Power conversion module and electronic device

Abstract

The application discloses a power conversion module and electronic equipment, and relates to the technical field of servers, wherein the power conversion module comprises a first power component and a second power component arranged in an upper and lower hierarchy, and the two power components are used for performing voltage conversion tasks of different phases. The arrangement mode of the power components can improve the utilization rate of space and reduce the board area of the power conversion module. The output voltage of the first power component is transmitted to a first load via a first inductor, and the output voltage of the second power component is transmitted to a second load via a second inductor. The first load and the second load can be the same load or different loads. Through the above power voltage output mode, various load requirements can be adapted, and the flexibility and efficiency of power use are improved. Through the application, the problem of insufficient space of a PCB in the prior art can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and particularly relates to a power conversion module and electronic equipment. BACKGROUND

[0002] Some processing components, such as graphic processing units (GPUs), application-specific integrated circuits (ASICs) and the like, can be integrated on a printed circuit board (PCB) of an electronic device (for example, a server). Through these processing components, tasks such as graphic processing and data processing can be performed.

[0003] With the increase of the power of the processing components, the volume of the processing components is also increasing, and in addition, the number of the processing components is also increasing, which leads to the corresponding increase of the space occupied by the processing components on the PCB. However, the space of the PCB is limited, and the increase of the power and the number of the processing components leads to the problem of insufficient space of the PCB. SUMMARY

[0004] The present application provides a power conversion module and electronic equipment to at least solve the problem of insufficient space of the PCB in the electronic device in the related art.

[0005] The present application provides a power conversion module, comprising: a first power component, a second power component, a first inductor and a second inductor, wherein the first power component and the second power component are arranged in an upper and lower level, wherein the first power component is configured to perform a voltage conversion task of a first phase, and an output voltage of the first power component is transmitted to a first load via the first inductor; the second power component is configured to perform a voltage conversion task of a second phase, and an output voltage of the second power component is transmitted to a second load via the second inductor, wherein the first load and the second load are the same load or different loads.

[0006] The application further provides an electronic device, comprising: a power conversion module, a mainboard and a set of processing components, the power conversion module and the set of processing components are connected to the mainboard, the power conversion module comprises a first power component, a second power component, a first inductor and a second inductor, the first power component and the second power component are arranged in an upper and lower hierarchy, wherein the first power component is configured to perform a voltage conversion task of a first phase, and an output voltage of the first power component is transmitted to a first processing component in the set of processing components via the first inductor; the second power component is configured to perform a voltage conversion task of a second phase, and an output voltage of the second power component is transmitted to a second processing component in the set of processing components via the second inductor, wherein the first processing component and the second processing component are the same processing component or different processing components.

[0007] According to the application, for the power conversion module, the first power component and the second power component are arranged in an upper and lower hierarchy, which can reduce the area of the power conversion module on the mainboard, and improve the utilization of space in a limited PCB space; the two power components are configured to perform voltage conversion tasks of different phases, and the output voltages of the two power components are transmitted to the same or different loads via different inductors, and the above power voltage output mode can adapt to various load requirements and improve the flexibility and efficiency of power use. Therefore, the problem of insufficient PCB space in the related art can be solved. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 is a front view structural schematic diagram of an optional power conversion module according to an embodiment of the application.

[0010] Figure 2 is a top view structural schematic diagram of an optional power conversion module according to an embodiment of the application.

[0011] Figure 3 is a structural schematic diagram of an optional power conversion module according to an embodiment of the application.

[0012] Figure 4 is a disassembly schematic diagram of an optional power conversion module according to an embodiment of the application.

[0013] Figure 5is a structural schematic diagram of another optional power conversion module according to an embodiment of the application.

[0014] Figure 6 is a structural schematic diagram of an optional inductor layer according to an embodiment of the application.

[0015] Figure 7 is a schematic diagram of an optional inductor magnetic field line direction according to an embodiment of the application.

[0016] Figure 8 is a schematic diagram of an optional stepped fillet according to an embodiment of the application.

[0017] Figure 9 is a structural schematic diagram of an optional magnetic core, signal copper bar and power copper bar according to an embodiment of the application.

[0018] Figure 10 is a circuit schematic diagram of an optional power conversion module according to an embodiment of the application.

[0019] Figure 11 is a disassembled schematic diagram of another optional power conversion module according to an embodiment of the application.

[0020] Figure 12 is a structural schematic diagram of another optional power conversion module according to an embodiment of the application.

[0021] Figure 13 is a structural schematic diagram of another optional power conversion module according to an embodiment of the application.

[0022] Figure 14 is a structural schematic diagram of an optional server according to an embodiment of the application. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, any other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the application.

[0024] It should be noted that in the description of the present application, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or further include elements inherent in such processes, methods, articles or devices. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0025] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0026] At present, some processing components, such as GPUs, ASICs, etc., can be integrated on the PCB of an electronic device (for example, a server). Through these processing components, tasks such as graphics processing and data processing can be performed. Among them, the server refers to a high-performance computer that provides various services on the network, which can provide computing or application services for other clients (for example, computers, smart phones, automatic teller machines, and even large devices). The functions of the server and the ordinary computer are similar, but compared with the ordinary computer, the server has higher requirements in stability, security, data throughput capacity, scalability and performance, etc., so the server and the ordinary computer are different in GPU, central processing unit (CPU), memory, disk system, network, etc.

[0027] With the improvement of the power of the processing components, the volume of the processing components is also increasing, and in addition, the number of processing components is also increasing, which leads to an increase in the space occupied by the processing components on the PCB. The space of the PCB is limited, and the improvement of the power and the number of the processing components leads to insufficient space of the PCB.

[0028] To solve the problem of insufficient space of the PCB, in addition to reducing the size of the processing components or reducing the number of the processing components on the basis of meeting the power demand, the volume of other components on the PCB can be optimized to reduce the space occupied by the components. Among them, as a power supply system closely related to the processing components, a voltage regulator (VR) separation scheme is usually adopted, that is, the input capacitor, power supply components and output inductor in the VR are separated. The layout of the components in the above VR separation scheme is dispersed, which further aggravates the problem of insufficient space of the PCB, greatly increases the wiring difficulty, and seriously affects the stability and reliability of the server.

[0029] In order to reduce the PCB space occupied by the power supply system, to cope with the situation of the increasing size and number of processing components, a voltage regulator model (VRM) can be used to supply power to the processing components on the PCB. The VRM module has the characteristics of high integration, which can effectively integrate the dispersed voltage regulation components. This design not only reduces the space occupied by each component on the PCB, but also optimizes the wiring structure, which can better cope with the space pressure on the PCB caused by the increase in the size of the processing components.

[0030] The VRM module can integrate two-phase power supply together, using 3D (Three-Dimensional, 3D) stacking technology or 4-layer stacking technology to realize the integration of power supply components and inductors, so as to improve the space utilization of the VRM module. For example, Figure 1 is a front view structural schematic diagram of an optional power conversion module according to an embodiment of the present application, as Figure 1 indicated, the VRM module uses 3D three-dimensional stacking technology, and the 4-layer structure is sequentially from top to bottom: the uppermost layer of the power supply component is the core control part of the whole module, responsible for completing the output voltage regulation, and the capacitors arranged on both sides of the power supply component are filter capacitors, used for filtering the input voltage of the power supply component; The second layer is the upper PCB, which provides stable electrical connection and physical support for the power supply component, and at the same time interconnects with the inductor below; The third layer is the inductor layer (inductor 1 and inductor 2), which is a magnetic device and realizes the charging and discharging process in the power conversion process; The lowermost layer is the lower PCB, which is responsible for providing the necessary electrical connection for the inductor, and at the same time is responsible for connecting with the external circuit to ensure the stable and reliable electrical performance of the whole module. Figure 1 is a top view of the VRM module as Figure 2 indicated, the two power supply components (power supply component 1 and power supply component 2) are arranged on the upper surface of the upper PCB with a certain interval.

[0031] Although compared with the VR separation scheme, the VRM module has higher space utilization. Through integration technology, the space occupied by power conversion can be greatly reduced, and the saving rate is close to 50%, thereby optimizing the internal space layout of the device and providing more available space for processing components. However, with the increase in the size of the processing components and the increase in the number of processing components, the space occupied by the processing components on the board card is further increased, and the demand for the number of VRM modules is also increasing, so there is still a problem of insufficient PCB space.

[0032] Taking electronic equipment as a server and a processing component as a GPU as an example, the GPU has a strong graphics processing capability and is widely used in the field of artificial intelligence, and its performance is constantly improving. At the same time, the power of the GPU is also increasing. With the increase of power, the size of the GPU is also increasing, and the space occupied on the PCB is also increasing, so that the PCB space cannot meet the demand. By adopting a VRM module, the problem of insufficient PCB space caused by the increase of the size of the GPU can be effectively solved, which provides guarantee for the stable operation of the entire device, and also brings more flexibility and optimization space for the design and layout of the PCB.

[0033] Compared with the VR separation scheme, the VRM module has higher space utilization. However, with the development of the GPU, the space occupied by the GPU on the board is increasing. The GPU not only expands in the component area to accommodate more computing cores and caches, but also shows an exponential growth trend in power consumption. In addition, in order to meet the increasing power demand of the GPU, the number of corresponding VRM modules is also increasing rapidly. It can be seen that the above VRM module has certain limitations in meeting the increasing power demand of the GPU. When facing the dual growth pressure of GPU power and quantity, the space of the PCB is limited and cannot fully meet the increasing power demand of the GPU.

[0034] In order to at least partially solve the above problems, in the embodiment, by improving the structure of the power conversion module, two power components are arranged in upper and lower layers, which can reduce the board area of the power conversion module and improve the space utilization of the PCB. Through the above design of changing the two-phase power components in the same layer of the VRM module to upper and lower arrangement, the VRM module is improved in structure and assembly, which has more advantages in space utilization, performance improvement and the like, and can better cope with the challenge of the rapid development of the processing component to the space of the PCB under the background of the continuous pursuit of high performance and miniaturization of electronic equipment, and provides a more efficient and reliable power solution for the development of electronic equipment.

[0035] It should be noted that in some examples of the embodiment, electronic equipment is taken as a server and a processing component is taken as a GPU for explanation and description. For other electronic equipment or processing components, as long as the power conversion module in the embodiment can be used for power supply, the purpose of improving the space utilization of the PCB can also be achieved.

[0036] According to an aspect of an embodiment of the present application, a power conversion module is provided. Optionally, the power conversion module can be applied to a server, but is not limited thereto. Figure 3 is a structural schematic diagram of an optional power conversion module according to an embodiment of the present application, like Figure 3The power conversion module comprises: a first power component 301 for performing a voltage conversion task of a first phase, a second power component 302 for performing a voltage conversion task of a second phase, a first inductor 303 and a second inductor 304, wherein the first power component 301 and the second power component 302 are arranged in an upper and lower hierarchy, the output voltage of the first power component 301 is transmitted to a first load via the first inductor 303, the output voltage of the second power component 302 is transmitted to a second load via the second inductor 304, and the first load and the second load are the same load or different loads.

[0037] It can be understood that the upper and lower hierarchy is in a direction perpendicular to the PCB, in the vertical direction of the mounting plane (for example, the PCB) of the power conversion module (which can be the mounting direction of the power conversion module), the first power component and the second power component are located in different levels, the first power component is located in one layer, the second power component is located in another layer, and the first power component and the second power component do not overlap in the direction perpendicular to the PCB. In addition, the projections of the first power component and the second power component on the mounting plane of the power conversion module can at least partially overlap.

[0038] In this embodiment, the first power component and the second power component are core components of the entire power conversion system, mainly responsible for power conversion tasks, and can internally integrate Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) and driving units. The first power component can be used to perform a voltage conversion task of a first phase, and the second power component can be used to perform a voltage conversion task of a second phase. Here, the first phase and the second phase can be with respect to the input power of the load, and different phases mean different parts of the input power. For a load, the input power of all phases can collectively form a power supply system of the load. In this way, the requirements of the load on the input power can be reduced.

[0039] The output voltage of the first power component can be transmitted to the first load via the first inductor, and the output voltage of the second power component can be transmitted to the second load via the second inductor. The first inductor and the second inductor can be elements for transmitting and filtering electric energy. On the one hand, the first inductor and the second inductor can transmit the output voltage of the first power component and the output voltage of the second power component to the corresponding load, and on the other hand, through the energy storage and release characteristics, the first inductor and the second inductor can stabilize the current output to the corresponding load.

[0040] It should be noted that as a key magnetic device in the voltage conversion process, the inductor is used to store and release energy. In the power conversion circuit, when the current passes through the inductor, the inductor can store or release corresponding energy according to the change of the current. This characteristic enables the inductor to smooth the current and stabilize the voltage output in the voltage conversion process, effectively avoiding the mutation and fluctuation of the voltage, thereby ensuring the integrity and reliability of the voltage conversion circuit and ensuring that the entire power supply system can continuously and stably output the required voltage, providing a solid power guarantee for the normal operation of the subsequent circuit.

[0041] The first load and the second load can be components or devices that consume electric energy, and both can be the same or different. For the case where the first load and the second load are different, the types of the two can be the same or different. Alternatively, the first load and the second load can be processing components on the PCB to which the power conversion module is mounted, which can be but are not limited to one of the following: GPU, CPU, data processing unit (DPU), extreme processing unit (XPU), etc.

[0042] It should be noted that the VRM module layout provided in this embodiment uses the upper and lower placement of the two power components, which can reduce the board area, optimize the space utilization of the PCB, and significantly reduce the occupied area of the VRM module on the circuit board. It can provide more ample space for the arrangement of other components or assemblies in the limited board space, effectively improving the overall layout rationality of the circuit board. For GPUs, the above VRM module layout has a smaller volume, which can adapt to the rapid development of GPU technology, ensure the performance and stability of electronic devices, and achieve higher space utilization and more efficient power transmission.

[0043] Through the embodiments provided in the present application, the power conversion module includes: a first power component, a second power component, a first inductor and a second inductor, the first power component and the second power component are arranged in an upper and lower level, wherein the first power component is used to perform a voltage conversion task of a first phase, and the output voltage of the first power component is transmitted to a first load via the first inductor; the second power component is used to perform a voltage conversion task of a second phase, and the output voltage of the second power component is transmitted to a second load via the second inductor, wherein the first load and the second load are the same load or different loads, which can solve the problem of insufficient space of the PCB in the related art and improve the space utilization of the PCB.

[0044] In some exemplary embodiments, the first power supply component 301 is located on the first power supply layer, and the second power supply component 302 can be located on the second power supply layer. In order to facilitate the layout of inductors, the first inductor 303 and the second inductor 304 can be located on the inductor layer. In order to further compress the volume of the VRM module, reduce the area occupied by the VRM module, and at the same time improve the stability of the VRM module, the power conversion module can further include a first circuit board and a second circuit board, and can adopt a 5-layer 3D stacking manner, that is, the first power supply layer, the first circuit board, the inductor layer, the second power supply layer and the second circuit board are stacked in turn, wherein for the first circuit board, one side adjacent to the first power supply layer is connected with the first power supply component 301, and the other side is connected with the input end of the first inductor 303; for the second circuit board, one side adjacent to the second power supply layer is connected with the output end of the first inductor 303, the output end of the second inductor 304 and the second power supply component 302. Through such a stacking structure, the compact arrangement of various components inside the VRM module can be realized, the space utilization can be optimized, and support can be provided for the miniaturization and high performance development of electronic devices.

[0045] In the present embodiment, the VRM module adopts a 5-layer 3D stacking structure, which can greatly reduce the width of the VRM module from the existing 10 mm (millimeters) to 6 mm. This optimization of size greatly reduces the area occupied by the VRM module, so that a larger number of VRM modules can be placed in the limited space of the board card, thereby being able to more effectively adapt to the increasing power demand of processing components such as GPUs, and providing sufficient power support for the stable operation of the processing components.

[0046] In addition, due to the significant reduction in the width of the VRM module, it can be placed closer to the processing component. On the one hand, such optimization in layout can effectively reduce the conduction loss on the PCB and reduce unnecessary consumption of energy during transmission. On the other hand, such optimization in layout is also beneficial to improve the dynamic performance of the VRM module, so that it can respond more quickly and stably to the power changes of the processing component, and ensure the efficient operation of the entire system. At the same time, the reduction of the VRM is also beneficial to the high-speed signal wiring, which is beneficial to shorten the length of the high-speed signal wiring and improve the quality of the high-speed signal.

[0047] Optionally, the first circuit board and the second circuit board can be PCBs. For the first circuit board, one side adjacent to the first power layer (which can be the top side) can be connected with the first power component and other components by welding, plugging or connector connection, etc., and the other side (which can be the bottom side) can be connected with the input end of the first inductor by welding, plugging or connector connection, etc.; similarly, for the second circuit board, one side adjacent to the second power layer (which can be the top side) can be connected with the output end of the first inductor, the output end of the second inductor and the second power component by welding, plugging or connector connection, etc., and the other side can be connected to the mounting plane such as the mainboard. For example, in the embodiment, the one side of the first circuit board adjacent to the first power layer can be connected with the first power component by welding, and the one side of the second circuit board adjacent to the second power layer can be connected with the output end of the first inductor, the output end of the second inductor and the second power component by welding.

[0048] A printed circuit board (PCB) is also called a printed wiring board or a printed line board. It is called a "printed" circuit board because it is made by using electronic printing. The printed circuit board is a substrate for assembling electronic components. It is an insulating board as a base material, cut into a certain size, with at least one conductive pattern attached, and has holes (such as component holes, fastening holes, and metalized holes), which are used to replace the bottom disc of the device electronic components. The main function of the printed circuit board is to connect various electronic components to form a predetermined circuit, and to play a relay transmission role. It is a key electronic interconnection of electronic products. The printed circuit board, as a substrate for loading electronic components and a key interconnection, is required for any electronic device or product.

[0049] For the case where the first circuit board and the second circuit board are PCBs, the layers of the PCB refer to copper layers, and the PCB can be made by pressing the copper layers and the base material. The number of layers of the first circuit board and the second circuit board is not limited in the embodiment. For example, the first circuit board can be a four-layer printed circuit board or a six-layer printed circuit board, and the second circuit board can also be a four-layer printed circuit board or a six-layer printed circuit board.

[0050] Optionally, according to the classification of the circuit layers of the PCB, the PCB can be classified into single-sided boards, double-sided boards and multi-layer boards. Common multi-layer boards are generally 4-layer boards or 6-layer boards, and complex multi-layer boards can reach dozens of layers. The single-sided board is the most basic PCB, and the components are concentrated on one side, and the wires are concentrated on the other side. The printed circuit board with wires appearing on only one side is called a single-sided board. The double-sided board has wiring on both sides, but in order to use the wires on both sides, there must be appropriate circuit connections between the two sides. The "bridge" between such circuits is called a via. The via is a small hole filled or coated with metal on the printed circuit board, which can connect the wires on both sides. Because the area of the double-sided board is twice that of the single-sided board, the double-sided board solves the difficulty of wiring intersection (which can be connected to the other side through the via), and is more suitable for use in more complex circuits than the single-sided board. The multi-layer board has more wiring area, and the multi-layer board can be a combination of single-layer boards and double-layer boards, for example, a printed circuit board with one double-sided inner layer and two single-sided outer layers, which is alternately connected through a positioning system and an insulating adhesive material and has conductive patterns interconnected according to design requirements, is a four-layer printed circuit board, also known as a multi-layer printed circuit board. For another example, a printed circuit board with two double-sided inner layers and two single-sided outer layers, which is alternately connected through a positioning system and an insulating adhesive material and has conductive patterns interconnected according to design requirements, is a six-layer printed circuit board.

[0051] In the embodiment, the first power component and the second power component are respectively placed in the first power layer and the second power layer, and the first inductor and the second inductor are located in the inductor layer. The first circuit board is connected with the first power component and the first inductor, and the first circuit board can transmit the output voltage of the first power component to the first inductor. The second circuit board is connected with the second power component and the second inductor, and the second circuit board can transmit the output voltage of the second power component to the second inductor. In other embodiments, the inductor layer can also include other numbers of inductors, such as a third inductor, a fourth inductor, etc., which are not limited here.

[0052] For example, the 5-layer 3D stacking structure of the VRM module can be as follows Figure 4 and Figure 5 from top to bottom, the first layer to the fifth layer, wherein the first layer is the first power layer, and the power component 3 (i.e., the first power component 301) is located in the first power layer; the second layer is the upper PCB (i.e., the first circuit board); the third layer is the inductor layer, and the inductor L1 (i.e., the first inductor 303) and the inductor L2 (i.e., the second inductor 304) are located in the inductor layer; the fourth layer is the second power layer, and the power component 4 (i.e., the second power component 302) is located in the second power layer; and the fifth layer is the lower PCB (i.e., the second circuit board).

[0053] The upper layer PCB mainly plays the role of interconnection and support. All the devices in the first layer, including the power component 3, are soldered on the top surface of the upper layer PCB, realizing the electrical connection between the devices. At the same time, the bottom surface of the upper layer PCB is soldered with the inductor, not only realizing the vertical interconnection of the circuit, but also providing stable support for the inductor, ensuring the stability of the inductor during the operation of the circuit, avoiding the displacement or damage of the inductor due to external force or vibration, and ensuring the reliability of the entire circuit system.

[0054] The lower layer PCB plays an important role in interconnection and fixation in the entire 5-layer 3D stacked structure. The top surface of the lower layer PCB is soldered with the power component 4, the inductor, etc., realizing the electrical interconnection of the devices in the third layer and the fourth layer with the lower layer PCB. The bottom surface of the lower layer PCB can be soldered to the mainboard, establishing a stable mechanical connection and reliable electrical interconnection with the mainboard, fixing the entire 5-layer 3D stacked structure to the mainboard, ensuring the stable operation of the circuit system in the mainboard environment, and facilitating the cooperative work with other mainboard circuits and elements, realizing the functional integration and performance optimization of electronic equipment.

[0055] It should be noted that, in addition to the first power component, the first power layer can also be provided with other power components, and the plurality of power components on the first power layer can be arranged adjacent to or at a certain distance apart, and the same or different inductors can be used, for example, three power components are arranged side by side on the first power layer, and the three power components share one inductor. Similarly, in addition to the second power component, the second power layer can also be provided with other power components, and the plurality of power components on the second power layer can be arranged adjacent to or at a certain distance apart, and the same or different inductors can be used. The increase of the power components can perform more phase voltage conversion tasks, accordingly, the structure and component arrangement mode of the power conversion module will be different, which can be designed according to the needs, which will not be described here in the embodiment.

[0056] Through the embodiments of the present application, the VRM module adopts a 5-layer 3D stacked structure, realizing the compact arrangement of the components inside the power conversion module, which can further compress the volume of the VRM module and reduce the board area occupied by it.

[0057] In some exemplary embodiments, the inductor layer can also include a magnetic core, which is a core component in the inductor for enhancing the magnetic field strength and controlling the magnetic flux path, usually made of magnetic materials, such as ferrite or metal powder core. In order to effectively save space, the first inductor and the second inductor can be coupled to each other and share the magnetic core.

[0058] Here, in an inductor component, if the magnetic flux generated by each coil in two or more coils intersects with the other coil, these coils are said to have magnetic coupling or mutual induction. Assuming that these coils are stationary and ignoring the resistance in the coils and the distributed capacitance between turns, the coils with magnetic coupling can be represented as idealized coupled inductors, or coupled inductors for short.

[0059] For example, the VRM module can adopt a two-phase coupled inductor structure, such as Figure 6 As shown, the two-phase coupled inductor structure includes a first-phase winding, a second-phase winding, and a magnetic core. The first-phase winding is inductor L1, which is soldered to the upper PCB via upper pads and to the lower PCB via lower pad 1. The second-phase winding is inductor L2, which is soldered to the lower PCB via lower pads 2 and 3. The magnetic core serves as the main supporting component of the entire coupled inductor structure, and both phase windings share the same core. This design effectively saves space.

[0060] Through the embodiments of the present application, the first inductor and the second inductor are coupled to each other and share a magnetic core, which can effectively save circuit board space and improve the energy conversion efficiency and electromagnetic compatibility of the inductor during the voltage conversion process.

[0061] In some exemplary embodiments, the first inductor and the second inductor can be designed to be reverse-coupled, thereby effectively reducing the inductance and size of the inductors while significantly improving the response speed of power conversion, providing strong support for the efficient operation of electronic devices. To reverse-couple the first and second inductors, the magnetic field lines of the first inductor and the magnetic field lines of the second inductor can be in opposite directions.

[0062] Magnetic field lines are a visual way to describe magnetic field distribution. They provide a visual representation of the direction and strength of the magnetic field. They typically originate from the north pole of a magnet and circle around it, returning to the south pole. Back-coupling occurs when the magnetic fields of two or more inductors are directed in opposite directions, canceling or weakening each other's magnetic effects.

[0063] For example, Figure 7 for Figure 6 The side view of the two-phase coupled inductor shown in Figure 7 As shown, the magnetic field lines formed by the first phase winding are in opposite directions to the magnetic field lines formed by the second phase winding. This structure with opposite directions of the magnetic field lines can achieve reverse coupling of the inductance.

[0064] Through the embodiments of the present application, the inductors of the two VRs share a magnetic core and form a reverse coupling relationship. Through this reverse coupling relationship, the magnetic field interference of the inductor itself can be offset, the performance of the inductor can be optimized, and the inductance value of the inductor can be effectively reduced, thereby improving the dynamic response capability of the VRM module, so that it can be adjusted more quickly and accurately when facing the rapidly changing power requirements of processing components such as GPUs, providing a more stable and reliable power supply for the processing components. In addition, the inductor can have a smaller size while meeting performance requirements, better adapting to the miniaturization and high performance requirements of electronic equipment.

[0065] In some exemplary embodiments, the first inductor has a Z-shaped structure in the magnetic core, and the second inductor has an N-shaped structure in the magnetic core.

[0066] The first inductor can have a Z-shaped structure in the magnetic core. It can be understood that during the winding process of the first inductor, there can be two turns, first extending in a first direction, then turning at a certain angle and extending in a second direction, and then turning at a certain angle again and extending in a third direction. The third direction can be parallel to the first direction.

[0067] It should be noted that the angle of the two turns can be 90 degrees or other angles (for example, an angle between 80 degrees and 100 degrees). The Z-shaped structure can be rotated to a certain angle, mirror-flipped or otherwise deformed, which is not specifically limited in this embodiment.

[0068] The second inductor may have an n-shaped structure in the magnetic core. It is understood that during the winding process of the second inductor, the winding first extends in one direction, then bends, and then extends parallel to the initial direction (or approximately parallel to the initial direction), forming an n-shaped structure.

[0069] For example, Figure 6 As shown in the figure, the first-phase winding has a Z-shaped structure within the core, while the second-phase winding has an N-shaped structure within the core. This winding structure design enables the two inductors to achieve reverse coupling, thereby improving the overall performance of the inductor. The two-phase windings share a magnetic core, which helps achieve reverse coupling, further optimizing the performance of the inductor and enhancing its application effect in the circuit.

[0070] Through the embodiments of the present application, the first inductor and the second inductor respectively adopt Z-shaped and n-shaped winding structures, which can optimize the reverse coupling effect of the inductor, while reducing the eddy current loss inside the inductor, reducing energy consumption, and improving power conversion efficiency.

[0071] In some exemplary embodiments, the first inductor can be connected to the first circuit board via a first connection point (e.g., a solder joint), where the first connection point, serving as the input terminal of the first inductor, belongs to the same power supply network as the phase control pin of the first power supply component. This structure ensures that the first inductor can accurately receive the voltage signal output by the first power supply component. The first inductor can be connected to the second circuit board via a second connection point, where the second connection point, serving as the output terminal of the first inductor, belongs to the same power supply network as the voltage output terminal of the power conversion module. This structure allows the output voltage of the first power supply component to be transmitted to subsequent circuits.

[0072] Here, the phase pin is used to control the different phases of power conversion. In a multiphase power conversion system, the signals from the phase pin can coordinate the operation of each inductor to achieve higher conversion efficiency and stability. The same power network can refer to an electronic circuit in which multiple electronic components or assemblies share the same voltage source or current source. The electrical connections between them form a closed circuit path. All components within this path are subject to the same power constraints and influences. In other words, if two or more electronic components belong to the same power network, they will share the same power supply voltage or current on the same line.

[0073] In this embodiment, when the phase-controlled pin of the first power component and the first connection point are in the same power network, the phase-controlled pin of the first power component is directly transmitted to the first inductor through the first connection point, eliminating the need for additional voltage regulation or conversion. Similarly, the second connection point, serving as the output terminal of the first inductor, belongs to the same power network as the voltage output terminal of the power conversion module. The output terminal of the second inductor can be directly connected to the power supply line of the load (such as a GPU) through the second connection point.

[0074] For example, Figure 6 As shown, the upper pad is soldered to the upper PCB and primarily serves as the input of inductor L1. It is in the same power network as the Phase pin voltage of power supply component 3, ensuring that inductor L1 can accurately receive the voltage signal output by power supply component 3. Lower pad 1, serving as the output of inductor L1, belongs to the output voltage (VOUT) power network and is responsible for outputting the voltage signal converted by inductor L1 to subsequent circuits.

[0075] In this embodiment, the input end of the first inductor and the phase-controlled pin of the first power supply component belong to the same power network, and the output end of the first inductor and the voltage output end of the power conversion module belong to the same power network. This reduces the signal transmission distance between multilayer circuit boards and reduces signal loss and delay caused by wiring. Furthermore, this direct electrical connection method enables rapid response and transmission of voltage signals, avoiding signal reflections and electromagnetic interference on the multilayer circuit boards, thereby improving power conversion efficiency and the stability of the entire power conversion module.

[0076] In some exemplary embodiments, the second inductor is connected to the second circuit board via a third connection point, wherein the third connection point, serving as the input terminal of the second inductor, belongs to the same power network as the phase control pin of the second power supply component. The second inductor is connected to the second circuit board via a fourth connection point, wherein the fourth connection point, serving as the output terminal of the second inductor, belongs to the same power network as the voltage output terminal of the power conversion module.

[0077] In this embodiment, when the phase-controlled pin of the second power component and the third connection point are in the same power network, the phase-controlled pin of the second power component is directly transmitted to the second inductor through the third connection point without any additional voltage regulation or conversion. Similarly, if the fourth connection point, as the output terminal of the second inductor, and the voltage output terminal of the power conversion module are in the same power network, the output terminal of the second inductor is directly connected to the power supply line of the load (such as a GPU) through the fourth connection point.

[0078] For example, Figure 6 As shown, the lower pad 2 serves as the input end of the inductor L2 and is in the same power supply network as the Phase pin voltage of the power supply component 4, ensuring that the inductor L2 can accurately receive the voltage signal output by the power supply component 4; the lower pad 3 serves as the output end of the inductor L2 and also belongs to the output voltage (VOUT) power supply network, outputting the voltage signal converted by the inductor L2 to the subsequent circuit, providing guarantee for the stable operation of the entire circuit system.

[0079] In the embodiments of the present application, the second inductor is connected to the second circuit board via the third connection point, and the second inductor is connected to the second circuit board via the fourth connection point. This reduces the signal transmission distance between the multi-layer circuit boards, reducing signal loss and delay caused by wiring. Furthermore, this direct electrical connection allows for rapid response and transmission of voltage signals, avoiding signal reflections and electromagnetic interference on the multi-layer circuit boards, thereby improving the efficiency of power conversion and the stability of the entire power conversion module.

[0080] In some example embodiments, in order to ensure stable connection between the inductor and the second circuit board (e.g., the lower PCB), effectively disperse the pressure of the inductor on the lower elements, and avoid the inductor of the third layer from crushing the power component of the fourth layer, the lower pad of the inductor can be structurally improved and modified into a soldering leg mode. The soldering leg can be accurately inserted into the soldering hole reserved on the second circuit board, and the size of the soldering hole matches the size of the soldering leg.

[0081] Optionally, for the first inductor, the second connecting point can be a soldering leg, which is inserted into a soldering hole on the second circuit board to connect the second connecting point to the second circuit board. After the second connecting point is inserted into the soldering hole on the second circuit board, a soldering operation can be performed to connect the second connecting point to the second circuit board.

[0082] Optionally, for the second inductor, the third connecting point and the fourth connecting point can both be soldering legs, which are inserted into different soldering holes on the second circuit board to connect the third connecting point and the fourth connecting point to the second circuit board. After the third connecting point and the fourth connecting point are inserted into the soldering holes on the second circuit board, a soldering operation can be performed to connect the third connecting point and the fourth connecting point to the second circuit board.

[0083] Here, the soldering leg is a kind of electronic component connection mode, which usually refers to the metal leg protruding from the bottom of the inductor, capacitor or other electronic components, used to be inserted into the soldering hole on the circuit board and fixed by soldering to form electrical connection. The soldering hole can be a small hole on the circuit board, usually plated with conductive metal such as copper or nickel to allow the soldering leg to be inserted and connected by melting solder to achieve electrical connection between the component and the circuit board.

[0084] By using the insertion connection of the soldering leg and the soldering hole, the stability of the electrical connection between the input and output terminals of the inductor and the second circuit board can be improved, the resistance at the connection is reduced, and the efficiency of power conversion is optimized, thereby improving the durability and reliability of the VRM module.

[0085] In some example embodiments, the soldering leg of the inductor can adopt a stepped soldering leg (soldering leg with stepped structure), i.e., a stepped structure (a convex structure) is added to the pin of the inductor. The size of the uppermost step is smaller than the size of the soldering hole, so it can be inserted into the soldering hole, and the size of the next step is larger than the size of the soldering hole, so it can be clamped outside the soldering hole. This stepped soldering leg can ensure the stability of soldering, thereby forming a safe gap between the magnetic core and the second circuit board, facilitating the layout of the second power component.

[0086] It is understandable that the welding pins under the inductor adopt a stepped design. This design can effectively avoid the risk of damage caused by the inductor directly pressing on the power supply components below, while enhancing the connection stability between the inductor and the circuit board, increasing the reliability of the entire design, and ensuring the stability and reliability of the VRM module during long-term operation.

[0087] Optionally, for the first inductor, the second connection point can be a stepped solder pin (i.e., a step structure is added to the pin of the first inductor). The height of the gap formed between the magnetic core and the second circuit board by the second connection point inserted into the solder hole on the second circuit board is greater than the height of the second power supply component. This structure provides a sufficient safety gap between the first inductor and the second power supply component, effectively preventing the inductor from causing damage to the second power supply component due to compression or collision during installation or use, thereby ensuring the safety of the second power supply component and the reliability of the entire circuit system.

[0088] Optionally, for the second inductor, the third connection point and the fourth connection point can both be stepped solder feet. The height of the gap between the magnetic core and the second circuit board formed by inserting the third connection point and the fourth connection point into the corresponding solder holes on the second circuit board is greater than the height of the second power supply component. Through the above structure, a sufficient safety gap is reserved between the second inductor and the second power supply component, effectively preventing the inductor from causing extrusion or collision damage to the second power supply component during installation or use, thereby ensuring the safety of the second power supply component and the reliability of the entire circuit system.

[0089] For example, Figure 8 As shown, in the VRM module, a safety gap is provided between the inductor and the power supply component 4, and the solder legs of the first-phase winding and the second-phase winding are stepped. Furthermore, the solder legs of the power busbar (used for transmitting power current between circuit boards) can also be stepped.

[0090] Through this embodiment, the connection point between the inductor and the second circuit board adopts a stepped solder foot, and ensures that the height of the gap between the magnetic core and the second circuit board is greater than the height of the second power supply component. This not only ensures a stable connection between the inductor and the second circuit board, but also provides the necessary physical avoidance space for the second circuit board, which can further disperse the pressure of the inductor on the underlying components, effectively avoid the inductor from crushing the second circuit board, and improve the safety and reliability of the entire power conversion module.

[0091] In some exemplary embodiments, to ensure efficient interconnection and transmission of power and signals between upper and lower circuit boards (e.g., upper and lower PCBs), a copper busbar can be fixed to the inductor. This reduces signal transmission losses and interference, improves power transmission efficiency and stability, and ensures improved performance of the entire module.

[0092] Optionally, a signal copper busbar may be fixed on the surface of the magnetic core, wherein two ends of the signal copper busbar are respectively connected to the first circuit board and the second circuit board, and the signal copper busbar is used for signal transmission between the first circuit board and the second circuit board.

[0093] The signal copper bus is used to transmit one or more signals of the first power supply component, for example, one or more of an input voltage (VIN) signal, a pulse width modulation (PWM) signal, and a current monitoring (Imon) signal. It can also be used to transmit other signals, which is not limited in this embodiment.

[0094] Optionally, a power copper busbar may be fixed on the surface of the magnetic core, wherein two ends of the power copper busbar are respectively connected to the first circuit board and the second circuit board, and the power copper busbar is used to transmit power current between the first circuit board and the second circuit board.

[0095] The width of the signal copper busbar can be the same as or different from the width of the power copper busbar. Considering that the power current is larger than the current required for signal transmission, the width of the signal copper busbar can be smaller than the width of the power copper busbar to ensure signal transmission reliability while reducing costs. The number of signal copper busbars and power copper busbars can be the same or different. There can be one or more signal copper busbars and one or more power copper busbars, which is not limited in this embodiment.

[0096] For example, the input voltage (VIN), PWM signal, and output IMON signal required by power supply component 3 need to be transmitted to the mainboard via the upper PCB to ensure the feasibility of the VRM module. To this end, copper busbars can be fixed on both sides of the inductor to interconnect the power and signal between the upper and lower PCBs.

[0097] like Figure 9 As shown, copper bars of different sizes can be fixed on the surface of the inductor's magnetic core. The narrow copper bars are signal copper bars for transmitting signals, and the wide copper bars are power copper bars for transmitting power current. The upper pads of these copper bars are welded to the upper PCB, and the lower pads of the copper bars are welded to the lower PCB, thereby building a stable and reliable power and signal transmission channel, ensuring that the various signals and power required by the power supply component 3 can be accurately transmitted to the mainboard, ensuring the normal operation of the entire circuit system.

[0098] According to the embodiments of the present application, the signal copper bar is fixed on the surface of the magnetic core and connected with the first circuit board and the second circuit board, forming a direct signal transmission channel, which can reduce the length of signal transmission on the PCB, more stable and reliable transmission of signals, reduce the electromagnetic interference and loss in the process of signal transmission; the power copper bar is fixed on the surface of the magnetic core and connected with the first circuit board and the second circuit board, forming a direct power transmission channel, which can reduce the length of power transmission on the PCB, more stable and reliable transmission of power, reduce the loss in the process of power transmission; the width of the power copper bar is greater than that of the signal copper bar, which not only can improve the efficiency of power transmission, but also can reduce the resistance loss in the process of current transmission and improve the efficiency of power conversion.

[0099] In some exemplary embodiments, in order to facilitate the layout of components and reduce the interference between signals, the signal copper bar and the power copper bar can be located between the first inductor and the second inductor and fixed on different sides of the magnetic core.

[0100] In the present embodiment, the signal copper bar transmits weak electric signals, such as the input voltage signal, the pulse modulation signal and the current monitoring signal mentioned above; the power copper bar transmits power current (large current), therefore, arranging the signal copper bar and the power copper bar between the first inductor and the second inductor and fixing them on different sides of the magnetic core can reduce the mutual interference between the power current and the weak electric (signal).

[0101] According to the embodiments of the present application, arranging the signal copper bar and the power copper bar between the first inductor and the second inductor and fixing them on different sides of the magnetic core can improve the accuracy of signal transmission and the stability of power current transmission, and improve the performance and reliability of the power conversion module.

[0102] In some exemplary embodiments, a filter capacitor can be used to improve the reliability of the power components. The first circuit board can further be connected with a first group of capacitors in parallel on the side adjacent to the first power layer, wherein one end of the first group of capacitors is connected with the input end of the first power component and the other end is grounded, for filtering the input voltage of the first power component. The second circuit board can further be connected with a second group of capacitors in parallel on the side adjacent to the second power layer, wherein one end of the second group of capacitors is connected with the input end of the second power component and the other end is grounded, for filtering the input voltage of the second power component.

[0103] It should be noted that the number of the first group of capacitors can be one or more, and the number of the second group of capacitors can also be one or more, for example, the number of the first group of capacitors is 1, 2 or 4, and the number of the second group of capacitors is 1, 2 or 4. The actual situation can be set, which is not specifically limited here.

[0104] Here, the first group of capacitors and the second group of capacitors can each be a filter capacitor. The filter capacitor refers to a storage device installed at both ends of a rectifier circuit to reduce the alternating ripple coefficient and improve the high-efficiency smooth DC output. Since the filter circuit requires a storage capacitor with a large capacity, the most commonly used is an electrolytic capacitor with a capacity of hundreds to thousands of microfarads. The positive terminal of the electrolytic capacitor is connected to the positive terminal of the rectifier output circuit, and the negative terminal of the electrolytic capacitor is connected to the negative terminal of the circuit. The setting of the filter capacitor makes the working performance of the electronic circuit more stable, and also reduces the interference of alternating ripple on the electronic circuit.

[0105] In order to obtain good filtering effect, the capacitor discharge must be slow. The slower the capacitor discharge, the smoother the output voltage and the better the filtering effect. The speed of capacitor discharge is related to the capacity C and the load R. The larger C and R, the slower the capacitor discharge. In addition, in order to be suitable for use at different frequencies, electrolytic capacitors are also divided into high-frequency capacitors and low-frequency capacitors. The so-called high frequency is relative. The low-frequency filter capacitor is mainly used for power supply filtering or filtering after transformer rectification, and its working frequency can be 50 Hz (Hz). The high-frequency filter capacitor mainly works in the filtering after the rectification of the switching power supply, and its working frequency is several kHz to several ten kHz. The frequency of the sawtooth wave voltage is as high as tens of kHz, or even tens of MHz. The standard for measuring the advantages and disadvantages of high-frequency aluminum electrolytic capacitors is the "impedance-frequency" characteristic. It is required to have a lower equivalent impedance within the working frequency of the switching power supply, and at the same time, it has a good filtering effect on the high-frequency peak signal generated by the semiconductor device when it works.

[0106] In the embodiment, the first group of capacitors can filter the input voltage of the first power supply component to filter out high-frequency interference signals and ensure that the voltage input to the first power supply component is stable and reliable, thereby providing higher-quality power input for the first-phase voltage conversion; the second group of capacitors can filter the input voltage of the second power supply component to filter out high-frequency interference signals and ensure that the voltage input to the second power supply component is stable and reliable, thereby providing higher-quality power input for the second-phase voltage conversion, ensuring the accuracy and reliability of the voltage conversion, and thereby laying a foundation for the stable operation of the entire circuit system.

[0107] Through the embodiment of the present application, the parallel first group of capacitors and the parallel second group of capacitors can effectively filter out the noise of the power input, suppress the voltage fluctuation and high-frequency interference of the power input end, and improve the stability of the power conversion process.

[0108] In some exemplary embodiments, in order to facilitate the layout of the first group of capacitors, the first group of capacitors can include two filter capacitors arranged on both sides of the first power supply component. In order to facilitate the layout of the second group of capacitors, the second group of capacitors can include two filter capacitors arranged on both sides of the second power supply component.

[0109] For example, the reference circuit diagram of the VRM module can be as shown in Figure 10 In the Figure 10 , as the core components of the entire power conversion system, the power component 3 and the power component 4 are mainly responsible for the power conversion task. The working principle is: receiving the input voltage (VIN), and then processing inside the component (including but not limited to voltage regulation, voltage stabilization, etc. Operation); after processing, the converted voltage is accurately output through the Phase pin, and when the voltage passes through the inductor, a stable output voltage (VOUT) is further generated, providing reliable power support for the subsequent circuit. In addition, the PWM pin is responsible for receiving the pulse modulation signal from the outside, accurately controlling the rhythm and amplitude of the power conversion, ensuring the accuracy and stability of the output voltage; the Imon pin undertakes the task of monitoring the current information of the component, and outputs the current information in real time, providing key data feedback to the system, so as to timely discover and handle possible current abnormal situations, and guarantee the safe and reliable operation of the power supply system.

[0110] The filter capacitor C1, the filter capacitor C2, the filter capacitor C3 and the filter capacitor C4 are connected to the input voltage (VIN) at one end, and are connected to the ground (GND) at the other end. The main function of these filter capacitors is to filter out high-frequency interference signals in the input voltage (VIN), improve the power quality, provide a more pure and stable input voltage for the power conversion process, and thus improve the reliability of the power conversion and reduce the conversion error or system failure caused by voltage fluctuation or interference. In terms of layout, the filter capacitor C1 and the filter capacitor C2 are placed close to the power component 3. Such layout design helps to quickly and effectively filter out the input voltage interference near the power component 3 when the power component 3 is working, ensuring the stable operation of the power component 3. Similarly, the filter capacitor C2 and the filter capacitor C3 are placed close to the power component 4, providing close filter support for the power component 4, ensuring that both power components can work in a relatively pure voltage environment, and cooperatively complete the power conversion task.

[0111] The 5-layer 3D stacking structure of the VRM module can be as shown in Figure 11 , Figure 12 and Figure 13As shown. Among them, for the first layer, the layer is equipped with power component 3 and filter capacitor C1 and filter capacitor C2. Power component 3 cooperates with filter capacitor C1 and filter capacitor C2 to mainly undertake the voltage conversion task of the first phase. Power component 3 is responsible for the voltage conversion process of the core, and filter capacitor C1 and filter capacitor C2 filter the input voltage to filter out high-frequency interference signals, ensure the stability and reliability of the voltage input to power component 3, provide high-quality power input for the first phase voltage conversion, and guarantee the precision and reliability of the voltage conversion, thereby laying a foundation for the stable operation of the entire circuit system. All devices in the first layer (including power component 3, filter capacitor C1 and filter capacitor C2) are welded on the top surface of the upper layer PCB (second layer). The third layer is an inductor layer, which can include a first phase winding, a second phase winding and a magnetic core, wherein a signal copper bar, a power copper bar and the like can be fixed on the surface of the magnetic core. The fourth layer is provided with power component 4 and filter capacitor C3 and filter capacitor C4, which are mainly responsible for the voltage conversion of the second phase. The top surface of the lower layer PCB (fifth layer) is welded with power component 4, filter capacitor C3 and filter capacitor C4, and inductors.

[0112] Through the embodiments of the present application, the filter capacitor is arranged on both sides of the power component, which can reduce the signal path between the capacitor and the power component, and further improve the filtering effect and the overall performance of the circuit.

[0113] In some exemplary embodiments, the filter capacitors in the first group of capacitors and the filter capacitors in the second group of capacitors can each be a multi-layer ceramic capacitor.

[0114] In the present embodiment, in the selection of filter capacitors of power components, small-size multi-layer ceramic capacitors (MLCC) can be selected. Such capacitors not only have the advantage of small size, which can effectively reduce the space occupation on the circuit board, but also have excellent electrical performance. The stable filtering effect of MLCC can better suppress power noise, increase the reliability of the entire module design, and ensure the stability and purity of the power output.

[0115] For example, the filter capacitors C1, C2, C3 and C4 can be small size filter capacitors, which can complete efficient filtering function in limited space and meet the needs of compact layout of the device. Among them, the filter capacitor with 0201 size (a size of filter capacitor) has a smaller package size, which can occupy less space on the circuit board, thereby providing more layout space for other elements, which is conducive to the high integration and miniaturization design of the entire circuit system. At the same time, the small size filter capacitor has better performance in high frequency application, and its parasitic inductance and parasitic resistance are relatively small, which can effectively filter out high frequency interference signals, improve power quality and ensure the reliability of power conversion.

[0116] Through the embodiments of the present application, the multilayer ceramic capacitor can provide large capacity filtering in limited space, reduce the wiring complexity of the PCB, and at the same time ensure the filtering effect of the power input end.

[0117] According to another aspect of the embodiments of the present application, an electronic device is also provided, which can be a server or similar device with a PCB. Optionally, in the present embodiment, the electronic device can include a power conversion module, a mainboard and a group of processing components, wherein the power conversion module and the group of processing components are connected to the mainboard, and the power conversion module can be any power conversion module provided in the foregoing embodiments.

[0118] Optionally, in the present embodiment, the power conversion module can include a first power component, a second power component, a first inductor and a second inductor, and the first power component and the second power component are arranged in an upper and lower level. Among them, the first power component is used to perform the voltage conversion task of the first phase, wherein the output voltage of the first power component is transmitted to the first processing component in the group of processing components via the first inductor; the second power component is used to perform the voltage conversion task of the second phase, wherein the output voltage of the second power component is transmitted to the second processing component in the group of processing components via the second inductor, wherein the first processing component and the second processing component are the same processing component or different processing components.

[0119] According to the embodiments provided in the present application, the electronic device includes a power conversion module, a mainboard and a set of processing components, the power conversion module and the set of processing components are connected to the mainboard; the power conversion module includes a first power component, a second power component, a first inductor and a second inductor, the first power component and the second power component are arranged in an upper and lower hierarchy, wherein the first power component is configured to perform a voltage conversion task of a first phase, and the output voltage of the first power component is transmitted to a first processing component in the set of processing components via the first inductor; the second power component is configured to perform a voltage conversion task of a second phase, and the output voltage of the second power component is transmitted to a second processing component in the set of processing components via the second inductor, the first processing component and the second processing component are the same processing component or different processing components, which can solve the problem of insufficient space of the PCB in the related art, and improve the space utilization of the PCB.

[0120] In some exemplary embodiments, the electronic device can be a server. One example of the server can be as shown in Figure 14 The server can include a plurality of power conversion modules, a load and a mainboard, wherein the plurality of power conversion modules are arranged at intervals on the lower surface of the mainboard, the load (for example, CPU, GPU, DPU, XPU, etc.) is arranged on the upper surface of the mainboard, and the plurality of power conversion modules are connected to the load through the via on the mainboard. As shown in Figure 10 The input ends of the plurality of power conversion modules are connected to the input voltage (VIN), and the output ends of the plurality of power conversion modules are connected in parallel to form the output voltage (VOUT) together to supply power to the load.

[0121] The number of power modules included in the server can be one or more, for example, the server can include 2, 3, 8 or other number of power conversion modules. The plurality of power conversion modules can be arranged uniformly (the distance between adjacent two power modules is equal) on the surface of the mainboard, or can be arranged non-uniformly (the distance between adjacent two power conversion modules is not equal) on the surface of the mainboard. The number of layers of the mainboard can be a single layer, a double layer or a multi-layer.

[0122] In the above server, the power supply components and the devices of the voltage inverter such as inductors are integrated into a power conversion module, and the integrated plurality of power conversion modules are directly attached to the back of the load, so that the power conversion module, the mainboard and the load are stacked in the vertical direction. Compared with the power supply architecture in the related art, the power supply path can be greatly shortened, the transmission impedance can be reduced, the copper loss of the printed circuit board path can be reduced, the power consumption of the server system can be reduced, the energy efficiency ratio can be improved, thereby helping the user to save the power cost. At the same time, the power conversion module can greatly reduce the area of the power supply device on the board, improve the power density of the server, and help to reduce the size of the printed circuit board and the server, and reduce the processing cost of the printed circuit board and the land cost of the data center. In addition, the power conversion module can release more printed circuit board area for high-speed input / output interfaces and memories, maximize system resource utilization, provide optimization space for signal wiring, and help to improve signal quality and anti-interference capability, and enhance system operation reliability.

[0123] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be realized by means of software and necessary general hardware platform, of course, it can also be realized by hardware, but in many cases, the former is a better implementation.

[0124] The skilled person can further realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be realized by electronic hardware, computer software or a combination of both. In order to clearly illustrate the interchangeability of hardware and software, the components and steps of the examples have been described in the above description in general terms. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0125] The above provides a detailed introduction to a power conversion module and an electronic device. The principles and implementation methods of the present application are described by applying specific examples. The above example description is only used to help understand the method and its core idea. It should be noted that for ordinary skilled persons in the technical field, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A power conversion module, characterized in that: include: A first power supply component, a second power supply component, a first inductor, a second inductor, a first circuit board, and a second circuit board, wherein the first power supply component and the second power supply component are arranged in upper and lower layers, wherein: The first power supply component is configured to perform a voltage conversion task of a first phase, wherein the output voltage of the first power supply component is transmitted to a first load via the first inductor; The second power supply component is configured to perform a voltage conversion task of a second phase, wherein the output voltage of the second power supply component is transmitted to a second load via the second inductor, wherein the first load and the second load are the same load or different loads; In a vertical direction of the installation plane of the power conversion module, the first power supply component and the second power supply component are located at different levels, the first power supply component is located on one layer, and the second power supply component is located on another layer, and the first power supply component and the second power supply component do not overlap in the vertical direction of the installation plane of the power conversion module; wherein the first power supply component and the second power supply component are both components responsible for power conversion tasks; The power conversion module is composed of the first to fifth layers from top to bottom, wherein the first layer is the first power layer, the first power component is located in the first power layer, the second layer is the first circuit board, the third layer is the inductor layer, the first inductor and the second inductor are located in the inductor layer, the fourth layer is the second power layer, the second power component is located in the second power layer, and the fifth layer is the second circuit board; the first power layer, the first circuit board, the inductor layer, the second power layer and the second circuit board are stacked in sequence.

2. The power conversion module according to claim 1, wherein: For the first circuit board, one side adjacent to the first power layer is connected to the first power component, and the other side is connected to the input end of the first inductor; For the second circuit board, a surface adjacent to the second power supply layer is connected to the output end of the first inductor, the output end of the second inductor, and the second power supply component.

3. The power conversion module according to claim 2, wherein: The inductor layer further includes a magnetic core, and the first inductor and the second inductor are coupled to each other and share the magnetic core.

4. The power conversion module according to claim 3, wherein: The magnetic field lines of the first inductor are in opposite directions to the magnetic field lines of the second inductor, so as to couple the first inductor and the second inductor in opposite directions.

5. The power conversion module according to claim 4, wherein: The first inductor is in a Z-shaped structure in the magnetic core, and the second inductor is in an N-shaped structure in the magnetic core.

6. The power conversion module according to claim 3, wherein: The first inductor is connected to the first circuit board via a first connection point, wherein the first connection point, serving as an input end of the first inductor, and the phase control pin of the first power supply component belong to the same power supply network; The first inductor is connected to the second circuit board via a second connection point, wherein the second connection point, serving as an output end of the first inductor, and the voltage output end of the power conversion module belong to the same power supply network.

7. The power conversion module according to claim 6, wherein: The second connection point is a solder foot, and the second connection point is inserted into a solder hole on the second circuit board to connect the second connection point to the second circuit board.

8. The power conversion module according to claim 7, wherein: The second connection point is a stepped solder foot, and the height of the gap between the magnetic core and the second circuit board formed by inserting the second connection point into the solder hole on the second circuit board is greater than the height of the second power supply component.

9. The power conversion module according to claim 3, wherein: The second inductor is connected to the second circuit board via a third connection point, wherein the third connection point, serving as an input end of the second inductor, and the phase control pin of the second power supply component belong to the same power supply network; The second inductor is connected to the second circuit board via a fourth connection point, wherein the fourth connection point, serving as an output end of the second inductor, and the voltage output end of the power conversion module belong to the same power supply network.

10. The power conversion module according to claim 9, wherein: The third connection point and the fourth connection point are both solder feet, and the third connection point and the fourth connection point are inserted into different solder holes on the second circuit board to connect the third connection point and the fourth connection point to the second circuit board.

11. The power conversion module according to claim 9, wherein: The third connection point and the fourth connection point are both stepped solder feet. The height of the gap between the magnetic core and the second circuit board formed by inserting the third connection point and the fourth connection point into the corresponding soldering holes on the second circuit board is greater than the height of the second power supply component.

12. The power conversion module according to claim 3, wherein: A signal copper bus is fixed on the surface of the magnetic core, wherein two ends of the signal copper bus are respectively connected to the first circuit board and the second circuit board, and the signal copper bus is used for signal transmission between the first circuit board and the second circuit board.

13. The power conversion module according to claim 12, wherein: The signal copper bus is used to transmit at least one of the following signals of the first power supply component: an input voltage signal, a pulse modulation signal, and a current monitoring signal.

14. The power conversion module according to claim 12, wherein: A power copper bus is also fixed on the surface of the magnetic core, wherein two ends of the power copper bus are respectively connected to the first circuit board and the second circuit board, and the power copper bus is used to transmit power current between the first circuit board and the second circuit board.

15. The power conversion module according to claim 14, wherein: The width of the signal copper bus is smaller than the width of the power copper bus.

16. The power conversion module according to claim 14, wherein: The signal copper busbar and the power copper busbar are located between the first inductor and the second inductor and are fixed on different sides of the magnetic core.

17. The power conversion module according to any one of claims 2 to 16, characterized in that: A first group of capacitors is connected in parallel to a surface of the first circuit board adjacent to the first power layer, and a second group of capacitors is connected in parallel to a surface of the second circuit board adjacent to the second power layer; wherein, The first group of capacitors has one end connected to the input terminal of the first power supply component and the other end grounded, and is used to filter the input voltage of the first power supply component; The second group of capacitors has one end connected to the input end of the second power supply component and the other end grounded, and is used to filter the input voltage of the second power supply component.

18. The power conversion module according to claim 17, wherein: The first group of capacitors includes two filter capacitors arranged on both sides of the first power supply component, and the second group of capacitors includes two filter capacitors arranged on both sides of the second power supply component.

19. The power conversion module according to claim 17, wherein: The filter capacitors in the first capacitor group and the filter capacitors in the second capacitor group are both multilayer ceramic capacitors.

20. An electronic device, characterized in that: include: A power conversion module, a mainboard, and a group of processing components, wherein the power conversion module and the group of processing components are both connected to the mainboard, the power conversion module includes a first power supply component, a second power supply component, a first inductor, a second inductor, a first circuit board, and a second circuit board, wherein the first power supply component and the second power supply component are arranged in an upper and lower layers, wherein: The first power supply component is configured to perform a voltage conversion task of a first phase, wherein an output voltage of the first power supply component is transmitted to a first processing component in the group of processing components via the first inductor; The second power supply component is configured to perform a voltage conversion task of a second phase, wherein an output voltage of the second power supply component is transmitted to a second processing component in the group of processing components via the second inductor, wherein the first processing component and the second processing component are the same processing component or different processing components; In a vertical direction of the installation plane of the power conversion module, the first power supply component and the second power supply component are located at different levels, the first power supply component is located on one layer, and the second power supply component is located on another layer, and the first power supply component and the second power supply component do not overlap in the vertical direction of the installation plane of the power conversion module; wherein the first power supply component and the second power supply component are both components responsible for power conversion tasks; The power conversion module is composed of the first to fifth layers from top to bottom, wherein the first layer is the first power layer, the first power component is located in the first power layer, the second layer is the first circuit board, the third layer is the inductor layer, the first inductor and the second inductor are located in the inductor layer, the fourth layer is the second power layer, the second power component is located in the second power layer, and the fifth layer is the second circuit board; the first power layer, the first circuit board, the inductor layer, the second power layer and the second circuit board are stacked in sequence.

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