Memory connection system and electronic equipment

Abstract

The invention provides a memory connection system and electronic equipment, which can be applied to the technical field of memory equipment. The memory connection system comprises: a memory connector comprising a first connector, a second connector and a signal connection assembly, the first connector is arranged on the second connector, the second connector is arranged on a main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection assembly is arranged in the first connector and the second connector; and the plurality of memory slots are arranged on the first connector and extend along the second direction, so that the opening orientation of the plurality of memory slots is parallel to the main circuit board.

Description

Technical Field

[0001] This application relates to the technical field of memory devices, and particularly to a memory connection system and an electronic device. Background Art

[0002] Memory is one of the core components of current servers. With the gradual expansion of the computing scale and power of servers, the number of memories inside the servers and the processing power of processors are also gradually increasing. However, the processing power of a processor is often related to its size. As the size of the processor gradually increases, the space available for accommodating memories becomes smaller and smaller, making it difficult for the number of memories to meet the high demands of servers. Summary of the Invention

[0003] In view of the above problems, this application provides a memory connection system and an electronic device.

[0004] According to the first aspect of this application, a memory connection system is provided, including: a memory connector, including a first connector, a second connector, and a signal connection component. The first connector is disposed on the second connector, the second connector is disposed on the main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection component is disposed within the first connector and the second connector; a plurality of memory slots are disposed on the first connector and extend along the second direction, such that the openings of the plurality of memory slots face parallel to the main circuit board.

[0005] The second aspect of this application provides an electronic device, including: a memory connection system disposed on the main circuit board; a memory module accommodated in the memory slots of the memory connection system; a processor disposed on the main circuit board, for providing a power supply signal and a memory signal to the memory module via a plurality of trace paths electrically connected to the processor through the memory connection system.

[0006] According to an embodiment of this application, the memory connection system may include a memory connector and a plurality of memory slots. The memory connector may include a first connector, a second connector, and a signal connection component. The first connector and the second connector are adjacently disposed on the main circuit board. The first connector may extend along a first direction perpendicular to the main circuit board, and the second connector may extend along a second direction parallel to the main circuit board. The signal connection component may be disposed within the first connector and the second connector having a hollow structure inside. The plurality of memory slots may be adjacently disposed to the first connector, and the extending direction of the bottom surfaces of the plurality of memory slots is the first direction, thereby achieving the arrangement of stacking a plurality of memory slots side by side in the first direction on the first connector, and the plurality of memory slots are all parallel to the main circuit board.

[0007] According to an embodiment of the present application, when inserting a memory module into a plurality of memory slots on a memory connector, the opening direction of each memory slot is parallel to the main circuit board, so that the plurality of memory modules inserted into the plurality of memory slots can also be parallel to the main circuit board. Combining with a signal connection component that can interconnect pins internally, the physical area of the second connector and the main circuit board can be reduced. When the same number of memory modules are needed, the occupied space of the memory modules and the memory connector can be reduced, so that more memory modules can be arranged in a predetermined memory space to facilitate adapting to the high computing power of the processor, simplifying the assembly process of various hardware components on the main circuit board, and reducing production costs.

[0008] According to an embodiment of the present application, through a signal connection component in the memory connector that is electrically connected to the memory slot and the main circuit board, the length of the component connection line of the signal connection component can be further shortened. There is no need to provide a circuit board in the connector and lay traces on the circuit board, reducing problems such as delay, reflection, and crosstalk of signals during transmission, improving the integrity of the signals transmitted between the memory modules. And since there is no need to transmit signals through the traces on the circuit board in the connector, the memory configuration can be adjusted without changing the structure parameters of the chassis and the main board, facilitating the upgrade, maintenance, and configuration adjustment of the memory. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Through the following description of the embodiments of the present application with reference to the drawings, the above content and other objects, features, and advantages of the present application will become clearer. In the drawings:

[0010] Figure 1 A schematic diagram of a memory connection system according to an embodiment of the present application is shown;

[0011] Figure 2 A front view of a memory connection system according to an embodiment of the present application is shown;

[0012] Figure 3 A schematic diagram of a gold finger lead according to an embodiment of the present application is shown;

[0013] Figure 4 A schematic diagram of a memory connection system including a signal transmission conductor according to an embodiment of the present application is shown;

[0014] Figure 5 A schematic diagram of the bottom pins of a second connector corresponding to a plurality of memory slots according to an embodiment of the present application is shown;

[0015] Figure 6 A schematic diagram of the bottom package of a second connector corresponding to a memory slot according to an embodiment of the present application is shown;

[0016] Figure 7Shows a schematic diagram of the bottom encapsulation of a second connector corresponding to a memory slot according to another embodiment of the present application;

[0017] Figure 8 Shows a schematic diagram of the corresponding relationship between the first connector encapsulation pins and the second connector encapsulation pins and the gold finger leads according to an embodiment of the present application;

[0018] Figure 9 Shows a schematic diagram of the inner layer traces from the processor to the farthest memory module according to an embodiment of the present application;

[0019] Figure 10 Shows a schematic diagram of a leaf spring type pin according to an embodiment of the present application;

[0020] Figure 11 Shows a schematic diagram of a pin type pin according to an embodiment of the present application;

[0021] Figure 12 Shows a schematic diagram of the bottom of a memory slot according to an embodiment of the present application;

[0022] Figure 13 Shows a schematic diagram of the traces at the bottom of a memory slot according to an embodiment of the present application;

[0023] Figure 14 Shows a schematic diagram of an electronic device according to an embodiment of the present application. Detailed implementation manners

[0024] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present application. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a thorough understanding of the embodiments of the present application. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of the present application.

[0025] The terms used herein are only for describing specific embodiments and are not intended to limit the present application. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0027] In the case of using an expression such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning that those skilled in the art usually understand this expression (for example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0028] The memory is one of the core components of current servers. As the computing scale and computing power of servers gradually expand, the number of memories inside the servers and the processing capabilities of the processors are also gradually increasing. However, the processing capabilities of processors are often related to their sizes. As the sizes of processors gradually increase, the space for accommodating memories becomes smaller and smaller, resulting in the number of memories being difficult to meet the high demands of servers.

[0029] Embodiments of the present application provide a memory connection system, including: a memory connector, including a first connector, a second connector, and a signal connection component. The first connector is disposed on the second connector, the second connector is disposed on the main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection component is disposed inside the first connector and the second connector; a plurality of memory slots are disposed on the first connector and extend along the second direction, such that when at least one memory module is inserted into the memory slot, the insertion and extraction direction of at least one memory module is parallel to the main circuit board.

[0030] According to an embodiment of the present application, the memory connector includes a first connector, a second connector, and a signal connection component. The first connector is disposed on the second connector, the second connector is disposed on the main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection component is disposed inside the first connector and the second connector.

[0031] The memory connector formed by the first connector and the second connector can be in an L shape, and the memory connector can be used to electrically connect the memory module to the main circuit board when at least one memory module is inserted into the memory slot.

[0032] The first direction can be characterized as a direction perpendicular to the main circuit board, and the second direction can be characterized as a direction parallel to the main circuit board. The first connector can change its size in the first direction to facilitate accommodating more memory modules, and the second connector can change its size in the second direction to facilitate setting more package pins at the bottom of the second connector in response to more memory modules.

[0033] The first connector and the second connector can be of a hollow structure. In the space inside the first connector and the second connector, a signal connection component can be provided. The signal connection component can be characterized as a connection component for transmitting various data signals including power supply signals, memory signals, etc.

[0034] The memory slot and the main circuit board are electrically connected through the signal connection component, so that when the memory module is inserted into the memory slot, the memory module can be electrically connected to the main circuit board, enabling the memory signal to be interactively transmitted between the memory module and the main circuit board, and the memory module performs operations such as storage according to the memory signal.

[0035] The main circuit board can be a PCB board. In addition to the memory connector, the memory slot and the memory module, a processor and a heat dissipation module can also be provided on the main circuit board. The memory connectors with inserted memory modules are usually distributed on both sides of the processor or the heat dissipation module. Usually, 8 memory slots can be respectively provided on the left and right sides of a processor, so that 16 memory modules can be inserted. The processor can interact with the memory modules inserted in the memory slots through the main circuit board.

[0036] According to an embodiment of the present application, a plurality of memory slots are provided on the first connector and extend in the second direction, such that the openings of the plurality of memory slots face parallel to the main circuit board.

[0037] The memory module can be a data storage memory bar. A plurality of memory slots are arranged in parallel and stacked on one side surface of the first connector. The plurality of memory slots are parallel to the second connector, that is, the plurality of memory slots are perpendicular to the first connector and parallel to the second connector and the main circuit board. By arranging the plurality of memory slots on the first connector and the extending direction being the second direction, the insertion or extraction of the memory module is parallel to the main circuit board, and the inserted memory module is parallel to the surface of the main circuit board.

[0038] The center distance between every two adjacent memory slots can be 7.5 mm. The available width of the main circuit board for the processor and the memory slots can be more than 200 mm, and the width of the main circuit board is usually about 452 mm.

[0039] According to an embodiment of the present application, a memory connection system may include a memory connector and a plurality of memory slots. The memory connector may include a first connector, a second connector, and a signal connection component. The first connector is disposed on the second connector, and the second connector is disposed on the main circuit board. The first connector may extend along a first direction perpendicular to the main circuit board, and the second connector may extend along a second direction parallel to the main circuit board. The signal connection component may be disposed within the first connector and the second connector having a hollow structure inside. The plurality of memory slots may be disposed on the first connector and extend along the second direction, thereby achieving the arrangement of the plurality of memory slots stacked side by side along the first direction on the first connector, and the plurality of memory slots are all parallel to the main circuit board.

[0040] According to an embodiment of the present application, when inserting a memory module into the plurality of memory slots on the memory connector, the opening direction of each memory slot is parallel to the main circuit board, so that the plurality of memory modules inserted into the plurality of memory slots can also be parallel to the main circuit board. Combining with the signal connection component that can interconnect pins inside, the physical area of the second connector and the main circuit board can be reduced. When the same number of memory modules are needed, the occupied space of the memory modules and the memory connector can be reduced, so that more memory modules can be arranged in a predetermined memory space to facilitate adapting to the high computing power of the processor, simplifying the assembly process of various hardware components on the main circuit board, and reducing production costs.

[0041] According to an embodiment of the present application, through the signal connection component electrically connected to each other between the memory slots and the main circuit board within the memory connector, the length of the component connection lines of the signal connection component can be further shortened. There is no need to provide a circuit board inside the connector and arrange traces on the circuit board, reducing problems such as signal delay, reflection, and crosstalk during signal transmission, improving the integrity of the signals transmitted to the memory module. And since there is no need to transmit signals through the traces on the circuit board inside the connector, the memory configuration can be adjusted without changing the structure parameters of the chassis and the motherboard, facilitating the upgrade and maintenance of the memory and the configuration adjustment.

[0042] Figure 1 The schematic diagram of the memory connection system according to an embodiment of the present application is shown.

[0043] As Figure 1As shown, multiple memory connection systems can be provided on the main circuit board. Each memory connection system can include a memory connector and multiple memory slots 101. A memory module 104 can be inserted into each memory slot 101. Multiple parallel stacked memory modules 104 parallel to the main circuit board 106 are respectively arranged on both sides of the processor or the heat dissipation module 105. The memory connector includes a first connector 102 and a second connector 103. The first connector 102 is vertically arranged on the second connector 103. The second connector 103 is arranged on the main circuit board 106. A signal connection component 107 is arranged in the first connector 102 and the second connector 103.

[0044] Figure 2 The front view of the memory connection system according to an embodiment of the present application is shown.

[0045] As Figure 2 As shown, multiple memory slots 101 are stacked side by side on the second connector 103. A memory module can be inserted into each memory slot 101. The back of the multiple memory slots 101 is the first connector 102.

[0046] According to an embodiment of the present application, the signal connection component can include multiple signal connection sub-components.

[0047] According to an embodiment of the present application, the multiple signal connection sub-components are respectively electrically connected to the multiple memory slots and extend to the second connector to be electrically connected to the connector package pins in the second connector.

[0048] The signal connection sub-component can be characterized as a connection component for transmitting including memory signals. The first ends of the multiple signal connection sub-components can be electrically connected to multiple memory package pins for transmitting memory signals at the bottom of the memory slot. The second ends of the multiple signal connection sub-components can be electrically connected to multiple connector package pins for transmitting memory signals at the bottom of the second connector. Thus, in the case where a memory module is inserted into the memory slot, the memory module can be electrically connected to components such as the main circuit board, the processor, and the heat dissipation module through the signal connection sub-components for transmitting memory signals, so as to facilitate the processor to perform data interaction with the memory module through the multiple signal connection sub-components.

[0049] Multiple memory package pins with different functions are provided at the bottom of each memory slot. Thus, multiple signal connection sub-components are correspondingly provided for each memory slot. There can be about 288 pins for the memory package pins at the bottom of the memory slot. Thus, the signal connection sub-components corresponding to the number can be configured according to the number of pins of the memory slot.

[0050] According to an embodiment of the present application, the signal connection component may include a plurality of signal connection sub-components. The plurality of signal connection sub-components are respectively electrically connected to a plurality of memory slots and extend to the second connector to be electrically connected to the connector package pins in the second connector. Thus, when the memory module is inserted into the memory slot, one end of the plurality of signal connection sub-components can be electrically connected to the functional pins and data pins at the bottom of the memory slot, and the other end of the plurality of signal connection sub-components can be electrically connected to the connector package pins at the bottom of the second connector, thereby realizing the interactive transmission of signals.

[0051] According to an embodiment of the present application, a plurality of memory gold finger pins are provided on the memory module, and the memory slot may include a plurality of memory gold finger slots.

[0052] According to an embodiment of the present application, the plurality of signal connection sub-components may include a plurality of gold finger leads, a plurality of first signal transmission conductors, and a plurality of second signal transmission conductors.

[0053] According to an embodiment of the present application, any one of the multiple groups of gold finger leads includes a first gold finger lead and a second gold finger lead. The first gold finger lead and the second gold finger lead are respectively arranged on both sides of the memory gold finger slot. The first gold finger lead and the second gold finger lead respectively have opposite first protruding structures and second protruding structures. So that when the memory module is inserted, the first gold finger lead and the second gold finger lead jointly clamp the memory gold finger pins of the memory module, and the first protruding structure and the second protruding structure form a double-contact connection with the memory gold finger pins.

[0054] The gold finger lead can be characterized as a lead with a protruding structure and can be V-shaped. The second gold finger lead combined with the first signal transmission conductor can electrically connect two package pins with the same function definition in one memory module together, or can also electrically connect two package pins with the same function definition in multiple memory modules together. Thus, the number of second signal transmission conductors led out to the second connector can be reduced, so that the number of package pins at the bottom of the second connector can be reduced, thereby reducing the occupied area of the second connector on the main circuit board.

[0055] The second gold finger lead wire combined with the first signal transmission conductor can also electrically connect multiple (more than two) package pins with the same function definition together, thereby further reducing the number of signal transmission conductors led out to the second connector. For example, if there are 5 memory slots on the first connector, and the address allocations of the first memory slot, the second memory slot, and the third memory slot are all the same address, then the function pins corresponding to the address allocation of the first memory slot, the second memory slot, and the third memory slot can be interconnected using the gold finger lead wire and the first signal transmission conductor. Then, one end of the second signal transmission conductor is electrically connected to the interconnected gold finger lead wire, and the other end of the second signal transmission conductor is led out. If the clocks of the second memory slot and the fourth memory slot are different, then the function pins corresponding to the clock function of the second memory slot and the fourth memory slot cannot be interconnected together.

[0056] Also, since the memory gold finger slots and the memory package pins at the bottom of each memory slot are arranged according to the same function sorting, the lead wire layout when connecting the package pins with the same function definition using the gold finger lead wire can be relatively regular and easy to adjust and modify.

[0057] According to an embodiment of the present application, multiple first signal transmission conductors are used to electrically connect multiple second gold finger lead wires with the same first preset pin function for the same memory module in multiple memory gold finger slots, and to electrically connect multiple second gold finger lead wires with the same second preset pin function for different memory modules in multiple memory gold finger slots.

[0058] The first preset pin function can be characterized as the pin function that can be interconnected among multiple memory gold finger pins in the same memory module. The second preset pin function can be characterized as the pin function that can be interconnected among multiple memory gold finger pins between different memory modules.

[0059] The first preset pin function can include data function, enable control function, read / write control function, power function, and ground function. When the pin functions of the memory gold finger pins in the same memory module are address allocation function, clock function, reset function, and reserved function, usually the first signal transmission conductor is not used to interconnect the second gold finger lead wires with the above same pin functions in its slot.

[0060] The second preset pin function can include pin functions such as address allocation function, clock function, enable control function, read / write control function, power function, and ground function. When the pin function of the memory gold finger pins in different memory modules is data function, usually the first signal transmission conductor is not used to interconnect the second gold finger lead wires with data function in its slot.

[0061] According to an embodiment of the present application, a plurality of second signal transmission conductors are electrically connected to a plurality of first gold finger leads and at least one second gold finger lead, and are also electrically connected to a plurality of connector package pins within a second connector.

[0062] For a memory gold finger slot where there is no case of interconnecting pins with the same function, the second gold finger lead within the memory gold finger slot is electrically connected to the second signal transmission conductor. For a memory gold finger slot where there is a case of interconnecting pins with the same function, one of the second gold finger leads within the interconnected memory gold finger slots can be selected to be electrically connected to the second signal transmission conductor, so that the memory signal can be transmitted to the second gold finger leads in a plurality of memory gold finger slots through one second signal transmission conductor, and the memory signal is transmitted to the memory module in contact connection with the second gold finger lead.

[0063] The memory signal can include a function signal and a data storage signal.

[0064] The signal transmission conductor can be characterized as a connection component for connecting the second gold finger lead and transmitting signals including the memory signal.

[0065] After using a plurality of first signal transmission conductors to electrically connect the package pins with the same function at the bottom of two gold finger slots, by using a plurality of second signal transmission conductors extending to the connector package pins, the effect of simultaneously transmitting function signals to the memory package pins with the same function that are interconnected can be achieved when using the gold finger lead and the signal transmission conductor in combination.

[0066] Compared with the case where independent signal transmission conductors need to be led out from the package pins at the bottom of each memory gold finger slot, the combination of using the gold finger lead and the signal transmission conductor adopted in the present application can reduce the use of space inside the first connector, so that on the basis of needing to insert the same memory module, the volume of the first connector can be reduced, facilitating the setting of more memory modules when more memory modules are needed. At the same time, due to the interconnection of the second gold finger leads in a plurality of memory gold finger slots, the number of second signal transmission conductors led out can be greatly reduced, thus greatly reducing the number of connector package pins at the bottom of the second connector and reducing the package area.

[0067] According to an embodiment of the present application, the signal connection sub-component may include multiple groups of gold finger leads, multiple first signal transmission conductors, and multiple second signal transmission conductors. Each group of gold finger leads includes a first gold finger lead and a second gold finger lead. By using the first gold finger lead and the second gold finger lead to clamp the memory gold finger pins of the memory module to form a double-contact electrical connection, and then according to the first preset pin function and the second preset pin function, the second gold finger leads in multiple memory gold finger slots are interconnected by using the first signal transmission conductors, and then the first gold finger lead, the un-interconnected second gold finger leads, and one of the interconnected second gold finger leads are electrically connected by using the second signal transmission conductors and extended to the connector package pins at the bottom of the second connector. Thus, while maintaining the normal transmission of memory signals, the number of second signal transmission conductors for transmitting between multiple memory gold finger slots with the same function can be greatly reduced, the number of pins on the second connector can be reduced, the length of the signal transmission conductors and the length of the routing path in the main circuit board can be shortened, so as to facilitate reducing the package area of the second connector on the main circuit board and improving the miniaturization and integration of the main circuit board.

[0068] Figure 3 FIG. shows a schematic diagram of a gold finger lead according to an embodiment of the present application.

[0069] As Figure 3 shown, on both sides inside the first memory gold finger slot 301 and the second memory gold finger slot 302 of a memory module, a first gold finger lead 303 and a second gold finger lead 304 are respectively arranged. The first gold finger lead 303 has a first protruding structure 305, and the second gold finger lead 304 has a second protruding structure 306. The first protruding structure 305 and the second protruding structure 306 are arranged oppositely. The second gold finger leads 304 inside the first memory gold finger slot 301 and the second memory gold finger slot 302 are interconnected by using the first signal transmission conductor 307. The first gold finger leads 303 inside the first memory gold finger slot 301 and the second memory gold finger slot 302 are connected and extended out by using the second signal transmission conductor 308, and then the second gold finger lead 304 inside the second memory gold finger slot 302 is connected and extended out by using the second signal transmission conductor 308.

[0070] Figure 4 FIG. shows a schematic diagram of a memory connection system including signal transmission conductors according to an embodiment of the present application.

[0071] As Figure 4 shown, the memory slot 101 needs to be electrically connected to the main circuit board through the extended signal connection component 107. The signal connection component 107 is led out from the first connector 102 and the second connector 103 and is electrically connected to multiple connector package pins at the bottom of the second connector 103.

[0072] According to an embodiment of the present application, the first signal transmission conductor and the second signal transmission conductor may include signal cables or signal pins.

[0073] The signal cable may be a cable conductor, and the outsides of both the signal cable and the signal pins may be wrapped and fixed with a material shell including but not limited to plastic.

[0074] The signal transmission conductor may further include signal cables and signal pins. The signal pins may be arranged at the intersection of the first connector and the second connector, that is, at the bottom surface of the first connector. A plurality of pin slots are provided at the intersection of the second connector and the first connector, such that the first end of the signal cable is electrically connected to the third end of the finger contact lead, and the second end of the signal cable is electrically connected to the first end of the signal pin. The first connector with a plurality of memory slots fixed thereon is electrically connected to the second connector through a plurality of signal pins, so that the first connector and the second connector do not need to be an integral device. In the case of replacing the memory slots or memory modules on the first connector, the entire memory connector does not need to be pulled out, but only the first connector can be pulled out for subsequent operations.

[0075] According to an embodiment of the present application, by using signal cables or signal pins as transmission components for transmitting functional signals and data storage signals, each signal cable or signal pin can be led out from the second connector, which can reduce the signal loss during transmission and optimize the signal integrity in the signal transmission conductor compared with arranging a circuit board inside the connector and transmitting signals through the signal paths on the circuit board. Combined with the shell wrapped outside the signal transmission conductor, the interference between multiple signals during simultaneous transmission can be reduced.

[0076] According to an embodiment of the present application, the signal connection component may further include a power cable and a ground cable.

[0077] According to an embodiment of the present application, the power cable is electrically connected to a plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins inside the second connector.

[0078] Among the memory package pins at the bottom of the memory slot, there may be memory power supply package pins. First, a power cable with a finger definition may be used to interconnect a plurality of memory power supply package pins in one memory slot and the second finger leads of each memory finger slot, and then a power cable is led out to be electrically connected to the connector package pins, that is, by connecting the power cable to the memory power supply package pins at the bottom of each memory finger slot and the connector package pins with a power supply function, a power supply signal can be provided to the memory module inserted in the memory slot.

[0079] According to an embodiment of the present application, the ground wire cable is electrically connected to a plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins within the second connector.

[0080] Among the memory package pins at the bottom of the memory slot, there may be memory ground package pins. First, the ground wire cable with a defined gold finger can be used to interconnect the multiple memory ground package pins within one memory slot and the memory ground package pins at the bottom of each memory slot, and then a ground wire cable is led out and electrically connected to the connector package pins. That is, by connecting the ground wire cable to the memory ground package pins at the bottom of each memory slot and the connector package pins with a grounding function, a complete conductive loop can be formed between the memory module inserted in the memory slot, the main circuit board, and the processor.

[0081] According to an embodiment of the present application, among the memory package pins at the bottom of all memory slots, there are pins corresponding to power supply for connecting the power cable and the ground wire cable. By connecting the pins corresponding to power supply that are common to each memory slot together using a power cable with the same definition as the gold finger and a ground wire cable with the same definition as the gold finger, and then electrically connecting the other ends of the power cable and the ground wire cable to the connector package pins, it is not necessary to connect the power cable and the ground wire cable to each memory slot, saving the number of led-out cables, further reducing the number of pins led out of the second connector, reducing the package area of the second connector on the main circuit board, and improving the miniaturization and integration of the main circuit board.

[0082] According to an embodiment of the present application, the second connector may include a plurality of connector package pins and a plurality of first fixing connectors.

[0083] According to an embodiment of the present application, the plurality of connector package pins are arranged at the bottom of the second connector and are used to electrically connect a plurality of memory slots to the processor through the main circuit board so as to transmit memory signals from the processor to the plurality of memory slots.

[0084] The plurality of connector package pins may be arranged at the bottom of the second connector. Since the signal transmission conductor and the gold finger lead are combined to connect the memory package pins on the memory slot, and then cooperated with the power cable and the ground wire cable that can interconnect all memory slots, the number of signal transmission conductors, power cables, and ground wire cables led out by the first connector can be reduced, and further the number of connector package pins at the bottom of the second connector can be greatly reduced, so that the area of the second connector is reduced, and the space of the main circuit board occupied by the second connector is reduced.

[0085] According to an embodiment of the present application, the plurality of first fixing connectors are arranged on both sides of the plurality of connector package pins and are used to fix the second connector on the main circuit board.

[0086] The first fixed connectors of the present application may only include two, and multiple first fixed connectors of the present application are only distributed on both sides of the bottom of the second connector, rather than being arranged among the multiple connector package pins at the bottom of the second connector.

[0087] Positioning and fixing marks corresponding to the first fixed connectors may be provided on the main circuit board, so as to facilitate fixing the first fixed connectors in the positioning and fixing marks on the main circuit board, thereby ensuring the accuracy of the fixing position.

[0088] According to an embodiment of the present application, multiple connector package pins and multiple first fixed connectors are provided on the bottom of the second connector. The signal connection component is electrically connected to the main circuit board through electrical connection with the multiple connector package pins, and the multiple first fixed connectors are only arranged on both sides of the multiple connector package pins, so that the arrangement of the multiple connector package pins can be made more compact, reducing the package area.

[0089] Figure 5 A schematic diagram of the bottom pins of the second connector corresponding to multiple memory slots according to an embodiment of the present application is shown.

[0090] As Figure 5 shown, the figure shows multiple connector package pins 501 and multiple first fixed connectors 502 corresponding to multiple memory slots. One first fixed connector 502 is respectively arranged on both sides of the multiple connector package pins 501. Since usually 8 memory modules are required to be paired on one side of a processor, in the case of containing two processors, two memory slots can be continuously arranged in a row. Thus, the second first fixed connector 502 corresponding to the first memory slot and the first first fixed connector 502 corresponding to the second memory slot in the same row can share one.

[0091] According to an embodiment of the present application, the multiple connector package pins are arranged in a dot pattern on the bottom of the second connector in a form matching the functional package pins of the processor. The multiple connector package pins include multiple first connector package pins and multiple second connector package pins. The first connector package pins are electrically connected to multiple memory gold finger slots through a first signal transmission conductor and a second signal transmission conductor, and the second connector package pins are electrically connected to the memory gold finger slots through a second signal transmission conductor; and the multiple first connector package pins and the multiple second connector package pins are electrically connected to the processor via a routing path provided in the main circuit board.

[0092] The functional areas of the pins can be encapsulated according to the functions of the processor, and the distribution areas of multiple connector encapsulated pins at the bottom of the second connector can be designed. For example, if the power supply functional encapsulated pins of the processor are located at the lower left of the processor, multiple connector power supply encapsulated pins can be set at the lower left of the bottom of the second connector; if the clock functional encapsulated pins of the processor are located at the upper right of the processor, multiple connector clock encapsulated pins can be set at the upper right of the bottom of the second connector. Thereby, the size of the routing path can be reduced, and it is easy to centrally manage and control the same functions of multiple memory modules. Also, the routing paths corresponding to multiple memory modules can be arranged on the same layer, so as to facilitate the grouped centralized management of multiple memory modules, signal transmission conductors connecting multiple memory modules, and multiple memory gold finger slots, improving integration and operability.

[0093] Also, by using the second gold finger leads, the first signal transmission conductor, and the second signal transmission conductor that are functionally interconnected with the same function, one connector encapsulated pin can correspond to multiple memory gold finger slots or even multiple memory modules, greatly reducing the number of the first connector encapsulated pins at the bottom of the second connector.

[0094] Also, since the encapsulation shape of the connector encapsulated pin is dot-shaped, the encapsulation area can be further reduced.

[0095] Figure 6 Shows a schematic diagram of the bottom encapsulation of the second connector corresponding to the memory slot according to an embodiment of the present application.

[0096] As Figure 6 shown, multiple connector encapsulated pins 601 are led out at the bottom of the second connector. A first fixed connector 502 is respectively arranged on both sides of the multiple connector encapsulated pins 601. The multiple connector encapsulated pins 601 in each row are arranged in parallel. Since the connector encapsulated pins 601 can adopt elastic sheet pins or pin-type pins, when encapsulating, multiple dot-shaped encapsulation contact points are formed. The number of the connector encapsulated pins 601 and the first fixed connector 502 is small, and the distance between each connector encapsulated pin 601 is small, so that the encapsulation area is small.

[0097] Figure 7 Shows a schematic diagram of the bottom encapsulation of the second connector corresponding to the memory slot according to another embodiment of the present application.

[0098] As Figure 7 shown, a first fixed connector 502 is respectively arranged on both sides of the multiple connector encapsulated pins 601. In order to further reduce the encapsulation area, the multiple connector encapsulated pins 601 in each row can also be arranged staggeredly, so that the multiple dot-shaped encapsulation contact points in each row also show a staggered distribution, further reducing the encapsulation area.

[0099] Figure 8 A schematic diagram showing the corresponding relationship between the first connector package pins and the second connector package pins and the gold finger leads according to an embodiment of the present application.

[0100] As Figure 8 shown, after interconnecting the second gold finger leads 304 in the first memory gold finger slots 301 and the second memory gold finger slots 302 with the same pin functions in a memory module by using the first signal transmission conductor 307, the second signal transmission conductor 308 is used to connect and extend the second gold finger leads 304 in the second memory gold finger slots 302, so that signals can be transmitted to the first memory gold finger slots 301 and the second memory gold finger slots 302 through a first connector package pin 801, signals can be transmitted to the second memory gold finger slots 302 through a second connector package pin 802, and signals can be transmitted to the first memory gold finger slots 301 through a third connector package pin 803.

[0101] Figure 9 A schematic diagram showing the inner layer traces from the processor to the farthest memory module according to an embodiment of the present application.

[0102] As Figure 9 shown, the processor can be disposed on a processor connection board 903, and the processor connection board 903 is disposed on the main circuit board. Thus, when the processor needs to be replaced or adjusted, there is no need to repeatedly adjust the electrical connection between the processor and the main circuit board, reducing damage to the main circuit board. On the main circuit board, a heat dissipation module can also be disposed, and the heat dissipation module can be disposed at a predetermined position through positioning posts 904. By using a combination of gold finger leads and signal transmission conductors, even multiple trace paths 901 corresponding to the memory modules farthest from the area 902 where the processor is located on the main circuit board can be neatly arranged, and through the interconnection of the gold finger leads, the number of trace paths 901 used is reduced. Thus, it is possible to achieve a configuration of 12 or more memory modules while keeping the motherboard size unchanged, meeting the requirements of high-performance processors for memory capacity and speed. Moreover, the package area of the memory connector is small, the trace paths leading out from the pins in the main circuit board are also short, and the length of the trace path between the processor and the connector package pins can be shortened to within 3 feet. By shortening the trace length, problems such as delay, reflection, and crosstalk in the signal transmission process are reduced, thereby significantly improving signal integrity.

[0103] According to an embodiment of the present application, the multiple connector package pins include connector power supply package pins, connector ground package pins, and multiple connector signal package pins.

[0104] According to an embodiment of the present application, a first end of a connector power supply package pin is electrically connected to a power cable, and a second end of the connector power supply package pin is electrically connected to a main circuit board.

[0105] According to an embodiment of the present application, a first end of a connector ground wire package pin is electrically connected to a ground wire cable, and a second end of the connector ground wire package pin is electrically connected to a main circuit board.

[0106] According to an embodiment of the present application, first ends of a plurality of connector signal package pins are electrically connected to a plurality of second signal transmission conductors, and second ends of the plurality of connector signal package pins are electrically connected to a main circuit board, so that the plurality of second signal transmission conductors extending to the plurality of connector signal package pins are electrically connected to a processor through a routing path.

[0107] A plurality of routing paths are arranged in the main circuit board. By fixing the connector power supply package pins, the connector ground wire package pins, and the plurality of connector signal package pins on the main circuit board, one end of the routing path can be electrically connected to the connector power supply package pins, the connector ground wire package pins, and the plurality of connector signal package pins, and the other end of the routing path can be electrically connected to the pins of the processor or the heat dissipation module. Thus, the power supply signal and the memory signal sent by the processor can be transmitted to different signal transmission conductors, power cables, and ground wire cables in the memory connector through different routing paths in the main circuit board, and then the memory signal is transmitted to different functional pins through the signal transmission conductors, so that the memory module inserted in the memory slot performs operations such as address allocation and data storage according to the functional signals.

[0108] According to an embodiment of the present application, the connector package pins may include spring pins or pin-type pins.

[0109] Figure 10 A schematic diagram of a spring pin according to an embodiment of the present application is shown.

[0110] As Figure 10 shown, a plurality of spring pins 1001 may be adopted at the bottom of the second connector.

[0111] Figure 11 A schematic diagram of a pin-type pin according to an embodiment of the present application is shown.

[0112] As Figure 11 shown, pin-type pins 1101 may be adopted at the bottom of the second connector, and correspondingly, there may be slots 1102 on the main circuit board for the pin-type pins 1101 to be inserted.

[0113] In the case where the signal connector pins are spring pins, the second connector may not need to perform the operation of welding the connector to the main circuit board, but is electrically connected to the main circuit board by means of spring crimping.

[0114] In the case where the signal connector pins are pin-type pins, the pin-type pins can be electrically connected to the main circuit board by crimping or soldering, so that the signal connection component is interconnected with the routing path.

[0115] Since the contact areas of the leaf spring pins or the pin-type pins are both small, when encapsulating, encapsulation contact points can be formed and neatly arranged in a dot-like shape at the bottom of the connector. Compared with the existing linear encapsulation contacts, the center spacing distance between adjacent pins is greatly reduced.

[0116] The memory connector with the memory module inserted can be directly fixed to the main circuit board at the end of the assembly, saving the assembly process and simplifying the operation of inserting and removing the memory module inserted in the memory slot. While facilitating the server configuration upgrade, it can avoid the consumption and damage of components caused by repeated insertion and removal.

[0117] According to the embodiments of the present application, by using leaf spring pins and pin-type pins, the second connector can be set on the main circuit board without using a soldering fixing method, but only using a crimping or abutting connection method, and electrically connected to multiple routing paths in the main circuit board. And by using the connection method of leaf spring pins and pin-type pins, the stability between the second connector and the main circuit board can be improved. For the main circuit board, when electrically connecting to the pins, there is no need to perform operations such as punching holes, so that the routing paths in the main circuit board can be more easily electrically connected to the pins.

[0118] The memory package pins on the memory slot are connected by a combination of a signal transmission conductor and a gold finger lead, and then cooperated with a power cable and a ground cable that can interconnect all memory slots, so that the number of connector package pins at the bottom of the second connector can be greatly reduced. By selecting leaf spring pins or pin-type pins, the area extended by the pins at the bottom of the second connector is reduced, combined with the first fixed connector only arranged on both sides of multiple connector package pins, so that the area of the second connector occupied by multiple pins and the encapsulation area can be reduced in multiple dimensions. And since the electrical connection form between the pins and the main board can be flexibly defined according to requirements, the flexibility of the memory connector is improved, and the space of the main circuit board occupied by the second connector is reduced.

[0119] The center spacing distance between adjacent pins of this application can be approximately 1.0 - 2.0 mm. If welding is required, the diameter of the welding pad is approximately 0.5 - 1.0 mm. Since the pad area is usually larger than the pin area, the diameter of the protruding area of the leaf spring pins or pin - type pins can be less than 0.5 - 1.0 mm. The package size between the second connector and the main circuit board is approximately 17 mm × 170 mm. Thus, the package area of the second connector is reduced by one - quarter compared to that of a common connector, and the package area corresponding to eight memory slots is only equivalent to the space of the package areas of two common connectors.

[0120] When the area at the bottom of the first connector can accommodate the number of memory modules inserted on the first connector, the second connector can be dispensed with, allowing the signal transmission conductors to extend out of the first connector, and a plurality of connector package pins electrically connected to the signal transmission conductors are provided at the bottom of the first connector.

[0121] According to an embodiment of the present application, a memory slot may include a memory groove frame, a plurality of memory gold finger slots, a plurality of memory package pins, and pads.

[0122] According to an embodiment of the present application, the memory groove frame is used to accommodate a memory module.

[0123] The bottom surface of the memory groove frame can be provided on the first connector.

[0124] According to an embodiment of the present application, a plurality of memory gold finger slots are provided at the bottom of the memory groove frame for accommodating a plurality of memory gold finger pins.

[0125] A memory module may include a plurality of memory gold finger pins.

[0126] According to an embodiment of the present application, a plurality of memory package pins are respectively provided at the bottom of the plurality of memory gold finger slots, electrically connected to the signal connection components in the memory connector, and providing a power supply signal and a memory signal to the plurality of memory slots.

[0127] The memory package pins can be provided at the bottom of the memory gold finger slots. By combining the signal transmission conductors and the gold finger leads, and matching with the power supply cable and the ground cable, the power supply signal and the memory signal can be transmitted to the memory gold finger slots. So that when a memory module is inserted into the memory groove frame, a plurality of memory gold finger pins at the bottom of the memory module can be electrically connected to the plurality of memory package pins, enabling the power supply signal and the memory signal to be transmitted to the memory module.

[0128] According to an embodiment of the present application, the pads are provided at the bottom of the memory groove frame for welding the plurality of memory package pins to the first connector.

[0129] The number of memory packaging pins of a memory slot is usually about 288 pins. The packaging size of the memory slot can be about 142x6.8mm, and the pad size can be about 0.53x1.5mm.

[0130] The maximum board width of the memory module is about 30mm. After being inserted into the memory slot, the overall height is about 35mm. The distance between memory slots is about 7.5mm. Usually, 8 memory slots can be configured on one side of a single processor, and the memory module usually requires a space of more than 59mm. After the memory slot layout is adjusted according to this application, the space occupied on the motherboard can be reduced from 60mm to about 40mm, which is beneficial to reducing the motherboard space and the manufacturing cost of the main circuit board.

[0131] According to an embodiment of the present application, the memory slot may include a memory groove frame, a plurality of memory gold finger slots, a plurality of memory packaging pins, and pads. The plurality of memory packaging pins are soldered to the first connector by welding and are electrically connected to the signal connection component, so that when the memory module is inserted into the memory groove frame, it can be electrically connected to the signal connection component to transmit the power supply signal and the memory signal completely and quickly.

[0132] Figure 12 A schematic diagram of the bottom of the memory slot according to an embodiment of the present application is shown.

[0133] As Figure 12 shown, a plurality of memory packaging pins and pads can be arranged on the bottom of the memory slot.

[0134] According to an embodiment of the present application, the plurality of memory packaging pins may include memory power supply packaging pins, memory ground wire packaging pins, and a plurality of memory signal packaging pins.

[0135] According to an embodiment of the present application, for the memory power supply packaging pins, when the memory module is inserted into the memory groove frame, the first end of the memory power supply packaging pin is electrically connected to the memory module, and the second end of the memory power supply packaging pin is electrically connected to the power cable.

[0136] When the memory module is inserted into the memory groove frame, the first end of the memory power supply packaging pin can be electrically connected to the memory gold finger pin related to the power supply function in the memory module.

[0137] According to an embodiment of the present application, for the memory ground wire packaging pins, when the memory module is inserted into the memory groove frame, the first end of the memory ground wire packaging pin is electrically connected to the memory module, and the second end of the memory ground wire packaging pin is electrically connected to the ground wire cable.

[0138] When the memory module is inserted into the memory groove frame, the first end of the memory ground wire packaging pin can be electrically connected to the memory gold finger pin related to the ground wire function in the memory module.

[0139] According to an embodiment of the present application, for multiple memory signal encapsulation pins, when the memory module is inserted into the memory groove housing, the multiple memory signal encapsulation pins are respectively electrically connected to multiple memory gold finger pins and multiple signal connection sub-components of the memory module.

[0140] When the memory module is inserted into the memory groove housing, the power supply signal and the memory signal can be transmitted to the corresponding pins of the memory slot through the signal connection component, and then through the electrical connection between the gold finger pins of the memory module and the multiple memory encapsulation pins of the memory slot, so that the power supply signal and the memory signal can be transmitted to the memory module.

[0141] According to an embodiment of the present application, the memory slot may further include multiple second fixed connectors.

[0142] According to an embodiment of the present application, the multiple second fixed connectors are respectively disposed on both sides of the multiple memory encapsulation pins and are used to fix the memory groove housing to the first connector.

[0143] The first connector may be provided with a memory positioning and fixing mark corresponding to the second fixed connector, so as to facilitate fixing the second fixed connector in the memory positioning and fixing mark of the first connector, thereby ensuring the accuracy of the fixing position.

[0144] According to an embodiment of the present application, the multiple second fixed connectors are respectively disposed on both sides of the multiple memory encapsulation pins, so that the stability of the setting of the memory slot can be improved through the multiple second fixed connectors.

[0145] Figure 13 The schematic diagram of the bottom wiring of the memory slot according to an embodiment of the present application is shown.

[0146] As Figure 13 shown, since usually 8 memory modules are required to be paired on one side of a processor, in the case of containing two processors, two memory slots can be continuously arranged in a row, so that the second second fixed connector 1301 of the first memory slot and the first second fixed connector 1301 of the second memory slot in the same row can share one, so that the memory slot can be fixed to the first connector through the second fixed connector 1301. Among them, the size of the memory encapsulation pin can be about 0.53mm×1.5mm, the pitch between two rows of pins can be about 4.1mm, the length of the first connector on the back of the two memory slots arranged in the same row can be about 142mm, the width of the first connector can be about 6.8mm, and the pitch between the pins on both sides of two adjacent second fixed pins can be about 5.95mm.

[0147] The air duct direction of the multiple memory modules inserted into the multiple memory slots of the present application is consistent with the traditional heat dissipation direction.

[0148] When it is necessary to replace the memory module or perform a system upgrade, since the memory connector is not fixed to the main circuit board, the memory connector with multiple memory modules inserted can be pulled out from the main circuit board without disassembling the entire motherboard. After inserting or removing the memory module from the empty memory slot, the memory connector containing the memory module is then inserted back onto the motherboard, improving the assembly efficiency and reducing the risks brought about by directly plugging and unplugging the memory module on the motherboard, such as electrostatic damage or misoperation, enhancing the convenience of maintenance and upgrade, and reducing the assembly process and production costs.

[0149] The memory connection system may further include a protective housing, and both the memory connector and multiple memory slots are disposed within the protective housing.

[0150] The protective housing can be a plastic housing or an insulated metal housing.

[0151] By using the protective housing, the memory connector and multiple memory slots can be wrapped and fixed, thereby reducing electromagnetic interference and improving the integrity of signals during transmission.

[0152] According to an embodiment of the present application, the memory connection system may further include a third connector.

[0153] According to an embodiment of the present application, the third connector is disposed between the second connector and the main circuit board. The upper surface of the third connector is provided with a plurality of connection structures, and the lower surface of the third connector is provided with a plurality of intermediate package pins; the third connector electrically connects the plurality of transmission connector package pins on the lower surface of the second connector to the main circuit board so that the second connector is fixed to the main circuit board.

[0154] The third connector can be used to transmit power supply signals and memory signals. The third connector can be disposed between the second connector and the main circuit board. The upper surface of the third connector is electrically connected to the second connector through a plurality of connection structures. The lower surface of the third connector is also provided with a plurality of intermediate package pins that are more than the number of connector package pins at the bottom of the second connector. The plurality of connection structures on the upper surface and the plurality of intermediate package pins on the lower surface can be electrically connected through signal cables or signal pins. By encapsulating the plurality of intermediate package pins on the main circuit board and electrically connecting them to the conductive paths in the main circuit board, the power supply signals and memory signals can be transmitted through the third connector to the signal connection components within the second connector and the first connector, and then transmitted to the memory slots.

[0155] The plurality of connection structures on the upper surface of the third connector are adapted to the plurality of connector package pins at the bottom of the second connector, and the plurality of intermediate package pins on the lower surface of the third connector and their encapsulation are the same as the plurality of connector package pins at the bottom of the second connector and their encapsulation.

[0156] By providing a third connector, when it is necessary to upgrade the configuration of the memory module and the memory connector, there is no need to repeatedly plug and unplug the memory connector electrically connected to the main circuit board, thus avoiding damage to the main circuit board and poor contact caused by repeated plugging and unplugging.

[0157] According to an embodiment of the present application, by providing a third connector between the second connector and the main circuit board, when it is necessary to replace the memory module, there is no need to plug and unplug the memory connector electrically connected to the main circuit board. The second connector is used to keep the connection with the main circuit board almost fixed or reduce the number of plugging and unplugging operations, thereby reducing the probability of damage to the main circuit board and its pins during the plugging and unplugging process, and improving the convenience and safety of maintenance.

[0158] According to an embodiment of the present application, an electronic device may include a memory connection system, a memory module, and a processor.

[0159] According to an embodiment of the present application, the memory connection system is provided on the main circuit board.

[0160] According to an embodiment of the present application, the memory module is accommodated in the memory slot of the memory connection system.

[0161] By inserting the memory module into the memory slot provided in the first connector, the memory module can communicate normally with the processor or the heat dissipation module.

[0162] According to an embodiment of the present application, the processor is provided on the main circuit board and is configured to supply a power signal and a memory signal to the memory module via a plurality of routing paths electrically connected to the processor through the memory connection system.

[0163] A heat dissipation module may also be provided on the main circuit board, and multiple memory modules may be respectively arranged on both sides of the processor or the heat dissipation module.

[0164] According to an embodiment of the present application, an electronic device may include a memory connection system, a memory module, and a processor. By inserting multiple memory modules into the memory connection system, the multiple memory modules are stacked and arranged parallel to the main circuit board, so that a larger number of memory modules can be inserted in a limited memory space compared with traditional memory modules to meet the high computing requirements of the processor.

[0165] According to an embodiment of the present application, the electronic device may further include a horizontal memory slot.

[0166] According to an embodiment of the present application, the horizontal memory slot is provided between multiple memory connection systems and is used to accommodate an extended memory module.

[0167] The bottom surface of the horizontal memory slot can be perpendicular to the main circuit board. That is, multiple extended memory modules can be respectively arranged side by side on the same horizontal plane on both sides of the processor or the heat dissipation module. The horizontal memory slot can also be arranged on the second connector. By using the gold finger leads and signal transmission conductors to interconnect the pins with the same function, the number of the second signal transmission conductors led to the second connector is reduced, thereby reducing the number of the connector package pins used. Then, the routing path is integrated through the second connector, making the size of the routing path shorter and neater.

[0168] In the memory space, multiple memory modules arranged in a stacked manner and parallel to the main circuit board can be set, and extended memory modules inserted into the horizontal memory slots can also be set, further increasing the number of memory modules in the space and the space utilization rate.

[0169] According to an embodiment of the present application, the electronic device may further include a horizontal memory slot. By combining the horizontal memory slot and the memory connector, the space utilization rate of the memory module is further improved.

[0170] Figure 14 A schematic diagram of an electronic device according to an embodiment of the present application is shown.

[0171] As Figure 14 shown, in the main board space of the electronic device, in order to maximize the memory layout in the limited main board space and meet the requirements of server upgrade and configuration expansion, a layout method combining the memory connector and the horizontal memory slot 1401 can be adopted. On the main circuit board 106, the extended memory module 1402 is paired with the horizontal memory slot 1401, and the memory module 104 is paired with the memory connector. The memory connector can be designed to layout the memory slot 101 above the 40mm main board space of the main circuit board 106, reserving the height space for inserting the horizontal memory slot 1401 directly welded on the main circuit board 106. The memory connector can be as close as possible to the horizontal memory slot 1401, thereby reducing the main board space occupied by the memory module 104. The memory module 104 on the memory connector is inserted above the extended memory module 1402, and the overall structure is higher than the insertion height of the extended memory module 1402. Moreover, the air duct direction is the same as the traditional memory layout method, without affecting the heat dissipation of the memory module 104. This layout method of the electronic device can support more memory slots 101 in the limited main board space, meet the memory capacity requirements of high-performance processors or heat dissipation modules 105, reduce the length of the signal connection components and the routing path in the main circuit board 106, reduce signal delay and crosstalk, and improve the high-speed signal performance, so as to facilitate the upgrade of the server and improve the flexibility of the extended memory configuration.

[0172] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code, and the above-mentioned module, segment of a program, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0173] Those skilled in the art can understand that the features described in various embodiments of the present application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present application. In particular, without departing from the spirit and teachings of the present application, the features described in various embodiments of the present application can be combined and / or combined in various ways. All such combinations and / or combinations fall within the scope of the present application.

[0174] The above describes the embodiments of the present application. However, these embodiments are merely for illustrative purposes and not for limiting the scope of the present application. Although the embodiments are described separately above, this does not mean that the measures in each embodiment cannot be used advantageously in combination. Without departing from the scope of the present application, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present application.

Claims

1. A memory connection system, characterized in that, The system includes: A memory connector, including a first connector, a second connector, and a signal connection component. The first connector is disposed on the second connector, the second connector is disposed on the main circuit board, the first connector extends in a first direction, and the second connector extends in a second direction perpendicular to the first direction; the signal connection component is disposed within the first connector and the second connector; A plurality of memory slots, disposed on the first connector and extending in the second direction, such that the openings of the plurality of memory slots face parallel to the main circuit board.

2. The system according to claim 1, wherein The signal connection component includes: A plurality of signal connection sub-components, each of the plurality of signal connection sub-components is electrically connected to one of the plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins within the second connector.

3. The system according to claim 2, wherein The memory slots include a plurality of memory gold finger slots, and the signal connection sub-component includes: Multiple groups of gold finger leads. Any one of the multiple groups of gold finger leads includes a first gold finger lead and a second gold finger lead. The first gold finger lead and the second gold finger lead are respectively disposed on both sides of the memory gold finger slot. The first gold finger lead and the second gold finger lead respectively have opposite first protruding structures and second protruding structures, so that when a memory module is inserted, the first gold finger lead and the second gold finger lead jointly clamp the memory gold finger pins of the memory module, and the first protruding structure and the second protruding structure form a double-contact connection with the memory gold finger pins; A plurality of first signal transmission conductors, for electrically connecting the plurality of second gold finger leads having the same first preset pin function for the same memory module among the plurality of memory gold finger slots, and electrically connecting the plurality of second gold finger leads having the same second preset pin function for different memory modules among the plurality of memory gold finger slots; A plurality of second signal transmission conductors, electrically connected to the plurality of first gold finger leads and at least one of the second gold finger leads, and electrically connected to the plurality of connector package pins within the second connector.

4. The system according to claim 3, wherein The first signal transmission conductors and the second signal transmission conductors include signal cables or signal pins.

5. The system according to claim 2, characterized in that, The signal connection component further includes: A power cable, electrically connected to the plurality of memory slots and extending to the second connector to be electrically connected to the connector package pins within the second connector; A ground cable, electrically connected to the plurality of memory slots and extending to the second connector to be electrically connected to the connector package pins within the second connector.

6. The system according to claim 1, characterized in that, The second connector includes: A plurality of connector package pins, disposed at the bottom of the second connector, for electrically connecting the plurality of memory slots to a processor through the main circuit board, so as to transmit memory signals from the processor to the plurality of memory slots; A plurality of first fixing connectors, disposed on both sides of the plurality of connector package pins, for fixing the second connector on the main circuit board.

7. The system according to claim 6, wherein Multiple of the connector package pins are dot - distributed at the bottom of the second connector in a form matching the functional package pins of the processor. The multiple connector package pins include multiple first connector package pins and multiple second connector package pins. The first connector package pins are electrically connected to multiple memory gold finger slots through a first signal transmission conductor and a second signal transmission conductor. The second connector package pins are electrically connected to the memory gold finger slots through the second signal transmission conductor. And the multiple first connector package pins and the multiple second connector package pins are electrically connected to the processor via a routing path provided in the main circuit board.

8. The system according to claim 6, wherein The multiple connector package pins include: A connector power supply package pin, the first end of which is electrically connected to a power cable, and the second end of which is electrically connected to the main circuit board; A connector ground wire package pin, the first end of which is electrically connected to a ground wire cable, and the second end of which is electrically connected to the main circuit board; Multiple connector signal package pins, the first ends of the multiple connector signal package pins are electrically connected to multiple second signal transmission conductors, and the second ends of the multiple connector signal package pins are electrically connected to the main circuit board, so that the multiple second signal transmission conductors extending to the multiple connector signal package pins are electrically connected to the processor through a routing path.

9. The system according to claim 6, wherein The connector package pin includes a spring - type pin or a pin - type pin.

10. The system according to claim 1, characterized in that, The memory slot includes: A memory groove frame for accommodating a memory module; Multiple memory gold finger slots provided at the bottom of the memory groove frame for accommodating multiple memory gold finger pins; Multiple memory package pins respectively provided at the bottoms of the multiple memory gold finger slots, electrically connected to the signal connection components in the memory connector, and providing a power supply signal and a memory signal to the multiple memory slots; A pad provided at the bottom of the memory groove frame for soldering the multiple memory package pins to the first connector.

11. The system according to claim 10, wherein The multiple memory package pins include: A memory power supply package pin, in the case where the memory module is inserted into the memory groove frame, the first end of the memory power supply package pin is electrically connected to the memory module, and the second end of the memory power supply package pin is electrically connected to a power cable; A memory ground wire package pin, in the case where the memory module is inserted into the memory groove frame, the first end of the memory ground wire package pin is electrically connected to the memory module, and the second end of the memory ground wire package pin is electrically connected to a ground wire cable; Multiple memory signal package pins, in the case where the memory module is inserted into the memory groove frame, the multiple memory signal package pins are respectively electrically connected to multiple memory gold finger pins of the memory module and multiple signal connection sub - components.

12. The system according to claim 10, wherein The memory slot further includes: Multiple second fixing connectors respectively provided on both sides of the multiple memory package pins for fixing the memory groove frame to the first connector.

13. The system according to claim 1, characterized in that, The system further includes: A third connector is disposed between the second connector and the main circuit board. A plurality of connection structures are provided on the upper surface of the third connector, and a plurality of intermediate package pins are provided on the lower surface of the third connector. The third connector electrically connects a plurality of connector package pins on the lower surface of the second connector to the main circuit board, so that the second connector is fixed to the main circuit board.

14. An electronic device, characterized in that, The electronic device includes: A memory connection system disposed on the main circuit board; A memory module accommodated in a memory slot of the memory connection system; A processor disposed on the main circuit board, and configured to provide a power supply signal and a memory signal to the memory module via a plurality of trace paths electrically connected to the processor through the memory connection system.

15. The electronic device according to claim 14, wherein The electronic device further includes: A horizontal memory slot disposed between a plurality of the memory connection systems for accommodating an expansion memory module.

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