Image sensor module, assembly tool, method and camera

Abstract

The invention discloses an image sensor module, an assembly tool, a method and a camera, and the image sensor module comprises an internal pressure clamping mechanism which is embedded in a circuit board, and the middle part of the internal pressure clamping mechanism is provided with an accommodation cavity; the first heat conduction piece is in heat conduction connection with the back of the sensor module and is sequentially connected with the circuit board and the internal pressure clamping mechanism; the inner pressing piece is connected with the inner pressing clamping mechanism; and the insulating heat conduction piece is used for insulating and covering the joint of the sensor module and the circuit board and conducting heat to the first heat conduction piece. The internal pressure clamping mechanism is embedded in the circuit board, a containing cavity corresponding to the sensor module can be reserved in the middle of the internal pressure clamping mechanism, the sensor module can be rapidly and accurately inserted, the whole back face and a pin area of the sensor module are completely exposed to the side close to the first heat conduction piece, the heat dissipation effect is greatly improved, and the service life of the sensor module is prolonged. Uniform heat dissipation of the sensor module is ensured, and the heat conduction uniformity of the sensor module is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the field of image sensors, and particularly relates to an image sensor module, an assembly tooling, a method and a camera. Background Art

[0002] When an image sensor is working, heat is generated, especially in the case of high-resolution or high-speed shooting, the generation of heat is more significant. If these heats cannot be effectively dissipated, it will cause the temperature of the image sensor to rise, which will in turn affect the image quality, reduce the performance and reliability of the sensor, and even may shorten its service life. Therefore, heat dissipation has become an important consideration in the design of image sensors.

[0003] Currently, the image sensor is located at the front end of the camera and is installed on the front side of the circuit board. There is an opening in the middle of the circuit board, and the copper plate passes through the circuit board and contacts a central local area on the back of the image sensor. Limited by the position of the image sensor and the heat conduction contact area, a uniform temperature difference is caused. At the same time, during this process, the heat generated by the image sensor and the heat generated by the components on the circuit board will affect each other, affecting the performance of the image sensor and the components on the circuit board. The problem of uniform temperature difference will cause the temperature environment where the photosensitive components on the image sensor are located to be inconsistent, affecting the photosensitive performance, and ultimately affecting the imaging quality of each pixel.

[0004] Based on this problem, an image sensor module, an assembly tooling, a method and a camera are provided. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above problems existing in the prior art, and provide an image sensor module, an assembly tooling, a method and a camera.

[0006] To achieve the above technical purposes and reach the above technical effects, the present invention is realized through the following technical solutions: An image sensor module for a sensor module with pins on the side, comprising: An internal pressure clamping mechanism, embedded and installed in the circuit board, with a receiving cavity in the middle for receiving the sensor module in its initial state; wherein, the pins of the sensor module are connected to the edge of the circuit board close to the receiving cavity; A first heat conducting member, thermally connected to the back of the sensor module, for sequentially connecting the circuit board and the internal pressure clamping mechanism to form a pre-tightening structure for the sensor module; An internal pressure member, connected to the internal pressure clamping mechanism, for providing pressure to the internal pressure clamping mechanism; Wherein, pressure is provided to the internal pressure clamping mechanism through the internal pressure member, so that the internal pressure clamping mechanism forms a clamping force towards the sensor module, thereby restricting the movement of the sensor module; the pre-tightening structure forms a fixed connection structure after the internal pressure clamping mechanism clamps the sensor module.

[0007] Furthermore, the internal pressure clamping mechanism includes: An embedded frame body, which is embedded and installed in the circuit board, and the inner wall is distributed with clamping guiding paths that are successively closer to the inner wall from the outside to the inside; A sliding internal pressure member, which is used to move along the clamping guiding path after being pressurized, so that the inner end of the sliding internal pressure member clamps the periphery of the sensor module; A limit connecting member, which is used to limit the sliding internal pressure member from disengaging from the clamping guiding path and connect the first heat conducting member.

[0008] Furthermore, the center of the limit connecting member is adapted to the embedded frame body, and is provided with a limit protrusion for restricting the sensor module from passing through the limit connecting member.

[0009] Furthermore, an elastic limit member is installed at the inner end of the clamping guiding path, which is used to jack up the sliding internal pressure member in the free state, so that the internal pressure clamping mechanism can accommodate the sensor module in the initial state.

[0010] Furthermore, an insulating heat conducting member is also included, which insulates and covers the connection part between the circuit board and the pins of the sensor module, and is in contact connection with the first heat conducting member, and is used to establish heat conduction between the first heat conducting member and the circuit board.

[0011] Furthermore, a second heat conducting member is also included, which is used to press the insulating heat conducting member and connect the first heat conducting member.

[0012] Furthermore, the sensor module includes: A plug-in sensor, which includes a sensor body and sensor pins vertically distributed with the sensor body; An adapter, which is plugged and connected with the plug-in sensor, and the edge of the adapter extends outwards to form pins connected to the circuit board; A heat dissipation coating layer, which is used to wrap the plug-in sensor and the adapter, and is composed of a plurality of heat dissipation plates.

[0013] The present invention also provides an assembly tool for an image sensor module, which is used to assemble the above-mentioned image sensor heat dissipation module, and includes: A base, which is used for the bottom support of the assembly tool; A plurality of sliding support seats, which are installed on the base along the assembly direction of the image sensor heat dissipation module; A plurality of elastic support members, which are used to elastically support the sliding support seats; An operation support table, which is fixedly connected with the sliding support seats and is used to support the image sensor heat dissipation module; A flipping positioning frame, which is used for positioning and matching the circuit board; A first magnetic attraction limit member, which is used to position the internal pressure clamping mechanism and is magnetically attracted and connected with the bottom of the flipping positioning frame; A flipping support member for rotatably mounting a flipping positioning frame; A second magnetic attraction limiting member magnetically and cooperatively connected to the top of the flipping positioning frame.

[0014] The present invention also provides an assembly method for an image sensor module, using the above-mentioned assembly tooling, including: Install the assembly tooling and withdraw the second magnetic attraction limiting member to wait for the assembly of the image sensor heat dissipation module; Successively complete the positioning and pre-tightening installation of the internal pressure clamping mechanism, circuit board, sensor module, first heat conducting member, and second magnetic attraction limiting member to form a pre-tightening structure; Flip the pre-tightening structure, withdraw the first magnetic attraction limiting member, and tightly install the internal pressure member so that the internal pressure clamping mechanism clamps the sensor module; Rotate the flipping positioning frame, adjust the pre-tightening structure to a fixed connection structure, and complete the pin soldering of the sensor module to completely fix the sensor module, forming an image sensor heat dissipation module, and withdraw the flipping positioning frame.

[0015] The present invention also provides a camera, including: A housing for accommodating and installing the above-mentioned image sensor heat dissipation module; A lens for converging light onto the sensor module.

[0016] The beneficial effects of the present invention are: 1. By embedding the internal pressure clamping mechanism in the circuit board, the present invention can leave a cavity corresponding to the sensor module in the middle, facilitating the quick and accurate insertion of the sensor module. The entire back surface of the sensor module is completely exposed on the side close to the first heat conducting member, and the first heat conducting member can conduct heat to the entire back surface of the sensor module. Compared with the traditional sensor module that only dissipates heat from the central area of the back surface, the heat dissipation effect is greatly improved, ensuring that the sensor module can dissipate heat evenly and effectively improving the heat conduction uniformity of the sensor module.

[0017] 2. The present invention also completely exposes the pin area on the side close to the first heat conducting member, and can insulate and conduct heat to the entire pin area of the sensor module through the insulating heat conducting member. Through the heat conduction between the circuit board and the first heat conducting member, the heat dissipation effect of the sensor module can be further improved.

[0018] 3. Through the cooperative installation among the embedded frame, the sliding internal pressure member, and the limiting connecting member, the present invention can not only ensure the quick and accurate insertion of the sensor module, but also quickly and stably clamp the sensor module, ensuring the quality of subsequent pin soldering.

[0019] 4. The present invention can achieve the efficient assembly of the image sensor heat dissipation module through the assembly tooling. With the elastic support and cooperation between the flipping positioning frame and the operation support table, it can stably horizontally support the image sensor heat dissipation module in different assembly states, ensuring the stability and reliability of the assembly process. At the same time, with the auxiliary limiting effect of the first magnetic attraction limiting part and the second magnetic attraction limiting part, the structural stability during the assembly rotation is ensured, preventing the structure from deviating from the predetermined position, and it can be quickly disassembled and assembled, improving the assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention, form a part of this application, and the schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute an improper limitation to the present invention. In the drawings: Figure 1 is a schematic structural diagram of the image sensor heat dissipation module in the present invention; Figure 2 is a schematic structural diagram of the image sensor heat dissipation module in the present invention; Figure 3 is an exploded structural diagram of the image sensor heat dissipation module in the present invention; Figure 4 is an exploded structural diagram of the image sensor heat dissipation module in the present invention; Figure 5 is a partial structural cross-sectional view of the image sensor heat dissipation module in the present invention; Figure 6 is a partial exploded structural diagram of the image sensor heat dissipation module in the present invention; Figure 7 is a partial schematic structural diagram of the image sensor heat dissipation module in the present invention; Figure 8 is a partial schematic structural diagram of the image sensor heat dissipation module in the present invention; Figure 9 is a schematic structural diagram of the assembly tooling in the present invention; Figure 10 is an exploded structural diagram of the assembly tooling in the present invention; Figure 11 is an exploded structural diagram of the assembly tooling in the present invention; Figure 12 is a schematic structural diagram of the use of the assembly tooling in the present invention; Figure 13 is a schematic structural diagram of the use of the assembly tooling in the present invention; Figure 14 is a schematic structural diagram of the use of the assembly tooling in the present invention; Figure 15 is a schematic structural diagram of the use of the assembly tooling in the present invention.

[0021] In the figure: 1 - internal pressure component; 2 - internal pressure clamping mechanism; 3 - spacer; 4 - circuit board; 5 - first heat conducting component; 6 - sensor module; 7 - second heat conducting component; 8 - insulating heat conducting component; 11 - internal pressure frame; 12 - internal pressure connecting plate; 13 - fourth positioning punching hole; 21 - embedded frame body; 22 - sliding internal pressure component; 23 - limiting connecting piece; 24 - fifth positioning bolt; 31 - second positioning screw hole; 32 - third positioning through hole; 33 - fourth positioning through hole; 41 - embedding hole; 42 - mounting groove; 43 - circuit board limiting hole; 51 - central heat conducting plate; 52 - side pressing block; 53 - side connecting plate; 54 - first positioning screw hole; 55 - second positioning perforation; 56 - third positioning perforation; 57 - fourth positioning screw hole; 61 - plug-in sensor; 62 - adapter; 63 - heat equalizing coating layer; 71 - heat conducting card slot; 72 - first positioning perforation; 131 - fourth positioning bolt; 211 - first guiding groove; 212 - guiding limiting hole; 213 - fifth positioning perforation; 221 - sliding inclined surface; 222 - clamping abutting surface; 223 - first transition connecting surface; 224 - second transition connecting surface; 225 - internal pressure boss; 226 - guiding limiting boss; 231 - limiting frame; 232 - second guiding groove; 233 - limiting protrusion; 234 - fifth positioning screw hole; 235 - positioning connecting plate; 236 - third positioning screw hole; 237 - fourth positioning perforation; 551 - second positioning bolt; 561 - third positioning bolt; 631 - opening slot; 721 - first positioning bolt; 10 - base; 20 - elastic support component; 30 - sliding support base; 40 - operation support table; 50 - flipping positioning frame; 60 - first magnetic attraction limiting piece; 70 - flipping support piece; 80 - second magnetic attraction limiting piece; 101 - sliding support column; 301 - sliding support top plate; 302 - sliding support tube; 303 - sixth positioning bolt; 401 - mounting guiding groove; 501 - flipping positioning plate; 502 - limiting groove; 503 - flipping protrusion; 504 - flipping shaft; 505 - receiving protrusion; 506 - second central limiting column; 507 - magnetic attraction connecting groove; 508 - first magnetic attraction clamping groove; 601 - central connecting strip; 602 - limiting protrusion; 603 - first central limiting column; 604 - magnetic attraction connecting block; 605 - first magnetic attraction clamping protrusion; 606 - mounting guiding protrusion; 701 - support base; 702 - flipping support beam; 703 - flipping shaft hole; 704 - seventh positioning bolt; 801 - second magnetic attraction clamping protrusion. Specific implementation manners

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Embodiment 1

[0023] As Figure 1-4 shown, this embodiment first provides an image sensor module for a sensor module with pins on the side, that is, it means that the pins of the sensor module 6 extend outward from the peripheral side or edge. Specifically, it includes the following components: The internal pressure clamping mechanism 2 is embedded in the circuit board 4 and has a receiving cavity in the middle for receiving the sensor module 6 in its initial state; among them, the pins of the sensor module 6 are connected to the circuit board 4 near the edge of the receiving cavity.

[0024] The first heat conducting member 5 is thermally connected to the back of the sensor module 6 and is used to connect the circuit board 4 and the internal pressure clamping mechanism 2 in sequence to form a pre-tightening structure for the sensor module 6.

[0025] The internal pressure member 1 is connected to the internal pressure clamping mechanism 2 and is used to provide pressure to the internal pressure clamping mechanism 2.

[0026] Among them, the internal pressure member 1 provides pressure to the internal pressure clamping mechanism 2, so that the internal pressure clamping mechanism 2 forms a clamping force towards the sensor module 6, thereby restricting the movement of the sensor module 6; the pre-tightening structure forms a fixed connection structure after the internal pressure clamping mechanism 2 clamps the sensor module 6. By embedding the internal pressure clamping mechanism 2 in the circuit board 4, a receiving cavity corresponding to the sensor module 6 can be left in the middle, which is convenient for the sensor module 6 to be inserted quickly and accurately. At this time, taking the single-sided circuit board structure as an example for the circuit board 4, the pins of the sensor module 6 are connected to the front side of the circuit board 4, that is, the front side of the sensor module 6 corresponds to the back side of the circuit board 4, and the entire back side and the pin area of the sensor module 6 are completely exposed on the side close to the first heat conducting member 5. The first heat conducting member 5 can conduct heat to the entire back side of the sensor module 6, and the insulating heat conducting member 8 conducts heat and insulates the entire pin area of the sensor module 6. Compared with the traditional sensor module with only the central area of the back side for heat dissipation, the heat dissipation effect is greatly improved, ensuring that the sensor module can dissipate heat evenly and effectively improving the thermal conduction uniformity of the sensor module.

[0027] As Figure 3-4 shown, as a specific implementation manner of the image sensor heat dissipation module, the specific structures of each component are as follows: The circuit board 4 is provided with an embedding hole 41 in the center that cooperates with the internal pressure clamping mechanism 2, mounting grooves 42 are opened on the left and right sides, and four circuit board limit holes 43 are evenly distributed around the edge.

[0028] The first heat conducting member 5 includes a central heat conducting plate 51 and side pressure blocks 52 symmetrically distributed at both ends of the central heat conducting plate 51. A side connecting plate 53 is provided on the outer side of the side pressure block 52. The surface of the central heat conducting plate 51 is completely attached to the back surface of the sensor module 6 for comprehensive heat conduction. The surface of the side pressure block 52 is in contact with the surfaces of the circuit board 4 on both sides of the embedding hole 41, facilitating the limitation of the circuit board 4 during the subsequent installation process; first positioning screw holes 54 are respectively provided on the outer surface of the central heat conducting plate 51. The position of the side connecting plate 53 corresponds to the position of the mounting groove 42. Second positioning through holes 55 are provided at both ends of the side connecting plate 53. Two third positioning through holes 56 are provided between the two second positioning through holes 55, and a fourth positioning screw hole 57 is provided between the two third positioning through holes 56.

[0029] As Figure 5-8 shown, as a specific implementation manner of the internal pressure clamping mechanism 2, the structure includes: An embedded frame body 21 is embedded and installed in the circuit board 4, and clamping guiding paths are distributed on the inner wall. The clamping guiding paths are successively closer to the inner wall from the outside to the inside; the number of clamping guiding paths is four, which are evenly distributed on the inner wall of the embedded frame body 21 and consist of inclined first guiding grooves 211 and guiding limit holes 212 symmetrically distributed at both ends of the first guiding grooves 211. The surface of the first guiding groove 211 is flat and smooth. Fifth positioning through holes 213 are provided at the four corners of the embedded frame body 21.

[0030] A sliding internal pressure member 22 is used to move along the clamping guiding path after being pressured, so that the inner end of the sliding internal pressure member 22 clamps the periphery of the sensor module 6; the sliding internal pressure member 22 includes a sliding inclined surface 221 that is in sliding contact with the first guiding groove 211 and clamping abutting surfaces 222 distributed oppositely. A first transition connecting surface 223 is provided between the sliding inclined surface 221 and the bottom end of the clamping abutting surface 222. A second transition connecting surface 224 is provided at the top of the clamping abutting surface 222. The second transition connecting surface 224 can be selected to be parallel to the sliding inclined surface 221. An internal pressure boss 225 is provided between the top of the sliding inclined surface 221 and the second transition connecting surface 224. Guiding limit bumps 226 that cooperate with the guiding limit holes 212 are provided at both ends of the surface of the sliding inclined surface 221.

[0031] In order to avoid the mutual influence of heat conduction between the circuit board 4 and the sensor module 6, the sliding internal pressure member 22 can be made of an adiabatic material, so that there is no direct heat conduction between the periphery of the sensor module 6 and the circuit board 4, reducing the heat influence between them.

[0032] The limiting connecting piece 23 is used to limit the sliding inner pressure piece 22 from disengaging from the clamping and guiding path and connect the first heat conducting piece 5. The limiting connecting piece 23 includes a limiting frame 231 corresponding to the edge of the embedded frame body 21. The inner wall of the limiting frame 231 is provided with a second guiding groove 232 corresponding to the first guiding groove 211. The surfaces of the first guiding groove 211 and the second guiding groove 232 are coplanar. At the four corners of the surface of the limiting frame 231, there are fifth positioning screw holes 234 corresponding to the fifth positioning through holes 213. On the outer side of the limiting frame 231, there is a positioning connecting plate 235. On the surface of the positioning connecting plate 235, there are two third positioning screw holes 236 corresponding to the third positioning through holes 56. Between the two third positioning screw holes 236, there is a fourth positioning through hole 237 corresponding to the fourth positioning screw hole 57.

[0033] In order to prevent the sensor module 6 from passing through the inner pressure clamping mechanism 2 during installation, the center of the limiting connecting piece 23 is adapted to the embedded frame body 21 and is provided with a limiting protrusion 233. The limiting protrusion 233 can be located at the inner wall corner of the limiting frame 231 and is used to prevent the sensor module 6 from passing through the limiting connecting piece 23.

[0034] In order to enable the sensor module 6 to be quickly placed during initial installation, an elastic limiting component is installed at the inner end of the clamping and guiding path and is used to push up the sliding inner pressure piece 22 in the free state, so that the inner pressure clamping mechanism 2 can accommodate the sensor module 6 in the initial state. The elastic limiting component can specifically be a spring structure and is placed at the bottom of the guiding and limiting hole 212. In its free state, the guiding and limiting convex block 226 abuts against the limiting frame 231. At this time, the clamping and abutting surface 222 is close to the inner wall of the embedded frame body 21.

[0035] In order to further improve the structural connection strength, a spacer 3 is further included and is used to be in close contact and connection with the limiting connecting piece 23 and the first heat conducting piece 5 respectively when the pre-tightening structure forms a fixed connection structure. The spacer 3 can adopt a block structure. At both ends of the surface, there are second positioning screw holes 31 corresponding to the second positioning through holes 55. Between the two second positioning screw holes 31, there are two third positioning through holes 32 corresponding to the third positioning through holes 56. Between the two third positioning through holes 32, there is a fourth positioning through hole 33 corresponding to the fourth positioning screw hole 57.

[0036] The inner pressure piece 1 includes an inner pressure frame 11 corresponding to the limiting frame 231 and inner pressure connecting plates 12 symmetrically arranged at both ends of the inner pressure frame 11. On the surface of the inner pressure connecting plates 12, there are fourth positioning punching holes 13 corresponding to the fourth positioning through holes 33. The inner pressure frame 11 is used to press the sliding inner pressure piece 22.

[0037] In an actual application scenario, in the face of the heat dissipation problem of the high-power sensor module 6, a thermoelectric cooler, i.e., TEC, is used for auxiliary heat dissipation. At this time, the first heat conducting member 5 is connected to the cold end of the TEC, so that the heat of the sensor module 6 is transferred to the TEC through the first heat conducting member 5 for heat dissipation.

[0038] However, in the application scenario of a device without a TEC, in order to further improve the heat dissipation effect, an insulating heat conducting member 8 can be introduced to insulate and cover the pin connection between the circuit board 4 and the sensor module 6 and be in contact connection with the first heat conducting member 5 to establish heat conduction between the first heat conducting member 5 and the circuit board 4. At this time, according to the surface temperatures of the sensor module 6, the first heat conducting member 5, and the circuit board 4 during actual use, the temperatures of the three are in descending order as the sensor module 6, the first heat conducting member 5, and the circuit board 4. Therefore, due to the heat conduction between the first heat conducting member 5 and the circuit board 4, while the first heat conducting member 5 dissipates heat to the outside, it will also transfer heat to the circuit board 4, thereby further improving the heat dissipation effect on the premise of ensuring the insulation of the pins of the sensor module 6. Moreover, the coverage area of the insulating heat conducting member 8 on the circuit board 4 can be increased, that is, in addition to insulating and covering the pin connection between the circuit board 4 and the sensor module 6, other areas on the circuit board 4 are also covered at the same time. At this time, the heat dissipation area on the surface of the circuit board 4 can be fully utilized to fully improve the heat dissipation effect.

[0039] In order to better conduct heat and fixedly install the insulating heat conducting member 8, a second heat conducting member 7 is also provided, which is used to press the insulating heat conducting member 8 and connect the first heat conducting member 5. The inner surface of the second heat conducting member 7 is provided with a heat conducting slot 71 that engages with the central heat conducting plate 51, and a first positioning through hole 72 corresponding to the first positioning screw hole 54 is provided in the middle of the heat conducting slot 71. Both the second heat conducting member 7 and the first heat conducting member 5 can be made of copper material.

[0040] It should be noted that the introduction of the insulating heat conducting member 8 is not suitable for the scenario using a TEC. When the heat of the sensor module 6 is transferred to the TEC through the first heat conducting member 5 for heat dissipation, insulation treatment between the sensor module 6 and the circuit board 4 needs to be carried out so that the TEC only cools the sensor module 6. At this time, the installation of the insulating heat conducting member 8 and the second heat conducting member 7 can be directly cancelled.

[0041] The following will be described in combination with specific principles: The forms of heat transfer between the heat source and the air include heat conduction, heat convection, and heat radiation. Since the inside of the camera is in a relatively enclosed space and the gas inside the camera does not undergo convection, the convective heat transfer coefficient is used to describe the heat exchange ability between the fluid and the solid surface during the movement process. When convection does not occur, the main forms of heat transfer inside the camera are heat conduction and heat radiation.

[0042] The calculation formula for the heat transfer from the hot end of the TEC to the air by thermal radiation is Q = EσA(T1 4 - T2 4 ), where E is the reflectivity of the object surface with a value range of 0 - 1, σ is the Stefan - Boltzmann constant with a value of 5.67×10 -8 , A is the surface area of the object, T1 is the temperature of the object surface in Kelvin, T2 is the temperature of the air around the TEC. As the hot end of the TEC reaches thermal equilibrium with the surrounding air, the temperature of the surrounding air approaches the temperature of the hot end of the TEC. As the temperature of the hot end of the TEC changes, the temperature difference between the hot end of the TEC and the surrounding air is small, and the heat conducted from the continuously rising temperature of the hot end of the TEC to the air can be ignored.

[0043] The calculation formula for the heat transfer from the hot end of the TEC to the air by thermal conduction is Q=-kA×dT / dx, where k is the thermal conductivity of the substance. The thermal conductivity of air is 0.024 W / (m·K), A is the contact area between the heat source and the heat sink in square meters (m²), and dT / dx is the temperature gradient, representing the rate of temperature change in the direction of length X; The central heat - conducting plate 51 in contact with the image sensor is made of copper, and the thermal conductivity of copper is 385 W / (m·K). The cold end of the TEC is in contact with the copper, and the other end is in contact with the aluminum alloy of the camera back cover. The thermal conductivity of the aluminum alloy is 209 W / (m·K). The thermal conductivity from the central heat - conducting plate 51 to the cold end of the TEC and from the hot end of the TEC to the back cover is much greater than the thermal conductivity to the air. The heat transfer from the copper plate and the hot end of the TEC to the air by heat conduction can be ignored.

[0044] Similarly, the heat conducted to the central heat - conducting plate 51 in contact with the cold end of the TEC by heat conduction, thermal radiation, and thermal convection from the air around the copper plate can be ignored.

[0045] Therefore, without considering the heat conduction, thermal convection, and thermal radiation between the hot end of the TEC and the air, only consider the heat conduction mode in contact with non - air heat - conducting materials.

[0046] Regarding whether to install the insulation heat - conducting part 8 and the second heat - conducting part 7, it specifically includes the following two situations: Situation 1: When using TEC conduction, at this time, the second heat - conducting part 7 and the insulation heat - conducting part 8 are not installed. The cold end of the TEC cools down the sensor module 6 through the central heat - conducting plate 51, so that the temperature of the sensor module 6 is maintained at a working temperature lower than the ambient temperature.

[0047] At this time, there is also provided a heat conduction detection system for the sensor module 6, including a temperature detection module, a heat transfer analysis module, and a temperature equalization determination module.

[0048] The heat on the surface of the sensor module 6 is conducted through the central heat conducting plate 51. The central heat conducting plate 51 is made of copper plate. Since the inside of the camera is a relatively enclosed environment, the way of heat convection between the sensor module 6, the central heat conducting plate 51 and the air can be ignored. The heat conduction capacity of the central heat conducting plate 51 and the TEC in the working state is much greater than that of the air, so the heat conduction with the air can be ignored. Therefore, in order to simplify the experiment, only the heat conduction between the central heat conducting plate 51, the TEC and the camera back cover in contact with the sensor module 6 is considered.

[0049] The temperature detection module detects the temperature values at each preset position on the sensor module 6 when the sensor module 6 is working normally and with / without heat conduction between the central heat conducting plate 51 and the sensor module 6, and also detects the temperature values at the hot and cold ends of the TEC. At this time, the central heat conducting plate 51 is in contact with the cold end of the TEC and absorbs the heat on the sensor module 6.

[0050] The temperature detection module can use a non-contact method and can select a thermal imager, an infrared thermometer, a laser radiation thermometer to measure the temperature at each preset position on the sensor module 6. The preset positions include the central position on the back of the sensor module 6 and each measurement point around the center of the sensor module 6.

[0051] The heat transfer analysis module analyzes the temperature at each preset position on the sensor module 6 when the sensor module 6 is working normally and with / without heat conduction of the solid heat conducting material, obtains the average temperature, and analyzes the heat that the sensor module 6 needs to transfer when the sensor module 6 is at the optimal operating temperature and meets the uniform temperature condition.

[0052] One end of the central heat conducting plate 51 is in contact with the back of the sensor module 6, and the other end is in contact with the cold end of the TEC to conduct the heat on the surface of the sensor module 6. Through experiments, when the sensor module 6 is working normally and the area of the sensor module 6 in contact with the central heat conducting plate 51 is at the optimal operating temperature and meets the uniform temperature condition, the heat Q absorbed by the cold end of the TEC is:

[0053] α represents the Seebeck coefficient (volts / kelvin, V / K), which represents the thermoelectric power of the TEC. I represents the current flowing through the TEC. △T1 represents the temperature difference between the hot end and the cold end of the TEC. r represents the total resistance of the TEC.

[0054] When the central heat conducting plate 51 is in good contact with the sensor module 6, the total heat conducted by the central heat conducting plate 51 is:

[0055] Q1 represents the heat conducted to the central heat conduction plate 51, k represents the thermal conductivity of the central heat conduction plate 51, the central heat conduction plate 51 is made of copper, A2 represents the contact area for heat conduction between the central heat conduction plate 51 and the sensor module 6, △T represents the temperature difference across the central heat conduction plate 51, △T = T4 - T3, T4 represents the temperature of the end face of the central heat conduction plate 51 in contact with the cold end of the TEC, which is equal to the temperature of the cold end of the TEC, T3 represents the temperature of the end face of the central heat conduction plate 51 in contact with the sensor module 6, which is equal to the surface temperature of the sensor module 6, d represents the thickness of the central heat conduction plate 51, and t represents the heat conduction time.

[0056] The heat absorbed by the cold end of the TEC is equal to the total heat conducted by the central heat conduction plate 51. That is, the surface temperature T3 of the sensor module 6 when it is in contact with the central heat conduction plate 51 is derived as follows:

[0057] When the current of the TEC is running and the heat conduction time t is fixed, the smaller the thickness d of the central heat conduction plate 51, the lower the surface temperature of the sensor module 6. Or when the thickness d of the central heat conduction plate 51 is larger, the surface temperature of the sensor module 6 relatively increases. The thickness of the central heat conduction plate 51 can be controlled according to the temperature required on the surface of the sensor module 6 under heat conduction.

[0058] The temperature equalization determination module is used to obtain the temperature values at each preset position on the sensor module 6 when the central heat conduction plate 51 and the sensor module 6 have different contact areas during the normal operation of the sensor module 6, and determine the temperature equalization degree on the surface of the sensor module 6 under different covering areas between the central heat conduction plate 51 and the surface of the sensor module 6.

[0059] When local heat conduction occurs between the central heat conduction plate 51 and the surface of the sensor module 6, the temperature at the center position of the surface of the sensor module 6 in contact with the central heat conduction plate 51 is T5, while the surface temperature of the sensor module 6 not in contact with the central heat conduction plate 51 is T u , T5 < T u < T6, where T6 represents the temperature of the surface of the sensor module 6 without heat conduction with the heat conducting material during the normal operation of the image sensor.

[0060] Specifically, the center of the sensor module 6 overlaps with the center of the central heat conduction plate 51. Taking the center of the sensor module 6 as the coordinate origin, the length direction of the central heat conduction plate 51 is the X-axis, and the width direction of the central heat conduction plate 51 is the Y-axis. The position coordinates A f (x f , y f ) of each predicted position are established to form the position coordinates at each preset position on the sensor module 6.

[0061] When the width of the central heat conduction plate 51 is less than the width of the sensor module 6, the temperature change amount per unit length of the surface of the sensor module 6 in the direction away from the sensor module 6 along the outside of the central heat conduction plate 51 in the area not covered by the central heat conduction plate 51 is trained respectively , and the temperature change amount per unit length of the surface of the sensor module 6 in the direction from the X axis to the width direction of the central heat conduction plate 51 in the area covered by the central heat conduction plate 51 is trained , and .

[0062] Calculate the distances D f and H f , D f represents the vertical distance D from the f-th preset position on the surface of the sensor module 6 in the area not covered by the central heat conduction plate 51 to the edge of the central heat conduction plate 51 f , f = 1, 2,..., n, where n is the number of preset positions on the sensor module 6, and H f represents the vertical distance from the f-th preset position on the image sensor module 6 in the area covered by the central heat conduction plate 51 to the X axis. H1 is the center position of the sensor module 6, and the coordinates of H1 are (0, 0). When the f-th preset position is covered by the first heat conduction member, the corresponding D f = 0, H f ≠0, H f ≤ L / 2.

[0063] If the width of the central heat conduction plate 51 is less than the width of the sensor module 6, the temperatures at each preset position on the sensor module 6 are as follows:

[0064] T5 represents the temperature value at the center of the area covered by the central heat conduction plate 51 and the sensor module 6. L represents the width of the central heat conduction plate 51, and S represents the width of the sensor module 6.

[0065] If the area of the central heat conduction plate 51 is equal to the area of the sensor module 6, the temperatures at each preset position on the sensor module 6 are as follows:

[0066] The average temperature evaluation coefficient at each preset position on the surface of the sensor module 6 is:

[0067] According to the expression of the average temperature evaluation coefficient at each predicted position on the surface of the sensor module 6 described above, it can be seen that when the covering area of the central heat conducting plate 51 in contact with the cold end of the TEC is smaller, the overall average temperature characteristic of the surface of the sensor module 6 is worse. And by comparing the average temperature evaluation coefficient with the set average temperature evaluation coefficient threshold Φ0, the minimum covering area of the sensor module 6 corresponding to the set average temperature evaluation coefficient can be determined in reverse, so as to select and design the size of the central heat conducting plate 51.

[0068] When there is an opening in the middle of the circuit board and the copper plate penetrates the circuit board and contacts the central local area on the back of the image sensor, according to the calculation formula of the average temperature evaluation coefficient, the average temperature evaluation coefficient Φ1 at each preset position on the surface of the sensor module 6 is calculated. As the contact area between the central heat conducting plate 51 covered by the TEC and the back of the sensor module 6 increases, the average temperature evaluation coefficient Φ corresponding to each preset position on the surface of the corresponding sensor module 6 becomes smaller, and Φ < Φ1. Therefore, in the present invention, the full contact heat conduction between the central heat conducting plate 51 and the sensor module 6 has a larger contact area on the back compared with the prior art where the copper plate penetrates the circuit board and contacts the central local area on the back of the image sensor, and the structure of the present invention has better average temperature.

[0069] The set uniform evaluation coefficient threshold is obtained through experiments and is the maximum average temperature evaluation coefficient that meets the heat dissipation and average temperature requirements of the sensor module 6. The relationship among the three satisfies: Φ ≤ Φ0 < Φ1. Under the condition of meeting the heat dissipation, when the average temperature evaluation coefficient is less than or equal to the set average temperature evaluation coefficient threshold Φ0, the requirements of heat dissipation and average temperature are met at the same time. In order to save costs, any covering area that satisfies the average temperature evaluation coefficient at each preset position on the surface of the sensor module 6 being less than or equal to the set average temperature evaluation coefficient threshold Φ0 can be selected.

[0070] Case 2: When there is no TEC, the heat on the surface of the sensor module 6 is conducted to the circuit board 4 through the central heat conducting plate 51, the second heat conducting member 7 and the insulating heat conducting member 8 in sequence. At the same time, the heat of the pins of the sensor module 6 is conducted to the circuit board 4. The central heat conducting plate 51 and the second heat conducting member 7 are made of copper plates.

[0071] At this time, a heat conduction detection system for the sensor module 6 is also provided, including a temperature detection module, a heat transfer analysis module and an average temperature determination module.

[0072] Since the inside of the camera is a relatively enclosed environment, the heat convection between the sensor module 6, the central heat conducting plate 51, the second heat conducting member 7, and the insulating heat conducting member 8 and the air can be ignored. At the same time, since the heat conduction coefficient of the air is much smaller than that of the central heat conducting plate 51, the second heat conducting member 7, and the insulating heat conducting member 8, the heat conduction with the air is ignored. To simplify the analysis, only the heat conduction between the sensor module 6, the central heat conducting plate 51, the second heat conducting member 7, the insulating heat conducting member 8, and the circuit board 4 is considered in sequence.

[0073] A temperature detection module that detects the temperatures at each preset position on the sensor module 6 when the sensor module 6 is operating normally and when there is / without heat conduction between the central heat conducting plate 51 and the sensor module 6, and detects the temperatures at both ends of the central heat conducting plate 51 that conducts heat with the sensor module 6.

[0074] The temperature detection module uses a non-contact method and can select a thermal imager, an infrared thermometer, a laser radiation thermometer, etc. to measure the temperatures at each preset position on the sensor module 6. The preset positions include the central position of the sensor module 6 and each measurement point outside the center of the sensor module 6.

[0075] The heat transfer analysis module is used to extract the temperatures at each preset position on the sensor module 6 when the sensor module 6 is operating normally and when there is heat conduction between the central heat conducting plate 51 and the sensor module 6, analyze the average temperature at the preset position on the sensor module 6 that conducts heat with the central heat conducting plate 51, and analyze the heat conducted by the central heat conducting plate 51.

[0076] The heat conducted by the central heat conducting plate 51 is:

[0077] c represents the specific heat capacity of the central heat conducting plate 51, with the unit J / (kg·℃), m represents the mass of the central heat conducting plate 51, with the unit kg, T H and T L respectively represent the temperature at the end of the central heat conducting plate 51 close to the sensor module 6 and the temperature at the end far from the sensor module 6 when the heat is balanced. T0 represents the temperature of the central heat conducting plate 51 before heat conduction, which is equal to the ambient temperature inside the camera at this time, with the unit ℃.

[0078] The uniform temperature determination module is used to analyze the uniform temperature evaluation coefficient of the sensor module 6 and the temperature attenuation at the preset position of the sensor module 6 when the sensor module 6 is operating normally and when there is heat conduction between the central heat conducting plate 51 and the sensor module 6, and make a comprehensive judgment based on the uniform temperature evaluation coefficient and the temperature attenuation of the sensor module 6 to determine whether the heat conduction path meets the requirements.

[0079] The uniform temperature evaluation coefficient of the sensor module 6 is:

[0080] It represents the temperature at the f-th preset position on the sensor module 6 when heat conduction occurs between the central heat conduction plate 51 and the sensor module 6, where f = 1, 2,..., n, and n is the number of preset positions on the sensor module 6. When f = 1, it represents the central position of the sensor module 6. It represents that when heat conduction occurs between the central heat conduction plate 51 and the sensor module 6, the average temperature at the preset position on the sensor module 6 is:

[0081] Among them, the average temperature evaluation coefficient of the sensor module 6 reflects the temperature uniformity on the surface of the sensor module 6.

[0082] The temperature attenuation amount at the preset position of the sensor module 6 is:

[0083] T f It represents the temperature at the f-th preset position on the sensor module 6 when the central heat conduction plate 51 does not conduct heat with the sensor module 6.

[0084] The heat conduction path determination coefficient ε is:

[0085] The heat conduction path determination coefficient is used to determine whether the heat conduction performance under this path meets the requirements.

[0086] When there is an opening in the middle of the circuit board and the copper plate penetrates the circuit board and contacts the central local area on the back of the image sensor, according to the calculation formula of the heat conduction path determination coefficient, the calculated heat conduction path determination coefficient ε becomes larger as the contact area between the central heat conduction plate 51 and the back of the sensor module 6 increases, and the calculated heat conduction path determination coefficient ɛ is greater than or equal to the set heat conduction path determination coefficient.

[0087] Therefore, in the present invention, the full contact heat conduction between the central heat conduction plate 51 and the sensor module 6 has a larger contact area on the back compared to the prior art where the copper plate penetrates the circuit board and contacts the central local area on the back of the image sensor, and the temperature uniformity of the structure of the present invention is better.

[0088] When the heat conduction path determination coefficient is greater than the set heat conduction path determination coefficient, this heat conduction path meets the requirements; if the heat conduction path determination coefficient is less than the set heat conduction path determination coefficient, this heat conduction path does not meet the requirements.

[0089] To fasten the above structure, specifically, the first positioning bolt 721 can pass through the first positioning through hole 72 and be fixedly connected to the first positioning screw hole 54, the second positioning bolt 551 can pass through the second positioning through hole 55 and be fixedly connected to the second positioning screw hole 31, the third positioning bolt 561 can sequentially pass through the third positioning through hole 56, the third positioning through hole 32 and be fixedly connected to the third positioning screw hole 236, the fourth positioning bolt 131 can sequentially pass through the fourth positioning punching hole 13, the fourth positioning through hole 237, the fourth positioning through hole 33 and be fixedly connected to the fourth positioning screw hole 57, and the fifth positioning bolt 24 can pass through the fifth positioning through hole 213 and be fixedly connected to the fifth positioning screw hole 234.

[0090] As a first implementation manner of the sensor module 6, it may include: A plug-in sensor 61, including a sensor body and sensor pins vertically distributed with respect to the sensor body; An adapter 62, plugged and connected to the plug-in sensor 61, and pins for connecting to the circuit board 4 extend outward from the edge of the adapter 62; A heat equalizing coating layer 63, used to wrap the plug-in sensor 61 and the adapter 62, composed of a plurality of heat equalizing plates, and an opening groove 631 adapted to the pins of the adapter 62 is provided on the peripheral side of the heat equalizing coating layer 63.

[0091] As a second implementation manner of the sensor module 6, a single sensor structure with pins protruding from the side can be directly adopted, so as to directly perform heat conduction installation on it.

[0092] Therefore, whether it is a common plug-in sensor 61 or a single sensor structure with pins protruding from the side, they can all be installed through the above structure to realize the assembly of the image sensor heat dissipation module. Embodiment 2

[0093] As Figure 9-15 shown, the second aspect of the present invention also provides an assembly tool for an image sensor module, used for assembling the above image sensor heat dissipation module, including: A base 10, used for the bottom support of the assembly tool; A plurality of sliding support seats 30, installed on the base 10 along the assembly direction of the image sensor heat dissipation module; A plurality of elastic support components 20, used for elastically supporting the sliding support seats 30; An operation support table 40, fixedly connected to the sliding support seats 30, used for supporting the image sensor heat dissipation module; A flipping positioning frame 50, used for positioning and cooperating with the circuit board 4; A first magnetic attraction limiting member 60, used for positioning the internal pressure clamping mechanism 2 and magnetically attracting and cooperating with the bottom of the flipping positioning frame 50; The flipping support member 70 is used for rotatably mounting the flipping positioning frame 50; The second magnetic attraction limiting member 80 is magnetically attracted and cooperatively connected to the top of the flipping positioning frame 50.

[0094] As a specific implementation manner of the assembly tooling, the specific structures of the components are as follows: Four sliding support columns 101 are evenly distributed on the top of the base 10. An elastic support member 20 is installed outside the sliding support columns 101. For example, a spring is selected for support. The sliding support seat 30 includes a sliding support tube 302 that cooperates with the sliding support columns 101. The bottom of the sliding support tube 302 is in abutting connection with the elastic support member 20. A sliding support top plate 301 is provided at the top of the sliding support tube 302. The sliding support top plate 301 is fixedly connected to the operation support table 40 through a sixth positioning bolt 303; an installation guiding groove 401 is provided in the center of the surface of the operation support table 40, which facilitates the first magnetic attraction limiting member 60 to be quickly and accurately placed in a predetermined position, so as to cooperate with the flipping positioning frame 50 for magnetic attraction cooperation.

[0095] The first magnetic attraction limiting member 60 includes a central connection bar 601 and limiting bosses 602 symmetrically arranged at both ends of the central connection bar 601. A first central limiting column 603 is vertically provided in the middle of the limiting bosses 602. A magnetic attraction connection block 604 is provided outside the limiting bosses 602. A first magnetic attraction clamping protrusion 605 is provided on the surface of the magnetic attraction connection block 604. An installation guiding protrusion 606 that cooperates with the installation guiding groove 401 is provided on the bottom surface of the central connection bar 601.

[0096] The flipping positioning frame 50 includes a flipping positioning plate 501 with a frame-shaped structure. Limiting grooves 502 are symmetrically provided on both sides of the inner wall of the flipping positioning plate 501. A magnetic attraction connection groove 507 that cooperates with the magnetic attraction connection block 604 is provided at the bottom of the limiting groove 502. A first magnetic attraction clamping groove 508 that cooperates with the first magnetic attraction clamping protrusion 605 is provided on the inner surface of the magnetic attraction connection groove 507; flipping protrusions 503 are symmetrically provided on the outside of the flipping positioning plate 501, and a flipping shaft 504 is provided outside the flipping protrusions 503; receiving protrusions 505 are provided at the four corners of the surface of the flipping positioning plate 501. A second central limiting column 506 is vertically provided in the middle of the receiving protrusions 505, and a second magnetic attraction clamping groove 509 is provided at the top of the second central limiting column 506.

[0097] The flipping support member 70 includes a support base 701 and a flipping support beam 702 vertically provided on the top of the support base 701. The support base 701 is fixedly connected to the base 10 through a seventh positioning bolt 704. A flipping shaft hole 703 that cooperates with the flipping shaft 504 is provided at the top of the flipping support beam 702.

[0098] The second magnetic attraction limiting member 80 has a frame structure, and a second magnetic attraction engaging protrusion 801 cooperating with the second magnetic attraction engaging groove 509 is provided at the bottom edge, and is magnetically attracted and connected to the top of the flipping positioning frame 50.

[0099] In order to enable the flipping positioning frame 50 to still maintain a horizontal state when there is no support from the operation support platform 40, two limiting transverse grooves distributed along the axis can be opened above and below the circumference of the flipping shaft 504, and then corresponding elastic limiting protrusions are opened on the inner wall of the flipping shaft hole 703. At this time, the flipping positioning frame 50 can be rotated freely, and can also be horizontally limited to a certain extent under the action of the elastic limiting protrusions. For example, when assembling the first magnetic attraction limiting member 60, one hand can press down the operation support platform 40, and the other hand can hold the first magnetic attraction limiting member 60 and put it into the installation guiding groove 401, and then release the operation support platform 40 to restore upward to complete the installation. Embodiment 3

[0100] The third aspect of the present invention further provides an assembly method for an image sensor module, using the above-mentioned assembly tooling, which specifically includes the following steps: Step 1: As Figure 9-11 shown, complete the installation of the assembly tooling, and withdraw the second magnetic attraction limiting member 80 to wait for the assembly of the image sensor heat dissipation module.

[0101] At this time, the second magnetic attraction limiting member 80 is placed near the assembly tooling and waits for subsequent use; the first central limiting post 603 of the first magnetic attraction limiting member 60 waits for the cooperation and placement of the inner pressure clamping mechanism 2, and the second central limiting post 506 of the flipping positioning frame 50 waits for the cooperation and placement of the circuit board 4 of the inner pressure clamping mechanism 2.

[0102] Step 2: As Figure 12-13 shown, sequentially complete the positioning and pre-tightening installation of the inner pressure clamping mechanism 2, the circuit board 4, the sensor module 6, the first heat conducting member 5, and the second magnetic attraction limiting member 80 to form a pre-tightening structure. At this time, the third positioning bolt 561 sequentially passes through the third positioning through hole 56, the third positioning through hole 32 and the third positioning screw hole 236 for pre-tightening, so that the inner pressure clamping mechanism 2, the circuit board 4, the sensor module 6, and the first heat conducting member 5 jointly form an integral body, that is, a pre-tightening structure. Then, the pre-tightening structure is clamped and limited through the magnetic attraction between the second magnetic attraction limiting member 80 and the flipping positioning frame 50 to prevent the pre-tightening structure from detaching from the second central limiting post 506 during the subsequent flipping process.

[0103] Step 3: As Figure 14 shown, flip the pre-tightening structure, withdraw the first magnetic attraction limiting member 60, and tightly install the inner pressure member 1 to clamp the sensor module 6 by the inner pressure clamping mechanism 2.

[0104] As the inner pressure member 1 is continuously tightened, it continuously presses the sliding inner pressure member 22 inward, causing the clamping abutting surface 222 to gradually approach the periphery of the sensor module 6 and finally achieving clamping.

[0105] Step Four: As Figure 15 shown, rotate the flipping positioning frame 50, adjust the pre-tightening structure to a fixed connection structure, that is, tighten the third positioning bolt 561, and complete the soldering of the pins of the sensor module 6 to completely fix the sensor module 6, form an image sensor heat dissipation module, and then withdraw the flipping positioning frame 50.

[0106] To ensure the assembly quality of the image sensor heat dissipation module, before soldering the pins of the sensor module 6, the assembly pose of the sensor module 6 can also be detected to ensure the subsequent soldering quality.

[0107] For scenarios where an insulating heat-conducting member 8 is required, by insulatingly covering the connection between the sensor module 6 and the circuit board 4 with the insulating heat-conducting member 8, the covering area of the insulating heat-conducting member 8 on the circuit board 4 can also be increased simultaneously.

[0108] At this time, the second heat-conducting member 7 can be fastened to the first heat-conducting member 5 through the first positioning bolt 721, which not only realizes the fixed installation of the insulating heat-conducting member 8, conducts heat insulation at the pin location, but also realizes efficient heat transfer between the insulating heat-conducting member 8 and the first heat-conducting member 5. Embodiment 4

[0109] The fourth aspect of the present invention further provides a camera, including: A housing for accommodating and installing the above-mentioned image sensor heat dissipation module; A lens for converging light to the sensor module 6.

[0110] After the above-mentioned image sensor heat dissipation module is realized through the above-mentioned assembly tooling and assembly method, the above-mentioned image sensor heat dissipation module can be fixedly installed in the housing as a whole in cooperation with the lens to complete the installation of the subsequent camera structure.

[0111] In the description of this specification, the description referring to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0112] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. An image sensor module for a sensor module with side-out pins, characterized in that, Comprising: An internal pressure clamping mechanism, which is embedded and installed in the circuit board, and has a receiving cavity in the middle for receiving the sensor module in its initial state; wherein, the pins of the sensor module are connected to the edge of the circuit board close to the receiving cavity; A first heat conducting member, which is thermally connected to the back of the sensor module, and is used to sequentially connect the circuit board and the internal pressure clamping mechanism to form a pre-tightening structure for the sensor module; An internal pressure member, which is connected to the internal pressure clamping mechanism and is used to provide pressure to the internal pressure clamping mechanism; Wherein, the internal pressure member provides pressure to the internal pressure clamping mechanism, so that the internal pressure clamping mechanism forms a clamping force towards the sensor module, thereby restricting the movement of the sensor module; the pre-tightening structure forms a fixed connection structure after the internal pressure clamping mechanism clamps the sensor module.

2. The image sensor module according to claim 1, wherein The internal pressure clamping mechanism includes: An embedded frame, which is embedded and installed in the circuit board, and the inner wall is distributed with a clamping guiding path, and the clamping guiding path gradually approaches the inner wall from the outside to the inside; A sliding internal pressure member, which is used to move along the clamping guiding path after being pressurized, so that the inner end of the sliding internal pressure member clamps the periphery of the sensor module; A limit connecting member, which is used to limit the sliding internal pressure member from disengaging from the clamping guiding path and connect the first heat conducting member.

3. An image sensor module according to claim 2, characterized in that, The center of the limit connecting member is adapted to the embedded frame, and is provided with a limit protrusion for restricting the sensor module from passing through the limit connecting member.

4. An image sensor module according to claim 3, wherein, An elastic limit component is installed at the inner end of the clamping guiding path, and is used to jack up the sliding internal pressure member in the free state, so that the internal pressure clamping mechanism can receive the sensor module in the initial state.

5. An image sensor module according to claim 1, wherein, It further includes an insulating heat conducting member, which insulates and covers the connection between the circuit board and the pins of the sensor module, and is in contact connection with the first heat conducting member, and is used to establish heat conduction between the first heat conducting member and the circuit board.

6. An image sensor module according to claim 5, wherein It further includes a second heat conducting member, which is used to press the insulating heat conducting member and connect the first heat conducting member.

7. An image sensor module according to any one of claims 1-6, characterized in that, The sensor module includes: A plug-in sensor, which includes a sensor body and sensor pins vertically distributed with the sensor body; An adapter, which is plugged and connected with the plug-in sensor, and the edge of the adapter extends outwards to form pins connected to the circuit board; A heat equalizing coating layer, which is used to wrap the plug-in sensor and the adapter, and is composed of a plurality of heat equalizing plates.

8. An assembly tooling for an image sensor module, which is used for assembling the image sensor heat dissipation module as described in any one of claims 1-7, and is characterized in that, Comprising: A base, which is used for the bottom support of the assembly tooling; A plurality of sliding support seats, which are installed on the base along the assembly direction of the image sensor heat dissipation module; A plurality of elastic support components, which are used to elastically support the sliding support seats; An operation support platform, which is fixedly connected with the sliding support seats and is used to support the image sensor heat dissipation module; A flipping positioning frame, which is used for positioning and matching the circuit board; A first magnetic attraction limit member, which is used to position the internal pressure clamping mechanism and is magnetically attracted and connected with the bottom of the flipping positioning frame; A flipping support member, which is used to rotatably install the flipping positioning frame; A second magnetic attraction limit member, which is magnetically attracted and connected with the top of the flipping positioning frame.

9. An assembly method for an image sensor module, using the assembly tooling as described in claim 8, characterized in that, Comprising: Complete the installation of the assembly tooling, and pull out the second magnetic attraction limit member to wait for the assembly of the image sensor heat dissipation module; Sequentially complete the positioning and pre-tightening installation of the internal pressure clamping mechanism, the circuit board, the sensor module, the first heat conducting member, and the second magnetic attraction limit member to form a pre-tightening structure; Flip the pre-tightening structure, pull out the first magnetic attraction limit member, and tightly install the internal pressure member so that the internal pressure clamping mechanism clamps the sensor module; The rotation and flipping positioning frame is adjusted so that the pre-tightening structure becomes a fixed connection structure, and the pin soldering of the sensor module is completed to completely fix the sensor module, forming an image sensor heat dissipation module, and then the flipping positioning frame is removed.

10. A camera, characterized in that, It includes: A housing for accommodating and installing the image sensor heat dissipation module according to any one of claims 1-7; A lens for converging light to the sensor module.

Images