Display panel and manufacturing method thereof

Abstract

The embodiment of the invention provides a display panel and a manufacturing method thereof. The display panel comprises a light-emitting substrate, a light-transmitting protective layer and a first reflecting layer. The light-emitting substrate includes a substrate and a light-emitting device layer. The light emitting device layer is on the substrate and includes a plurality of light emitting devices. The first reflecting layer is located on the side, away from the substrate, of the light-emitting device layer and comprises a plurality of first light-transmitting openings penetrating through the first reflecting layer. The plurality of first light-transmitting openings are respectively overlapped with the plurality of light-emitting devices. The light-transmitting protection layer is located between the light-emitting device layer and the first reflection layer. In the process of forming the plurality of first light-transmitting openings of the first reflecting layer, the light-transmitting protective layer plays a role in protecting the light-emitting device layer, so that the risk of damage to the light-emitting device layer is reduced, and the service life of the display panel is prolonged. Moreover, the light emitted by the light-emitting device is reflected by the reflecting layer after entering the first light-transmitting opening, so that the utilization rate of the light emitted by the light-emitting device is improved, and the display brightness of the display panel is further improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] With the maturity and development of wearable consumer electronic technologies such as augmented reality (AR) and virtual reality (VR), users have higher and higher requirements for the displays of wearable consumer electronic devices, especially in terms of display life and brightness.

[0003] Therefore, how to strike a balance between the lifespan and brightness of the display is a technical problem that needs to be solved. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, which extend the service life of the display panel and improve the display brightness of the display panel, so as to at least partially solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned object, according to a first aspect of an embodiment of the present application, a display panel is provided. The display panel includes a light-emitting substrate, a light-transmitting protective layer and a first reflective layer. The light-emitting substrate includes a substrate and a light-emitting device layer. The light-emitting device layer is located on the substrate and includes a plurality of light-emitting devices. The first reflective layer is located on a side of the light-emitting device layer away from the substrate, and includes a plurality of first light-transmitting openings penetrating the first reflective layer. The plurality of first light-transmitting openings overlap with the plurality of light-emitting devices, respectively. The light-transmitting protective layer is located between the light-emitting device layer and the first reflective layer.

[0006] Optionally, the thickness of the light-transmitting protective layer is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms.

[0007] Optionally, the display panel further comprises a filling structure, and the filling structure is filled between adjacent light-emitting devices; wherein the material of the filling structure is the same as that of the light-transmitting protective layer.

[0008] Optionally, the display panel further includes a dielectric layer, wherein the dielectric layer at least covers a plurality of side walls of the first reflective layer, and the plurality of side walls respectively define a plurality of the first light-transmitting openings.

[0009] Optionally, the thickness of the dielectric layer is smaller than the thickness of the light-transmitting protective layer.

[0010] Optionally, the material of the dielectric layer is the same as that of the light-transmitting protective layer.

[0011] Optionally, the thickness of the dielectric layer is greater than or equal to 500 angstroms and less than or equal to 1000 angstroms.

[0012] Optionally, the light-emitting device includes an inorganic light-emitting diode and a first transparent conductive layer, the first transparent conductive layer being located between the inorganic light-emitting diode and the substrate. The plurality of light-emitting devices further includes a shared second transparent conductive layer, the second transparent conductive layer being located on a side of the inorganic light-emitting diode facing away from the substrate and between adjacent light-emitting devices, and a thickness of the second transparent conductive layer being greater than a thickness of the first transparent conductive layer.

[0013] Optionally, the first reflective layer includes a metal, and a ratio of a thickness of the first reflective layer to a thickness of the light-transmissive protective layer is greater than or equal to 5 and less than or equal to 50.

[0014] Optionally, the thickness of the first reflective layer is greater than or equal to 1 micrometer and less than or equal to 5 micrometers.

[0015] Optionally, the display panel further includes:

[0016] a first color conversion unit, located in at least one of the first light-transmissive openings and configured to convert first color light emitted by at least one of the light-emitting devices into second color light, a color of the first color light being different from a color of the second color light;

[0017] a second color conversion unit, located in at least one of the first light-transmissive openings and configured to convert first color light emitted by at least one of the light-emitting devices into third color light, a color of the third color light being different from the color of the second color light and the color of the first color light; and

[0018] a light-transmissive scattering unit, located in at least one of the first light-transmissive openings.

[0019] Optionally, the display panel further includes a second reflective layer, the second reflective layer being located on a side of the first reflective layer facing away from the light-transmissive protective layer, covering the first color conversion unit and the second color conversion unit, and including second light-transmissive openings, the second light-transmissive openings overlapping with the light-transmissive scattering unit; the second reflective layer is configured to reflect the first color light and transmit the second color light and the third color light.

[0020] According to a second aspect of the embodiments of the present application, there is provided a method for manufacturing a display panel. The method for manufacturing a display panel includes:

[0021] forming a light-emitting substrate, the light-emitting substrate including a substrate and a light-emitting device layer, the light-emitting device layer being located on the substrate and including a plurality of light-emitting devices;

[0022] forming a light-transmissive protective layer on a surface of the light-emitting device layer facing away from the substrate;

[0023] A first reflective layer is formed on the surface of the light-transmissive protective layer facing away from the light-emitting substrate, and a part of the first reflective layer is removed to form a plurality of spaced-apart first light-transmissive openings, and the plurality of first light-transmissive openings respectively overlap with the plurality of light-emitting devices.

[0024] In the display panel and its manufacturing method according to some embodiments of the present application, during the process of forming the plurality of first light-transmissive openings of the first reflective layer, the light-transmissive protective layer plays a protective role on the light-emitting device layer to reduce the risk of damage to the light-emitting device layer, thereby extending the service life of the display panel. Moreover, after the light emitted by the light-emitting device enters the first light-transmissive opening, it will be reflected by the reflective layer, improving the utilization rate of the light emitted by the light-emitting device, and further improving the display brightness of the display panel. Brief Description of the Drawings

[0025] Figure 1 It is a schematic cross-sectional structure diagram of a display panel provided by some embodiments of the present application;

[0026] Figure 2 It is a schematic cross-sectional structure diagram of a light-emitting substrate provided by some embodiments of the present application;

[0027] Figure 3 It is a schematic flow chart of a manufacturing method of a display panel provided by some embodiments of the present application;

[0028] Figures 4 to 8 It is a schematic process diagram of a manufacturing method of a display panel provided by some embodiments of the present application.

[0029] The reference numerals are as follows:

[0030] 100, display panel;

[0031] 11, light-emitting substrate; 111, substrate; 112, light-emitting device layer; 112A, light-emitting epitaxial stack; 113, light-emitting device; 114, N electrode; 114A, N electrode layer; 115, P electrode; 115A, P electrode layer; 116, inorganic light-emitting layer; 116A, light-emitting layer;

[0032] 131, first transparent conductive layer; 132, second transparent conductive layer;

[0033] 141, first bonding metal layer; 142, second bonding metal layer;

[0034] 15, isolation layer;

[0035] 21, first reflective layer; 211, first light-transmissive opening; 212, reflective dam;

[0036] 31, light-transmissive protective layer; 32, filling structure;

[0037] 41. Dielectric layer;

[0038] 51. First color conversion unit; 52. Second color conversion unit; 53. Light-transmitting and scattering unit;

[0039] 61. Second reflective layer; 611. Second light-transmitting opening;

[0040] 71. Temporary carrier substrate. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0042] Refer to Figure 1 and Figure 2 , Figure 1 which are schematic cross-sectional views of a display panel provided in some embodiments of the present application, Figure 2 and which are schematic cross-sectional views of a light-emitting substrate provided in some embodiments of the present application.

[0043] As Figure 1 shown, the display panel 100 includes a light-emitting substrate 11. The light-emitting substrate 11 includes a substrate 111 and a light-emitting device layer 112. The light-emitting device layer 112 is located on the substrate 111 and includes a plurality of light-emitting devices 113.

[0044] In some embodiments, a driving circuit is provided on the substrate 111 to drive the plurality of light-emitting devices 113 to emit light. In some embodiments, the driving circuit may include at least one of a field-effect transistor and a transistor.

[0045] In some embodiments, the substrate 111 may include any one of a silicon substrate, a glass substrate, and a flexible substrate.

[0046] Exemplarily, the substrate 111 includes a silicon substrate, and a CMOS circuit is provided on the silicon substrate. The technology of the silicon substrate is mature, the process stability is good, and the yield is high. Integrating the plurality of light-emitting devices 113 on the silicon substrate is beneficial for the display panel 100 to have a higher pixel density and lower power consumption.

[0047] In some embodiments, the light-emitting device 113 may include any one of an organic light-emitting diode, an inorganic light-emitting diode, a micro light-emitting diode, and a submillimeter light-emitting diode.

[0048] In an exemplary embodiment, as Figure 2As shown, the light-emitting device 113 includes an inorganic light-emitting diode. The inorganic light-emitting diode includes an N electrode 114, a P electrode 115, and an inorganic light-emitting layer 116. The inorganic light-emitting layer 116 is located between the N electrode 114 and the P electrode 115.

[0049] The inorganic light-emitting layer 116 includes a semiconductor material. In some embodiments, the inorganic light-emitting layer 116 may include one or more of gallium arsenide (GaAs), gallium phosphide (GaP), gallium nitride (GaN), silicon carbide (SiC), and zinc selenide (ZnSe).

[0050] The N electrode 114 may include an N-type ion-doped semiconductor material. The P electrode 115 may include a P-type ion-doped semiconductor material. In some embodiments, the semiconductor material may include one or more of gallium arsenide (GaAs), gallium phosphide (GaP), gallium nitride (GaN), and zinc selenide (ZnSe).

[0051] Exemplarily, the inorganic light-emitting layer 116 may include indium gallium nitride (InGaN), the N electrode 114 includes N-type ion-doped gallium nitride, and the P electrode 115 includes P-type ion-doped gallium nitride. Thus, the light-emitting device 113 can emit blue light.

[0052] In some embodiments, as Figure 2 shown, when the light-emitting device 113 includes an inorganic light-emitting diode, each light-emitting device 113 may further include a first transparent conductive layer 131. The first transparent conductive layer 131 is located between the inorganic light-emitting diode and the substrate 111. The P electrode 115 is located between the inorganic light-emitting layer 116 and the first transparent conductive layer 131. The first transparent conductive layer 131 plays a role in expanding the surface current of the light-emitting device 113, improving the brightness uniformity of the light emitted by the light-emitting device 113.

[0053] In some embodiments, as Figure 2 shown, when the light-emitting device 113 includes an inorganic light-emitting diode, a plurality of light-emitting devices 113 further include a second transparent conductive layer 132. The second transparent conductive layer 132 is located on the side of the inorganic light-emitting diode facing away from the substrate 111 and between adjacent light-emitting devices 113. The N electrode 114 is located between the second transparent conductive layer 132 and the inorganic light-emitting layer 116, and a plurality of light-emitting devices 113 share a second transparent conductive layer 132. The second transparent conductive layer 132 also plays a role in expanding the surface current of the light-emitting device 113, improving the brightness uniformity of the light emitted by the light-emitting device 113.

[0054] In some embodiments, the thickness of the second transparent conductive layer 132 located between adjacent light-emitting devices 113 is greater than the thickness of the second transparent conductive layer 132 located between the light-transmitting protective layer and the inorganic light-emitting diode, so that the thickness of the second transparent conductive layer 132 located between adjacent light-emitting devices 113 is reduced, thereby reducing the risk of the second transparent conductive layer 132 located between adjacent light-emitting devices 113 breaking at a step difference (for example, a step difference formed by a gap between a light-emitting device 113 and an adjacent light-emitting device 113).

[0055] In some embodiments, the thickness of the second transparent conductive layer 132 is greater than that of the first transparent conductive layer 131 , so that the thickness of the second transparent conductive layer 132 is relatively large, thereby reducing the risk of the second transparent conductive layer 132 being broken at the step due to its thin thickness.

[0056] In some embodiments, the thickness of the first transparent conductive layer 131 is greater than or equal to 1800 angstroms and less than or equal to 2500 angstroms.

[0057] In some embodiments, the thickness of the second transparent conductive layer 132 is greater than or equal to 2000 angstroms and less than or equal to 3000 angstroms.

[0058] In some embodiments, any one of the first transparent conductive layer 131 and the second transparent conductive layer 132 may include at least one of indium tin oxide, aluminum zinc oxide, gallium zinc oxide, and tin oxide. Exemplarily, both the first transparent conductive layer 131 and the second transparent conductive layer 132 include indium tin oxide.

[0059] like Figure 1 As shown, the display panel 100 further includes a first reflective layer 21 and a light-transmitting protective layer 31. The first reflective layer 21 is located on the side of the light-emitting device layer 112 away from the substrate 111, and includes a plurality of first light-transmitting openings 211 penetrating the first reflective layer 21. The plurality of first light-transmitting openings 211 overlap with the plurality of light-emitting devices 113, respectively. The light-transmitting protective layer 31 is located between the light-emitting device layer 112 and the first reflective layer 21. In the process of forming the plurality of first light-transmitting openings 211 of the first reflective layer 21, the light-transmitting protective layer 31 protects the light-emitting device layer 112 to reduce the risk of damage to the light-emitting device layer 112, thereby extending the service life of the display panel 100. In addition, after the light emitted by the light-emitting device 113 is incident on the first light-transmitting opening 211, it will be reflected by the reflective layer, thereby improving the utilization rate of the light emitted by the light-emitting device 113, thereby improving the display brightness of the display panel 100. That is, the arrangement of the first reflective layer 21 and the light-transmitting protective layer 31 takes into account both the service life and the display brightness of the display panel 100.

[0060] In some embodiments, the thickness of the light-transmitting protective layer 31 is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms, ensuring that the thickness of the light-transmitting protective layer 31 is within a suitable range, not only reducing the risk of the light-transmitting protective layer 31 being easily damaged due to its too thin thickness, but also improving the problem of light crosstalk that is likely to occur when the thickness of the light-transmitting protective layer 31 is too thick and the light emitted by the light-emitting device 113.

[0061] In some embodiments, the thickness of the light-transmitting protective layer 31 can be greater than or equal to 1200 angstroms and less than or equal to 2500 angstroms, or greater than or equal to 1500 angstroms and less than or equal to 2000 angstroms.

[0062] In some embodiments, the light-transmitting protective layer 31 can include one or more inorganic dielectric layers, ensuring that the light-transmitting protective layer 31 plays a good protective role for the light-emitting device layer 112. The materials of the inorganic dielectric layers include but are not limited to at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0063] In some embodiments, the light-transmitting protective layer 31 includes a first inorganic dielectric layer and a second inorganic dielectric layer. The first inorganic dielectric layer is located between the second inorganic dielectric layer and the light-emitting device layer. The refractive index of the first inorganic dielectric layer is greater than that of the second inorganic dielectric layer and less than that of the second transparent conductive layer 132. In this way, the amount of light emitted by the light-emitting device 113 incident into the light-transmitting protective layer 31 from the second transparent conductive layer 132 is increased. Exemplarily, the first inorganic dielectric layer can be silicon nitride, and the second inorganic dielectric layer can be silicon oxide.

[0064] In some embodiments, the thickness of the first inorganic dielectric layer can be less than that of the second inorganic dielectric layer to ensure that the second inorganic dielectric layer has a relatively thick thickness and plays a better protective role in the process of forming the first light-transmitting opening 211.

[0065] In some embodiments, the top surface of the light-transmitting protective layer 31 can be provided with microstructures (not shown in the figure), and the top surface of the light-transmitting protective layer 31 is the surface of the light-transmitting protective layer 31 away from the substrate 111. The microstructures overlap with the first light-transmitting opening 211. The microstructures play a converging role on the light in the light-transmitting protective layer 31, ensuring that the light in the light-transmitting protective layer 31 is converged and then incident into the first light-transmitting opening 211, and increasing the amount of light emitted from the first light-transmitting opening 211.

[0066] In some embodiments, the shape of the microstructures includes but is not limited to at least one of triangular pyramids and hemispherical shapes. In some other embodiments, the microstructures can be obtained by roughening the top surface of the light-transmitting protective layer 31.

[0067] In some embodiments, the size D1 of the bottom of the first light-transmitting opening 211 is greater than the size D2 of the N electrode 114 of the light-emitting device 113, which is conducive to the light emitted by the light-emitting device 113 entering the first light-transmitting opening 211 overlapping with the light-emitting device 113, and improves the utilization rate of the light emitted by the light-emitting device 113. Among them, the bottom of the first light-transmitting opening 211 is located at one end of the first light-transmitting opening 211 close to the light-emitting device 113. In an exemplary embodiment, the size of the bottom of the first light-transmitting opening 211 in the direction parallel to the substrate 111 is greater than the size of the N electrode 114 of the light-emitting device 113 in the direction parallel to the substrate 111.

[0068] In some embodiments, the size D3 of the top of the first light-transmitting opening 211 may be greater than or equal to the size D1 of the bottom of the first light-transmitting opening 211, ensuring that the light reflected by the side wall of the first reflective layer is easily emitted from the first light-transmitting opening 211, and improving the display brightness of the display panel 100. For example, the size of the top of the first light-transmitting opening 211 in the direction parallel to the substrate 111 is greater than the size of the bottom of the first light-transmitting opening 211 in the direction parallel to the substrate 111.

[0069] In some embodiments, the size D3 of the top of the first light-transmitting opening 211 and the size D1 of the bottom of the first light-transmitting opening 211 may be less than or equal to 5 micrometers, so that the light-emitting area defined by the first light-transmitting opening 211 is small, thereby improving the resolution of the display panel.

[0070] In some embodiments, the orthographic projection of each light-emitting device 113 on the substrate 111 may be located within the orthographic projection of the first light-transmitting opening 211 overlapping with the light-emitting device 113 on the substrate 111, which is conducive to the light emitted by the light-emitting device 113 entering the first light-transmitting opening 211 overlapping with the light-emitting device 113, and improves the utilization rate of the light emitted by the light-emitting device 113.

[0071] In some embodiments, the plurality of first light-transmitting openings 211 may be obtained by etching the first reflective layer.

[0072] In some embodiments, the shape of the longitudinal section of the first light-transmitting opening 211 includes but is not limited to a rectangle, and the shape of the cross section of the first light-transmitting opening 211 includes but is not limited to a rectangle. Among them, the longitudinal section of the first light-transmitting opening 211 may be perpendicular to the substrate 111. The cross section of the first light-transmitting opening 211 may be parallel to the substrate 111.

[0073] In some embodiments, as Figure 1 shown, the first reflective layer 21 further includes a plurality of interconnected light-reflecting dams 212. Each light-reflecting dam 212 is disposed around a first light-transmitting opening 211.

[0074] In some embodiments, the first reflective layer 21 includes a metal, ensuring that the first reflective layer 21 has a good reflection effect on the light emitted by the light-emitting device 113 and incident into the first light-transmitting opening 211. More light is emitted from the display panel 100, improving the display brightness of the display panel 100.

[0075] In some embodiments, the metal includes at least one of, but is not limited to, aluminum and silver. Exemplarily, the metal includes aluminum.

[0076] In some embodiments, the ratio of the thickness of the first reflective layer 21 to the thickness of the light-transmitting protective layer 31 is greater than or equal to 5 and less than or equal to 50. Thus, to ensure that the thickness of the first reflective layer 21 is within a suitable range, improving the problem that the light in the first light-transmitting opening 211 may not be effectively processed due to the too thin thickness of the first reflective layer 21. For example, when a color conversion unit or a light-transmitting scattering unit is provided in the first light-transmitting opening 211, the thickness of the first reflective layer 21 is less than 5 micrometers, which can improve the problem that the quantum efficiency of the color conversion unit is low due to the too thin thickness of the color conversion unit. At the same time, when the thickness of the first reflective layer 21 is within a suitable range, it also improves the problem that the formation of the first light-transmitting opening 211 is difficult due to the too thick thickness of the first reflective layer 21.

[0077] In some embodiments, the ratio of the thickness of the first reflective layer 21 to the thickness of the light-transmitting protective layer 31 is greater than or equal to 10 and less than or equal to 45.

[0078] In some embodiments, the thickness of the first reflective layer 21 is greater than or equal to 1 micrometer and less than or equal to 5 micrometers, to ensure that the thickness of the first reflective layer 21 is within a suitable range, improving the problem that the light in the first light-transmitting opening 211 may not be effectively processed due to the too thin thickness of the first reflective layer 21, and also improving the problem that the formation of the first light-transmitting opening 211 is difficult due to the too thick thickness of the first reflective layer 21.

[0079] In some embodiments, the thickness of the first reflective layer 21 can be greater than or equal to 1.5 micrometers and less than or equal to 4 micrometers.

[0080] In some embodiments, as Figure 1 shown, the display panel 100 further includes a filling structure 32. The filling structure 32 is filled between adjacent light-emitting devices 113 to improve the flatness of the light-emitting device layer 112. The material of the filling structure 32 is the same as that of the light-transmitting protective layer 31, so that the filling structure 32 and the light-transmitting protective layer 31 can be formed in one film-forming process, simplifying the manufacturing process of the display panel 100.

[0081] In some embodiments, as Figure 1As shown, the display panel 100 further includes a dielectric layer 41. The dielectric layer 41 covers at least a plurality of sidewalls of the first reflective layer 21. The plurality of sidewalls respectively define a plurality of first light-transmitting openings 211. The dielectric layer 41 protects the plurality of sidewalls of the first reflective layer 21 and reduces the risk of damage to the first reflective layer.

[0082] In some embodiments, the dielectric layer 41 further covers the top surface of the first reflective layer 21 facing away from the light-emitting substrate 11, so that the dielectric layer 41 also protects the top surface of the first reflective layer 21.

[0083] In some embodiments, the dielectric layer 41 is also located at the bottom of the first light-transmitting opening 211, and the dielectric layer 41 at the bottom of the first light-transmitting opening 211 is not removed, thereby reducing the difficulty of forming the dielectric layer 41.

[0084] In some embodiments, the thickness of the dielectric layer 41 is less than the thickness of the light-transmitting protective layer 31, which improves the problem that the size of the remaining first light-transmitting openings 211 is small due to the excessive thickness of the dielectric layer 41, and further improves the problem that the light located in the first light-transmitting openings 211 may not be effectively processed due to the small size of the remaining first light-transmitting openings 211. For example, when a color conversion unit or a light-transmitting scattering unit 53 is disposed in the first light-transmitting opening 211, the thickness of the dielectric layer 41 is less than the thickness of the light-transmitting protective layer 31, which is beneficial to ensuring that the size of the color conversion unit located in the first light-transmitting opening 211 is large and improving the quantum efficiency of the color conversion unit.

[0085] In some embodiments, the thickness of the dielectric layer 41 is less than or equal to 1000 angstroms to improve the problem that the size of the remaining first light-transmitting openings 211 is small due to the excessive thickness of the dielectric layer 41.

[0086] In some embodiments, the thickness of the dielectric layer 41 is greater than or equal to 500 angstroms to ensure that the dielectric layer 41 provides good protection for the sidewalls of the reflective layer.

[0087] In some embodiments, the thickness of the dielectric layer 41 is greater than or equal to 600 angstroms and less than or equal to 800 angstroms.

[0088] In some embodiments, when the dielectric layer 41 is also located at the bottom of the first light-transmitting opening 211, the dielectric layer 41 is in contact with the light-transmitting protective layer 31. The material of the dielectric layer 41 is the same as that of the light-transmitting protective layer 31, and the refractive indices of the dielectric layer 41 and the light-transmitting protective layer 31 tend to be the same, reducing the loss of light incident from the light-transmitting protective layer 31 to the dielectric layer 41. More light is incident on the first light-transmitting opening 211 and exits from the first light-transmitting opening 211, improving the display brightness of the display panel.

[0089] In some embodiments, the dielectric layer 41 includes an inorganic insulating material, and the inorganic insulating material includes at least one of, but is not limited to, silicon oxide, silicon nitride, and silicon oxynitride.

[0090] In some embodiments, as Figure 1 shown, the display panel 100 further includes a first color conversion unit 51, a second color conversion unit 52, and a light-transmitting and scattering unit 53.

[0091] The first color conversion unit 51 is located in at least one first light-transmitting opening 211 and is configured to convert the first color light emitted by at least one light-emitting device 113 into second color light. The color of the first color light is different from the color of the second color light.

[0092] The second color conversion unit 52 is located in at least one first light-transmitting opening 211 and is configured to convert the first color light emitted by at least one light-emitting device 113 into third color light. The color of the third color light is different from the color of the second color light and the color of the first color light.

[0093] The light-transmitting and scattering unit 53 is located in at least one first light-transmitting opening 211. The light-transmitting and scattering unit 53 scatters the light emitted by the light-emitting device 113 to improve the brightness uniformity of the light emitted by the light-emitting device 113.

[0094] Since the first reflective layer 21 has a reflective effect, when the first color conversion unit 51, a second color conversion unit 52, and a light-transmitting and scattering unit 53 are located in a plurality of first light-transmitting openings 211, the light-reflecting dams 212 of the first reflective layer 21 also play a role in isolating the first color light, the second color light, and the third color light, reducing the risk of mutual crosstalk between different color lights, and improving the display effect of the display panel 100.

[0095] In some embodiments, an adjacent first color conversion unit 51, a second color conversion unit 52, and a light-transmitting and scattering unit 53 may form a filling group. A plurality of filling groups are arranged in an array. The first color conversion unit 51, a second color conversion unit 52, and a light-transmitting and scattering unit 53 in each filling group are respectively filled in three adjacent first light-transmitting openings 211. Moreover, the plurality of first light-transmitting openings 211 respectively pattern the first color conversion unit 51, the second color conversion unit 52, and the light-transmitting and scattering unit 53, which is beneficial to miniaturize the first color conversion unit 51, a second color conversion unit 52, and a light-transmitting and scattering unit 53, especially when the first color conversion unit 51 and the second color conversion unit 52 include quantum dots, thereby improving the resolution of the display panel 100.

[0096] In some embodiments, the first color light may be blue light, and the second color light and the third color light may be red light and green light respectively, but are not limited thereto.

[0097] In some embodiments, any one of the first color conversion unit 51 and the second color conversion unit 52 may include a light-transmissive matrix material and a light conversion material.

[0098] In some embodiments, the light conversion material may include any one of quantum dot materials and fluorescent materials.

[0099] Exemplarily, the first color conversion unit 51 includes a first light-transmissive matrix material and red quantum dots. The second color conversion unit 52 includes a second light-transmissive matrix material and green quantum dots.

[0100] In some embodiments, the light-transmissive scattering unit 53 may include a light-transmissive matrix material and scattering particles, and the scattering particles are dispersed in the light-transmissive matrix material.

[0101] In some embodiments, the scattering particles may include any one of inorganic scattering particles and organic scattering particles. The inorganic scattering particles may include at least one of, but not limited to, silica, titanium oxide, and aluminum oxide. The organic scattering particles may include at least one of, but not limited to, polyimide, polypropylene, polyethylene, and polystyrene.

[0102] In some embodiments, the particle size of the scattering particles may be less than or equal to 200 nanometers to ensure that the scattering particles have a good scattering effect on the light emitted by the light-emitting device 113.

[0103] In some embodiments, the particle size of the scattering particles may be greater than or equal to 20 nanometers to ensure that the scattering particles are uniformly dispersed in the matrix material of the light-transmissive scattering unit 53 and maintain the brightness uniformity of the light emitted from the light-transmissive scattering unit 53.

[0104] In some embodiments, the light-transmissive matrix materials of the first color conversion unit 51, the second color conversion unit 52, and the light-transmissive scattering unit 53 may include, but not limited to, organic materials such as polyimide.

[0105] In some embodiments, as Figure 1 shown, the display panel 100 further includes a second reflective layer 61. The second reflective layer 61 is located on a side of the first reflective layer 21 away from the light-transmissive protective layer 31 and covers the first color conversion unit 51 and the second color conversion unit 52. The second reflective layer 61 includes a second light-transmissive opening 611, and the second light-transmissive opening 611 overlaps with the light-transmissive scattering unit 53. The second reflective layer 61 is configured to reflect the first color light and transmit the second color light and the third color light.

[0106] For the first-color light emitted from the first color conversion unit 51 and the second color conversion unit 52, the second reflective layer 61 can reflect this first-color light, effectively improving the problem of the first-color light leaking from the pixel regions corresponding to the first color conversion unit 51 and the second color conversion unit 52, and further improving the problem that the leakage of the first-color light affects the display effect. Moreover, the second reflective layer 61 reflects this first-color light into the first color conversion unit 51 and the second color conversion unit 52, and the first-color light can re-excite the light conversion materials in the first color conversion unit 51 and the second color conversion unit 52, improving the efficiency of the first-color light exciting the light conversion materials. In addition, the first-color light scattered by the light-transmitting and scattering unit 53 can be emitted from the second light-transmitting opening 611. Therefore, the setting of the second reflective layer 61 can effectively improve the brightness and color gamut of the display.

[0107] In some embodiments, the second reflective layer 61 may include a Bragg reflective layer. The Bragg reflective layer includes alternately arranged high-refractive-index dielectric layers and low-refractive-index dielectric layers. The high-refractive-index dielectric layer may include at least one of, but is not limited to, gallium nitride (GaN), gallium arsenide (GaAs), and titanium dioxide (TiO2). The low-refractive-index dielectric layer may include at least one of, but is not limited to, silicon dioxide (SiO2), silicon nitride (Si3N4), and aluminum oxide (Al2O3).

[0108] In some embodiments, the dimension D4 of the light-transmitting and scattering unit 53 in the direction parallel to the substrate 111 is less than or equal to the dimension D5 of the second light-transmitting opening 611 in the direction parallel to the substrate 111, so as to ensure that the first-color light scattered by the light-transmitting and scattering unit 53 can be emitted from the second light-transmitting opening 611, increasing the light output of the first-color light, and further increasing the display brightness of the display panel 100.

[0109] In some embodiments, the orthographic projection of the light-transmitting and scattering unit 53 on the substrate 111 is located inside the orthographic projection of the second light-transmitting opening 611 on the substrate 111, so as to ensure that the first-color light scattered by the light-transmitting and scattering unit 53 can be emitted from the second light-transmitting opening 611, increasing the light output of the first-color light, and further increasing the display brightness of the display panel 100.

[0110] In some embodiments, the display panel 100 further includes a filling unit (not shown in the figure). The filling unit is located in the second light-transmitting opening 611 to improve the flatness of the display panel 100.

[0111] In some embodiments, the material of the filling unit may be the same as the light-transmitting matrix material of the light-transmitting and scattering unit 53. Therefore, the transmittance of the first-color light scattered by the light-transmitting and scattering unit 53 passing through the filling unit is greater, and further the display brightness of the display panel 100 is increased.

[0112] See Figure 3, which is a schematic flow chart of a method for manufacturing a display panel provided by some embodiments of the present application. The method for manufacturing the display panel includes the following steps:

[0113] S101: Form a light-emitting substrate, the light-emitting substrate includes a substrate and a light-emitting device layer, the light-emitting device layer is located on the substrate and includes a plurality of light-emitting devices;

[0114] S102: Form a light-transmitting protective layer on the surface of the light-emitting device layer facing away from the substrate;

[0115] S103: Form a first reflective layer on the surface of the light-transmitting protective layer facing away from the light-emitting substrate, and remove a part of the first reflective layer to form a plurality of spaced-apart first light-transmitting openings, and the plurality of first light-transmitting openings respectively overlap with the plurality of light-emitting devices.

[0116] In the method for manufacturing a display panel according to some embodiments of the present application, during the process of forming the plurality of first light-transmitting openings of the first reflective layer, the light-transmitting protective layer plays a protective role on the light-emitting device layer to reduce the risk of damage to the light-emitting device layer, thereby extending the service life of the display panel. And, after the light emitted by the light-emitting device enters the first light-transmitting opening, it will be reflected by the reflective layer, improving the utilization rate of the light emitted by the light-emitting device, and further improving the display brightness of the display panel.

[0117] The following details the process of the method for manufacturing the display panel 100 in conjunction with specific embodiments.

[0118] Refer to Figures 4 to 5 As shown, perform the above step S101.

[0119] As Figure 4 As shown, form a light-emitting substrate 11, including: providing a substrate 111, and forming a first bonding metal layer 141 on the substrate 111, and a driving circuit is provided on the substrate 111.

[0120] In some embodiments, the substrate 111 may include a semiconductor substrate such as a silicon substrate, and a driving circuit is provided on the semiconductor substrate.

[0121] In some embodiments, the first bonding metal layer 141 may include at least one of copper, aluminum, molybdenum, gold, nickel, and titanium.

[0122] As Figure 4 As shown, forming the light-emitting substrate 11 further includes: providing a temporary carrier substrate 71, and forming a light-emitting epitaxial stack 112A on the temporary carrier substrate 71, and the light-emitting epitaxial stack 112A includes an N electrode layer 114A layer, a light-emitting layer 116A, and a P electrode layer 115A that are sequentially stacked on the temporary carrier substrate 71.

[0123] In some embodiments, the temporary carrier substrate 71 may include a semiconductor substrate such as a sapphire substrate.

[0124] As shown in Figure 4 , a light-emitting substrate 11 is formed, further comprising: forming a first transparent conductive layer 131 and a second bonding metal layer 142 in sequence on a side of the light-emitting epitaxial stack 112A facing away from the temporary carrier substrate 71. The first transparent conductive layer 131 can play a role in expanding the surface current of the P electrode 115, improving the brightness uniformity of the light emitted by the light-emitting substrate 11.

[0125] In some embodiments, the second bonding metal layer 142 may include at least one of copper, aluminum, molybdenum, gold, nickel, and titanium.

[0126] As shown in Figure 5 , a light-emitting substrate 11 is formed, further comprising: bonding the first bonding metal layer 141 and the second bonding metal layer 142, and removing the temporary carrier substrate 71;

[0127] Patterning the first bonding metal layer 141, the second bonding metal layer 142, the first transparent conductive layer 131, and the light-emitting epitaxial stack 112A on the substrate 111 to obtain a plurality of light-emitting devices 113 arranged in an array, and each light-emitting device 113 includes the first transparent conductive layer 131 and an inorganic light-emitting diode.

[0128] In some embodiments of the present application, the connection between the driving circuit and the light-emitting epitaxial stack 112A is realized by using the bonding between the first bonding metal layer 141 and the second bonding metal layer 142. Then, the light-emitting epitaxial stack 112A and the bonding layer, etc. are patterned to form a plurality of independent light-emitting devices 113.

[0129] As shown in Figure 5 , a light-emitting substrate 11 is formed, further comprising:

[0130] Forming an isolation layer 15 in the gap between adjacent light-emitting bodies; and

[0131] Forming a second transparent electric layer covering a plurality of inorganic light-emitting diodes.

[0132] In some embodiments of the present application, the second transparent electric layer plays a role in expanding the surface current of the N electrode 114, improving the brightness uniformity of the light emitted by the light-emitting substrate 11.

[0133] Refer to Figure 6 to perform the above step S102.

[0134] As shown in Figure 6 , a filling structure 32 is formed between adjacent light-emitting devices 113, and a light-transmitting protective layer 31 is formed on a surface of the light-emitting device layer 112 facing away from the substrate 111.

[0135] Specifically, an initial light-transmitting dielectric layer is formed to fill the gaps between adjacent light-emitting devices 113 and cover the light-emitting device layer 112. The initial light-transmitting dielectric layer is planarized, and the remaining initial light-transmitting dielectric layer constitutes the filling structure 32 and the light-transmitting protective layer 31.

[0136] In some embodiments, the initial light-transmitting dielectric layer includes an inorganic insulating material. The inorganic insulating material may include at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0137] As Figure 6 shown, the above step S103 is executed.

[0138] In some embodiments, forming a first reflective layer 21 on the surface of the light-transmitting protective layer 31 facing away from the light-emitting substrate 11 includes:

[0139] forming a metal film on the surface of the light-transmitting protective layer 31;

[0140] patterning the metal film to form a plurality of first light-transmitting openings 211, and the remaining metal film constitutes a plurality of light-reflecting dams 212 of the first reflective layer 21.

[0141] In some embodiments, the method of patterning the metal film may include a yellow light process and an etching process. The etching process includes, but is not limited to, wet etching.

[0142] In some embodiments, as Figure 6 shown, after step S103, the manufacturing method of the display panel 100 further includes: forming a dielectric layer 41, and the dielectric layer 41 covers the sidewalls of the plurality of first reflective layers 21, and the sidewalls respectively define a plurality of first light-transmitting openings 211.

[0143] In some embodiments, the dielectric layer 41 also covers the top surface of the first reflective layer 21 facing away from the light-emitting substrate 11 and is located at the bottom of the first light-transmitting openings 211, so that the dielectric layer 41 also protects the top surface of the first reflective layer 21, and avoids removing the dielectric layer 41 at the bottom of the first light-transmitting openings 211, thereby reducing the formation difficulty of the dielectric layer 41.

[0144] In some embodiments, as Figures 7 to 8As shown, after forming the dielectric layer 41, the manufacturing method of the display panel 100 also includes: forming a first color conversion unit 51, a second color conversion unit 52 and a light-transmitting scattering unit 53; the first color conversion unit 51 is located in at least one first light-transmitting opening 211, and is configured to convert the first color light emitted by at least one light-emitting device 113 into a second color light, and the color of the first color light is different from the color of the second color light; the second color conversion unit 52 is located in at least one first light-transmitting opening 211, and is configured to convert the first color light emitted by at least one light-emitting device 113 into a third color light, and the color of the third color light is different from the color of the second color light and the color of the first color light; the light-transmitting scattering unit 53 is located in at least one first light-transmitting opening 211.

[0145] The first color conversion unit 51 may be formed by forming the first color conversion unit 51 in each of the plurality of first light-transmitting openings 211 , removing a portion of the first color conversion unit 51 by developing or the like, and retaining a portion of the first color conversion unit 51 .

[0146] The second color conversion unit 52 may be formed by forming the second color conversion unit 52 in all other first light-transmitting openings 211 except the first light-transmitting opening 211 filled with the first color conversion unit 51, removing part of the second color conversion unit 52 by developing or the like, and retaining part of the second color conversion unit 52.

[0147] The light-transmitting scattering unit 53 may be formed by forming the light-transmitting scattering unit 53 in all the first light-transmitting openings 211 other than the first light-transmitting opening 211 filled with the first color conversion unit 51 and the second color conversion unit 52 .

[0148] In some embodiments, Figure 1 As shown, after forming the first color conversion unit 51, the second color conversion unit 52 and the light-transmitting scattering unit 53, the method for manufacturing the display panel 100 further includes:

[0149] A second reflective layer 61 is formed. The second reflective layer 61 is located on a side of the first reflective layer 21 away from the light-transmitting protective layer 31, covers the first color conversion unit 51 and the second color conversion unit 52, and includes a second light-transmitting opening 611. The second light-transmitting opening 611 overlaps with the light-transmitting scattering unit 53. The second reflective layer 61 is configured to reflect the first color light and transmit the second color light and the third color light.

[0150] The description of the above embodiments is only used to help understand the technical solutions and their core ideas of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: A light-emitting substrate, comprising a substrate and a light-emitting device layer, wherein the light-emitting device layer is located on the substrate and comprises a plurality of light-emitting devices; A first reflective layer, located on a side of the light-emitting device layer away from the substrate, and comprising a plurality of first light-transmitting openings penetrating the first reflective layer, wherein the plurality of first light-transmitting openings respectively overlap with the plurality of light-emitting devices; as well as The light-transmitting protective layer is located between the light-emitting device layer and the first reflective layer.

2. The display panel according to claim 1, characterized in that: The thickness of the light-transmitting protective layer is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms.

3. The display panel according to claim 1, characterized in that: Also includes: A filling structure is filled between adjacent light-emitting devices; wherein the material of the filling structure is the same as the material of the light-transmitting protective layer.

4. The display panel according to claim 1, characterized in that: Also includes: The dielectric layer at least covers a plurality of side walls of the first reflective layer, and the plurality of side walls respectively define a plurality of the first light-transmitting openings.

5. The display panel according to claim 4, characterized in that: The thickness of the dielectric layer is smaller than the thickness of the light-transmitting protective layer; and / or the material of the dielectric layer is the same as that of the light-transmitting protective layer.

6. The display panel according to claim 1, characterized in that: The light-emitting device includes an inorganic light-emitting diode and a first transparent conductive layer, wherein the first transparent conductive layer is located between the inorganic light-emitting diode and the substrate. The multiple light-emitting devices also include a common second transparent conductive layer, which is located on a side of the inorganic light-emitting diode away from the substrate and between adjacent light-emitting devices. The thickness of the second transparent conductive layer is greater than the thickness of the first transparent conductive layer.

7. The display panel according to claim 1, characterized in that: The first reflective layer includes metal, and a ratio of a thickness of the first reflective layer to a thickness of the light-transmitting protective layer is greater than or equal to 5 and less than or equal to 50.

8. The display panel according to any one of claims 1 to 7, characterized in that: Also includes: A first color conversion unit is located in at least one of the first light-transmitting openings and is configured to convert a first color light emitted by at least one of the light-emitting devices into a second color light, wherein the color of the first color light is different from the color of the second color light; A second color conversion unit is located in at least one of the first light-transmitting openings and is configured to convert the first color light emitted by at least one of the light-emitting devices into a third color light, the color of the third color light being different from the color of the second color light and the color of the first color light; as well as The light-transmitting scattering unit is located in at least one of the first light-transmitting openings.

9. The display panel according to claim 8, characterized in that: Also includes: The second reflective layer is located on the side of the first reflective layer away from the light-transmitting protective layer, covers the first color conversion unit and the second color conversion unit, and includes a second light-transmitting opening, and the second light-transmitting opening overlaps the light-transmitting scattering unit; the second reflective layer is configured to reflect the first color light and transmit the second color light and the third color light.

10. A method for manufacturing a display panel, characterized in that: include: forming a light-emitting substrate, the light-emitting substrate comprising a substrate and a light-emitting device layer, the light-emitting device layer being located on the substrate and comprising a plurality of light-emitting devices; forming a light-transmitting protective layer on a surface of the light-emitting device layer facing away from the substrate; A first reflective layer is formed on the surface of the light-transmitting protective layer away from the light-emitting substrate, and a portion of the first reflective layer is removed to form a plurality of first light-transmitting openings spaced apart from each other. The plurality of first light-transmitting openings overlap with the plurality of light-emitting devices respectively.

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