A substrate magnetron sputtering coating production equipment

Abstract

The application relates to a substrate magnetron sputtering film production equipment, which comprises a rack, a pre-vacuum unit, a transmission unit, a pretreatment unit and a magnetron sputtering process unit; the four units are integrated and installed on the rack; the pre-vacuum unit, the pretreatment unit and the magnetron sputtering process unit are arranged in three directions outside the transmission unit; the transmission unit is connected with the substrate entrances and exits of the pre-vacuum unit, the substrate entrances and exits of the pretreatment unit and the substrate entrances and exits of the magnetron sputtering process unit through the three substrate entrances and exits, and gate valves are arranged at the connecting positions of the transmission unit and the pretreatment unit and the transmission unit and the magnetron sputtering process unit; the pre-vacuum unit is used for multilayer loading of the substrate; the transmission unit is used for transmitting the substrate among the other three units; the pretreatment unit is used for removing water vapor on the substrate and etching the surface of the substrate; and the magnetron sputtering process unit is used for realizing sputtering film on the surface of the substrate. The application improves the utilization rate of the target material and realizes the diversity of the process.

Description

Technical Field

[0001] This invention belongs to the field of thin film deposition technology, specifically relating to a substrate magnetron sputtering coating production equipment. Background Technology

[0002] Substrate coating refers to the process of coating a thin film material onto the surface of a substrate. It is widely used in semiconductors, optics, electronics, and biology. Currently, there are various substrate coating methods. Among them, magnetron sputtering equipment is widely used in microelectronics, optoelectronics, nanotechnology, new materials, biomedicine, energy, aerospace, and other fields due to its advantages such as low deposition temperature, good film quality, good uniformity, and fast deposition speed.

[0003] Current magnetron sputtering coating methods typically use large-diameter targets to sputter coating onto small-diameter substrates. This results in low target utilization. Furthermore, a single magnetron sputtering unit is generally suitable for a single coating process, leading to poor process adaptability. The high cost of magnetron sputtering equipment itself contributes to the high production cost of substrate coating. In addition, sputtering multiple materials onto a substrate usually requires two or more independent machines, hindering seamless integration between production steps and resulting in low coating efficiency and increased substrate coating costs. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention proposes a substrate magnetron sputtering coating production equipment that can improve coating production efficiency, coating quality, target material utilization, and coating process diversity.

[0005] The above-mentioned objective of the present invention is achieved through the following technical solution:

[0006] A substrate magnetron sputtering coating production equipment includes a frame, a pre-vacuum unit, a transport unit, a pretreatment unit, and a magnetron sputtering process unit. The pre-vacuum unit, transport unit, pretreatment unit, and magnetron sputtering process unit are integrated and installed on the frame. The pre-vacuum unit, pretreatment unit, and magnetron sputtering process unit are located at three positions outside the transport unit. The transport unit is connected to the substrate inlet / outlet A of the pre-vacuum unit, the substrate inlet / outlet E of the pretreatment unit, and the substrate inlet / outlet F of the magnetron sputtering process unit via substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D, respectively. Gate valves are provided at the connection points with the pretreatment unit and the magnetron sputtering process unit.

[0007] The pre-vacuum unit includes a vacuum chamber A and a liftable substrate carrier placed inside the vacuum chamber A for multi-layer substrate loading. The transmission unit includes a vacuum chamber B and a transmission actuator. The transmission actuator is a robotic arm capable of lifting, rotating, and extending, used to transfer the substrate between the pre-vacuum unit, the pre-processing unit, and the magnetron sputtering process unit. The pre-processing unit includes a vacuum chamber C and a pre-processing actuator. The pre-processing actuator includes an upper heating unit, a substrate carrier unit, and an RF power unit, used to remove moisture from the substrate and etch the substrate surface. The magnetron sputtering process unit includes a vacuum chamber D and a magnetron sputtering execution part. The magnetron sputtering execution part includes a sputtering device, a substrate carrier system, and a gas supply device. The sputtering device and the substrate carrier system are arranged vertically opposite each other to achieve sputtering coating of the substrate while it revolves around the central axis of the substrate carrier system and rotates around its own central axis.

[0008] Furthermore, a lockable and sealable door is connected to the front of the vacuum chamber A, and a substrate inlet / outlet A is provided on the back of the vacuum chamber A. The substrate support frame is a three-dimensional frame with multiple upper and lower platforms separated by spacers. A positioning boss is provided at the center of the upper end of each platform to provide positioning support for the substrate disk. The lower end of the substrate support frame is connected to a push rod, which passes through a rod hole provided at the lower end of the vacuum chamber A. A flange bellows is provided at the lower end of the vacuum chamber A outside the push rod. The lower end of the push rod is connected to the push rod of the electric cylinder A located below the vacuum chamber A. The electric cylinder A is fixed on the cylinder frame below the vacuum chamber A. A through-beam laser photoelectric switch transmitter and a through-beam laser photoelectric switch receiver are installed opposite each other on the left and right walls of the vacuum chamber A, which together constitute a through-beam photoelectric sensor.

[0009] Furthermore, the vacuum chamber B adopts a square box structure, including a main chamber and an upper cover. The main chamber has substrate inlets / outlets on three sides: substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D. Substrate inlet / outlet B is directly connected to substrate inlet / outlet A of the pre-vacuum unit. Substrate inlet / outlet C is sealed to substrate inlet / outlet E on the vacuum chamber C of the pretreatment unit via a gate valve. Substrate inlet / outlet D is sealed to substrate inlet / outlet F on the vacuum chamber D of the magnetron sputtering process unit via a gate valve, thus connecting the four vacuum chambers into a single unit with a centrally located... The gate has an overall vacuum chamber structure; the upper chamber cover is a circular cover with a positioning hole at the upper end of the main chamber, and the lower end of the upper chamber cover is sealed to the positioning hole. The two are coaxially arranged and fixedly connected; an observation window B is provided in the center of the upper chamber cover; two flange interfaces are also reserved on the upper chamber cover for connection with external vacuum systems and vacuum degree detection devices; two sets of through-beam photoelectric sensors are installed on the upper chamber cover and the main chamber, respectively near the substrate inlet / outlet C and near the substrate inlet / outlet D.

[0010] Furthermore, the transmission actuator also includes a retractable robotic arm, a lifting drive cylinder, a rotary drive cylinder, an arm extension drive cylinder, a hollow transmission shaft, a central shaft, a transmission unit frame, a lower magnetic fluid vacuum seal transmission device, an upper magnetic fluid vacuum seal transmission device, and a bearing seat; the end of the robotic arm is in the shape of a fork.

[0011] The transmission unit frame includes a top plate, a bottom base, and multiple fixed support columns connecting the top plate and the bottom base;

[0012] The lifting drive cylinder is vertically fixed below the bottom base, and the upper cylinder rod end of the lifting drive cylinder is fixedly connected to the lower end of the cylinder body of the rotary drive cylinder through a lifting flange.

[0013] The upper cylinder rod end of the rotary drive cylinder is fixedly connected to the lower rotary base. The arm telescopic drive cylinder is fixed to the upper end of the lower rotary base. An upper rotary base is provided above the arm telescopic drive cylinder. The upper rotary base and the lower rotary base are fixedly connected as one unit by multiple rotary support columns arranged along the circumferential direction. The hollow drive shaft is coaxially fixedly connected to the lower magnetohydrodynamic vacuum sealing drive device. The lower flange of the hollow drive shaft is coaxially fixedly connected to the upper rotary base.

[0014] A guide plate is provided above the upper rotating base. The guide plate forms a vertical guide fit with multiple upper guide columns that are vertically fixed to the lower end of the top plate through multiple guide holes. The upper magnetic fluid vacuum sealing transmission device is coaxially fixedly installed on the lower part of the guide plate, and the bearing seat is coaxially fixedly installed on the upper part of the guide plate. A transition flange is coaxially installed on the upper end of the bearing seat through an end face bearing, and a rotating base is coaxially positioned on the upper end of the transition flange.

[0015] The hollow drive shaft is sequentially fitted with the upper magnetic fluid vacuum seal transmission device and the bearing seat from bottom to top, and the upper end of the hollow drive shaft is fixedly connected to the transition flange; the lower end of the central shaft is coaxially fixedly connected to the output shaft of the arm telescopic drive cylinder, and the central shaft is sequentially fitted with the lower magnetic fluid vacuum seal transmission device, the hollow drive shaft, and the transition flange from bottom to top, and the part of the central shaft near the upper end is rotatably fitted with the central hole of the rotating base through the bearing; the upper end of the central shaft is connected to the tip of the telescopic robotic arm.

[0016] A bellows is also provided on the outside of the bearing housing. The upper part of the bellows is welded to the top plate, and the lower part of the bellows is welded to the upper part of the guide plate.

[0017] The retractable robotic arm consists of two sets of robotic arms and an end effector. One set of robotic arms consists of a first linear robotic arm and a left curved arm, with one end of the first linear robotic arm connected to one end of the left curved arm via a revolute joint. The other set of robotic arms consists of a second linear robotic arm and a right curved arm, with one end of the second linear robotic arm connected to one end of the right curved arm via a revolute joint. The end effector adopts a fork structure, with the other ends of both the left and right curved arms fixedly connected to the fork handle of the end effector.

[0018] The upper end of the central shaft is fixedly connected to the other end of one of the linear robotic arms and is equipped with a drive gear; a pin hole is provided on one side of the central hole on the rotating base, and a pin is rotatably installed in the pin hole through a bearing. The upper end of the pin is fixedly connected to the other end of the other linear robotic arm and is equipped with a driven gear, which meshes with the drive gear.

[0019] Moreover, the upper end of the vacuum chamber C is sealed to the upper heating unit, and the lower end of the vacuum chamber C is sealed to the substrate carrier unit, forming a pretreatment chamber inside. The lower end of the upper heating unit located in the pretreatment chamber is equipped with heating lamps.

[0020] The substrate carrier unit includes an anode flange, a shield A, a temperature-controlled anode plate, a ceramic circuit breaker, a high-temperature resistant insulating plug, an insulating sleeve, a temperature-controlled medium input pipe, and a temperature-controlled medium output pipe. The anode flange is located at the lower end of the vacuum chamber C and is fixedly connected to the vacuum chamber C. The shield A is a cylindrical shield with a frustum at the upper end and a flange at the lower end, and the lower flange of the shield A is fixedly connected to the upper end of the anode flange. The ceramic circuit breaker is built into the inner hole of the shield A, and the lower end of the ceramic circuit breaker is fixedly connected to the upper end of the anode flange. The lower end of the temperature-controlled anode plate is fixedly connected to the upper end of the ceramic circuit breaker, and the upper part of the temperature-controlled anode plate extends from the upper part of the shield A. The upper end of the truncated cone extends outward, forming a substrate tray or substrate support surface. A uniformly distributed medium flow channel is formed within the upper part of the temperature-controlled anode plate. A high-temperature resistant insulating plug is installed in the upper part of the inner hole of the ceramic circuit breaker, and an insulating sleeve is fixed at the lower part. The temperature-controlled medium input pipe and temperature-controlled medium output pipe pass through the pipe holes in the high-temperature resistant insulating plug and the inner hole of the insulating sleeve. The upper ends of the two pipes are fixed to the temperature-controlled anode plate and communicate with the built-in medium flow channel. The lower ends of the two pipes extend to below the anode flange. The lower end of the temperature-controlled medium input pipe forms a medium inlet, and the lower end of the temperature-controlled medium output pipe forms a medium return port. The medium inlet and medium return port are connected to an externally installed medium supply device.

[0021] The radio frequency power unit includes a radio frequency protection box and a radio frequency matching unit. The radio frequency protection box is fixed to the bottom of the anode flange by the outer shell flange, so that the temperature control medium input tube and the temperature control medium output tube are located inside the radio frequency protection box. The radio frequency matching unit is installed outside the radio frequency protection box, and the output line of the radio frequency matching unit is electrically connected to the temperature control medium input tube and the temperature control medium output tube through a power transmission clamp.

[0022] Furthermore, the pretreatment actuator also includes a pneumatic grille, which is disposed within the vacuum chamber C, located between the lower part of the upper heating unit and the upper part of the temperature-controlled anode plate. The pneumatic grille includes a grille base plate, grille plates, a swing cylinder, and rigid connecting parts. The grille base plate is fixed to the lower part of the upper heating unit by multiple support columns B, and a square opening is provided in the center of the grille base plate. A fixed seat is fixed on both sides of the square opening at the upper end of the grille base plate, and a sliding seat is slidably disposed above the fixed seats on both sides. Multiple grille plates are arranged in parallel within the square opening, and the lower ends of each grille plate can rotate relative to the fixed seats on both sides through a lower rotating shaft. The connection is as follows: the upper ends of each grid plate are rotatably connected to the sliding seats on both sides via an upper rotating shaft; a rigid connector is provided on the outer side of one side of the sliding seat, one end of the rigid connector is fixedly connected to one end of a forked pin, and the other end of the forked pin is rotatably connected to the outer side of the corresponding sliding seat, with the two ends of the forked pin being parallel; the other end of the rigid connector is connected to the output end of the swing cylinder; a rigid connector lead-out interface is provided on the side wall of the vacuum chamber C, and the rigid connector forms a rotatable sealed fit with the rigid connector lead-out interface through a mechanical seal and bearing; the swing cylinder is fixed on a cylinder bracket outside the vacuum chamber C.

[0023] Furthermore, the vacuum chamber D consists of a lower chamber and an upper cover. The upper cover is sealed and fastened to the upper end of the lower chamber, forming a closed sputtering process chamber inside. An interface for connecting to an external vacuum system and an inlet interface for connecting to a gas supply device are provided on the side wall of the lower chamber. A substrate inlet / outlet F is provided on the side of the lower chamber.

[0024] The sputtering apparatus includes a magnetron cathode, a target material, and a sputtering power supply; the substrate holder system includes a substrate tray, a substrate support, a substrate tray and a substrate support motion drive mechanism; there are multiple substrate trays, which are arranged circumferentially around the center of the substrate support; the substrate tray and substrate support motion drive mechanism is a composite motion drive mechanism used to drive the substrate support to rotate the substrate tray around the center of the revolution axis and simultaneously drive each substrate tray to rotate around its own center of rotation axis;

[0025] A cathode mounting flange is provided on the top cover, or multiple cathode mounting flanges are arranged circumferentially with the center of the top cover as the center. A magnetron cathode is installed at each cathode mounting flange. The target material is installed at the lower end of the magnetron cathode. The sputtering power supply is connected to the magnetron cathode. The substrate tray and substrate support are placed below the magnetron cathode in the sputtering process cavity. Multiple substrate trays and magnetron cathodes are eccentrically arranged in the radial direction of the substrate support.

[0026] Furthermore, the substrate support is a disc-shaped support, coaxially disposed within the lower cavity. The center of the substrate support is coaxially driven and connected to the upper end of the revolution axis. An eccentric mounting through hole is provided on the substrate support, or multiple mounting through holes are arranged circumferentially around the center of the substrate support. A self-rotating bearing seat is installed in each mounting through hole. Each self-rotating bearing seat is rotatably engaged with the self-rotating axis of a substrate tray via a bearing. The motion drive mechanism of the substrate tray and substrate support includes a revolution drive motor, a self-rotating drive motor, a central wheel, and planetary gears. Multiple planetary gears are respectively fixed to the lower ends of multiple self-rotating axes. The central wheel is coaxially fixedly connected to an upper bearing seat, which is positioned and installed in the central hole at the bottom of the lower cavity. The central wheel meshes with multiple planetary gears. A lower bearing seat is fixed at the lower end of the lower cavity, and the lower bearing seat is connected to... The upper bearing housing is coaxially arranged. A bushing, with its upper and lower limits, is installed in the central holes of both the upper and lower bearing housings. The bushing is rotatably connected to the lower bearing housing via a bearing. The upper end of the bushing is connected to the central hole of the upper bearing housing via a key. A first driven wheel is fixed on the bushing below the lower bearing housing. The first driven wheel is connected to a first driving wheel via a synchronous belt or gear meshing. The first driving wheel is fixedly installed at the output end of a self-rotating drive motor, which is fixed below the lower cavity via a motor bracket. The revolution shaft is fitted inside the bushing, and its upper end is rotatably connected to the upper bearing housing via a bearing. A second driven wheel is fixed on the revolution shaft near its lower end. The second driven wheel is connected to a second driving wheel via a synchronous belt or gear meshing. The second driving wheel is fixedly installed at the output end of the revolution drive motor.

[0027] Furthermore, a shield B is installed above the substrate support in the vacuum chamber D via a support column. The shield B has through holes corresponding to the position of each substrate tray for the substrate tray to extend upward. A baffle is provided at the upper end of the shield B between two adjacent substrate trays, and multiple baffles intersect at the center.

[0028] Furthermore, one or more spacing adjustment rings are installed below the housing flange of the magnetron cathode, and the spacing adjustment rings are connected to the cathode flange on the top cover.

[0029] The advantages and positive effects of this invention are as follows:

[0030] 1. The present invention sets up a pre-vacuum unit, a pre-treatment unit and a magnetron sputtering process unit at three positions around the periphery of the transmission unit. The transmission unit connects the four vacuum chambers into an integral chamber structure with a gate valve inside, ensuring that the entire coating process is completed in a closed vacuum environment.

[0031] 2. The extendable robotic arm of the substrate transfer mechanism of the present invention is driven by three coaxially arranged electric cylinders to perform up / down movements, unfolding / retracting movements, and rotational movements. This enables the robotic arm to pick up a substrate from one position and transport it to another position by rotating it at a certain angle within a small transfer space.

[0032] 3. Compared with the existing four-motor driven robotic arm, the substrate transmission mechanism of the present invention simplifies the transmission and coaxial design, resulting in a smaller size, lighter weight, higher degree of integration, more stable and robust structure, and reduced cost.

[0033] 4. After evacuating the vacuum chamber C, the pretreatment actuator of this invention degasses the substrate placed on the upper part of the temperature-controlled anode plate by turning on the heating lamp of the upper heating unit. After degassing, argon gas is introduced through the process gas input interface until it stabilizes, and then the RF matching device is turned on to achieve etching of the substrate surface, achieving a better pretreatment effect. The anode plate is a temperature-controlled anode plate, which can achieve cooling or heating treatment of the anode plate, thereby achieving cooling or heating treatment of the substrate during the etching process. This ensures that the substrate is etched at an optimal temperature, improving etching efficiency. On the other hand, it is applicable to the pretreatment of substrates of various materials and different specifications and sizes, and has good applicability.

[0034] 5. The substrate support of the magnetron sputtering process module of the present invention can be applied to substrate processes of different sizes (such as regular or irregular substrates with a diameter of 8 inches or less) and different materials (such as silicon, ceramic, glass, silicon carbide, gallium arsenide, gallium nitride, sapphire, etc.), realizing the diversity of substrate processes.

[0035] 6. This magnetron sputtering module allows the substrate tray to rotate continuously or in a scanning (back-and-forth) manner around the center of the cathode's revolution axis. Simultaneously, the substrate tray can also rotate around its own axis. Furthermore, the substrate tray's position is offset from the cathode's central axis. During the sputtering process, different parts of a large-diameter substrate supported on the substrate tray can be successively positioned below the target sputtering area. This enables sputtering of large-diameter substrates using a small target. This method reduces target overflow waste and minimizes unusable volume before target replacement, significantly improving target utilization. It also achieves better coating uniformity: for general metals, film thickness uniformity can reach ≤±2%; for magnetic materials, ≤±3%; and for reactive sputtering materials, ≤±3%.

[0036] 7. This magnetron sputtering process module can achieve sputtering coating of a single substrate under the rotation of the substrate tray or a combination of rotation and revolution, and can simultaneously achieve sputtering coating of a target material of one type on multiple substrates under the rotation of the substrate tray or a combination of rotation and revolution. In addition, when multiple magnetron cathodes are installed on the upper cover, targets of different materials can be placed at the lower end of the multiple magnetron cathodes, so as to achieve multi-layer sputtering coating of multiple materials on the surface of the substrate under the same vacuum environment and at different sputtering time stages, thereby realizing the diversity of magnetron sputtering process and improving the applicability of the equipment.

[0037] In summary, this invention, through the cooperation of four functional units, enables the pretreatment of substrates and magnetron sputtering coating under the same vacuum environment, which can significantly improve the production efficiency and coating quality of sputtering coating. Attached Figure Description

[0038] Figure 1 This is an overall structural diagram of the substrate magnetron sputtering coating production equipment of the present invention;

[0039] Figure 2 This is a front view of the pre-vacuum unit of the present invention;

[0040] Figure 3 This is a perspective view of the pre-vacuum unit of the present invention;

[0041] Figure 4 This is a schematic diagram of the internal structure of the pre-vacuum unit of the present invention after the cavity door is removed;

[0042] Figure 5 This is a front view of the substrate transmission unit of the present invention;

[0043] Figure 6 yes Figure 5 AA section view;

[0044] Figure 7 This is a perspective view of the transmission unit of the present invention;

[0045] Figure 8 This is a schematic diagram of the structure of the transmission actuator and the transmission cavity of the present invention;

[0046] Figure 9 This is a schematic diagram of the transmission actuator of the present invention in the retracted state;

[0047] Figure 10 This is a three-dimensional structural diagram of the transmission actuator of the present invention without the protective cover;

[0048] Figure 11 This is a longitudinal sectional view of the transmission actuator of the present invention;

[0049] Figure 12This is a schematic diagram of the transmission actuator of the present invention in the extended state;

[0050] Figure 13 This is an overall appearance view of the preprocessing unit of the present invention;

[0051] Figure 14 This is a cross-sectional view of the upper heating device of the pretreatment unit of the present invention;

[0052] Figure 15 This is a cross-sectional view of the substrate carrier unit and the radio frequency power unit of the preprocessing unit of the present invention;

[0053] Figure 16 This is an overall cross-sectional view of the preprocessing unit of the present invention;

[0054] Figure 17 This is a schematic diagram of the structure of the pneumatic grille of the present invention;

[0055] Figure 18 This is a schematic diagram of the overall appearance of the magnetron sputtering process module of the present invention. Figure 1 ;

[0056] Figure 19 This is a schematic diagram of the overall appearance of the magnetron sputtering process module of the present invention. Figure 2 ;

[0057] Figure 20 This is a schematic diagram of the installation of the magnetron cathode of the magnetron sputtering process module of the present invention on the upper cover plate;

[0058] Figure 21 This is a schematic diagram of the structure of the magnetron cathode in the magnetron sputtering process module of the present invention;

[0059] Figure 22 This is a perspective view of the substrate holder system of the present invention;

[0060] Figure 23 This is an overall sectional view of the substrate holder system of the present invention;

[0061] Figure 24 This is a schematic diagram of the lower cavity of the magnetron sputtering process module of the present invention and its internal mounting structure;

[0062] Reference numerals: 1. Frame; 2. Pre-vacuum unit; 2.1. Vacuum chamber A; 2.2. Chamber door; 2.3. Observation window A; 2.4. Through-beam laser photoelectric switch transmitter; 2.5. Through-beam laser photoelectric switch receiver; 2.6. Flange bellows; 2.7. Cylinder frame; 2.8. Electric cylinder A; 2.9. Substrate inlet / outlet A; 2.10. Frame; 2.10.1. Stage; 3. Transmission unit; 3.1. Vacuum chamber B; 3.1.1. Main chamber; 3.1.2. Upper chamber cover; 3.2. Transmission actuator; 3.2.1. End effector; 3.2.2. Robotic arm; 3.2.2.1. First linear robotic arm; 3.2.2.2. Left curved arm; 3.2.2.3. Second linear robotic arm 3.2.2.4 Right-side curved arm; 3.2.3 Top plate; 3.2.4 Protective cover; 3.2.5 Lifting drive cylinder; 3.2.6 Rotating base; 3.2.7 Limit sleeve; 3.2.8 Upper guide column; 3.2.9 Linear bearing; 3.2.10 Cable fixing corner piece; 3.2.11 Anti-cable entanglement spacer; 3.2.12 Upper rotating base; 3.2.13 Rotating support column; 3.2.14 Arm telescopic drive cylinder; 3.2.15 Lower rotating base; 3.2.16 Rotary drive cylinder; 3.2.17 Bottom base; 3.2.18 Lower guide column; 3.2.19 Guide sleeve fixing seat; 3.2.20 Coupling; 3.2.21 Lower magnetofluidic... 3.2.22 Upper Magnetohydrodynamic Vacuum Sealing Transmission Device; 3.2.23 Guide Plate; 3.2.24 Bearing Housing; 3.2.25 Transition Flange; 3.2.26 Bellows; 3.2.27 Pin; 3.2.28 Driven Gear; 3.2.29 Drive Gear; 3.2.30 Hollow Drive Shaft; 3.2.31 Central Shaft; 3.2.32 Lifting Flange; 3.3 Gate Valve; 3.4 Flange Interface; 3.5 Observation Window B; 3.6 Through-beam Photoelectric Sensor; 4. Pre-processing Unit; 4.1 Upper Heating Unit; 4.1.1 Thermocouple; 4.1.2 Terminal Protective Cover; 4.1.3 Positive Wiring; 4.1.4 Negative Wiring; 4.1.5 Connecting flange; 4.1.6 Top cover; 4.1.7 Positive power supply terminal; 4.1.8 Negative power supply terminal; 4.1.9 Heat insulation cover; 4.1.10 Heat insulation board; 4.1.11 Heating lamp; 4.1.12 Lamp holder; 4.1.13 Viewing window; 4.2 Vacuum chamber C; 4.2.1 Substrate inlet / outlet E; 4.3 Lifting rod; 4.4 Guide seat; 4.5 Top cover connecting frame; 4.6 Substrate bearing unit; 4.6.1 Temperature-controlled anode plate; 4.6.2 High-temperature resistant insulating plug; 4.6.3 Ceramic circuit breaker; 4.6.4 Shielding cover A; 4.6.5 Anode flange; 4.6.6 Outer shell flange; 4.6.7 Insulating sleeve; 4.68. Temperature-controlled medium output pipe; 4.6.9. Temperature-controlled medium input pipe; 4.7. Power transmission fixture; 4.8. RF protection box; 4.9. RF matching unit; 4.10. Pneumatic grille; 4.10.1. Swing cylinder; 4.10.2. Rigid connector; 4.10.3. Fork pin; 4.10.4. Sliding seat; 4.10.5. Fixed seat; 4.10.6. Grille plate; 4.10.7. Grille substrate; 5. Magnetron sputtering process unit; 5.1. Magnetron cathode; 5.2. Gap adjustment pressure ring; 5.3. Top cover; 5.4. Lower cavity; 5.5. Substrate inlet / outlet F; 5.6. Angle valve; 5.7. Self-rotating drive motor 5.8 Revolution drive motor; 5.9 Electric cylinder B; 5.10 Condensate pump; 5.11 Guide seat; 5.12 Observation window D; 5.13 Target material; 5.14 Substrate tray; 5.15 Baffle; 5.16 Shielding cover B; 5.17 First driving wheel; 5.18 First driven wheel; 5.19 Encoder; 5.20 Second driving wheel; 5.21 Second driven wheel; 5.22 Magnetohydrodynamic seal; 5.23 Substrate support; 5.24 Upper bearing seat; 5.25 Center wheel; 5.26 Planetary gear; 5.27 Lower bearing seat; 5.28 Bushing; 5.29 Revolution shaft; 6. Disc body. Detailed Implementation

[0063] The structure of the present invention will be further described below with reference to the accompanying drawings and embodiments. It should be noted that these embodiments are descriptive and not limiting.

[0064] Please refer to the following: A substrate magnetron sputtering coating production equipment. Figures 1-24 The invention features a frame 1, a pre-vacuum unit 2, a transmission unit 3, a pre-treatment unit 4, and a magnetron sputtering process unit 5.

[0065] The pre-vacuum unit, transport unit, pre-processing unit, and magnetron sputtering process unit are integrated and mounted on a rack. The pre-vacuum unit, pre-processing unit, and magnetron sputtering process unit are positioned on three sides outside the transport unit. The pre-vacuum unit is used to achieve multi-layer loading of the substrate. The transport unit is used to transport the substrate between the three units. The pre-processing unit is used to remove moisture from the substrate and etch the substrate surface; the magnetron sputtering process unit is used to perform magnetron sputtering coating on the substrate surface.

[0066] Pre-vacuum unit:

[0067] The pre-vacuum unit mainly includes a vacuum chamber A2.1 and a liftable substrate support frame placed inside the vacuum chamber A2.1. The specific structure is as follows:

[0068] A lockable and sealable door 2.2 is connected to the front of the vacuum chamber A2.1, and a transparent observation window A2.3 is provided in the middle of the door 2.2. The door 2.2, when opened, allows for the insertion of the substrate before coating and its removal after coating is complete. A substrate inlet / outlet A2.9 is provided on the back of the vacuum chamber A2.1 for direct connection to the substrate inlet / outlet B on one side of the transmission unit. The substrate support frame is a three-dimensional frame 2.10 with multiple upper and lower platforms 2.10.1 separated by spacers. Each platform has a positioning boss at its upper center for positioning and supporting the substrate-bearing disk 6. A top rod is connected to the lower end of the substrate support frame. The top rod passes through a rod hole at the lower end of the vacuum chamber A2.1. A flanged bellows 2.6 is provided at the lower end of the vacuum chamber A2.1 outside the top rod to ensure a tight seal between the top rod and the vacuum chamber A2.1. The lower end of the push rod is connected to the push rod of the electric cylinder A2.8 located below the vacuum chamber A2.1. The electric cylinder A2.8 is fixed on the cylinder frame 2.7 below the vacuum chamber A2.1. A through-beam laser photoelectric switch transmitter 2.4 and a through-beam laser photoelectric switch receiver 2.5 are installed opposite to each other on the left and right walls of the vacuum chamber A2.1. These two components constitute a through-beam photoelectric sensor, used to detect the presence of a substrate at a set height position, so as to control the vertical movement of the substrate carrier through the production equipment's control system.

[0069] Transmission unit:

[0070] The transmission unit mainly includes a vacuum chamber B3.1 and a transmission actuator 3.2. The vacuum chamber B3.1 is a transmission chamber and adopts a square box structure, including a main chamber 3.1.1 and an upper cover 3.1.2. The main chamber 3.1.1 has substrate inlets and outlets on three sides, namely substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D. Substrate inlet / outlet B is directly connected to substrate inlet / outlet A of the pre-vacuum unit. Substrate inlet / outlet C is sealed to substrate inlet / outlet E on the vacuum chamber C of the pre-treatment unit through a gate valve 3.3. Substrate inlet / outlet D is sealed to substrate inlet / outlet F on the vacuum chamber D of the magnetron sputtering process unit through a gate valve 3.3, thereby realizing the connection of four vacuum chambers into an integral vacuum chamber structure with a gate in the middle. The upper cavity cover 3.1.2 is a circular cover. A positioning hole is provided at the upper end of the main cavity 3.1.1. The lower end of the upper cavity cover 3.1.2 is sealed to the positioning hole. The two are coaxially arranged and fixedly connected by a ring of screws. An observation window B3.5 is provided at the center of the upper cavity cover 3.1.2, through which the tooling status of the transmission actuator can be observed in a timely manner.

[0071] The transmission actuator mainly includes two sets of robotic arms 3.2.2, an end effector 3.2.1, a lifting drive cylinder 3.2.5, a rotary drive cylinder 3.2.16, an arm extension drive cylinder 3.2.14, a hollow drive shaft 3.2.30, a central shaft 3.2.31, a transmission unit frame, a lower magnetohydrodynamic vacuum seal transmission device 3.2.21, an upper magnetohydrodynamic vacuum seal transmission device 3.2.22, and a bearing seat 3.2.24. The two sets of robotic arms 3.2.2 and the end effector 3.2.1 constitute the robotic arm. The lifting drive cylinder 3.2.5 is a lever-type electric cylinder, and the rotary drive cylinder 3.2.16 and the arm extension drive cylinder 3.2.14 are both rotary electric cylinders. A flange is provided at the lower end of the hollow drive shaft 3.2.30. One set of robotic arms consists of a first linear robotic arm 3.2.2.1 and a left curved arm 3.2.2.2, with one end of the first linear robotic arm connected to one end of the left curved arm via a revolute joint. The other set of robotic arms consists of a second linear robotic arm 3.2.2.3 and a right curved arm 3.2.2.4, with one end of the second linear robotic arm connected to one end of the right curved arm via a revolute joint. The end effector 3.2.1 adopts a fork structure, with the other ends of both the left and right curved arms fixed to the fork handle of the end effector 3.2.1 via screws. The two sets of robotic arms and the end effector 3.2.1 are connected to form a telescopic robotic arm.

[0072] The transmission unit frame consists of a top plate 3.2.3, a bottom base 3.2.17, multiple fixed supports connecting the top plate 3.2.3 and the bottom base 3.2.17, and a protective cover 3.2.4 surrounding the multiple fixed supports. The transmission unit frame has an internal cavity for mounting transmission components. A screw through-hole is provided at the upper end of the top plate 3.2.3, allowing it to be fixed to the lower part of the vacuum chamber B with screws, thus enabling the retractable robotic arm to be housed within the vacuum chamber B.

[0073] The lifting drive cylinder 3.2.5 is vertically fixed below the bottom base 3.2.17. Its cylinder rod extends into the transmission unit frame through the central hole on the bottom base 3.2.17. The upper cylinder rod end of the lifting drive cylinder 3.2.5 is fixedly connected to the lower end of the cylinder body of the rotary drive cylinder 3.2.16 through the lifting flange 3.2.32. A guide sleeve fixing seat 3.2.19 is fixed on the side of the cylinder body of the rotary drive cylinder 3.2.16. A linear bearing is installed in the guide hole of the guide sleeve fixing seat. The linear bearing and the lower guide post 3.2.18 fixed to the bottom base 3.2.17 form a guide fit in the vertical direction.

[0074] The upper cylinder rod end of the rotary drive cylinder 3.2.16 is fixedly connected to the lower rotary base 3.2.15. The arm telescopic drive cylinder 3.2.14 is fixed to the upper end of the lower rotary base 3.2.15. An upper rotary base 3.2.12 is provided above the arm telescopic drive cylinder 3.2.14, and the upper rotary base 3.2.12 and the lower rotary base 3.2.15 are fixedly connected as a whole by multiple rotary support columns 3.2.13 arranged along the circumferential direction. The hollow drive shaft 3.2.30 is fixedly connected to the lower magnetohydrodynamic vacuum seal transmission device 3.2.21 coaxially by screws, and the lower flange of the hollow drive shaft 3.2.30 is fixedly connected to the upper rotary base 3.2.12 coaxially by screws. An anti-cable entanglement spacer 3.2.11 is also installed outside the lower flange of the hollow drive shaft 3.2.30. The anti-cable entanglement spacer is composed of two half-discs joined together and fixedly connected by screws.

[0075] A guide plate 3.2.23 is provided above the upper rotating base 3.2.12. The guide plate 3.2.23 has multiple guide holes arranged circumferentially, and a linear bearing 3.2.9 is installed in each guide hole. These linear bearings, together with multiple upper guide posts 3.2.8 vertically fixed to the lower end of the top plate 3.2.3, form a vertical guiding fit. An inverted L-shaped cable fixing bracket 3.2.10 is also fixed to the lower end of each upper guide post 3.2.8, with a gap between the inner side of the vertical edge of the cable fixing bracket and the outer side of the anti-cable entanglement spacer. The upper magnetohydrodynamic vacuum sealing transmission device 3.2.22 is coaxially fixed to the lower part of the guide plate 3.2.23 by screws, and the bearing seat 3.2.24 is coaxially fixed to the upper part of the guide plate 3.2.23 by screws. A transition flange 3.2.25 is coaxially mounted on the upper end of the bearing housing 3.2.24 via an end face bearing, and a rotating base 3.2.6 is coaxially positioned on the upper end of the transition flange 3.2.25.

[0076] The hollow drive shaft 3.2.30 is sequentially fitted from bottom to top with the upper magnetohydrodynamic vacuum seal transmission device 3.2.22 and the bearing seat 3.2.24, and the upper end of the hollow drive shaft 3.2.30 is fixedly connected to the transition flange 3.2.25 by screws. The lower end of the central shaft 3.2.31 is fixedly connected to the output shaft of the arm telescopic drive cylinder 3.2.14 via a coupling 3.2.20. The central shaft 3.2.31 is sequentially fitted upwards with the lower magnetohydrodynamic vacuum seal transmission device 3.2.21, the hollow drive shaft 3.2.30, and the transition flange 3.2.25. The portion of the central shaft 3.2.31 near the upper end is rotatably fitted with the center hole of the rotating base 3.2.6 via a bearing. The upper end of the central shaft 3.2.31 is fixedly connected to the other end of one of the linear robotic arms and is equipped with a drive gear 3.2.29. A pin hole is provided on one side of the central hole on the rotating base 3.2.6. A pin 3.2.27 is rotatably installed in the pin hole through a bearing. The upper end of the pin is fixedly connected to the other end of another linear robotic arm and a driven gear 3.2.28 is installed thereon. The driven gear 3.2.28 meshes with the driving gear 3.2.29.

[0077] In the above structure, a bellows 3.2.26 is also provided outside the bearing housing 3.2.24. The upper part of the bellows 3.2.26 is welded to the top plate 3.2.3, and the lower part of the bellows 3.2.26 is welded to the upper part of the guide plate 3.2.23. The bellows 3.2.26 is provided to accommodate the vertical movement of the guide plate 3.2.23 and to achieve a vacuum seal on the outer periphery of the bearing housing 3.2.24 and the central hole of the top plate 3.2.3. This layer of seal is the outermost seal. The cooperation between the upper magnetohydrodynamic vacuum sealing transmission device 3.2.22 and the hollow transmission shaft 3.2.30 constitutes the middle layer seal. The cooperation between the lower magnetohydrodynamic vacuum sealing transmission device 3.2.21 and the central shaft 3.2.31 constitutes the inner layer seal. Through the above three layers of seal, this invention makes the substrate transmission mechanism more suitable for vacuum operation environments.

[0078] In the above structure, a limit sleeve 3.2.7 is fixed on the multiple guide columns at the lower end of the top plate 3.2.3 above the guide plate 3.2.23 to achieve the upward limit of the robotic arm.

[0079] This substrate transfer mechanism can realize the lifting and lowering of the two sets of robotic arms driving the end effector 3.2.1, the rotation of the two sets of robotic arms driving the end effector 3.2.1 around the center of the rotating base, and the extension and retraction of the two sets of robotic arms driving the end effector 3.2.1 in the radial direction, thus realizing the transfer of the substrate between different vacuum chambers of the coating production equipment.

[0080] In addition, two flange interfaces 3.4 are reserved on the upper cavity cover 3.1.2 for connection to the external vacuum system and vacuum level detection device. Two sets of through-beam photoelectric sensors 3.6 are installed on the upper cavity cover 3.1.2 and the main cavity 3.1.1. The two sets of through-beam photoelectric sensors are respectively installed near the substrate inlet / outlet C and near the substrate inlet / outlet D, and are used to detect whether the retractable robotic arm has extended into the vacuum cavity C of the pretreatment unit and into the vacuum cavity D of the magnetron sputtering process unit. If the receiver of the through-beam photoelectric sensor does not sense the signal from the generator, it indicates that the retractable robotic arm has extended into the corresponding vacuum cavity. At this time, the gate valve 3.3 between the transmission unit and the corresponding vacuum cavity cannot be closed. If the receiver of the through-beam photoelectric sensor can sense the signal from the generator, it indicates that the retractable robotic arm has not extended into the corresponding vacuum cavity. At this time, the gate valve 3.3 between the transmission unit and the corresponding vacuum cavity needs to be closed to achieve isolation between the vacuum cavities. An exhaust port is also provided at the lower part of the main cavity 3.1.1. An exhaust switch valve is installed at the exhaust port. When the exhaust switch valve is opened, the vacuum in vacuum cavity A and vacuum cavity B can be broken.

[0081] Preprocessing unit:

[0082] The preprocessing unit includes a vacuum chamber C4.2 and a preprocessing actuator. The preprocessing actuator includes an upper heating unit 4.1, a substrate support unit 4.6, and a radio frequency power unit.

[0083] The upper end of the vacuum chamber C4.2 is sealed to the upper heating unit 4.1, and the lower end of the vacuum chamber C4.2 is sealed to the substrate support unit 4.6, forming a pretreatment chamber inside. Multiple flange interfaces are provided on the side wall of the vacuum chamber C4.2, connecting to an externally located vacuum system, vacuum level detection device, process gas supply device (the gas used for etching the substrate, typically argon), and exhaust valve for breaking the vacuum. A substrate inlet / outlet E4.2.1 is also provided on the side wall of the vacuum chamber C4.2, connected to the corresponding substrate inlet / outlet C on the vacuum chamber B via a gate valve. An observation window C is also provided on the side wall of the vacuum chamber C4.2, allowing observation of the interior of the vacuum chamber C4.2 from the outside.

[0084] The upper heating unit 4.1 adopts a heating tube structure, mainly including a top cover 4.1.6, a lamp holder 4.1.12, a viewing window 4.1.13, a heating lamp tube 4.1.11, an upper heat insulation device, a positive power supply terminal 4.1.7, a negative power supply terminal 4.1.8, a positive wire 4.1.3, a negative wire 4.1.4, a thermocouple 4.1.1, a terminal protective cover 4.1.2, and a connecting flange 4.1.5, etc.

[0085] The top cover is supported on the upper end of the vacuum chamber C4.2, and the two are sealed by a sealing ring. The lamp holder is connected to the lower part of the top cover by multiple support columns A, and a viewing window is provided on the lamp holder. The viewing window is fixed below the lamp holder at a position corresponding to the viewing window. The upper heat insulation device consists of a heat insulation cover 4.1.9 with an opening at the lower end and upper and lower multi-layer heat insulation plates 4.1.10 arranged inside the heat insulation cover. The heat insulation cover is fixedly connected to the multiple support columns A and is arranged above the lamp cover. The heating lamp is a halogen heating lamp, and multiple heating lamps are supported parallel to each other above the lamp holder by lamp holders and located below the lowest heat insulation plate inside the heat insulation cover. The multiple heating lamps form a circular radiant heating surface, which is aligned with the viewing window located below. The positive power terminal and the negative power terminal are fixed to the top of the heat insulation cover and are electrically connected to the positive and negative terminals of the heating lamps. A wire hole is provided in the center of the top cover. A connecting flange is fixed at the center of the top cover. The connecting flange has a positive lead hole, a negative lead hole, and a thermocouple passage hole. A terminal protective cover is fixed around the connecting flange on the top cover, with a main cable inlet at its upper end. The positive lead, negative lead, and thermocouple are sealed and pass through the positive lead hole, negative lead hole, and thermocouple lead hole, respectively. The upper ends of the positive lead, negative lead, and thermocouple are all introduced through the main cable inlet. The lower ends of the positive and negative leads are connected to the positive and negative power terminals, respectively. The lower end of the thermocouple extends to a position near the upper end of the viewing window for detecting the heating temperature.

[0086] The substrate carrier unit 4.6 mainly includes an anode flange 4.6.5, a shielding cover A4.6.4, a temperature-controlled anode plate 4.6.1, a ceramic circuit breaker 4.6.3, a high-temperature resistant insulating plug 4.6.2, an insulating sleeve 4.6.7, a temperature-controlled medium input pipe 4.6.9, and a temperature-controlled medium output pipe 4.6.8. The anode flange 4.6.5 is located at the lower end of the vacuum chamber C4.2 and is fixedly connected to the vacuum chamber C4.2 with screws. The shielding cover A4.6.4 is a cylindrical protective cover with a frustum at the upper end and a flange at the lower end; the lower flange of the shielding cover A4.6.4 is fixedly connected to the upper end of the anode flange 4.6.5 with screws. The ceramic circuit breaker 4.6.3 is built into the inner hole of the shielding cover A4.6.4, and the lower end of the ceramic circuit breaker 4.6.3 is fixedly connected to the upper end of the anode flange 4.6.5 with screws. The lower end of the temperature-controlled anode plate 4.6.1 is fixedly connected to the upper end of the ceramic circuit breaker 4.6.3. The upper part of the temperature-controlled anode plate 4.6.1 extends from the upper end of the upper truncated cone, and its upper end forms a support surface. The upper part of the temperature-controlled anode plate 4.6.1 has evenly distributed medium flow channels. A high-temperature resistant insulating plug 4.6.2 is installed in the upper part of the inner hole of the ceramic circuit breaker 4.6.3, and an insulating sleeve 4.6.7 is fixed in the lower part. The temperature-controlled medium input pipe 4.6.9 and temperature-controlled medium output pipe 4.6.8 pass vertically through the pipe holes on the high-temperature resistant insulating plug 4.6.2 and the inner hole of the insulating sleeve 4.6.7. The upper ends of the two pipes are fixed to the temperature-controlled anode plate 4.6.1 and communicate with the built-in medium flow channel. The lower ends of the two pipes extend to below the anode flange 4.6.5. The lower end of the temperature-controlled medium input pipe 4.6.9 forms the medium inlet, and the lower end of the temperature-controlled medium output pipe 4.6.8 forms the medium return port. The medium inlet and medium return port are connected to an external medium supply device to realize the input and output of the medium. Depending on the specific substrate processing requirements, the temperature-controlled medium can be used for cooling or heating.

[0087] The radio frequency power unit includes a radio frequency protection box 4.8 and a radio frequency matching unit 4.9. The radio frequency protection box 4.8 is fixed to the bottom of the anode flange 4.6.5 via the outer shell flange 4.6.6, so that the temperature control medium input pipe 4.6.9 and the temperature control medium output pipe 4.6.8 are located inside the radio frequency protection box 4.8. The radio frequency matching unit 4.9 is installed outside the radio frequency protection box 4.8, and the output line of the radio frequency matching unit 4.9 is electrically connected to the temperature control medium input pipe 4.6.9 and the temperature control medium output pipe 4.6.8 via the power transmission clamp 4.7.

[0088] In addition to the above structure, a lifting mechanism is also provided to raise the upper heating unit 4.1. The lifting mechanism includes a lifting rod 4.3, two guide seats 4.4, a top cover connecting frame 4.5, and a lifting rod drive structure. The two guide seats are fixed vertically to the outer wall of the vacuum chamber C4.2. Linear bearings are installed in the guide holes of the two guide seats, which are aligned vertically. The lifting rod 4.3 passes through the vertically aligned linear bearings. The upper end of the lifting rod 4.3 is fixedly connected to the top cover connecting frame 4.5, which is fixed to the top cover. The lifting rod drive structure can be a drive cylinder, such as an electric cylinder, or a combination structure of gear transmission and lead screw nut driven by a handwheel.

[0089] In addition to the above structure, a pneumatic grille 4.10 is also provided inside the vacuum chamber C4.2, located between the lower part of the upper heating unit 4.1 and the upper part of the temperature-controlled anode plate 4.6.1. The pneumatic grille 4.10 includes a grille base plate 4.10.7, grille plates 4.10.6, a swing cylinder 4.10.1, and a rigid connector 4.10.2. The grille base plate 4.10.7 is fixed to the lower part of the upper heating unit 4.1 by multiple support columns B, and a square opening is provided in the middle of the grille base plate 4.10.7. A fixing seat 4.10.5 is fixed on each side of the square opening at the upper end of the grille base plate 4.10.7, and a sliding seat 4.10.4 is slidably provided above each of the two fixing seats 4.10.5. Multiple grille plates 4.10.6 are arranged in parallel within the square opening. The lower ends of each grid plate 4.10.6 are rotatably connected to the fixed seats 4.10.5 on both sides via a lower pivot, and the upper ends of each grid plate 4.10.6 are rotatably connected to the sliding seats 4.10.4 on both sides via an upper pivot. A rigid connector 4.10.2 is provided on the outer side of one sliding seat 4.10.4. One end of the rigid connector 4.10.2 is fixedly inserted into one end of a fork pin 4.10.3, and the other end of the fork pin 4.10.3 is rotatably connected to the outer side of the corresponding sliding seat 4.10.4. The two ends of the fork pin 4.10.3 are parallel (not on the same axis), and the other end of the rigid connector 4.10.2 is connected to the output end of a swing cylinder 4.10.1. A rigid connector 4.10.2 lead-out interface is provided on the side wall of the vacuum chamber C4.2. The rigid connector 4.10.2 forms a rotatable sealed fit with the lead-out interface through a mechanical seal and bearing. The swing cylinder 4.10.1 is fixed on the electric cylinder bracket outside the vacuum chamber C4.2. This pneumatic grille 4.10 drives the rigid connector 4.10.2 to rotate through the swing cylinder 4.10.1. The rigid connector 4.10.2 drives the sliding seat 4.10.4 to slide on the fixed seat 4.10.5, realizing the rotation of the grille pieces around the lower pivot center. When all the grille pieces 4.10.6 rotate to the horizontal position, the directional opening on the grille substrate 4.10.7 is closed, which can avoid the adverse effects of metal particles generated during the etching process impacting the upper heating unit 4.1. When all the grid plates 4.10.6 are rotated to the vertical position, the substrate placed on the temperature-controlled anode plate 4.6.1 can be heated by the upper heating unit to remove moisture from the substrate.

[0090] Magnetron sputtering process unit:

[0091] The magnetron sputtering process unit includes a vacuum chamber D and the magnetron sputtering execution unit. The vacuum chamber D is externally connected to a vacuum pumping system, a gas supply system, and a vacuum-breaking switch valve via pre-installed interfaces. The magnetron sputtering execution unit includes the sputtering apparatus, a substrate holder system, and a gas supply system.

[0092] The vacuum chamber D adopts a cylindrical cavity structure, consisting of a lower cavity 5.4 and an upper cover 5.3. The lower cavity 5.4 is mounted on the frame. A substrate inlet / outlet F5.5 is provided on the side of the lower cavity 5.4, and the substrate inlet / outlet F is sealed to the corresponding substrate inlet / outlet D on the vacuum chamber B through a gate valve. In addition, a transparent observation window D5.12 is provided on the side wall of the lower cavity 5.4 to facilitate observation of the internal conditions during sputtering. The upper cover 5.3 is sealed and covers the upper end of the lower cavity 5.4, forming a closed sputtering process chamber. A cathode mounting flange is provided on the upper cover 5.3, or multiple cathode mounting flanges are arranged circumferentially around the center of the upper cover 5.3, and a magnetron cathode 5.1 can be installed at each cathode mounting flange.

[0093] The vacuum system includes a condenser pump 5.10, a primary vacuum pump, a fully automatic gate valve, a bypass vacuum valve, and a charging valve. The condenser pump is connected to a flange interface pre-reserved on the side wall of the lower cavity 5.4 via the fully automatic gate valve. The primary vacuum pump is connected to a flange interface pre-reserved on the side wall of the lower cavity 5.4 via the bypass vacuum valve. The charging valve is connected to a pre-reserved interface position on the side wall of the lower cavity 5.4.

[0094] The capacitive vacuum gauge is installed at the angle valve 5.6 on the side wall of the lower cavity 5.4 to monitor the vacuum level of the cavity during the sputtering process.

[0095] The sputtering apparatus includes magnetron cathodes 5.1, target materials 5.13, and a sputtering power supply. The target material 5.13 is mounted on the lower end of each set of magnetron cathodes 5.1 via clamps or adhesive bonding. Each set of magnetron cathodes 5.1 is electrically connected to the sputtering power supply, which can be DC, radio frequency, etc. The magnetron control device of the magnetron cathodes 5.1 can employ a permanent magnet system or an electromagnetic coil system. The outer shell flanges of multiple sets of magnetron cathodes 5.1 are fixedly connected to multiple cathode mounting flanges on the upper cover 5.3 using screws.

[0096] The substrate holder system is a magnetron anode system, comprising a substrate tray 5.14, a substrate support 5.23, a substrate tray motion drive mechanism, wherein a rotation shaft is fixed at the lower center of the substrate tray 5.14. The substrate support 5.23 is a disc-shaped support, coaxially disposed within the lower cavity 5.4, and its center is coaxially driven to the upper end of a revolution shaft 5.29. An eccentric mounting through hole is provided on the substrate support 5.23, or multiple mounting through holes are arranged circumferentially around its center. A rotation bearing seat is installed in each mounting through hole. Each rotation bearing seat is rotatably engaged with the rotation shaft of a substrate tray 5.14 via a bearing. The substrate tray and substrate support motion drive mechanism is a composite motion drive mechanism, used to drive the substrate support 5.23 to rotate multiple substrate trays 5.14 around the center of the revolution axis 5.29, and simultaneously drive each substrate tray 5.14 to rotate around its own rotation axis. Specifically, it includes a revolution drive motor 5.8, a rotation drive motor 5.7, a central wheel 5.25, and planetary gears 5.26. Multiple planetary gears 5.26 are respectively fixed to the lower ends of multiple rotation axes. The central wheel 5.25 is coaxially fixedly connected to an upper bearing seat 5.24, which is positioned and installed in the central hole at the bottom of the lower cavity 5.4. The central wheel 5.25 meshes with the multiple planetary gears 5.26. A lower bearing seat 5.27 is fixed to the lower end of the lower cavity 5.4. The lower bearing seat 5.27 is coaxially arranged with the upper bearing seat 5.24. A bushing 5.28, which is limited vertically, is installed in the central hole of the upper bearing seat 5.24 and the central hole of the lower bearing seat 5.27. The bushing 5.28 and the lower bearing seat 5.27 are rotatably connected by bearings. The upper end of the bushing 5.28 is connected to the central hole of the upper bearing seat 5.24 by a key. A first driven wheel 5.18 is fixed on the bushing 5.28 below the lower bearing seat 5.27. The first driven wheel 5.18 is connected to a first driving wheel 5.17 through a synchronous belt or gear meshing. The first driving wheel 5.17 is fixedly installed at the output end of a self-rotating drive motor 5.7. The self-rotating drive motor 5.7 is fixed to the lower part of the lower cavity 5.4 by a motor bracket.

[0097] The revolution shaft 5.29 is fitted inside the bushing 5.28 with clearance, and its upper end is rotatably connected to the upper bearing seat 5.24 via a bearing. A second driven wheel 5.21 is fixed on the revolution shaft 5.29 near its lower end. The second driven wheel 5.21 is connected to the second driving wheel 5.20 via a synchronous belt or gear meshing. The second driving wheel 5.20 is fixedly installed at the output end of the revolution drive motor 5.8. Furthermore, to detect the revolution speed and rotation speed, an encoder 5.19 is fixedly installed at the lower end of the revolution shaft 5.29. Additionally, a magnetohydrodynamic seal 5.22 is installed on the revolution shaft 5.29 above the second driven wheel 5.21. The upper end of the magnetohydrodynamic seal 5.22 forms an insert-fitting position with the lower end of the bushing 5.28. The function of the magnetohydrodynamic seal 5.22 is to maintain a high vacuum environment within the cavity.

[0098] The aforementioned substrate support 5.23 can rotate continuously or in a scanning (back and forth) manner around the axis of revolution 5.29 under the magnetron cathode 5.1, with a speed of up to 5 RPM, and can be quickly accelerated to a certain uniform speed; while the substrate tray 5.14 can rotate around the center of its own rotation axis, with a rotation speed of up to 30 RPM, and the position of the substrate tray 5.14 can be offset from the center of the magnetron cathode 5.1 to obtain better uniformity.

[0099] The lower cavity 5.4 is grounded via a cable.

[0100] Additionally, a shielding cover B5.16 ​​is mounted above the substrate support 5.23 within the vacuum chamber D via a support column. The shielding cover B5.16 ​​has through holes corresponding to the positions of each substrate tray 5.14, allowing the substrate tray 5.14 to extend upwards. A baffle 5.15 is positioned at the upper end of the shielding cover B5.16 ​​between two adjacent substrate trays 5.14, with multiple baffles 5.15 intersecting at their centers. The shielding cover B5.16 ​​and the baffles 5.15 reduce cross-contamination between different magnetron cathodes 5.1.

[0101] The gas supply system includes a flow meter, shut-off valve, and gas supply pipeline. A gas supply interface is installed at the bottom of the lower cavity 5.4, which can supply Ar, N2, and O2 as needed. The gas supply pipeline is made of stainless steel electropolished tubing and is equipped with a shut-off valve and VCR interface.

[0102] In the above structure, to facilitate the replacement of the target material 5.13 and the shielding cover B5.16, an automatic lifting mechanism for the upper cover is also included. The automatic lifting mechanism for the upper cover includes an electric cylinder B5.9, guide seats 5.11, and an upper cover connecting frame. The electric cylinder B5.9 is vertically fixed on the lower frame, and multiple guide seats 5.11 are fixed on the outer side wall of the lower cavity 5.4 in the vertical direction. The upper cover connecting frame is fixed to the upper end of the upper cover 5.3. The cylinder rod of the electric cylinder B5.9 passes through the guide holes on the two cylinder rod guide seats 5.11, and its upper end is connected to the upper cover connecting frame.

[0103] In the above structure, in order to adjust the distance between the target 5.13 and the substrate to further optimize the uniformity of the coating and the deposition rate, a distance adjustment ring 5.2 is installed below the housing flange of the magnetron cathode 5.1. By adjusting the number of distance adjustment rings, the installation height of the magnetron cathode 5.1 can be adjusted, thereby adjusting the distance between the target 5.13 and the substrate. In this invention, the distance between the target 5.13 and the substrate can be adjusted from 30 to 80 mm.

[0104] The process of coating the substrate in this invention is as follows:

[0105] 1. Establish preconditions for coating work: Use an external vacuum system to ensure that the pre-vacuum unit, transfer unit, pretreatment unit, and magnetron sputtering process unit are in a high vacuum state.

[0106] 2. Substrate loading: Open the exhaust valve at the lower end of vacuum chamber B to allow it to automatically break the vacuum and return to atmospheric conditions. Then, open the front door of vacuum chamber A and place multiple substrates directly or via disk 6 onto the multi-layer platform of the substrate carrier. Close the door. Then, start the vacuum system to restore vacuum chambers A and B to a high vacuum state. During this process, vacuum chambers A and B remain connected, and the two chambers eventually reach the same vacuum level.

[0107] 3. Perform self-inspection of the substrate in vacuum chamber A: According to the program settings, the electric cylinder A supporting the substrate carrier is activated, causing the substrate carrier to rise; on the left and right walls of vacuum chamber A, there are through-beam laser photoelectric switch transmitters and receivers installed opposite each other. Through the signals from the transmitter and receiver, the through-beam photoelectric sensor detects whether there is a substrate on the substrate carrier at the set height position, so as to confirm the substrate status of the pre-vacuum chamber unit in the fully automatic process flow.

[0108] 4. Transferring the substrate from the pre-vacuum unit to the pre-processing unit: The lifting drive cylinder of the transfer unit actuates, causing the rotary drive cylinder, arm extension drive cylinder, hollow drive shaft, central shaft, lower magnetic fluid vacuum sealing drive device, upper magnetic fluid vacuum sealing drive device, two sets of robotic arms, and end effector to move as a whole to the lower working position; then, the rotary drive cylinder actuates, causing the extendable robotic arm to rotate to a position aligned with the substrate inlet / outlet B of the transfer unit; then, the arm extension drive cylinder actuates, causing the left and right curved arms to unfold, driving the end effector to extend into the vacuum chamber A through the substrate inlet / outlet A of the pre-vacuum unit; finally, the lifting drive cylinder actuates, causing the extendable robotic arm to move to the upper working position, where the end effector's forks support or carry the substrate. The retractable robotic arm moves the substrate tray or substrate to the lower working position via the arm extension drive cylinder, retracting and folding the left and right curved arms. Then, via the rotation drive cylinder, the retractable robotic arm rotates the substrate tray or substrate to a position aligned with the substrate inlet / outlet C of the vacuum chamber B. At this point, the gate valve is open. Then, via the arm extension drive cylinder, the left and right curved arms extend, causing the end effector to extend into the vacuum chamber C through the substrate inlet / outlet E of the pretreatment unit. By moving the lifting drive cylinder, the retractable robotic arm moves to the lower working position, placing the substrate or substrate tray 6 onto the support surface of the temperature-controlled anode plate. Then, via the arm extension drive cylinder, the left and right curved arms retract and fold. Finally, the gate valve at the substrate inlet / outlet E of the vacuum chamber C is closed.

[0109] 5. Degassing and Etching of the Substrate: The upper heating unit is activated to degas the substrate. After degassing is completed within the set time, the upper heating unit is turned off. Argon gas is then introduced into the vacuum chamber C. When the pressure inside the vacuum chamber C reaches a set stable state, the radio frequency power source is activated. Under the action of the radio frequency electric field, the argon gas is ionized, generating argon ions and electrons. The argon ions gain energy after being accelerated in the electric field and bombard the substrate surface, removing material from the substrate surface through physical sputtering, thus achieving the etching effect. During the etching process, depending on the specific process requirements, a cooling or heating medium (such as water) can be introduced through the temperature-controlled medium input pipe to regulate the substrate temperature, and the heat-exchanged medium can be output through the temperature-controlled medium output pipe. Alternatively, the substrate can be heated through the upper heating unit. During this heating process, the pneumatic grid needs to be activated and the argon gas input needs to be paused.

[0110] 6. Transferring the pretreated substrate to the magnetron sputtering process unit: First, the gate valve at the substrate inlet / outlet E of the vacuum chamber C is opened. The arm extension / retraction drive cylinder actuates, causing the left and right curved arms to extend, driving the end effector to extend into the vacuum chamber C through the substrate inlet / outlet E of the pretreatment unit, supporting the pretreated substrate. Then, the lifting drive cylinder lifts the substrate from the support surface of the temperature-controlled anode plate. Next, the arm extension / retraction drive cylinder actuates, causing the left and right curved arms to retract and fold. Finally, the rotation drive cylinder rotates the extendable robotic arm to align with the substrate inlet / outlet D of the transfer unit. At this point, the gate valve at the substrate inlet / outlet F of the magnetron sputtering process unit is open, while the gate valve at the substrate inlet / outlet E of the pretreatment unit is closed. Then, the arm extension / retraction drive cylinder extends the left and right curved arms, driving the end effector to extend into the vacuum chamber D through the substrate inlet / outlet F of the magnetron sputtering process unit. Then, the lifting drive cylinder moves the retractable robotic arm to the lower working position, placing the substrate or substrate-carrying disk 6 onto the substrate tray. Then, the left and right curved arms retract and fold back using the arm extension / retraction drive cylinder. The gate valve at the substrate inlet / outlet F of the vacuum chamber D is closed.

[0111] 7. Perform magnetron sputtering coating on the substrate surface: Turn on the gas supply system of the magnetron sputtering process unit and introduce the sputtering gas medium. When the set gas flow rate is reached, the magnetron cathode is energized, and the substrate holder rotation drive motor and revolution drive motor are turned on, so that the substrate completes the coating while rotating and revolving.

[0112] 8. Return the coated substrate to the pre-vacuum unit: After the substrate coating is completed, the gate valve at the substrate inlet / outlet F of the vacuum chamber D is opened. Through the coordinated extension, rotation and lifting movements of the telescopic robotic arm, the coated substrate is sent to the initial placement position of the substrate carrier in the pre-vacuum unit, and the gate valve at the substrate inlet / outlet F of the vacuum chamber D is closed.

[0113] 9. Substrate Unloading: When the substrate is placed on the substrate carrier, the robotic arm returns to its original position. Vacuum chamber A automatically breaks the vacuum, restoring it to atmospheric conditions; the front door of vacuum chamber A is opened, and the substrate or disk 6 placed on the substrate carrier is removed, then the door is closed. The vacuum system is activated to restore vacuum chamber A to a high vacuum state; during this process, vacuum chamber A and vacuum chamber B remain connected, and the two chambers eventually reach the same vacuum level, thus completing the entire substrate coating process.

[0114] Although embodiments and drawings of the present invention have been disclosed for illustrative purposes, those skilled in the art will understand that various substitutions, variations and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the contents disclosed in the embodiments and drawings.

Claims

1. A substrate magnetron sputtering coating production equipment, comprising a frame (1), a pre-vacuum unit (2), a transmission unit (3), a pretreatment unit (4), and a magnetron sputtering process unit (5); the pre-vacuum unit (2), the transmission unit (3), the pretreatment unit (4), and the magnetron sputtering process unit (5) are integrated and installed on the frame (1); the pre-vacuum unit (2), the pretreatment unit (4), and the magnetron sputtering process unit (5) are located at three positions outside the transmission unit (3); the transmission unit (3) is connected to the substrate inlet / outlet A (2.9) of the pre-vacuum unit (2), the substrate inlet / outlet E of the pretreatment unit (4), and the substrate inlet / outlet F (5.5) of the magnetron sputtering process unit (5) through substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D, respectively, and gate valves (3.3) are respectively provided at the connection points with the pretreatment unit (4) and the magnetron sputtering process unit (5); The pre-vacuum unit (2) includes a vacuum chamber A (2.1) and a liftable substrate carrier placed inside the vacuum chamber A (2.1) for multi-layer loading of substrates; the transfer unit (3) includes a vacuum chamber B (3.1) and a transfer actuator (3.2). The transfer actuator (3.2) is a robotic arm capable of lifting, rotating, and extending, used to transfer the substrate between the pre-vacuum unit (2), the pre-processing unit (4), and the magnetron sputtering process unit (5); the pre-processing unit (4) includes a vacuum chamber C (4.2) and pre-processing execution mechanism; the pre-processing execution mechanism includes an upper heating unit (4.1), a substrate carrier unit (4.6) and an RF power unit, used to remove water vapor on the substrate and etch the substrate surface; the magnetron sputtering process unit (5) includes a vacuum chamber D and a magnetron sputtering execution part; the magnetron sputtering execution part includes a sputtering device, a substrate holder system and a gas supply device, the sputtering device and the substrate holder system are arranged opposite each other to realize sputtering coating of the substrate while it revolves around the central axis of the substrate holder system and rotates around its own central axis; The vacuum chamber D consists of a lower chamber (5.4) and an upper cover (5.3). The upper cover (5.3) is sealed to the upper end of the lower chamber (5.4), forming a closed sputtering process chamber. The sputtering device includes a magnetron cathode (5.1), a target material (5.13), and a sputtering power supply. The substrate holder system includes a substrate tray (5.14), a substrate support (5.23), and a substrate tray and substrate support motion drive mechanism. There are multiple substrate trays (5.14), with the multiple substrate trays (5.14) centered on the substrate support (5.23). The substrate tray and substrate support are arranged in a circular direction around the center; the motion drive mechanism of the substrate tray and substrate support is a compound motion drive mechanism for driving the substrate support (5.23) to drive the substrate tray (5.14) to rotate around the center of the revolution axis (5.29) and simultaneously driving each substrate tray (5.14) to rotate around its own rotation axis; the revolution drive motor (5.8) provides power for the substrate support (5.23) to drive the substrate tray to rotate around the center of the revolution axis (5.29), and the rotation drive motor (5.7) provides power for the substrate tray to rotate around its own rotation axis; Multiple cathode mounting flanges are provided on the upper cover (5.3) with the center of the upper cover (5.3) as the center and arranged in a circumferential direction. A magnetron cathode (5.1) is installed at each cathode mounting flange. The target material (5.13) is installed at the lower end of the magnetron cathode (5.1). The sputtering power supply is connected to the magnetron cathode (5.1). The substrate tray (5.14) and the substrate support (5.23) are placed below the magnetron cathode (5.1) in the sputtering process cavity. The multiple substrate trays (5.14) and the magnetron cathode (5.1) are eccentrically arranged in the radial direction of the substrate support (5.23). A shielding cover B (5.16) is installed above the substrate support (5.23) in the vacuum chamber D via a support column. The shielding cover B (5.16) has through holes corresponding to the positions of each substrate tray (5.14) for the substrate tray (5.14) to extend upward. A baffle (5.15) is provided at the upper end of the shielding cover B (5.16) between two adjacent substrate trays (5.14), and multiple baffles (5.15) intersect at the center.

2. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: A lockable and sealable door (2.2) is connected to the front of the vacuum chamber A (2.1), and a substrate inlet / outlet A (2.9) is provided on the back of the vacuum chamber A (2.1). The substrate support frame is a three-dimensional frame (2.10) with multiple upper and lower platforms (2.10.1) separated by spacers. Each platform (2.10.1) has a positioning boss at the center of its upper end for positioning and supporting the substrate disk. The lower end of the substrate support frame is connected to a top rod, which is located through a rod hole at the lower end of the vacuum chamber A (2.1). A flanged bellows (2.6) is provided at the lower end of the vacuum chamber A (2.1) outside the push rod; the lower end of the push rod is connected to the push rod of the electric cylinder A (2.8) located below the vacuum chamber A (2.1); the electric cylinder A (2.8) is fixed on the cylinder frame (2.7) below the vacuum chamber A (2.1); a through-beam laser photoelectric switch transmitter (2.4) and a through-beam laser photoelectric switch receiver (2.5) are installed opposite to each other on the left and right walls of the vacuum chamber A (2.1), which together constitute a through-beam photoelectric sensor.

3. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: The vacuum chamber B (3.1) adopts a square box structure, including a main chamber (3.1.1) and an upper chamber cover (3.1.2). The main chamber (3.1.1) has substrate inlets and outlets on three sides, namely substrate inlet / outlet B, substrate inlet / outlet C and substrate inlet / outlet D. Substrate inlet / outlet B is directly connected to substrate inlet / outlet A of the pre-vacuum unit. Substrate inlet / outlet C is sealed to substrate inlet / outlet E on the vacuum chamber C (4.2) of the pretreatment unit (4) through a gate valve (3.3). Substrate inlet / outlet D is sealed to substrate inlet / outlet F (5.5) on the vacuum chamber D of the magnetron sputtering process unit (5) through a gate valve (3.3), so that the four vacuum chambers are connected into an integral vacuum chamber structure with a gate in the middle. The structure includes: the upper cavity cover (3.1.2) is a circular cavity cover, with a positioning circular hole at the upper end of the main cavity (3.1.1), and the lower end of the upper cavity cover (3.1.2) is sealed to the positioning circular hole, and the two are coaxially arranged and fixedly connected; an observation window B (3.5) is provided in the center of the upper cavity cover (3.1.2); two flange interfaces (3.4) are also reserved on the upper cavity cover (3.1.2) for connection with the external vacuum system and vacuum degree detection device; two sets of through-beam photoelectric sensors (3.6) are installed on the upper cavity cover (3.1.2) and the main cavity (3.1.1), and the two sets of through-beam photoelectric sensors (3.6) are respectively installed near the substrate inlet / outlet C and near the substrate inlet / outlet D.

4. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: An interface for connecting to an external vacuum system and an air inlet for connecting to a gas supply device are provided on the side wall of the lower cavity (5.4); a substrate inlet / outlet F (5.5) is provided on the side of the lower cavity (5.4).

5. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: The substrate support (5.23) is a disc-shaped support, coaxially disposed within the lower cavity (5.4). The center of the substrate support (5.23) is coaxially driven to the upper end of the revolution axis (5.29). An eccentric mounting through hole is provided on the substrate support (5.23), or multiple mounting through holes are arranged circumferentially around the center of the substrate support (5.23). A self-rotating bearing seat is installed in each mounting through hole. Each self-rotating bearing seat is rotatably engaged with the self-rotating axis of a substrate tray (5.14) via a bearing. The motion drive mechanism of the substrate tray and substrate support includes a revolution drive. The structure includes a motor (5.8), a self-rotating drive motor (5.7), a central gear (5.25), and planetary gears (5.26). Multiple planetary gears (5.26) are fixed to the lower ends of multiple rotating shafts. The central gear (5.25) is coaxially fixedly connected to an upper bearing housing (5.24), which is positioned within the central hole at the bottom of the lower cavity (5.4). The central gear (5.25) meshes with multiple planetary gears (5.26). A lower bearing housing (5.27) is fixed at the lower end of the lower cavity (5.4), and the lower bearing housing (5.27) is coaxial with the upper bearing housing (5.24). The upper and lower bearing housings (5.27) are fitted with vertically and vertically limited bushings (5.28), which are installed in the central holes of the upper bearing housing (5.24) and the lower bearing housing (5.27) respectively. The bushings (5.28) are rotatably connected to the lower bearing housing (5.27) via bearings, and the upper end of the bushings (5.28) is connected to the central hole of the upper bearing housing (5.24) via a key. A first driven wheel (5.18) is fixed on the bushings (5.28) below the lower bearing housing (5.27). The first driven wheel (5.18) is connected to the first driving wheel (5.17) via a synchronous belt or gear meshing. The first driving wheel (5.17) is fixed. The self-rotating drive motor (5.7) is fixedly installed at the output end of the self-rotating drive motor (5.7), which is fixed below the lower cavity (5.4) by a motor bracket; the revolution shaft (5.29) is inserted into the bushing (5.28) with a gap, and its upper end is rotatably connected to the upper bearing seat (5.24) by a bearing; a second driven wheel (5.21) is fixed on the revolution shaft (5.29) near the lower end, and the second driven wheel (5.21) is connected to the second driving wheel (5.20) by a synchronous belt or gear meshing, and the second driving wheel (5.20) is fixedly installed at the output end of the revolution drive motor (5.8).

6. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: One or more spacing adjustment rings (5.2) are installed below the housing flange of the magnetron cathode (5.1), and are connected to the cathode flange on the top cover (5.3) through the spacing adjustment rings (5.2).

Images