Dirt detection method and system for detection equipment and storage medium

Abstract

The invention discloses a smudginess detection method and system of detection equipment and a storage medium. The smudginess detection method comprises the steps that the detection process of a to-be-detected piece in the to-be-detected detection equipment is determined; determining at least one working area associated with the detection process according to the detection process; performing smudginess detection on the working area to obtain a smudginess detection result corresponding to the working area; and according to the dirt detection result, determining pollution source information of the detection equipment. The pollution source of the detection equipment can be effectively determined.

Description

Technical Field

[0001] The present invention relates to the technical field of detection equipment, and particularly relates to a method and system for detecting dirt on a detection equipment and a storage medium. Background Art

[0002] In fields such as semiconductor manufacturing that require surface detection, the detection equipment needs to ensure that no impurities, particles and other pollutants are introduced during the detection process to ensure the accuracy of the detection results.

[0003] The detection equipment has mechanical moving mechanisms or laser components, etc. When it is working, it may generate pollutants, or the sealing performance of the retrieval equipment is poor and it is connected to the outside world, resulting in pollutants entering the equipment interior.

[0004] Currently, when the pollution in the detection equipment exceeds the standard, it is difficult to determine the location of the pollution source. Summary of the Invention

[0005] The main technical problem to be solved by the present invention is how to determine the pollution source in the detection equipment.

[0006] According to a first aspect, an embodiment provides a dirt detection method, including:

[0007] Determine the detection process of the test piece in the detection equipment to be detected;

[0008] According to the detection process, determine at least one working area associated with the detection process;

[0009] Perform dirt detection on the working area to obtain a dirt detection result corresponding to the working area;

[0010] According to the dirt detection result, determine the pollution source information of the detection equipment.

[0011] According to a second aspect, an embodiment provides a dirt detection system, including:

[0012] A zoning module, configured to determine the detection process of the test piece in the detection equipment to be detected; according to the detection process, determine at least one working area associated with the detection process;

[0013] A dirt detection module, configured to perform dirt detection on the working area to obtain a dirt detection result corresponding to the working area;

[0014] A processing module, configured to determine the pollution source information of the detection equipment according to the dirt detection result.

[0015] According to a third aspect, an embodiment provides a dirt detection system, including:

[0016] A standard detection device is used to detect the surface of a workpiece to be tested for dirt and output corresponding detection results;

[0017] A controller is used to control the functional modules associated with the detection process in the detection device to be tested to work in a preset test mode; respectively control the standard detection device to detect the surface of the workpiece to be tested before and after the preset test mode to obtain corresponding detection results; and determine the pollution source information of the detection device to be tested according to the detection results.

[0018] According to the fourth aspect, in an embodiment, a computer-readable storage medium is provided, on which a program is stored, and the program can be executed by a processor to implement the method described in the first aspect.

[0019] According to the dirt detection method, system, and storage medium of the above embodiments, by dividing the working area according to the detection process in the detection device, determining the working areas involved by the workpiece to be tested in the detection device, and detecting the dirt in these working areas, the pollution source information of the device can be determined. This application effectively determines the pollution source of the detection device through segmented detection. Description of the Drawings

[0020] Figure 1 It is a flowchart of a dirt detection method provided by an embodiment of the present application;

[0021] Figure 2 It is a schematic structural diagram of a detection device provided by an embodiment of the present application;

[0022] Figure 3 It is a schematic structural diagram (I) of a dirt detection system provided by an embodiment of the present application;

[0023] Figure 4 It is a schematic structural diagram (II) of a dirt detection system provided by an embodiment of the present application.

[0024] Reference numerals: 100 - detection device; 110 - loading module; 120 - calibration module; 130 - manipulator module; 140 - motion module; 150 - detection module; 160 - purging module; 10 - zoning module; 20 - dirt detection module; 30 - processing module; 40 - standard detection device; 50 - controller. Detailed Embodiments

[0025] The present invention will be further described in detail below in conjunction with the specific embodiments and the accompanying drawings. Similar elements in different embodiments are denoted by related similar element numbers. In the following embodiments, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overwhelming the core part of the present application with excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and the general technical knowledge in the art.

[0026] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is stated that a certain sequence must be followed.

[0027] The serial numbers assigned to the components in this article, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, both include direct and indirect connection (coupling).

[0028] In semiconductor detection equipment, according to different detection items, the functional modules set in the detection equipment are different, and the detection processes performed on the device under test (such as a wafer) in the detection equipment are also different. Some detection processes involve a working medium or a movement process, and in these detection processes, pollutants may be generated when the functional modules are operating.

[0029] In the embodiments of the present application, the device under test is mainly a wafer and a semiconductor detection equipment as an example for illustration, but it does not limit that the detection equipment of the present application must be used to detect semiconductors or wafers. The device under test can be a wafer, or can be a chip, a glass substrate, a display panel, a mask, etc. that need to be detected. The detection equipment can be the equipment used to detect the above-mentioned device under test, and the equipment has corresponding cleanliness requirements.

[0030] In the embodiments of the present application, according to the detection process that the component to be measured needs to go through in the detection device, by dividing the working area of the detection device to be detected, it is determined in which working areas the component to be measured needs to be detected or acted on. By analyzing whether there is a possibility of contamination in this working area for the component to be measured, it is thus determined whether it is necessary to perform a dirt detection on this working area, perform a dirt detection on the working areas considered to have a possible contamination, and determine the pollution source of the detection device according to the detection result.

[0031] As Figure 1 shown, the embodiments of the present application provide a dirt detection method, which may include:

[0032] Step 1: Determine the detection process of the component to be measured in the detection device 100 to be detected.

[0033] Step 2: According to the detection process, determine at least one working area associated with the detection process.

[0034] Step 3: Perform a dirt detection on the working area to obtain a dirt detection result corresponding to the working area.

[0035] Step 4: According to the dirt detection result, determine the pollution source information of the detection device 100.

[0036] In the embodiments of the present application, the detection process corresponding to the component to be measured is determined according to the specific detection device 100, and may include processes such as loading, center calibration, transfer, and optical detection, for example.

[0037] Some detection processes do not involve a working medium and a movement process. For example, in the step of collecting a surface image using a white light source, there will be no possibility of generating pollutants at this time. Therefore, it is possible to detect each working area, or it is possible to selectively detect some areas considered to have a possible contamination.

[0038] In some embodiments, as Figure 2 shown, the detection device 100 may include multiple functional modules. The functional modules may at least include a loading module 110, a calibration module 120, a manipulator module 130, a movement module 140, and a detection module 150. The number of working areas is the same as the number of functional modules in the detection device 100. The component to be measured sequentially passes through the working areas corresponding to the loading module 110, the calibration module 120, the manipulator module 130, the movement module 140, and the detection module 150 in the detection process. The detection process may correspondingly include a loading process, a calibration process, a transfer process, and a detection process.

[0039] The manipulator module 130 is used to move the component to be measured from the feeding port of the loading module 110 (such as a wafer carrier box) to the calibration module 120, and is also used to move the component to be measured from the calibration module 120 to the movement module 140.

[0040] The calibration module 120 is used to perform center calibration on the device under test, and during calibration, the device under test can be rotated.

[0041] The motion module 140 is used to carry the device under test and drive the device under test to move along a preset motion direction.

[0042] The detection module 150 is used to detect the feature to be measured on the surface of the device under test.

[0043] In some embodiments, the detection module 150 may include a laser and an optical component. The laser is used to form a detection light spot on the device under test through the optical component.

[0044] For example, in a semiconductor detection device, when using a laser light spot for detection, during the transmission or modulation of the laser, when the laser directly irradiates or the scattered light of the laser irradiates a mechanical structure, such as a wafer chuck or a carrying device, the surface of the mechanical structure will be irradiated by the laser and contaminated to generate particulate matter, resulting in the diffusion of the particulate powder onto the device under test and causing contamination.

[0045] In some embodiments, as Figure 2 shown, the detection device 100 may further include a purging module 160. The motion module 140 may include a carrying device for carrying the device under test.

[0046] The purging module 160 is used to provide a purging gas to one side of the carrying device; the working area may also include a working area corresponding to the purging module 160 and the carrying device.

[0047] For example, some detection devices 100 have a wind field component or a purging module 160. The purging module 160 provides a purging gas to the device under test to protect the device under test. However, the air flow system of the purging module 160 itself is contaminated, which will cause pollutants to be carried in the purging gas, resulting in the contamination of the device under test.

[0048] In some embodiments, the device under test may be a wafer. The detection device 100 may include a front-end module of the device and a device host. The front-end module of the device may include a loading module 110, a calibration module 120, and a manipulator module 130; the device host may include the above-mentioned motion module 140 and detection module 150.

[0049] In the above embodiments, the loading process may include: the manipulator module 130 moves the device under test from the sample carrier box to the calibration module 120 of the front-end module of the device.

[0050] The calibration process may include: controlling the calibration module 120 to drive the device under test to rotate to achieve center calibration.

[0051] The transfer process may include: controlling the manipulator module 130 to move the workpiece to be measured from the calibration module 120 to the motion module 140 of the equipment mainframe through the transfer window.

[0052] The detection process may include: controlling the laser to generate a detection spot, and controlling the transmission mechanism to drive the workpiece to be measured to move so that the detection spot traverses the area to be measured of the workpiece.

[0053] The cleaning process may include: controlling the purging module 160 to provide purging gas to the workpiece on the motion module 140.

[0054] In some embodiments, step 3 of performing dirt detection on the working area to obtain a dirt detection result corresponding to the working area may include:

[0055] Step 310: Before the workpiece to be measured enters the working area, perform dirt detection on the surface of the workpiece to be measured to obtain a first detection result.

[0056] Step 320: Place the workpiece to be measured on the work station in the working area, control the function module corresponding to the working area to work in a preset test mode, and perform dirt detection on the surface of the workpiece to be measured to obtain a second detection result.

[0057] Step 330: Obtain the dirt detection result of the current working area according to the first detection result and the second detection result.

[0058] It may be that the workpiece to be measured is placed in the working area where dirt detection is required. Before that, perform dirt detection on the workpiece to be measured once to obtain a first detection result. Control the function module of the working area to work in a preset test mode once. For example, after the workpiece to be measured is loaded onto the calibration module 120 by the loading module 110, perform dirt detection once to obtain a corresponding second detection result. By comparing the detection results, it can be determined whether the workpiece to be measured is contaminated after being acted on by the function module in the current working area.

[0059] In the embodiments of the present application, the specific preset test mode of each function module can be set according to the actual detection device 100. Hereinafter, the detection device 100 for semiconductors will be taken as an example for illustration.

[0060] For example, for the loading process, the preset test mode may be to control the workpiece to be measured to move back and forth between the sample carrier cassette and the calibration module 120 of the equipment front end module at least once through the manipulator module 130.

[0061] Among them, in the loading process, the possible reasons for dirt are:

[0062] 1. When the front opening unified pod (foup) moves up and down, the cable or other parts of the sensor may rub against the foup, thus causing contamination.

[0063] 2. Pollution introduced from the outside due to local sealing or air flow problems in the equipment front-end module (EFEM).

[0064] 3. The ion bar tips need to be cleaned, and there is aggregated pollution on the old tips.

[0065] 4. There are large gaps in the sheet metal of the EFEM structure, which are connected to the outside, allowing dirt from the external environment to enter the EFEM chamber.

[0066] 5. The detection chamber where the detection module 150 is located is not tightly joined to the EFEM chamber, causing leakage;

[0067] 6. In order to facilitate the transfer of wafers between the EFEM chamber and the detection chamber, a transfer window is provided. The transfer window is connected to the peripheral side of the detection chamber by screws, and the friction between the transfer window screws and the housing will cause dirt.

[0068] For example, corresponding to the transfer process of the manipulator module 130, the preset test mode can be to control the device under test to move back and forth at least once through the transfer window between the equipment front-end module and the equipment by the manipulator module 130.

[0069] Among them, corresponding to the transfer process of the manipulator module 130, the possible reasons for dirt are:

[0070] The sealing of the transfer window between the manipulator module 130 and the motion module 140 is not tight, resulting in pollution.

[0071] For example, corresponding to the transfer process of the motion module 140, the preset test mode can be to control the device under test to move back and forth at least once on the motion module 140 in the equipment mainframe.

[0072] Among them, corresponding to the transfer process of the motion module 140, the possible reasons for dirt are:

[0073] 1. Friction occurs between the Y-axis of the motion module 140 and the moving parts and the stationary structure, causing pollution

[0074] 2. Pollution inside the Y-axis axis click moves with the mover of the motor, resulting in pollution.

[0075] 3. Friction between cables such as sensors and structural parts.

[0076] 4. Friction between the cable dust-free chain air pipe and the marble.

[0077] 5. Collision occurs between the motion module 140 and the surrounding enclosure of the motion module 140, generating dirt.

[0078] 6. There is a large gap at the junction of the optical machine (the upper part of the chamber where the detection module 150 is located) and the motion module 140 chamber (the lower part of the detection chamber), which makes it difficult for the micro-positive pressure to repel dirt from the external environment to form protection.

[0079] 7. The enclosure of the motion module 140 forming the closed structure is too thin and deforms, causing the cavity of the motion module 140 to communicate with the outside world.

[0080] For example, corresponding to the detection process, the preset test mode may be to control the detection module 150 to perform optical detection on the DUT in the states where the laser light source is turned off and turned on respectively.

[0081] Among them, corresponding to the detection process, the possible causes of contamination are:

[0082] 1. Laser directly irradiates mechanical structural parts, such as wafer chucks, causing contamination.

[0083] 2. Laser creates pollution in the optical path, such as scattered light irradiating mechanical structures.

[0084] For example, corresponding to the purge process, the preset test mode may be to control the purge module 160 to work, place the piece to be tested in the wind field, and purge the piece to be tested once.

[0085] Among them, corresponding to the purge process, the possible causes of contamination are:

[0086] 1. The air intake system is not cleaned thoroughly and particles are continuously released.

[0087] 2. The air inlet structure leaks, or the air outlet is mistakenly closed or opened, causing the particles to exceed the standard.

[0088] 3. If the air inlet duct is not cleaned thoroughly, you can wipe it with a dust-free cloth for inspection.

[0089] 4. The exhaust fan in the wind farm fails, the exhaust fan does not rotate, and the air is not exhausted in time, causing the particles to exceed the standard.

[0090] 5. There is no way to filter out the pollution caused by the failure of the compressed air filtration system in time.

[0091] It should be noted that the preset test mode provided in the embodiment of the present application can be set specifically according to the possible causes of contamination involved in the working area to verify whether the points where contamination may exist exist. The description of the above embodiment is only used to illustrate that the preset test mode has a certain correlation with the cause of contamination, and the preset test mode can be set according to the cause of contamination. The actual cause of contamination needs to be analyzed and determined based on the actual situation of the detection equipment. The possible causes of contamination in the processes of the above embodiments are only used to illustrate the work-related conditions of these processes and the points where contamination occurs. The preset test mode can also be the normal detection mode of the actual detection equipment 100 directly adopted.

[0092] In some embodiments, in step 3 above, the surface of the device under test is subjected to dirt detection, which may include:

[0093] Using a standard detection device 40 that has passed dirt detection to detect the dirt on the surface of the device under test; or using the detection module 150 of the detection device 100 to detect the dirt on the surface of the device under test, where the detection module 150 is used for surface dirt detection.

[0094] For example, a standard detection device 40 can be used. The standard detection device 40 can be a device of the same or different model as the detection device 100 to be detected, or other devices that can achieve dirt detection on the surface of the device under test, such as a detection device with optical detection function.

[0095] Again, for example, the detection module 150 in the detection device 100 to be detected can achieve dirt detection on the surface of the device under test. The corresponding working area of the detection module 150 can be an area that has passed dirt detection. It can be determined the change amount of dirt after the device under test undergoes a preset test mode in this working preset. It can be free of contamination or there can be contamination.

[0096] Illustratively, for example, taking the particle size to measure the dirt situation, after the detection module 150 processes the device under test once using a preset test module, the change amount of the surface particle size is 100 particle sizes. Suppose a clean device under test is placed in the working area corresponding to the loading module 110 to perform a preset measurement mode once, and then the surface dirt is detected. The particle size is 1000 particle sizes. Subtracting the contamination brought by the detection module 150, the contamination brought by the loading module 110 can be obtained as 900 particle sizes.

[0097] Of course, the above is only used to illustrate how to perform dirt detection, and does not limit the amount of contamination brought by which functional modules. Nor does it limit how to specifically perform dirt detection on the surface of the device under test.

[0098] In some embodiments, both the first detection result and the second detection result are used to represent the particle size of the contaminants on the surface of the device under test.

[0099] Wherein, in step 4, according to the first detection result and the second detection result, obtaining the dirt detection result of the current working area may include:

[0100] Step 410: Calculate the particle size difference of the contaminants on the device under test after being processed in the current working area according to the first detection result and the second detection result.

[0101] Step 420: Determine the dirt detection result of the current working area according to the particle size difference and the preset judgment criterion.

[0102] For example, the first detection result corresponding to a functional module / work area is 900 particle sizes, and the second detection result is 1000 particle sizes. The particle size difference is 100 contaminations. The preset judgment criterion, such as 200 particle sizes, can be determined according to the actual cleanliness requirement. At this time, it can be judged that the functional module / work area will not cause contamination.

[0103] In the embodiment of the present application, through segmented detection, the dirt detection is performed on each work area, and the work area where the pollution source exists in the detection device 100 can be determined.

[0104] In some embodiments, in step 4, after the pollution source information of the detection device 100, it may further include:

[0105] Step 5: Determine whether there is a pollution source in the work area where the dirt detection is currently being performed. If not, use the device under test to perform a complete detection process to detect whether the surface of the device under test is contaminated.

[0106] Step 6: If not, determine that there is no pollution source in the current detection device 100.

[0107] Step 7: If there is, determine that there is a pollution source in the current detection device 100 and it does not exist in the work areas where the dirt detection has been performed. For the other work areas where the dirt detection has not been performed, repeat steps 3 and 4 to determine the work areas where the pollution source exists. Until the total amount of pollution in the work areas where the pollution source is determined to exist is equivalent to the amount of pollution brought by the detection device 100 when the detection process is completed.

[0108] For example, in step 2, when determining at least one work area associated with the detection process, the work area determined to require dirt detection may not have a pollution source, while the detection device 100 actually has a pollution source. It is necessary to detect other work areas to detect the work areas where the pollution source of the detection device 100 exists, and finally implement pollution source investigation, so that the detection device 100 can meet the cleanliness requirements.

[0109] As Figure 3 shown, the embodiment of the present application further provides a dirt detection system, which may include: a zoning module 10, a dirt detection module 20, and a processing module 30.

[0110] The zoning module 10 is used to determine the detection process of the device under test in the detection device 100 to be detected; according to the detection process, determine at least one work area associated with the detection process.

[0111] The dirt detection module 20 is used to perform dirt detection on the work area to obtain a dirt detection result corresponding to the work area.

[0112] The processing module 30 is configured to determine the pollution source information of the detection device 100 according to the dirt detection result.

[0113] For example, the dirt detection module 20 can be the standard detection device 40, or the detection module 150 of the detection device 100 to be detected. The zoning module 10 and the processing module 30 can be implemented by using terminal modules such as a computer. The user operates on the device terminal to determine which working areas need to be subjected to dirt detection.

[0114] As Figure 4 shown, an embodiment of the present application further provides another dirt detection system, which may include: a standard detection device 40 and a controller 50.

[0115] The standard detection device 40 is configured to perform dirt detection on the surface of the workpiece to be tested and output a corresponding detection result.

[0116] The controller 50 is configured to control the functional modules associated with the detection process in the detection device 100 to be detected to work in a preset test mode; control the standard detection device 40 to perform dirt detection on the workpiece to be tested before and after the preset test mode respectively, and obtain corresponding detection results; determine the pollution source information of the detection device 100 to be detected according to the detection results.

[0117] The controller 50 can control the standard detection device 40 to work, and can also control the detection device 100 to be detected to work.

[0118] By using a standard detection device 40, it is possible to perform dirt detection on the surface of the workpiece to be tested. The controller 50 can determine whether there is pollution on the workpiece to be tested before and after the functional module works in the preset test mode according to the detection result of the standard detection device 40, so as to determine the pollution source information of the detection device 100.

[0119] Based on the pollution source information of the detection device 100, the user can check and maintain the detection device 100 until the detection device 100 meets the cleanliness requirements for detection needs.

[0120] It should be noted that the two dirt detection systems provided by the embodiments of the present application do not limit the hardware implementation manner of the dirt detection method, and other hardware systems that can achieve the above technical effects can also be used.

[0121] In summary, the dirt detection method and system provided by the embodiments of the present application can detect whether there is dirt in different areas of the detection device 100 through a progressive detection method. For example, it is sequentially the loading working area, the calibration working area, the transfer working area, and the detection working area, so as to judge where the pollution source is located. It can effectively identify where the pollution source is, and is a very effective method for detecting the source in the pollution control of wafer equipment.

[0122] Those skilled in the art can understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the programs can be stored in a computer-readable storage medium, which can include: read-only memory, random access memory, magnetic disks, optical disks, hard disks, etc. The above functions can be achieved by a computer executing the programs. For example, the programs are stored in the memory of a device, and when the programs in the memory are executed by a processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the programs can also be stored in storage media such as servers, another computer, magnetic disks, optical disks, flash drives or external hard drives, and are saved to the memory of the local device by downloading or copying, or the system of the local device is updated. When the programs in the memory are executed by a processor, all or part of the functions in the above embodiments can be achieved.

[0123] This document has been described with reference to various exemplary embodiments. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document. For example, the various operation steps and the components used to perform the operation steps can be implemented in different ways according to a specific application or any number of cost functions associated with the operation of the system (e.g., one or more steps can be deleted, modified, or incorporated into other steps).

[0124] Although the principles of this document have been shown in various embodiments, many modifications of the structures, arrangements, proportions, elements, materials, and components that are particularly applicable to specific environments and operating requirements can be used without departing from the principles and scope of this disclosure. The above modifications and other changes or corrections will be included within the scope of this document.

[0125] The foregoing detailed description has been presented with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of the disclosure. Accordingly, the contemplation of the disclosure is meant in an illustrative rather than a limiting sense, and all such modifications are intended to be included within its scope. Similarly, advantages, other advantages, and solutions to problems have been described above with respect to the various embodiments. However, benefits, advantages, solutions to problems, and any elements that may produce these, or any element that makes them more explicit, should not be construed as critical, required, or essential. As used herein, the term "comprising" and any other variants thereof are non-exclusive inclusions, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but also other elements not expressly listed or inherent to the process, method, system, article, or apparatus. Additionally, as used herein, the term "coupled" and any other variants thereof refer to physical connection, electrical connection, magnetic connection, optical connection, communication connection, functional connection, and / or any other connection.

[0126] Those having skill in the art will recognize that many changes may be made to the details of the above-described embodiments without departing from the basic principles of the invention. Thus, the scope of the invention should be determined solely by the claims.

Claims

1. A dirt detection method, characterized in that, Including: Determine the detection process of the component to be tested in the detection device to be detected; According to the detection process, determine at least one working area associated with the detection process; Perform dirt detection on the working area to obtain a dirt detection result corresponding to the working area; According to the dirt detection result, determine the pollution source information of the detection device.

2. The dirt detection method according to claim 1, wherein The performing dirt detection on the working area to obtain a dirt detection result corresponding to the working area includes: Before the component to be tested enters the working area, perform dirt detection on the surface of the component to be tested to obtain a first detection result; Place the component to be tested on the work station of the working area, control the function module corresponding to the working area to work in a preset test mode, and perform dirt detection on the surface of the component to be tested to obtain a second detection result; According to the first detection result and the second detection result, obtain the dirt detection result of the current working area.

3. The dirt detection method according to claim 2, characterized in that, Performing dirt detection on the surface of the component to be tested includes: Use a standard detection device that has passed dirt detection to perform dirt detection on the surface of the component to be tested; Or use the detection module of the detection device to perform dirt detection on the surface of the component to be tested, and the detection module is used for surface dirt detection.

4. The dirt detection method according to claim 2, characterized in that Both the first detection result and the second detection result are used to represent the particle size of the pollutants on the surface of the component to be tested; Among them, the obtaining the dirt detection result of the current working area according to the first detection result and the second detection result includes: According to the first detection result and the second detection result, calculate the particle size difference of the pollutants after the component to be tested is processed by the current working area; According to the particle size difference and a preset judgment criterion, determine the dirt detection result of the current working area.

5. The dirt detection method according to claim 1, wherein The detection device includes a plurality of function modules, and the function modules at least include a loading module, a calibration module, a manipulator module, a motion module, and a detection module. The number of working areas is the same as the number of function modules in the detection device; The manipulator module is used to move the component to be tested from the feeding port of the loading module to the calibration module, and is also used to move the component to be tested from the calibration module to the motion module; The motion module is used to carry the component to be tested and drive the component to be tested to move along a preset motion direction; The detection module is used to detect the characteristics to be tested on the surface of the component to be tested; The component to be tested sequentially passes through the working areas corresponding to the loading module, the calibration module, the manipulator module, the motion module, and the detection module in the detection process.

6. The dirt detection method according to claim 5, wherein, The detection module includes a laser and an optical component, and the laser is used to form a detection spot on the component to be tested through the optical component.

7. The dirt detection method according to claim 5, characterized in that, The detection device further includes a purging module, and the motion module includes a carrying device for carrying the component to be tested; The purging module is used to provide purging gas to one side of the carrying device; The working area further includes the working area corresponding to the purging module and the carrying device.

8. The dirt detection method according to claim 5, wherein The device under test is a wafer, and the detection device includes a front-end module and a mainframe. The front-end module includes the loading module, the calibration module, and the manipulator module; The mainframe includes the motion module and the detection module.

9. A dirt detection system, characterized in that, It includes: A zoning module for determining the detection process of the device under test in the detection device to be detected; According to the detection process, determine at least one working area associated with the detection process; A contamination detection module for detecting contamination of the working area to obtain a contamination detection result corresponding to the working area; A processing module for determining the pollution source information of the detection device according to the contamination detection result.

10. A dirt detection system, characterized in that, It includes: A standard detection device for detecting the surface of the device under test for contamination and outputting a corresponding detection result; A controller for controlling the functional modules associated with the detection process in the detection device to be detected to work in a preset test mode; Control the standard detection device to detect the device under test for contamination before and after the preset test mode respectively to obtain corresponding detection results; according to the detection results, determine the pollution source information of the detection device to be detected.

11. A computer-readable storage medium, characterized in that, The medium stores a program that can be executed by a processor to implement the method according to any one of claims 1-8.

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