Polishing head, polishing equipment and method for polishing square substrates

Abstract

The present invention discloses a polishing head, polishing equipment, and method for polishing square substrates, comprising: a connecting plate and multiple piezoelectric components; wherein the multiple piezoelectric components are disposed on the connecting plate and positioned between the connecting plate and the square substrate to be polished, the piezoelectric components having pressure transmission surfaces for transmitting pressure to the square substrate, and the pressure transmission surfaces of different piezoelectric components are used to transmit pressure to different polishing areas of the square substrate. During the polishing process, the input voltage of the piezoelectric components is adjusted according to the speed of the different polishing areas of the square substrate to control the pressure transmitted to the corresponding polishing areas of the square substrate by the pressure transmission surfaces. The present invention achieves the technical effect of maintaining consistent or similar material removal rates even for polishing areas with different speeds on the square substrate, thereby improving the material removal uniformity and surface flatness of the square substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing equipment, and in particular to a polishing pressure head, polishing equipment and a polishing pressure control method for polishing a square substrate. Background Art

[0002] Through-Glass Via (TGV), an advanced chip packaging technology, has attracted significant research and development investment worldwide. Its core material is a glass substrate, and the production process involves polishing the glass substrate. As packages grow larger, the demand for larger and thinner glass substrates is increasing.

[0003] However, the polishing of ultra-large and ultra-thin glass substrates (e.g., glass substrates with dimensions exceeding 500mm in length, 500mm in width, and thicknesses between 0.5mm and 1mm) is still being researched and developed in the laboratory. Due to their large size, the polishing speed difference between the edge and center of the glass substrate is significant. Furthermore, due to their ultra-thinness, the surface flatness requirements for the glass substrate are extremely high, typically at the micron level.

[0004] The polishing accuracy of ultra-large and ultra-thin glass substrates in the existing technology does not meet the requirements of large-scale production. Summary of the Invention

[0005] The main purpose of the present invention is to provide a polishing pressure head, polishing equipment and polishing pressure control method to solve the problems in the related art of difficult pressure control, uneven surface material removal rate and low surface flatness when polishing ultra-large and ultra-thin square substrates.

[0006] In order to achieve the above-mentioned object, the present invention provides a polishing press head, comprising: a connecting plate and a plurality of piezoelectric components; wherein,

[0007] Multiple piezoelectric components are arranged on the connecting plate and are located between the connecting plate and the square substrate to be polished. The piezoelectric components have a pressure transmission surface for transmitting pressure to the square substrate. The pressure transmission surfaces of different piezoelectric components are used to transmit pressure to different polishing areas of the square substrate, so that during the polishing process, the input voltage of the piezoelectric component is adjusted according to the speed of different polishing areas of the square substrate to control the pressure transmitted to the corresponding polishing area of ​​the square substrate by the pressure transmission surface.

[0008] Optionally, the plurality of piezoelectric components are arranged in a matrix in accordance with the shape of the square substrate.

[0009] Optionally, a plurality of piezoelectric components are evenly covered on the square substrate in accordance with the shape of the square substrate.

[0010] Optionally, during the polishing process, the input voltage of the piezoelectric component is adjusted according to the speed of different polishing areas of the square substrate to control the pressure transmitted by the pressure transmission surface to the corresponding polishing areas of the square substrate, specifically:

[0011] Dividing the square substrate into a plurality of polishing areas, wherein each polishing area corresponds to at least one of the piezoelectric components, and determining the speed of each polishing area during the polishing process;

[0012] According to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted to the polishing area by the piezoelectric component, so as to achieve the target material removal rate for the square substrate.

[0013] Optionally, according to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted to the polishing area by the piezoelectric component, specifically:

[0014] The target material removal rate for the square substrate is achieved through the following correspondence:

[0015] ,

[0016] in, is the material removal rate of the polishing area corresponding to the piezoelectric component on the square substrate, is the Preston constant, is the speed of the polishing area on the square substrate corresponding to the piezoelectric component, is the surface area of ​​the piezoelectric material in the piezoelectric component, is the elastic modulus of the piezoelectric material when the electric field is zero or constant, is the input voltage of the piezoelectric component, is the piezoelectric constant, is the thickness of the piezoelectric material, is the surface area of ​​the pressure transmission surface on the piezoelectric component.

[0017] Optionally, the piezoelectric assembly includes a piezoelectric layer and a first pressure plate, the piezoelectric layer is located between the connecting plate and the first pressure plate, so that the first pressure plate applies a pre-tightening force to the piezoelectric layer, and the piezoelectric layer transmits pressure to the square substrate through the first pressure plate.

[0018] Optionally, the piezoelectric component also includes a connecting column, the first end of which is fixedly connected to the first pressure plate, and the second end of the connecting column passes through the piezoelectric layer and is fixedly connected to the connecting plate, and the magnitude of the pre-tightening force applied by the first pressure plate to the piezoelectric layer is changed by adjusting the axial fixed position of the connecting column on the connecting plate.

[0019] Optionally, the stiffness of the first pressure plate is greater than that of the connecting column. During pressure transmission, the connecting column generates axial elastic deformation under the pressure of the piezoelectric layer to provide the displacement required for the first pressure plate to transmit pressure.

[0020] Optionally, the connecting column is a hollow columnar structure, and a wiring hole is provided on the connecting column. The cable connected to the piezoelectric layer enters the connecting column through the wiring hole and extends from the second end of the connecting column into the wiring space above the connecting plate.

[0021] Optionally, the piezoelectric component further includes a second pressing plate, which is arranged between the connecting plate and the piezoelectric layer, and the second end of the connecting column passes through the second pressing plate and is fixedly connected to the connecting plate.

[0022] Optionally, a buffer pad is further included, which is arranged between the pressure transmission surface of the piezoelectric component and the square substrate, and the pressure of the pressure transmission surface is transmitted to the square substrate through the buffer pad.

[0023] Optionally, a retaining ring is further included, which is provided on one side of the connecting plate and is used to constrain the square substrate within the retaining ring.

[0024] Optionally, a buffer pad covers the pressure transmission surfaces of the plurality of piezoelectric components, and the buffer pad is wrapped around the piezoelectric component to seal the ring side of the piezoelectric component and the retaining ring.

[0025] Optionally, the polishing head further comprises a driving member for driving the retaining ring to move toward and away from the polishing pad.

[0026] Optionally, the driving member includes an airbag assembly, which is connected to the retaining ring, and drives the retaining ring to move through expansion and contraction of the airbag assembly.

[0027] Optionally, the airbag assembly is provided in plurality, and the plurality of airbag assemblies are arranged around the retaining ring.

[0028] Optionally, the airbag assembly includes an airbag, a first connecting member, and a second connecting member;

[0029] The first connecting member and the second connecting member are fixed to the first end and the second end of the airbag respectively, and the second connecting member is connected to the retaining ring.

[0030] Optionally, the polishing press head further comprises:

[0031] A support plate, the support plate being used to connect to the machine, a wiring channel being provided in the support plate, and the first connector being connected to the support plate;

[0032] The connecting plate is fixed on a side of the supporting plate facing the square substrate. A wiring space is provided between the connecting plate and the supporting plate. The wiring channel is connected to the wiring space for passing the cables of the piezoelectric assembly.

[0033] Optionally, a plurality of fixing columns are provided on a side of the connecting plate facing the supporting plate, and ends of the fixing columns are fixedly connected to the supporting plate, so that the wiring space is provided between the connecting plate and the supporting plate.

[0034] Optionally, a first connecting groove is provided on the supporting plate, a second connecting groove is provided on the retaining ring, the first connecting member is fixedly matched with the first connecting groove, and the second connecting member is fixedly matched with the second connecting groove.

[0035] Optionally, loading ports are provided on the side of the support plate and the side of the retaining ring, and the loading ports are connected to the corresponding first connecting groove and the second connecting groove, and the first connecting member is loaded into the first connecting groove through the corresponding loading ports, and the second connecting member is loaded into the second connecting groove through the corresponding loading ports.

[0036] Optionally, a first air channel is provided on the first connecting member, and a second air channel is provided on the supporting plate. The first air channel is communicated with the airbag, and the second air channel is used to communicate with a pressure control source.

[0037] Optionally, a guide structure is further included, wherein a first end of the guide structure is connected to the supporting plate, and a second end of the guide structure is connected to the retaining ring, and the guide structure provides guidance for the movement of the retaining ring.

[0038] Optionally, the guide structure includes a guide shaft, a third connecting member is provided at the second end of the guide shaft, the third connecting member is fixed in cooperation with the second connecting groove, a guide hole is provided on the support plate, and the upper end of the guide shaft is slidably connected to the guide hole.

[0039] According to another aspect of the present invention, a polishing device is provided, comprising the above-mentioned polishing head.

[0040] According to another aspect of the present invention, there is provided a polishing method using the above-mentioned polishing head, the method comprising:

[0041] Dividing the square substrate into a plurality of polishing areas, and each polishing area corresponds to at least one of the piezoelectric components;

[0042] determining a velocity of each of the polishing regions during polishing;

[0043] According to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted by the piezoelectric component to the polishing area so that the square substrate can achieve the target material removal rate.

[0044] In an embodiment of the present invention, a connecting plate and multiple piezoelectric components are provided; wherein, the multiple piezoelectric components are provided on the connecting plate and are located between the connecting plate and the square substrate to be polished, the piezoelectric components have a pressure transmission surface for transmitting pressure to the square substrate, and the pressure transmission surfaces of different piezoelectric components are used to transmit pressure to different polishing areas of the square substrate, so that during the polishing process, the input voltage of the piezoelectric component is adjusted according to the speed of the different polishing areas of the square substrate to control the pressure transmitted to the corresponding polishing area of ​​the square substrate by the pressure transmission surface.

[0045] On the one hand, after multiple piezoelectric components are provided on the connecting plate, the input voltage of each piezoelectric component can be controlled to control the pressure transmitted by the pressure transmission surface of each piezoelectric component. Since different piezoelectric components correspond to different polishing areas of the square substrate, the pressure exerted on different polishing areas of the square substrate can be controlled, thereby achieving the technical effect of maintaining a consistent material removal rate even for polishing areas with different speeds on the square substrate, thereby improving the material removal uniformity and surface flatness of the square substrate.

[0046] Especially when targeting large-sized, ultra-thin square substrates, some of the multiple independent piezoelectric components can be easily arranged to directly correspond to the corner areas and the central areas of the edges of the square substrate. By controlling the input voltage of the piezoelectric components at this position, the pressure of the corresponding polishing area on the square substrate can be controlled, thereby controlling the material removal uniformity of the corresponding polishing area, so that the corner areas and the central areas of the edges of the square substrate can also achieve the effect of local pressure control relatively simply, thereby improving the overall material removal uniformity and surface flatness of the square substrate.

[0047] On the other hand, after arranging multiple independent piezoelectric components, since local pressure can be controlled in different polishing areas on the square substrate, when polishing a large square substrate, the deformation of the edge of the large-sized polishing head due to its own weight can be compensated. In this way, the additional pressure applied to the square substrate due to the deformation of the edge of the polishing head during the polishing process can be adjusted, further improving the material removal uniformity and surface flatness of the square substrate.

[0048] On the other hand, after using the piezoelectric component as the pressure transmission element for the square substrate, the pressure control only needs to change the input voltage. Accordingly, it is only necessary to arrange a cable connected to the piezoelectric component on the polishing head. Compared with the need to arrange an air path or liquid path for each chamber separately, the overall structure is simpler, and the sealing performance requirements for the polishing head are also lower, which makes the production cost lower and the pressure control more precise. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention and to make other features, objects, and advantages of the present invention more apparent. The accompanying drawings and descriptions of the exemplary embodiments of the present invention are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0050] Figure 1 is a schematic cross-sectional view of a polishing indenter according to an embodiment of the present invention;

[0051] Figure 2 yes Figure 1 Schematic diagram of the local enlarged structure in;

[0052] Figure 3 is a schematic diagram of the bottom view of the polishing indenter according to an embodiment of the present invention;

[0053] Figure 4 2 is a schematic diagram of the axial structure of a polishing press head according to an embodiment of the present invention;

[0054] Figure 5 is a schematic diagram of partitioning a square substrate according to an embodiment of the present invention;

[0055] Figure 6 is a schematic diagram of the partitioning of the piezoelectric component according to an embodiment of the present invention;

[0056] Figure 7 is a schematic structural diagram of a piezoelectric component according to an embodiment of the present invention;

[0057] Figure 8 is a schematic structural diagram of a first pressing plate according to an embodiment of the present invention;

[0058] Figure 9 is a schematic cross-sectional structural diagram of a first pressing plate according to an embodiment of the present invention;

[0059] Figure 10 is a schematic structural diagram of an airbag assembly according to an embodiment of the present invention;

[0060] Figure 11 is a schematic cross-sectional structural diagram of an airbag assembly according to an embodiment of the present invention;

[0061] Figure 12is a structural schematic diagram of a guide structure according to an embodiment of the present invention;

[0062] Figure 13 is a schematic structural diagram of a retaining ring according to an embodiment of the present invention;

[0063] Figure 14 is a schematic structural diagram of a support disk according to an embodiment of the present invention;

[0064] Figure 15 is a bottom-view structural diagram of a support plate according to an embodiment of the present invention;

[0065] Figure 16 is a schematic structural diagram of a connecting plate according to an embodiment of the present invention;

[0066] Figure 17 is a schematic structural diagram of a piezoelectric assembly after being mounted on a connecting plate according to an embodiment of the present invention;

[0067] Figure 18 is a structural schematic diagram from another perspective after the piezoelectric assembly is installed on the connecting plate according to an embodiment of the present invention;

[0068] Figure 19 is a schematic structural diagram of a buffer pad according to an embodiment of the present invention;

[0069] Among them, 1. Rigid component; 101. Support plate; 1010. Guide hole; 1011. Second air channel; 102. Connecting plate; 1020. Fixed column; 103. Airbag assembly; 1030. Airbag; 1031. First connecting piece; 10310. First air channel; 1032. Second connecting piece; 104. Retaining ring; 1040. Flow trough; 2. Piezoelectric assembly; 20. Piezoelectric layer; 21. First pressure plate; 22. Second pressure plate; 23. Gasket; 24. Nut; 25. Connecting column; 250. Routing hole; 200. Pressure transmission surface; 3. Buffer pad; 4. Square substrate; 5. Routing space; 6. Routing channel; 7. Guide structure; 70. Guide shaft; 71. Third connecting piece; 8. First connecting groove; 9. Second connecting groove. DETAILED DESCRIPTION

[0070] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0071] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate to facilitate the description of the embodiments of the present invention.

[0072] In the present invention, the terms "upper," "lower," "inner," and the like indicate positions or locations based on those shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0073] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0074] Furthermore, the terms "disposed," "provided with," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0075] Additionally, the term "plurality" shall mean two or more.

[0076] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0077] To solve related technical problems, such as Figures 1 to 6 As shown, an embodiment of the present invention provides a polishing press head, comprising: a connecting plate 102 and a plurality of piezoelectric components 2; wherein,

[0078] Multiple piezoelectric components 2 are arranged on the connecting plate 102 and are located between the connecting plate 102 and the square substrate 4 to be polished. The piezoelectric components 2 have a pressure transmission surface 200 for transmitting pressure to the square substrate 4. The pressure transmission surfaces 200 of different piezoelectric components 2 are used to transmit pressure to different polishing areas of the square substrate 4. During the polishing process, the input voltage of the piezoelectric component 2 is adjusted according to the speed of the different polishing areas of the square substrate 4 to control the pressure transmitted to the corresponding polishing area of ​​the square substrate 4 by the pressure transmission surface 200, so as to control the material removal rate of the corresponding polishing area of ​​the square substrate 4.

[0079] In this embodiment, the connecting plate 102 comprises a rigid structure that can move under the action of the machine equipment and transmit the pressure from the machine equipment. The piezoelectric component 2 is installed between the connecting plate 102 and the square substrate 4 to be polished, specifically, it is installed on the side of the connecting plate 102 opposite to the square substrate 4. For example, the polishing pressure head transmits the pressure downward to the square substrate 4. Figure 1 As shown, the piezoelectric assembly 2 is mounted at the lower end of the connecting plate 102 and is capable of transmitting pressure to the square substrate 4 located below. To achieve localized pressure control in different polishing areas of the square substrate 4, this embodiment includes multiple piezoelectric assemblies 2. These assemblies are arranged on the connecting plate 102 in a specific arrangement, which can be determined based on the regional division of the square substrate 4.

[0080] In one embodiment, the square substrate 4 can be grid-divided into a plurality of polishing areas, and the plurality of polishing areas are distributed in an array. Figure 5 As shown, it can be divided into multiple complete rectangular polishing areas. Specifically, as shown in the figure, during the polishing process, the square substrate 4 rotates around the center O at an angular velocity of Rotation, assuming that in the square substrate 4, the distance from the center point O to the right angle point is , then the rotation speed of this polishing area is approximately The distance from the center point O to the right angle side is , then the rotation speed of this polishing area is approximately . Obviously in the square square substrate 4, , According to Preston equation ( is the material removal rate, is the Preston constant, is the polishing pressure, is the instantaneous relative velocity of any point on the surface of the square substrate 4 relative to the polishing pad), under the same polishing pressure conditions The material removal rate in the area is less than Material removal rate of the area.

[0081] In the actual processing process, it is impossible to infinitely mesh the square substrate. Figure 5 The division shown, polishing area Material removal rate , For polishing area The average pressure, For polishing area The average speed of the polishing area can be obtained by the same method. ,in ,

[0082] .

[0083] Based on this, the multiple piezoelectric components 2 on the polishing head adopt the following Figure 6 In the matrix arrangement shown, multiple piezoelectric assemblies 2 are evenly distributed on the square substrate 4 in accordance with the shape of the square substrate 4, thereby corresponding to the polishing area division on the square substrate 4. During the polishing process, the input voltage of the corresponding piezoelectric assembly 2 is adjusted according to the speed of each polishing area of ​​the square substrate 4 to control the pressure transmitted to the corresponding polishing area by the pressure transmission surface 200. This controls the material removal rate of the corresponding polishing area on the square substrate 4, ensuring that each polishing area on the surface of the square substrate 4 achieves a consistent or similar material removal rate, thereby improving the uniformity of material removal and surface smoothness.

[0084] In this embodiment, the piezoelectric component 2 is a key component for transmitting pressure. The piezoelectric component 2 includes a piezoelectric material. Due to the characteristics of the piezoelectric material, when a voltage is applied to it, the piezoelectric material generates an electric displacement, which is used to transmit pressure. Within the range of electric displacement, the greater the input voltage, the greater the electric displacement generated by the piezoelectric material, and the greater the pressure transmitted, and vice versa. The piezoelectric material included in the piezoelectric component 2 can be a piezoelectric crystal, such as a quartz crystal, or a piezoelectric ceramic, or a semiconductor piezoelectric material, etc., and this is not limited in this embodiment.

[0085] In one aspect of the present invention, after multiple piezoelectric assemblies 2 are provided on the connecting plate 102, the input voltage of each piezoelectric assembly 2 can be controlled to control the pressure transmitted by the pressure transmission surface 200 of each piezoelectric assembly 2. Since different piezoelectric assemblies 2 correspond to different polishing areas of the square substrate 4, the pressure exerted on different polishing areas on the square substrate 4 can be controlled, thereby achieving the technical effect of maintaining a consistent material removal rate even for polishing areas with different speeds on the square substrate 4, thereby improving the material removal uniformity and surface flatness of the square substrate 4.

[0086] Especially when targeting a large-sized, ultra-thin square substrate 4, some of the multiple independent piezoelectric components 2 can be easily arranged to directly correspond to the corner areas and the central areas of the edges of the square substrate 4. By controlling the input voltage of the piezoelectric component 2 at this position, the pressure of the corresponding polishing area on the square substrate 4 can be controlled, thereby controlling the material removal uniformity of the corresponding polishing area, so that the corner areas and the central areas of the edges of the square substrate 4 can also achieve the effect of local pressure control relatively simply, thereby improving the overall material removal uniformity and surface flatness of the square substrate 4.

[0087] On the other hand, after arranging multiple independent piezoelectric components 2, since local pressure control can be performed on different polishing areas on the square substrate 4, when polishing a large-sized square substrate 4, the deformation of the edge of the large-sized polishing head due to its own weight can be compensated, thereby adjusting the additional pressure applied to the square substrate 4 due to the deformation of the edge of the polishing head during the polishing process, thereby further improving the material removal uniformity and surface flatness of the square substrate 4;

[0088] On the other hand, after using the piezoelectric component 2 as the pressure transmission component for the square substrate 4, the control of the pressure only requires changing the input voltage. Accordingly, it is only necessary to arrange a cable connected to the piezoelectric component 2 on the polishing head. Compared with the need to arrange an air path or liquid path for each chamber separately, the overall structure is simpler, and the sealing performance requirements for the polishing head are also lower, which makes the production cost lower and the pressure control more precise.

[0089] Finally, in conventional thin-film pressurization, the thin film is a flexible structure. Since the square substrate 4 exerts a force on the film in the plane of rotation during rotation, this can easily cause the film to be stretched outward, resulting in uneven pressure transmission. However, in the present invention, the piezoelectric component 2 has a relatively rigid structure. After contact with the square substrate 4, the rotation of the square substrate 4 does not easily cause the piezoelectric component 2 to deform, thereby ensuring uniform pressure transmission to the square substrate 4.

[0090] In one embodiment, during the polishing process, the input voltage of the piezoelectric component is adjusted according to the speed of different polishing areas of the square substrate to control the pressure transmitted by the pressure transmission surface to the corresponding polishing area of ​​the square substrate, specifically:

[0091] Dividing the square substrate into a plurality of polishing areas, wherein each polishing area corresponds to at least one of the piezoelectric components, and determining the speed of each polishing area during the polishing process;

[0092] According to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted to the polishing area by the piezoelectric component, so as to achieve the target material removal rate for the square substrate.

[0093] According to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted to the polishing area by the piezoelectric component, specifically:

[0094] The target material removal rate for the square substrate is achieved through the following correspondence:

[0095] ,

[0096] in, is the material removal rate of the polishing area corresponding to the piezoelectric component 2 on the square substrate 4, is the Preston constant, is the speed of the polishing area corresponding to the piezoelectric component 2 on the square substrate 4, is the surface area of ​​the piezoelectric material in the piezoelectric component 2, is the elastic modulus of the piezoelectric material when the electric field is zero or constant, is the input voltage of the piezoelectric component 2, is the piezoelectric constant, is the thickness of the piezoelectric material, is the surface area of ​​the pressure transmission surface 200 on the piezoelectric component 2.

[0097] In this embodiment, the material removal rate of the square substrate 4 and the rotational speed of the square substrate 4 are pre-set. Based on the rotational speed of the square substrate 4 and the positions of the polishing areas divided on the square substrate 4, the speed of each polishing area can be calculated. The speed can be the average speed or the center speed of the polishing area. The surface area of ​​the piezoelectric material, the elastic modulus of the piezoelectric material when the electric field is zero or constant, the thickness of the piezoelectric material, the surface area of ​​the pressure transmission surface 200 on the piezoelectric component 2, and the piezoelectric constant are all physically known quantities. Therefore, based on the above relationships, the input voltage of each piezoelectric component can be calculated. By controlling the input voltage of each piezoelectric component accordingly, the square substrate 4 can achieve the target material removal rate.

[0098] During the polishing process, the input voltage of each piezoelectric component 2 can be controlled according to the above correspondence, so that each polishing area on the square substrate 4 maintains a consistent or similar material removal rate.

[0099] In one embodiment of the piezoelectric component 2, as Figure 7As shown, the piezoelectric component 2 includes a piezoelectric layer 20, which is a piezoelectric material and can generate electric displacement and thus transmit pressure after input voltage. In order for the piezoelectric layer 20 to be able to better transmit pressure, it is necessary to apply a certain pre-tightening force to the piezoelectric layer 20. Therefore, in this embodiment, the piezoelectric component 2 also includes a first pressure plate 21, and the side of the piezoelectric layer 20 away from the square substrate 4 is constrained on the connecting plate 102, and the other side is in contact with the first pressure plate 21. That is, the piezoelectric layer 20 is located between the connecting plate 102 and the first pressure plate 21. The constraint method of the piezoelectric layer 20 on the connecting plate 102 can be an adhesive constraint, that is, the piezoelectric layer 20 is adhesively fixed to the connecting plate 102, or the piezoelectric layer 20 is pre-installed in a specific rigid part, and then the rigid part is fixed to the connecting plate 102. After being constrained to the connecting plate 102, the piezoelectric layer 20 can still generate electric displacement and thus transmit pressure.

[0100] After the first pressure plate 21 is attached to the piezoelectric layer 20, the pressure of the piezoelectric layer 20 needs to be transmitted through the first pressure plate 21. The side of the first pressure plate 21 close to the square substrate 4 serves as the pressure transmission surface 200 of the piezoelectric component 2. While serving as a pressure transmission component, the first pressure plate 21 also needs to apply a pre-tightening force to the piezoelectric layer 20. In one embodiment, the first pressure plate 21 is connected to the connecting plate 102 via a connector to press the piezoelectric layer 20, thereby applying a pre-tightening force to the piezoelectric layer 20. At this time, in order to achieve pressure transmission, when the piezoelectric layer 20 generates an electrical displacement, the first pressure plate 21 or the connector needs to be deformed to transmit pressure. In order to enable the first pressure plate 21 to evenly transmit pressure to the square substrate 4, it is preferred that the connector be deformed to transmit pressure.

[0101] Depending on the structure of the connecting piece, the deformation is generated and the transmission method is different while ensuring the preload. Figures 7 to 9 As shown, the piezoelectric assembly 2 further includes a connecting post 25, which serves as a connector connecting the first pressure plate 21 and the connecting plate 102. Specifically, a first end of the connecting post 25 is fixedly connected to the first pressure plate 21, and a second end of the connecting post 25 passes through the piezoelectric layer 20 and is fixedly connected to the connecting plate 102. By adjusting the axial fixed position of the connecting post 25 on the connecting plate 102, the magnitude of the preload force applied by the first pressure plate 21 to the piezoelectric layer 20 is changed.

[0102] In this embodiment, the connecting column 25 is a columnar structure, and the first end of the connecting column 25 (ie, Figure 8 The second end of the connecting column 25 (i.e., the lower end shown in FIG. 2 ) is fixedly connected to the first pressing plate 21, and the two can be fixed by welding or integrally formed. Figure 8The upper end (shown as an upper end) passes through a pre-set hole in the piezoelectric layer 20 and is fixedly connected to the connecting plate 102. The connection between the connecting post 25 and the connecting plate 102 enables the first pressing plate 21 to apply an upward force to the piezoelectric layer 20, thereby pressing and constraining the piezoelectric layer 20 against the connecting plate 102 and applying a certain preload force to the piezoelectric layer 20. Furthermore, the magnitude of the preload force applied by the first pressing plate 21 to the piezoelectric layer 20 can be varied by adjusting the axial fixed position of the connecting post 25 on the connecting plate 102.

[0103] In one embodiment, Figure 1 、 Figure 2 and Figure 7 As shown, the second end of the connecting column 25 is inserted into the connecting plate 102 and is sleeved with the gasket 23 and the threaded connection locking nut 24. The axial position of the connecting column 25 is adjusted by rotating the locking nut 24, thereby changing the magnitude of the pre-tightening force applied by the first pressure plate 21 to the piezoelectric layer 20.

[0104] In another embodiment, the connecting post 25 can be inserted into the connecting plate 102 and snap-fitted. The connecting post 25 is provided with multiple snap-fit ​​positions along the axial direction, and the axial position of the connecting post 25 can be adjusted by changing the snap-fit ​​positions. In order to achieve linear preload adjustment, the first embodiment is preferred.

[0105] During the pressure transmission process, the pressure of the piezoelectric layer 20 first acts on the first pressure plate 21. Since the first pressure plate 21 is connected to the connecting plate 102 through the connecting column 25, the pressure is also transmitted to the connecting column 25. In order for the first pressure plate 21 to be able to uniformly transmit pressure to the square substrate 4, it is necessary for the connecting column 25 to produce tensile deformation under the pressure of the piezoelectric layer 20, and the first pressure plate 21 uses the displacement provided by this deformation to transmit pressure. To this end, in this embodiment, the stiffness of the first pressure plate 21 is greater than the stiffness of the connecting column 25. During the pressure transmission process, the connecting column 25 produces axial elastic deformation under the pressure of the piezoelectric layer 20 to provide the displacement required for the first pressure plate 21 to transmit pressure. To achieve uniform force transmission, the connecting column 25 is connected to the center of the first pressure plate 21.

[0106] Since the piezoelectric component 2 requires input voltage to control the output pressure, the piezoelectric component 2 needs to be connected to the power supply device through a cable. In order to achieve wiring in a limited space, Figure 8 and Figure 9 As shown, in this embodiment, the connecting column 25 is a hollow columnar structure, and a wiring hole 250 is provided on the connecting column 25. The cable connected to the piezoelectric layer 20 enters the channel 252 of the connecting column 25 through the wiring hole 250 and extends from the opening 251 at the second end of the connecting column 25 to enter the wiring space 5 of the connecting plate 102.

[0107] Specifically, in this embodiment, a wiring hole 250 is defined on the lower side of the connecting post 25. The piezoelectric layer 20 is sleeved onto the connecting post 25 and abuts against the first pressure plate 21 at the lower end. Cables connected to the piezoelectric layer 20 pass through the wiring hole 250, into the hollow channel of the connecting post 25, and upwardly pass out of the upper end of the connecting post 25 into the wiring space 5 of the connecting plate 102. The cables of the piezoelectric layers 20 in multiple piezoelectric assemblies 2 can pass through corresponding connecting posts 25 and converge into the wiring space 5 within the connecting plate 102. After being combined into a bus, they are connected to an external power supply.

[0108] In this embodiment, on the one hand, the channel in the hollow connecting column 25 is used for routing, which saves the layout space of the cables. On the other hand, the hollow connecting column 25 can more easily make its stiffness lower than the stiffness of the first pressure plate 21, thereby facilitating the pressure transmission of the first pressure plate 21.

[0109] On the basis of the above embodiment, in order to protect the piezoelectric layer 20, as Figure 7 As shown, the piezoelectric component 2 in this embodiment also includes a second pressure plate 22, which is attached to the side of the piezoelectric layer 20 away from the square substrate 4, and the side of the second pressure plate 22 away from the piezoelectric layer 20 is attached to the connecting plate 102, that is, the second pressure plate 22 is arranged between the connecting plate 102 and the piezoelectric layer 20, and the second end of the connecting column 25 passes through the second pressure plate 22 and is fixedly connected to the connecting plate 102.

[0110] Specifically, in this embodiment, the second pressure plate 22 and the first pressure plate 21 are respectively attached to the upper and lower surfaces of the piezoelectric layer 20. The upper ends of the connecting posts 25 pass through the second pressure plate 22 and are fixedly connected to the connecting plate 102, thereby pressing and fixing the first pressure plate 21, the piezoelectric layer 20, and the second pressure plate 22 to the connecting plate 102. The lengths of the first pressure plate 21, the piezoelectric layer 20, and the second pressure plate 22 can remain consistent. In one embodiment, the first pressure plate 21, the piezoelectric layer 20, and the second pressure plate 22 are all rectangular.

[0111] Since the first pressure plate 21 is a rigid structure, in order to avoid the first pressure plate 21 directly contacting the square substrate 4 and damaging the square substrate 4, the polishing pressure head in this embodiment also includes a buffer pad 3. The buffer pad 3 is arranged on the pressure transmission surface 200 of the piezoelectric component 2, and is located between the pressure transmission surface 200 and the square substrate 4. The pressure of the pressure transmission surface 200 is transmitted to the square substrate 4 through the buffer pad 3.

[0112] Specifically, during the polishing process, the buffer pad 3 is located between the first pressure plate 21 and the square substrate 4. The pressure of the piezoelectric layer 20 is first transmitted to the first pressure plate 21, and then transmitted from the first pressure plate 21 to the square substrate 4 through the buffer pad 3. In one embodiment, each piezoelectric component 2 may include a buffer pad 3, and the buffer pad 3 may be attached to and fixed on the surface of the first pressure plate 21 away from the piezoelectric layer 20. In another embodiment, Figure 1 and Figure 19 As shown, the cushion pad 3 covers the pressure transmission surface 200 of all piezoelectric components 2. The shape of the cushion pad 3 is substantially consistent with the shape of the square substrate 4. Because the cushion pad 3 is a flexible pad with a certain thickness, even if it covers the pressure transmission surface 200 of all piezoelectric components 2, different piezoelectric components 2 can still transmit pressure to the square substrate 4 individually through the cushion pad 3.

[0113] During the polishing process, polishing liquid needs to be sprayed onto the square substrate 4. As an electronic device, the piezoelectric component 2 needs to prevent the polishing liquid from directly contacting the piezoelectric layer 20 and cables in the piezoelectric component 2. To this end, in this embodiment, when the buffer pad 3 covers the pressure transmission surfaces 200 of multiple or all piezoelectric components 2, the buffer pad 3 is wrapped around the piezoelectric component 2 to seal the ring side of the piezoelectric component 2 with the retaining ring 104, thereby preventing the polishing liquid from directly contacting the piezoelectric component 2.

[0114] In one embodiment, Figures 1 to 4 As shown, the polishing indenter includes:

[0115] Support plate 101, which is used to connect to the machine, and a wiring channel 6 is provided in the support plate 101;

[0116] The connecting plate 102 is fixed on the side of the supporting plate 101 facing the square substrate. There is a wiring space 5 between the connecting plate 102 and the supporting plate 101. The wiring channel 6 is connected to the wiring space 5 for the cable of the piezoelectric component 2 to pass through. The piezoelectric component 2 is fixed on the connecting plate 102.

[0117] In this embodiment, the support plate 101 is a rigid structure, and the upper end of the support plate 101 is used to connect to the machine. The connecting plate 102 is fixed to the lower end of the support plate 101, and the connecting plate 102 and the support plate 101 can be fixed by bolts or welding, etc., and a corresponding connecting hole 1012 can be preset on the support plate 101. In this embodiment, the support plate and the connecting plate constitute a rigid component 1 of the polishing press head. There is a gap between the upper surface of the connecting plate 102 and the support plate 101 to form a wiring space 5, and a wiring channel 6 connected to the wiring space 5 is provided on the support plate 101. As shown Figure 17 and Figure 18 As shown, the piezoelectric assembly 2 is fixed to the connecting plate 102. Specifically, the second pressure plate 22 of the piezoelectric assembly 2 is in contact with the lower end surface of the connecting plate 102. The connecting post 25 passes through the hole in the connecting plate 102, enters the wiring space 5, and is threadedly connected to the nut 24. The cable connected to the piezoelectric layer 20 passes through the upper end of the connecting post 25, enters the wiring space 5, and then converges into the wiring channel 6 in the support plate 101 and is led out.

[0118] In order to fix the connecting plate 102 and form the wiring space 5 at the same time, Figure 16 As shown, a plurality of fixing posts 1020 are provided on the side of the connecting plate 102 facing the support plate 101. The ends of the fixing posts 1020 are fixedly connected to the support plate 101, so that there is a wiring space 5 between the connecting plate 102 and the support plate 101. The plurality of fixing posts 1020 can be arranged at intervals along the circumferential edge of the connecting plate 102.

[0119] Since pressure needs to be transmitted to the polishing pad separately during the polishing process, the polishing head needs to have a structure that can transmit pressure to the polishing pad separately in addition to the piezoelectric component 2 used to transmit pressure to the square substrate 4. Figure 1 and Figure 4 As shown, the connecting plate 102 in this embodiment further includes:

[0120] A retaining ring 104 is movably connected to the support plate 101 so that the retaining ring 104 can move toward and away from the polishing pad relative to the support plate 101. The retaining ring 104 is provided on one side of the connecting plate 102 and surrounds the outer side of the piezoelectric assembly 2. The retaining ring is used to constrain the square substrate within the retaining ring;

[0121] The driving member is used to drive the retaining ring 104 to move toward and away from the polishing pad.

[0122] Specifically, in this embodiment, the retaining ring 104 is mounted on the lower end of the support plate 101. The retaining ring 104 has an opening that matches the square substrate 4. The opening can accommodate the square substrate 4 and also serves as a position limiter for the square substrate 4. When applied to the polishing of the square substrate 4, the retaining ring 104 is configured as a square ring.

[0123] During the polishing process, pressure must be transmitted to the polishing pad via retaining ring 104. To this end, the polishing head in this embodiment further includes a driver that drives retaining ring 104 toward the polishing pad, thereby transmitting pressure to the polishing pad. The driver can be any structure capable of outputting linear displacement, such as an airbag assembly 103, a hydraulic cylinder assembly, etc., and is not limited to this embodiment.

[0124] To facilitate the flow of polishing liquid, Figure 4 As shown, a plurality of liquid flow grooves 1040 are provided at one end of the retaining ring 104 close to the polishing pad.

[0125] In one embodiment, to reduce the overall weight of the polishing head, as Figure 4 As shown, the driving member includes an airbag assembly 103 , a first end of the airbag assembly 103 is connected to the support plate 101 , and a second end of the airbag assembly 103 is connected to the retaining ring 104 . The retaining ring 104 is driven to move by the expansion and contraction of the airbag assembly 103 .

[0126] Specifically, in this embodiment, the airbag assembly 103 is connected between the support plate 101 and the retaining ring 104. The support plate 101 is provided with an air path connected to the airbag assembly 103. By controlling the expansion of the airbag assembly 103, the retaining ring 104 is pushed toward the polishing pad, thereby transmitting pressure to the polishing pad. By controlling the contraction of the airbag assembly 103, the retaining ring 104 is pulled away from the polishing pad, thereby releasing the square substrate 4.

[0127] When polishing a large square substrate 4, the retaining ring 104 is also large. Therefore, to ensure that the retaining ring 104 can evenly transmit pressure to the polishing pad, multiple airbag assemblies 103 are provided. These airbag assemblies 103 are arranged around the support plate 101. Taking a square retaining ring 104 as an example, at least one airbag assembly 103 can be provided on each side of the retaining ring 104, and preferably, multiple airbag assemblies 103 are provided on each side.

[0128] like Figure 10 and Figure 11 As shown, since the airbag assembly 103 needs to drive the retaining ring 104 to move by expanding and contracting, the airbag assembly 103 includes at least an airbag 1030. Furthermore, since the airbag 1030 is a flexible capsule, to facilitate connection between the airbag 1030, the support plate 101, and the retaining ring 104, the airbag assembly 103 in this embodiment further includes a first connector 1031 and a second connector 1032. The first connector 1031 and the second connector 1032 are respectively fixed to the first and second ends of the airbag 1030. The first connector 1031 is connected to the support plate 101, and the second connector 1032 is connected to the retaining ring 104.

[0129] In one embodiment, the airbag 1030 is a strip-shaped airbag. The lower end surface of the first connecting member 1031 is flat and bonded to the upper end surface of the airbag 1030. The upper end of the first connecting member 1031 is clipped or bolted to the support plate 101. The upper end surface of the second connecting member 1032 is flat and bonded to the lower end surface of the airbag 1030. The lower end of the second connecting member 1032 is clipped or bolted to the support plate 101. The pressure of the airbag 1030 is transmitted to the retaining ring 104 through the second connecting member 1032, and then transmitted to the polishing pad by the retaining ring 104.

[0130] To facilitate the connection of the airbag assembly 103 with the support plate 101 and the retaining ring 104, as shown in FIG. Figure 4 As shown, in this embodiment, a first connecting groove 8 is provided on the supporting plate 101, a second connecting groove 9 is provided on the retaining ring 104, a first connecting member 1031 is fixedly matched with the first connecting groove 8, and a second connecting member 1032 is fixedly matched with the second connecting groove 9.

[0131] Specifically, the structure of the first connecting groove 8 can be designed based on the structure of the upper end of the first connecting member 1031. Similarly, the structure of the second connecting groove 9 can be designed based on the structure of the lower end of the second connecting member 1032. In one embodiment, the upper end of the first connecting member 1031 and the lower end of the second connecting member 1032 are T-shaped, and the corresponding first connecting groove 8 and second connecting groove 9 are T-shaped grooves. The first connecting groove 8 is located along the edge of the support plate 101, while the second connecting groove 9 is located along the edge of the retaining ring 104.

[0132] To further facilitate installation and disassembly, loading ports are provided on the side of the support plate 101 and the side of the retaining ring 104, which are connected to the corresponding first connecting groove 8 and the second connecting groove 9. The first connecting member 1031 is loaded into the first connecting groove 8 through the corresponding loading port, and the second connecting member 1032 is loaded into the second connecting groove 9 through the corresponding loading port.

[0133] Specifically, in this embodiment, each first connecting slot 8 on each side of the support plate 101 is provided with an insertion opening at at least one end, or at both ends. When both ends have insertion openings, the first connecting slot 8 is a through slot. The upper end of the first connecting member 1031 can be inserted into the first connecting slot 8 through the corresponding insertion opening, and similarly, the lower end of the second connecting member 1032 can be inserted into the second connecting slot 9 through the corresponding insertion opening.

[0134] Since the retaining ring 104 needs to be driven to move by the airbag 1030, in order to facilitate the air supply to the airbag 1030, as shown in FIG. Figure 10 、 Figure 11 As shown, in this embodiment, a first air channel 10310 is provided on the first connecting member 1031. Figure 14 、 Figure 15 As shown, a second air channel 1011 is provided on the support plate 101 , the first air channel 10310 is communicated with the air bag 1030 , and the second air channel 1011 is used to communicate with a pressure control source.

[0135] Since the airbag 1030 is a flexible bag, it is not easy to limit the horizontal deviation of the retaining ring 104, which may cause the linear movement of the retaining ring 104 in the axial direction to be inaccurate. Figure 4 The polishing head in the embodiment shown further includes a guide structure 7 , a first end of the guide structure 7 is connected to the support plate 101 , and a second end of the guide structure 7 is connected to the retaining ring 104 . The guide structure 7 provides guidance for the movement of the retaining ring 104 .

[0136] Specifically, the guide structure 7 primarily serves to guide the movement of the retaining ring 104. The first end of the guide structure 7 can be fixedly connected to the support plate 101, and the second end can be movably connected to the retaining ring 104. Alternatively, the first end of the guide structure 7 can be movably connected to the support plate 101, and the second end can be fixedly connected to the retaining ring 104. Multiple guide structures 7 can be provided and spaced apart circumferentially around the support plate 101 and the retaining ring 104, thereby ensuring that the retaining ring 104 is subjected to uniform force during movement.

[0137] In one embodiment, Figure 15 and Figure 12 As shown, the guide structure 7 includes a guide shaft 70, which can be arranged between adjacent airbag assemblies 103. The support plate 101 is provided with a guide hole 1010. The upper end of the guide shaft 70 is inserted into the guide hole 1010 and can slide. The lower end of the guide shaft 70 is assembled with the second connecting groove 9 on the retaining ring 104 through the third connecting member 71. When the second connecting groove 9 is a T-slot, the third connecting member 71 includes a T-shaped connecting portion that can be assembled with the T-slot.

[0138] In the present invention, the downward movement of the polishing head proceeds as follows: before the buffer pad 3 contacts the square substrate 4, the airbag 1030 is under negative pressure, exerting an upward pull on the retaining ring 104, overcoming the influence of gravity on the retaining ring 104 and controlling the height difference between the bottom surface of the retaining ring 104 and the bottom surface of the buffer pad 3. This ensures that the retaining ring 104 preferentially contacts the polishing pad during the downward movement of the polishing head. Once the retaining ring 104 contacts the polishing pad, the negative pressure in the airbag 1030 is released, maintaining airflow to the atmosphere. The polishing head continues to move until the polishing pad contacts the square substrate 4. During this process, the airbag 1030 is squeezed by the support plate 101. Because the airbag 1030 is at the same pressure as the atmosphere, its deformation allows the support plate 101 to drive the piezoelectric assembly 2 and the buffer pad 3 downward, allowing them to continue moving. During the polishing process, air is inflated into the airbag 1030 to maintain a positive pressure, transmitting pressure to the polishing pad.

[0139] According to another aspect of the present invention, a polishing device is provided, comprising the above-mentioned polishing head.

[0140] According to another aspect of the present invention, there is provided a polishing method using the above-mentioned polishing head, the method comprising:

[0141] Divide the square substrate 4 into a plurality of polishing areas, and each polishing area corresponds to at least one piezoelectric component 2;

[0142] Determine the speed of each polishing area during the polishing process;

[0143] According to the speed of the polishing area, the input voltage of the piezoelectric component 2 is controlled to change the pressure transmitted to the polishing area by the piezoelectric component 2 so as to achieve the target material removal rate for the square substrate.

[0144] During the polishing process, the input voltage is adjusted according to the correspondence between the input voltage of the piezoelectric component 2, the speed of the area corresponding to the piezoelectric component 2 on the square substrate 4, and the material removal rate of the polishing area corresponding to the piezoelectric component 2 on the square substrate 4 to achieve the target material removal rate.

[0145] According to the speed of the polishing area, the input voltage of the piezoelectric component is controlled to change the pressure transmitted to the polishing area by the piezoelectric component, specifically:

[0146] The target material removal rate for the square substrate is achieved through the following correspondence:

[0147]

[0148] in, is the material removal rate of the polishing area corresponding to the piezoelectric component 2 on the square substrate 4, is the Preston constant, is the speed of the polishing area corresponding to the piezoelectric component 2 on the square substrate 4, is the surface area of ​​the piezoelectric material in the piezoelectric component 2, is the elastic modulus of the piezoelectric material when the electric field is zero or constant, is the input voltage of the piezoelectric component 2, is the piezoelectric constant, is the thickness of the piezoelectric material, is the surface area of ​​the pressure transmission surface 200 on the piezoelectric component 2.

[0149] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to fall within the scope of protection of the present invention.

Claims

1. A polishing head for polishing a square substrate, characterized in that: It includes: a connecting plate and a plurality of piezoelectric components; wherein, The plurality of piezoelectric components are arranged on the connecting plate and located between the connecting plate and the square substrate to be polished. The plurality of piezoelectric components are evenly covered on the square substrate in accordance with the shape of the square substrate, and the corner areas and the central area of ​​the edges of the square substrate respectively correspond to independent piezoelectric components. At least a portion of the piezoelectric components directly corresponds to a corner region of the square substrate; The piezoelectric component includes a piezoelectric layer, a first pressure plate and a connecting column. The piezoelectric layer is located between the connecting plate and the first pressure plate. The piezoelectric layer transmits pressure to the square substrate through the first pressure plate. The first end of the connecting post is fixedly connected to the first pressure plate, and the second end of the connecting post passes through the piezoelectric layer and is fixedly connected to the connecting plate. The stiffness of the first pressure plate is greater than the stiffness of the connecting post. During pressure transmission, the connecting post generates axial elastic deformation under the pressure of the piezoelectric layer to provide the displacement required for the first pressure plate to transmit pressure. The piezoelectric component has a pressure transmission surface for transmitting pressure to the square substrate. The square substrate has multiple polishing areas, and each polishing area corresponds to at least one piezoelectric component. The pressure transmission surfaces of different piezoelectric components are used to transmit pressure to different polishing areas of the square substrate. During the polishing process, the input voltage of the piezoelectric component is adjusted according to the speed of different polishing areas of the square substrate to control the pressure transmitted by the pressure transmission surface to the corresponding polishing area of ​​the square substrate, so that the square substrate achieves a target material removal rate. Specifically: The target material removal rate for the square substrate is achieved through the following correspondence: ； in, is the material removal rate of the polishing area corresponding to the piezoelectric component on the square substrate, is the Preston constant, is the speed of the polishing area on the square substrate corresponding to the piezoelectric component, is the surface area of ​​the piezoelectric material in the piezoelectric component, is the elastic modulus of the piezoelectric material when the electric field is zero or constant, is the input voltage of the piezoelectric component, is the piezoelectric constant, is the thickness of the piezoelectric material, is the surface area of ​​the pressure transmission surface on the piezoelectric component.

2. The polishing head according to claim 1, characterized in that: The plurality of piezoelectric components are arranged in a matrix in accordance with the shape of the square substrate.

3. The polishing head according to claim 1, characterized in that: The magnitude of the pre-tightening force applied by the first pressing plate to the piezoelectric layer is changed by adjusting the axial fixing position of the connecting column on the connecting plate.

4. The polishing head according to claim 1, characterized in that: The connecting column is a hollow columnar structure, and a wiring hole is provided on the connecting column. The cable connected to the piezoelectric layer enters the connecting column through the wiring hole and extends from the second end of the connecting column into the wiring space above the connecting plate.

5. The polishing head according to claim 4, characterized in that: The piezoelectric component further includes a second pressing plate, which is disposed between the connecting plate and the piezoelectric layer. The second end of the connecting column passes through the second pressing plate and is fixedly connected to the connecting plate.

6. The polishing head according to claim 1, characterized in that: It also includes a buffer pad, which is arranged between the pressure transmission surface of the piezoelectric component and the square substrate. The pressure of the pressure transmission surface is transmitted to the square substrate through the buffer pad.

7. The polishing head according to claim 6, characterized in that: The device further comprises a retaining ring, which is provided on one side of the connecting plate and is used to constrain the square substrate within the retaining ring.

8. The polishing head according to claim 7, characterized in that: The buffer pad covers the pressure transmission surfaces of the plurality of piezoelectric components, is wrapped around the piezoelectric components, and seals the ring side of the piezoelectric components and the retaining ring.

9. The polishing head according to claim 7, characterized in that: The polishing head further includes a driving member for driving the retaining ring to move toward and away from the polishing pad.

10. The polishing press head according to claim 9, characterized in that: The driving member includes an airbag assembly, which is connected to the retaining ring. The retaining ring is driven to move by the expansion and contraction of the airbag assembly.

11. The polishing head according to claim 10, characterized in that: The airbag assembly is provided in plurality, and the plurality of airbag assemblies are arranged around the retaining ring.

12. The polishing head according to claim 10, characterized in that: The airbag assembly includes an airbag, a first connecting member and a second connecting member; The first connecting member and the second connecting member are fixed to the first end and the second end of the airbag respectively, and the second connecting member is connected to the retaining ring.

13. The polishing press head according to claim 12, characterized in that: The polishing press head also includes: A support plate, the support plate being used to connect to the machine, a wiring channel being provided in the support plate, and the first connector being connected to the support plate; The connecting plate is fixed on a side of the supporting plate facing the square substrate. A wiring space is provided between the connecting plate and the supporting plate. The wiring channel is connected to the wiring space for passing the cables of the piezoelectric assembly.

14. The polishing press head according to claim 13, characterized in that: A plurality of fixing columns are provided on a side of the connecting plate facing the supporting plate, and ends of the fixing columns are fixedly connected to the supporting plate, so that the wiring space is provided between the connecting plate and the supporting plate.

15. The polishing press head according to claim 14, characterized in that: The supporting plate is provided with a first connecting groove, the retaining ring is provided with a second connecting groove, the first connecting member is fixedly matched with the first connecting groove, and the second connecting member is fixedly matched with the second connecting groove.

16. The polishing press head according to claim 15, characterized in that: The side of the support plate and the side of the retaining ring are provided with loading ports, which are connected to the corresponding first connecting groove and the second connecting groove. The first connecting member is loaded into the first connecting groove through the corresponding loading port, and the second connecting member is loaded into the second connecting groove through the corresponding loading port.

17. The polishing press head according to claim 15, characterized in that: The first connecting member is provided with a first air channel, and the supporting plate is provided with a second air channel. The first air channel is communicated with the airbag, and the second air channel is used to communicate with a pressure control source.

18. The polishing press head according to claim 15, characterized in that: The invention also includes a guide structure, wherein a first end of the guide structure is connected to the supporting plate, and a second end of the guide structure is connected to the retaining ring, and the guide structure provides a guide for the movement of the retaining ring.

19. The polishing press head according to claim 18, characterized in that: The guide structure includes a guide shaft, a third connecting member is provided at the second end of the guide shaft, the third connecting member is fixed in cooperation with the second connecting groove, a guide hole is provided on the support plate, and the upper end of the guide shaft is slidably connected to the guide hole.

20. A polishing device, characterized in that: Comprising the polishing indenter according to any one of claims 1 to 19.

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