A chip packaging machine and a chip packaging method

Abstract

The present invention provides a chip packaging machine and a chip packaging method, relating to chip packaging technology. The chip packaging machine includes: a workbench, on which a rotating column is provided; a transfer mechanism, including a carrier plate and a temporary storage plate. The carrier plates are arranged in a circumferential array around the rotating column, and the temporary storage plates are respectively arranged on the upper surfaces of the carrier plates. A plurality of through grooves are formed through the plate surfaces of the temporary storage plates; a feeding mechanism for feeding chips; a detection mechanism for detecting chips; a screening and removing mechanism, including a screening and removing track and two driving members. The track surface of the screening and removing track penetrates through a first lifting groove and a second lifting groove. A first lifting block and a second lifting block are respectively movably arranged in the first lifting groove and the second lifting groove. The driving members are both arranged in the screening and removing track along the length direction of the screening and removing track; a packaging mechanism for packaging chips; the feeding mechanism, the detection mechanism, the screening and removing mechanism, and the packaging mechanism are sequentially arranged in a circumferential array around the rotating column. The present invention can improve the packaging efficiency and packaging effect of chips and has strong practicability.

Description

Technical Field

[0001] The present invention relates to chip packaging technology, and specifically relates to a chip packaging machine and a chip packaging method. Background Art

[0002] After a conventional chip is encapsulated, a series of external packaging processes are usually required to ensure its full protection throughout the supply chain process and facilitate transportation, storage, and final use. This process not only involves physical protection but also includes identification, anti-static measures, etc.

[0003] Such as Figure 11 shown is a typical chip packaging method: placing the qualified chips 7 in the placement slots 72 in the packaging tape 71; then attaching the packaging film 73 to the upper surface of the packaging tape 71 to place the chips 7 in a sealed environment; finally, winding the packaging tape 71 with the chips 7 and the attached packaging film 73 around the packaging disk 74, thus completing the packaging of the chips 7.

[0004] In this packaging method, generally only a picking machine can place the qualified chips one by one into the placement slots, with low efficiency; if multiple chips need to be processed each time, that is, a row of chips are detected at one time and placed into the packaging tape at one time, if one or more chips are detected as defective products, when directly placing the remaining chips into the packaging tape after removing the defective chips, it is easy to cause some placement slots in the packaging tape to be empty, affecting the packaging effect. Summary of the Invention

[0005] To solve the above-mentioned related prior art defects, the present invention provides a chip packaging machine and a chip packaging method, which can improve the packaging efficiency and packaging effect of chips and have strong practicability.

[0006] To achieve the above object, the present invention adopts the following technologies:

[0007] A chip packaging machine, comprising:

[0008] A workbench, on which a rotating column is rotatably arranged around its central axis;

[0009] A transfer mechanism, including a plurality of carrier plates and a plurality of temporary storage plates with matching quantities. The carrier plates are arranged in a circumferential array around the rotating column and rotate with the rotating column. The carrier plates are all movably arranged along their own width directions. The temporary storage plates are respectively slidably arranged on the upper surfaces of the carrier plates along the width directions of the carrier plates and rotate and move with the carrier plates. The temporary storage plates are parallel to the length directions of the corresponding carrier plates. A plurality of through slots are formed through the surfaces of the temporary storage plates, and the through slots are all arranged in an array along the length directions of the corresponding temporary storage plates, and the array pitch is a first predetermined value;

[0010] A feeding mechanism, used for feeding chips into the through slots;

[0011] A detection mechanism for detecting chips;

[0012] A screening mechanism, including a screening track and two driving members. The track surface of the screening track is penetrated with a first lifting groove and a second lifting groove whose quantities match the through grooves. The first lifting grooves are arranged in an array along the length direction of the screening track with an array pitch of a first predetermined value. A first lifting block and a second lifting block are respectively arranged to move along the height direction of themselves in the first lifting groove and the second lifting groove. The driving members are both arranged to move along the length direction of the screening track in the screening track, and the distance between the two driving members is a second predetermined value;

[0013] A packaging mechanism for packaging chips;

[0014] The feeding mechanism, the detection mechanism, the screening mechanism, and the packaging mechanism are sequentially arranged in a circumferential array around the rotating column.

[0015] A chip packaging method, including the steps:

[0016] S1: Rotate the rotating column to move the carrier plate to the feeding mechanism. Place the chips into the through grooves in sequence through the feeding mechanism and let them fall on the carrier plate;

[0017] S2: Rotate the rotating column to move the carrier plate carrying the chips to the detection mechanism. Detect whether the chips on the carrier plate are qualified through the detection mechanism and record the positions of the unqualified chips;

[0018] S3: If there are unqualified chips, rotate the rotating column to move the carrier plate carrying the chips to the screening mechanism; Move the first lifting block and the second lifting block to make the upper surfaces of the first lifting block and the second lifting block coplanar with the track surface of the screening track; Move the temporary storage plate to make the chips fall on the screening track and between the two driving members; Move the driving members to drive the chips to move on the screening track; When the unqualified chip moves onto the second lifting block, move the second lifting block downward to remove the unqualified chip from below the screening track and move the second lifting block back to make the upper surface of the second lifting block coplanar with the track surface of the screening track; Move the first lifting block downward to make the distance between the upper surface of the first lifting block and the track surface of the screening track match the thickness of the chips; Move the driving members to drive the chips to fall into the first lifting grooves in sequence; Move the first lifting block upward to make the qualified chips enter the through grooves in sequence, move the temporary storage plate, and the temporary storage plate drives the chips to return to the upper surface of the carrier plate;

[0019] S4: Rotate the rotating column to move the carrier plate carrying the qualified chips to the packaging mechanism. Put the chips into the placement grooves on the packaging tape in sequence through the transfer mechanism and the packaging mechanism, and package the chips through the packaging mechanism.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. Using a carrier plate and a temporary storage plate with multiple through slots for chip transfer and packaging can complete the detection and packaging of multiple chips at one time, improving the packaging efficiency.

[0022] 2. Using a screening mechanism to screen out unqualified chips, and after screening, the chips can be arranged at equal intervals, avoiding the empty placement slots of the packaging tape and improving the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional schematic diagram of the chip packaging machine according to an embodiment of the present invention.

[0024] Figure 2 is a three-dimensional schematic diagram of the transfer mechanism according to an embodiment of the present invention.

[0025] Figure 3 is an exploded structural schematic diagram of the screening mechanism according to an embodiment of the present invention Figure 1 .

[0026] Figure 4 is a schematic diagram of the cooperation between the screening mechanism and the cooperation plate according to an embodiment of the present invention.

[0027] Figure 5 is an exploded structural schematic diagram of the screening mechanism according to an embodiment of the present invention Figure 2 .

[0028] Figure 6 is a three-dimensional schematic diagram of the feeding mechanism according to an embodiment of the present invention.

[0029] Figure 7 is an exploded structural schematic diagram of the feeding mechanism according to an embodiment of the present invention.

[0030] Figure 8 is of the present invention Figure 6 partial enlarged schematic diagram at A in

[0031] Figure 9 is a three-dimensional schematic diagram of the detection mechanism according to an embodiment of the present invention.

[0032] Figure 10 is a three-dimensional schematic diagram of the packaging mechanism according to an embodiment of the present invention.

[0033] Figure 11 is a schematic diagram of a typical chip packaging method.

[0034] Markings in the figure: 1 - Workbench, 11 - Rotating column, 2 - Transfer mechanism, 21 - Carrying plate, 22 - Temporary storage plate, 23 - Through groove, 24 - First electric screw rod, 25 - First fitting block, 26 - First support frame, 27 - First support bar, 28 - Slide bar, 29 - Slide block, 210 - First spring, 211 - Connecting plate, 212 - Second support frame, 213 - Lifting column, 214 - Limiting plate, 215 - Limiting groove, 216 - Limiting bar, 217 - Third spring, 3 - Feeding mechanism, 31 - Conveyor channel, 32 - First conveyor plate, 33 - Second conveyor plate, 34 - Vibration sieve plate, 35 - Third lifting groove, 36 - Third linear cylinder, 37 - Second lifting frame, 38 - Third lifting block, 39 - Limiting belt, 310 - Clamping channel, 311 - Clamping plate, 312 - Third electric screw rod, 313 - Third fitting block, 314 - Mounting block, 315 - Guide rod, 316 - Connecting block, 317 - Fourth spring, 318 - First pressing block, 319 - Second pressing block, 4 - Detection mechanism, 41 - Accommodating plate, 42 - Glass plate, 43 - First camera, 44 - Second camera, 45 - Fourth electric screw rod, 46 - Fourth fitting block, 47 - Accommodating rack, 5 - Screening mechanism, 51 - Screening track, 52 - Driving part, 53 - First lifting groove, 54 - Second lifting groove, 55 - First lifting block, 56 - Second lifting block, 57 - Second electric screw rod, 58 - Second fitting block, 59 - Second support bar, 510 - Driving rod, 511 - Driving block, 512 - Second spring, 513 - Driving plate, 514 - Notch, 515 - Fitting plate, 516 - First linear cylinder, 517 - Rotating motor, 518 - Receiving bin, 519 - First lifting frame, 520 - Rotating seat, 521 - Second linear cylinder, 6 - Packaging mechanism, 61 - Packaging track, 62 - Tape storage column, 63 - Film pressing column, 64 - Film storage column, 65 - Tape reel, 7 - Chip, 71 - Packaging tape, 72 - Placing groove, 73 - Packaging film, 74 - Packaging disk. Detailed implementation mode

[0035] To make the purposes, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the implementation modes of the present invention in detail with reference to the drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0036] As Figure 1 and Figure 11 shown, this embodiment provides a chip packaging machine, which is used to place the qualified chip 7 into the placing groove 72 in the packaging tape 71, then stick the packaging film 73 on the upper surface of the packaging tape 71, so that the chip 7 is placed in a sealed environment. Finally, the packaging tape 71 with the chip 7 and the stuck packaging film 73 is wound around the packaging disk 74. It includes a workbench 1, a transfer mechanism 2, a feeding mechanism 3, a detection mechanism 4, a screening mechanism 5, and a packaging mechanism 6.

[0037] Specifically, as shown in Figure 1 FIG. Figure 1 , a rotating column 11 is provided on the workbench 1 and is rotatably arranged around its own central axis; more specifically, a rotation driving mechanism is embedded in the workbench 1, and the driving shaft of the rotation driving mechanism is coaxially connected to the rotating column 11 for driving the rotating column 11 to rotate around its own central axis.

[0038] Specifically, as shown in Figure 1 , Figure 2 , Figure 11 FIGS. Figure 1 to Figure 11 , the transfer mechanism 2 includes a plurality of carrier plates 21 and a plurality of temporary storage plates 22 with matching quantities. Both the carrier plates 21 and the temporary storage plates 22 are in the shape of rectangular plates. In this embodiment, there are four carrier plates 21 and four temporary storage plates 22 in total; the carrier plates 21 are all arranged in a circumferential array around the rotating column 11 and all rotate with the rotating column 11. The plate surface of the carrier plates 21 is perpendicular to the rotating column 11, and the carrier plates 21 are all arranged to move along their own width directions. The temporary storage plates 22 are respectively slidably arranged on the upper surfaces of the carrier plates 21 along the width directions of the carrier plates 21 and rotate and move with the carrier plates 21. The temporary storage plates 22 are parallel to the length directions of the corresponding carrier plates 21. Here, the corresponding carrier plate 21 is the carrier plate 21 where the temporary storage plate 22 is located; a plurality of through grooves 23 are respectively formed through the plate surfaces of the temporary storage plates 22 for accommodating the chips 7. In this embodiment, there are eight through grooves 23 in total; the through grooves 23 are all arranged in an array along the length directions of the corresponding temporary storage plates 22 and the array pitch is a first predetermined value. Here, the first predetermined value is the pitch between adjacent placement grooves 72 on the packaging tape 71.

[0039] Specifically, as shown in Figure 1 FIG. Figure 1 , the loading mechanism 3 is used to load the chips 7 into the through grooves 23.

[0040] Specifically, as shown in Figure 1 FIG. Figure 1 , the detection mechanism 4 is used to detect the chips 7.

[0041] Specifically, as shown in Figures 1 to 3 FIG. Figures 1 to 3 , the screening mechanism 5 includes a screening track 51 and two driving members 52. The track surface of the screening track 51 is provided with a first lifting groove 53 and a second lifting groove 54 whose quantities match the through grooves 23 on one temporary storage plate 22. In this embodiment, there are eight first lifting grooves 53; the first lifting grooves 53 are arranged in an array along the length direction of the screening track 51 and the array pitch is the first predetermined value. A first lifting block 55 and a second lifting block 56 are respectively arranged to move along their own height directions in the first lifting groove 53 and the second lifting groove 54. The driving members 52 are all arranged to move along the length direction of the screening track 51 in the screening track 51, and the distance between the two driving members 52 is a second predetermined value. Here, the second predetermined value should be greater than the sum of the lengths and the pitch of the eight first lifting grooves 53.

[0042] When one of the carrier plates 21 rotates to the screening mechanism 5 and one of the carrier plates 21 is parallel to the screening track 51, at this time, move one of the carrier plates 21 along the width direction of one of the carrier plates 21, and slide the temporary storage plate 22 along the width direction of one of the carrier plates 21. When the temporary storage plate 22 moves out of the upper surface of one of the carrier plates 21 and is directly above the screening track 51, the through slots 23 on the temporary storage plate 22 should just be directly above the first lifting slots 53 respectively.

[0043] Specifically, as Figure 1 shown, the packaging mechanism 6 is used to package the chips 7.

[0044] More specifically, as Figure 1 shown, the feeding mechanism 3, the detection mechanism 4, the screening mechanism 5, and the packaging mechanism 6 are sequentially arranged in a circumferential array around the rotating column 11, so that the feeding mechanism 3, the detection mechanism 4, the screening mechanism 5, and the packaging mechanism 6 can respectively cooperate with the transfer mechanism 2 to work simultaneously.

[0045] During operation, rotate the rotating column 11 to move the carrier plate 21 to the feeding mechanism 3. The chips 7 are sequentially placed in the through slots 23 through the feeding mechanism 3 and fall on the carrier plate 21; rotate the rotating column 11 to move the carrier plate 21 carrying the chips 7 to the detection mechanism 4. The detection mechanism 4 detects whether the chips 7 on the carrier plate 21 are qualified and records the positions of the unqualified chips 7; if there are unqualified chips 7, rotate the rotating column 11 to move the carrier plate 21 carrying the chips 7 to the screening mechanism 5; move the first lifting block 55 and the second lifting block 56 so that the upper surfaces of the first lifting block 55 and the second lifting block 56 are coplanar with the track surface of the screening track 51; move the temporary storage plate 22 so that the chips 7 fall on the screening track 51 and fall between the two driving members 52; move the driving member 52 to drive the chips 7 to move on the screening track 51; when the unqualified chips 7 move to the second lifting block 56, move the second lifting block 56 downward to remove the unqualified chips 7 from below the screening track 51, and then move the second lifting block 56 again to make the upper surface of the second lifting block 56 coplanar with the track surface of the screening track 51; move the first lifting block 55 downward so that the distance between the upper surface of the first lifting block 55 and the track surface of the screening track 51 matches the thickness of the chips 7; move the driving member 52 to drive the chips 7 to fall into the first lifting slots 53 in sequence; move the first lifting block 55 upward so that the qualified chips 7 enter the through slots 23 in sequence, move the temporary storage plate 22, and the temporary storage plate 22 drives the chips 7 to return to the upper surface of the carrier plate 21; rotate the rotating column 11 to move the carrier plate 21 carrying the qualified chips 7 to the packaging mechanism 6. The chips are sequentially placed in the placement slots 72 on the packaging tape 71 through the transfer mechanism 2 and the packaging mechanism 6, and the packaging mechanism 6 packages the chips 7.

[0046] Preferably, as Figure 2As shown in the figure, the side wall of the rotating column 11 is provided with the first electric screw rods 24 whose quantity matches that of the bearing plates 21. The driving shafts of the first electric screw rods 24 are all vertically intersected with the central axis of the rotating column 11. The driving shafts of the first electric screw rods 24 are all in threaded fit with the first fitting blocks 25. The first support frames 26 are all arranged on the first fitting blocks 25. The first support bars 27 are all arranged on the first support frames 26. Two parallel slide bars 28 are connected to each of the first support bars 27. The sliders 29 are all sleeved on the slide bars 28 in a sliding manner. The first springs 210 are all coaxially sleeved on the outer sides of the circumferences of the slide bars 28. The two ends of the first springs 210 are respectively connected to the first support bars 27 and the sliders 29. The bearing plates 21 are connected to the two sliders 29. The first support bars 27 are also connected to the connecting plates 211. The temporary storage plates 22 are connected to the connecting plates 211. When the first springs 210 are in the original state, the two side surfaces of the bearing plates 21 are coplanar with the two side surfaces of the temporary storage plates 22 respectively. The first electric screw rods 24 are used to drive the bearing plates 21 to move along their own width directions.

[0047] With such a design, when the upper surface of the bearing plate 21 is set to be coplanar with the upper surface of the screening track 51, and one of the bearing plates 21 rotates to the screening mechanism 5 and the bearing plate 21 is parallel to the screening track 51, at this time, when the bearing plate 21 is moved along its own width direction, the bearing plate 21 can first contact the screening track 51. Under the limitation of the screening track 51, the first electric screw rod 24 continues to drive, which will cause the temporary storage plate 22 to slide, so that the temporary storage plate 22 slides forward out of the upper surface of the bearing plate 21, and the through slots 23 on the temporary storage plate 22 are just respectively located directly above the first lifting slots 53. At this time, the chips 7 in the through slots 23 just fall into the first lifting slots 53.

[0048] Preferably, as Figure 1 and Figure 3As shown, the screening mechanism 5 further includes a second electric screw rod 57 arranged along the length direction of the screening track 51. A second mating block 58 is in threaded fit with the driving shaft of the second electric screw rod 57. The second mating block 58 is connected to a second support bar 59. Two driving rods 510 are slidably penetrated through the second support bar 59 along the width direction of the screening track 51. The driving rods 510 are both connected to driving blocks 511. A second spring 512 is coaxially sleeved on the outer circumference of the driving rods 510. The two ends of the second spring 512 are respectively connected to the second support bar 59 and the driving blocks 511. Above the screening track 51, a driving plate 513 is arranged at intervals. The two driving blocks 511 are connected to the upper surface of the driving plate 513. The two driving members 52 are connected to the lower surface of the driving plate 513. When the second spring 512 is in its original state, the two side surfaces of the driving plate 513 are coplanar with the two side surfaces of the screening track 51 respectively. On one side surface of the screening track 51 facing the second support bar 59, a notch 514 matching the shape of the driving member 52 is penetrated. One end of the screening track 51 is open. The distance between the notch 514 and one end of the screening track 51 matches the distance between the two driving members 52. The second electric screw rod 57 is used to drive the driving member 52 to move along the length direction of the screening track 51.

[0049] With such a design, when one of the driving members 52 is located at the notch 514, the other driving member 52 is just located outside one end of the screening track 51. When the temporary storage plate 22 slides forward out of the upper surface of the bearing plate 21, the temporary storage plate 22 will contact and push the driving plate 513 to move. At this time, one of the driving members 52 passes through the notch 514, and the other driving member 52 moves outside one end of the screening track 51. The through grooves 23 on the temporary storage plate 22 can just be respectively located directly above the first lifting grooves 53.

[0050] Preferably, as Figure 1 and Figure 4 shown, each of the first support bars 27 is connected to two second support frames 212. Two lifting columns 213 are slidably penetrated through each of the two second support frames 212 along the height direction of the bearing plate 21. The upper ends of the two lifting columns 213 on one second support frame 212 are connected to the same limiting plate 214. Limiting grooves 215 are opened on the upper surface of the limiting plate 214. The limiting grooves 215 penetrate through both side surfaces of the limiting plate 214. The ends of the upper surface of the limiting plate 214 facing away from the rotating column 11 are both inclined surfaces. Limiting strips 216 are connected to the lower ends of the bearing plates 21 respectively. The limiting strips 216 and the limiting grooves 215 are both in matching shapes. A third spring 217 is coaxially sleeved on the outer circumference of each of the lifting columns 213. The two ends of the third spring 217 are respectively connected to the limiting plate 214 and the second support frame 212. A mating plate 515 is fixed at a predetermined distance below the screening track 51. The end of the lower surface of the mating plate 515 facing the limiting plate 214 is an inclined surface. The inclined surface on the mating plate 515 is used for sliding contact with the inclined surface on the limiting plate 214. When the third spring 217 is in its original state, the limiting strip 216 is located in the limiting groove 215.

[0051] With such a design, when the third spring 217 is in its original state and the limiting strip 216 is located within the limiting groove 215, when the bearing plate 21 is moved, the first spring 210 will not fluctuate, the distance between the bearing plate 21 and the second support frame 212 is fixed, and the temporary storage plate 22 always remains on the upper surface of the bearing plate 21; when the bearing plate 21 moves towards the screening track 51, the inclined surface on the mating plate 515 will first come into sliding contact with the inclined surface on the limiting plate 214, and continued movement will drive the limiting plate 214 to move upward until the limiting plate 214 moves out of the limiting groove 215, and further movement can drive the temporary storage plate 22 to slide forward out of the upper surface of the bearing plate 21.

[0052] Preferably, as Figure 1 and Figure 5 shown, the screening mechanism 5 further includes a first linear cylinder 516, a rotating motor 517, and a receiving bin 518. The first linear cylinder 516 is arranged below the screening track 51 along the height direction of the screening track 51. The driving shaft of the first linear cylinder 516 is connected upward to a first lifting frame 519. First lifting blocks 55 are arranged on the first lifting frame 519. The rotating motor 517 is arranged below the screening track 51 along the length direction of the screening track 51. The driving shaft of the rotating motor 517 is connected to a rotating seat 520. A second linear cylinder 521 is arranged on the rotating seat 520. The driving shaft of the second linear cylinder 521 is perpendicular to the driving shaft of the rotating motor 517. The driving shaft of the second linear cylinder 521 is connected to a second lifting block 56. The receiving bin 518 is fixedly arranged below the screening track 51 and on one side of the rotating seat 520. The upper surface of the receiving bin 518 is open.

[0053] With such a design, the first linear cylinder 516 is used to drive the first lifting block 55 to move, the second linear cylinder 521 is used to drive the second lifting block 56 to move, and the rotating motor 517 is used to pour the chips 7 on the second lifting block 56 into the receiving bin 518.

[0054] Preferably, as Figure 2 、 Figure 6 、 Figure 7As shown in the figure, the feeding mechanism 3 includes a conveying channel 31, a first conveying plate 32, and a second conveying plate 33. The conveying channel 31 is arranged on the outer side of the circumferential side of the rotating column 11, and one end of it is connected to a vibrating sieve plate 34, which is used to convey the chips into the conveying channel 31; the first conveying plate 32 is connected to the lower surface of the other end of the conveying channel 31. There are third lifting grooves 35 on the first conveying plate 32 whose quantity matches that of the through grooves 23. In this example, there are eight third lifting grooves 35; the third lifting grooves 35 are arranged in an array along the length direction of the first conveying plate 32, and the array pitch matches the array pitch of the through grooves 23. A third linear cylinder 36 is fixed along the height direction below the first conveying plate 32. The driving shaft of the third linear cylinder 36 is connected upward to a second lifting frame 37. There are third lifting blocks 38 on the second lifting frame 37 whose quantity and shape match those of the third lifting grooves 35. The third lifting blocks 38 are respectively located directly below the third lifting grooves 35. The second conveying plate 33 is arranged parallel and spaced above the first conveying plate 32. Limiting bands 39 are provided on both sides of the lower surface of the second conveying plate 33. The limiting bands 39 are in sliding contact with the upper surface of the first conveying plate 32. A clamping channel 310 is provided through the end of the limiting band 39 close to the conveying channel 31. A clamping plate 311 is movably arranged in the clamping channel 310. A third electric screw rod 312 is fixed along the length direction on one side of the first conveying plate 32. The driving shaft of the third electric screw rod 312 is in threaded cooperation with a third fitting block 313, and the third fitting block 313 is connected to the second conveying plate 33.

[0055] With such a design, the chips 7 are sent into the conveying channel 31 by the vibrating sieve plate 34, and the chips 7 are sent out from the other end of the conveying channel 31. When eight chips 7 are sent out from the other end of the conveying channel 31, the clamping plate 311 is moved to clamp the chip 7 closest to the conveying channel 31 at this time, and then the second conveying plate 33 is moved to drive the clamped chip 7 and the seven chips 7 behind it to slide on the first conveying plate 32; the third lifting blocks 38 are moved so that the distances between the upper surfaces of the third lifting blocks 38 and the upper ends of the third lifting grooves 35 all match the thickness of the chips 7. When the second conveying plate 33 drives the chips 7 to pass through the third lifting grooves 35 in sequence, the chips 7 fall into the third lifting grooves 35 in sequence; the second conveying plate 33 is moved away from above the third lifting grooves 35, and the temporary storage plate 22 is moved to the surface of the first conveying plate 32 to make the through grooves 23 coincide with the third lifting grooves 35 respectively. The third lifting blocks 38 are moved upward to drive the chips 7 into the through grooves 23, and the temporary storage plate 22 is moved to the upper surface of the bearing plate 21, thus completing the feeding of the chips 7.

[0056] Further preferably, the upper surface of the first conveying plate 32 can be set to be coplanar with the upper surface of the bearing plate 21, which is convenient for completing the feeding work only by driving with the first electric screw rod 24.

[0057] Further preferably, a structure similar to the mating plate 515 can be introduced below the first conveying plate 32 for contacting the limiting plate 214.

[0058] Preferably, as Figure 1 shown, on the upper surface of one end of the second conveying plate 33 close to the conveying channel 31, there are two mounting blocks 314. The two mounting blocks 314 are arranged at intervals along the width direction of the second conveying plate 33. Guide rods 315 are slidably penetrated through the two mounting blocks 314 along the width direction of the second conveying plate 33. Connecting blocks 316 are connected to the opposite ends of the guide rods 315. The connecting blocks 316 are respectively connected to the clamping plates 311. A fourth spring 317 is coaxially sleeved on the outer circumference of the guide rods 315. The two ends of the fourth spring 317 are respectively connected to the mounting blocks 314 and the connecting blocks 316. Opposite ends of the guide rods 315 are both connected with a first pressing block 318. One side of the opposite sides of the first pressing block 318 towards one end of the conveying channel 31 is beveled. On the upper surface of the other end of the conveying channel 31, a second pressing block 319 is installed. Both sides of one end of the second pressing block 319 towards the first conveying plate 32 are beveled. The beveled surface of the second pressing block 319 is used for sliding contact with the beveled surface of the first pressing block 318. The fourth spring 317 is always in a stretched state.

[0059] With such a design, when the second conveying plate 33 moves to the other end of the conveying channel 31, the beveled surface of the second pressing block 319 contacts the beveled surface of the first pressing block 318 and drives the distance between the first pressing blocks 318 to increase. At this time, the two clamping plates 311 move out of the conveying channel 31, and the chip 7 can enter the upper surface of the first conveying plate 32 from the other end of the conveying channel 31; when the second conveying plate 33 is moved towards the third lifting groove 35, the first pressing block 318 is separated from the second pressing block 319. At this time, the clamping plates 311 clamp the chip 7 and drive the chip 7 to move.

[0060] Preferably, as Figure 1 and Figure 9 shown, the detection mechanism 4 includes a receiving plate 41, a glass plate 42, a first camera 43, and a second camera 44. The receiving plate 41 is arranged on the outer circumference of the rotating column 11. The glass plate 42 is installed on the receiving plate 41. The upper and lower surfaces of the glass plate 42 are coplanar with the receiving plate 41 respectively. On one side of the outer edge of the receiving plate 41 along its own length direction, a fourth electric screw rod 45 is provided. A fourth mating block 46 is in threaded cooperation with the driving shaft of the fourth electric screw rod 45. The fourth mating block 46 is connected with a receiving frame 47. The first camera 43 and the second camera 44 are both arranged on the receiving frame 47. The first camera 43 is arranged towards the lower surface of the glass plate 42, and the second camera 44 is arranged towards the upper surface of the glass plate 42.

[0061] With such a design, when the chip 7 in the through slot 23 is driven by the temporary storage board 22 to be located on the glass plate 42, the first camera 43 is used to detect the lower surface of the chip 7 through the glass plate 42, the second camera 44 is used to detect the upper surface of the chip 7, and the fourth electric screw rod 45 is used to drive the first camera 43 and the second camera 44 to move, so as to detect each chip 7.

[0062] Further preferably, the upper surface of the accommodation board 41 can be set to be coplanar with the upper surface of the bearing board 21, which is convenient for completing the detection work only by driving with the first electric screw rod 24.

[0063] Further preferably, a structure similar to the fitting board 515 can be introduced below the accommodation board 41 for contacting the limiting board 214.

[0064] Preferably, as Figure 10 and Figure 11 shown, the packaging mechanism 6 includes a packaging track 61, a tape storage column 62, a film pressing column 63, a film storage column 64, and a tape reel 65. The packaging track 61 is arranged on the outer side of the circumferential side of the rotating column 11. The packaging track 61 is used to carry the packaging tape 71. The tape storage column 62 is arranged outside one end of the packaging track 61. The tape storage column 62 is arranged along the width direction of the packaging track 61 and is rotatably arranged around its own central axis. The tape storage column 62 is used to store the packaging tape 71. The film pressing column 63 is arranged above the other end of the packaging track 61 and the distance between the film pressing column 63 and the packaging track 61 is a third predetermined value. Here, the third predetermined value matches the thickness of the packaging film 73, so that the packaging film 73 contacts the upper surface of the packaging tape 71. The film pressing column 63 is parallel to the width direction of the packaging track 61 and is used to press the packaging film 73 onto the upper surface of the packaging tape 71. The film storage column 64 is arranged above the film pressing column 63. The film storage column 64 is parallel to the width direction of the packaging track 61 and rotates around its own central axis. The film storage column 64 is used to store the packaging film 73. The tape reel 65 is arranged outside the other end of the packaging track 61. Its central axis is parallel to the width direction of the packaging track 61. The tape reel 65 is rotatably arranged around its own central axis. The tape reel 65 is used to store the packaging tape 71 carrying the chip 7. Further preferably, the packaging mechanism 6 further includes a rotation driving mechanism. The driving shaft of the rotation driving mechanism is coaxially connected to the tape reel 65 and is used to drive the tape reel 65 to rotate, and the tape reel 65 is detachably installed. Specifically, the tape reel 65 here is the Figure 11 packaging tray 74 in

[0065] With such a design, the bearing board 21 is moved to the packaging track 61. The temporary storage board 22 is moved so that the chip 7 in the through slot falls into the placement groove 72 on the packaging tape 71. The tape reel 65 is rotated. The upper surface of the packaging tape 71 carrying the chip 7 contacts and adheres to the packaging film 73 during the movement process and is finally wound into the tape reel 65, thus completing the packaging of the chip 7. At the same time, the next packaging tape 71 for placing the chip 7 moves onto the packaging track 61.

[0066] Further preferably, the upper surface of the packaging track 61 can be set to be coplanar with the upper surface of the carrier plate 21, facilitating the completion of the packaging work only by driving with the first electric screw rod 24.

[0067] Further preferably, a structure similar to the mating plate 515 can be introduced below the packaging track 61 for contacting the limiting plate 214.

[0068] As Figures 1 to 11 shown, this embodiment provides a chip packaging method, which is implemented by using the chip packaging machine described in the above embodiment, including the steps:

[0069] S1: Rotate the rotating column 11 to move the carrier plate 21 to the feeding mechanism 3. The chips 7 are sequentially placed in the through slots 23 through the feeding mechanism 3 and fall onto the carrier plate 21.

[0070] S2: Rotate the rotating column 11 to move the carrier plate 21 carrying the chips 7 to the detection mechanism 4. The detection mechanism 4 detects whether the chips 7 on the carrier plate 21 are qualified and records the positions of the unqualified chips 7.

[0071] S3: If there are unqualified chips 7, rotate the rotating column 11 to move the carrier plate 21 carrying the chips 7 to the screening mechanism 5; Move the first lifting block 55 and the second lifting block 56 to make the upper surfaces of the first lifting block 55 and the second lifting block 56 coplanar with the track surface of the screening track 51; Move the temporary storage plate 22 to make the chips 7 fall onto the screening track 51 and fall between the two driving members 52; Move the driving member 52 to drive the chips 7 to move on the screening track 51; When the unqualified chips 7 move onto the second lifting block 56, move the second lifting block 56 downward to remove the unqualified chips 7 from below the screening track 51, and move the second lifting block 56 back to make the upper surface of the second lifting block 56 coplanar with the track surface of the screening track 51; Move the first lifting block 55 downward to make the distance between the upper surface of the first lifting block 55 and the track surface of the screening track 51 match the thickness of the chips 7; Move the driving member 52 to drive the chips 7 to fall into the first lifting slots 53 in sequence; Move the first lifting block 55 upward to make the qualified chips 7 enter the through slots 23 in sequence, and move the temporary storage plate 22. The temporary storage plate 22 drives the chips 7 to return to the upper surface of the carrier plate 21.

[0072] S4: Rotate the rotating column 11 to move the carrier plate carrying the qualified chips 7 to the packaging mechanism 6. The chips are sequentially placed in the placement slots 72 on the packaging tape 71 through the transfer mechanism 2 and the packaging mechanism 6, and the chips 7 are packaged by the packaging mechanism 6.

[0073] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various modifications and deformations to the present invention without departing from the spirit and scope of the present invention.

Claims

1. A chip packaging machine, characterized in that: include: A workbench (1) is provided with a rotating column (11) rotatably arranged around its central axis; The transfer mechanism (2) includes a plurality of supporting plates (21) and a plurality of temporary storage plates (22) of matching numbers. The supporting plates (21) are arranged in a circular array around the rotating column (11) and rotate with the rotating column (11). The supporting plates (21) are all arranged to move along their own width directions. The temporary storage plates (22) are respectively slidably arranged on the upper surface of the supporting plates (21) along the width direction of the supporting plates (21) and rotate and move with the supporting plates (21). The temporary storage plates (22) are parallel to the length direction of the corresponding supporting plates (21). The temporary storage plates (22) have a plurality of through slots (23) extending through the plate surface. The through slots (23) are all arranged in an array along the length direction of the corresponding temporary storage plates (22) and the array spacing is a first predetermined value. A loading mechanism (3) for loading the chip (7) into the through slot (23); A detection mechanism (4) for detecting a chip (7); The screening mechanism (5) comprises a screening track (51) and two driving members (52), wherein the track surface of the screening track (51) is penetrated by a first lifting groove (53) and a second lifting groove (54) whose number matches the through groove (23), the first lifting grooves (53) are arrayed along the length direction of the screening track (51) and the array spacing is a first predetermined value, a first lifting block (55) and a second lifting block (56) are respectively arranged in the first lifting groove (53) and the second lifting groove (54) to move along their own height direction, the driving members (52) are all arranged in the screening track (51) to move along the length direction of the screening track (51), and the spacing between the two driving members (52) is a second predetermined value; A packaging mechanism (6) for packaging the chip (7); The feeding mechanism (3), the detection mechanism (4), the screening mechanism (5), and the packaging mechanism (6) are sequentially arranged in a circular array around the rotating column (11).

2. The chip packaging machine according to claim 1, characterized in that: The side wall of the rotating column (11) is provided with a first electric screw (24) whose number matches the bearing plate (21), the driving shaft of the first electric screw (24) is perpendicular to the central axis of the rotating column (11), the driving shaft of the first electric screw (24) is threadedly matched with a first matching block (25), the first matching block (25) is provided with a first support frame (26), the first support frame (26) is provided with a first support bar (27), the first support bar (27) is connected to two parallel sliding rods (2) arranged and parallel to the first electric screw (24). 8), a sliding sleeve is provided on each slide rod (28), a first spring (210) is provided on each outer side of each slide rod (28), two ends of the first spring (210) are respectively connected to the first support bar (27) and the slider (29), the bearing plate (21) is connected to the two sliders (29), the first support bar (27) is further connected to the connecting plate (211), the temporary storage plate (22) is connected to the connecting plate (211), and when the first spring (210) is in the original state, the two side surfaces of the bearing plate (21) are respectively coplanar with the two side surfaces of the temporary storage plate (22).

3. The chip packaging machine according to claim 2, characterized in that: The screening mechanism (5) further comprises a second electric screw (57) arranged along the length direction of the screening track (51), a driving shaft of the second electric screw (57) being threadedly matched with a second matching block (58), the second matching block (58) being connected with a second support bar (59), the second support bar (59) being slidably passed through two driving rods (510) along the width direction of the screening track (51), the driving rods (510) being connected with a driving block (511), a second spring (512) being coaxially sleeved on the outer side of the driving rod (510), the two ends of the second spring (512) being respectively connected with the second support bar (59) and the driving block (511), the screening track A driving plate (513) is provided above the (51), two driving blocks (511) are connected to the upper surface of the driving plate (513), and two driving members (52) are connected to the lower surface of the driving plate (513). When the second spring (512) is in the original state, the two side surfaces of the driving plate (513) are coplanar with the two side surfaces of the screening track (51), and a notch (514) having a shape matching that of the driving member (52) is passed through one side of the screening track (51) facing the second support bar (59). One end of the screening track (51) is open, and the distance between the notch (514) and one end of the screening track (51) matches the distance between the two driving members (52).

4. The chip packaging machine according to claim 3, characterized in that: The first support bars (27) are all connected to the second support frame (212), and the second support frame (212) is slidably provided with a lifting column (213) along the height direction of the bearing plate (21), and the upper ends of the lifting columns (213) are all connected to the limiting plate (214), and the upper surface of the limiting plate (214) is provided with a limiting groove (215), and the limiting groove (215) is passed through both sides of the limiting plate (214), and the end of the upper surface of the limiting plate (214) facing away from the rotating column (11) is inclined, and the lower end of the bearing plate (21) is connected to the limiting bar (216), and the limiting bar (216) and the limiting groove (214) are connected. 15) are matched in shape, and a third spring (217) is coaxially sleeved on the outer side of the lifting column (213), and the two ends of the third spring (217) are respectively connected to the limit plate (214) and the second support frame (212). A matching plate (515) is fixed at a predetermined distance below the screening track (51), and the lower surface of the matching plate (515) is inclined toward one end of the limit plate (214). The inclined surface on the matching plate (515) is used to slide in contact with the inclined surface on the limit plate (214). When the third spring (217) is in the original state, the limit bar (216) is located in the limit groove (215).

5. The chip packaging machine according to claim 1, characterized in that: The screening mechanism (5) further comprises a first linear cylinder (516), a rotating motor (517), and a receiving bin (518). The first linear cylinder (516) is arranged below the screening track (51) along the height direction of the screening track (51). The driving shaft of the first linear cylinder (516) is upwardly connected to a first lifting frame (519). The first lifting blocks (55) are all arranged on the first lifting frame (519). The rotating motor (517) is arranged on the screening track (51) along the length direction of the screening track (51). 1) below, the driving shaft of the rotating motor (517) is connected to the rotating seat (520), the rotating seat (520) is provided with a second linear cylinder (521), the driving shaft of the second linear cylinder (521) is perpendicular to the driving shaft of the rotating motor (517), the driving shaft of the second linear cylinder (521) is connected to the second lifting block (56), the receiving bin (518) is fixedly provided below the screening track (51) and located on one side of the rotating seat (520), and the upper surface of the receiving bin (518) is open.

6. The chip packaging machine according to claim 1, characterized in that: The feeding mechanism (3) includes a conveying channel (31), a first conveying plate (32), and a second conveying plate (33). The conveying channel (31) is arranged outside the peripheral side of the rotating column (11), and one end of the conveying channel is connected to a vibrating screen plate (34). The vibrating screen plate (34) is used to convey the chips into the conveying channel (31). The first conveying plate (32) is connected to the lower surface of the other end of the conveying channel (31). The first conveying plate (32) is penetrated by a third lifting groove (35) whose number matches the through groove (23). The third lifting groove (35) is arranged in an array along the length direction of the first conveying plate (32) and the array spacing matches the array spacing of the through groove (23). A third linear cylinder (36) is fixed below the first conveying plate (32) along its own height direction. The driving shaft of the third linear cylinder (36) is upwardly connected to a second lifting frame (37). The second lifting frame (37) A third lifting block (38) is provided on the conveyor belt (31) whose number and shape match the third lifting groove (35). The third lifting blocks (38) are respectively located directly below the third lifting groove (35). The second conveying plate (33) is arranged parallel to and spaced directly above the first conveying plate (32). Limiting belts (39) are provided on both sides of the lower surface of the second conveying plate (33). The limiting belts (39) are in sliding contact with the upper surface of the first conveying plate (32). One end of the limiting belt (39) close to the conveying channel (31) is provided with a clamping channel (310) passing through. A clamping plate (311) is provided in the clamping channel (310). A third electric screw (312) is fixedly provided on one side of the first conveying plate (32) along its own length direction. The driving shaft of the third electric screw (312) is threadedly matched with a third matching block (313). The third matching block (313) is connected to the second conveying plate (33).

7. The chip packaging machine according to claim 6, characterized in that: Two mounting blocks (314) are provided on the upper surface of one end of the second conveying plate (33) close to the conveying channel (31). The two mounting blocks (314) are spaced apart along the width direction of the second conveying plate (33). The two mounting blocks (314) are both slidably penetrated along the width direction of the second conveying plate (33) and provided with guide rods (315). The opposite ends of the guide rods (315) are connected to connecting blocks (316). The connecting blocks (316) are respectively connected to the clamping plates (311). A fourth spring (317) is provided on the outer coaxial sleeve of the guide rod (315). The two ends of the fourth spring (317) are respectively connected to the clamping plates (311). The mounting block (314) and the connecting block (316) are connected, and the opposite ends of the guide rod (315) are connected to the first pressing block (318), and the opposite side of the first pressing block (318) is inclined toward the end of the conveying channel (31). A second pressing block (319) is installed on the upper surface of the other end of the conveying channel (31), and both sides of the second pressing block (319) are inclined toward the end of the first conveying plate (32). The inclined surface of the second pressing block (319) is used to slide in contact with the inclined surface of the first pressing block (318), and the fourth spring (317) is always in a stretched state.

8. The chip packaging machine according to claim 1, characterized in that: The detection mechanism (4) includes a accommodating plate (41), a glass plate (42), a first camera (43), and a second camera (44). The accommodating plate (41) is arranged outside the circumference of the rotating column (11), and the glass plate (42) is installed on the accommodating plate (41). The upper and lower surfaces of the glass plate (42) are respectively coplanar with the accommodating plate (41). A fourth electric screw (45) is provided on the outer side of one side of the accommodating plate (41) along its own length direction. The drive shaft of the fourth electric screw (45) is threadedly matched with a fourth matching block (46). The fourth matching block (46) is connected to the accommodating frame (47). The first camera (43) and the second camera (44) are both arranged on the accommodating frame (47). The first camera (43) is arranged toward the lower surface of the glass plate (42), and the second camera (44) is arranged toward the upper surface of the glass plate (42).

9. The chip packaging machine according to claim 1, characterized in that: The packaging mechanism (6) includes a packaging track (61), a tape storage column (62), a film pressing column (63), and a film storage column (64). The packaging track (61) is arranged outside the peripheral side of the rotating column (11). The packaging track (61) is used to carry the packaging tape (71). The tape storage column (62) is arranged outside one end of the packaging track (61). The tape storage column (62) is arranged along the width direction of the packaging track (61) and rotates around its own central axis. The tape storage column (62) is used to store the packaging tape (71). The film pressing column (63) is arranged above the other end of the packaging track (61) and the distance between the packaging track (61) and the film pressing column is a third predetermined value. The column (63) is parallel to the width direction of the packaging track (61) and is used to press the packaging film (73) onto the upper surface of the packaging tape (71). The film storage column (64) is arranged above the film pressing column (63). The film storage column (64) is parallel to the width direction of the packaging track (61) and rotates around its own central axis. The film storage column (64) is used to store the packaging film (73). The take-up reel (65) is arranged outside the other end of the packaging track (61), and its central axis is parallel to the width direction of the packaging track (61). The take-up reel (65) is rotated around its own central axis. The take-up reel (65) is used to store the packaging tape (71) carrying the chip (7).

10. A chip packaging method, characterized in that: The method is implemented by using the chip packaging machine according to any one of claims 1 to 9, comprising the steps of: S1: rotating the rotating column (11) to move the carrier plate (21) to the loading mechanism (3), and placing the chips (7) in the through slots (23) in sequence through the loading mechanism (3) and dropping them onto the carrier plate (21); S2: rotating the rotating column (11) to move the carrier plate (21) carrying the chip (7) to the detection mechanism (4), detecting whether the chip (7) on the carrier plate (21) is qualified by the detection mechanism (4), and recording the position of the unqualified chip (7); S3: If there is an unqualified chip (7), the rotating column (11) is rotated to move the carrier plate (21) carrying the chip (7) to the screening mechanism (5); the first lifting block (55) and the second lifting block (56) are moved to make the upper surfaces of the first lifting block (55) and the second lifting block (56) coplanar with the track surface of the screening track (51); the temporary storage plate (22) is moved to make the chip (7) fall on the screening track (51) and fall between the two driving members (52); the driving member (52) is moved to drive the chip (7) to move on the screening track (51); when the unqualified chip (7) moves to the second lifting block (56), the second lifting block (56) is moved downward. ), remove the unqualified chips (7) from under the screening track (51), and re-move the second lifting block (56) until the upper surface of the second lifting block (56) is coplanar with the track surface of the screening track (51); move the first lifting block (55) downward so that the distance between the upper surface of the first lifting block (55) and the track surface of the screening track (51) matches the thickness of the chip (7); move the driving member (52) to drive the chips (7) to fall into the first lifting slot (53) in sequence; move the first lifting block (55) upward so that the qualified chips (7) enter the through slot (23) in sequence, move the temporary storage plate (22), and the temporary storage plate (22) drives the chip (7) to return to the upper surface of the carrier plate (21); S4: Rotate the rotating column (11) to move the carrier plate carrying the qualified chips (7) to the packaging mechanism (6), place the chips in sequence into the placement slots (72) on the packaging belt (71) through the transfer mechanism (2) and the packaging mechanism (6), and package the chips (7) through the packaging mechanism (6).

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