Apparatus and method for controlling temperature

Abstract

The invention provides a device and a method for controlling temperature. Provided is an apparatus for controlling temperature, comprising: a chamber having a processing space therein; a substrate support unit disposed in the chamber and supporting a substrate; a heating unit including a heating member installed in an upper portion of the chamber and heating the upper portion of the chamber; a cooling unit including a cooling member installed in an upper portion of the chamber and cooling the upper portion of the chamber; and a controller that controls the heating unit and the cooling unit.

Description

Cross - reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10 - 2023 - 0196352, filed with the Korean Intellectual Property Office on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0002] The present disclosure relates to an apparatus and method for controlling temperature. Background art

[0003] A semiconductor device manufacturing process may include a process of etching a surface of a substrate to form a desired pattern on the substrate. The etching process may be performed by causing ions or radicals included in a plasma to collide with or react with a thin film formed on the substrate.

[0004] Plasma is mainly used in an etching process to form a fine pattern. Plasma refers to a gaseous substance that is separated into ions, radicals, electrons, etc. at a high temperature. Plasma is generated by an extremely high temperature, a strong electric field, or a high - frequency electromagnetic field (RF electromagnetic field).

[0005] The internal temperature or pressure of a chamber is controlled to control a plasma generation environment or a substrate processing environment using plasma. A heater and a cooling pipe may be installed in an upper part of the chamber to control the temperature of the upper part of the chamber. The heater may be used to rapidly increase the temperature of the upper part of the chamber, and the cooling rate may be controlled according to the temperature and flow rate of a refrigerant flowing through the cooling pipe.

[0006] Generally, the heater and the cooling pipe installed in the upper part of the chamber are independently controlled, but since the heater and the cooling pipe may interfere with each other, there may be a problem of temperature control deviation due to an operator who controls the heater and the cooling pipe. Summary of the invention

[0007] One aspect of the present disclosure provides an apparatus and method for controlling temperature, which can effectively improve the temperature control performance of the upper part of a chamber.

[0008] In an embodiment, the present disclosure provides an apparatus and method for controlling temperature, which can ensure robust temperature control performance not affected by external disturbances by estimating the temperature of an upper part of a chamber heated by a heating member and controlling a cooling member by feed - forward compensation based on the estimated temperature of the upper part of the chamber.

[0009] In an embodiment, the present disclosure provides an apparatus and a method for controlling temperature, which can quickly stabilize the temperature by deriving a compensation value for the opening rate of a flow rate control valve based on the output of a heater controller for controlling the temperature of a heating member and controlling the flow rate control valve, wherein the flow rate control valve controls the flow rate of the refrigerant delivered to the refrigerant path.

[0010] To achieve the above object, the present disclosure provides the following apparatus and method for controlling temperature.

[0011] In an embodiment of the present disclosure, there is provided an apparatus for controlling temperature, including: a chamber having a processing space therein; a substrate support unit disposed in the chamber and supporting a substrate; a heating unit including a heating member installed in an upper portion of the chamber and heating the upper portion of the chamber; a cooling unit including a cooling member installed in the upper portion of the chamber and cooling the upper portion of the chamber; and a controller controlling the heating unit and the cooling unit, and the controller estimates the temperature of the upper portion of the chamber heated by the heating member and controls the cooling member based on the estimated temperature of the upper portion of the chamber to control the temperature of the upper portion of the chamber.

[0012] In an embodiment of the present disclosure, there is provided a method for controlling temperature, including: heating an upper portion of a chamber by a heating member installed in an upper portion of the chamber; compensatorily controlling a cooling member installed in an upper portion of the chamber based on an estimated value of the temperature of the upper portion of the chamber heated by the heating member; and cooling the upper portion of the chamber by a cooling member installed in an upper portion of the chamber.

[0013] In an embodiment of the present disclosure, there is provided a method for controlling temperature, including: measuring the temperature of an upper portion of a chamber by a temperature sensor installed in an upper portion of the chamber; heating the upper portion of the chamber by a heating member installed in an upper portion of the chamber; compensatorily controlling a cooling member installed in an upper portion of the chamber based on an estimated value of the temperature of the upper portion of the chamber heated by the heating member; and cooling the upper portion of the chamber by a cooling member installed in an upper portion of the chamber, and compensatorily controlling the cooling member includes: deriving an estimated value of the temperature of the upper portion of the chamber based on a heater temperature estimation model; and calculating a compensation value for the opening rate of a flow rate control valve for controlling the flow rate of the refrigerant delivered to the cooling member. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0015] Figure 1 An apparatus for controlling temperature according to an embodiment of the present disclosure is shown;

[0016] Figure 2 is a block diagram of a controller of a device for controlling temperature according to an embodiment of the present disclosure;

[0017] Figure 3 shows a control block diagram of a method for controlling temperature according to a comparative example;

[0018] Figure 4 is an exemplary control block diagram showing some operations of a method for controlling temperature according to an embodiment of the present disclosure;

[0019] Figure 5 is an exemplary control block diagram showing some operations of a method for controlling temperature according to an embodiment of the present disclosure;

[0020] Figure 6 is an exemplary control block diagram showing some operations of a method for controlling temperature according to an embodiment of the present disclosure;

[0021] Figure 7A is a graph showing the upper temperature and valve position of a device for controlling temperature according to a comparative example;

[0022] Figure 7B is an exemplary graph showing the upper temperature and valve position of a device for controlling temperature according to an embodiment of the present disclosure; and

[0023] Figure 8 is a flowchart of a method for controlling temperature according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0024] Hereinafter, preferred exemplary embodiments will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the present disclosure. However, when determining that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present disclosure, the detailed description thereof will be omitted. In addition, throughout the drawings, the same reference numerals are used to refer to the same or similar functions and actions. In this specification, it can be understood that expressions such as "above", "over", "on", "below", "under", "beneath", and "side surface" are only indicated based on the drawings and can actually vary according to the direction in which the components are arranged.

[0025] In addition, throughout the specification, the terms "connected to" or "coupled to" are used to indicate the connection or coupling of one element to another element, and include both the case where an element is "directly connected or coupled to" another element and the case where an element is "indirectly connected or coupled to" another element via other elements. In addition, when a certain part "includes" or "contains" a certain component, this indicates that other components are not excluded and other components can be further included, unless otherwise specified.

[0026] Figure 1 shows an apparatus for controlling temperature according to an embodiment of the present disclosure. Referring to Figure 1 , the apparatus 100 for controlling temperature may include a chamber 110, a substrate support unit 120, a heating unit 130, a cooling unit 140, and a controller 150.

[0027] The apparatus 100 for controlling temperature may be a substrate processing apparatus that performs processing on a substrate W using plasma. The processing of the substrate W may include, for example, an etching process.

[0028] The chamber 110 may have a processing space 111 formed therein. The processing space 111 may be an environment that can be controlled to an appropriate temperature and pressure to perform processing on the substrate W.

[0029] The substrate support unit 120 may be disposed in the chamber 110. The substrate support unit 120 may include a substrate support surface that supports the substrate W and adsorbs and fixes the substrate W.

[0030] The substrate support unit 120 may receive a DC voltage and adsorb the substrate W by electrostatic force. Additionally, the substrate support unit 120 may be controlled to have a preset temperature to control the processing of the substrate W.

[0031] The apparatus 100 for controlling temperature may further include a plasma generation part that generates plasma in the processing space 111. The plasma generation part may generate plasma from a processing gas supplied to the processing space 111.

[0032] The heating unit 130 may heat the upper part of the chamber 110. The heating unit 130 may include a heating member 131 installed in the upper part of the chamber 110.

[0033] The heating member 131 may be installed in an appropriate arrangement form inside the wall of the chamber 110 or on the inner surface of the chamber 110 to increase the temperature of the upper part of the chamber 110. For example, the heating member 131 may be inserted and installed in at least a part of the upper wall and the side wall of the chamber 110.

[0034] The cooling unit 140 may cool the upper part of the chamber 110. The cooling unit 140 may include a cooling member installed in the upper part of the chamber 110. The cooling member may be implemented as part of, for example, a shower head.

[0035] The cooling member may be disposed above the substrate support unit 120 in the upper part of the chamber 110.

[0036] The cooling member may include a plate 141 in which a refrigerant path 142 through which refrigerant flows is formed. The refrigerant path 142 may be formed in the plate 141 in a suitable arrangement so as to reduce the temperature of the upper part of the chamber 110 by the flow of the refrigerant.

[0037] The cooling unit 140 may further include a refrigerant supply section 143 and a flow rate control valve 144.

[0038] The refrigerant supply section 143 may store refrigerant and supply the refrigerant to the refrigerant path 142. The refrigerant supply section 143 may control and maintain the temperature of the stored refrigerant.

[0039] The flow rate control valve 144 may be installed in a refrigerant supply line connecting the refrigerant supply section 143 and the refrigerant path 142. The flow rate control valve 144 may control the flow rate of the refrigerant delivered from the refrigerant supply section 143 to the refrigerant path 142 in the refrigerant supply line.

[0040] The controller 150 may control the temperature of the upper part of the chamber 110 by controlling the heating unit 130 and the cooling unit 140.

[0041] Specifically, the controller 150 may estimate the temperature of the upper part of the chamber 110 heated by the heating member 131. The controller 150 may control the cooling member based on the estimated temperature of the upper part of the chamber 110.

[0042] Figure 2 is a block diagram showing the configuration of the controller 150. Refer to Figure 2 , the controller 150 may include a heater controller 151, a cooling controller 152, and a temperature compensator 153.

[0043] The heater controller 151 may control the temperature of the heating member 131. The controller 150 may control the temperature of the heating member 131 to change according to the output value of the heater controller 151 by controlling the output value of the heater controller 151.

[0044] That is, the controller 150 may control the degree of increase in the temperature of the upper part of the chamber 110 by controlling the output of the heater controller 151.

[0045] The temperature control device 100 may further include a temperature sensor 160 installed at the upper part of the chamber 110. The temperature sensor 160 may be, for example, an IR sensor that measures the temperature of the upper part of the chamber 110 in a non-contact manner. Alternatively, the temperature sensor 160 may be a contact-type temperature measurement sensor.

[0046] The controller 150 can control the heater controller 151 to output a heater control value for controlling the temperature of the heating member 131. The heater control value can be determined based on the target temperature value of the upper part of the chamber 110 and the measured value of the temperature sensor 160.

[0047] The cooling controller 152 can control the opening rate of the flow rate control valve 144. The controller 150 can control the output value of the cooling controller 152 so that the opening rate of the flow rate control valve 144 changes according to the output value of the cooling controller 152, and can control the flow rate of the refrigerant delivered to the refrigerant path 142 based on the opening rate of the flow rate control valve 144.

[0048] That is, the controller 150 can control the degree of temperature reduction of the upper part of the chamber 110 by controlling the output of the cooling controller 152.

[0049] The controller 150 can further control the cooling controller 152 based on the output value of the temperature compensator 153. Specifically, the temperature compensator 153 can input the heater control value output from the heater controller 151 and output a compensation value for the opening rate of the flow rate control valve 144.

[0050] The controller 150 can control the cooling controller 152 based on the opening rate of the flow rate control valve 144 according to the target temperature value of the upper part of the chamber 110 and the compensation value for the opening rate of the flow rate control valve 144 output from the temperature compensator 153.

[0051] Figure 3 A control block diagram showing a method for controlling temperature according to a comparative example is shown, and Figure 4 A control block diagram showing a method for controlling temperature according to an embodiment of the present disclosure is shown.

[0052] In Figure 3 and Figure 4 , u c can represent the opening rate of the flow rate control valve 144 according to the target temperature value of the upper part of the chamber 110, P c (z) can represent the temperature model of the cooling member, r can represent the target temperature value, C h (z) can represent the model of the heater controller 151, u h can represent the heater control value output from the heater controller 151, P h (z) can represent the temperature model of the heating member 131, and y can represent the temperature of the upper part of the chamber 110.

[0053] As Figure 3As shown, the control of the cooling member and the control of the heating member can be performed independently of each other. The temperature control of the upper part of the chamber 110 can be performed by combining the control results of the cooling member and the heating member that are performed independently of each other.

[0054] As Figure 4 shown, in the control of the cooling member and the control of the heating member that are performed independently of each other, the method for controlling temperature according to the present disclosure can additionally perform feedforward compensation control on the cooling member based on the heater control value for controlling the heating member, thereby improving the temperature control performance of the upper part of the chamber 110.

[0055] Specifically, in Figure 4 , F(z) can represent the model of the temperature compensator 153 that can perform feedforward compensation control. F(z) can receive the heater control value (u h ) output from the heater controller 151, and can output a compensation value for the opening rate of the flow rate control valve 144.

[0056] As Figure 4 shown, based on the target temperature value of the upper part of the chamber 110 and the compensation value for the opening rate of the flow rate control valve 144 output from the temperature compensator 153, the cooling member can be controlled based on the opening rate (u c ) of the flow rate control valve 144.

[0057] The temperature compensator 153 can derive a compensation value for the opening rate of the flow rate control valve 144 based on the heater temperature estimation model and the proportional constant (K). The heater temperature estimation model can derive the temperature estimation value of the upper part of the chamber 110 heated by the heating member 131. The proportional constant (K) can be a constant based on the relationship between the temperature of the upper part of the chamber 110 and the opening rate of the flow rate control valve 144.

[0058] Figure 5 Shows an example of a control block diagram for implementing the model (F(z)) of the temperature compensator 153 in the method for controlling temperature according to an embodiment of the present disclosure.

[0059] Figure 5 , u h can represent the heater control value output from the heater controller 151, P' h (z) can represent the mathematical model of the heating member 131, y' h can represent the temperature estimation value of the upper part of the chamber 110 heated by the heating member 131, K can represent the proportional constant between the temperature of the upper part of the chamber 110 and the opening rate of the flow rate control valve 144, and u ff can represent the compensation value for the opening rate of the flow rate control valve 144.

[0060] P' h (z) can represent a mathematical model of the heating member 131, and can be a heater temperature estimation model for deriving an estimated value of the temperature of the upper part of the chamber 110 heated by the heating member 131. As Figure 5 shown, P' h (z) can receive a heater control value (u h ) and can derive an estimated value of the temperature of the upper part of the chamber 110 heated by the heating member 131 (y' h ).

[0061] The temperature compensator 153 can derive a compensation value (u h ) for the opening rate of the flow rate control valve 144 based on the estimated value of the temperature of the upper part of the chamber 110 (y' ff ) and the proportionality constant (K) between the temperature of the upper part of the chamber 110 and the opening rate of the flow rate control valve 144.

[0062] The temperature compensator 153 can include a differentiator configured to derive a change amount of the estimated value of the temperature of the upper part of the chamber 110, and an integrator configured to derive an accumulated value of the change amount of the estimated value of the temperature of the upper part of the chamber 110.

[0063] The temperature compensator 153 can further derive a compensation value for the opening rate of the flow rate control valve 144 based on a first weight (K1) and a second weight (K2). For example, the temperature compensator 153 can apply the first weight (K1) to the change amount of the estimated value of the temperature of the upper part of the chamber 110 output from the differentiator, and can apply the second weight (K2) to the accumulated value of the change amount of the estimated value of the temperature of the upper part of the chamber 110 output from the integrator.

[0064] The temperature compensator 153 can be set such that the value obtained by multiplying the first weight (K1) by the second weight (K2) has the same value as the value of the proportionality constant (K) between the temperature of the upper part of the chamber 110 and the opening rate of the flow rate control valve 144.

[0065] Figure 6 Another example of a control block diagram showing a model (F(z)) implementing the temperature compensator 153 in a method for controlling temperature according to an embodiment of the present disclosure is shown.

[0066] In Figure 6 , u h can represent the heater control value output from the heater controller 151, P' h (z) can represent a mathematical model of the heating member 131, y' hcan represent the estimated temperature value of the upper part heated by the heating member 131 of the chamber 110. K1 can represent the first weight applied to the change amount of the estimated temperature value of the upper part of the chamber 110. K2 can represent the second weight applied to the cumulative value of the change amount of the estimated temperature value of the upper part of the chamber 110, and u ff can represent the compensation value for the opening rate of the flow rate control valve 144.

[0067] P' h P'(z) can represent the mathematical model of the heating member 131 and can be a heater temperature estimation model for deriving the estimated temperature value of the upper part heated by the heating member 131 of the chamber 110. As Figure 6 shown, P' h P'(z) can receive the heater control value (u h ), and can derive the estimated temperature value (y' h ) of the upper part heated by the heating member 131 of the chamber 110.

[0068] Figure 6 The temperature compensator 153 can also include a differentiator and an integrator by utilizing a multi-rate.

[0069] The differentiator can receive the estimated temperature value (y'h) of the upper part heated by the heating member 131 of the chamber 110, and can output the change amount of the estimated temperature value of the upper part of the chamber 110. The change amount of the estimated temperature value of the upper part can be expressed as Equation 1. In Equation 1, y' h [n] represents the current estimated temperature value of the upper part, and y' h [n - 1] represents the previous estimated temperature value of the upper part.

[0070] Equation 1:

[0071]

[0072] In addition, the integrator can receive the output of the differentiator to which the first weight (K1) is applied, and can output the cumulative value of the change amount of the estimated temperature value of the upper part of the chamber 110. The cumulative value of the change amount of the estimated temperature value of the upper part can be approximated as Equation 2.

[0073] Equation 2:

[0074]

[0075] The temperature compensator 153 can derive the compensation value (u ff ) for the opening rate of the flow rate control valve 144 by applying the second weight (K2) to the cumulative value of the change amount of the estimated temperature value of the upper part of the chamber 110 output from the integrator.

[0076] Figure 6 The temperature compensator 153 can be set such that the value obtained by multiplying the first weight (K1) by the second weight (K2) has the same value as the proportionality constant (K) between the temperature at the upper part of the chamber 110 and the opening rate of the flow rate control valve 144, as Figure 5 shown in the temperature compensator 153.

[0077] Figure 7A is a graph showing the upper temperature and the valve position of the device for controlling temperature according to the comparative example, and Figure 7B is an exemplary graph showing the upper temperature and the valve position of the temperature control device 100 according to an embodiment of the present disclosure. In Figure 7A and Figure 7B , the valve position may represent the opening rate of the refrigerant control valve that controls the flow rate of the refrigerant delivered to the refrigerant path of the cooling member.

[0078] In Figure 7A the graph, even in the interval where the upper temperature changes, the valve position does not change, but in Figure 7B the graph, the valve position changes in real time in the interval where the upper temperature changes. That is, the method for controlling temperature according to an embodiment of the present disclosure can more flexibly control the opening rate of the refrigerant control valve in response to the change in the temperature at the upper part of the chamber.

[0079] The present disclosure can control the heating member 131 based on the measurement value of the temperature sensor 160 provided on the upper part of the chamber 110, and can compensatorily control the cooling member in a feedforward manner based on the output value of the heater controller 151 for controlling the temperature of the heating member 131, so as to accurately control and quickly stabilize the temperature at the upper part of the chamber 110.

[0080] Figure 8 is a flowchart of the method for controlling temperature according to an embodiment of the present disclosure. Referring to Figure 8 , the method (800) for controlling temperature may include: an operation of heating the upper part of the chamber by the heating member (S810), an operation of compensatorily controlling the cooling member based on the estimated temperature value of the upper part of the chamber (S820), and an operation of cooling the upper part of the chamber by the cooling member (S830).

[0081] The operation of heating the upper part of the chamber (S810) may include: an operation of controlling the output of the heater controller to control the temperature of the heating member. The temperature of the heating member can be controlled by the heater control value output from the heater controller.

[0082] The method (800) for controlling temperature may further include an operation of measuring the temperature of the upper part of the chamber by a temperature sensor installed in the upper part of the chamber.

[0083] The operation (S810) of heating the upper part of the chamber may further include an operation of setting a target temperature value of the upper part of the chamber, and an operation of calculating a heater control value output from a heater controller based on the target temperature value and the measured value of the temperature sensor.

[0084] The operation (S820) of compensatorily controlling the cooling member may include an operation of controlling the opening rate of a flow rate control valve for controlling the flow rate of the refrigerant delivered to the refrigerant path, and an operation of calculating a compensation value for the opening rate of the flow rate control valve based on the heater control value.

[0085] In the operation of calculating the compensation value for the opening rate of the flow rate control valve, the compensation value may be further derived based on a heater temperature estimation model for deriving an estimated temperature value of the upper part of the chamber heated by a heated member of the chamber, and a proportional constant between the temperature of the upper part of the chamber and the opening rate of the flow rate control valve.

[0086] The operation of calculating the compensation value for the opening rate of the flow rate control valve may include an operation of deriving a change amount of the estimated temperature value of the upper part of the chamber, an operation of applying a first weight to the change amount of the estimated temperature value of the upper part of the chamber, an operation of deriving an accumulated value of the change amount of the estimated temperature value of the upper part of the chamber, and an operation of applying a second weight to the accumulated value of the change amount of the estimated temperature value of the upper part of the chamber.

[0087] In the operation of calculating the compensation value for the opening rate of the flow rate control valve, the value obtained by multiplying the first weight and the second weight may be set to have the same value as the proportional constant value between the temperature of the upper part of the chamber and the opening rate of the flow rate control valve.

[0088] In addition, when describing the present disclosure, "~ part" or "unit" may be implemented in various ways, for example, implemented by a processor, program instructions executed by the processor, software modules, microcode, computer program products, logic circuits, application specific integrated circuits, firmware, etc.

[0089] The content of the method disclosed in the embodiments of the present application may be directly implemented by a hardware processor, or may be implemented and executed by a combination of software modules and hardware among processors. The software modules may be stored in a conventional storage medium such as random access memory, flash memory, read only memory, programmable read only memory, electrically erasable programmable memory, registers, etc. The storage medium is provided in the memory, and the processor reads the information stored in the memory and combines the information with the hardware to complete the content of the above method. To avoid redundancy, detailed description is omitted here.

[0090] In the implementation process, each content of the above method can be completed by the logical integrated circuit of the hardware between processors or instructions in the form of software.

[0091] That is to say, those skilled in the art can recognize that each exemplary unit and algorithm operation described in the embodiments disclosed herein can be implemented by combining electronic hardware or by a combination of computer software and electronic hardware. Whether to execute this function in a hardware manner or a software manner is determined by the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described function for each specific application, but such implementation should not be regarded as exceeding the scope of this application.

[0092] It should be understood that in several embodiments provided in this application, the disclosed devices and methods can also be implemented in other ways. For example, the device embodiments described above are only exemplary. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. And for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. On the other hand, the coupling or direct coupling or communication connection shown or discussed between each other can be an indirect coupling or communication connection through some interface, device or unit, and can be set in an electrical, mechanical or other form.

[0093] The units described above as separate components can be physically separated, and the components shown as units can be physical units or not (that is, set at one point or distributed in multiple network units). Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0094] That is to say, the functional units in each embodiment of this application can be integrated into a processing unit, and each unit can exist alone, or two or more units can be integrated into one unit.

[0095] When the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the part that makes a substantial contribution to the prior art in the technical solution of this application, or a part of this technical solution, can be implemented in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server or a network device, etc.) to execute all or part of the operations of the methods described in each embodiment of this application. The above storage medium includes various media that can store program codes, such as USB memories, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, CD-ROMs, etc.

[0096] The present disclosure is not limited to the above embodiments and accompanying drawings. The scope of rights of the present disclosure is intended to be defined by the appended claims. Those skilled in the art will understand that various substitutions, modifications, and changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure defined by the appended claims.

Claims

1. A device for controlling temperature, comprising: a chamber having a processing space therein; a substrate supporting unit, disposed in the chamber and supporting a substrate; a heating unit including a heating member installed in an upper portion of the chamber and heating the upper portion of the chamber; a cooling unit including a cooling member installed in the upper portion of the chamber and cooling the upper portion of the chamber; as well as a controller, controlling the heating unit and the cooling unit, The controller estimates a temperature of the upper portion of the chamber heated by the heating member, and controls the cooling member based on the estimated temperature of the upper portion of the chamber to control the temperature of the upper portion of the chamber.

2. The device for controlling temperature according to claim 1, wherein: The cooling member includes a plate in which a refrigerant path is formed through which a refrigerant flows, and Wherein, the cooling unit further includes a flow rate control valve, and the flow rate control valve controls the flow rate of the refrigerant delivered to the refrigerant path.

3. The device for controlling temperature according to claim 2, wherein: The controller comprises: a heater controller to control the temperature of the heating member; and A cooling controller controls the opening rate of the flow rate control valve.

4. The device for controlling temperature according to claim 3, further comprising: a temperature sensor mounted in the upper portion of the chamber, The heater controller outputs a heater control value for controlling the heating member based on a target temperature value of the upper portion of the chamber and a measurement value of the temperature sensor.

5. The device for controlling temperature according to claim 4, wherein: The controller further includes a temperature compensator which inputs the heater control value and outputs a compensation value for an opening rate of the flow rate control valve.

6. The device for controlling temperature according to claim 5, wherein: The temperature compensator is configured as: The compensation value is derived based on a heater temperature estimation model for deriving a temperature estimation value of the upper portion of the chamber heated by the heating member and a proportionality constant between the temperature of the upper portion of the chamber and the opening rate of the flow rate control valve.

7. The device for controlling temperature according to claim 6, wherein: The temperature compensator comprises: a differentiator configured to derive an amount of change in an estimate of a temperature of the upper portion of the chamber; and An integrator is configured to derive a cumulative value of the amount of change in the temperature estimate value of the upper portion of the chamber.

8. The device for controlling temperature according to claim 7, wherein: The temperature compensator is configured as: The compensation value is further derived based on a first weight applied to an output of the differentiator and a second weight applied to an output of the integrator.

9. The device for controlling temperature according to claim 8, wherein: The temperature compensator is set so that a value obtained by multiplying the first weight and the second weight has the same value as the proportional constant.

10. A method for controlling temperature, comprising: heating the upper portion of the chamber by a heating member installed in the upper portion of the chamber; compensatively controlling a cooling member installed in the upper portion of the chamber based on an estimated value of the temperature of the upper portion of the chamber heated by the heating member; and The upper portion of the chamber is cooled by the cooling member installed in the upper portion of the chamber.

11. The method for controlling temperature according to claim 10, wherein: The cooling member includes a plate in which a refrigerant path is formed for the refrigerant to flow, and Wherein, compensatingly controlling the cooling component comprises: An opening rate of a flow rate control valve that controls a flow rate of the refrigerant delivered to the refrigerant path is controlled.

12. The method for controlling temperature according to claim 11, wherein: Heating the upper portion of the chamber comprises: An output of a heater controller is controlled, the heater controller controlling the temperature of the heating member.

13. The method for controlling temperature according to claim 12, further comprising: measuring the temperature of the upper portion of the chamber by a temperature sensor installed in the upper portion of the chamber, Wherein, heating the upper portion comprises: setting a target temperature value for the upper portion of the chamber; and A heater control value output from the heater controller is calculated based on the target temperature value and the measurement value of the temperature sensor.

14. The method for controlling temperature according to claim 13, wherein: Compensatively controlling the cooling component further comprises: A compensation value for the opening rate of the flow rate control valve is calculated based on the heater control value.

15. The method for controlling temperature according to claim 14, wherein: When calculating the compensation value, The compensation value is further derived based on a heater temperature estimation model for deriving a temperature estimation value of the upper portion of the chamber heated by the heating member and a proportionality constant between the temperature of the upper portion of the chamber and the opening rate of the flow rate control valve.

16. The method for controlling temperature according to claim 15, wherein: Calculating the compensation value includes: deriving a change in the temperature estimate of the upper portion of the chamber; and A cumulative value of the amount of change in the estimated temperature value of the upper portion of the chamber is derived.

17. The method for controlling temperature according to claim 16, wherein: Calculating the compensation value further includes: applying a first weight to the amount of change in the temperature estimate of the upper portion of the chamber; and A second weight is applied to the cumulative value of the amount of change in the temperature estimate value of the upper portion of the chamber.

18. The method for controlling temperature according to claim 17, wherein: A value obtained by multiplying the first weight and the second weight is set to have the same value as that of the proportional constant.

19. A method for controlling temperature, comprising: measuring a temperature of the upper portion of the chamber by a temperature sensor mounted in the upper portion of the chamber; heating the upper portion of the chamber using a heating member installed in the upper portion of the chamber; compensatively controlling a cooling member installed in the upper portion of the chamber based on an estimated value of the temperature of the upper portion of the chamber heated by the heating member; and cooling the upper portion of the chamber by the cooling member installed in the upper portion of the chamber, Wherein, compensatingly controlling the cooling component comprises: deriving the temperature estimate of the upper portion of the chamber based on a heater temperature estimation model; and A compensation value of an opening rate of a flow rate control valve that controls a flow rate of a refrigerant delivered to the cooling member is calculated.

20. The method for controlling temperature according to claim 19, wherein: Calculating the compensation value includes: deriving a change in the estimated temperature of the upper portion of the chamber; applying a first weight to the amount of change in the temperature estimate of the upper portion of the chamber; deriving a cumulative value of the amount of change in the estimated temperature value of the upper portion of the chamber; and A second weight is applied to the cumulative value of the amount of change in the temperature estimate value of the upper portion of the chamber.

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