Electronic tester

Abstract

A testing apparatus is described. Various components contribute to the functionality of the testing apparatus to facilitate movement of a vacuum-maintained wafer package without human supervision. These functions include a latching system to maintain the integrity of the wafer package and a pressure sensing system to detect and relay pressure in the wafer package.

Description

[0001] This application is a divisional application of Chinese patent application No. 202180068810.9, filed on October 5, 2021.

[0002] Cross-references to related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 088,635, filed October 7, 2020, the entire contents of which are incorporated herein by reference. Background Technology 1) Technical Field

[0005] This invention relates to a testing apparatus for testing microelectronic circuits.

[0006] 2) Discussion of related technologies

[0007] Microelectronic circuits are typically fabricated on and within semiconductor wafers. These wafers are then "divided" or "cut" into individual dies. These dies are typically mounted onto a support substrate to provide rigidity and for electronic communication with the integrated circuits or microelectronic circuits within the die. Final packaging may include the die itself, and the resulting package can then be shipped to the customer.

[0008] Dies or packages need to be tested before being shipped to customers. Ideally, dies should be tested early in the manufacturing process to identify defects that occur during early manufacturing stages. Wafer-level testing can be achieved by providing a manipulator and contactor with contacts, and then using the manipulator to move the wafer so that the contacts on the wafer make contact with the contacts on the contactor. Power and electronic signals can then be supplied to and from the microelectronic circuitry formed in the wafer via the contactor.

[0009] According to various embodiments, a chip includes a substrate such as a silicon substrate or a printed circuit board, and one or more devices manufactured in or mounted to the substrate.

[0010] Alternatively, the chip can be housed within a movable chip package with an electrical interface and a thermal chuck. When the chip's temperature is thermally controlled by heating or cooling the thermal chuck, power and signals can be supplied to and from the chip via the electrical interface.

[0011] After the wafer is diced, it may be necessary to test each die again, and it may also be necessary to test the die again after it is mounted onto the support substrate. Summary of the Invention

[0012] This invention provides a microelectronic circuit test kit, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component mating with the terminals for contact with the terminals; a differential pressure chamber seal between the first and second components, the differential pressure chamber seal forming a closed differential pressure chamber together with the surfaces of the first and second components; a pressure relief channel formed through one of the first and second components, the pressure relief channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; and a pressure relief valve connected to the pressure relief channel, the opening of which allows air to escape from the differential pressure chamber to allow the first and second components to move relative to each other to ensure contact with the terminals. The system includes a proper contact between the components and a closed pressure relief valve to prevent air from entering the differential pressure chamber; a first interface on the movable support structure and connected to a contact; a second interface on the fixed structure for connection when the movable support structure is held by the fixed structure; and a latching system including a first latching assembly. The first latching assembly may include a first part engaging with a first component, a second part engaging with a second component, a connecting part having opposing ends respectively fixed to the first and second parts to form a locking device, and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first and second components locked in a closed position, and in the unlocked position, the locking device allows the first and second components to move from a closed relationship to an open relationship.

[0013] The microelectronic circuit test kit may include an engagement mechanism that moves a second component between a locked position and an unlocked position.

[0014] The microelectronic circuit test kit may include a second component that rotates between a locked position and an unlocked position.

[0015] The microelectronic circuit test kit may include a engagement mechanism comprising a surface on a first part that forms a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part rotating a second part via a connecting part to move between a locked position and an unlocked position.

[0016] The microelectronic circuit test kit may include a first part on which the surface forming the base is the outer surface of the first part.

[0017] The microelectronic circuit test kit may include a first part having tool pin openings for aligning the pins of the tool with the first part.

[0018] The microelectronic circuit test kit may include a second part having a body and at least a first wing extending from the body, wherein the first wing moves over the shoulder of the first part when moved to a first locked position and moves away from the shoulder when moved away from the first locked position toward an unlocked position.

[0019] The microelectronic circuit test kit may include a second component having a second wing extending from the body, wherein the second wing moves over the shoulder of the first component when moved to a second locked position, and moves away from the shoulder when moved away from the second locked position toward an unlocked position.

[0020] The microelectronic circuit test kit may include a latching system that may also include a tuning block mounted in a fixed position relative to the first component. The tuning block has a leveling surface, and when the first wing is above the shoulder, a second wing is located above the leveling surface. The second part is adjustable relative to the first part to adjust the gap between the leveling surface and the second wing.

[0021] The microelectronic circuit test kit may include a latching system that may also include a locking nut having threads that engage with the threads on the connection to rotatably adjust the second part relative to the connection.

[0022] The microelectronic circuit test kit may include a latching system, which may also include a shim between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0023] The microelectronic circuit test kit may include a latching system that may further include a latching mechanism having a latching surface that latches into a first latching recess to prevent a second component from moving out of the locked position, and a latching surface that latches into a second latching recess to prevent the second component from moving out of the unlocked position.

[0024] The microelectronic circuit test kit may include a first snap recess and a second snap recess located on a locking device.

[0025] The microelectronic circuit test kit may include a first snap-fit ​​recess and a second snap-fit ​​recess located on the second part.

[0026] The microelectronic circuit test kit may include a first component comprising a backplane and a signal distribution board, wherein a portion of the signal distribution board is located between the backplane and the second component. The signal distribution board has an opening through which a connector is inserted. The opening has a first dimension on an axis toward the center point of the signal distribution board, the first dimension being larger than a second dimension transverse to the axis. The connector has a first portion smaller than the first dimension in the axial direction to allow thermal expansion of the signal distribution board and the backplane relative to each other. The first portion is sized to slidably fit within the second dimension of the opening to prevent the signal distribution board from moving relative to the backplane in the transverse direction to the axis.

[0027] Microelectronic circuit testing may include a connection having a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being able to fit through an opening in the axial direction during insertion, and the first thickness being greater than a second dimension of the opening, the second thickness being able to fit through a second dimension of the opening during insertion.

[0028] The microelectronic circuit test kit may include a latching system that may also include a second latching assembly, wherein each respective latching assembly may include a first part engaging with a first component, a second part engaging with a second component, a connecting part having opposite ends respectively fixed to the first and second parts to form a locking device, and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position, wherein in the locked position the locking device holds the first and second components locked in a closed position, and in the unlocked position the locking device allows the first and second components to move from a closed relationship to an open relationship.

[0029] The microelectronic circuit test kit may include a first latch assembly and a second latch assembly having corresponding second parts on different sides of the second part.

[0030] Microelectronic circuit test kits may include differential pressure chamber seals surrounding contacts and terminals.

[0031] The microelectronic circuit test kit may include a differential pressure chamber seal fixed to the first component when the first and second components are separated.

[0032] The microelectronic circuit test kit may include a differential pressure chamber seal, which is a lip seal.

[0033] The microelectronic circuit test kit may include a pressure reducing valve, which is a pressure reducing check valve, a vacuum release channel formed through the component having the pressure reducing check valve, the vacuum release channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and a second valve, which is a vacuum release valve connected to the vacuum release channel, the opening of the vacuum release valve allowing air to enter the differential pressure chamber, and the closing of the vacuum release valve preventing air from escaping from the differential pressure chamber.

[0034] A microelectronic circuit test kit may include a substrate that is a wafer with multiple microelectronic circuits.

[0035] The microelectronic circuit test kit may include contacts that are pins, each pin having a spring, which is pressed against its spring force when the corresponding contact is pressed by the corresponding one of the terminals.

[0036] The present invention also provides a testing apparatus, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component mating with the terminals to contact the terminals; a differential pressure chamber seal between the first and second components, the differential pressure chamber seal forming a closed differential pressure chamber together with the surfaces of the first and second components; a pressure reducing channel formed through one of the first and second components, the pressure reducing channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; a pressure reducing valve connected to the pressure reducing channel, the opening of the pressure reducing valve allowing air to exit from the differential pressure chamber to cause the first and second components to move relative to each other to ensure proper contact between the contacts and terminals, and the closing of the pressure reducing valve preventing air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contacts; and a first latching assembly including a first portion engaging with the first component and engaging with the second component. The device comprises: a second part; a connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device; and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position, wherein in the locked position, the locking device holds the first and second parts locked in a closed position, and in the unlocked position, the locking device allows the first and second parts to move from a closed relationship to an open relationship; a fixed structure, wherein a movable support structure can be received to be held by the fixed structure and can be removed from the fixed structure; a second interface on the fixed structure, wherein when the movable support structure is held by the fixed structure, the second interface is connected to the first interface, and when the movable support structure is removed from the fixed structure, the second interface is disconnected from the first interface; and an electronic tester connected to the terminal via the second interface, the first interface and the contacts, such that a signal is transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit.

[0037] The testing apparatus may include an engagement mechanism that moves the second component between a locked position and an unlocked position.

[0038] The testing device may include a second component that rotates between a locked position and an unlocked position.

[0039] The testing apparatus may include an engagement mechanism comprising a surface on a first part that forms a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part rotating a second part via a connecting part to move between a locked position and an unlocked position.

[0040] The testing apparatus may include a first part on which the surface forming the seat is the outer surface of the first part.

[0041] The testing apparatus may include a first part having a tool pin opening therein for aligning the pins of a tool with the first part.

[0042] The testing apparatus may include a second part having a body and at least a first wing extending from the body, wherein the first wing moves over the shoulder of the first part when moved to a first locked position and moves away from the shoulder when moved away from the first locked position toward an unlocked position.

[0043] The testing device may include a second part having a second wing extending from the main body, wherein the second wing moves over the shoulder of the first part when moving to a second locked position, and moves away from the shoulder when moving away from the second locked position toward an unlocked position.

[0044] The testing apparatus may include a latching system that may further include a tuning block mounted in a fixed position relative to the first part, the tuning block having a leveling surface, and a second part being positioned above the leveling surface when the first part is above the shoulder, the second part being adjustable relative to the first part to adjust the gap between the leveling surface and the second part.

[0045] The testing apparatus may include a latching system that may further include a locking nut having threads that engage with the threads on the connection portion to rotatably adjust the second portion relative to the connection portion.

[0046] The testing apparatus may include a latching system, and may also include a shim between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0047] The testing apparatus may include a latching system that may further include a latching mechanism having a latching surface that latches into a first latching recess to prevent the second component from moving out of the locked position, and a latching surface that latches into a second latching recess to prevent the second component from moving out of the unlocked position.

[0048] The testing device may include a first snap-fit ​​recess and a second snap-fit ​​recess located on the locking device.

[0049] The testing device may include a first snap-fit ​​recess and a second snap-fit ​​recess located on the second part.

[0050] The testing apparatus may include a first component comprising a backplate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backplate and the second component. The signal distribution plate has an opening through which a connecting portion is inserted. The opening has a first dimension on an axis toward the center point of the signal distribution plate, the first dimension being larger than a second dimension transverse to the axis. The connecting portion has a first portion smaller than the first dimension in the axial direction to allow thermal expansion of the signal distribution plate and the backplate relative to each other, and the first portion is sized to slidably fit within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backplate in the transverse direction to the axis.

[0051] The testing apparatus may include a connecting portion having a second part having a first thickness and a second thickness transverse to the first thickness, the first thickness being able to fit through the opening in the axial direction during the insertion and being greater than a second size of the opening, the second thickness being able to fit through the second size of the opening during the insertion.

[0052] The testing apparatus may include a latching system that may further include a second latching assembly, wherein each latching assembly may have a first portion engaging with a first component, a second portion engaging with a second component, a connecting portion having opposing ends respectively fixed to the first and second portions to form a locking device, and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position, wherein in the locked position the locking device holds the first and second components locked in a closed position, and in the unlocked position the locking device allows the first and second components to move from a closed relationship to an open relationship.

[0053] The testing apparatus may include a first latch assembly and a second latch assembly having corresponding second parts on different sides of the second part.

[0054] The testing apparatus may include a differential pressure chamber seal surrounding the contacts and terminals.

[0055] The testing apparatus may include a differential pressure chamber seal fixed to the first component when the first component and the second component are separated.

[0056] The testing apparatus may include a differential pressure chamber seal that is a lip seal.

[0057] The testing apparatus may include a pressure reducing valve, which is a pressure reducing check valve, and a vacuum release channel formed through the component having the pressure reducing check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The testing apparatus also includes a second valve, which is a vacuum release valve connected to the vacuum release channel. Opening the vacuum release valve allows air to enter the differential pressure chamber, and closing the vacuum release valve prevents air from escaping from the differential pressure chamber.

[0058] The testing apparatus may include a fixed structure comprising a thermal chuck, and a second component of a movable support structure comprising a thin chuck that contacts the thermal chuck to allow heat transfer between the movable support structure and the thermal chuck.

[0059] The testing apparatus may include a substrate that is a wafer with multiple microelectronic circuits.

[0060] The testing device may include contacts that are pins, each pin having a spring, such that when a corresponding contact is pressed by a corresponding terminal, the spring is pressed against its spring force.

[0061] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first and a second component of a movable support structure, the second component having contacts abutting against terminals connected to the substrate of the microelectronic circuit, wherein a pressure-reducing channel is formed through one of the first and second components, the pressure-reducing channel having an inlet opening at a pressure differential chamber and an outlet opening outside the pressure differential chamber, positioning a pressure differential chamber seal between the first and second components to form a closed cavity by the surfaces of the first and second components and the pressure differential chamber seal, opening a pressure-reducing valve to allow air to leave the pressure differential chamber and reduce the pressure within the pressure differential chamber to allow the first and second components to move toward each other to ensure proper contact between the contacts and terminals, and closing the pressure-reducing valve to prevent air from leaving the pressure differential chamber. Gas enters the differential pressure chamber, and the engagement mechanism is operated to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first and second components locked in a closed position. In the unlocked position, the locking device allows the first and second components to move from a closed relationship to an open relationship. The locking device may include a first part engaging with the first component, a second part engaging with the second component, and a connecting part having opposite ends respectively fixed to the first and second parts. A movable support structure is received through a fixed structure, wherein a first interface on the movable support structure is connected to a second interface on the fixed structure, and signals are transmitted between the electronic tester and the microelectronic circuit through terminals, contacts, and the first and second interfaces to test the microelectronic circuit.

[0062] The method may include an engagement mechanism that moves the second component between a locked position and an unlocked position.

[0063] The method may include rotating the second component between a locked position and an unlocked position.

[0064] The method may include an engagement mechanism comprising a surface on a first part that forms a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part rotating a second part via a connecting part to move between a locked position and an unlocked position.

[0065] The method may include having the surface on the first part forming the seat be the outer surface of the first part.

[0066] The method may include a first part having a tool pin opening therein for aligning the pins of a tool with the first part.

[0067] The method may include a second part having a body and at least a first wing extending from the body, wherein the first wing moves over the shoulder of the first part when moved to a first locked position and moves away from the shoulder when moved away from the first locked position toward an unlocked position.

[0068] The method may include a second part having a second wing extending from the body, wherein the second wing moves over the shoulder of the first part when moved to a second locked position, and moves away from the shoulder when moved away from the second locked position toward an unlocked position.

[0069] The method may include a latching system that may further include a tuning block mounted in a fixed position relative to a first component, the tuning block having a leveling surface, and a second component positioned above the leveling surface when the first component is positioned above the shoulder, the second component being adjustable relative to the first component to adjust the gap between the leveling surface and the second component.

[0070] The method may include a latching system that may also include a locking nut having threads that engage with threads on the connection portion to rotatably adjust the second portion relative to the connection portion.

[0071] The method may include, further comprising, positioning a shim between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0072] The method may include a latching system that further includes a latching mechanism having a latching surface that latches into a first latching recess to prevent movement of the second component out of the locked position, and a latching surface that latches into a second latching recess to prevent movement of the second component out of the unlocked position.

[0073] The method may include a first snap-fit ​​recess and a second snap-fit ​​recess located on the locking device.

[0074] The method may include a first snap-fit ​​recess and a second snap-fit ​​recess located on the second part.

[0075] The method may include a first component comprising a backplate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backplate and the second component, the signal distribution plate having an opening through which a connector is inserted, the opening having a first dimension on an axis toward a center point of the signal distribution plate, the first dimension being larger than a second dimension transverse to the axis, the connector having a first portion smaller than the first dimension in the axial direction to allow thermal expansion of the signal distribution plate and the backplate relative to each other, and the first portion being sized to slidably fit within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backplate in the transverse direction to the axis.

[0076] The method may include a connecting portion having a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being able to fit through an opening in an axial direction during the insertion, and the first thickness being greater than a second dimension of the opening, the second thickness being able to fit through a second dimension of the opening during the insertion.

[0077] The method may include a latching system that may include a second latching assembly, each respective latching assembly having: a first portion engaging with a first component, a second portion engaging with a second component, a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device, and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position, wherein in the locked position the locking device holds the first component and the second component locked in a closed position, and in the unlocked position the locking device allows the first component and the second component to move from a closed relationship to an open relationship.

[0078] The method may include a first latch assembly and a second latch assembly having corresponding second parts on different sides of the second part.

[0079] The method may include a differential pressure chamber seal surrounding the contacts and terminals.

[0080] The method may include fixing the differential pressure chamber seal to the first component when the first component and the second component are separated.

[0081] The method may include using a lip seal to create a differential pressure chamber seal.

[0082] The method may include a pressure reducing valve being a pressure reducing check valve, a vacuum release passage formed through a component having a pressure reducing check valve, the vacuum release passage having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and opening a second valve, which is a vacuum release valve connected to the vacuum release passage, to allow air to enter the differential pressure chamber.

[0083] The method may include a fixed structure comprising a thermal chuck, and a second component of a movable support structure comprising a thin chuck.

[0084] The method may include a substrate that is a wafer having multiple microelectronic circuits.

[0085] The method may include contacts being pins, each pin having a spring, wherein when a corresponding contact is pressed by a corresponding terminal, the spring is pressed against its spring force.

[0086] The present invention also provides a microelectronic circuit test kit, comprising a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, a plurality of contacts on the second component that mate with the terminals for contact, a differential pressure chamber seal between the first and second components that forms a closed differential pressure chamber together with the surfaces of the first and second components, and a pressure reduction channel formed through one of the first and second components that has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The system includes an outlet opening, a pressure reducing valve connected to the pressure reducing channel, the opening of which allows air to leave the differential pressure chamber to move the first and second components toward each other to ensure proper contact between the contacts and the terminals, and closing the pressure reducing valve to prevent air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contacts; a second interface on the fixed structure for connection when the movable support structure is held in a removable manner by the fixed structure; a pressure sensor positioned to detect pressure in the differential pressure chamber; and an electronic pressure sensor interface connected to the pressure sensor to communicate pressure with an electronic tester.

[0087] The microelectronic circuit test kit may include a pressure sensor positioned away from the differential pressure chamber, and a pressure sensing channel connecting the differential pressure chamber to the pressure sensor.

[0088] The microelectronic circuit test kit may include a decompression channel formed in the first component.

[0089] The microelectronic circuit test kit may include a first component comprising a backplane and a signal distribution board, wherein a portion of the signal distribution board is located between the backplane and the second component, wherein a pressure sensing channel is formed in the backplane.

[0090] The microelectronic circuit test kit may include a pressure sensing channel formed through a signal distribution board.

[0091] The microelectronic circuit test kit may include a pressure sensor fixed to a movable support structure.

[0092] The microelectronic circuit test kit may include a differential pressure chamber seal fixed to the first component when the first and second components are separated.

[0093] The microelectronic circuit test kit may include a differential pressure chamber seal, which is a lip seal.

[0094] The microelectronic circuit test kit may include a pressure reducing valve, which is a pressure reducing check valve, a vacuum release channel formed through the component having the pressure reducing check valve, the vacuum release channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and a second valve, which is a vacuum release valve connected to the vacuum release channel, the opening of the vacuum release valve allowing air to enter the differential pressure chamber, and the closing of the vacuum release valve preventing air from escaping from the differential pressure chamber.

[0095] A microelectronic circuit test kit may include a substrate that is a wafer with multiple microelectronic circuits.

[0096] The microelectronic circuit test kit may include contacts that are pins, each pin having a spring, which is pressed against its spring force when the corresponding contact is pressed by the corresponding one of the terminals.

[0097] The present invention also provides a testing apparatus, comprising: a movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; a plurality of contacts on the second component, the contacts mating with the terminals to contact the terminals; a differential pressure chamber seal between the first and second components, the differential pressure chamber seal forming a closed differential pressure chamber together with the surfaces of the first and second components; a pressure reduction channel formed through one of the first and second components, the pressure reduction channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; and a pressure reduction valve connected to the pressure reduction channel, the opening of the pressure reduction valve allowing air to escape from the pressure chamber. The differential pressure chamber allows the first and second components to move relative to each other to ensure proper contact between the contact and the terminal; and the closure of the pressure reducing valve prevents air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contact; a fixing structure, which holds the movable support structure and is removable from the fixing structure; a second interface on the fixing structure, which connects to the first interface when the movable support structure is held by the fixing structure and disconnects from the first interface when the movable support structure is removed from the fixing structure; an electronic tester connected to the terminal via the second interface, the first interface, and the contact to transmit signals between the electronic tester and the microelectronic circuit for testing the microelectronic circuit; a pressure sensor positioned to detect pressure in the differential pressure chamber; and a pressure monitoring system including an electronic pressure sensor interface connected to the pressure sensor to communicate pressure with the electronic tester.

[0098] The testing apparatus may include a pressure sensor positioned away from the differential pressure chamber, and a pressure sensing channel connecting the differential pressure chamber to the pressure sensor.

[0099] The testing apparatus may include a pressure reduction channel formed in the first component.

[0100] The testing apparatus may include a first component comprising a backplate and a signal distribution board, wherein a portion of the signal distribution board is located between the backplate and the second component, wherein a pressure sensing channel is formed in the backplate.

[0101] The testing apparatus may include a pressure sensing channel formed through a signal distribution board.

[0102] The testing apparatus may include a pressure sensor fixed to a movable support structure.

[0103] The testing apparatus may include a pressure monitoring system, which may include an electronic pressure connector interface on a fixed structure, and an electronic pressure sensor interface releasably contacts the electronic pressure connector interface to communicate pressure with an electronic tester.

[0104] The testing apparatus may include an electronic pressure sensor interface including at least a first contact and a pressure monitoring system including at least a first terminal, wherein the first contact engages with the first terminal when the movable support structure is received by the fixed structure, and the first contact disengages from the first terminal when the movable support structure is removed from the fixed structure.

[0105] The testing apparatus may include an electronic pressure sensor interface in a printed circuit board having a substrate, and a first contact formed on the substrate.

[0106] The testing apparatus may include an electronic pressure sensor interface including at least a second contact and a pressure monitoring system including at least a second terminal, wherein the second contact engages with the second terminal when the movable support structure is received by the fixed structure, and disengages from the second terminal when the movable support structure is removed from the fixed structure.

[0107] The testing apparatus may include a differential pressure chamber seal surrounding the contacts and terminals.

[0108] The testing apparatus may include a differential pressure chamber seal fixed to the first component when the first component and the second component are separated.

[0109] The testing apparatus may include a differential pressure chamber seal that is a lip seal.

[0110] The pressure reducing valve of the test device is a pressure reducing check valve. A vacuum release channel is formed through the component with the pressure reducing check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The test device also includes a second valve, which is a vacuum release valve connected to the vacuum release channel. Opening the vacuum release valve allows air to enter the differential pressure chamber, and closing the vacuum release valve prevents air from escaping from the differential pressure chamber.

[0111] The testing apparatus may include a fixed structure comprising a thermal chuck, and a second component of the movable support structure comprising a thin chuck that contacts the thermal chuck to allow heat transfer between the movable support structure and the thermal chuck.

[0112] The testing apparatus may include a substrate that is a wafer with multiple microelectronic circuits.

[0113] The testing apparatus may include contacts that are pins, each pin having a spring, wherein the spring is pressed against its spring force when the corresponding contact is pressed by the corresponding terminal.

[0114] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first and a second component of a movable support structure, the second component having contacts abutting against terminals connected to the substrate of the microelectronic circuit, wherein a pressure-reducing channel is formed through one of the first and second components, the pressure-reducing channel having an inlet opening at a differential pressure chamber and an outlet opening outside the differential pressure chamber, positioning a differential pressure chamber seal between the first and second components to form a closed cavity by the surfaces of the first and second components and the differential pressure chamber seal, opening a pressure-reducing valve to allow air to leave the differential pressure chamber and reduce the pressure within the differential pressure chamber to move the first and second components toward each other to ensure proper contact between the contacts and terminals, closing the pressure-reducing valve to prevent air from entering the differential pressure chamber, receiving the movable support structure through a fixed structure, wherein a first interface on the movable support structure is connected to a second interface on the fixed structure, transmitting signals between an electronic tester and the microelectronic circuit through terminals, contacts, and the first and second interfaces to test the microelectronic circuit, detecting the pressure in the differential pressure chamber of a pressure monitoring system and communicating the pressure with the electronic tester.

[0115] The method may include positioning the pressure sensor away from the differential pressure chamber, and a pressure sensing channel connecting the differential pressure chamber to the pressure sensor.

[0116] The method may include forming a decompression channel in the first component.

[0117] The method may include a first component comprising a backplate and a signal distribution board, wherein a portion of the signal distribution board is located between the backplate and the second component, wherein a pressure sensing channel is formed in the backplate.

[0118] The method may include forming a pressure sensing channel through a signal distribution plate.

[0119] The method may include attaching a pressure sensor to a movable support structure.

[0120] The method may include a pressure monitoring system that includes an electronic pressure connector interface on a fixed structure, wherein an electronic pressure sensor interface is releasably contacted with the electronic pressure connector interface to communicate pressure with an electronic tester.

[0121] The method may include an electronic pressure sensor interface including at least a first contact, and a pressure monitoring system including at least a first terminal, wherein the first contact engages with the first terminal when the movable support structure is received by the fixed structure, and the first contact disengages from the first terminal when the movable support structure is removed from the fixed structure.

[0122] The method may include an electronic pressure sensor interface in a printed circuit board having a substrate, with a first contact formed on the substrate.

[0123] The method may include an electronic pressure sensor interface including at least a second contact, and a pressure monitoring system including at least a second terminal, wherein the second contact engages with the second terminal when the movable support structure is received by the fixed structure, and disengages from the second terminal when the movable support structure is removed from the fixed structure.

[0124] The method may include a differential pressure chamber seal surrounding the contacts and terminals.

[0125] The method may include fixing the differential pressure chamber seal to the first component when the first component and the second component are separated.

[0126] The method may include using a lip seal to create a differential pressure chamber seal.

[0127] The method may include a pressure reducing valve being a pressure reducing check valve, a vacuum release passage formed through a component having a pressure reducing check valve, the vacuum release passage having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and opening a second valve, which is a vacuum release valve connected to the vacuum release passage, to allow air to enter the differential pressure chamber.

[0128] The method may include a fixed structure comprising a thermal chuck, and a second component of a movable support structure comprising a thin chuck.

[0129] The method may include a substrate that is a wafer having multiple microelectronic circuits.

[0130] The method may include contacts being pins, each pin having a spring, wherein when a corresponding contact is pressed by a corresponding terminal, the spring is pressed against its spring force. Attached Figure Description

[0131] The invention will be further described by way of example with reference to the accompanying drawings, wherein:

[0132] Figure 1 This is a cross-sectional side view of a test apparatus with a slot assembly according to an embodiment of the present invention;

[0133] Figure 2 It is along Figure 1 A cross-sectional side view of the test apparatus in line 2-2;

[0134] Figure 3 It is along Figure 1 A cross-sectional side view of the test apparatus in line 3-3;

[0135] Figure 4 It is along Figure 2 and 3 A cross-sectional side view of the test apparatus in line 4-4;

[0136] Figure 5A , 5B 5C is a perspective view of the test setup, showing a movable wafer package being inserted into or removed from an oven defined by a frame;

[0137] Figure 6 It is a timeline showing how a chip package can be inserted and used to test the electronic components on the chip, and subsequently inserted into another chip package;

[0138] Figure 7 This is a three-dimensional view of the test setup, showing the insertion or removal of a slot assembly;

[0139] Figure 8A and 8B It is shown in relation to Figure 1-7 A cross-sectional side view of the support used in the described wafer package structure;

[0140] Figure 9A , 9B 10 and 10 are side views showing the apparatus for inserting and removing a movable wafer package into an oven;

[0141] Figure 11 This is a three-dimensional view taken from above the first chip package;

[0142] Figure 12 This is a three-dimensional view taken from below the first chip package;

[0143] Figure 13 It is the first chip packaging edge Figure 11 and 12 Sectional view of 13-13 in the image;

[0144] Figure 14 It is the first chip package edge Figure 13 Sectional view of 14-14 in the image;

[0145] Figure 15 It is the first chip package edge Figure 12 Sectional view 15-15 in the diagram;

[0146] Figure 16 It is along Figure 15 The view showing the direction of arrow A in the image, with its components removed;

[0147] Figure 17 yes Figure 15 Sectional view of 17-17;

[0148] Figure 18a(i) and 18a(ii) yes Figure 15 Views in the directions of arrows A and B, with the latch mechanism in the unlocked configuration;

[0149] Figure 18b(i) and 18b(ii) Is with Figure 18a(i) and 18a(ii) A similar view, where the latching mechanism is in the locked position;

[0150] Figure 19 This is a perspective view showing how to use shims to set the height of the flaps in the latching mechanism;

[0151] Figure 20 This is a 3D view of the components of the pressure monitoring system;

[0152] Figure 21 This is a 3D view of the other components of the pressure monitoring system;

[0153] Figure 22a and 22b These are perspective and side views of the pressure monitoring system components before assembly; and

[0154] Figure 23a and 23b Is with Figure 22a and 22b A view of the components of a similar pressure monitoring system after they have been joined together. Detailed Implementation

[0155] The attached image Figure 1A test apparatus 10 according to an embodiment of the present invention is shown, comprising (i) a fixed structure including a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, and a vacuum line 24E; (ii) a movable device including first and second wafer packages 28A and 28B; and (iii) first and second wafers 30A and 30B. The first and second wafer packages 28A and 28B are described herein as “wafer packages,” and their use is described as for testing wafers. It should be understood that the first and second wafers 28A and 28B can generally be used to test microelectronic circuits and can be classified as “first and second microelectronic circuit test packages 28A and 28B.”

[0156] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature changing device in the form of a heating resistor 38, a first slot assembly interface 40, and a plurality of second slot assembly interfaces, including a control interface 44, a power interface 46, a cold liquid supply interface 48A, a cold liquid return interface 48B, a control liquid supply interface 48C, a control liquid return interface 48D, and a vacuum interface 48E.

[0157] The first slot assembly interface 40 is located within and mounted to the slot assembly body 32. A control interface 44, a power interface 46, and second interfaces in the form of interfaces 48A to 48E are mounted in the left wall of the slot assembly body 32.

[0158] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, power cable 22, and conduits 24A to 24E are manually connected to the control interface 44, power interface 46, and interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, power cable 22, and conduits 24A to 24E are first manually disconnected from the control interface 44, power interface 46, and interfaces 48A to 48E, respectively.

[0159] The slot assembly 18A includes a motherboard 60 with test electronics, multiple channel module boards 62 with test electronics, a flexible connector 64, and a connection board 66. A control interface 44 and a power interface 46 are connected to the motherboard 60, and a thermal controller 50 is mounted to the motherboard 60. The channel module boards 62 are electrically connected to the motherboard 60. The flexible connector 64 connects the channel module boards 62 to the connection board 66. Control functionality is provided by an electrical conductor connecting the control interface 44 to the motherboard 60. Power is supplied to the motherboard 60 via the power interface 46. Both power and control are supplied from the motherboard 60 to the channel module boards 62 via conductors. The flexible connector 64 provides a conductor connecting the channel module boards 62 to the connection board 66. The connection board 66 includes a conductor connecting the flexible connector 64 to a first slot assembly interface 40. The first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 via various conductors, allowing power and control to be supplied to the first slot assembly interface 40 via the control interface 44 and the power interface 46.

[0160] The second slot assembly 18B includes components similar to those in the first slot assembly 18A, and the same reference numerals denote the same components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, power interface 46, and interfaces 48A to 48E of the second slot assembly 18B are manually connected to a separate set of connection components, which includes a separate tester cable 20, a separate power cable 22, and separate conduits 24A to 24E.

[0161] The wafer package 28A includes a wafer package body formed by a thin chuck 72 and a backplate 74. A wafer 30A has multiple microelectronic devices formed therein. The wafer 30A is inserted into the wafer package body between the thin chuck 72 and the backplate 74. Wafer package contacts 76 contact corresponding contacts (not shown) on the wafer 30A. The wafer package 28A also includes a wafer package interface 78 located on the backplate 74. Conductors in the backplate 74 connect the wafer package interface 78 to the wafer package contacts 76.

[0162] The wafer package 28A has a lip seal 77 (also referred to herein as a "differential pressure chamber seal") connecting a backplate 74 and a thin chuck 72. A vacuum is applied to the area defined by the lip seal 77, the backplate 74, and the thin chuck 72. The vacuum holds the wafer package 28A together and ensures proper contact between the wafer package contacts 76 and the contacts on the wafer 30A.

[0163] Temperature detector 36 is located in hot chuck 34, so that it is close enough to wafer 30A to detect the temperature of wafer 30A or to within five degrees Celsius, preferably to within one or two degrees Celsius.

[0164] The slot assembly 18A also has a door 82, which is connected to the slot assembly body 32 via a hinge 84. When the door 82 is rotated to the open position, the wafer package 28A can be inserted into the slot assembly body 32 through the door opening 86. The wafer package 28A is then lowered onto a thermal chuck 34, and the door 82 is closed. The thermal chuck 34 is mounted onto the slot assembly body 32. The thermal chuck 34 then essentially forms a holder with a wafer test stage.

[0165] The slot assembly 18A also has a thermal interface cavity seal 88 located between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the area defined by the thermal interface cavity seal 88, the thermal chuck 34, and the thin chuck 72 via the vacuum interface 48E and the vacuum line 90. Therefore, a good thermal connection is provided between the thermal chuck 34 and the thin chuck 72. When the heating resistor 38 generates heat, the heat is conducted through the thermal chuck 34 and the thin chuck 72 to the wafer 30A. When the thermal chuck 34 is at a lower temperature than the wafer 30A, the heat is conducted in the opposite direction.

[0166] The wafer package interface 78 engages with the first slot assembly interface 40. Power and signals are supplied to the wafer 30A through the first slot assembly interface 40, the wafer package interface 78, and the wafer package contact 76. The performance of the devices within the wafer 30A is measured through the wafer package contact 76, the wafer package interface 78, and the first slot assembly interface 40.

[0167] The door 82 of slot assembly 18B in the closed position is shown. A front seal 100 is mounted on the upper surface of slot assembly 18A and seals against the lower surface of slot assembly 18B. A front seal 102 is mounted to the upper surface of slot assembly 18B and seals against the lower surface of frame 14. A continuously sealed front wall 104 is provided by the door 82 of slot assemblies 18A and 18B and the front seals 100 and 102.

[0168] The slot assembly 18A also includes a thermal controller 50. A temperature detector 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the heating resistor 38 via a power interface 46 and a power line 54, causing the heating resistor 38 to heat up. The heating resistor 38 then heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34, and the heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0169] The hot chuck 34 has a hot fluid channel 224 formed therein. The hot fluid channel 224 holds a hot fluid. The hot fluid is preferably a liquid rather than a gas because liquids are incompressible and heat is convection to or from the liquid more quickly. Different hot fluids are used for different applications, with oil being used for the highest temperature applications.

[0170] Control liquid supply and return lines 226 and 228 connect the opposite ends of the hot fluid channel 224 to the cold liquid supply and return interfaces 48C and 48D, respectively. A heating resistor 38, acting as a heater, is mounted at the location of the heated chuck 34 to heat the hot fluid. By recirculating the hot fluid through the hot fluid channel 224, the heated chuck 222 provides a more uniform heat distribution to the heated chuck 34, and ultimately to the wafer 30A. The temperature of the fluid can also be controlled to heat or cool the heated chuck 34.

[0171] The test apparatus 10 also includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two cold liquid supply lines 24A, connected to the first and second slot assemblies 18A and 18B, are also connected to the cooling system 240 via a manifold (not shown). An additional manifold connects a cold liquid return line 24B to the cooling system 240, a control liquid supply line 24C to the temperature control system 242, a control liquid return line 24D to the temperature control system 242, and a vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cooling plate 246 with a respective fluid channel 248. The cooling system 240 circulates fluid through the fluid channel 248 to cool the cooling plate 246. The cooling plate 246 then keeps the channel module plate 62 cooled. Temperature control system 242 circulates fluid through hot fluid channel 224 to control the temperature of hot chuck 34 and transfer heat from or to wafers 30A and 30B. Vacuum pump 244 supplies air at vacuum pressure to vacuum line 90.

[0172] Slot assembly 18A includes a separation seal 108 mounted to the upper surface of slot assembly body 32 and above its inner wall 106. Separation seal 108 seals against the lower surface of slot assembly 18B. Slot assembly 18B has a separation seal 110 mounted to the upper surface of its slot assembly body 32. Separation seal 108 seals against the lower surface of frame 14. A continuously sealed separation wall 112 is provided by the inner walls 106 of slot assemblies 18A and 18B, and separation seals 108 and 110.

[0173] Figure 2 It shows Figure 1 Test apparatus 10 on 2-2. Frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path, in which air at room temperature passes through frame 14 without being recirculated. The closed-loop path is particularly useful in cleanroom environments because it results in less particulate material being released into the air.

[0174] The test apparatus 10 also includes a temperature changing device in the form of a first fan 122, a first fan motor 124, and a water cooler 126.

[0175] The first fan 122 and the first fan motor 124 are mounted on the upper part of the first closed-loop air path 120. The water cooler 126 is mounted to the frame 14 within the upper part of the first closed-loop air path 120.

[0176] The wafer packages 28A and 28B are positioned together with the slot components 18A and 18B and are located within the lower half of the first closed-loop air path 120.

[0177] In operation, current is supplied to the first fan motor 124. The first fan motor 124 causes the first fan 122 to rotate. The first fan 122 causes air to circulate clockwise through the first closed-loop air path 120.

[0178] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows over the slot assemblies 18A and 18B located above the wafer packages 28A or 28B. The wafer packages 28A or 28B are then cooled by convection using the air.

[0179] Figure 3 It shows Figure 1 Test apparatus 10 on 3-3. Frame 14 defines a second closed-loop air path 150. Test apparatus 10 also includes a temperature changing device in the form of a second fan 152, a second fan motor 154, and a water cooler 156. Figure 2 There is no electric heater or throttle valve installed. The air inlet and outlet openings (not shown) can be opened to turn the second closed-loop air path 150 into an open air path, in which room temperature air passes through the frame 14 without being recirculated.

[0180] The closed-loop path is particularly useful in cleanroom environments because it results in less particulate material being released into the air. A second fan 152 and a second fan motor 154 are located in the upper part of the second closed-loop air path 150. A water cooler 156 is located slightly downstream of the second fan 152 within the second closed-loop air path 150. The main board 60 and channel module board 62, forming part of the slot assemblies 18A and 18B, are located in the lower half of the second closed-loop air path 150.

[0181] In operation, current is supplied to the second fan motor 154, which rotates the second fan 152. The second fan 152 then recirculates air clockwise through the second closed-loop air path 150. The air is cooled by a water cooler 156. The cooled air then passes through the motherboard 60 and the channel module board 62, causing heat to be transferred from the motherboard 60 and the channel module board 62 to the air via convection.

[0182] Figure 1 The continuous sealing separation wall 112 shown makes Figure 2 The air recirculated through the first closed-loop air path 120 is... Figure 3 The air in the second closed-loop air path 150 remains isolated. Figure 1 The continuous sealed front wall 104 shown prevents air from escaping from the first closed-loop air path 120.

[0183] like Figure 2 and 3 As shown, with Figure 1 The same cooling system 240 used in the cooling water cooler 126 is also used in the cooling water cooler. For example... Figure 4 As shown, the pressure ventilation device (plenum) 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuous sealed separation wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0184] Figure 5A , 5B The diagrams 30C, 30D, and 30E illustrate how wafer packages 30C, 30D, and 30E can be inserted or removed at any time, even when all other wafer packages are used to test the device and can be subjected to various temperature ramp conditions. Figure 6 The concept is illustrated in more detail. At time T1, a first wafer package is inserted into frame 14, while a second wafer package is located outside frame 14. At time T1, heating of the first wafer package begins. Between T1 and T2, the temperature of the first wafer package increases from room temperature, approximately 22°C, to a test temperature 50°C to 150°C higher than room temperature at T2. At T2, power is applied to the first wafer package, and the device within the first wafer package is tested. At T3, the second wafer package is inserted into frame 14, and heating of the second wafer package begins. At T4, testing of the first wafer package is terminated. Cooling of the first wafer package also begins at T4. At T5, the second wafer package reaches the test temperature, and power is supplied to the second wafer package, and the wafer within the second wafer package is tested. At T6, the second wafer package reaches a temperature close to room temperature and is removed from frame 14. A third wafer package can then be inserted in place of the first wafer package. At T7, testing of the second wafer package is terminated, and its cooling begins. At T8, the second wafer package has cooled to room temperature or close to room temperature and is removed from frame 14.

[0185] Different tests can be performed at different temperatures. For example, an interposable wafer package can be tested at room temperature. Another test can be performed as the temperature rises. Further tests can be performed at the rising temperature. Further tests can be performed as the temperature falls. Two of these tests can be a single test running from one temperature stage to the next.

[0186] like Figure 7 As shown, a slot assembly 18A can be removed or inserted into frame 14. Slot assembly 18A can be inserted or removed, while other slot assemblies in frame 14 are used for testing wafer devices, as shown in the reference. Figure 6 As stated above.

[0187] like Figure 8A As shown, a signal distribution board 500, a contactor 502, multiple pins 504, a contactor clamping ring 506, a fastener 508, and a post 510 are further illustrated.

[0188] The signal distribution board 500 is primarily made of insulating material and has circuitry (not shown) formed therein. Contacts 512 are formed on the lower side 514 of the signal distribution board 500. A threaded opening 516 is formed in the lower side 514.

[0189] Contactor 502 has multiple pin openings 518, post openings 520, and fastener openings 522, which extend from the upper side 524 through the contactor to the lower side 526. Each pin opening 518 has a first portion 528 and a second portion 530. When viewed in plan view, both the first and second portions 528 and 530 are circular. The first portion 528 has a larger diameter than the second portion 530. Figure 8A When viewed in a cross-sectional side view, the diameter of the first part 528 is larger than that of the second part 530, resulting in the first part 528 being wider than the second part 530.

[0190] The column opening 520 has a first portion 534 and a second portion 536. When viewed in plan view, both the first portion 534 and the second portion 536 are circular. The diameter of the first portion 534 is larger than the diameter of the second portion 536. Because the diameter of the first portion 534 is larger than the diameter of the second portion 536, when... Figure 8A In a cross-sectional side view, the first portion 534 is wider than the second portion 536. The first and second portions 534 and 536 have vertical sidewalls. A water platform 538 connects the vertical sidewalls of the first and second portions 534 and 536.

[0191] Each pin 504 includes a conductive retainer portion 542, a helical spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first interior 550 and a first end 552. The second end piece 548 has a second interior 554 and a second end 556. The helical spring 544 and the first and second interiors 550 and 554 are held by the retainer portion 542, wherein the helical spring 544 is located between the first and second interiors 550 and 554. The first and second ends 552 and 556 protrude from the upper and lower ends of the retainer portion 542, respectively.

[0192] A terminal 560 is formed on the upper surface of the first end 552. A contact 562 is formed on the lower end of the second end 556. The helical spring 544 and the first and second end members 546 and 548 are made of metal, and therefore of a conductive material. The helical spring 544 and the first and second end members 546 and 548 form conductors capable of conducting current between the terminal 560 and the contact 562.

[0193] The corresponding pin is inserted into the corresponding pin opening 518 through the upper side 524. The second end 556 is slightly smaller than the second portion 530 so that it passes through the second portion 530 and protrudes from the lower side 526. The retainer portion 542 is slightly narrower than the first portion 528 but wider than the second portion 530 to prevent the pin 504 from falling out from the lower side 526. When the pin 504 is fully inserted into the pin opening 518, and before the contactor 502 is mounted to the signal distribution board 500, the first end 552 still protrudes above the upper side 524 of the contactor 502.

[0194] The column 510 has a support 564, a force transfer portion 566, and a force transmission portion 568. The column 510 is made of a single piece of metal or other material, chosen because its strength is comparable to the strength and brittleness of the ceramic material of the contactor 502.

[0195] The column 510 is inserted into the column opening 520 via the upper side 524. The support 564 and the force transfer portion 566 are slightly narrower than the second portion 536. The force transmission portion 568 is slightly narrower than the first portion 534, but wider than the second portion 536. The lower surface 570 of the force transmission portion 568 abuts against the platform 538, thereby preventing the column 510 from falling off the lower side 526.

[0196] Column 510 has surface 572, when column 510 is as Figure 8A When fully inserted, surface 572 lies in a plane parallel to and below the surface of lower side 526. When column 510 is fully inserted, force transmission portion 568 has surface 574 in the same plane as upper side 524.

[0197] Signal distribution board 500 is positioned on top of contactor 502. Each contact 512 contacts a corresponding terminal 560. Because the terminal 560 is located in a plane above the plane of upper side 524, lower side 514 is initially spaced apart from upper side 524.

[0198] Fastener 508 has a threaded shaft 578 and a head 580. Contactor clamping ring 506 has an annular opening 582. Contactor clamping ring 506 is located on the lower surface 584 of contactor 502. Threaded shaft 578 is inserted from the bottom through an annular opening 582 and then through fastener opening 522. Head 580 contacts the lower surface of contactor clamping ring 506. Head 580 is then rotated so that the threads on threaded shaft 578 are screwed into the threads on threaded opening 516. The threading action moves signal distribution plate 500 closer to contactor 502 and contactor clamping ring 506. Lower side 514 eventually contacts upper side 524. Contact 512 moves first end piece 546 downward into pin opening 518 until terminal 560 is in the same plane as upper side 524. Coil spring 544 is compressed and thus slightly deformed to allow first end piece 546 to move relative to second end piece 548.

[0199] The lower side 514 has a portion that stops against the surface 574 that forms part of the column 510. Because the column 510 is close to the signal distribution plate 500, the column 510 is in a position to transmit force to the signal distribution plate 500 through the surface 572.

[0200] The first chip 32A has a plurality of electronic devices formed therein. Each electronic device has a plurality of terminals 588 at the upper surface 590 of the first chip 32A. When the back plate 74 and the first chip 32A are placed together, the first chip 32A is aligned with the back plate 74 to ensure that each terminal 588 is in contact with a corresponding contact 562.

[0201] A vacuum pressure is generated in the region between the upper surface 590 and the lower surface 526, while the pressure below the lower surface 592 of the thin chuck 72 and the upper surface 594 of the signal distribution plate 500 remains at atmospheric pressure. The pressure difference generates equal and opposite forces F1 and F2 on the signal distribution plate 500 and the thin chuck 72.

[0202] like Figure 8BAs shown, forces F1 and F2 cause the backplate 74 to move relative to the first wafer 32A and the thin chuck 72. The coil spring 544 compresses further to allow the second end piece 548 to move into the pin opening 518. Each coil spring 544 overcomes its spring force deformation, such as F3. However, force F1 is still greater than the sum of all forces F3 added together. The upper surface 590 eventually abuts against the surface 572 of the support 564. Because the post 510 is close to the signal distribution plate 500, the support 564 prevents the upper surface 590 from moving closer to and contacting the underside 526 of the contactor 502. The first wafer 32A transfers force F4 to the support 564. The force transfer portion 566 transfers force F4 through the second portion 536 of the post opening 520. The force transmission portion 568 receives force F4 from the force transfer portion 566 and transmits force F4 to the signal distribution plate 500 via surface 574.

[0203] Therefore, it can be seen that the force F4 is not borne by the contactor 502, thus preventing stress that could damage the brittle ceramic material of the contactor 502. Instead, the force F4 is transmitted directly from the electronic device in the form of the first wafer 32A to the signal distribution board 500 through the post 510.

[0204] exist Figure 8A and 8B In the illustrated embodiment, contactor 502 serves as a support plate having a post opening 520 passing through it. Signal distribution plate 500 serves as a backing structure on a first side of the support plate and includes at least a circuit board with contacts 512. Pin 504 serves as a conductor with contacts 562 for contacting terminals 588 on an electronic device located on a second side of the support plate, opposite to the first side of the support plate. Holder portion 542 serves as a portion of the conductor held by the support plate. The conductor also has terminals 560 connected to contacts 512 on the signal distribution plate 500. A spring in the form of a helical spring 544 is provided. Thin chuck 72 serves as a force generating device on one side of an electronic device in the form of a first wafer 32A opposite to the support plate. The force generating device and the support plate are movable relative to each other to move the electronic device closer to the support plate and deform the spring. The column 510 has a support 564 having a surface 572 in a plane spaced apart from the surface of the support plate to prevent the electronic device from moving closer to the support plate; a force transfer portion 566 extending at least partially from the support 564 through the column opening 520; and a force transmission portion 568 extending from the force transfer portion 566, the force transmission portion 568 being held by a backing structure.

[0205] Figure 9A A portion of the test apparatus 10 is shown, which is used to insert a wafer package into each slot assembly, such as into slot assembly 18A, and remove it therefrom. Figure 9AThe components of the test apparatus 10 shown are fixed structure components, including frame 300, a portion of the first slot assembly 18A, first slot assembly interface 40, holding structure 302, horizontal conveying device 304, vertical conveying device 306, push rod blade 308 and locking mechanism 310.

[0206] The frame 300 includes a first mounting member 312 and a second mounting member 314 spaced apart from each other. A horizontal conveying device 304 is a sliding member mounted between the first and second mounting members 312 and 314. A retaining structure 302 is mounted for sliding along the horizontal conveying device 304. Opposite ends of push rod blades 308 are respectively mounted to the first and second mounting members 312 and 314.

[0207] The locking mechanism 310 includes a connecting rod 316, a control rod 318, and a pressure rod 320. The control rod 318 is mounted to a first mounting member 312 on a pivot connection 322. The vertical conveying device 306 is a rigid beam. A connecting member 324 connects the center points of the vertical conveying device 306 and the push rod blade 308 to each other. The pressure rod 320 has a first connecting rod 326 rotatably connected to the control rod 318 and a second connecting rod 328 rotatably connected to one end of the vertical conveying device 306. Figure 9A In the unlocking configuration shown, line 330 connects pivot connection 322 to second link 328, and first link 326 is on the left side of line 330.

[0208] In use, the first wafer package 28A is positioned on the holding structure 302. Then, the first wafer package 28A, together with the holding structure 302, moves from left to right into the first slot assembly 18A. The placement and movement of the first wafer package 28A can be performed manually or using a robot.

[0209] The retaining structure 302 slides along the horizontal conveying device 304. The connecting rod 316 connects one end of the control rod 318 to the retaining structure 302. When the retaining structure 302 moves horizontally along the horizontal conveying device 304, the connecting rod 316 causes the control rod 318 to rotate counterclockwise about the pivot connection 322.

[0210] The first link 326 rotates counterclockwise together with the control lever 318. The pressure lever 320 converts the movement of the first link 326 into the downward movement of the second link 328. Initially, the downward movement is minimal, but the vertical movement becomes more significant when the first wafer package 28A is fully inserted into the first slot assembly 18A, and the vertical transport device 306 engages the first wafer package 28A with the first slot assembly 18A. The horizontal transport device 304 is thus operable to move the first wafer package 28A horizontally from a first position to a second position into the first slot assembly 18A, and the vertical transport device 306 is operable to move the first wafer package 28A and the first slot assembly 18A relative to each other in a first vertical direction so that the slot assembly interface 40 engages with the wafer package interface on the first wafer package 28A.

[0211] exist Figure 9A In the diagram, control lever 318 is shown in the unlocked position, with first link 326 located on the first side of line 330 connecting pivot connection 322 and second link 328. Control lever 318 is... Figure 9A The unlock position is rotated through the compression position, in which the push rod blade 308 is deformed by the vertical conveying device 306 via the connecting part 324 by bending the push rod blade 308 against its spring force, and the first link 326 is aligned with the pivot connecting part 322 and the second link 328. The control lever 318 continues to rotate from the compression position to the locking position, as shown. Figure 9B and 10 As shown. In the locked position, the first link 326 is to the right of line 330, and therefore to the second side of line 330 opposite to the first side. Because the first link 326 has passed through line 330 and the push rod blade 308 has overcome its spring force deformation, the first wafer package 28A is locked in position against the slot assembly interface 40.

[0212] The system can be unlocked by moving the holding structure 302 from right to left. The control lever 318 rotates clockwise, and the first link 326 moves from right to left along line 330. The vertical transport device 306 moves upward, i.e., in a second vertical direction opposite to the first vertical direction, to release the first wafer package 28A from the slot assembly interface 40. Further movement of the holding structure 302 along the horizontal transport device 304 removes the first wafer package.

[0213] Figure 11 and 12 Other components of the first wafer package 28A are shown, including a pressure relief check valve 600, a vacuum release check valve 602, components of a latching system including first, second, third and fourth latching assemblies 604A to 604D, and an electronic pressure sensor interface 606 forming part of a pressure monitoring system.

[0214] Figure 13 It is along Figure 11 and 12 The cross-sectional view is shown in section 13-13. A pressure-reducing channel 608 is formed in the back plate 74. The pressure-reducing channel 608 has an outlet opening 610 and an intermediate position 612 located in the same plane. The outlet opening 610 is connected to the pressure-reducing check valve 600. The intermediate position 612 is closer to the center point of the back plate 74 than the outlet opening 610. The pressure-reducing channel 608 is formed by first drilling four channels in the back plate 74 and then sealing one end of three of the channels, thereby completely isolating the formed pressure-reducing channel 608 from the atmospheric pressure outside the back plate 74.

[0215] Figure 14 yes Figure 13 In the cross-sectional view of 14-14, the pressure-reducing channel 608 continues downward from the middle position 612 through the support plate 74 and the signal distribution plate 500. The pressure-reducing channel 608 has an inlet opening 624 communicating with the differential pressure chamber 622. A lip seal 77 is located within a groove in the thin chuck 72. The differential pressure chamber 622 is formed by the thin chuck 72 forming the lower side of the differential pressure chamber 622, the contactor 502, the contactor clamping ring 506, the signal distribution plate 500 forming the upper side of the differential pressure chamber 622, and the lip seal 77 forming the connection between the upper and lower sides of the differential pressure chamber 622. The lip seal 77 is perfectly circular and completely surrounds the contactor 502 and the wafer located between the contactor 502 and the thin chuck 72.

[0216] Figure 14 The components shown form a movable support structure 626. The movable support structure 626 has a first component 628 including a signal distribution plate 500 and a back plate 74, and a second component 630 including a thin chuck 72.

[0217] In use, the first component 628 is separated from the second component 630. The wafer is then placed on the thin chuck 72. The first component 628 is then positioned on the second component 630. The upper peripheral edge of the lip seal 77 contacts the signal distribution plate 500. The wafer is thus held in the movable support structure 626.

[0218] Now, in conjunction with references Figure 13 and 14 The pump is connected to the pressure reducing check valve 600. The pressure reducing check valve 600 then opens. The pressure reducing channel 608 can initially be at atmospheric pressure, and the pump subsequently reduces the pressure within the pressure reducing channel 608. The differential pressure chamber 622 is exposed to a pressure below atmospheric pressure. The outer surface of the first wafer package 28A remains exposed to atmospheric pressure. Because a pressure difference is generated between the differential pressure chamber 622 and the outer surface of the first wafer package 28A, the spring within the contactor 502 is compressed, as shown in the reference. Figure 8BThe lip seal 77 is made of an elastomeric material that allows the lip seal to compress against its spring force. Because the lip seal 77 compresses against its spring force, an improved seal is created between the lip seal 77 and the signal distribution plate 500, thereby maintaining the pressure within the differential pressure chamber 622. The pressure-reducing check valve 600 is then closed, thereby isolating the pressure-reducing passage 608 from external atmospheric pressure. The pump can then be disconnected from the pressure-reducing check valve 600.

[0219] The first wafer package 28A, containing the wafer, can now be moved within the manufacturing environment without being connected to a pump or tester. If the wafer subsequently needs to be removed, it can be... Figure 11 and 12 The vacuum release check valve 602, as shown, applies positive pressure. The vacuum release check valve 602 is spring-loaded and requires a predetermined amount of pressure to open. Air can then flow through the vacuum release passage in the backplate 74 to the differential pressure chamber 622, bringing it to atmospheric pressure. The first and second components 628 and 630 can then be separated from each other, and the wafer can be removed. The vacuum release check valve 602 subsequently closes when a new wafer is loaded into the first wafer package 28A, and when it is necessary to reduce the pressure within the differential pressure chamber 622 using the pressure-reducing check valve 600.

[0220] Figure 15 yes Figure 12 The first latch assembly 604A includes a first part 640, a second part 642, a connecting part 644, an engagement mechanism 646, a tuning block 648, a locking nut 650, a spacer 652A, a washer 652B, and a snap-fit ​​mechanism 654.

[0221] The first part 640 and the connecting part 644 are machined as a single piece and thus fixed to each other. The first part 640 has a length 660 and a width 662. In cross-section, only half of the width 662 is shown. The length 660 is greater than the width 662. The length 660 is also greater than the diameter of the connecting part 644. The first part 640 has a tool pin opening 664 formed therein.

[0222] The second part 642 has a main body 666 and first and second flaps 668A and 668B extending from the main body 666. The second part 642 has a length 670 and a width 672 including the flaps 668A and 668B. Only half of the width 672 is shown in cross-section. Because the first and second flaps 668A and 668B form part of the length 670 but not part of the width 672, the length 670 is much larger than the width 672. The main body 666 also has an opening 674 into which a connecting portion 644 can be inserted.

[0223] The connecting portion 644 includes a first portion 678 and a second portion 680. The second portion 680 has external threads formed thereon.

[0224] The engagement mechanism 646 is formed by opposing surfaces that define the width 662 of the first part 640. The opposing surfaces forming the engagement mechanism 646 are parallel to each other to facilitate engagement of the parallel surfaces on the jaws of a tool capable of subsequently rotating the first part 640.

[0225] Tuning block 648 is mounted in a fixed position to spacer 652A. Thin chuck 72 includes a metal portion 682 and a protective plate 684. The protective plate 684 forms a shoulder 686 on thin chuck 72. Gasket 652B is located between spacer 652A and signal distribution plate 500. Only a single gasket 652B is shown. Additional gaskets are typically inserted one on top of the other until the leveling surface 690 of tuning block 648 is at the same vertical height as shoulder 686.

[0226] The latching mechanism 654 includes a retaining body 694, a spherical ball 696, and a spring 698. The body 666 of the second part 642 forms part of the latching mechanism 654 because the body 666 has a first latching recess 700A formed therein.

[0227] The retainer body 694 has an outer surface with threads 702. The retainer body 694 also has an end with a slot 704 formed therein, capable of receiving a tool such as a screwdriver. A spring 698 is located within the retainer body 694. A spherical ball 696 is positioned within an opening in the retainer body 694. The opening of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a snap-fit ​​surface 706. The threads 702 engage with complementary threads within a tuning block 648. A tool such as a screwdriver is inserted into the slot 704, and then the tool is rotated to adjust the distance between the snap-fit ​​surface 706 and the tuning block 648.

[0228] Intermediate protective member 708 is inserted into a complementary groove on the upper surface of backplate 74. Openings 710, 712, and 714 are formed in intermediate protective member 708, backplate 74, and signal distribution plate 500, respectively. Second portion 680 of connector 644 is inserted from above through openings 710, 712, and 714. The length 660 of first portion 640 is greater than the length of any one of openings 710, 712, and 714 in the same direction, preventing first portion 640 from entering openings 710, 712, and 714. The lower surface of first portion 640 rests against the upper surface formed within intermediate protective member 708. Then, first portion 678 of connector 644 is located within openings 710, 712, and 714, and second portion 680 of connector 644 is located below openings 710, 712, and 714. Spring-loaded washer 720, gasket 652B, and spacer 652A are then positioned from below on connector 644. Then, the second part 642 is positioned on the connecting part 644 from below. The opening 674 forms a sliding fit with the outer diameter of the thread on the second part 680 of the connecting part 644.

[0229] As the second part 642 slides upward on the connecting part 644, the first snap-fit ​​recess 700A also contacts the snap-fit ​​surface 706. The spherical ball 696 moves slightly from right to left against the spring force of the spring 698. Then, the locking nut 650 engages with the protruding end of the second part 680. Rotation of the locking nut 650 causes the body 666 of the second part 642 to tighten against the spring force of the washer 720. A gap gauge or other instrument can be used to determine the gap between the second flap 668B and the leveling surface 690. The locking nut 650 can be rotated until an acceptable gap is formed between the second flap 668B and the leveling surface 690. This gap is generally the same as the desired gap between the first flap 668A and the shoulder 686. The locking device is then formed by the first part 640, the second part 642, and the connecting part 644.

[0230] As the locking nut 650 rotates, the first snap-fit ​​recess 700A also moves upward. The first snap-fit ​​recess 700A is an elongated slot. As the second part 642 continues to move upward with the continued rotation of the locking nut 650, the snap-fit ​​surface 706 and the first snap-fit ​​recess 700A can thus slide on top of each other.

[0231] As shown in the attached figures, the thin chuck 72 is in place when the first latching assembly 604A is assembled. Additionally, a negative pressure exists in the differential pressure chamber 622. By compressing the first wafer package 28A, it is possible to measure whether the first and second flaps 668A and 668B are equidistant from the shoulder 686 and the leveling surface 690. As long as the leveling surface 690 has been set at the correct height using one or more shims such as shim 652B, the first latching assembly 604A can also be assembled without the thin chuck 72 by simply measuring the gap between the second flap 668B and the leveling surface 690.

[0232] Figure 16 It is along Figure 15 The view is in direction A, but only the connector 644 and the signal distribution board 500 are shown.

[0233] The opening 712 has a first dimension 724 on the axis 726 toward the center point of the signal distribution board 500, which is larger than a second dimension 728 transverse to the axis 726. The first portion 678 of the connection 644 is smaller than the first dimension 724 in the direction of the axis 726 to allow the signal distribution board 500 and the backplate 74 (see...) Figure 15 The first part 678 is sized to slidably fit within the second part 728 to prevent the signal distribution board 500 from moving relative to the back plate 74 in a direction transverse to the axis 726.

[0234] The second portion 680 of the connecting portion 644 has a first thickness 730 and a second thickness 732. The first thickness 730 can fit through the opening 712 in the direction of the axis 726, and the first thickness 730 is larger than the second dimension 728 of the opening 712. The second thickness 732 is transverse to the first thickness 730 and can fit through the second dimension 728 of the opening 712. Because the second dimension 728 is relatively large, it allows threads to be formed thereon and it remains relatively robust. The entire second portion 680 is located below the opening 712, which allows the connecting portion 644 to rotate about its longitudinal axis without the second portion 680 getting stuck in the relatively narrow opening 712. The first portion 678 has a circular cross-section with a diameter not greater than the second dimension 728, which allows the first portion 678 to rotate freely within the relatively narrow second dimension 728 of the opening 712.

[0235] An additional opening 734 is formed in the signal distribution plate 500 for further securing of the gasket. The opening 734 is similarly proportional to the opening 712, having a longer dimension along axis 736 toward the center point of the signal distribution plate 500. When used in a manufacturing environment, the anchor passing through the opening 734 need not rotate, and the size of the opening 734 is solely for allowing thermal expansion of the signal distribution plate 500 relative to the backplate 74.

[0236] Figure 17 for Figure 15 Cross-sectional view of section 17-17, with retainer 740 inserted through. Figure 16 The opening 734 is used to secure the spacer 652A and the gasket 652B to the back plate 74. The retainer 740 includes a bolt and a nut, wherein the head of the bolt is on one side and the nut is on the opposite side.

[0237] The main body 666 has a circular outer surface 742 in which first, second, third, and fourth snap-fit ​​recesses 700A to 700D are formed. The snap-fit ​​surface 706 of the spherical sphere 696 is located within the first snap-fit ​​recess 700A, which prevents the main body 666 from rotating. An opening 674 within the main body 666 is keyed to receive the shape of the second portion 680, such that if the main body 666 remains stationary, the second portion 680 cannot rotate.

[0238] A small amount of torque is required to rotate the main body 666 and dislodge the spherical ball 696 from the first snap-fit ​​recess 700A. If the main body 666 rotates clockwise, the snap-fit ​​surface 706 rests on the circular outer surface 742 between the first snap-fit ​​recess 700A and the second snap-fit ​​recess 700B. As the main body 666 rotates, the second part 680 rotates with the main body 666 by the same angle. When the main body 666 has rotated approximately 90 degrees, the snap-fit ​​surface 706 snaps into the second snap-fit ​​recess 700B. The second snap-fit ​​recess 700B then prevents the rotation of the main body 666 and the second part 680. The first to fourth snap-fit ​​recesses 700A to 700D gently lock the main body 666 at four different rotation angles, including 0 degrees, 90 degrees, 180 degrees, and 270 degrees.

[0239] Figure 18a(i) and 18a(ii) It is along Figure 15 The view is in the direction of arrows A and B, but the locking device is rotated to the unlocked position. The operator can compare the orientation of the first part 640 with the reference 750 on the upper surface of the thin chuck 72. In Figure 18a(ii), the first latch assembly 604A is shown unlocked. The shoulder 686 is not obstructed from below by the first wing 668A or the second wing 668B. Wings 668A and 668B are... Figure 15 and 17 The latching mechanism 654 shown is held in the position indicated in FIG18a(i). The pressure within the first wafer package 28A can be reduced, and the thin chuck 72 can be removed to insert or replace the wafer. After the wafer is replaced, the pressure within the first wafer package 28A is reduced again to hold the first wafer package 28A together.

[0240] When the first wafer package 28A is fully assembled, further fault protection may be required to maintain electrical contact with the wafer even if the negative pressure within the first wafer package 28A cannot be maintained due to a system failure. An operator can use a tool with jaws and leads (not shown). The leads are inserted into the tool lead opening 664. The tool lead opening 664 is tapered, such that the deeper the leads are inserted into the tool lead opening 664, the more aligned the tool becomes with the first part 640. The operator then engages the opposing parallel surfaces of the tool's jaws with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool, and the tool rotates the first part 640. The connecting part 644 and the second part 642, along with their first and second flaps 668A and 668B, rotate together with the first part 640. (See reference...) Figure 17 The snap-fit ​​surface 706 disengages from the fourth snap-fit ​​recess 700D and slides on the circular outer surface 742. Then, the snap-fit ​​surface 706 snaps into the first snap-fit ​​recess 700A.

[0241] Figure 18b(i) and 18b(ii) The first latch assembly is shown after the first part 640 and the second part 642 have been rotated 90 degrees at an angle 752. The operator can see that the orientation of the first part 640 matches the locking position indicated by reference numeral 750. The first flap 668A is now positioned above the shoulder 686, which prevents the thin chuck 72 from moving vertically downwards away from the rest of the wafer package 28A. The second flap 668B is positioned on the tuning block 648. The first flap 668A can be disengaged from the shoulder 686 by rotating the first part 640 90 degrees clockwise or counterclockwise. Either flap 668A or 668B can be used to lock the thin chuck 72 into place.

[0242] Figure 19 This diagram illustrates how one or more shims 652B to 652F are used to adjust the height of the leveling surface 690 of the tuning block 648. Ideally, the tuning block 648 should be at the same height as the shoulder 686. Since the tuning block 648 is mounted to the spacer 652A, the tuning block 648 moves up and down together with the spacer 652A as more shims 652B to 652F are inserted. If the leveling surface 690 is below the shoulder 686, more shims can be inserted to raise the leveling surface 690, or if the leveling surface 690 is above the height of the shoulder 686, the shims can be removed.

[0243] The engagement mechanism 646 is conveniently located directly on the first part 640. In another arrangement, the engagement mechanism may be formed directly on the second part 642 or directly on the connecting part 644.

[0244] In another embodiment, the engagement mechanism may be a mechanism separate from the first part 640, the second part 642, and the connecting part 644. For example, the worm gear may be formed on the connecting part 644, and the engagement mechanism may be a separate rotatable mechanism that rotates the worm gear.

[0245] The engagement mechanism can also be located between the first part 640 and the connecting part 644. For example, the first flap 668A can be pivoted downward away from the shoulder 686 and backward toward the shoulder 686 using a cam system located between the first part 640 and the connecting part 644. This cam system as the engagement mechanism can alternatively be located between the connecting part 644 and the second part 642. Alternatively, the connecting part 644 can be made into two parts, and the engagement mechanism can connect these two parts and adjust the distance between them, and the distance adjustment can pivot the flap.

[0246] The first latch assembly 604A primarily uses an incompressible and non-flexible material. In alternative embodiments, a strip or other flexible material may be used for the same or similar purposes.

[0247] Instead of having a coupling mechanism 646 on the outer surface of the first part 640, the coupling mechanism may alternatively be on the inner surface of any part.

[0248] Refer again Figure 12 The first, second, third, and fourth latching assemblies 604A to 604D are identical except for their respective positions and orientations. The first and third latching assemblies 604A and 604C are located on opposite sides of the thin chuck 72, and the second and fourth latching assemblies 604B and 604D are located on opposite sides of the thin chuck 72. Because the latching assemblies 604A to 604D are located on more than one side of the thin chuck 72, i.e., they cover more than 180 degrees around the circumference of the thin chuck 72, they can collectively hold all sides of the thin chuck 72 in place around its entire circumference.

[0249] The latching system provided by the first, second, third, and fourth latching assemblies 604A to 604D facilitates easier movement of the first wafer package 28A within the manufacturing environment without human supervision. Without the latching system, human supervision is required to determine when the negative pressure within the first wafer package 28A fails and when the wafer 28A separates. The latching system provides structural fault protection to prevent the first wafer package 28A from separating, even if it draws in air from the outside.

[0250] Figure 20 , 21 Figures 22a and 22b show other components of the pressure monitoring system, including pressure sensing channel 760. Figure 21 ), pressure sensor 762 ( Figure 22a and 22b ), reference Figure 11 The electronic pressure sensor interface 606 ( Figure 20 , 21 764, 766, 72a and 22b), electronic pressure connector interface 764, mounting bracket 766, and ribbon cable 768 having first and second connectors 770 and 772 at their opposite ends. Figure 20 , 22a and 22b), connector block 774 and reinforcing plate 776 ( Figure 20 ).

[0251] Pressure sensing channel 760 is similar to a reference Figure 13 The pressure relief channel 608 is formed in the back plate 74. The pressure sensing channel 760 has Figure 14 The first end is located within the differential pressure chamber 622 shown. The pressure sensing channel 760 has a second end opposite to the first end near the outer edge of the back plate 74.

[0252] The electronic pressure sensor interface 606 is in the form of a printed circuit board, which has a substrate 780 and multiple contacts, including first, second and third contacts 782A, 782B and 782C formed on the substrate 780.

[0253] Pressure sensor 762 is mounted to substrate 780 on the side opposite to the first, second, and third contacts 782A, 782B, and 782C. Pressure sensor 762 is electrically connected to the first, second, and third contacts 782A, 782B, and 782C via substrate 780. Pressure sensor 762 is capable of sensing the pressure of a gas (in this case, air) and converting the pressure into an electrical signal, wherein the magnitude of the pressure is indicated by the magnitude of the signal or another variable. Pressure can be conveniently detected using a diaphragm that displaces a known distance as the pressure increases or decreases. Other pressure sensors are also within the scope of this invention, such as pressure sensors using piezoelectric crystals or pressure sensors using stress meters. In the case of moving the diaphragm, for example by moving an induction coil, the movement can be converted into a voltage, and the magnitude of the voltage then indicates the displacement and thus the pressure. The pressure sensor can be, for example, the MLX90809 sold by Melexis (www.melexis.com). The electronic pressure sensor interface 606 is mounted to backplate 74 using fastener 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing channel 760. The pressure sensor 762 can therefore sense the pressure within the differential pressure chamber 622.

[0254] The electronic pressure connector interface 764 has a plate 790 and multiple terminals, including first terminals 792A to sixth terminals 792F fixed to the plate 790. The plate 790 is mounted to a mounting bracket 766 by fasteners 794. A reinforcing plate 776 is fixed between two push rod blades 308. The mounting bracket 766 is fixed to the reinforcing plate 776 by fasteners 796. The slot assembly body 32, together with the push rod blades 308 and the reinforcing plate 776, forms part of a fixed structure, and the electronic pressure connector interface 764 is thus mounted to the fixed structure.

[0255] Connector block 774 is mounted to slot assembly body 32. Connectors 770 and 772 are connected to electronic pressure connector interface 764 and connector block 774, respectively. First to sixth terminals 792A to 792F are connected to the pressure sensing plate of the electronic tester via first connector 770, ribbon cable 768 and second connector 772.

[0256] Figure 23a and 23b The diagram illustrates the engagement of the electronic pressure sensor interface 606 with the electronic pressure connector interface 764 when the first wafer package 28A is inserted into the slot assembly. First, second, and third contacts 782A, 782B, and 782C initially contact the first, second, and third terminals 792A, 792B, and 792C, respectively. Further movement of the electronic pressure sensor interface 606 causes the first, second, and third contacts 782A, 782B, and 782C to engage with the fourth, fifth, and sixth terminals 792D, 792E, and 792F, respectively. The first contact 782A thus contacts both the first terminal 792A and the fourth terminal 792D. Similarly, each of contacts 782B and 782C contacts two of terminals 792B, 792C, 792E, and 792F.

[0257] Terminals 792A to 792F can be elastically pressed relative to plate 790 to ensure proper contact with contacts 782A to 782C. The ribbon cable 768 allows for slight movement of the reinforcing plate 776 relative to the slot assembly body 32 during insertion of the first wafer package 28A.

[0258] While the wafer is being tested, the pressure within the differential pressure chamber 622 can be monitored throughout the process. If the wafer test fails, the tester can be programmed to determine whether the test failure might be a result of negative pressure within the differential pressure chamber 622.

[0259] While certain exemplary embodiments have been described and illustrated in the accompanying drawings, it should be understood that these embodiments are merely illustrative and not intended to limit the invention, and that the invention is not limited to the specific constructions and arrangements shown and described, as modifications will be conceived by those skilled in the art.

Claims

1. A microelectronic circuit test kit, comprising: A movable support structure includes a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; Multiple contacts are located on the first component and are mated to the terminal to make contact with the terminal. A differential pressure chamber seal is located between the first component and the second component, and the differential pressure chamber seal together with the surfaces of the first component and the second component forms a closed differential pressure chamber; A first channel is formed through one of the first component and the second component, the first channel having a first opening at the differential pressure chamber and a second opening outside the differential pressure chamber; A valve is connected to the first channel, the opening of which allows gas to flow through the first channel, and the closing of which prevents the gas from flowing through the first channel; A first interface, which is on the movable support structure and connected to the contact, is used to connect to a second interface on the fixed structure when the movable support structure is removably held by the fixed structure. as well as The fixing system includes a first fixing component, the first fixing component having: The first part is engaged with the first component; The second part, which engages with the second component; and The connecting portion has opposite ends that are respectively fixed to the first portion and the second portion to form a locking device.

2. The microelectronic circuit test kit according to claim 1, wherein, The first fixing component includes: An engagement mechanism is connected to the locking device and operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in a closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to an open relationship.

3. The microelectronic circuit test kit according to claim 2, wherein, The engagement mechanism causes the second part to move between the locked position and the unlocked position.

4. The microelectronic circuit test kit according to claim 3, wherein, The second part rotates between the locked position and the unlocked position.

5. The microelectronic circuit test kit according to claim 4, wherein, The second part rotates about an axis perpendicular to the substrate between the locked position and the unlocked position.

6. The microelectronic circuit test kit according to claim 4, wherein, The engagement mechanism includes a surface on the first component that forms a seat for contacting a surface on the jaws of the tool, the jaws of the tool being rotatable to rotate the first component, and the first component rotating the second component via the connecting portion to move between the locked position and the unlocked position.

7. The microelectronic circuit test kit according to claim 6, wherein, The surface on the first part on which the seat is formed is the outer surface of the first part.

8. The microelectronic circuit test kit according to claim 7, wherein, The first part has a tool pin opening therein for aligning the pins of the tool with the first part.

9. The microelectronic circuit test kit according to claim 4, wherein, The second part has a body and at least a first wing extending from the body, wherein the first wing moves over the shoulder of the second part when moved to a first locked position, and moves away from the shoulder when moved away from the first locked position toward the unlocked position.

10. The microelectronic circuit test kit according to claim 9, wherein, The second part has a second wing extending from the body, wherein the second wing moves over the shoulder of the second part when moving to the second locked position, and moves away from the shoulder when moving away from the second locked position toward the unlocked position.

11. The microelectronic circuit test kit according to claim 10, wherein, The fixing system also includes: A tuning block is mounted in a fixed position relative to the second component. The tuning block has a leveling surface. When the first wing is located above the shoulder, the second wing is located above the leveling surface. The second component is adjustable relative to the first component to adjust the gap between the leveling surface and the second wing.

12. The microelectronic circuit test kit according to claim 1, wherein, The fixing system also includes: A locking nut having threads that engage with the threaded portion of the connection to rotatably adjust the second portion relative to the connection.

13. The microelectronic circuit test kit according to claim 11, wherein, The fixing system also includes: A shim is placed between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

14. The microelectronic circuit test kit according to claim 11, wherein, The fixing system also includes: A latching mechanism having a latching surface that latches into a first latching recess to prevent the second part from moving away from the locked position, and latches into a second latching recess to prevent the second part from moving away from the unlocked position.

15. The microelectronic circuit test kit according to claim 14, wherein, The first and second latch recesses are located on the locking device.

16. The microelectronic circuit test kit according to claim 15, wherein, The first and second buckle recesses are located on the second part.

17. The microelectronic circuit test kit according to claim 4, wherein, The first component includes a backplate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backplate and the second component. The signal distribution plate has an opening through which the connecting portion is inserted. The opening has a first dimension on an axis toward the center point of the signal distribution plate, the first dimension being larger than a second dimension transverse to the axis. The connecting portion has a first portion smaller than the first dimension in the direction of the axis to allow thermal expansion of the signal distribution plate and the backplate relative to each other. The first portion is sized to slidably fit within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backplate in the direction transverse to the axis.

18. The microelectronic circuit test kit according to claim 17, wherein, The connecting portion has a second part having a first thickness and a second thickness transverse to the first thickness, the first thickness being able to fit through the opening in the direction of the axis during the insertion and being larger than the second dimension of the opening, and the second thickness being able to fit through the second dimension of the opening during the insertion.

19. The microelectronic circuit test kit according to claim 1, wherein, The fixed system includes: The second fixing component, wherein each respective fixing component has: The first part is engaged with the first component; The second part, which engages with the second component; and The connecting portion has opposite ends that are respectively fixed to the first portion and the second portion to form a locking device.

20. The microelectronic circuit test kit according to claim 19, wherein, The second fixing component includes: An engagement mechanism is connected to the locking device and operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in a closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to an open relationship.

21. The microelectronic circuit test kit according to claim 19, wherein, The first fixing component and the second fixing component have corresponding second parts on different sides of the second component.

22. The microelectronic circuit test kit according to claim 1, wherein, The differential pressure chamber seal surrounds the contact and the terminal.

23. The microelectronic circuit test kit according to claim 1, wherein, When the first component and the second component are separated, the differential pressure chamber seal is fixed to the second component.

24. The microelectronic circuit test kit according to claim 1, wherein, The differential pressure chamber seal is a lip seal.

25. The microelectronic circuit test kit according to claim 1, wherein, The first channel is a pressure reducing channel, the first opening is an inlet opening, the second opening is an outlet opening, the valve is a pressure reducing valve, the gas is air allowed to leave the differential pressure chamber, so that the first component and the second component move toward each other relative to ensure proper contact between the contact and the terminal, and the closure of the pressure reducing valve prevents air from entering the differential pressure chamber.

26. The microelectronic circuit test kit according to claim 25, wherein, The pressure reducing valve is a pressure reducing check valve, and a vacuum release channel is formed through the component containing the pressure reducing check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The microelectronic circuit test kit also includes: The second valve is a vacuum release valve connected to the vacuum release channel. Opening the vacuum release valve allows air to enter the differential pressure chamber, and closing the vacuum release valve prevents air from escaping from the differential pressure chamber.

27. The microelectronic circuit test kit according to claim 1, wherein, The substrate is a wafer with multiple microelectronic circuits.

28. The microelectronic circuit test kit according to claim 1, wherein, The contacts are pins, each pin having a spring that is pressed against its spring force when the corresponding contact is pressed by the corresponding terminal.

29. A testing apparatus, comprising: A movable support structure includes a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; Multiple contacts are located on the first component and are mated to the terminal to make contact with the terminal. A differential pressure chamber seal is located between the first component and the second component, and the differential pressure chamber seal together with the surfaces of the first component and the second component forms a closed differential pressure chamber; A first channel is formed through one of the first component and the second component, the first channel having a first opening at the differential pressure chamber and the outlet and a second opening outside the differential pressure chamber; A valve connected to the first channel, the opening of which allows gas to flow through the first channel, and the closing of which prevents air from flowing through the first channel; A first interface, which is on the movable support structure and connected to the contact, is used to connect to a second interface on the fixed structure when the movable support structure is removably held by the fixed structure. A fixing system having a first fixing component, the first fixing component having: The first part is joined to the first component; The second part is engaged with the second component; A connecting portion having opposite ends that are respectively fixed to the first portion and the second portion to form a locking device; A fixed structure, wherein the movable support structure can be received to be held by the fixed structure and can be removed from the fixed structure; A second interface is located on the fixed structure. The second interface is connected to the first interface when the movable support structure is held by the fixed structure, and the second interface is disconnected from the first interface when the movable support structure is removed from the fixed structure. as well as An electronic tester is connected to the terminal via the second interface, the first interface, and the contacts, such that signals are transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit.

30. A method for testing a microelectronic circuit held by a substrate, comprising: The substrate is held between a first component and a second component of a movable support structure. The first component has a contact of a terminal abutting against the substrate, the terminal being connected to the microelectronic circuit. A first channel is formed through one of the first and second components. The first channel has a first opening at a differential pressure chamber and a second opening outside the differential pressure chamber. The differential pressure chamber seal is positioned between the first component and the second component to form a closed cavity by the surfaces of the first component and the second component and the differential pressure chamber seal; Open the valve to allow gas to flow through the first channel; Close the valve to prevent gas from flowing through the first channel; The locking device is moved from an unlocked position to a locked position. In the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to an intermittent relationship. In the locked position, the locking device holds the first component and the second component locked in the closed position. The locking device includes: The first part is engaged with the first component; The second part is engaged with the second component; A connecting portion having opposite ends respectively fixed to the first portion and the second portion; The movable support structure is received by a fixed structure, wherein a first interface on the movable support structure is connected to a second interface on the fixed structure; Signals are transmitted between the electronic tester and the microelectronic circuit via the terminals, contacts, and first and second interfaces to test the microelectronic circuit. Remove the movable support structure from the fixed structure; and The locking device moves from the locked position to the unlocked position. In the locked position, the locking device holds the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the interval relationship.

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