Capsule film, polishing pressure head, equipment and method for polishing square substrate

Abstract

The invention discloses a capsule film, a polishing pressure head, equipment and a method for polishing a square substrate, the capsule film comprises a plurality of annular pressurizing cavities and a rigid force transmission piece, the annular pressurizing cavities are sequentially distributed from inside to outside, at least one annular pressurizing cavity is used for transmitting pressure to the rigid force transmission piece, the rigid force transmission piece is provided with an annular narrow end, and the annular narrow end is used for transmitting pressure to the annular narrow end; the annular narrow end is used for applying pressure on a circle, tangent to any opposite side, on the square substrate or near the circle; at least one annular pressurizing cavity is used for transmitting pressure to the area outside the circle tangent to any opposite side on the square base plate so as to independently adjust the pressure of the area where the four corners of the square base plate are located. According to the device, independent pressure control can be carried out on the four corners of the square substrate, and pressure can be transmitted to the thin and narrow edge area on the square substrate through the annular narrow end of the rigid force transmission piece, so that the material removal rate difference caused by the linear speed difference in different areas is compensated; and the material removal uniformity and the surface flatness of the square substrate are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular, to a bladder, a polishing chuck, a device and a method for polishing a square substrate. Background Art

[0002] As a chip advanced packaging technology, TGV (Through Glass Via) has been extensively researched and developed in various countries around the world. Its core material is a glass substrate, and the polishing of the glass substrate is involved in the production process. As the package becomes larger and larger, there are greater and thinner requirements for the size of the glass substrate.

[0003] However, the polishing of ultra-large and ultra-thin glass substrates (for example, glass substrates with a size specification of more than 500 mm in length, more than 500 mm in width, and a thickness between 0.5 mm and 1 mm) is still under research and development in the laboratory. Due to the extremely large size, the polishing speed difference between the edge area and the central area of the glass substrate is extremely large. Due to the ultra-thin thickness, there are extremely high requirements for the surface flatness of the glass substrate, usually at the micron level.

[0004] In the prior art, the polishing accuracy of ultra-large and ultra-thin glass substrates fails to meet the requirements of mass production. Summary of the Invention

[0005] The main object of the present invention is to provide a bladder, a polishing chuck, a device and a method for polishing a square substrate, so as to solve the problems in the related art that when polishing an ultra-large and ultra-thin square substrate, the material removal of the square substrate is uneven and the surface flatness is relatively low.

[0006] To achieve the above object, the present invention provides a bladder for polishing a square substrate, including: a plurality of annular pressure chambers and a rigid force transmission member, the plurality of annular pressure chambers are sequentially distributed from the inside to the outside, at least one of the annular pressure chambers is used to transmit pressure to the rigid force transmission member, the rigid force transmission member is provided with an annular narrow end, and the annular narrow end is used to apply pressure on a circle that is tangent to any pair of opposite sides of the square substrate or near the circle; at least one of the annular pressure chambers is used to transmit pressure to an area outside the circle that is tangent to any pair of opposite sides of the square substrate, so as to separately adjust the pressure in the areas where the four corners of the square substrate are located.

[0007] Optionally, it further includes a circular pressure chamber, the annular pressure chambers are arranged outside the circular pressure chamber, and the circular pressure chamber is used to transmit pressure to an area inside the circle that is tangent to any pair of opposite sides of the square substrate.

[0008] Optionally, the outer boundary of the annular narrow end is used to apply pressure on the largest inscribed circle of the square substrate.

[0009] Optionally, the annular pressure chamber for transmitting pressure to the rigid force transmission member is set as a force transmission pressure chamber, and the force transmission pressure chamber is farther away from the square substrate than the other annular pressure chambers.

[0010] Optionally, it further includes a membrane body, the annular pressure chamber and the rigid force transmission member are both arranged in the membrane body, and the annular narrow end transmits pressure to the square substrate through the membrane body.

[0011] Optionally, the rigid force transmission member includes a first rigid member and a second rigid member. The first rigid member is connected to the force transmission pressure chamber, the second rigid member is arranged in the annular pressure chamber adjacent to the force transmission pressure chamber, the annular narrow end is arranged on the second rigid member, and the pressure in the force transmission pressure chamber is transmitted to the second rigid member through the first rigid member.

[0012] Optionally, a part of the annular pressure chamber where the second rigid member is located is separated between the second rigid member and the square substrate.

[0013] Optionally, the second rigid member and the annular narrow end are of an integral structure, and the annular narrow end protrudes from the second rigid member.

[0014] Optionally, a first installation groove is provided at the bottom of the force transmission pressure chamber, and the first rigid member is arranged in the first installation groove.

[0015] Optionally, the first installation groove is set as an annular groove, and the first rigid member is set as annular.

[0016] Optionally, the rigid force transmission member further includes a third rigid member, and the third rigid member is located between the first rigid member and the second rigid member.

[0017] Optionally, a second installation groove is provided on the membrane body, and the third rigid member is arranged in the second installation groove.

[0018] Optionally, the second installation groove is set as an annular groove, and the third rigid member is set as annular.

[0019] Optionally, the annular pressure chamber adjacent to the force transmission pressure chamber is communicated with the second installation groove.

[0020] Optionally, the outer boundary diameter of at least one of the multiple annular pressure chambers is greater than the diameter of the largest circumscribed circle of the square substrate, and the inner boundary diameter is less than the diameter of the largest circumscribed circle of the square substrate.

[0021] Optionally, at least two of the annular pressure chambers are used to transmit pressure to the area outside the circle tangent to any pair of opposite sides on the square substrate, so as to apply independent pressures to different areas of the four corners of the square substrate.

[0022] Optionally, at least one of the annular pressure chambers is used to transfer pressure to the area within a circle tangent to any pair of opposite sides of the square substrate.

[0023] Optionally, at least one of the pressure chambers is used to transfer pressure to a carrier wafer located outside the square substrate.

[0024] Optionally, a deformable structure is provided on the side wall of the annular pressure chamber, and the deformable structure is used to provide a displacement amount by deforming during the pressurization process of the annular pressure chamber.

[0025] Optionally, the deformable structure includes an arc-shaped groove.

[0026] According to another aspect of the present invention, a polishing head is provided, including the above-mentioned bladder.

[0027] Optionally, it further includes a housing, a retaining ring, a retaining ring fixing member, and a sealing ring; The retaining ring is fixed to the lower end of the housing by the retaining ring fixing member; The bladder further includes a folded portion, and the folded portion is located at one end of the lateral extension wall away from the bottom wall. The folded portion of the outermost lateral extension wall is pressed and fixed between the retaining ring fixing member and the housing, and the remaining folded portions are pressed and fixed to the lower end surface of the housing by the sealing ring; A plurality of air channels are provided on the housing, and the air channels communicate with the corresponding pressure chambers.

[0028] According to another aspect of the present invention, a polishing device is provided, including the above-mentioned bladder, or the above-mentioned polishing head.

[0029] According to another aspect of the present invention, a polishing method is provided, using the above-mentioned bladder, or using the above-mentioned polishing head. The method includes: Arranging a carrier wafer on a polishing pad, the carrier wafer is circular, and a square hole is provided on the carrier wafer; Placing the square substrate to be polished into the square hole, and making the lower surface of the square substrate contact the polishing pad, and restricting the movement of the square substrate in the horizontal direction through the square hole; Controlling the movement of the polishing head, adjusting the position of the bladder, so that each of the annular pressure chambers on the bladder corresponds to a set area on the square substrate and the carrier wafer; Making the lower surface of the bladder fit the upper surface of the square substrate; Controlling the pressure in each of the annular pressure chambers in the bladder to adjust the pressure transmitted to different areas on the square substrate and the carrier wafer to a set value; Controlling the rotation of the polishing head and the polishing pad to polish the square substrate.

[0030] In the embodiments of the present invention, a plurality of annular pressure chambers and rigid force transmitters are provided. The plurality of annular pressure chambers are arranged in sequence from the inside to the outside. At least one annular pressure chamber is used to transmit pressure to the rigid force transmitter. The rigid force transmitter is provided with an annular narrow end, and the annular narrow end is used to apply pressure on a circle that is tangent to any pair of opposite sides of the square substrate or in the vicinity of the circle; at least one annular pressure chamber is used to transmit pressure to an area outside the circle that is tangent to any pair of opposite sides of the square substrate, so as to separately adjust the pressure in the areas where the four corners of the square substrate are located.

[0031] A plurality of annular pressure chambers are arranged in the capsule membrane. Some of the annular pressure chambers can separately transmit pressure to an area outside the circle that is tangent to any pair of opposite sides of the square substrate. In other words, there is at least one annular pressure chamber that can separately transmit pressure to the corner area of the square substrate to control the material removal rate of this area; In addition, some of the annular pressure chambers can separately transmit pressure to a narrow area where the circle tangent to any pair of opposite sides of the square substrate is located or in the narrow area near the circle. Since this area is relatively narrow, in order to achieve the transmission of pressure, a rigid force transmitter is additionally arranged, and the rigid force transmitter has an annular narrow end, and the annular narrow end is used to apply pressure to this area, so as to separately control the pressure in this area, and further separately control the material removal rate in this area.

[0032] Since the circle tangent to any pair of opposite sides of the square substrate will pass through or be close to the edge area of the square substrate, after separately controlling the pressure in the area where the circle is located or in the narrow area near the circle, the material removal rate in the edge area of the square substrate can be effectively controlled. Moreover, after setting at least one annular pressure chamber to transmit pressure to this area, the four corners of the square substrate can be separated, and the other annular pressure chambers can separately transmit pressure to the corner areas where the four corners are located.

[0033] After being set in this way, the material removal rate difference caused by the linear velocity difference between the edge area and the corner area of the square substrate relative to the inner ring area can be compensated, and the material removal uniformity and surface flatness of the square substrate can be improved; Especially when polishing a large-size ultra-thin square substrate, by separately controlling the pressure in the annular pressure chambers corresponding to the corner area and the edge area of the square substrate, the deformation caused by the self-weight of the edge of the large-size polishing head can be compensated, so as to adjust the additional pressure applied to the square substrate due to the deformation of the edge of the polishing head during the polishing process, and further improve the material removal uniformity and surface flatness of the square substrate. Description of the Drawings

[0034] The accompanying drawings, which form a part of the present invention, are used to provide a further understanding of the present invention, making other features, objectives, and advantages of the present invention more apparent. The schematic embodiments and descriptions of the present invention in the accompanying drawings are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 is a schematic cross-sectional structure diagram of a polishing chuck equipped with a bladder according to an embodiment of the present invention; Figure 2 is Figure 1 a partial structure diagram in Figure 3 a schematic structure diagram of a film body according to an embodiment of the present invention; Figure 4 is Figure 3 a partial structure diagram in Figure 5 a schematic diagram of the force on a lateral extension wall according to an embodiment of the present invention; Figure 6 a schematic diagram of the pressure area of a bladder according to an embodiment of the present invention; Figure 7 a schematic diagram of the area of a square substrate during polishing according to an embodiment of the present invention; Figure 8 a schematic diagram of the area of a square substrate during polishing according to another embodiment of the present invention; Figure 9 a schematic bottom view structure diagram of a polishing assembly according to an embodiment of the present invention; Figure 10 a schematic diagram of the force on a square substrate without a spacer according to an embodiment of the present invention; Figure 11 a schematic diagram of the force on a square substrate with a spacer according to an embodiment of the present invention; Wherein, 1. housing; 2. sealing ring; 3. retainer fixing member; 4. retainer; 5. bladder; 50. annular pressure chamber; 51. circular pressure chamber; 500. force transmission pressure chamber; 502. bottom wall; 503. lateral extension wall; 505. second installation groove; 506. first installation groove; 507. sealing ring; 508. folding portion; 509. deformable structure; 52. film body; 6. rigid force transmission member; 60. annular narrow end; 61. first rigid member; 62. second rigid member; 63. third rigid member; 9. square substrate; 90. third region; 91. second region; 92. first region; 10. spacer; 11. polishing pad. Detailed Description of the Invention

[0035] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to describe the embodiments of the present invention here.

[0037] In the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0038] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above-mentioned terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0039] In addition, terms such as "arranged", "provided with", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can also be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood according to specific circumstances.

[0040] In addition, the meaning of the term "plurality" should be two or more.

[0041] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0042] To solve the related technical problems, as Figures 1 to 4 shown, the embodiment of the present invention provides a capsule film for polishing a square substrate, including: a plurality of annular pressurizing chambers 50 and a rigid force transmission member 6, and the plurality of annular pressurizing chambers 50 are distributed in sequence from the inside to the outside. There is at least one annular pressurizing cavity 50 for transmitting pressure to the rigid force transmission member 6. The rigid force transmission member 6 is provided with an annular narrow end 60, and the annular narrow end 60 is used to apply pressure on a circle tangent to any pair of opposite sides of the square substrate 9 or near the circle. There is at least one annular pressurizing cavity 50 for transmitting pressure to an area outside the circle tangent to any pair of opposite sides of the square substrate 9, so as to individually adjust the pressure in the areas where the four corners of the square substrate 9 are located.

[0043] In this embodiment, as Figure 4 shown, the capsule membrane 5 includes a bottom wall 502 and lateral extension walls 503 surrounding the bottom wall 502. The lateral extension walls 503 are provided in multiple numbers and are sequentially distributed on the bottom wall 502 from the inside to the outside. There are annular gaps between adjacent lateral extension walls 503, and the lateral extension walls 503 and the bottom wall 502 can be integrally formed. A part of the bottom wall 502 and the adjacent lateral extension walls 503 enclose an expandable chamber, that is, the annular pressurizing cavity 50. The upper end of the annular pressurizing cavity 50 is an opening, and the number of annular pressurizing cavities 50 is determined according to the number of lateral extension walls 503. When the upper end of the capsule membrane 5 is assembled with the housing 1 of the polishing indenter, the lower end surface of the housing 1 or the pressing plate pressing the upper end of the capsule membrane 5 against the housing 1 can close the upper end opening of the annular pressurizing cavity 50, so as to change the pressure in the annular pressurizing cavity 50 by introducing a gaseous or liquid medium into the annular pressurizing cavity 50, and further change the expansion degree of the annular pressurizing cavity 50 and the pressure transmitted outward.

[0044] The multiple annular pressurizing cavities 50 formed in the above manner are sequentially distributed from the inside to the outside. The sizes of the annular pressurizing cavities 50 at different positions are different, and the corresponding areas are different, so that pressure can be transmitted to different areas. Since each annular pressurizing cavity 50 is isolated from each other, the pressure in each annular pressurizing cavity 50 can be individually controlled after configuring air paths separately communicated with each annular pressurizing cavity 50.

[0045] The areas corresponding to different annular pressurizing cavities 50 on the square substrate 9 are different. As Figure 7 shown, in this embodiment, the square substrate 9 is divided into at least three areas, namely the third area 90, the second area 91 and the first area 92. According to the shape of the square substrate 9, the third area 90 can be the area covered by the inner circle of the square substrate 9, and the edge of the third area 90 can be close to or on the largest inscribed circle of the square substrate 9. In other words, the third area 90 is a circular area, and the diameter of this area can be slightly smaller than or equal to the diameter of the largest inscribed circle of the square substrate 9.

[0046] The second region 91 is adjacent to the third region 90 and located outside the third region 90. The first region 92 is a corner region on the square substrate 9 outside the second region 91. In this embodiment, the second region 91 is a narrow region. The second region 91 can cover a circle tangent to any pair of opposite sides on the square substrate 9, or its coverage range can be set near a circle tangent to any pair of opposite sides on the square substrate 9.

[0047] In a specific implementation, the outer boundary of the third region 90 is within the largest inscribed circle of the square substrate 9. The inner boundary of the second region 91 can be within the largest inscribed circle of the square substrate 9, and the outer boundary diameter of the second region 91 can be on or within the largest inscribed circle of the square substrate 9, or on the largest tangent circle tangent to the long side.

[0048] Of course, the outer boundary of the third region 90 can be on the largest inscribed circle of the square substrate 9. Correspondingly, the inner boundary of the second region 91 can also be outside the largest inscribed circle of the square substrate 9. Correspondingly, the outer boundary of the second region 91 can be on the largest tangent circle tangent to the long side, or outside or within the largest tangent circle tangent to the long side.

[0049] In this embodiment, the positions of the inner and outer boundaries of the second region 91 are not specifically limited and can be designed according to actual needs. However, the second region 91 should satisfy that its coverage range includes a circle tangent to any pair of opposite sides on the square substrate 9 or near the circle, so that the second region 91 is narrow and close to or covers the edge central region of the square substrate 9. The second region 91 can be used to divide the four corners of the square substrate 9 to form the first region 92, and the first region 92 is outside the circle tangent to any pair of opposite sides on the square substrate 9.

[0050] Based on this, in this embodiment, at least one of the plurality of annular pressure chambers 50 is used to transfer pressure to the second region 91, that is, to transfer pressure to the circle tangent to any pair of opposite sides on the square substrate 9 or near the circle.

[0051] As Figure 7 shown, since the second region 91 is a narrow annular region, the corresponding annular pressure chamber 50 corresponding to the second region 91 will be relatively narrow, and there are other annular pressure chambers 50 on the side of the annular pressure chamber 50. Therefore, when the pressure increases, the other annular pressure chambers 50 are likely to squeeze the narrow annular pressure chamber 50 in the middle, making it difficult for the annular pressure chamber 50 to transfer pressure to the second region 91 of the square substrate 9.

[0052] For this reason, as Figure 1 and Figure 2As shown in the figure, in this embodiment, a rigid force transmission member 6 is provided, and an annular narrow end 60 is provided on the rigid force transmission member 6. The width of the annular narrow end 60 matches the width of the narrow second region 91 on the preset square substrate 9. The rigid force transmission member 6 is located between the annular pressure chamber 50 and the square substrate 9. The pressure in the annular pressure chamber 50 is first transmitted to the rigid force transmission member 6, and then the annular narrow end 60 on the rigid force transmission member 6 applies the pressure to the second region 91 of the square substrate 9. By providing the rigid force transmission member 6, it can be ensured that the pressure in the annular pressure chamber can be stably transmitted to the second region 91. In addition, after the rigid force transmission member 6 is provided between the annular pressure chamber 50 and the square substrate 9, the position of the annular pressure chamber 50 on the capsule membrane 5 can be higher, which can reduce the influence caused by other annular pressure chambers 50.

[0053] On this basis, at least one annular pressure chamber 50 located outside the above-mentioned annular pressure chamber 50 can separately transmit pressure to the first region 92 on the square substrate 9, that is, it is used to transmit pressure to the region outside the circle tangent to any pair of opposite sides of the square substrate 9. For example, Figure 7 As shown in the figure, the first region 92 is a corner region including the four corners of the square substrate 9. Therefore, the annular pressure chamber 50 can be used to separately control the pressure of the corner region of the square substrate 9.

[0054] In summary, in the present invention, a plurality of annular pressure chambers 50 are provided in the capsule membrane 5. Some of the annular pressure chambers 50 can separately transmit pressure to the region outside the circle tangent to any pair of opposite sides of the square substrate 9. In other words, there is at least one annular pressure chamber 50 that can separately transmit pressure to the corner region of the square substrate 9 to control the material removal rate of this region; In addition, some of the annular pressure chambers 50 can separately transmit pressure to the narrow region where the circle tangent to any pair of opposite sides of the square substrate 9 is located or the narrow region near the circle. Since this region is relatively narrow, in order to achieve the transmission of pressure, a rigid force transmission member 6 is additionally arranged, and the rigid force transmission member 6 has an annular narrow end 60. The annular narrow end 60 is used to apply pressure to this region, so as to separately control the pressure of this region, and then separately control the material removal rate of this region.

[0055] Since the circle tangent to any pair of opposite sides of the square substrate 9 will pass through or be close to the edge region of the square substrate 9, after separately controlling the pressure of the region where the circle is located or the narrow region near the circle, the material removal rate of the square substrate 9 in the edge region can be effectively controlled. And after setting at least one annular pressure chamber 50 to transmit pressure to this region, the four corners of the square substrate 9 can be separated, and the other annular pressure chamber 50 can separately transmit pressure to the corner regions where the four corners are located.

[0056] After such a setting, it is possible to compensate for the difference in material removal rate caused by the difference in linear velocity between the edge region and the corner region of the square substrate 9 relative to the inner ring region, and improve the material removal uniformity and surface flatness of the square substrate 9; Especially when polishing a large-sized and ultra-thin square substrate 9, by separately controlling the pressure in the annular pressure chamber 50 corresponding to the corner region and the edge region of the square substrate 9, the deformation caused by the self-weight of the edge of the large-sized polishing head can be compensated, so as to adjust the pressure additionally applied to the square substrate 9 due to the deformation of the edge of the polishing head during the polishing process, and further improve the material removal uniformity and surface flatness of the square substrate 9.

[0057] According to different setting methods of the second region 91 and the shape of the square substrate 9, the first region 92 also has different shapes.

[0058] When the square substrate 9 is a square and the outer boundary of the second region 91 is located on the largest inscribed circle on the square substrate 9, the second region 91 is a narrow annular region on the square substrate 9, and the first region 92 is four bow-shaped regions where the four corners of the square substrate 9 are located.

[0059] When the square substrate 9 is a rectangle with unequal length and width and the outer boundary of the second region 91 is located on the largest inscribed circle on the square substrate 9, the second region 91 is a narrow annular region on the square substrate 9, and the first region 92 is two symmetric bow-shaped regions on the square substrate 9 including the long side and the four corners.

[0060] When the square substrate 9 is a rectangle with unequal length and width and the outer boundary of the second region 91 is located on the largest tangent circle tangent to the long side on the square substrate 9, the second region 91 is a narrow non-integral ring region on the square substrate 9, and the first region 92 is four bow-shaped regions where the four corners of the square substrate 9 are located.

[0061] As Figure 7 shown, in the present invention, preferably, the outer boundary of the annular narrow end 60 is used to apply pressure on the largest inscribed circle of the square substrate 9, that is, the outer boundary of the annular narrow end 60 is located on the largest inscribed circle of the square substrate 9. In other words, the outer boundary of the second region corresponding to the annular narrow end 60 on the square substrate 9 is located on the largest inscribed circle of the square substrate 9. At this time, the annular narrow end 60 alone can transmit pressure to the central region of the edge of the square substrate 9, improving the polishing effect on this region.

[0062] In addition, when the annular narrow end 60 in the capsule membrane 5 is used to apply pressure near the circle tangent to any pair of opposite sides on the square substrate 9, it means that the inner boundary of the annular narrow end 60 can be located outside the circle, or the outer boundary can be located inside the circle. In other words, the outer diameter of the annular narrow end 60 can be smaller than the diameter of the circle, or the inner diameter of the annular narrow end 60 can be larger than the diameter of the circle. In this embodiment, to achieve a sufficient polishing effect, the dimensional difference between the two can float within ±10%.

[0063] Specifically, when the size specification of the square substrate 9 is 500 mm in length and width, and when the outer boundary of the annular narrow end 60 is selected within the largest inscribed circle of the square substrate 9, the diameter of the outer boundary of the annular narrow end 60 can float within -10% of the diameter of the largest inscribed circle. Similarly, when the outer boundary of the annular narrow end 60 is selected outside the largest inscribed circle of the square substrate 9, the diameter of the inner boundary of the annular narrow end 60 can float within +10% of the diameter of the largest inscribed circle.

[0064] When the length and width of the square substrate 9 are 1000 mm, and when the outer boundary of the annular narrow end 60 is selected within the largest inscribed circle of the square substrate 9, the diameter of the outer boundary of the annular narrow end 60 can float within -5% of the diameter of the largest inscribed circle. Similarly, when the outer boundary of the annular narrow end 60 is selected outside the largest inscribed circle of the square substrate 9, the diameter of the inner boundary of the annular narrow end 60 can float within +5% of the diameter of the largest inscribed circle.

[0065] For the pressure control of the third region 90 on the square substrate 9, as Figures 1 to 3 shown, a pressurizing chamber can be separately provided in the capsule membrane 5 of the present invention to control its pressure. At this time, the capsule membrane 5 in the present invention has a circular pressurizing chamber 51 in the middle, and the circular pressurizing chamber 51 is used to separately control the pressure of the circular third region 90 on the square substrate 9. Other capsule membranes 5 or pressing members can also be used to separately control the pressure of the third region 90. At this time, no additional pressurizing chamber is provided in the middle of the capsule membrane 5 in this embodiment.

[0066] In this embodiment, it is preferably to provide a circular pressurizing chamber 51 in the middle of the capsule membrane 5. The annular pressurizing chamber 50 is arranged outside the circular pressurizing chamber 51. The circular pressurizing chamber 51 is used to transmit pressure to the area (i.e., the third region 90) within the circle tangent to any pair of opposite sides on the square substrate 9.

[0067] In one implementation, as Figures 1 to 4 shown, the annular pressurizing chamber 50 for transmitting pressure to the rigid force transmission member 6 is set as a force transmission pressurizing chamber 500, and the force transmission pressurizing chamber 500 is farther away from the square substrate 9 than other annular pressurizing chambers 50.

[0068] Specifically, in this embodiment, the annular pressurizing cavity 50 for transmitting pressure to the rigid force transmission member 6 is defined as the force transmission pressurizing cavity 500. First, the axial position of the force transmission pressurizing cavity 500 is different from that of other annular pressurizing cavities 50. Its axial position is relatively far from the square substrate 9 compared to other annular pressurizing cavities 50. Specifically, it can be located at the upper part of the capsule membrane 5, such that the depth of the force transmission pressurizing cavity 500 is smaller than that of other annular pressurizing cavities 50. The rigid force transmission member 6 is disposed below the force transmission pressurizing cavity 500, between the force transmission pressurizing cavity 500 and the square substrate 9. Since the pressure of the force transmission pressurizing cavity 500 is transmitted to the square substrate 9 through the rigid force transmission member 6, the force transmission pressurizing cavity 500 only needs to be vertically corresponding to the rigid force transmission member 6. The width of the force transmission pressurizing cavity 500 can be increased, thereby reducing the pressure influence of the side annular pressurizing cavity 50 on the force transmission pressurizing cavity 500.

[0069] In one embodiment, as Figure 2 shown, the capsule membrane 5 further includes a membrane body 52. The annular pressurizing cavity 50 and the rigid force transmission member 6 are both disposed within the membrane body 52. The annular narrow end 60 transmits pressure to the square substrate 9 through the membrane body 52. Through the membrane body 52, the annular narrow end 60 can not only uniformly transmit pressure to the second region 91 on the square substrate 9, but also serve as a buffer layer to prevent the rigid annular narrow end 60 from damaging the square substrate 9 when applying pressure.

[0070] In one embodiment, to improve the stability of pressure transmission, as Figure 6 shown, the rigid force transmission member 6 includes a first rigid member 61 and a second rigid member 62. The first rigid member 61 is connected to the force transmission pressurizing cavity 500, and the second rigid member 62 is disposed within the annular pressurizing cavity 50 adjacent to the force transmission pressurizing cavity 500. The annular narrow end 60 is disposed on the second rigid member 62. The pressure within the force transmission pressurizing cavity 500 is transmitted to the second rigid member 62 through the first rigid member 61.

[0071] Specifically, in this embodiment, the rigid force transmission member 6 includes a split first rigid member 61 and a second rigid member 62. The first rigid member 61 and the second rigid member 62 are vertically corresponding but installed at different positions. The first rigid member 61 is selected to be connected to the force transmission pressurizing cavity 500. For example, it can be installed within the wall of the membrane body 52 below the force transmission pressurizing cavity 500. The second rigid member 62 is installed within one of the annular pressurizing cavities 50 adjacent to the force transmission pressurizing cavity 500, which can be within the annular pressurizing cavity 50 within the force transmission pressurizing cavity 500 or within the annular pressurizing cavity 50 outside the force transmission pressurizing cavity 500. After such a setting, in the case where the depth of the force transmission pressurizing cavity 500 is small, the combined thickness of the first rigid member 61 and the second rigid member 62 can compensate for the difference in depth between the force transmission pressurizing cavity 500 and other annular pressurizing cavities 50. At the same time, both the first rigid member 61 and the second rigid member 62 can be set to a flat structure, which is beneficial to achieving stable pressure transmission.

[0072] The annular narrow end 60 is provided on the second rigid member 62, specifically, it can be provided at the lower end of the second rigid member 62. The annular narrow end 60 and the second rigid member 62 can be of an integral structure or a split-mounted structure. For ease of assembly, an integral structure is preferably adopted. In order to transmit pressure to the square substrate 9 through the annular narrow end 60, the annular narrow end 60 protrudes from the lower end surface of the second rigid member 62.

[0073] To achieve pressure transmission to the second region 91 on the square substrate 9, it is desired that only the annular narrow end 60 presses on the square substrate 9 during the pressure transmission process. For this purpose, after the second rigid member 62 is installed in one of the annular pressure chambers 50, as Figure 6 shown, a part of the annular pressure chamber 50 is separated between the second rigid member 62 and the square substrate 9. After introducing pressurized gas into the annular pressure chamber 50, the gas can be filled below the second rigid member 62, thereby supporting the second rigid member 62, so that the second rigid member 62 does not directly apply pressure on the square substrate 9, ensuring that only the annular narrow end 60 presses on the square substrate 9.

[0074] To facilitate the installation of the first rigid member 61, as Figure 4 shown, in this embodiment, a first installation groove 506 is provided at the bottom of the force transmission pressure chamber 500, and the first rigid member 61 is disposed in the first installation groove 506. The first installation groove 506 is provided as an annular groove, and the first rigid member 61 is provided as an annular shape, so that the first rigid member 61 can uniformly transmit pressure downward.

[0075] To further improve the stability of pressure transmission, the thicknesses of the first rigid member 61 and the second rigid member 62 can be further reduced. At this time, to compensate for the depth difference between the force transmission pressure chamber 500 and other annular pressure chambers 50, a third rigid member 63 needs to be additionally provided, as Figure 2 shown, the third rigid member 63 is located between the first rigid member 61 and the second rigid member 62. The pressure in the force transmission pressure chamber 500 is transmitted to the third rigid member 63 through the first rigid member 61, then transmitted to the second rigid member 62 by the third rigid member 63, and then transmitted to the annular narrow end 60 by the second rigid member 62. Finally, the annular narrow end 60 transmits the pressure to the square substrate 9 through the membrane body 52. In this embodiment, both the first rigid member 61 and the third rigid member 63 can be provided with a flat structure, so as to provide a sufficient pressure transmission area.

[0076] As Figure 4As shown in the figure, for the convenience of installing the third rigid member 63, in this embodiment, a second installation groove 505 is provided on the film body 52, and the third rigid member 63 is disposed in the second installation groove 505. The second installation groove 505 may be located between the first installation groove 506 and the second rigid member 62. When the second rigid member 62 is disposed in the annular pressure chamber 50 inside the force transmission pressure chamber 500, the second installation groove 505 may communicate with the annular pressure chamber 50 outside the force transmission pressure chamber 500, so that the third rigid member 63 can be loaded into the second installation groove 505 through the annular pressure chamber 50. The second installation groove 505 may be set as an annular groove, and the third rigid member 63 is set as an annular shape, so as to achieve stable transmission of pressure.

[0077] In the present invention, a part of the annular pressure chamber 50 can separately transmit pressure to the area outside the circle tangent to any pair of opposite sides on the square substrate 9 (i.e., the first area 92), so as to separately adjust the pressure in the areas where the four corners of the square substrate 9 are located. On this basis, the outer boundary diameter of the annular pressure chamber 50 can be equal to or greater than the maximum circumscribed circle diameter of the square substrate 9. When they are equal, the edge of the annular pressure chamber 50 just presses on the top corner of the square substrate 9, increasing the difficulty of controlling the pressure of the opposite corners. Therefore, in this embodiment, the inner boundary diameter of at least one of the plurality of annular pressure chambers 50 is smaller than the maximum circumscribed circle diameter of the square substrate 9, and the outer boundary diameter is larger than the maximum circumscribed circle diameter of the square substrate 9.

[0078] Specifically, as Figure 8 shown, in this embodiment, the area covered by the annular pressure chamber 50 when transmitting pressure can slightly exceed the top corner when including the top corner of the square substrate 9 (i.e., the first area 92), so that the annular pressure chamber 50 can better control the pressure of the top corner of the square substrate 9.

[0079] In one embodiment, as Figure 6 and Figure 8 shown, at least two annular pressure chambers 50 are provided to transmit pressure to the area outside the circle tangent to any pair of opposite sides on the square substrate 9, so as to apply independent pressure to different areas of the four corners of the square substrate 9. That is, at least two annular pressure chambers 50 are provided to transmit pressure to the inner and outer layers of the first area 92 respectively, so as to perform more refined pressure control on the first area 92 and improve the polishing effect.

[0080] In one embodiment, when the capsule membrane 5 further includes a circular pressurizing cavity 51 and the annular pressurizing cavity 50 is arranged outside the circular pressurizing cavity 51, and when the circular pressurizing cavity 51 is used to transfer pressure to the area within the circle tangent to any pair of opposite sides on the square substrate 9, at least one annular pressurizing cavity 50 is used to transfer pressure to the area within the circle tangent to any pair of opposite sides on the square substrate 9. That is, the third area 90 of the square substrate 9 is pressurized by a circular pressurizing cavity 51 and an annular pressurizing cavity 50 together.

[0081] In one embodiment, at least one pressurizing cavity is used to transfer pressure to the spacer 10 located outside the square substrate 9.

[0082] Specifically, in one embodiment, as Figures 1 to 4 shown, the capsule membrane 5 includes five annular pressurizing cavities 50 and one circular pressurizing cavity 51, forming areas P1, P2, P3, P4, P5 and P6 as shown in Figure 6 and as Figure 8 shown. Among them, areas P1 and P2 jointly correspond to the third area 90 of the square substrate 9. Area P3 individually corresponds to the second area 91 of the square substrate 9. Areas P4 and P5 jointly correspond to the first area 92 of the square substrate 99. Area P6 can individually correspond to the spacer 10 installed outside the square substrate 9. After forming the above areas, the pressure distribution trend during polishing is: P1 > P2 > P3 > P4 > P5.

[0083] Since each annular pressurizing cavity 50 includes a lateral extension wall 503, when the pressure in the annular pressurizing cavity 50 increases, the bottom wall 502 of the annular pressurizing cavity 50 receives a downward pressure P, and the lateral extension wall 503 of the annular pressurizing cavity 50 generates an upward tensile elastic force F under the action of this downward pressure P, resulting in an upward convex deformation of the part of the bottom wall 502 of the capsule membrane 5 corresponding to the lateral extension wall 503 (as shown in Figure 5 shown), so that the bottom wall 502 of the capsule membrane 5 cannot completely fit the square substrate 9, and thus a uniform pressure cannot be generated, and the polishing effect becomes poor.

[0084] Therefore, as shown in Figure 4 shown, in this embodiment, a deformable structure 509 is provided on the side wall of the annular pressurizing cavity 50, and the deformable structure 509 is used to provide a displacement amount through deformation during the pressurization process of the annular pressurizing cavity 50.

[0085] In one embodiment, the deformable structure 509 includes an arc-shaped groove, which can be formed by bending the lateral extension wall 503. During the downward pressing movement of the capsule membrane 5, the groove expands to provide a displacement amount for the non-bent part on the side wall.

[0086] To facilitate the sealing of each annular pressurizing chamber 50 when the capsule film 5 is installed on the housing 1 of the polishing head, in this embodiment, a plurality of sealing rings 507 are provided at one end of the capsule film 5 away from the square substrate 9. The plurality of sealing rings 507 correspond to the plurality of annular pressurizing chambers 50 respectively. The sealing ring 507 is adapted to the housing 1 of the polishing head and seals the corresponding annular pressurizing chamber 50.

[0087] According to another aspect of the present invention, there is provided a polishing head including the above-mentioned capsule film 5. Specifically, as Figure 1 and Figure 2 shown, the polishing head may further include a housing 1, a retaining ring 4, a retaining ring fixing member 3 and a sealing ring 2; the retaining ring 4 is fixed to the lower end of the housing 1 through the retaining ring fixing member 3; the outermost folding portion 508 of the plurality of capsule films 5 is pressed and fixed between the retaining ring fixing member 3 and the housing 1, and the remaining folding portions 508 are pressed and fixed to the lower end surface of the housing 1 through the sealing ring 2. A plurality of air channels are provided on the housing 1, and the air channels communicate with the corresponding annular pressurizing chambers 50.

[0088] In this embodiment, the upper end of the housing 1 is used to connect with the machine tool equipment. The retaining ring fixing member 3 is fixed to the lower end of the housing 1 and can be fixed to the housing 1 by screws. The retaining ring 4 is fixed to the lower end of the retaining ring fixing member 3 and can be fixed by bonding. The retaining ring 4 can be a circular ring, and the capsule film 5 is installed in the retaining ring 4 and fixedly connected to the lower end surface of the housing 1. The folding portion 508 on each lateral extension wall 503 needs to be fixed to the housing 1 to seal the corresponding annular pressurizing chamber 50. To save components, in this embodiment, for the outermost folding portion 508, it can be pressed against the housing 1 by the retaining ring fixing member 3, and the remaining folding portions 508 can be pressed and fixed to the housing 1 by the corresponding sealing ring 2.

[0089] Further, a folding portion 508 is provided at the upper end of each lateral extension wall 503. The folding portion 508 is located at one end of the lateral extension wall 503 away from the bottom wall 502. When installed, the outermost folding portion 508 of the plurality of capsule films 5 is pressed and fixed between the retaining ring fixing member 3 and the housing 1, and the remaining folding portions 508 are pressed and fixed to the lower end surface of the housing 1 through the sealing ring 2.

[0090] According to another aspect of the present invention, there is provided a polishing assembly, as Figure 9 shown, including the above-mentioned polishing head and a companion wafer 10. The companion wafer 10 is provided as a circle, and a square hole is provided on the companion wafer 10. The square hole is used to accommodate the square substrate 9, and the capsule film 5 transmits pressure to the companion wafer 10 through at least one annular pressurizing chamber 50.

[0091] The companion wafer 10 in this embodiment is applied to a circular polishing head. The size of the square hole on the companion wafer 10 is 1 mm larger than that of the square substrate 9, and the thickness is the same as that of the square substrate 9. Figure 10When there is no carrier sheet 10, the stress state of the square substrate 9 is as follows. After the chamber is pressurized, the bladder 5 will contact the polishing pad 11 and the square substrate 9 and generate a pressure P. It can be seen that due to the thickness of the square substrate 9, the deformation of the bladder 5 is uneven, and a space area will be formed among the bladder 5, the polishing pad 11, and the square substrate 9, which will cause a bending moment M around point O at the edge of the square substrate 9. This bending moment will cause additional pressure and slight warping at the edge of the square substrate 9, resulting in additional material removal, especially in the right-angle cusp area of the square substrate 9, where the polishing removal amount is larger.

[0092] As Figure 11 As shown in the schematic diagram after adding the carrier sheet 10, it can be seen that after adding the carrier sheet 10, the pressure distribution is uniform, so no additional bending moment will be generated, and a better polishing effect can be obtained. In addition, the carrier sheet 10 can limit the movement of the square substrate 9 and confine the square substrate 9 within the central area of the bladder 5. The carrier sheet 10 can prevent the bladder 5 from contacting the polishing pad 11 and damaging the bladder 5 during the polishing process.

[0093] According to another aspect of the present invention, there is provided a polishing device, including the above-mentioned bladder 5, or the above-mentioned bladder assembly, or the above-mentioned polishing head, or the above-mentioned polishing assembly.

[0094] According to another aspect of the present invention, there is provided a polishing method, using the above-mentioned bladder 5, or using the above-mentioned polishing head. The method includes: Arrange the carrier sheet 10 on the polishing pad 11. The carrier sheet 10 is circular and has a square hole provided thereon; Place the square substrate 9 to be polished into the square hole, and make the lower surface of the square substrate 9 contact the polishing pad 11 to limit the movement of the square substrate 9 in the horizontal direction through the square hole; Control the movement of the polishing head, adjust the position of the bladder 5, so that each annular pressure chamber 50 on the bladder 5 corresponds to the set area on the square substrate 9 and the carrier sheet 10; Make the lower surface of the bladder 5 fit with the upper surface of the square substrate 9; Control the pressure in each annular pressure chamber 50 in the bladder 5 to adjust the pressure transmitted to different areas on the square substrate 9 and the carrier sheet 10 to the set value; Control the rotation of the polishing head and the polishing pad 11 to polish the square substrate 9.

[0095] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A bladder film for polishing a square substrate, characterized in that, Comprising: A plurality of annular pressure chambers and a rigid force transmission member, the plurality of annular pressure chambers are distributed in sequence from the inside to the outside, At least one of the annular pressure chambers is used to transmit pressure to the rigid force transmission member, the rigid force transmission member is provided with an annular narrow end, and the annular narrow end is used to apply pressure on a circle tangent to any pair of opposite sides of the square substrate or near the circle; At least one of the annular pressure chambers is used to transmit pressure to an area outside the circle tangent to any pair of opposite sides of the square substrate, so as to independently adjust the pressure in the areas where the four corners of the square substrate are located.

2. The bladder film for polishing a square substrate according to claim 1, characterized in that, It further includes a circular pressure chamber, the annular pressure chamber is arranged outside the circular pressure chamber, and the circular pressure chamber is used to transmit pressure to an area within the circle tangent to any pair of opposite sides of the square substrate.

3. The bladder film for polishing a square substrate according to claim 1, characterized in that, The outer boundary of the annular narrow end is used to apply pressure on the largest inscribed circle of the square substrate.

4. The bladder film for polishing a square substrate according to claim 1, characterized in that, The annular pressure chamber for transmitting pressure to the rigid force transmission member is set as a force transmission and pressure application chamber, and the force transmission and pressure application chamber is farther away from the square substrate than the other annular pressure chambers.

5. The bladder film for polishing a square substrate according to claim 4, characterized in that, It further includes a membrane body, the annular pressure chamber and the rigid force transmission member are both arranged in the membrane body, and the annular narrow end transmits pressure to the square substrate through the membrane body.

6. The bladder film for polishing a square substrate according to claim 5, characterized in that, The rigid force transmission member includes a first rigid member and a second rigid member, the first rigid member is connected to the force transmission and pressure application chamber, the second rigid member is arranged in the annular pressure chamber adjacent to the force transmission and pressure application chamber, the annular narrow end is arranged on the second rigid member, and the pressure in the force transmission and pressure application chamber is transmitted to the second rigid member through the first rigid member.

7. The bladder film for polishing a square substrate according to claim 6, wherein, A part of the annular pressure chamber where the second rigid member is located is separated between the second rigid member and the square substrate.

8. The bladder film for square substrate polishing according to claim 7, characterized in that, The second rigid member and the annular narrow end are of an integral structure, and the annular narrow end protrudes from the second rigid member.

9. The bladder film for polishing a square substrate according to claim 6, wherein, The bottom of the force transmission and pressure application chamber is provided with a first installation groove, and the first rigid member is arranged in the first installation groove.

10. The bladder film for polishing a square substrate according to claim 9, wherein, The first installation groove is set as an annular groove, and the first rigid member is set as annular.

11. The bladder film for polishing a square substrate according to claim 6, wherein, The rigid force transmission member further includes a third rigid member, and the third rigid member is located between the first rigid member and the second rigid member.

12. The bladder film for polishing a square substrate according to claim 11, wherein, The membrane body is provided with a second installation groove, and the third rigid member is arranged in the second installation groove.

13. The bladder film for polishing a square substrate according to claim 12, characterized in that, The second installation groove is set as an annular groove, and the third rigid member is set as annular.

14. The bladder film for polishing a square substrate according to claim 13, wherein, The annular pressure chamber adjacent to the force transmission and pressure application chamber communicates with the second installation groove.

15. The bladder film for polishing a square substrate according to claim 1, wherein, The outer boundary diameter of at least one of the plurality of annular pressure chambers is greater than the diameter of the largest circumscribed circle of the square substrate, and the inner boundary diameter is less than the diameter of the largest circumscribed circle of the square substrate.

16. The bladder film for polishing a square substrate according to claim 1, characterized in that, At least two of the annular pressure chambers are used to transmit pressure to an area outside the circle tangent to any pair of opposite sides of the square substrate, so as to apply independent pressures to different areas of the four corners of the square substrate.

17. The bladder film for polishing a square substrate according to claim 2, wherein, At least one of the annular pressure chambers is used to transmit pressure to an area within the circle tangent to any pair of opposite sides of the square substrate.

18. The bladder film for polishing a square substrate according to claim 1, wherein, At least one of the pressure chambers is used to transmit pressure to a spacer located outside the square substrate.

19. The bladder film for square substrate polishing according to claim 1, wherein, A deformable structure is provided on the side wall of the annular pressurizing cavity, and the deformable structure is used to provide a displacement amount through deformation during the pressurization process of the annular pressurizing cavity.

20. The bladder film for square substrate polishing according to claim 19, characterized in that, The deformable structure includes an arc-shaped groove.

21. A polishing indenter, characterized in that, It includes the capsule according to any one of claims 1 to 20.

22. The polishing head according to claim 21, wherein, It further includes a housing, a retaining ring, a retaining ring fixing member, and a sealing ring; The retaining ring is fixed to the lower end of the housing through the retaining ring fixing member; The capsule further includes a folded portion, the folded portion is located at one end of the lateral extension wall of the capsule away from the bottom wall, and the folded portion of the outermost lateral extension wall is pressed and fixed between the retaining ring fixing member and the housing, and the remaining folded portions are pressed and fixed to the lower end surface of the housing through the sealing ring; A plurality of air channels are provided on the housing, and the air channels communicate with the corresponding pressurizing cavities.

23. A polishing device, characterized in that, It includes the capsule according to any one of claims 1 to 20, or the polishing head according to claim 21 or 22.

24. A polishing method, characterized in that, Using the capsule according to any one of claims 1 to 20, or using the polishing head according to claim 21 or 22, the method includes: Arranging a spacer on the polishing pad, the spacer is circular, and a square hole is provided on the spacer; Placing the square substrate to be polished in the square hole, and making the lower surface of the square substrate contact the polishing pad, and restricting the movement of the square substrate in the horizontal direction through the square hole; Controlling the movement of the polishing head, adjusting the position of the capsule, so that each of the annular pressurizing cavities on the capsule corresponds to the set area on the square substrate and the spacer; Making the lower surface of the capsule fit with the upper surface of the square substrate; Controlling the pressure in each of the annular pressurizing cavities in the capsule to adjust the pressure transmitted to different areas on the square substrate and the spacer to a set value; Controlling the rotation of the polishing head and the polishing pad to polish the square substrate.

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