Vapor chamber and electronic equipment

Abstract

The invention provides a vapor chamber and electronic equipment, and relates to the technical field of electronic equipment. The problems that the heat dissipation performance is poor and the heat dissipation effect of internal elements of electronic equipment is poor due to the fact that the heat resistance of a vapor chamber is large are solved. The vapor chamber comprises the shell, the first wick and at least one second wick, the shell comprises a first cover plate and a second cover plate, and the first cover plate comprises an evaporation area and a condensation area. The first liquid absorption core is arranged in the shell, the first liquid absorption core is attached to the first cover plate, the first liquid absorption core and the second cover plate are arranged in a spaced mode, and the first liquid absorption core covers the evaporation area and the condensation area. The second liquid absorption core is arranged in the shell and covers the evaporation area, and the second liquid absorption core and the first liquid absorption core are arranged in a stacked mode.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a vapor chamber and an electronic device. Background Art

[0002] With the continuous development of electronic devices (such as mobile phones), the heat generation of some components inside the electronic devices is also increasing continuously. Therefore, a vapor chamber (VC) is provided inside the electronic device to dissipate heat from components with relatively large heat generation. However, the existing vapor chambers have a relatively large thermal resistance, resulting in poor heat dissipation performance and thus poor heat dissipation effect for the components inside the electronic device. Summary of the Invention

[0003] Embodiments of this application provide a vapor chamber and an electronic device to solve the problem that the relatively large thermal resistance of the vapor chamber results in poor heat dissipation performance and thus poor heat dissipation effect for the components inside the electronic device.

[0004] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, a vapor chamber is provided. The vapor chamber includes a housing, a first wick, and at least one second wick. The housing includes a first cover plate and a second cover plate. The first cover plate includes an evaporation area and a condensation area. The first wick is disposed inside the housing, is attached to the first cover plate, and is spaced apart from the second cover plate. The first wick covers the evaporation area and the condensation area. The second wick is disposed inside the housing and covers the evaporation area. The second wick is stacked with the first wick.

[0006] For the vapor chamber provided in the first aspect of this application, on the basis of providing the first wick inside the housing, at least one second wick is provided at a position corresponding to the evaporation area, that is, multiple wicks are stacked in the evaporation area to increase the liquid storage capacity corresponding to the evaporation area, so as to be able to absorb more heat and improve the heat dissipation performance. And, since the multiple layers of wicks are all disposed inside the housing, during the heat transfer process, the thermal resistance is small, thus further improving the heat dissipation performance.

[0007] In a possible implementation manner of the first aspect of this application, the housing further includes a plurality of support columns. The support columns are all disposed on the second cover plate and are in contact with the first wick. In this structure, the support columns are in contact between the first wick and the second cover plate, so as to be able to form a support to prevent the space between the first wick and the second cover plate from decreasing and affecting the steam flow.

[0008] In a possible implementation of the first aspect of the present application, the support columns include a first support column and a second support column. The vertical projection of the first support column on the first cover plate is located within the evaporation region, and the vertical projection of the second support column on the first cover plate is located within the condensation region; the spacing distance between two adjacent first support columns is greater than the spacing distance between two adjacent second support columns. In this structure, when the liquid working medium evaporates to form steam and flows from the region where the first support column is located to the region where the second support column is located, since the spacing between the first support columns is greater than the spacing between the second support columns, the cross-sectional area of the steam flow channel decreases, thereby increasing the flow velocity of the steam flow and being beneficial to improving the steam flow efficiency.

[0009] In a possible implementation of the first aspect of the present application, the diameter of the first support column is greater than the diameter of the second support column. In this structure, the supporting effect and reliability of the first support column on the first liquid absorption core and the second liquid absorption core in the evaporation region can be improved.

[0010] In a possible implementation of the first aspect of the present application, the length of the first support column is greater than the length of the second support column. In this structure, it is beneficial to increase the space corresponding to the evaporation region, so that more steam can be accommodated, which is beneficial to further improving the evaporation efficiency.

[0011] In a possible implementation of the first aspect of the present application, the second liquid absorption core includes a first region and a second region. The first region covers the evaporation region, the second region is attached to the condensation region, and the second region extends to the end of the condensation region far from the evaporation region; the second support column is arranged in a region outside the vertical projection of the second region on the second cover plate. In this way, a steam channel can be formed between the second region and the second cover plate, so that the steam can flow quickly to the condensation region. Moreover, the second region can increase the liquid absorption capacity of the condensation region, which is beneficial to improving the heat dissipation performance of the heat pipe.

[0012] In a possible implementation of the first aspect of the present application, the distance between the evaporation region and the second cover plate is a first distance, and the distance between the condensation region and the second cover plate is a second distance. The first distance is greater than the second distance; the first cover plate further includes a transition region, the transition region is connected between the evaporation region and the condensation region, and the included angle formed by the transition region and the second cover plate is an acute angle. In this structure, the transition region is inclined, which is beneficial to reducing the resistance of a part of the first liquid absorption core attached to the transition region, so that the liquid working medium in the first liquid absorption core can flow quickly to the evaporation region to improve the heat dissipation efficiency.

[0013] In a possible implementation of the first aspect of the present application, the support pillar further includes a third support pillar, and the vertical projection of the third support pillar on the first cover plate is located within the transition region. In this structure, the third support pillar abuts against the first liquid absorption core attached to the transition region, thereby ensuring that the first liquid absorption core is closely attached to the transition region.

[0014] In a possible implementation of the first aspect of the present application, the surface of the third support pillar facing the transition region is an abutting surface, and the abutting surface is arranged parallel to the transition region. In this structure, a surface-to-surface contact is formed between the third support pillar and the first liquid absorption core, that is, the contact area between the two is increased, which is beneficial to improving the support reliability.

[0015] In a possible implementation of the first aspect of the present application, the abutting surface extends from the edge of the transition region close to the evaporation region to the edge of the transition region close to the condensation region. In this structure, the contact area between the abutting surface and the first liquid absorption core can be further increased, thereby further improving the support reliability.

[0016] In a possible implementation of the first aspect of the present application, a plurality of third support pillars are provided, and the plurality of third support pillars are spaced apart along the length direction of the transition region. In this structure, the support reliability can be further improved.

[0017] In a possible implementation of the first aspect of the present application, the part of the first liquid absorption core attached to the transition region is fixedly connected to the transition region. For example, the first liquid absorption core and the transition region can be fixed by spot welding.

[0018] In a possible implementation of the first aspect of the present application, a plurality of heat dissipation holes are provided on the outer wall of the second cover plate, the heat dissipation holes are provided in one-to-one correspondence with the support pillars, and the heat dissipation holes extend along the axial direction of the support pillars. In this way, the contact area between the second cover plate and the external air can be increased, thereby improving the heat dissipation efficiency.

[0019] In the second aspect, an electronic device is provided. The electronic device includes a housing, a heating element, and a heat pipe. The heat pipe is the heat pipe described in any of the above technical solutions. The heating element and the heat pipe are both arranged in the housing, the heating element is attached to the first cover plate of the heat pipe, and is located within the evaporation region of the first cover plate.

[0020] For the electronic device provided in the second aspect of the present application, since it includes the heat pipe described in any of the above technical solutions, it can solve the same technical problems and achieve the same technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of an electronic device provided by an embodiment of the present application;

[0022] Figure 2An exploded view of an electronic device provided by an embodiment of the present application;

[0023] Figure 3 A structural diagram of a heat pipe provided by an embodiment of the present application;

[0024] Figure 4 A structural diagram of a stacked heat pipe assembly provided by an embodiment of the present application;

[0025] Figure 5 A structural diagram of another stacked heat pipe assembly provided by an embodiment of the present application;

[0026] Figure 6 A structural diagram of another heat pipe provided by an embodiment of the present application;

[0027] Figure 7 A structural diagram of yet another heat pipe provided by an embodiment of the present application;

[0028] Figure 8 A structural diagram of yet another heat pipe provided by an embodiment of the present application;

[0029] Figure 9 A schematic diagram of the density of the first wick and the second wick provided by an embodiment of the present application;

[0030] Figure 10 A schematic diagram of the spacing between the first support posts and the spacing between the second support posts provided by an embodiment of the present application;

[0031] Figure 11 A structural diagram of a second wick provided by an embodiment of the present application;

[0032] Figure 12 A structural diagram of a second cover plate provided by an embodiment of the present application;

[0033] Figure 13 A structural diagram of a first cover plate provided by an embodiment of the present application;

[0034] Figure 14 A structural diagram of another first cover plate provided by an embodiment of the present application;

[0035] Figure 15 A partial structural diagram of a connection manner between a transition region and a first wick provided by an embodiment of the present application;

[0036] Figure 16 A partial structural diagram of another connection manner between a transition region and a first wick provided by an embodiment of the present application;

[0037] Figure 17 A partial structural diagram of yet another connection manner between a transition region and a first wick provided by an embodiment of the present application.

[0038] Reference numerals: 10 - electronic device; 100 - display module; 110 - light-transmitting cover plate; 120 - display screen; 200 - housing; 210 - rear cover; 220 - frame; 230 - middle plate; 300 - heat pipe; 300a - first heat pipe; 300b - second heat pipe; 301 - lower cover; 301a - first lower cover; 301b - second lower cover; 302 - upper cover; 302a - first upper cover; 302b - second upper cover; 303 - wick; 303a - first wick; 303b - second wick; 304 - double-sided tape; 305 - middle cover plate; 309 - outer shell; 310 - first cover plate; 311 - evaporation area; 312 - condensation area; 313 - transition area; 320 - second cover plate; 321 - heat dissipation holes; 330 - first wick; 340 - second wick; 341 - first area; 342 - second area; 350 - support pillar; 351 - first support pillar; 352 - second support pillar; 353 - third support pillar; 353a - abutting surface; 400 - circuit board. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0040] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0041] In addition, in the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation in which the components in the accompanying drawings are schematically placed. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they may change accordingly with the change of the orientation in which the components in the accompanying drawings are placed.

[0042] In the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, or an integral body; it may be directly connected, or indirectly connected through an intermediate medium.

[0043] Embodiments of the present application provide an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For the convenience of description below, the mobile phone is taken as an example of the electronic device for illustration.

[0044] Please refer to Figure 1 and Figure 2 , Figure 1 , which is a structural diagram of the electronic device 10 provided by the embodiments of the present application. Figure 2 , which is an exploded view of the electronic device 10 provided by the embodiments of the present application. It can be understood that Figure 1 and Figure 2 only schematically show some components included in the electronic device 10, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Figure 1 and Figure 2 .

[0045] As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 may have an approximate rectangular plate-like structure. The electronic device 10 may include a display module 100, a housing 200, a circuit board 400, and components.

[0046] The above display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover plate 110 and a display screen 120 (English name: panel, also known as a display panel), and the light-transmitting cover plate 110 and the display screen 120 are stacked. The material of the light-transmitting cover plate 110 includes but is not limited to glass. For example, the light-transmitting cover plate 110 may be an ordinary light-transmitting cover plate 110, which is used to protect the display screen 120 to avoid damage to the display screen 120 caused by external forces and can play a dust-proof role. Or, the light-transmitting cover plate 110 may also be a light-transmitting cover plate 110 with a touch function, so that the electronic device 10 has a touch function, making it more convenient for users to use. Therefore, the present application does not make special limitations on the specific material of the light-transmitting cover plate 110.

[0047] In addition, the above display screen 120 can be a flexible display screen or a rigid display screen. For example, the display screen 120 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0048] The above housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 can include a rear cover 210 and a frame 220. The rear cover 210 is located on the side of the display screen 120 away from the light-transmitting cover plate 110 and is stacked with the light-transmitting cover plate 110 and the display screen 120. The frame 220 is located between the light-transmitting cover plate 110 and the rear cover 210. The frame 220 is fixed to the rear cover 210. Exemplarily, the frame 220 can be fixed to the rear cover 210 by means of adhesion, screw connection, welding, snap connection, etc.; alternatively, the frame 220 and the rear cover 210 can also be an integrally formed structure, that is, the frame 220 and the rear cover 210 form a structural member as a whole. The light-transmitting cover plate 110 can be fixed to the frame 220 by gluing, so that the light-transmitting cover plate 110, the rear cover 210, and the frame 220 enclose a receiving cavity inside the electronic device 10, and the above circuit board assembly and electronic components are all arranged in this receiving cavity.

[0049] In some embodiments, the housing 200 may further include a middle plate 230 disposed in the accommodation cavity and located on the side of the display screen 120 away from the light-transmitting cover plate 110. The middle plate 230 is fixedly connected to the frame 220 to form the middle frame of the electronic device 10. Exemplarily, the middle plate 230 and the frame 220 may be fixedly connected by means such as gluing, screw connection, welding, snap connection, etc.; alternatively, the middle plate 230 and the frame 220 may also be an integrally formed structure, that is, the middle plate 230 and the frame 220 form a structural member as a whole. The middle plate 230 divides the accommodation cavity into two independent spaces. One space is located between the light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located in this space. The other space is located between the middle plate 230 and the rear cover 210, and the circuit board assembly is located in this space.

[0050] The circuit board 400 is used to arrange the components inside the electronic device 10 and realize the electrical connection between the components. Among them, the circuit board 400 can be fixed to the middle plate 230 by means such as gluing, screw connection, welding, snap connection, etc. Therefore, the present application does not make special limitations on the fixing method of the circuit board 400.

[0051] The above-mentioned components are used to realize various functions of the electronic device 10. For example, the components can be a control chip (such as a system-on-chip, SOC), a graphics control chip (graphics processing unit, GPU), a universal flash storage (UFS), a camera module, a flash module, and capacitors, resistors, inductors, etc.

[0052] Among them, some components can generate heat during operation. For example, the SOC chip. These components that can generate heat can also be called heat-generating elements, and are all called heat-generating elements in the following embodiments. To reduce the risk of damage to the heat-generating elements due to excessive heat generation, a heat pipe 300 can be provided in the housing 200 to dissipate heat for the heat-generating elements with relatively large heat generation through the heat pipe 300.

[0053] Specifically, please refer to Figure 3 , Figure 3 which is a structural diagram of a heat pipe 300 provided by an embodiment of the present application. The heat pipe 300 may include a housing 309 and a wick 303. The housing 309 includes a lower cover 301 and an upper cover 302. The wick 303 is disposed inside the housing 309, and the wick 303 is filled with a liquid working medium. The above-mentioned heat-generating element is attached to the outer surface of the housing 309, that is, the outer wall of the lower cover 301 or the upper cover 302.

[0054] When the heating element generates heat, the liquid working medium in the wick 303 absorbs the heat (i.e., the evaporation end). After the liquid working medium evaporates, it detaches from the wick 303 and forms steam. The steam can flow in the internal space of the housing 309 and flow to an area far from the heating element (i.e., the condensation end). After the steam releases heat in this area, it condenses back into a liquid (i.e., the liquid working medium) again, and is absorbed by the wick 303. Finally, the liquid working medium in the wick 303 flows back to the area where the heating element is located, thus forming an evaporative cooling cycle (as Figure 3 indicated by the arrow) to achieve heat dissipation.

[0055] To further improve the heat dissipation performance of the heat pipe 300, two heat pipes 300 can be stacked on top of each other to form a stacked heat pipe 300 assembly, which can increase the heat storage capacity of the heat pipe 300 to improve the heat dissipation performance of the heat pipe 300. In some embodiments, the above-mentioned stacked heat pipe assembly can include two heat pipes 300, and the outer shells 309 of the two heat pipes 300 are adhesively fixed by double-sided tape 304.

[0056] Exemplarily, please refer to Figure 4 , Figure 4 which is a structural diagram of a stacked heat pipe assembly provided by an embodiment of the present application. The two heat pipes 300 are respectively the first heat pipe 300a and the second heat pipe 300b. The first heat pipe 300a includes a first lower cover 301a, a first upper cover 302a, and a first wick 303a. The second heat pipe 300b includes a second lower cover 301b, a second upper cover 302b, and a second wick 303b. The heating element can be attached to the outer wall of the first upper cover 302a.

[0057] When the heating element generates heat, the heat transfer needs to pass through the first upper cover 302a, the first wick 303a, the first lower cover 301a, the double-sided tape 304, the second upper cover 302b, the second wick 303b, and the second lower cover 301b in sequence. That is, the total thermal resistance = the thermal resistance of the first upper cover 302a + the thermal resistance of the first wick 303a + the thermal resistance of the first lower cover 301a + the thermal resistance of the double-sided tape 304 + the thermal resistance of the second upper cover 302b + the thermal resistance of the second wick 303b + the thermal resistance of the second lower cover 301b.

[0058] Alternatively, please refer to Figure 5 , Figure 5 which is another structural diagram of a stacked heat pipe assembly provided by an embodiment of the present application. The stacked heat pipe assembly can include a lower cover 301, an intermediate cover plate 305, and an upper cover 302. A sealed cavity is formed between the lower cover 301 and the intermediate cover plate 305, and a sealed cavity is formed between the upper cover 302 and the intermediate cover plate 305. A first wick 303a and a second wick 303b are respectively arranged in the two sealed cavities, and are filled with a liquid working medium, so as to form a stacked structure.

[0059] Exemplarily, the heating element is attached to the outer wall of the upper cover 302. When the heating element generates heat, the heat transfer needs to pass through the upper cover 302, the first wick 303a, the intermediate cover plate 305, the second wick 303b, and the lower cover 301 in sequence. That is, during the heat transfer process, the total thermal resistance = the thermal resistance of the upper cover 302 + the thermal resistance of the first wick 303a + the thermal resistance of the intermediate cover plate 305 + the thermal resistance of the second wick 303b + the thermal resistance of the lower cover 301.

[0060] It can be seen from this that during the operation of the above-mentioned stacked heat pipe 300 assembly, there is a large thermal resistance in the heat transfer. Therefore, it will affect the overall heat dissipation ability and result in poor heat dissipation effect of the heating element inside the electronic device 10.

[0061] To solve the above problems, please refer to Figure 6 , Figure 6 FIG. is a structural diagram of another heat pipe 300 provided by an embodiment of the present application. The heat pipe 300 can be applied to the above-mentioned electronic device 10. And the heat pipe 300 can be fixed to the middle frame of the electronic device 10 by means of dispensing, dispensing plus back glue, large-area back glue plus local dispensing, etc. The present application does not make special limitations on this. The heat pipe 300 includes a housing 309, a first wick 330, and at least one second wick 340.

[0062] Among them, the housing 309 includes a first cover plate 310 and a second cover plate 320. The first cover plate 310 and the second cover plate 320 are fastened and fixed to each other, and a cavity is formed therebetween. The first cover plate 310 includes an evaporation area 311 and a condensation area 312. The first wick 330 is disposed inside the housing 309. The first wick 330 is attached to the first cover plate 310 and is spaced from the second cover plate 320. The first wick 330 covers the evaporation area 311 and the condensation area 312. The second wick 340 is disposed inside the housing 309 and covers the evaporation area 311. The second wick 340 is stacked with the first wick 330.

[0063] In some embodiments, please continue to refer to Figure 6 , the second wick 340 can also be disposed on the side of the first wick 330 away from the first cover plate 310. Or, please refer to Figure 7 , Figure 7 FIG. is a structural diagram of yet another heat pipe 300 provided by an embodiment of the present application. The second wick 340 can be disposed between the first wick 330 and the first cover plate 310. And the second wick 340 can be provided with one, or can be provided with multiple according to actual needs. Therefore, the present application does not make special limitations on this. In the following embodiments, it is described by taking the second wick 340 being provided with one and disposed between the first wick 330 and the first cover plate 310 as an example.

[0064] In this way, on the basis that the first liquid absorbent core 330 is arranged inside the outer shell 309, at least one second liquid absorbent core 340 is arranged at a position corresponding to the evaporation area 311, that is, multiple layers of liquid absorbent cores 303 are stacked in the evaporation area 311 to increase the liquid storage capacity corresponding to the evaporation area 311, so as to be able to absorb more heat and improve the heat dissipation performance. And, since the multiple layers of liquid absorbent cores 303 are all arranged inside the outer shell 309, therefore, during the heat transfer process, the thermal resistance is small, so as to be able to further improve the heat dissipation performance. At the same time, only by arranging multiple layers of liquid absorbent cores 303 in the space corresponding to the evaporation area 311, only the thickness dimension of the evaporation area 311 on the first cover plate 310 needs to be increased, and the size of the condensation area 312 does not need to be increased.

[0065] In some embodiments, please continue to refer to Figure 7 , when the first cover plate 310 and the second cover plate 320 are buckled with each other to form the outer shell 309, the distance between the evaporation area 311 of the first cover plate 310 and the second cover plate 320 is the first distance H1, and the distance between the condensation area 312 of the first cover plate 310 and the second cover plate 320 is the second distance H2, and the first distance H1 is greater than the second distance H2. That is, the evaporation area 311 and the condensation area 312 are connected by a transition area 313 (see the following embodiments for details).

[0066] In this way, multiple layers of second liquid absorbent cores 340 can be stacked in the evaporation area 311 of the first cover plate 310, so as to be able to increase the liquid storage capacity of the liquid absorbent core 303 at the evaporation area 311, and further be beneficial to improving the heat absorption capacity and the heat dissipation performance.

[0067] Exemplarily, the first cover plate 310 and the second cover plate 320 can be formed by stamping, that is, a stamping process is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320, so as to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two are buckled with each other, an outer shell 309 with a cavity inside can be formed. When performing the stamping process on the first cover plate 310, the depth of the groove structure formed in the evaporation area 311 can be made greater than the depth of the groove in the condensation area 312, so that after the first cover plate 310 and the second cover plate 320 are buckled with each other, the first distance can be greater than the second distance.

[0068] And, the first cover plate 310 and the second cover plate 320 can be fixed by laser welding. For example, the first cover plate 310 and the second cover plate 320 can be made of stainless steel material and fixed by laser welding.

[0069] Or, please refer to Figure 8 , Figure 8This is another structural diagram of the heat pipe 300 provided by the embodiments of the present application. The above-mentioned first cover plate 310 and second cover plate 320 can also be formed by etching, that is, an etching process is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320, so as to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two are buckled with each other, a housing 309 with a cavity inside can be formed. When etching the first cover plate 310, the groove structures with different depths can be formed, so that after the first cover plate 310 and the second cover plate 320 are buckled with each other, the first distance can be greater than the second distance.

[0070] Moreover, the first cover plate 310 and the second cover plate 320 can be fixedly connected by solder paste. For example, the first cover plate 310 and the second cover plate 320 can be made of copper metal and fixedly connected by solder paste.

[0071] In addition, the above-mentioned first wick 330 and second wick 340 can be fixed on the first cover plate 310 by spot welding, which is beneficial to further improving the overall structural strength. And the first wick 330 and the second wick 340 can adopt wicks 303 with different densities (different mesh numbers).

[0072] For example, please refer to Figure 9 , Figure 9 This is a schematic diagram of the density of the first wick 330 and the second wick 340 provided by the embodiments of the present application. The second wick 340 can adopt a high-mesh wick 303, and the first wick 330 can adopt a low-mesh wick 303. In this way, since the mesh number of the second wick 340 is higher, the bubbles generated by the evaporation of the liquid working medium in the second wick 340 are smaller, that is, the flow channel space is smaller. And the mesh number of the first wick 330 is lower, so the bubbles generated by the evaporation of the liquid working medium in the first wick 330 are larger, that is, the flow channel space is larger. Thus, the smaller bubbles generated in the second wick 340 can squeeze the larger bubbles in the first wick 330 to promote the evaporation cycle and improve the evaporation efficiency.

[0073] In some other possible examples, the above-mentioned second wick 340 can also adopt a low-mesh wick 303, and the first wick 330 can also adopt a high-mesh wick. In this way, since the permeability of the wick 303 decreases with the increase of the mesh number, that is, the permeability of the high-mesh wick is lower. Therefore, the second wick 340 adopts a low mesh number and the first wick 330 adopts a high mesh number, which is beneficial to reducing the flow resistance and thus reducing the risk of the wick being dried out by evaporation.

[0074] Since there is a space between the first wick 330 and the second cover plate 320 as described above, after the liquid working medium absorbs heat to form steam, it can flow in the space between the first wick 330 and the second cover plate 320. To prevent the space between the first wick 330 and the second cover plate 320 from gradually decreasing during use. Please go back and refer to Figure 7 and Figure 8 , the heat pipe 300 provided by the embodiment of the present application further includes a plurality of support columns 350. The plurality of support columns 350 are arranged on the inner wall of the second cover plate 320, and the free ends of the support columns 350 abut against the first wick 330.

[0075] Based on this, by arranging a plurality of support columns 350 between the second cover plate 320 and the first wick 330, on the one hand, an effective support can be formed between the second cover plate 320 and the first wick 330 to prevent the first cover plate 310 or the second cover plate 320 from being recessed, resulting in a reduction in the space between the first wick 330 and the second cover plate 320. On the other hand, by abutting the support columns 350 against the first wick 330, it can be ensured that the first wick 330 and the second wick 340 are in close contact with the first cover plate 310 to prevent the two from separating, thereby ensuring the heat dissipation effect.

[0076] In some embodiments, the plurality of support columns 350 include a plurality of first support columns 351 and a plurality of second support columns 352. The vertical projections of the plurality of first support columns 351 on the first cover plate 310 are located in the evaporation region 311, and the vertical projections of the plurality of second support columns 352 on the first cover plate 310 are located in the condensation region 312. The spacing distance between two adjacent first support columns 351 is greater than the spacing distance between two adjacent second support columns 352.

[0077] In this way, please refer to Figure 10 , Figure 10 is a schematic diagram of the spacing of the first support columns 351 and the spacing of the second support columns 352 provided by the embodiment of the present application. When the steam flows from the region where the first support columns 351 are located to the region where the second support columns 352 are located, since the spacing of the first support columns 351 is greater than the spacing of the second support columns 352, that is, the flow cross-section of the steam decreases, the flow velocity of the steam can be increased. It is known through experiments that this structure can increase the steam flow velocity by 85%. Therefore, the heat can be quickly flowed to the space corresponding to the condensation region 312. When the steam condenses into a liquid state, it is absorbed by the wick 303 and then continues to circulate.

[0078] In addition, the diameter of the first support column 351 described above can be greater than the diameter of the second support column 352. In this structure, it is beneficial to improve the support strength of the first support column 351, ensure that the first liquid absorption core 330 and the second liquid absorption core 340 are in mutual contact and in contact with the first cover plate 310, so as to ensure the heat absorption and evaporation efficiency.

[0079] Moreover, the length of the first support column 351 can also be greater than the length of the second support column 352 (as Figure 8 shown). That is, within the area corresponding to the evaporation area 311, the distance between the first liquid absorption core 330 and the second cover plate 320 is the third distance H3; within the area corresponding to the condensation area 312, the distance between the first liquid absorption core 330 and the second cover plate 320 is the fourth distance H4, and the third distance H3 is greater than the fourth distance H4. In this structure, the space corresponding to the evaporation area 311 can be increased, so that more steam can be accommodated, which is beneficial to further improving the evaporation efficiency.

[0080] In some other embodiments, please refer to Figure 11 and Figure 12 , Figure 11 which is a structural diagram of a second liquid absorption core provided by an embodiment of the present application, Figure 12 and Figure 12 which is a structural diagram of a second cover plate 320 provided by an embodiment of the present application. The above-mentioned second liquid absorption core 340 can include a first area 341 and a second area 342. The first area 341 covers the evaporation area 311 of the first cover plate 310, and the second area 342 is in contact with the condensation area 312, and the second area 342 extends to one end of the condensation area 312 far from the evaporation area 311. The second support columns 352 are all arranged in the area outside the vertical projection of the second area 342 of the second liquid absorption core 340 on the second cover plate 320.

[0081] In this way, by arranging the second area 342 of the second liquid absorption core 340 in the condensation area 312 and not arranging the second support columns 352 in the corresponding area, a steam channel can be formed between the second area 342 and the second cover plate 320. On the one hand, the liquid absorption capacity of the condensation area 312 can be improved through the second area 342. On the other hand, there is no steam resistance in this steam channel, which is beneficial to the rapid flow of steam, so as to improve the evaporation cooling cycle efficiency.

[0082] Exemplarily, please continue to refer to Figure 11 and Figure 12 , one end of the second area 342 of the above-mentioned second liquid absorption core 340 connected to the first area 341 can be arranged at the position closest to the heat source (i.e., the heating element), so that part of the heat can flow quickly to the condensation area 312 through the steam channel formed between the second area 342 and the second cover plate 320 and be cooled into a liquid state to improve the cycle efficiency.

[0083] On this basis, since the evaporation region 311 and the condensation region 312 of the first cover plate 310 are not in the same plane, the first cover plate 310 further includes a transition region 313 (as shown in Figure 7 and Figure 8 ), and the transition region 313 forms an acute angle with the second cover plate 320, that is, 0 to 90°. And, along the direction from the evaporation region 311 to the condensation region 312, the length of the transition region 313 is in the range of 0.3 mm to 5 mm.

[0084] Exemplarily, please refer to Figure 13 , Figure 13 which is a structural diagram of a first cover plate 310 provided by an embodiment of the present application. The transition region 313 can form a straight-line structure, that is, it extends along one direction. Or, please refer to Figure 14 , Figure 14 which is another structural diagram of a first cover plate 310 provided by an embodiment of the present application. The transition region 313 can also be a bent structure, that is, it extends along multiple directions. Thus, the first cover plate 310 can be separated into an evaporation region 311 and a condensation region 312 through the transition region 313. Therefore, the specific structure of the transition region 313 in the present application is not particularly limited.

[0085] In this way, by extending the transition region 313 obliquely, the part of the first wick 330 that fits to the transition region 313 can better fit to the transition region 313, so as to ensure that the part of the first wick 330 that fits to the transition region 313 does not generate a large resistance, so as to ensure that the liquid working medium can flow normally.

[0086] In addition, to avoid the part of the first wick 330 that fits to the transition region 313 not fitting tightly to the transition region 313. In some embodiments, please refer to Figure 15 , Figure 15 which is a partial structural diagram of a connection manner between the transition region 313 and the first wick 330 provided by an embodiment of the present application. Spot welding can be performed between the transition region 313 and the first wick 330 to ensure that the first wick 330 fits tightly to the transition region 313, so that the liquid working medium in the first wick 330 can absorb heat and evaporate normally.

[0087] In some other embodiments, please refer to Figure 16 , Figure 16This is a partial structural diagram of another connection method between the transition region 313 and the first liquid absorption core 330 provided by the embodiment of the present application. The above-mentioned plurality of support columns 350 may further include a third support column 353, and the vertical projection of the third support column 353 on the first cover plate 310 is located within the transition region 313. That is, the first liquid absorption core 330 is abutted against by the third support column 353, so as to ensure that the first liquid absorption core 330 is closely attached to the transition region 313. At the same time, the third support column 353 can support the transition region 313, which is beneficial to further improving the reliability of the overall structure.

[0088] Exemplarily, the surface of the third support column 353 facing the transition region 313 is a contact surface 353a, and the contact surface 353a may be arranged parallel to the transition region 313. That is, a surface-to-surface contact and abutment can be formed between the third support column 353 and the first liquid absorption core 330, which is beneficial to increasing the contact area between the third support column 353 and the first liquid absorption core 330, and thus is beneficial to ensuring that the first liquid absorption core 330 is closely attached to the transition region 313.

[0089] Moreover, one or more of the above-mentioned third support columns 353 may be provided. When only one third support column 353 is provided, the third support column 353 may be arranged in the middle region of the transition region 313 to ensure stable support. When a plurality of third support columns 353 are provided, the plurality of third support columns 353 may be spaced apart.

[0090] In addition, please refer to Figure 17 , Figure 17 This is a partial structural diagram of yet another connection method between the transition region 313 and the first liquid absorption core 330 provided by the embodiment of the present application. The contact surface 353a of the above-mentioned third support column 353 may extend from the edge of the transition region 313 close to the evaporation region 311 to the edge of the transition region 313 close to the condensation region 312. In this way, the contact area between the contact surface 353a and the first liquid absorption core 330 can be further increased, and thus the support effect can be further improved.

[0091] In some other possible examples, the end of the above-mentioned third support column 353 abutting against the first liquid absorption core 330 may also be a circular structure, a square structure, etc. Therefore, the present application does not make special limitations on this.

[0092] Based on this, to further improve the heat dissipation effect of the above-mentioned heat pipe 300, a plurality of heat dissipation holes 321 can be formed on the outer wall of the second cover plate 320. The heat dissipation holes 321 are arranged in one-to-one correspondence with the support columns 350, and the heat dissipation holes 321 extend along the axial direction of the support columns 350. That is, a hollow structure is formed in the middle of each support column 350, which is beneficial to increasing the contact area between the outer wall of the second cover plate 320 and the external air, thereby further improving the heat dissipation efficiency and enhancing the heat dissipation performance of the heat pipe 300.

[0093] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

[0094] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat pipe, characterized in that, Comprising: A housing, the housing includes a first cover plate and a second cover plate, the first cover plate includes an evaporation area and a condensation area; A first wick, disposed within the housing, the first wick is attached to the first cover plate and is spaced apart from the second cover plate, the first wick covers the evaporation area and the condensation area; At least one second wick, disposed within the housing and covering the evaporation area; the second wick is stacked with the first wick.

2. The heat pipe according to claim 1, characterized in that, The housing further includes a plurality of support columns, the support columns are all disposed on the second cover plate and are in contact with the first wick.

3. The heat pipe according to claim 2, wherein The support columns include a first support column and a second support column, the vertical projection of the first support column on the first cover plate is located within the evaporation area, and the vertical projection of the second support column on the first cover plate is located within the condensation area; the spacing distance between two adjacent first support columns is greater than the spacing distance between two adjacent second support columns.

4. The heat pipe according to claim 3, characterized in that, The diameter of the first support column is greater than the diameter of the second support column.

5. The heat pipe according to claim 3, characterized in that, The length of the first support column is greater than the length of the second support column.

6. The heat pipe according to claim 3, characterized in that, The second wick includes a first area and a second area, the first area covers the evaporation area, the second area is attached to the condensation area, and the second area extends to the end of the condensation area away from the evaporation area; the second support column is disposed in an area outside the vertical projection of the second area on the second cover plate.

7. The heat pipe according to any one of claims 2 to 6, characterized in that The distance between the evaporation area and the second cover plate is a first distance, and the distance between the condensation area and the second cover plate is a second distance, the first distance is greater than the second distance; The first cover plate further includes a transition area, the transition area is connected between the evaporation area and the condensation area, and the angle formed by the transition area and the second cover plate is an acute angle.

8. The heat pipe according to claim 7, wherein The support column further includes a third support column, and the vertical projection of the third support column on the first cover plate is located within the transition area.

9. The heat pipe according to claim 8, wherein, The surface of the third support column facing the transition area is a contact surface, and the contact surface is arranged parallel to the transition area.

10. The heat pipe according to claim 9, wherein, The contact surface extends from the edge of the transition area close to the evaporation area to the edge of the transition area close to the condensation area.

11. The heat pipe according to claim 10, wherein A plurality of the third support columns are provided, and the plurality of third support columns are spaced apart along the length direction of the transition area.

12. The heat pipe according to claim 7, characterized in that, The portion of the first wick attached to the transition area is fixedly connected to the transition area.

13. The heat pipe according to any one of claims 2 to 12, characterized in that A plurality of heat dissipation holes are provided on the outer wall of the second cover plate, the heat dissipation holes are arranged in one-to-one correspondence with the support columns, and the heat dissipation holes extend along the axial direction of the support columns.

14. An electronic device, characterized in that, Comprising a housing, a heating element, and a heat pipe, the heat pipe is the heat pipe according to any one of claims 1 to 13, the heating element and the heat pipe are both disposed within the housing, the heating element is attached to the first cover plate of the heat pipe and is located within the evaporation area of the first cover plate.

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