Semiconductor chip wear resistance testing machine based on computer

Abstract

The invention discloses a computer-based semiconductor chip wear resistance testing machine, and relates to the technical field of chip scratch detection, the computer-based semiconductor chip wear resistance testing machine comprises a case base and a driving motor, the driving motor is installed in the case base, and the upper end of the case base is provided with a scratch driver; the upper end of the scratch driving mechanism is provided with two mounting mechanisms used for clamping a semiconductor chip and heating the surface of the semiconductor chip, and one side of the upper end of the case base is provided with a probe detection mechanism used for conducting coating testing on the semiconductor chip clamped in the mounting mechanisms. According to the invention, the hot air flow is jetted to the surface of the chip, the surface temperature of the chip is rapidly changed and stabilized, the material of the chip can be softened at a high temperature and is easy to wear, and the material which can still keep stable performance at an extreme temperature can be screened out through test data at different temperatures; micro vibration, such as high-frequency low-amplitude vibration, of the chip is controlled in an electromagnetic mode, and the vibration resistance of a coating or packaging is tested.

Description

Technical Field

[0001] The present invention relates to the technical field of chip scratch detection, and particularly to a computer-based wear-resistant testing machine for semiconductor chips. Background Art

[0002] For example, the publication number is CN113495036A, and the name is a high-throughput scratch reciprocating friction and wear test device. The device includes a base, a movable multifunctional machine head with a multi-station grinding head disk system, a sample holder system, a sample reciprocating scratch platform, a sample displacement platform, a data acquisition system, and a computer system. A sample displacement platform and a support rod are respectively provided on the base; a sample reciprocating scratch platform is provided on the sample displacement platform, and a sample holder system is provided on the sample reciprocating scratch platform; the support rod is connected to the movable multifunctional machine head, and the movable multifunctional machine head is located directly above the sample in the sample holder system; the movable multifunctional machine head, the sample holder system, the sample reciprocating scratch platform, and the sample displacement platform are respectively connected to the computer system through the data acquisition system. This invention can realize the testing of the coating bonding force, friction coefficient, and wear resistance of multiple coating specimens with a single sample loading.

[0003] When the chip is actually working, the material softens due to heat generation, which exacerbates wear. Conventional tests are difficult to simulate the dynamic wear behavior in a high-temperature environment and cannot accurately evaluate the reliability of materials at extreme temperatures. Moreover, the chip undergoes fretting wear in electronic devices due to vibration (such as fans, motors) or assembly errors (such as minute displacements caused by thermal expansion). Static tests cannot capture such dynamic failure modes. Therefore, this application provides a computer-based wear-resistant testing machine for semiconductor chips to meet the requirements. Summary of the Invention

[0004] The purpose of this application is to provide a computer-based wear-resistant testing machine for semiconductor chips, which can effectively solve the problems raised in the above background art.

[0005] To achieve the above purpose, this application provides the following technical solution: A computer-based wear-resistant testing machine for semiconductor chips includes a chassis base and a drive motor, and the drive motor is installed inside the chassis base. A scratch drive mechanism is provided at the upper end of the chassis base, and two installation mechanisms for clamping a semiconductor chip and heating its surface are provided at the upper end of the scratch drive mechanism. A probe detection mechanism for coating testing of the semiconductor chip clamped inside the installation mechanism is provided at one side of the upper end of the chassis base;

[0006] The probe detection mechanism includes a support assembly, and a friction assembly for scratch friction testing of the surface coating of the semiconductor chip and a probe assembly for incrementally applying pressure to detect the scratch state of the coating are provided inside the support assembly.

[0007] Among them, an outer frame is provided at the upper end of the chassis base, and a protective cover is provided at the upper end of the outer frame, and the protective cover covers the outside of the probe detection mechanism.

[0008] Among them, the scratch driving mechanism includes a central axis frame, the central axis frame is rotatably installed inside the chassis base, and one end of the central axis frame is connected to the output end of the driving motor. Two semi-circular plates are provided at the upper end of the central axis frame, and screw rod frames are provided inside both of the two semi-circular plates, and sliders are provided inside both of the two screw rod frames.

[0009] Among them, the installation mechanism includes an installation plate, the installation plate is installed at the upper end of the slider, two placement grooves are symmetrically opened at the upper end of the installation plate, bottom sealing plates are provided inside both of the two placement grooves, rubber pads are provided at the upper ends of the bottom sealing plates, upper sealing plates are provided at the upper ends of the rubber pads, and the upper sealing plates, rubber pads and bottom sealing plates are fixed by bolts.

[0010] Among them, a chip is provided at the upper end of the upper sealing plate, clamping blocks are provided on both sides of the upper sealing plate, air jet flat tubes are provided on both sides of the bottom sealing plate, the air outlets of the two air jet flat tubes are aligned with the surface of the chip, and a vibration motor is provided in the middle of the lower end of the upper sealing plate.

[0011] Among them, the support assembly includes a support frame, the support frame is installed at the upper end of the chassis base, a detection head is provided in the middle of the lower end of the support frame, a control force wheel is provided inside the support frame, and the control force wheel is sleeved on the outer surface of the motor output end.

[0012] Among them, the convex teeth provided on the outer surface of the control force wheel are of different lengths, and the convex teeth are distributed in a circular array from long to short.

[0013] Among them, the probe assembly includes an installation tube, the installation tube is installed inside the support frame, a tapered tube is slidably installed inside the support frame, a push block is provided at the upper end of the tapered tube, a first spring is provided at the bottom of the push block, and the convex teeth of the control force wheel are in contact with the surface of the push block.

[0014] Among them, a probe cone is slidably installed inside the tapered tube, and a second spring is provided at the upper end of the probe cone.

[0015] Among them, the friction assembly includes a top tube, the top tube is installed at the lower end of the support frame, a return member is provided at the lower end of the top tube, an installation basket is sleeved on the outer surface of the return member, a friction plate is provided at the lower end of the installation basket, and a top pin is provided at the lower end of the top tube.

[0016] In summary, the technical effects and advantages of the present invention:

[0017] 1. The present invention sprays hot air flow onto the chip surface to quickly change and stabilize the chip surface temperature, simulating a high-temperature environment such as the heating environment during chip operation. At high temperatures, the materials of the chip may soften, resulting in easier wear. Through the test data at different temperatures, materials that can still maintain stable performance under extreme temperatures can be screened out, improving the reliability of the chip in harsh environments. Moreover, the chip is fixed inside the installation mechanism and slightly jittered, and the tiny vibration of the chip such as high-frequency and low-amplitude vibration is controlled electromagnetically to test the anti-vibration ability of the coating or packaging, such as the working vibration of the chip in electronic devices such as fan and motor vibration, to evaluate the wear risk under long-term vibration, and to simulate the tiny displacement between the chip and the substrate such as fretting wear caused by thermal expansion, avoiding failure caused by assembly errors and simulating non-ideal installation conditions.

[0018] 2. In the control force wheel of the present invention, the convex teeth are distributed in a circular array and have different lengths from long to short. By rotating the control force wheel, convex teeth of different lengths can be selected to contact the push block. Convex teeth of different lengths can apply different pressures. When the long convex teeth are in contact, a smaller pressure is applied, and when the short convex teeth are in contact, a larger pressure is applied, thus realizing hierarchical pressure control. By rotating the control force wheel, the preset pressure level can be quickly selected, which is suitable for the test requirements of different materials or coatings, such as evaluating the tolerance limit of materials with different hardness, and can generate direct correlation data of pressure with scratch depth and width, identifying the minimum pressure at which the coating begins to peel off or the material yield point.

[0019] 3. By sequentially selecting convex teeth of different lengths in the present invention, gradually increasing load conditions can be simulated to study the fatigue wear characteristics of materials. The first spring provides an upward thrust to balance the downward pressure of the push block, ensuring uniform distribution of the force when the probe cone contacts the chip. It provides buffering when the probe cone contacts the chip, preventing damage to the chip surface due to excessive impact force. At the same time, by squeezing the second spring, a stable thrust is provided for the probe cone, and the chip jitters slightly. The upper sealing plate generates tiny vibrations through the vibration motor, changing the contact mode between the probe cone and the chip surface. The jitter simulates the dynamic environment in actual use, such as vibration and fretting wear. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a first perspective three-dimensional structural schematic diagram of a semiconductor chip wear-resistant testing machine;

[0022] Figure 2 It is a second perspective three-dimensional structural schematic diagram of a semiconductor chip wear-resistant testing machine;

[0023] Figure 3 Schematic diagram of the three-dimensional connection structure of the local first perspective of the semiconductor chip wear-resistant testing machine;

[0024] Figure 4 Schematic diagram of the three-dimensional connection structure of the local second perspective of the semiconductor chip wear-resistant testing machine;

[0025] Figure 5 Schematic diagram of the three-dimensional connection structure of the scratch driving mechanism and the mounting mechanism;

[0026] Figure 6 Schematic diagram of the three-dimensional connection structure of the scratch driving mechanism;

[0027] Figure 7 Schematic diagram of the three-dimensional connection structure of the lead screw frame and the mounting mechanism;

[0028] Figure 8 Schematic diagram of the three-dimensional connection structure of the mounting mechanism;

[0029] Figure 9 Schematic diagram of the partial three-dimensional connection structure of the mounting mechanism;

[0030] Figure 10 Cross-sectional view of the partial three-dimensional connection structure of the mounting mechanism;

[0031] Figure 11 Schematic diagram of the three-dimensional connection structure of the probe detection mechanism;

[0032] Figure 12 Cross-sectional view of the three-dimensional connection structure of the probe detection mechanism;

[0033] Figure 13 Cross-sectional view of the three-dimensional connection structure of the probe assembly;

[0034] Figure 14 Schematic diagram of the three-dimensional connection structure of the friction assembly;

[0035] Figure 15 Cross-sectional view of the three-dimensional connection structure of the friction assembly.

[0036] In the figure: 1, chassis base; 2, shield case; 3, scratch driving mechanism; 31, center line shaft frame; 32, semi-circular plate; 33, lead screw frame; 34, slider; 4, outer frame; 5, probe detection mechanism; 51, support assembly; 511, support frame; 512, detection head; 513, force control wheel; 52, probe assembly; 521, push block; 522, first spring; 523, installation tube; 524, tapered tube; 525, second spring; 526, probe cone; 53, friction assembly; 531, top tube; 532, return force member; 533, installation basket; 534, friction plate; 535, thimble; 6, drive motor; 7, installation mechanism; 71, installation plate; 72, placement groove; 73, jet flat tube; 74, chip; 75, clamping block; 76, upper sealing plate; 77, rubber pad; 78, bottom sealing plate; 79, bolt; 711, vibration motor. Detailed implementation mode

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] Embodiment 1. Refer to Figures 1 to 15 A computer-based semiconductor chip wear-resistant testing machine shown in the figure, including a chassis base 1 and a drive motor 6, and the drive motor 6 is installed inside the chassis base 1. A scratch driving mechanism 3 is arranged at the upper end of the chassis base 1. Two installation mechanisms 7 for clamping a semiconductor chip and performing a surface heating treatment on it are arranged at the upper end of the scratch driving mechanism 3. A probe detection mechanism 5 for performing a coating test on the semiconductor chip clamped inside the installation mechanism 7 is arranged on one side of the upper end of the chassis base 1;

[0039] The probe detection mechanism 5 includes a support assembly 51. Inside the support assembly 51, there are arranged a friction assembly 53 for performing a scratch friction test on the surface coating of the semiconductor chip and a probe assembly 52 for incrementally applying pressure to detect the scratch state of the coating.

[0040] It should be noted that when performing a friction test and detection on a semiconductor chip, the semiconductor chip is placed in the installation mechanism 7 arranged above the scratch driving mechanism 3. The arranged scratch driving mechanism 3 is used to push the installation mechanism 7 to move and cooperate with the probe detection mechanism 5 to detect the semiconductor chip. The arranged scratch driving mechanism 3 can also adjust the position of the installation mechanism 7 by rotation;

[0041] The semiconductor chip installed inside the installation mechanism 7 changes the temperature of the chip surface through hot air jets, thereby controlling the temperature of the semiconductor chip for detecting the scratches on the chip surface coating at different temperatures. And inside the installation mechanism 7, there is a device to fix the semiconductor chip and control its slight vibration. By combining the vibration of the semiconductor chip with the probe detection mechanism 5, the usage of the semiconductor chip in an unconventional environment can be detected.

[0042] Among them, the scratch driving mechanism 3 pushes the installation mechanism 7 to move, achieving precise contact between the probe detection mechanism 5 and the chip surface and controlling the scratch path through linear driving. Through linear movement, scratch tests can be performed on any position of the chip surface, ensuring that all key areas of the chip are covered by the test, such as the circuit-dense area, the package edge, etc., to avoid local deviation.

[0043] The rotation adjustment function can simulate the frictions in different directions during actual use, such as oblique friction and rotational friction, making it closer to real working conditions, such as the moving parts of MEMS devices and the edge wear of chip packages.

[0044] And by spraying hot air flow onto the chip surface, the temperature of the chip surface can be quickly changed and stabilized, simulating high temperatures, such as the heating environment when the chip is working. At high temperatures, the material of the chip may soften, resulting in easier wear. Through the test data at different temperatures, materials that can still maintain stable performance at extreme temperatures can be screened out, improving the reliability of the chip in harsh environments.

[0045] Moreover, the chip is fixed inside the installation mechanism 7 and a slight vibration is applied. The tiny vibration of the chip is controlled electromagnetically, such as high-frequency and low-amplitude vibration, to test the anti-vibration ability of the coating or package. For example, the working vibration of the chip in electronic devices, such as the vibration of fans and motors, is simulated to evaluate the wear risk under long-term vibration, and the tiny displacement between the chip and the substrate, such as fretting wear caused by thermal expansion, is simulated to avoid failures caused by assembly errors and simulate non-ideal installation conditions.

[0046] When detecting the semiconductor chip, the bottom of the friction component 53 contacts the chip surface for friction testing on the chip, and the scratch situation on the chip surface can also be detected through the friction component 53. The probe component 52 provided can touch the chip, while the support component 51 continuously applies different pressures to the probe component 52 to detect the scratch situation on the chip surface under different pressures by applying different pressures to the probe component 52.

[0047] Embodiment 2: Based on the installation mechanism 7 and the scratch driving mechanism 3 proposed in Embodiment 1, this embodiment provides a further technical solution for the installation mechanism 7 and the scratch driving mechanism 3.

[0048] An outer frame 4 is provided at the upper end of the chassis base 1, and a protective cover 2 is provided at the upper end of the outer frame 4, and the protective cover 2 covers the outside of the probe detection mechanism 5.

[0049] The scratch driving mechanism 3 includes a central axis frame 31 which is rotatably installed inside the chassis base 1, and one end of the central axis frame 31 is connected to the output end of the driving motor 6. Two semi-circular plates 32 are provided at the upper end of the central axis frame 31, and screw rod frames 33 are provided inside both of the two semi-circular plates 32, and sliders 34 are provided inside both of the two screw rod frames 33.

[0050] It should be noted that the driving motor 6 drives the central axis frame 31 to rotate through the output shaft, and the central axis frame 31 drives the semi-circular plate 32 to rotate. The semi-circular plate 32 drives the screw rod frame 33 to rotate, and the screw rod frame 33 drives the slider 34 to rotate. The two semi-circular plates 32 are spliced into a disc shape, and the mounting mechanism 7 for mounting the chip can be rotated into the inside of the protective cover 2.

[0051] The mounting mechanism 7 includes a mounting plate 71 which is mounted on the upper end of the slider 34. Two placing grooves 72 are symmetrically opened at the upper end of the mounting plate 71. Bottom sealing plates 78 are provided inside both of the two placing grooves 72. A rubber pad 77 is provided at the upper end of the bottom sealing plate 78. An upper sealing plate 76 is provided at the upper end of the rubber pad 77. The upper sealing plate 76, the rubber pad 77 and the bottom sealing plate 78 are fixed by bolts 79.

[0052] A chip 74 is provided at the upper end of the upper sealing plate 76. Clamping blocks 75 are provided on both sides of the upper sealing plate 76. Air jet flat tubes 73 are provided on both sides of the bottom sealing plate 78. The air outlets of the two air jet flat tubes 73 are aligned with the surface of the chip 74. A vibration motor 711 is provided in the middle of the lower end of the upper sealing plate 76.

[0053] It should be noted that when performing a friction test on the chip 74, the chip 74 is clamped inside the upper sealing plate 76 by the clamping blocks 75. The provided vibration motor 711 causes the chip 74 above the upper sealing plate 76 to vibrate slightly through jitter. The upper sealing plate 76 is clamped and fixed by bolts 79. The rubber pad 77 provided between the upper sealing plate 76 and the bottom sealing plate 78 is used to prevent the transmission of the jitter force. The chip 74 changes the form of contact between the probe detection mechanism 5 and the surface of the chip 74 through slight jitter;

[0054] When performing a scratch test on the chip 74, the screw rod frame 33 will push the slider 34 to slide, drive the mounting plate 71 to move through the slider 34, thereby driving the chip 74 to move for the scratch test. The provided air jet flat tubes 73 directly spray the heated hot air onto the surface of the quasi-chip 74 to detect whether the friction test structure of the quasi-chip 74 is the same at different temperatures by changing the surface temperature of the quasi-chip 74.

[0055] Among them, the semi-circular plates 32 are spliced into a disc. The two semi-circular plates 32 are combined into a complete disc structure, which can rotate 360°, driving the installation mechanism 7 to move inside the shield case 2. By rotating, the chip 74 can be adjusted to any angle or position inside the shield case 2 to ensure that the scratch test covers all key areas on the surface of the chip, such as the circuit-dense area, the edge, etc., to avoid local omission.

[0056] The clamping block 75 fixes the chip 74. The chip is firmly fixed inside the upper sealing plate 76 through the clamping block 75 to prevent displacement during the test. The vibration motor 711 generates slight jitter, simulating the dynamic environment of the chip in actual use, such as vibration and fretting wear, through mechanical vibration. The rubber pad 77 isolates the vibration transmission. The rubber pad 77 reduces the force transmission of the vibration motor to other components, such as the bottom sealing plate 78, ensuring that the vibration only acts on the surface of the chip.

[0057] The slight jitter can simulate transportation vibration and equipment operation vibration, such as fan and motor vibration, to evaluate the wear resistance of the chip under dynamic conditions. Vibration can cause small displacements between the chip 74 and the substrate, resulting in long-term wear, such as fretting wear caused by thermal expansion, to identify potential failure risks in advance. The clamping block 75 ensures that the chip remains fixed during the test, avoiding the influence of position offset caused by vibration or friction on the test results. Moreover, the rubber pad 77 prevents the vibration from being transmitted to other mechanical components, avoiding test errors caused by additional vibration.

[0058] The shield case 2, as a closed test cavity, places the installation mechanism 7 and the chip 74 in a closed environment, which may be used to control temperature, humidity or gas atmosphere, simulate the heating environment when the chip 74 is working, and evaluate the wear resistance of the coating at high temperature, such as the scratch expansion caused by softening.

[0059] Embodiment 3: Based on the probe detection mechanism 5 proposed in Embodiment 1, this embodiment provides further technical solutions for the support assembly 51, the probe assembly 52 and the friction assembly 53.

[0060] The support assembly 51 includes a support frame 511. The support frame 511 is installed at the upper end of the chassis base 1. A detection head 512 is provided in the middle of the lower end of the support frame 511. A force control wheel 513 is provided inside the support frame 511, and the force control wheel 513 is sleeved on the outer surface of the motor output end.

[0061] The convex teeth provided on the outer surface of the force control wheel 513 are of different lengths, and the lengths of the convex teeth are distributed in a circular array from long to short.

[0062] It should be noted that the lifting height of the probe assembly 52 and the friction assembly 53 is adjusted through the support frame 511, and the provided detection head 512 is used to detect the scratch condition of the coating on the surface of the chip 74.

[0063] The probe assembly 52 includes an installation tube 523 which is installed inside the support frame 511. A tapered tube 524 is slidably installed inside the support frame 511. A push block 521 is provided at the upper end of the tapered tube 524. A first spring 522 is provided at the bottom of the push block 521. The convex teeth of the force control wheel 513 are in contact with the surface of the push block 521.

[0064] A probe cone 526 is slidably installed inside the tapered tube 524, and a second spring 525 is provided at the upper end of the probe cone 526.

[0065] It should be noted that by rotating the force control wheel 513, the convex teeth are in contact with the surface of the push block 521. After the push block 521 is squeezed, it pushes the tapered tube 524 to slide inside the installation tube 523, and the first spring 522 is used to provide an upward driving force for the push block 521. When the tapered tube 524 moves downward, it will drive the probe cone 526 to contact the surface of the chip 74. The provided second spring 525 provides a buffering force for the probe cone 526, and after the second spring 525 is squeezed, it will also provide a thrust force for the probe cone 526.

[0066] Moreover, since the provided convex teeth are distributed in a circular array and the lengths of the convex teeth are different and arranged from long to short, when the force control wheel 513 rotates, it can apply different pressures to the push block 521. The force of the probe cone 526 contacting the surface of the chip 74 is different, so as to detect the scratch conditions caused by different forces on the surface coating of the chip 74. Moreover, when the chip 74 is being tested, the chip 74 will also vibrate slightly downward, so that the contact mode between the probe cone 526 and the chip 74 is changing in real time.

[0067] Among them, the convex teeth in the force control wheel 513 are distributed in a circular array and have different lengths from long to short. By rotating the force control wheel, convex teeth of different lengths can be selected to contact the push block 521. Convex teeth of different lengths can apply different pressures. When the long convex teeth are in contact, a smaller pressure is applied, and when the short convex teeth are in contact, a larger pressure is applied, so as to realize hierarchical pressure control.

[0068] By rotating the force control wheel, the preset pressure level can be quickly selected, which is suitable for the test requirements of different materials or coatings, such as evaluating the tolerance limits of materials with different hardnesses, and can generate direct correlation data of pressure with scratch depth and width, and identify the minimum pressure at which the coating begins to peel off or the material yield point.

[0069] By sequentially selecting different convex tooth lengths, gradually increasing load conditions can be simulated to study the fatigue wear characteristics of the material. The first spring 522 provides an upward thrust to balance the downward pressure of the push block 521, ensuring uniform distribution of the force when the probe cone 526 contacts the chip. It provides buffering when the probe cone contacts the chip, preventing damage to the chip surface due to excessive impact force. At the same time, by squeezing the second spring 525, a stable thrust is provided to the probe cone. Moreover, the chip 74 vibrates slightly, and the upper sealing plate 76 generates minute vibrations through the vibration motor 711, changing the contact mode between the probe cone 526 and the chip surface. The vibration simulates dynamic environments such as vibration and fretting wear in actual use.

[0070] The friction assembly 53 includes a top pipe 531, which is installed at the lower end of the support frame 511. A return force member 532 is provided at the lower end of the top pipe 531. An installation basket 533 is sleeved on the outer surface of the return force member 532. A friction plate 534 is provided at the lower end of the installation basket 533. A top pin 535 is provided at the lower end of the top pipe 531.

[0071] It should be noted that when performing a friction test on the coating on the surface of the chip 74, the friction plate 534 abuts against the surface of the chip 74, and the provided return force member 532 presses the friction plate 534 against the surface of the chip 74 through deformation. And the provided top pin 535 penetrates through the friction plate 534 and abuts against the surface of the chip 74, enabling the friction plate 534 to perform a friction test on the chip 74, while the top pin 535 simultaneously performs a scratch test on the surface of the chip 74.

[0072] Among them, the combined use of the friction plate 534 and the top pin 535. The friction plate performs a large-area friction test, and the top pin simultaneously performs a fixed-point scratch test. The return force member 532 provides continuous pressure through deformation to ensure the synchronous progress of the friction and scratch tests.

[0073] Working principle: When performing a friction test and detection on a semiconductor chip, the semiconductor chip is placed in the installation mechanism 7 provided above the scratch driving mechanism 3. The provided scratch driving mechanism 3 is used to push the installation mechanism 7 to move in cooperation with the probe detection mechanism 5 to detect the semiconductor chip. And the provided scratch driving mechanism 3 can also adjust the position of the installation mechanism 7 by rotating;

[0074] Among them, the scratch driving mechanism 3 pushes the installation mechanism 7 to move, achieving precise contact between the probe detection mechanism 5 and the chip surface and scratch path control through linear driving. Through linear movement, scratch tests can be performed on any position on the chip surface, ensuring that the tests cover all key areas of the chip such as the circuit dense area and the package edge, avoiding local deviations.

[0075] The rotation adjustment function can simulate the frictions in different directions during actual use, such as oblique friction and rotational friction, which is closer to real working conditions, such as the moving parts of MEMS devices and the edge wear of chip packages.

[0076] Moreover, the semiconductor chip arranged inside the installation mechanism 7 changes the temperature of the chip surface through hot air jet, so as to control the temperature of the semiconductor chip for detecting the scratch conditions of the chip surface coating at different temperatures. And inside the installation mechanism 7, there is a device for fixing the semiconductor chip and controlling the slight jitter of the chip. By the cooperation of the jitter of the semiconductor chip and the probe detection mechanism 5, the usage conditions of the semiconductor chip in an unconventional environment are detected.

[0077] And by spraying hot air flow onto the chip surface, the temperature of the chip surface is quickly changed and stabilized, simulating high temperatures such as the heating environment when the chip is working. The material of the chip may soften at high temperatures, resulting in easier wear. Through the test data at different temperatures, materials that can still maintain stable performance at extreme temperatures can be screened out, improving the reliability of the chip in harsh environments.

[0078] Moreover, the chip is fixed inside the installation mechanism 7 and slight jitter is applied. The tiny vibration of the chip, such as high-frequency and low-amplitude vibration, is controlled electromagnetically to test the vibration resistance of the coating or package, such as the working vibration of the chip in electronic devices, such as the vibration of the fan and motor, to evaluate the wear risk under long-term vibration, and to simulate the tiny displacement between the chip and the substrate, such as fretting wear caused by thermal expansion, to avoid failure caused by assembly errors and simulate non-ideal installation conditions.

[0079] When detecting the semiconductor chip, the bottom of the friction component 53 contacts the chip surface for friction testing of the chip, and the scratch conditions of the chip surface can also be detected through the friction component 53. The probe component 52 arranged can contact the chip, and the support component 51 cooperates with the probe component 52 to continuously apply different pressures to the probe component 52, and the scratch conditions of the chip surface under different pressures are detected by applying different pressures to the probe component 52.

[0080] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A computer-based semiconductor chip wear-resistant testing machine, comprising a chassis base (1) and a drive motor (6), and the drive motor (6) is installed inside the chassis base (1), characterized in that: A scratch driving mechanism (3) is provided at the upper end of the chassis base (1). At the upper end of the scratch driving mechanism (3), there are two mounting mechanisms (7) for clamping a semiconductor chip and heating its surface. A probe detection mechanism (5) for coating testing of the semiconductor chip clamped inside the mounting mechanism (7) is provided on one side of the upper end of the chassis base (1). The probe detection mechanism (5) includes a support assembly (51). Inside the support assembly (51), there is a friction assembly (53) for performing scratch friction testing on the surface coating of the semiconductor chip and a probe assembly (52) for incrementally applying pressure to detect the scratch state of the coating.

2. A computer-based semiconductor chip wear-resistant testing machine according to claim 1, wherein: An outer frame (4) is provided at the upper end of the chassis base (1). A protective cover (2) is provided at the upper end of the outer frame (4), and the protective cover (2) covers the outside of the probe detection mechanism (5).

3. A computer-based semiconductor chip wear-resistant testing machine according to claim 2, characterized in that: The scratch driving mechanism (3) includes a central axis frame (31). The central axis frame (31) is rotatably installed inside the chassis base (1), and one end of the central axis frame (31) is connected to the output end of the driving motor (6). At the upper end of the central axis frame (31), there are two semi-circular plates (32). Inside both of the two semi-circular plates (32), there are screw rod frames (33). Inside both of the two screw rod frames (33), there are sliders (34).

4. A computer-based semiconductor chip wear-resistant testing machine according to claim 1, characterized in that: The mounting mechanism (7) includes a mounting plate (71). The mounting plate (71) is installed at the upper end of the slider (34). At the upper end of the mounting plate (71), two placement grooves (72) are symmetrically opened. Inside both of the two placement grooves (72), there is a bottom sealing plate (78). At the upper end of the bottom sealing plate (78), there is a rubber pad (77). At the upper end of the rubber pad (77), there is an upper sealing plate (76). The upper sealing plate (76), the rubber pad (77), and the bottom sealing plate (78) are fixed by bolts (79).

5. The wear-resistant testing machine for semiconductor chips based on a computer according to claim 4, characterized in that: A chip (74) is provided at the upper end of the upper sealing plate (76). Clamping blocks (75) are provided on both sides of the upper sealing plate (76). Air jet flat tubes (73) are provided on both sides of the bottom sealing plate (78). The air outlets of the two air jet flat tubes (73) are aligned with the surface of the chip (74). A vibration motor (711) is provided in the middle of the lower end of the upper sealing plate (76).

6. A computer-based semiconductor chip wear-resistant testing machine according to claim 1, characterized in that: The support assembly (51) includes a support frame (511). The support frame (511) is installed at the upper end of the chassis base (1). A detection head (512) is provided in the middle of the lower end of the support frame (511). A force control wheel (513) is provided inside the support frame (511), and the force control wheel (513) is sleeved on the outer surface of the motor output end.

7. A computer-based semiconductor chip wear-resistant testing machine according to claim 6, characterized in that: The convex teeth provided on the outer surface of the force control wheel (513) are of different lengths, and the lengths of the convex teeth are distributed in a circular array from long to short.

8. A computer-based semiconductor chip wear-resistant testing machine according to claim 7, characterized in that: The probe assembly (52) includes a mounting tube (523), the mounting tube (523) is installed inside the support frame (511), a tapered tube (524) is slidably installed inside the support frame (511), a push block (521) is arranged at the upper end of the tapered tube (524), a first spring (522) is arranged at the bottom of the push block (521), and the convex teeth of the force control wheel (513) are in contact with the surface of the push block (521).

9. A computer-based semiconductor chip wear-resistant testing machine according to claim 8, characterized in that: A probe cone (526) is slidably installed inside the tapered tube (524), and a second spring (525) is arranged at the upper end of the probe cone (526).

10. A computer-based semiconductor chip wear-resistant testing machine according to claim 1, characterized in that: The friction assembly (53) includes a top tube (531), the top tube (531) is installed at the lower end of the support frame (511), a return member (532) is arranged at the lower end of the top tube (531), a mounting basket (533) is sleeved on the outer surface of the return member (532), a friction plate (534) is arranged at the lower end of the mounting basket (533), and a top pin (535) is arranged at the lower end of the top tube (531).

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