Module temperature and voltage monitoring method and device

Abstract

The invention relates to the technical field of communication, and provides a module temperature and voltage monitoring method and device. The method comprises the following steps: measuring in advance to obtain a first preset relation, collecting an ADC value of a temperature sensor located in a module, and converting the ADC value into an internal temperature value; wherein the temperature sensor is arranged on the back surface of a PCB (Printed Circuit Board) in the module, and the back surface refers to one surface, on which no heating device is arranged, of the PCB; and calibrating the internal temperature value by using a preset calibration coefficient to obtain the environment temperature of the module. According to the invention, the internal temperature value is measured by using the temperature sensor in the module, and then the internal temperature value is further calibrated, so that the environment temperature of the module is obtained, and the working environment of the module can be monitored without additionally arranging a temperature sensor outside the module.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and particularly to a method and device for monitoring module temperature and voltage. Background Art

[0002] In most cases, active optical cables or high-speed cables are used for interconnection in data centers. However, since the transmission distance of high-speed cables is within 7m, the transmission distance is too short. Although using active cables can meet the transmission distance requirements, the cost is too high within a transmission distance of 100m. At this time, the electrical port module just makes up for the deficiencies of the short transmission distance of high-speed cables and the high cost of active cables.

[0003] The pure gigabit optical module is an electrical port module with a small form pluggable (SFP) package type. One end connecting to the host is an SFP gold finger, and the other end facing outward uses an electrical port (i.e., RJ45 interface). It is generally applicable when the device has insufficient network ports, that is, the SFP optical port can be converted into an RJ45 electrical port by using an SFP electrical port module. The transmission rate is 1000Mbps and it is designed for high-speed communication with a maximum rate of 1.25Gbps (fiber channel rate 1.0625Gbps); it can meet the requirements of gigabit SFP connection solutions for operators, radio and television, access networks, small and medium-sized enterprises, the security industry, education networks, and Internet cafes. The transmission distance is 100 meters. This is because there is attenuation when electrical signals are transmitted in twisted pairs, so the maximum transmission distance of electrical signals in twisted pairs is 100m.

[0004] The electrical port module complies with the SFP Multi-Source Agreement (MSA) and IEEE Std802.3-2002 standards. In addition, the electrical port module can not only make up for the deficiencies of the transmission distance of SFP+ high-speed cables, but also directly use the existing copper cable wiring system to achieve data transmission at a rate of 10G. However, the electrical port modules in the prior art cannot monitor their own ambient temperature and voltage, resulting in the inability to confirm whether the electrical port module is working properly.

[0005] The optical module is used in combination with optical fibers for wiring to play its role at short transmission distances. However, due to the presence of lasers in the optical module, its temperature monitoring is often affected by the lasers, and an accurate ambient temperature cannot be obtained.

[0006] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field. Summary of the Invention

[0007] The technical problem to be solved by the present invention is that the existing electrical interface modules cannot monitor their own environmental temperature and voltage, resulting in the inability to confirm whether the electrical interface modules are working properly.

[0008] A further technical problem to be solved by the present invention is that in an optical module, due to the presence of a laser, its temperature monitoring is often affected by the laser, and an accurate environmental temperature cannot be obtained.

[0009] The present invention adopts the following technical solutions:

[0010] In a first aspect, the present invention provides a method for monitoring the temperature and voltage of a module, and a first preset relationship is measured in advance, including:

[0011] Collect the ADC value of a temperature sensor located inside the module, and convert the ADC value into an internal temperature value; wherein, the temperature sensor is arranged on the back side of the PCB board inside the module, and the back side refers to the side of the PCB board where no heat-generating devices are arranged;

[0012] Use the first preset relationship to calibrate the internal temperature value to obtain the environmental temperature of the module.

[0013] Preferably, the first preset relationship includes a first preset calibration coefficient and a second preset calibration coefficient, and the first preset calibration coefficient and the second preset calibration coefficient are measured in advance, specifically including:

[0014] Measure the internal temperature value of the module under multiple different environmental temperature conditions in advance;

[0015] Perform linear fitting on the internal temperature value and the corresponding environmental temperature to obtain the first preset calibration coefficient and the second preset calibration coefficient.

[0016] Preferably, the step of using the preset calibration coefficient to calibrate the internal temperature value to obtain the environmental temperature of the module specifically includes:

[0017] Multiply the internal temperature value by the first preset calibration coefficient to obtain a reference value, and add the second preset calibration coefficient to the reference value to obtain the environmental temperature of the module.

[0018] Preferably, before measuring the internal temperature value of the module, the module is also powered on, and the internal temperature value is measured after the power-on reaches a preset duration.

[0019] Preferably, the method further includes:

[0020] Measure the working voltage of the temperature sensor;

[0021] Determine whether the operating voltage of the temperature sensor is within a preset range. If the operating voltage of the temperature sensor is within the preset range, determine that the temperature credibility is the preset credibility;

[0022] If the operating voltage of the temperature sensor is outside the preset range, determine the corresponding temperature credibility according to the magnitude of the deviation of the operating voltage from the preset range; wherein, the greater the magnitude of the deviation of the operating voltage from the preset range, the lower the temperature credibility;

[0023] Write the temperature credibility and the ambient temperature to the corresponding ports so that the monitoring party can obtain the temperature credibility and the ambient temperature by reading the ports.

[0024] Preferably, when there are multiple modules, the multiple modules respectively monitor the ambient temperature at different times, and the monitoring times of the multiple modules are staggered from each other, specifically including:

[0025] When there are N modules, the N modules monitor the ambient temperature with the same monitoring period T, and the monitoring start time of the i-th module is (i - 1)×T / N + t0; where t0 is the monitoring start time of the first module.

[0026] Preferably, the method further includes:

[0027] Take the ambient temperature with the highest temperature credibility among the ambient temperatures monitored by each module within the sliding window time range formed with time t as the center of the sliding window and the preset time length as the size of the sliding window as the common ambient temperature of each module at time t.

[0028] Preferably, the writing the temperature credibility and the ambient temperature to the corresponding ports specifically includes:

[0029] Concatenate the temperature credibility before the ambient temperature to form complete data, and write the complete data to bits 96 to 99 of the A2H address of the internal register of the module.

[0030] Preferably, the method further includes:

[0031] Monitor the operating voltage of the micro control unit in the module, and write the operating voltage of the micro control unit to the corresponding port so that the monitoring party can obtain the operating voltage of the micro control unit by reading the port.

[0032] Second aspect, the present invention further provides a method for monitoring the module temperature and voltage. Four working states are defined for the optical module, including the receiving state, the transmitting state, the receiving and transmitting state, and the idle state. The first cooling relationship when the optical module switches from the receiving and transmitting state to the receiving state, the second cooling relationship when the optical module switches from the receiving and transmitting state to the idle state, the third cooling relationship when the optical module switches from the transmitting state to the receiving state, and the fourth cooling relationship when the optical module switches from the transmitting state to the idle state are measured in advance. The first mapping relationship between the internal temperature value and the ambient temperature of the optical module in the receiving state and the second mapping relationship between the internal temperature value and the ambient temperature of the optical module in the idle state are measured in advance. The method includes:

[0033] When the optical module is in the receiving and transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state. At this time, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the first cooling relationship, the first cooling time is found. After the first cooling time has passed, the ambient temperature is collected according to the receiving state; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the second cooling relationship, the second cooling time is found. After the second cooling time has passed, the ambient temperature is collected according to the idle state.

[0034] When the optical module is in the transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state. At this time, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the third cooling relationship, the third cooling time is found. After the third cooling time has passed, the ambient temperature is collected according to the receiving state; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the fourth cooling relationship, the fourth cooling time is found. After the fourth cooling time has passed, the ambient temperature is collected according to the idle state.

[0035] When the optical module is in the receiving state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the first mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module.

[0036] When the optical module is in the idle state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the second mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module. Wherein, the temperature sensor is arranged on the back side of the PCB board inside the module, and the back side refers to the side of the PCB board where no heat-generating devices are arranged.

[0037] Preferably, the first cooling relationship for the pre-measured optical module to switch from the receiving and transmitting state to the receiving state specifically includes:

[0038] When the optical module is in the receiving and transmitting state, change the transmission power of the optical module to obtain different initial internal temperature values through measurement;

[0039] At each different initial internal temperature value, turn off the laser to switch the optical module to the receiving state, and record the corresponding cooling time when the preset condition is met; wherein, the preset condition is: the difference between the internal temperature of the optical module and the ambient temperature is less than the preset difference, or the internal temperature of the optical module and the ambient temperature satisfy the first mapping relationship;

[0040] Establish a mapping relationship between different initial internal temperature values and the corresponding cooling times to obtain the first cooling relationship.

[0041] In a third aspect, the present invention also provides a module temperature and voltage monitoring device, which is used to implement the module temperature and voltage monitoring method described in the first aspect or the module temperature and voltage monitoring method described in the second aspect. The device includes:

[0042] At least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor to execute the module temperature and voltage monitoring method described in the first aspect or the module temperature and voltage monitoring method described in the second aspect.

[0043] In a fourth aspect, the present invention also provides a non-volatile computer storage medium, which stores computer-executable instructions. The computer-executable instructions are executed by one or more processors to complete the module temperature and voltage monitoring method described in the first aspect or the module temperature and voltage monitoring method described in the second aspect.

[0044] The present invention measures the internal temperature value through the temperature sensor inside the module, and further calibrates the internal temperature value to obtain the ambient temperature where the module is located. Thus, it is possible to monitor the working environment where the module is located without additionally setting a temperature sensor outside the module. Further, the present invention differentiates the various working states of the optical module, selects a relatively stable working state for ambient temperature acquisition, so as to avoid the influence of heat dissipation on ambient temperature acquisition when the laser requires different working temperatures under different power demands. On the other hand, analyze the cooling law corresponding to the working state switch, and perform cooling for a corresponding duration according to the cooling law, so as to avoid the influence of the operation of the laser on the ambient temperature acquisition in the subsequent working state, and finally ensure the accuracy of the ambient temperature. Description of the Drawings

[0045] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for use in the embodiments of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0046] Figure 1 is a schematic flowchart of the first method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0047] Figure 2 is a schematic flowchart of the second method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0048] Figure 3 is a schematic diagram of a method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0049] Figure 4 is a schematic flowchart of the third method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0050] Figure 5 is a schematic flowchart of the fourth method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0051] Figure 6 is a schematic diagram of another method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0052] Figure 7 is a schematic flowchart of the fifth method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0053] Figure 8 is a schematic flowchart of the sixth method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0054] Figure 9 is a schematic flowchart of the seventh method for monitoring module temperature and voltage provided by the embodiments of the present invention;

[0055] Figure 10 is a schematic diagram of the architecture of a device for monitoring module temperature and voltage provided by the embodiments of the present invention. Detailed implementation manners

[0056] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the following further details the present invention in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0057] In the present invention, terms such as "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0058] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] Embodiment 1:

[0060] The electrical port module in the prior art cannot monitor its own ambient temperature and voltage, resulting in the inability to confirm whether the electrical port module is working properly. To solve this problem, Embodiment 1 of the present invention provides a method for monitoring the temperature and voltage of a module. The module can be an electrical port module or an optical module, such as Figure 1 shown, including:

[0061] In step 201, a first preset relationship is measured in advance, the analog-to-digital conversion (ADC) value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; wherein, the temperature sensor is arranged on the back side of the printed circuit board (PCB) inside the module. Hereinafter, the printed circuit board is simply referred to as the PCB board, and the back side refers to the side of the PCB board where no heat-generating devices are arranged; specifically: each heat-generating device is distributed on the front side of the PCB board, the microcontroller unit (MCU) and the temperature sensor are arranged on the back side of the PCB board, and in a preferred embodiment, a heat sink is further arranged on one side of the heat-generating device, and the heat sink is in contact with the housing, so as to realize the heat dissipation of the internal heat-generating devices, so as to ensure that the temperature measured by the temperature sensor is not affected by the heat-generating devices. The conversion of the ADC value into the internal temperature value is obtained by analyzing the characteristics of the temperature sensor. In actual use, there is a linear relationship between the temperature value measured by the temperature sensor and the ADC value. Subsequently, the relationship between the temperature value measured by the temperature sensor and the ADC value is also referred to as the first relationship. In an alternative embodiment, the temperature sensor can be arranged in the MCU.

[0062] In step 202, the internal temperature value is calibrated using the first preset relationship to obtain the ambient temperature of the module. Wherein, the first preset relationship is analyzed by those skilled in the art, and it represents the relationship between the internal temperature and the external temperature of the module.

[0063] There is also another consideration here. For the electrical port module, since there is no laser inside itself, and the main heat-generating component inside the electrical port module is the external signal interface chip (Physical, abbreviated as: PHY chip), and the working current of the PHY chip is only on the order of 100 mA, so its power is very low, and the corresponding heating effect is relatively small. After adding a heat sink, it can basically have no impact on the temperature of the back of the PCB board, thereby ensuring that the relationship between the internal temperature value and the ambient temperature remains stable. After measurement by the inventor, the method described in this embodiment is applicable to the test of the ambient temperature between -40°C and 85°C, and the measurement error of the ambient temperature can be maintained between -3°C and 3°C.

[0064] In this embodiment, the internal temperature value is measured by using the temperature sensor inside the electrical port module, and then the internal temperature value is further calibrated to obtain the ambient temperature where the electrical port module is located, so that the monitoring of the working environment where the electrical port module is located can be carried out without additionally setting a temperature sensor outside the electrical port module.

[0065] In an alternative embodiment, the first preset relationship includes a first preset calibration coefficient and a second preset calibration coefficient, and the first preset relationship is measured in advance, as Figure 2 shown, specifically including:

[0066] In step 301, the internal temperature value of the module is measured in advance under multiple different ambient temperature conditions.

[0067] In step 302, the internal temperature value is linearly fitted with the corresponding ambient temperature to obtain a first preset calibration coefficient and a second preset calibration coefficient. That is, as Figure 3 shown, the relationship between the fitted internal temperature value and the ambient temperature should be a linear relationship. Among them, Temp out is the ambient temperature, Temp in is the internal temperature value. The first preset calibration coefficient is shown as slope in Figure 3 , that is, the slope of the fitted linear relationship, and the second preset calibration coefficient is shown as offset in Figure 3 , which can be understood as the ambient temperature corresponding to the internal temperature value of 0°C in the fitted linear relationship.

[0068] In this embodiment, the internal temperature value is calibrated by using the preset calibration coefficient to obtain the ambient temperature of the module, as Figure 4 shown, specifically including:

[0069] In step 401, the first preset calibration coefficient is multiplied by the internal temperature value to obtain a reference value.

[0070] In step 402, the ambient temperature of the module is obtained by using the reference value plus the second preset calibration coefficient. It is expressed as a formula: Temp out =(slope×Temp in )+offset.

[0071] In actual use, before measuring the internal temperature value of the module, the module is also powered on, and the internal temperature value is measured after the power-on reaches a preset duration. The preset duration is obtained by those skilled in the art through empirical analysis.

[0072] In an alternative embodiment, in order to further improve the measurement accuracy, multiple ambient temperature intervals can be respectively set. Within each ambient temperature interval, a linear fitting is performed between the internal temperature value and the corresponding ambient temperature interval. During actual measurement, according to the measured internal temperature value, the corresponding ambient temperature interval is selected, and the linear relationship within this interval is used for calibration to obtain the measured ambient temperature. Among them, the step of selecting the corresponding ambient temperature interval according to the measured internal temperature value is specifically: according to the result of the linear fitting, each ambient temperature interval is mapped to each internal temperature interval. During actual measurement, the linear relationship in the internal temperature interval where the internal temperature value is located is directly used for calibration.

[0073] In actual use, the accuracy of the temperature measured by the temperature sensor is also related to the working voltage of the temperature sensor. When the working voltage of the temperature sensor exceeds its normal working range, it may cause the temperature-ADC curve to drift, that is, the first relationship drifts. To solve this problem, this embodiment also provides a preferred embodiment, as Figure 5 shown, that is, the method further includes:

[0074] In step 501, the working voltage of the temperature sensor is measured.

[0075] In step 502, it is determined whether the working voltage of the temperature sensor is within a preset range. If the working voltage of the temperature sensor is within the preset range, the temperature credibility is determined to be a preset credibility; the preset range is obtained by those skilled in the art through analysis of the characteristics of the temperature sensor, and the preset credibility is obtained by those skilled in the art through empirical analysis.

[0076] In step 503, if the working voltage of the temperature sensor is outside the preset range, the corresponding temperature credibility is determined according to the magnitude of the deviation of the working voltage from the preset range; among them, the greater the magnitude of the deviation of the working voltage from the preset range, the lower the temperature credibility.

[0077] In step 504, the temperature credibility and the ambient temperature are written to corresponding ports, so that the monitoring party can obtain the temperature credibility and the ambient temperature by reading the ports.

[0078] For example, multiple working voltage ranges are preset in advance. The first range in the middle position is the preset range, and its corresponding preset credibility is the highest. Each range on both sides corresponds to its own temperature credibility, and the farther away from the first range, the lower the corresponding temperature credibility. The temperature credibility of the range where the working voltage is located is used as the temperature credibility of the monitored ambient temperature.

[0079] In a preferred embodiment, when there are multiple modules, the multiple modules monitor the ambient temperature at different times respectively, and the monitoring times of the multiple modules are staggered from each other. Specifically, it includes:

[0080] When there are N modules, the N modules monitor the ambient temperature with the same monitoring period T. The monitoring start time of the i-th module is (i - 1)×T / N + t0; where t0 is the monitoring start time of the first module. That is, as Figure 6 shown, the first module monitors the ambient temperature at t0 + nT, n represents the n-th monitoring period, the second module monitors the ambient temperature at t0 + T / N + nT, the third module monitors the ambient temperature at t0 + 2T / N + nT, and the N-th module monitors the ambient temperature at t0 + (N - 1)T / N + nT.

[0081] By staggering the monitoring times of each module, when there are multiple modules, it is not necessary to perform high-speed temperature monitoring on each module, thereby reducing the overall resource occupancy.

[0082] In an alternative embodiment, the ambient temperature monitored most recently at a distance time t can be used as the common ambient temperature of the multiple modules at time t.

[0083] However, considering the influence of the working voltage on the temperature sensor, a preferred embodiment is also provided here, that is, the method further includes: using the ambient temperature with the highest temperature credibility among the ambient temperatures monitored by each module within the sliding window time range formed with time t as the center of the sliding window and a preset time length as the sliding window size as the common ambient temperature of each module at time t.

[0084] The preset time length is obtained by those skilled in the art through empirical analysis. For example, the preset time length can be the monitoring period T. By staggering the mutual monitoring times of multiple modules and selecting the ambient temperature with the highest temperature credibility through the sliding window, long-term accurate ambient temperature monitoring can be carried out under the condition of continuous low resource occupancy.

[0085] In an alternative embodiment, the step of writing the temperature credibility and the ambient temperature to the corresponding ports specifically includes: splicing the temperature credibility before the ambient temperature to form complete data, and writing the complete data to bits 96 to 99 of the A2H address of the internal register of the module.

[0086] In actual use, the method further includes: monitoring the operating voltage of the microcontroller unit in the module, and writing the operating voltage of the microcontroller unit to the corresponding port, so that the monitoring party can obtain the operating voltage of the microcontroller unit by reading the port.

[0087] Both the operating voltage of the microcontroller unit and the ambient temperature are used to monitor whether the module is operating normally.

[0088] Embodiment 2:

[0089] In the prior art, in an optical module, due to the presence of a laser, its temperature monitoring is often affected by the laser, and an accurate ambient temperature cannot be obtained. To solve this problem, in this embodiment, on the basis of the module temperature voltage monitoring method provided in Embodiment 1, a module temperature voltage monitoring method is further provided. The object of the method described in this embodiment is an optical module, such as a bi-directional optical sub-assembly (abbreviated as: BOSA). Four working states are defined for the optical module, including a receiving state, a transmitting state, a receiving and transmitting state, and an idle state; the first cooling relationship when the optical module switches from the receiving and transmitting state to the receiving state, the second cooling relationship when the optical module switches from the receiving and transmitting state to the idle state, the third cooling relationship when the optical module switches from the transmitting state to the receiving state, and the fourth cooling relationship when the optical module switches from the transmitting state to the idle state are measured in advance; the first mapping relationship between the internal temperature value and the ambient temperature of the optical module in the receiving state and the second mapping relationship between the internal temperature value and the ambient temperature of the optical module in the idle state are measured in advance; wherein, the receiving state refers to the state where the optical receiving component works while the laser does not work, the transmitting state is the state where the laser works while the optical receiving component does not work, the receiving and transmitting state is the state where both the optical receiving component and the laser work, and the idle state is the state where both the optical receiving component and the laser do not work. The first cooling relationship, the second cooling relationship, the third cooling relationship, and the fourth cooling relationship are all relationships between the cooling time corresponding to the corresponding switching conditions and the initial internal temperature. In actual use, the first cooling relationship, the second cooling relationship, the third cooling relationship, the fourth cooling relationship, the first mapping relationship, and the second mapping relationship are all linear relationships. The measurement of the first mapping relationship and the second mapping relationship is based on the same concept as the measurement of the first preset relationship in Embodiment 1, and the only difference is that the first mapping relationship is measured when the optical module is in the receiving state, while the second mapping relationship is measured when the optical module is in the idle state.

[0090] The method described in this embodiment, as Figure 7 shown, includes:

[0091] In step 601, when the optical module is in the receiving and transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state, and the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the first cooling relationship, the first cooling time is found. After the first cooling time has elapsed, the ambient temperature is collected according to the receiving state, that is, step 603 below is executed; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the second cooling relationship, the second cooling time is found. After the second cooling time has elapsed, the ambient temperature is collected according to the idle state. That is, step 604 below is executed.

[0092] In step 602, when the optical module is in the transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state. At this time, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the third cooling relationship, the third cooling time is found. After the third cooling time has elapsed, the ambient temperature is collected in the receiving state, that is, step 603 described below is executed; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the fourth cooling relationship, the fourth cooling time is found. After the fourth cooling time has elapsed, the ambient temperature is collected in the idle state. That is, step 604 described below is executed. The above steps 601 and 602 are both for the case where the working state of the optical module remains unchanged during the process of reaching the corresponding cooling time after switching to the idle state or the receiving state. If it switches from the idle state to the receiving state again during this period, then in the receiving state, it is judged whether the third cooling time has elapsed since the transmitting state. After the third cooling time has elapsed, the ambient temperature is collected in the receiving state. Other switching situations are implemented based on the same concept as this switching situation. If it switches to the transmitting state or the receiving and transmitting state again during this period, then the above steps 601 or 602 are executed again.

[0093] In step 603, when the optical module is in the receiving state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the first mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module.

[0094] In step 604, when the optical module is in the idle state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the second mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module; wherein, the temperature sensor is arranged on the back side of the PCB board inside the module, and the back side refers to the side of the PCB board where no heat-generating devices are arranged. The heat-generating devices include a laser and an optical receiving component, etc.

[0095] In an actual application scenario, the first cooling relationship for pre-measuring the optical module to switch from the receiving and transmitting state to the receiving state, as Figure 8 shown, specifically includes:

[0096] In step 701, when the optical module is in the receiving and transmitting state, the transmission power of the optical module is changed to obtain different initial internal temperature values by measurement.

[0097] In step 702, with different initial internal temperature values, the laser is turned off, and the optical module is switched to the receiving state. The cooling time corresponding to when the preset condition is met is recorded. Wherein, the preset condition is: the difference between the internal temperature of the optical module cooled to the ambient temperature is less than a preset difference, or the internal temperature of the optical module cooled to the ambient temperature satisfies the first mapping relationship. Wherein, the preset difference is obtained by those skilled in the art through empirical analysis. The satisfaction of the first mapping relationship means that the difference between the first internal temperature in the first mapping relationship corresponding to the ambient temperature and the cooled internal temperature is less than the first preset difference, and the first preset difference is obtained by those skilled in the art through empirical analysis.

[0098] In step 703, a mapping relationship between different initial internal temperature values and the corresponding cooling time is established to obtain the first cooling relationship. The measurement of the second cooling relationship is implemented based on the same concept as the measurement of the first cooling relationship, and will not be elaborated here.

[0099] In actual use, the first mapping relationship includes a first preset calibration coefficient and a second preset calibration coefficient. The pre-measurement of the first preset relationship specifically includes: when the optical module is in the receiving state, the internal temperature values of the module are pre-measured under multiple different ambient temperature conditions; the internal temperature values are linearly fitted with the corresponding ambient temperatures to obtain the first preset calibration coefficient and the second preset calibration coefficient. The calibration of the internal temperature value using the first mapping relationship to obtain the ambient temperature of the module specifically includes: multiplying the internal temperature value by the first preset calibration coefficient to obtain a reference value, and adding the second preset calibration coefficient to the reference value to obtain the ambient temperature of the module. The measurement of the second preset relationship is implemented based on the same concept as the measurement of the first preset relationship. It should be noted here that the methods described in Embodiment 1 are all applicable in this embodiment.

[0100] In this embodiment, by distinguishing the various working states of the optical module and selecting a relatively stable working state for ambient temperature acquisition, the influence of heat dissipation on ambient temperature acquisition when the laser requires different working temperatures under different power demands is avoided. On the other hand, the cooling law corresponding to the working state switch is analyzed, and cooling is performed for a corresponding duration according to the cooling law, so as to avoid the influence of the operation of the laser on the ambient temperature acquisition in the subsequent working state, and finally ensure the accuracy of the ambient temperature.

[0101] Embodiment 2:

[0102] Based on the method described in Embodiment 1, the present invention combines specific application scenarios and uses the technical expressions in the relevant scenarios to elaborate the implementation process in the characteristic scenarios of the present invention.

[0103] Taking the application scenario where an MCU integrated with a temperature sensor is provided in a Gigabit Ethernet port module RJ45 as an example, the model of the microcontroller unit can be EFM8BB2. The Gigabit Ethernet port module uses SFP packaging and has a transmission rate of 1000 Mbps. Considering that in actual use, when the monitoring party monitors the optical module, it often reads the temperature data from the A2H address of the optical module. In this embodiment, in order to enable the monitoring party to achieve compatibility directly without modification, in this embodiment, the 96th to 99th bits of the A2H address of the internal register of the Ethernet port module are also used as the write position for the temperature data.

[0104] Currently, Gigabit Ethernet port modules do not have the function of real-time temperature and voltage data monitoring, and cannot meet the measurement of the module operating temperature and real-time voltage when running in devices such as switches. The MCU inside the RJ45 module collects temperature and voltage information, and after calculating the sampled values, stores them in the corresponding storage locations to achieve data monitoring functions such as the ambient temperature and voltage of the Gigabit-rate RJ45 module.

[0105] Specifically: Calculate the temperature information before calibration from the ADC sampling information of the temperature sensor of the MCU, and then obtain the actual temperature and voltage through the golden sample method for external calibration. The output of the uncalibrated temperature sensor is very linear and is suitable for relative temperature measurement. For absolute temperature measurement, offset and / or gain calibration is performed. The calibration coefficients required for the calibration process are obtained in advance through measurement, as Figure 9 shown, specifically:

[0106] In step 801, control / measure the ambient temperature (this temperature must be known).

[0107] In step 802, turn on the power and delay for a few seconds (i.e., the preset duration) to allow it to self-heat.

[0108] In step 803, perform an ADC conversion using the selected temperature sensor as the ADC input.

[0109] In step 804, calculate the offset characteristics (i.e., the first preset calibration coefficient and the second preset calibration coefficient), and store this value in the non-volatile memory for use with subsequent temperature sensor average value requirements.

[0110] Calibrate the actually measured internal temperature value using the previously obtained first preset calibration coefficient and second preset calibration coefficient to obtain the ambient temperature value, where the internal temperature value is calculated by combining the ADC value with the temperature value calculation rule of the temperature sensor after collecting the ADC value of the temperature sensor.

[0111] In this embodiment, the calculated ambient temperature is written to bits 96 to 99 at the A2H address of the internal register of the electrical port module. It should be noted here that the module temperature and voltage monitoring method described in Embodiment 1 are all applicable in this embodiment.

[0112] Embodiment 3:

[0113] Based on the method described in Embodiment 1, the present invention combines specific application scenarios and uses technical expressions in relevant scenarios to elaborate on the implementation process in the characteristic scenarios of the present invention.

[0114] Taking an example where there are multiple electrical port modules in a device, the first preset calibration coefficient and the second preset calibration coefficient corresponding to each electrical port module are measured in advance for each electrical port module. Among them, after fixing the corresponding ambient temperature, the internal temperature values of the multiple electrical port modules are measured. By selecting multiple ambient temperatures, multiple internal temperature values of each electrical port module are obtained, and then linear fitting is performed to obtain the first preset calibration coefficient and the second preset calibration coefficient corresponding to each electrical port module.

[0115] When performing actual ambient temperature monitoring, starting from the first electrical port module, the ambient temperature measurements of each electrical port module are staggered. As Figure 6 shown, the first electrical port module monitors the ambient temperature at t0 + nT, where n represents the nth monitoring cycle. The second electrical port module monitors the ambient temperature at t0 + T / N + nT. The third electrical port module monitors the ambient temperature at t0 + 2T / N + nT. The Nth electrical port module monitors the ambient temperature at t0 + (N - 1)T / N + nT. In this way, N ambient temperatures are measured in one monitoring cycle.

[0116] According to the requirements of ambient temperature monitoring, if the real-time performance of the ambient temperature monitoring requirements is relatively high, then each monitored ambient temperature is used as the common ambient temperature for multiple electrical port modules. If the accuracy requirement for ambient temperature monitoring is relatively high and the real-time requirement is relatively low, then in the form of a sliding window, the ambient temperature with the highest temperature credibility in the sliding window is selected as the common ambient temperature for multiple electrical port modules.

[0117] In this embodiment, the calculated ambient temperature and the temperature credibility are written together to bits 96 to 99 at the A2H address of the internal register of the electrical port module. Among them, the temperature credibility is in the high position and the ambient temperature is in the low position. The number of bits occupied by the temperature credibility is fixed, that is, the corresponding number of bits is preset by those skilled in the art for storing the temperature credibility.

[0118] In actual use, which specific ambient temperature is used as the common ambient temperature for multiple electrical port modules is actually obtained by the monitoring party through comprehensive analysis after reading the ambient temperatures and temperature credibility levels of each electrical port module, that is, the ambient temperature with the highest temperature credibility is used as the common ambient temperature. When the common ambient temperature exceeds the normal operating temperature range of any one electrical port module, a fault is reported to generate a corresponding alarm.

[0119] It should be noted here that the module temperature and voltage monitoring methods described in Embodiment 1 are all applicable in this embodiment.

[0120] Embodiment 4:

[0121] As Figure 10 shown, it is a schematic architecture diagram of the module temperature and voltage monitoring device according to an embodiment of the present invention. The module temperature and voltage monitoring device of this embodiment includes one or more processors 21 and a memory 22. Among them, Figure 10 One processor 21 is taken as an example herein.

[0122] The processor 21 and the memory 22 can be connected through a bus or other means, Figure 10 Taking connection through a bus as an example herein.

[0123] The memory 22, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs and non-volatile computer-executable programs, such as the module temperature and voltage monitoring methods in Embodiment 1, Embodiment 2, or Embodiment 3. The processor 21 executes the module temperature and voltage monitoring method by running the non-volatile software programs and instructions stored in the memory 22.

[0124] The memory 22 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage devices. In some embodiments, the memory 22 may optionally include a memory remotely provided relative to the processor 21, and these remote memories can be connected to the processor 21 through a network. Examples of the above networks include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0125] The program instructions / modules are stored in the memory 22 and, when executed by the one or more processors 21, execute the module temperature and voltage monitoring methods in the above-mentioned Embodiment 1, Embodiment 2, or Embodiment 3.

[0126] It should be noted here that the module temperature and voltage monitoring device described in this embodiment can be a built-in module located in the module, dedicated to executing the module temperature and voltage monitoring method described in Embodiment 1, Embodiment 2 or Embodiment 3, or it can be the module itself. For example, when executing the module temperature and voltage monitoring method described in Embodiment 1, the module temperature and voltage monitoring device can be an electrical port module or an optical module; when executing the module temperature and voltage monitoring method described in Embodiment 2, the module temperature and voltage monitoring device can be an optical module.

[0127] It is worth noting that for the information interaction, execution process, etc. between the modules and units in the above-mentioned device and system, since they are based on the same concept as the method embodiment of the present invention, the specific content can be referred to the description in the method embodiment of the present invention, and will not be elaborated here.

[0128] Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the embodiments can be completed by instructing relevant hardware through a program, and this program can be stored in a computer-readable storage medium. The storage medium can include: read-only memory (ROM, Read Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc.

[0129] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for monitoring the temperature and voltage of a module, characterized in that, Pre-measure to obtain a first preset relationship, including: Collect the ADC value of the temperature sensor inside the module, and convert the ADC value into an internal temperature value; wherein, the temperature sensor is arranged on the back side of the PCB board inside the module, and the back side refers to the side of the PCB board where no heating devices are arranged; Use the first preset relationship to calibrate the internal temperature value to obtain the ambient temperature of the module.

2. The module temperature and voltage monitoring method according to claim 1, wherein The first preset relationship includes a first preset calibration coefficient and a second preset calibration coefficient. The pre-measurement to obtain the first preset relationship specifically includes: Pre-measure the internal temperature value of the module under multiple different ambient temperature conditions; Perform linear fitting on the internal temperature value and the corresponding ambient temperature to obtain the first preset calibration coefficient and the second preset calibration coefficient.

3. The module temperature and voltage monitoring method according to claim 2, wherein The step of using the first preset relationship to calibrate the internal temperature value to obtain the ambient temperature of the module specifically includes: Multiply the internal temperature value by the first preset calibration coefficient to obtain a reference value, and add the second preset calibration coefficient to the reference value to obtain the ambient temperature of the module.

4. The module temperature and voltage monitoring method according to claim 1, wherein The method further includes: Measure the working voltage of the temperature sensor; Judge whether the working voltage of the temperature sensor is within a preset range. If the working voltage of the temperature sensor is within the preset range, determine that the temperature credibility is a preset credibility; If the working voltage of the temperature sensor is outside the preset range, determine the corresponding temperature credibility according to the magnitude of the deviation of the working voltage from the preset range; wherein, the greater the magnitude of the deviation of the working voltage from the preset range, the lower the temperature credibility; Write the temperature credibility and the ambient temperature to the corresponding ports so that the monitoring party can obtain the temperature credibility and the ambient temperature by reading the ports.

5. The module temperature and voltage monitoring method according to claim 4, characterized in that When there are multiple modules, the multiple modules respectively monitor the ambient temperature at different times, and the monitoring times of the multiple modules are staggered from each other. Specifically include: When there are N modules, the N modules monitor the ambient temperature with the same monitoring period T. The monitoring start time of the i-th module is (i - 1)×T / N + t0; wherein, t0 is the monitoring start time of the first module.

6. The module temperature and voltage monitoring method according to claim 5, wherein The method further includes: Take the ambient temperature with the highest temperature credibility among the ambient temperatures monitored by each module within the sliding window time range formed with time t as the center of the sliding window and a preset time length as the size of the sliding window as the common ambient temperature of each module at time t.

7. The module temperature and voltage monitoring method according to any one of claims 1-6, characterized in that The method further includes: Monitor the working voltage of the microcontroller unit in the module, and write the working voltage of the microcontroller unit to the corresponding port so that the monitoring party can obtain the working voltage of the microcontroller unit by reading the port.

8. A method for monitoring the temperature and voltage of a module, characterized in that, Four working states are defined for the optical module, including a receiving state, a transmitting state, a receiving and transmitting state, and an idle state; the first cooling relationship for the optical module to switch from the receiving and transmitting state to the receiving state, the second cooling relationship for the optical module to switch from the receiving and transmitting state to the idle state, the third cooling relationship for the optical module to switch from the transmitting state to the receiving state, and the fourth cooling relationship for the optical module to switch from the transmitting state to the idle state are measured in advance; The first mapping relationship between the internal temperature value and the ambient temperature of the optical module in the receiving state and the second mapping relationship between the internal temperature value and the ambient temperature of the optical module in the idle state are measured in advance; the method includes: When the optical module is in the receiving and transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state. At this time, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the first cooling relationship, the first cooling time is found. After the first cooling time has passed, the ambient temperature is collected according to the receiving state; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the second cooling relationship, the second cooling time is found. After the second cooling time has passed, the ambient temperature is collected according to the idle state; When the optical module is in the transmitting state, the ambient temperature is not collected until the optical module switches to the receiving state. At this time, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the third cooling relationship, the third cooling time is found. After the third cooling time has passed, the ambient temperature is collected according to the receiving state; or, until the optical module switches to the idle state, the internal temperature value at the time of switching is collected. According to the internal temperature value at the time of switching and the fourth cooling relationship, the fourth cooling time is found. After the fourth cooling time has passed, the ambient temperature is collected according to the idle state; When the optical module is in the receiving state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the first mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module; When the optical module is in the idle state, the ADC value of the temperature sensor located inside the module is collected, and the ADC value is converted into an internal temperature value; the second mapping relationship is used to calibrate the internal temperature value to obtain the ambient temperature of the module; wherein, the temperature sensor is arranged on the back side of the PCB board inside the module, and the back side refers to the side of the PCB board where no heating devices are arranged.

9. The module temperature and voltage monitoring method according to claim 8, wherein, The specific steps for measuring the first cooling relationship of the optical module to switch from the receiving and transmitting state to the receiving state are as follows: When the optical module is in the receiving and transmitting state, the transmission power of the optical module is changed to obtain different initial internal temperature values through measurement; With different initial internal temperature values, turn off the laser to switch the optical module to the receiving state, and record the corresponding cooling time when the preset conditions are met; wherein, the preset conditions are: the difference between the internal temperature of the optical module cooled to the ambient temperature is less than the preset difference, or the internal temperature of the optical module cooled to the ambient temperature satisfies the first mapping relationship; Establish a mapping relationship between different initial internal temperature values and the corresponding cooling times to obtain the first cooling relationship.

10. A module temperature and voltage monitoring device, characterized in that, Comprising: At least one processor; And a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor for performing the module temperature voltage monitoring method according to any one of claims 1-7, or performing the module temperature voltage monitoring method according to any one of claims 8-9.

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