Diamond abrasive surface electroplating device and method for grinding and cutting tools
By setting up multiple anodes and vibration drive mechanisms in the electroplating box and combining them with electromagnetic adsorption, the problems of uneven contact between diamond particles and cathodes and uneven plating are solved, uniform electroplating on the surface of diamond abrasives is achieved, and the electroplating efficiency and tool performance are improved.
Patent Information
- Application Number
- CN202510758539.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2045-06-09
AI Technical Summary
Traditional diamond surface electroplating equipment has problems such as poor contact uniformity between diamond particles and the cathode, poor conductivity, and uneven plating, making it difficult to achieve uniform and firm metal plating deposition on the surface of diamond particles.
The electroplating box is equipped with multiple spaced anodes and a vibration drive mechanism, combined with an electromagnetic adsorption mechanism. Through flow field disturbance and vibration drive, the diamond abrasives are evenly dispersed and fully contacted with the cathode, achieving uniform deposition of nickel. Ultrasonic vibration is used to prevent particles from being adsorbed on the anode surface, and magnetic force selectively adsorbs particles with perfect coatings, and the electroplating process is carried out in a circulating flow.
The coating on the surface of diamond abrasive grains is uniform and dense, the bonding strength and service life of diamond tools are improved, and the electroplating efficiency is enhanced.
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Figure CN120250121B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of diamond surface processing, and in particular to a device and method for electroplating the surface of diamond abrasive grains used for grinding and cutting tools. Background Art
[0002] Diamond, one of nature's hardest substances, possesses excellent mechanical properties and stable chemical properties. Plating diamond particles with a layer of metal effectively enhances the bond between the diamond particles and the substrate in diamond tools, thereby improving the tool's service life, performance, and efficiency. The most common method involves electroplating the diamond surface, which involves pre-treating the diamond, followed by chemical plating, and then electroplating to deposit a metal coating on the diamond surface.
[0003] However, traditional diamond surface electroplating equipment has problems such as poor contact uniformity between diamond particles and cathode, poor conductivity and uneven plating of diamond particles, making it difficult to better uniformly and firmly plate the metal coating on the surface of diamond particles. Summary of the Invention
[0004] In order to solve the above technical problems existing in the prior art, the present invention provides a device and method for electroplating the surface of diamond abrasive grains for grinding and cutting tools.
[0005] The technical solution of the present invention to solve the above technical problems is as follows:
[0006] The first aspect of the present invention is to provide a surface electroplating device for diamond abrasives for grinding and cutting tools, comprising an electroplating box and a liquid storage tank, wherein the liquid storage tank is used to contain electroplating liquid, and the diamond abrasives are dispersed in the electroplating liquid. An anode and a cathode are provided in the electroplating box, and a plurality of anodes are provided at intervals, and a vibration drive mechanism is provided on the anode; an inlet and an outlet are provided on the electroplating box, and the inlet and outlet are respectively connected to the liquid storage tank through pipelines for the circulation of diamond abrasives and electroplating liquid; an electromagnetic adsorption mechanism is provided in the liquid storage tank.
[0007] The diamond abrasive surface electroplating device provided by the present invention performs electroplating coating on the surface of the diamond abrasive in an electroplating box. Multiple anodes arranged at intervals provide metal ions and disperse the electroplating solution into multiple flow channels, causing the electroplating solution to generate multiple flow field disturbances. At the same time, a vibration drive mechanism is used to drive the anode to vibrate, so that the diamond abrasives in the electroplating solution are evenly dispersed and continuously move, thereby increasing the contact between the diamond abrasives and the cathode, so that the diamond abrasives are fully and evenly dispersed and fully contact the cathode, so that the nickel element precipitated from the cathode is evenly deposited on the surface of the diamond particles. At the same time, the vibration drive mechanism prevents the diamond abrasives from being adsorbed on the surface of the anode and promotes the precipitation of cations at the anode, thereby increasing the cation concentration in the electroplating solution and accelerating the electroplating process. The diamond abrasives and the electroplating solution circulate between the electroplating box and the liquid storage tank. Diamond abrasives with uniform and complete coatings are adsorbed by the electromagnetic adsorption mechanism and no longer undergo electroplating, while diamond abrasives with imperfect coatings continue to undergo electroplating to deposit the coating, so that the surface coating of the diamond abrasives is more uniform, complete, and dense.
[0008] On the basis of the above technical solution, the present invention can also make the following improvements:
[0009] Furthermore, the cathode is arranged on the bottom inner wall of the electroplating box, the anode is arranged on the cathode, the anode is extended in a vertical direction, and an insulating gasket is arranged between the anode and the cathode.
[0010] The beneficial effect of adopting the above-mentioned further technical solution is that: the cathode is set on the bottom inner wall of the electroplating box, and during the process of flow field disturbance and vibration of the electroplating solution, the diamond particles are evenly distributed in the electroplating solution and keep moving, thereby constantly and evenly contacting the cathode on the bottom inner wall of the electroplating box, that is, increasing the contact between the diamond abrasives and the cathode, so that the nickel element precipitated from the cathode is evenly deposited on the surface of the diamond particles; the anode is extended in the vertical direction, which can increase the flow field disturbance effect on the electroplating solution in the vertical direction of the electroplating box; an insulating gasket is set between the anode and the cathode, which can reduce the transmission of vibration to the electroplating box body while isolating.
[0011] Furthermore, the inlet and the outlet are respectively arranged on opposite side walls of the electroplating box, and the anodes are distributed in an array between the inlet and the outlet.
[0012] Furthermore, adjacent anodes are arranged in an S-shape along the flow direction of the electroplating solution.
[0013] The beneficial effect of adopting the above-mentioned further technical solution is that the anodes are arranged crosswise, and the plating solution generates flow field disturbance (Karman vortex street phenomenon) when passing through the anode, so that the diamond abrasive particles in the plating solution are evenly dispersed and fully contacted with the cathode.
[0014] Furthermore, the vibration driving mechanism is an ultrasonic vibrator, and each of the anodes is connected to the ultrasonic vibrator.
[0015] The beneficial effects of adopting the above-mentioned further technical solution are: causing the nickel column anode to generate ultrasonic vibration, improving the uniform contact between the diamond abrasive particles and the cathode, and at the same time causing the nickel ions adsorbed on the cathode surface to fall off, so that the nickel ions are deposited on the surface of the diamond particles in contact with the cathode in the form of nickel element after gaining electrons, thereby improving the diamond plating effect; utilizing ultrasonic vibration to promote the precipitation of cations on the anode, increase the cation concentration in the electroplating solution, accelerate electroplating, and improve the diamond electroplating effect.
[0016] Furthermore, the height of the liquid storage tank is lower than that of the electroplating tank, the inlet is connected to the liquid storage tank through a first pipeline, and the outlet is connected to the liquid storage tank through a second pipeline. The first pipeline is provided with a magnetic pump, a flow meter and a flow valve.
[0017] Furthermore, the electromagnetic adsorption mechanism is provided at the bottom of the liquid storage tank, and the electromagnetic adsorption mechanism is connected to an electromagnetic power supply, and the electromagnetic power supply controls the magnetic force value of the electromagnetic adsorption mechanism.
[0018] The beneficial effects of adopting the above-mentioned further technical solution are as follows: the plated metal has weak magnetism, and the degree of perfection of the plating is different, that is, different magnetism can screen diamond particles with different plating effects; the magnitude of the current is controlled by the electromagnetic power supply, thereby changing the magnetic force. As the electroplating process proceeds, the magnetic force gradually increases, thereby adsorbing the remaining plated diamond particles. Diamond particles with more perfect plating will be attracted to the bottom and no longer undergo cyclic electroplating; while diamond particles with imperfect plating will continue to be sucked into the electroplating box for electroplating, thereby obtaining diamond abrasive particles with uniform and perfect plating.
[0019] Furthermore, the inlet is connected to a plurality of nozzles, the plurality of nozzles are spaced or evenly distributed, and the nozzles are flat as a whole; an agitator is provided in the liquid storage tank; and the anode and cathode are connected to an electroplating power supply.
[0020] The beneficial effects of adopting the above further technical solution are: the nozzle is flat as a whole, forming a stable and uniform flow field, so that the diamond particles in the plating solution are more fully in contact with the cathode; and the diamond particles in the plating solution are evenly distributed through the rotation and stirring of the stirrer.
[0021] Furthermore, the anode is a nickel column, and the electroplating solution contains nickel ions.
[0022] The beneficial effects of adopting the above-mentioned further technical solution are: achieving nickel plating on the surface of the diamond abrasive; by adopting a nickel column anode, the entire plating liquid in the plating box produces flow field disturbance, and the mixed plating liquid produces a vortex in the plating box, so that the diamond particles are evenly distributed and fully contacted with the cathode.
[0023] Another aspect of the present invention is to provide a method for electroplating a coating on the surface of diamond abrasive grains, using the above-mentioned diamond abrasive grain surface electroplating device for grinding and cutting tools, comprising the following steps:
[0024] S1, mixing diamond abrasive grains and electroplating solution and injecting them into a liquid storage tank, mixing them evenly with a stirrer, turning on a magnetic pump, and delivering the mixture of diamond abrasive grains and electroplating solution into the electroplating tank through a first pipeline;
[0025] S2, the mixed liquid is evenly sprayed into the interior of the electroplating box, and the mixed liquid generates flow field disturbance when passing through the anode, and the vibration drive mechanism and electroplating power supply are started to perform surface plating treatment on the diamond abrasive grains;
[0026] S3. The mixed liquid flows back to the liquid storage tank through the second pipeline, and the electromagnetic power supply is turned on. The diamond abrasive grains with complete coating on the surface are adsorbed to the electromagnetic adsorption mechanism, and the diamond abrasive grains that are not coated and / or not completely coated with coating are transported to the electroplating box through the first pipeline to continue the surface electroplating treatment.
[0027] Compared with the prior art, the present invention has the following technical effects:
[0028] The diamond abrasive surface electroplating device provided by the present invention is used for grinding and cutting tools. A nickel layer is electroplated on the surface of the diamond abrasive in an electroplating box. Multiple anode nickel columns arranged at intervals provide metal ions while dispersing the electroplating solution into multiple flow channels, causing the electroplating solution to generate multiple flow field disturbances. At the same time, a vibration drive mechanism drives the anode to generate high-frequency vibrations, forming multi-source disturbances in the electroplating solution flow field, causing the diamond abrasive in the electroplating solution to continuously move, thereby increasing the contact between the diamond abrasive and the cathode, achieving better contact reaction between the diamond particles and the cathode, and making the diamond powder electroplating more uniform.
[0029] The flow field disturbance causes the mixed plating solution to generate a swirl in the electroplating box. The diamond particles in the plating solution are constantly moving, making them constantly in contact with the cathode at the bottom of the electroplating box, increasing the contact probability and contact uniformity between the diamond particles and the cathode, and enhancing conductivity.
[0030] The adjacent nickel column anodes are arranged in an S-shaped cross pattern, which effectively disturbs the flow field of the electroplating solution, making the diamond powder evenly distributed and increasing the electroplating efficiency on the surface of the diamond abrasive grains.
[0031] The vibration drive mechanism vibrates the anode, preventing diamond abrasive particles from adsorbing on the anode surface and promoting the precipitation of positive ions (nickel ions) at the anode, increasing the concentration of positive ions (nickel ions) in the electroplating solution and accelerating the electroplating process. At the same time, the positive ions (nickel ions) in the solution adsorb on the cathode surface and gain electrons to form nickel. The vibration of the vibration drive mechanism causes the electroplating box to vibrate at a high frequency, thereby causing the nickel on the cathode surface to fall off. Furthermore, the vibration effect allows diamond particles that fall to the bottom of the electroplating box to be recycled for electroplating.
[0032] Diamond abrasives and electroplating liquid circulate between the electroplating box and the liquid storage tank to achieve efficient and high-quality electroplating coating on the surface of the diamond abrasives. Diamond nickel-plated powder is selectively adsorbed by magnetic force. Diamond abrasives with uniform and perfect coating are adsorbed by the electromagnetic adsorption mechanism and no longer undergo electroplating. Diamond abrasives with uneven, imperfect and unplated coating are circulated into the electroplating box for continued electroplating, making the surface coating of the diamond abrasives more uniform and perfect. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 Schematic diagram of the structure of the diamond abrasive surface electroplating device of the present invention;
[0034] Figure 2 It is a structural diagram of the electroplating box;
[0035] Figure 3 Schematic diagram of the structure of cathode, nozzle and insulating gasket.
[0036] Reference numerals:
[0037] 1. Electroplating box; 2. Anode; 3. Vibration drive mechanism; 4. First pipeline; 5. Electroplating power supply; 6. Cathode; 7. Second pipeline; 8. Liquid storage tank; 9. Agitator; 10. Magnetic pump; 11. Flow meter; 12. Flow valve; 13. Nozzle; 14. Workbench; 15. Electromagnetic power supply; 16. Insulating gasket. DETAILED DESCRIPTION
[0038] The following is an explanation of the embodiments of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.
[0039] Example:
[0040] See also Figure 1-3, a diamond abrasive surface electroplating device, comprising an electroplating box 1 and a liquid storage tank 8 placed on a workbench 14, wherein the height of the liquid storage tank 8 is lower than that of the electroplating box 1, and the liquid storage tank 8 is used to contain an electroplating solution, wherein the electroplating solution contains nickel ions, and the diamond abrasives are uniformly dispersed in the electroplating solution. A stirrer 9 is provided in the liquid storage tank 8, and the diamond particles in the electroplating solution are uniformly distributed by the rotation and stirring of the stirrer 9; a nickel column anode 2 and a cathode 6 are provided in the electroplating box 1, and the anode 2 and the cathode 6 are connected to an electroplating power supply 5, and a plurality of nickel column anodes 2 are arranged at intervals, and a vibration drive mechanism 3 is provided on the nickel column anode 2, and the vibration drive mechanism 3 is an ultrasonic vibrator, and each of the nickel column anodes 2 are connected to the ultrasonic vibrator, and the nickel column anode 2 is vibrated by the ultrasonic vibrator; an inlet and an outlet are provided on the electroplating box 1, and the inlet is connected to a plurality of nozzles 13, and the plurality of nozzles 13 are spaced apart, and the nozzles 13 are flat as a whole; the inlet and the outlet are both provided on the side wall of the electroplating box 1 near the bottom, and the inlet and the outlet are provided on opposite side walls to facilitate the circulation of the electroplating solution, and the inlet and the outlet are respectively connected to the liquid storage tank 8 through pipelines for the circulation of diamond abrasives and electroplating solution. Specifically, the inlet is connected to the liquid storage tank 8 through a first pipeline 4, and the outlet is connected to the liquid storage tank 8 through a second pipeline 7. The first pipeline A magnetic pump 10, a flow meter 11 and a flow valve 12 are provided on the circuit 4. The magnetic pump 10 is turned on to transport the electroplating liquid in the liquid storage tank 8 to the electroplating box 1. The flow rate is controlled by manipulating the flow valve 12 and recorded by the flow meter 11. By controlling the flow rate of the electroplating liquid, the electroplating liquid containing diamond particles slowly flows out into the electroplating box 1, reducing the diamond particles and the electroplating liquid in the electroplating box 1, thereby controlling the electroplating speed and performing slow electroplating, which is conducive to a tighter and more uniform nickel layer on the surface of the diamond; the cathode 6 is provided on the bottom inner wall of the electroplating box 1, and the nickel column anode 2 is provided on the cathode 6. The nickel column anode 2 is extended in the vertical direction in the electroplating box 1, and an insulating layer is provided between the anode 2 and the cathode 6. The edge gasket 16 effectively prevents the contact between the two electrodes and plays an insulating role; the anodes 2 are distributed in an array between the inlet and the outlet, and the adjacent anodes 2 are arranged in an S shape along the flow direction of the electroplating solution, and the nickel columns are cross-arranged, which can achieve sufficient disturbance of the electroplating solution flow field, while increasing the contact probability between the cathode 6 and the diamond particles, and realizing efficient plating of the diamond particles; an electromagnetic adsorption mechanism is provided in the liquid storage tank 8, and the electromagnetic adsorption mechanism is provided at the bottom of the liquid storage tank 8, and the electromagnetic adsorption mechanism is connected to the electromagnetic power supply 15, and the electromagnetic power supply 15 controls the magnetic force value of the electromagnetic adsorption mechanism. Specifically, as the electroplating process proceeds, the magnetic force gradually increases, thereby adsorbing the remaining nickel-plated diamond particles.
[0041] The anode 2 and cathode 6 are connected to the positive pole and negative pole of the electroplating power supply 5 respectively through wires, and the electromagnetic adsorption mechanism is connected to the electromagnetic power supply 15 through wires.
[0042] During the electroplating process, some diamond particles, due to their large size, will fall to the bottom of the electroplating box 1 under the action of gravity and friction and will no longer undergo cyclic electroplating. The ultrasonic vibrator will cause these diamond particles to tumble up and down in the electroplating box 1, thereby undergoing a cyclic electroplating process with the electroplating mixture.
[0043] The stirrer 9 may be of any form in the prior art, as long as it can achieve stirring and mixing of the solution.
[0044] It should be noted that, before the diamond abrasive grains are subjected to electroplating treatment, they are pre-treated and chemically plated to improve the electrical conductivity of the diamond abrasive grains so as to better perform the electroplating treatment.
[0045] After the electroplating power supply 5 is turned on, the cathode 6 contacts the diamond particles. The diamond particles can conduct electric charges due to pre-treatment, so the surface of the diamond particles is negatively charged. The nickel ions in the solution neutralize the negative charge on the diamond surface to form nickel element. However, inevitably, a part of the nickel ions still forms nickel element on the surface of the cathode 6.
[0046] The method for electroplating a coating on the surface of a diamond abrasive grain using the diamond abrasive grain surface electroplating device of the present invention comprises the following steps:
[0047] S1. Diamond abrasive grains are mixed with an electroplating solution, which is a mixed solution of nickel chloride, nickel sulfate, boric acid, ammonium lauryl sulfate, a dispersant, a complexing agent, and a stabilizer, and then injected into a liquid storage tank 8. After being uniformly mixed by an agitator 9, a magnetic pump 10 is turned on to transport the mixture of diamond abrasive grains and the electroplating solution into the electroplating tank 1 through a first pipeline 4. The flow rate of the mixture is controlled by operating a flow valve 12 and recorded by a flow meter 11.
[0048] S2. The mixed solution is evenly sprayed into the electroplating box 1 at a stable flow rate through the nozzle 13. When the mixed solution passes through the nickel column anode 2, flow field disturbance is generated, and the mixed plating solution generates a vortex in the electroplating box 1, so that the diamond particles in the electroplating solution are evenly dispersed, continuously moving and fully contacting with the cathode 6. The ultrasonic vibrator and the electroplating power supply 5 are started. The nickel ions precipitated from the nickel column anode 2 move toward the cathode 6 under the action of the electric field and gain electrons, and are reduced to nickel element and deposited on the surface of the diamond particles in contact with the cathode 6, thereby performing surface plating treatment on the diamond abrasive particles. The ultrasonic vibrator is connected to the nickel column anode 2 to realize ultrasonic vibration of the nickel column anode 2, so that the diamond particles adsorbed on the anode 2 and the cathode 6 fall off and continuously move, increasing the contact with the cathode 6. The diamond particles are in continuous contact with the cathode 6, thereby improving the nickel plating effect of the diamond particles;
[0049] S3, after flowing through the nickel column anode 2, the electroplated mixed solution flows back to the liquid storage tank 8 through the second pipeline 7, and the electromagnetic power supply 15 is turned on. The diamond abrasive particles with the surface completely coated with the coating are adsorbed to the electromagnetic adsorption mechanism and no longer undergo cyclic electroplating treatment. The diamond abrasive particles that are not coated and / or not completely coated with the nickel coating are transported to the electroplating box 1 through the first pipeline 4 and continue the surface electroplating treatment, thereby obtaining uniformly coated nickel-plated diamonds;
[0050] S4. Repeat the above steps and gradually increase the magnetic force of the electromagnetic adsorption mechanism through the electromagnetic power supply 15 until all the diamond abrasive grains are adsorbed to the electromagnetic adsorption mechanism, thereby obtaining diamond abrasive grains with uniform and perfect coating, and the electroplating is completed.
[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A diamond abrasive surface electroplating device for grinding and cutting tools, characterized in that: The invention comprises an electroplating box (1) and a liquid storage box (8), wherein the liquid storage box (8) is used to contain electroplating liquid, wherein the diamond abrasive particles are dispersed in the electroplating liquid, wherein an anode (2) and a cathode (6) are provided in the electroplating box (1), wherein a plurality of anodes (2) are provided at intervals, and a vibration driving mechanism (3) is provided on the anode (2); an inlet and an outlet are provided on the electroplating box (1), wherein the inlet and the outlet are respectively connected to the liquid storage box (8) through pipelines for the circulation of the diamond abrasive particles and the electroplating liquid; and an electromagnetic adsorption mechanism is provided in the liquid storage box (8); The cathode (6) is arranged on the bottom inner wall of the electroplating box (1), the anode (2) is arranged on the cathode (6), the anode (2) is extended in a vertical direction, and an insulating gasket (16) is arranged between the anode (2) and the cathode (6).
2. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 1, characterized in that: The inlet and the outlet are respectively arranged on opposite side walls of the electroplating box (1), and the anodes (2) are distributed in an array between the inlet and the outlet.
3. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 2, characterized in that: Along the flow direction of the electroplating solution, adjacent anodes (2) are arranged in an S shape.
4. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 1, characterized in that: The vibration driving mechanism (3) is an ultrasonic vibrator, and each of the anodes (2) is connected to the ultrasonic vibrator.
5. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 1, characterized in that: The height of the liquid storage tank (8) is lower than that of the electroplating tank (1); the inlet is connected to the liquid storage tank (8) through a first pipeline (4); the outlet is connected to the liquid storage tank (8) through a second pipeline (7); and the first pipeline (4) is provided with a magnetic pump (10), a flow meter (11) and a flow valve (12).
6. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 5, characterized in that: The electromagnetic adsorption mechanism is arranged at the bottom of the liquid storage tank (8), and the electromagnetic adsorption mechanism is connected to an electromagnetic power supply (15), and the electromagnetic power supply (15) controls the magnetic force value of the electromagnetic adsorption mechanism.
7. The diamond abrasive surface electroplating device for grinding and cutting tools according to claim 1, characterized in that: The inlet is connected to a plurality of nozzles (13), the plurality of nozzles (13) are spaced or evenly distributed, and the nozzles (13) are flat as a whole; an agitator (9) is provided in the liquid storage tank (8); and the anode (2) and cathode (6) are connected to an electroplating power supply (5).
8. The diamond abrasive surface electroplating device for grinding and cutting tools according to any one of claims 1 to 7, characterized in that: The anode (2) is a nickel column, and the electroplating solution contains nickel ions.
Citation Information
Patent Citations
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