Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body having dielectric layers and inner electrode layers alternately disposed in a first direction, the dielectric layers interposed between the inner electrode layers, the inner electrode layers including inner electrodes and dummy electrodes spaced apart from the inner electrodes; an external electrode connected to the internal electrode; and insulating portions disposed on a side surface of the main body with the external electrodes interposed therebetween. The dummy electrode may overlap the exposed portion of the inner electrode.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0197086, filed with the Korean Intellectual Property Office on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC) as a multi-layer electronic component is a chip capacitor that is mounted on a printed circuit board of various electronic products (such as imaging devices (e.g., liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, mobile phones, etc.) and is used for charging or discharging.

[0004] Such multi-layer ceramic capacitors can be used as components in various electronic devices due to their small size, high capacitance, and ease of installation. As various electronic devices such as computers and mobile devices are miniaturized and have higher outputs, the demand for miniaturization and high capacitance of multi-layer ceramic capacitors is increasing.

[0005] In addition, depending on the environment in which the MLCC is used, a multi-terminal MLCC is sometimes used instead of a typical two-terminal MLCC, and among these multi-terminal MLCCs, a three-terminal MLCC has a structure in which signal patterns and ground patterns of different shapes are alternately stacked. At this time, in the case of the ground pattern, a small-width outer electrode should be laterally exposed, and signal patterns (where the outer electrodes are not exposed in the same direction) are alternately stacked, resulting in a step difference. During lamination and pressing, the step difference may cause delamination. Such delamination may provide a moisture penetration path, which may lead to a reduction in reliability. Summary of the Invention

[0006] One aspect of the present disclosure is to provide a multi-layer electronic component having an improved step difference.

[0007] One aspect of the present disclosure is to provide a multi-layer electronic component having improved moisture resistance reliability.

[0008] According to one aspect of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer, a first inner electrode layer, and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer being alternately arranged in a first direction, and the dielectric layer being interposed between the first inner electrode layer and the second inner electrode layer, the main body including a first surface and a second surface that are opposite to each other in the first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and are opposite to each other in a second direction, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and are opposite to each other in a third direction, the first inner electrode layer including a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode arranged to be spaced apart from the first inner electrode, and the second inner electrode layer including a second inner electrode exposed to the third surface and the fourth surface and a second dummy electrode arranged to be spaced apart from the second inner electrode; a first outer electrode and a second outer electrode respectively arranged on the third surface and the fourth surface, and the first outer electrode and the second outer electrode being connected to the second inner electrode; a third outer electrode and a fourth outer electrode respectively arranged on the fifth surface and the sixth surface, and the third outer electrode and the fourth outer electrode being connected to the first inner electrode; a first insulating portion and a second insulating portion arranged on the fifth surface to be spaced apart from each other in the second direction, and the third outer electrode being interposed between the first insulating portion and the second insulating portion; and a third insulating portion and a fourth insulating portion arranged on the sixth surface to be spaced apart from each other in the second direction, and the fourth outer electrode being interposed between the third insulating portion and the fourth insulating portion. The first dummy electrode overlaps an exposed portion of the second inner electrode in the first direction, and the second dummy electrode overlaps an exposed portion of the first inner electrode in the first direction.

[0009] According to one aspect of the present disclosure, a multi-layer electronic component includes: a body including a dielectric layer, a first inner electrode layer, and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer being alternately arranged in a first direction, and the dielectric layer being interposed between the first inner electrode layer and the second inner electrode layer, and the body having a first surface and a second surface that are opposite to each other in the first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and are opposite to each other in a second direction, and a fifth surface and a sixth surface that are connected to the first surface to the fourth surface and are opposite to each other in a third direction. The first inner electrode layer includes a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode arranged to be spaced apart from the first inner electrode, and the second inner electrode layer includes a second inner electrode exposed to the third surface to the sixth surface and a second dummy electrode arranged to be spaced apart from the second inner electrode. A first outer electrode is provided on the third surface, the fifth surface, and the sixth surface and is connected to the second inner electrode; a second outer electrode is provided on the fourth surface, the fifth surface, and the sixth surface and is connected to the second inner electrode; a third outer electrode is provided on the fifth surface and is connected to the first inner electrode; and a fourth outer electrode is provided on the sixth surface and is connected to the first inner electrode. The first dummy electrode overlaps an exposed portion of the second inner electrode in the first direction, and the second dummy electrode overlaps an exposed portion of the first inner electrode in the first direction.

[0010] According to one aspect of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer, a first inner electrode layer, and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer being alternately arranged in a first direction, and the dielectric layer being interposed between the first inner electrode layer and the second inner electrode layer, and the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, the first inner electrode layer including a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode arranged to be spaced apart from the first inner electrode, and the second inner electrode layer including a second inner electrode exposed to the third surface and the fourth surface and a second dummy electrode arranged to be spaced apart from the second inner electrode; a first outer electrode and a second outer electrode respectively arranged on the third surface and the fourth surface, and the first outer electrode and the second outer electrode being connected to the second inner electrode; a third outer electrode and a fourth outer electrode respectively arranged on the fifth surface and the sixth surface, and the third outer electrode and the fourth outer electrode being connected to the first inner electrode; an insulating portion arranged on at least one surface of the main body, covering an exposed portion of at least one of the first inner electrode and the second inner electrode, and positioned between two outer electrodes. The first dummy electrode overlaps an exposed portion of the second inner electrode in the first direction, and the second dummy electrode overlaps an exposed portion of the first inner electrode in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an embodiment; Figure 2 is schematically showing Figure 1 a perspective view of the structure of the multi-layer electronic component in which the outer electrodes are removed; Figure 3A and Figure 3B is a perspective view schematically showing an inner electrode layer according to an embodiment; Figure 4 is a perspective view schematically showing a multi-layer electronic component according to another embodiment; Figure 5A and Figure 5B is a perspective view schematically showing an inner electrode layer of another embodiment; Figure 6is a perspective view schematically showing a multi-layer electronic component according to another embodiment; Figure 7A and Figure 7B is a perspective view schematically showing an inner electrode layer of another embodiment; Figure 8 is a perspective view schematically showing a multi-layer electronic component according to another embodiment; and Figure 9A and Figure 9B is a perspective view schematically showing an inner electrode layer of another embodiment. Detailed Embodiments

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to detailed embodiments and the drawings. However, the embodiments of the present disclosure can be modified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more completely describe the present disclosure to those skilled in the art. Therefore, for clearer illustration, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements indicated by the same reference numerals in the drawings represent the same elements.

[0013] In addition, to clearly describe the present disclosure in the drawings, parts irrelevant to the description are omitted, and for ease of description, the dimensions of each component shown in the drawings, such as thickness, are arbitrarily depicted. Therefore, the present disclosure does not have to be limited to the drawings. In addition, the same reference numerals are used to describe components having the same functions within the scope of the same concept. In addition, throughout the specification, when a certain component is referred to as "including", unless otherwise stated, it means that it may further include other components without excluding other components.

[0014] In the drawings, the first direction may be defined as the stacking direction or the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0015] Multi-layer electronic component Figure 1 A perspective view schematically showing a multi-layer electronic component according to an embodiment is shown.

[0016] Figure 2 is a perspective view schematically showing the structure of the multi-layer electronic component from which the outer electrodes are removed from Figure 1 the multi-layer electronic component.

[0017] Figure 3A and Figure 3B is a perspective view schematically showing an inner electrode layer according to an embodiment.

[0018] Figure 4 is a perspective view schematically showing a multi-layer electronic component according to another embodiment.

[0019] Figure 5A and Figure 5B is a perspective view schematically showing an inner electrode layer of another embodiment.

[0020] Figure 6 is a perspective view schematically showing a multilayer electronic component according to another embodiment.

[0021] Figure 7A and Figure 7B is a perspective view schematically showing an inner electrode layer of another embodiment.

[0022] Figure 8 is a perspective view schematically showing a multilayer electronic component according to another embodiment.

[0023] Figure 9A and Figure 9B is a perspective view schematically showing an inner electrode layer of another embodiment.

[0024] Hereinafter, reference will be made to Figure 1 FIG. 9 to describe in detail the multilayer electronic component according to each embodiment. However, although the multilayer ceramic capacitor is described as an example of the multilayer electronic component, the present disclosure can be applied to various electronic products using a dielectric composition, such as inductors, piezoelectric elements, varistors, or thermistors.

[0025] Refer to Figures 1 to 3B, according to an embodiment, the multi-layer electronic component 100 may include: a main body 110, the main body 110 includes a dielectric layer 111 and a first inner electrode layer 121 and a second inner electrode layer 122, the first inner electrode layer 121 and the second inner electrode layer 122 are alternately arranged in a first direction and the dielectric layer 111 is interposed between the first inner electrode layer 121 and the second inner electrode layer 122, and the main body 110 has a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction. The first inner electrode layer 121 includes a first inner electrode 121a exposed to the fifth surface 5 and the sixth surface 6 and a first dummy electrode 121b arranged at an interval from the first inner electrode 121a, and the second inner electrode layer 122 includes a second inner electrode 122a exposed to the third surface 3 and the fourth surface 4 and a second dummy electrode 122b arranged at an interval from the second inner electrode 122a; a first outer electrode 131 and a second outer electrode 132, respectively arranged on the third surface 3 and the fourth surface 4 and connected to the second inner electrode 122a; a third outer electrode 133 and a fourth outer electrode 134, respectively arranged on the fifth surface 5 and the sixth surface 6 and connected to the first inner electrode 121a; a first insulating portion 141 and a second insulating portion 142, arranged at an interval from each other in the second direction on the fifth surface 5, and the third outer electrode 133 is interposed between the first insulating portion 141 and the second insulating portion 142; and a third insulating portion 143 and a fourth insulating portion 144, arranged at an interval from each other in the second direction on the sixth surface 6, and the fourth outer electrode 134 is interposed between the third insulating portion 143 and the fourth insulating portion 144. The first dummy electrode 121b may overlap with the exposed portions (i.e., lead portions 122a-1 and 122a-2) of the second inner electrode 122a in the first direction, and the second dummy electrode 122b may overlap with the exposed portions (i.e., lead portions 121a-1 and 121a-2) of the first inner electrode 121a in the first direction.

[0026] Referring to Figures 8 to 9B, a multi-layer electronic component 400 according to another embodiment may include: a main body 410, the main body 410 includes a dielectric layer 411, a first inner electrode layer 421 and a second inner electrode layer 422, the first inner electrode layer 421 and the second inner electrode layer 422 are alternately arranged in a first direction, and the dielectric layer 411 is interposed between the first inner electrode layer 421 and the second inner electrode layer 422, and the main body 410 has a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction, the first inner electrode layer 421 includes a first inner electrode 421a exposed to the fifth surface 5 and the sixth surface 6 and a first dummy electrode 421b spaced apart from the first inner electrode 421a, and the second inner electrode layer 422 includes a second inner electrode 422a exposed to the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 and a second dummy electrode 422b spaced apart from the second inner electrode 422a; a first outer electrode 431, disposed on the third surface 3, the fifth surface 5 and the sixth surface 6 and connected to the second inner electrode 422a; a second outer electrode 432, disposed on the fourth surface 4, the fifth surface 5 and the sixth surface 6 and connected to the second inner electrode 422a; a third outer electrode 433, disposed on the fifth surface 5 and connected to the first inner electrode 421a; and a fourth outer electrode 434, disposed on the sixth surface 6 and connected to the first inner electrode 421a. The first dummy electrode 421b overlaps with the exposed portions (i.e., lead portions 422a-1 and 422a-2) of the second inner electrode 422a in the first direction, and the second dummy electrode 422b may overlap with the exposed portions (i.e., lead portions 421a-1 and 421a-2) of the first inner electrode 421a in the first direction.

[0027] Hereinafter, a multi-layer electronic component 100 according to an embodiment will be described. However, unless there are special circumstances, the same structure as that of the multi-layer electronic component 100 according to the embodiment can also be applied to the multi-layer electronic components 200, 300, and 400 according to other embodiments of the present disclosure.

[0028] The main body 110 may have a dielectric layer 111 and inner electrode layers 121 and 122 that are alternately stacked with the dielectric layer 111 interposed therebetween.

[0029] More specifically, the main body 110 may include a first inner electrode layer 121 and a second inner electrode layer 122. The first inner electrode layer 121 and the second inner electrode layer 122 are disposed inside the main body 110 and alternately stacked in a first direction, and the dielectric layer 111 is interposed between the first inner electrode layer 121 and the second inner electrode layer 122.

[0030] Although the detailed shape of the main body 110 is not particularly limited, as shown, the main body 110 may have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic particles included in the main body 110 during firing, the main body 110 may have a substantially hexahedral shape, although it does not have a perfect straight hexahedral shape.

[0031] The main body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0032] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and adjacent dielectric layers 111 are integrated to such an extent that it is difficult to confirm the boundary therebetween without using a scanning electron microscope (SEM).

[0033] There is no limitation on the raw material for forming the dielectric layer 111 as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. The barium titanate-based material may include BaTiO3-based ceramic particles. Examples of BaTiO3-based ceramic particles may include (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0034] In addition, according to the application of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to a powder such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111.

[0035] The thickness of the dielectric layer 111 does not need to be particularly limited.

[0036] To ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thickness of the dielectric layer 111 can be 10.0 μm or less. In addition, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 can be 3.0 μm or less, and to more easily achieve ultra-miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 can be 1.0 μm or less. Specifically, 0.6 μm or less, and more specifically, 0.4 μm or less.

[0037] In this case, the thickness of the dielectric layer 111 refers to the thickness of the dielectric layer 111 provided between two first inner electrode layers 121 and a second inner electrode layer 122 adjacent to each other in the first direction.

[0038] In addition, the thickness of the dielectric layer 111 refers to the dimension of the dielectric layer 111 in the first direction. In addition, the thickness of the dielectric layer 111 refers to the average thickness of the dielectric layer 111, and refers to the average dimension of the dielectric layer 111 in the first direction.

[0039] The average dimension of the dielectric layer 111 in the first direction can be measured by scanning cross-sectional images of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average dimension of a dielectric layer 111 in the first direction refers to the average value calculated by measuring the dimension of a dielectric layer 111 in the first direction at 10 equally spaced points in the second direction in the scanned cross-sectional image. The 10 equally spaced points can be specified in the capacitance forming portion. In addition, if the average value measurement is extended to 10 dielectric layers 111 and the average value is calculated, the average dimension of the dielectric layer 111 in the first direction can be further generalized.

[0040] The inner electrode layers 121 and 122 are alternately stacked with the dielectric layer 111.

[0041] The inner electrode layers 121 and 122 include a first inner electrode layer 121 and a second inner electrode layer 122, and the first inner electrode layer 121 and the second inner electrode layer 122 are alternately arranged in the first direction, and the dielectric layer 111 constituting the main body 110 is interposed between the first inner electrode layer 121 and the second inner electrode layer 122.

[0042] More specifically, the first inner electrode layer 121 includes a first inner electrode 121a exposed to the fifth surface 5 and the sixth surface 6 and a first dummy electrode 121b arranged to be spaced apart from the first inner electrode 121a, and the second inner electrode layer 122 includes a second inner electrode 122a exposed to the third surface 3 and the fourth surface 4 and a second dummy electrode 122b arranged to be spaced apart from the second inner electrode 122a.

[0043] For example, the first inner electrode 121a is spaced apart from the third surface 3 and the fourth surface 4 and is exposed to the fifth surface 5 and the sixth surface 6 to be connected to the third outer electrode 133 and the fourth outer electrode 134, and the first dummy electrode 121b is exposed to the third surface 3 and the fourth surface 4 to be connected to the first outer electrode 131 and the second outer electrode 132. However, the present disclosure is not limited thereto, and the first dummy electrode 121b may also be exposed through the fifth surface and the sixth surface.

[0044] The second inner electrode 122a is spaced apart from the fifth surface 5 and the sixth surface 6 and is exposed through the third surface 3 and the fourth surface 4 to be connected to the first outer electrode 131 and the second outer electrode 132, and the second dummy electrode 122b is exposed through the fifth surface 5 and the sixth surface 6 to be connected to the third outer electrode 133 and the fourth outer electrode 134.

[0045] For example, the first inner electrode 121a is not connected to the first outer electrode 131 and the second outer electrode 132 but is connected to the third outer electrode 133 and the fourth outer electrode 134, and the second inner electrode 122a is not connected to the third outer electrode 133 and the fourth outer electrode 134 but is connected to the first outer electrode 131 and the second outer electrode 132.

[0046] At this time, the first inner electrode 121a and the second inner electrode 122a may be electrically insulated from each other by a dielectric layer 111 disposed therebetween in the first direction, and the first inner electrode 121a and the second inner electrode 122a may include main portions 121a-0 and 122a-0 that form a capacitance by overlapping in the first direction and lead portions 121a-1 and 121a-2 and lead portions 122a-1 and 122a-2 that do not form a capacitance and are exposed to the surface of the main body 110.

[0047] However, the number of lead portions of the inner electrode exposed to the surface of the main body 110 is not limited to one, but may include a plurality of lead portions. This will be described in more detail below.

[0048] In addition, the first dummy electrode 121b may overlap the exposed portions 122a-1 and 122a-2 of the second inner electrode 122a in the first direction, and the second dummy electrode 122b may overlap the exposed portions 121a-1 and 121a-2 of the first inner electrode 121a in the first direction.

[0049] Since the dummy electrodes 121b and 122b overlap the exposed portions of the inner electrodes 121a and 122a in the first direction, the step difference in the region where no capacitance is formed can be significantly reduced, and the process operation can be simplified when applying the paste, thereby improving the process speed.

[0050] In addition, the first inner electrode 121a and the second inner electrode 122a may each have a substantially constant dimension in the second direction and may each have a substantially constant dimension in the third direction. Optionally, the regions of the first inner electrode 121a that are exposed through the surface of the main body 110 (i.e., the lead portions 121a-1 and 121a-2) and the regions of the second inner electrode 122a that are exposed through the surface of the main body 110 (i.e., the lead portions 122a-1 and 122a-2) may each have a substantially constant dimension in the second direction and each have a substantially constant dimension in the third direction.

[0051] In this case, the substantially constant dimension in the second direction may mean that the deviation of the dimension in the second direction from the average value of the maximum dimension and the minimum dimension in the second direction is 5% or less. This definition also applies to the substantially constant dimension in the third direction.

[0052] In addition, the main body 110 may be formed by the following method: alternately stacking a first green ceramic sheet on which a conductive paste for forming the first inner electrode layer 121 is printed and a second green ceramic sheet on which a conductive paste for forming the second inner electrode layer 122 is printed to form a stacked body, and then firing the stacked body.

[0053] The materials for forming the inner electrode layers 121 and 122 are not particularly limited, and materials having excellent conductivity may be used. For example, the inner electrode layers 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0054] In addition, the inner electrode layers 121 and 122 may be formed by the following method: printing a conductive paste for inner electrodes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys onto a green ceramic sheet. The printing method of the conductive paste for inner electrodes may be a screen printing method or a gravure printing method, and the present disclosure is not limited thereto.

[0055] In addition, the thicknesses of the inner electrode layers 121 and 122 do not need to be particularly limited.

[0056] To ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thicknesses of the inner electrode layers 121 and 122 can be 3.0 μm or less. In addition, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thicknesses of the inner electrode layers 121 and 122 can be 1.0 μm or less, and to more easily obtain ultra-miniaturization and high capacitance of the multilayer electronic component 100, the thicknesses of the inner electrode layers 121 and 122 can be 0.6 μm or less, and more specifically, 0.4 μm or less.

[0057] In this case, the thicknesses of the inner electrode layers 121 and 122 refer to the dimensions of the inner electrode layers 121 and 122 in the first direction. In addition, the thicknesses of the inner electrode layers 121 and 122 refer to the average thicknesses of the inner electrode layers 121 and 122 or the average dimensions of the inner electrode layers 121 and 122 in the first direction.

[0058] The average dimensions of the inner electrode layers 121 and 122 in the first direction can be measured by the following method: Scanning the cross-sectional images of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average dimension of an inner electrode layer in the first direction refers to the average value calculated by measuring the dimensions of an inner electrode layer in the first direction at 10 equally spaced points in the second direction in the scanned cross-sectional image. The 10 equally spaced points can be specified in the capacitance forming portion. In addition, if the average value measurement is extended to 10 inner electrode layers and the average value is calculated, the average dimension of the inner electrode layer in the first direction can be further generalized.

[0059] In addition, in the embodiment, the average thickness (td) of at least one of the plurality of dielectric layers 111 and the average thickness (te) of at least one of the plurality of inner electrode layers 121 and 122 can satisfy 2×te < td.

[0060] More specifically, the average thickness (td) of one dielectric layer 111 can be greater than twice the average thickness (te) of one of the inner electrode layers 121 and 122. In detail, the average thickness (td) of the plurality of dielectric layers 111 can be greater than twice the average thickness (te) of the plurality of inner electrode layers 121 and 122.

[0061] Generally, reliability problems caused by a decrease in the breakdown voltage (BDV) in a high-voltage environment are the main concerns of high-voltage electronic components.

[0062] Therefore, in order to prevent a reduction in breakdown voltage in a high-voltage environment, the average thickness (td) of the dielectric layer 111 can be greater than twice the average thickness (te) of the inner electrode layers 121 and 122, thereby increasing the thickness of the dielectric layer 111 (the thickness being the distance between two inner electrode layers adjacent to each other in the first direction) and improving the breakdown voltage characteristics.

[0063] If the average thickness (td) of the dielectric layer 111 is twice or less than the average thickness (te) of the inner electrode layers 121 and 122, the average thickness of the dielectric layer as the distance between two inner electrode layers adjacent to each other in the first direction may be too small. Therefore, the breakdown voltage may deteriorate, and a short circuit may occur between the inner electrode layers.

[0064] In addition, the main body 110 may include covering portions provided on two surfaces of the capacitor forming portion in the first direction.

[0065] More specifically, the main body 110 may include a first covering portion provided on one surface of the capacitor forming portion in the first direction and a second covering portion provided on the other surface of the capacitor forming portion in the first direction, and in more detail, the main body 110 may include an upper covering portion provided on the upper part of the capacitor forming portion in the first direction and a lower covering portion provided on the lower part of the capacitor forming portion in the first direction.

[0066] The upper covering portion and the lower covering portion can be formed by the following method: stacking a single dielectric layer 111 or two or more dielectric layers 111 on the upper surface and the lower surface of the capacitor forming portion in the first direction, respectively, and the upper covering portion and the lower covering portion are mainly used to protect the inner electrode layers 121 and 122 from physical stress or chemical stress.

[0067] The upper covering portion and the lower covering portion do not include the inner electrode layers 121 and 122 and may include the same material as that of the dielectric layer 111. For example, the upper covering portion and the lower covering portion may include a ceramic material, such as a barium titanate (BaTiO3)-based ceramic material.

[0068] In addition, the thickness of the covering portion does not need to be particularly limited.

[0069] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the covering portion can be 100 μm or less, in detail, 30 μm or less, and in more detail, in an ultra-small product, it can be 20 μm or less.

[0070] In this case, the thickness of the covering portion refers to the dimension of the covering portion in the first direction. In addition, the thickness of the covering portion may refer to the average thickness of the covering portion and may refer to the average dimension of the covering portion in the first direction.

[0071] The average size of the covering portion in the first direction can be measured by the following method: Scanning the cross-sectional images of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of the covering portion in the first direction means: In the cross-sectional image obtained by scanning one covering portion, the average value calculated by measuring the size of the one covering portion in the first direction at 10 equally spaced points in the second direction.

[0072] In addition, the average size of the covering portion in the first direction measured by the above method can be substantially equal to the average size of the covering portion in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0073] In the embodiment, a structure in which the multi-layer electronic component 100 has four outer electrodes 131, 132, 133, and 134 is described, but the number or shape of the outer electrodes 131, 132, 133, and 134 can be changed according to the shape of the inner electrode layers 121 and 122 or other uses.

[0074] The outer electrodes 131, 132, 133, and 134 can be provided on the main body 110 and connected to the corresponding inner electrode layers in the inner electrode layers 121 and 122.

[0075] More specifically, the outer electrodes 131, 132, 133, and 134 can include a first outer electrode 131 provided on the third surface 3 of the main body 110 and connected to the second inner electrode 122a, a second outer electrode 132 provided on the fourth surface 4 of the main body 110 and connected to the second inner electrode 122a, a third outer electrode 133 provided on the fifth surface 5 of the main body 110 and connected to the first inner electrode 121a, and a fourth outer electrode 134 provided on the sixth surface 6 of the main body 110 and connected to the first inner electrode 121a.

[0076] In addition, the first outer electrode 131 and the second outer electrode 132 can extend to a part of the first surface 1 and a part of the second surface 2 of the main body 110, or can be provided to extend to a part of the fifth surface 5 and a part of the sixth surface 6 of the main body 110. For example, the first outer electrode 131 can be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the main body 110 and on the third surface 3 of the main body 110, and the second outer electrode 132 can be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the main body 110 and on the fourth surface 4 of the main body 110.

[0077] The third external electrode 133 and the fourth external electrode 134 may be provided to extend to a part of the first surface 1 and a part of the second surface 2 of the main body 110. For example, the third external electrode 133 may be provided on a part of the first surface 1 and a part of the second surface 2 of the main body 110 and a part of the fifth surface 5 of the main body 110, and the fourth external electrode 134 may be provided on a part of the first surface 1 and a part of the second surface 2 of the main body 110 and a part of the sixth surface 6 of the main body 110.

[0078] In addition, the external electrodes 131, 132, 133, and 134 may be formed of any conductive material such as metal, and the detailed material may be determined in consideration of electrical characteristics, structural stability, etc. The external electrodes 131, 132, 133, and 134 may also each have a multilayer structure.

[0079] For example, the external electrodes 131, 132, 133, and 134 may each include an electrode layer provided on the main body 110 and a plating layer provided on the electrode layer.

[0080] For a more detailed example of the electrode layer, the electrode layer may include a first electrode layer or a second electrode layer. The first electrode layer is a fired electrode including a first conductive metal and glass, and the second electrode layer is a resin-based electrode including a second conductive metal and resin.

[0081] In this case, the conductive metal included in the first electrode layer may be referred to as the first conductive metal, and the conductive metal included in the second electrode layer may be referred to as the second conductive metal. In this case, the first conductive metal and the second conductive metal may be the same as or different from each other, and in the case of including a plurality of conductive metals, only some of the plurality of conductive metals may be the same as each other, but the present disclosure is not particularly limited thereto.

[0082] In addition, the electrode layer may be in the form of a fired electrode and a resin-based electrode sequentially formed on the main body 110.

[0083] In addition, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body, or may be formed by transferring a sheet containing a conductive metal onto a fired electrode.

[0084] A material having excellent conductivity may be used as the conductive metal included in the electrode layer. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0085] The electrode layer may have a bilayer structure including a first electrode layer and a second electrode layer. Accordingly, the external electrodes 131, 132, 133, and 134 may each include a first electrode layer and a second electrode layer. The first electrode layer includes a first conductive metal and glass, and the second electrode layer is disposed on the first electrode layer and includes a second conductive metal and a resin.

[0086] The first electrode layer may function to improve the bonding with the main body 110 by including glass, and the second electrode layer functions to improve the bending strength by including a resin.

[0087] The first conductive metal included in the first electrode layer is not particularly limited as long as it is a material capable of being electrically connected to the inner electrode layer to form a capacitor, and may include, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0088] The first electrode layer may be formed by coating a conductive paste prepared by adding a glass frit to first conductive metal particles and then firing the conductive paste.

[0089] The second conductive metal included in the second electrode layer may function to electrically connect to the first electrode layer.

[0090] The second conductive metal included in the second electrode layer is not particularly limited as long as it is a material capable of being electrically connected to the first electrode layer, and may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0091] The second conductive metal included in the second electrode layer may include at least one of spherical particles and flake-shaped particles. For example, the second conductive metal may include only flake-shaped particles, may include only spherical particles, or may include a mixture of flake-shaped particles and spherical particles. In this case, the spherical particles may also include shapes other than perfect spheres, for example, may include shapes having a length ratio of the major axis to the minor axis (major axis / minor axis) of 1.45 or less. Flake-shaped particles refer to particles having a flat and elongated shape, and although not particularly limited, for example, the flake-shaped particles may have a length ratio of the major axis to the minor axis (major axis / minor axis) of 1.95 or more. The lengths of the major axis and the minor axis of the above spherical particles and flake-shaped particles may be measured by the following image: the image is obtained by scanning the first direction and the second direction cross-sections cut from the central portion in the third direction of the multilayer electronic component using a scanning electron microscope (SEM).

[0092] The resin included in the second electrode layer serves to ensure adhesion performance and absorb shock. The resin included in the second electrode layer is not particularly limited as long as it has adhesion performance and shock absorption performance and can be mixed with the second conductive metal to form a paste, and may include, for example, an epoxy resin.

[0093] In addition, the second electrode layer may include a plurality of second conductive metals, intermetallic compounds, and resins. By including intermetallic compounds, the electrical connectivity with the first electrode layer can be further improved. The intermetallic compounds connect multiple metal particles to improve electrical connectivity and can surround and bond multiple metal particles.

[0094] In this case, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin. For example, since the intermetallic compound includes a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing process, forms an intermetallic compound with some of the metal particles, and surrounds the metal particles. Specifically, the intermetallic compound may include a low-melting-point metal having a melting point of 300 °C or lower.

[0095] For example, the intermetallic compound may include Sn having a melting point of 213 °C to 220 °C. During the drying and curing process, Sn is melted, and the melted Sn wets high-melting-point metal particles (such as Ag, Ni, or Cu) by capillary action and reacts with some of the Ag, Ni, and Cu metal particles to form intermetallic compounds (such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc.). Ag, Ni, or Cu that does not participate in the reaction remains in the form of metal particles.

[0096] Therefore, the plurality of second conductive metals may include at least one of Ag, Ni, and Cu, and the intermetallic compound may include at least one of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0097] The plating layer serves to improve the mounting characteristics.

[0098] The type of the plating layer is not particularly limited, and the plating layer may be a single layer containing at least one of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and their alloys, or may be formed using multiple layers.

[0099] For example, the plating layer may be a Ni plating layer or a Sn plating layer, and may be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer. Optionally, it may be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. In addition, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0100] The multi-layer electronic component 100 according to an embodiment may further include insulating portions 141, 142, 143, and 144 disposed on the main body 110. The materials of the insulating portions 141, 142, 143, and 144 are not particularly limited as long as they can achieve the purpose of insulation. For example, the insulating portions 141, 142, 143, and 144 may include a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a material including a filler, a reinforcing material (such as glass fiber), and a resin. In addition, the materials of the insulating portions 141, 142, 143, and 144 may be the same as or different from each other.

[0101] The insulating portions 141, 142, 143, and 144 are connected to the inner electrode layers 121 and 122 exposed on the surface of the main body 110, and specifically, may be arranged to cover the exposed inner electrode layers 121 and 122.

[0102] More specifically, the insulating portions 141, 142, 143, and 144 may include: a first insulating portion 141 and a second insulating portion 142, which are spaced apart from each other in the second direction on the fifth surface 5 and the third outer electrode 133 is interposed between the first insulating portion 141 and the second insulating portion 142; and a third insulating portion 143 and a fourth insulating portion 144, which are spaced apart from each other in the second direction on the sixth surface 6 and the fourth outer electrode 134 is interposed between the third insulating portion 143 and the fourth insulating portion 144. For example, the first insulating portion 141 and the second insulating portion 142 may be arranged to be spaced apart from each other on opposite sides of the third outer electrode 133 in the second direction, and the third insulating portion 143 and the fourth insulating portion 144 may be arranged to be spaced apart from each other on opposite sides of the fourth outer electrode 134 in the second direction.

[0103] At this time, the first insulating portion 141 and the second insulating portion 142 may each be connected to the lead portions 121a-1 of the first dummy electrode 122b-1 and the first inner electrode 121a exposed on the fifth surface 5, and the third insulating portion 143 and the fourth insulating portion 144 may each be connected to the lead portions 121a-2 of the first dummy electrode 122b-2 and the first inner electrode 121a exposed on the sixth surface 6.

[0104] For example, the lead portions 121a-1 of the first dummy electrode 122b-1 and the first inner electrode 121a respectively exposed to the fifth surface 5 may be covered by the first insulating portion 141, the third outer electrode 133, and the second insulating portion 142 and may be connected to the first insulating portion 141, the third outer electrode 133, and the second insulating portion 142. The lead portions 121a-2 of the first dummy electrode 122b-2 and the first inner electrode 121a respectively exposed to the sixth surface 6 may be arranged to be covered by the third insulating portion 142, the fourth outer electrode 134, and the fourth insulating portion 144 and may be connected to the third insulating portion 142, the fourth outer electrode 134, and the fourth insulating portion 144. Here, the first insulating portion 141, the second insulating portion 142, the third insulating portion 143, and the fourth insulating portion 144 may each be connected to at least a part of the exposed portion of the first inner electrode 121a.

[0105] Although the embodiments show that the insulating portions 141, 142, 143, and 144 include four insulating portions, those skilled in the art will appreciate that the number of insulating portions of the multilayer electronic component according to the present disclosure is not limited thereto, but may be set to a corresponding number as needed. For example, the insulating portion may include a plurality of insulating portions spaced apart from each other, some of the plurality of insulating portions may be connected to the portion of the first inner electrode 121a exposed to the fifth surface 5, and other insulating portions of the plurality of insulating portions may be connected to the portion of the first inner electrode 121a exposed on the sixth surface 6. The insulating portion may be provided on at least one surface of the main body 110, may cover the exposed portion of at least one of the first inner electrode 121a and the second inner electrode 122a, and may be positioned between two outer electrodes (for example, the first insulating portion 141 is provided between the first outer electrode 131 and the third outer electrode 133).

[0106] Since the insulating portions 141, 142, 143, and 144 are provided to cover the inner electrode layers 121 and 122 exposed to the surface of the main body 110, external moisture penetration can be suppressed, thereby improving the moisture resistance reliability. In addition, in order to significantly reduce the mounting area of the third outer electrode 133 and the fourth outer electrode 134, the sizes of the third outer electrode 133 and the fourth outer electrode 134 are reduced, so that the exposed areas of the inner electrode layers 121 and 122 are increased.. However, even when the exposed areas of the inner electrode layers 121 and 122 are increased, these areas can be sufficiently covered by the insulating portions 141, 142, 143, and 144. Therefore, the mounting area of the outer electrode can be significantly reduced while still providing excellent moisture resistance reliability.

[0107] The size of the multilayer electronic component 100 does not need to be particularly limited. However, in order to achieve miniaturization and high capacitance simultaneously, the thicknesses of the dielectric layer and the inner electrode should be reduced to increase the number of layers. Therefore, the effects according to the present disclosure are more significant in a multilayer electronic component having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or smaller.

[0108] Hereinafter, the present disclosure will be described in more detail by way of various embodiments. However, these embodiments are provided to facilitate a deeper understanding of the present disclosure, and the scope of the present disclosure is not limited by the embodiments.

[0109] First Embodiment: Hereinafter, reference will be made to Figures 1 to 3B describe a multi-layer electronic component 100 according to an embodiment.

[0110] The multi-layer electronic component 100 includes: a main body 110, the main body 110 includes a dielectric layer 111 and a first inner electrode layer 121 and a second inner electrode layer 122, the first inner electrode layer 121 and the second inner electrode layer 122 are alternately arranged in a first direction, and the dielectric layer 111 is interposed between the first inner electrode layer 121 and the second inner electrode layer 122, and the main body 110 includes a first surface 1 and a second surface 2 that are opposite to each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction. The first inner electrode layer 121 includes a first inner electrode 121a exposed to the fifth surface 5 and the sixth surface 6 and a first dummy electrode 121b spaced apart from the first inner electrode 121a, and the second inner electrode layer 122 includes a second inner electrode 122a exposed to the third surface 3 and the fourth surface 4 and a second dummy electrode 122b spaced apart from the second inner electrode 122a; a first outer electrode 131 and a second outer electrode 132 are respectively provided on the third surface 3 and the fourth surface 4 and are connected to the second inner electrode 122a; a third outer electrode 133 and a fourth outer electrode 134 are respectively provided on the fifth surface 5 and the sixth surface 6 and are connected to the first inner electrode 121a; a first insulating portion 141 and a second insulating portion 142 are provided to be spaced apart from each other in the second direction on the fifth surface 5 and the third outer electrode 133 is interposed between the first insulating portion 141 and the second insulating portion 142; and a third insulating portion 143 and a fourth insulating portion 144 are provided to be spaced apart from each other in the second direction on the sixth surface 6 and the fourth outer electrode 134 is interposed between the third insulating portion 143 and the fourth insulating portion 144. The first dummy electrode 121b may overlap with the exposed portions (i.e., lead portions 122a-1 and 122a-2) of the second inner electrode 122a in the first direction, and the second dummy electrode 122b may overlap with the exposed portions (i.e., lead portions 121a-1 and 121a-2) of the first inner electrode 121a in the first direction.

[0111] More specifically, the first inner electrode 121a may include a first main portion 121a-0, and first lead portions 121a-1 and 121a-2 extending from the first main portion 121a-0. The first lead portions 121a-1 and 121a-2 may include a 1-1 lead portion 121a-1 exposed to the fifth surface 5 and at least partially connected to the third outer electrode 133, and a 1-2 lead portion 121a-2 exposed to the sixth surface 6 and at least partially connected to the fourth outer electrode 134. The first dummy electrode 121b may include a 1-1 dummy electrode 121b-1 exposed to the third surface 3 and a 1-2 dummy electrode 121b-2 spaced apart from the 1-1 dummy electrode 121b-1 and exposed to the fourth surface 4. The second inner electrode 122a may include a second main portion 122a-0, and second lead portions 122a-1 and 122a-2 extending from the second main portion 122a-0. The second lead portions 122a-1 and 122a-2 may include a 2-1 lead portion 122a-1 exposed to the third surface 3 and connected to the first outer electrode 131, and a 2-2 lead portion 122a-2 exposed to the fourth surface 4 and connected to the second outer electrode 132. The second dummy electrodes 122b-1 and 122b-2 may include a 2-1 dummy electrode 122b-1 exposed to the fifth surface 5 and a 2-2 dummy electrode 122b-2 exposed to the sixth surface 6. The 1-1 dummy electrode 121b-1 may overlap with the 2-1 lead portion 122a-1 in the first direction, the 1-2 dummy electrode 121b-2 may overlap with the 2-2 lead portion 122a-2 in the first direction, the 2-1 dummy electrode 122b-1 may overlap with the 1-1 lead portion 121a-1 in the first direction, and the 2-2 dummy electrode 122b-2 may overlap with the 1-2 lead portion 121a-2 in the first direction.

[0112] In this case, at least a part of the 1-1 lead portion 121a-1 may be further connected to the first insulating portion 141 and the second insulating portion 142, and at least a part of the 1-2 lead portion 121a-2 may be further connected to the third insulating portion 143 and the fourth insulating portion 144.

[0113] Second Embodiment: Hereinafter, reference will be made to Figures 4 to 5B describe a multi-layer electronic component 200 according to another embodiment.

[0114] Here, the first external electrode 231, the second external electrode 232, the main body 210, the dummy electrodes 221b-1 and 221b-2, the lead portions 222a-1 and 222a-2, and the main portions 221a-0 and 222a-0 of the multilayer electronic component 200 according to another embodiment may be the same as the corresponding components in the multilayer electronic component 100 according to the embodiment, and thus their descriptions will be omitted. Although the description of the structure identical to that of the multilayer electronic component 100 will be omitted, those skilled in the art will still be able to easily understand the structure.

[0115] In the multilayer electronic component 200, the 1-1 lead portions 221a-1, 221a-3, and 221a-5 are spaced apart from each other and include the 1-1-1 lead portion 221a-1 connected to the third external electrode 233, the 1-1-2 lead portion 221a-3 connected to the first insulating portion 241, and the 1-1-3 lead portion 221a-5 connected to the second insulating portion 242. The 1-2 lead portions 221a-2, 221a-4, and 221a-6 are spaced apart from each other and include the 1-2-1 lead portion 221a-2 connected to the fourth external electrode 234, the 1-2-2 lead portion 221a-4 connected to the third insulating portion 243, and the 1-2-3 lead portion 221a-6 connected to the fourth insulating portion 244. The 2-1 dummy electrodes 222b-1, 222b-3, and 222b-5 are spaced apart from each other and include the 2-1-1 dummy electrode 222b-1 overlapping the 1-1-1 lead portion 221a-1 in the first direction, the 2-1-2 dummy electrode 222b-3 overlapping the 1-1-2 lead portion 221a-3 in the first direction, and the 2-1-3 dummy electrode 222b-5 overlapping the 1-1-3 lead portion 221a-5 in the first direction. The 2-2 dummy electrodes 222b-2, 222b-4, and 222b-6 are spaced apart from each other and include the 2-2-1 dummy electrode 222b-2 overlapping the 1-2-1 lead portion 221a-2 in the first direction, the 2-2-2 dummy electrode 222b-4 overlapping the 1-2-2 lead portion 221a-4 in the first direction, and the 2-2-3 dummy electrode 222b-6 overlapping the 1-2-3 lead portion 221a-6 in the first direction.

[0116] Third Embodiment: Hereinafter, reference will be made to Figures 6 to 7B describe the multilayer electronic component 300 according to another embodiment.

[0117] Here, the first external electrode 331, the second external electrode 332, the third external electrode 333, the fourth external electrode 334, the main body 310, the dummy electrodes 322b-1 and 322b-2, the lead portions 321a-1 and 321a-2, and the main portions 321a-0 and 322a-0 of the multi-layer electronic component 300 according to another embodiment may be the same as the corresponding components in the multi-layer electronic component 100 according to the embodiment and the multi-layer electronic component 200 according to another embodiment, and thus their descriptions will be omitted. Although the descriptions of the configurations that are the same as those of the multi-layer electronic components 100 and 200 will be omitted, those skilled in the art can easily understand such configurations.

[0118] In the multi-layer electronic component 300, the second lead portions 322a-1, 322a-2, 322a-3, 322a-4, 322a-5, and 322a-6 may further include 2-3 lead portions 322a-3 and 322a-5 exposed to the fifth surface 5 and 2-4 lead portions 322a-4 and 322a-6 exposed to the sixth surface 6. The 2-3 lead portions 322a-3 and 322a-5 may be spaced apart from each other, and may include a 2-3-1 lead portion 322a-3 connected to the first insulating portion 341 and a 2-3-2 lead portion 322a-5 connected to the second insulating portion 342. The 2-4 lead portions 322a-4 and 322a-6 may be spaced apart from each other, and may include a 2-4-1 lead portion 322a-4 connected to the third insulating portion 343 and a 2-4-2 lead portion 322a-6 connected to the fourth insulating portion 344. The first dummy electrodes 321b-1, 321b-2, 321b-3, 321b-4, 321b-5, and 321b-6 may further include 1-3 dummy electrodes 321b-3 and 321b-5 exposed to the fifth surface 5 and 1-4 dummy electrodes 321b-4 and 321b-6 exposed to the sixth surface 6. The 1-3 dummy electrodes 321b-3 and 321b-5 may be spaced apart from each other, and may include a 1-3-1 dummy electrode 321b-3 overlapping with the 2-3-1 lead portion 322a-3 in the first direction and a 1-3-2 dummy electrode 321b-5 overlapping with the 2-3-2 lead portion 322a-5 in the first direction. The 1-4 dummy electrodes 321b-4 and 321b-6 may be spaced apart from each other, and may include a 1-4-1 dummy electrode 321b-4 overlapping with the 2-4-1 lead portion 322a-4 in the first direction and a 1-4-2 dummy electrode 321b-6 overlapping with the 2-4-2 lead portion 322a-6 in the first direction.

[0119] Fourth Embodiment: Hereinafter, reference will be made to Figures 8 to 9B describe the multi-layer electronic component 400 according to another embodiment.

[0120] Here, the main body 410, dummy electrodes 421b-1, 421b-2, 422b-1, and 422b-2, and main portions 421a-0 and 422a-0 of the multi-layer electronic component 400 according to another embodiment may be the same as the corresponding components in the multi-layer electronic component 300 according to another embodiment, and thus their descriptions will be omitted. The multi-layer electronic component 400 according to another embodiment may include a structure the same as that of the multi-layer electronic component 300 except for not including an insulating portion. Therefore, although the description of the structure except for the insulating portion will be omitted, those skilled in the art will be able to easily understand the structure.

[0121] The multi-layer electronic component 400 includes: a main body 410, the main body 410 including a dielectric layer 411 and a first inner electrode layer 421 and a second inner electrode layer 422, the first inner electrode layer 421 and the second inner electrode layer 422 being alternately arranged in a first direction, and the dielectric layer 411 being interposed between the first inner electrode layer 421 and the second inner electrode layer 422, and the main body 410 including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction. The first inner electrode layer 421 includes a first inner electrode 421a exposed to the fifth surface 5 and the sixth surface 6 and a first dummy electrode 421b arranged at an interval from the first inner electrode 421a, and the second inner electrode layer 422 includes a second inner electrode 422a exposed to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and a second dummy electrode 422b arranged at an interval from the second inner electrode 422a; a first outer electrode 431 provided on the third surface 3, the fifth surface 5, and the sixth surface 6 and connected to the second inner electrode 422a; a second outer electrode 432 provided on the fourth surface 4, the fifth surface 5, and the sixth surface 6 and connected to the second inner electrode 422a; a third outer electrode 433 provided on the fifth surface 5 and connected to the first inner electrode 421a; and a fourth outer electrode 434 provided on the sixth surface 6 and connected to the first inner electrode 421a. The first dummy electrode 421b may overlap an exposed portion (i.e., lead portion 422a) of the second inner electrode 422a in the first direction, and the second dummy electrode 422b may overlap an exposed portion (i.e., lead portion 421a) of the first inner electrode 421a in the first direction.

[0122] In this case, the second lead portions 422a-1, 422a-2, 422a-3, 422a-4, 422a-5, and 422a-6 further include 2-3 lead portions 422a-3 and 422a-5 exposed to the fifth surface 5 and 2-4 lead portions 422a-4 and 422a-6 exposed to the sixth surface 6. The 2-3 lead portions 422a-3 and 422a-5 can be spaced apart from each other, and include a 2-3-1 lead portion 422a-3 connected to the first external electrode 431 and a 2-3-2 lead portion 422a-5 connected to the second external electrode 432. The 2-4 lead portions 422a-4 and 422a-6 can be spaced apart from each other, and include a 2-4-1 lead portion 422a-4 connected to the first external electrode 431 and a 2-4-2 lead portion 422a-6 connected to the second external electrode 432. The first dummy electrode 421b further includes 1-3 dummy electrodes 421b-3 and 421b-5 exposed to the fifth surface 5 and 1-4 dummy electrodes 421b-4 and 421b-6 exposed to the sixth surface 6. The 1-3 dummy electrodes 421b-3 and 421b-5 can be spaced apart from each other, and include a 1-3-1 dummy electrode 421b-3 overlapping with the 2-3-1 lead portion 422a-3 in the first direction and a 1-3-2 dummy electrode 421b-5 overlapping with the 2-3-2 lead portion 422a-5 in the first direction. And the 1-4 dummy electrodes 421b-4 and 421b-6 can be spaced apart from each other, and include a 1-4-1 dummy electrode 321b-4 overlapping with the 2-4-1 lead portion 422a-4 in the first direction and a 1-4-2 dummy electrode 421b-6 overlapping with the 2-4-2 lead portion 422a-6 in the first direction.

[0123] Although various embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various forms of substitutions, modifications, and changes, which also fall within the scope of the present disclosure.

[0124] The expression "embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, the combination of the features of the above-presented embodiments with other embodiments is not excluded. For example, even if the matters described in one embodiment are not described in another embodiment, unless there is a description conflicting with the matters in the other embodiment, such matters can also be understood as being related to the other embodiment.

[0125] The terms used in the present disclosure are only for describing embodiments and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, the singular expression includes the plural expression.

[0126] As described above, according to the embodiment, the step difference of the multi-layer electronic component is improved.

[0127] According to the embodiment, the moisture resistance reliability of the multi-layer electronic component is improved.

[0128] Although the example embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body, comprising a dielectric layer and a first inner electrode layer and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer are alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode layer and the second inner electrode layer, the body comprising a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction, the first inner electrode layer comprising a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode spaced apart from the first inner electrode, and the second inner electrode layer comprising a second inner electrode exposed to the third surface and the fourth surface and a second dummy electrode spaced apart from the second inner electrode; A first external electrode and a second external electrode are disposed on the third surface and the fourth surface, respectively, and the first external electrode and the second external electrode are connected to the second internal electrode; A third external electrode and a fourth external electrode are disposed on the fifth surface and the sixth surface, respectively, and the third external electrode and the fourth external electrode are connected to the first internal electrode; A first insulating portion and a second insulating portion are arranged on the fifth surface to be spaced apart from each other in the second direction, and the third external electrode is interposed between the first insulating portion and the second insulating portion; as well as The third insulating portion and the fourth insulating portion are arranged on the sixth surface to be spaced apart from each other in the second direction, and the fourth external electrode is interposed between the third insulating portion and the fourth insulating portion, The first dummy electrode overlaps with the exposed portion of the second internal electrode in the first direction, and the second dummy electrode overlaps with the exposed portion of the first internal electrode in the first direction.

2. The multilayer electronic component according to claim 1, wherein The first insulating portion, the second insulating portion, the third insulating portion, and the fourth insulating portion are each connected to at least a portion of the exposed portion of the first internal electrode.

3. The multilayer electronic component according to claim 1, wherein: The first internal electrode and the second internal electrode each have a constant size in the second direction and each have a constant size in the third direction.

4. The multilayer electronic component according to claim 1, wherein: Regions of the first and second internal electrodes exposed through the surface of the body each have a constant size in the second direction and each have a constant size in the third direction.

5. The multilayer electronic component according to claim 2, wherein: The first inner electrode is exposed to the fifth and sixth surfaces through a plurality of lead portions of the first inner electrode and is connected to the third and fourth outer electrodes and the first, second, third, and fourth insulating portions.

6. The multilayer electronic component according to claim 2, wherein: The second internal electrode is further exposed to the fifth and sixth surfaces through a plurality of lead portions of the second internal electrode, and is connected to the first, second, third, and fourth insulating portions.

7. The multilayer electronic component according to claim 1, wherein: the first inner electrode includes a first main portion and a first lead portion extending from the first main portion, the first lead portion includes a 1-1 lead portion exposed to the fifth surface and at least partially connected to the third outer electrode and a 1-2 lead portion exposed to the sixth surface and at least partially connected to the fourth outer electrode, and the first dummy electrode includes a 1-1 dummy electrode exposed to the third surface and a 1-2 dummy electrode spaced apart from the 1-1 dummy electrode and exposed to the fourth surface, The second inner electrode includes a second main portion and a second lead portion extending from the second main portion, the second lead portion includes a 2-1 lead portion exposed to the third surface and connected to the first outer electrode and a 2-2 lead portion exposed to the fourth surface and connected to the second outer electrode, and the second dummy electrode includes a 2-1 dummy electrode exposed to the fifth surface and a 2-2 dummy electrode exposed to the sixth surface, and The 1-1 dummy electrode overlaps with the 2-1 lead portion in the first direction, the 1-2 dummy electrode overlaps with the 2-2 lead portion in the first direction, the 2-1 dummy electrode overlaps with the 1-1 lead portion in the first direction, and the 2-2 dummy electrode overlaps with the 1-2 lead portion in the first direction.

8. The multilayer electronic component according to claim 7, wherein: At least a portion of the 1-1 lead portion is further connected to the first insulating portion and the second insulating portion, and at least a portion of the 1-2 lead portion is further connected to the third insulating portion and the fourth insulating portion.

9. The multilayer electronic component according to claim 8, wherein: The 1-1 lead portion includes a 1-1-1 lead portion connected to the third external electrode, a 1-1-2 lead portion connected to the first insulating portion, and a 1-1-3 lead portion connected to the second insulating portion, the 1-1-1 lead portion, the 1-1-2 lead portion, and the 1-1-3 lead portion are spaced apart from each other, and The 1-2 lead portion includes a 1-2-1 lead portion connected to the fourth external electrode, a 1-2-2 lead portion connected to the third insulating portion, and a 1-2-3 lead portion connected to the fourth insulating portion, wherein the 1-2-1 lead portion, the 1-2-2 lead portion, and the 1-2-3 lead portion are spaced apart from each other. The 2-1 dummy electrode includes a 2-1-1 dummy electrode overlapping the 1-1-1 lead portion in the first direction, a 2-1-2 dummy electrode overlapping the 1-1-2 lead portion in the first direction, and a 2-1-3 dummy electrode overlapping the 1-1-3 lead portion in the first direction, the 2-1-1 dummy electrode, the 2-1-2 dummy electrode, and the 2-1-3 dummy electrode being arranged to be spaced apart from each other, and The 2-2 dummy electrodes include a 2-2-1 dummy electrode overlapping the 1-2-1 lead portion in the first direction, a 2-2-2 dummy electrode overlapping the 1-2-2 lead portion in the first direction, and a 2-2-3 dummy electrode overlapping the 1-2-3 lead portion in the first direction, and the 2-2-1 dummy electrode, the 2-2-2 dummy electrode, and the 2-2-3 dummy electrode are spaced apart from each other.

10. The multilayer electronic component according to claim 8, wherein The second lead portion further includes a plurality of 2-3 lead portions exposed to the fifth surface and a plurality of 2-4 lead portions exposed to the sixth surface, wherein the 2-3 lead portion includes a 2-3-1 lead portion connected to the first insulating portion and a 2-3-2 lead portion connected to the second insulating portion, and the 2-3-1 lead portion and the 2-3-2 lead portion are spaced apart from each other, and wherein the 2-4 lead portion includes a 2-4-1 lead portion connected to the third insulating portion and a 2-4-2 lead portion connected to the fourth insulating portion, and the 2-4-1 lead portion and the 2-4-2 lead portion are spaced apart from each other, and The first dummy electrode also includes a plurality of 1-3 dummy electrodes exposed to the fifth surface and a plurality of 1-4 dummy electrodes exposed to the sixth surface, wherein the 1-3 dummy electrodes include a 1-3-1 dummy electrode overlapping the 2-3-1 lead portion in the first direction and a 1-3-2 dummy electrode overlapping the 2-3-2 lead portion in the first direction, and the 1-3-1 dummy electrode and the 1-3-2 dummy electrode are spaced apart from each other, and wherein the 1-4 dummy electrodes include a 1-4-1 dummy electrode overlapping the 2-4-1 lead portion in the first direction and a 1-4-2 dummy electrode overlapping the 2-4-2 lead portion in the first direction, and the 1-4-1 dummy electrode and the 1-4-2 dummy electrode are spaced apart from each other.

11. A multilayer electronic component comprising: A body, comprising a dielectric layer and a first inner electrode layer and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer are alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode layer and the second inner electrode layer, and the body comprises a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction, wherein the first inner electrode layer comprises a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode spaced apart from the first inner electrode, and wherein the second inner electrode layer comprises a second inner electrode exposed to the third surface, the fourth surface, the fifth surface and the sixth surface and a second dummy electrode spaced apart from the second inner electrode; a first external electrode disposed on the third surface, the fifth surface, and the sixth surface and connected to the second internal electrode; a second outer electrode disposed on the fourth surface, the fifth surface, and the sixth surface and connected to the second inner electrode; a third outer electrode disposed on the fifth surface and connected to the first inner electrode; and a fourth outer electrode disposed on the sixth surface and connected to the first inner electrode, The first dummy electrode overlaps with the exposed portion of the second internal electrode in the first direction, and the second dummy electrode overlaps with the exposed portion of the first internal electrode in the first direction.

12. The multilayer electronic component according to claim 11, wherein The second inner electrode includes a second main portion and a second lead portion extending from the second main portion, the second lead portion includes a 2-3 lead portion exposed to the fifth surface and a 2-4 lead portion exposed to the sixth surface, wherein the 2-3 lead portion includes a 2-3-1 lead portion connected to the first outer electrode and a 2-3-2 lead portion connected to the second outer electrode, the 2-3-1 lead portion and the 2-3-2 lead portion are spaced apart from each other, and the 2-4 lead portion includes a 2-4-1 lead portion connected to the first outer electrode and a 2-4-2 lead portion connected to the second outer electrode, the 2-4-1 lead portion and the 2-4-2 lead portion are spaced apart from each other; and The first dummy electrode includes a 1-3 dummy electrode exposed to the fifth surface and a 1-4 dummy electrode exposed to the sixth surface, wherein the 1-3 dummy electrode includes a 1-3-1 dummy electrode overlapping with the 2-3-1 lead portion in the first direction and a 1-3-2 dummy electrode overlapping with the 2-3-2 lead portion in the first direction, and the 1-3-1 dummy electrode and the 1-3-2 dummy electrode are spaced apart from each other, wherein the 1-4 dummy electrode includes a 1-4-1 dummy electrode overlapping with the 2-4-1 lead portion in the first direction and a 1-4-2 dummy electrode overlapping with the 2-4-2 lead portion in the first direction, and the 1-4-1 dummy electrode and the 1-4-2 dummy electrode are spaced apart from each other.

13. A multilayer electronic component comprising: a body, comprising a dielectric layer and a first inner electrode layer and a second inner electrode layer, the first inner electrode layer and the second inner electrode layer are alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode layer and the second inner electrode layer, and the body comprises a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction, the first inner electrode layer comprises a first inner electrode exposed to the fifth surface and the sixth surface and a first dummy electrode spaced apart from the first inner electrode, and the second inner electrode layer comprises a second inner electrode exposed to the third surface and the fourth surface and a second dummy electrode spaced apart from the second inner electrode; A first external electrode and a second external electrode are disposed on the third surface and the fourth surface, respectively, and the first external electrode and the second external electrode are connected to the second internal electrode; A third external electrode and a fourth external electrode are disposed on the fifth surface and the sixth surface, respectively, and the third external electrode and the fourth external electrode are connected to the first internal electrode; an insulating portion provided on at least one surface of the body, covering an exposed portion of at least one of the first internal electrode and the second internal electrode, and positioned between two external electrodes; The first dummy electrode overlaps with the exposed portion of the second internal electrode in the first direction, and the second dummy electrode overlaps with the exposed portion of the first internal electrode in the first direction.

14. The multilayer electronic component according to claim 13, wherein: The insulating part is disposed on the fifth and sixth surfaces of the body and is configured to cover at least a portion of the first and second internal electrodes exposed to the fifth and sixth surfaces.

15. The multilayer electronic component according to claim 13, wherein The insulating portion includes first and second insulating portions and third and fourth insulating portions, the first insulating portion and the second insulating portion being arranged to be spaced apart from each other on opposite sides of the third external electrode in the second direction, and the third insulating portion and the fourth insulating portion being arranged to be spaced apart from each other on opposite sides of the fourth external electrode in the second direction.

16. The multilayer electronic component according to claim 15, wherein At least one of the first insulating portion and the second insulating portion is connected to the exposed portion of the first internal electrode located on the fifth surface, and at least one of the third insulating portion and the fourth insulating portion is connected to the exposed portion of the first internal electrode located on the sixth surface.

17. The multilayer electronic component according to claim 13, wherein: The insulating portion includes a plurality of insulating portions spaced apart from each other, Some of the plurality of insulating portions are connected to portions of the first internal electrode exposed to the fifth surface, and other insulating portions of the insulating portions are connected to portions of the first internal electrode exposed to the sixth surface.

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