Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first, second, third, and fourth portions; first and second external electrodes disposed on the first and second portions, respectively, and connected to the first internal electrode; third and fourth external electrodes disposed on the third and fourth portions, respectively, and connected to the second internal electrode; and a connection electrode disposed in at least one of the first to fourth portions, penetrating the dielectric layer, connecting two first internal electrodes or two second internal electrodes adjacent to each other in the first direction. The connection electrode has a plurality of via electrodes stacked in the first direction, and via electrodes adjacent to each other in the first direction among the plurality of via electrodes are offset from each other in a direction perpendicular to the first direction.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0032177, filed on March 6, 2024, and Korean Patent Application No. 10-2023-0195449, filed on December 28, 2023, with the Korean Intellectual Property Office, the entire disclosure of which is hereby incorporated by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, is a chip capacitor that is mounted on a printed circuit board of various electronic products and charges or discharges electricity therefrom. The various electronic products include image display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, and the like. Since the multi-layer ceramic capacitor can have a small size and a high capacitance and can be easily mounted, such a multi-layer ceramic capacitor can be used as a component of various electronic devices.

[0004] An MLCC generally includes a body and external electrodes. The body includes a plurality of internal electrodes that are alternately arranged, and dielectric layers are interposed between the internal electrodes. The external electrodes are provided on the outside of the body and connected to the plurality of internal electrodes.

[0005] During a sintering process for manufacturing an MLCC, the internal electrodes may shrink or cracks may occur in the body, such that the connection between the internal electrodes and the external electrodes may be disconnected, which may cause a decrease in the capacitance of the MLCC. Summary of the Invention

[0006] An embodiment of the present disclosure is to provide a multi-layer electronic component having excellent mechanical strength and electrical characteristics.

[0007] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer and first and second inner electrodes alternately arranged, and the dielectric layer is interposed between the first and second inner electrodes and includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction, the main body including a first part, a second part, a third part, and a fourth part; a first outer electrode and a second outer electrode respectively disposed on the first part and the second part and connected to the first inner electrode; a third outer electrode and a fourth outer electrode respectively disposed on the third part and the fourth part and connected to the second inner electrode; and a connection electrode disposed in at least one of the first part, the second part, the third part, and the fourth part, penetrating the dielectric layer, connecting two first inner electrodes adjacent to each other in the first direction, or connecting two second inner electrodes adjacent to each other in the first direction. The first part and the third part are connected to each other in the second direction, the first part and the fourth part are connected to each other in the third direction, the second part and the third part are connected to each other in the third direction, and the second part and the fourth part are connected to each other in the second direction. The first part includes a corner where the third surface and the fifth surface intersect, the second part includes a corner where the fourth surface and the sixth surface intersect, the third part includes a corner where the fourth surface and the fifth surface intersect, and the fourth part includes a corner where the third surface and the sixth surface intersect. The connection electrode has a plurality of via electrodes stacked in the first direction, and the via electrodes adjacent to each other in the first direction among the plurality of via electrodes are offset from each other in a direction perpendicular to the first direction.

[0008] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a main body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction. The main body includes a first part, a second part, a third part, and a fourth part. The main body includes a first inner electrode layer, which includes a first dielectric layer, a first inner electrode disposed on the first dielectric layer, and a third auxiliary electrode and a fourth auxiliary electrode disposed on the first dielectric layer. The third auxiliary electrode and the fourth auxiliary electrode are spaced apart from the first inner electrode and are respectively disposed on the third part and the fourth part. The main body includes a second inner electrode layer, which includes a second dielectric layer, a second inner electrode disposed on the second dielectric layer, and a first auxiliary electrode and a second auxiliary electrode disposed on the second dielectric layer. The first auxiliary electrode and the second auxiliary electrode are spaced apart from the second inner electrode and are respectively disposed in the first part and the second part. In the main body, the first inner electrode layer and the second inner electrode layer are alternately disposed in the first direction; a first outer electrode and a second outer electrode are respectively disposed on the first part and the second part and are connected to the first inner electrode; a third outer electrode and a fourth outer electrode are respectively disposed on the third part and the fourth part and are connected to the second inner electrode; a first via electrode is disposed on the first part, penetrates the first dielectric layer, and connects the first inner electrode to the first auxiliary electrode; and a second via electrode is disposed on the first part, penetrates the second dielectric layer, and connects the first inner electrode to the first auxiliary electrode. The first part and the third part are connected to each other in the second direction, the first part and the fourth part are connected to each other in the third direction, the second part and the third part are connected to each other in the third direction, and the second part and the fourth part are connected to each other in the second direction. The first part includes a corner where the third surface and the fifth surface intersect, the second part includes a corner where the fourth surface and the sixth surface intersect, the third part includes a corner where the fourth surface and the fifth surface intersect, and the fourth part includes a corner where the third surface and the sixth surface intersect. The first via electrode and the second via electrode are offset from each other in a direction perpendicular to the first direction.

[0009] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer and first and second inner electrodes alternately arranged, and the dielectric layer is interposed between the first and second inner electrodes and includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first outer electrode provided at least on the third surface to be connected to the first inner electrode extending to the third surface; a third outer electrode provided at least on the fourth surface to be connected to the second inner electrode extending to the fourth surface; and a connection electrode provided in a region where one of the second inner electrodes is spaced apart from the third surface to connect two first inner electrodes adjacent to each other in the first direction among the first inner electrodes. The connection electrode includes a first via electrode extending from one of the two first inner electrodes and a second via electrode extending from the other of the two first inner electrodes.

[0010] According to an embodiment of the present disclosure, a multi-layer electronic component includes: a main body including a dielectric layer and first and second inner electrodes alternately arranged, and the dielectric layer is interposed between the first and second inner electrodes and includes a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the main body includes a capacitance forming portion and a covering portion, in the capacitance forming portion, the first and second inner electrodes are alternately arranged in the first direction, and the dielectric layer is interposed between the first and second inner electrodes, the covering portion is provided on two surfaces of the capacitance forming portion in the first direction; a first outer electrode provided at least on the first surface to be connected to the first inner electrode; a third outer electrode provided at least on the first surface to be connected to the second inner electrode; a connection electrode provided in a region where one of the second inner electrodes is spaced apart from the third surface to connect two first inner electrodes adjacent to each other in the first direction among the first inner electrodes; and a contact structure penetrating the covering portion to connect the first inner electrode provided in the outermost region with respect to the first direction to the first outer electrode. The connection electrode includes a first via electrode directly extending from one of the two first inner electrodes and a second via electrode directly extending from the other of the two first inner electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multi-layer electronic component according to a first embodiment of the present disclosure; Figure 2 is a sectional view taken along line I1-I1' in Figure 1 ; Figure 3 is a sectional view taken along line II1-II1' in Figure 1 ; Figure 4A is a sectional view taken along line III1-III1' in Figure 2 ; Figure 4B is a sectional view taken along line IV1-IV1' in Figure 2 ; Figure 5 is a magnified view showing area A in Figure 2 ; Figure 6 is a perspective view showing a multi-layer electronic component according to a first modified example of the first embodiment of the present disclosure; Figure 7 is a sectional view taken along line I2-I2' in Figure 6 ; Figure 8 is a sectional view taken along line II2-II2' in Figure 6 ; Figure 9A is a sectional view taken along line III2-III2' in Figure 7 ; Figure 9B is a sectional view taken along line IV2-IV2' in Figure 7 ; Figure 10A and Figure 10B are sectional views corresponding to Figure 9A and Figure 9B showing a multi-layer electronic component according to a second modified example of the first embodiment of the present disclosure; Figure 11A and Figure 11B are sectional views corresponding to Figure 9A and Figure 9B showing a multi-layer electronic component according to a third modified example of the first embodiment of the present disclosure; Figure 12 is a perspective view showing a multi-layer electronic component according to a fourth modified example of the first embodiment of the present disclosure; Figure 13 is a cross-sectional view taken along Figure 12 line I3-I3' in; Figure 14 is a cross-sectional view taken along Figure 12 line II3-II3' in; Figure 15A is a cross-sectional view taken along Figure 13 line III3-III3' in; Figure 15B is a cross-sectional view taken along Figure 13 line IV3-IV3' in; Figure 16 is a perspective view of a multi-layer electronic component showing a fifth modified example according to the first embodiment of the present disclosure; Figure 17 is a cross-sectional view taken along Figure 16 line I4-I4' in; Figure 18 is a cross-sectional view taken along Figure 16 line II4-II4' in; Figure 19A is a cross-sectional view taken along Figure 17 line III4-III4' in; Figure 19B is a cross-sectional view taken along Figure 17 line VI4-VI4' in; Figure 20 is a perspective view of a multi-layer electronic component showing a sixth modified example according to the first embodiment of the present disclosure; Figure 21 is a cross-sectional view taken along Figure 20 line I5-I5' in; Figure 22 is a cross-sectional view taken along Figure 20 line II5-II5' in; Figure 23 is a perspective view of a multi-layer electronic component showing the second embodiment of the present disclosure; Figure 24 is an exploded perspective view of the main body of a multi-layer electronic component showing the second embodiment of the present disclosure; Figure 25 is a cross-sectional view taken along Figure 23 line I6-I6' in; Figure 26 is a cross-sectional view taken along Figure 23 line II6-II6' in; Figure 27A is a cross-sectional view taken along Figure 25 line III6-III6' in; Figure 27B is a cross-sectional view taken along line IV6-IV6' in Figure 25 ; Figure 28 is an enlarged view showing region B in Figure 25 ; Figure 29A and Figure 29B are cross-sectional views showing the multilayer electronic component corresponding to Figure 27A and Figure 27B in a first modification example of the second embodiment of the present disclosure; Figure 30A and Figure 30B are cross-sectional views showing the multilayer electronic component corresponding to Figure 27A and Figure 27B in a second modification example of the second embodiment of the present disclosure; Figure 31 is a perspective view of a multilayer electronic component in a third modification example of the second embodiment of the present disclosure; Figure 32 is a cross-sectional view taken along line I7-I7' in Figure 31 ; Figure 33 is a cross-sectional view taken along line II7-II7' in Figure 31 ; Figure 34A is a cross-sectional view taken along line III7-III7' in Figure 32 ; Figure 34B is a cross-sectional view taken along line IV7-IV7' in Figure 32 ; Figure 35 is a perspective view of a multilayer electronic component in a fourth modification example of the second embodiment of the present disclosure; Figure 36 is a cross-sectional view taken along line I8-I8' in Figure 35 ; Figure 37 is a cross-sectional view taken along line II8-II8' in Figure 35 ; Figure 38 is a cross-sectional view showing the filling process and printing process for manufacturing the multilayer electronic component according to the first embodiment or the second embodiment of the present disclosure; Figures 39 to 41 is a cross-sectional view showing Figure 38 in a modification example. DETAILED DESCRIPTION

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows.

[0013] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It will be understood that although the various embodiments of the present disclosure are not identical, they are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structures, shapes, and dimensions described as examples in the embodiments of the present disclosure can be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments can be modified. Therefore, the following detailed description should not be construed in a limiting sense, and the scope of the present disclosure is defined only by the appended claims (properly construed) and the full scope of equivalents to which the claims are entitled.

[0014] In the drawings, the same elements will be denoted by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present disclosure will be omitted. In the drawings, some elements may be exaggerated, omitted, or shown briefly, and the dimensions of the elements do not necessarily reflect the actual dimensions of these elements. The terms "comprising", "including", "configured to", etc. in the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, parts, or combinations thereof.

[0015] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0016] (First Embodiment) Figure 1 is a perspective view showing a multilayer electronic component according to a first embodiment.

[0017] Figure 2 is along Figure 1 the cross-sectional view taken along the line I1-I1' in

[0018] Figure 3 is along Figure 1 the cross-sectional view taken along the line II1-II1' in

[0019] Figure 4A is along Figure 2 the cross-sectional view taken along the line III1-III1' in

[0020] Figure 4B is along Figure 2 the cross-sectional view taken along the line IV1-IV1' in

[0021] Figure 5 is a view showing Figure 2 the enlarged view of the area A in

[0022] Hereinafter, reference will be made to Figures 1 to 5 The multilayer electronic component 100a according to the first embodiment will be described in more detail. A multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the embodiments of the multilayer electronic component are not limited thereto, and examples of the multilayer electronic component may also include various electronic components using a dielectric composition, such as inductors, piezoelectric elements, varistors, or thermistors.

[0023] The size of the multilayer electronic component 100a is not limited to any specific example. When the sizes of the multilayer electronic component 100a in the first direction, the second direction, and the third direction are defined as T, L, and W, respectively, L may be, for example, 0.5 mm to 1.7 mm, W may be, for example, 0.5 mm to 1.7 mm, and T may be, for example, 0.05 mm to 3.5 mm. In an embodiment, each of the ratio of T to L (T / L) and the ratio of T to W (T / W) may satisfy less than or equal to 0.6. The lower limits of T / L and T / W are not limited to any specific example and may be, for example, each greater than or equal to 0.05. The multilayer electronic component 100a may have, for example, a 0606 size (L = about 0.6 mm, W = about 0.6 mm, T = 0.3 mm). According to one example, T, L, and W may respectively refer to the maximum sizes of the multilayer electronic component 100a in the first direction, the second direction, and the third direction. The size of the multilayer electronic component 100a (i.e., T in the first direction, L in the second direction, and / or W in the third direction) may be measured based on the cross-section of the multilayer electronic component 100a using a microscope. In one example, the size of the multilayer electronic component 100a (i.e., T in the first direction, L in the second direction, and / or W in the third direction) may be measured along the corresponding direction among the first direction, the second direction, and the third direction of the multilayer electronic component 100a. The average size of the multilayer electronic component 100a (i.e., the average T in the first direction, the average L in the second direction, and / or the average W in the third direction) may be obtained by measuring the corresponding sizes at a plurality of points (e.g., 30 points equally spaced from each other) and measuring their average value. The maximum size of the multilayer electronic component 100a (i.e., the maximum T in the first direction, the maximum L in the second direction, and / or the maximum W in the third direction) may be obtained by selecting the maximum value among the corresponding sizes obtained at a plurality of points (e.g., 30 points equally spaced from each other).

[0024] The multilayer electronic component 100a according to an embodiment may include a body 110, outer electrodes 131, 132, 133, and 134, and connection electrodes 141, 142, 143, and 144.

[0025] The shape of the body 110 is not limited to any specific shape, but as Figures 1 to 3As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the body 110 during the sintering process or the polishing of the corners, the body 110 may not have an exact hexahedral shape formed by straight lines, but may generally have a hexahedral shape.

[0026] The body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0027] The body 110 may be divided into a first part P1, a second part P2, a third part P3, and a fourth part P4. The first part P1, the second part P2, the third part P3, and the fourth part P4 may be distinguished from each other by dividing the body 110 into two parts in the second direction and the third direction, respectively. For example, referring to Figure 4A and Figure 4B , the first part P1 and the third part P3 may be connected to each other in the second direction, the first part P1 and the fourth part P4 may be connected to each other in the third direction, the second part P2 and the third part P3 may be connected to each other in the third direction, and the second part P2 and the fourth part P4 may be connected to each other in the second direction. The first part P1 may include a corner E1 where the third surface and the fifth surface intersect each other, the second part P2 may include a corner E2 where the fourth surface and the sixth surface intersect each other, the third part P3 may include a corner E3 where the fourth surface and the fifth surface intersect each other, and the fourth part P4 may include a corner E4 where the third surface and the sixth surface intersect each other. Hereinafter, the corner E1 where the third surface and the fifth surface intersect may be defined as the first corner, the corner E2 where the fourth surface and the sixth surface intersect may be defined as the second corner, the corner E3 where the fourth surface and the fifth surface intersect may be defined as the third corner, and the corner E4 where the third surface and the sixth surface intersect may be defined as the fourth corner.

[0028] The body 110 may include a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in a first direction and the dielectric layer 111 is interposed therebetween. The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that it is difficult to identify the boundary therebetween without using a scanning electron microscope (SEM).

[0029] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may be BaTiO3, (Ba 1-x Ca x)TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3 or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5).

[0030] The main body 110 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged, and a dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. That is, the first internal electrode 121 and the second internal electrode 122 (a pair of electrodes with different polarities) may be arranged opposite to each other, and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 interposed therebetween.

[0031] The metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. More preferably, Ni may be included, but the embodiments are not limited thereto.

[0032] Referring to Figure 4A , the first internal electrode 121 may include: a first main portion 123 that overlaps with the second internal electrode 122 in a first direction; a first lead portion 125 that extends from the first main portion 123, does not overlap with the second internal electrode 122, and is exposed to at least one of the third surface 3 and the fifth surface 5; and a second lead portion 127 that extends from the first main portion 123, does not overlap with the second internal electrode 122, and is exposed to at least one of the fourth surface 4 and the sixth surface 6.

[0033] The first main portion 123 may have, for example, a flat plate shape perpendicular to the first direction. The first main portion 123 may be provided in the first portion P1, the second portion P2, the third portion P3, and the fourth portion P4. The first main portion 123 may have a quadrilateral shape, but the embodiments are not limited thereto, and the edges of the first main portion 123 may be inclined or curved with respect to the second direction or the third direction.

[0034] The first lead-out portion 125 and the second lead-out portion 127 may be respectively exposed to the outer surface of the first part P1 and the outer surface of the second part P2. Although not shown, the edges of the first lead-out portion 125 connected to the first main portion 123 and the edges of the second lead-out portion 127 connected to the first main portion 123 may extend from the first main portion 123 toward the outer surface of the main body 110 in a direction inclined with respect to the second direction or the third direction.

[0035] Referring to Figure 4B , the second internal electrode 122 may include: a second main portion 124, overlapping with the first internal electrode 121 in the first direction; a third lead-out portion 126, extending from the second main portion 124, not overlapping with the first internal electrode 121 and exposed to at least one of the fourth surface 4 and the fifth surface 5; and a fourth lead-out portion 128, extending from the second main portion 124, not overlapping with the first internal electrode 121 and exposed to at least one of the third surface 3 and the sixth surface 6.

[0036] The second main portion 124 may have, for example, a flat plate shape perpendicular to the first direction. The second main portion 124 may be disposed in the first part P1, the second part P2, the third part P3, and the fourth part P4. The second main portion 124 may have a quadrilateral shape, but its embodiments are not limited thereto, and the edges of the second main portion 124 may be inclined or curved with respect to the second direction or the third direction.

[0037] The third lead-out portion 126 and the fourth lead-out portion 128 may be respectively exposed to the outer surface of the third part P3 and the outer surface of the fourth part P4. Although not shown, the edges of the third lead-out portion 126 and the fourth lead-out portion 128 connected to the second main portion 124 may extend from the second main portion 124 toward the outer surface of the main body 110 in a direction inclined with respect to the second direction or the third direction.

[0038] The average thicknesses of the dielectric layer 111 and the internal electrodes 121 and 122 are not limited to any specific examples. The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm. The average thicknesses of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0039] The average thickness of the dielectric layer 111 and the average thicknesses of the inner electrodes 121 and 122 can respectively represent the average size of the dielectric layer 111 in the first direction and the average sizes of the inner electrodes 121 and 122 in the first direction. The average thickness of the dielectric layer 111 and the average thicknesses of the inner electrodes 121 and 122 can be obtained by scanning cross-sections of the main body 110 in the first and second directions using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average thickness of the dielectric layer 111 can be obtained as follows: measuring the thickness of the dielectric layer 111 at 30 points equally spaced in the second direction of the dielectric layer 111 and taking the average value. In addition, the average thicknesses of the inner electrodes 121 and 122 can be obtained as follows: measuring the thicknesses of a plurality of points (e.g., 30 points equally spaced) in the second direction of one of the inner electrodes 121 or 122 and taking the average value. The 30 equally spaced points can be specified in the capacitance forming portion Ac. By taking the average value after performing the above thickness measurements on ten dielectric layers 111 and ten inner electrodes 121 and 122 respectively, the average thickness of the dielectric layer 111 and the average thicknesses of the inner electrodes 121 and 122 can be made more general.

[0040] The main body 110 may include: a capacitance forming portion Ac provided in the main body 110 and including a first inner electrode 121 and a second inner electrode 122 that are alternately provided with the dielectric layer 111 interposed therebetween; and a first covering portion 112 and a second covering portion 113 provided on two surfaces of the capacitance forming portion Ac that face each other in the first direction. Except that no inner electrodes are provided on the covering portions 112 and 113, the covering portions 112 and 113 may be constructed similarly to the dielectric layer 111.

[0041] The average thicknesses of the covering portions 112 and 113 are not limited to any specific example. The average thicknesses of the covering portions 112 and 113 can be, for example, less than or equal to 40 μm, less than or equal to 30 μm, or less than or equal to 20 μm. The average thicknesses of the covering portions 112 and 113 can be, for example, greater than or equal to 5 μm or greater than or equal to 10 μm. Here, the average thicknesses of the covering portions 112 and 113 can represent the average thickness of each of the first covering portion 112 and the second covering portion 113.

[0042] The average thicknesses of the covering portions 112 and 113 can represent the average size of the covering portions 112 and 113 in the first direction, and can be the average value of the first direction sizes of the covering portions 112 and 113 measured at five points equally spaced in the second direction in a cross-section of the main body 110 in the first and second directions cut from the center of the main body 110 in the third direction.

[0043] The first external electrode 131 and the second external electrode 132 can be respectively disposed on the first part P1 and the second part P2, and can be connected to the first internal electrode 121. The first external electrode 131 can be disposed on at least one of the third surface 3 and the fifth surface 5, and can be connected to the first lead-out part 125. The second external electrode 132 can be disposed on at least one of the fourth surface 4 and the sixth surface 6, and can be connected to the second lead-out part 127.

[0044] The third external electrode 133 and the fourth external electrode 134 can be respectively disposed on the third part P3 and the fourth part P4, and can be connected to the second internal electrode 122. The third external electrode 133 can be disposed on at least one of the fourth surface 4 and the fifth surface 5, and can be connected to the third lead-out part 126. The fourth external electrode 134 can be disposed on at least one of the third surface 3 and the sixth surface 6, and can be connected to the fourth lead-out part 128.

[0045] For example, the first external electrode 131 can be disposed on the third surface 3 and the fifth surface 5 and can extend to a part of the first surface 1 and a part of the second surface 2, the second external electrode 132 can be disposed on the fourth surface 4 and the sixth surface 6 and can extend to a part of the first surface 1 and a part of the second surface 2, the third external electrode 133 can be disposed on the fourth surface 4 and the fifth surface 5 and can extend to a part of the first surface 1 and a part of the second surface 2, and the fourth external electrode 134 can be disposed on the third surface 3 and the sixth surface 6 and can extend to a part of the first surface 1 and a part of the second surface 2. However, the embodiments are not limited thereto, and by including the contact electrodes described later, the external electrodes 131, 132, 133, and 134 can be disposed only on the first surface 1 and / or the second surface 2.

[0046] The types of the external electrodes 131, 132, 133, and 134 are not limited to any specific examples, and the external electrodes 131, 132, 133, and 134 can have a multilayer structure. The external electrodes 131, 132, 133, and 134 can include, for example, a base electrode layer in contact with the internal electrode 121 or 122 and a plating layer disposed on the base electrode layer. The base electrode layer can include, for example, one or more of a sintered electrode layer, a conductive resin layer, and a thin film electrode layer.

[0047] The sintered electrode layer can include a metal and a glass. The metal included in the sintered electrode layer can include one or more of Cu, Ni, Pd, Pt, Au, Ag, Pb, and their alloys, but the embodiments are not limited thereto. The glass included in the sintered electrode layer can include oxides of one or more of Ba, Ca, Zn, Al, B, and Si, but the embodiments are not limited thereto.

[0048] The conductive resin layer may include metal particles and a resin. The metal particles included in the conductive resin layer may include one or more of spherical particles and flake-shaped particles. Here, the spherical particles may have a shape that is not perfectly spherical, for example, a shape with a length ratio (major axis / minor axis) between the major axis and the minor axis greater than or equal to 1.45. The flake-shaped particles may refer to particles having a flat and elongated shape, and are not limited to any specific example. For example, the length ratio (major axis / minor axis) between the major axis and the minor axis may be greater than or equal to 1.95. The metal particles included in the conductive resin layer may include one or more of, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and their alloys. The resin included in the conductive resin layer may include one or more of, for example, epoxy resin, acrylic resin, and ethyl cellulose.

[0049] The conductive resin layer may be formed using a conductive polymer. The conductive polymer may include one or more of, for example, polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

[0050] The thin film electrode layer may be formed, for example, by using an electrolytic plating method, an electroless plating method, an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method.

[0051] The base electrode layer may be, for example, a sintered electrode layer, or may have a form in which the sintered electrode layer and the conductive resin layer are sequentially laminated, or may have a form in which the thin film electrode layer and the sintered electrode layer are sequentially laminated.

[0052] The plating layer may include at least one of, for example, Ni, Sn, Pd, and their alloys, and may include multiple layers. The plating layer may be, for example, a Ni plating layer or a Sn plating layer, and may be formed in a form in which the Ni plating layer and the Sn plating layer are sequentially formed. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0053] In the drawings (for example, Figure 1 ), the multilayer electronic component 100a may have four outer electrodes 131, 132, 133, and 134, but the embodiments are not limited thereto, and the number of outer electrodes or their shapes may vary according to the shape of the inner electrodes or other purposes.

[0054] The multilayer electronic component 100a may include connection electrodes 141, 142, 143, and 144. The connection electrodes 141, 142, 143, and 144 are provided in at least one of the first part P1, the second part P2, the third part P3, and the fourth part P4, penetrate the dielectric layer 111, and connect two first inner electrodes 121 adjacent to each other in the first direction or connect two second inner electrodes 122 adjacent to each other in the first direction.

[0055] For example, the first connection electrode 141 may be disposed in the first part P1, penetrate the dielectric layer 111, and connect two first inner electrodes 121 adjacent to each other in the first direction, and the second connection electrode 142 may be disposed in the second part P2, penetrate the dielectric layer 111, and connect two first inner electrodes 121 adjacent to each other in the first direction.

[0056] The first connection electrode 141 may penetrate the region of the main body 110 adjacent to the first corner E1 and may connect two adjacent first lead-out portions 125 among the plurality of first lead-out portions 125. The first connection electrode 141 may penetrate the following region (hereinafter referred to as the first edge region) located between two first lead-out portions 125 adjacent to each other in the first direction: the region where the third surface 3 and the second inner electrode 122 are spaced apart from each other and the region where the fifth surface 5 and the second inner electrode 122 are spaced apart from each other.

[0057] The second connection electrode 142 may penetrate the region of the main body 110 adjacent to the second corner E2 and may connect two adjacent second lead-out portions 127 among the plurality of second lead-out portions 127. The second connection electrode 142 may penetrate the following region (hereinafter referred to as the second edge region) located between two second lead-out portions 127 adjacent to each other in the first direction: the region where the fourth surface 4 and the second inner electrode 122 are spaced apart from each other and the region where the sixth surface 6 and the second inner electrode 122 are spaced apart from each other.

[0058] For example, the third connection electrode 143 may be disposed in the third part P3, penetrate the dielectric layer 111, and connect two second inner electrodes 122 adjacent to each other in the first direction, and the fourth connection electrode 144 may be disposed in the fourth part P4, penetrate the dielectric layer 111, and connect two second inner electrodes 122 adjacent to each other in the first direction.

[0059] The third connection electrode 143 may penetrate the region of the main body 110 adjacent to the third corner E3 and may connect two adjacent third lead-out portions 126 among the plurality of third lead-out portions 126. The third connection electrode 143 may penetrate the following region (hereinafter referred to as the third edge region) located between two third lead-out portions 126 adjacent to each other in the first direction: the region where the fourth surface 4 and the first inner electrode 121 are spaced apart from each other and the region where the fifth surface 5 and the first inner electrode 121 are spaced apart from each other.

[0060] The fourth connection electrode 144 can penetrate the region of the main body 110 adjacent to the fourth corner E4 and can connect two adjacent fourth lead-out portions 128 among the plurality of fourth lead-out portions 128. The fourth connection electrode 144 can penetrate the following region (hereinafter referred to as the fourth edge region) located between two fourth lead-out portions 128 adjacent to each other in the first direction: the region where the third surface 3 and the first internal electrode 121 are spaced apart from each other and the sixth surface 6 and the first internal electrode 121 are spaced apart from each other.

[0061] Generally, the connection between the internal electrode and the external electrode may be disconnected due to the shrinkage of the internal electrode during the sintering process or cracks appearing in the main body. When the number of internal electrodes among the plurality of internal electrodes that are disconnected from the external electrode increases, the capacitance of the multilayer electronic component may decrease.

[0062] According to the first embodiment, even when a part of the internal electrodes 121 and 122 shrinks due to the sintering process and loses contact with the external electrodes 131, 132, 133, and 134, the internal electrodes 121 and 122 can be electrically connected to the external electrodes 131, 132, 133, and 134 through the connection electrodes 141, 142, 143, and 144 and the internal electrodes 121 and 122 of another layer. Therefore, a decrease in the capacitance of the multilayer electronic component 100a can be prevented.

[0063] In addition, the connection electrodes 141, 142, 143, and 144 can be provided in the edge region, thereby preventing the following phenomena: a step difference formed due to the difference in the number of layers of the internal electrodes 121 and 122 located between the edge region and the capacitance forming portion Ac or the depression of the edge region due to external stress.

[0064] According to the first embodiment, in at least one of the first connection electrode 141, the second connection electrode 142, the third connection electrode 143, and the fourth connection electrode 144, a plurality of via electrodes can be stacked in the first direction, and adjacent via electrodes among the plurality of via electrodes can be offset from each other in a direction perpendicular to the first direction. For example, the first connection electrode 141 can have a plurality of first via electrodes 141a and 141b stacked in the first direction, the second connection electrode 142 can have a plurality of second via electrodes 142a and 142b stacked in the first direction, the third connection electrode 143 can have a plurality of third via electrodes 143a and 143b stacked in the first direction, and the fourth connection electrode 144 can have a plurality of fourth via electrodes (not shown) stacked in the first direction.

[0065] Refer to Figure 5, the structure in which a plurality of via electrodes 141a and 141b are offset from each other in a direction perpendicular to the first direction may indicate that in a cross-section of the main body 110 in the first direction and the third direction and / or in the first direction and the second direction, a virtual line L11a connecting the 1 / 2 points of the upper and lower surfaces of the first via electrode 141a and a virtual line L11b connecting the 1 / 2 points of the upper and lower surfaces of another first via electrode 141b adjacent in the first direction may not coincide with each other. For example, the virtual line L11a connecting the 1 / 2 points of the upper and lower surfaces of the first via electrode 141a and the virtual line L11b connecting the 1 / 2 points of the upper and lower surfaces of another first via electrode 141b adjacent in the first direction may be substantially parallel, and the distance therebetween in a direction perpendicular to the first direction may be in a range greater than 0 and less than or equal to 50% of the width of the upper surface of the first via electrode 141b.

[0066] For example, the process of forming the connection electrodes 141, 142, 143, and 144 may include the process of laminating two dielectric sheets in which via electrodes are formed. In this case, the via electrodes formed in each dielectric sheet may not be accurately aligned with each other. Therefore, two adjacent laminated via electrodes may be offset from each other in a direction perpendicular to the first direction. Different from the general method of forming connection electrodes by drilling or punching holes in the main body after sintering, in the first embodiment, the connection electrodes 141, 142, 143, and 144 may be formed by laminating dielectric sheets having via electrodes, and cracks formed in the main body 110 due to drilling can be prevented.

[0067] In the first embodiment, a plurality of connection electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 may be provided. The plurality of connection electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 may be arranged along the second direction and the third direction. Here, the plurality of connection electrodes penetrating the same dielectric layer may refer to a plurality of first connection electrodes 141, a plurality of second connection electrodes 142, a plurality of third connection electrodes 143, and a plurality of fourth connection electrodes 144 that respectively penetrate the same dielectric layer.

[0068] For example, a plurality of connection electrodes 141, 142, 143, and 144 provided at the same height may be arranged along the second direction and the third direction. Here, the plurality of connection electrodes provided at the same height may refer to a plurality of first connection electrodes 141, a plurality of second connection electrodes 142, a plurality of third connection electrodes 143, and a plurality of fourth connection electrodes 144 that are respectively provided at the same height.

[0069] The number of connection electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 is not limited to any specific example and may vary according to the size of the multilayer electronic component 100a or the size of the connection electrodes 141, 142, 143, and 144. For example, the number of connection electrodes 141, 142, 143, and 144 penetrating the same dielectric layer 111 may be greater than or equal to 5 and less than or equal to 300. Here, the number of connection electrodes 141, 142, 143, and 144 may represent the number of each of the first connection electrode 141, the second connection electrode 142, the third connection electrode 143, and the fourth connection electrode 144.

[0070] In the first embodiment, referring to Figure 5 , the width of the upper surface of the via electrodes 141a and 141b may be greater than the width of the lower surface of the via electrodes 141a and 141b. The via holes formed in the dielectric sheet may be formed, for example, by irradiating the dielectric sheet with a laser. In this case, the energy of the laser light may decrease from the surface of the dielectric sheet irradiated with the laser to the other surface. Therefore, the width of the via electrodes 141a and 141b may gradually decrease from the upper surface of the via electrodes 141a and 141b to the lower surface of the via electrodes 141a and 141b.

[0071] In the drawings (e.g., Figure 2 ), the cross-section of the via electrodes 141a and 141b may have a trapezoidal shape, but the embodiment is not limited thereto, and by controlling the irradiation conditions of the laser, the cross-section of the via electrodes 141a and 141b may have various shapes, and the side walls of the via electrodes 141a and 141b may also have a curved shape.

[0072] The maximum width of the via electrodes 141a and 141b may vary according to the size of the multilayer electronic component 100a or the thickness of the dielectric layer 111. The maximum width of the via electrodes 141a and 141b is not limited to any specific example and may be 0.03 μm to 10 μm.

[0073] Figure 6 is a perspective view of a multilayer electronic component showing a first modification example according to the first embodiment. Figure 7 is a cross-sectional view taken along the line I2-I2' in Figure 6 . Figure 8 is a cross-sectional view taken along the line II2-II2' in Figure 6 . Figure 9A is a cross-sectional view taken along the line III2-III2' in Figure 7 . Figure 9B is a cross-sectional view taken along the line IV2-IV2' in Figure 7 .

[0074] Hereinafter, referring toFigures 6 to 9B Describe a multilayer electronic component 100b according to a first modification example of the first embodiment. For components that are the same as or similar to the components of the multilayer electronic component 100a described in Figures 1 to 5 , the same or similar reference numerals will be used, and duplicate descriptions will not be provided.

[0075] The multilayer electronic component 100b may include auxiliary electrodes 151, 152, 153, and 154, which are disposed in at least one of the first part P1, the second part P2, the third part P3, and the fourth part P4 and between two via electrodes adjacent to each other in the first direction among the plurality of via electrodes.

[0076] For example, the first auxiliary electrode 151 may be disposed in the first part P1 and between two first via electrodes 141a and 141b stacked in the first direction, the second auxiliary electrode 152 may be disposed in the second part P2 and between two second via electrodes 142a and 142b stacked in the first direction, the third auxiliary electrode 153 may be disposed in the third part P3 and between two third via electrodes 143a and 143b stacked in the first direction, and the fourth auxiliary electrode 154 may be disposed in the fourth part P4 and between two fourth via electrodes (not shown) stacked in the first direction.

[0077] The first auxiliary electrode 151 may be exposed to at least one of the third surface 3 and the fifth surface 5 and connected to the first external electrode 131, the second auxiliary electrode 152 may be exposed to at least one of the fourth surface 4 and the sixth surface 6 and connected to the second external electrode 132, the third auxiliary electrode 153 may be exposed to at least one of the fourth surface 4 and the fifth surface 5 and connected to the third external electrode 133, and the fourth auxiliary electrode 154 may be exposed to at least one of the third surface 3 and the sixth surface 6 and connected to the fourth external electrode 134. However, the embodiments are not limited thereto, and the auxiliary electrodes 151, 152, 153, and 154 may be spaced apart from the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0078] The first auxiliary electrode 151 and the second auxiliary electrode 152 may be disposed at the first corner E1 and the second corner E2, respectively, and extend toward the third part P3 and the fourth part P4 along the second direction and the third direction. The first auxiliary electrode 151 and the second auxiliary electrode 152 may be disposed only at the first part P1 and the second part P2, respectively, but the embodiments are not limited thereto.

[0079] The third auxiliary electrode 153 and the fourth auxiliary electrode 154 may be respectively disposed at the third corner E3 and the fourth corner E4, and may extend along the second direction and the third direction toward the first part P1 and the second part P2. The third auxiliary electrode 153 and the fourth auxiliary electrode 154 may be respectively disposed only at the third part P3 and the fourth part P4, but the embodiments are not limited thereto.

[0080] The first auxiliary electrode 151 and the second auxiliary electrode 152 may be disposed on a plane substantially the same as that of the second inner electrode 122 and may be spaced apart from the second inner electrode 122. The third auxiliary electrode 153 and the fourth auxiliary electrode 154 may be disposed on a plane substantially the same as that of the first inner electrode 121 and may be spaced apart from the first inner electrode 121.

[0081] The first auxiliary electrode 151 may be connected to a plurality of first connection electrodes 141 that penetrate the same dielectric layer 111. The second auxiliary electrode 152 may be connected to a plurality of second connection electrodes 142 that penetrate the same dielectric layer 111. The third auxiliary electrode 153 may be connected to a plurality of third connection electrodes 143 that penetrate the same dielectric layer 111. The fourth auxiliary electrode 154 may be connected to a plurality of fourth connection electrodes 144 that penetrate the same dielectric layer 111.

[0082] By providing the auxiliary electrodes 151, 152, 153, and 154, the step difference formed due to the difference in the number of stacked inner electrodes between the edge region and the capacitance forming portion Ac can be suppressed. Therefore, the edge region can be prevented from being recessed. In addition, by appropriately providing the auxiliary electrodes 151, 152, 153, and 154, even when the via electrodes included in the connection electrodes 141, 142, 143, and 144 are excessively misaligned, the electrical connection between the adjacent inner electrodes 121 and 122 can be ensured.

[0083] The metal included in the auxiliary electrodes 151, 152, 153, and 154 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. The auxiliary electrodes 151, 152, 153, and 154 may include the same metal as that of the inner electrodes 121 and 122, but the embodiments are not limited thereto.

[0084] The distance in the second direction between the first inner electrode 121 and the third auxiliary electrode 153 may be 10% to 90% of the distance between the first main portion 123 of the first inner electrode 121 and the fourth surface 4, and the distance in the third direction between the first inner electrode 121 and the third auxiliary electrode 153 may be 10% to 90% of the distance between the first main portion 123 of the first inner electrode 121 and the fifth surface 5. This can be applied to the distance between the first main portion 123 of the first inner electrode 121 and the fourth auxiliary electrode 154, and the distances between the second main portion 124 of the second inner electrode 122 and the first auxiliary electrode 151 and the second auxiliary electrode 152.

[0085] Figure 10A and Figure 10B is a cross-sectional view showing a multilayer electronic component according to a second modified example of the first embodiment of the present disclosure, corresponding to Figure 9A and Figure 9B respectively.

[0086] Hereinafter, the multilayer electronic component 100c according to the second modified example of the first embodiment will be described with reference to Figure 10A and Figure 10B . For components that are the same / similar to those of the multilayer electronic components 100a and 100b described in Figures 1 to 9B , the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0087] Referring to Figure 10A , the first inner electrode 121c may include a first main portion 123c, a first lead portion 125c extending from the first main portion 123c and exposed to at least one of the third surface 3 and the fifth surface 5, and a second lead portion 127c extending from the first main portion 123c and exposed to at least one of the fourth surface 4 and the sixth surface 6.

[0088] Referring to Figure 10B , the second inner electrode 122c may include a second main portion 124c, a third lead portion 126c extending from the second main portion 124c and exposed to at least one of the fourth surface 4 and the fifth surface 5, and a fourth lead portion 128c extending from the second main portion 124c and exposed to at least one of the third surface 3 and the sixth surface 6.

[0089] The multilayer electronic component 100c may include auxiliary electrodes 151c, 152c, 153c, and 154c disposed between via electrodes adjacent to each other in the first direction among the plurality of via electrodes.

[0090] For example, the first auxiliary electrode 151c, the second auxiliary electrode 152c, the third auxiliary electrode 153c, and the fourth auxiliary electrode 154c may be respectively disposed in the first part P1, the second part P2, the third part P3, and the fourth part P4, and may be respectively connected to the first connection electrode 141 and the first external electrode 131, the second connection electrode 142 and the second external electrode 132, the third connection electrode 143 and the third external electrode 133, and the fourth connection electrode 144 and the fourth external electrode 134. However, embodiments thereof are not limited thereto, and the first auxiliary electrode 151c, the second auxiliary electrode 152c, the third auxiliary electrode 153c, and the fourth auxiliary electrode 154c may be spaced apart from the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134.

[0091] The second internal electrode 122c may include a first cut portion 161 and a second cut portion 162 respectively disposed in the first part P1 and the second part P2, and the first internal electrode 121c may include a third cut portion 163 and a fourth cut portion 164 respectively disposed in the third part P3 and the fourth part P4. Here, the cut portions 161, 162, 163, and 164 may be defined as regions in which the internal electrodes 121c and 122c are not provided among the internal regions defined by virtual lines formed by extending the edges of the main portions 123c and 124c.

[0092] For example, the first cut portion 161 and the second cut portion 162 may be respectively disposed at two corners of the second internal electrode 122c that are respectively disposed in the first part P1 and the second part P2, and the third cut portion 163 and the fourth cut portion 164 may be respectively disposed at two corners of the first internal electrode 121c that are respectively disposed in the third part P3 and the fourth part P4. The first main portion 123c and the second main portion 124c may be set in a "+" shape, for example, through the cut portions 161, 162, 163, and 164.

[0093] In an embodiment, the first cut portion 161, the second cut portion 162, the third cut portion 163, and the fourth cut portion 164 may have shapes corresponding to the shapes of the auxiliary electrodes 151c, 152c, 153c, and 154c. For example, as Figure 10A and Figure 10BAs shown, the first cut portion 161, the second cut portion 162, the third cut portion 163, and the fourth cut portion 164 may have a quadrilateral shape corresponding to the shapes of the auxiliary electrodes 151c, 152c, 153c, and 154c. However, the embodiments are not limited thereto, and the auxiliary electrodes 151c, 152c, 153c, and 154c may have various shapes such as an arc shape, and the first cut portion 161, the second cut portion 162, the third cut portion 163, and the fourth cut portion 164 may also have various shapes corresponding to the shapes of the auxiliary electrodes 151c, 152c, 153c, and 154c. A part of the auxiliary electrodes 151c, 152c, 153c, and 154c may be disposed in the cut portions 161, 162, 163, and 164.

[0094] Figure 11A and Figure 11B is a cross-sectional view showing a multi-layer electronic component according to a third modification example of the first embodiment of the present disclosure corresponding to Figure 9A and Figure 9B respectively.

[0095] Hereinafter, with reference to Figure 11A and Figure 11B a multi-layer electronic component 100d according to a third modification example of the first embodiment will be described. For components that are the same / similar to the components of the multi-layer electronic components 100a, 100b, and 100c described in Figures 1 to 10B the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0096] Referring to Figure 11A the first internal electrode 121d may include a first main portion 123d, a first lead portion 125d extending from the first main portion 123d and exposed to at least one of the third surface 3 and the fifth surface 5, and a second lead portion 127d extending from the first main portion 123d and exposed to at least one of the fourth surface 4 and the sixth surface 6.

[0097] Referring to Figure 11B the second internal electrode 122d may include a second main portion 124d, a third lead portion 126d extending from the second main portion 124d and exposed to at least one of the fourth surface 4 and the fifth surface 5, and a fourth lead portion 128d extending from the second main portion 124d and exposed to at least one of the third surface 3 and the sixth surface 6.

[0098] The multi-layer electronic component 100d may include auxiliary electrodes 151d, 152d, 153d, and 154d, which are disposed in at least one of the first portion P1, the second portion P2, the third portion P3, and the fourth portion P4 and between the via electrodes adjacent to each other in the first direction among the plurality of via electrodes.

[0099] For example, the first auxiliary electrode 151d, the second auxiliary electrode 152d, the third auxiliary electrode 153d, and the fourth auxiliary electrode 154d may be respectively disposed in the first part P1, the second part P2, the third part P3, and the fourth part P4, and may be respectively connected to the first connection electrode 141 and the first external electrode 131, the second connection electrode 142 and the second external electrode 132, the third connection electrode 143 and the third external electrode 133, and the fourth connection electrode 144 and the fourth external electrode 134.

[0100] The first auxiliary electrode 151d may include: a first connection portion 151d1, which is exposed to a part of the third surface 3 and a part of the fifth surface 5; a first extension portion 151d2, which is exposed to a part of the fifth surface 5, extends from the first connection portion 151d1 toward the third part P3, and the size of the first extension portion 151d2 in the third direction is smaller than the size of the first connection portion 151d1 in the third direction; and a second extension portion 151d3, which is exposed to a part of the third surface 3, extends from the first connection portion 151d1 toward the fourth part P4, and the size of the second extension portion 151d3 in the second direction is smaller than the size of the first connection portion 151d1 in the second direction.

[0101] The second auxiliary electrode 152d may include: a second connection portion 152d1, which is exposed to a part of the fourth surface 4 and a part of the sixth surface 6; a third extension portion 152d2, which is exposed to a part of the fourth surface 4, extends from the second connection portion 152d1 toward the third part P3, and the size of the third extension portion 152d2 in the second direction is smaller than the size of the second connection portion 152d1 in the second direction; and a fourth extension portion 152d3, which is exposed to a part of the sixth surface 6, extends from the second connection portion 152d1 toward the fourth part P4, and the size of the fourth extension portion 152d3 in the third direction is smaller than the size of the second connection portion 152d1 in the third direction.

[0102] The third auxiliary electrode 153d may include: a third connection portion 153d1, which is exposed to a part of the fourth surface 4 and a part of the fifth surface 5; a fifth extension portion 153d2, which is exposed to a part of the fifth surface 5, extends from the third connection portion 153d1 toward the first part P1, and the size of the fifth extension portion 153d2 in the third direction is smaller than the size of the third connection portion 153d1 in the third direction; and a sixth extension portion 153d3, which is exposed to a part of the fourth surface 4, extends from the third connection portion 153d1 toward the second part P2, and the size of the sixth extension portion 153d3 in the second direction is smaller than the size of the third connection portion 153d1 in the second direction.

[0103] The fourth auxiliary electrode 154d may include: a fourth connection portion 154d1, which is exposed to a part of the third surface 3 and a part of the sixth surface 6; a seventh extension portion 154d2, which is exposed to a part of the third surface 3, extends from the fourth connection portion 154d1 toward the first portion P1, and the size of the seventh extension portion 154d2 in the second direction is smaller than the size of the fourth connection portion 154d1 in the second direction; and an eighth extension portion 154d3, which is exposed to a part of the sixth surface 6, extends from the fourth connection portion 154d1 toward the second portion P2, and the size of the eighth extension portion 154d3 in the third direction is smaller than the size of the fourth connection portion 154d1 in the third direction.

[0104] The multilayer electronic component 100d can effectively prevent the edge region from being recessed due to external stress by including the first extension portion 151d2, the second extension portion 151d3, the third extension portion 152d2, the fourth extension portion 152d3, the fifth extension portion 153d2, the sixth extension portion 153d3, the seventh extension portion 154d2, and the eighth extension portion 154d3.

[0105] Figure 12 is a perspective view of a multilayer electronic component showing a fourth modification example according to the first embodiment of the present disclosure. Figure 13 is along Figure 12 the cross-sectional view taken along line I3-I3' in Figure 14 is along Figure 12 the cross-sectional view taken along line II3-II3' in Figure 15A is along Figure 13 the cross-sectional view taken along line III3-III3' in Figure 15B is along Figure 13 the cross-sectional view taken along line IV3-IV3' in

[0106] Hereinafter, the multilayer electronic component 100e according to the fourth modification example of the first embodiment will be described with reference to Figures 12 to 15B For components that are the same / similar to those of the multilayer electronic component 100a described in Figures 1 to 5 , the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0107] According to the fourth modification example of the first embodiment, two connection electrodes 141e, 142e, 143e, 144e adjacent to each other in the first direction may be offset from each other in a direction perpendicular to the first direction.

[0108] For example, two first connection electrodes 141e adjacent to each other in the first direction may be offset from each other in a direction perpendicular to the first direction, two second connection electrodes 142e adjacent to each other in the first direction may be offset from each other in a direction perpendicular to the first direction, two third connection electrodes 143e adjacent to each other in the first direction may be offset from each other in a direction perpendicular to the first direction, and two fourth connection electrodes 144e adjacent to each other in the first direction may be offset from each other in a direction perpendicular to the first direction.

[0109] Here, two first connection electrodes 141e adjacent to each other in the first direction may refer to: in a cross-section of the main body 110 in the first and second directions or a cross-section of the main body in the first and third directions, the first connection electrode 141e in contact with the upper surface of the same first inner electrode 121 and another first connection electrode 141e in contact with the lower surface of the same first inner electrode 121.

[0110] In addition, when a plurality of first connection electrodes 141e in contact with the upper and lower surfaces of the first inner electrode 121 are provided, two first connection electrodes 141e adjacent to each other in the first direction may refer to the first connection electrode 141e in contact with the upper surface of the same first inner electrode 121 and another first connection electrode 141e that is closest to the first connection electrode 141e in the second or third direction among the plurality of first connection electrodes 141e in contact with the lower surface of the same first inner electrode 121.

[0111] In addition, the structure in which two adjacent first connection electrodes 141e are offset from each other may mean that: in a cross-section of the main body 110 in the first and second directions or a cross-section of the main body 110 in the first and third directions, the virtual line connecting the 1 / 2 points of the upper and lower surfaces of one first connection electrode 141e does not coincide with the virtual line connecting the 1 / 2 points of the upper and lower surfaces of the other first connection electrode 141e.

[0112] According to the fourth modification example of the first embodiment, two first connection electrodes 141e adjacent to each other in the first direction may be offset from each other so that the first connection electrodes 141e can be dispersed in the first edge region. Therefore, regardless of the number of the first connection electrodes 141e, the mechanical strength of the multilayer electronic component 100e can be effectively improved.

[0113] Since the second connection electrode 142e, the third connection electrode 143e, and the fourth connection electrode 144e may have a structure similar to that of the first connection electrode 141e, a detailed description of the second connection electrode 142e, the third connection electrode 143e, and the fourth connection electrode 144e will not be provided. Unless otherwise specified, the above description of the first connection electrode 141e may be applied to the second connection electrode 142e, the third connection electrode 143e, and the fourth connection electrode 144e.

[0114] Figure 16 is a perspective view showing a multilayer electronic component according to a fifth modification example of the first embodiment. Figure 17 is along Figure 16 a sectional view taken along line I4-I4' in Figure 18 is along Figure 16 a sectional view taken along line II4-II4' in Figure 19A is along Figure 17 a sectional view taken along line III4-III4' in Figure 19B is along Figure 17 a sectional view taken along line VI4-VI4' in

[0115] Hereinafter, a multilayer electronic component 100f according to a fifth modification example of the first embodiment will be described with reference to Figures 16 to 19B For components that are the same / similar to the components of the multilayer electronic components 100a, 100b, and 100c described in Figures 1 to 10B , the same / similar reference numerals will be used, and duplicate descriptions will not be provided.

[0116] Referring to Figure 19A , the first internal electrode 121f may include: a first main portion 123f that overlaps the second internal electrode 122f in a first direction; a first lead portion 125f that is provided in a first portion P1, extends from the first main portion 123f and does not overlap the second internal electrode 122f; and a second lead portion 127f that is provided in a second portion P2, extends from the first main portion 123f and does not overlap the second internal electrode 122f.

[0117] Referring to Figure 19B , the second internal electrode 122f may include: a second main portion 124f that is provided to overlap the first internal electrode 121f in a first direction; a third lead portion 126f that is provided in a third portion P3, extends from the second main portion 124f and does not overlap the first internal electrode 121f; and a fourth lead portion 128f that is provided in a fourth portion P4, extends from the second main portion 124f and does not overlap the first internal electrode 121f.

[0118] The multi-layer electronic component 100f may include auxiliary electrodes 151f, 152f, 153f, and 154f disposed between via electrodes adjacent to each other in a first direction among a plurality of via electrodes.

[0119] For example, the first auxiliary electrode 151f, the second auxiliary electrode 152f, the third auxiliary electrode 153f, and the fourth auxiliary electrode 154f may be respectively disposed in the first cutout portion 161, the second cutout portion 162, the third cutout portion 163, and the fourth cutout portion 164, and may be respectively connected to the first connection electrode 141, the second connection electrode 142, the third connection electrode 143, and the fourth connection electrode 144. The first auxiliary electrode 151f, the second auxiliary electrode 152f, the third auxiliary electrode 153f, and the fourth auxiliary electrode 154f may be spaced apart from the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134.

[0120] The first auxiliary electrode 151f, the second auxiliary electrode 152f, the third auxiliary electrode 153f, and the fourth auxiliary electrode 154f may be respectively disposed in the first cutout portion 161, the second cutout portion 162, the third cutout portion 163, and the fourth cutout portion 164, but embodiments are not limited thereto, and a part of the auxiliary electrodes 151f, 152f, 153f, and 154f may be disposed outside the cutout portions 161, 162, 163, and 164.

[0121] The first auxiliary electrode 151f, the second auxiliary electrode 152f, the third auxiliary electrode 153f, and the fourth auxiliary electrode 154f may respectively have a shape corresponding to the shape of the first cutout portion 161, the second cutout portion 162, the third cutout portion 163, and the fourth cutout portion 164, and may have, for example, a quadrilateral shape, but embodiments are not limited thereto.

[0122] The multi-layer electronic component 100f may include contact electrodes 171, 172, and 173 disposed in at least one of the first portion P1, the second portion P2, the third portion P3, and the fourth portion P4, penetrating the covering portions 112 and 113, and connecting the first inner electrode 121f disposed in the outermost region with respect to the first direction to the first external electrode 131 or the second external electrode 132, or connecting the second inner electrode 122f disposed in the outermost region with respect to the first direction to the third external electrode 133 or the fourth external electrode 134.

[0123] For example, the first contact electrode 171 may be disposed in the first portion P1, penetrate the covering portions 112 and 113, and connect the first inner electrode 121f and / or the first auxiliary electrode 151f disposed in the outermost region with respect to the first direction to the first outer electrode 131. The second contact electrode 172 may be disposed in the second portion P2, penetrate the covering portions 112 and 113, and connect the first inner electrode 121f and / or the second auxiliary electrode 152f disposed in the outermost region with respect to the first direction to the second outer electrode 132.

[0124] The third contact electrode 173 may be disposed in the third portion P3, penetrate the covering portions 112 and 113, and connect the second inner electrode 122f and / or the third auxiliary electrode 153f disposed in the outermost region with respect to the first direction to the third outer electrode 133. A fourth contact electrode (not shown) may be disposed in the fourth portion P4, penetrate the covering portions 112 and 113, and connect the second inner electrode 122f and / or the fourth auxiliary electrode 154f disposed in the outermost region with respect to the first direction to the fourth outer electrode 134. The first to fourth contact electrodes may be disposed in the first covering portion 112 and the second covering portion 113.

[0125] The contact electrodes 171, 172, and 173 may be formed by laminating two or more layers of sheets for forming the covering portion in which via electrodes are formed. Accordingly, the contact electrodes 171, 172, and 173 may have a shape similar to that of the connection electrodes. In an embodiment, the contact electrodes 171, 172, and 173 may include a plurality of through electrodes laminated in the first direction, and two adjacent through electrodes among the plurality of through electrodes may be offset from each other in a direction perpendicular to the first direction. In the drawings, a contact electrode in which two through electrodes are laminated is shown, but the number of laminated through electrodes included in the contact electrodes 171, 172, and 173 is not limited to any specific example and may vary according to the number of sheets for forming the covering portion.

[0126] The first outer electrode 131, the second outer electrode 132, the third outer electrode 133, and the fourth outer electrode 134 may be respectively disposed on the first surface 1 and / or the second surface 2 for contact with the contact electrodes. For example, the first outer electrode 131, the second outer electrode 132, the third outer electrode 133, and the fourth outer electrode 134 may be disposed on the upper surface and / or the lower surface of the main body 110 and extend to the side surface of the main body 110. The contact electrodes may connect the inner electrodes 121 and 122 or the auxiliary electrodes 151f, 152f, 153f, and 154f disposed in the outermost region with respect to the first direction to the regions of the outer electrodes 131, 132, 133, and 134 extending to the first surface 1 and / or the second surface 2, thereby increasing the current path of the multilayer electronic component 100f and reducing the equivalent series resistance (ESR).

[0127] Since electrical connection between the inner electrodes 121f and 122f and the outer electrodes 131, 132, 133, and 134 can be ensured through the contact electrodes, the first inner electrode 121f, the second inner electrode 122f, the first auxiliary electrode 151f, the second auxiliary electrode 152f, the third auxiliary electrode 153f, and the fourth auxiliary electrode 154f can be spaced apart from the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6. Therefore, deterioration of the moisture resistance reliability of the multilayer electronic component 100f can be prevented.

[0128] Figure 20 is a perspective view of a multilayer electronic component showing a sixth modification example according to the first embodiment of the present disclosure. Figure 21 is along Figure 20 a cross-sectional view taken along line I5-I5' in Figure 22 is along Figure 20 a cross-sectional view taken along line II5-II5' in

[0129] Hereinafter, the multilayer electronic component 100g according to the sixth modification example of the first embodiment will be described with reference to Figures 20 to 22 For components that are the same as / similar to those of the multilayer electronic component 100f described in Figures 16 to 19B the same / similar reference numerals will be used, and duplicate descriptions will not be provided.

[0130] The first outer electrodes 131g1 and 131g2, the second outer electrodes 132g1 and 132g2, the third outer electrodes 133g1 and 133g2, and the fourth outer electrodes 134g1 and 134g2 can be provided on the first surface 1 and the second surface 2, respectively. The first outer electrodes 131g1, the second outer electrodes 132g1, the third outer electrodes 133g1, and the fourth outer electrodes 134g1 provided on the first surface 1 and the first outer electrodes 131g2, the second outer electrodes 132g2, the third outer electrodes 133g2, and the fourth outer electrodes 134g2 provided on the second surface 2 can be spaced apart from each other. That is, the outer electrodes of the multilayer electronic component 100g can have the form of lower electrodes.

[0131] The first outer electrodes 131g1 and 131g2, the second outer electrodes 132g1 and 132g2, the third outer electrodes 133g1 and 133g2, and the fourth outer electrodes 134g1 and 134g2 may not extend to the corresponding surfaces among the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6, but embodiments are not limited thereto, and the first outer electrodes 131g1 and 131g2, the second outer electrodes 132g1 and 132g2, the third outer electrodes 133g1 and 133g2, and / or the fourth outer electrodes 134g1 and 134g2 may extend to the corresponding surfaces among the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6.

[0132] Since the multi-layer electronic component 100g can ensure the electrical connection between the internal electrodes and the external electrodes through the contact electrodes 171, 172, and 173, the first internal electrode 121f, the second internal electrode 122f, and the auxiliary electrodes 151f, 152f, 153f, and 154f can be spaced apart from the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6. In addition, the external electrodes can be in the form of lower electrodes provided on the first surface 1 and the second surface 2, thereby improving the capacitance per unit volume and the warpage strength of the multi-layer electronic component 100g.

[0133] In addition, in the drawings, the external electrodes are shown in the form of lower electrodes provided on the first surface 1 and the second surface 2, respectively, but the embodiments are not limited thereto, and the first to fourth external electrodes can be provided on one of the first surface 1 and the second surface 2 and not provided on the other surface. That is, the first to fourth external electrodes can be provided on the first surface 1 and not provided on the second surface 2, or can be provided on the second surface 2 and not provided on the first surface 1.

[0134] (Second Embodiment) Figure 23 is a perspective view showing a multi-layer electronic component according to a second embodiment of the present disclosure. Figure 24 is an exploded perspective view of the main body of a multi-layer electronic component according to a second embodiment of the present disclosure. Figure 25 is along Figure 23 a cross-sectional view taken along line I6-I6' in Figure 26 is along Figure 23 a cross-sectional view taken along line II6-II6' in Figure 27A is along Figure 25 a cross-sectional view taken along line III6-III6' in Figure 27B is along Figure 25 a cross-sectional view taken along line IV6-IV6' in Figure 28 is a view showing Figure 25 an enlarged view of region B in

[0135] Hereinafter, the multi-layer electronic component 200a according to the second embodiment will be described with reference to Figures 23 to 28 For components that are the same / similar to those of the multi-layer electronic components 100a and 100b described in Figures 1 to 9B , the same / similar reference numerals will be used, and duplicate descriptions will not be provided.

[0136] The multilayer electronic component 200a according to the second embodiment may include a main body 210, external electrodes 231, 232, 233, and 234, and via electrodes 241a, 241b, 242a, 242b, 243a, 243b, 244a, and 244b.

[0137] The main body 210 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0138] The main body 210 may be divided into a first part P1, a second part P2, a third part P3, and a fourth part P4. The first part P1, the second part P2, the third part P3, and the fourth part P4 may be distinguished from each other by dividing the main body 110 into two parts in the second direction and the third direction, respectively. For example, referring to Figure 27A and Figure 27B , the first part P1 may include a corner E1 where the third surface and the fifth surface intersect each other, the second part P2 may include a corner E2 where the fourth surface and the sixth surface intersect each other, the third part P3 may include a corner E3 where the fourth surface and the fifth surface intersect each other, and the fourth part P4 may include a corner E4 where the third surface and the sixth surface intersect each other. Hereinafter, the corner E1 where the third surface and the fifth surface intersect may be defined as the first corner, the corner E2 where the fourth surface and the sixth surface intersect may be defined as the second corner, the corner E3 where the fourth surface and the fifth surface intersect may be defined as the third corner, and the corner E4 where the third surface and the sixth surface intersect may be defined as the fourth corner.

[0139] The main body 210 may include a first inner electrode layer 220a and a second inner electrode layer 220b that are alternately arranged in the first direction. The main body 210 may include: a capacitance forming portion Ac, which is provided in the main body 210 and forms a capacitance by including alternately arranged first inner electrodes 221 and second inner electrodes 222 and interposing a first dielectric layer 211a or a second dielectric layer 211b therebetween; and covering portions 212 and 213, which are provided on two surfaces of the capacitance forming portion Ac that face each other in the first direction.

[0140] The first inner electrode layer 220a may include: a first dielectric layer 211a; a first inner electrode 221, which is provided on the first dielectric layer 211a; and a third auxiliary electrode 253 and a fourth auxiliary electrode 254, which are provided on the first dielectric layer 211a, are spaced apart from the first inner electrode 221, and are respectively provided in the third part P3 and the fourth part P4.

[0141] The second inner electrode layer 220b may include: a second dielectric layer 211b; a second inner electrode 222 disposed on the second dielectric layer 211b; and a first auxiliary electrode 251 and a second auxiliary electrode 252 disposed on the second dielectric layer 211b, spaced apart from the second inner electrode 222 and disposed in a first portion P1 and a second portion P2, respectively.

[0142] Referring Figure 27A , the first inner electrode 221 may include: a first main portion 223 overlapping the second inner electrode 222 in a first direction; a first lead portion 225 extending from the first main portion 223, not overlapping the second inner electrode 222 and exposed to at least one of a third surface 3 and a fifth surface 5; and a second lead portion 227 extending from the first main portion 223, not overlapping the second inner electrode 222 and exposed to at least one of a fourth surface 4 and a sixth surface 6.

[0143] Referring Figure 27B , the second inner electrode 222 may include: a second main portion 224 overlapping the first inner electrode 221 in a first direction; a third lead portion 226 extending from the second main portion 224, not overlapping the first inner electrode 221 and exposed to at least one of the fourth surface 4 and the fifth surface 5; and a fourth lead portion 228 extending from the second main portion 224, not overlapping the first inner electrode 221 and exposed to at least one of the third surface 3 and the sixth surface 6.

[0144] The first auxiliary electrode 251 may be disposed between two adjacent first lead portions 225 among the plurality of first lead portions 225, the second auxiliary electrode 252 may be disposed between two adjacent second lead portions 227 among the plurality of second lead portions 227, the third auxiliary electrode 253 may be disposed between two adjacent third lead portions 226 among the plurality of third lead portions 226, and the fourth auxiliary electrode 254 may be disposed between two adjacent fourth lead portions 228 among the plurality of fourth lead portions 228.

[0145] The first auxiliary electrode 251 may be exposed to at least one of the third surface 3 and the fifth surface 5 and may be connected to the first external electrode 231, the second auxiliary electrode 252 may be exposed to at least one of the fourth surface 4 and the sixth surface 6 and may be connected to the second external electrode 232, the third auxiliary electrode 253 may be exposed to at least one of the fourth surface 4 and the fifth surface 5 and may be connected to the third external electrode 233, and the fourth auxiliary electrode 254 may be exposed to at least one of the third surface 3 and the sixth surface 6 and may be connected to the fourth external electrode 234. However, embodiments thereof are not limited thereto, and the auxiliary electrodes 251, 252, 253, and 254 may be spaced apart from the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0146] The first auxiliary electrode 251 and the second auxiliary electrode 252 may be respectively disposed on the first corner E1 and the second corner E2, and may extend along the second direction and the third direction toward the third part P3 and the fourth part P4. The first auxiliary electrode 251 and the second auxiliary electrode 252 may be respectively disposed only on the first part P1 and the second part P2, but the embodiments are not limited thereto.

[0147] The third auxiliary electrode 253 and the fourth auxiliary electrode 254 may be respectively disposed on the third corner E3 and the fourth corner E4, and may extend along the second direction and the third direction toward the first part P1 and the second part P2. The third auxiliary electrode 253 and the fourth auxiliary electrode 254 may be respectively disposed only on the third part P3 and the fourth part P4, but the embodiments are not limited thereto.

[0148] The first outer electrode 231 and the second outer electrode 232 may be respectively disposed on the first part P1 and the second part P2, and may be connected to the first inner electrode 221. The first outer electrode 231 may be disposed on at least one of, for example, the third surface 3 and the fifth surface 5, and may be connected to the first lead-out portion 225. The second outer electrode 232 may be disposed on at least one of, for example, the fourth surface 4 and the sixth surface 6, and may be connected to the second lead-out portion 227.

[0149] The third outer electrode 233 and the fourth outer electrode 234 may be respectively disposed on the third part P3 and the fourth part P4, and may be connected to the second inner electrode 222. The third outer electrode 233 may be disposed on at least one of, for example, the fourth surface 4 and the fifth surface 5, and may be connected to the third lead-out portion 226. The fourth outer electrode 234 may be disposed on at least one of, for example, the third surface 3 and the sixth surface 6, and may be connected to the fourth lead-out portion 228.

[0150] For example, the first outer electrode 231 may be disposed on the third surface 3 and the fifth surface 5 and may extend to a part of the first surface 1 and a part of the second surface 2, the second outer electrode 232 may be disposed on the fourth surface 4 and the sixth surface 6 and may extend to a part of the first surface 1 and a part of the second surface 2, the third outer electrode 233 may be disposed on the fourth surface 4 and the fifth surface 5 and may extend to a part of the first surface 1 and a part of the second surface 2, and the fourth outer electrode 234 may be disposed on the third surface 3 and the sixth surface 6 and may extend to a part of the first surface 1 and a part of the second surface 2. However, the embodiments are not limited thereto, and by including the contact structure described below, the outer electrodes 231, 232, 233, and 234 may be disposed only on the first surface 1 and / or the second surface 2.

[0151] The outer electrodes 231, 232, 233, and 234 may include, for example, a base electrode layer in contact with the inner electrodes 221, 222 and a plating layer provided on the base electrode layer. The base electrode layer may include, for example, one or more of a fired electrode layer, a conductive resin layer, and a thin film electrode layer.

[0152] The multilayer electronic component 200a according to the second embodiment may include: a first via electrode 241a provided in the first portion P1, penetrating the first dielectric layer 211a and connecting the first inner electrode 221 to the first auxiliary electrode 251; and a second via electrode 241b provided in the first portion P1, penetrating the second dielectric layer 211b and connecting the first inner electrode 221 to the first auxiliary electrode 251.

[0153] The first via electrode 241a and the second via electrode 241b may respectively penetrate regions adjacent to the first corner E1 of the first dielectric layer 211a and the second dielectric layer 211b, and may connect the first lead-out portion 225 and the first auxiliary electrode 251 to each other. The first via electrode 241a and the second via electrode 241b may penetrate an edge region where the third surface 3 and the capacitor forming portion Ac are spaced apart from each other and the fifth surface 5 and the capacitor forming portion Ac are spaced apart from each other between the first lead-out portion 225 and the first auxiliary electrode 251.

[0154] According to the second embodiment, even when a part of the first inner electrode 221 shrinks due to a sintering process and loses contact with the first outer electrode 231, the first inner electrode 221 may be electrically connected to the first outer electrode 231 through the first via electrode 241a, the second via electrode 241b, and the first inner electrode 221 of other layers. Therefore, a decrease in the capacitance of the multilayer electronic component 200a can be prevented.

[0155] According to the second embodiment, the first via electrode 241a and the second via electrode 241b may be offset from each other in a direction perpendicular to the first direction.

[0156] Referring to Figure 28 , the configuration in which the first via electrode 241a and the second via electrode 241b are offset from each other in a direction perpendicular to the first direction may mean that in a cross-section of the main body 210 in the first direction and the second direction and / or in the first direction and the third direction, a virtual line L21a connecting the 1 / 2 points of the upper and lower surfaces of the first via electrode 241a and a virtual line L21b connecting the 1 / 2 points of the upper and lower surfaces of the second via electrode 241b may not coincide with each other.

[0157] Since the first via electrode 241a and the second via electrode 241b are not aligned with each other, the via electrodes 241a and 241b can be dispersed in the edge region. Therefore, it is possible to prevent the edge region from being recessed due to the density difference between the region where the via electrodes 241a and 241b are provided and the region where the via electrodes 241a and 241b are not provided or external stress. In addition, since the via electrodes 241a and 241b are dispersed in the edge region, the mechanical strength of the multilayer electronic component 200a can be effectively improved regardless of the number of the via electrodes 241a and 241b.

[0158] In an embodiment, the first via electrode 241a and the second via electrode 241b may not overlap with each other in a first direction. When the first via electrode 241a and the second via electrode 241b are offset from each other, the expected effect of improving the mechanical strength of the multilayer electronic component 200a in the embodiment can be exhibited, and when the first via electrode 241a and the second via electrode 241b are arranged not to overlap with each other in the first direction, the effect of improving the mechanical strength can be significant.

[0159] Referring to Figure 28 , the configuration in which the first via electrode 241a and the second via electrode 241b do not overlap with each other in the first direction may mean that a virtual line TL in the first direction that contacts the second via electrode 241b at the point where the width of the second via electrode 241b is the largest may not intersect the first via electrode 241a, that is, the first via electrode 241a may be located outside the region defined by the virtual line TL.

[0160] In an embodiment, a plurality of first via electrodes 241a penetrating the same first dielectric layer 211a may be provided, and the plurality of first via electrodes 241a penetrating the same first dielectric layer 211a may be arranged along a second direction and a third direction. For example, the plurality of first via electrodes 241a provided at the same height may be arranged along the second direction and the third direction.

[0161] Similarly, a plurality of second via electrodes 241b penetrating the same second dielectric layer 211b may be provided, and the plurality of second via electrodes 241b penetrating the same second dielectric layer 211b may be arranged along the second direction and the third direction. For example, the plurality of second via electrodes 241b provided at the same height may be arranged along the second direction and the third direction.

[0162] Referring to Figure 27A and Figure 27B, a plurality of first via electrodes 241a penetrating the same first dielectric layer 211a may be arranged in a staggered manner with respect to the second direction and the third direction to form a first grid pattern LP1a, and a plurality of second via electrodes 241b penetrating the same second dielectric layer 211b may be arranged in a staggered manner with respect to the second direction and the third direction to form a second grid pattern LP1b.

[0163] The first grid pattern LP1a and the second grid pattern LP1b may be alternately disposed in the main body 210, and the first inner electrode 221 or the first auxiliary electrode 251 may be interposed therebetween. The first grid pattern LP1a and the second grid pattern LP1b may include a plurality of first via electrodes 241a and a plurality of second via electrodes 241b arranged in a zigzag pattern and may not overlap each other in the first direction, thereby effectively improving the mechanical strength of the multilayer electronic component 200a.

[0164] In an embodiment, the first dielectric layer 211a may include a first region R1 disposed between two first via electrodes 241a adjacent to each other in the second direction or the third direction among the plurality of first via electrodes 241a, and the plurality of second via electrodes 241b may overlap the first region R1 in the first direction.

[0165] In an embodiment, the width of the upper surface of the first via electrode 241a may be greater than the width of the lower surface of the first via electrode 241a, and the width of the upper surface of the second via electrode 241b may be greater than the width of the lower surface of the second via electrode 241b. The width of the first via electrode 241a may gradually decrease, for example, from the upper surface of the first via electrode 241a toward the lower surface of the first via electrode 241a, and the width of the second via electrode 241b may gradually decrease from the upper surface of the second via electrode 241b toward the lower surface of the second via electrode 241b.

[0166] The second part P2, the third part P3, and the fourth part P4 may also include via electrodes having a form similar to the form of the first via electrode 241a and the second via electrode 241b provided in the first part P1.

[0167] The multilayer electronic component 200a may include: a third via electrode 242a disposed in the second part P2, penetrating the first dielectric layer 211a and connecting the first inner electrode 221 to the second auxiliary electrode 252; and a fourth via electrode 242b disposed in the second part P2, penetrating the second dielectric layer 211b and connecting the first inner electrode 221 to the second auxiliary electrode 252. The third via electrode 242a and the fourth via electrode 242b may be offset from each other in a direction perpendicular to the first direction.

[0168] The multi-layer electronic component 200a may include: a fifth via electrode 243a, disposed in the third portion P3, penetrating the first dielectric layer 211a and connecting the second inner electrode 222 to the third auxiliary electrode 253; and a sixth via electrode 243b, disposed in the third portion P3, penetrating the second dielectric layer 211b and connecting the second inner electrode 222 to the third auxiliary electrode 253. The fifth via electrode 243a and the sixth via electrode 243b may be offset from each other in a direction perpendicular to the first direction.

[0169] The multi-layer electronic component 200a may include: a seventh via electrode 244a, disposed in the fourth portion P4, penetrating the first dielectric layer 211a and connecting the second inner electrode 222 to the fourth auxiliary electrode 254; and an eighth via electrode 244b, disposed in the fourth portion P4, penetrating the second dielectric layer 211b and connecting the second inner electrode 222 to the fourth auxiliary electrode 254. The seventh via electrode 244a and the eighth via electrode 244b may be offset from each other in a direction perpendicular to the first direction.

[0170] Referring to Figure 27A and Figure 27B , a plurality of third via electrodes 242a penetrating the same first dielectric layer 211a may be arranged in a staggered manner with respect to the second direction and the third direction and may form a third grid pattern LP2a, and a plurality of fourth via electrodes 242b penetrating the same second dielectric layer 211b may be arranged in a staggered manner with respect to the second direction and the third direction and may form a fourth grid pattern LP2b. The third grid pattern LP2a and the fourth grid pattern LP2b may include a plurality of third via electrodes 242a and a plurality of fourth via electrodes 242b respectively arranged in a zigzag pattern, and may not overlap each other in the first direction.

[0171] In an embodiment, the first dielectric layer 211a may include a second region R2 disposed between two third via electrodes 242a adjacent to each other in the second direction or the third direction among the plurality of third via electrodes 242a, and the plurality of fourth via electrodes 242b may overlap with the second region R2 in the first direction.

[0172] A plurality of fifth via electrodes 243a penetrating the same first dielectric layer 211a may be arranged in a staggered manner with respect to the second direction and the third direction, and may form a fifth grid pattern LP3a, and a plurality of sixth via electrodes 243b penetrating the same second dielectric layer 211b may be arranged in a staggered manner with respect to the second direction and the third direction, and may form a sixth grid pattern LP3b. The fifth grid pattern LP3a and the sixth grid pattern LP3b may include a plurality of fifth via electrodes 243a and a plurality of sixth via electrodes 243b respectively arranged in a zigzag pattern, and may not overlap each other in the first direction.

[0173] In an embodiment, the first dielectric layer 211a may include a third region R3 disposed between two fifth via electrodes 243a adjacent to each other in the second direction or the third direction among the plurality of fifth via electrodes 243a, and a plurality of sixth via electrodes 243b may overlap with the third region R3 in the first direction.

[0174] A plurality of seventh via electrodes 244a penetrating the same first dielectric layer 211a may be arranged in a staggered manner with respect to the second direction and the third direction and may form a seventh grid pattern LP4a, and a plurality of eighth via electrodes 244b penetrating the same second dielectric layer 211b may be arranged in a staggered manner with respect to the second direction and the third direction and may form an eighth grid pattern LP4b. The seventh grid pattern LP4a and the eighth grid pattern LP4b may include a plurality of seventh via electrodes 244a and a plurality of eighth via electrodes 244b arranged in a zigzag pattern, respectively, and may not overlap with each other in the first direction.

[0175] In an embodiment, the first dielectric layer 211a may include a fourth region R4 disposed between two seventh via electrodes 244a adjacent to each other in the second direction or the third direction among the plurality of seventh via electrodes 244a, and a plurality of eighth via electrodes 244b may overlap with the fourth region R4 in the first direction.

[0176] Hereinafter, detailed descriptions of the third via electrode 242a, the fourth via electrode 242b, the fifth via electrode 243a, the sixth via electrode 243b, the seventh via electrode 244a, and the eighth via electrode 244b will not be provided. However, unless otherwise specified, the descriptions of the first via electrode 241a and the second via electrode 241b may be applied to the third via electrode 242a, the fourth via electrode 242b, the fifth via electrode 243a, the sixth via electrode 243b, the seventh via electrode 244a, and the eighth via electrode 244b.

[0177] Figure 29A and Figure 29B are cross-sectional views showing a multi-layer electronic component according to a first modification example of the second embodiment of the present disclosure, corresponding to Figure 27A and Figure 27B respectively.

[0178] Hereinafter, with reference to Figure 29A and Figure 29B a multi-layer electronic component 200b according to a first modification example of the second embodiment will be described. For components that are the same / similar to those of the multi-layer electronic components 100c and 200a described in Figure 10A and Figure 10B as well as Figures 23 to 28 the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0179] Referring to Figure 29A , the first internal electrode 221b may include: a first main portion 223b; a first lead portion 225b extending from the first main portion 223b and exposed to at least one of the third surface 3 and the fifth surface 5; and a second lead portion 227b extending from the first main portion 223b and exposed to at least one of the fourth surface 4 and the sixth surface 6.

[0180] Referring to Figure 29B , the second internal electrode 222b may include: a second main portion 224b; a third lead portion 226b extending from the second main portion 224b and exposed to at least one of the fourth surface 4 and the fifth surface 5; and a fourth lead portion 228b extending from the second main portion 224b and exposed to at least one of the third surface 3 and the sixth surface 6.

[0181] The second internal electrode 222b may include a first cut portion 261 and a second cut portion 262 respectively provided in the first part P1 and the second part P2, and the first internal electrode 221b may include a third cut portion 263 and a fourth cut portion 264 respectively provided in the third part P3 and the fourth part P4. Here, the cut portions 261, 262, 263, and 264 may be defined as regions where the internal electrodes 221b and 222b are not provided among the internal regions defined by virtual lines formed by extending the edges of the main portions 223b and 224b.

[0182] For example, the first cut portion 261 and the second cut portion 262 may be respectively provided at two corners of the second internal electrode 222b provided in the first part P1 and the second part P2, and the third cut portion 263 and the fourth cut portion 264 may be respectively provided at two corners of the first internal electrode 221b provided in the third part P3 and the fourth part P4. The first main portion 223b and the second main portion 224b may have a "+" shape through the cut portions 261, 262, 263, and 264, for example.

[0183] In an embodiment, the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264 may respectively have shapes corresponding to the shapes of the first auxiliary electrode 251b, the second auxiliary electrode 252b, the third auxiliary electrode 253b, and the fourth auxiliary electrode 254b. For example, as Figure 29A and Figure 29BAs shown, the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264 may have a quadrilateral shape corresponding to the shapes of the auxiliary electrodes 251b, 252b, 253b, and 254b. However, the embodiments are not limited thereto, and the auxiliary electrodes 251b, 252b, 253b, and 254b may have various shapes such as an arc shape, and the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264 may have various shapes corresponding to the shapes of the auxiliary electrodes 251b, 252b, 253b, and 254b. A part of the auxiliary electrodes 251b, 252b, 253b, and 254b may be disposed in the cut portions 261, 262, 263, and 264.

[0184] Figure 30A and Figure 30B is a cross-sectional view showing a multi-layer electronic component of a second modified example according to a second embodiment of the present disclosure corresponding to Figure 27A and Figure 27B corresponding.

[0185] Hereinafter, with reference to Figure 30A and Figure 30B will be described a multi-layer electronic component 200c of a second modified example according to the second embodiment. For components that are the same / similar to the components of the multi-layer electronic components 100d and 200a described in Figure 11A and Figure 11B as well as Figures 23 to 28 the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0186] Referring to Figure 30A , the first internal electrode 221c may include: a first main portion 223c; a first lead portion 225c extending from the first main portion 223c and exposed to at least one of the third surface 3 and the fifth surface 5; and a second lead portion 227c extending from the first main portion 223c and exposed to at least one of the fourth surface 4 and the sixth surface 6.

[0187] Referring to Figure 30B , the second internal electrode 222c may include: a second main portion 224c; a third lead portion 226c extending from the second main portion 224c and exposed to at least one of the fourth surface 4 and the fifth surface 5; and a fourth lead portion 228c extending from the second main portion 224c and exposed to at least one of the third surface 3 and the sixth surface 6.

[0188] The auxiliary electrodes 251c, 252c, 253c, and 254c may be respectively disposed in the first part P1, the second part P2, the third part P3, and the fourth part P4, and may be respectively connected to the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134.

[0189] The first auxiliary electrode 251c may include: a first connection portion 251c1, which is exposed to a part of the third surface 3 and a part of the fifth surface 5; a first extension portion 251c2, which is exposed to a part of the fifth surface 5, extends from the first connection portion 251c1 toward the third portion P3, and the dimension of the first extension portion 251c2 in the third direction is smaller than the dimension of the first connection portion 251c1 in the third direction; and a second extension portion 251c3, which is exposed to a part of the third surface 3, extends from the first connection portion 251c1 toward the fourth portion P4, and the dimension of the second extension portion 251c3 in the second direction is smaller than the dimension of the first connection portion 251c1 in the second direction.

[0190] The second auxiliary electrode 252c may include: a second connection portion 252c1, which is exposed to a part of the fourth surface 4 and a part of the sixth surface 6; a third extension portion 252c2, which is exposed to a part of the fourth surface 4, extends from the second connection portion 252c1 toward the third portion P3, and the dimension of the third extension portion 252c2 in the second direction is smaller than the dimension of the second connection portion 252c1 in the second direction; and a fourth extension portion 252c3, which is exposed to a part of the sixth surface 6, extends from the second connection portion 252c1 toward the fourth portion P4, and the dimension of the fourth extension portion 252c3 in the third direction is smaller than the dimension of the second connection portion 252c1 in the third direction.

[0191] The third auxiliary electrode 253c may include: a third connection portion 253c1, which is exposed to a part of the fourth surface 4 and a part of the fifth surface 5; a fifth extension portion 253c2, which is exposed to a part of the fifth surface 5, extends from the third connection portion 253c1 toward the first portion P1, and the dimension of the fifth extension portion 253c2 in the third direction is smaller than the dimension of the third connection portion 253c1 in the third direction; and a sixth extension portion 253c3, which is exposed to a part of the fourth surface 4, extends from the third connection portion 253c1 toward the second portion P2, and the dimension of the sixth extension portion 253c3 in the second direction is smaller than the dimension of the third connection portion 253c1 in the second direction.

[0192] The fourth auxiliary electrode 254c may include: a fourth connection portion 254c1, which is exposed to a part of the third surface 3 and a part of the sixth surface 6; a seventh extension portion 254c2, which is exposed to a part of the third surface 3, extends from the fourth connection portion 254c1 toward the first portion P1, and the dimension of the seventh extension portion 254c2 in the second direction is smaller than the dimension of the fourth connection portion 254c1 in the second direction; and an eighth extension portion 254c3, which is exposed to a part of the sixth surface 6, extends from the fourth connection portion 254c1 toward the second portion P2, and the dimension of the eighth extension portion 254c3 in the third direction is smaller than the dimension of the fourth connection portion 254c1 in the third direction.

[0193] The multilayer electronic component 200c can effectively prevent the edge region from being recessed due to external stress by including a first extension portion 251c2, a second extension portion 251c3, a third extension portion 252c2, a fourth extension portion 252c3, a fifth extension portion 253c2, a sixth extension portion 253c3, a seventh extension portion 254c2, and an eighth extension portion 254c3.

[0194] Figure 31 is a perspective view of a multilayer electronic component showing a third modified example according to a second embodiment of the present disclosure. Figure 32 is along Figure 31 a sectional view taken along line I7-I7' in Figure 33 is along Figure 31 a sectional view taken along line II7-II7' in Figure 34A is along Figure 32 a sectional view taken along line III7-III7' in Figure 34B is along Figure 32 a sectional view taken along line IV7-IV7' in

[0195] Hereinafter, the multilayer electronic component 200d according to the third modified example of the second embodiment will be described with reference to Figures 31 to 34B For components that are the same / similar to those of the multilayer electronic components 100f and 200a described in Figures 16 to 19B as well as Figures 23 to 28 the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0196] Referring to Figure 34A , the first internal electrode 221d may include: a first main portion 223d that overlaps the second internal electrode 222d in a first direction; a first lead portion 225d that is provided in a first portion P1 and extends from the first main portion 223d and does not overlap the second internal electrode 222d; and a second lead portion 227d that is provided in a second portion P2 and extends from the first main portion 223d and does not overlap the second internal electrode 222d.

[0197] Referring to Figure 34B , the second internal electrode 222d may include: a second main portion 224d that overlaps the first internal electrode 221d in a first direction; a third lead portion 226d that is provided in a third portion P3 and extends from the second main portion 224d and does not overlap the first internal electrode 221d; and a fourth lead portion 228d that is provided in a fourth portion P4 and extends from the second main portion 224d and does not overlap the first internal electrode 221d.

[0198] The second inner electrode 222d may include a first cut portion 261 and a second cut portion 262 respectively provided in the first part P1 and the second part P2, and the first inner electrode 221d may include a third cut portion 263 and a fourth cut portion 264 respectively provided in the third part P3 and the fourth part P4.

[0199] The first auxiliary electrode 251d, the second auxiliary electrode 252d, the third auxiliary electrode 253d, and the fourth auxiliary electrode 254d may be respectively provided in the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264. The first auxiliary electrode 251d, the second auxiliary electrode 252d, the third auxiliary electrode 253d, and the fourth auxiliary electrode 254d may be spaced apart from the first outer electrode 231, the second outer electrode 232, the third outer electrode 233, and the fourth outer electrode 234 respectively. The first auxiliary electrode 251d, the second auxiliary electrode 252d, the third auxiliary electrode 253d, and the fourth auxiliary electrode 254d may be respectively provided in the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264, but the embodiments are not limited thereto, and a part of the auxiliary electrodes 251d, 252d, 253d, and 254d may be provided outside the cut portions 261, 262, 263, and 264.

[0200] The first auxiliary electrode 251d, the second auxiliary electrode 252d, the third auxiliary electrode 253d, and the fourth auxiliary electrode 254d may respectively have shapes corresponding to the shapes of the first cut portion 261, the second cut portion 262, the third cut portion 263, and the fourth cut portion 264, and may have, for example, a square shape, but the embodiments are not limited thereto.

[0201] The multilayer electronic component 200d may include a first contact structure 271. The first contact structure 271 is provided in the first part P1, penetrates the covering portions 212 and 213, and connects the first inner electrode 221d and / or the first auxiliary electrode 251d provided in the outermost region with respect to the first direction to the first outer electrode 231.

[0202] The first contact structure 271 may include a first through electrode 271a and a first dummy electrode 271b alternately provided in the first direction. The first dummy electrode 271b may be connected to the first outer electrode 231 located on the third surface 3 and the fifth surface 5, but the embodiments are not limited thereto. The first contact structure 271 may be respectively provided in the first covering portion 212 and the second covering portion 213.

[0203] The first contact structure 271 can be formed in a similar manner to the auxiliary electrode and the via electrode. For example, the first contact structure 271 can be formed by forming a dummy electrode pattern on a sheet for forming a covering portion in which a via electrode is formed, and laminating two or more sheets for forming a covering portion on which a dummy electrode pattern is formed.

[0204] The first contact structure 271 can have a structure similar to that of the auxiliary electrode and the via electrode. For example, a plurality of first through electrodes 271a can be provided, and the plurality of first through electrodes 271a can be arranged along the second direction and the third direction. For example, the plurality of first through electrodes 271a provided at the same height can have a first grid pattern or a second grid pattern. Two first through electrodes 271a adjacent to each other in the first direction may not overlap each other in the first direction.

[0205] Similarly, the multilayer electronic component 200d can include a second contact structure 272, which is provided in the second portion P2, penetrates the covering portions 212 and 213, and connects the first inner electrode 221d and / or the second auxiliary electrode 252d provided in the outermost region with respect to the first direction to the second outer electrode 232. The second contact structure 272 can include second through electrodes 272a and first dummy electrodes 272b alternately provided in the first direction. The second contact structure 272 can be respectively provided in the first covering portion 212 and the second covering portion 213.

[0206] The multilayer electronic component 200d can include a third contact structure 273, which is provided in the third portion P3, penetrates the covering portions 212 and 213, and connects the second inner electrode 222d and / or the third auxiliary electrode 253d provided in the outermost region with respect to the first direction to the third outer electrode 233. The third contact structure 273 can include third through electrodes 273a and third dummy electrodes 273b alternately provided in the first direction. The third contact structure 273 can be respectively provided in the first covering portion 212 and the second covering portion 213.

[0207] The multilayer electronic component 200d can include a fourth contact structure (not shown), which is provided in the fourth portion P4, penetrates the covering portions 212 and 213, and connects the second inner electrode 222d and / or the fourth auxiliary electrode 254d provided in the outermost region with respect to the first direction to the fourth outer electrode 234. The fourth contact structure can include fourth through electrodes and fourth dummy electrodes alternately provided in the first direction. The fourth contact structure can be respectively provided in the first covering portion 212 and the second covering portion 213.

[0208] In the following, a detailed description of the second to fourth contact structures will not be provided. However, the second to fourth contact structures may be constructed similarly to the first contact structure. Therefore, unless otherwise specified, the description of the first contact structure 271 may be applied to the second to fourth contact structures.

[0209] In order to contact the contact structures, the first outer electrode 231, the second outer electrode 232, the third outer electrode 233, and the fourth outer electrode 234 may be disposed on the first surface 1 and / or the second surface 2, respectively. The first outer electrode 231, the second outer electrode 232, the third outer electrode 233, and the fourth outer electrode 234 may be disposed on the upper surface and / or the lower surface of the main body 210 and may extend to the side surface of the main body 210.

[0210] Since electrical connection between the inner electrodes 221d, 222d and the outer electrodes 231, 232, 233, and 234 can be ensured through the contact structures, the first inner electrode 221d and the second inner electrode 222d may be spaced apart from the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6. That is, the first lead portion 225d, the second lead portion 227d, the third lead portion 226d, and the fourth lead portion 228d may be spaced apart from the outer surface of the main body 210. Therefore, deterioration of the moisture resistance reliability of the multilayer electronic component 200d can be prevented.

[0211] Figure 35 FIG. is a perspective view of a multilayer electronic component showing a fourth modification example according to the second embodiment. Figure 36 is along Figure 35 a cross-sectional view taken along line I8-I8' in Figure 37 is along Figure 35 a cross-sectional view taken along line II8-II8' in

[0212] In the following, reference will be made to Figures 35 to 37 describe the multilayer electronic component 200e of the fourth modification example according to the second embodiment. For components that are the same / similar to those of the multilayer electronic components 100g and 200d described in Figures 20 to 22 as well as Figures 31 to 34B the same / similar reference numerals will be used, and repeated descriptions will not be provided.

[0213] The first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and the fourth external electrodes 234e1 and 234e2 can be respectively disposed on the first surface 1 and the second surface 2. The first external electrodes 231e1, the second external electrodes 232e1, the third external electrodes 233e1, and the fourth external electrodes 234e1 disposed on the first surface 1 and the first external electrodes 231e2, the second external electrodes 232e2, the third external electrodes 233e2, and the fourth external electrodes 234e2 disposed on the second surface 2 can be spaced apart from each other. That is, the external electrodes of the multilayer electronic component 200e can have the form of lower electrodes.

[0214] The first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and the fourth external electrodes 234e1 and 234e2 may not extend to the corresponding surfaces among the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6, but the embodiments are not limited thereto, and the first external electrodes 231e1 and 231e2, the second external electrodes 232e1 and 232e2, the third external electrodes 233e1 and 233e2, and / or the fourth external electrodes 234e1 and 234e2 may extend to the corresponding surfaces among the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6.

[0215] Since the multilayer electronic component 200e can ensure the electrical connection between the internal electrodes and the external electrodes through the contact structures 271, 272, and 273, the first internal electrode 221d and the second internal electrode 222d can be spaced apart from the third surface 3, the third surface 4, the third surface 5, and the sixth surface 6. In addition, since the external electrodes have the form of lower electrodes disposed on the first surface 1 and the second surface 2, the capacitance per unit volume and the warpage strength of the multilayer electronic component 200e can be improved.

[0216] In the drawings, the form of the lower electrodes in which the external electrodes are respectively disposed on the first surface 1 and the second surface 2 is shown, but the embodiments are not limited thereto, and the first to fourth external electrodes can be disposed on one of the first surface 1 and the second surface 2 and may not be disposed on the other surface. That is, the first to fourth external electrodes can be disposed on the first surface 1 and may not be disposed on the second surface 2, or can be disposed on the second surface 2 and may not be disposed on the first surface 1.

[0217] (Method for manufacturing a multilayer electronic component) Figure 38 is a cross-sectional view showing a filling process and a printing process for manufacturing a multilayer electronic component according to the first embodiment or the second embodiment.

[0218] Hereinafter, referring to Figure 38, an example of a method for manufacturing the multilayer electronic component 100a according to the first embodiment or the multilayer electronic component 200a according to the second embodiment will be described.

[0219] A method for manufacturing a multilayer electronic component will be described for the multilayer electronic component 100a according to the first embodiment or the multilayer electronic component 200a according to the second embodiment, and unless otherwise specified, this method can be applied to the multilayer electronic components 100b, 100c, 100d, 100e, 100f, and 100g of the first to sixth modified examples according to the first embodiment and the multilayer electronic components 200b, 200c, 200d, and 200e of the first to fourth modified examples according to the second embodiment.

[0220] Hereinafter, each process of the method for manufacturing a multilayer electronic component will be described.

[0221] (Process of preparing a dielectric sheet) Dielectric powder for forming the dielectric sheet 10 can be prepared. Examples of the dielectric powder can include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). For example, BaTiO3 powder can be synthesized by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. The method for synthesizing the dielectric powder can include, for example, the solid-state method, the sol-gel method, the hydrothermal synthesis method, etc., but the embodiments are not limited thereto.

[0222] Thereafter, the prepared dielectric powder can be dried and pulverized, and can be mixed with an organic solvent such as ethanol and a binder such as polyvinyl butyral to manufacture a dielectric slurry, and the dielectric slurry can be coated on a carrier film and dried, thereby manufacturing the dielectric sheet 10.

[0223] The dielectric sheet 10 can form a dielectric layer by firing the unit laminate described later.

[0224] (Process of forming a via electrode) For example, the manufactured dielectric sheet 10 can be continuously supplied by the following method: the dielectric sheet 10 is conveyed from a supply roll (not shown) around which the dielectric sheet 10 is wound to a rewinding roll (not shown) that rewinds the dielectric sheet 10.

[0225] In this case, via holes 20 can be formed in the continuously supplied dielectric sheet 10. For example, the process of forming the via holes 20 can be performed by irradiating the dielectric sheet 10 with a laser. The laser can be irradiated from a laser device 50 provided on the dielectric sheet 10.

[0226] The type of the laser device 50 is not limited to any specific example, and a CO2 laser, a YAG laser, a femtosecond laser, or a picosecond UV laser can be used. The via holes 20 can be formed by laser processing such that the via holes 20 have a tapered shape in which the width can gradually decrease from one surface of the dielectric sheet 10 to the other surface.

[0227] (Filling process) Thereafter, a filling process of filling the via holes 20 with an electrode paste EP can be performed. The electrode paste EP can include, for example, metal powder, binder, organic solvent, etc.

[0228] The method of filling the via holes 20 with the electrode paste EP is not limited to any specific example. For example, as Figure 38 shown, the dielectric sheet 10 can pass between a coating roll 61 and a cylinder 71. The coating roll 61 can be in contact with the electrode paste EP, and the electrode paste EP can be filled into recesses (not shown) formed on the outer surface of the coating roll 61 by the rotational drive of the coating roll 61.

[0229] In addition, the coating roll 61 and the cylinder 71 can apply pressure to the dielectric sheet 10 by rotating in opposite directions. The electrode paste EP coated on the outer surface of the coating roll 61 can be filled into the via holes 20 formed in the moving dielectric sheet 10 by the pressure. The electrode paste EP filled into the via holes 20 can form via electrodes by firing the unit laminate described later.

[0230] An excess of the electrode paste EP coated on the outer surface of the coating roll 61 can be removed using a doctor blade DB.

[0231] (Printing process) A printing process for printing an internal electrode pattern 30 connected to the via electrodes on the dielectric sheet 10 can be performed. The method for forming the internal electrode pattern 30 is not limited to any specific example. For example, the internal electrode pattern 30 can be formed using the coating roll 61 and the cylinder 71. That is, the printing process can include a process for supplying the electrode paste EP to the outer surface of the coating roll 61, and a process for coating the electrode paste EP on the dielectric sheet 10 by bringing the dielectric sheet 10 into contact with the coating roll 61.

[0232] In this case, by controlling the shape of the concave portions (not shown) formed on the outer surface of the coating roller 61, the via holes 20 can be filled with the electrode paste EP to form via electrodes, and at the same time, the inner electrode patterns 30 can be formed. That is, in the embodiment, the filling process and the printing process can be performed simultaneously. A drying device can be used to dry the printed inner electrode patterns 30.

[0233] The inner electrode patterns 30 can form inner electrodes by firing the unit laminate described later. In addition, although not shown, auxiliary electrode patterns can also be formed in the same manner as the inner electrode patterns 30, and the auxiliary electrode patterns form auxiliary electrodes by firing the unit laminate.

[0234] (Lamination process) To form the multilayer electronic component 100a according to the first embodiment, a predetermined number of dielectric sheets 10 printed with different inner electrode patterns 30 can be laminated to form a laminate. To form the connection electrodes 141, 142, 143, and 144, the via electrodes formed in different dielectric sheets 10 can be aligned during the lamination process. However, the via electrodes formed in each dielectric sheet 10 may not be accurately aligned with each other. Therefore, the laminated via electrodes can be laminated in such a way that their central axes are offset from each other. In addition, since the via electrodes can have a tapered shape, it is possible to easily align the via electrodes formed in different dielectric sheets 10.

[0235] To form the multilayer electronic component 200a according to the second embodiment, a predetermined number of dielectric sheets 10 printed with different inner electrode patterns 30 can be laminated to form a laminate. In addition, auxiliary electrode patterns can be appropriately formed on the dielectric sheets 10.

[0236] For the laminate used to form the multilayer electronic component 200a according to the second embodiment, auxiliary electrode patterns can be included so that it is not necessary to align the via electrodes formed on different dielectric sheets 10, thereby ensuring process convenience.

[0237] On the upper and lower portions of the laminate in the first direction, sheets for forming the covering portion in which no inner electrode patterns and auxiliary electrode patterns are formed can be laminated in a predetermined number of layers to form a covering portion after firing.

[0238] To form the multilayer electronic components 100e, 100f, and 100g according to the fourth to sixth modification examples of the first embodiment, sheets for forming the covering portion in which via electrodes are formed can be laminated in a predetermined number of layers on the upper and lower portions of the laminate in the first direction.

[0239] To manufacture the multilayer electronic components 200c, 200d, and 200e according to the second to fourth modified examples of the second embodiment, sheets for forming a covering portion in which via electrodes and dummy electrode patterns are formed may be laminated in a predetermined number of layers on the upper and lower portions of the laminate in the first direction.

[0240] (Cutting and firing process) Thereafter, the laminate may be pressed, and the laminate may be cut along a plurality of cutting lines to obtain unit laminates. Further, the unit laminates may be fired to obtain a body. The firing may be performed at a temperature of, for example, greater than or equal to 1000°C and less than or equal to 1400°C, but the embodiments are not limited thereto.

[0241] (Process of forming an external electrode) Thereafter, an external electrode may be formed on the body. The method of forming the external electrode is not limited to any specific example.

[0242] When the external electrode includes a fired electrode layer, the process of forming the external electrode may include the following process: dipping the body in a fired paste including metal powder, glass frit, binder, and organic solvent, and firing the fired paste at a temperature of 500°C to 900°C.

[0243] However, the embodiments are not limited thereto, and to manufacture the multilayer electronic components 100f, 100g, 200d, and 200e having contact electrodes (or contact structures) according to the fifth and sixth modified examples of the first embodiment and the third and fourth modified examples of the second embodiment, the process of forming the external electrode may include a process of transferring a sheet including metal to the body.

[0244] When the external electrode includes a conductive resin layer, the process of forming the external electrode may include the following process: dipping the body in a conductive resin composition including metal powder, resin, binder, and organic solvent, and performing a curing heat treatment at a temperature of 250°C to 550°C.

[0245] When the external electrode includes a thin film electrode layer, the process of forming the external electrode may include a process of performing an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method.

[0246] In addition, electrolytic plating and / or electroless plating may be further performed to form a plating layer.

[0247] Figures 39 to 41 is a cross-sectional view showing Figure 38 a modified example of.

[0248] Hereinafter, with reference to Figures 39 to 41 a modified example of a method for manufacturing a multilayer electronic component according to the first embodiment or the second embodiment will be described.

[0249] For components that are the same as or similar to the components described in Figure 38 the same or similar reference numerals will be used, and duplicate descriptions will not be provided.

[0250] Referring to Figure 39 , the process of forming the via hole 20 can be performed by bringing the dielectric sheet 10 into contact with the imprint roller 80, which has protrusions 81 provided on its outer surface.

[0251] Specifically, the dielectric sheet 10 can pass between the imprint roller 80 and the cylinder 72. In this case, the imprint roller 80 and the cylinder 72 can apply pressure to the dielectric sheet 10 by rotating in opposite directions. The via hole 20 can be formed in the dielectric sheet 10 by the pressure and the protrusions 81.

[0252] The protrusions 81 formed on the outer surface of the imprint roller 80 can have a pattern corresponding to the grid pattern of the via hole electrode.

[0253] Referring to Figure 40 , after forming the via hole 20 by irradiating the dielectric sheet 10 with a laser, the electrode paste EP can be filled into the via hole 20 using the coating roller 61 and the cylinder 71.

[0254] Thereafter, the electrode paste EP can be coated on the dielectric sheet 10 using the coating roller 62 and the cylinder 73, and the inner electrode pattern 30 can be formed separately. That is, the filling process and the printing process can be performed in sequence.

[0255] Referring to Figure 41 , the via hole 20 can be formed in the dielectric sheet 10 using the imprint roller 80 provided with the protrusions 81 and the cylinder 72, and the electrode paste EP can be filled into the via hole 20 using the coating roller 61 and the cylinder 71.

[0256] Specifically, the dielectric sheet 10 can pass between the imprint roller 80 and the cylinder 72. In this case, the imprint roller 80 and the cylinder 72 can apply pressure to the dielectric sheet 10 by rotating in opposite directions, and thus, the via hole 20 can be formed in the dielectric sheet 10.

[0257] Thereafter, the electrode paste EP can be coated on the dielectric sheet 10 using the coating roller 62 and the cylinder 73, and the inner electrode pattern 30 can be formed separately. That is, the filling process and the printing process can be performed in sequence.

[0258] According to the foregoing embodiments, a multilayer electronic component having excellent mechanical strength and electrical characteristics can be provided.

[0259] The embodiments do not necessarily limit the scope of the present disclosure to the specific forms of the embodiments. Instead, modifications, equivalents, and alternatives included in the concept and technical scope disclosed in this specification can be adopted.

[0260] In an embodiment, the term "embodiment" does not refer to an identical embodiment and may be provided to describe and emphasize different unique features of each embodiment. The presented embodiments may be implemented without excluding the possibility of combining features with other embodiments. For example, unless otherwise stated, even if a feature described in an embodiment is not described in another embodiment, the description may be understood as being relevant to the other embodiment.

[0261] The terms "first", "second", etc. may be used to distinguish one element from another element and may not limit the order and / or importance, etc. associated with the element. In some cases, without departing from the scope of the exemplary embodiments, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0262] Although the embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: A body, comprising a dielectric layer and first and second inner electrodes alternately arranged, wherein the dielectric layer is interposed between the first and second inner electrodes, and comprises a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first, second, third and fourth surfaces and opposite to each other in a third direction, wherein the body comprises a first portion, a second portion, a third portion and a fourth portion; A first external electrode and a second external electrode, disposed on the first portion and the second portion, respectively, and connected to the first internal electrode; a third external electrode and a fourth external electrode, disposed on the third portion and the fourth portion, respectively, and connected to the second internal electrode; as well as a connecting electrode, disposed in at least one of the first portion, the second portion, the third portion, and the fourth portion, penetrating the dielectric layer, connecting two first inner electrodes adjacent to each other in the first direction, or connecting two second inner electrodes adjacent to each other in the first direction, wherein the first portion and the third portion are connected to each other in the second direction, the first portion and the fourth portion are connected to each other in the third direction, the second portion and the third portion are connected to each other in the third direction, and the second portion and the fourth portion are connected to each other in the second direction, wherein the first portion includes a corner where the third surface and the fifth surface intersect each other, the second portion includes a corner where the fourth surface and the sixth surface intersect each other, the third portion includes a corner where the fourth surface and the fifth surface intersect each other, the fourth portion includes a corner where the third surface and the sixth surface intersect each other, and The connection electrode includes a plurality of via electrodes stacked in the first direction, and via electrodes adjacent to each other in the first direction among the plurality of via electrodes are offset from each other in a direction perpendicular to the first direction.

2. The multilayer electronic component according to claim 1, wherein A plurality of the connecting electrodes penetrating the same dielectric layer are provided.

3. The multilayer electronic component according to claim 2, wherein: The plurality of connection electrodes penetrating the same dielectric layer are arranged along the second direction and the third direction.

4. The multilayer electronic component according to claim 1, in, The first internal electrode includes: a first main portion overlapping the second internal electrode in the first direction; a first lead portion extending from the first main portion, not overlapping the second internal electrode in the first direction, and extending to at least one of the third surface and the fifth surface; and a second lead portion extending from the first main portion, not overlapping the second internal electrode in the first direction, and extending to at least one of the fourth surface and the sixth surface, and The second inner electrode comprises: a second main portion, overlapping with the first inner electrode in the first direction; a third lead portion, extending from the second main portion, not overlapping with the first inner electrode in the first direction, and extending to at least one of the fourth surface and the fifth surface; and a fourth lead portion, extending from the second main portion, not overlapping with the first inner electrode in the first direction, and extending to at least one of the third surface and the sixth surface.

5. The multilayer electronic component according to claim 1, further comprising: An auxiliary electrode is provided in at least one of the first portion, the second portion, the third portion, and the fourth portion, and is provided between via electrodes adjacent to each other in the first direction among the plurality of via electrodes.

6. The multilayer electronic component according to claim 1, in, The second internal electrode includes a first cutout portion and a second cutout portion respectively disposed in the first portion and the second portion, and The first internal electrode includes a third cutout portion and a fourth cutout portion which are respectively disposed in the third portion and the fourth portion.

7. The multilayer electronic component according to claim 6, further comprising: an auxiliary electrode disposed in at least one of the first portion, the second portion, the third portion, and the fourth portion, and disposed between via electrodes adjacent to each other in the first direction among the plurality of via electrodes, Here, each of the first cutout portion, the second cutout portion, the third cutout portion, and the fourth cutout portion has a shape corresponding to a shape of the auxiliary electrode.

8. The multilayer electronic component according to claim 6, further comprising: a first auxiliary electrode disposed in the first portion and disposed between via electrodes adjacent to each other in the first direction among the plurality of via electrodes, Wherein, the first auxiliary electrode includes: a first connecting portion, extending to a portion of the third surface and a portion of the fifth surface; a first extending portion, extending from the first connecting portion toward the third portion, extending to a portion of the fifth surface, and a size of the first extending portion in the third direction is smaller than a size of the first connecting portion in the third direction; and a second extending portion, extending from the first connecting portion toward the fourth portion, extending to a portion of the third surface, and a size of the second extending portion in the second direction is smaller than a size of the first connecting portion in the second direction.

9. The multilayer electronic component according to claim 1, in, The first inner electrode and the second inner electrode are spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface, wherein the second internal electrode comprises a first cutout portion and a second cutout portion respectively disposed in the first portion and the second portion, wherein the first internal electrode comprises a third cutout portion and a fourth cutout portion respectively disposed in the third portion and the fourth portion, and The multilayer electronic component further includes an auxiliary electrode, which is arranged in at least one of the first cutout portion, the second cutout portion, the third cutout portion and the fourth cutout portion, and is arranged between the via electrodes adjacent to each other in the first direction among the plurality of via electrodes.

10. The multilayer electronic component according to claim 1, in, Two of the connection electrodes adjacent to each other in the first direction are offset from each other in the direction perpendicular to the first direction.

11. The multilayer electronic component according to claim 1 or 9, in, The body includes a capacitor forming portion and a covering portion, in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, and the dielectric layer is interposed between the first internal electrodes and the second internal electrodes, and the covering portion is arranged on both surfaces of the capacitor forming portion in the first direction, and Among them, the multilayer electronic component also includes a contact electrode, which is arranged in at least one of the first part, the second part, the third part and the fourth part, penetrates the covering part, and connects the first inner electrode arranged in the outermost area relative to the first direction to the first outer electrode or the second outer electrode, or connects the second inner electrode arranged in the outermost area relative to the first direction to the third outer electrode or the fourth outer electrode.

12. The multilayer electronic component according to claim 11, in, The contact electrode includes a plurality of through electrodes stacked in the first direction, and Wherein, two mutually adjacent through electrodes among the plurality of through electrodes are offset from each other in the direction perpendicular to the first direction.

13. The multilayer electronic component according to claim 11, in, The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are respectively disposed on the first surface and the second surface, and The first external electrode, the second external electrode, the third external electrode and the fourth external electrode disposed on the first surface are spaced apart from the first external electrode, the second external electrode, the third external electrode and the fourth external electrode disposed on the second surface.

14. The multilayer electronic component according to claim 11, wherein The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed on one of the first surface and the second surface, and are not disposed on the other surface.

15. The multilayer electronic component according to claim 1, wherein Dimensions of the multilayer electronic component in the first direction, the second direction, and the third direction are defined as T, L, and W, respectively, and each of T / L and T / W satisfies less than or equal to 0.

6.

16. The multilayer electronic component according to claim 15, wherein T, L, and W refer to maximum dimensions of the multilayer electronic component in the first direction, the second direction, and the third direction, respectively.

17. A multilayer electronic component comprising: A body, comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the body comprising a first part, a second part, a third part and a fourth part, The body includes a first inner electrode layer, the first inner electrode layer includes a first dielectric layer, a first inner electrode disposed on the first dielectric layer, and a third auxiliary electrode and a fourth auxiliary electrode disposed on the first dielectric layer, the third auxiliary electrode and the fourth auxiliary electrode being spaced apart from the first inner electrode and disposed on the third portion and the fourth portion, respectively, The body includes a second inner electrode layer, the second inner electrode layer includes a second dielectric layer, a second inner electrode disposed on the second dielectric layer, and a first auxiliary electrode and a second auxiliary electrode disposed on the second dielectric layer, the first auxiliary electrode and the second auxiliary electrode being spaced apart from the second inner electrode and disposed in the first portion and the second portion, respectively, In the body, the first internal electrode layers and the second internal electrode layers are alternately arranged in the first direction; A first external electrode and a second external electrode, disposed on the first portion and the second portion, respectively, and connected to the first internal electrode; a third external electrode and a fourth external electrode, disposed on the third portion and the fourth portion, respectively, and connected to the second internal electrode; a first via electrode, disposed on the first portion, penetrating the first dielectric layer and connecting the first inner electrode to the first auxiliary electrode; as well as a second via electrode, disposed on the first portion, penetrating the second dielectric layer and connecting the first inner electrode to the first auxiliary electrode; wherein the first portion and the third portion are connected to each other in the second direction, the first portion and the fourth portion are connected to each other in the third direction, the second portion and the third portion are connected to each other in the third direction, and the second portion and the fourth portion are connected to each other in the second direction, wherein the first portion includes a corner where the third surface and the fifth surface intersect each other, the second portion includes a corner where the fourth surface and the sixth surface intersect each other, the third portion includes a corner where the fourth surface and the fifth surface intersect each other, the fourth portion includes a corner where the third surface and the sixth surface intersect each other, and The first via electrode and the second via electrode are offset from each other in a direction perpendicular to the first direction.

18. The multilayer electronic component according to claim 17, wherein: The first via electrode and the second via electrode do not overlap each other in the first direction.

19. The multilayer electronic component according to claim 17, in, A plurality of first via electrodes penetrating the same first dielectric layer are provided, and a plurality of second via electrodes penetrating the same second dielectric layer are provided, and The first via electrodes penetrating the same first dielectric layer are arranged along the second direction and the third direction, and the second via electrodes penetrating the same second dielectric layer are arranged along the second direction and the third direction.

20. The multilayer electronic component according to claim 19, in, The first dielectric layer includes a first region disposed between two first via electrodes adjacent to each other in the second direction or in the third direction among the plurality of first via electrodes, and The plurality of second via electrodes overlap with the first region in the first direction.

21. The multilayer electronic component according to claim 17, in, The first internal electrode includes: a first main portion overlapping the second internal electrode in the first direction; a first lead portion extending from the first main portion, not overlapping the second internal electrode in the first direction, and extending to at least one of the third surface and the fifth surface; and a second lead portion extending from the first main portion, not overlapping the second internal electrode in the first direction, and extending to at least one of the fourth surface and the sixth surface, The second inner electrode comprises: a second main portion, overlapping with the first inner electrode in the first direction; a third lead portion, extending from the second main portion, not overlapping with the first inner electrode in the first direction, and extending to at least one of the fourth surface and the fifth surface; and a fourth lead portion, extending from the second main portion, not overlapping with the first inner electrode in the first direction, and extending to at least one of the third surface and the sixth surface.

22. The multilayer electronic component according to claim 17, in, The second internal electrode includes a first cutout portion and a second cutout portion respectively disposed in the first portion and the second portion, and The first internal electrode includes a third cutout portion and a fourth cutout portion which are respectively disposed in the third portion and the fourth portion.

23. The multilayer electronic component according to claim 22, wherein: The first cutout portion, the second cutout portion, the third cutout portion, and the fourth cutout portion have shapes corresponding to shapes of the first auxiliary electrode, the second auxiliary electrode, the third auxiliary electrode, and the fourth auxiliary electrode, respectively.

24. The multilayer electronic assembly of claim 22, wherein: The first auxiliary electrode includes: a first connecting portion extending to a portion of the third surface and a portion of the fifth surface; a first extending portion extending from the first connecting portion toward the third portion and extending to a portion of the fifth surface, and a size of the first extending portion in the third direction is smaller than a size of the first connecting portion in the third direction; and a second extending portion extending from the first connecting portion toward the fourth portion and extending to a portion of the third surface, and a size of the second extending portion in the second direction is smaller than a size of the first connecting portion in the second direction.

25. The multilayer electronic component according to claim 17, in, The first inner electrode and the second inner electrode are spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface, wherein the second internal electrode comprises a first cutout portion and a second cutout portion respectively disposed in the first portion and the second portion, wherein the first internal electrode comprises a third cutout portion and a fourth cutout portion respectively disposed in the third portion and the fourth portion, and The first auxiliary electrode, the second auxiliary electrode, the third auxiliary electrode and the fourth auxiliary electrode are respectively disposed in the first cutout portion, the second cutout portion, the third cutout portion and the fourth cutout portion.

26. The multilayer electronic component according to claim 17 or 25, in, The main body includes a capacitor forming portion and a covering portion, in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, and the first dielectric layer or the second dielectric layer is interposed between the first internal electrodes and the second internal electrodes, and the covering portion is arranged on two surfaces of the capacitor forming portion that are opposite to each other in the first direction, and The multilayer electronic component further comprises a first contact structure, which is arranged in the first portion, penetrates the covering portion, and connects the first inner electrode and / or the first auxiliary electrode arranged in the outermost region relative to the first direction to the first outer electrode.

27. The multilayer electronic component according to claim 26, in, The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are respectively disposed on the first surface and the second surface, and The first external electrode, the second external electrode, the third external electrode and the fourth external electrode disposed on the first surface are spaced apart from the first external electrode, the second external electrode, the third external electrode and the fourth external electrode disposed on the second surface.

28. The multilayer electronic assembly of claim 26, wherein: The first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed on one of the first surface and the second surface and are not disposed on the other surface.

29. The multilayer electronic assembly of claim 17, wherein: Dimensions of the multilayer electronic component in the first direction, the second direction, and the third direction are defined as T, L, and W, respectively, and each of T / L and T / W satisfies less than or equal to 0.

6.

30. The multilayer electronic assembly of claim 29, wherein: T, L, and W refer to maximum dimensions of the multilayer electronic component in the first direction, the second direction, and the third direction, respectively.

31. The multilayer electronic assembly of claim 17, further comprising: a third via electrode, disposed in the second portion, penetrating the first dielectric layer and connecting the first inner electrode to the second auxiliary electrode; a fourth via electrode, disposed in the second portion, penetrating the second dielectric layer and connecting the first inner electrode to the second auxiliary electrode; a fifth via electrode, disposed in the third portion, penetrating the first dielectric layer and connecting the second inner electrode to the third auxiliary electrode; a sixth via electrode, disposed in the third portion, penetrating the second dielectric layer and connecting the second inner electrode to the third auxiliary electrode; a seventh via electrode, disposed in the fourth portion, penetrating the first dielectric layer and connecting the second inner electrode to the fourth auxiliary electrode; as well as an eighth via electrode, disposed in the fourth portion, penetrating the second dielectric layer and connecting the second inner electrode to the fourth auxiliary electrode, wherein the third via electrode and the fourth via electrode are offset from each other in the direction perpendicular to the first direction, wherein the fifth via electrode and the sixth via electrode are offset from each other in the direction perpendicular to the first direction, and The seventh via electrode and the eighth via electrode are offset from each other in the direction perpendicular to the first direction.

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