A large-format marking method and system based on laser galvanometer

Abstract

The present invention discloses a large-format marking method and system based on a laser galvanometer. The method comprises: acquiring processing data; analyzing the processing data and determining continuous trajectories in the processing data as marking stacks or cutting stacks; defining each marking stack and each cutting stack as a processing area, and sequentially processing each processing area using a galvanometer system; during the processing process, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence, and correcting the processing coordinates of each processing area based on the geometric error ΔE. The present invention provides a dynamic optimization technology that integrates error pre-compensation for forced splicing with intelligent splicing, achieving high precision, high efficiency, and strong robustness in large-format laser processing.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and more specifically, to a large-format marking method and system based on a laser galvanometer. Background Art

[0002] The laser galvanometer system is limited by the galvanometer deflection angle and the field of view of the field lens. When processing large formats, it is necessary to use area-by-area splicing and marking. The traditional splicing method has the following problems:

[0003] Block stitching: There is a problem of cumulative error when stitching large formats. Relying on manual experience to set stitching parameters is prone to cumulative errors, resulting in overlaps or gaps in the stitching.

[0004] Therefore, the prior art has defects and is in urgent need of improvement. Summary of the Invention

[0005] In view of the above problems, the purpose of the present invention is to provide a large-format marking method and system based on laser galvanometer, and to provide a dynamic optimization technology that integrates error pre-compensation of forced splicing and intelligent splicing to achieve high precision, high efficiency and strong robustness of large-format laser processing.

[0006] The first aspect of the present invention provides a large-format marking method based on a laser galvanometer, comprising:

[0007] Obtain processing data;

[0008] Analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks;

[0009] Each marking stack and each cutting stack is determined as a processing area, and each processing area is processed in turn by the galvanometer system;

[0010] During the machining process, the geometric error ΔE between adjacent machining areas is calculated based on the machining sequence, and the machining coordinates of each machining area are corrected according to the geometric error ΔE.

[0011] In this solution, analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks includes:

[0012] Comparing the continuous track in the processing data with the galvanometer width M, if the outer frame of the continuous track is smaller than the galvanometer width M, determining the continuous track as a processing stack;

[0013] The galvanometer width M is adjusted with the processing stack as the center, and other continuous tracks within the adjusted galvanometer width M and with an outer frame smaller than the galvanometer width M are added to the processing stack to determine the marking stack;

[0014] The continuous track whose outer frame exceeds the galvanometer format M is determined as the cutting stack.

[0015] This plan also includes:

[0016] The galvanometer system is installed on an XY motion platform, and the XY motion platform drives the galvanometer system to perform motion processing.

[0017] This plan also includes:

[0018] The marking stack and the cutting stack are distinguished by layer parameters, the marking stack is set as the first layer, and the cutting stack is set as the second layer.

[0019] In this solution, each marking stack and each cutting stack is determined as a processing area, and each processing area is processed in sequence by the galvanometer system, including:

[0020] Move the galvanometer system according to the XY platform coordinates of the marking stack corresponding to the processing area;

[0021] Converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system;

[0022] Controlling the laser to process the marking stack according to the galvanometer coordinates;

[0023] When all marking stacks are processed, the laser is adjusted to the center of the galvanometer system, and the XY motion platform is controlled based on the XY platform coordinates of the cutting stack to drive the galvanometer system to process the cutting stack.

[0024] In this solution, the calculation of the geometric error ΔE of adjacent processing areas based on the processing sequence includes:

[0025] With the galvanometer width M as the interval, a cross coordinate is drawn at the center of each processing area, and the coordinates of the cross center point are obtained by the visual positioning module to determine the coordinates of the center point of each processing area;

[0026] The coordinate difference between the center point coordinates of adjacent processing areas is calculated based on the processing sequence, and the geometric error ΔE of the adjacent processing areas is determined.

[0027] In this solution, the processing coordinates of each processing area are corrected by using the geometric error ΔE, including:

[0028] Get the geometric error ΔE between the nth processing area and the n-1th processing area (n,n-1) , combined with the compensation value C of the n-1th processing area n-1 Calculate the compensation value C of the nth processing area n ; ;

[0029] According to the compensation value C n Correct the processing coordinates of the nth processing area.

[0030] The second aspect of the present invention provides a large-format marking system based on a laser galvanometer, comprising:

[0031] Data acquisition module, used to acquire processing data;

[0032] a data analysis module, configured to analyze the processing data and determine the continuous tracks in the processing data as marking stacks or cutting stacks;

[0033] The data processing module is used to determine each marking stack and each cutting stack as a processing area, and process each processing area in turn through the galvanometer system;

[0034] The data correction module is used to calculate the geometric error ΔE between adjacent processing areas based on the processing sequence during the processing, and correct the processing coordinates of each processing area according to the geometric error ΔE.

[0035] The third aspect of the present invention provides a computer-readable storage medium, which includes a large-format marking method program based on a laser galvanometer. When the large-format marking method program based on a laser galvanometer is executed by a processor, the steps of the large-format marking method based on a laser galvanometer as described above are implemented.

[0036] The present invention discloses a large-format marking method and system based on a laser galvanometer. The method comprises: acquiring processing data; analyzing the processing data and determining continuous trajectories in the processing data as marking stacks or cutting stacks; defining each marking stack and each cutting stack as a processing area, and sequentially processing each processing area using a galvanometer system; during the processing process, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence, and correcting the processing coordinates of each processing area based on the geometric error ΔE. The present invention provides a dynamic optimization technology that integrates error pre-compensation for forced splicing with intelligent splicing, achieving high precision, high efficiency, and strong robustness in large-format laser processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A flow chart of a large-format marking method based on a laser galvanometer provided by the present invention is shown;

[0038] Figure 2 A flow chart showing a method for determining a marking stack and a cutting stack provided by the present invention is shown;

[0039] Figure 3 A flow chart of a method for processing a processing area provided by the present invention is shown;

[0040] Figure 4 The block diagram of a large-format marking system based on a laser galvanometer provided by the present invention is shown. DETAILED DESCRIPTION

[0041] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0042] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0043] Figure 1 The flowchart of a large-format marking method based on a laser galvanometer provided by the present invention is shown.

[0044] like Figure 1 As shown, the present invention discloses a large-format marking method based on a laser galvanometer, comprising:

[0045] S102, obtaining processing data;

[0046] S104, analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks;

[0047] S106, each marking stack and each cutting stack is determined as a processing area, and each processing area is processed in sequence by the galvanometer system;

[0048] S108 , during the machining process, calculating the geometric error ΔE between adjacent machining areas based on the machining sequence, and correcting the machining coordinates of each machining area according to the geometric error ΔE.

[0049] According to an embodiment of the present invention, large-format processing data marking is achieved through the use of a galvanometer system (including a laser for emitting laser light), an XY motion platform, and a visual positioning module. First, the large-format processing data is analyzed based on the galvanometer format M of the galvanometer system (the processing format of the galvanometer system). The outer frame size of each continuous track is compared with the specifications of the galvanometer format, and multiple marking stacks and / or cutting stacks are determined, and the processing data is divided into multiple processing areas. By establishing different layers to distinguish between the marking stack and the cutting stack, a processing path is generated in the order of processing the marking stack first and then the cutting stack, and each processing area is processed in sequence. During the processing of the marking stack, the XY motion platform drives the galvanometer system to the corresponding position of the marking stack. The coordinates of the galvanometer system's galvanometer center point are used as the zero-point coordinates. The marking stack is converted from XY platform coordinates to galvanometer coordinates. The galvanometer system's laser is controlled to emit laser light according to the marking stack's galvanometer coordinates, completing the processing of the marking stack. During the processing of the cutting stack, the galvanometer system stops oscillating, aligning the laser at the center of the galvanometer system. The XY motion platform is controlled to drive the galvanometer system to perform the cutting action according to the XY platform coordinates of the corresponding processing area of the cutting stack, completing the processing of the cutting stack. Through the operation of these two processing modes, large-scale processing data is completed. Since the processing data of the continuous trajectory is not segmented, the entire processing trajectory is very smooth, without any misalignment, gaps, or color differences caused by the size of the laser cutting at the beginning and end.

[0050] In addition, when the equipment is installed, the xy axis is not absolutely vertical, and there will be a certain angle error. When the xy format is relatively large, there must be a position error between the starting point and the end point of the processing. For example, the starting position is (0,0); the end point of the processing at the same level may be (0,0.05mm), and the position error may be positive or negative. Since this solution does not splice the continuous trajectory, the splicing phenomenon is not visible, but the position error still exists, so compensation is required. By calculating the center point coordinates of each processing area, combined with the processing order of each processing area in the processing data, the geometric error of the adjacent processing areas is determined, and the compensation value of the current processing area is determined in combination with the compensation value of the previous processing area. The processing coordinates of the current processing area are corrected to eliminate the position error to the greatest extent and ensure the processing effect of the processing data.

[0051] Figure 2 The flowchart of the method for determining the marking stack and the cutting stack provided by the present invention is shown.

[0052] like Figure 2 As shown, according to an embodiment of the present invention, analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks includes:

[0053] S202, comparing the continuous track in the processing data with the galvanometer width M, if the outer frame of the continuous track is smaller than the galvanometer width M, then determining the continuous track as a processing stack;

[0054] S204, adjusting the galvanometer width M with the processing stack as the center, adding other continuous tracks within the adjusted galvanometer width M and with an outer frame smaller than the galvanometer width M to the processing stack to determine the marking stack;

[0055] S206 , determining the continuous track where the outer frame exceeds the galvanometer width M as a cutting stack.

[0056] It should be noted that, with the XY motion platform as the reference coordinate system, the processing format of the galvanometer system is determined as the galvanometer format M. First, the galvanometer system is controlled to return to the coordinate zero point of the XY platform coordinates, and the processing data (large-format data) is analyzed and classified based on the trajectory continuity. If the outer frame of the continuous trajectory is smaller than the galvanometer format M, it is stored separately as a processing stack. With this stack as the center, if there are other continuous tracks within the area of the galvanometer format that also meet this condition, they are also added to this stack. And so on. After calculation and planning, all data with outer frames smaller than the galvanometer format M have been stacked, and each processing stack is determined as a marking stack. The remaining data larger than the galvanometer format M is listed as a separate stack and determined as a cutting stack.

[0057] According to an embodiment of the present invention, the further embodiment includes:

[0058] The galvanometer system is installed on the XY motion platform, which drives the galvanometer system to perform motion processing.

[0059] It should be noted that the galvanometer system is installed on the XY motion platform and driven by the XY motion platform. It can realize two processing modes: (1) The XY motion platform moves to a certain position and stops. The galvanometer system controls the laser to start marking. After marking is completed, the XY motion platform continues to move to other positions. This method can realize the processing of data within the galvanometer format. Data exceeding the galvanometer processing format adopts the second processing mode. (2) The laser is returned to the center of the galvanometer system. The dual-axis galvanometer of the galvanometer system does not move. The laser is output from the galvanometer. The XY motion platform drives the galvanometer head to move, forming a processing system with the galvanometer head as the cutting head. This method can realize large-scale arbitrary continuous trajectory processing.

[0060] According to an embodiment of the present invention, the further embodiment includes:

[0061] The marking stack and cutting stack are distinguished by layer parameters, and the marking stack is set as the first layer and the cutting stack is set as the second layer.

[0062] It should be noted that the parameters of the cutting stack and the marking stack are different, so different layers are created and distinguished by layer parameters.

[0063] Figure 3 A flow chart of the method for processing a processing area provided by the present invention is shown.

[0064] like Figure 3 As shown, according to an embodiment of the present invention, each marking stack and each cutting stack is respectively determined as a processing area, and each processing area is processed in sequence by a galvanometer system, including:

[0065] S302, moving the galvanometer system according to the XY platform coordinates of the processing area corresponding to the marking stack;

[0066] S304, converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system;

[0067] S306, controlling the laser to process the marking stack according to the galvanometer coordinates;

[0068] S308, when all marking stacks are processed, the laser is adjusted to the center of the galvanometer system, and the XY motion platform is controlled based on the XY platform coordinates of the cutting stack to drive the galvanometer system to process the cutting stack.

[0069] It should be noted that the processing area includes the marking stack and the cutting stack. The processing system gives priority to processing the marking stack. According to the XY platform coordinates of the processing area corresponding to the marking stack, the XY motion platform is controlled to drive the galvanometer system to move to the processing area corresponding to the marking stack. The coordinate conversion of the marking data corresponding to the marking stack is performed. The coordinates of the galvanometer center point of the galvanometer system are used as the 0-point coordinates, and the XY platform coordinates are converted to galvanometer coordinates. The marking stack is galvanometer marked. After completion, the next marking stack is searched for and the above operation is repeated for galvanometer marking until all marking stacks are processed. The system switches to the cutting stack processing, the galvanometer system stops swinging, and the laser is at the center of the galvanometer system. According to the XY platform coordinates of the processing area corresponding to the cutting stack, the XY motion platform is controlled to drive the galvanometer system to perform the cutting action to complete the processing of the cutting stack.

[0070] According to an embodiment of the present invention, calculating the geometric error ΔE of adjacent processing areas based on the processing sequence includes:

[0071] With the galvanometer width M as the interval, a cross coordinate is drawn at the center of each processing area. The coordinates of the cross center point are obtained through the visual positioning module to determine the coordinates of the center point of each processing area;

[0072] The coordinate difference between the center point coordinates of adjacent processing areas is calculated based on the processing sequence, and the geometric error ΔE of the adjacent processing areas is determined.

[0073] It should be noted that during the movement of the XY motion platform, there are cumulative errors from left to right and from top to bottom. Because the XY axes are not absolutely perpendicular (high-end equipment will perform laser interferometer measurements and then compensate, but ordinary equipment does not have this condition), the visual positioning module can be used for measurement and compensation. After controlling the XY motion platform to return to the coordinate zero point of the XY platform coordinates, use the galvanometer format M as an interval and, in order from left to right and from top to bottom, mark a cross coordinate at the center of each processing area. The entire processing format can mark a maximum of R rows and C columns of crosses. Use the visual positioning module to test the position of each cross center point, obtain the cross center point coordinates, and determine the center point coordinates of each processing area.

[0074] The processing order is usually from left to right and from top to bottom. The horizontal coordinate difference between the actual center point coordinates of adjacent processing areas is subtracted from the horizontal coordinate difference between the standard center point coordinates of adjacent processing areas to determine the horizontal coordinate geometric error Δx of the adjacent processing areas. The vertical coordinate geometric error Δy of the adjacent processing areas is subtracted from the vertical coordinate difference between the actual center point coordinates of adjacent processing areas. The horizontal coordinate geometric error Δx and the vertical coordinate geometric error Δy of the adjacent processing areas are determined as the geometric error ΔE(Δx,Δy) of the adjacent processing areas. The horizontal coordinate difference and the vertical coordinate difference of the standard center point coordinates of adjacent processing areas are determined based on the number of galvanometer frames M between them. The horizontal coordinate difference is the number of galvanometer frames M in the x-axis direction × the length of the galvanometer frame M, and the vertical coordinate difference is the number of galvanometer frames M in the y-axis direction × the width of the galvanometer frame M.

[0075] In addition, the accuracy of the visual positioning module directly affects the accuracy of error detection, so a high-resolution industrial camera needs to be selected.

[0076] According to an embodiment of the present invention, the processing coordinates of each processing area are corrected using the geometric error ΔE, including:

[0077] Get the geometric error ΔE between the nth processing area and the n-1th processing area (n,n-1) , combined with the compensation value C of the n-1th processing area n-1 Calculate the compensation value C of the nth processing area n ; ;

[0078] According to the compensation value C n Correct the processing coordinates of the nth processing area.

[0079] It should be noted that the splicing error has a cumulative characteristic and needs to be corrected through the splicing error chain compensation. The core idea is to avoid the accumulation of errors by correcting the errors in the splicing area step by step. During the processing, the compensation value of the current processing area is calculated based on the geometric errors of the current processing area and the previous processing area, as well as the compensation value of the previous processing area. The compensation value includes the horizontal coordinate compensation value and the vertical coordinate compensation value. The horizontal coordinate compensation value of the n-1th processing area is added to the horizontal coordinate geometric error Δx (n,n-1) Determine the horizontal coordinate compensation value of the nth processing area, and add the vertical coordinate compensation value of the n-1th processing area to the vertical coordinate geometric error Δy (n,n-1) Determine the vertical coordinate compensation value for the nth processing area. Add the horizontal coordinate compensation value to the horizontal coordinate of the processing coordinate of the current processing area, and add the vertical coordinate compensation value to the vertical coordinate of the processing coordinate of the current processing area to determine the corrected processing coordinate. Process the current processing area using the corrected processing coordinate. The compensation value for the first processing area is (0, 0).

[0080] Figure 4 The block diagram of a large-format marking system based on a laser galvanometer provided by the present invention is shown.

[0081] like Figure 4 As shown, the second aspect of the present invention provides a large-format marking system based on a laser galvanometer, comprising:

[0082] Data acquisition module, used to acquire processing data;

[0083] A data analysis module is used to analyze the processing data and determine the continuous tracks in the processing data as marking stacks or cutting stacks;

[0084] The data processing module is used to determine each marking stack and each cutting stack as a processing area, and process each processing area in turn through the galvanometer system;

[0085] The data correction module is used to calculate the geometric error ΔE of adjacent processing areas based on the processing sequence during the processing, and correct the processing coordinates of each processing area according to the geometric error ΔE.

[0086] The third aspect of the present invention provides a computer-readable storage medium, which includes a large-format marking method program based on a laser galvanometer. When the large-format marking method program based on a laser galvanometer is executed by a processor, the steps of the above-mentioned large-format marking method based on a laser galvanometer are implemented.

[0087] The information involved in this application (including but not limited to user device information, user personal information, etc.), data (including but not limited to data used for analysis, stored data, displayed data, etc.) and signals (including but not limited to signals transmitted between user terminals and other devices, etc.) are all authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of the relevant countries and regions. For example, the "processing data" and "geometric errors of adjacent processing areas" involved in this disclosure are all obtained with full authorization.

[0088] The present invention discloses a large-format marking method and system based on a laser galvanometer. The method comprises: acquiring processing data; analyzing the processing data and determining continuous trajectories in the processing data as marking stacks or cutting stacks; defining each marking stack and each cutting stack as a processing area, and sequentially processing each processing area using a galvanometer system; during the processing process, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence, and correcting the processing coordinates of each processing area based on the geometric error ΔE. The present invention provides a dynamic optimization technology that integrates error pre-compensation for forced splicing with intelligent splicing, achieving high precision, high efficiency, and strong robustness in large-format laser processing.

[0089] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0090] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed across multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the scheme of this embodiment.

[0091] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0092] Those skilled in the art will appreciate that all or part of the steps of the above-mentioned method embodiments may be implemented by hardware associated with program instructions, and the aforementioned program may be stored in a computer-readable storage medium. When the program is executed, the program executes the steps of the above-mentioned method embodiments. The aforementioned storage medium includes various media that can store program codes, such as mobile storage devices, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical disks.

[0093] Alternatively, if the integrated units described above are implemented as software modules and sold or used as standalone products, they can also be stored on a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present invention, or the portion that contributes to the prior art, can be embodied in the form of a software product. This computer software product, stored on a storage medium, includes instructions for enabling a computer device (such as a personal computer, server, or network device) to execute all or part of the methods described in various embodiments of the present invention. The aforementioned storage media include various media capable of storing program code, such as removable storage devices, ROM, RAM, magnetic disks, or optical disks.

Claims

1. A large-format marking method based on a laser galvanometer, characterized in that: include: Obtain processing data; Analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks; Each marking stack and each cutting stack is determined as a processing area, and each processing area is processed in turn by the galvanometer system; During the machining process, the geometric error ΔE of adjacent machining areas is calculated based on the machining sequence, and the machining coordinates of each machining area are corrected according to the geometric error ΔE; The analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks includes: Comparing the continuous track in the processing data with the galvanometer width M, if the outer frame of the continuous track is smaller than the galvanometer width M, determining the continuous track as a processing stack; The galvanometer width M is adjusted with the processing stack as the center, and other continuous tracks within the adjusted galvanometer width M and with an outer frame smaller than the galvanometer width M are added to the processing stack to determine the marking stack; The continuous track whose outer frame exceeds the galvanometer format M is determined as the cutting stack.

2. The large-format marking method based on a laser galvanometer according to claim 1, characterized in that: Also includes: The galvanometer system is installed on an XY motion platform, and the XY motion platform drives the galvanometer system to perform motion processing.

3. The large-format marking method based on laser galvanometer according to claim 1, characterized in that: Also includes: The marking stack and the cutting stack are distinguished by layer parameters, the marking stack is set as the first layer, and the cutting stack is set as the second layer.

4. The large-format marking method based on a laser galvanometer according to claim 1, characterized in that: The method of determining each marking stack and each cutting stack as a processing area and processing each processing area in sequence by the galvanometer system includes: Move the galvanometer system according to the XY platform coordinates of the marking stack corresponding to the processing area; Converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system; Controlling the laser to process the marking stack according to the galvanometer coordinates; When all marking stacks are processed, the laser is adjusted to the center of the galvanometer system, and the XY motion platform is controlled based on the XY platform coordinates of the cutting stack to drive the galvanometer system to process the cutting stack.

5. The large-format marking method based on laser galvanometer according to claim 1, characterized in that: The step of calculating the geometric error ΔE of adjacent processing areas based on the processing sequence includes: With the galvanometer width M as the interval, a cross coordinate is drawn at the center of each processing area, and the coordinates of the cross center point are obtained by the visual positioning module to determine the coordinates of the center point of each processing area; The coordinate difference between the center point coordinates of adjacent processing areas is calculated based on the processing sequence, and the geometric error ΔE of the adjacent processing areas is determined.

6. The large-format marking method based on laser galvanometer according to claim 1, characterized in that: The correcting of the processing coordinates of each processing area by using the geometric error ΔE includes: Get the geometric error ΔE between the nth processing area and the n-1th processing area (n,n-1) , combined with the compensation value C of the n-1th processing area n-1 Calculate the compensation value C of the nth processing area n ; ; According to the compensation value C n Correct the processing coordinates of the nth processing area.

7. A large-format marking system based on a laser galvanometer, used to implement the large-format marking method based on a laser galvanometer according to any one of claims 1 to 6, characterized in that: include: Data acquisition module, used to acquire processing data; a data analysis module, configured to analyze the processing data and determine the continuous tracks in the processing data as marking stacks or cutting stacks; The data processing module is used to determine each marking stack and each cutting stack as a processing area, and process each processing area in turn through the galvanometer system; A data correction module is used to calculate the geometric error ΔE of adjacent processing areas based on the processing sequence during the processing, and to correct the processing coordinates of each processing area according to the geometric error ΔE; The analyzing the processing data and determining the continuous tracks in the processing data as marking stacks or cutting stacks includes: Comparing the continuous track in the processing data with the galvanometer width M, if the outer frame of the continuous track is smaller than the galvanometer width M, determining the continuous track as a processing stack; The galvanometer width M is adjusted with the processing stack as the center, and other continuous tracks within the adjusted galvanometer width M and with an outer frame smaller than the galvanometer width M are added to the processing stack to determine the marking stack; The continuous track whose outer frame exceeds the galvanometer format M is determined as the cutting stack.

8. The large-format marking system based on laser galvanometer according to claim 7, characterized in that: The method of determining each marking stack and each cutting stack as a processing area and processing each processing area in sequence by the galvanometer system includes: Move the galvanometer system according to the XY platform coordinates of the marking stack corresponding to the processing area; Converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system; Controlling the laser to process the marking stack according to the galvanometer coordinates; When all marking stacks are processed, the laser is adjusted to the center of the galvanometer system, and the XY motion platform is controlled based on the XY platform coordinates of the cutting stack to drive the galvanometer system to process the cutting stack.

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