Precise air floatation gantry motion platform

Abstract

The invention provides a precise air floatation gantry motion platform, and relates to the technical field of air floatation motion platforms. A controller is arranged on the side wall of one end of the platform base; damping supporting feet are arranged at the four corners of the bottom of the platform base correspondingly, and pneumatic damping buffering mechanisms are arranged among the four damping supporting feet and used for stabilizing the platform base. Portal frames parallel to each other are arranged on the edges of the left end and the right end of the platform base respectively. Through multi-dimensional innovative design, leap-type improvement of the performance of the precise air floating gantry motion platform is achieved. Firstly, a low-thermal-expansion-coefficient alloy material and a honeycomb-shaped lightening hole structure are adopted, the thermal inertia is reduced while the flexural rigidity of the base is guaranteed, and a foundation platform with light weight and vibration resistance is formed in cooperation with the high damping characteristic of honeycomb filler.

Description

Technical Field

[0001] The present invention relates to the technical field of air-floating motion platforms, and in particular to a precision air-floating gantry motion platform. Background Art

[0002] In the process of semiconductor manufacturing and precision detection, the processing and detection of high-precision components such as wafers impose stringent requirements on the dynamic performance of the motion platform. Due to the friction and wear of components such as ball screws and guide rail pairs in traditional mechanical contact platforms, it is easy to introduce positioning errors and thermal deformations, making it difficult to meet the nanometer-level precision requirements. Although the air-floating platform realizes non-contact motion through aerostatic support, its open air film is extremely sensitive to external vibrations. Especially when the cross-movement mechanism starts and stops at high speed, the hammering effect caused by air flow pulsation will cause the platform to generate periodic vibrations, directly affecting the repeat positioning accuracy of wafer transfer. In addition, wafer inspection equipment usually needs to integrate multi-functional modules such as conveying, inspection, loading and unloading, etc. The traditional single-station design has low equipment utilization due to the serial arrangement of inspection and loading / unloading processes, while multi-station coordination exacerbates vibration transmission due to mechanical coupling. More seriously, semiconductor production lines usually require equipment to operate stably in a wide temperature range environment. However, due to the mismatch of material thermal expansion coefficients and the limitations of passive vibration isolation design in conventional platforms, thermal drift is easily generated due to temperature fluctuations, further deteriorating the detection accuracy. Although existing technologies have tried to suppress vibrations by increasing structural stiffness or passive damping, they often come at the cost of sacrificing light weight and cannot eliminate the multi-degree-of-freedom vibration coupling problem at the root. Summary of the Invention

[0003] The present invention relates to a precision air-floating gantry motion platform, which realizes high-precision and high-efficiency wafer processing capabilities in semiconductor manufacturing scenarios through the deep coordination of air-floating vibration reduction, dynamic vibration elimination, thermal stability optimization and intelligent control.

[0004] The present invention provides a precision air-floating gantry motion platform, specifically including: a platform base; a controller is provided on the side wall at one end of the platform base; shock-absorbing feet are respectively provided at the four corners of the bottom of the platform base, and a pneumatic shock-absorbing buffer mechanism is provided between the four shock-absorbing feet for stabilizing the platform base; gantry frames are respectively provided on the upper and lower edges at the left and right ends of the platform base; a horizontal cross-movement seat is provided at the upper end of the gantry frame, a cross-movement air-floating guide table is provided on the cross-movement seat, a cross-movement air-floating bearing seat is slidably installed on the cross-movement air-floating guide table, and a vertical lifting frame is installed on the cross-movement air-floating bearing seat for transferring wafers to be detected; the cross-movement seat and the gantry frame are supported by two vertical support rods; a vibration elimination mechanism for eliminating the air hammer is provided on the support rods; a conveyor is provided on the platform base between the two gantry frames for conveying wafers, and a double inspection station is fixedly provided on the platform base on one side of the conveyor.

[0005] Optionally, the platform base is made of an alloy material with a low coefficient of thermal expansion, and honeycomb-shaped weight-reducing holes are designed inside to balance rigidity and light weight. The honeycomb cavities are filled with honeycomb fillers.

[0006] Optionally, the pneumatic shock-absorbing and buffering mechanism includes a support foot block, a balance air pipe, an external connecting pipe, and an anti-disengagement pin. The support foot block has an inverted T-shaped structure and slides vertically in the shock-absorbing support leg. An anti-disengagement pin is connected between the support foot block and the shock-absorbing support leg to prevent the support foot block from separating from the shock-absorbing support leg. A balance air pipe is connected outward from the cavity between the support foot block and the shock-absorbing support leg to connect the cavities between the four shock-absorbing support legs in series. An external connecting pipe is connected outward from one of the balance air pipes for communicating with an external air source.

[0007] Optionally, the vibration damping mechanism includes a resonance ring, a conduction column, a vibration damping body, a guiding pipe, and a spring. The resonance ring is sleeved on the upper end of the support rod, and two conduction columns are symmetrically penetrated through the resonance ring. The upper ends of the conduction columns are fixedly connected to the bottom of the transverse movement seat. A vibration damping body with a wider upper part and a narrower lower part is slidably sleeved on the support rod below the resonance ring, and a spring is sleeved on the support rod below the vibration damping body.

[0008] Optionally, at least six L-shaped guiding pipes are annularly distributed on the conical surface of the vibration damping body, and the corner section of the guiding pipe is at the lower end.

[0009] Optionally, two center guiding frames are symmetrically arranged on the left and right at the position near the input end of the conveyor, and the wafers to be conveyed pass through between the two center guiding frames.

[0010] Optionally, two inspection table air-floating guide rails are arranged in parallel on the duplex inspection table. An inspection table air-floating bearing seat is slidably installed on the inspection table air-floating guide rail, and the wafers to be detected are placed on the inspection table air-floating bearing seat.

[0011] The present invention provides a precision air-floating gantry motion platform, which has the following beneficial effects: Through multi-dimensional innovative design, the present invention has achieved a leapfrog improvement in the performance of the precision air-floating gantry motion platform. First, an alloy material with a low coefficient of thermal expansion and a honeycomb-shaped weight-reducing hole structure are adopted to reduce the thermal inertia while ensuring the flexural rigidity of the base. Combined with the high damping characteristics of the honeycomb filler, a basic platform with both light weight and vibration resistance is formed, so that the thermal drift error of the whole machine within the temperature change range of 15 - 35 °C is suppressed within 5 nm / °C, which is significantly better than the 20 nm / °C index of the traditional platform. The pneumatic shock-absorbing and buffering mechanism constructs a four-foot pressure self-equilibrium network through the balance air pipe. When a single point is loaded, the pneumatic pressure is transiently redistributed to other feet. Combined with the vertical guiding constraint of the anti-disengagement pin, while maintaining the levelness of the platform ≤ ±0.5 arcsec, the vertical vibration amplitude under dynamic load is reduced by more than 60%, effectively blocking the transmission of external environmental vibration.

[0012] For the inherent air hammer effect of the air floating system, the innovatively designed vibration damping mechanism captures vibration energy through a resonance ring, guides it to a conical vibration damping body through a conduction column, and the L-shaped guiding pipes annularly distributed on its surface utilize the turbulent shear effect to convert high-frequency vibration into heat energy dissipation. Supplementary with the reverse damping force provided by a spring, a composite attenuation mechanism is formed, enabling the amplitude during the lateral movement to decay to less than 5% of the initial value within 10 ms, ensuring a repeat positioning accuracy of ±1 μm when the lifter transfers wafers. The duplex inspection table adopts a porous air floating guide rail and an independent motion control strategy, realizing parallel detection and loading / unloading processes while moving smoothly at the nanometer level, with the detection efficiency increased by more than 40%, and the non-contact characteristic of the air floating support avoids the risk of scratching the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0014] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0015] In the drawings: Figure 1 A first axonometric structural schematic diagram of the present invention is shown; Figure 2 A second axonometric structural schematic diagram of the present invention is shown; Figure 3 A third axonometric structural schematic diagram of the present invention is shown; Figure 4 An axonometric structural schematic diagram of the state where the gantry of the present invention is separated from the platform base is shown; Figure 5 The Figure 4 partial enlarged structure schematic diagram of A in the present invention is shown; Figure 6 An axonometric structural schematic diagram of the gantry part of the present invention is shown; Figure 7 An axonometric structural schematic diagram of the platform base part of the present invention is shown; Figure 8 An axonometric structural schematic diagram of the state where the platform base of the present invention is separated from the shock-absorbing support feet is shown.

[0016] LIST OF REFERENCE NUMERALS: 1. Platform base; 11. Honeycomb filler; 2. Controller; 3. Shock-absorbing support feet; 31. Support foot block; 32. Balance air pipe; 321. Outer connecting pipe; 33. Anti-detaching pin; 4. Gantry; 41. Support rod; 42. Transverse movement base; 43. Transverse movement air-floating guide table; 44. Transverse movement air-floating bearing seat; 45. Resonance ring; 451. Conduction column; 46. Vibration damping body; 461. Guide pipe; 47. Spring; 5. Lifting frame; 6. Conveyor; 61. Centering guide frame; 7. Duplex inspection table; 71. Inspection table air-floating guide rail; 72. Inspection table air-floating bearing seat. Specific implementation manner

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0018] Please refer to Figures 1 to 8 : Embodiment: The present invention provides a precision air-floating gantry motion platform, including: a platform base 1; a controller 2 is provided on a side wall at one end of the platform base 1; shock-absorbing feet 3 are respectively provided at the four corners of the bottom of the platform base 1, and a pneumatic shock-absorbing buffer mechanism is provided between the four shock-absorbing feet 3 for stabilizing the platform base 1; gantries 4 are respectively provided on the edges at the left and right ends of the platform base 1 and are parallel to each other; a horizontal transverse movement base 42 is provided at the upper end of the gantry 4, a transverse movement air-floating guide table 43 is provided on the transverse movement base 42, a transverse movement air-floating bearing seat 44 is slidably installed on the transverse movement air-floating guide table 43, and a vertical lifting frame 5 is installed on the transverse movement air-floating bearing seat 44 for transferring wafers to be detected; the transverse movement base 42 and the gantry 4 are supported by two vertical support rods 41; a vibration damping mechanism for eliminating air hammers is provided on the support rod 41; a conveyor 6 is provided on the platform base 1 between the two gantries 4 for conveying wafers, and a duplex inspection table 7 is fixedly provided on the platform base 1 on one side of the conveyor 6.

[0019] Among them, the platform base 1 is made of a low thermal expansion coefficient alloy material, and honeycomb-shaped weight-reducing holes are designed inside to balance rigidity and light weight, and honeycomb fillers 11 are filled in the honeycomb cavity structure.

[0020] Among them, the pneumatic shock absorption and buffering mechanism includes a support foot block 31, a balance air pipe 32, an outer connecting pipe 321 and an anti-disengagement pin 33. The support foot block 31 is in an inverted T-shaped structure and vertically slides in the shock absorption support foot 3. An anti-disengagement pin 33 is connected between the support foot block 31 and the shock absorption support foot 3, and the anti-disengagement pin 33 is used to prevent the support foot block 31 from separating from the shock absorption support foot 3. A balance air pipe 32 is externally connected to the cavity between the support foot block 31 and the shock absorption support foot 3. The balance air pipe 32 connects the cavities between the four shock absorption support feet 3 in series, and an outer connecting pipe 321 is externally connected to one of the balance air pipes 32, and the outer connecting pipe 321 is used to communicate with an external air source.

[0021] Among them, the vibration damping mechanism includes a resonance ring 45, a conduction column 451, a vibration damping body 46, a guiding pipe 461 and a spring 47. The resonance ring 45 is sleeved on the upper end of the support rod 41. Two conduction columns 451 are symmetrically penetrated through the resonance ring 45, and the upper ends of the conduction columns 451 are fixedly connected to the bottom of the transverse movement seat 42. A vibration damping body 46 with a wider upper part and a narrower lower part is slidably sleeved on the support rod 41 below the resonance ring 45, and a spring 47 is sleeved on the support rod 41 below the vibration damping body 46.

[0022] Among them, at least six L-shaped guiding pipes 461 are annularly distributed on the conical surface of the vibration damping body 46, and the corner section of the guiding pipe 461 is at the lower end.

[0023] Among them, two center guiding frames 61 are symmetrically arranged on the conveyor 6 near the input end, and the wafers to be conveyed pass through between the two center guiding frames 61.

[0024] Among them, two inspection table air floating guide rails 71 are arranged in parallel on the duplex inspection table 7, an inspection table air floating bearing seat 72 is slidably installed on the inspection table air floating guide rail 71, and the wafers to be detected are placed on the inspection table air floating bearing seat 72.

[0025] The functions and effects of the above structures are further explained and described below, so that those skilled in the art can better understand the technical solution: The platform base 1 is made of an alloy material with a low coefficient of thermal expansion. The internal honeycomb-shaped weight-reducing hole structure significantly reduces the weight while ensuring the overall rigidity of the base. The honeycomb filler 11 filled in the honeycomb cavities further enhances the structural damping characteristics, effectively absorbing high-frequency mechanical vibrations (such as disturbances transmitted by motor drives or the external environment), and suppressing thermal deformation caused by temperature fluctuations, ensuring the geometric stability of the base during long-term operation. The shock-absorbing feet 3 provided at the four corners of the base and the internal pneumatic shock-absorbing buffer mechanism form a composite vibration isolation system: the support foot block 31 is slidably matched with the shock-absorbing foot 3 through an inverted T-shaped structure, and the anti-disengagement pin 33 prevents mechanical disengagement while allowing slight displacement in the vertical direction. The balance air pipe 32 connecting the cavities of the four shock-absorbing feet 31 in series is connected to an external air source through the external connecting pipe 321 to form a pressure self-balancing network. When a certain foot bears an instantaneous impact load, the pneumatic pressure can be quickly and evenly distributed to other feet through the balance air pipe 32, avoiding local air film instability. Combining with the overall rigidity of the honeycomb base, the vertical vibration amplitude of the platform under dynamic load is finally reduced by more than 60%.

[0026] The symmetrical layout of the gantry 4 and the rigid connection of the support rod 41 provide high-stability support for the transverse seat 42. The vibration-damping mechanism at the bottom of the transverse seat 42 eliminates the hammering effect generated by the air-bearing system through the synergistic action of the resonance ring 45, the conduction column 451, and the vibration-damping body 46: when the airflow pulsation generated by the high-speed movement of the transverse air-bearing guide 43 is transmitted to the resonance ring 45 through the support rod 41, the conduction column 451 guides the vibration energy to the vibration-damping body 46, and the L-shaped guide pipes 461 annularly distributed on its conical surface convert the vibration energy into heat energy dissipation through the turbulent effect at the corner. At the same time, the spring 47 provides a reverse buffer force, reducing the hammering vibration to less than 5% of the initial amplitude within 10 ms. This design effectively avoids the positioning jitter problem caused by airflow disturbance in traditional air-bearing platforms, ensuring that the lifting frame 5 on the transverse air-bearing seat 44 achieves a repeat positioning accuracy of ±1 μm when transferring wafers.

[0027] The centering guide frames 61 symmetrically arranged at the input end of the conveyor 6 guide the wafers to automatically align through the V-shaped guiding surface. The spacing can be electrically adjusted according to the wafer size, and together with the microporous air-bearing layer (not shown in the figure) on the conveyor belt surface, it realizes non-contact transfer of wafers, avoiding surface scratches. The two inspection table air-bearing guide rails 71 arranged in parallel on the duplex inspection table 7 adopt porous air-bearing technology. The inspection table air-bearing seat 72 can move smoothly along the guide rail with nanometer-level accuracy under the support of the air film. Combining with the vibration isolation design of the platform base 1, the attitude error of the wafer during the detection process is controlled within 0.1 arc seconds. The independent motion control of the double stations allows the feeding and unloading operations to be performed synchronously at the other station while optical detection is carried out at one station, increasing the overall detection efficiency by more than 40%.

[0028] In addition, the multi-axis motion planning algorithm built into the controller 2 is deeply integrated with the air film pressure closed-loop control system, which can collect the pressure data of the pneumatic shock absorption buffer mechanism, the vibration spectrum of the vibration damping mechanism, and the displacement feedback of the air-bearing guide rail 71 of the inspection table in real time. By dynamically adjusting the gas source flow rate, the thrust of the lateral movement motor, and the damping parameters, the platform can maintain an acceleration fluctuation of less than 0.05 m / s² when carrying a 200 kg wafer load. The design of matching the thermal expansion coefficients between the platform base 1 and the gantry 4, combined with the non-contact characteristics of the air-bearing system, enables the thermal drift error of the whole machine to be less than 5 nm / °C within the ambient temperature range of 15 - 35 °C, significantly superior to traditional ball screw platforms (usually > 20 nm / °C).

[0029] Working principle: When the platform starts, the external gas source continuously supplies gas to the pneumatic shock absorption buffer mechanism through the external connecting pipe 321. The dry gas enters the balance gas pipe 32 after three-stage filtration, forming a balanced air pressure in the cavities of the four shock absorption feet 3. The support foot block 31 floats inside the shock absorption foot 3 under the action of air pressure, and realizes vertical-direction micron-level displacement compensation through the sliding fit of the inverted T-shaped structure and the anti-detachment pin 33. When the platform base 1 is subjected to external impact or load change, the pressures in the cavities of the four feet are dynamically evenly distributed through the balance gas pipe 32, effectively suppressing local air film collapse. Combining with the high damping characteristics of the honeycomb filler 11 inside the base 1, the vibration energy is quickly dissipated, ensuring that the overall flatness error of the platform is ≤ ±0.5 arcsec.

[0030] When the lateral movement seat 42 on the gantry 4 moves along the lateral movement air-bearing guide 43 under the air-bearing drive, the air film (thickness 10 - 20 μm) between the lateral movement air-bearing seat 44 and the lateral movement air-bearing guide 43 realizes frictionless sliding. During this process, the support rod 41 transmits the air flow pulsation generated by the air-bearing system to the vibration damping mechanism: the vibration energy is input into the resonance ring 45 through the conduction column 451, triggering the vibration damping body 46 to slide axially along the support rod 41. Its conical L-shaped guiding pipe 461 converts the high-frequency vibration into heat energy through turbulent shear action. At the same time, the spring 47 applies a reverse damping force to the vibration damping body 46, forming a composite attenuation mechanism. This design enables the amplitude caused by the air hammer effect during the lateral movement to decay to less than 5% of the initial value within 10 ms, ensuring that the lifting frame 5 achieves a positioning accuracy of ±1 μm when transferring wafers.

[0031] When the conveyor 6 is running, the wafers are automatically centered through the V-shaped guiding surface of the centering guide frame 61, and the spacing is adaptively adjusted by the electric adjustment mechanism according to the wafer size. The microporous air-floating layer on the surface of the conveyor belt forms a non-contact support with an air pressure of 0.05 - 0.1 MPa to avoid scratching the surface of the wafers. After the wafers are transferred to the duplex inspection stage 7, the air-floating bearing seat 72 of the inspection stage moves on the air-floating guide rail 71 of the inspection stage with nanometer-level precision. The air film stiffness is evenly distributed through the porous material, and together with the closed-loop control algorithm of the controller 2, the attitude error of the wafers during the optical inspection process is stabilized within 0.1 arcseconds. The two stations of the duplex inspection stage 7 adopt an independent control strategy. When one station performs high-precision inspection, the other station synchronously completes the loading and unloading of the wafers, and the inspection efficiency is increased by more than 40%.

[0032] The controller 2 collects the sensor data of each module of the platform in real time: monitors the air film stability of the shock-absorbing feet 3 through the pressure sensor, feeds back the position deviation of the transverse air-floating guide table 43 through the laser interferometer, and tracks the thermal expansion deformation through the temperature sensor. The built-in multi-axis motion planning algorithm integrates feedforward compensation and iterative learning control to dynamically adjust the gas source flow rate, the thrust of the transverse motor, and the damping parameters of the vibration damping mechanism. For example, when carrying wafers weighing 200 kg, the controller 2 corrects the air cushion pressure in real time according to the data of the acceleration sensor, and suppresses the fluctuation of the motion acceleration below 0.05 m / s². At the same time, the platform base 1 and the gantry 4 adopt materials with matching low thermal expansion coefficients. Combining with the non-contact characteristics of the air-floating system, the thermal drift error of the whole machine in the environment of 15 - 35 °C is less than 5 nm / °C, which is significantly better than the 20 nm / °C index of the traditional mechanical contact platform.

[0033] In this article, the following points need attention: 1. The attached drawings of the embodiments of the present invention only relate to the structures involved in the embodiments of the present invention, and other structures can refer to the general design.

[0034] 2. Without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain new embodiments.

[0035] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention.

Claims

1. A precision air-bearing gantry motion platform, comprising: Platform base (1); a controller (2) is provided on one side wall at one end of the platform base (1); characterized in that shock-absorbing feet (3) are respectively provided at the four corners of the bottom of the platform base (1), and a pneumatic shock-absorbing and buffering mechanism is provided between the four shock-absorbing feet (3), and the pneumatic shock-absorbing and buffering mechanism is used to stabilize the platform base (1); gantry frames (4) parallel to each other are respectively provided at the edges of the left and right ends on the platform base (1); a horizontal cross-moving seat (42) is provided at the upper end of the gantry frame (4), a cross-moving air-floating guide table (43) is provided on the cross-moving seat (42), a cross-moving air-floating bearing seat (44) is slidably installed on the cross-moving air-floating guide table (43), and a vertical lifting frame (5) is installed on the cross-moving air-floating bearing seat (44) for transferring the wafer to be detected; the cross-moving seat (42) and the gantry frame (4) are supported by two vertical support rods (41); a vibration-damping mechanism for eliminating pneumatic hammers is provided on the support rod (41); a conveyor (6) is provided on the platform base (1) between the two gantry frames (4), the conveyor (6) is used to convey wafers, and a duplex inspection table (7) is fixedly provided on the platform base (1) on one side of the conveyor (6).

2. The precision air-bearing gantry motion platform according to claim 1, wherein The platform base (1) is made of an alloy material with a low coefficient of thermal expansion, and honeycomb-shaped weight-reducing holes are designed inside to balance rigidity and light weight, and honeycomb fillers (11) are filled in the honeycomb cavity structure.

3. The precision air-bearing gantry motion platform according to claim 1, characterized in that The pneumatic shock-absorbing and buffering mechanism includes a support foot block (31), a balance air pipe (32), an external connection pipe (321) and an anti-detachment pin (33). The support foot block (31) is in an inverted T-shaped structure, and the support foot block (31) slides vertically in the shock-absorbing foot (3). An anti-detachment pin (33) is connected between the support foot block (31) and the shock-absorbing foot (3), and the anti-detachment pin (33) is used to prevent the support foot block (31) from separating from the shock-absorbing foot (3). A balance air pipe (32) is connected outward from the cavity between the support foot block (31) and the shock-absorbing foot (3), and the balance air pipe (32) connects the cavities between the four shock-absorbing feet (3) in series, and an external connection pipe (321) is connected outward from one of the balance air pipes (32), and the external connection pipe (321) is used to communicate with an external air source.

4. A precision air-bearing gantry motion platform according to claim 1, wherein, The vibration-damping mechanism includes a resonance ring (45), a conduction column (451), a vibration-damping body (46), a guiding pipe (461) and a spring (47). The resonance ring (45) is sleeved on the upper end of the support rod (41), and two conduction columns (451) are symmetrically penetrated through the resonance ring (45). The upper ends of the conduction columns (451) are fixedly connected to the bottom of the cross-moving seat (42). A vibration-damping body (46) with a wider upper part and a narrower lower part is slidably sleeved on the support rod (41) below the resonance ring (45), and a spring (47) is sleeved on the support rod (41) below the vibration-damping body (46).

5. The precision air-bearing gantry motion platform according to claim 4, characterized in that, At least six L-shaped guiding pipes (461) are annularly distributed on the conical surface of the vibration-damping body (46), and the corner section of the guiding pipe (461) is at the lower end.

6. The precision air-bearing gantry motion platform according to claim 1, characterized in that, Two center guiding frames (61) are symmetrically provided on the conveyor (6) at positions close to the input end, and the wafers being conveyed pass through between the two center guiding frames (61).

7. A precision air-bearing gantry motion platform according to claim 1, wherein, Two inspection table air-floating guide rails (71) are arranged in parallel on the duplex inspection table (7), an inspection table air-floating bearing seat (72) is slidably mounted on the inspection table air-floating guide rail (71), and a wafer to be detected is placed on the inspection table air-floating bearing seat (72).

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