Semiconductor process chamber and semiconductor process apparatus

Abstract

The application discloses a semiconductor process chamber and a semiconductor process device. The disclosed semiconductor process chamber comprises a chamber body, a plurality of boat carriers and a plurality of electrode groups. The chamber body has an inner cavity. The plurality of boat carriers are spaced and oppositely arranged in the inner cavity in a carrying direction. The plurality of boat carriers are respectively used for supporting a plurality of carrying boats. The plurality of electrode groups are used for one-to-one corresponding connection with the plurality of carrying boats. One of the two electrode ends of each electrode group is used for realizing electrical connection between the corresponding carrying boat and the positive electrode of a radio frequency assembly. The other of the two electrode ends of each electrode group is used for realizing electrical connection between the corresponding carrying boat and the negative electrode of the radio frequency assembly. The above scheme can solve the problem that the related art semiconductor process chamber has the carrying boat deformed due to extrusion, which leads to the silicon wafer in the carrying boat damaged and difficult to improve the process efficiency while ensuring the process yield.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor process equipment design, and specifically relates to a semiconductor process chamber and semiconductor process equipment. Background Art

[0002] Semiconductor process equipment such as PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment typically processes semiconductor wafers (e.g., silicon wafers) in a carrier boat in a semiconductor process chamber. To reduce production costs, process efficiency needs to be improved.

[0003] Related art semiconductor process chambers utilize two carrier boats stacked directly together and placed within the chamber, allowing them to accommodate more silicon wafers and thus improve process efficiency. However, the lower carrier boat is easily deformed by the upper carrier boat, which can damage the silicon wafers in the lower boat and reduce process yield. Improving process efficiency while avoiding a reduction in process yield is a pressing technical problem for those skilled in the art. Summary of the Invention

[0004] The present invention discloses a semiconductor process chamber and semiconductor process equipment to solve the problem in the related art that the semiconductor process chamber has a carrying boat that is easily deformed by being squeezed, resulting in easy damage to the silicon wafers therein, making it difficult to ensure the process yield while improving the process efficiency.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] In a first aspect, the present application discloses a semiconductor process chamber, wherein the disclosed semiconductor process chamber includes a chamber body, a plurality of boat carriers, and a plurality of electrode groups;

[0007] The chamber body has an inner cavity, and the multiple boat carriers are spaced and relatively arranged in the inner cavity in the carrying direction. The multiple boat carriers are respectively used to support multiple carrying boats. At least part of the structure of each of the electrode groups is arranged in the inner cavity. The multiple electrode groups are used to be connected to the multiple carrying boats one by one. Each of the electrode groups includes two electrode ends, one of the two electrode ends of each electrode group is used to realize the electrical connection between the corresponding carrying boat and the positive pole of the radio frequency component, and the other of the two electrode ends of each electrode group is used to realize the electrical connection between the corresponding carrying boat and the negative pole of the radio frequency component.

[0008] In a second aspect, the present application discloses a semiconductor process equipment, and the disclosed semiconductor process equipment comprises a plurality of carrier boats and the semiconductor process chamber described above.

[0009] The plurality of boat carriers are respectively used for supporting the plurality of carrier boats, and each of the carrier boats is electrically connected with the radio frequency assembly through the two electrode ends of the corresponding electrode group.

[0010] The technical scheme adopted by the present application can achieve the following technical effects:

[0011] The semiconductor process chamber disclosed by the embodiments of the present application improves the structure of the semiconductor process chamber related to the prior art, and the plurality of boat carriers are spaced apart and oppositely arranged in the inner cavity in the carrying direction, so that the plurality of boat carriers can support the plurality of carrier boats respectively, thereby improving the process efficiency and avoiding the mutual stacking of the plurality of carrier boats, which can cause the lower carrier boats to be easily deformed due to extrusion, thereby damaging the silicon wafers in the carrier boats and affecting the yield of the process, so that the process efficiency can be improved while avoiding affecting the yield of the process. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a structural schematic diagram of a semiconductor process chamber disclosed by the embodiments of the present application;

[0013] Figure 2 is a structural schematic diagram of another semiconductor process chamber disclosed by the embodiments of the present application;

[0014] Figure 3 is a structural schematic diagram of still another semiconductor process chamber disclosed by the embodiments of the present application;

[0015] Figure 4 is a structural schematic diagram of a semiconductor process equipment disclosed by the embodiments of the present application;

[0016] Figure 5 is a structural schematic diagram of a semiconductor process equipment disclosed by the embodiments of the present application from another perspective;

[0017] Figure 6 is a structural schematic diagram of a semiconductor process equipment disclosed by the embodiments of the present application from still another perspective;

[0018] Figure 7 is a structural schematic diagram of another semiconductor process equipment disclosed by the embodiments of the present application;

[0019] Figure 8 is a structural schematic diagram of still another semiconductor process equipment disclosed by the embodiments of the present application.

[0020] EXPLANATION OF REFERENCE NUMERALS:

[0021] 100-chamber body, 110-inner cavity, 120-opening, 130-bottom wall, 131-second support block, 132-second support rod, 140-first flange, 141-first support block, 142-first support rod,

[0022] 200-boat carrier, 210-insulation, 220-support rod,

[0023] 300-electrode group, 310-electrode end, 320-electrical connection part,

[0024] 400-carrying boat, 410-boat foot,

[0025] 500-heater,

[0026] 600-Conveying Department,

[0027] 710-first support base, 720-second support base. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "first," "second," and the like generally distinguish objects of a class and do not limit the number of objects. For example, the first object may be one or more.

[0030] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; and direct or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0031] Please refer to Figures 1 to 8The embodiment of the present application discloses a semiconductor process chamber, which includes a chamber body 100, a plurality of boat carriers 200 and a plurality of electrode groups 300.

[0032] The chamber body 100 is the foundation of a semiconductor processing chamber, providing mounting locations for other components of the semiconductor processing chamber. Specifically, the multiple boat carriers 200 and the multiple electrode assemblies 300 are mounted on the chamber body 100. Furthermore, the chamber body 100 also forms some functional spaces or structures, such as the inner cavity 110.

[0033] The boat carrier 200 is a core component in a semiconductor processing chamber used to support the carrier boat 400. Multiple boat carriers 200 are spaced apart and arranged opposite each other in the inner chamber 110 in the loading direction. Each boat carrier 200 is used to support multiple carrier boats 400, ensuring that the multiple carrier boats 400 can be relatively stably supported in the inner chamber 110 to facilitate processing.

[0034] The electrode group 300 is a core component in a semiconductor process chamber used to achieve electrical connection between the carrier boat 400 and the RF component. Multiple electrode groups 300 are used to connect to multiple carrier boats 400 in a one-to-one correspondence. Each electrode group 300 includes two electrode terminals 310. One of the two electrode terminals 310 of each electrode group 300 is used to achieve electrical connection between the corresponding carrier boat 400 and the positive electrode of the RF component, and the other of the two electrode terminals 310 of each electrode group 300 is used to achieve electrical connection between the corresponding carrier boat 400 and the negative electrode of the RF component. This enables electrical connection between the corresponding carrier boat 400 and the RF component to be achieved through the two electrode terminals 310 of each electrode group 300.

[0035] The semiconductor process chamber disclosed in the embodiment of the present application improves the structure of the semiconductor process chamber involved in the related art. By arranging multiple boat carriers 200 at intervals and relatively in the inner cavity 110 in the carrying direction, the multiple boat carriers 200 can respectively support multiple carrying boats 400, so as to improve the process efficiency and avoid the multiple carrying boats 400 being stacked on each other so that the lower carrying boat 400 is squeezed and easily deformed, which may easily damage the silicon wafers in the carrying boat 400 and affect the process yield, thereby improving the process efficiency while avoiding affecting the process yield.

[0036] In addition, this structure can prevent multiple carrying boats 400 from being stacked together and supported on the boat carrier 200, which would cause the boat carrier 200 to be subjected to excessive pressure and easily break, thereby improving the stability of the semiconductor process chamber.

[0037] In a further technical solution, each of the plurality of boat carriers 200 can include a plurality of insulating pieces 210, each of the plurality of carrier boats 400 can include a plurality of boat feet 410, the plurality of boat carriers 200 are configured to be supported on the plurality of carrier boats 400 respectively via the plurality of boat feet 410, and the plurality of boat carriers 200 are configured to be insulated from the plurality of boat feet 410 of the plurality of carrier boats 400 respectively via the plurality of insulating pieces 210, that is, each of the plurality of boat carriers 200 is configured to be supported in an insulated manner with the plurality of boat feet 410 of the corresponding carrier boat 400 via the plurality of insulating pieces 210. Specifically, the plurality of insulating pieces 210 can be made of aluminum nitride, silicon nitride, or quartz, and the present application is not limited in this regard.

[0038] Such a structure can avoid current leakage from the plurality of carrier boats 400 to the plurality of boat carriers 200 respectively, thereby avoiding unnecessary energy loss. At the same time, in the case where the parts of the plurality of boat carriers 200 other than the insulating pieces 210 are all made of metal, such a structure can avoid direct contact between the plurality of carrier boats 400 and the parts of the plurality of boat carriers 200 other than the insulating pieces 210, which can easily form a primary cell effect and cause metal ion migration to contaminate the silicon wafers in the plurality of carrier boats 400.

[0039] In a feasible technical solution, each of the plurality of boat carriers 200 can further include at least two support rods 220 spaced from each other, and the insulating piece 210 can be an insulating sleeve, and the plurality of insulating sleeves can be respectively sleeved on the plurality of support rods 220. Such a structure is relatively simple and can occupy a smaller space in the inner cavity 110, thereby avoiding affecting the plurality of carrier boats 400 as much as possible to facilitate loading or unloading the plurality of carrier boats 400 into or out of the inner cavity 110. Specifically, the plurality of support rods 220 can be made of aluminum oxide, molybdenum, or tungsten, and the present application is not limited in this regard.

[0040] In order to save costs, each of the plurality of boat carriers 200 can include two support rods 220 spaced from each other, and in the case where the plurality of boat carriers 200 support the plurality of carrier boats 400 respectively, the plurality of boat feet 410 of each of the plurality of carrier boats 400 can be located between the two support rods 220 of the corresponding boat carrier 200, and the plurality of boat feet 410 of the plurality of carrier boats 400 can respectively abut against the two support rods 220 of the corresponding boat carrier 200.

[0041] Such a structure can avoid the plurality of carrier boats 400 from moving in the distribution direction of the two support rods 220 of the corresponding boat carrier 200 as much as possible, so that the plurality of boat carriers 200 can stably support the corresponding carrier boats 400.

[0042] In one embodiment, the electrode terminal 310 may be a first electrical connector, and the two first electrical connectors of each electrode group 300 may be respectively provided on the plurality of insulating members 210 of each boat carrier 200. One of the two first electrical connectors of each electrode group 300 is used to electrically connect to the corresponding boat foot 410 in the corresponding carrier boat 400 to achieve electrical connection between the corresponding carrier boat 400 and the positive electrode of the RF component, and the other of the two first electrical connectors of each electrode group 300 is used to electrically connect to the corresponding boat foot 410 in the corresponding carrier boat 400 to achieve electrical connection between the corresponding carrier boat 400 and the negative electrode of the RF component, thereby enabling electrical connection between the corresponding carrier boat 400 and the RF component through the two first electrical connectors of each electrode group 300.

[0043] In this structure, the location and number of the first electrical connectors can be flexibly arranged according to actual needs during the specific design process, thereby enhancing design flexibility. Furthermore, the two first electrical connectors of each electrode assembly 300 can be easily installed on the insulating member 210 of each boat carrier 200, and the two first electrical connectors of each electrode assembly 300 can also be easily removed from the multiple insulating members 210 of each boat carrier 200. This means that the first electrical connectors are easy to install and remove, thereby reducing maintenance complexity.

[0044] In another embodiment, the electrode end 310 can be an electrode rod, and each carrier boat 400 can have two electrode holes. One of the two electrode rods of each electrode group 300 is used to plug and match with one of the two electrode holes of the corresponding carrier boat 400 to achieve electrical connection between the corresponding carrier boat 400 and the positive pole of the radio frequency component, and the other of the two electrode rods of each electrode group 300 is used to plug and match with the other of the two electrode holes of the corresponding carrier boat 400 to achieve electrical connection between the corresponding carrier boat 400 and the negative pole of the radio frequency component, thereby enabling the electrical connection between the corresponding carrier boat 400 and the radio frequency component to be achieved through the two electrode rods of each electrode group 300.

[0045] In this structure, since the two electrode rods of each electrode group 300 can be plugged into the two electrode holes of the corresponding carrier boat 400 respectively, the electrical connection between the corresponding carrier boat 400 and the RF component can be achieved, so that each electrode group 300 and the corresponding carrier boat 400 can be more firmly connected, which is beneficial to improving the reliability of the connection between each electrode group 300 and the corresponding carrier boat 400.

[0046] In the embodiments of the present application, each electrode group 300 can further include two electrical connection parts 320, the two electrical connection parts 320 of each electrode group 300 can be connected with the two electrode ends 310 of each electrode group 300 respectively, and part of the structures of the plurality of electrical connection parts 320 can be arranged outside the inner cavity 110 for electrical connection with the radio frequency assembly. This structure reduces the difficulty of electrical connection between the plurality of electrical connection parts 320 and the radio frequency assembly by arranging part of the structures of the plurality of electrical connection parts 320 outside the inner cavity 110, thereby facilitating the electrical connection of the plurality of electrical connection parts 320 with the radio frequency assembly respectively.

[0047] More specifically, one of the two electrical connection parts 320 of each electrode group 300 is used for connection with the positive electrode of the radio frequency assembly, and the other of the two electrical connection parts 320 of each electrode group 300 is used for connection with the negative electrode of the radio frequency assembly, thereby enabling electrical connection between the plurality of electrical connection parts 320 and the radio frequency assembly.

[0048] In a feasible technical solution, the semiconductor process chamber can further include a cavity door, the chamber body 100 can have an opening 120 and a bottom wall 130 opposite to the opening 120, the opening 120 can be in communication with the inner cavity 110, and the cavity door is used for sealing and plugging the opening 120. Each boat carrier 200 is used for supporting a plurality of carrier boats 400 distributed along a first direction, and the distribution direction of the opening 120 and the bottom wall 130 can be parallel to the first direction.

[0049] In the plurality of electrode groups 300, the two electrical connection parts 320 of a part of the electrode groups 300 can be arranged at the opening 120, and the two electrode ends 310 of a part of the electrode groups 300 are used for electrical connection with the carrier boats 400 close to the opening 120 respectively. The two electrical connection parts 320 of another part of the electrode groups 300 can be arranged at the bottom wall 130, and the two electrode ends 310 of another part of the electrode groups 300 are used for electrical connection with the carrier boats 400 close to the bottom wall 130 respectively. This structure enables each electrode group 300 to be connected with the corresponding carrier boat 400 more conveniently, thereby facilitating the process more conveniently.

[0050] Further, the two electrode ends 310 of a part of the electrode groups 300 can be first electrical connection parts, and the two first electrical connection parts of a part of the electrode groups 300 can be arranged at the plurality of boat carriers 200 respectively, and the two electrode ends 310 of another part of the electrode groups 300 can be electrode rods.

[0051] In this structure, since the two electrical connection parts 320 of a part of the electrode group 300 are both arranged at the opening 120, the two electrode ends 310 of the part of the electrode group 300 are closer to the opening 120. In this case, the two electrode ends 310 of the part of the electrode group 300 are both first electrical connectors, and the two first electrical connectors of the part of the electrode group 300 are respectively arranged on multiple boat carriers 200, which can avoid affecting the loading or removal of multiple carrier boats 400 into or out of the inner cavity 110 through the opening 120, so as to facilitate the loading or removal of multiple carrier boats 400 into or out of the inner cavity 110.

[0052] At the same time, in this structure, the two electrode ends 310 of the other electrode group 300 are both electrode rods, which have a lower cost, thereby reducing costs while avoiding affecting the loading or removal of multiple carrying boats 400 into or out of the inner cavity 110 through the opening 120.

[0053] Optionally, the chamber body 100 may include a process tube and a first flange 140. The first flange 140 and the bottom wall 130 may be connected to opposite ends of the process tube, respectively. The first flange 140, the bottom wall 130, and the process tube may collectively define an inner cavity 110. The opening 120 may be provided in the first flange 140. The two electrical connection portions 320 of a portion of the electrode assembly 300 may both be provided in the first flange 140. The first direction may be parallel to the extension direction of the process tube. This structure is relatively simple and easy to implement, thereby facilitating manufacturing and reducing production difficulty.

[0054] In other embodiments, the bottom wall 130 may include a second flange, and the bottom wall 130 may be connected to the end of the process pipe through the second flange, thereby making it easier to connect the bottom wall 130 to the end of the process pipe, which helps reduce production difficulty.

[0055] In an optional technical solution, the first flange 140 may include multiple first support blocks 141, the bottom wall 130 may include multiple second support blocks 131, the first ends of multiple boat carriers 200 may be connected one-to-one with the multiple first support blocks 141, and the second ends of multiple boat carriers 200 may be connected one-to-one with the multiple second support blocks 131. This structure can raise the multiple boat carriers 200 respectively through the multiple first support blocks 141 and the multiple second support blocks 131, which is conducive to determining the height of the multiple boat carriers 200 in the inner cavity 110.

[0056] In order to facilitate the maintenance of multiple boat carriers 200, the first ends of the multiple boat carriers 200 can be detachably connected to the multiple first support blocks 141 one by one, and the second ends of the multiple boat carriers 200 can be detachably connected to the multiple second support blocks 131 one by one, so that the multiple boat carriers 200 can be disassembled for maintenance.

[0057] When each boat carrier 200 includes at least two spaced-apart support rods 220, each first support block 141 can be provided with a first positioning slot, and each second support block 131 can be provided with a second positioning slot. The first end of each support rod 220 can be positioned in a one-to-one correspondence within the plurality of first positioning slots, and the second end of each support rod 220 can be positioned in a one-to-one correspondence within the plurality of second positioning slots. This structure enables rapid assembly and disassembly of the plurality of support rods 220, thereby improving installation efficiency and making maintenance more convenient.

[0058] Of course, the first ends of the multiple boat carriers 200 can also be detachably connected to the multiple first support blocks 141 one by one through a threaded connection, and the second ends of the multiple boat carriers 200 can also be detachably connected to the multiple second support blocks 131 one by one through a threaded connection. The embodiment of the present application does not limit this.

[0059] In one embodiment, the first flange 140 may further include a first support rod 142, and the bottom wall 130 may further include a second support rod 132. Among the plurality of first support blocks 141 and the plurality of second support blocks 131, some of the first support blocks 141 may be fixed to the edge of the first flange 140, and some of the second support blocks 131 may be fixed to the edge of the bottom wall 130, thereby securing the lowest boat carrier 200 in the loading direction. Simultaneously, another portion of the first support blocks 141 may be fixed to the first support rod 142, and another portion of the second support blocks 131 may be fixed to the second support rod 132, thereby securing other boat carriers 200. Specifically, in this case, the semiconductor process chamber may be a horizontal furnace.

[0060] This structure can conveniently achieve the fixation of the plurality of first support blocks 141 and the plurality of second support blocks 131 , thereby facilitating the fixation of the plurality of boat carriers 200 .

[0061] In an embodiment of the present application, the semiconductor process chamber may further include a plurality of heaters 500. The plurality of heaters 500 may be spaced apart and disposed relative to each other within the inner cavity 110. Each boat carrier 200 may be located between two adjacent heaters 500. This allows the two adjacent heaters 500 to heat the boat carrier 200 located between the two adjacent heaters 500, thereby avoiding the situation where uneven heating results in a localized temperature unevenness within the inner cavity 110, which may affect the process effect. This structure also enables more efficient heating, thereby improving heating efficiency and, in turn, improving process efficiency.

[0062] When the chamber body 100 includes a process tube and a first flange 140, the second end of each heater 500 can be connected to the bottom wall 130, the first ends of some heaters 500 can be connected to the first flange 140, and the first ends of another portion of heaters 500 can be connected to the inner wall of the process tube, thereby achieving installation of each heater 500 in the inner cavity 110. This structure can prevent the first end of each heater 500 from being connected to the first flange 140, which could easily block the opening 120 and affect the loading or removal of multiple carrier boats 400 into or out of the inner cavity 110.

[0063] In one embodiment, the semiconductor process chamber can be a horizontal furnace. When the semiconductor process chamber is a horizontal furnace and the chamber body 100 includes a process tube and a first flange 140, the semiconductor process chamber can also include a first support seat 710 and multiple second support seats 720. The first support seat 710 can be fixed on the inner wall of the process tube, and the multiple second support seats 720 can be fixed on the first flange 140.

[0064] In the heater 500, the first end of the bottom heater 500 (i.e., the lowest in the load-bearing direction) can be supported on the first support seat 710 by overlapping, so as to be connected to the inner wall of the process pipe through the first support seat 710. The first ends of the remaining heaters 500 can be supported on multiple second support seats 720 by overlapping, so as to be connected to the first flange 140 respectively through the multiple second support seats 720. This structure can more conveniently realize the installation of multiple heaters 500, thereby improving installation efficiency.

[0065] Furthermore, when the first flange 140 includes the first support rod 142, a portion of the second support base 720 can be fixed to the first support rod 142, thereby fully utilizing the first support rod 142. Of course, another portion of the second support base 720 can be fixedly connected to the edge of the first flange 140, thereby achieving the fixation of the other portion of the second support base 720 on the first flange 140.

[0066] Based on the semiconductor process equipment disclosed in the embodiments of this application, the embodiments of this application further disclose a semiconductor process equipment, comprising multiple carrier boats 400 and a semiconductor process chamber as described in any of the above embodiments. The multiple boat carriers 200 are respectively used to support multiple carrier boats 400, and each carrier boat 400 is electrically connected to a radio frequency component via two electrode terminals 310 of a corresponding electrode assembly 300. Specifically, the semiconductor process equipment may be PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment.

[0067] Optionally, the semiconductor processing equipment may further include a radio frequency component and multiple carrier boats 400. The radio frequency component may be at least partially disposed within the inner cavity 110. Each carrier boat 400 is electrically connected to the radio frequency component via two electrode terminals 310 of a corresponding electrode assembly 300. The multiple carrier boats 400 are used to carry semiconductor wafers. Specifically, the multiple carrier boats 400 may each be a graphite boat, and the semiconductor wafers may be silicon wafers.

[0068] Furthermore, the semiconductor process equipment may also include a conveying mechanism, which may have multiple conveying parts 600, for conveying multiple boat carriers 200 to the inner cavity 110 or outside the inner cavity 110 through multiple conveying parts 600, thereby avoiding the situation where each conveying part 600 is subjected to excessive pressure and is prone to breakage, which is beneficial to improving the stability of the semiconductor process equipment.

[0069] During the specific operation, multiple conveying units 600 can operate simultaneously, which enables multiple boat carriers 200 to be simultaneously transported into or out of the inner cavity 110 through the multiple conveying units 600, thereby improving work efficiency. Of course, each conveying unit 600 can also operate independently, and this embodiment of the application is not limited to this.

[0070] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0071] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A semiconductor process chamber, characterized in that: It comprises a chamber body (100), a plurality of boat carriers (200), and a plurality of electrode groups (300); The chamber body (100) has an inner cavity (110), the plurality of boat carriers (200) are spaced and arranged relatively in the inner cavity (110) in a carrying direction, the plurality of boat carriers (200) are respectively used to support a plurality of carrying boats (400), at least a part of the structure of each electrode group (300) is arranged in the inner cavity (110), the plurality of electrode groups (300) are used to be connected to the plurality of carrying boats (400) in a one-to-one correspondence, each electrode group (300) includes two electrode terminals (310), one of the two electrode terminals (310) of each electrode group (300) is used to realize electrical connection between the corresponding carrying boat (400) and the positive electrode of the radio frequency component, and the other of the two electrode terminals (310) of each electrode group (300) is used to realize electrical connection between the corresponding carrying boat (400) and the negative electrode of the radio frequency component; The semiconductor process chamber further comprises a plurality of heaters (500), wherein the plurality of heaters (500) are spaced apart and arranged relatively in the inner cavity (110), and each of the boat carriers (200) is located between two adjacent heaters (500).

2. The semiconductor process chamber according to claim 1, wherein: The multiple boat carriers (200) each include multiple insulating members (210), the multiple carrying boats (400) each include multiple boat feet (410), the multiple boat carriers (200) are used to respectively support the multiple carrying boats (400) through the multiple boat feet (410), and the multiple boat carriers (200) are used to be insulated and isolated from the multiple boat feet (410) through the multiple insulating members (210).

3. The semiconductor process chamber according to claim 2, wherein: Each of the boat carriers (200) further comprises at least two support rods (220) spaced apart from each other, the insulating member (210) is an insulating sleeve, and a plurality of the insulating sleeves are respectively sleeved on a plurality of the support rods (220).

4. The semiconductor process chamber according to claim 2, wherein: The electrode end (310) is a first electrical connector, and the two first electrical connectors of each electrode group (300) are respectively provided on the plurality of insulating members (210) of each boat carrier (200); One of the two first electrical connectors of each electrode group (300) is used to electrically connect to the corresponding boat foot (410) in the corresponding carrier boat (400) to achieve electrical connection between the corresponding carrier boat (400) and the positive electrode of the radio frequency component, and the other of the two first electrical connectors of each electrode group (300) is used to electrically connect to the corresponding boat foot (410) in the corresponding carrier boat (400) to achieve electrical connection between the corresponding carrier boat (400) and the negative electrode of the radio frequency component.

5. The semiconductor process chamber according to claim 1, wherein: The electrode end (310) is an electrode rod, and each of the carrying boats (400) has two electrode holes. One of the two electrode rods of each electrode group (300) is used to be plugged into and matched with one of the two electrode holes of the corresponding carrying boat (400) to achieve electrical connection between the corresponding carrying boat (400) and the positive electrode of the radio frequency component, and the other of the two electrode rods of each electrode group (300) is used to be plugged into and matched with the other of the two electrode holes of the corresponding carrying boat (400) to achieve electrical connection between the corresponding carrying boat (400) and the negative electrode of the radio frequency component.

6. The semiconductor process chamber according to claim 1, wherein: Each of the electrode groups (300) further comprises two electrical connection parts (320), wherein the two electrical connection parts (320) of each of the electrode groups (300) are respectively connected to the two electrode ends (310) of each of the electrode groups (300), and partial structures of the plurality of electrical connection parts (320) are arranged outside the inner cavity (110) for electrically connecting the radio frequency components.

7. The semiconductor process chamber according to claim 6, wherein: The semiconductor process chamber further comprises a chamber door, the chamber body (100) has an opening (120) and a bottom wall (130), the opening (120) is communicated with the inner cavity (110), the chamber door is used to seal and block the opening (120), each of the boat carriers (200) is used to support a plurality of the carrying boats (400) distributed along a first direction, and the distribution direction of the opening (120) and the bottom wall (130) is parallel to the first direction; Among the plurality of electrode groups (300), the two electrical connection portions (320) of a portion of the electrode groups (300) are both provided at the opening (120), and the two electrode ends (310) of a portion of the electrode groups (300) are respectively used for electrical connection to the carrying boat (400) close to the opening (120); The two electrical connection portions (320) of another portion of the electrode group (300) are both provided on the bottom wall (130), and the two electrode ends (310) of another portion of the electrode group (300) are respectively used for electrical connection to the supporting boat (400) close to the bottom wall (130).

8. The semiconductor process chamber according to claim 7, wherein: The two electrode ends (310) of a portion of the electrode groups (300) are both first electrical connectors, and the two first electrical connectors of a portion of the electrode groups (300) are respectively provided on a plurality of the boat carriers (200), and the two electrode ends (310) of another portion of the electrode groups (300) are both electrode rods.

9. The semiconductor process chamber according to claim 7, wherein: The chamber body (100) includes a process pipe and a first flange (140); The first flange (140) and the bottom wall (130) are respectively connected to opposite ends of the process tube, and the first flange (140), the bottom wall (130) and the process tube together form the inner cavity (110), the opening (120) is provided on the first flange (140), and the two electrical connection parts (320) of a part of the electrode group (300) are both provided on the first flange (140), and the first direction is parallel to the extension direction of the process tube.

10. The semiconductor process chamber according to claim 9, wherein: The first flange (140) includes a plurality of first support blocks (141), the bottom wall (130) includes a plurality of second support blocks (131), the first ends of the plurality of boat carriers (200) are connected to the plurality of first support blocks (141) in a one-to-one correspondence, and the second ends of the plurality of boat carriers (200) are connected to the plurality of second support blocks (131) in a one-to-one correspondence.

11. A semiconductor process equipment, characterized in that: A semiconductor process chamber comprising a plurality of carrier boats (400) and any one of claims 1 to 10; The multiple boat carriers (200) are respectively used to support the multiple carrier boats (400), and each carrier boat (400) is electrically connected to the radio frequency component through the two electrode terminals (310) of the corresponding electrode group (300).

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