Device and method for breaking wafers without cutting through the groove during slicing

Abstract

The present invention discloses a device and method for breaking the grooves that are not cut through when wafers are cut, belonging to the field of wafer cutting technology. The device includes a bracket and a cylindrical roller arranged on the bracket. When used, the process film attached to the back of the wafer is wrapped around a part of the outer surface of the roller, with the wafer facing outward, so that the two adjacent chips wrapped around the outer surface of the roller are broken along the groove that is not cut through between the two chips. A narrow opening with an axial length direction and a radial depth direction is provided on the roller. A narrow and radially retractable tongue is provided in the narrow opening. The outer side of the tongue is a narrow convex blade. When the groove on the wafer is located at the mouth of the narrow opening, the tongue extends outward, and its convex blade pushes the process film at the groove outward, so that the fold angle between the chips on both sides of the groove becomes smaller, thereby breaking the groove. Its advantage is that it can quickly and completely break all the grooves that are not cut through on the entire wafer.

Description

Technical Field

[0001] The invention relates to a device and a method for breaking a wafer without cutting through a groove during wafer slicing, belonging to the technical field of wafer cutting. Background Art

[0002] The early processing of the chip, that is, all processing procedures before packaging (including packaging) are completed on an entire wafer. There are multiple chips arranged vertically and horizontally on a wafer. The chip is round. The number of chips processed on a wafer with a diameter of 300mm depends on the size of the chip, ranging from hundreds to tens of thousands.

[0003] After chip packaging is completed on the wafer, it is necessary to perform slicing along the gaps between adjacent rows and columns of the chip to obtain individual chips. Before slicing, the wafer is pasted on a circular process film. A hard ring is pasted on the edge of the film to fix the film and wafer on the cutting equipment. The cutting method is generally to use a high-speed rotating circular cutter or laser cutting. Due to the equipment itself or equipment adjustment and the high cutting accuracy requirements, the above cutting often results in incomplete cutting. Only the cutting grooves left after cutting are left between adjacent rows and / or adjacent columns. The chips between adjacent rows and / or adjacent columns are still connected together through the bottom of the groove.

[0004] The traditional solution to this problem is to push upward with your fingers on the bottom surface of the film, creating a V-shaped sharp angle between two adjacent rows or columns of chips, thereby completely breaking the chips along the cut groove. However, due to the small size and large number of chips, even after one or more manual attempts, the remaining unbroken chips may still be scattered across multiple areas, resulting in incomplete treatment and low efficiency. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: how to quickly and completely break the incomplete groove on the wafer so as to separate the two chips located on both sides of the groove.

[0006] In view of the above problems, the technical solution proposed by the present invention is:

[0007] A device for breaking the incomplete cut grooves during wafer slicing, comprising a bracket and a cylindrical roller mounted on the bracket. When in use, a process film attached to the back of the wafer is wrapped around a portion of the outer surface of the roller, with the wafer facing outward, so that two adjacent chips wrapped around the outer surface of the roller are broken by forming an angle along the incomplete cut groove between the two chips.

[0008] The roller is provided with a narrow opening with an axial length direction and a radial depth direction. A narrow radially retractable tongue is provided in the narrow opening, and the outer side of the tongue is a narrow convex blade. When the groove on the wafer is located at the mouth of the narrow opening, the tongue extends outward, and its convex blade pushes the process film at the groove outward, so that the angle between the chips on both sides of the groove becomes smaller and the groove is broken.

[0009] The roller is composed of a cylindrical roller sleeve with a tube hole on the outside and a shaft sleeved in the tube hole. The narrow opening is provided on the roller sleeve and communicates with the tube hole. There is a gap of one between the outer circumference of the shaft and the inner wall of the roller sleeve tube hole. After the tongue piece retracts centripetally, its inner side is located in the gap of one and its outer side is located in the narrow opening within the outer circumference of the roller sleeve. The shaft is provided with an ejector for ejecting the tongue piece radially outward.

[0010] The ejector is a guide ridge provided on the surface of the shaft, and the guide ridge has a tangential guide surface and a cliff surface relative to the shaft. One side of the tangential guide surface starts from the surface of the shaft, and the other side reaches the top of the guide ridge. The top of the guide ridge is close to the inner wall of the tube hole of the rolling sleeve. One end of the cliff surface intersects with the tangential guide surface at the top of the ridge, and the other end is radially connected to the surface of the shaft. When the rolling sleeve rotates relative to the shaft along the tangential guide surface toward the cliff surface, the inner side surface of a tongue piece located inside the gap 1 can slide along the tangential guide surface to the top of the guide ridge, so that the tongue piece extends. When the rolling sleeve continues to roll, the inner side surface of the tongue piece located at the top of the ridge separates from the top of the ridge under the action of external force and slides radially along the cliff surface, so that the tongue piece falls back.

[0011] There are multiple narrow openings, which are arranged at equal intervals along the circumference of the roller sleeve. The spacing between adjacent narrow openings is equal to the spacing of the grooves on the wafer. The shaft is fixed, and bearings are respectively provided between the two ends of the roller sleeve and the shaft. The roller is arranged horizontally, and there is only one ejector, which is provided on the upper surface of the shaft.

[0012] A plurality of fixed-distance transmission hanging nails are respectively provided at both ends of the outer circumference of the rolling sleeve. The number of the fixed-distance transmission hanging nails is equal to the number of the narrow and long openings, and the fixed-distance transmission hanging nails are provided on the rolling sleeve between two adjacent narrow and long openings.

[0013] The tongue is made of a material that can be attracted by magnetism, and a C-shaped permanent magnet with its opening facing upward is provided below the shaft. At least when the outer port of the narrow mouth is lower than the inner port, the tongue in the narrow mouth is subjected to the magnetic attraction of the C-shaped permanent magnet, which is used to prevent the tongue from sliding out of the narrow mouth.

[0014] Limiting platforms for limiting the retraction of the tongue are provided at both ends of the narrow mouth. Limiting protrusions protruding along the length direction are provided at both ends of the tongue. When the tongue retracts centripetally, it stops at the contact between the limiting protrusion and the limiting platform. When the limiting protrusion contacts the limiting platform, there is a gap between the inner side surface of the tongue and the surface of the shaft.

[0015] A method for breaking an uncut groove using the above-mentioned device: a positioning mat with no stretching elasticity but capable of deformation is prepared, a row of positioning holes is provided on the left and right sides and the front and back sides of the positioning mat, the spacing between adjacent positioning holes in a row of positioning holes being equal to the spacing between fixed-distance transmission pegs on a corresponding device being used, and longitudinal positioning marks and transverse positioning marks corresponding to the longitudinal and transverse grooves of the wafer are provided on the positioning mat;

[0016] Using the device and the positioning cloth to break the uncut groove includes the following steps:

[0017] S1. Paste the process film and wafer together with the longitudinal and transverse positioning marks on the positioning mat;

[0018] S2. Wrap the positioning cloth obtained in step S1 in an arc shape around the upper surface of the roller sleeve of the corresponding device, with the side with the wafer facing outward, so that some of the positioning holes in the left row of positioning holes and some of the positioning holes in the right row of positioning holes are respectively placed on the corresponding fixed-distance transmission pegs on the left and right sides of the roller sleeve;

[0019] S3. Apply downward oblique pulling force to the front and back sides of the positioning cloth at the same time, and control the magnitude of the pulling force on both sides to make the roller rotate in the specified direction. The positioning cloth moves from one side to the other side on the roller, completing the breaking of all the transverse grooves.

[0020] S4. Rotate the positioning cloth 90 degrees and place it in an arc shape on the upper surface of the roller sleeve of the corresponding device, with the side with the wafer facing outward, so that some of the positioning holes in the front row of positioning holes and some of the positioning holes in the rear row of positioning holes are respectively placed on the corresponding fixed-distance transmission pegs on the left and right sides of the roller sleeve;

[0021] S5. Apply downward oblique pulling force to the left and right sides of the positioning cloth at the same time, and control the magnitude of the pulling force on both sides to make the roller sleeve rotate in the specified direction. The positioning cloth moves from one side to the other side on the roller sleeve, completing the breaking of all longitudinal grooves.

[0022] S6. Remove the positioning pad and start the process of peeling the chip from the process film.

[0023] The positioning mat is a fiber cloth that can withstand high temperatures above 65°C. In step S1, the process film and the positioning mat are bonded together with hot melt adhesive. After the chip is separated from the process film, the process film and the positioning mat are hot melt glued at high temperature to debond the positioning mat and reuse it.

[0024] Beneficial effects: It can quickly and completely break all the uncut grooves on the entire wafer; the setting is simple and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of a three-dimensional device for breaking a wafer without cutting through a groove during dicing according to the first embodiment;

[0026] Figure 2 This is a three-dimensional schematic diagram of the device according to the first embodiment when the wafer is broken without being cut through the groove during slicing;

[0027] Figure 3 A perspective schematic diagram of the device for breaking a wafer without cutting through the cut groove during dicing according to the second embodiment;

[0028] Figure 4 This is a three-dimensional schematic diagram of the rolling sleeve described in Example 2;

[0029] Figure 5 for Figure 4 A partial schematic diagram of

[0030] Figure 6 This is a three-dimensional schematic diagram of the tongue piece described in Example 2;

[0031] Figure 7 This is a three-dimensional schematic diagram of the shaft and its bearing described in Example 2;

[0032] Figure 8 is a schematic cross-sectional view of the roller described in Example 2;

[0033] Figure 9 is a schematic cross-sectional view of the roller according to the second embodiment, showing the tongue ready for assembly;

[0034] Figure 10 is a schematic transverse cross-sectional view of the roller according to the second embodiment, in which the tongue is not assembled;

[0035] Figure 11 is a schematic transverse cross-sectional view of the roller described in Example 2;

[0036] Figure 12 for Figure 11 A partial schematic diagram, in which arrow A represents the direction of rotation of the roller sleeve;

[0037] Figure 13 This is a three-dimensional schematic diagram of the positioning cloth described in Example 3;

[0038] Figure 14 This is a top view schematic diagram of the process film and wafer attached to the positioning cloth according to the third embodiment;

[0039] Figure 15 This is a three-dimensional schematic diagram of the method of Example 3 for causing a wafer to be broken without being cut through during slicing. In the figure, arrow F1 represents the magnitude and direction of the tension applied to the front end of the positioning cloth, and arrow F2 represents the magnitude and direction of the tension applied to the rear end of the positioning cloth. F1>F2. Arrow A represents the direction of rotation of the roller sleeve.

[0040] Figure 16 for Figure 15 A partial schematic diagram of

[0041] Figure 17 This is a three-dimensional schematic diagram of the wafer being bonded to the process film before it is scribed and broken.

[0042] In the figure: 1. bracket; 2. roller; 20. gap one; 21. roller sleeve; 211. narrow mouth; 212. limit platform; 22. shaft; 23. bearing; 3. guide ridge; 30. ridge top; 31. tangential guide surface; 32. cliff surface; 4. tongue; 40. gap two; 41. convex edge; 42. limit convex; 5. fixed distance transmission peg; 6. C-shaped permanent magnet; 7. positioning pad; 70. positioning hole; 71. longitudinal positioning mark; 72. transverse positioning mark; 8. wafer; 80. slot; 81. chip; 9. process film; 10. hard ring. DETAILED DESCRIPTION

[0043] The present invention will be further described below with reference to the embodiments and accompanying drawings:

[0044] Example 1: Figure 1 、 2 Shown and see Figure 17 A device for breaking uncut grooves during wafer slicing comprises a support 1 and a cylindrical roller 2 mounted on the support 1. During use, a process film 9 attached to the back of a wafer 8 is wrapped around a portion of the outer surface of the roller 2, with the wafer 8 facing outward. The curved outer surface of the roller 2 causes adjacent chips 81 wrapped around the outer surface of the roller 2 to form a fold along the uncut groove 80 between the two chips 81, thereby breaking the adjacent chips 81. For wafers 8 with larger chips 81, the roller 2 simply rolls or repeatedly rolls on the process film 9 on the back of the wafer 8, forcing all adjacent chips 81 to form a fold along the uncut groove 80 between the two chips 81 as they pass through the curved outer surface of the wrapping area, thereby breaking the adjacent chips 81. After breaking all the grooves 80 in one direction (longitudinal or transverse), the process film is rotated 90 degrees and the above operation is repeated to break all the grooves 80 in the other direction (longitudinal or transverse), thereby quickly and completely breaking all the uncut grooves 80 on the wafer.

[0045] Embodiment 2: This is a further improvement of the aforementioned embodiment 1. This embodiment is suitable for wafers with smaller chip sizes. Because when the chips are smaller, the angle formed by the slot 80 between two adjacent chips 81 along the curved surface of the wrapping area is large, or almost invisible, which may prevent the slot 80 from breaking. In particular, if an adjacent slot 80 breaks, the slot 80 is more likely to remain intact. Therefore, this embodiment continues with the following configuration.

[0046] like Figure 3 —12 shown and see Figure 15 、 16 , 17. A narrow opening 211 is provided on the roller 2, with the length direction being axial and the depth direction being radial. A narrow radially retractable tongue 4 is provided in the narrow opening 211, and the outer side surface of the tongue 4 is a narrow convex blade 41. When the groove 80 on the wafer 8 is located at the mouth of the narrow opening 211, the tongue 4 extends outward, and the convex blade 41 thereof pushes the process film 9 at the groove 80 outward, so that the angle between the chips 81 on both sides of the groove 80 becomes smaller, thereby breaking the groove 80.

[0047] Furthermore, the roller 2 is composed of a cylindrical roller sleeve 21 with a tube hole on the outside and a shaft 22 sleeved in the tube hole. A narrow opening 211 is provided on the roller sleeve 21 and communicates with the tube hole. There is a gap 20 between the outer peripheral surface of the shaft 22 and the inner wall of the tube hole of the roller sleeve 21. After the tongue 4 retracts centripetally, its inner side is located in the gap 20, and its outer side is located in the narrow opening 211 within the outer peripheral surface of the roller sleeve 21; the shaft 22 is provided with an ejector for ejecting the tongue 4 radially outward.

[0048] like Figure 7 、 11 As shown in Figure 12, as a preference, the ejector is a guide ridge 3 provided on the surface of the shaft 22, the guide ridge 3 having a tangential guide surface 31 and a cliff surface 32 relative to the shaft 22, one side of the tangential guide surface 31 starts from the surface of the shaft 22, and the other side reaches the ridge top 30 of the guide ridge 3, the ridge top 30 of the guide ridge 3 is close to the inner wall of the tube hole of the roller sleeve 21, one end of the cliff surface 32 intersects with the ridge top 30 and the tangential guide surface 31, and the other end is radially connected to the surface of the shaft 22. When the roller sleeve 21 When the roller sleeve 21 rotates relative to the shaft 22 along the tangential guide surface 31 toward the cliff surface 32, the inner side surface of a tongue piece 4 located inside the gap 1 20 can slide along the tangential guide surface 31 to the ridge top 30 of the guide ridge 3, so that the tongue piece 4 extends out. When the roller sleeve 21 continues to roll, the inner side surface of the tongue piece 4 located at the ridge top 30 separates from the ridge top 30 and slides radially along the cliff surface 32 under the action of external force, causing the tongue piece 4 to fall back, and the following tongue piece 4 begins to enter the tangential guide surface 31 of the guide ridge 3.

[0049] like Figure 4 、 5As shown in Figures 10 and 11 , there are multiple slits 211, spaced evenly along the circumference of the roller sleeve 21. The spacing between adjacent slits 211 is equal to the spacing between the slots 80 on the wafer 8. The shaft 22 is fixed, with bearings 23 positioned between each end of the roller sleeve 21 and the shaft 22. The roller 2 is positioned horizontally, and there is only one ejector (guide ridge 3) located on the upper surface of the shaft 22. This ensures that only one tongue 4 above the roller sleeve 21 rises upward at any one time. When the wafer 8 on the process film 9 has a slot 80 parallel to the axis of the roller 2, located above the slit 211, and the process film 9 moves synchronously with the roller sleeve 21 on its upper surface, each slit 211 that rotates with the roller sleeve 21 will accurately correspond to a slot 80 on the wafer 8 above it. This allows the tongue 4 extending from the slit 211 to push up against the slot 80, causing it to break.

[0050] A number of fixed-distance transmission pegs 5 are provided at both ends of the outer periphery of the roller sleeve 21. The number of these fixed-distance transmission pegs 5 is equal to the number of the slits 211, and they are located on the roller sleeve 21 between adjacent slits 211. During use, the process film 9 is attached to a flexible but non-stretchable cloth, paper, or film. Holes corresponding to the fixed-distance transmission pegs 5 are punched in the edge of the cloth, paper, or film. These holes are then fitted over the fixed-distance transmission pegs 5, and the cloth, paper, or film is pulled to cause the roller sleeve 21 to rotate synchronously.

[0051] like Figure 7 、 10 As shown in Figures 1 and 11, the tongue 4 is made of a material that can be attracted by magnets. A C-shaped permanent magnet 6 with its opening facing upward is provided below the shaft 22. At least when the outer end of the narrow opening 211 is lower than the inner end, the tongue 4 in the narrow opening 211 is subjected to the magnetic attraction of the C-shaped permanent magnet 6, which prevents the tongue 4 from sliding out of the narrow opening 211. In this way, when all the narrow openings 211 rotate to the upper area of ​​the roller sleeve 21, the tongue 4 retracts by gravity. When the narrow opening 211 rotates to a nearly horizontal state, that is, to the area outside the C-shaped permanent magnet 6, it begins to be subjected to the magnetic attraction of the C-shaped permanent magnet 6, ensuring that the retracted tongue 4 will not slide out under the action of gravity when the outer end of the narrow opening 211 is lower than the inner end. The C-shaped permanent magnet 6 is opened upward, so that the tongue 4 can get rid of the magnetic attraction of the C-shaped permanent magnet 6 when it is located above the rolling sleeve 21, making it easier for the guide ridge 3 to push the tongue 4 upward. At the same time, the tongue 24 in this opening area can automatically retract centripetally due to gravity.

[0052] like Figure 5 、 6As shown in Figures 8 and 9, further, limit platforms 212 for limiting the retraction of the tongue piece 4 are provided at both ends of the narrow opening 211. Limiting protrusions 42 protruding along the length direction are provided at both ends of the tongue piece 4. When the tongue piece 4 retracts centripetally, it stops at the contact between the limiting protrusions 42 and the limit platforms 212. When the limiting protrusions 42 contact the limit platforms 212, a gap 40 is formed between the inner side surface of the tongue piece 4 and the surface of the shaft 22. In this way, it is ensured that, except for the tongue piece 4 that is currently extending and is in sliding contact with the tangential guide surface 31 of the guide ridge 3, all other tongue pieces 4 do not contact the shaft 22, thereby avoiding the formation of frictional resistance that hinders the rotation of the roller sleeve 21, allowing the roller sleeve 21 to rotate smoothly. At the same time, noise caused by the sliding contact between the tongue piece 4 and the shaft 22 is avoided.

[0053] like Figure 3 、 7 As shown, in this embodiment, chips 81 of different specifications use rollers 2 with different spacings between the fixed-distance transmission nails 5, and the rollers 2 are replaceably arranged on the bracket 1.

[0054] Example 3: Figure 13 —16 and see Figure 17 A method for breaking an uncut groove using the device described in Example 2 is to make a positioning pad 7 that has no tensile elasticity but can be flexibly deformed, and set a row of positioning holes 70 on the left and right sides and the front and back sides of the positioning pad 7. In a row of positioning holes 70, the spacing between two adjacent positioning holes 70 is equal to the spacing of the fixed-distance transmission nails 5 on the corresponding device used, and longitudinal positioning marks 71 and transverse positioning marks 72 corresponding to the longitudinal grooves 80 and transverse grooves 80 of the wafer 8 are set on the positioning pad 7.

[0055] Using the device and the positioning cloth 7 to break the uncut groove 80 includes the following steps:

[0056] S1, remove the hard ring 10 on the process film 9, align the process film 9 and the wafer 8 with the longitudinal positioning mark 71 and the transverse positioning mark 72 on the positioning cloth 7 and stick them on the positioning cloth 7;

[0057] S2. Wrap the positioning cloth 7 obtained in step S1 in an arc shape around the upper surface of the roller sleeve 21 of the corresponding device, with the side with the wafer 8 facing outward, so that part of the positioning holes 70 in the left row of positioning holes 70 and part of the positioning holes 70 in the right row of positioning holes 70 are respectively placed on the corresponding fixed-distance transmission pegs 5 on the left and right sides of the roller sleeve 21;

[0058] S3. Apply downward oblique pulling force to the front and rear sides of the positioning cloth 7 at the same time, and control the magnitude of the pulling force on both sides to rotate the roller sleeve 21 in a specified direction. The positioning cloth 7 moves from one side to the other side on the roller sleeve 21, completing the breaking of all the transverse grooves 80.

[0059] In this step, whenever a transverse groove 80 passes over a narrow opening 211 from which a tongue 4 extends, the transverse groove 80 is lifted up and broken by the extended tongue 4.

[0060] This step can be found in detail in Figure 15 、 16 , Figure 15 The middle arrow F1 represents the magnitude and direction of the tension on the front end of the positioning cloth, and the arrow F2 represents the magnitude and direction of the tension on the rear end of the positioning cloth. F1>F2, and the arrow A represents the direction of rotation of the roller sleeve;

[0061] S4. Rotate the positioning cloth 7 90 degrees and place it in an arc shape on the upper surface of the roller sleeve 21 of the corresponding device, with the side with the wafer 8 facing outward, so that part of the positioning holes 70 in the front row of positioning holes 70 and part of the positioning holes 70 in the rear row of positioning holes 70 are respectively placed on the corresponding fixed-distance transmission pegs 5 on the left and right sides of the roller sleeve 21;

[0062] S5. Apply downward oblique pulling force to both sides of the positioning cloth 7 at the same time, and control the magnitude of the pulling force on both sides to rotate the roller sleeve 21 in a specified direction. The positioning cloth 7 moves from one side to the other side on the roller sleeve 21, completing the breaking of all the longitudinal grooves 80.

[0063] In this step, whenever a longitudinal groove 80 passes over a narrow opening 211 from which a tongue 4 extends, the longitudinal groove 80 is lifted up and broken by the extended tongue 4.

[0064] S6 , removing the positioning cloth 7 and entering the process of peeling the chip 81 from the process film 9 .

[0065] When the chips on the wafer are square and the spacing between the longitudinal grooves is equal to the spacing between the transverse grooves, the same device can be used to break the transverse grooves 80 and the longitudinal grooves 80. When the chips on the wafer are rectangular and the spacing between the longitudinal grooves is not equal to the spacing between the transverse grooves, two devices with different spacing of the transmission nails 5 can be used to break the transverse grooves 80 and the longitudinal grooves 80 respectively.

[0066] Preferably, the positioning mat 7 is made of fiber cloth that is resistant to temperatures above 65°C, 100°C, or 180°C. For example, it can be made of the high-temperature-resistant fiber used in firefighter uniforms. In step S1, the process film 9 and the positioning mat 7 are bonded together using hot melt adhesive. After the chip 81 is separated from the process film 9, the process film 9 and the positioning mat 7 are melted at high temperature to debond the positioning mat 7 and reuse it.

[0067] In order to make the positioning pad 7 more flexible, the hot melt adhesive is preferably a flexible adhesive, and the positioning pad 7 is preferably a thinner cloth made of fine yarn.

[0068] The above embodiments are only used to more clearly describe the present invention and cannot be regarded as limiting the scope of protection covered by the present invention. Any modifications in equivalent forms should be regarded as falling within the scope of protection covered by the present invention.

Claims

1. A device for breaking a wafer without cutting through a groove during slicing, characterized in that: The invention comprises a support (1) and a cylindrical roller (2) arranged on the support (1). When in use, a process film (9) attached to the back of a wafer (8) is wrapped around a portion of the outer surface of the roller (2), with the wafer (8) facing outward, so that two adjacent chips (81) wrapped around the outer surface of the roller (2) are broken along the incomplete cut groove (80) between the two chips (81); a narrow opening (211) with an axial length direction and a radial depth direction is provided on the roller (2); a narrow and radially retractable tongue (4) is provided in the narrow opening (211); the outer side surface of the tongue (4) is a narrow convex blade (41); when the wafer (8) When the groove (80) on the roller is located at the mouth of the narrow opening (211), the tongue (4) extends outward, and its convex edge (41) pushes the process film (9) at the groove (80) outward, so that the angle between the chips (81) on both sides of the groove (80) becomes smaller and the groove (80) is broken; the roller (2) is composed of a cylindrical roller sleeve (21) with a tube hole on the outside and a shaft (22) sleeved in the tube hole, the narrow opening (211) is provided on the roller sleeve (21) and communicates with the tube hole, and there is a gap (20) between the outer peripheral surface of the shaft (22) and the inner wall of the tube hole of the roller sleeve (21), and after the tongue (4) retracts centripetally, Its inner side is located in the gap 1 (20), and its outer side is located in the narrow and long opening (211) within the outer peripheral surface of the rolling sleeve (21); the shaft (22) is provided with an ejection member for ejecting the tongue (4) radially outward; the ejection member is a guide ridge (3) provided on the surface of the shaft (22), the guide ridge (3) has a tangential guide surface (31) and a cliff surface (32) relative to the shaft (22), one side of the tangential guide surface (31) starts from the surface of the shaft (22), and the other side reaches the ridge top (30) of the guide ridge (3), the ridge top (30) of the guide ridge (3) is close to the inner wall of the tube hole of the rolling sleeve (21), and the cliff surface (32) is provided on the outer peripheral surface of the rolling sleeve (21). ) intersects with the tangential guide surface (31) at the ridge top (30), and the other end is radially connected to the surface of the shaft (22). When the rolling sleeve (21) rotates relative to the shaft (22) along the tangential guide surface (31) toward the cliff surface (32), the inner side surface of a tongue piece (4) located inside the gap (20) can slide along the tangential guide surface (31) to the ridge top (30) of the guide ridge (3), so that the tongue piece (4) extends out. When the rolling sleeve (21) continues to roll, the inner side surface of the tongue piece (4) located at the ridge top (30) is separated from the ridge top (30) under the action of external force and slides radially along the cliff surface (32), so that the tongue piece (4) falls back.

2. The device for breaking a wafer without cutting through a groove during slicing according to claim 1, wherein: There are a plurality of narrow openings (211), which are arranged at equal intervals along the circumference of the roller sleeve (21), and the spacing between adjacent narrow openings (211) is equal to the spacing of the slots (80) on the wafer (8). The shaft (22) is fixed, and bearings (23) are respectively provided between the two ends of the roller sleeve (21) and the shaft (22). The roller (2) is arranged horizontally, and there is only one ejector, which is arranged on the upper surface of the shaft (22).

3. The device for breaking a wafer without cutting through a groove during slicing according to claim 2, wherein: A plurality of fixed-distance transmission hanging nails (5) are respectively provided at both ends of the outer periphery of the rolling sleeve (21), and the number of the fixed-distance transmission hanging nails (5) is equal to the number of the narrow and long openings (211), and the fixed-distance transmission hanging nails (5) are provided on the rolling sleeve (21) between two adjacent narrow and long openings (211).

4. The device for breaking a wafer without cutting through a groove during dicing according to claim 2, wherein: The tongue piece (4) is made of a material capable of being attracted by magnetism, and a C-shaped permanent magnet (6) with an opening facing upward is provided below the shaft (22). At least when the outer end of the narrow opening (211) is lower than the inner end, the tongue piece (4) in the narrow opening (211) is subjected to the magnetic attraction force of the C-shaped permanent magnet (6), which is used to prevent the tongue piece (4) from sliding out of the narrow opening (211).

5. The device for breaking a wafer without cutting through a groove during dicing according to claim 4, wherein: A limiting platform (212) for limiting the retraction of the tongue (4) is provided at both ends of the narrow opening (211). A limiting protrusion (42) protruding along the length direction is provided at both ends of the tongue (4). When the tongue (4) retracts centripetally, it stops at the contact between the limiting protrusion (42) and the limiting platform (212). When the limiting protrusion (42) contacts the limiting platform (212), a gap (40) is formed between the inner side surface of the tongue (4) and the surface of the shaft (22).

6. A method for breaking an uncut groove using the device according to claim 3, characterized in that: A positioning mat (7) having no stretching elasticity but capable of deformation is produced, and a row of positioning holes (70) is respectively provided on the left and right sides and the front and rear sides of the positioning mat (7). In a row of positioning holes (70), the spacing between two adjacent positioning holes (70) is equal to the spacing between fixed-distance transmission nails (5) on a corresponding device used, and longitudinal positioning marks (71) and transverse positioning marks (72) corresponding to the longitudinal grooves (80) and transverse grooves (80) of the wafer (8) are provided on the positioning mat (7); Using the device and the positioning cloth (7) to break the uncut groove (80) comprises the following steps: S1, aligning the process film (9) together with the wafer (8) with the longitudinal positioning mark (71) and the transverse positioning mark (72) on the positioning mat (7) and pasting them on the positioning mat (7); S2, wrapping the positioning pad (7) completed in step S1 in an arc shape around the upper surface of the roller sleeve (21) of the corresponding device to be used, with the side with the wafer (8) facing outward, so that part of the positioning holes (70) in the left row of positioning holes (70) and part of the positioning holes (70) in the right row of positioning holes (70) are respectively placed on the corresponding fixed-distance transmission hanging nails (5) on the left and right sides of the roller sleeve (21); S3, applying a downward oblique pulling force to the front and rear sides of the positioning cloth (7) at the same time, and controlling the magnitude of the pulling force on both sides to rotate the roller sleeve (21) in a specified direction, so that the positioning cloth (7) moves from one side to the other side on the roller sleeve (21), completing the breaking of all the transverse grooves (80); S4, rotate the positioning cloth (7) by 90 degrees and then wrap the positioning cloth (7) in an arc shape around the upper surface of the roller sleeve (21) of the corresponding device to be used, with the side with the wafer (8) facing outward, so that part of the positioning holes (70) in the front row of positioning holes (70) and part of the positioning holes (70) in the rear row of positioning holes (70) are respectively placed on the corresponding fixed-distance transmission hanging nails (5) on the left and right sides of the roller sleeve (21); S5, applying downward oblique pulling force to the left and right sides of the positioning cloth (7) at the same time, and controlling the magnitude of the pulling force on both sides to rotate the roller sleeve (21) in a specified direction, the positioning cloth (7) moves from one side to the other side on the roller sleeve (21), and all longitudinal cut grooves (80) are broken; S6. Remove the positioning pad (7) and proceed to the process of peeling the chip (81) from the process film (9).

7. A method for breaking an incomplete cut groove according to claim 6, characterized in that: The positioning pad (7) is a fiber cloth that can withstand high temperatures above 65°C. In step S1, the process film (9) and the positioning pad (7) are bonded together by hot-melt adhesive. After the chip (81) is separated from the process film (9), the process film (9) and the positioning pad (7) are hot-melt-adhesed at high temperature to debond the positioning pad (7) and reuse it.

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