Film forming apparatus, film forming method, and product manufacturing method

Abstract

A film forming apparatus includes: a substrate stage including a substrate holder configured to hold a substrate; a mold holder configured to hold a mold; a driving mechanism configured to change an interval between the substrate holder and the mold holder; and a curing apparatus configured to cure the curable component in a state in which the curable component disposed on the substrate and the mold are in contact with each other. The substrate stage includes a gas blower configured to supply a gas for inhibiting curing of the curable component to the substrate held by the substrate holder.

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, and a product manufacturing method. Background Art

[0002] Techniques are known in which a curable component on a substrate is brought into contact with a mold and the curable component is cured to form a cured film of the curable component. A film forming apparatus that uses a mold having a pattern and transfers the pattern to a curable component may be referred to as an imprint apparatus. A film forming apparatus that uses a mold having a flat surface and forms a cured film having a flat surface may be referred to as a planarizing apparatus.

[0003] Japanese Patent Laid-Open No. 2022-173919 discloses an imprint apparatus in which while irradiating a surface region of a substrate on which a pattern is formed with curing light, a gas for suppressing the curing of the curable component (hereinafter referred to as a curing suppression gas) is supplied to the periphery of the region. A plurality of gas nozzles for blowing out the curing suppression gas are arranged to surround a mold holder that holds the mold, and the gas is blown toward the substrate or the substrate holder.

[0004] In an arrangement in which gas nozzles for blowing out the curing suppression gas are arranged above the substrate or the substrate holder so as to surround the mold holder, whenever the position of the substrate changes, the curing suppression gas supply conditions with respect to the substrate may also change. Such an arrangement makes it difficult to process the substrate under fixed conditions. Summary of the Invention

[0005] The present invention provides a technique that facilitates processing of a substrate under fixed conditions.

[0006] A first aspect of the present invention provides a film forming apparatus including: a substrate stage including a substrate holder configured to hold a substrate; a mold holder configured to hold a mold; a drive mechanism configured to change a distance between the substrate holder and the mold holder; and a curing device configured to cure a curable component in a state where the curable component disposed on the substrate and the mold are in contact with each other, wherein the substrate stage includes a gas blower configured to supply a gas for suppressing the curing of the curable component to the substrate held by the substrate holder.

[0007] A second aspect of the present invention provides a film forming method including: bringing a curable component disposed on a substrate held by a substrate holder into contact with a mold; supplying a gas for suppressing the curing of the curable component from the substrate holder to the substrate held by the substrate holder; curing the curable component in a state where the curable component on the substrate and the mold are in contact with each other to form a film from a cured product of the curable component; and separating the film from the mold.

[0008] A third aspect of the present invention provides a method for manufacturing an article, the method for manufacturing an article comprising: forming a film on a substrate from a cured product of a curable component by means of a film-forming device as defined in the first aspect; and obtaining an article by treating the substrate that has undergone said film formation.

[0009] A fourth aspect of the present invention provides a method for manufacturing an article, the method for manufacturing an article comprising: forming a film on a substrate from a cured product of a curable component by means of a film-forming method as defined in the second aspect; and obtaining an article by treating the substrate that has undergone said film formation.

[0010] With reference to the accompanying drawings, other features of the present invention will become apparent from the following description of exemplary embodiments. Description of the Drawings

[0011] Figure 1 is a diagram schematically showing the arrangement of a film-forming device according to a first embodiment;

[0012] Figure 2 is a flowchart showing a film-forming method performed by the film-forming device according to the first embodiment;

[0013] Figure 3 is a diagram schematically showing the state of forming a cured film of a curable component in a partial region;

[0014] Figure 4 is a schematic perspective view showing an example of the structure of a gas blower;

[0015] Figure 5 is a schematic perspective view showing another example of the structure of a gas blower;

[0016] Figure 6 is a diagram schematically showing the arrangement of a film-forming device according to a second embodiment;

[0017] Figure 7 is a flowchart showing a film-forming method performed by the film-forming device according to the second embodiment;

[0018] Figure 8 is a diagram schematically showing the arrangement of a film-forming device according to a third embodiment;

[0019] Figures 9A to 9F is a diagram showing an example of a method for manufacturing an article; and

[0020] Figures 10A to 10D is a diagram showing another example of a method for manufacturing an article. Detailed Description of the Invention

[0021] In the following, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. In the embodiments, a plurality of features are described, but the invention is not limited to requiring all such features, and a plurality of such features may be appropriately combined. Further, in the drawings, the same reference numerals are given to the same or similar configurations, and redundant descriptions thereof are omitted.

[0022] In the specification and the drawings, directions will be indicated on an XYZ coordinate system, where the direction parallel to the surface of the substrate is defined as the X - Y plane. The directions parallel to the X - axis, Y - axis, and Z - axis of the XYZ coordinate system are the X - direction, Y - direction, and Z - direction, respectively. The rotation about the X - axis, rotation about the Y - axis, and rotation about the Z - axis are θX, θY, and θZ, respectively. Control or drive with respect to the X - axis, Y - axis, and Z - axis respectively refers to control or drive in the direction parallel to the X - axis, in the direction parallel to the Y - axis, and in the direction parallel to the Z - axis. Further, control or drive with respect to the θX - axis, θY - axis, and θZ - axis respectively refers to control or drive of rotation about an axis parallel to the X - axis, rotation about an axis parallel to the Y - axis, and rotation about an axis parallel to the Z - axis. Further, position is information specified based on coordinates on the X - axis, Y - axis, and Z - axis, and posture is information specified by values on the θX - axis, θY - axis, and θZ - axis. The positioning device controls the position and / or the posture. Alignment may include controlling the position and / or the posture of at least one of the substrate and the mold such that the alignment error (overlay error) between the projection area of the substrate and the molding area (the area in contact with the curable component) of the mold is reduced. Additionally, alignment may include controlling to correct or change the shape of at least one of the projection area of the substrate and the molding area of the mold.

[0023] Figure 1 FIG. 1 schematically shows the arrangement of a film - forming apparatus 100 according to a first embodiment. The film - forming apparatus 100 brings the curable component 6 on the substrate 3 into contact with the mold 1, and cures the curable component 6, thereby forming a cured film of the curable component 6. The film - forming apparatus 100 may be configured as an imprinting apparatus that uses a mold 1 having a pattern and transfers the pattern to the curable component 6. Examples of the film - forming apparatus 100 configured as an imprinting apparatus will be explained below. However, the film - forming apparatus 100 may also be configured as a flattening apparatus that uses a mold 1 having a flat surface and uses this flat surface to mold the curable component 6, thereby forming a cured film having a flat surface.

[0024] The curable component 6 is a component that cures upon light irradiation or heating. Among such components, the photocurable component that cures by light contains at least a polymerizable compound and a photoinitiator, and may contain, if necessary, a non-polymerizable compound or a solvent. The non-polymerizable compound is at least one type of material selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like. The curable component 6 may be a monomer such as acrylate or methacrylate.

[0025] The curable component 6 is applied onto the substrate 3 in a film form by a spin coater or a slit coater. Alternatively, a liquid injection head may be used to apply the curable component 6 onto the substrate, either like droplets or like islands or films formed by connecting multiple droplets. The viscosity of the imprint material (viscosity at 25 °C) is, for example, from 1 mPa·s (including the end values) to 100 mPa·s (including the end values). The film forming apparatus 100 may include a dispenser 9 that disposes the curable component 6 on the substrate 3. The dispenser 9 may be configured to discharge the curable component 6 according to, for example, an inkjet method or a thermal inkjet method using a piezoelectric element.

[0026] The controller 7 controls the constituent components of the film forming apparatus 100, such as the curing device 5, the drive mechanism 13 (substrate drive mechanism 11 and mold drive mechanism 12), the dispenser 9, and the gas supplier 20. From another perspective, the controller 7 controls the operation of the film forming apparatus 100. The controller 7 may be constituted by, for example, a programmable logic device (PLD) such as a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a computer installed with a general or specific program, or all or part of them.

[0027] The substrate 3 may be, for example, a silicon wafer, but is not limited thereto. The substrate 3 may be a substrate of aluminum, titanium tungsten alloy, aluminum silicon alloy, aluminum copper silicon alloy, silicon oxide, silicon nitride, or the like. On the substrate 3, a contact layer may be formed by a surface treatment such as a silane coupling treatment, a silicon nitride treatment, or an organic thin film formation. The contact layer may improve the adhesion between the curable component 6 and the substrate 3. It should be noted that the substrate 3 generally may have a circular shape with a diameter of 300 mm, but is not limited thereto.

[0028] The mold 1 may be formed of a material that can transmit the curing energy (such as an optically transparent material). The mold 1 may be formed of an optically transparent resin (such as glass, quartz, polymethyl methacrylate (PMMA), or polycarbonate resin). Alternatively, the mold 1 may be formed of a transparent metallized film, a flexible film such as polydimethylsiloxane or the like, a photocurable film, or a metal film. The mold 1 may have a molding region FR that contacts the curable component 6 in order to mold the curable component 6. The mold 1 may have, for example, a table such that the surface of the table forms the molding region FR.

[0029] The film forming apparatus 100 may include a substrate stage 4, which includes a substrate holder 25 for holding the substrate 3 and a mold holder 2 for holding the mold 1. The substrate holder 25 and the mold holder 2 may include, for example, a vacuum chuck, an electrostatic chuck, or a mechanical jig. The film forming apparatus 100 may include a drive mechanism 13 for changing the distance between the substrate holder 25 and the mold holder 2. The drive mechanism 13 may be configured to change the distance between the substrate holder 25 and the mold holder 2 so that the mold 1 and the curable component 6 disposed on the substrate 3 come into contact with each other, or to separate the curable component 6 (cured product or cured film) from the mold 1. From another perspective, the drive mechanism 13 is configured to change or adjust, for example, the relative position between the substrate holder 25 and the mold holder 2, thereby changing or adjusting the relative position between the substrate 3 and the mold 1.

[0030] The adjustment of the relative position by the drive mechanism 13 may include the alignment between the projection area SR of the substrate 3 and the molding area FR of the mold 1. The drive mechanism 13 may include a substrate drive mechanism 11 for driving the substrate stage 4 and a mold drive mechanism 12 for driving the mold holder 2. The substrate drive mechanism 11 may be configured to drive the substrate 3, the substrate holder 25, or the substrate stage 4 about a plurality of axes (for example, three axes of the X axis, the Y axis, and the θZ axis, and preferably six axes of the X axis, the Y axis, the Z axis, the θX axis, the θY axis, and the θZ axis). The mold drive mechanism 12 may be configured to drive the mold 1 or the mold holder 2 about a plurality of axes (for example, three axes of the Z axis, the θX axis, and the θY axis, and preferably six axes of the X axis, the Y axis, the Z axis, the θX axis, the θY axis, and the θZ axis). The mold drive mechanism 12 may include, for example, a deformation mechanism that deforms the mold 1 by applying a force to the side surface of the mold 1.

[0031] The film forming apparatus 100 may include a curing device 5 for curing the curable component 6. The curing device 5 may cure the curable component 6 by applying curing energy to the curable component 6 in a state where the curable component 6 on the substrate 3 (projection area SR) and the mold 1 (molding area FR) are in contact with each other. The curing energy is, for example, electromagnetic waves such as ultraviolet light. The curing device 5 may include at least one of, for example, a high-pressure mercury lamp, various excimer lamps, excimer lasers, light-emitting diodes, and laser diodes as a curing energy source.

[0032] The substrate stage 4 may include a gas blower 21 that supplies a curing-inhibiting gas to the substrate 3 held by the substrate holder 25. The curing-inhibiting gas is a gas that inhibits the curing of the curable component 6 on the substrate 3. The gas blower 21 may be arranged to supply the curing-inhibiting gas to the substrate 3, particularly near the edge of the substrate 3. The film forming apparatus 100 may include a gas supplier 20 that supplies the curing-inhibiting gas to the gas blower 21, thereby supplying the curing-inhibiting gas to the substrate 3. The curing-inhibiting gas is, for example, an oxygen-containing gas and may be, for example, air. It should be noted that the amount of oxygen in the space formed between the projection area (film forming area) SR of the substrate 3 and the molding area FR of the mold 1 is negligible in a state where the space is filled with the curable component 6. The gas supplier 20 may include a regulator that regulates the gas composition and flow rate of the curing-inhibiting gas.

[0033] Figure 4 FIG. is a schematic perspective view illustrating the structure of the gas blower 21. Figure 4 FIG. illustrates the relative position between the substrate 3 and the mold 1 when a cured film is formed in a partial area among a plurality of projection areas of the substrate 3. The partial area is a projection area defined by the edge of the substrate 3. In other words, the partial area is a projection area whose outer shape is partially defined by an arc along the edge of the substrate 3.

[0034] As Figure 4 Illustrated, the gas blower 21 may be arranged to surround the substrate 3 held by the substrate holder 25. The gas blower 21 may include a plurality of gas blowing holes 22. The plurality of gas blowing holes 22 may be arranged at equal intervals on a circle concentric with the center of the substrate 3 held by the substrate holder 25. Depending on the position of the projection area SR (partial area) where the cured film is to be formed, the gas supplier 20 may supply the curing-inhibiting gas to at least only one gas blowing hole 22 arranged near the projection area SR.

[0035] Alternatively, the plurality of gas blowing holes 22 may be divided into a plurality of groups, and the gas supplier 20 may supply the curing-inhibiting gas to the group corresponding to the position of the projection area SR where the cured film is to be formed. Alternatively, a valve may be provided for each group and controlled so that the curing-inhibiting gas is blown only from the group corresponding to the position of the projection area SR where the cured film is to be formed. All or part of the constituent components of the gas supplier 20 may be arranged on the substrate stage 4.

[0036] As Figure 5 Illustrated, the gas blowing hole 21 may include a gas blowing hole 23 having an annular shape. The center of the annular shape may coincide with the center of the substrate 3 held by the substrate holder 25.

[0037] The distance between the gas blowing hole 21 and the substrate 3 can fall within the range of 1 mm to 30 mm, and preferably within the range of 1 mm to 15 mm.

[0038] For processing the substrate under fixed conditions, it is advantageous to provide the gas blower 21 on the substrate stage 4. By providing the gas blower 21 on the substrate stage 4, the curing inhibition gas can be supplied to, for example, the substrate 3, particularly near the edge of the substrate 3, under fixed conditions regardless of the position of the substrate stage 4. If the gas blower 21 is arranged to surround the substrate 3 held by the substrate holder 25, the curing inhibition gas can be supplied to all partial regions or projection regions near the edge of the substrate 3 under fixed conditions. To reduce the consumption of the curing inhibition gas, it is also advantageous to provide the gas blower 21 on the substrate stage 4.

[0039] Figure 2 An example of a film forming method performed by the film forming apparatus according to the first embodiment will be described. The controller 7 controls the film forming method. In step S101, the dispenser 9 disposes the uncured curable component 6 in the projection region SR of the substrate 3. It should be noted that the substrate 3 can be supplied to the film forming apparatus 100 after the curable component 6 is applied to the substrate 3. In this case, step S101 can be omitted.

[0040] In step S102, the drive mechanism 13 is controlled to bring the molding region FR of the mold 1 into contact with the curable component 6 in the projection region SR of the substrate 3. In step S103, the drive mechanism 13 is controlled to align the projection region SR of the substrate 3 with the molding region FR of the mold 1. This alignment can be performed while observing the relative positions between the alignment marks on the substrate 3 and the alignment marks on the mold 1 by using an alignment mirror (not shown). Alternatively, this alignment can be performed while observing the outer shape of the substrate 3 and the outer shape of the mold 1 by using a sensor (not shown).

[0041] In step S104, while supplying the curing inhibition gas from the gas blower 21, curing energy is applied to the curable component 6 from the curing device 5 to cure the curable component 6 in the projection region SR, thereby forming a cured film from the cured product of the curable component 6. In step S105, the drive mechanism 13 is controlled to separate the mold 1 from the cured film in the projection region SR of the substrate 3.

[0042] Figure 3Schematically shows a state where a cured film of a curable component 6 is formed in a partial region PF that serves as a projection region SR defined by the edge of a substrate 3. The peripheral portion of the substrate 3 has an inclined surface portion, so the distance between the substrate 3 and the molding region FR of the mold 1 increases from the center of the substrate 3 toward the edge of the substrate 3. Therefore, when the cured film of the curable component 6 is formed in the partial region PF, a recess CCV can be formed in the outer portion of the curable component 6. If the recess CCV at the outer portion of the curable component 6 is cured, when separating the mold 1 from the cured film of the curable component 6, residues of the cured product of the curable component 6 can remain in the molding region FR of the mold 1. The residues can remain in the pattern provided in the molding region FR of the mold 1. The residues in the molding region FR of the mold 1 can cause defects when forming a cured film in the next projection region SR.

[0043] To prevent this, when forming the cured film of the curable component 6 in the partial region PF of the substrate 3, a curing-inhibiting gas is blown from a gas blower 21 to supply the curing-inhibiting gas to the vicinity of the edge of the substrate 3. This can solve the problem of residues of the cured product that may be formed by curing of the recess CCV. It should be noted that even when forming the cured film of the curable component 6 in the entire region (rectangular projection region SR) of the substrate 3, the curing-inhibiting gas can be blown from the gas blower 21. In addition, even when forming the cured film at once in the entire region on the surface of the substrate 3 where the cured film should be formed, the curing-inhibiting gas can be blown from the gas blower 21.

[0044] The gas blower 21 can be configured to selectively blow a curing-inhibiting gas or a filling-promoting gas. The filling-promoting gas is a gas that is superior to air in terms of solubility and diffusibility with respect to the curable component 6 and promotes filling the space formed between the substrate 3 and the mold 1 with the curable component 6. As the filling-promoting gas, for example, a gas containing at least one of helium, nitrogen, and a condensable gas (e.g., pentafluoropropane (PFP)) is used. The gas supplier 20 can supply the filling-promoting gas to the gas blower 21 so that the filling-promoting gas is blown from the gas blower 21 before bringing the mold 1 into contact with the curable component 6 on the substrate 3. The gas supplier 20 can be operated so that blowing of the filling-promoting gas from the gas blower 21 ends before curing the curable component 6, and then blowing of the curing-inhibiting gas from the gas blower 21 starts.

[0045] The second embodiment will be described below. Matters not mentioned in the second embodiment can be in accordance with the first embodiment. Figure 6FIG. is a diagram schematically showing the arrangement of the film forming apparatus 100 according to the second embodiment. The film forming apparatus 100 according to the second embodiment may include an arrangement in which a second gas blower 8 is added to the arrangement of the film forming apparatus 100 according to the first embodiment. The second gas blower 8 may be arranged to face the substrate stage 4.

[0046] In the first example, the second gas blower 8 is configured to blow out a curing inhibition gas for inhibiting the curing of the curable component 6. In the second example, the second gas blower 8 is configured to selectively blow out the curing inhibition gas or the filling promotion gas. The second gas blower 8 can be controlled to blow out the filling promotion gas before bringing the mold 1 into contact with the curable component 6 on the substrate 3. The second gas blower 8 can end the blowing of the filling promotion gas before curing the curable component 6, and then start blowing out the curing inhibition gas. The gas blower 21 provided on the substrate stage 4 can start blowing out the curing inhibition gas after the blowing of the filling promotion gas blown out by the second gas blower 8 arranged to face the substrate stage 4 ends. In the third example, the second gas blower 8 is configured to only blow out the filling promotion gas. In this case, the second gas blower 8 can be controlled to start blowing out the filling promotion gas before bringing the mold 1 into contact with the curable component 6 on the substrate 3, and end the blowing of the filling promotion gas before starting to cure the curable component 6 by the curing device 5.

[0047] Figure 7 An example of a film forming method performed by the film forming apparatus 100 according to the second embodiment will be described. The controller 7 controls the film forming method. Here, an example in which the second gas blower 8 is configured to blow out the filling promotion gas as in the third example will be explained.

[0048] In step S701, the dispenser 9 disposes the uncured curable component 6 in the projection area SR of the substrate 3. It should be noted that the substrate 3 may be supplied to the film forming apparatus 100 after the curable component 6 is applied to the substrate 3. In this case, step S701 can be omitted. In step S702, the second gas blower 8 starts blowing out the filling promotion gas. Then, the supply of the filling promotion gas to the space between the substrate 3 and the mold 1 is started.

[0049] In step S703, in a state where the filling promotion gas exists in the space between the substrate 3 and the mold 1, the drive mechanism 13 is controlled to bring the molding area FR of the mold 1 into contact with the curable component 6 in the projection area SR of the substrate 3. In step S704, the drive mechanism 13 is controlled to align the projection area SR of the substrate 3 with the molding area FR of the mold 1. This alignment can be performed while observing the relative positions between the alignment marks on the substrate 3 and the alignment marks on the mold 1 by using an alignment mirror (not shown). Alternatively, this alignment can be performed while observing the outer shape of the substrate 3 and the outer shape of the mold 1 by using a sensor (not shown).

[0050] In step S705, blowing of the filling promotion gas from the second gas blower 8 is stopped. Blowing of the filling promotion gas from the second gas blower 8 can be stopped before the start of the alignment in step S704 or during the execution of the alignment in step S704.

[0051] In step S706, blowing of the curing inhibition gas from the gas blower 21 is started. Then, supply of the curing inhibition gas to the vicinity of the edge of the substrate 3 is started. It should be noted that step S706 can be performed only when the projection area where the curing film is to be formed is a partial area. When step S706 is not performed, step S708 is also not performed.

[0052] In step S707, in a state where the curing inhibition gas is supplied from the gas blower 21, curing energy is applied from the curing device 5 to the curable component 6 to cure the curable component 6 in the projection area SR, thereby forming a curing film from the cured product of the curable component 6. In step S708, blowing of the curing inhibition gas from the gas blower 21 is stopped. It should be noted that when the curing inhibition gas is sufficiently supplied to the vicinity of the edge of the substrate 3 before the start of step S707, blowing of the curing inhibition gas from the gas blower 21 can be stopped before the start of step S707. In step S709, the drive mechanism 13 is controlled to separate the mold 1 from the curing film in the projection area SR of the substrate 3.

[0053] The third embodiment will be described below. Matters not mentioned in the third embodiment can be in accordance with the first and second embodiments. Figure 8FIG. is a diagram schematically showing the arrangement of a film forming apparatus 100 according to a third embodiment. The film forming apparatus 100 according to the third embodiment may include an arrangement in which a third gas blower 31 is added to the arrangement of the film forming apparatus 100 according to the second embodiment. The third gas blower 31 may be arranged to face the substrate stage 4. The third gas blower 31 may be arranged between the second gas blower 8 and the mold 1 held by the mold holder 2. Alternatively, the second gas blower 8 may be arranged between the third gas blower 31 and the mold 1 held by the mold holder 2. In the third embodiment, the second gas blower 8 is configured to blow out a filling promoting gas, and the third gas blower 31 is configured to blow out a curing inhibiting gas.

[0054] Reference will be made to Figure 7 Exemplarily explained is a film forming method performed by the film forming apparatus 100 according to the third embodiment. In step S701, the dispenser 9 disposes the uncured curable component 6 in the projection area SR of the substrate 3. It should be noted that the substrate 3 may be supplied to the film forming apparatus 100 after the curable component 6 is applied to the substrate 3. In this case, step S701 may be omitted. In step S702, the second gas blower 8 starts blowing out the filling promoting gas. Then, the filling promoting gas is started to be supplied to the space between the substrate 3 and the mold 1.

[0055] In step S703, in a state where the filling promoting gas is present in the space between the substrate 3 and the mold 1, the drive mechanism 13 is controlled to bring the molding area FR of the mold 1 into contact with the curable component 6 in the projection area SR of the substrate 3. In step S704, the drive mechanism 13 is controlled to align the projection area SR of the substrate 3 with the molding area FR of the mold 1. This alignment may be performed while observing the relative positions between the alignment marks of the substrate 3 and the mold 1 by using an alignment mirror (not shown). Alternatively, this alignment may be performed while observing the outer shape of the substrate 3 and the outer shape of the mold 1 by a sensor (not shown).

[0056] In step S705, the blowing out of the filling promoting gas from the second gas blower 8 is stopped. The blowing out of the filling promoting gas from the second gas blower 8 may be stopped before the start of the alignment in step S704 or during the execution of the alignment in step S704.

[0057] In step S706, blowing of the curing inhibition gas starts from the gas blower 21 and the third gas blower 31. Then, supplying of the curing inhibition gas to the vicinity of the edge of the substrate 3 starts. Blowing of the curing inhibition gas from the gas blower 21 and from the third gas blower 31 may start simultaneously or at different times. It should be noted that step S706 can be executed only when the projection area where the cured film is formed is a partial area. When step S706 is not executed, step S708 is not executed either.

[0058] In step S707, in a state where the curing inhibition gas is supplied to the edge area of the substrate 3, curing energy is applied from the curing device 5 to the curable component 6 to cure the curable component 6 in the projection area SR, whereby a cured film is formed from the cured product of the curable component 6. In step S708, blowing of the curing inhibition gas from the gas blower 21 stops. It should be noted that when the curing inhibition gas is sufficiently supplied to the vicinity of the edge of the substrate 3 before the start of step S707, blowing of the curing inhibition gas from at least one of the gas blower 21 and the third gas blower 31 can stop before the start of step S707. In step S709, the drive mechanism 13 is controlled to separate the mold 1 from the cured film in the projection area SR of the substrate 3.

[0059] The imprinting device is a device that brings an imprinting material supplied to a substrate into contact with a mold and applies curing energy to the imprinting material to form a pattern of a cured product having a concavo-convex pattern of the mold transferred thereto.

[0060] As the imprinting material, a curable component (sometimes referred to as uncured resin) that cures when receiving curing energy is used. Electromagnetic waves, radiation, heat, or the like is used as the curing energy. The electromagnetic waves are, for example, light such as infrared light, visible light, or ultraviolet light selected in the range of wavelengths from 10 nm (including the end values) to 1 mm (including the end values), or may be electromagnetic radiation such as X-rays or gamma rays. The radiation may be particle radiation such as an electron beam.

[0061] The curable component is a component that cures by being irradiated with light or radiation or by being heated. Among such curable components, the photocurable component that cures by light contains at least a polymerizable compound and a photoinitiator, and if necessary, may contain a non-polymerizable compound or a solvent. The non-polymerizable compound is at least one type of material selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0062] A polymerizable compound is a compound that reacts with a polymerization factor (e.g., a free radical) generated from a photopolymerization initiator and forms a solid from a polymer compound through a chain reaction (polymerization reaction). Examples of polymerizable compounds are compounds having one or more acryloyl or methacryloyl groups, i.e., (meth)acrylic compounds. A photopolymerization initiator is a compound that generates a polymerization factor upon receiving light, and is, for example, a free radical generator such as an acylphosphine oxide compound.

[0063] The imprint material can be applied to a substrate in a film form by a spin coater or a slit coater. Alternatively, the imprint material can be applied to the substrate using a liquid injection head, either like droplets or like islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 °C) is, for example, 1 mPa·s (including the end values) to 100 mPa·s (including the end values).

[0064] Glass, ceramic, metal, semiconductor, resin, or the like is used as the substrate, and, if necessary, a member made of a material different from the substrate can be formed on the surface of the substrate. Examples of the substrate are silicon wafers, semiconductor compound wafers, quartz glass, and the like. Before applying the imprint material, a contact layer for improving the adhesion between the imprint material and the substrate can be provided as needed.

[0065] The pattern of the cured product formed using the film forming apparatus 100 is permanently used for at least some of various products, or temporarily used when manufacturing various products. Products are circuit elements, optical elements, MEMS, recording elements, sensors, molds, and the like. Examples of circuit elements are volatile or non-volatile semiconductor memories (such as DRAM, SRAM, flash memories, and MRAM) and semiconductor elements (such as LSI, CCD, image sensors, and FPGA). Examples of optical elements include microlenses, optical waveguides, waveguides, antireflection films, diffraction gratings, polarization elements, color filters, light emitting elements, displays, and solar cells. Examples of MEMS include DMD, microchannels, and electromechanical conversion elements. Examples of recording elements include optical discs (such as CD or DVD), magnetic disks, magneto-optical discs, and magnetic heads. Examples of sensors include magnetic sensors, optical sensors, and gyro sensors. Molds include imprint molds and the like.

[0066] The pattern of the cured product is directly used as at least some of the constituent members of the above products or temporarily used as a resist mask. After etching or ion implantation in the substrate processing step, the resist mask is removed.

[0067] Next, a product manufacturing method will be described, in which the film forming apparatus 100 configured as an imprint apparatus forms a pattern on a substrate, processes the substrate on which the pattern is formed, and manufactures a product from the processed substrate. AsFigure 9A As shown, a substrate 1z, such as a silicon wafer, is prepared, and a processed material 2z, such as an insulator, is formed on the surface. Next, an imprint material 3z is applied to the surface of the processed material 2z by an inkjet method or a similar method. The state in which the imprint material 3z is applied as a plurality of droplets onto the substrate is shown here.

[0068] As Figure 9B shown, the side of the mold 4z for imprinting having a concavo-convex pattern directly faces and is made to face the imprint material 3z on the substrate. As Figure 9C shown, the substrate 1 on which the imprint material 3z is applied comes into contact with the mold 4z and pressure is applied. The gap between the mold 4z and the processed material 2z is filled with the imprint material 3z. In this state, when the imprint material 3z is irradiated with light as the energy for curing via the mold 4z, the imprint material 3z cures.

[0069] As Figure 9D shown, after the imprint material 3z cures, the mold 4z is separated from the substrate 1z, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In the pattern of the cured product, the concave portion of the mold corresponds to the convex portion of the cured product, and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z is transferred to the imprint material 3z.

[0070] As Figure 9E shown, when etching is performed using the pattern of the cured product as an anti-etching mask, the portions of the surface of the processed material 2z where there is no cured product or where the cured product is still thin are removed to form grooves 5z. As Figure 9F shown, when the pattern of the cured product is removed, an article in which grooves 5z are formed in the surface of the processed material 2z can be obtained. Here, the pattern of the cured product is removed. However, as an alternative to removing the pattern of the cured product after processing, the pattern of the cured product can be used as, for example, an interlayer dielectric film included in a semiconductor element or the like, that is, a constituent member of the article.

[0071] Next, another method for manufacturing an article will be described. As Figure 10A shown, a substrate 1y, such as quartz glass, is prepared. Next, an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of other material, such as a metal or a metal compound, can be provided on the surface of the substrate 1y.

[0072] As Figure 10B shown, the side of the mold 4y for imprinting having a concavo-convex pattern directly faces and is made to face the imprint material 3y on the substrate. As Figure 10CAs shown, the substrate 1y to which the imprint material 3y is applied contacts the mold 4y and pressure is applied. The gap between the mold 4y and the substrate 1y is filled with the imprint material 3y. In this state, when the imprint material 3 is irradiated with light through the mold 4y, the imprint material 3 cures.

[0073] As Figure 10D shown, after the imprint material 3y cures, the mold 4y is separated from the substrate 1y, and a pattern of the cured product of the imprint material 3y is formed on the substrate 1y. Accordingly, an article including the pattern of the cured product as a constituent member can be obtained. It should be noted that when the substrate 1y is etched using the pattern of the cured product as a mask in the Figure 10D state shown, an article having concavo-convex portions opposite to the mold 4y (e.g., an imprint mold) can be obtained.

[0074] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims will be given the broadest interpretation so as to cover all such modifications as well as equivalent structures and functions.

Claims

1. A film forming apparatus, comprising: a substrate stage including a substrate holder configured to hold a substrate; a mold holder configured to hold a mold; a driving mechanism configured to change a gap between the substrate holder and the mold holder; and a curing device configured to cure a curable component while the curable component disposed on the substrate is in contact with the mold; wherein the substrate stage includes a gas blower configured to supply a gas for suppressing curing of the curable component to the substrate held by the substrate holder.

2. The apparatus according to claim 1, wherein the gas blower is arranged to surround the substrate held by the substrate holder.

3. The apparatus according to claim 2, wherein the gas blower includes a plurality of gas blowing holes, and the plurality of gas blowing holes are arranged at equal intervals on a circle concentric with the center of the substrate.

4. The apparatus according to claim 2, wherein the gas blower includes a gas blowing hole having an annular shape, and the center of the annular shape coincides with the center of the substrate held by the substrate holder.

5. The apparatus according to claim 1, further comprising a second gas blower arranged to face the substrate stage and configured to blow out a curing inhibition gas for suppressing curing of the curable component.

6. The apparatus according to claim 5, wherein the second gas blower selectively blows out one of the curing inhibition gas and a filling promotion gas for promoting filling of a space formed between the substrate and the mold with the curable component.

7. The apparatus according to claim 6, wherein the second gas blower ends blowing out the filling promotion gas before curing the curable component and then starts blowing out the curing inhibition gas.

8. The apparatus according to claim 7, wherein after ending blowing out the filling promotion gas by the second gas blower, the gas blower starts blowing out a gas for suppressing curing of the curable component.

9. The apparatus according to claim 5, further comprising a third gas blower arranged to face the substrate stage, wherein the third gas blower blows out a filling promotion gas to supply the filling promotion gas to a space formed between the substrate and the mold, the filling promotion gas being for promoting filling with the curable component.

10. The apparatus according to claim 9, wherein the third gas blower is arranged between the second gas blower and the mold held by the mold holder.

11. The apparatus according to claim 10, wherein the third gas blower ends blowing out the filling promotion gas before curing the curable component, and after ending blowing out the filling promotion gas by the third gas blower, the gas blower starts supplying a gas for suppressing curing of the curable component.

12. The device according to claim 1, wherein the distance between the gas blower and the edge of the substrate falls within the range of 1 mm to 30 mm.

13. The device according to any one of claims 1 to 12, wherein the drive mechanism drives at least one of the substrate holder and the mold holder so that the curable component and the mold come into contact with each other or the curable component and the mold are separated from each other.

14. The device according to any one of claims 1 to 12, wherein the mold holder holds a mold having a pattern as the mold, and a film having the pattern transferred thereon is formed by curing the curable component.

15. The device according to any one of claims 1 to 12, wherein the mold holder holds a mold having a flat surface as the mold, and a film having a flat surface is formed by curing the curable component.

16. A method for forming a film, comprising: bringing a curable component disposed on a substrate held by a substrate holder into contact with a mold; supplying a gas for suppressing the curing of the curable component from the substrate holder to the substrate held by the substrate holder; curing the curable component in a state where the curable component on the substrate is in contact with the mold, thereby forming a film from the cured product of the curable component; and separating the film from the mold.

17. The method according to claim 16, further comprising supplying a filling promoting gas to a space formed between the substrate and the mold, the filling promoting gas being for promoting filling of the space with the curable component, wherein the bringing the curable component disposed on the substrate held by the substrate holder into contact with the mold is performed in a state where the filling promoting gas is present in the space.

18. The method according to claim 17, wherein the supplying is performed after ending the supply of the filling promoting gas.

19. A method for manufacturing an article, comprising: forming a film on a substrate from a cured product of a curable component by the film forming device defined in any one of claims 1 to 15; and obtaining an article by processing the substrate that has undergone the film formation.

20. A method for manufacturing an article, comprising: forming a film on a substrate from a cured product of a curable component by the film forming method defined in any one of claims 16 to 18; and obtaining an article by processing the substrate that has undergone the film formation.

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