High-temperature-resistant circuit board multi-layer press-fit processing device and processing method thereof

Abstract

The invention belongs to the technical field of circuit board processing, and discloses a high-temperature-resistant circuit board multi-layer press-fit processing device and a processing method thereof.The high-temperature-resistant circuit board multi-layer press-fit processing device comprises a processing base, a supporting top seat is fixedly installed at the top end of the processing base, a hydraulic cylinder is arranged at the top end of the supporting top seat, and a press-fit top plate is installed at the output end of the hydraulic cylinder; the high-temperature-resistant circuit board press-fit device comprises a processing base, a press-fit top plate is arranged in the processing base, a press-fit bottom plate is arranged below the press-fit top plate, the press-fit bottom plate is installed in the processing base in a sliding mode through a material pushing assembly, limiting plates are arranged at the four corners of the top of the press-fit bottom plate, and the four limiting plates are connected with the processing base in a sliding mode through moving assemblies. When a circuit board is pressed, the motor is started at first, the pressing bottom plate bears the pressed circuit board to move out of the pressing groove, the operation difficulty during material taking is reduced, and therefore the production efficiency is indirectly improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board processing, and specifically relates to a high-temperature resistant circuit board multi-layer lamination processing device and its processing method. Background Art

[0002] A high-temperature resistant circuit board is a printed circuit board (PCB) that can work stably in a high-temperature environment and is usually used in electronic devices under extreme temperature conditions. Due to its special materials and technical requirements, high-temperature resistant circuit boards have important applications in the fields of aerospace, automotive electronics, industrial control, etc. The multi-layer lamination processing device is a key equipment in the manufacturing process of high-temperature resistant circuit boards. It uses advanced lamination technology to tightly bond multi-layer circuit board materials together to ensure the stability and reliability of the circuit boards. During the process of multi-layer lamination, the high-temperature resistant circuit board is placed in the lamination groove and closely fitted with it. When laminating, due to the pressure of the lamination plate, the degree of fit between the circuit board and the lamination groove is further enhanced, resulting in an increase in the difficulty of taking out the circuit board, which in turn affects the production efficiency. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-temperature resistant circuit board multi-layer lamination processing device and its processing method to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A high-temperature resistant circuit board multi-layer lamination processing device includes a processing base. A support top seat is fixedly installed at the top of the processing base. A hydraulic cylinder is arranged at the top of the support top seat. The output end of the hydraulic cylinder is installed with a lamination top plate. A lamination bottom plate is arranged below the lamination top plate. The lamination bottom plate is slidably installed inside the processing base through a pushing component. Limit plates are arranged at the four corners of the top of the lamination bottom plate. The four limit plates are slidably connected to the processing base through a moving component. The pushing component includes a connecting shaft fixedly installed at the bottom end of the lamination bottom plate. There are two connecting shafts symmetrically arranged. A first threaded rod is threadedly connected inside one of the connecting shafts. The bottom end of the first threaded rod is fixedly installed with a first gear. A second gear is meshed and connected to one side of the first gear. A first rotating shaft is fixedly installed inside the second gear. A motor is arranged at the bottom end of the first rotating shaft.

[0005] As a further technical solution of the present invention, a support plate is arranged inside the limit plate. There are two support plates. The two support plates are perpendicularly distributed. Activity shafts are connected between the two support plates and the limit plate. A first spring is arranged on one side of the activity shaft. The first spring is installed inside the limit plate.

[0006] As a further technical solution of the present invention, the moving assembly includes a slider fixedly mounted at the bottom end of four limit plates, the four sliders are slidably mounted inside the slide groove, the four slide grooves are all opened inside the processing base, two second threaded rods are rotatably mounted inside the processing base, the outer walls of the two second threaded rods are meshed with two moving seats, and the four moving seats are respectively mounted at the bottom of the four sliders; The two second threaded rods are connected through a pulley set, wherein a first bevel gear is fixedly installed on the outer wall of one of the second threaded rods, a second bevel gear is meshingly connected to the bottom end of the first bevel gear, a second rotating shaft is fixedly installed on the bottom end of the second bevel gear, a third gear is fixedly connected to the bottom of the second rotating shaft, and the third gear is arranged on one side of the second gear.

[0007] As a further technical solution of the present invention, the slide groove is arranged inclined.

[0008] As a further technical solution of the present invention, the third gear and the first gear are respectively arranged on both sides of the second gear.

[0009] As a further technical solution of the present invention, an airbag is provided at the bottom of the pressed base plate, and heat dissipation holes are evenly opened inside the pressed base plate and the airbag. The two groups of heat dissipation holes are connected by a connecting pipe, and a baffle is slidably installed inside the pressed base plate, a wedge block is fixedly connected to one side of the baffle, and a second spring is provided on one side of the wedge block.

[0010] As a further technical solution of the present invention, the bottom of the wedge block is inclined.

[0011] As a further technical solution of the present invention, a push plate is provided at the bottom of the airbag, and the push plate is fixedly installed at the bottom end of the connecting shaft.

[0012] As a further technical solution of the present invention, an air intake pipe is fixedly connected to one side of the airbag.

[0013] A processing method of a high temperature resistant circuit board multilayer pressing processing device comprises the following steps: S1: When the high temperature resistant circuit board is laminated for multilayer processing, the circuit board is first placed on the top of the laminating bottom plate and located between four limit plates, and then the hydraulic cylinder is started to drive the laminating top plate downward to perform laminating processing on the circuit board; S2: After pressing, drive the pressing top plate to move upward through the hydraulic cylinder, and then start the motor. When the motor starts, it drives the rotation of the first rotating shaft. The rotation of the first rotating shaft drives the rotation of the second gear. The rotation of the second gear drives the rotation of the third gear. The rotation of the third gear drives the rotation of the second rotating shaft. The rotation of the second rotating shaft drives the rotation of the second bevel gear. The rotation of the second bevel gear drives the rotation of the first bevel gear. The rotation of the first bevel gear drives the rotation of the second threaded rod. When the second threaded rod rotates, it drives another second threaded rod to rotate synchronously through the pulley group transmission. The rotation of the two second threaded rods drives the movement of the four moving seats. The movement of the moving seats drives the movement of the sliders. When the sliders move, they expand outward along the guide of the chute, so that the four limiting plates move away from the periphery of the pressing bottom plate; S3: The second gear continues to rotate and drives the rotation of the first gear. The rotation of the first gear drives the movement of the connecting shaft. The movement of the connecting shaft drives the pressing bottom plate to move upward, so that the pressing bottom plate carries the pressed circuit board out of the pressing groove; S4: At the same time, the upward movement of the pressing bottom plate drives the wedge block to move upward. When the wedge block separates from the inner wall of the processing base, the elastic potential energy is released through the second spring to drive the wedge block to slide out from the inside of the pressing bottom plate. The movement of the wedge block drives the movement of the baffle. When the baffle moves, it opens the heat dissipation holes, so that the gas inside the airbag is discharged from the heat dissipation holes to cool the circuit board; S5: After the circuit board is taken out of the pressing groove, take it out, and then repeat the above steps for continuous operation.

[0014] The beneficial effects of the present invention are as follows: Through the setting of the pushing component of the present invention, when a high-temperature resistant circuit board needs to be taken out of the pressing groove after multi-layer pressing and processing, first start the motor. When the motor starts, it drives the rotation of the first rotating shaft. The rotation of the first rotating shaft drives the rotation of the second gear. The rotation of the second gear drives the rotation of the first gear. The rotation of the first gear drives the movement of the connecting shaft. The movement of the connecting shaft drives the pressing bottom plate to move upward, so that the pressing bottom plate carries the pressed circuit board out of the pressing groove. This method reduces the operation difficulty during material taking, thereby indirectly improving the production efficiency.

[0015] Due to the elastic potential energy of the first spring, the support plate can slide a certain distance. Since the circuit board will expand due to heat during the pressing process, the elastic plate can adapt to this expansion, preventing material extrusion or deformation caused by thermal expansion, thereby improving the interlayer bonding quality.

[0016] With the arrangement of the moving components in the present invention, when the circuit board is taken out from the pressing groove after pressing, the rotation of the second gear drives the rotation of the third gear, the rotation of the third gear drives the rotation of the second rotating shaft, the rotation of the second rotating shaft drives the rotation of the second bevel gear, the rotation of the second bevel gear drives the rotation of the first bevel gear, the rotation of the first bevel gear drives the rotation of the second threaded rod, the rotation of the second threaded rod drives the movement of the moving seat, the movement of the moving seat drives the movement of the slider, and when the slider moves, it expands outward along the guide of the chute, so that the four limiting plates move away from the periphery of the pressing bottom plate. During material taking, it can avoid contacting the edge of the circuit board, prevent scratching, extrusion or other physical damages, effectively protect the integrity of the circuit board, and improve the material taking efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic cross-sectional view of the overall structure of the present invention; Figure 3 is a schematic cross-sectional view of the structure at the processing base of the present invention; Figure 4 For the present invention Figure 3 is an enlarged schematic view of the structure at A in; Figure 5 is a schematic cross-sectional view of the structure of the pressing bottom plate and the airbag of the present invention; Figure 6 is a schematic diagram of the structure of the moving seat and the second threaded rod of the present invention; Figure 7 is a schematic cross-sectional view of the structure of the pressing bottom plate of the present invention; Figure 8 is a schematic cross-sectional view of the structure of the limiting plate of the present invention.

[0018] In the figure: 1, processing base; 2, supporting top seat; 3, hydraulic cylinder; 4, pressing top plate; 5, pressing bottom plate; 6, connecting shaft; 7, first threaded rod; 8, first gear; 9, second gear; 10, first rotating shaft; 11, motor; 12, limiting plate; 13, supporting plate; 14, movable shaft; 15, first spring; 16, slider; 17, chute; 18, moving seat; 19, second threaded rod; 20, first bevel gear; 21, second bevel gear; 22, second rotating shaft; 23, third gear; 24, pulley group; 25, heat dissipation hole; 26, airbag; 27, baffle; 28, wedge block; 29, second spring; 30, push plate; 31, connecting pipe; 32, air inlet pipe. DETAILED DESCRIPTION OF THE INVENTION

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0020] As Figures 1 to 8 shown, in the embodiment of the present invention, a high-temperature resistant circuit board multi-layer lamination processing device includes a processing base 1. A support top seat 2 is fixedly installed at the top of the processing base 1. A hydraulic cylinder 3 is arranged at the top of the support top seat 2. A lamination top plate 4 is installed at the output end of the hydraulic cylinder 3. A lamination bottom plate 5 is arranged below the lamination top plate 4. The lamination bottom plate 5 is slidably installed inside the processing base 1 through a feeding assembly. Limiting plates 12 are arranged at the four corners of the top of the lamination bottom plate 5. The four limiting plates 12 are slidably connected to the processing base 1 through a moving assembly; The feeding assembly includes a connecting shaft 6 fixedly installed at the bottom end of the lamination bottom plate 5. There are two symmetrically arranged connecting shafts 6. A first threaded rod 7 is threadedly connected inside one of the connecting shafts 6. A first gear 8 is fixedly installed at the bottom end of the first threaded rod 7. A second gear 9 is meshed and connected to one side of the first gear 8. A first rotating shaft 10 is fixedly installed inside the second gear 9. A motor 11 is arranged at the bottom end of the first rotating shaft 10.

[0021] The lamination bottom plate 5 and the four limiting plates 12 form a lamination groove; When the high-temperature resistant circuit board needs to be taken out of the lamination groove after multi-layer lamination processing, first start the motor 11. When the motor 11 starts, it drives the rotation of the first rotating shaft 10. The rotation of the first rotating shaft 10 drives the rotation of the second gear 9. The rotation of the second gear 9 drives the rotation of the first gear 8. The rotation of the first gear 8 drives the movement of the connecting shaft 6. The movement of the connecting shaft 6 drives the lamination bottom plate 5 to move upward, so that the lamination bottom plate 5 carries the laminated circuit board out of the lamination groove. This method reduces the operation difficulty during material taking, thereby indirectly improving the production efficiency.

[0022] As Figure 8 shown, a support plate 13 is arranged inside the limiting plate 12. There are two support plates 13. The two support plates 13 are perpendicularly distributed. Moving shafts 14 are connected between the two support plates 13 and the limiting plate 12. A first spring 15 is arranged on one side of the moving shaft 14. The first spring 15 is installed inside the limiting plate 12.

[0023] Due to the elastic potential energy of the first spring 15, the support plate 13 can slide a certain distance. Since the circuit board will expand due to heat during the lamination process, the elastic plate can adapt to this expansion, preventing material extrusion or deformation caused by thermal expansion, thereby improving the interlayer bonding quality.

[0024] As Figure 2 , Figure 3 , Figure 4 and Figure 6 shown, the moving component includes sliders 16 fixedly installed at the bottom ends of four limiting plates 12. The four sliders 16 are all slidably installed inside the sliding grooves 17. The four sliding grooves 17 are all opened inside the processing base 1. Two second threaded rods 19 are rotatably installed inside the processing base 1. Two moving seats 18 are meshingly installed on the outer walls of the two second threaded rods 19. The four moving seats 18 are respectively installed at the bottoms of the four sliders 16; The two second threaded rods 19 are drivingly connected through a pulley group 24. A first bevel gear 20 is fixedly installed on the outer wall of one of the second threaded rods 19. The bottom end of the first bevel gear 20 is meshingly connected with a second bevel gear 21. The bottom end of the second bevel gear 21 is fixedly installed with a second rotating shaft 22. The bottom of the second rotating shaft 22 is fixedly connected with a third gear 23. The third gear 23 is arranged on one side of the second gear 9.

[0025] Two threads are provided on the outer wall of the second threaded rod 19, and the directions of the two threads are opposite, so as to make the two moving seats 18 installed on the outer wall of each second threaded rod 19 move relatively; When the circuit board is taken out from the pressing groove after pressing, the rotation of the second gear 9 drives the rotation of the third gear 23. The rotation of the third gear 23 drives the rotation of the second rotating shaft 22. The rotation of the second rotating shaft 22 drives the rotation of the second bevel gear 21. The rotation of the second bevel gear 21 drives the rotation of the first bevel gear 20. The rotation of the first bevel gear 20 drives the rotation of the second threaded rod 19. The rotation of the second threaded rod 19 drives the movement of the moving seat 18. The movement of the moving seat 18 drives the movement of the slider 16. When the slider 16 moves, it expands outward under the guidance of the sliding groove 17, so that the four limiting plates 12 move away from the periphery of the pressing bottom plate 5. When taking the material, it can avoid contacting the edge of the circuit board, prevent scratching, extrusion or other physical damages, effectively protect the integrity of the circuit board, and improve the material taking efficiency.

[0026] As Figure 2 shown, the sliding groove 17 is inclined.

[0027] As Figure 3 shown, the third gear 23 and the first gear 8 are respectively arranged on both sides of the second gear 9.

[0028] The tooth blocks on the outer wall of the second gear 9 are distributed in a fan shape; When taking the material, make the second gear 9 rotate counterclockwise, first engage with the third gear 23 to drive the expansion of the four limiting plates 12, and then engage with the first gear 8 to drive the pressing bottom plate 5 to move upward to push the material; When feeding, rotate the second gear 9 clockwise. First, it meshes with the first gear 8 to drive the pressing base plate 5 to move downward and reset. Then, it meshes with the third gear 23 to drive the four limit plates 12 to contract.

[0029] As Figures 2 to 5 shown, an airbag 26 is arranged at the bottom of the pressing base plate 5. Heat dissipation holes 25 are evenly formed inside the pressing base plate 5 and the airbag 26. The two groups of heat dissipation holes 25 are connected by a connecting pipe 31. A baffle 27 is slidably installed inside the pressing base plate 5. One side of the baffle 27 is fixedly connected with a wedge block 28, and a second spring 29 is arranged on one side of the wedge block 28.

[0030] When taking the material, the pressing base plate 5 moves upward to drive the wedge block 28 to move upward. After the wedge block 28 separates from the inner wall of the processing base 1, the elastic potential energy is released through the second spring 29 to drive the wedge block 28 to slide out from inside the pressing base plate 5. The movement of the wedge block 28 drives the movement of the baffle 27. When the baffle 27 moves, it opens the heat dissipation holes 25, so that the gas inside the airbag 26 is discharged from the heat dissipation holes 25 to blow the circuit board, reducing the temperature of the circuit board and shortening the cooling time, thereby improving the production efficiency.

[0031] As Figure 4 and Figure 7 shown, the bottom of the wedge block 28 is inclined.

[0032] After taking the material, when the pressing base plate 5 moves downward and resets, it drives the wedge block 28 to move downward. When the inclined surface of the wedge block 28 contacts the inner wall of the processing base 1, it is forced to slide into the pressing base plate 5, so that the baffle 27 moves to below the heat dissipation holes 25 to close them; At the same time, the second spring 29 is deformed by force to store elastic potential energy.

[0033] As Figure 2 , Figure 3 and Figure 5 shown, a push plate 30 is arranged at the bottom of the airbag 26, and the push plate 30 is fixedly installed at the bottom end of the connecting shaft 6.

[0034] The connecting pipe 31 is set as a corrugated pipe, which has a certain stretching effect and is convenient for the pressing base plate 5 to communicate with the airbag 26 after moving upward; When taking the material, the upward movement of the pressing base plate 5 drives the movement of the connecting shaft 6, and the movement of the connecting shaft 6 drives the movement of the push plate 30, so that the push plate 30 squeezes the airbag 26 to deform upward, which is convenient for exhausting heat and cooling down.

[0035] As Figure 2 , Figure 3 and Figure 5 shown, an air inlet pipe 32 is fixedly connected to one side of the airbag 26.

[0036] A one-way valve is installed on the outer wall of the air inlet pipe 32; After taking the material, when the pressing bottom plate 5 moves downward and resets, the airbag 26 resets due to its own elasticity, and the hydraulic cylinder 3 intakes air through the hydraulic cylinder 3, so that the gas stored in the airbag 26 is filled.

[0037] The processing method of the high-temperature resistant circuit board multi-layer pressing processing device includes the following steps: S1: When multi-layer pressing the high-temperature resistant circuit board, first place the circuit board on the top of the pressing bottom plate 5 and make it located between the four limiting plates 12, and then start the hydraulic cylinder 3. The hydraulic cylinder 3 drives the pressing top plate 4 to move downward to press and process the circuit board. S2: After pressing, the hydraulic cylinder 3 drives the pressing top plate 4 to move upward, and then start the motor 11. When the motor 11 starts, it drives the rotation of the first rotating shaft 10. The rotation of the first rotating shaft 10 drives the rotation of the second gear 9. The rotation of the second gear 9 drives the rotation of the third gear 23. The rotation of the third gear 23 drives the rotation of the second rotating shaft 22. The rotation of the second rotating shaft 22 drives the rotation of the second bevel gear 21. The rotation of the second bevel gear 21 drives the rotation of the first bevel gear 20. The rotation of the first bevel gear 20 drives the rotation of the second threaded rod 19. When the second threaded rod 19 rotates, it drives another second threaded rod 19 to rotate synchronously through the pulley group 24. The rotation of the two second threaded rods 19 drives the movement of the four moving seats 18. The movement of the moving seats 18 drives the movement of the sliders 16. When the sliders 16 move, they expand outward along the guide of the chute 17, so that the four limiting plates 12 move away from the periphery of the pressing bottom plate 5. S3: The second gear 9 continues to rotate and drives the rotation of the first gear 8. The rotation of the first gear 8 drives the movement of the connecting shaft 6. The movement of the connecting shaft 6 drives the pressing bottom plate 5 to move upward, so that the pressing bottom plate 5 carries the pressed circuit board out of the pressing groove. S4: At the same time, the upward movement of the pressing bottom plate 5 drives the wedge block 28 to move upward. After the wedge block 28 is separated from the inner wall of the processing base 1, the elastic potential energy is released through the second spring 29 to drive the wedge block 28 to slide out of the pressing bottom plate 5. The movement of the wedge block 28 drives the movement of the baffle 27. When the baffle 27 moves, it opens the heat dissipation holes 25, so that the gas inside the airbag 26 is discharged from the heat dissipation holes 25 to cool the circuit board. S5: After the circuit board is taken out of the pressing groove, take it out, and then repeat the above steps for continuous operation.

[0038] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. High-temperature resistant circuit board multi-layer lamination processing device, including a processing base (1), characterized in that: A support top seat (2) is fixedly installed at the top of the processing base (1). A hydraulic cylinder (3) is arranged at the top of the support top seat (2). The output end of the hydraulic cylinder (3) is installed with a pressing top plate (4). A pressing bottom plate (5) is arranged below the pressing top plate (4). The pressing bottom plate (5) is slidably installed inside the processing base (1) through a material pushing component. Limiting plates (12) are arranged at the four corners of the top of the pressing bottom plate (5). The four limiting plates (12) are slidably connected with the processing base (1) through a moving component; The material pushing component includes a connecting shaft (6) fixedly installed at the bottom end of the pressing bottom plate (5). There are two symmetrically arranged connecting shafts (6). A first threaded rod (7) is threadedly connected inside one of the connecting shafts (6). A first gear (8) is fixedly installed at the bottom end of the first threaded rod (7). A second gear (9) is meshed and connected to one side of the first gear (8). A first rotating shaft (10) is fixedly installed inside the second gear (9). A motor (11) is arranged at the bottom end of the first rotating shaft (10).

2. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 1, characterized in that: A support plate (13) is arranged inside the limiting plate (12). There are two support plates (13). The two support plates (13) are perpendicularly distributed. Moving shafts (14) are connected between the two support plates (13) and the limiting plate (12). A first spring (15) is arranged on one side of the moving shaft (14). The first spring (15) is installed inside the limiting plate (12).

3. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 1, characterized in that: The moving component includes sliders (16) fixedly installed at the bottom ends of the four limiting plates (12). The four sliders (16) are all slidably installed inside sliding grooves (17). The four sliding grooves (17) are all opened inside the processing base (1). Two second threaded rods (19) are rotatably installed inside the processing base (1). Two moving seats (18) are meshed and installed on the outer walls of the two second threaded rods (19). The four moving seats (18) are respectively installed at the bottoms of the four sliders (16); The two second threaded rods (19) are driven and connected through a pulley group (24). A first bevel gear (20) is fixedly installed on the outer wall of one of the second threaded rods (19). A second bevel gear (21) is meshed and connected to the bottom end of the first bevel gear (20). A second rotating shaft (22) is fixedly installed at the bottom end of the second bevel gear (21). A third gear (23) is fixedly connected to the bottom of the second rotating shaft (22). The third gear (23) is arranged on one side of the second gear (9).

4. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 3, characterized in that: The sliding groove (17) is inclined.

5. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 3, characterized in that: The third gear (23) and the first gear (8) are respectively arranged on both sides of the second gear (9).

6. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 1, wherein: A airbag (26) is provided at the bottom of the pressing bottom plate (5). Heat dissipation holes (25) are evenly formed inside both the pressing bottom plate (5) and the airbag (26). The two groups of heat dissipation holes (25) are connected by a connecting pipe (31). A baffle (27) is slidably installed inside the pressing bottom plate (5). One side of the baffle (27) is fixedly connected to a wedge block (28). A second spring (29) is provided on one side of the wedge block (28).

7. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 6, wherein: The bottom of the wedge block (28) is inclined.

8. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 6, characterized in that: A push plate (30) is provided at the bottom of the airbag (26). The push plate (30) is fixedly installed at the bottom end of the connecting shaft (6).

9. The high-temperature resistant circuit board multi-layer lamination processing device according to claim 6, wherein: An air inlet pipe (32) is fixedly connected to one side of the airbag (26).

10. Processing method of a high-temperature resistant circuit board multi-layer lamination processing device, this method is applicable to the high-temperature resistant circuit board multi-layer lamination processing device described in the above claims 1-9, characterized in that, It includes the following steps: S1: When multi-layer pressing and processing of high-temperature resistant circuit boards, first place the circuit board on the top of the pressing bottom plate (5) and make it located between the four limiting plates (12). Then start the hydraulic cylinder (3), and drive the pressing top plate (4) to move downward through the hydraulic cylinder (3) to perform pressing and processing on the circuit board; S2: After pressing, drive the pressing top plate (4) to move upward through the hydraulic cylinder (3). Then start the motor (11). When the motor (11) starts, it drives the rotation of the first rotating shaft (10). The rotation of the first rotating shaft (10) drives the rotation of the second gear (9). The rotation of the second gear (9) drives the rotation of the third gear (23). The rotation of the third gear (23) drives the rotation of the second rotating shaft (22). The rotation of the second rotating shaft (22) drives the rotation of the second bevel gear (21). The rotation of the second bevel gear (21) drives the rotation of the first bevel gear (20). The rotation of the first bevel gear (20) drives the rotation of the second threaded rod (19). When the second threaded rod (19) rotates, it drives another second threaded rod (19) to rotate synchronously through the pulley group (24). The rotation of the two second threaded rods (19) drives the movement of the four moving seats (18). The movement of the moving seats (18) drives the movement of the sliders (16). When the sliders (16) move, they expand outward along the guide of the sliding grooves (17), so that the four limiting plates (12) move away from the periphery of the pressing bottom plate (5); S3: The second gear (9) continues to rotate and drives the rotation of the first gear (8). The rotation of the first gear (8) drives the movement of the connecting shaft (6). The movement of the connecting shaft (6) drives the pressing bottom plate (5) to move upward, so that the pressing bottom plate (5) carries the pressed circuit board out of the pressing groove; S4: At the same time, the upward movement of the pressing bottom plate (5) drives the upward movement of the wedge block (28). When the wedge block (28) is separated from the inner wall of the processing base (1), the elastic potential energy is released through the second spring (29) to drive the wedge block (28) to slide out of the pressing bottom plate (5). The movement of the wedge block (28) drives the movement of the baffle (27). When the baffle (27) moves, it opens the heat dissipation holes (25), so that the gas inside the airbag (26) is discharged from the heat dissipation holes (25) to cool the circuit board; S5: After the circuit board is taken out of the pressing groove, take it out, and then repeat the above steps for continuous operation.

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