Data processing method, probe card probe adjusting method and system

Abstract

The invention discloses a data processing method and a probe card probe adjusting method and system.The probe card probe adjusting system comprises a testing machine, a server and a probe adjusting machine, and the server is used for establishing communication connection between the wafer testing machine and the probe adjusting machine and guiding the probe adjusting machine to automatically address abnormal probe points based on the probe mark testing result of the testing machine; information interconnection and intercommunication among equipment are realized, needle adjusting time is shortened, needle point maintenance accuracy and efficiency are improved, and personnel training requirements are reduced.

Description

Technical Field

[0001] This application relates to the technical field of wafer probe testing, and in particular, to a data processing method, a probe card needle adjustment method and system. Background Art

[0002] After wafer manufacturing is completed, wafer probe testing (CP, Chip Probing) is usually required. The test object is each die in the entire wafer. The purpose is to find defective dies and mark them. The wafer testing process is completed in a tester. When the probe card contacts the wafer pads, marks (hereinafter referred to as needle marks) will be left. The position of the needle marks is a very important indicator in the wafer production process. Therefore, it is required that the relative position between the probe and the center of the pad be as aligned as possible. When it is found that the tip of the probe card cannot be aligned with the center of the pad, the probe card needs to be transferred from the testing machine to the needle adjustment device to detect and repair the position of the tip, so as to ensure that the tip of each probe can be located at the specified position. CN2684374Y discloses the needle adjustment process in detail.

[0003] The main problems existing in the prior art are as follows: 1. During wafer testing, the test conditions of the probe card are mostly high temperature (85 degrees Celsius and above) or low temperature (below 0 degrees Celsius), while the detection and repair of the position of the probe card tip are carried out under normal temperature (about 25 degrees Celsius). The position of the probe card tip will expand due to heat and contract due to cold. Therefore, there will be a deviation between the tip position recorded on the tester and the position detected by the needle adjustment machine under normal temperature conditions, and it often takes a lot of time for personnel to record abnormal tip information.

[0004] 2. Since the tester and the needle adjustment machine often come from different equipment manufacturers, there is no corresponding relationship between the tip number of the file output by the tester and the tip position scanned and located by the needle adjustment machine itself, and manual calculation and conversion are required in the middle.

[0005] 3. To confirm the tip position, the probe card needs to be installed on the tester for debugging and needle insertion to check the needle mark condition. To adjust the tip position, the probe card needs to be installed on the needle adjustment machine for operation. After repair, it is also necessary to return to the tester to reconfirm whether the needle mark position is correct. The whole process is repeated many times until the needle mark position meets the specifications before normal test production can start. The whole process requires repeated disassembly and installation of the probe card, with low operation efficiency and high requirements for personnel experience. The operation time for a probe card often takes several hours. Summary of the Invention

[0006] The purpose of this application is to solve the problems of low needle adjustment efficiency and long operation time in the prior art. This application provides a server and a data processing method for communicating between a tester and a needle adjustment, as well as a probe card needle adjustment method and system.

[0007] To achieve the above object, the present application adopts the following technical solutions: In a first aspect, the present application provides a data processing method, including: Receiving an output file from a tester, where the output file contains the tip number corresponding to each needle mark, the needle mark position, and determination result information, and the determination result information includes normal and abnormal; Parsing and processing the output file to generate a parsed file adapted to a needle adjustment machine, where the parsed file includes the tip number of the abnormal tip and the abnormal needle mark position; Sending the parsed file to the needle adjustment machine.

[0008] In one embodiment, the output file contains tip test data, and the tip test data includes one or more parameters of contact resistance, leakage current, stitch parameters, tip diameter, etc.

[0009] In one embodiment, the processing includes offset processing of the needle mark position.

[0010] In one embodiment, the offset processing includes: B1) Selecting multiple calibration points on the wafer to be tested and recording the position coordinates of each calibration point at the test temperature; B2) Establishing a corresponding relationship between the position coordinates and the reference position coordinates of the wafer to be tested at room temperature, and calculating the offset; B3) Calculating the corrected position information corresponding to each needle mark at room temperature based on the needle mark positions of the corresponding tips in the output file and the offset.

[0011] In one embodiment, the parsed file further includes the tip positions of each probe, and each of the needle mark positions corresponds one-to-one to the tip positions of each probe.

[0012] Furthermore, the present application also provides a server, which has a processor, a memory, an input port connected to the tester, and an output port connected to the needle adjustment machine. The memory stores program instructions executable by the processor to implement the data processing method.

[0013] In a second aspect, the present application provides a method for adjusting the needles of a probe card, including: S31) Fixing the probe card to be tested on a three-dimensional mounting platform, scanning and positioning the current positions of the tips on the probe card; S32) Based on the analysis of the needle marks of the tester, or based on the parsed file from the server, determining the tip numbers of the abnormal tips, and corresponding each of the needle mark positions to the current positions of the tips on the probe card; S33) Automatically move the three-dimensional mounting platform so that the abnormal tip is exposed within the field of view of the maintenance window, while displaying the real-time images of the tips of the probe card and the positions of the abnormal needle marks; S34) Repair the abnormal tip so that the abnormal tip is adjusted to the center of the position of the abnormal needle mark.

[0014] In one embodiment, before step S31), it further includes: S11) Place the probe card to be tested at the test temperature and let it stand for a set time so that the probe card to be tested expands or cools sufficiently; S12) Try to punch needle marks on several pads of the wafer, perform image processing on the needle marks of the wafer pads, identify and locate each needle mark, and generate an output file. The output file contains the tip number, needle mark position, and determination result information corresponding to each needle mark; S21) Parse and process the output file to generate a parsing file adapted to the needle adjustment machine. The parsing file includes the tip number of the abnormal tip and the position of the abnormal needle mark.

[0015] In one embodiment, in step S32), it further includes calculating the correction value of each tip based on the difference between the current position of each tip and the center point of the position of each needle mark, sorting the correction values of each tip, and automatically moving the three-dimensional mounting platform based on the magnitudes of the correction values.

[0016] In one embodiment, in step S33), move the three-dimensional mounting platform based on the tip number of the abnormal tip or the position of the abnormal needle mark or the current position of the abnormal tip.

[0017] In one embodiment, after step S34), it further includes: S40) A review step, scanning the real-time positions of the tips on the probe card and comparing them with the needle mark positions corresponding to the tip numbers in the current maintenance window to ensure that each tip is located within the corresponding needle mark position, and updating the record of the comparison result.

[0018] In a third aspect, the present application also provides a probe card needle adjustment system, including: A tester, having an image acquisition and processing module for identifying and locating the needle marks on the pads, and generating an output file containing the tip number, needle mark position, and determination result information corresponding to each needle mark; A server, for parsing and processing the output file to generate a parsing file adapted to the needle adjustment machine; A needle adjustment machine, having a camera for positioning and scanning the tip positions, a three-dimensional mounting platform for fixing the probe card, and a driving mechanism for driving the movement of the three-dimensional mounting platform. The needle adjustment machine can automatically locate the abnormal tip based on the parsing file; A processor and a memory, wherein program instructions executable by the processor are stored in the memory to implement the method for adjusting needles of the probe card.

[0019] In this application, the server is used to establish communication between the tester and the needle adjusting machine, and convert the data such as needle mark information and needle tip numbers obtained during the wafer testing process into information that the needle adjusting machine can utilize, enabling the needle adjusting machine to quickly locate abnormal needle tips, saving the time for manual addressing and debugging, improving the recognition rate and accuracy of abnormal needle tips, reducing the requirements for personnel training, and enhancing the maintenance efficiency. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of a needle adjusting system provided by an embodiment of this application.

[0021] Figure 2 It is a schematic diagram of a wafer provided by an embodiment of this application.

[0022] Figure 3 It is a partial structural schematic diagram of the needle marks left after the die is pricked on the tester provided by an embodiment of this application.

[0023] Figure 4 It is a schematic diagram of the actual needle tip position scanned on the needle adjusting machine provided by an embodiment of this application.

[0024] Figure 5 It is a schematic diagram of the recognition of the needle mark position collected by the tester provided by an embodiment of this application.

[0025] Figure 6 It is a schematic diagram of the real-time image of the needle tip and the position of the abnormal needle mark collected by the needle adjusting machine provided by an embodiment of this application.

[0026] Wherein: 100, wafer; 10, die; 20, alignment mark; 11, calibration point; 2, bonding pad; A1, needle tip number; a1, current position of the needle tip. Detailed Embodiments

[0027] To describe in detail the technical content, structural features, achieved objectives and effects of the invention, the technical solutions in the embodiments of this application will be described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments can also be implemented without these specific details or in the case of one or more equivalent arrangements. In addition, various exemplary embodiments can be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shapes, structures and characteristics of an exemplary embodiment can be used or implemented in another exemplary embodiment.

[0028] In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0029] The embodiments of the present application provide a method for adjusting needles of a probe card, an adjusting needle system, a server, and a data processing method of the server. Among them, the probe card needle adjusting system includes a tester, a server, and a needle adjusting machine. The server is used to establish a communication connection between the wafer tester and the needle adjusting machine, and guide the needle adjusting machine to automatically address abnormal needle tips based on the needle mark test results of the tester, so as to realize the information interconnection between devices, shorten the needle adjusting time, improve the accuracy and operation efficiency of needle tip maintenance, and reduce the personnel training requirements.

[0030] Please refer to Figure 1 , which shows a schematic structural diagram of the needle adjusting system provided by the embodiments of the present application. The needle adjusting system includes a tester, a server, and a needle adjusting machine.

[0031] Tester. During the wafer probe test process, the tester is connected to the pin signals of each die using a probe card and applies a predetermined test signal to check whether each die meets the preset performance standards, such as operating voltage, current consumption, signal timing, and correct execution of specific functions.

[0032] See Figure 2 , in one embodiment, the tester has an image acquisition and processing module that can perform high-definition shooting on the wafer 100 and identify and locate the needle marks on the pads through automatic image processing technology. See Figure 5 , so that the tester can generate an output file containing the needle tip numbers, needle mark positions, and determination result information corresponding to each needle mark. See Figure 3 , 4 , and the determination result information includes normal and abnormal.

[0033] In the above embodiments, image recognition technology is used to identify abnormal needle tips based on the needle mark test results. In other embodiments of the present application, abnormal needle tips can also be identified through the performance test data of the tester, such as one or more parameters among contact resistance, leakage current, needle trace parameters, needle tip diameter, etc. When the tester detects that the above needle tip test data is abnormal or deviates from the standard value, it automatically determines the corresponding needle tip as an abnormal needle tip and generates an output file based on the needle tip test data.

[0034] A server, which can be a local server or a networked server. The server can communicate between the testing machine and the needle adjustment machine through the FTP protocol, and at the same time parse and process the needle marks feedback by the testing machine so that the needle adjustment machine can identify and utilize them. In some embodiments, the server and the needle adjustment machine can also be integrated into one body, that is, the computing control system of the needle adjustment machine has the ability to analyze and process the output file of the testing machine. The output file received by the needle adjustment machine through the external interface is automatically converted into data information that can be utilized.

[0035] Specifically, the server can parse and process the output file of the testing machine to generate a parsed file adapted to the needle adjustment machine. The parsed file includes the positions and / or pictures of each needle mark and the determination result information, and the parsed file is in a format that can be recognized by the needle adjustment machine.

[0036] The server has a processor, a memory, an input port connected to the testing machine, and an output port connected to the needle adjustment machine, and the memory stores program instructions executable by the processor. When these program instructions are executed, the processor can execute the following data processing methods, including: Receiving an output file from the testing machine, where the output file contains the tip number a1 corresponding to each needle mark, the needle mark position, and the determination result information, and the determination result information includes normal and abnormal; Parsing and processing the output file to generate a parsed file adapted to the needle adjustment machine. The parsed file includes the tip positions of each probe, the positions of each needle mark, the tip numbers of abnormal tips, and the positions of abnormal needle marks, etc. In the parsed file, the positions of each needle mark correspond one-to-one with the tip positions of each probe: Sending the parsed file to the needle adjustment machine.

[0037] In order to overcome the position change caused by different temperatures of the probe card in the testing temperature and the needle adjustment environment, in one embodiment, the server also includes offset processing of the needle mark positions in the output file. The offset processing can be implemented in various ways. The offset processing in this embodiment includes the steps: B1) Selecting multiple calibration points 11 on the wafer to be tested and recording the position coordinates of each calibration point at the testing temperature; B2) Establishing a corresponding relationship between the position coordinates and the reference position coordinates of the wafer to be tested at room temperature, and calculating the offset amount. The reference position comes from the design drawing or from the visual recognition and positioning of the wafer by the testing machine at room temperature; B3) Calculating the corrected position information corresponding to each needle mark at room temperature based on the needle mark positions of the corresponding tips in the output file and the offset amount.

[0038] That is to say, establish a reference coordinate system at room temperature (25°C) and record the coordinate matrix P of each calibration pointPref Next, collect the coordinates of each calibration point at the test temperature (low temperature or high temperature), and record the coordinate matrix P max / P min Perform deformation modeling and coordinate mapping. Randomly retain 20% of the calibration points as the validation set, calculate the reprojection error. If the error is within the allowable threshold range, establish the offset correspondence relationship between the coordinate positions on the probe card at normal temperature and the test temperature.

[0039] In one embodiment, the analysis file includes the corrected position information and / or pictures of each needle mark and the determination result information. The analysis file can be viewed through the display device of the needle adjustment machine, so that the maintenance personnel can quickly understand the situation of abnormal needle tips.

[0040] The needle adjustment machine has a camera for positioning and scanning the needle tip position, a three-dimensional mounting platform for fixing the probe card, and a driving mechanism for driving the movement of the three-dimensional mounting platform. Since the size of the needle tip of the probe card is very small, for the convenience of staff maintenance and inspection, the needle adjustment machine also has an optical microscope or imaging display device for magnifying and displaying the needle tip of the probe card, which can display the real-time images of each needle tip in real time. See Figure 6 as shown. The needle adjustment machine can automatically locate the abnormal needle tip based on the analysis file, and drive the three-dimensional mounting platform to move by the driving mechanism, so as to automatically move the abnormal needle tip into the visual field range of the maintenance window, saving the time for manual debugging and searching for abnormal needle tips.

[0041] The probe card needle adjustment system of the present application further includes a processor and a memory. The memory stores program instructions executable by the processor to implement the following needle adjustment method. This article does not limit the use of one or more processors and memories. The needle adjustment system can realize the collaborative control of the tester, the needle adjustment machine and the server through multiple processors and memories, so as to implement the following needle adjustment method. In some simplified systems, the server and the needle adjustment machine are integrated, and the control system of the needle adjustment machine completes the work of the processor and the memory.

[0042] A probe card needle adjustment method includes: S11) Place the probe card to be tested at the test temperature for a set time to allow the probe card to fully expand or cool; S12) Try to make needle marks on several pads 2 of the wafer 100, perform image processing on the needle marks of the wafer pads, identify and locate each needle mark. See Figure 5 Generate an output file. The output file contains the needle tip number, needle mark position, and determination result information corresponding to each needle mark. Figure 3 The figure shows the needle mark position diagram. In the figure, A1, A2, B1... Kn represent the needle tip numbers corresponding to each needle mark; Figure 5The upper row in the figure is the photo taken after the pilot injection marks in the test machine and the image acquisition of each pad on the crystal grain. The lower row is the photo after the injection marks are identified and located. It can be seen that in the 4 photos on the left and in the middle, there are injection marks at the center of each pad. In the two photos on the right, the middle pad lacks injection marks. Through the image acquisition and processing module in the test machine, the abnormal injection mark position can be successfully identified, that is Figure 5 the position within the red frame area in the lower right corner of the figure, and at the same time, the tip number is obtained; S21) The server downloads the output file of the test machine through the FTP network, parses and processes the output file to generate a parsed file adapted to the needle adjustment machine. The parsed file includes the tip numbers of each tip, the injection mark positions, the tip numbers of abnormal tips, and the abnormal injection mark positions. Here, the injection mark positions can adopt the aforementioned corrected position information, and the corrected position information is obtained after temperature offset correction based on the injection mark positions in the output file. The calculation method of the offset correction has been introduced before and will not be elaborated here; S31) Fix the probe card to be tested on the three-dimensional installation platform of the needle adjustment machine by manual or mechanical feeding method, and use a high-definition camera to scan and locate the current positions of each tip on the probe card. In this embodiment, the current positions can be visually displayed by real-time images, and can also be displayed by extracting features from the images and then reconstructing the images. For example Figure 4 as shown, a1, a2... kn are the tip numbers, corresponding to the position numbers in the injection mark position diagram respectively. The numbers of a1 and A1, a2 and A2, b1 and B1 correspond one by one; S32) Based on the analysis of the injection marks of the test machine, or based on the parsed file from the server, determine the tip numbers of the abnormal tips, and correspond the injection mark positions of each tip with the current positions of each tip on the probe card; S33) Automatically move the three-dimensional installation platform to expose the abnormal tip within the field of view of the maintenance window, and at the same time display the real-time images of each tip on the probe card and the abnormal injection mark positions. Refer to Figure 6 the figure, where the abnormal injection mark position is represented by a blue frame, the white dots are the real-time images of normal tips, the yellow dots are the current positions of abnormal tips, the red cross marks represent the center points of the tips, and the green cross marks represent the center points of the injection mark positions, which are also the standard positions of the tips. It can be seen that the center position of the abnormal tip is not at the exact center of the injection mark position; S34) Manually repair the abnormal tip. Please continue to refer to Figure 6, since the needle adjustment system of the probe card has marked the position of the needle mark of the abnormal needle tip and the current position of the abnormal needle tip, it only needs to manually adjust the abnormal needle tip to the green cross alignment mark at the center of the blue frame; S40) Recheck step, scan the real-time positions of the needle tips on the probe card, and compare them with the standard positions of the needle tips corresponding to the needle tip numbers within the current maintenance window. If the comparison result shows that the current position of the needle tip is within the standard position threshold range, manually or automatically proceed to the next abnormal needle tip for maintenance and record the maintenance data; S41) Check whether all abnormal needle tips have been repaired. If so, end the repair; otherwise, continue to loop through steps S31 to S40 until the current positions of all needle tips correspond to the standard positions of each needle tip.

[0043] In one embodiment, after the needle adjustment machine takes pictures and scans the current positions of each needle tip, the correction value of each needle tip can also be calculated based on the difference between the current position of each needle tip and the center point of each needle mark position, that is, calculate Figure 6 the distance between the red cross line and the green cross line in, and record the difference between the actual position and the standard position of each needle tip currently. In some embodiments, the correction values of each needle tip can also be sorted from largest to smallest, and the correction values greater than a certain set threshold are set as abnormal to automatically identify the needle tips that need to be adjusted in position. In some embodiments, the three-dimensional mounting platform can also be automatically moved based on the magnitudes of the correction values, that is, the needle tips are repaired in the order from largest to smallest correction value, or random repair can also be performed according to the selection of the maintenance personnel.

[0044] To improve the timeliness of finding and positioning abnormal probes, in this application, the three-dimensional mounting platform for fixing the probe card to be repaired moves automatically. There are various ways to select the movement path of the three-dimensional mounting platform. For example, the software automatically plans the optimal movement path according to the positions of multiple abnormal needle tips. In one embodiment, the three-dimensional mounting platform can also be moved sequentially based on the needle tip numbers of the abnormal needle tips. Or, the three-dimensional mounting platform can be moved based on the needle mark position. The three-dimensional mounting platform can also be moved to the abnormal needle tip closest to the current position of the abnormal needle tip.

[0045] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements. The scope of protection required by the present invention is defined by the appended claims, the specification and their equivalents.

Claims

1. A data processing method, characterized in that, Comprising: Receiving an output file from a test machine, where the output file contains the tip numbers corresponding to each needle mark, the needle mark positions, and determination result information, and the determination result information includes normal and abnormal; Parsing and processing the output file to generate a parsed file adapted to a needle adjustment machine, where the parsed file includes the tip numbers of abnormal tips and the abnormal needle mark positions; Sending the parsed file to the needle adjustment machine.

2. The data processing method according to claim 1, wherein: The output file contains tip test data, and the tip test data includes one or more parameters among contact resistance, leakage current, stitch parameters, and tip diameter.

3. The data processing method according to claim 1, characterized in that: The processing includes offset processing of the needle mark positions.

4. The data processing method according to claim 1, characterized in that: The parsed file further includes the tip positions of each probe, and the needle mark positions correspond one-to-one with the tip positions of each probe.

5. A server, having a processor, a memory, an input port connected to a test machine, and an output port connected to a needle adjustment machine, where the memory stores program instructions executable by the processor to implement the method according to any one of claims 1-4.

6. A method for adjusting needles of a probe card, characterized in that, Comprising: S31) Fixing a probe card to be tested on a three-dimensional mounting platform, scanning and positioning the current positions of the tips on the probe card; S32) Based on the analysis of the needle marks of the test machine, or based on the parsed file from the server, determining the tip numbers of abnormal tips, and corresponding each of the needle mark positions with the current positions of the tips on the probe card one-to-one; S33) Automatically moving the three-dimensional mounting platform to expose the abnormal tips within the field of view of the maintenance window, and simultaneously displaying the real-time images of the tips on the probe card and the abnormal needle mark positions; S34) Repairing the abnormal tips to adjust the abnormal tips to the center of the abnormal needle mark positions.

7. The method for adjusting needles of a probe card according to claim 6, characterized in that, Before step S31), it further includes: S11) Letting the probe card to be tested stand for a set time at the test temperature to enable the probe card to fully expand or cool; S12) Trying to make needle marks on several bonding pads of a wafer, performing image processing on the needle marks of the wafer bonding pads, identifying and positioning each needle mark, and generating an output file, where the output file contains the tip numbers corresponding to each needle mark, the needle mark positions, and determination result information; S21) Parsing and processing the output file to generate a parsed file adapted to a needle adjustment machine, where the parsed file includes the tip numbers of abnormal tips and the abnormal needle mark positions.

8. The method for adjusting needles of a probe card according to claim 7, wherein In step S33), moving the three-dimensional mounting platform based on the tip number of the abnormal tip or the abnormal needle mark position or the current position of the abnormal tip.

9. The needle adjustment method according to claim 6, wherein After step S34), it further includes: S40) A review step, scanning the real-time positions of the tips on the probe card, and comparing them with the needle mark positions corresponding to the tip numbers in the current maintenance window to ensure that each tip is located within the corresponding needle mark position, and updating and recording the comparison result.

10. A probe card needle adjustment system, characterized in that, Comprising: A test machine, having an image acquisition and processing module for identifying and positioning needle marks on bonding pads, and generating an output file containing the tip numbers corresponding to each needle mark, the needle mark positions, and determination result information; A server, for parsing and processing the output file to generate a parsed file adapted to a needle adjustment machine; Needle adjustment machine, comprising a camera for positioning and scanning the position of the needle tip, a three-dimensional mounting platform for fixing the probe card, and a driving mechanism for driving the movement of the three-dimensional mounting platform, wherein the needle adjustment machine can automatically position abnormal needle tips based on the parsing file; A processor and a memory, wherein the memory stores program instructions executable by the processor to implement the needle adjustment method according to any one of claims 6-9.

Images