Device for detecting installation quality of deep-cavity inner hole part

Abstract

The invention discloses a deep cavity inner hole part installation quality detection device, which comprises a printed board, an electronic part and a detection mechanism, and is characterized in that the detection mechanism is used for welding and installing the electronic part in a deep cavity inner hole in the printed board and evaluating the welding quality of the electronic part and the printed board; the detection mechanism comprises a controller; the controller is electrically connected with a thermal imaging display instrument and a laser; and a detection module and a processing module are arranged in the controller. According to the device, operation is convenient, a standardized detection result can be obtained immediately after welding is completed, compared with X-Ray detection equipment and metallographic microscope sampling detection or batch detection, if installation quality problems exist, the device can also be found and rectified in time, the defective rate can be reduced, and practicability is high.

Description

Technical Field

[0001] The present invention relates to the technical field of part detection, and particularly relates to a detection device for the installation quality of parts with deep inner holes. Background Art

[0002] With the progress of electronic technology, the packaging of used electronic components is developing towards "miniaturization", "high density", and "fine pitch". Microelectronic technology includes microelectronic components and microelectronic assembly (connection) technology. So far, the main factor restricting the further realization of high performance and miniaturization of electronic products is no longer the components themselves, but the assembly method of the circuit system. The quality of welding directly affects the performance reliability and economic effect of electronic products.

[0003] Such as Figure 1 and Figure 2 , it is necessary to weld and install electronic parts 4 in the deep cavity small holes 2 of the printed circuit board 1. The diameter of the deep cavity small holes 2 is generally 0.5 - 2 mm, and the diameter-depth ratio ≤ 0.5. Therefore, the installation method of the parts in the deep inner holes 2 is to use laser soldering technology to realize the welding and installation of the deep cavity small holes 2 in the printed circuit board 1 and the electronic parts 4.

[0004] After the installation of the parts in the deep inner holes of the printed circuit board is completed, it is necessary to detect the quality of the welded installation. Since the welding points are located in the deep inner holes of the printed circuit board and cannot be observed with the naked eye, it is necessary to conduct sampling detection or batch inspection through professional equipment such as X-Ray detection equipment and metallographic microscopes after welding. Not only is the detection operation troublesome, but also a standardized detection result cannot be obtained in a timely manner when the welding is completed. Summary of the Invention

[0005] The present invention provides a detection device for the installation quality of parts with deep inner holes to solve the problems raised in the above background art.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A detection device for the installation quality of parts with deep inner holes, including a printed circuit board and electronic parts, includes a detection mechanism. The detection mechanism is used to evaluate the welding quality of the electronic parts and the printed circuit board when the electronic parts are welded and installed in the deep inner holes of the printed circuit board;

[0008] The detection mechanism includes a controller, and the controller is electrically connected to a thermal imaging display and a laser;

[0009] The controller is provided with a detection module and a processing module;

[0010] The detection module includes a power detection unit for detecting the laser power of the laser, a welding time detection unit for detecting the laser welding time of the laser, a spot diameter detection unit for detecting the spot diameter generated by the laser welding of the laser, and a diameter ratio detection unit for detecting the ratio of the diameter of the solder ball put into the deep cavity hole to the diameter of the deep cavity hole;

[0011] The processing module includes an evaluation unit and a judgment unit.

[0012] Preferably, the power detection unit and the welding time detection unit are electrically connected to the signal terminal of the laser to directly obtain the laser power and the laser welding time during laser welding of the laser.

[0013] Preferably, the laser welding in the deep cavity hole generates a spot that produces a thermal effect, causing the temperature distribution on the target surface to change. The thermal imaging display captures the change in the temperature distribution, forms thermal image data, and sends it to the controller. The spot diameter detection unit can detect the spot diameter by analyzing the thermal image.

[0014] Preferably, by detecting in advance the diameter data of the solder ball to be put in and the diameter of the deep cavity hole and inputting them into the controller, the diameter ratio detection unit obtains the diameter ratio through the formula: diameter ratio = diameter data of the deep cavity hole / diameter of the solder ball.

[0015] Preferably, the detection method of the detection device for the installation quality of the deep cavity hole parts includes the following specific steps:

[0016] In the first step, the end of the electronic part to be installed is docked with one end of the deep cavity hole, and then the solder ball is thrown into the deep cavity hole. During welding, the focus of the laser falls on the solder ball, and the solder ball generates a spot and melts to form a solder joint, completing the welding installation of the end of the electronic part and one end of the deep cavity hole;

[0017] In the second step, during the welding installation process, through the power detection unit, welding time detection unit, spot diameter detection unit, and diameter ratio detection unit in the detection module, the laser power, welding time, spot diameter, and the ratio of the diameter of the solder ball to the diameter of the deep cavity hole during welding are respectively detected to obtain the power V, time T, spot diameter L, and diameter ratio N, and they are transmitted to the evaluation unit;

[0018] In the third step, the obtained power V, time T, spot diameter L, and diameter ratio N are summarized to form detection condition information, a data model is constructed and optimized and trained. Through the analysis software, regression analysis is performed on the obtained power V, time T, spot diameter L, and diameter ratio N to obtain the influence of power V, time T, spot diameter L, and diameter ratio N on the welding forming quality, and the power influence factor Av, time influence factor At, spot diameter influence factor Al, and diameter ratio influence factor An are output;

[0019] In the fourth step, the evaluation unit obtains the power V, time T, spot diameter L, and diameter ratio N, and performs dimensionless processing on them, and correlates them to form an evaluation coefficient PG. Its correlation model is:

[0020]

[0021] Among them, Av represents the output power influence factor, 0.21 ≤ Av ≤ 0.45; At represents the time influence factor, 0.32 ≤ At ≤ 0.53; Al represents the spot diameter influence factor, 0.46 ≤ Al ≤ 0.81; An represents the diameter ratio influence factor, 0.67 ≤ An ≤ 0.93;

[0022] In the fifth step, according to the obtained evaluation coefficient PG, it is evaluated whether the welding and installation quality of the deep cavity hole parts on the printed circuit board meets the standard.

[0023] Preferably, in the fifth step, according to the obtained evaluation coefficient PG, it is evaluated whether the welding and installation quality of the deep cavity hole parts on the printed circuit board meets the standard. Specifically:

[0024] The obtained evaluation coefficient PG is transmitted to the judgment unit and compared with the preset threshold. If the evaluation coefficient PG is within the range of the preset threshold, the welding and installation quality of the deep cavity hole parts on the printed circuit board meets the standard. If the evaluation coefficient PG is not within the range of the preset threshold, the welding and installation quality does not meet the standard.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] The present invention is not only convenient to operate, but also can immediately obtain standardized detection results after one welding is completed. Compared with X-Ray detection equipment, metallographic microscope sampling detection or batch detection, if there are installation quality problems in this device, they can be found and rectified in time, which can reduce the defective rate and has high practicability.

[0027] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly and implement it according to the content of the specification, the following takes the preferred embodiment of the present invention and details it in conjunction with the accompanying drawings. The specific implementation manner of the present invention is given in detail by the following embodiments and their accompanying drawings. Brief Description of the Drawings

[0028] The drawings described herein are provided to further understand the present invention and form a part of this application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0029] Figure 1 It is a schematic cross-sectional view of the welding structure of a printed circuit board and electronic components;

[0030] Figure 2 It is a schematic cross-sectional view of the printed circuit board;

[0031] Figure 3 It is a schematic structural view of a detection device for the installation quality of deep cavity inner hole parts proposed by the present invention.

[0032] In the drawings, the list of components represented by each reference numeral is as follows:

[0033] 1. Printed circuit board; 2. Deep cavity inner hole; 3. Solder joint; 4. Electronic component; 5. Thermal imaging display; 6. Controller; 7. Laser. Detailed Embodiments

[0034] The principles and features of the present invention will be described below in conjunction with the drawings. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention. In the following paragraphs, the present invention will be described more specifically by way of example with reference to the drawings. It should be noted that the drawings are all in a very simplified form and use non-precise scales, only for the purpose of conveniently and clearly assisting in explaining the objectives of the embodiments of the present invention.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0036] In an embodiment of the present invention, a detection device for the installation quality of deep cavity inner hole parts includes a printed circuit board 1 and an electronic component 4, and includes a detection mechanism. The detection mechanism is used to evaluate the welding quality of the electronic component 4 and the printed circuit board 1 when the electronic component 4 is welded and installed in the deep cavity inner hole 2 of the printed circuit board 1;

[0037] The detection mechanism includes a controller 6, and the controller 6 is electrically connected to a thermal imaging display 5 and a laser 7;

[0038] The controller 6 is provided with a detection module and a processing module;

[0039] The processing module includes an evaluation unit and a judgment unit;

[0040] The detection module includes a power detection unit for detecting the laser power of the laser 7, a welding time detection unit for detecting the laser welding time of the laser 7, a spot diameter detection unit for detecting the spot diameter generated by the laser welding of the laser 7, and a diameter ratio detection unit for detecting the ratio of the diameter of the solder ball put into the deep cavity hole 2 to the diameter of the deep cavity hole 2;

[0041] Specifically: The power detection unit and the welding time detection unit are electrically connected to the signal terminal of the laser 7 to directly obtain the laser power and the laser welding time during the welding of the laser 7;

[0042] The laser welding spot in the deep cavity hole 2 will generate a thermal effect, causing the temperature distribution on the target surface to change. The thermal imaging display 5 captures the change in the temperature distribution, forms thermal image data, and sends it to the controller 6. The spot diameter detection unit can detect the spot diameter by analyzing the thermal image;

[0043] By detecting in advance the diameter data of the solder ball to be put in and the diameter of the deep cavity hole 2 and inputting them into the controller 6, the diameter ratio detection unit obtains the diameter ratio through the formula: diameter ratio = diameter data of the deep cavity hole 2 / diameter of the solder ball;

[0044] The detection method of the detection device for the installation quality of the deep cavity hole parts includes the following specific steps:

[0045] In the first step, the end of the electronic part 4 to be installed is butted against one end of the deep cavity hole 2, and then the solder ball is thrown into the deep cavity hole 2. During welding, the focus of the laser 7 falls on the solder ball, and the solder ball generates a spot and melts to form a solder joint 3, completing the welding installation of the end of the electronic part 4 and one end of the deep cavity hole 2;

[0046] In the second step, during the welding installation process, through the power detection unit, welding time detection unit, spot diameter detection unit, and diameter ratio detection unit in the detection module, the laser power, welding time, spot diameter, and the ratio of the diameter of the solder ball to the diameter of the deep cavity hole 2 during welding are respectively detected to obtain the power V, time T, spot diameter L, and diameter ratio N, and they are transmitted to the evaluation unit;

[0047] In the third step, the obtained power V, time T, spot diameter L, and diameter ratio N are summarized to form detection condition information, a data model is constructed and optimized and trained. The obtained power V, time T, spot diameter L, and diameter ratio N are subjected to regression analysis through the analysis software spss to obtain the influence of the power V, time T, spot diameter L, and diameter ratio N on the welding forming quality, and the power influence factor Av, time influence factor At, spot diameter influence factor Al, and diameter ratio influence factor An are output;

[0048] In the fourth step, the evaluation unit obtains the power V, time T, spot diameter L, and diameter ratio N, and performs dimensionless processing on them, and correlates them to form an evaluation coefficient PG. The correlation model is:

[0049]

[0050] Among them, Av represents the output power influence factor, 0.21 ≤ Av ≤ 0.45; At represents the time influence factor, 0.32 ≤ At ≤ 0.53; Al represents the spot diameter influence factor, 0.46 ≤ Al ≤ 0.81; An represents the diameter ratio influence factor, 0.67 ≤ An ≤ 0.93;

[0051] In the fifth step, according to the obtained evaluation coefficient PG, it is evaluated whether the welding and installation quality of the deep cavity inner hole parts of the printed circuit board meets the standard. Specifically:

[0052] The obtained evaluation coefficient PG is transmitted to the judgment unit and compared with the preset threshold. If the evaluation coefficient PG is within the range of the preset threshold, the welding and installation quality of the deep cavity inner hole parts of the printed circuit board meets the standard. If the evaluation coefficient PG is not within the range of the preset threshold, the welding and installation quality does not meet the standard.

[0053] Experimental comparison: 50 products with the deep cavity inner hole 2 welded and installed with the electronic component 4 are respectively inspected by the X-Ray detection equipment, metallurgical microscope and the detection method of the detection device of the present invention to obtain the probability that the quality meets the standard. The probability that the quality meets the standard = the number of conforming standards / the total number of detections. The results are as follows in the table:

[0054]

[0055]

[0056] It can be seen from the above table that the detection method accuracy rate of the detection device of the present invention is the same as that of the X-Ray detection equipment and the metallurgical microscope. Moreover, the present invention is not only convenient to operate, but also can immediately obtain a standardized detection result after one welding is completed. Compared with the sampling detection or batch detection of the X-Ray detection equipment and the metallurgical microscope, if there are installation quality problems in this device, they can also be discovered and rectified in time, and the practicability is high.

[0057] As described above, it is only the preferred embodiment of the present invention, and it does not impose any form of limitation on the present invention; any ordinary technician in the industry can smoothly implement the present invention according to the illustrations in the specification and the above description; however, any minor changes, modifications, and equivalent variations made by those skilled in the art within the scope of the technical solution of the present invention by using the technical content disclosed above are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications, and evolutions made to the above embodiments based on the essential technology of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A detection device for the installation quality of parts with deep inner holes, comprising a printed circuit board (1) and an electronic component (4), characterized in that, It includes a detection mechanism which is used to evaluate the welding quality of the electronic component (4) welded and installed in the deep cavity hole (2) on the printed circuit board (1). The detection mechanism includes a controller (6), and the controller (6) is electrically connected to a thermal imaging display (5) and a laser (7). The controller (6) is provided with a detection module and a processing module. The detection module includes a power detection unit for detecting the laser power of the laser (7), a welding time detection unit for detecting the laser welding time of the laser (7), a spot diameter detection unit for detecting the spot diameter generated by the laser welding of the laser (7), and a diameter ratio detection unit for detecting the ratio of the diameter of the solder ball put into the deep cavity hole (2) to the diameter of the deep cavity hole (2). The processing module includes an evaluation unit and a judgment unit.

2. The inspection device for the installation quality of a deep cavity inner hole part according to claim 1, characterized in that, The power detection unit and the welding time detection unit are electrically connected to the signal end of the laser (7) to directly obtain the laser power and the laser welding time when the laser (7) is welding.

3. The detection device for the installation quality of a deep cavity inner hole part according to claim 2, characterized in that, The laser welding in the deep cavity hole (2) generates a spot that produces a thermal effect, causing the temperature distribution on the target surface to change. The thermal imaging display (5) captures the change in the temperature distribution to form thermal image data and sends it into the controller (6). The spot diameter detection unit can detect the spot diameter by analyzing the thermal image.

4. The inspection device for the installation quality of a deep cavity inner hole part according to claim 3, characterized in that, By detecting in advance the diameter data of the solder ball to be put in and the diameter of the deep cavity hole (2) and inputting them into the controller (6), the diameter ratio detection unit obtains the diameter ratio through the formula: diameter ratio = diameter data of the deep cavity hole (2) / diameter of the solder ball.

5. The inspection device for the installation quality of a deep cavity inner hole part according to claim 4, characterized in that, The detection method of the detection device for the installation quality of the deep cavity hole parts includes the following specific steps: First step, dock the end of the electronic component (4) to be installed with one end of the deep cavity hole (2), then throw the solder ball into the deep cavity hole (2). When welding, the focus of the laser (7) falls on the solder ball, and the solder ball generates a spot and melts to form a solder joint (3), so that the end of the electronic component (4) is welded and installed with one end of the deep cavity hole (2). Second step, during the welding and installation process, through the power detection unit, welding time detection unit, spot diameter detection unit, and diameter ratio detection unit in the detection module, respectively detect the laser power, welding time, spot diameter, and the ratio of the diameter of the solder ball to the diameter of the deep cavity hole (2) during welding, obtain the power V, time T, spot diameter L, and diameter ratio N, and transmit them to the evaluation unit. Third step, summarize the obtained power V, time T, spot diameter L, and diameter ratio N to form detection condition information, construct a data model and optimize and train it. Through regression analysis of the obtained power V, time T, spot diameter L, and diameter ratio N by analysis software, obtain the influence of the power V, time T, spot diameter L, and diameter ratio N on the welding forming quality, and output the power influence factor Av, time influence factor At, spot diameter influence factor Al, and diameter ratio influence factor An. In the fourth step, the evaluation unit obtains the power V, time T, spot diameter L, and diameter ratio N, and performs dimensionless processing on them, and correlates them to form an evaluation coefficient PG. The correlation model is as follows: Among them, Av represents the output power influence factor, where 0.21 ≤ Av ≤ 0.45; At represents the time influence factor, where 0.32 ≤ At ≤ 0.53; Al represents the spot diameter influence factor, where 0.46 ≤ Al ≤ 0.81; An represents the diameter ratio influence factor, where 0.67 ≤ An ≤ 0.93; In the fifth step, the welding and installation quality of the deep cavity inner hole parts of the printed circuit board is evaluated and detected according to the obtained evaluation coefficient PG to determine whether it meets the standard.

6. The detection device for the installation quality of deep cavity inner hole parts according to claim 5, characterized in that, In the fifth step, the welding and installation quality of the deep cavity inner hole parts of the printed circuit board is evaluated and detected according to the obtained evaluation coefficient PG to determine whether it meets the standard. Specifically: The obtained evaluation coefficient PG is transmitted to the judgment unit and compared with the preset threshold. If the evaluation coefficient PG is within the range of the preset threshold, the welding and installation quality of the deep cavity inner hole parts of the printed circuit board meets the standard. If the evaluation coefficient PG is not within the range of the preset threshold, the welding and installation quality does not meet the standard.

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