Chip packaging mold heating system
Through the design of heat conduction heating devices and limit containers, combined with thermocouples and PID controllers, rapid and efficient heating of chip packaging molds is achieved, solving the problem of low heating efficiency in the prior art, and improving production efficiency and equipment utilization.
Patent Information
- Application Number
- CN202510305305.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2025-07-04
AI Technical Summary
In the prior art, the heating efficiency of chip packaging molds is low, resulting in a long idle time for packaging equipment, affecting production efficiency, and traditional oven heating methods take a long time and are seriously wasted electricity.
The heating platform of heat conduction heating devices and limit containers is adopted, combined with a thermocouple and a PID controller, and the power of the heat conduction heating device is adjusted in real time by real-time temperature to achieve rapid and uniform heating.
It shortens the heating time of the packaging mold, improves equipment utilization, reduces power consumption, ensures heating uniformity and accuracy, and meets the requirements of chip packaging process.
Smart Images
Figure CN120261337A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of semiconductor device manufacturing, and particularly to a heating system for a chip packaging mold. Background Art
[0002] In the current production process of IC (Integrated Circuit) packaging, i.e., chip packaging, the heating of the packaging mold usually depends on the heating system built in the packaging equipment, and the heating efficiency of this heating system for the packaging mold is low. Especially after each replacement of the packaging mold, a long time needs to be waited before the packaging mold completes the temperature rising process and can continue production, resulting in the inefficient utilization of the packaging equipment and a long sample processing cycle. Especially when multiple packaging molds need to be replaced on the same day, a temperature rising process of up to 2 hours must be waited after each replacement of the packaging mold, leading to too long idle time of the IC packaging equipment and seriously affecting the production efficiency.
[0003] In addition, a conventional oven can pre-heat the packaging mold offline, but the oven uses the heat convection heating method and cannot be in direct contact with the packaging mold, resulting in too long a temperature rising time and low heating efficiency. It is difficult to quickly raise the temperature of the packaging mold in a short time. If the packaging mold is placed in the oven for a long time for heating as a standby, it will cause power waste.
[0004] How to quickly and efficiently heat the chip packaging mold is a technical problem that needs to be solved urgently at present. Summary of the Invention
[0005] In view of this, the embodiments of the present disclosure provide a heating system for a chip packaging mold to solve the technical problem in the prior art that the chip packaging mold cannot be heated quickly.
[0006] To achieve the above object, the technical solution adopted by the present disclosure is:
[0007] The embodiments of the present disclosure provide a heating system for a chip packaging mold, and the heating system for the chip packaging mold includes: a heating platform, including a platform body, a heat conduction heating device uniformly laid on the platform body, and a limiting container located above the heat conduction heating device and capable of performing heat transfer with the heat conduction heating device, wherein the shape and size of the accommodating space of the limiting container are adapted to the chip packaging mold; a thermocouple, arranged on the surface of the platform body for measuring the surface temperature of the platform body; a controller, communicatively connected with the thermocouple, for determining the target power of the heat conduction heating device by using a PID control algorithm according to the real-time temperature of the heating platform measured by the thermocouple and a preset reference temperature; a switching device, communicatively connected with the controller and electrically connected with the heat conduction heating device, for controlling the heating power of the heat conduction heating device according to the target power generated by the controller.
[0008] In the embodiments of the present disclosure, the heat conduction heating device includes a heating tube, a ceramic heater, or a silicone heating pad.
[0009] In the embodiments of the present disclosure, the controller is an embedded device. The embedded device is provided with an input keyboard and a display screen, or the embedded device is provided with a touch screen.
[0010] In the embodiments of the present disclosure, the limiting container has a metal base, and the metal base can conduct heat transfer with the heat conduction heating device.
[0011] In the embodiments of the present disclosure, the limiting container includes a boundary expansion member. Through the boundary expansion member, the shape and size of the accommodation space of the limiting container can be adjusted to adapt to different models of chip packaging molds.
[0012] In the embodiments of the present disclosure, the preset reference temperature range is 170°C to 180°C.
[0013] In the embodiments of the present disclosure, the switching device includes a solid-state relay or a semiconductor switching device.
[0014] In the embodiments of the present disclosure, the controller is further configured to generate a stop heating signal when the real-time temperature is greater than or equal to the reference temperature, so that the switching device cuts off the power supply of the heat conduction heating device according to the stop heating signal.
[0015] In the embodiments of the present disclosure, the controller is further configured to generate an alarm signal when a fault occurs in the device or the temperature reaches a set temperature threshold, so that the switching device cuts off the power supply of the chip packaging mold heating system according to the alarm signal.
[0016] In the embodiments of the present disclosure, the heating platform includes at least two limiting containers.
[0017] The beneficial effects of the embodiments of the present disclosure compared with the prior art are as follows: By designing a heating platform paved with a heat conduction heating device and arranging a limiting container capable of accommodating a chip packaging mold on the heating platform, a heat conduction type heating source convenient for disassembly and assembly can be provided for the chip packaging mold. Through the design of the thermocouple and the controller, PID control can be performed according to the real-time temperature to obtain the control data of the heat conduction heating device, so as to control the heating power of the heat conduction heating device through the switching device, thereby quickly and efficiently heating the chip packaging mold. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a schematic structural diagram of a chip packaging mold heating system provided by an embodiment of the present disclosure;
[0020] Figure 2 It is a schematic diagram of a chip packaging mold heating system provided by an embodiment of the present disclosure;
[0021] Figure 3 It is a schematic diagram of another chip packaging mold heating system provided by an embodiment of the present disclosure. Specific embodiments
[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present disclosure clearer, the present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and are not used to limit the present disclosure.
[0023] The chip packaging mold heating system according to an embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0024] Figure 1 It is a schematic structural diagram of a chip packaging mold heating system provided by an embodiment of the present disclosure; Figure 2 It is a schematic diagram of a chip packaging mold heating system provided by an embodiment of the present disclosure; Figure 3 It is a schematic diagram of another chip packaging mold heating system provided by an embodiment of the present disclosure. The chip packaging mold heating system provided by an embodiment of the present disclosure will be described below in conjunction with Figure 1 and Figure 3 together.
[0025] As Figure 1 shown, the chip packaging mold heating system provided by an embodiment of the present disclosure includes: a heating platform 101, including a platform body, a heat conduction heating device uniformly laid on the platform body, and a limiting container located above the heat conduction heating device and capable of performing heat transfer with the heat conduction heating device, the shape and size of the accommodating space of the limiting container being adapted to the chip packaging mold; a thermocouple 102, disposed on the surface of the platform body for measuring the surface temperature of the platform body; a controller 103, communicatively connected to the thermocouple, for determining the target power of the heat conduction heating device according to the real-time temperature of the heating platform measured by the thermocouple and a preset reference temperature, using a PID (Proportional-Integral-Derivative) control algorithm; a switching device 104, communicatively connected to the controller and electrically connected to the heat conduction heating device, for controlling the heating power of the heat conduction heating device according to the target power generated by the controller.
[0026] In the following text, the chip packaging mold may be simply referred to as the packaging mold.
[0027] The technical solution of the embodiment of the present disclosure provides an off-line heating system for a chip packaging mold, which can pre-heat the mold outside the IC packaging equipment. Specifically, after the mold to be packaged is heated to the required temperature by the heat conduction heating method, the packaging mold is directly transferred to the IC packaging equipment for use, thereby reducing the heating time of the packaging mold, improving the equipment utilization rate, and reducing power consumption.
[0028] The heating platform in the embodiment of the present disclosure is a heat conduction heating platform, which is equipped with efficient heat conduction heating devices. Through the heat conduction heating technology in direct contact with the packaging mold, the heating efficiency is improved, the heating time is shortened, and rapid and uniform heating is achieved. Among them, the heat conduction heating device can be a heating tube, a ceramic heater or a silicone heating pad, and is not limited thereto.
[0029] The heat conduction heating devices are evenly laid on the heating platform, which can ensure that all parts of the packaging mold are heated evenly.
[0030] As Figure 2 shown, the chip packaging mold heating system can be integrated into a heating device with a rectangular structure. The heating device includes a heating area, a controller area, and a control button area. Among them, the heating area includes a limiting container 201, and a touch screen 202 can be set in the control button area. The top of the heating device is the heating area, and a bracket can be configured at the bottom to ensure the stable placement of the heating device. Further, universal load-bearing wheels can be provided at the bottom of the heating device to facilitate the movement of the heating device.
[0031] The off-line heating system for the chip packaging mold in the embodiment of the present disclosure can adopt a switching power supply MeanWell LRS-350-12 with an output voltage of 12V as the power module to provide stable power for the low-voltage control circuit, the temperature sensor and the temperature conversion circuit.
[0032] The thermocouple in the embodiment of the present disclosure can be a K-type thermocouple sensor, which is installed on the surface of the heating platform, and the temperature data of the packaging mold is collected in real time through the MAX31855 module. Among them, the MAX31855 module is a thermocouple-to-digital output converter module.
[0033] The controller in the embodiments of the present disclosure may be an Arduino Mega 2560 controller. Arduino Mega 2560 is a core circuit board with a USB interface, having 54 digital input / outputs, suitable for designs requiring a large number of IO interfaces. The processor core is an ATmega2560, which also has 54 digital input / output ports, 15 analog inputs, 4 UART interfaces, a 16 MHz crystal oscillator, a USB port, a power socket, an ICSP header debugging interface, and a reset button.
[0034] The Arduino Mega 2560 controller can be combined with a PID control algorithm to adjust the power output of the heat conduction heating device in real time according to the real-time temperature collected by the thermocouple and the preset reference temperature, ensuring the stability of the temperature of the encapsulation mold. Specifically, the Arduino Mega 2560 controller can run the PID algorithm to adjust the power output of the heat conduction heating device according to the error between the real-time temperature and the reference temperature, ensuring the precise stability of the temperature of the encapsulation mold.
[0035] In the embodiments of the present disclosure, the switching device may be a solid-state relay or a semiconductor switching device. The semiconductor switching device may be an IGBT (Insulate-Gate Bipolar Transistor) or a MOS tube (Metal-Oxide-Semiconductor Field-Effect Transistor), and is not limited thereto.
[0036] A solid-state relay (SSR for short) is a contactless switch composed of a microelectronic circuit, discrete electronic devices, and power electronic power devices. It can use an isolation device to achieve isolation between the control end and the load end. The solid-state relay can drive a large-current load through a tiny control signal at the input end. The solid-state relay or the semiconductor switching device can adjust the power of the heat conduction heating device according to the target power output after the controller performs PID calculation, ensuring precise control of the temperature of the encapsulation mold.
[0037] When heating the encapsulation mold, after placing the encapsulation mold on the heating platform, the heating device directly transfers heat to the encapsulation mold through heat conduction, quickly heating the encapsulation mold to 175°C. The thermocouple collects the temperature data of the encapsulation mold in real time, and the MAX31855 module transmits the temperature data to the controller. During the heating process, the controller can use the PID algorithm to control the switching frequency of the solid-state relay by adjusting the PWM signal to achieve precise heating power adjustment. After the temperature of the encapsulation mold reaches the set temperature, the encapsulation mold can be moved from the heating platform to the IC packaging equipment for packaging operations.
[0038] To improve the temperature control accuracy and response speed, the PID control algorithm in the embodiments of the present disclosure can be a fuzzy PID control algorithm or an adaptive PID control algorithm.
[0039] In the embodiments of the present disclosure, the controller is an embedded device, and the embedded device is provided with an input keyboard and a display screen. In addition, the embedded device can also be provided with a touch screen as an input device and a display device. The input keyboard or the touch screen can generate human-computer interaction data according to the operation data of the operator to adjust the heating system of the chip packaging mold. The display screen or the touch screen can display the current temperature, the set reference temperature, and the heating state of the heating platform in real time, which is convenient for the operator to monitor and adjust.
[0040] In the embodiments of the present disclosure, the limiting container has a metal base, and the metal base can conduct heat transfer with the heat conduction heating device to improve the heat transfer efficiency. The limiting container includes a boundary expansion member, and the shape and size of the accommodation space of the limiting container can be adjusted through the boundary expansion member to adapt to different models of chip packaging molds. Through the boundary expansion member, the limiting container can adjust its own size according to different sizes of packaging molds so as to be applicable to most chip packaging molds.
[0041] In the embodiments of the present disclosure, the preset reference temperature range is 170°C to 180°C.
[0042] In the embodiments of the present disclosure, the controller is further configured to generate a stop heating signal when the real-time temperature is greater than or equal to the reference temperature, so that the switching device cuts off the power supply of the heat conduction heating device according to the stop heating signal. In the embodiments of the present disclosure, the controller is further configured to generate an alarm signal when a device failure occurs or the temperature reaches a set temperature threshold, so that the switching device cuts off the power supply of the chip packaging mold heating system according to the alarm signal.
[0043] Specifically, when the temperature of the heating platform reaches the preset temperature threshold, the chip packaging mold heating system will automatically stop heating and trigger over-temperature protection to ensure the safety of the heating process. When the reference temperature range is 170°C, the temperature threshold can be set to 175°C. If a heating device fails or the temperature rises abnormally, the chip packaging mold heating system will automatically cut off the power supply to prevent overheating from damaging the packaging mold or the chip packaging mold heating system.
[0044] In the embodiments of the present disclosure, the heating platform can be provided with two, three or more limiting containers. Such as Figure 3As shown in the figure, the heating platform is provided with two limiting containers, namely the limiting container 301 and the limiting container 302. The limiting container 301 and the limiting container 302 are limiting containers of different specifications, so that encapsulation molds of different specifications can be carried, so that encapsulation molds of different sizes can be heated on the same heating platform. In addition, the two limiting containers of the heating platform can also be limiting containers of the same specification, so that more encapsulation molds of the same specification can be heated simultaneously.
[0045] The technical solution of the embodiment of the present disclosure adopts a PID temperature control system, which can achieve precise control of the temperature of the encapsulation mold and ensure the stability of the temperature. By adopting the technical solution of the embodiment of the present disclosure, offline independent operation can be performed during the heating process of the encapsulation mold. The encapsulation equipment does not need to rely on an online mold heating system, simplifies the operation process, and improves the utilization rate of the encapsulation equipment. The chip encapsulation mold heating system of the embodiment of the present disclosure adopts an over-temperature protection mechanism, which can ensure that the encapsulation mold will not overheat during the heating process and guarantee the safety of the encapsulation equipment.
[0046] By adopting the offline heating system in the embodiment of the present disclosure, the heating time of the encapsulation mold is shortened by more than 50% compared with the traditional oven heating, and the heating uniformity is significantly improved. The temperature control accuracy during the heating process can reach ±3°C, meeting the requirements of the chip encapsulation process. During the production process, after replacing different encapsulation molds on the encapsulation equipment with the technical solution of the embodiment of the present disclosure, the interval time can be shortened by 2 hours, thereby further improving the utilization rate of the encapsulation equipment and shortening the production time of the sample in this process.
[0047] According to the chip encapsulation mold heating system provided by the embodiment of the present disclosure, by designing a heating platform paved with a heat conduction heating device and setting a limiting container capable of accommodating the chip encapsulation mold on the heating platform, a heat conduction heating source convenient for disassembly and assembly can be provided for the chip encapsulation mold. Through the design of the thermocouple and the controller, PID control can be performed according to the real-time temperature to obtain the control data of the heat conduction heating device, so as to control the heating power of the heat conduction heating device through the switching device, thereby quickly and efficiently heating the chip encapsulation mold.
[0048] The above are only the preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. A chip packaging mold heating system, characterized in that, The chip packaging mold heating system includes: A heating platform, comprising a platform body, a heat conduction heating device uniformly laid on the platform body, and a limiting container located above the heat conduction heating device and capable of performing heat transfer with the heat conduction heating device, wherein the shape and size of the accommodating space of the limiting container are adapted to the chip packaging mold; A thermocouple, arranged on the surface of the platform body, for measuring the surface temperature of the platform body; A controller, communicatively connected to the thermocouple, for determining the target power of the heat conduction heating device by using a proportional integral derivative (PID) control algorithm based on the real-time temperature of the heating platform measured by the thermocouple and a preset reference temperature; A switching device, communicatively connected to the controller and electrically connected to the heat conduction heating device, for controlling the heating power of the heat conduction heating device according to the target power generated by the controller.
2. The chip package mold heating system according to claim 1, wherein, The heat conduction heating device includes a heating tube, a ceramic heater or a silicone heating pad.
3. The chip packaging mold heating system according to claim 1, characterized in that The controller is an embedded device, and the embedded device is provided with an input keyboard and a display screen, or the embedded device is provided with a touch screen.
4. The chip package mold heating system according to claim 1, characterized in that, The limiting container has a metal base, and the metal base can perform heat transfer with the heat conduction heating device.
5. The chip package mold heating system according to claim 1, wherein, The limiting container includes a boundary expansion member, and the shape and size of the accommodating space of the limiting container can be adjusted through the boundary expansion member to be adapted to different models of chip packaging molds.
6. The chip package mold heating system according to claim 1, characterized in that The preset reference temperature range is from 170°C to 180°C.
7. The chip packaging mold heating system according to claim 1, wherein The switching device includes a solid-state relay or a semiconductor switching device.
8. The chip package mold heating system according to claim 1, characterized in that, The controller is further configured to generate a stop heating signal when the real-time temperature is greater than or equal to the reference temperature, so that the switching device cuts off the power supply of the heat conduction heating device according to the stop heating signal.
9. The chip package mold heating system according to claim 1, characterized in that, The controller is further configured to generate an alarm signal when a fault occurs in the device or the temperature reaches a set temperature threshold, so that the switching device cuts off the power supply of the chip packaging mold heating system according to the alarm signal.
10. The chip packaging mold heating system according to claim 1, characterized in that, The heating platform includes at least two of the limiting containers.