A flexible circuit board bending and pressing integrated device

Abstract

The present invention relates to the field of flexible circuit board processing, and discloses an integrated device for bending and pressing flexible circuit boards, including a device body, a control module, a vertical frame, a bending mechanism, a pressing mechanism and a storage rack, which are used for processing the bending and pressing of flexible circuit boards. There are also a segmented temperature control module, a switching and purging module, a heat transfer and flattening module and a release compensation module. The segmented temperature control module switches to exchange the hot and cold temperatures of the flexible circuit board along with the bending action of the bending mechanism. The switching and purging module purifies the operating environment of the bending mechanism. The heat transfer and flattening module makes flexible contact with the pressing surface of the pressing mechanism and compensates for the deformation generated on the pressing surface during heat transfer. The release compensation module realizes omission compensation collection for the transfer of the flexible circuit board; synchronizing with the bending action of the bending mechanism, segmented temperature control adjustment is set for the flexible circuit board substrate, the yield strength of the material is reduced in the preheating and softening stage, and after the bending is completed, the cooling module is switched to give rapid shaping to reduce the bending angle error.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit board processing, and more specifically, it relates to an integrated device for bending and pressing flexible circuit boards. Background Art

[0002] A flexible circuit board is a printed circuit board made of a flexible insulating material, with characteristics such as being bendable, foldable, and wound. An integrated device for bending and pressing is an automated processing equipment that integrates functions such as bending and forming, hot pressing and curing, and electrical testing, and is designed specifically for the complex form processing requirements of flexible circuit boards.

[0003] During the bending process of a flexible circuit board, the elastic modulus of the base material that is not preheated and softened increases at low temperatures. Microcracks or even fractures are likely to occur during bending, the ductility of the copper foil decreases, the interfacial bonding force between the base material layers decreases, delamination is caused by the difference in the thermal expansion coefficients of each layer of material during bending, the brittleness of the material increases during cold bending, forming permanent creases, and when there is no cooling and shaping link after the bending process, the deviation of the material's springback angle causes warping and deformation, affecting the subsequent assembly accuracy of the flexible circuit board.

[0004] During the processing environment, with the loading and transfer of the base material and other materials, it is inevitable to carry and attach dust particles from the outside to the bending mechanism area, causing local stress concentration, leading to copper foil cracks or covering film damage. When dust is embedded in the bonding surface between the covering film and the copper foil, it may damage the interfacial adhesion force, resulting in delamination or warping and deformation. Summary of the Invention

[0005] The present invention provides an integrated device for bending and pressing flexible circuit boards, which solves the technical problem in the related art that the bending and pressing of flexible circuit boards are affected by temperature and external dust particles, resulting in poor bending and pressing effects.

[0006] The present invention provides an integrated device for bending and pressing flexible circuit boards, including:

[0007] A device body, a control module, a vertical frame, a bending mechanism, a pressing mechanism, and a storage rack, which are used for processing the bending and pressing of flexible circuit boards;

[0008] A segmented temperature control module, a switching and purging module, a heat transfer and leveling module, and a release compensation module. The segmented temperature control module switches the hot and cold temperatures of the flexible circuit board along with the bending action of the bending mechanism. The switching and purging module purifies the operating environment of the bending mechanism. The heat transfer and leveling module makes flexible contact with the pressing surface of the pressing mechanism and compensates for the deformation generated on the pressing surface during heat transfer. The release compensation module realizes omission compensation and collection for the transfer of the flexible circuit board;

[0009] The segmented temperature control module includes a bending piece, which is slidably connected to the middle of a bending mechanism. A first placement seat is fixedly connected to the middle of the bending mechanism directly below the bending piece, and a housing is fixedly connected to the outside of the first placement seat inside the equipment body;

[0010] The segmented temperature control module further includes:

[0011] A push rod, which is fixedly connected to the bending piece. A connecting spring is fixedly connected inside the push rod, and the other end of the connecting spring is fixedly connected to the equipment body. A rotating piece is sleeved on the outer wall of the push rod;

[0012] One side of the top of the rotating piece is fixedly connected with a preheating module, and the other side of the top of the rotating piece is fixedly connected with a cooling module. A cavity is formed inside the first placement seat, and the preheating module, the cooling module and the cavity are on the same horizontal line.

[0013] As a further optimized solution of the present invention, the outer wall of the rotating piece is rotatably connected to the inner wall of the housing. An annular rail is fixedly connected to the bottom of the rotating piece, and a guiding ball is fixedly connected to the inner wall of the housing. The outer wall of the guiding ball is slidably connected to the inner wall of the annular rail.

[0014] As a further optimized solution of the present invention, a right-angle plate is fixedly connected to the outer wall of the bottom end of the push rod. A ball is rotatably connected to the middle of the top end of the right-angle plate. A transmission groove is formed on the outer wall of the rotating piece, and the outer wall of the ball is slidably connected to the inner wall of the transmission groove.

[0015] As a further optimized solution of the present invention, the switching and purging module includes:

[0016] A fan, which is fixedly connected to the top of the push rod. A three-way pipe is rotatably connected to the inside of the top of the push rod of the fan. Wedge-shaped covers are fixedly connected to the two ends of the fan away from the three-way pipe, and the bottom of the wedge-shaped cover abuts against the top of the first placement seat.

[0017] As a further optimized solution of the present invention, the heat transfer and leveling module includes:

[0018] A pressing plate, which is slidably connected to the middle of a pressing mechanism. A silica gel pad is fixedly connected to the bottom of the pressing plate. A central cavity, a transition cavity and an edge cavity are sequentially formed in the silica gel pad from the center to the outside. A plurality of flow guiding plates are arranged on the inner walls of the central cavity, the transition cavity and the edge cavity, and the number of the flow guiding plates decreases from the center to the outside. Heat transfer particles are filled in the central cavity, the transition cavity and the edge cavity, and a pair of guiding blocks are fixedly connected to both sides of the inner wall of the central cavity.

[0019] As a further optimization scheme of the present invention, the internal rotation of the silicone pad is connected to a transmission gear, one side of the outer wall of the transmission gear is meshed with a trigger tooth plate, and the other side of the outer wall of the transmission gear is meshed with a lower pressure tooth plate. The guide blocks on both sides are respectively slidably connected to the inner walls of the trigger tooth plate and the lower pressure tooth plate, and the bottom of the lower pressure tooth plate is fixedly connected to a compensation ring, and the outer wall of the compensation ring corresponds to the inner wall of the matching transition cavity and the edge cavity.

[0020] As a further optimization solution of the present invention, the release compensation module includes:

[0021] A stepper motor is fixedly connected to the outer wall of the stand, the driving end of the stepper motor is fixedly connected to a toggle member, the interior of the stand is fixedly connected to a hollow cylinder, the interior of the hollow cylinder is slidably connected to an ejection member, the outer wall of the toggle member is sleeved with an energy storage spring, and the ejection member and the hollow cylinder are connected through the energy storage spring.

[0022] As a further optimization scheme of the present invention, abutment rods are fixedly connected to both sides of the inner wall of the ejection part, and the abutment rods on both sides abut against the toggle part respectively. A knocking plate is fixedly connected to the outer wall of the ejection part, and the knocking plate and the pressing plate are located on the same horizontal line.

[0023] As a further optimization scheme of the present invention, the middle part of the outer side of the pressing plate is rotatably connected to a connecting plate, the top of the pressing plate is rotatably connected to an electric telescopic rod, the telescopic rod end of the electric telescopic rod is hinged to the connecting plate, and the middle parts of both sides of the connecting plate are fixedly connected to vacuum suction cups.

[0024] The beneficial effects of the present invention are:

[0025] 1. The flexible circuit board bending and pressing integrated equipment described in the present invention sets segmented temperature control adjustment for the flexible circuit board substrate to be bent through the bending action of the synchronous bending mechanism, and preheats and softens the flexible circuit board substrate before the bending operation. The preheating and softening stage can effectively reduce the yield strength of the material, making it easier for the flexible circuit board to achieve small angle adjustments during the bending process. After the bending is completed, the cooling module is switched to quickly set the shape, suppress material rebound, and reduce the bending angle error. The segmented temperature control treatment can optimize the crystallinity distribution, so that the bending part has higher fatigue resistance while maintaining flexibility.

[0026] 2. The flexible circuit board bending and pressing integrated equipment described in the present invention corresponds to the temperature control treatment of the bending process. While adjusting the switching action, gas purge is set according to the operating environment of the bending mechanism to blow away the dust particles that may be carried on the flexible circuit board substrate through air supply, thereby ensuring the cleanliness of the bending area and reducing the generation of microcracks caused by foreign body indentations during the bending process of the flexible circuit board.

[0027] 3. In the integrated flexible circuit board bending and pressing device of the present invention, by providing a flexible material silicone pad on the contact surface of the hot press head, flexible contact is made for the pressing treatment of the base material and the copper foil. According to the pressing area, gradient heat transfer measures are set, and partition heat transfer is set corresponding to the pressing range of the flexible circuit board. The temperature diffuses from the center to the outside in the pressing area, and the gradient transfer suppresses the warping of the copper foil. Moreover, corresponding to the different expansion deformations of the silicone pad caused by heat transfer in different areas, measures for slowing down excessive deformation protection and defect leveling in the deformed area are set, so that the contact between the silicone pad and the flexible circuit board can maintain full adhesion, giving a consistent pressing strength and ensuring the tight bonding between the copper foil and the base material.

[0028] 4. In the integrated flexible circuit board bending and pressing device of the present invention, by setting a release compensation module on the transfer path of the flexible circuit board, when the flexible circuit board product transferred by the vacuum suction cup moves to the minimum distance above the storage rack, a knocking action is triggered so that the incompletely released flexible circuit board can be normally detached and collected into the storage rack, which is more convenient without manual intervention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is an overall three-dimensional schematic diagram of an integrated flexible circuit board bending and pressing device proposed by the present invention.

[0030] Figure 2 It is an internal structure schematic diagram of the device body in an integrated flexible circuit board bending and pressing device proposed by the present invention.

[0031] Figure 3 It is a partial structure schematic diagram of the bending mechanism in an integrated flexible circuit board bending and pressing device proposed by the present invention.

[0032] Figure 4 For an integrated flexible circuit board bending and pressing device proposed by the present invention Figure 3 The enlarged schematic diagram at position A.

[0033] Figure 5 It is a schematic diagram of the bending part of an integrated flexible circuit board bending and pressing device proposed by the present invention.

[0034] Figure 6 For an integrated flexible circuit board bending and pressing device proposed by the present invention Figure 5 The enlarged schematic diagram at position B.

[0035] Figure 7 It is a vertical sectional schematic diagram of the outer shell in an integrated flexible circuit board bending and pressing device proposed by the present invention.

[0036] Figure 8Partial structural schematic diagram of the pressing mechanism in an integrated device for bending and pressing flexible circuit boards proposed by the present invention.

[0037] Figure 9 Of an integrated device for bending and pressing flexible circuit boards proposed by the present invention Figure 8 Enlarged schematic diagram at position C.

[0038] Figure 10 Schematic diagram of the split state of the partial structure of the pressing mechanism in an integrated device for bending and pressing flexible circuit boards proposed by the present invention.

[0039] Figure 11 Of an integrated device for bending and pressing flexible circuit boards proposed by the present invention Figure 10 Enlarged schematic diagram at position D.

[0040] Figure 12 Schematic diagram of the transfer path of the flexible circuit board in an integrated device for bending and pressing flexible circuit boards proposed by the present invention.

[0041] Figure 13 Internal structural schematic diagram of the vertical frame of an integrated device for bending and pressing flexible circuit boards proposed by the present invention.

[0042] Figure 14 Of an integrated device for bending and pressing flexible circuit boards proposed by the present invention Figure 13 Enlarged structural schematic diagram at position E.

[0043] Figure 15 Schematic diagram of the split state of the partial structure of the release compensation module in an integrated device for bending and pressing flexible circuit boards proposed by the present invention.

[0044] In the figure:

[0045] 1. Equipment body; 2. Control module; 3. Vertical frame; 4. Bending mechanism; 5. Pressing mechanism; 6. Storage rack;

[0046] The segmented temperature control module 7 includes:

[0047] 701. Bending piece; 702. First placement seat; 703. Push rod; 704. Outer shell; 705. Rotating piece; 706. Connecting spring; 707. Transmission groove; 708. Right-angle plate; 709. Ball; 710. Ring track; 711. Guide ball; 712. Preheating module; 713. Cooling module.

[0048] The switching purge module 8 includes:

[0049] 801. Fan; 802. Three-way pipe; 803. Wedge-shaped cover.

[0050] The heat transfer and leveling module 9 includes:

[0051] 901, Laminating plate; 902, Silicone pad; 903, Central cavity; 904, Transition cavity; 905, Edge cavity; 906, Flow guide plate; 907, Heat transfer particles; 908, Trigger tooth plate; 909, Transmission gear; 910, Guide block; 911, Lower pressing tooth plate; 912, Compensation ring;

[0052] The release compensation module 10 includes:

[0053] 1001, Stepper motor; 1002, Poking part; 1003, Hollow cylinder; 1004, Energy storage spring; 1005, Ejecting part; 1006, Contact rod; 1007, Knocking plate.

[0054] 11, Electric telescopic rod; 12, Connecting plate; 13, Vacuum sucker. Specific embodiments

[0055] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that discussing these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein, and the functions and arrangements of the elements discussed can be changed without departing from the scope of protection of the content of this specification. Each example can omit, substitute, or add various processes or components as needed. Additionally, the features described in some examples can also be combined in other examples.

[0056] Example 1

[0057] As Figures 1 to 15 shown, a flexible circuit board bending and laminating integrated device according to an embodiment of the present invention includes:

[0058] A device body 1, a control module 2, a vertical frame 3, a bending mechanism 4, a laminating mechanism 5, and a storage rack 6, which are used for bending and laminating processing of flexible circuit boards;

[0059] A segmented temperature control module 7, a switching and purging module 8, a heat transfer and leveling module 9, and a release compensation module 10. The segmented temperature control module 7 switches the cold and hot temperatures of the flexible circuit board along with the bending action of the bending mechanism 4. The switching and purging module 8 purifies the operating environment of the bending mechanism 4. The heat transfer and leveling module 9 makes flexible contact with the laminating surface of the laminating mechanism 5 and compensates for the deformation generated on the laminating surface during heat transfer. The release compensation module 10 realizes omission compensation collection for the transportation of the flexible circuit board;

[0060] The segmented temperature control module 7 includes a bending part 701. The bending part 701 is slidably connected to the middle of the bending mechanism 4. A first placement seat 702 is fixedly connected to the middle of the bending mechanism 4 directly below the bending part 701. An outer shell 704 is fixedly connected to the inside of the device body 1 outside the first placement seat 702.

[0061] It should be noted that through the bending action of the synchronous bending mechanism 4, segmented temperature control adjustment is set for the flexible circuit board substrate to be bent. Before the bending operation, preheating and softening treatment is given to the flexible circuit board substrate. The preheating and softening stage can effectively reduce the material yield strength, making it easier to achieve small-angle adjustment during the bending process of the flexible circuit board. After the bending is completed, rapid shaping is given to inhibit material springback and reduce the bending angle error.

[0062] The segmented temperature control module 7 further includes:

[0063] A push rod 703, which is fixedly connected between the bending member 701. A connecting spring 706 is fixedly connected inside the push rod 703, and the other end of the connecting spring 706 is fixedly connected to the equipment body 1. A rotating member 705 is sleeved on the outer wall of the push rod 703, and the outer wall of the rotating member 705 is rotatably connected to the inner wall of the outer shell 704. The bottom of the rotating member 705 is fixedly connected with an annular rail 710, and a guiding ball 711 is fixedly connected to the inner wall of the outer shell 704. The outer wall of the guiding ball 711 is slidably connected to the inner wall of the annular rail 710. The bottom outer wall of the push rod 703 is fixedly connected with a right-angle plate 708, and a ball 709 is rotatably connected to the middle of the top of the right-angle plate 708. A transmission groove 707 is formed in the outer wall of the rotating member 705, and the outer wall of the ball 709 is slidably connected to the inner wall of the transmission groove 707. A preheating module 712 is fixedly connected to one side of the top of the rotating member 705, and a cooling module 713 is fixedly connected to the other side of the top of the rotating member 705. A cavity is formed inside the first placement seat 702, and the preheating module 712, the cooling module 713 and the cavity are on the same horizontal line.

[0064] It should be noted that as the bending member 701 moves downward for bending the substrate, the push rod 703 moves downward synchronously, applying a downward pressure to the connecting spring 706 to cause deformation. When the push rod 703 moves downward, it drives the right-angle plate 708 to move downward synchronously, and the ball 709 moves along the inner wall of the transmission groove 707, causing the rotating member 705 to rotate along the inner wall of the outer shell 704. With the guiding and limiting assistance of the annular rail 710 and the guiding ball 711, the stable rotation of the rotating member 705 is ensured. When the bending member 701 moves downward, it can drive the preheating module 712 to rotate into the cavity of the first placement seat 702 to preheat and soften the substrate above. Correspondingly, when the bending member 701 moves upward and returns to its original position after the bending process, it can drive the rotating member 705 to rotate in the reverse direction, causing the cooling module 713 to move correspondingly into the first placement seat 702 to cool the circuit board substrate after the bending process and quickly shape it to inhibit material springback.

[0065] Embodiment 2

[0066] Corresponding to the adjustment and switching action of the segmented temperature control module 7 in the first embodiment above, a particulate matter blowing treatment is set to perform foreign matter treatment on the bending area. The switching purge module 8 includes:

[0067] A blower 801, the blower 801 is fixedly connected to the top of the push rod 703. A three-way pipe 802 is rotatably connected inside the blower 801 at the top of the push rod 703. Two ends of the blower 801 away from the three-way pipe 802 are fixedly connected with wedge-shaped covers 803. The bottom of the wedge-shaped cover 803 abuts against the top of the first placement seat 702;

[0068] It should be noted that the blower 801 operates with the action switching of the segmented temperature control module 7, conveys gas from the three-way pipe 802 to the inside of the wedge-shaped cover 803, and directly conveys it to the top of the first placement seat 702, performing a blowing treatment on the particulate matter existing on the outer wall, reducing the generation of microcracks caused by foreign matter indentation during the bending treatment of the flexible circuit board.

[0069] Embodiment Three

[0070] The heat transfer and leveling module 9 includes:

[0071] A pressing plate 901, the pressing plate 901 is slidably connected to the middle of the pressing mechanism 5. A silica gel pad 902 is fixedly connected to the bottom of the pressing plate 901. A central cavity 903, a transition cavity 904, and an edge cavity 905 are sequentially formed in the silica gel pad 902 from the center to the outside. A plurality of flow guiding plates 906 are provided on the inner walls of the central cavity 903, the transition cavity 904, and the edge cavity 905. The number of the flow guiding plates 906 decreases sequentially from the center to the outside. Heat transfer particles 907 are filled in the central cavity 903, the transition cavity 904, and the edge cavity 905. A pair of guiding blocks 910 are fixedly connected to both sides of the inner wall of the central cavity 903. A transmission gear 909 is rotatably connected inside the silica gel pad 902. One side of the outer wall of the transmission gear 909 is meshed with a trigger tooth plate 908, and the other side of the outer wall of the transmission gear 909 is meshed with a downward pressing tooth plate 911. The two guiding blocks 910 are respectively slidably connected to the inner walls of the trigger tooth plate 908 and the downward pressing tooth plate 911. The bottom of the downward pressing tooth plate 911 is fixedly connected with a compensation ring 912. The outer wall of the compensation ring 912 corresponds to and matches the inner walls of the transition cavity 904 and the edge cavity 905;

[0072] It should be noted that when the pressing plate 901 performs a pressing treatment on the flexible circuit board, it contacts the flexible circuit board through the silica gel pad 902. The heat in the pressing plate 901 is input into the silica gel pad 902. Under the transfer action of the different numbers and densities of the flow guiding plates 906 in different cavities, the heat is respectively concentrated in the central cavity 903, the transition cavity 904, and the edge cavity 905 at different temperatures, realizing segmented heat transfer adjustment for the circuit board to be pressed below. The gradual temperature transfer can effectively avoid the warping of the copper foil on the outer wall;

[0073] In response to the expansion deformation that may occur in the silicone pad 902 itself during the gradual heat transfer adjustment process, a dynamic compensation process is set for it. The expansion deformation area of the silicone pad 902 corresponds to the temperature changes of the central cavity 903, the transition cavity 904 and the edge cavity 905. The deformation bulge in the central cavity 903 is most obvious. When the deformed part contacts the flexible circuit board, an inward extrusion force is generated on the silicone pad 902, which acts on the trigger tooth plate 908 arranged near the bottom. When the trigger tooth plate 908 is pushed upward, it drives the transmission gear 909 to rotate, drives the lower pressure tooth plate 911 on the other side to move downward, and drives the compensation ring 912 to move downward to compensate for the deformation defects formed in the transition cavity 904 and the edge cavity 905, so that the contact surface of the silicone pad 902 remains flush, giving the flexible circuit board consistent pressure and pressing strength.

[0074] Example 4

[0075] Corresponding to the above embodiment, the bending and pressing process of the flexible circuit board is completed, and the final step of collection process is performed. The release compensation module 10 includes:

[0076] Stepper motor 1001, stepper motor 1001 is fixedly connected to the outer wall of stand 3, the driving end of stepper motor 1001 is fixedly connected with toggle member 1002, the interior of stand 3 is fixedly connected with hollow cylinder 1003, the interior of hollow cylinder 1003 is slidably connected with ejection member 1005, the outer wall of toggle member 1002 is provided with energy storage spring 1004, ejection member 1005 is connected to hollow cylinder 1003 through energy storage spring 1004, and both sides of the inner wall of ejection member 1005 are fixedly connected with Abutment rod 1006, the abutment rods 1006 on both sides abut against the toggle member 1002 respectively, the outer wall of the ejection member 1005 is fixedly connected with a knocking plate 1007, the knocking plate 1007 and the pressing plate 901 are located on the same horizontal line, the middle part of the outer side of the pressing plate 901 is rotatably connected to the connecting plate 12, the top of the pressing plate 901 is rotatably connected to the electric telescopic rod 11, the telescopic rod end of the electric telescopic rod 11 is hinged to the connecting plate 12, and the middle part of both sides of the connecting plate 12 is fixedly connected to the vacuum suction cup 13;

[0077] It should be noted that after the pressing process is completed, the electric telescopic rod 11 drives the connecting plate 12 to rotate to a horizontal state, so that the vacuum suction cups 13 on both sides come into contact with the flexible circuit board product, adsorb it and then transport it, and the pressing mechanism 5 slides toward the storage rack 6 through the stand 3. The outer wall of the stand 3 is located next to the release compensation module 10 and is provided with a distance sensor to detect the distance between the pressing mechanism 5 and the top of the storage rack 6 during the movement process. In the default state, the control module 2 triggers the stepping motor 1001 to operate, driving the toggle member 1002 to rotate, and the arc-shaped piece on the outer wall of the toggle member 1002 contacts the abutment rod 1006 and corresponds to it. The arc-shaped trajectory causes the ejection part 1005 to slide along the inner wall of the hollow cylinder 1003, generating an extrusion force on the energy storage spring 1004, so as to accumulate a certain amount of elastic potential energy for future use. When the minimum distance threshold is reached, the control module 2 controls the stepper motor 1001 to operate in reverse. Corresponding to the above-mentioned reverse operation, the ejection part 1005 slides out of the inner wall of the hollow cylinder 1003 in the opposite direction, driving the knocking plate 1007 made of soft rubber material to knock the connecting plate 12 in the middle of the pressing plate 901, so that the flexible circuit board that has not been fully released can be normally detached and collected into the storage rack 6, which is more convenient without manual intervention.

[0078] Working principle:

[0079] First, the flexible printed circuit board is transferred to the first placement seat 702 of the bending mechanism 4 through the loading mechanism (not shown in the figure), and the bending member 701 of the bending mechanism 4 is controlled by the control module 2 to prepare for the bending process;

[0080] The push rod 703 moves downward synchronously with the bending part 701 to bend the substrate, and applies downward pressure to the connecting spring 706 to cause deformation. When the push rod 703 moves downward, it drives the right-angle plate 708 to move downward synchronously, and the ball 709 moves along the inner wall of the transmission groove 707, so that the rotating member 705 rotates along the inner wall of the shell 704, and with the guidance and limitation of the annular rail 710 and the guide ball 711, the stable rotation of the rotating member 705 is ensured. The downward movement of the bending member 701 can drive the preheating module 712 to rotate to the cavity of the first placement seat 702 to preheat and soften the substrate above. Correspondingly, after the bending process, when the bending member 701 moves upward to return to its original position, it can drive the rotating member 705 to rotate in the opposite direction, so that the cooling module 713 moves to the interior of the first placement seat 702 to cool the circuit board substrate after the bending process, quickly shaping it and suppressing material rebound.

[0081] The fan 801 rotates synchronously with the switching of the segmented temperature control module 7, delivering air through the three-way pipe 802 to the interior of the wedge-shaped cover 803 and directly to the top of the first placement seat 702. It blows away particulate matter on the outer wall and reduces the occurrence of micro-cracks caused by foreign matter indentation during the bending of the flexible circuit board.

[0082] Entering the pressing step, when the pressing plate 901 is pressing the flexible circuit board, it contacts the flexible circuit board through the silicone pad 902. The heat in the pressing plate 901 is input into the inside of the silicone pad 902, and under the transfer effect of the guide plates 906 with different numbers and densities in different cavities, the heat is respectively gathered in the center cavity 903, the transition cavity 904 and the edge cavity 905 at different temperatures, so as to achieve segmented heat transfer adjustment for the circuit board to be pressed below. The gradual temperature transfer can effectively avoid the warping of the copper foil on the outer wall. In the process of gradual heat transfer adjustment, the silicone pad 902 itself may expand and deform, and a dynamic compensation process is set for it. The expansion deformation area of 902 corresponds to the temperature changes of the central cavity 903, the transition cavity 904 and the edge cavity 905. The deformation bulge in the central cavity 903 is the most obvious. When the deformed area contacts the flexible circuit board, it will generate an inward squeezing force on the silicone pad 902, which acts on the trigger tooth plate 908 arranged near the bottom. When the trigger tooth plate 908 is pushed upward, it drives the transmission gear 909 to rotate, driving the lower pressure tooth plate 911 on the other side to move downward, and driving the compensation ring 912 to move downward to compensate for the deformation defects formed in the transition cavity 904 and the edge cavity 905, so that the contact surface of the silicone pad 902 remains flush, giving the flexible circuit board consistent pressure and pressing strength;

[0083] After the lamination process is completed, the electric telescopic rod 11 drives the connecting plate 12 to rotate to a horizontal state, so that the vacuum suction cups 13 on both sides contact the flexible circuit board product, suck it and then transfer it. The lamination mechanism 5 slides toward the storage rack 6 through the stand 3. The outer wall of the stand 3 is located next to the release compensation module 10. A distance sensor is installed to detect the distance between the lamination mechanism 5 and the top of the storage rack 6 during the movement process;

[0084] In the default state, the control module 2 triggers the stepper motor 1001 to operate, driving the toggle member 1002 to rotate. The arc-shaped piece on the outer wall of the toggle member 1002 contacts the abutment rod 1006 and corresponds to its arc trajectory to make the ejection member 1005 slide along the inner wall of the hollow cylinder 1003, generating an extrusion force on the energy storage spring 1004, so as to accumulate a certain amount of elastic potential energy for future use. When the minimum distance threshold is reached, the control module 2 controls the stepper motor 1001 to operate in the reverse direction, corresponding to the above-mentioned reverse operation, so that the ejection member 1005 slides out of the inner wall of the hollow cylinder 1003 in the reverse direction, driving the knocking plate 1007 made of soft rubber material to knock the connecting plate 12 in the middle of the pressing plate 901, so that the flexible circuit board that has not been fully released can be normally detached and collected into the storage rack 6, which is more convenient without manual intervention.

[0085] The embodiments of the present invention have been described above, but these embodiments are not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative rather than restrictive. Under the inspiration of these embodiments, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of these embodiments.

Claims

1. A flexible circuit board bending and pressing integrated device, characterized in that, Including: The equipment body (1), control module (2), vertical frame (3), bending mechanism (4), pressing mechanism (5) and storage rack (6) are used for bending and pressing flexible printed circuit boards for processing. The segmented temperature control module (7), switching and purging module (8), heat transfer and flattening module (9) and release compensation module (10). The segmented temperature control module (7) switches the hot and cold temperatures of the flexible circuit board along with the bending action of the bending mechanism (4). The switching and purging module (8) purifies the operating environment of the bending mechanism (4). The heat transfer and flattening module (9) makes flexible contact with the pressing surface of the pressing mechanism (5) and compensates for the deformation generated on the pressing surface during heat transfer. The release compensation module (10) realizes omission compensation collection for the transfer of the flexible circuit board. The segmented temperature control module (7) includes a bending part (701). The bending part (701) is slidably connected to the middle of the bending mechanism (4). A first placement seat (702) is fixedly connected directly below the middle of the bending mechanism (4). A housing (704) is fixedly connected to the outside of the first placement seat (702) inside the equipment body (1). The segmented temperature control module (7) further includes: A push rod (703). The push rod (703) is fixedly connected to the bending part (701). A connecting spring (706) is fixedly connected inside the push rod (703). The other end of the connecting spring (706) is fixedly connected to the equipment body (1). A rotating part (705) is sleeved on the outer wall of the push rod (703). One side of the top of the rotating part (705) is fixedly connected with a preheating module (712). The other side of the top of the rotating part (705) is fixedly connected with a cooling module (713). A cavity is formed inside the first placement seat (702). The preheating module (712), cooling module (713) and this cavity are on the same horizontal line.

2. The integrated device for bending and pressing a flexible circuit board according to claim 1, wherein: The outer wall of the rotating part (705) is rotatably connected to the inner wall of the housing (704). The bottom of the rotating part (705) is fixedly connected with an annular rail (710). A guiding ball (711) is fixedly connected to the inner wall of the housing (704). The outer wall of the guiding ball (711) is slidably connected to the inner wall of the annular rail (710).

3. The integrated device for bending and pressing a flexible circuit board according to claim 2, characterized in that: The outer wall of the bottom end of the push rod (703) is fixedly connected with a right-angle plate (708). A ball (709) is rotatably connected to the middle of the top end of the right-angle plate (708). A transmission groove (707) is formed on the outer wall of the rotating part (705). The outer wall of the ball (709) is slidably connected to the inner wall of the transmission groove (707).

4. The integrated device for bending and pressing a flexible circuit board according to claim 1, characterized in that: The switching and purging module (8) includes: A blower (801). The blower (801) is fixedly connected to the top of the push rod (703). A tee pipe (802) is rotatably connected inside the blower (801) at the top of the push rod (703). Wedge-shaped covers (803) are fixedly connected to both ends of the blower (801) away from the tee pipe (802). The bottom of the wedge-shaped cover (803) abuts against the top of the first placement seat (702).

5. A flexible circuit board bending and pressing integration device according to claim 1, characterized in that: The heat transfer and leveling module (9) comprises: A pressing plate (901) is slidably connected to the middle of the pressing mechanism (5); a silicone pad (902) is fixedly connected to the bottom of the pressing plate (901); a central cavity (903), a transition cavity (904) and an edge cavity (905) are sequentially provided inside the silicone pad (902) from the center to the outside; the inner walls of the central cavity (903), the transition cavity (904) and the edge cavity (905) are each provided with a plurality of guide plates (906); the number of the guide plates (906) decreases from the center to the outside; the interiors of the central cavity (903), the transition cavity (904) and the edge cavity (905) are each filled with heat transfer particles (907); and a pair of guide blocks (910) are fixedly connected to both sides of the inner wall of the central cavity (903).

6. The integrated device for bending and pressing a flexible circuit board according to claim 5, characterized in that: The silicone pad (902) is internally rotatably connected to a transmission gear (909), one side of the outer wall of the transmission gear (909) is meshedly connected to a trigger tooth plate (908), and the other side of the outer wall of the transmission gear (909) is meshedly connected to a lower pressure tooth plate (911), and the guide blocks (910) on both sides are slidably connected to the inner walls of the trigger tooth plate (908) and the lower pressure tooth plate (911), respectively, and a compensation ring (912) is fixedly connected to the bottom of the lower pressure tooth plate (911), and the outer wall of the compensation ring (912) corresponds to the inner wall of the matching transition cavity (904) and the edge cavity (905).

7. A flexible circuit board bending and pressing integrated device according to claim 1, characterized in that: The release compensation module (10) comprises: A stepper motor (1001) is fixedly connected to the outer wall of a stand (3); a driving end of the stepper motor (1001) is fixedly connected to a toggle member (1002); a hollow cylinder (1003) is fixedly connected to the interior of the stand (3); an ejection member (1005) is slidably connected to the interior of the hollow cylinder (1003); an energy storage spring (1004) is sleeved on the outer wall of the toggle member (1002); and the ejection member (1005) is connected to the hollow cylinder (1003) via the energy storage spring (1004).

8. The integrated device for bending and pressing a flexible circuit board according to claim 7, characterized in that: Both sides of the inner wall of the ejection member (1005) are fixedly connected to abutment rods (1006), and the abutment rods (1006) on both sides abut against the toggle member (1002) respectively. The outer wall of the ejection member (1005) is fixedly connected to a knocking plate (1007), and the knocking plate (1007) and the pressing plate (901) are located on the same horizontal line.

9. A flexible circuit board bending and pressing integration device according to claim 8, characterized in that: The middle portion of the outer side of the pressing plate (901) is rotatably connected to a connecting plate (12), the top of the pressing plate (901) is rotatably connected to an electric telescopic rod (11), the telescopic rod end of the electric telescopic rod (11) is hingedly connected to the connecting plate (12), and the middle portions of both sides of the connecting plate (12) are fixedly connected to vacuum suction cups (13).

Images