A new IC chip packaging structure

Abstract

The present invention discloses a novel IC chip packaging structure, which belongs to the field of semiconductor packaging technology. The structure includes a wafer, a conductive block, pins, wires, a heat-conducting block, a substrate, a pressing block and a limiting block. A wafer is placed on the upper surface of the substrate. Rectangular grooves are formed on the upper surfaces of the left and right sides of the substrate. Several heat-conducting blocks are installed in the substrate. The upper surfaces of one end of the heat-conducting blocks are in contact with the bottom surface of the wafer. Several conductive blocks are installed in the substrate. The conductive blocks and the wafer are connected by wires. The limiting blocks are arranged in pairs and installed above the substrate. The limiting blocks are pressed above the conductive blocks. The pressing blocks are arranged in pairs and arranged above the substrate. One end of the pressing block is inserted into the limiting block. Several sockets are formed between the bottom of the pressing block and the rectangular groove. One end of several pins is inserted into the sockets. The structure solves the problem of poor heat dissipation of the packaging structure and poor pin connection effect in the prior art, which affects work efficiency and has high maintenance costs. The heat dissipation effect and assembly efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a novel IC chip packaging structure. Background Art

[0002] With the rapid development of information technology, the requirements for the integration and performance of integrated circuit (IC) chips are increasing.

[0003] Traditional two-dimensional IC chip packaging structures are no longer able to meet the demands of today's high-density, high-performance electronic systems. Three-dimensional (3D) integration technology achieves higher integration and more compact packaging by stacking multiple IC chips vertically. However, existing 3D integrated IC chip packaging structures still face numerous challenges in terms of signal transmission, heat dissipation, and manufacturing complexity. Furthermore, in existing packaging structures, pins are often connected using glue. This glue-bonding method has two drawbacks. First, the IC packaging structure releases a certain amount of heat during use, which causes the glue to melt, making it easy for the pins to debond and fall off after prolonged use. Second, it is difficult to remove and replace glued pins. This results in the IC chip not functioning properly if a pin is damaged. Furthermore, the pins are difficult to replace, and remaking the packaging structure increases both time and material costs.

[0004] Therefore, how to provide a new IC chip packaging structure to solve the defects of the existing IC packaging structure is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0005] To this end, the present invention provides a novel IC chip packaging structure to solve the problems in the prior art of poor heat dissipation and poor pin connection of the packaging structure, which affect work efficiency and increase maintenance costs.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention discloses a novel IC chip packaging structure, comprising:

[0008] A substrate, with a wafer placed on its upper surface, and rectangular grooves formed on the upper surfaces of the left and right sides of the substrate;

[0009] a plurality of heat-conducting blocks, mounted in the substrate, wherein the upper surface of one end of the heat-conducting block contacts the bottom surface of the wafer;

[0010] A plurality of conductive blocks are installed in the substrate, and the conductive blocks are connected to the wafer by wires;

[0011] Limit blocks are provided in pairs and installed above the substrate, and the limit blocks are pressed above the conductive blocks;

[0012] A pressing block is provided in pairs and is arranged above the substrate, one end of the pressing block is inserted into the limiting block, a portion of the pressing block is pressed above the conductive block, and a plurality of insertion holes are formed between the bottom of the pressing block and the rectangular groove;

[0013] One end of a plurality of pins is inserted into the jack.

[0014] In a possible implementation, upper and lower ends of the outer side of the pressing block are connected to a plastic shell, and an epoxy resin layer is provided between the plastic shell and the substrate.

[0015] In one possible implementation, a plurality of L-shaped grooves are provided in the substrate, the heat-conducting blocks are installed in the L-shaped grooves, a rectangular hole is provided on the upper surface of the substrate, the rectangular hole is connected to the rectangular grooves, a conductive block is installed in the rectangular hole, a plurality of limiting top blocks are provided in the rectangular grooves, and a plurality of T-shaped blocks are installed on the upper surface of the substrate.

[0016] In a possible implementation, a plurality of installation grooves are formed on the outer surface of the limit block, one end of the pressing block is inserted into the installation groove, and a limit block is provided on the upper surface of the installation groove.

[0017] In a possible implementation, the pressing block includes:

[0018] The block has a plurality of insert blocks mounted on one end surface, wherein arc grooves are formed on the upper surfaces of the insert blocks, and the insert blocks are inserted into the mounting grooves;

[0019] An extension block is mounted on the other end surface of the block body, the extension block is arranged on the opposite side of the insert block, and grooves are formed on the upper and lower surfaces of the extension block;

[0020] A plurality of connecting grooves are provided on the bottom surface of the block, and limiting components are installed in the connecting grooves.

[0021] In a possible implementation, the limiting component includes:

[0022] A connecting rod is mounted on the top surface of the connecting groove, and a disc is mounted on the bottom of the connecting rod;

[0023] The limiting sphere is a solid structure, a displacement groove is provided in the limiting sphere, a limiting groove is provided on the top of the limiting sphere, the limiting groove is connected to the displacement groove, and the disc is connected to the displacement groove in a transmission manner.

[0024] In a possible implementation, an upper limit hole is opened on the top surface of one end of the pin, and a plurality of lower limit holes are opened on the bottom surface of one end of the pin, and the upper limit holes are arranged above the lower limit holes.

[0025] In a possible implementation, a T-shaped slot is further provided in the block.

[0026] In a possible implementation, the heat conducting block is made of metal.

[0027] The present invention installs a heat-conducting block on the substrate, and then utilizes the contact between the heat-conducting block and the wafer to transfer heat, utilizes the heat-conducting block to realize rapid heat dissipation of the wafer, prevents the wafer temperature from being too high and affecting its working efficiency, and utilizes the thermal expansion deformation of the heat-conducting block to make the heat-conducting block tightly connected to the substrate, prevents the heat-conducting block from falling off and affecting the heat conduction effect, not only that, utilizes the jack formed between the pressing block and the rectangular groove, and then utilizes the jack to realize the plug-in connection between the substrate and the pin, not only can produce the same connection effect as gluing, but also can make the pin replacement more convenient, and in the absence of external force, the pin will not fall off easily, the setting of the limit block can not only be used to determine the installation position of the pressing block, but also can realize the limit of the pressing block, and prevent the pressing block from falling off before plastic sealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other implementation drawings based on the provided drawings without inventive effort.

[0029] The structures, proportions, sizes, etc. illustrated in this specification are intended only to complement the contents disclosed herein and to facilitate understanding and reading by persons familiar with the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in sizes, without affecting the efficacy and objectives of the present invention, shall still fall within the scope of the technical contents disclosed herein.

[0030] Figure 1 A three-dimensional diagram of the novel IC chip packaging structure provided by the present invention;

[0031] Figure 2 A cross-sectional view of the epoxy resin layer provided by the present invention;

[0032] Figure 3 A three-dimensional diagram of the substrate provided by the present invention;

[0033] Figure 4A three-dimensional diagram of the limiting block provided by the present invention;

[0034] Figure 5 A cross-sectional view of a compact provided by the present invention;

[0035] Figure 6 A cross-sectional view of a position-limiting member provided by the present invention;

[0036] Figure 7 A cross-sectional view of the pins provided by the present invention;

[0037] Figure 8 A cross-sectional view of a T-slot provided by the present invention;

[0038] In the figure: 1 wafer; 2 conductive block; 3 pin; 31 lower limit hole; 32 upper limit hole; 4 wire; 5 heat conductive block; 6 substrate; 61 limit top block; 62 rectangular hole; 63 L-shaped slot; 64 T-shaped block; 7 pressure block; 71 block; 72 groove; 73 extension block; 74 connecting slot; 75 limit member; 751 limit sphere; 752 displacement slot; 753 disk; 754 connecting rod; 76 insert block; 77 T-shaped slot; 8 limit block; 81 mounting slot; 82 limit block; 9 epoxy resin layer; 10 plastic shell. DETAILED DESCRIPTION

[0039] The following describes the implementation of the present invention using specific embodiments. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. Obviously, the embodiments described are only a portion of the present invention, not all of it. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are intended to fall within the scope of protection of the present invention.

[0040] Please follow Figures 1-8 Now, a novel IC chip packaging structure disclosed by the present invention is described. Figure 1 , including a wafer 1, a conductive block 2, a pin 3, a wire 4, a heat conductive block 5, a substrate 6, a pressing block 7 and a limit block 8. The wafer 1 is placed on the upper surface of the substrate 6. Rectangular grooves are opened on the upper surfaces of the left and right sides of the substrate 6. Several heat conductive blocks 5 are installed in the substrate 6. The upper surface of one end of the heat conductive block 5 contacts the bottom surface of the wafer 1. Several conductive blocks 2 are installed in the substrate 6. The conductive block 2 and the wafer 1 are connected by wires 4. The limit blocks 8 are arranged in pairs and are installed above the substrate 6. The limit blocks 8 are pressed above the conductive block 2. The pressing blocks 7 are arranged in pairs and are arranged above the substrate 6. One end of the pressing block 7 is inserted into the limit block 8. A part of the pressing block 7 is pressed above the conductive block 2. Several sockets are formed between the bottom of the pressing block 7 and the rectangular groove, and one end of the several pins 3 is inserted into the sockets.

[0041] When the present invention is in use, the wafer 1 is installed on the substrate 6. After the wafer 1 is installed, a socket is formed between the bottom of the wafer 1 and one end of the L-shaped groove 63. The heat conducting block 5 is an L-shaped structure. The end of the L-shaped long rod is inserted into the socket, and the heat conducting block 5 is completely clamped in the L-shaped groove 63. Then, several conductive blocks 2 are clamped in the rectangular holes 62. After installation, the limit block 8 will be fixed above the substrate 6. After fixation, the T-shaped block 64 on the substrate 6 can be used to guide the pressing block 7 to slide and install from the left and right sides. Then, the insert block 76 at the inner end of the pressing block 7 is inserted into the installation groove 81 of the limit block 8. The T-shaped block 64 and the limit block 82 are used to limit the pressing block 7 in the horizontal and vertical directions. After the pressing block 7 is installed, the end of the pin 3 with the upper limit hole 32 and the lower limit hole 31 is inserted into the pressing block 7 and the rectangular When the locking cam 751 is in the unlocked position, the locking cam 752 is in the unlocked position, and the locking cam 753 is in the unlocked position, so that the locking cam 753 is unlocked and the locking cam 754 can be unlocked. After the pins are installed, the plastic shell 10 is connected. The plastic shell 10 is divided into two parts, the upper and lower parts. The two ends of the left and right side panels are respectively aligned with the grooves 72 of the plug-in block 76 for installation. In this way, because the width of the plastic shell 10 is fixed, if the two pressing blocks 7 are set asymmetrically, one of the pressing blocks 7 is offset a little, which will cause the width between the grooves 72 to increase and be greater than the width of the plastic shell 10. It can be quickly determined whether the pressing blocks 7 are installed in place, which is convenient for timely position adjustment of various components before plastic sealing. At the same time, using the above method, the plastic shell 10 can be quickly positioned to the middle position when it is installed, thereby improving the installation of the plastic shell 10. Installation efficiency, and when the plastic shell 10 is installed on the pressure block 7, since the length, width and height of the plastic shell 10 are fixed, after the plastic shell 10 is installed, the plastic shell 10 will limit the position of the pressure block 7 to prevent the pressure block 7 from being displaced during the plastic sealing process. After the plastic shell 10 is installed, the hollow position between the inside of the plastic shell 10 and the substrate 6 is plastic sealed. After the plastic sealing is completed, the positioning between each unit is further limited and an epoxy resin layer 9 is produced. Before sealing, the wire 4 is used to electrically connect the wafer 1 and the conductive block 2. The conductive block 2 and the pin 3 are both made of metal, and the electrical signal is transmitted through the conductivity of the metal.

[0042] Based on the previous embodiment, Figure 2 The upper and lower ends of the outer side of the pressing block 7 are connected to the plastic shell 10, and an epoxy resin layer 9 is provided between the plastic shell 10 and the substrate 6. After the plastic sealing is completed, the plastic sealing shell 10 will be removed. By utilizing the good physical properties of the epoxy resin layer 9, the entire packaging structure can be resistant to high temperatures and collisions, so that the packaging structure has a long service life. However, although the epoxy resin layer 9 has high temperature resistance, its thermal conductivity is relatively poor. Therefore, the expansion plan of this packaging structure is not to set two pairs of identical structures for the plastic sealing shell 10, and the structure of the upper end is not changed. For the structure of the lower end, its height is not the same as that of the upper end, but the bottom surface is close to the substrate 6, so that there is no gap between the bottom surface of the substrate and the bottom surface of the plastic sealing shell 10. In this way, after the sealing is completed and the plastic sealing shell 10 is removed, the bottom surface of the substrate 6 is completely exposed to the air, and the other end of the heat-conducting block 5 is aligned with the bottom surface of the substrate 6. In this way, when there is no epoxy resin layer 9 covering the bottom surface of the substrate 6, the heat-conducting effect of the heat-conducting block 5 can be utilized to achieve good heat dissipation when the wafer is working.

[0043] In a specific embodiment, Figure 3 A plurality of L-shaped grooves 63 are provided in the substrate 6, and a heat-conducting block 5 is installed in the L-shaped groove 63. A rectangular hole 62 is provided on the upper surface of the substrate 6, and the rectangular hole 62 is connected to the rectangular groove. A conductive block 2 is installed in the rectangular hole 62. A plurality of limiting top blocks 61 are provided in the rectangular groove, and a plurality of T-shaped blocks 64 are installed on the upper surface of the substrate 6. For the packaging structure without the epoxy resin layer 9, the heat-conducting block 5 can also be used to achieve heat dissipation at the connection position between the wafer 1 and the substrate 6. The setting of the L-shaped groove 63 itself has a good limiting effect on the heat-conducting block 5, because the heat-conducting block 5 generally adopts a metal structure. While utilizing the contact heat transfer between the wafer 1 and the wafer 1, it can also use its own thermal expansion effect to make the heat-conducting block 5 produce a certain degree of deformation after receiving the heat, so that the heat-conducting block 5 can be better stuck in the L-shaped groove 63. Not only that, after the heat-conducting block 5 is better restricted in the L-shaped groove 63, it can be ensured that it will not fall off, thereby achieving continuous heat conduction to the wafer 1. The rectangular hole 62 is used to install the conductive block 2, and the width of the rectangular groove is smaller than the rectangular hole 62, which can better achieve the limiting of the conductive block 2. The setting of the limiting top block 61 can limit the position of the pin 3. As for the T-shaped block 64, in addition to guiding the installation direction of the pressing block 7, it can also limit the movement of the pressing block 7 in the vertical direction.

[0044] In a specific embodiment, Figure 4The outer surface of the limit block 8 is provided with a plurality of mounting grooves 81, into which one end of the pressure block 7 is inserted, and a limiting block 82 is provided on the upper surface of the mounting groove 81. The mounting groove 81 is provided to guide the connection of the plug block 76, while the limiting block 82 is provided to cooperate with the circular arc groove to limit the movement of the pressure block 7 in the horizontal direction. At the same time, the compression of the plug block 76 by the mounting groove 81 and the conductive block 2 can better limit the position of the pressure block 7 and prevent it from shifting in the horizontal direction.

[0045] In a specific embodiment, Figure 5 The pressing block 7 includes a block body 71, a groove 72, an extension block 73, a connecting groove 74, a limiting member 75, and an insert block 76. Several insert blocks 76 are mounted on one end surface of the block body 71. The insert blocks 76 have arc grooves on their upper surfaces and are inserted into the mounting grooves 81. The extension block 73 is mounted on the other end surface of the block body 71, and is located on the opposite side of the insert block 76. Grooves 72 are formed on the upper and lower surfaces of the extension block 73. Several connecting grooves 74 are formed on the bottom surface of the block body 71, and limiting members 75 are mounted in the connecting grooves 74. The grooves 72 on the extension block 73 can guide the installation of the plastic-encapsulated housing 10 and determine the installation position of the plastic-encapsulated housing 10. The connecting grooves 74 are provided to cause the limiting member 75 to move, while the insert blocks 76 are provided to guide the installation and limiting of the pressing block 7.

[0046] Based on the previous embodiment, Figure 6 The limiting component 75 includes a limiting ball 751, a displacement groove 752, a disc 753 and a connecting rod 754. The connecting rod 754 is installed on the top surface of the connecting groove 74. The disc 753 is installed at the bottom of the connecting rod 754. The limiting ball 751 is a solid structure. The displacement groove 752 is opened in the limiting ball 751. A limiting groove is opened on the top of the limiting ball 751. The limiting groove is connected to the displacement groove 752. The disc 753 is transmission-connected in the displacement groove 752. When the locking cam 751 is in the closed position, the locking cam 751 is in the closed position, and the retaining member 751 is in the closed position, so that the retaining member 751 is locked.

[0047] In a specific embodiment, Figure 7 An upper limit hole 32 is opened on the top surface of one end of the pin 3, and a plurality of lower limit holes 31 are opened on the bottom surface of one end of the pin 3. The upper limit holes 32 are arranged above the lower limit holes 31. The arrangement of the upper limit holes 32 and the lower limit holes 31 is to facilitate the limiting of the pin 3.

[0048] Based on the previous embodiment, Figure 8 , a T-slot 77 is also provided in the block 71. The T-slot 77 is provided to cooperate with the T-block 64, and the T-shaped pattern is utilized to effectively limit the vertical direction of the pressing block 7.

[0049] In a specific embodiment, the heat conducting block 5 is made of metal. By utilizing the good thermal conductivity and thermal expansion effect of the metal material, the heat conducting block 5 can achieve better heat dissipation for the wafer 1, thereby preventing the wafer 1 from being overheated and affecting its performance.

[0050] Although the present invention has been described in detail above using general descriptions and specific embodiments, it will be apparent to those skilled in the art that modifications and improvements may be made thereto. Therefore, such modifications and improvements, without departing from the spirit of the present invention, are intended to be within the scope of protection claimed herein.

Claims

1. A new IC chip packaging structure, characterized in that: include: A substrate (6) has a wafer (1) placed on its upper surface, and rectangular grooves are formed on the upper surfaces of the left and right sides of the substrate (6); A plurality of heat-conducting blocks (5) are mounted in the substrate (6), wherein the upper surface of one end of the heat-conducting block (5) contacts the bottom surface of the wafer (1); A plurality of conductive blocks (2) are mounted in the substrate (6), and the conductive blocks (2) are connected to the wafer (1) using wires (4); Limit blocks (8) are arranged in pairs and installed above the substrate (6), and the limit blocks (8) are pressed above the conductive block (2); The pressing blocks (7) are arranged in pairs and are arranged above the substrate (6). One end of the pressing block (7) is inserted into the limiting block (8). A portion of the pressing block (7) is pressed above the conductive block (2). A plurality of insertion holes are formed between the bottom of the pressing block (7) and the rectangular groove. A plurality of pins (3), one end of which is inserted into the socket; A plurality of mounting grooves (81) are formed on the outer surface of the limit block (8), one end of the pressure block (7) is inserted into the mounting groove (81), and a limit block (82) is provided on the upper surface of the mounting groove (81); The pressing block (7) comprises: A block (71) has a plurality of insert blocks (76) mounted on one end surface, wherein arc grooves are formed on the upper surfaces of the insert blocks (76), and the insert blocks (76) are inserted into the mounting grooves (81); An extension block (73) is mounted on the other end surface of the block body (71), the extension block (73) is arranged on the opposite side of the insert block (76), and grooves (72) are formed on the upper and lower surfaces of the extension block (73); A plurality of connecting grooves (74) are provided on the bottom surface of the block (71), and limiting members (75) are installed in the connecting grooves (74); The limiting component (75) includes: A connecting rod (754) is mounted on the top surface of the connecting groove (74), and a disc (753) is mounted on the bottom of the connecting rod (754); The limiting sphere (751) is a solid structure, a displacement groove (752) is provided in the limiting sphere (751), a limiting groove is provided on the top of the limiting sphere (751), the limiting groove is communicated with the displacement groove (752), and the disc (753) is transmission-connected in the displacement groove (752).

2. The novel IC chip packaging structure according to claim 1, wherein: The upper and lower ends of the outer side of the pressing block (7) are connected to a plastic-encapsulated shell (10), and an epoxy resin layer (9) is provided between the plastic-encapsulated shell (10) and the substrate (6).

3. The novel IC chip packaging structure according to claim 1, wherein: The base plate (6) is provided with a plurality of L-shaped grooves (63), the heat conducting blocks (5) are installed in the L-shaped grooves (63), a rectangular hole (62) is provided on the upper surface of the base plate (6), the rectangular hole (62) is connected to the rectangular groove, a conductive block (2) is installed in the rectangular hole (62), a plurality of limiting top blocks (61) are provided in the rectangular groove, and a plurality of T-shaped blocks (64) are installed on the upper surface of the base plate (6).

4. The novel IC chip packaging structure according to claim 1, wherein: An upper limit hole (32) is formed on the top surface of one end of the pin (3), and a plurality of lower limit holes (31) are formed on the bottom surface of one end of the pin (3), wherein the upper limit hole (32) is arranged above the lower limit hole (31).

5. The novel IC chip packaging structure according to claim 1, wherein: The block (71) is also provided with a T-slot (77).

6. The novel IC chip packaging structure according to claim 1, wherein: The heat conducting block (5) is made of metal.

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