Circuit board and electric connector connected with circuit board

Abstract

The invention provides a circuit board and an electric connector connected with the circuit board, the circuit board comprises a grounding piece and a plurality of signal pads, the grounding piece comprises a plurality of division spaces which are arranged in an up-down penetrating mode, the signal pads are located in the division spaces, and gaps exist between the signal pads and the inner walls of the division spaces. The electric connector comprises a plurality of signal terminals which are in one-to-one correspondence with the plurality of signal pads and are electrically conducted, and the opposite areas of the signal terminals and the signal pads are adjusted by adjusting the sizes of the signal pads in different areas on the circuit board, so that the impedance of the signal terminals is adjusted; besides, the impedance of the signal pads is adjusted according to the sizes of the gaps between the signal pads in different areas and the inner wall of the divided space, so that the impedance matching of different areas of the electric connector is further adjusted, and the signal integrity performance of the electric connector is improved.

Description

Technical Field

[0001] The present invention relates to a circuit board and an electrical connector connected to the circuit board, and in particular to a circuit board capable of adjusting impedance and an electrical connector connected to the circuit board.

Background Art

[0002] A circuit board is connected with an electrical connector. The circuit board includes a plurality of signal conductors, and the electrical connector includes a plurality of signal terminals that are in one-to-one contact with and electrically conduct with the plurality of signal conductors. Due to reasons such as different media or distribution of surrounding conductors around a part of the signal terminals among the plurality of signal terminals, there is an impedance difference between these signal terminals and other signal terminals. This impedance difference causes a time delay between the signal terminals, resulting in signal distortion. In the prior art, those skilled in the art improve the internal structure of the electrical connector, for example, change the structure of a part of the signal terminals to match the impedance of this part of the signal terminals with that of other signal terminals, or make other modifications to the electrical connector to meet the requirements of impedance matching. However, these solutions often require complex structural designs. On the one hand, it may increase the manufacturing difficulty and raise the manufacturing cost. On the other hand, it will also increase the assembly complexity of the electrical connector. Therefore, how to design the product structure to optimize the time delay between the plurality of signal terminals of the electrical connector, thereby reducing signal distortion, still remains a problem to be considered.

[0003] Therefore, it is necessary to design a new circuit board and an electrical connector connected to the circuit board to overcome the above problems.

Summary of the Invention

[0004] Aiming at the problems faced in the background art, the creative purpose of the present invention is to provide a circuit board and an electrical connector connected to the circuit board. By setting the size of the first signal pad on the circuit board to be larger than that of the second signal pad, a split space is provided on the ground plane of the circuit board, and the first gap between the inner wall of the split space and the first signal pad located in the split space is smaller than the second gap between the inner wall of another split space and the second signal pad located in the other split space. As a result, the facing area of the first signal pad and the signal terminal corresponding to and contacting the first signal pad is larger than that of the second signal pad and the signal terminal corresponding to and contacting the second signal pad, thereby reducing the impedance of the signal terminal corresponding to and contacting the first signal pad. In addition, since the first gap is smaller than the second gap, the distance between the first signal pad and the ground plane is reduced, further reducing the impedance of the first signal pad, ensuring the impedance matching of the signal transmission path from the first signal pad to the signal terminal, and being beneficial to signal transmission.

[0005] To achieve the above purpose, the present invention adopts the following technical means:

[0006] A circuit board, characterized in that it includes: a ground plate and a plurality of signal pads are provided in the same layer, the ground plate is provided with a plurality of divided spaces and penetrates in the up and down directions, the plurality of signal pads are respectively located in the plurality of divided spaces, the plurality of signal pads include a plurality of first signal pads and a plurality of second signal pads, there is a first gap between the inner wall of each divided space and each first signal pad, and there is a second gap between the inner wall of each divided space and the second signal pad; wherein, the size of the first signal pad is larger than that of the second signal pad, and the first gap is smaller than the second gap.

[0007] Furthermore, the circuit board has a first area and a second area. In the up and down direction, the upper surface of the first area extends upward beyond the upper surface of the second area. A plurality of first signal pads are provided in the first area, and a plurality of second signal pads are provided in the second area. A plurality of signal terminals in the electrical connector are in one-to-one contact with the plurality of signal pads and are electrically connected.

[0008] Furthermore, the circuit board has a first area and a second area. The first area is provided at the central position of the circuit board, and the second area is arranged farther away from the central position of the circuit board than the first area; a plurality of first signal pads are provided in the first area, and a plurality of second signal pads are provided in the second area; wherein, a plurality of first signal pads at the outermost periphery of the first area enclose a first closed figure, and a plurality of second signal pads at the innermost side of the second area enclose a second closed figure, and the first closed figure is located within the second closed figure.

[0009] Furthermore, the circuit board has a first area and a second area. A plurality of first signal pads are provided in the first area, and a plurality of second signal pads are provided in the second area; wherein, in the direction from the first area to the second area, the sizes of the plurality of first signal pads gradually decrease, and the sizes of the plurality of second signal pads gradually decrease or remain unchanged.

[0010] Furthermore, the circuit board has a first area and a second area. A plurality of first signal pads are located in the first area, and a plurality of second signal pads are located in the second area, wherein the sizes of the divided spaces located in the first area are different from the sizes of the divided spaces located in the second area.

[0011] Furthermore, the circuit board has a first area and a second area. A plurality of first signal pads are provided in the first area, and a plurality of second signal pads are provided in the second area. In the direction from the first area to the second area, the plurality of first gaps gradually increase, and the plurality of second gaps remain unchanged or gradually increase.

[0012] Furthermore, the circuit board has a first area and a second area. A plurality of first signal pads are provided in the first area, and a plurality of second signal pads are provided in the second area; the ground plate includes a plurality of first ground pads located in the first area and a plurality of second ground pads located in the second area, wherein the size of any first ground pad is the same as the size of any second ground pad.

[0013] Furthermore, the grounding piece has a plurality of grounding pads; when viewed in the up-down direction, the distance between any one of the plurality of divided spaces and the plurality of grounding pads adjacent to the divided space is equal, and the grounding contact portions of the plurality of grounding terminals of the electrical connector are in contact with and electrically conduct with the plurality of grounding pads one by one, and the plurality of signal terminals of the electrical connector are in contact with and electrically conduct with the plurality of signal pads one by one, wherein, when viewed in the up-down direction, the distance between the divided space and the grounding contact portions of the plurality of grounding terminals is equal.

[0014] Furthermore, the present application also relates to an electrical connector cooperating with the above-mentioned circuit board, which includes: an insulating body, the insulating body includes a plurality of receiving grooves, a plurality of identical signal terminals and a plurality of identical grounding terminals, one signal terminal and one grounding terminal are respectively received in one receiving groove, wherein, the plurality of signal terminals are in contact with and electrically conduct with the plurality of signal pads one by one, the plurality of grounding terminals are in contact with and electrically conduct with the plurality of grounding pads one by one, when viewed in the up-down direction, the distance between any one of the plurality of divided spaces and the plurality of grounding pads adjacent to the divided space is equal, and each of the grounding terminals in contact with and electrically conducting with the plurality of grounding pads includes a grounding contact portion, and the plurality of grounding contact portions are in contact with the plurality of grounding pads one by one, wherein, when viewed in the up-down direction, the distance between the divided space and the plurality of grounding contact portions is equal.

[0015] Furthermore, the signal terminal has a first portion, a second portion and a third portion. When viewed in the up-down direction, the second portion is located between the first portion and the third portion, and the first portion has a signal contact portion; the signal contact portion abuts against the signal pad in an up-down direction, in the up-down direction, the projection of the first portion of the signal terminal is located within the projection of the signal pad, the projection of the second portion is located within the projection of the first gap or the second gap, and the projection of the third portion is located within the projection of the grounding piece.

[0016] Furthermore, the circuit board has a first region and a second region, a plurality of first signal pads are provided in the first region, and a plurality of second signal pads are provided in the second region;

[0017] Furthermore, the present application also relates to an electrical connector connected to the circuit board, which includes: an insulating body, the insulating body includes a plurality of receiving grooves, a plurality of identical signal terminals, and one signal terminal is received in one receiving groove. Among the plurality of identical signal terminals, the signal terminal in contact with the first signal pad is defined as the first signal terminal, and the signal terminal in contact with the second signal pad is defined as the second signal terminal; after the electrical connector is connected to the circuit board, the first signal terminal has a first volume located outside the receiving groove and exposed in the air, and the second signal terminal has a second volume located outside the receiving groove and exposed in the air, wherein, the first volume is greater than the second volume.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] In this application, by setting the size of the first signal pad to be larger than that of the second signal pad, the facing area between the first signal pad and the signal terminal corresponding to and in contact with the first signal pad is increased, thereby reducing the impedance of the signal terminal. In other words, through the size settings of the first signal pad and the second signal pad, the impedance of the corresponding signal terminal is adjusted. At the same time, the first gap between the grounding sheet and the first signal pad is set to be smaller than the second gap between the grounding sheet and the second signal pad, so as to cooperate with the above size settings of the first signal pad and the second signal pad to further reduce the impedance of the first signal pad, ensuring the impedance matching of the signal transmission path from the first signal pad to the signal terminal and facilitating signal transmission.

Description of the Drawings

[0020] Figure 1 is the front view of the circuit board;

[0021] Figure 2 is the top view of the circuit board;

[0022] Figure 3 is Figure 2 the enlarged view of part A;

[0023] Figure 4 is the top view of the best embodiment of the present invention after removing the insulating layer;

[0024] Figure 5 is Figure 4 the enlarged view of part B;

[0025] Figure 6 is the schematic diagram after the chip, the electrical connector and the circuit board are crimped;

[0026] Figure 7 is the bottom view of a single signal terminal after the electrical connector abuts against the circuit board;

[0027] Figure 8 is the top view of other embodiments of the present invention;

[0028] Figure 9 is Figure 8 the enlarged view of part C.

[0029] Explanation of the reference numerals in the drawings of the specific embodiments:

[0030] Circuit board 1 Grounding piece 11 Partitioned space 111 Signal pad 12 First signal pad S1 Second signal pad S2 Grounding pad 13 First grounding pad T1 Second grounding pad T2 First region 14 Second region 15 First gap P1 Second gap P2 Insulating layer L Opening Q Chip C Electrical connector 2 Insulating body 21 Receiving groove 211 Signal terminal 22 First signal terminal S3 Second signal terminal S4 First part 22a Second part 22b Third part 22c Signal contact part 22a1 Grounding terminal 23 First grounding terminal T3 Second grounding terminal T4 Grounding contact part 231 First closed figure N1 Second closed figure N2

Specific Embodiments

[0031] To better understand the purpose, structure, features, and effects of the present invention, the present invention will be further described below in conjunction with the drawings and specific embodiments.

[0032] As shown in Figure 1 , the circuit board 1 of the present invention defines the front - rear direction as the X - axis, the up - down direction as the Y - axis, and the left - right direction as the Z - axis. Please note that the up, down, left, and right directions in the present invention are only for better understanding the implementation of the present invention, rather than limiting the present invention.

[0033] As shown in Figure 2 and Figure 3 , the circuit board 1 with a multi - layer structure includes a ground sheet 11 and a plurality of signal pads 12 located on the same layer as the ground sheet 11. Among them, the ground sheet 11 includes a plurality of divided spaces 111 penetrating up and down, and a plurality of ground pads 13 that are completely staggered left and right with the divided spaces 111. A plurality of signal pads 12 are correspondingly arranged in a plurality of divided spaces 111. A part of the plurality of signal pads 12 is defined as the first signal pads S1, and the other part is defined as the second signal pads S2. The number of the first signal pads S1 is multiple, and the number of the second signal pads S2 is also multiple. The size of the first signal pads S1 is larger than the size of the second signal pads S2. In this embodiment, the circuit board 1 is a main board. Of course, in other embodiments, the circuit board 1 can also be in the structure of a chip C, an electronic card, etc.

[0034] As shown in Figure 4 , it is defined that the circuit board 1 has a first area 14 and a second area 15. In this embodiment, the first area 14 of the circuit board 1 is located inside the second area 15. In other words, the first area 14 is arranged at the central position of the circuit board 1, and the second area 15 is arranged farther away from the central position of the circuit board 1 than the first area 14, that is, arranged around the circuit board 1. Of course, in other embodiments, the first area 14 and the second area 15 can also be arranged left - right or front - rear; a plurality of first signal pads S1 are arranged in the first area 14, and a plurality of second signal pads S2 are arranged in the second area 15. Looking along the up - down direction, the outermost plurality of first signal pads S1 in the first area 14 enclose a first closed figure N1, and the innermost plurality of second signal pads S2 in the second area 15 enclose a second closed figure N2. The first closed figure N1 is located inside the second closed figure N2; there is a first gap P1 between the inner wall of a divided space 111 and a first signal pad S1 corresponding to it inside, and there is a second gap P2 between the inner wall of another divided space 111 and a second signal pad S2 corresponding to it inside, and the first gap P1 is smaller than the second gap P2.

[0035] As shown in Figure 2 , Figure 4 , Figure 8 , in this embodiment, the sizes of the plurality of first signal pads S1 in the first area 14 are set to be the same, and the sizes of the plurality of second signal pads S2 in the second area 15 are set to be the same. However, in other embodiments (please refer to Figure 3 , Figure 5 andFigure 9 ), in the direction from the first region 14 to the second region 15, the sizes of the plurality of first signal pads S1 gradually decrease, the sizes of the plurality of second signal pads S2 gradually decrease, or the sizes of the plurality of first signal pads S1 gradually decrease and the sizes of the plurality of second signal pads S2 remain unchanged; similarly, in the direction from the first region 14 to the second region 15, the plurality of first gaps P1 gradually increase, the plurality of second gaps P2 gradually increase, or the plurality of first gaps P1 gradually increase and the plurality of second gaps P2 remain unchanged; further explained here, when the sizes of the plurality of first signal pads S1 gradually decrease and the sizes of the plurality of second signal pads S2 gradually decrease, both the plurality of first gaps P1 and the plurality of second gaps P2 can be set to gradually increase. Of course, the plurality of second gaps P2 can also be set to remain unchanged, and the first gap P1 is still set to gradually increase; when the sizes of the plurality of first signal pads S1 gradually decrease and the sizes of the plurality of second signal pads S2 remain unchanged, both the plurality of first gaps P1 and the plurality of second gaps P2 can also be set to gradually increase. Of course, the plurality of second gaps P2 can also be set to remain unchanged, and the first gap P1 is still set to gradually increase; in addition, not only are the sizes of the first signal pad S1 and the second signal pad S2 different and the first gap P1 and the second gap P2 different, but the size of the divided space 111 located in the first region 14 can also be set to be different from the size of the divided space 111 located in the second region 15, as long as the impedances of the first signal pad S1 and the second signal pad S2 can be relatively well matched. In addition, when viewed in the up and down direction, in the present application, the distance between any one of the plurality of divided spaces 111 and the plurality of ground pads 13 adjacent to the divided space 111 is set to be equal.

[0036] As Figure 1As shown in the figure, in this embodiment, the ground pad 13, the signal pad 12, and the ground piece 11 are actually all located on the second layer of the circuit board 1. The first layer is the insulating layer L, and the first layer is located above the second layer. The first layer includes a plurality of openings Q with the same size. The plurality of openings Q with the same size are correspondingly arranged with the plurality of signal pads 12 one by one. In other words, that is, the plurality of signal pads 12 are correspondingly exposed in the openings Q with the same size. Looking along the up-and-down direction, the sizes of the parts of the first signal pad S1 and the second signal pad S2 located in the plurality of openings Q are the same; the plurality of ground pads 13 are also exposed in the corresponding openings Q. It should be noted that the ground pad 13 in this embodiment is actually the part of the grounding component exposed in the opening Q. Define the ground pad 13 located in the first area 14 as the first ground pad T1, and the ground pad 13 located in the second area 15 as the second ground pad T2. In this embodiment, the size of any first ground pad T1 is the same as that of any second ground pad T2. Of course, in other embodiments, the size of any first ground pad T1 can also be set to be smaller than that of any second ground pad T2 according to requirements, or the size of any first ground pad T1 can be set to be larger than that of any second ground pad T2, or the sizes of the plurality of first ground pads T1 are different, and the sizes of the plurality of second ground pads T2 are also different.

[0037] As Figure 6 shown, an electrical connector 2 is in abutting connection with the above-mentioned circuit board 1 along the up-and-down direction. The electrical connector 2 includes an insulating body 21 and a plurality of signal terminals 22 and a plurality of ground terminals 23 received in the insulating body 21; the insulating body 21 includes a plurality of receiving grooves 211, and the plurality of signal terminals 22 and the plurality of ground terminals 23 are correspondingly received in the plurality of receiving grooves 211 one by one. Each signal terminal 22 has a signal contact portion 22a1, and each ground terminal 23 has a ground contact portion 231; please note that in this embodiment, the plurality of signal terminals 22 are the same, and the plurality of ground terminals 23 are also the same. That is to say, the size and structure of any signal terminal 22 are the same, and the size and structure of any ground terminal 23 are also the same. In addition, the structure and size between any ground terminal 23 and any signal terminal 22 can be set to be the same or different according to requirements;

[0038] As Figure 7 shown, each signal terminal 22 includes a first portion 22a, a second portion 22b, and a third portion 22c. The first portion 22a has a signal contact portion 22a1, and the signal contact portion 22a1 is used to contact the above-mentioned circuit board 1; looking along the up-and-down direction, the second portion 22b is located between the first portion 22a and the third portion 22c; similarly, each ground terminal 23 in this embodiment includes a ground contact portion 231, and the ground contact portion 231 is used to contact the above-mentioned circuit board 1.

[0039] As Figure 2 and Figure 7 shown, a plurality of signal terminals 22 are in one-to-one correspondence with a plurality of signal pads 12 through signal contact portions 22a1 and are electrically connected. A part of the plurality of signal terminals 22 is defined as a first signal terminal S3, and another part is defined as a second signal terminal S4. In this embodiment, the number of the first signal terminals S3 is plural, and the number of the second signal terminals S4 is also plural. Along the up-down direction, the first signal terminal S3 abuts against the large-sized first signal pad S1, and the second signal terminal S4 abuts against the small-sized second signal pad S2; a plurality of ground terminals 23 are in one-to-one correspondence with a plurality of ground pads 13 and are electrically connected. A part of the plurality of ground terminals 23 is defined as a first ground terminal T3, and another part is defined as a second ground terminal T4. In this embodiment, the number of the first ground terminals T3 is plural, and the number of the second ground terminals T4 is also plural. Along the up-down direction, the first ground terminal T3 abuts against the first ground pad T1, and the second ground terminal T4 abuts against the second ground pad T2.

[0040] Please note that in some embodiments, since the electrical connector 2 is provided on the circuit board 1, the circuit board 1 will warp, and such warping will cause the upper surface of the first area 14 of the circuit board 1 to extend upward beyond the upper surface of the second area 15 of the circuit board 1; of course, in some other embodiments, it may also be that in the initial design stage of the circuit board 1, the upper surface of the first area 14 is set to be higher than the upper surface of the second area 15; in this application, the matching relationship between the electrical connector 2 and the above-mentioned circuit board 1 is set as follows: along the up-down direction, the first signal terminal S3 abuts against the large-sized first signal pad S1, the second signal terminal S4 abuts against the small-sized second signal pad S2, a plurality of first signal pads S1 are provided in the first area 14, and a plurality of second signal pads S2 are provided in the second area 15. The purpose of this design is to provide a solution to the problem of impedance mismatch in different areas (the first area 14, the second area 15).

[0041] This application exemplifies one cause of impedance mismatch in the electrical connector 2, and the following is a specific description. As Figure 6As shown, a chip C and a crimping structure (not shown) are provided above the electrical connector 2, and the above-mentioned circuit board 1 is provided below the electrical connector 2. When the crimping structure fixes the chip C to the electrical connector 2, so that the chip C is electrically connected to the above-mentioned circuit board 1 through the electrical connector 2, due to the uneven abutting force of the crimping structure acting on the chip C. For example, when the crimping structure adopts a surrounding crimping method, the abutting force received by the surrounding positions is greater. Compared with the surrounding positions, the abutting force received by the central position is smaller. As a result, not only the central position of the insulating body 21 of the electrical connector 2 warps upward more than the surrounding positions, but also for the signal terminal 22 at the central position, the volume located outside the receiving groove 211 and exposed in the air is larger than the volume of the signal terminal 22 at the surrounding positions located outside the receiving groove 211 and exposed in the air, resulting in a higher impedance of the signal terminal 22 at the central position; therefore, the impedance of the signal terminal 22 at the central position should be reduced to match the impedance of the signal terminal 22 at the surrounding positions.

[0042] In order to reduce the impedance of the signal terminal 22 at the above-mentioned central position, in this embodiment, the first region 14 and the second region 15 on the circuit board 1 respectively correspond to the central position and the surrounding positions of the above-mentioned electrical connector 2. Then, the signal terminal 22 at the central position is the first signal terminal S3, and the signal terminal 22 at the surrounding positions is the second signal terminal S4. Specifically, the first signal terminal S3 has a first volume located outside the receiving groove 211 and exposed in the air, and the second signal terminal S4 has a second volume located outside the receiving groove 211 and exposed in the air. Among them, the first volume is larger than the second volume, which results in an impedance mismatch of the electrical connector 2 and affects signal transmission. Therefore, the large-sized first signal pad S1 is matched with the first signal terminal S3, and the small-sized second signal pad S2 is matched with the second signal terminal S4, so as to increase the facing area between the first signal terminal S3 and the first signal pad S1, increase the capacitance of the first signal terminal S3, and achieve the purpose of reducing the impedance of the first signal terminal S3.

[0043] As Figure 2 shown, after the circuit board 1 is electrically connected to the electrical connector 2, when viewed in the up-down direction, the distance between the divided space 111 and the grounding contact portions 231 of the plurality of grounding terminals 23 adjacent to the divided space 111 is equal. Please refer to Figure 3 , select a part of the second region of the circuit board in this embodiment for description. Among the plurality of divided spaces 111, take the divided space M as an example. The plurality of grounding terminals 23 adjacent to the divided space M are G1, G2, G3, G4, G5, G6, and the distances between the divided space M and the grounding terminals G1, G2, G3, G4, G5, G6 are all equal.

[0044] As Figure 7As shown, after the circuit board 1 is electrically connected to the electrical connector 2, in the up and down direction, the projection of the first part 22a of the signal terminal 22 is located within the projection of the signal pad 12, the projection of the second part 22b is located within the first gap P1 or within the second gap P2, and the projection of the third part 22c is located within the projection of the ground tab 11.

[0045] In summary, the present invention has the following beneficial effects:

[0046] 1. In this application, by setting the size of the first signal pad S1 to be larger than the size of the second signal pad S2, the facing area between the first signal pad S1 and the signal terminal 22 that correspondingly contacts the first signal pad S1 is increased, thereby reducing the impedance of the signal terminal 22. In other words, in this application, by setting the sizes of the first signal pad S1 and the second signal pad S2, the impedance of the corresponding signal terminal 22 is adjusted. At the same time, the first gap P1 between the ground tab 11 and the first signal pad S1 is set to be smaller than the second gap P2 between the ground tab 11 and the second signal pad S2, so as to cooperate with the above settings of the sizes of the first signal pad S1 and the second signal pad S2 to further reduce the impedance of the first signal pad

[0047] S1, ensuring the impedance matching of the signal transmission path from the first signal pad S1 to the signal terminal 22, which is beneficial to signal transmission.

[0048] 2. Compared with the surface of the first region 14 being flush with the surface of the second region 15, setting the upper surface of the first region 14 to extend upward beyond the upper surface of the second region 15 makes the first signal pad S1 located in the first region 14 close to the signal terminal 22 that correspondingly contacts it, thereby further adjusting the impedance of the signal terminal 22 to meet the signal transmission requirements.

[0049] 3. Since the holding structure presses and fixes the chip C on the electrical connector 2 in a manner of crimping around its four sides, and the electrical connector 2 is fixed on the circuit board 1, the central position of the circuit board 1 is the central position of the electrical connector 2. In other words, the holding structure directly presses downward against the four sides of the chip C, thereby bringing the chip C into contact with the electrical connector 2 and achieving electrical conduction. It is precisely this crimping method of the holding structure that causes the signal terminal 22 located at the central position of the electrical connector 2 to be under less pressure from the chip C than the signal terminal 22 located at the outer position away from the central position of the electrical connector 2. Therefore, compared with the signal terminal 22 under greater pressure from the chip C, the elastic deformation amount (shrinkage amount) of the signal terminal 22 under less pressure from the chip C into the insulating body 21 of the electrical connector 2 is smaller. So, it will be more exposed to the air than the signal terminal 22 under greater pressure from the chip C. The difference in the dielectric constants of the insulating body 21 and the air results in a higher impedance of the signal terminal 22 that is more exposed to the air, leading to impedance mismatch of the electrical connector 2. In this application, the first region 14 is provided at the central position of the circuit board 1, the second region 15 is arranged farther away from the central position of the circuit board 1 than the first region 14, and the first region 14

[0050] The outermost plurality of first signal pads S1 enclose to form a first closed figure N1, and the plurality of second signal pads S2 arranged at the innermost side of the second region 15 enclose to form a second closed figure N2, thereby matching the impedance of the first region 14 with the impedance of the second region 15, which is beneficial to the signal transmission of the electrical connector 2.

[0051] 4. The circuit board 1 has a first region 14 and a second region 15. A plurality of first signal pads S1 are provided in the first region 14, and a plurality of second signal pads S2 are provided in the second region 15. And in the direction from the first region 14 to the second region 15, the sizes of the plurality of first signal pads S1 gradually decrease, and the sizes of the plurality of second signal pads S2 gradually decrease or remain unchanged, so that the impedance of the signal terminal 22 in contact with the first signal pad S1 with gradually decreasing size can be accurately adjusted within the first region 14

[0052] When the sizes of the plurality of second signal pads S2 also gradually decrease, the impedance of the signal terminal 22 in contact with the second signal pad S2 with gradually decreasing size can also be accurately adjusted within the second region 15, thereby better optimizing the impedance of the electrical connector 2 and being beneficial to signal transmission.

[0053] 5. Since the size of the divided space 111 located in the first region 14 is different from the divided space located in the second region 15

[0054] The size of 111 is such that in the first region 14 and the second region 15 on the circuit board 1, the sizes of the first gap P1, the second gap P2, and the first signal pad S1, the second signal pad S2 can be freely adjusted based on the different-sized divided spaces 111 according to requirements, so as to satisfy that the size of the first signal pad S1 is greater than the size of the second signal pad S2, and the first gap P1 is less than the second gap P2, in order to adjust the first signal pad S1 and the second signal pad S2

[0055] and the impedance of the corresponding signal terminal 22, which is beneficial to signal transmission.

[0056] 6. The circuit board 1 has a first region 14 and a second region 15. A plurality of first signal pads S1 are provided in the first region 14, and a plurality of second signal pads S2 are provided in the second region 15. In the direction from the first region 14 to the second region 15, the plurality of first gaps P1 gradually increase, and the plurality of second gaps P2 remain unchanged or gradually increase, so that the impedance of the first signal pad S1 can be accurately adjusted in the first region 14. When the plurality of second gaps P2 also gradually increase, the impedance of the signal terminal 22 in contact with the second signal pad S2 with a gradually decreasing size can also be accurately adjusted in the second region 15, thereby better optimizing the impedance of the electrical connector 2 and being beneficial to signal transmission.

[0057] 7. When viewed in the up-and-down direction, in the present application, the distance between any one of the plurality of divided spaces 111 and the plurality of ground pads 13 adjacent to the divided space 111 is equal. The ground contact portions 231 of the plurality of ground terminals 23 of the electrical connector 2 are in one-to-one correspondence with the plurality of ground pads 13 in contact and electrically conductive, and the distance between the divided space 111 and the ground contact portions 231 of the plurality of ground terminals 23 is equal. Thus, for the signal pad 12 located in the divided space 111 and the signal terminal 22 in contact with the signal pad 12, the electromagnetic field distribution generated by the plurality of ground terminals 23 around it is relatively uniform, which is beneficial to the transmission of the signal in the transmission path from the signal pad 12 to the signal terminal 22, and when viewed in the up-and-down direction, the ground contact portions

[0058] 231 of the plurality of ground terminals 23 being equidistant from the divided space 111 also ensures the distance between the signal terminal 22 and the ground terminal 23, preventing the signal terminal 22 and the ground terminal 23 from contacting and short-circuiting.

[0059] 8. When viewed in the up-and-down direction, the present application is provided with a plurality of identical signal terminals 22 and a plurality of identical ground terminals

[0060] 23. The distance between any one of the plurality of divided spaces 111 and the plurality of ground pads 13 adjacent to the divided space 111 is also set to be equal. Each ground terminal 23 in the plurality of ground terminals 23 that is in contact with and electrically conducts to the plurality of ground pads 13 includes a ground contact portion 231. The plurality of ground contact portions 231 are respectively and correspondingly abutted against the plurality of ground pads 13. Wherein, when viewed in the up-down direction, the distance between the divided space 111 and the plurality of ground contact portions 231 is also set to be equal. Thus, for the signal pad 12 located in the divided space 111 and the signal terminal 22 in contact with the signal pad 12, the electromagnetic field distribution generated by the plurality of identical ground terminals 23 around them is relatively uniform, which is beneficial to the transmission of the signal in the transmission path from the signal pad 12 to the signal terminal 22. And the equal distance between the ground contact portions 231 of the plurality of ground terminals 23 and the divided space 111 when viewed in the up-down direction also ensures the distance between the signal terminal 22 and the ground terminal 23, preventing the signal terminal 22 and the ground terminal 23 from contacting and short-circuiting. In addition, the electrical connector 2 includes a plurality of identical signal terminals

[0061] 22. That is to say, there is no need to adjust the structure of some of the plurality of signal terminals 22. Only through the structural design of the circuit board 1 can the impedance of the signal terminals 22 be adjusted, so that only one set of molds for manufacturing the signal terminals 22 is required, simplifying the manufacturing process of the electrical connector 2 and saving costs.

[0062] 9. In this application, the projection of the third part 22c of the above-mentioned signal terminal 22 is located within the projection of the ground sheet 11, so that the capacitance existing between the signal terminal 22 and the ground sheet 11 can reduce the impedance of the signal terminal 22, which is beneficial to signal transmission.

[0063] 10. After the electrical connector 2 is connected to the circuit board 1, the first signal terminal S3 has a first volume located outside the receiving groove 211 and exposed in the air, and the second signal terminal S4 has a second volume located outside the receiving groove 211 and exposed in the air. Wherein, the first volume is larger than the second volume. That is to say, the dielectric constants around the same first signal terminal S3 and second signal terminal S4 are different, which also makes the impedances of the first signal terminal S3 and the second signal terminal S4 different. Such a difference will cause a time delay between the signal terminals 22, resulting in signal distortion. In order to avoid signal distortion, the larger-sized first signal pad S1 is set to be in contact with the first signal terminal S3, and the smaller-sized second signal pad S2 is in signal contact with the second signal terminal S4. Thus, compared with the second signal terminal S4, the capacitance of the first signal terminal S3 is increased to reduce the impedance of the first signal terminal S3, making the impedances of the signal terminals 22 in the electrical connector 2 match and reducing the signal distortion caused by the time delay.

[0064] The above detailed description is only for the description of the preferred embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the content of this creative specification and illustrations are included in the patent scope of this creation.

Claims

1. A circuit board, characterized in that, Including: In the same layer, a ground plate and a plurality of signal pads are provided. The ground plate is provided with a plurality of divided spaces and penetrates in the up and down directions. The plurality of signal pads are respectively located in the plurality of divided spaces. The plurality of signal pads include a plurality of first signal pads and a plurality of second signal pads. There is a first gap between the inner wall of each divided space and each first signal pad, and there is a second gap between the inner wall of each divided space and the second signal pad. Among them, the size of the first signal pad is larger than that of the second signal pad, and the first gap is smaller than the second gap.

2. The circuit board according to claim 1, wherein: The circuit board has a first area and a second area. In the up and down direction, the upper surface of the first area extends upward beyond the upper surface of the second area. The plurality of first signal pads are provided in the first area, and the plurality of second signal pads are provided in the second area. A plurality of signal terminals in the electrical connector are in one-to-one contact with the plurality of signal pads and are electrically connected.

3. The circuit board according to claim 1, wherein: The circuit board has a first area and a second area. The first area is provided at the central position of the circuit board, and the second area is arranged farther away from the central position of the circuit board than the first area. The plurality of first signal pads are provided in the first area, and the plurality of second signal pads are provided in the second area. Among them, the plurality of first signal pads at the outermost periphery of the first area enclose a first closed figure, and the plurality of second signal pads at the innermost side of the second area enclose a second closed figure, and the first closed figure is located within the second closed figure.

4. The circuit board according to claim 1, wherein The circuit board has a first area and a second area. The plurality of first signal pads are provided in the first area, and the plurality of second signal pads are provided in the second area. Among them, in the direction from the first area to the second area, the sizes of the plurality of first signal pads gradually decrease, and the sizes of the plurality of second signal pads gradually decrease or remain unchanged.

5. The circuit board according to claim 1, wherein: The circuit board has a first area and a second area. The plurality of first signal pads are located in the first area, and the plurality of second signal pads are located in the second area. Among them, the size of the divided space located in the first area is different from the size of the divided space located in the second area.

6. The circuit board according to claim 1, characterized in that: The circuit board has a first area and a second area. The plurality of first signal pads are provided in the first area, and the plurality of second signal pads are provided in the second area. In the direction from the first area to the second area, the plurality of first gaps gradually increase, and the plurality of second gaps remain unchanged or gradually increase.

7. The circuit board according to claim 1, characterized in that: The circuit board has a first area and a second area. The plurality of first signal pads are provided in the first area, and the plurality of second signal pads are provided in the second area. The ground plate includes a plurality of first ground pads located in the first area and a plurality of second ground pads located in the second area. Among them, the size of any one of the first ground pads is the same as the size of any one of the second ground pads.

8. The circuit board according to claim 1, wherein: The ground plate has a plurality of ground pads. When viewed in the up and down direction, the distance between any one of the plurality of divided spaces and the plurality of adjacent ground pads is equal. The contact parts of the plurality of ground terminals of the electrical connector are in one-to-one contact with the plurality of ground pads and are electrically connected. The plurality of signal terminals of the electrical connector are in one-to-one contact with the plurality of signal pads and are electrically connected. Among them, when viewed in the up and down direction, the distance between the divided space and the contact parts of the plurality of ground terminals is equal.

9. An electrical connector for mating with the circuit board described in claim 1, comprising: an insulating body including a plurality of receiving grooves, a plurality of identical signal terminals, and a plurality of identical ground terminals, wherein one signal terminal and one ground terminal are respectively received in one receiving groove, wherein, A plurality of signal terminals are in one-to-one correspondence with and in electrical conduction contact with a plurality of signal pads, and a plurality of ground terminals are in one-to-one correspondence with and in electrical conduction contact with a plurality of ground pads. When viewed in the up-down direction, the distance between any one of the plurality of divided spaces and the plurality of ground pads adjacent to the divided space is equal. Each of the plurality of ground terminals that is in contact with and in electrical conduction with the plurality of ground pads includes a contact portion, and the plurality of contact portions are in one-to-one correspondence and abut against the plurality of ground pads. Among them, when viewed in the up-down direction, the distance between the divided space and the plurality of contact portions is equal.

10. The electrical connector according to claim 9, wherein: The signal terminal has a first portion, a second portion, and a third portion. When viewed in the up-down direction, the second portion is located between the first portion and the third portion, and the first portion has a signal contact portion. The signal contact portion abuts against the signal pad in an up-down direction. In the up-down direction, the projection of the first portion of the signal terminal is located within the projection of the signal pad, the projection of the second portion is located within the projection of the first gap or the second gap, and the projection of the third portion is located within the projection of the ground sheet.

11. An electrical connection assembly, comprising: The circuit board as described in claim 1, the circuit board having a first region and a second region, a plurality of first signal pads being disposed in the first region, and a plurality of second signal pads being disposed in the second region; An electrical connector connected to the circuit board, comprising: an insulating body including a plurality of receiving grooves, a plurality of identical signal terminals, one signal terminal being received in one receiving groove, among the plurality of identical signal terminals, the signal terminal in contact with the first signal pad is defined as the first signal terminal, and the signal terminal in contact with the second signal pad is defined as the second signal terminal; after the electrical connector is connected to the circuit board, the first signal terminal has a first volume located outside the receiving groove and exposed in the air, and the second signal terminal has a second volume located outside the receiving groove and exposed in the air, wherein, The first volume is greater than the second volume.

Images