Mini backlight module, preparation method and display device

Abstract

The invention relates to the technical field of backlight display, and particularly provides a Mini backlight module, a preparation method and a display device.The Mini backlight module comprises a backlight module body and a plurality of box dams, the backlight module body comprises a circuit substrate, and one side of the circuit substrate is a chip mounting surface; the plurality of box dams are arranged on the chip mounting surface in a protruding manner, and the chip mounting surface is uniformly divided into two or more than two square light control subareas by the box dams; wherein the two or more than two light control subareas are respectively provided with a light-emitting chip group, and the light-emitting chip groups are distributed on the chip mounting surface in a square or concentric-square-shaped manner. The light control subareas of the Mini backlight module are provided with the light-emitting chip sets which are distributed in a square or concentric-square-shaped mode, the square light spots emitted between the adjacent light control subareas are separated through the box dams, the consistency of the shape and size of the light spots of the light source and the shape and size of the light control subareas of a liquid crystal panel can be kept, picture details under gray-scale signals do not need to be sacrificed, and therefore the light control subareas of the Mini backlight module are not damaged. And the halo phenomenon is weakened.

Description

Technical Field

[0001] This application relates to the technical field of backlight display, and particularly relates to a Mini backlight module, a preparation method and a display device. Background Art

[0002] Mini LED backlight display products generally have relatively high requirements for the contrast of the display screen. The main manufacturing forms of current Mini LED backlight sources include dotting microlens glue on the lamp core, covering a lens on the LED lamp bead, and attaching a planar reflector on the LED light source lamp board, etc. Since the light emission pattern of the LED is approximately circular, and the microlens dotting and the lens are also circular, the light spot shape of each light source in the Mini LED backlight is a circular light spot. When setting the light source array, in order to avoid dark spots between the circular light spots, the distance between each light source needs to be reduced to meet the illuminance at the dark area position. Therefore, there is an overlapping part of the light source light spots in each partition, and this setting will produce a partition halo phenomenon. At the same time, the pixel partitions of the liquid crystal panel are cut into squares, and each partition corresponds to a large circular light spot of the light source, which is irradiated on the square pixel partitions, further generating a halo phenomenon and affecting the image quality.

[0003] Currently, there is a method to reduce the pixel aperture ratio of the liquid crystal panel at the halo position through an image quality algorithm and increase the image sharpness to improve the halo, but this method will sacrifice the image details under low gray-scale signals and also affect the image quality; and the optimization effect of the algorithm on the image quality is limited and the cost is relatively high.

[0004] Therefore, the existing Mini LED backlight display products have problems of halo phenomenon and low gray-scale image distortion. Summary of the Invention

[0005] In view of the above deficiencies of the prior art, the purpose of this application is to provide a Mini backlight module, a preparation method and a display device, aiming to solve the problems of halo phenomenon and low gray-scale image distortion existing in the existing Mini LED backlight display products.

[0006] The technical solution adopted by this application to solve the technical problems is as follows: Provide a Mini backlight module, including:

[0007] A backlight module main body, the backlight module main body includes a circuit board, and one side of the circuit board is a chip mounting surface;

[0008] A plurality of dams, a plurality of the dams are all convexly arranged on the chip mounting surface, and the chip mounting surface is evenly divided into two or more square light control partitions by the dams;

[0009] Among them, a light-emitting chip group is provided on each of two or more of the light control partitions, and the light-emitting chip group is arranged in a square or rectangular distribution on the chip mounting surface.

[0010] Optionally, the light-emitting chip group includes a red LED chip group, a green LED chip group, and a blue LED chip group; the red LED chips in the red LED chip group are connected in series and are arranged in a rectangular distribution on the chip mounting surface; the green LED chips in the green LED chip group are connected in series and are arranged in a rectangular distribution on the chip mounting surface; the blue LED chips in the blue LED chip group are connected in series and are arranged in a square distribution on the chip mounting surface;

[0011] The quantity ratio of the red LED chips, the green LED chips, and the blue LED chips is 6:5:4.

[0012] Optionally, the rectangular distribution of the red LED chip group is nested outside the rectangular distribution of the green LED chip group, and the rectangular distribution of the green LED chip group is nested outside the square distribution of the blue LED chip group; and the voltages of the red LED chip group, the green LED chip group, and the blue LED chip group are all greater than or equal to 12V.

[0013] Optionally, a phosphor or fluorescent glue is coated on the light-emitting chip group; the light-emitting chip group is a blue LED chip group, and the blue LED chips in the blue LED chip group are connected in series;

[0014] Alternatively, the light-emitting chip group includes a blue LED chip group and a green LED chip group, the blue LED chips in the blue LED chip group are connected in series and are arranged in a square distribution on the chip mounting surface; the green LED chips in the green LED chip group are connected in series and are arranged in a rectangular distribution on the chip mounting surface; the rectangular distribution of the green LED chip group is nested outside the square distribution of the blue LED chip group.

[0015] Optionally, when the phosphor is coated on the light-emitting chip group, the thickness of the phosphor is 50 - 300 μm; when the fluorescent glue is coated on the light-emitting chip group, the thickness of the fluorescent glue is 0.15 - 0.40 mm.

[0016] Optionally, an electrode pad is provided at the bottom of the light-emitting chip group, and the light-emitting chip group is arranged on the chip mounting surface through the electrode pad; or, the light-emitting chip group is directly connected to the chip mounting surface.

[0017] Optionally, a transparent optical glue is poured on the light-emitting chip group, and the thickness of the transparent optical glue is higher than the height of the light-emitting chip group and lower than the height of the dam.

[0018] Optionally, the cross-sectional width of the dam decreases in the direction away from the chip mounting surface.

[0019] The present application also provides a method for manufacturing the Mini backlight module as described above. The method for manufacturing the Mini backlight module is to fix the light-emitting chip group on the chip mounting surface, then evenly divide the chip mounting surface into two or more square light control partitions by means of a plurality of the dams, and finally obtain the Mini backlight module through overall encapsulation;

[0020] Alternatively, the method for manufacturing the Mini backlight module is to encapsulate the light-emitting chip group first, then fix it on the chip mounting surface, and then evenly divide the chip mounting surface into two or more square light control partitions by means of a plurality of the dams, and finally obtain the Mini backlight module through overall encapsulation.

[0021] The present application also provides a display device including the Mini backlight module as described above.

[0022] Compared with the prior art, the present application provides a Mini backlight module, a manufacturing method, and a display device. The Mini backlight module includes a backlight module main body and dams. One side of the circuit board of the backlight module main body is a chip mounting surface. The dams are arranged on the chip mounting surface and evenly divide it into a plurality of square light control partitions. The light control partitions are provided with a light-emitting chip group, and the light-emitting chip group is arranged in a square or loop shape, capable of forming a uniform square light spot, corresponding to the square of the pixel partition of the liquid crystal panel. Moreover, the square light spots emitted between adjacent light control partitions are separated by the dams, which can weaken the halo phenomenon and further improve the display image quality of the Mini backlight module; and, the light-emitting chip group can be directly controlled by applying current and voltage, without the need for an optimization algorithm, with low cost, and without sacrificing the picture details under the gray-scale signal. Description of the Drawings

[0023] Figure 1 is a top view of the Mini backlight module manufactured by the COB process in the present application;

[0024] Figure 2 is a side view of the Mini backlight module manufactured by the COB process in the present application;

[0025] Figure 3 is a top view of an embodiment in which the light control partition of the Mini backlight module manufactured by the MIP process includes three groups of light-emitting chip groups;

[0026] Figure 4 is Figure 3 a side view of;

[0027] Figure 5 is a top view of another embodiment in which the light control partition provided in the present application includes three groups of light-emitting chip groups;

[0028] Figure 6 is a schematic diagram (the direction in the attached drawing is the current direction) in which three groups of light-emitting chip groups in the light control partition provided in the present application are respectively connected in series;

[0029] Figure 7 is a top view of an embodiment in which the light control partition in the Mini backlight module prepared by the MIP process in the present application includes one group of light-emitting chip groups;

[0030] Figure 8 is Figure 7 a side view of;

[0031] Figure 9 is Figure 7 a bottom view of.

[0032] Explanation of reference numerals:

[0033] 1. Circuit substrate; 2. Dam; 3. Transparent optical adhesive; 10. Light control partition; 11. Light-emitting chip group; 12. Electrode pad; 111. Blue LED chip; 112. Green LED chip; 113. Red LED chip; 114. Encapsulated circuit substrate; 115. Fluorescent adhesive. Detailed implementation manners

[0034] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the attached drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the attached drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0035] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0037] Terms such as "parallel" and "perpendicular" do not mean that the components are required to be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" only means that its direction is more parallel relative to "perpendicular", and does not mean that the structure must be completely parallel, but may be slightly inclined.

[0038] Terms such as "horizontal", "vertical", and "overhanging" do not mean that the components are required to be absolutely horizontal, vertical, or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] With reference to Figure 1 and Figure 2 , this application provides a Mini backlight module, including: a backlight module main body and a plurality of dams 2. The backlight module main body includes a circuit board 1, and one side of the circuit board 1 is a chip mounting surface; a plurality of the dams 2 are all protrudingly arranged on the chip mounting surface, and the chip mounting surface is evenly divided into two or more square light control zones 10 by the dams 2; wherein, light-emitting chip groups 11 are provided on two or more of the light control zones 10, and the light-emitting chip groups 11 are arranged in a square or loop shape on the chip mounting surface.

[0041] Among them, the chip mounting surface is evenly divided into two or more light control partitions 10 by the dam 2 glue, that is, adjacent light control partitions 10 are separated by the dam 2; the dam 2 can be horizontally arranged on the chip mounting surface or vertically arranged on the chip mounting surface, and can intersect with each other to evenly divide more light control partitions 10; the size, dimension, etc. of each light control partition 10 can be adjusted by the setting of the dam 2 to be equal, so that the light control partitions 10 can be evenly distributed, which is beneficial to generating a stable and consistent light-emitting effect, and the light rays formed by reflection, refraction, etc. of the light-emitting chip group 11 in the square light control partition 10 can be better superimposed and fused, reducing the local strength difference, making the light more uniform, weakening the halo effect, and improving the low gray-scale picture distortion phenomenon. The dam 2 is specifically one or more, and the number of light control partitions 10 can be set according to the actual needs such as the size of the chip mounting surface and the number of light control partitions 10.

[0042] The light control partition 10 is square, which can correspond to the square of the pixel partition of the liquid crystal panel, so as to reduce the halo phenomenon, and it is convenient to divide the chip mounting surface into a plurality of uniform light control partitions 10 by the dam; each light control partition 10 is preferably the same in size and dimension, so that each light control partition 10 can emit a consistent light effect, ensuring a stable and consistent light-emitting effect of the entire Mini backlight module. The outer edge of the circuit board 1 can be provided with a frame, a bracket, etc., so as to facilitate moving the circuit board 1 through the frame, the bracket, etc., and thus moving the entire Mini backlight module, which is convenient for the transportation of the Mini backlight module.

[0043] The light-emitting chip group 11 is distributed in a square or loop shape on the chip mounting surface, which can change the side light angle of the light-emitting chip, making the light emission direction more dispersed and reasonable, forming a uniform square light spot, and concentrating the light of the light control partition 10 in this partition through the dam 2, which can reduce the radiation energy of the light control partition 10 penetrating into the adjacent light control partition 10, thereby reducing the occurrence of the light crosstalk phenomenon, weakening the halo phenomenon, and improving the display effect of the Mini backlight module. The light-emitting chip group 11 of each light control partition 10 is preferably the same, and the distribution and setting are the same, which can ensure the overall consistency of the Mini backlight module. The number of light control partitions 10 can be set according to actual needs. The square is preferably a square or a rhombus to ensure that the distances between adjacent lamp cores are equal, thereby ensuring the uniformity of the emitted light.

[0044] The Mini backlight module of this embodiment includes a backlight module main body and a dam 2. One side of the circuit board 1 of the backlight module main body is a chip mounting surface. The dam 2 is arranged on the chip mounting surface and evenly divides it into a plurality of square light control partitions 10. The light control partitions 10 are provided with light-emitting chip groups 11. The light-emitting chip groups 11 are arranged in a square or loop shape, capable of forming a uniform square light spot. Moreover, the square light spots between adjacent light control partitions 10 are separated by the dam 2, which can weaken the halo phenomenon and further improve the display image quality of the Mini backlight module. Additionally, the light-emitting chip groups 11 can be directly controlled by applying current and voltage, without the need for an optimization algorithm, with low cost and without sacrificing the picture details under the gray-scale signal. In some embodiments, the light-emitting chip group includes a red LED chip group, a green LED chip group, and a blue LED chip group. The red LED chips 113 in the red LED chip group are connected in series and arranged in a loop shape on the chip mounting surface. The green LED chips 112 in the green LED chip group are connected in series and arranged in a loop shape on the chip mounting surface. The blue LED chips 111 in the blue LED chip group are connected in series and arranged in a square shape on the chip mounting surface. The quantity ratio of the red LED chips 113, the green LED chips 112, and the blue LED chips 111 is 6:5:4.

[0045] Red, green, and blue are the three primary colors. There are three groups of light-emitting chip groups 11, namely a red LED chip group composed of a plurality of red LED chips 113 connected in series, a green LED chip group composed of a plurality of green LED chips 112 connected in series, and a blue LED chip group composed of a plurality of blue LED chips 111 connected in series. They can be mixed by the light intensities of red, green, and blue and their mutual ratios to achieve different color displays. Moreover, the red LED chip group, the green LED chip group, and the blue LED chip group are all connected in series internally and are independent of each other. By adjusting the applied current and voltage of the red LED chip group, the green LED chip group, and the blue LED chip group, the light intensities of red, green, and blue can be adjusted respectively, and then the mutual ratios of red light, green light, and blue light can be adjusted for mixing, improving the control accuracy of the mixed picture in the control partition, capable of accurately displaying the required picture colors and improving the picture quality.

[0046] Among the three groups of light-emitting chip groups 11, before the red LED chip group composed of a plurality of red LED chips 113 connected in series, the green LED chip group composed of a plurality of green LED chips 112 connected in series, and the blue LED chip group composed of a plurality of blue LED chips 111 connected in series are arranged on the chip mounting surface, the schematic diagram of power-on is as Figure 6;The operation of setting in the light control partition 10 is specifically to arrange the series-connected red LED chip group, green LED chip group, and blue LED chip group in a meandering or square distribution on the light control partition 10.

[0047] Furthermore, the quantity ratio of the red LED chips 113, green LED chips 112, and blue LED chips 111 is 6:5:4, mainly selected according to the characteristics of the lamp cores of different colors. The working voltage of the existing red LED chips 113 is usually 1.8 - 2.2V, the working voltage of the green LED chips 112 is usually 2.0 - 3.0V, and the working voltage of the blue LED chips 111 is usually 3.0 - 3.6V; such a quantity ratio can make the overall voltages of the red LED chip group, green LED chip group, and blue LED chip group approximately the same.

[0048] Among them, the overall voltage of six series-connected red LED chips 113, the overall voltage of five series-connected green LED chips 112, and the overall voltage of four series-connected blue LED chips 111 are similar, which can ensure that the different-color lamp cores in the entire light control partition 10 are connected with similar voltages, so that the luminous intensity, brightness, etc. of the lamp cores are uniform, reduce the color difference between different colors, and ensure the stable working state of the entire light control partition 10, the stable heating state of each lamp core, and improve the overall stability and reliability.

[0049] Specifically, the minimum number of lamp cores contained in the light-emitting chip group 11 is fifteen, that is, six red LED chips 113, five green LED chips 112, and four blue LED chips 111; specifically, the number of lamp cores in the light-emitting chip group 11 can also be a positive integer multiple of fifteen, while meeting the requirement of the quantity ratio of red LED chips 113, green LED chips 112, and blue LED chips 111 being 6:5:4.

[0050] Furthermore, the voltage difference between the overall voltage of the red LED chip group, the overall voltage of the green LED chip group, and the overall voltage of the blue LED chip group is less than or equal to 2.0V; that is, the voltage difference among the overall voltage of the series-connected red LED chips 113, the overall voltage of the series-connected green LED chips 112, and the overall voltage of the series-connected blue LED chips 111 is less than or equal to 2.0V. Through the setting of the voltage difference, it is ensured that the voltages applied to the red LED chip group, green LED chip group, and blue LED chip group are similar, making the luminous intensity, brightness, etc. of the lamp cores of different colors uniform, reducing the color difference between different colors, and ensuring the stable working state of the entire light control partition 10, the stable heating state of each lamp core, and improving the overall stability and reliability. More preferably, the voltage difference between the red LED chip group, green LED chip group, and blue LED chip group is less than or equal to 1.0V.

[0051] In some embodiments, the loop distribution of the red LED chip group is nested outside the loop distribution of the green LED chip group, and the loop distribution of the green LED chip group is nested outside the square distribution of the blue LED chip group; that is, the loop distribution of the red LED chip 113 is nested outside the loop distribution of the green LED chip 112, and the loop distribution of the green LED chip 112 is nested outside the square distribution of the blue LED chip 111. Moreover, the voltages of the red LED chip group, the green LED chip group, and the blue LED chip group are all greater than or equal to 12V; that is, the total voltage of the red LED chips 113, the total voltage of the green LED chips 112, and the total voltage of the blue LED chips 111 are all greater than or equal to 12V.

[0052] The loop distribution of the red LED chips 113, the loop distribution of the green LED chips 112, and the square distribution of the blue LED chips 111 can be nested in equal proportion, making the overall shape symmetrical, achieving a progressive layering of each color, and thus achieving a uniform mixing effect; the loop distribution of the red LED chips 113, the loop distribution of the green LED chips 112, and the square distribution of the blue LED chips 111 can also have a certain angle, preferably less than 30 degrees, which can increase the overlap degree of the distribution areas of the lamp cores of each color, thereby improving the mixing degree of the emitted light, reducing the local intensity difference, making the light more uniform, and weakening the halo effect.

[0053] It can ensure that the light-emitting control partition 10 emits light with sufficient intensity and brightness, and at the same time ensure that the lamp cores can stably emit light, thereby reducing the phenomenon of large local temperature difference caused by unstable lamp cores, reducing power loss, and improving the overall energy efficiency and stability. Specifically, the currents of the three colors can be controlled and adjusted separately. Under the low-current conditions of a low-gray-scale picture, the color accuracy can be accurately controlled, and the light-emitting control of the partition and the display picture quality effect can be effectively improved.

[0054] Combined with reference Figure 3 、 Figure 4 and Figure 5, preferably, the distribution patterns formed by the LED chips of the red LED chip group, the green LED chip group, and the blue LED chip group are nested with each other, so as to ensure uniform mixing of red, green, and blue and reduce color difference; specifically, the circular distribution formed by the red LED chips 113 nests the circular distribution formed by the green LED chips 112, and the circular distribution formed by the green LED chips 112 nests the square distribution formed by the blue LED chips 111, ensuring that the light emitted by the square blue LED chips 111 nested inside can be mixed with the light emitted by the diverging circular red LED chips 113 from both the inside and the outside, and can also be mixed with the light emitted by the diverging circular green LED chips 112 from both the inside and the outside, improving the mixing uniformity between different colors.

[0055] In some embodiments, a phosphor or a fluorescent glue 115 is coated on the light-emitting chip group 11; the light-emitting chip group is a blue LED chip group, and the blue LED chips 111 in the blue LED chip group are connected in series; alternatively, the light-emitting chip group includes a blue LED chip group and a green LED chip group, the blue LED chips 111 in the blue LED chip group are connected in series and are arranged in a square distribution on the chip mounting surface; the green LED chips 112 in the green LED chip group are connected in series and are arranged in a circular distribution on the chip mounting surface; the circular distribution of the green LED chip group nests outside the square distribution of the blue LED chip group.

[0056] The light-emitting chip group can be a fluorescent group, that is, the light-emitting chip group can be a blue LED chip group of the same color, and a phosphor or a fluorescent glue 115 is coated on the blue LED chip group; the light-emitting chip group can also be a combination of a blue LED chip group and a green chip group, and a phosphor or a fluorescent glue 115 is coated on both the blue LED chip group and the green chip group.

[0057] Among them, when the light-emitting chip group is a combination of a blue LED chip group and a green chip group, the blue LED chips 111 in the blue LED chip group are connected in series and are arranged in a square distribution on the chip mounting surface; the green LED chips 112 in the green LED chip group are connected in series and are arranged in a circular distribution on the chip mounting surface; the circular distribution of the green LED chip group nests outside the square distribution of the blue LED chip group; in addition, the number ratio of the blue LED chips 111 to the green LED chips 112 is preferably 4:5. The color of the diverging mixed light can be adjusted by mixing blue light and green light, and under the action of the phosphor or the fluorescent glue 115, white light or light of a specific color can be output; at the same time, the nested circular distribution setting can make the blue light and the green light mix evenly, ensuring the stability and light efficiency of the light.

[0058] A blue LED chip 111 of the same color can be arranged in the light control partition 10 to emit a single blue light, and then the light emitted by the monochromatic light is converted into light of different colors through the phosphor in the phosphor or phosphor glue 115 to achieve the output of white light or light of a specific color. A blue LED chip group and a green LED chip group connected in series can also be arranged in the light control partition 10 to emit blue light and green light respectively, and then the emitted light is converted into light of different colors through the phosphor in the phosphor or phosphor glue 115 to achieve the output of white light or light of a specific color. Further, when the phosphor is coated on the light-emitting chip group 11, the thickness of the phosphor is 50 - 300 μm; when the phosphor glue 115 is coated on the light-emitting chip group 11, the thickness of the phosphor glue 115 is 0.15 - 0.40 mm.

[0059] The phosphor can directly absorb light and thus be converted into light of other colors; to improve color uniformity, the thickness of the phosphor is preferably 80 - 150 μm; the type and particle size of the phosphor can be selected according to actual needs. To emit different colors, multiple phosphors can be mixed in the required proportion and coated on the wick. When coating the phosphor, an encapsulation glue can be added simultaneously to bond the phosphor to the wick. The encapsulation glue can be a transparent optical glue 3, which can protect the wick while fixing the phosphor; specifically, the thickness of the transparent optical glue 3 is greater than the thickness of the wick, which can immerse the wick and provide better protection. At the same time, the phosphor in the phosphor or phosphor glue 115 is preferably evenly distributed beside the wick instead of completely covering the wick, preventing the light emitted by the wick from being completely covered, resulting in poor absorption and conversion effects of the phosphor.

[0060] The phosphor glue 115 is a glue containing phosphor, which can be common commercially available products such as Mini LED fluorescent thin film glue or Mini LED fluorescent film UV glue. Specifically, a layer of glue containing phosphor is evenly coated on the wick. After absorbing the light emitted by the wick, the phosphor is excited and mixed with the light emitted by the wick to show different colors.

[0061] The color of the phosphor in the phosphor glue 115 can be selected according to the color of the wick and the color to be emitted, or it can be a phosphor mixed with multiple colors in the required proportion; the thickness of the phosphor glue 115 is preferably 0.15 - 0.40 mm, which can ensure that enough phosphor is coated on the LED chips of the same color, and the glue therein not only plays an adhesive role but also has a certain protective effect, which can prevent the wick from being damaged by the outside; the glue in the phosphor glue 115 is transparent to facilitate the excitation of the phosphor, the reflection of light, and the emission of light.

[0062] In some embodiments, an electrode pad 12 is provided at the bottom of the light-emitting chip group 11, and the light-emitting chip group 11 is disposed on the chip mounting surface through the electrode pad 12; alternatively, the light-emitting chip group 11 is directly connected to the chip mounting surface.

[0063] Specifically, the light-emitting chip group 11 can be encapsulated by MIP (Micro LED in Package). After encapsulating the light-emitting chip group 11 and the electrode pad 12 at the bottom, it is then arranged on the chip mounting surface for overall encapsulation, so that the composed Mini backlight module can independently drive the light-emitting chip groups 11 of different light control partitions 10, improving the light control effect, and being overall miniaturized, and can be applied to miniature, ultra-thin, and lightweight devices, such as micro projectors, AR glasses, etc. Alternatively, the light-emitting chip group 11 can be directly arranged on the chip mounting surface by COB (Chip on Board). Specifically, the light-emitting chip group 11 can be directly soldered on the chip mounting surface, and the Mini backlight module is obtained through overall encapsulation, which can simplify the preparation process of the Mini backlight module and can also make the light spot uniform and improve the light efficiency.

[0064] On the side of the circuit board 1 away from the chip mounting surface, the electrodes of the light-emitting chip group 11 can be led out and connected to an external power supply through the electrodes, so as to supply power to the light-emitting chip group 11.

[0065] With reference to Figure 7 、 Figure 8 and Figure 9 , when the light-emitting chip group 11 of a single light control partition 10 is a set composed of monochromatic LED chips plus the setting of the fluorescent glue 115. Specifically, when the light-emitting chip group 11 only includes a blue LED chip group, four series-connected blue LED chips 111 are distributed in a square in the light control partition 10, and the distance between adjacent blue LED chips 111 is equal to ensure uniform emitted light.

[0066] In some embodiments, a transparent optical glue 3 is poured on the light-emitting chip group 11, and the thickness of the transparent optical glue 3 is higher than the height of the light-emitting chip group 11 and lower than the height of the dam 2. The function of the transparent optical glue 3 is to separate the wick from the outside world, thereby protecting the wick. The thickness of the transparent optical glue 3 being higher than the height of the light-emitting chip group 11 and lower than the height of the dam 2 can ensure that the wick is completely immersed in the transparent optical glue 3, and the cost can be reduced by reducing the amount of the transparent optical glue 3 used. The transparent optical glue 3 is also an optical clear adhesive (OCA), which is a highly transparent optical glue with a light transmittance of more than 90%. Common commercially available optical glues can be selected, which can play a good role in protecting the wick.

[0067] In some embodiments, the cross-sectional width of the dam 2 decreases in the direction away from the chip mounting surface. The function of the dam 2 is to reflect the light source emitted by the square light-emitting chip group 11 and the large-angle stray light on the dam 2, reflect the stray light to the area above the circuit substrate 1, reduce the stray light loss, and form a uniform square light spot emitted upward, improve the light concentration of each light-controlling partition 10; at the same time, reduce the radiation energy of the light-controlling partition 10 penetrating into the adjacent light-controlling partition 10, thereby reducing the occurrence of light crosstalk and weakening the halo phenomenon.

[0068] The cross-sectional width of the dam 2 decreases in the direction away from the chip mounting surface, which can facilitate the reflection of stray light to the area above the circuit substrate 1 to form a uniform square light spot emitted upward; in addition, the cross-sectional width of the dam 2 decreases in the direction away from the chip mounting surface, which is easier to implement in terms of technology. The dam 2 only needs to be processed by a simple dispensing process to easily form a peak-shaped structure with a large bottom surface and a small top surface, which meets the requirement that the cross-sectional width decreases in the direction away from the chip mounting surface and reduces the difficulty of processing.

[0069] Furthermore, the light-emitting chip group 11 also includes a packaging circuit substrate 114, and the wicks are all arranged on the packaging circuit substrate 114. The packaging circuit substrate 114 is connected to the circuit substrate 1 through the electrode pad 12, and is connected to the external power supply through the electrode led out from the circuit substrate 1 to control the opening and closing of the wicks and the current and voltage passed through.

[0070] A reflector, a diffuser, a membrane and a liquid crystal panel may also be provided on the circuit substrate 1. Specifically, the reflector is fixed to the circuit substrate 1 by means of gluing or snapping, or is installed around the LED chipset in a wrapping manner, and its function is to reflect the light scattered to the side and below by the LED chip to the light emitting direction, thereby improving the light utilization rate and reducing light loss. More specifically, the reflector is provided on the side or bottom of the LED chipset, at the junction of the LED chip and the phosphor layer (phosphor or phosphor glue 115), and is combined with the phosphor layer through transparent optical glue 3 to form a sealing structure.

[0071] The diffuser is located above the reflector, preferably with a certain space between it and the reflector, or separated by some supporting structure; specifically, the diffuser is above the light emitting chip group 11 and above the transparent optical adhesive 3. The diffuser is combined with the reflector to evenly diffuse the light reflected by the reflector through the optical diffusion structure of the spaced space, so that the light is more evenly distributed on the entire diffuser plane, providing a uniform light source for the subsequent optical film and liquid crystal panel.

[0072] The diaphragm may include a brightness enhancement film, which is disposed above the diffusion film and stacked with the diffusion film. Its function is to combine with the diffusion film to converge and organize the diffused light, improving the light extraction efficiency and brightness. Moreover, the brightness enhancement film is adjacent to the liquid crystal panel, providing uniform and bright backlight for the liquid crystal panel.

[0073] The liquid crystal panel is located at the top of the entire backlight module and is closely attached to the diaphragm below or fixed and attached through structures such as a frame. Its function is to receive the light from the backlight module and control the light transmittance and polarization direction by the rotation of internal liquid crystal molecules, thereby realizing the display of images.

[0074] The second embodiment of the present application provides a method for manufacturing a Mini backlight module as described in the first embodiment or any of its implementation manners. The method for manufacturing the Mini backlight module is to fix the light-emitting chip group 11 on the chip mounting surface, and then evenly divide the chip mounting surface into two or more square light control partitions 10 by means of a plurality of the dams 2, and finally obtain the Mini backlight module through overall encapsulation; or, the method for manufacturing the Mini backlight module is to encapsulate the light-emitting chip group 11 first, then fix it on the chip mounting surface, and then evenly divide the chip mounting surface into two or more square light control partitions 10 by means of a plurality of the dams 2, and finally obtain the Mini backlight module through overall encapsulation. Specifically, the fixing method of the light-emitting chip group 11 can be mounting plus wire bonding or welding, electrically connecting the circuit board 1 to the light-emitting chip group 11, and the overall encapsulation can be performed using transparent silicone.

[0075] Fixing the light-emitting chip group 11 on the chip mounting surface, then evenly dividing the chip mounting surface into two or more square light control partitions 10 by means of a plurality of the dams 2, and finally obtaining the Mini backlight module through overall encapsulation is the COB process. This process can simplify the operation steps and processes of the manufacturing method, and can also make the light spot uniform and improve the light efficiency.

[0076] When the light-emitting chip group 11 of a single light control partition 10 includes a group of red LED chips 113, a group of green LED chips 112, and a group of blue LED chips 111, directly fix the light-emitting chip groups 11 of multiple required light control partitions 10 on the chip mounting surface, and then pour the dam 2 material on the chip mounting surface to form the dams 2 to divide the chip mounting surface, ensuring that the number of the group of red LED chips 113, the group of green LED chips 112, and the group of blue LED chips 111 included in the light-emitting chip group 11 of each light control partition 10 is the same or a set multiple, and then perform overall encapsulation to obtain the Mini backlight module.

[0077] When the light-emitting chip group 11 of a single light control partition 10 only includes LED chip groups of the same color, directly fix the light-emitting chip groups 11 of multiple required light control partitions 10 on the chip mounting surface, and then pour the dam 2 material on the chip mounting surface to form the dam 2 to divide the chip mounting surface, ensuring that the number of LED chip groups included in the light-emitting chip group 11 of each light control partition 10 is the same or a set multiple. Then, apply phosphor or phosphor glue 115, and finally perform overall encapsulation to obtain the Mini backlight module.

[0078] After encapsulating the light-emitting chip group 11, fix it on the chip mounting surface, and then evenly divide the chip mounting surface into two or more square light control partitions 10 through several dams 2. Finally, obtain the Mini backlight module through overall encapsulation, which is the MIP process. This process can enable the manufactured Mini backlight module to accommodate more light-emitting chip groups 11, thereby enhancing the brightness, or being applicable to ultra-thin, lightweight, and miniature devices, and can independently drive the light-emitting chip groups 11 of different light control partitions 10, with good light control effect. Specifically, the fixing method of the light-emitting chip group 11 on the chip mounting surface after encapsulation can be welding, electrically connecting the circuit board 1 to the light-emitting chip group 11, and the overall encapsulation can be performed using transparent silicone.

[0079] When the light-emitting chip group 11 of a single light control partition 10 includes a red LED chip group 113, a green LED chip group 112, and a blue LED chip group 111, encapsulate the light-emitting chip group 11 of a single light control partition 10 including the red LED chip group 113, the green LED chip group 112, the blue LED chip group 111, and the corresponding electrode pads 12 to obtain the LED chip unit of a single light control partition 10. Then, fix several required LED chip units on the chip mounting surface, and then pour the dam 2 material on the chip mounting surface to form the dam 2 to divide the chip mounting surface, ensuring that the light-emitting chip group 11 of each light control partition 10 is one or several LED chip units. Then, perform overall encapsulation to obtain the Mini backlight module.

[0080] When the light-emitting chip group 11 of a single light control partition 10 is a fluorescent group, encapsulate the light-emitting chip group 11 of a single light control partition 10 and the corresponding electrode pads 12 to obtain the LED chip unit of a single light control partition 10. Then, fix several required LED chip units on the chip mounting surface, and then pour the dam 2 material on the chip mounting surface to form the dam 2 to divide the chip mounting surface, ensuring that the light-emitting chip group 11 of each light control partition 10 is one or several LED chip units. Then, perform overall encapsulation to obtain the Mini backlight module.

[0081] When the light-emitting chip group 11 only includes LED chip groups of the same color, phosphor or phosphor glue 115 can be coated on the LED chip unit after the LED chip unit is encapsulated and before it is fixed on the chip mounting surface. After the LED chip unit is fixed on the chip mounting surface and before overall encapsulation, phosphor or phosphor glue 115 can also be coated again; or, phosphor or phosphor glue 115 is only coated on the LED chip unit after the LED chip unit is fixed on the chip mounting surface and before overall encapsulation.

[0082] When the light-emitting chip group 11 of a single light control partition 10 includes a red LED chip group 113, a green LED chip group 112, and a blue LED chip group 111, it is preferable to use the MIP process to prepare the Mini backlight module. After the light-emitting chip group 11 is encapsulated and cut, it is set on the chip mounting surface of the circuit board 1. The electrodes after the lamp cores of the light-emitting chip group 11 are connected in series are led out from the bottom of the circuit board 1 and then connected to an external power supply for power-on, which can greatly improve the mounting yield and reduce the chip material cost through the MIP process.

[0083] Specifically, when the light-emitting chip group 11 of a single light control partition 10 includes a red LED chip group, a green LED chip group, and a blue LED chip group, the four electrodes led out by the MIP common anode design are V+, R-, G-, B-, and the four electrodes led out by the MiP common cathode design are R+, G+, B+, COM-, where V+ refers to the common anode and COM- refers to the common cathode; R is the red LED chip 113, R+ is the anode representation of the red LED chip 113, and R- is the cathode representation of the red LED chip 113; similarly, G+ is the anode representation of the green LED chip 112, G- is the cathode representation of the green LED chip 112; B+ is the anode representation of the blue LED chip 111, and B- is the cathode representation of the blue LED chip 111.

[0084] When the light-emitting chip group 11 of a single light control partition 10 is a fluorescent group, that is, a group composed of LED chips plus the setting of phosphor or phosphor glue 115, the white light MiP process or the white light COB process can be used, that is, the four electrodes are V+, X-, X-, X-, or X+, X+, X+, COM-, where X- is the cathode representation of the LED chips of the same color, X+ is the anode representation of the LED chips of the same color, V+ refers to the common anode, and COM- refers to the common cathode. Further, when using the MIP process to prepare the Mini backlight module, electrode pads 12 of the light-emitting chip group 11 are provided at the positions corresponding to the four corners of the light control partition 10. That is, four electrode pads 12 are connected and set at the bottom of each light control partition 10, and the positions of the electrode pads 12 correspond to the four corners of the light control partition 10, which can be used to lead out the above four electrodes and prevent the mutual entanglement between the four electrodes, affecting the current transmission.

[0085] The third embodiment of the present application provides a display device, which includes a Mini backlight module as described in the first embodiment or any one of its implementation manners.

[0086] The display device can specifically be an ultra-high definition TV, an LED display screen, a monitor, a laptop, a mobile phone, a tablet computer, etc., and provides a high-quality picture display effect through the Mini backlight module.

[0087] In this embodiment, the Mini backlight module is connected to the circuit board 1 through an external power supply, so as to energize the lamp cores on different light control partitions 10, thereby emitting lights of different colors, reducing the light scattering phenomenon and improving the low gray-scale picture distortion phenomenon. After passing through the diffusion of the diffusion sheet and the brightening of the brightening sheet, it reaches the liquid crystal panel, making the color performance uniform, without color difference, improving the display effect, and further performing high-precision display for the display device, improving the user experience.

[0088] In summary, the present application provides a Mini backlight module, a preparation method and a display device. The Mini backlight module includes a backlight module main body and a dam. One side of the circuit board of the backlight module main body is a chip mounting surface. The dam is arranged on the chip mounting surface and evenly divides it into multiple light control partitions. The light control partitions are provided with lamp cores connected in series. After being connected in series, the voltages of the lamp cores are the same, which can maintain the consistency of the lamp cores, making the color performance uniform, without color difference, improving the display effect, and improving the low gray-scale picture distortion phenomenon; at the same time, the lamp cores are arranged in a square or loop shape, which can form a uniform square light spot, and the square light spots emitted between adjacent light control partitions are separated by the dam, which can weaken the halo phenomenon and further improve the display image quality of the Mini backlight module.

[0089] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the examples of the present application.

Claims

1. A Mini backlight module, characterized in that, Comprising: A backlight module main body, the backlight module main body includes a circuit substrate, and one side of the circuit substrate is a chip mounting surface; A plurality of dams, and the plurality of dams are all protrudingly arranged on the chip mounting surface, and the chip mounting surface is evenly divided into two or more square light control partitions by the dams; Among them, light-emitting chip groups are provided on two or more of the light control partitions, and the light-emitting chip groups are arranged in a square or rectangular shape on the chip mounting surface.

2. The Mini backlight module according to claim 1, wherein The light-emitting chip group includes a red LED chip group, a green LED chip group, and a blue LED chip group; the red LED chips in the red LED chip group are connected in series and are arranged in a rectangular shape on the chip mounting surface; the green LED chips in the green LED chip group are connected in series and are arranged in a rectangular shape on the chip mounting surface; the blue LED chips in the blue LED chip group are connected in series and are arranged in a square shape on the chip mounting surface; the number ratio of the red LED chips, the green LED chips, and the blue LED chips is 6:5:

4.

3. The Mini backlight module according to claim 2, wherein, The rectangular distribution of the red LED chip group is nested outside the rectangular distribution of the green LED chip group, and the rectangular distribution of the green LED chip group is nested outside the square distribution of the blue LED chip group; and the voltages of the red LED chip group, the green LED chip group, and the blue LED chip group are all greater than or equal to 12V.

4. The Mini backlight module according to claim 1, wherein A phosphor or fluorescent glue is coated on the light-emitting chip group; the light-emitting chip group is a blue LED chip group, and the blue LED chips in the blue LED chip group are connected in series; Or, the light-emitting chip group includes a blue LED chip group and a green LED chip group, the blue LED chips in the blue LED chip group are connected in series and are arranged in a square shape on the chip mounting surface; the green LED chips in the green LED chip group are connected in series and are arranged in a rectangular shape on the chip mounting surface; the rectangular distribution of the green LED chip group is nested outside the square distribution of the blue LED chip group.

5. The Mini backlight module according to claim 4, wherein When the phosphor is coated on the light-emitting chip group, the thickness of the phosphor is 50 - 300μm; when the fluorescent glue is coated on the light-emitting chip group, the thickness of the fluorescent glue is 0.15 - 0.40mm.

6. The Mini backlight module according to claim 1, wherein An electrode pad is provided at the bottom of the light-emitting chip group, and the light-emitting chip group is arranged on the chip mounting surface through the electrode pad; or, the light-emitting chip group is directly connected to the chip mounting surface.

7. The Mini backlight module according to claim 2 or claim 5, characterized in that, A transparent optical glue is poured on the light-emitting chip group, and the thickness of the transparent optical glue is higher than the height of the light-emitting chip group and lower than the height of the dam.

8. The Mini backlight module according to claim 1, wherein, The cross-sectional width of the dam decreases in the direction away from the chip mounting surface.

9. A method for preparing a Mini backlight module according to any one of claims 1 to 8, characterized in that, The preparation method of the Mini backlight module is to fix the light-emitting chip group on the chip mounting surface, then evenly divide the chip mounting surface into two or more square light control partitions by a plurality of the dams, and finally obtain the Mini backlight module through overall encapsulation; Alternatively, the method for manufacturing the Mini backlight module is as follows: after encapsulating the light-emitting chip group, it is fixed on the chip mounting surface, and then the chip mounting surface is evenly divided into two or more square light control partitions by a plurality of the dams, and finally the Mini backlight module is obtained through overall encapsulation.

10. A display device, characterized in that, It includes the Mini backlight module according to any one of claims 1 to 8.

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