Semiconductor package mold magazine

Abstract

The present application relates to the technical field of semiconductor processing, and particularly relates to a semiconductor packaging mold rack. The technical scheme of the present application is as follows: a rack is provided, handles are symmetrically arranged on one side of the rack, a clamping mechanism is further provided, the clamping mechanism is arranged in the rack, the clamping mechanism comprises telescopic racks, a plurality of telescopic racks are movably connected in the rack, sliding tubes are fixedly connected to two ends of the plurality of telescopic racks, the sliding tubes are slidably connected to the rack, elastic members A are arranged between the sliding tubes and the rack, and clamping plates are symmetrically slidably connected to the inner walls of the plurality of telescopic racks. According to the present application, when the telescopic racks drive the clamping plates to rotate, the two adjacent clamping plates slide in close contact with the surface of the elliptic cylinder, the gap between the two clamping plates can be increased, so that the semiconductor can be conveniently placed between the two clamping plates, and according to the design of the cutting mechanism, the cutting knife can conveniently cut the packaging waste, thereby saving time and effort.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a semiconductor packaging mold rack. BACKGROUND

[0002] With the increasingly advanced integrated circuit process, great challenges are put forward to the technology and cost, and the packaging industry has realized the transformation from traditional packaging to advanced packaging. The main functions of traditional packaging are to provide mechanical protection, heat dissipation path and to ensure the stability of mechanical and electrical connection for chips.

[0003] In the prior art, when the semiconductor is packaged, it is usually clamped and fixed by two layers of racks. During the process of placing the semiconductor, the semiconductor needs to be accurately positioned by a customized base, and then placed in a packaging device for packaging. After the packaging is completed, the upper rack needs to be removed by the worker, the lower rack is placed on the hydraulic cutting device to cut off the packaging waste, and then the semiconductor is taken down, which is time-consuming and laborious. SUMMARY

[0004] In order to overcome the shortcomings in the prior art, the technical problem to be solved is to provide a semiconductor packaging mold rack.

[0005] The technical scheme of the present application is: a semiconductor packaging mold rack, comprising a rack, a handle is symmetrically arranged on one side of the rack, and a clamping mechanism is further included, the clamping mechanism is arranged in the rack, and the clamping mechanism comprises a telescopic frame, a plurality of telescopic frames are movably connected in the rack, sliding tubes are fixedly connected to both ends of the plurality of telescopic frames, the sliding tubes are slidably connected with the rack, elastic members A are arranged between the sliding tubes and the rack, clamping plates are symmetrically slidably connected to the inner walls of the plurality of telescopic frames, elastic members B are arranged between the clamping plates and the telescopic frames, a cutting mechanism is connected to the upper side of the rack, and the cutting mechanism comprises a plurality of cutters arranged on the upper side of the rack.

[0006] As a preferred technical scheme of the present application, the clamping mechanism further comprises an oval cylinder, four groups of the oval cylinders are arranged in the rack, and the clamping plates are used in cooperation with the oval cylinders.

[0007] As a preferred technical scheme of the present application, the cutting mechanism further comprises a cutting frame, a clamping block is fixedly connected to the bottom of the cutting frame, a clamping groove matched with the clamping block is formed in the rack, elastic extension rods are symmetrically fixedly connected to the top of the cutting frame, a rectangular frame is fixedly connected to the top end of the elastic extension rods, and a plurality of elastic members C are symmetrically arranged between the top of the plurality of cutters and the rectangular frame.

[0008] As a preferred technical solution of the present invention, the cutting mechanism also includes a limiting frame, the tops of several of the cutters are fixedly connected to the limiting frame, several mounting seats are fixedly connected to the cutting frame, and elastic wedge blocks are slidably connected in several of the mounting seats, and the elastic wedge blocks are used in conjunction with the limiting frame.

[0009] As a preferred technical solution of the present invention, the inclination angle of the upper inclined surface of the elastic wedge block is smaller than that of the lower inclined surface.

[0010] As a preferred technical solution of the present invention, a grinding strip is also included. The outer walls of several of the cutters are penetrated with special-shaped grooves, and the grinding strips are slidably connected in the special-shaped grooves.

[0011] As a preferred technical solution of the present invention, it also includes a vertical shaft, the top end of the grinding strip is fixedly connected to the vertical shaft, the top end of the vertical shaft passes through the special-shaped groove of the cutter, the top of the outer wall of the vertical shaft is fixedly connected to a sliding shaft, and several guide seats are fixedly connected to the cutting frame, and the outer walls of several of the guide seats are provided with guide grooves for use with the sliding shaft.

[0012] As a preferred technical solution of the present invention, it also includes a rotating shaft, which is symmetrically rotatably connected in the material rack, the handle is fixedly connected to the rotating shaft, an elastic member D is provided between the handle and the material rack, a guide frame is symmetrically fixedly connected to one side of the outer wall of the rotating shaft, and a plurality of wedge bars are slidably connected in the material rack, and a convex shaft used in conjunction with the guide frame is fixedly connected to one side of the plurality of wedge bars.

[0013] As a preferred technical solution of the present invention, an annular groove is formed on the outer wall of the sliding tube, a connecting ring is sleeved on the annular groove, and a protruding shaft used in conjunction with the wedge strip is fixedly connected to one side of the connecting ring.

[0014] As a preferred technical solution of the present invention, it also includes wedge-shaped columns. Four groups of the wedge-shaped columns are fixedly connected in the material rack through a transverse axis, and the clamping plate is used in conjunction with the wedge-shaped columns.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention adopts the design of the telescopic frame and the clamping plate. When the telescopic frame drives the clamping plate to rotate, the two adjacent clamping plates slide in contact with the surface of the elliptical cylinder, and the gap between the two clamping plates can be increased, thereby facilitating the placement of the semiconductor between the two clamping plates. The design of the cutting mechanism can conveniently enable the cutter to cut the packaging waste, saving time and effort.

[0017] 2. Through the design of the cutting mechanism, when the rectangular frame is pressed downward, the limit frame can contact the upper inclined surface of the elastic wedge block, thereby achieving the effect of storing force on the elastic part C. By storing force on the elastic part C, the cutter can be quickly lowered to cut the packaging waste. Compared with the existing technology of cutting packaging waste by hydraulic equipment, it greatly saves costs and improves production efficiency.

[0018] 3. Through the design of the grinding bar, the present invention can make the grinding bar perform horizontal reciprocating motion during the descent process by driving the sliding shaft along the guide groove of the corresponding guide seat when the cutter descends quickly to cut the packaging waste, thereby effectively improving the grinding effect of the incision and preventing sharp protrusions on the incision from injuring the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0020] Figure 2 Schematic diagram of the cutting mechanism of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the clamping mechanism of the present invention;

[0022] Figure 4 It is a structural schematic diagram of the telescopic frame of the present invention;

[0023] Figure 5 This is a schematic diagram of the installation of the telescopic frame of the present invention;

[0024] Figure 6 This is a schematic diagram of the installation of the elliptical column of the present invention;

[0025] Figure 7 This is a schematic diagram of the installation of the card block of the present invention;

[0026] Figure 8 This is a schematic diagram of the installation of the limit frame of the present invention;

[0027] Figure 9 This is a schematic diagram of the installation of the elastic wedge block of the present invention;

[0028] Figure 10 This is a schematic diagram of the installation of the wedge strip of the present invention;

[0029] Figure 11 This is a schematic diagram of the installation of the wedge-shaped column of the present invention.

[0030] Marked in the figure: 1-material rack, 101-handle, 201-telescopic rack, 202-sliding tube, 203-splint, 204-cutter, 301-elliptical column, 401-cutting rack, 402-block, 501-elastic telescopic rod, 502-rectangular rack, 601-limiting rack, 602-mounting seat, 603-elastic wedge block, 701-grinding strip, 702-vertical axis, 703-guide seat, 801-rotating shaft, 802-guide rack, 803-wedge strip, 901-connecting ring, 1001-wedge column. DETAILED DESCRIPTION

[0031] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this does not limit the present invention. Example

[0032] A semiconductor packaging mold material frame, such as Figures 1-6 As shown, it includes a material rack 1, a handle 101 is symmetrically provided on one side of the material rack 1, and a clamping mechanism is provided inside the material rack 1, and the clamping mechanism includes a telescopic rack 201, and four telescopic racks 201 are movably connected inside the material rack 1, and the four telescopic racks 201 are distributed in a rectangular shape. Both ends of the four telescopic racks 201 are fixed with sliding tubes 202, and the sliding tubes 202 are slidably connected to the material rack 1, and an elastic member A is provided between the sliding tube 202 and the material rack 1, and the elastic member A is a compression spring. The left and right sides of the inner walls of the four telescopic racks 201 are symmetrically slidably connected with splints 203, and an elastic member B is provided between the splints 203 and the telescopic rack 201, and the elastic member B is a reset spring. The upper side of the material rack 1 is connected with a cutting mechanism, and the cutting mechanism is used to cut off the packaging waste. The cutting mechanism includes four cutters 204 provided on the upper side of the material rack 1.

[0033] like Figure 6 As shown, the clamping mechanism also includes an elliptical cylinder 301. Four groups of elliptical cylinders 301 are arranged in the material rack 1, with two in each group. The four groups of elliptical cylinders 301 are symmetrically arranged about the middle of the four telescopic frames 201, and the clamping plate 203 is used in conjunction with the elliptical cylinder 301.

[0034] At the beginning, the four telescopic frames 201 are in a horizontal state, and the elastic members A and the elastic members B are in a released state. Taking the telescopic frame 201 close to the right handle 101 as an example, first of all, the staff rotates the telescopic frame 201 upward, and the telescopic frame 201 rotates around the connection of the sliding pipe 202 as the center, and drives the four clamping plates 203 in it to rotate. At this time, the two adjacent clamping plates 203 are in contact with the outer wall of the corresponding elliptical cylinder 301 and slide. As the telescopic frame 201 gradually rotates upward, the two adjacent clamping plates 203 are extruded by the outer wall of the elliptical cylinder 301 and slide away from each other, and the elastic member B is contracted under the action of force. At this time, the gap between the two adjacent clamping plates 203 increases, so as to facilitate the placement of the semiconductor between the two adjacent clamping plates 203. At this time, the staff places the two sides of the semiconductor between the two adjacent clamping plates 203, respectively. The semiconductor slides down under the influence of gravity and comes into contact with the telescopic frame 201. Then the staff slowly rotates the telescopic frame 201 back to its original position. The telescopic frame 201 drives the four clamping plates 203 in it to rotate, and the two adjacent clamping plates 203 slide in contact with the outer wall of the corresponding elliptical cylinder 301. As the telescopic frame 201 gradually rotates downward, the extrusion force of the outer wall of the elliptical cylinder 301 on the two adjacent clamping plates 203 decreases, the elastic member B is released, and the two adjacent clamping plates 203 are slid back to their original positions. The four clamping plates 203 in the telescopic frame 201 cooperate with each other to clamp the left and right sides of the semiconductor. Then the above steps are repeated for the remaining three shelves 1 to complete the placement and fixation of the semiconductor. Then the shelf 1 is placed in the stamping and packaging device (the stamping and packaging device is prior art and will not be described here), and the stamping and packaging are completed. Embodiments

[0035] As shown in Figure 5-Figure 6 , the cutting mechanism further comprises a cutting frame 401, and the bottom of the cutting frame 401 is fixedly connected with a clamping block 402. The clamping block 402 is L-shaped, and the top of the shelf 1 is provided with a clamping groove matched with the clamping block 402. The top of the cutting frame 401 is fixedly connected with elastic telescopic rods 501 in a symmetrical manner, the top of each of the four cutting knives 204 is fixedly connected with a rectangular frame 502, and a plurality of elastic members C are arranged between the top of each of the four cutting knives 204 and the rectangular frame 502 in a symmetrical manner. The elastic member C is an elastic telescopic shaft.

[0036] As shown in Figure 8-Figure 9 , the cutting mechanism further comprises a limiting frame 601, and the top of each of the four cutting knives 204 is fixedly connected with the limiting frame 601. The cutting frame 401 is fixedly connected with four mounting seats 602, and each of the four mounting seats 602 is horizontally and slidably connected with an elastic wedge block 603. The elastic wedge block 603 is matched with the limiting frame 601, and the inclination angle of the upper inclined surface of the elastic wedge block 603 is smaller than that of the lower inclined surface.

[0037] As shown in Figure 8-Figure 9As shown, a grinding strip 701 is also included. The outer walls of the four cutters 204 are penetrated with a special-shaped groove, and the grinding strip 701 is slidably connected in the special-shaped groove. The grinding strip 701 is used to grind the cut of the packaging waste.

[0038] like Figure 8-Figure 9 As shown, it also includes a vertical shaft 702, the top of the grinding strip 701 is fixedly connected to the vertical shaft 702, the top of the vertical shaft 702 passes through the special-shaped groove of the cutter 204, the top of the outer wall of the vertical shaft 702 is fixedly connected to a sliding shaft, and four guide seats 703 are fixedly connected to the cutting frame 401. The outer walls of the four guide seats 703 are all provided with guide grooves for use with the sliding shafts. The sliding of the sliding shafts along the guide grooves can make the grinding strip 701 slide back and forth horizontally.

[0039] like Figure 10 As shown, it also includes a rotating shaft 801, which is symmetrically rotated and connected inside the material rack 1, and the handle 101 is fixedly connected to the rotating shaft 801. An elastic member D is provided between the handle 101 and the material rack 1, and the elastic member D is a torsion spring. A guide frame 802 is symmetrically fixedly connected to one side of the outer wall of the rotating shaft 801, and four wedge bars 803 are slidably connected inside the material rack 1. The four wedge bars 803 are arranged in a one-to-one correspondence with the four telescopic frames 201, and a convex shaft used in conjunction with the guide frame 802 is fixedly connected to the middle part of one side of the four wedge bars 803.

[0040] like Figure 11 As shown, an annular groove is provided on the outer wall of the sliding tube 202, and a connecting ring 901 is sleeved on the annular groove. A protruding shaft that cooperates with the wedge bar 803 is fixed to one side of the connecting ring 901. When the wedge bar 803 is lifted and slid upward, the two adjacent connecting rings 901 can slide away from each other.

[0041] like Figure 11 As shown, wedge-shaped columns 1001 are also included. Four groups of wedge-shaped columns 1001 are fixedly connected to the material rack 1 through a horizontal axis, with two in each group. The four groups of wedge-shaped columns 1001 are symmetrically arranged about the four telescopic frames 201, and the splints 203 are used in conjunction with the wedge-shaped columns 1001.

[0042] Initially, the cutting frame 401 is in a separated state from the material frame 1. After the stamping and packaging are completed, the packaging waste on the semiconductor needs to be cut off. First, the material frame 1 is placed on the cutting base (the cutting base is a prior art and will not be described here). The staff moves the cutting frame 401 to the upper side of the material frame 1 through the handle on the cutting frame 401, and inserts the card block 402 into the card slot of the material frame 1, thereby completing the card connection between the cutting frame 401 and the material frame 1. Then the staff presses the rectangular frame 502, and the rectangular frame 502 drives the elastic telescopic rod 501 to contract, and applies downward pressure to the four cutters 204 through the elastic member C. The cutter 204 applies downward pressure to the upper inclined surface of the corresponding elastic wedge block 603 through the limit frame 601. It is worth noting that due to the elastic The wedge block 603 has an upper inclined surface angle characteristic, and the elastic force of the elastic wedge block 603 is relatively large. At this time, the downward pressure exerted by the limit frame 601 on the elastic wedge block 603 is not enough to make the elastic wedge block 603 shrink and slide. The limit frame 601 is restricted so that the corresponding cutter 204 cannot move downward. When the elastic member C shrinks to the limit, the downward pressure exerted by the limit frame 601 on the elastic wedge block 603 is greater than the elastic force of the elastic wedge block 603. The elastic wedge block 603 shrinks and slides and no longer contacts the limit frame 601. After the limit frame 601 is released from the restriction, the cutter 204 can move. At this time, the four cutters 204 are released by the elastic member C and fall quickly. The four cutters 204 respectively drive the grinding strips 701 therein to fall. After the cutter 204 falls, it will cut the semiconductor The upper packaging waste is cut off and continues to fall, and then the grinding bar 701 falls to the incision where the waste is cut off and grinds the incision. During the falling process of the grinding bar 701, the grinding bar 701 drives the corresponding vertical shaft 702 to fall, and the vertical shaft 702 drives the sliding shaft thereon to slide along the guide groove of the corresponding guide seat 703, thereby causing the vertical shaft 702 to drive the grinding bar 701 to slide back and forth horizontally. By making the grinding bar 701 slide back and forth horizontally, the grinding effect of the incision can be effectively improved. It is worth noting that due to the large elastic force of the elastic member B, the two adjacent clamping plates 203 can clamp the semiconductor. During the process of the cutter 204 cutting off the packaging waste and the grinding bar 701 grinding the incision, the semiconductor and the packaging waste can remain stable, and then the rectangular frame is released. 502, the elastic telescopic rod 501 is released to drive the rectangular frame 502 to lift and reset, and the rectangular frame 502 drives the four cutters 204 to lift and reset upward through the elastic member C. The four cutters 204 respectively drive the corresponding limit frame 601 and the grinding bar 701 to lift upward, and the grinding bar 701 drives the vertical shaft 702 to lift upward, and the vertical shaft 702 drives the sliding shaft to slide and reset along the guide groove of the guide seat 703, so that the grinding bar 701 grinds the incision again. By grinding the incision, the comfort of the staff in picking up the packaged semiconductor can be greatly improved, and the sharp protrusions on the incision can be prevented from injuring the staff. Then the limit frame 601 contacts and squeezes the lower inclined surface of the corresponding elastic wedge block 603. Due to the angle characteristics of the lower inclined surface of the elastic wedge block 603,The elastic wedge block 603 is forced to shrink and slide, and then the limit frame 601 passes over the elastic wedge block 603. After the elastic wedge block 603 is freed from the limit, it is released and slid back to its original position, thereby completing the cutting of the packaging waste. Then the staff separates the cutting frame 401 from the material frame 1 through the handle on the cutting frame 401, and then rotates the two handles 101 in opposite directions. The elastic member D is forced to shrink, and the handle 101 drives the corresponding guide frame 802 to rotate upward through the rotating shaft 801. The inner wall of the guide frame 802 squeezes the convex shaft of the adjacent wedge strip 803, causing the wedge strip 803 to lift and slide upward, and the inclined surface of the wedge strip 803 squeezes the protruding shaft of the adjacent connecting ring 901, causing the two adjacent connecting rings 901 to slide away from each other, thereby causing the telescopic frame 201 to expand to both sides, and the adjacent The two clamping plates 203 contact the inclined surfaces of the corresponding wedge-shaped columns 1001 and slide along the inclined surfaces of the wedge-shaped columns 1001. At this time, the two adjacent clamping plates 203 slide away from each other, and the elastic member B contracts under the force. The two adjacent clamping plates 203 release the semiconductor, and the semiconductor falls to the surface of the cutting table under its own weight. Then, the handle 101 is released, and the elastic member D is released to drive the two handles 101 to rotate and reset. The two handles 101 drive the two rotating shafts 801 to rotate and reset, thereby causing the wedge bar 803 to fall and reset. The wedge bar 803 no longer presses the protruding shaft of the connecting ring 901. The elastic member A drives the connecting ring 901 to slide and reset through the sliding tube 202, and drives the corresponding telescopic frame 201 to contract and reset, thereby restoring the two clamping plates 203, thereby completing the semiconductor packaging work.

[0043] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A semiconductor packaging mold material rack, comprising a material rack (1), wherein a handle (101) is symmetrically provided on one side of the material rack (1), characterized in that: The material rack (1) is provided with a clamping mechanism, and the clamping mechanism includes a telescopic frame (201). The material rack (1) is movably connected with a plurality of the telescopic frames (201). Both ends of the plurality of the telescopic frames (201) are fixed with sliding tubes (202). The sliding tubes (202) are slidably connected to the material rack (1). An elastic member A is provided between the sliding tubes (202) and the material rack (1). The left and right sides of the wall are symmetrically connected to each other in a sliding manner. An elastic member B is provided between the clamping plate (203) and the telescopic frame (201). The upper side of the material rack (1) is connected to a cutting mechanism. The cutting mechanism includes a plurality of cutters (204) provided on the upper side of the material rack (1). The clamping mechanism also includes an elliptical column (301). Four groups of the elliptical columns (301) are provided in the material rack (1). The clamping plate (203) cooperates with the elliptical column (301). The invention also comprises a rotating shaft (801), the rotating shaft (801) is symmetrically connected to the material rack (1), the handle (101) is fixedly connected to the rotating shaft (801), an elastic member D is provided between the handle (101) and the material rack (1), a guide frame (802) is symmetrically fixedly connected to one side of the outer wall of the rotating shaft (801), a plurality of wedge-shaped bars (803) are slidably connected to the material rack (1), and one side of the plurality of wedge-shaped bars (803) is fixedly connected to the outer wall of the rotating shaft (801). A convex shaft for use with the guide frame (802) is fixedly connected; an annular groove is formed on the outer wall of the sliding tube (202), a connecting ring (901) is sleeved on the annular groove, and a protruding shaft for use with the wedge strip (803) is fixedly connected to one side of the connecting ring (901); and wedge-shaped columns (1001) are also included. Four groups of the wedge-shaped columns (1001) are fixedly connected in the material rack (1) via a transverse axis, and the clamping plate (203) is used in conjunction with the wedge-shaped columns (1001).

2. The semiconductor packaging mold rack according to claim 1, wherein: The cutting mechanism further comprises a cutting frame (401), a clamping block (402) being fixedly connected to the bottom of the cutting frame (401), a clamping slot for use with the clamping block (402) being provided on the material frame (1), an elastic telescopic rod (501) being symmetrically fixedly connected to the top of the cutting frame (401), a rectangular frame (502) being fixedly connected to the top of the elastic telescopic rod (501), and a plurality of elastic members C being symmetrically arranged between the tops of the plurality of cutting knives (204) and the rectangular frame (502).

3. The semiconductor packaging mold rack according to claim 2, wherein: The cutting mechanism further comprises a limiting frame (601), the tops of the plurality of cutters (204) are fixedly connected to the limiting frame (601), the cutting frame (401) is fixedly connected to a plurality of mounting seats (602), the plurality of mounting seats (602) are slidably connected to elastic wedge blocks (603), and the elastic wedge blocks (603) are used in conjunction with the limiting frame (601).

4. The semiconductor packaging mold rack according to claim 3, wherein: The upper slope of the elastic wedge block (603) has an inclination angle smaller than that of the lower slope.

5. The semiconductor packaging mold rack according to claim 3, wherein: A grinding strip (701) is also included. A plurality of the outer walls of the cutters (204) are provided with special-shaped grooves, and the grinding strips (701) are slidably connected in the special-shaped grooves.

6. The semiconductor packaging mold rack according to claim 5, characterized in that: The cutting frame (401) further comprises a vertical shaft (702), the top end of the grinding strip (701) is fixedly connected to the vertical shaft (702), the top end of the vertical shaft (702) passes through the special-shaped groove of the cutting blade (204), the top of the outer wall of the vertical shaft (702) is fixedly connected to a sliding shaft, and the cutting frame (401) is fixedly connected to a plurality of guide seats (703), and the outer walls of the plurality of guide seats (703) are each provided with a guide groove for use with the sliding shaft.

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