electrodes connecting the plurality of extraction electrodes, and an insulating portion covering the plurality of extraction electrodes, and Among them, one of the plurality of lead electrodes contacts the internal electrode in the second direction.

2. The multilayer electronic component of claim 1, wherein: The plurality of extraction electrodes are in contact with the external electrode.

3. The multilayer electronic component of claim 1, wherein: One ends of the plurality of extraction electrodes in the first direction are exposed to one surface of the extension portion in the first direction, and the other ends of the plurality of extraction electrodes in the first direction are not exposed to another surface of the extension portion in the first direction opposite to the one surface.

4. The multilayer electronic component of claim 1, wherein: The plurality of via electrodes are arranged between a pair of adjacent lead-out electrodes among the plurality of lead-out electrodes, and the diameters of the plurality of via electrodes have a maximum value on surfaces of the plurality of via electrodes contacting the lead-out electrode disposed closer to the body among the pair of adjacent lead-out electrodes.

5. The multilayer electronic component of claim 1, wherein: The plurality of via electrodes are continuously arranged along the second direction.

6. The multilayer electronic component of claim 1, wherein: The plurality of lead-out electrodes include a first lead-out electrode in contact with the internal electrode, a second lead-out electrode spaced apart from the first lead-out electrode in the second direction, and a third lead-out electrode spaced apart from the second lead-out electrode in the second direction.

7. The multilayer electronic component of claim 6, wherein: The plurality of via electrodes include: a first via electrode connecting the first lead-out electrode and the second lead-out electrode; and a second via electrode connecting the second lead-out electrode and the third lead-out electrode.

8. The multilayer electronic component of claim 7, wherein: At least a portion of the first via electrode is positioned to overlap at least a portion of the second via electrode in the second direction.

9. The multilayer electronic component of claim 1, wherein: In cross sections of the multilayer electronic component in the first direction and the second direction, the plurality of via electrodes have a trapezoidal shape.

10. The multilayer electronic component of claim 1, wherein: The plurality of extraction electrodes are arranged to pass through both ends of the inner electrode along the first direction.

11. The multilayer electronic component of claim 1, wherein: 0.01≤LC / LM≤0.9, wherein LM is a maximum length of the extension portion in the second direction, and LC is a maximum length of the plurality of extraction electrodes in the second direction.

12. The multilayer electronic component of claim 1, wherein: 0.85≤TC / TM≤0.95, wherein TM is a maximum thickness of the extension portion in the first direction, and TC is a maximum thickness of the plurality of extraction electrodes in the first direction.

13. The multilayer electronic component of claim 1, wherein: The maximum thickness of the multilayer electronic component in the first direction is less than or equal to 120 μm.

14. The multilayer electronic component of claim 1, wherein: The external electrode is disposed only on one surface of the extension portion in the first direction.

15. The multilayer electronic component of claim 1, wherein: The extension portion is provided on one surface and the other surface of the body that are opposite in the second direction, and the plurality of extraction electrodes contact the internal electrode on the one surface and the other surface of the body that are opposite in the second direction.

16. A multilayer electronic component comprising: a main body including internal electrodes stacked in a thickness direction, with a dielectric layer disposed between the internal electrodes; Extension portions, provided on opposite end surfaces of the main body in the length direction; an outer electrode disposed on a bottom surface of the extension portion, Wherein, each of the extensions comprises: lead-out electrodes disposed parallel to respective end surfaces of the body, one of the lead-out electrodes contacting the inner electrode at the respective end surface of the body, the lead-out electrode contacting the outer electrode at the bottom surface of the extension and spaced apart from the top surface of the extension; and The via electrode is disposed between adjacent lead-out electrodes and forms electrical contact between the lead-out electrodes.

17. The multilayer electronic component of claim 16, wherein: 0.01≤LC / LM≤0.9, wherein LM is the maximum dimension of the extension portion in the length direction, and LC is the maximum dimension of the extraction electrode in the length direction.

18. The multilayer electronic component of claim 16, wherein: 0.85≤TC / TM≤0.95, wherein TM is the maximum dimension of the extension portion in the thickness direction, and TC is the maximum dimension of the extraction electrode in the thickness direction.

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