Heat exchanger for liquid coolant

Abstract

A heat exchanger for transferring heat from a spaced apart first coolant liquid to a spaced apart second coolant liquid includes: a first set of ports for receiving and outputting the first coolant liquid; a second set of ports for receiving and outputting a second coolant liquid; a third set of ports for receiving and outputting a second coolant liquid, the second set of ports and the third set of ports communicating within the heat exchanger to allow the second coolant liquid to flow between the second set of ports and the third set of ports; a thermal interface to transfer heat between a first coolant liquid received at the first set of ports and a second coolant liquid received at the second set of ports and / or the third set of ports; and a flow restrictor configured to adjustably or selectively restrict flow of the second coolant liquid to and / or out of the thermal interface without restricting flow of the second coolant liquid between the second set of ports and the third set of ports.

Description

Technical Field

[0001] The present invention relates to a heat exchanger, a module for cooling an electronic component including such a heat exchanger, and a method for configuring a heat exchanger. Background Art

[0002] Inside a computer, a server, or other devices for data processing (referred to as IT or information technology), there are many electronic devices called integrated circuits (ICs). The electronic devices inside an integrated circuit can include a central processing unit (CPU), an application specific integrated circuit (ASIC), a graphics processing unit (GPU), a random access memory (RAM), and the like. Each of these devices generates heat during use. In order to keep the devices at an optimal temperature for proper operation, the heat should be transferred away from the devices. With the increase in IT processing power, and thus the growth in the number of electronic devices in a computer, a server, or other IT, the challenge of adequately removing the heat generated by the electronic devices has also increased.

[0003] Electronic devices are usually mounted on a printed circuit board (PCB) and are generally housed or encapsulated in a housing, a casing, or a chassis to form an electronic module. A computer server system typically includes a plurality of electronic modules that are mounted in a rack and connected together to provide the required IT facilities. A method for removing heat from each housing or chassis is needed to keep the electronic devices inside the chassis at an appropriate temperature.

[0004] Electronic modules are usually cooled by passing air over or through each housing or chassis. The air flow may be sufficient to remove some of the heat inside the enclosure to the surrounding environment. Until recently, this cooling method has been almost exclusively used for mass-produced IT and server equipment. However, it has been found that for the same computing performance, as the technology size decreases, even when the occupied area decreases, the heat generated by the electronic devices increases. Therefore, the peak performance of IT systems is limited and constrained by the use of air-cooling systems to cool electronic modules.

[0005] Therefore, more complex systems and methods for cooling electronic modules have been proposed. In some cases, liquid cooling has been used, where a liquid coolant flows over or to a radiator coupled to the electronic device. Then, the heat can be transferred from the electronic device to an area or component capable of removing the heat from the liquid coolant. In some cases, liquid cooling can more effectively transfer the heat away from the electronic device or electronic component and thus provide a greater cooling power than an air-cooling system. However, the liquid cooling systems of the prior art typically use custom systems, and their installation may be complex and expensive. In addition, it is always desirable to improve the cooling performance.

[0006] International Patent Application Publication WO-2022 / 106582 (commonly assigned with the present disclosure) discusses a method in which, for example, liquid immersion cooling based on a dielectric coolant can be combined with a cold plate supplied by a second liquid coolant such as a water-based coolant. Heat can be transferred from the dielectric coolant to the second liquid coolant in a heat exchanger, which is advantageously located in the same chassis as the immersion coolant and the electronic devices being cooled. The second liquid coolant is typically provided from outside the chassis, for example, from a building or a water supply facility.

[0007] To assist this method, a heat exchanger, such as a plate heat exchanger, is also disclosed, which includes six ports. These ports are a combination of inlet ports and outlet ports. The heat exchanger can include a first chamber and a second chamber, with a first liquid coolant flowing through the first chamber and a second liquid coolant flowing through the second chamber, where the first chamber and the second chamber are separated by a thermally conductive interface. Depending on the temperature gradient across the thermally conductive interface, heat can be transferred across the thermally conductive interface from the first liquid coolant to the second liquid coolant, or from the second liquid coolant to the first liquid coolant. The six ports can be arranged on each of the first chamber and the second chamber, where each of the first chamber and the second chamber has at least one inlet port and at least one outlet port.

[0008] A beneficial implementation of the heat exchanger provides a second chamber that includes at least two paths for the second liquid coolant to flow through. A path can be considered a route or passage through the chamber with a specific starting point (input) and ending point (output). Different paths have different combinations of starting points (inputs) and ending points (outputs), although some of the individual inputs and outputs may be shared or common to different paths. Each chamber of the heat exchanger is considered an area that is fluidly connected within the chamber but fluidly separated from any other chamber. Different paths through a chamber are fluidly connected, although a particular pair of paths through the same chamber may not have to connect or cross at any point (but are connected via another path within the same chamber).

[0009] For example, the second chamber can include two paths for the second liquid coolant to pass through: a first path from a first inlet port to a first outlet port; and a second path from the first inlet port to a second outlet port. A third path from a second inlet port to the second outlet port can also be provided. In other words, the second liquid coolant can flow into the heat exchanger through the thermally conductive interface and then out of the heat exchanger, or it can flow into and out of the heat exchanger without flowing through the thermally conductive interface.

[0010] In this regard, referring to FIG. 1, which shows a top view of an exemplary module (server) of a heat exchanger including six ports, similar to FIG. 20A of WO-2022 / 106582. Referring to FIG. 2, an isometric view of the module of FIG. 1 is also shown. The module includes: a chassis 2; a heat exchanger 1; a cold plate 3; a pump 9; a piping system 8; and a dielectric (main) coolant radiator 21. Specifically, two cold plates 3 and two radiators 21 are shown in this example. The heat exchanger 1 includes three pairs of ports: a dielectric coolant input port 30; a dielectric coolant output port 31; a first auxiliary coolant input port 7; a first auxiliary coolant output port 9; a second auxiliary coolant output port 5; and a second auxiliary coolant input (return) port 12. The first auxiliary coolant input port 7 is also shown as having an external connector 10. The heat exchanger 1 is a plate heat exchanger having a heat transfer interface in the form of plates 4.

[0011] In an advantageous operating mode, the dielectric coolant is received at the pump 9 and flows into the heat exchanger 1 via the dielectric coolant input port 30. The dielectric coolant is cooled by the plates 4 and flows out from the dielectric coolant output port 31 to the dielectric coolant radiator 21. The dielectric coolant radiator 21 operates as described in International Patent Application Publication WO-2019 / 048864. The dielectric coolant overflowing from the dielectric coolant radiator 21 cools other heat-generating components and accumulates in the chassis before being pumped back to the heat exchanger 1. This creates a dielectric coolant loop.

[0012] The auxiliary coolant is received by the heat exchanger 1 via the first auxiliary coolant input port 7. Some of the auxiliary coolant in this auxiliary coolant passes through the plates 4 (thereby cooling the dielectric coolant) and then flows out of the heat exchanger 1 via the first auxiliary coolant output port 9. Some of the auxiliary coolant in the auxiliary coolant flows through the heat exchanger to the second auxiliary coolant output port 5, flows from the second auxiliary coolant output port 5 to the cold plate 3 via the piping system 8. The return flow from the cold plate 3 enters the heat exchanger 1 through the second auxiliary coolant input port 12 and then flows out of the heat exchanger 1 via the auxiliary coolant output port 9. The auxiliary coolant flowing out of the auxiliary coolant output port 9 can be directed to an external heat exchanger (not shown), where the coolant can be cooled and then returned to the heat exchanger 1 through the first auxiliary coolant input port 7. This flow of the auxiliary coolant can be described as an auxiliary coolant loop.

[0013] Thus, this operating mode provides the ability to bring the cooling facility coolant directly into the chassis 2 to cool one or more cold plates 3 without the coolant flowing through the plates 4, resulting in heat transfer from the dielectric side of the heat exchanger and thus not having to heat the coolant.

[0014] This is an efficient and effective cooling method. Improving this cooling method to address more types of applications and implementation methods remains a challenge. Summary of the Invention

[0015] In this context, a heat exchanger defined by claim 1 is provided. A module for cooling an electronic component is also provided according to claim 9. In addition, a method of configuring a heat exchanger for transferring heat from a first coolant liquid to a second coolant liquid is provided according to claim 13. Other claims define advantageous and / or more detailed features.

[0016] In one aspect, a heat exchanger (or a method of configuring such a heat exchanger) having at least six ports can be considered. A first pair of ports is provided for a main fluid (usually but not necessarily a liquid coolant), and second and third pairs of ports are provided for an auxiliary fluid (usually also a liquid coolant). The heat exchanger has a thermal interface for transferring heat between the main fluid and the auxiliary fluid, and at least some of the coolant flows between the second and / or third pairs of ports and the thermal interface, the thermal interface being in the form of, for example, a heat transfer plate. Additionally, the heat exchanger can allow some of the auxiliary fluid to pass between the second and third pairs of ports without flowing through the thermal interface. Then, without restricting the flow of the auxiliary fluid between the second and third pairs of ports, the flow of the auxiliary fluid to and / or from the thermal interface is restricted. Advantageously, the flow restriction is selective (since it can be opened or closed) and / or adjustable (since the degree of restriction can be configured within a continuous range or from a set of discrete options).

[0017] The flow restriction can be achieved by a component configured to be located within one of the ports for the auxiliary fluid. The component can include an aperture arrangement for restricting the flow of the auxiliary fluid to and / or from the thermal interface. The aperture arrangement can be formed by one or more holes, slots, and / or grids. In one implementation, the component can have two parts: an inner part having a first aperture arrangement; and an outer part having a second aperture arrangement. Thus, the relative alignment of the two aperture arrangements sets the fluid flow through the component. The component can be replaceable, but alternatively, the component can be integrated into the heat exchanger. Optionally, the flow restriction can also filter the auxiliary fluid, for example, filter particles larger than a certain size.

[0018] The heat exchanger can form part of a module, such as a blade server or the like, in which electronic components are housed and cooled. The module typically has a chassis, inside which the electronic components are located. In this case, the main fluid is a liquid, typically a dielectric coolant, and the module can be operated to keep the main fluid in the liquid phase. One, some, or all of the electronic components can be at least partially immersed in the dielectric coolant for their cooling. The auxiliary fluid is also typically a liquid, such as a water-based liquid, and the module can similarly be operated to keep the auxiliary fluid in the liquid phase. The auxiliary fluid can be supplied to one or more cold plates, each of which is configured to cool one or more of the electronic components (e.g., the electronic components mounted on the cold plate). The auxiliary fluid can pass through the heat exchanger to a cold plate (or cold plates) and also through a thermal interface in the heat exchanger to allow heat transfer between the main fluid and the auxiliary fluid.

[0019] Setting the heat exchanger inside the chassis is advantageous for the cooling efficiency and portability of the module. Advantageously, a pump for the main fluid is also provided inside the chassis. The form of the heat exchanger can allow connection to a second pair of ports outside the chassis, where a first pair of ports and a third pair of ports are connected to the heat exchanger from inside the chassis.

[0020] In use, the flow restrictor can be configured to set the flow rate of the auxiliary fluid based on the pressure drop of the auxiliary fluid flowing between the second pair of ports and the third pair of ports (i.e., bypassing the thermal interface and preferably flowing to one or more cold plates). For example, if the pressure drop increases, the flow rate can be increased accordingly to compensate. Additionally or alternatively, the ratio between the flow rate of the auxiliary fluid flowing to the thermal interface and the flow rate of the auxiliary fluid between the second pair of ports and the third pair of ports can be set to (or maintained at) a predetermined value. This can thus be achieved by setting the flow restriction accordingly. Description of the Drawings

[0021] The present disclosure can be implemented in various ways and will now be described by way of example only and with reference to the accompanying drawings, in which:

[0022] Figure 1 shows a top view of an exemplary module including a six-port heat exchanger;

[0023] Figure 2 shows an isometric view of the module of Figure 1;

[0024] Figure 3 A cross-section of a heat exchanger with flow restriction according to a first embodiment of the present disclosure is depicted;

[0025] Figure 4 Shown for clarity Figure 3 of the enlarged portion;

[0026] Figure 5 Illustrates Figure 3 An exploded view of a heat exchanger, which shows an adapter according to a first variant;

[0027] Figure 6 Shows an adapter for use with a Figure 3 Heat exchanger according to a first variant;

[0028] Figure 7 Shows an adapter for use with a Figure 3 Heat exchanger according to a second variant;

[0029] Figure 8 Shows an adapter for use with a Figure 3 Heat exchanger according to a third variant;

[0030] Figure 9 Shows an adapter for use with a Figure 3 Heat exchanger according to a fourth variant;

[0031] Figure 10 Shows an adapter for use with a Figure 3 Heat exchanger according to a fifth variant;

[0032] Figure 11 Illustrates an exploded view of an adapter for use with a Figure 3 Heat exchanger according to a sixth variant;

[0033] Figure 12 Shows Figure 11 The adapter in a first configuration;

[0034] Figure 13 Shows Figure 11 The adapter in a second configuration;

[0035] Figure 14 Shows an adapter for use with a second embodiment of a heat exchanger according to the present disclosure;

[0036] Figure 15 Depicts an exploded view of a second embodiment of a heat exchanger according to the present disclosure having an Figure 14 Adapter. Detailed Description

[0037] Implementations of the present disclosure are generally used in conjunction with the modules shown in FIGS. 1 and 2. A key issue has been identified as the mode of operation, in which some of the secondary coolant passes through the heat exchanger and some of the secondary coolant is used for heat transfer with the primary coolant. Specifically, the hydraulic pressure loss of the secondary coolant at the outlet port of the heat exchanger (specifically, the second secondary coolant output port 5 to the cold plate 3 as shown in FIGS. 1 and 2) can vary. For example, the bias of the secondary coolant passing through the plate 4 can be different between implementations. Similarly, although the pressure drop across the plate 4 can be fixed, the pressure drop of the coolant flowing directly to the cold plate 3 can be variable, depending on, for example: how many cold plates 3 are in the system; the type of each cold plate 3 (e.g., having different internal fin / pin patterns and / or structures); and / or the length and diameter of the supply hose or pipe from the heat exchanger 1 to the cold plate 3. Thus, each implementation can have a different flow rate to the plate 4 and / or to each cold plate 3. The flow rate may be suboptimal.

[0038] To facilitate a better flow rate to the cold plate 3, it is proposed to insert an adapter into the first secondary coolant input port 7 of the heat exchanger 1. The purpose of the adapter is to reduce the amount of coolant that can pass through the plate 4 without restricting the amount of coolant flowing directly through the heat exchanger 1, i.e., restricting the amount flowing from the first secondary coolant input port 7 to the second secondary coolant output port 5 (thereby supplying the cold plate 3). The adapter can be removable and / or replaceable.

[0039] In a general sense, a heat exchanger can be considered that is configured to transfer heat from a first coolant liquid to a second coolant liquid while keeping the first liquid coolant and the second liquid coolant isolated from each other. The heat exchanger includes: a first set of ports for receiving and outputting a first coolant liquid at the heat exchanger; a second set of ports for receiving and outputting a second coolant liquid at the heat exchanger; a third set of ports for receiving and outputting the second coolant liquid at the heat exchanger, the second set of ports and the third set of ports being in communication within the heat exchanger to allow the second coolant liquid to flow between the second set of ports and the third set of ports; and a thermal interface configured to transfer heat between the first coolant liquid received at the first set of ports and the second coolant liquid received at the second set of ports and / or the third set of ports. Then, a flow restrictor is advantageously provided that is configured (in an adjustable or selective manner) to restrict the flow of the second coolant liquid to and / or from the thermal interface without restricting the flow of the second coolant liquid between the second set of ports and the third set of ports.

[0040] On the other hand, it can be found in a module for cooling an electronic component, which module comprises: a chassis for receiving the electronic component and a first (dielectric) coolant liquid for at least partially submerging the electronic component (optionally, the electronic component and / or the first coolant are also provided); one or more cold plates configured to cool at least one of the electronic components, each of the one or more cold plates being configured to receive a second coolant liquid; and a heat exchanger as disclosed herein, which heat exchanger is configured to transfer heat from the first coolant liquid to the second coolant liquid. The electronic component may include one or more of the following: one or more circuit boards; one or more integrated circuits; one or more other electronic components (e.g., resistors, capacitors, inductors, transformers). The electronic component may form a computer server or other information technology (IT) device.

[0041] In yet another aspect, a method of configuring a heat exchanger as described herein for transferring heat from a first coolant liquid to a second coolant liquid while keeping the first liquid coolant and the second liquid coolant isolated from each other may be considered. The method includes (optionally or in an adjustable manner) restricting the flow of the second coolant liquid to and / or from a heat interface that transfers heat from the first coolant liquid received at a first set of ports to the second coolant liquid received at a second set of ports and / or a third set of ports, without restricting the flow of the second coolant liquid between the second set of ports and the third set of ports.

[0042] Many optional and / or particularly advantageous features are possible. These features may be applied to any one or more of the aspects considered herein. For example, according to one embodiment, the flow restrictor includes a component. The component may be configured to be located within at least one of the second set of ports and / or the third set of ports. The flow restrictor may then include an orifice arrangement for restricting the flow of the second coolant liquid between at least one port and the heat interface.

[0043] Advantageously, the flow restrictor is replaceable. This may allow the flow restrictor to be reconfigured for different applications.

[0044] In a preferred implementation, the heat interface includes a plate heat exchange arrangement. Preferably, the heat exchanger is located within (or integrated with) the chassis. Advantageously, a pump for the first coolant liquid within the chassis is also provided. This may allow the dielectric coolant to flow effectively around the corresponding coolant loop.

[0045] In an embodiment, the first set of ports and the second set of ports of the heat exchanger are configured to receive coolant from within the chassis and provide coolant to within the chassis (the first set of ports are generally configured for the flow of a primary coolant, such as a dielectric liquid, and / or the second set of ports are generally configured for the flow of an auxiliary coolant to and from one or more cold plates). Then, the third set of ports may be configured to receive coolant from a device external to the chassis and provide coolant to a device external to the chassis, such as an auxiliary heat exchanger (which may include a heat rejection unit).

[0046] Advantageously, restricting the flow of the second coolant liquid (optionally, selectively, or in an adjustable manner) may include setting the flow rate of the second coolant liquid based on the pressure drop of the second coolant liquid flowing between the second set of ports and the third set of ports and then out of the heat exchanger. Additionally or alternatively, restricting the flow of the second coolant liquid may include setting the ratio between the flow rate of the second coolant liquid flowing to the thermal interface and the flow rate of the second coolant liquid between the second set of ports and the third set of ports to a predetermined value.

[0047] Other optional and / or advantageous features in a general sense will be discussed below. Before that, additional details of the specific embodiment are described again.

[0048] Now referring to Figure 3 , a cross-section of a heat exchanger 1 with flow restriction provided by an adapter 6 is depicted. Also referring to Figure 4 , where, for clarity, an enlarged portion of Figure 3 is shown. In cases where the same features as shown in other figures are depicted, the same reference numerals are used. As can be seen from this figure, the heat exchanger includes: a heat exchanger plate 4; a first auxiliary coolant input port 7 having an external connector 10; a first auxiliary coolant output port 9; a second auxiliary coolant output port 5; and a second auxiliary coolant input port 12. Also visible are: a chassis 2; and a piping system 8. The adapter 6 includes a restriction hole 11.

[0049] In Figure 3 and Figure 4In the example, the adapter 6 has a generally hollow elongated tubular (or cylindrical) shape and is located inside the facility coolant inlet side of the heat exchanger 1 and between the external connector 10 of the first auxiliary coolant input port 7 and the second auxiliary coolant output port 5, bypassing the plate 4. The restriction hole 11 promotes the flow directly towards the outlet port 5 and the piping system 8, reducing the attraction of the coolant through the plate 4. As will be discussed further below, based on the optimal shape, the hole 11 may include one or more holes, slots, and / or other shapes to produce one or more target (predetermined) flow rates. The left - hand side of the heat exchanger 1 shows the second auxiliary coolant input (coolant return) port 12. In this example, there is no restriction on this second auxiliary coolant input port 12 because there is no benefit in bypassing the plate 4 for this coolant.

[0050] The adapter 6 can be made of a series of different materials, such as made of metal and / or plastic. Depending on the implementation, the adapter 6 can be customized according to the flow rate restrictions required for specific uses within the module (and then selectively disabled by switching or removing the adapter 6 if the flow rate needs to be changed), or it can be adjustable so that the flow rate restriction can be changed without the need to disassemble the heat exchanger 1.

[0051] Different versions of the adapter 6 can be used for different arrangements and / or different types of cold plates 3. For example, the adapter 6 can have different predetermined holes and / or slots that are suitable for different required flow rates. Many implementations will be discussed below to show a series of possible examples. It will be understood that combinations of features from these exemplary designs are also possible.

[0052] Next, refer to Figure 5 which illustrates Figure 3 an exploded view of the heat exchanger that shows the adapter according to the first variant. As previously mentioned, the same reference numerals are used to identify the same features depicted in other figures. In this figure, it can be seen: the heat exchanger 1; the piping system 8; the first auxiliary coolant input port 7; the adapter 6 with the hole 11; the first external connector 10; the first auxiliary coolant output port 9; and the second external connector 29. Thus, it can be seen how the adapter 6 is fitted into the first auxiliary coolant input port 7 and inside the first external connector 10.

[0053] Also refer to Figure 6 which shows the adapter 6 according to the first variant. Here, the restriction hole 11 can be seen more clearly.

[0054] Now refer to Figure 7 which shows the adapter according to the second variant for use with Figure 3Adapter 6' for use with a heat exchanger. A slot 11' is provided instead of a hole.

[0055] Now refer to Figure 8 which shows an adapter 6'' for use with a Figure 3 heat exchanger according to a third variant. Here, a slotted hole 11'' is provided.

[0056] Different types of adapters can use alternative structures. For example, refer to Figure 9 which shows an adapter for use with a Figure 3 heat exchanger according to a fourth variant. The adapter 6''' includes a mesh filter 13. The mesh filter 13 can be used to remove harmful particles that are sucked into the heat exchanger 1, which may cause the system to stop working. The specification of the mesh 13 can be from (for example) 50 microns to 300 microns, depending on the specifications and / or materials used in the secondary coolant loop.

[0057] In addition to the mesh, for example, a filter screen pattern can also provide filtration. Next refer to Figure 10 which shows an adapter for use with a Figure 3 heat exchanger according to a fifth variant. The adapter 6'''' includes a filter screen 14. The filter screen 14 can be used as a filter in the same way as the mesh 13, and all the details of these options will also be applicable to this implementation.

[0058] In these embodiments, flow restriction can be selectively implemented. In particular, the adapter 6 can be inserted into or removed from the heat exchanger according to the desired flow rate.

[0059] As mentioned above, an adjustable version of the adapter (where the degree of restriction can be changed) may be beneficial. For example, in the case where the items used for cooling within the module may change, an adjustable version of the adapter can be used, which means that the flow rate around the plate 4 of the heat exchanger 1 can be changed without having to completely deactivate the heat exchanger 1.

[0060] Now refer to Figure 11 which illustrates an adapter for use with a Figure 3Exploded view of an adapter used with a heat exchanger. The adapter 26 includes: an external portion 18 having an external groove 17; and an internal portion 16 having an internal opening 41. Both the external portion 18 and the internal portion 16 have a hollow cylindrical shape, where the external portion 18 has a slightly wider dimension (in this case the diameter, since these portions have a circular cross-section, but this shape is not necessary) than the internal portion 16, such that the internal portion 16 can be fitted inside the external portion 18. The internal openings 41 are formed in rows, each row extending along the length of the internal portion 16, where different rows are located at different positions along the outer surface (circumference) of the internal portion 16. Each row has openings 41 of different shapes and / or sizes. In the example shown, the number of openings 41 in each row is the same, but this is not necessary and in some implementations this number can vary (e.g., instead of or in addition to hole-shaped openings, grooves similar to the external groove 17 can be used such that one or more rows can have only a single opening).

[0061] By aligning the internal openings 41 with the external groove 17, the flow restriction can be adjusted. The internal portion 16 is further provided with a protrusion 15 for corresponding to a notch 25 on the external portion 18. This is an example of a system that can be used to allow the internal portion 16 of the adapter 26 to twist relative to the external portion 18 and lock into a desired position.

[0062] Next, referring to Figure 12 which shows Figure 11 the adapter in a first configuration. It can be seen that the internal portion 16 is fitted inside the external portion. This fit is quite tight such that fluid does not easily flow around the internal openings 41 and through the external groove 17. In the configuration shown, the internal openings 41 aligned with the external groove 17 largely restrict the flow of fluid through the external groove 17. The position of the protrusion 15 within one of the grooves 25 locks the positioning of the internal openings 41. Thereby, the desired flow restriction to the plate 4 of the heat exchanger 1 is achieved.

[0063] Now referring to Figure 13 which shows Figure 11 the adapter in a second configuration. Here, the internal openings 41 aligned with the external groove 17 are only small holes. Therefore, the flow restriction in this configuration is even greater than Figure 12 in the configuration of Figure 12 Conversely, in this configuration, the flow rate from the first auxiliary coolant input port 7 to the second auxiliary coolant output port 5 is greater than

[0064] Returning to the general sense of the present disclosure, as discussed above, additional optional and / or beneficial features may be discussed. For example, the orifice arrangement of the flow restrictor component is advantageously formed by one or more of the following: one or more holes (in some configurations, one or more holes may be arranged in the form of a filter mesh); one or more slots; and a grid.

[0065] In one implementation, the flow restrictor includes an internal component having a first orifice arrangement and an external component having a second orifice arrangement. Then, the relative alignment of the first orifice arrangement and the second orifice arrangement can thereby set the flow (quantity and / or rate) of the second coolant liquid between at least one port of the component and the thermal interface.

[0066] Optionally, the flow restrictor is also configured to filter the second coolant liquid. For example, the filtration can be for particles larger than a certain size. This is an additional possible benefit of the flow restriction according to the present disclosure.

[0067] Other specific embodiments will now be discussed again. Then, the general sense of the present disclosure will be further referred to.

[0068] All of the adapter designs described so far are intended to fit within the first auxiliary coolant input port 7. However, it will be seen that this is not necessary. For example, the adapter can fit within the second auxiliary coolant output port 5. Next, refer to Figure 14 , which shows an adapter for use with a heat exchanger according to the method. The adapter 36 includes a tubular portion 19 and a threaded portion 20. The tubular portion 19 has an orifice 11, and the threaded portion 20 is located at one end of the tubular portion 19. The threaded portion 20 is designed to be coupled to the second auxiliary coolant output port 5 to fix the adapter 36 in place, and the threaded portion 20 includes a hole 22 to allow coolant to flow through the second auxiliary coolant output port 5.

[0069] Finally, refer to Figure 15 , which depicts an exploded view of a heat exchanger of an adapter according to Figure 14 . Thus, it can be seen how the adapter 36 fits into the second auxiliary coolant output port 5 opposite the inlet port (the first auxiliary coolant input port 7).

[0070] In view of the general sense of the present disclosure, other alternative and / or beneficial features may be provided. For example, although the flow limiter may be provided in one of the second set of ports (preferably, the port is configured for coolant to flow into the heat exchanger), the flow limiter may also be provided in one of the third set of ports (e.g., the port is configured for coolant to flow out of the heat exchanger). In some embodiments, the flow limiter may be provided in more than one port, such as in one port of the second set of ports and one port of the third set of ports (or even in more than two ports). In certain implementations, the flow limiter may be integrated with at least one port.

[0071] Although specific embodiments have now been described, those skilled in the art will understand that various modifications and alternatives are possible. The arrangement of components, heat sinks, pumps, support structures, and other configurations can be varied, combined, or otherwise constructed in a number of different ways, and those disclosed herein are merely examples. The configuration of the electronic device cooled by one or more heat sinks, one or more plates, and / or other electronic devices can vary significantly. The exact shape and / or dimensions of the heat sink and / or cold plate can also be modified. The structure of the heat sink and / or cold plate can also be changed, such as using other multi-part components or a device constructed as a single unit.

[0072] Although the present disclosure has been described with reference to a server module of a particular shape and size, this can vary (e.g., a blade server with a vertical orientation can be used), and in fact, aspects of the present disclosure can be applied to cooling other types of devices. For example (and as discussed at least in WO-2020 / 178579 co-assigned with the present disclosure), the cooling techniques according to the present disclosure can be used to cool a wider variety of different heat-generating (generally electrical and / or electronic) components, including but not limited to IT devices.

[0073] The primary coolant and / or the secondary coolant are typically liquids and can remain in a liquid form (single-phase coolant). However, this need not be the case. Two-phase coolants (which can be allowed to change to a gas phase and from the gas phase to a two-phase coolant) and / or refrigerant coolants can be used, particularly for the secondary coolant.

[0074] The shape and / or design of the adapter can be different from those described above. For example, the adapter need not be in a tubular or cylindrical shape.

[0075] In the design described herein, the adapter fits within the first secondary coolant input port 7 or the second secondary coolant output port 5. However, depending on the application and implementation, the adapter can fit into both of these ports or another port.

[0076] In some embodiments, the flow restriction can be integrated into the manufacture of the heat exchanger 1. This approach can provide a permanent solution that is not modified after the manufacturing process, although the flow restriction can be selectively or controllably adjusted in the implementation.

[0077] All features disclosed herein can be combined in any combination, except combinations in which at least some of these features and / or steps are mutually exclusive. In particular, the preferred features of the invention apply to all aspects of the invention and can be used in any combination. Similarly, the features described in non-essential combinations can be used alone (rather than in combination).

Claims

1. A heat exchanger for transferring heat from a first coolant liquid to a second coolant liquid while keeping the first liquid coolant and the second liquid coolant isolated from each other, the heat exchanger comprising: A first set of ports for receiving the first coolant liquid at the heat exchanger and outputting the first coolant liquid from the heat exchanger; A second set of ports for receiving the second coolant liquid at the heat exchanger and outputting the second coolant liquid from the heat exchanger; A third set of ports for receiving the second coolant liquid at the heat exchanger and outputting the second coolant liquid from the heat exchanger, the second set of ports and the third set of ports being in communication within the heat exchanger to allow the second coolant liquid to flow between the second set of ports and the third set of ports; A heat interface configured to transfer heat between the first coolant liquid received at the first set of ports and the second coolant liquid received at the second set of ports and / or the third set of ports; And A flow restrictor configured to restrict the flow of the second coolant liquid to and / or from the heat interface in an adjustable or selective manner without restricting the flow of the second coolant liquid between the second set of ports and the third set of ports.

2. The heat exchanger according to claim 1, wherein, The flow restrictor includes a component configured to be located within at least one of the second set of ports and / or the third set of ports, and the flow restrictor includes an orifice arrangement for restricting the flow of the second coolant liquid between the at least one port and the heat interface.

3. The heat exchanger according to claim 2, wherein, The orifice arrangement is formed by one or more of the following: one or more holes; one or more slots; and a grid.

4. The heat exchanger according to claim 2 or claim 3, wherein The flow restrictor includes an internal component having a first orifice arrangement and an external component having a second orifice arrangement, and the relative alignment of the first orifice arrangement and the second orifice arrangement thereby sets the flow of the second coolant liquid between the at least one port and the heat interface.

5. The heat exchanger according to any one of claims 2 to 4, wherein, The flow restrictor is replaceable.

6. The heat exchanger according to any one of claims 2 to 4, wherein, The flow restrictor is integrated with the at least one port.

7. The heat exchanger according to any one of the preceding claims, wherein, The flow restrictor is further configured to filter the second coolant liquid.

8. The heat exchanger according to any one of the preceding claims, wherein, The heat interface includes a plate heat exchange arrangement.

9. A module for cooling an electronic component, the module comprising: A chassis for housing the electronic component and at least partially submerging the electronic component in a first coolant liquid; One or more cold plates for cooling at least one of the electronic components, each of the one or more cold plates being configured to receive a second coolant liquid; And The heat exchanger according to any one of the preceding claims, the heat exchanger being configured to transfer heat from the first coolant liquid to the second coolant liquid.

10. The module according to claim 9, wherein, The heat exchanger is located within the chassis.

11. The module according to claim 9 or claim 10, further comprising: A pump for the first coolant liquid within the chassis.

12. The module according to any one of claims 9 to 11, wherein, The first set of ports and the second set of ports of the heat exchanger are configured to receive coolant from inside the chassis and supply coolant to inside the chassis, and the third set of ports are configured to receive coolant from a device outside the chassis and supply coolant to a device outside the chassis.

13. A method of configuring a heat exchanger for transferring heat from a first coolant liquid to a second coolant liquid while keeping the first liquid coolant and the second liquid coolant isolated from each other, the heat exchanger comprising: A first set of ports for receiving the first coolant liquid at the heat exchanger and outputting the first coolant liquid from the heat exchanger; A second set of ports for receiving the second coolant liquid at the heat exchanger and outputting the second coolant liquid from the heat exchanger; And a third set of ports for receiving the second coolant liquid at the heat exchanger and outputting the second coolant liquid from the heat exchanger, the second set of ports and the third set of ports being in communication within the heat exchanger to allow the second coolant liquid to flow between the second set of ports and the third set of ports, the method comprising: Restricting the flow of the second coolant liquid to and / or from a heat interface of the heat exchanger that transfers heat from the first coolant liquid received at the first set of ports to the second coolant liquid received at the second set of ports and / or the third set of ports, without restricting the flow of the second coolant liquid between the second set of ports and the third set of ports.

14. The method according to claim 13, wherein The step of restricting the flow of the second coolant liquid includes setting the flow rate of the second coolant liquid based on the pressure drop of the second coolant liquid flowing between the second set of ports and the third set of ports and then out of the heat exchanger.

15. The method according to claim 13 or claim 14, wherein, The step of restricting the flow of the second coolant liquid includes setting the ratio between the flow rate of the second coolant liquid flowing to the heat interface and the flow rate of the second coolant liquid between the second set of ports and the third set of ports to a predetermined value.

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