Focusing shock wave capacitor charging system powered by low-voltage direct current

Abstract

The invention provides a focusing shock wave capacitor charging system powered by low-voltage direct current, which comprises a direct current source, a boost charging module, a charging voltage acquisition module and an isolation charging control module, and is characterized in that the direct current source is connected to the input end of the boost charging module; a first charging output end of the boost charging module is connected to one end of a high-voltage capacitor in the shock wave generator, and a second charging output end of the boost charging module is connected to the other end of the high-voltage capacitor; the input end of the charging voltage acquisition module is connected to the charging signal acquisition end of the boost charging module, the output end of the charging voltage acquisition module is connected to the input end of the isolation charging control module, and the output end of the isolation charging control module is connected to the charging control end of the boost charging module. Charging control over the high-voltage capacitor in the shock wave generator is achieved through the direct-current power source, the size and cost of a charging system are reduced, and meanwhile safety is improved.

Description

Technical Field

[0001] This application relates to the technical field of electromagnetic focusing shock wave capacitor charging, and particularly to a focusing shock wave capacitor charging system powered by low-voltage direct current. Background Art

[0002] The impact energy of electromagnetic focusing shock waves mainly comes from the pulsed current generated by the instantaneous discharge of a high-voltage capacitor to an inductor coil, forming a strong pulsed magnetic field, which causes the diaphragm covered on the coil to induce a magnetic field. The magnetic field of the diaphragm and the magnetic field of the coil interact to generate a repulsive force, forming a shock wave on the other side of the diaphragm in a water medium, and achieving focusing through a focusing lens or self-focusing.

[0003] The electromagnetic focusing shock wave needs to include a capacitor charging module, which charges a high-voltage capacitor to a certain high voltage to provide energy and convert electromagnetic energy into the acoustic energy of the shock wave. Currently, the power supply of the existing capacitor charging modules basically adopts a scheme powered by AC 220V. Products using AC high-voltage power supply have higher costs and larger volumes due to the limitations of rectification and other modules in AC conversion. Moreover, due to the too high supply voltage, there are also certain risks. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide at least a focusing shock wave capacitor charging system powered by low-voltage direct current, which uses a DC power supply to achieve the charging control of the high-voltage capacitor in the shock wave generator, reducing the volume and cost of the charging system while improving safety.

[0005] This application mainly includes the following aspects:

[0006] In the first aspect, an embodiment of this application provides a focusing shock wave capacitor charging system powered by low-voltage direct current. The focusing shock wave capacitor charging system includes a DC power source, a boost charging module, a charging voltage acquisition module, and an isolated charging control module. Among them, the DC power source is connected to the input end of the boost charging module. The first charging output end of the boost charging module is connected to one end of the high-voltage capacitor in the shock wave generator, and the second charging output end of the boost charging module is connected to the other end of the high-voltage capacitor. The input end of the charging voltage acquisition module is connected to the charging signal acquisition end of the boost charging module, the output end of the charging voltage acquisition module is connected to the input end of the isolated charging control module, and the output end of the isolated charging control module is connected to the charging control end of the boost charging module.

[0007] In a possible implementation manner, the boost charging module includes a Boost boost unit, a resonant full-bridge isolation boost unit, and a voltage-doubling rectification unit. Among them, the DC source is connected to the input end of the Boost boost unit, the output end of the Boost boost unit is connected to the input end of the resonant full-bridge isolation boost unit, the charging control end of the resonant full-bridge isolation boost unit is connected to the output end of the isolation charging control module, the first output end of the resonant full-bridge isolation boost unit is connected to the first input end of the voltage-doubling rectification unit, the second output end of the resonant full-bridge isolation boost unit is connected to the second input end of the voltage-doubling rectification unit, the first charging output end of the voltage-doubling rectification unit is connected to one end of the high-voltage capacitor, the second charging output end of the voltage-doubling rectification unit is connected to the other end of the high-voltage capacitor, and the charging signal acquisition end of the voltage-doubling rectification unit is connected to the input end of the charging voltage acquisition module.

[0008] In a possible implementation, the Boost boost unit includes a Boost boost chip, a fuse, a first inductor, a first diode, a first capacitor, a second capacitor, a third capacitor, an energy storage component, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first control switch, an eighth resistor, a ninth resistor, a tenth resistor, a second diode, and an eleventh resistor. Among them, the positive pole of the DC source is connected to one end of the fuse, the negative pole of the DC source is connected to the first power ground, the first capacitor and the second capacitor are connected in parallel between the other end of the fuse and the negative pole of the DC source, one end of the first resistor is connected to the other end of the fuse, the other end of the first resistor is connected to the first power ground through the second resistor, the other end of the fuse is connected to the anode of the first diode through the first inductor, the third capacitor and the energy storage component are connected in parallel between the cathode of the first diode and the first power ground, the cathode of the first diode is also connected to one end of the third resistor and the input end of the resonant full-bridge isolation boost unit, and the other end of the third resistor is connected to the first power ground through the fourth resistor; the switching frequency setting pin of the Boost boost chip is connected to the first power ground through the fourth capacitor, the power input terminal of the Boost boost chip is connected to the switching frequency setting pin through the fifth resistor, connected to the first power ground through the fifth capacitor, and connected to the other end of the fuse, the soft start time programming pin of the Boost boost chip is connected to the first power ground through the sixth capacitor and the sixth resistor, the enable pin of the Boost boost chip is connected to the other end of the first resistor, the inverting input pin of the error amplifier of the Boost boost chip is connected to the other end of the third resistor, the ground pin of the Boost boost chip is connected to the first power ground, the boost control pin of the Boost boost chip is connected to the control end of the first control switch through the seventh resistor, the first connection end of the first control switch is connected to the anode of the first diode, the second connection end of the first control switch is connected to the first power ground through the eighth resistor, connected to the current detection pin of the Boost boost chip through the ninth resistor, and connected to the first power ground through the ninth resistor and the seventh capacitor, the regulator output pin of the Boost boost chip is connected to the first power ground through the eighth capacitor, the output pin of the error amplifier of the Boost boost chip is connected to the other end of the third resistor through the ninth capacitor and the tenth resistor and connected to the other end of the third resistor through the tenth capacitor; the anode of the second diode is connected to the other end of the fuse, and the cathode of the second diode is connected to the cathode of the first diode through the eleventh resistor.

[0009] In a possible implementation, the resonant full-bridge isolation boost unit includes a high-voltage full-bridge driver chip, a full-bridge component, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a resonant capacitor, a twelfth resistor, a thirteenth resistor, and a transformer component. Among them, the power supply pins of the high-voltage full-bridge driver chip are respectively connected to the first power supply and connected to the first power ground through the eleventh capacitor. The oscillator timing resistor input pin of the high-voltage full-bridge driver chip is sequentially connected to the first power ground through the twelfth resistor and the twelfth capacitor. The oscillator timing capacitor input pin of the high-voltage full-bridge driver chip is connected to the first power ground through the twelfth capacitor. The shutdown input pin of the high-voltage full-bridge driver chip is used as the charging control terminal of the boost charging module and is connected to the isolation charging control module through the thirteenth resistor. The first upper-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the first upper-bridge drive end of the full-bridge component. The power supply end of the full-bridge component is connected to the output end of the Boost boost unit. The first upper-bridge drive power input pin of the high-voltage full-bridge driver chip is respectively connected to the midpoint of the corresponding first bridge arm of the full-bridge component and the first upper-bridge loop pin of the high-voltage full-bridge driver chip through the thirteenth capacitor. The second upper-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the second upper-bridge drive end of the full-bridge component. The second upper-bridge drive power input pin of the high-voltage full-bridge driver chip is respectively connected to the midpoint of the corresponding second bridge arm of the full-bridge component and the second upper-bridge loop pin of the high-voltage full-bridge driver chip through the fourteenth capacitor. The first lower-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the first lower-bridge drive end of the full-bridge component. The second lower-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the second lower-bridge drive end of the full-bridge component. The ground end of the full-bridge component and the signal ground pin of the high-voltage full-bridge driver chip are respectively connected to the first power ground. The midpoint of the first bridge arm of the full-bridge component is also connected to the first connection end of the primary side of the transformer component through the resonant capacitor. The midpoint of the second bridge arm of the full-bridge component is connected to the second connection end of the primary side of the transformer component. The first connection end of the secondary side of the transformer component is connected to the first input end of the voltage-doubling rectification unit. The second connection end of the secondary side of the transformer component is connected to the second input end of the voltage-doubling rectification unit.

[0010] In a possible implementation, the full-bridge component includes a first upper-bridge driving switch and its corresponding first current-limiting protection component and a fifteenth capacitor, a second upper-bridge driving switch and its corresponding second current-limiting protection component and a sixteenth capacitor, a first lower-bridge driving switch and its corresponding third current-limiting protection component and a seventeenth capacitor, and a second lower-bridge driving switch and its corresponding fourth current-limiting protection component and an eighteenth capacitor. Among them, the control terminal of the first upper-bridge driving switch is connected to the first upper-bridge driving output pin of the high-voltage full-bridge driving chip through the first current-limiting protection component. The first connection terminal of the first upper-bridge driving switch is respectively connected to the first connection terminal of the second upper-bridge driving switch and one end of the fifteenth capacitor and then connected to the output terminal of the Boost boost unit. The second connection terminal of the first upper-bridge driving switch is respectively connected to the other end of the fifteenth capacitor, the first upper-bridge loop pin of the high-voltage full-bridge driving chip, and the first connection terminal of the first lower-bridge driving switch. The second connection terminal of the first upper-bridge driving switch is also connected to the first connection terminal of the primary side of the transformer component through a resonant capacitor. The control terminal of the second upper-bridge driving switch is connected to the second upper-bridge driving output pin of the high-voltage full-bridge driving chip through the second current-limiting protection component. The first connection terminal of the second upper-bridge driving switch is also connected to the second connection terminal of the second upper-bridge driving switch, the second upper-bridge loop pin of the high-voltage full-bridge driving chip, and the first connection terminal of the second lower-bridge driving switch through the sixteenth capacitor. The second connection terminal of the second upper-bridge driving switch is also connected to the second connection terminal of the primary side of the transformer component. The control terminal of the first lower-bridge driving switch is connected to the first lower-bridge driving output pin of the high-voltage full-bridge driving chip through the third current-limiting protection component. The first connection terminal of the first lower-bridge driving switch is connected to the second connection terminal of the first lower-bridge driving switch through the seventeenth capacitor. The second connection terminal of the first lower-bridge driving switch is also respectively connected to the signal ground terminal of the high-voltage full-bridge driving chip and the second connection terminal of the second lower-bridge driving switch and then connected to the first power ground. The control terminal of the second lower-bridge driving switch is connected to the second lower-bridge driving output pin of the high-voltage full-bridge driving chip through the fourth current-limiting protection component. The first connection terminal of the second lower-bridge driving switch is connected to the second connection terminal of the second lower-bridge driving switch through the eighteenth capacitor.

[0011] In a possible implementation, the transformer component includes a first transformer and a second transformer. Among them, the first connection terminal of the primary side of the first transformer is respectively connected to the first connection terminal of the primary side of the second transformer and connected to the midpoint of the first bridge arm through a resonant capacitor. The second connection terminal of the primary side of the first transformer is respectively connected to the second connection terminal of the primary side of the second transformer and the midpoint of the second bridge arm. The first connection terminal of the secondary side of the first transformer is connected to the first input terminal of the voltage-doubling rectification unit. The second connection terminal of the secondary side of the first transformer is connected to the first connection terminal of the secondary side of the second transformer. The second connection terminal of the secondary side of the second transformer is connected to the second input terminal of the voltage-doubling rectification unit.

[0012] In a possible implementation, the voltage-doubling rectification unit includes a first rectifier bridge and its corresponding 19th capacitor, a second rectifier bridge and its corresponding 20th capacitor, and a second inductor. Among them, after the anode of the first rectifier bridge and the cathode of the second rectifier bridge are connected, they are used as the first input terminal of the voltage-doubling rectification unit and connected to the first output terminal of the resonant full-bridge isolation boost unit. The cathode of the first rectifier bridge is connected to one end of the 19th capacitor. The anode of the second rectifier bridge is respectively connected to one end of the 20th capacitor and the second power ground. After the other ends of the 19th capacitor and the 20th capacitor are connected, they are used as the second input terminal of the voltage-doubling rectification unit and connected to the second output terminal of the resonant full-bridge isolation boost unit. The cathode of the first rectifier bridge is also connected to one end of the high-voltage capacitor through the second inductor. The anode of the second rectifier bridge is also connected to the other end of the high-voltage capacitor. The other end of the high-voltage capacitor is connected to the input terminal of the charging voltage acquisition module as the charging signal acquisition terminal of the boost charging module.

[0013] In a possible implementation, the charging voltage acquisition module includes an isolation acquisition chip, a 21st capacitor, a 22nd capacitor, a 23rd capacitor, a bidirectional overvoltage protection component, a transient voltage suppressor diode, a first voltage division unit, a second voltage division unit, and a differential signal amplification unit. Among them, the high-voltage power supply pins of the isolation acquisition chip are respectively connected to the isolation power supply and connected to the second power ground through the 21st capacitor. The analog input pins of the isolation acquisition chip are respectively connected to the bidirectional overvoltage protection component, one end of the transient voltage suppressor diode, one end of the 22nd capacitor, one end of the first voltage division unit, and one end of the second voltage division unit. After the other end of the transient voltage suppressor diode is connected to the other end of the 22nd capacitor and the other end of the first voltage division unit, it is connected to the other end of the high-voltage capacitor. The other end of the second voltage division unit is connected to one end of the high-voltage capacitor. The data input pin of the isolation acquisition chip and the high-voltage side ground pin of the isolation acquisition chip are connected and then connected to the second power ground. The low-voltage power supply pins of the isolation acquisition chip are respectively connected to the second power supply and connected to the first power ground through the 23rd capacitor. The first differential output pin of the isolation acquisition chip is connected to the first input terminal of the differential signal amplification unit. The second differential output pin of the isolation acquisition chip is connected to the second input terminal of the differential signal amplification unit. The low-voltage side ground pin of the isolation acquisition chip is connected to the first power ground. The output terminal of the differential signal amplification unit is connected to the input terminal of the isolation charging control module.

[0014] In a possible implementation, the isolated charging control module includes a comparison unit, a charging limit voltage input unit, and a charging control unit. Among them, the input end of the charging limit voltage input unit is connected to the charging limit pulse width modulation signal, the output end of the charging limit voltage input unit is connected to the non-inverting input end of the comparison unit, the inverting input end of the comparison unit is connected to the output end of the differential signal amplification unit in the charging voltage acquisition module, and the power supply end of the comparison unit is connected to the second power supply; the output end of the comparison unit is connected to the input end of the charging control unit, and the output end of the charging control unit is connected to the charging control end of the resonant full-bridge isolated boost unit in the boost charging module.

[0015] In a possible implementation, the focused shock wave capacitor charging system further includes a power supply module and an isolated power supply module. The input end of the power supply module is connected to the target input power supply. The first output end of the power supply module outputs the first power supply, the second output end of the power supply module outputs the second power supply, and the ground end of the power supply module is connected to the first power ground; the input end of the isolated power supply module is connected to the second power supply, the output end of the isolated power supply module outputs the isolated power supply, and the ground end of the isolated power supply module is connected to the second power ground.

[0016] A focused shock wave capacitor charging system using low-voltage DC power supply provided by an embodiment of the present application includes a DC source, a boost charging module, a charging voltage acquisition module, and an isolated charging control module. Among them, the DC source is connected to the input end of the boost charging module. The first charging output end of the boost charging module is connected to one end of the high-voltage capacitor in the shock wave generator, and the second charging output end of the boost charging module is connected to the other end of the high-voltage capacitor; the input end of the charging voltage acquisition module is connected to the charging signal acquisition end of the boost charging module, the output end of the charging voltage acquisition module is connected to the input end of the isolated charging control module, and the output end of the isolated charging control module is connected to the charging control end of the boost charging module. The present application uses a DC power supply to realize the charging control of the high-voltage capacitor in the shock wave generator, reducing the volume and cost of the charging system while improving safety.

[0017] To make the above objects, features, and advantages of the present application more obvious and understandable, the following specific preferred embodiments are given, and in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1Shows a schematic structural diagram of a focused shock wave capacitor charging system powered by low-voltage direct current provided by an embodiment of the present application;

[0020] Figure 2 Shows a schematic structural diagram of a boost charging module provided by an embodiment of the present application;

[0021] Figure 3 Shows a schematic structural diagram of a Boost boost unit provided by an embodiment of the present application;

[0022] Figure 4 Shows a schematic structural diagram of a resonant full-bridge isolation boost unit provided by an embodiment of the present application;

[0023] Figure 5 Shows a schematic structural diagram of a voltage doubling rectification unit and a charging voltage acquisition module provided by an embodiment of the present application;

[0024] Figure 6 Shows a schematic structural diagram of a differential signal amplification unit provided by an embodiment of the present application;

[0025] Figure 7 Shows a schematic structural diagram of an isolation charging control module provided by an embodiment of the present application;

[0026] Figure 8 Shows a schematic structural diagram of a power supply system provided by an embodiment of the present application;

[0027] Figure 9 Shows a schematic diagram of the working process of a focused shock wave capacitor charging system provided by an embodiment of the present application. Detailed implementation manners

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the accompanying drawings in the present application are only for the purposes of illustration and description, and are not used to limit the protection scope of the present application. Additionally, it should be understood that the schematic drawings are not drawn to actual scale. The flowcharts used in the present application illustrate the operations implemented according to some embodiments of the present application. It should be understood that the operations in the flowchart may not be implemented in sequence, and steps without logical context relationships may be reversed or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart or remove one or more operations from the flowchart under the guidance of the content of the present application.

[0029] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all embodiments. The components of the embodiments of the present application described and illustrated in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but only represents the selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0030] The electromagnetic focusing shock wave needs to include a capacitor charging module, which charges a high-voltage capacitor to a certain high voltage to provide energy and convert electromagnetic energy into the acoustic energy of the shock wave. Currently, the power supply of the existing capacitor charging modules basically adopts the scheme of AC 220V power supply. The products using AC high-voltage power supply have higher costs and larger volumes due to the limitations of rectification and other modules in AC conversion. Moreover, due to the too high supply voltage, there are also certain risks.

[0031] Based on this, the embodiments of the present application provide a focusing shock wave capacitor charging system using low-voltage DC power supply, which realizes the charging control of the high-voltage capacitor in the shock wave generator by using a DC power supply, reduces the volume and cost of the charging system, and improves safety at the same time, as follows:

[0032] Please refer to Figure 1 , Figure 1 which shows a schematic structural diagram of a focusing shock wave capacitor charging system using low-voltage DC power supply provided by the embodiments of the present application. As Figure 1 shown, the focusing shock wave capacitor charging system provided by the embodiments of the present application includes a DC power source, a boost charging module 1, a charging voltage acquisition module 2, and an isolated charging control module 3. Among them, the DC power source is connected to the input end of the boost charging module 1. The first charging output end of the boost charging module 1 is connected to one end of the high-voltage capacitor C0 in the shock wave generator, and the second charging output end of the boost charging module 1 is connected to the other end of the high-voltage capacitor C0. The input end of the charging voltage acquisition module 2 is connected to the charging signal acquisition end ACQ of the boost charging module 1, the output end of the charging voltage acquisition module 2 is connected to the input end of the isolated charging control module 3, and the output end of the isolated charging control module 3 is connected to the charging control end SD of the boost charging module 1.

[0033] In a preferred embodiment, please refer to Figure 2 , Figure 2 which shows a schematic structural diagram of a boost charging module provided by the embodiments of the present application. As Figure 2As shown in the figure, the boost charging module includes a Boost boost unit 11, a resonant full-bridge isolation boost unit 12, and a voltage-doubling rectification unit 13. Among them, the DC source is connected to the input end of the Boost boost unit 11, the output end of the Boost boost unit 11 is connected to the input end of the resonant full-bridge isolation boost unit 12, the first output end of the resonant full-bridge isolation boost unit 12 is connected to the first input end of the voltage-doubling rectification unit 13, the second output end of the resonant full-bridge isolation boost unit 12 is connected to the second input end of the voltage-doubling rectification unit 13, the first charging output end of the voltage-doubling rectification unit 13 is connected to one end of the high-voltage capacitor C0, the second charging output end of the voltage-doubling rectification unit 13 is connected to the other end of the high-voltage capacitor C0, and the charging signal acquisition end of the voltage-doubling rectification unit 13 is connected to the input end of the charging voltage acquisition module 2.

[0034] In a specific embodiment, as Figure 2 shown, the positive pole of the DC power supply is connected to the input end of the Boost boost unit 11, and the negative pole of the DC power supply is connected to the first grounding terminal GND1 and then connected to the Boost boost unit 11 and the resonant full-bridge isolation boost unit 12. In an example, after the DC power supply is input into the Boost boost unit 11, through the boosting effect of the Boost boost unit 11, the first boosted value VCC1 (such as 48V) is output. After the first boosted value VCC1 is output to the resonant full-bridge isolation boost unit 12, it is boosted again by the resonant full-bridge isolation boost unit 12, and the second boosted value VCC2 (such as 2000V) is output. The second boosted value VCC2 is then input into the voltage-doubling rectification unit 13 for rectification and boosting again, and the third boosted value VCC3 (such as 4000V) is output to charge the high-voltage capacitor C0.

[0035] Please refer to Figure 3 , Figure 3 which shows a schematic structural diagram of a Boost boost unit provided by an embodiment of the present application. As Figure 3 shown, the Boost boost unit includes a Boost boost chip U1, a fuse FU, a first inductor L1, a first diode D1, a first capacitor C1, a second capacitor C2, a third capacitor C3, an energy storage component, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first control switch K1, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a second diode D2, and an eleventh resistor R11.

[0036] Preferably, the positive pole of the DC power source is connected to one end of the fuse FU, the negative pole of the DC power source is connected to the first power ground GND1, the first capacitor C1 and the second capacitor C2 are connected in parallel between the other end of the fuse FU and the negative pole of the DC power source, one end of the first resistor R1 and the target input power supply VPUT are connected to the other end of the fuse FU, the other end of the first resistor R1 is connected to the first power ground GND1 through the second resistor R2, the other end of the fuse FU is connected to the anode of the first diode D1 through the first inductor L1, the third capacitor C3 and the energy storage component 110 are connected in parallel between the cathode of the first diode D1 and the first power ground GND1, the cathode of the first diode D1 is also connected to one end of the third resistor R3 and the input end of the resonant full-bridge isolation boost unit 12, and the other end of the third resistor R3 is connected to the first power ground GND1 through the fourth resistor R4.

[0037] The switching frequency setting pin RC of the Boost boost chip U1 is connected to the first power ground GND1 through the fourth capacitor C4. The power input terminal VDD of the Boost boost chip U1 is respectively connected to the switching frequency setting pin RC through the fifth resistor R5, connected to the first power ground GND1 through the fifth capacitor C5, and connected to the other end of the fuse FU. The soft start time programming pin SS of the Boost boost chip U1 is connected to the first power ground GND1 through the sixth capacitor C6 and the sixth resistor R6. The enable pin of the Boost boost chip U1 is connected to the other end of the first resistor R1. The error amplifier inverting input pin FB of the Boost boost chip U1 is connected to the other end of the third resistor R3. The grounding pin GND of the Boost boost chip U1 is connected to the first power ground GND1. The boost control pin CDRV of the Boost boost chip U1 is connected to the control terminal of the first control switch K1 through the seventh resistor R7. The first connection terminal of the first control switch K1 is connected to the anode of the first diode D1. The second connection terminal of the first control switch K1 is respectively connected to the first power ground GND1 through the eighth resistor R8, connected to the current detection pin ISNS of the Boost boost chip U1 through the ninth resistor R9, and connected to the first power ground GND1 through the ninth resistor R9 and the seventh capacitor C7. The regulator output pin BP of the Boost boost chip U1 is connected to the first power ground GND1 through the eighth capacitor C8. The error amplifier output pin COMP of the Boost boost chip U1 is respectively connected to the other end of the third resistor R3 through the ninth capacitor C9 and the tenth resistor R10 and connected to the other end of the third resistor R3 through the tenth capacitor C10.

[0038] The anode of the second diode D2 is connected to the other end of the fuse FU, and the cathode of the second diode D2 is connected to the cathode of the first diode D1 through the eleventh resistor R11.

[0039] In a specific embodiment, the first diode D1 is a freewheeling diode. The Boost boost chip U1 can be selected as the TPS40210 chip. Since the output of the entire system is a capacitive load and the power is relatively large during the charging instant, a relatively large capacitor is required for energy storage. Therefore, in this application, two large electrolytic capacitors CE1 and CE2 are connected in parallel to form an energy storage component 110 for energy storage. Moreover, in order to make the BOOST more stable when powered on instantaneously, a structure formed by connecting the second diode D2 and the eleventh resistor R11 in series is connected in parallel to the first inductor L1 and the first diode D1, so that the current flowing through the first inductor L1 will not be too large due to the excessive electrolytic capacitors CE1 and CE2 when the Boost boost unit is powered on instantaneously, causing the first inductor L1 to saturate. The function of the Boost boost unit is to raise the DC source to the first boost value VCC1 (48V).

[0040] In a specific embodiment, the first control switch K1 can be selected as a MOSFET. The control terminal of the first control switch is the gate of the MOSFET, the first connection terminal of the first control switch K1 is the drain of the MOSFET, and the second connection terminal of the first control switch K1 is the source of the MOSFET. The first control switch K1 is specifically selected as an NMOS.

[0041] In a preferred embodiment, please refer to Figure 4 , Figure 4 which shows a schematic structural diagram of a resonant full-bridge isolated boost unit provided by an embodiment of the present application. As Figure 4 shown, the resonant full-bridge isolated boost unit 12 includes a high-voltage full-bridge drive chip U2, a full-bridge component 120, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a resonant capacitor Cr, a twelfth resistor R12, a thirteenth resistor R13, and a transformer component T.

[0042] The power supply pin VCC of the high-voltage full-bridge drive chip U2 is respectively connected to the first power supply VCC-a1 and connected to the first power supply ground GND1 through the eleventh capacitor C11. The oscillator timing resistor input pin RT of the high-voltage full-bridge drive chip U2 is sequentially connected to the first power supply ground GND1 through the twelfth resistor R12 and the twelfth capacitor C12. The oscillator timing capacitor input pin CT of the high-voltage full-bridge drive chip U2 is connected to the first power supply ground GND1 through the twelfth capacitor C12. The shutdown input pin SD of the high-voltage full-bridge drive chip U2 serves as the charging control terminal of the boost charging module and is connected to the isolated charging control module 3 through the thirteenth resistor R13.

[0043] The first high-side drive output pin HO1 of the high-voltage full-bridge drive chip U2 is connected to the first high-side drive end of the full-bridge component 120. The power supply end of the full-bridge component 120 is connected to the output end of the Boost boost unit 11 (i.e., VCC1). The first high-side drive power input pin VB1 of the high-voltage full-bridge drive chip U2 is respectively connected to the midpoint of the corresponding first bridge arm of the full-bridge component 120 and the first high-side loop pin VS1 of the high-voltage full-bridge drive chip U2 through the thirteenth capacitor C13. The second high-side drive output pin HO2 of the high-voltage full-bridge drive chip U2 is connected to the second high-side drive end of the full-bridge component 120. The second high-side drive power input pin VB2 of the high-voltage full-bridge drive chip U2 is respectively connected to the midpoint of the corresponding second bridge arm of the full-bridge component 120 and the second high-side loop pin VS2 of the high-voltage full-bridge drive chip U2 through the fourteenth capacitor C14.

[0044] The first low-side drive output pin LO1 of the high-voltage full-bridge drive chip U2 is connected to the first low-side drive end of the full-bridge component 120. The second low-side drive output pin LO2 of the high-voltage full-bridge drive chip U2 is connected to the second low-side drive end of the full-bridge component 120. The ground end of the full-bridge component 120 and the signal ground pin COM of the high-voltage full-bridge drive chip U2 are respectively connected to the first power ground GND1.

[0045] The midpoint of the first bridge arm of the full-bridge component 120 is also connected to the first connection end of the primary side of the transformer component T through the resonant capacitor Cr. The midpoint of the second bridge arm of the full-bridge component 120 is connected to the second connection end of the primary side of the transformer component T. The first connection end of the secondary side of the transformer component T is connected to the first input end of the voltage-doubling rectification unit 13. The second connection end of the secondary side of the transformer component T is connected to the second input end of the voltage-doubling rectification unit 13.

[0046] In another preferred embodiment, as Figure 4 , the full-bridge component 120 includes the first high-side drive switch Q1 and its corresponding first current-limiting protection component 1201 and the fifteenth capacitor C15, the second high-side drive switch Q2 and its corresponding second current-limiting protection component 1202 and the sixteenth capacitor, the first low-side drive switch Q3 and its corresponding third current-limiting protection component 1203 and the seventeenth capacitor C17, and the second low-side drive switch Q4 and its corresponding fourth current-limiting protection component 1204 and the eighteenth capacitor C18.

[0047] Among them, the control terminal of the first upper-bridge driving switch Q1 is connected to the first upper-bridge driving output pin HO1 of the high-voltage full-bridge driving chip U2 through the first current-limiting protection component 1201. The first connection terminal of the first upper-bridge driving switch Q1 is respectively connected to the first connection terminal of the second upper-bridge driving switch Q2 and one end of the fifteenth capacitor C15, and then connected to the output terminal of the Boost boost unit 11. The second connection terminal of the first upper-bridge driving switch Q1 is respectively connected to the other end of the fifteenth capacitor C15, the first upper-bridge loop pin VS1 of the high-voltage full-bridge driving chip U2, and the first connection terminal of the first lower-bridge driving switch Q3. The second connection terminal of the first upper-bridge driving switch Q1 is also connected to the first connection terminal of the primary side of the transformer assembly T through the resonance capacitor Cr.

[0048] The control terminal of the second upper-bridge driving switch Q2 is connected to the second upper-bridge driving output pin HO2 of the high-voltage full-bridge driving chip U2 through the second current-limiting protection component 1202. The first connection terminal of the second upper-bridge driving switch Q2 is also connected to the second connection terminal of the second upper-bridge driving switch Q2, the second upper-bridge loop pin VS2 of the high-voltage full-bridge driving chip U2, and the first connection terminal of the second lower-bridge driving switch Q4 through the sixteenth capacitor C16. The second connection terminal of the second upper-bridge driving Q2 is also connected to the second connection terminal of the primary side of the transformer assembly T.

[0049] The control terminal of the first lower-bridge driving switch Q3 is connected to the first lower-bridge driving output pin LO1 of the high-voltage full-bridge driving chip U2 through the third current-limiting protection component 1203. The first connection terminal of the first lower-bridge driving switch Q3 is connected to the second connection terminal of the first lower-bridge driving switch Q3 through the seventeenth capacitor C17. The second connection terminal of the first lower-bridge driving switch Q3 is also respectively connected to the signal ground terminal COM of the high-voltage full-bridge driving chip U2 and the second connection terminal of the second lower-bridge driving switch Q4, and then connected to the first power ground GND1.

[0050] The control terminal of the second lower-bridge driving switch Q4 is connected to the second lower-bridge driving output pin LO2 of the high-voltage full-bridge driving chip U2 through the fourth current-limiting protection component 1204. The first connection terminal of the second lower-bridge driving switch Q4 is connected to the second connection terminal of the second lower-bridge driving switch Q4 through the eighteenth capacitor C18.

[0051] In a specific embodiment, such as Figure 4As shown, the first current-limiting protection component 1201 includes a first gate resistor RM1, a first voltage-limiting diode ZD1, and a first current-limiting resistor RF1. Among them, the control terminal of the first upper-bridge driving switch Q1 is respectively connected to one end of the first current-limiting resistor RF1 and one end of the first gate resistor RM1. The other end of the first current-limiting resistor RF1 is connected to the anode of the first voltage-limiting diode ZD1. The cathode of the first voltage-limiting diode ZD1 is connected to the other end of the first gate resistor RM1 and then connected to the first upper-bridge driving output pin HO1 of the high-voltage full-bridge driving chip U2.

[0052] The second current-limiting protection component 1202 includes a second gate resistor RM2, a second voltage-limiting diode ZD2, and a second current-limiting resistor RF2. Among them, the control terminal of the second upper-bridge driving switch Q2 is respectively connected to one end of the second current-limiting resistor RF2 and one end of the second gate resistor RM2. The other end of the second current-limiting resistor RF2 is connected to the anode of the second voltage-limiting diode ZD2. The cathode of the second voltage-limiting diode ZD2 is connected to the other end of the second gate resistor RM2 and then connected to the second upper-bridge driving output pin HO2 of the high-voltage full-bridge driving chip U2.

[0053] The third current-limiting protection component 1203 includes a third gate resistor RM3, a third voltage-limiting diode ZD3, and a third current-limiting resistor RF3. Among them, the control terminal of the first lower-bridge driving switch Q3 is respectively connected to one end of the third current-limiting resistor RF3 and one end of the third gate resistor RM3. The other end of the third current-limiting resistor RF3 is connected to the anode of the third voltage-limiting diode ZD3. The cathode of the third voltage-limiting diode ZD3 is connected to the other end of the third gate resistor RM3 and then connected to the first lower-bridge driving output pin LO1 of the high-voltage full-bridge driving chip U2.

[0054] The fourth current-limiting protection component 1204 includes a fourth gate resistor RM4, a fourth voltage-limiting diode ZD4, and a fourth current-limiting resistor RF4. Among them, the control terminal of the second lower-bridge driving switch Q4 is respectively connected to one end of the fourth current-limiting resistor RF4 and one end of the fourth gate resistor RM4. The other end of the fourth current-limiting resistor RF4 is connected to the anode of the fourth voltage-limiting diode ZD4. The cathode of the fourth voltage-limiting diode ZD4 is connected to the other end of the fourth gate resistor RM4 and then connected to the second lower-bridge driving output pin LO2 of the high-voltage full-bridge driving chip U2.

[0055] In a preferred embodiment, as Figure 4As shown, the transformer assembly T includes a first transformer T1 and a second transformer T2. Among them, the first connection end of the primary side of the first transformer T1 is respectively connected to the first connection end of the primary side of the second transformer T2 and connected to the midpoint of the first bridge arm (i.e., the second connection end of the first upper-bridge driving switch Q1) through the resonant capacitor Cr. The second connection end of the primary side of the first transformer T1 is respectively connected to the second connection end of the primary side of the second transformer T2 and the midpoint of the second bridge arm (i.e., the second connection end of the second upper-bridge driving switch Q2).

[0056] The first connection end of the secondary side of the first transformer T1 is connected to the first input end of the voltage-doubling rectification unit 13. The second connection end of the secondary side of the first transformer T1 is connected to the first connection end of the secondary side of the second transformer T2. The second connection end of the secondary side of the second transformer T2 is connected to the second input end of the voltage-doubling rectification unit 13.

[0057] In a specific embodiment, the function of the resonant full-bridge isolation boost unit 12 is to invert and boost the first boost value VCC1 (such as 48V) to the second boost value VCC2 (2000V in this embodiment) for output. The high-voltage full-bridge driving chip uses IRS2453. The driving switches in the full-bridge assembly of this application use field-effect transistors with the same specifications. The resonant capacitor Cr is a CBB resonant capacitor. And in order to further reduce the volume and cost of the entire system in this application, only the leakage inductance of the transformer assembly is used as the resonant inductance.

[0058] For the transformer assembly T, a design scheme of parallel connection of the primaries of the first transformer T1 and the second transformer T2 and series connection of the secondaries of the first transformer T1 and the second transformer T2 is adopted. Such a method can increase the boost ratio of the transformer. In addition, the turns ratio of the secondary coils of the first transformer T1 and the second transformer T2 is the same, and the secondary voltage is evenly distributed to the secondaries of the first transformer T1 and the second transformer T2. In this application, the first transformer T1 and the second transformer T2 adopt a multi-slot transformer skeleton, which has the characteristics of high withstand voltage between the primary and secondary and large leakage inductance, and is more suitable for the focused shock wave capacitor charging system provided by this application.

[0059] In a preferred embodiment, please refer to Figure 5 , Figure 5 shows a schematic structural diagram of a voltage-doubling rectification unit and a charging voltage acquisition module provided by an embodiment of this application. As Figure 5As shown in the figure, the voltage-doubling rectifier unit 13 includes a first rectifier bridge 130 and its corresponding nineteenth capacitor C19, a second rectifier bridge 131 and its corresponding twentieth capacitor C20, and a second inductor L2. Among them, after the anode of the first rectifier bridge 130 and the cathode of the second rectifier bridge 131 are connected, they are used as the first input terminal of the voltage-doubling rectifier unit 13 and connected to the first output terminal of the resonant full-bridge isolated boost unit 12 (i.e., the first connection terminal on the secondary side of the first transformer T1). The cathode of the first rectifier bridge 130 is connected to one end of the nineteenth capacitor C19. The anode of the second rectifier bridge 131 is respectively connected to one end of the twentieth capacitor C20 and the second power ground GND2. After the other ends of the nineteenth capacitor C19 and the twentieth capacitor C20 are connected, they are used as the second input terminal of the voltage-doubling rectifier unit 13 and connected to the second output terminal of the resonant full-bridge isolated boost unit 12 (i.e., the second connection terminal on the secondary side of the second transformer T2).

[0060] The cathode of the first rectifier bridge 130 is also connected to one end of the high-voltage capacitor C0 through the second inductor L2. The anode of the second rectifier bridge 131 is also connected to the other end of the high-voltage capacitor C0. The other end of the high-voltage capacitor C0 is used as the charging signal acquisition terminal of the boost charging module 1 and connected to the input terminal of the charging voltage acquisition module 2.

[0061] In a specific embodiment, the first rectifier bridge 130 and the second rectifier bridge 131 are respectively formed by connecting multiple fast-recovery diodes in series. In a specific embodiment, the first rectifier bridge 130 includes a first fast-recovery diode DM1, a second fast-recovery diode DM2, and a third fast-recovery diode DM3 connected in series in sequence. The second rectifier bridge 131 includes a fourth fast-recovery diode DM4, a fifth fast-recovery diode DM5, and a sixth fast-recovery diode DM6 connected in series in sequence. After the anode of the first fast-recovery diode DM1 and the cathode of the sixth fast-recovery diode DM6 are connected, they are connected to the first connection terminal of the first transformer T1. The cathode of the third fast-recovery diode DM3 is respectively connected to one end of the nineteenth capacitor C19 and connected to one end of the high-voltage capacitor C0 through the second inductor L2. The anode of the fourth fast-recovery diode DM4 is respectively connected to one end of the twentieth capacitor C20, the second power ground, and the other end of the high-voltage capacitor C0.

[0062] Preferably, the nineteenth capacitor C19 and the twentieth capacitor C20 are high-voltage ceramic capacitors. The main function of the voltage-doubling rectifier unit 13 is to rectify the AC voltage inverted by the transformer assembly and double the second boost value VCC2 (2000V) output by the transformer assembly to output a third boost value VCC3, and use the third boost value VCC3 (such as 4000V) to charge the high-voltage capacitor C0. The second inductor L2 is an air-core inductor, and its main function is to limit the charging current of the high-voltage capacitor C0 from being too large. The fast-recovery diode can be 2KV.

[0063] In a preferred embodiment, as Figure 5 , the charging voltage acquisition module 2 includes an isolation acquisition chip U3, a twenty-first capacitor C21, a twenty-second capacitor C22, a twenty-third capacitor C23, a bidirectional overvoltage protection component 20, a transient voltage suppressor diode TVS, a first voltage division unit 21, a second voltage division unit 22, and a differential signal amplification unit 23. Among them, the isolation acquisition chip U3 uses an isolation sampling chip with the model number AMC1311.

[0064] Among them, the high-voltage power supply pin VDD1 of the isolation acquisition chip U3 is respectively connected to the isolation power supply HV_VCC and connected to the second power supply ground GND2 through the twenty-first capacitor C21. The analog input pin VIN of the isolation acquisition chip U3 is respectively connected to the bidirectional overvoltage protection component 20, one end of the transient voltage suppressor diode TVS, one end of the twenty-second capacitor C22, one end of the first voltage division unit 21, and one end of the second voltage division unit 22. After the other end of the transient voltage suppressor diode TVS is connected to the other end of the twenty-second capacitor C22 and the other end of the first voltage division unit 21, it is connected to the other end of the high-voltage capacitor C0. The other end of the second voltage division unit 22 is connected to one end of the high-voltage capacitor C0. The data input pin SHTDN of the isolation acquisition chip U3 is connected to the high-voltage side ground pin GND_H of the isolation acquisition chip U3 and then connected to the second power supply ground GND2.

[0065] In a specific embodiment, the bidirectional overvoltage protection component 20 includes a fifth voltage limiting diode ZD5 and a sixth voltage limiting diode ZD6 connected in series. Specifically, the anode of the fifth voltage limiting diode ZD5 is connected to the second power supply ground, the cathode of the fifth voltage limiting diode ZD5 is respectively connected to the anode of the sixth voltage limiting diode ZD6 and the analog input pin VIN of the isolation acquisition chip U3, and the cathode of the sixth voltage limiting diode ZD6 is connected to the isolation power supply HV_VCC.

[0066] In another specific embodiment, the first voltage division unit 21 is formed by at least one voltage division resistor connected in series, and the second voltage division unit 22 is formed by multiple voltage division resistors connected in series. Preferably, as Figure 5 shown, the first voltage division unit 21 includes a voltage division resistor RA1, and the second voltage division unit 22 includes voltage division resistors RA2 to RA8 connected in series. Among them, one end of the voltage division resistor RA2 is respectively connected to one end of the voltage division resistor RA1 and the analog input pin VIN of the isolation acquisition chip U3, the other end of the voltage division resistor RA1 is connected to the other end of the high-voltage capacitor C0, and the other end of the voltage division resistor RA2 is sequentially connected to one end of the high-voltage capacitor C0 through the voltage division resistors RA3 to RA8.

[0067] In a preferred embodiment, as Figure 5As shown, the low-voltage power supply pin VDD2 of the isolation acquisition chip U3 is respectively connected to the second power supply VCC-a2 and to the first power ground GND1 through the twenty-third capacitor C23. The first differential output pin OUTP of the isolation acquisition chip U3 is connected to the first input end of the differential signal amplification unit 23. The second differential output pin OUTN of the isolation acquisition chip U3 is connected to the second input end of the differential signal amplification unit 23. The low-voltage side ground pin GND_L of the isolation acquisition chip U3 is connected to the first power ground GND1. The output end of the differential signal amplification unit 23 is connected to the input end of the isolation charging control module 3.

[0068] In a specific embodiment, please refer to Figure 6 , Figure 6 which shows a schematic structural diagram of a differential signal amplification unit provided by an embodiment of the present application. As Figure 6 shown, the differential signal amplification unit 23 includes a fourteenth resistor R14, a fifteenth resistor R15, a first-stage operational amplifier U4A, a sixteenth resistor R16, a seventeenth resistor R17, an eighteenth resistor R18, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26, and a twenty-seventh capacitor C27.

[0069] Specifically, one end of the fourteenth resistor R14 is connected to the first differential output pin OUTP of the isolation acquisition chip U3, and the other end of the fourteenth resistor R14 is connected to the non-inverting input end of the first-stage differential operational amplifier U4A. One end of the fifteenth resistor R15 is connected to the second differential output pin OUTN of the isolation acquisition chip U3, and the other end of the fifteenth resistor R15 is connected to the inverting input end of the first-stage differential operational amplifier U4A. The positive power input end of the first-stage differential operational amplifier U4A is connected to the second power supply, and the negative power input end of the first-stage differential operational amplifier U4A is connected to the first power ground GND1. The output end of the first-stage differential operational amplifier U4A is respectively connected to one end of the sixteenth resistor R16, one end of the seventeenth resistor R17, and one end of the twenty-fourth capacitor C24. After the other ends of the seventeenth resistor R17 and the twenty-fourth capacitor C24 are connected, they are connected to the inverting input end of the first-stage differential operational amplifier U4A. The other end of the sixteenth resistor R16 is respectively connected to one end of the twenty-fifth capacitor and the input end HVFB-IOS of the isolation charging control module.

[0070] The other end of the twenty-fifth capacitor C25 is respectively connected to the first power ground GND1 and the non-inverting input terminal of the second-stage differential operational amplifier U4B. The inverting input terminal of the second-stage differential operational amplifier U4B is respectively connected to the output terminal of the second-stage differential operational amplifier U4B, one end of the twenty-sixth capacitor C26, and one end of the eighteenth resistor R18. After the other ends of the twenty-sixth capacitor C26 and the eighteenth resistor R18 are connected, they are connected to the non-inverting input terminal of the first-stage differential operational amplifier U4A. The positive power input terminal of the second-stage differential operational amplifier U4B is respectively connected to the second power supply and is connected to the first power ground through the twenty-seventh capacitor C27. The negative power input terminal of the second-stage differential operational amplifier U4B is connected to the first power ground GND1.

[0071] In a preferred embodiment, please refer to Figure 7 , Figure 7 which shows a schematic structural diagram of an isolation charging control module provided by an embodiment of the present application. As Figure 7 shown, the isolation charging control module 3 includes a comparison unit 31, a charging limit voltage input unit 32, and a charging control unit 33. Among them, the input terminal of the charging limit voltage input unit 32 is connected to the charging limit pulse width modulation signal HV-PWM. The output terminal of the charging limit voltage input unit 32 is connected to the non-inverting input terminal of the comparison unit 31. The inverting input terminal of the comparison unit 31 is connected to the output terminal HVFB-IOS (i.e., the other end of the sixteenth resistor R16) of the differential signal amplification unit in the charging voltage acquisition module 2. The power supply terminal of the comparison unit 31 is connected to the second power supply VCC-a2. The output terminal of the comparison unit 31 is connected to the input terminal of the charging control unit 33. The output terminal of the charging control unit 33 is connected to the charging control terminal (i.e., the shutdown input pin SD of the high-voltage full-bridge driver chip U2) of the resonant full-bridge isolation boost unit 12 in the boost charging module 1.

[0072] In a preferred embodiment, as Figure 7 shown, the charging limit voltage input unit 32 includes a pulse width signal conversion chip U5, a twenty-eighth capacitor C28, a twenty-ninth capacitor C29, a thirtieth capacitor C30, a nineteenth resistor R19, and a transient voltage suppressor diode TVS2.

[0073] Preferably, the power input pin VCC of the pulse width signal conversion chip U5 is respectively connected to the second power supply VCC-a2 and connected to the first ground GND1 through the twenty-eighth capacitor. The pulse width signal input pin PWM of the pulse width signal conversion chip U5 is connected to the charging limit pulse width modulation signal HV-PWM. The NC pin of the pulse width signal conversion chip U5 is left floating. The ground pin GND of the pulse width signal conversion chip U5 is respectively connected to the first ground GND1, one end of the nineteenth resistor R19, one end of the twenty-ninth capacitor C29, one end of the thirtieth capacitor C30, and one end of the transient voltage suppressor diode TVS2. The output pin OUT of the pulse width signal conversion chip U5 outputs a voltage signal PWM-ADC and is respectively connected to the other end of the transient voltage suppressor diode TVS2, the other end of the thirtieth capacitor C30, and the non-inverting input terminal of the comparator unit 31. The output voltage amplitude selection pin SEL of the pulse width signal conversion chip U5 is connected to the other end of the nineteenth resistor R19. The internal LDO pin V5V of the pulse width signal conversion chip U5 is connected to the other end of the twenty-ninth capacitor C29. In this application, the pulse width signal conversion chip U5 can be selected as GP8101.

[0074] In a preferred embodiment, as Figure 7 shown, the comparator unit 31 includes a follower operational amplifier U6A, a thirty-first capacitor C31, a thirty-second capacitor C32, a twentieth resistor R20, a twenty-first resistor R21, a twenty-second resistor R22, and a comparator U6B.

[0075] Preferably, the non-inverting input terminal of the follower operational amplifier U6A is connected to the output terminal HVFB-IOS of the differential signal amplification unit. The inverting input terminal of the follower operational amplifier U6A is respectively connected to the output terminal of the follower operational amplifier U6A, one end of the thirty-second capacitor C32, and one end of the twentieth resistor R20. The other end of the thirty-second capacitor C32 is connected to the negative power input terminal of the follower operational amplifier U6A and then connected to the first ground GND1. The other end of the twentieth resistor R20 is connected to the inverting input terminal of the comparator U6B. The positive power input terminal of the follower operational amplifier U6A is respectively connected to the second power supply VCC-a2 and connected to the first ground GND1 through the thirty-first capacitor C31. The non-inverting input terminal of the comparator U6B is respectively connected to the output pin OUT of the pulse width signal conversion chip U5 through the twenty-first resistor R21, to the output terminal of the comparator U6B through the twenty-second resistor R22, and to the input terminal of the charging control unit 33. The positive power input terminal of the comparator U6B is connected to the second power supply VCC-a2. The negative power input terminal of the comparator U6B is connected to the first ground GND1.

[0076] In a preferred embodiment, the charging control unit 33 includes a thirty-third capacitor C33, a thirty-fourth capacitor C34, a twenty-third resistor R23, a twenty-fourth resistor R24, a twenty-fifth resistor R25, a twenty-sixth resistor R26, a twenty-seventh resistor R27, a third diode D3, a second control switch K2, and an AND gate logic control chip U7.

[0077] Preferably, the power input pin VDD of the AND gate logic control chip U7 is connected to the second power supply VCC-a2 and to the first ground GND1 through a thirty-third resistor. The signal input pin 4A and the signal output pin 4Y of the AND gate logic control chip U7 are connected and then respectively connected to one end of the twenty-third resistor R23 and one end of the twenty-fourth resistor R24. The other end of the twenty-fourth resistor R24 is connected to the signal output pin 3Y of the AND gate logic control chip U7. The other end of the twenty-third resistor R23 is respectively connected to the control end of the second control switch K2 and one end of the twenty-fifth resistor R25. The other end of the twenty-fifth resistor R25 is connected to the second connection end of the second control switch K2 and then connected to the first ground. The first connection end of the second control switch K2 is respectively connected to the cathode of the third diode D3 and one end of the twenty-seventh resistor R27. The other end of the twenty-seventh resistor R27 is connected to the second power supply VCC-a2. The anode of the third diode D3 is connected to the shutdown input pin SD of the high-voltage full-bridge drive chip U2.

[0078] The signal input pin 3B of the AND gate logic control chip U7 is respectively connected to the output end of the comparator U6B through a twenty-sixth resistor R26 and to the first ground GND1 through a thirty-fourth capacitor C34. The ground pin VSS of the AND gate logic control chip U7 is connected to the first ground GND1.

[0079] In addition, the signal input pin 4B of the AND gate logic control chip U7 in this application is connected to the temperature protection module of the entire focused shock wave capacitor charging system. When the temperature protection module detects a temperature warning event, it outputs a low-level signal to the signal input pin 4B of the AND gate logic control chip U7. Otherwise, it outputs a high-level signal to the signal input pin 4B of the AND gate logic control chip U7.

[0080] The signal input pin 3A of the AND gate logic control chip U7 is connected to the charging emergency stop control switch. Under normal circumstances, the signal input pin 3A of the AND gate logic control chip U7 is at a high level. When the signal input pin 3A of the AND gate logic control chip U7 is at a low-level signal, it indicates that the charging emergency stop control switch has been triggered.

[0081] In a specific embodiment, when the AND gate logic control chip U7 detects that any one of the input pins 3A, 3B, and 4B is at a low level, it controls the second control K2 to conduct through the output pin 4Y, so as to pull down the shutdown input pin SD of the high-voltage full-bridge drive chip U2 and stop the charging process of the high-voltage capacitor C0.

[0082] In this application, the main function of the isolation charging control module 3 is to control the charging voltage of the high-voltage capacitor C0. The main working principle is to use the isolation acquisition chip to collect the voltage after being divided by RA1~RA8. After isolation processing, it is differentially amplified by 2.5 times through the differential signal amplification unit and then given to the comparison unit. Then, the voltage signal PWM-ADC obtained by converting the charging limit pulse-width modulation signal HV-PWM through the charging limit voltage input unit is compared, and the comparison result is output to the charging control unit, so as to further realize the on-off control of the high-voltage full-bridge drive chip through the charging control unit, thereby realizing the control of the charging voltage of the high-voltage capacitor C0.

[0083] In this application, the function of the charging limit pulse-width modulation signal HV-PWM is to serve as the input of the voltage regulation signal, and the signal output by the comparison unit serves as the on-off control instruction of the high-voltage full-bridge drive chip.

[0084] In a preferred embodiment, please refer to Figure 8 , Figure 8 which shows the structural schematic diagram of a power supply system provided by the embodiment of this application. As Figure 8 shown, the focused shock wave capacitor charging system further includes a power supply system. The power supply system includes a power supply module 4 and an isolated power supply module 5. Preferably, the input end of the power supply module 4 is connected to the target input power supply VPUT, the first output end of the power supply module 4 outputs the first power supply VCC-a1, the second output end of the power supply module 4 outputs the second power supply VCC-a2, the grounding end of the power supply module 4 is connected to the first power ground GND1, the input end of the isolated power supply module 5 is connected to the second power supply VCC-a2, the output end of the isolated power supply module 5 outputs the isolated power supply HV-VCC, and the grounding end of the isolated power supply module 5 is connected to the second power ground GND2.

[0085] In a specific embodiment, the target input power supply VPUT = +24V, the first power supply VCC-a1 = +12V, the second power supply VCC-a2 = +5V, and the isolated power supply HV-VCC = +5V.

[0086] Furthermore, as Figure 8As shown in the figure, the power supply module 4 includes the thirty-fifth capacitor C35, the thirty-sixth capacitor C36, the thirty-seventh capacitor C37, the thirty-eighth capacitor C38, the first power supply chip U8 and the second power supply chip U9. The isolated power supply module 5 includes the thirty-ninth capacitor C39, the isolated power supply chip U10, the fortieth capacitor C40, the forty-first capacitor C41 and the third inductor L3.

[0087] Preferably, the input terminal VIN of the first power supply chip U8 is respectively connected to the target input power supply VPUT and one end of the thirty-fifth capacitor C35. The ground terminal GND of the first power supply chip U8 is respectively connected to the other end of the thirty-fifth capacitor C35 and the first power ground GND1. The output terminal VOUT of the first power supply chip U8 outputs the first power supply VCC-a1 and is respectively connected to one end of the thirty-sixth capacitor C36, one end of the thirty-seventh capacitor C37 and the input terminal VIN of the second power supply chip U9. The output terminal VOUT of the second power supply chip U9 outputs the second power supply VCC-a2 and is respectively connected to one end of the thirty-eighth capacitor C38, one end of the thirty-ninth capacitor C39 and the input terminal VIN of the isolated power supply chip U10. The other ends of the thirty-sixth capacitor C36, the thirty-seventh capacitor C37, the thirty-eighth capacitor C38, the thirty-ninth capacitor C39, the ground terminal of the second power supply chip U9 and the input side ground terminal GND of the isolated power supply chip U10 are all connected to the first power ground GND1.

[0088] The output terminal +VO of the isolated power supply chip U10 is respectively connected to one end of the fortieth capacitor C40 and one end of the third inductor L3. The other end of the third inductor L3 outputs the isolated power supply HV-VCC and is connected to one end of the forty-first capacitor C41. The other end of the fortieth capacitor C40, the output side ground terminal 0V of the isolated power supply chip U10 and the other end of the forty-first capacitor C41 are respectively connected to the second power ground GND2.

[0089] In this application, for the power supply module 4, the main function is to step down the target input power supply VPUT (DC 24V) of the power supply into the first power supply VCC-a1 (12V) and the second power supply VCC-a2 (5V), and supply them to the devices in the entire focused shock wave capacitor charging system that rely on the first power supply VCC-a1 and the second power supply VCC-a2. Specifically, the first power supply chip U8 can adopt a step-down chip of model 78L12, and the second power supply chip U9 can adopt a step-down chip of model AMS1117-5V.

[0090] Preferably, in this application, the isolated power supply HV-VCC provided by the isolated power supply module 5 powers the isolated acquisition chip U3 to ensure the input-output isolation of the entire focused shock wave capacitor charging system.

[0091] In a specific embodiment, please refer to Figure 9 , Figure 9 which shows a schematic diagram of the working process of a focused shock wave capacitor charging system provided by an embodiment of the present application. As Figure 9 shown, the target input power supply (24V) of the present application is input into the power supply module on the one hand. After being stepped down step by step by the power supply module, the first power supply VCC-a1 (12V) and the second power supply VCC-a2 (5V) are obtained. The first power supply VCC-a1 (12V) is provided to the Boost boost unit (to drive the Boost boost chip U1 to work) and the resonant full-bridge isolation boost unit (to drive the high-voltage full-bridge drive chip U2 to work). The second power supply VCC-a2 (5V) is provided to the isolated power supply module. After being processed by the isolated power supply module, the isolated power supply HV-VCC (5V) is output to the charging voltage acquisition module (to drive the isolated acquisition chip U3 to work).

[0092] On the other hand, the target input power supply (24V) is provided to the Boost boost unit. Through the boosting effect of the Boost boost unit, the first boosted value VCC1 (48V) is obtained and input into the resonant full-bridge isolation boost unit. The resonant full-bridge isolation boost unit boosts VCC1 (48V) to obtain the second boosted value VCC2 (2000V). The second boosted value VCC2 is provided to the voltage doubling rectification unit. The voltage doubling rectification unit rectifies and boosts the second boosted value VCC2 to the third boosted value VCC3 (4000V) to charge the high-voltage capacitor C0 with the third boosted value VCC3 (4000V). The charging voltage acquisition module acquires and processes the charging voltage of the high-voltage capacitor and outputs it to the isolated charging control module. After comparison and processing, the isolated charging control module outputs the corresponding on-off control signal to the resonant full-bridge isolation boost unit to realize the charging control of the high-voltage capacitor C0.

[0093] In a specific embodiment, as Figure 7, for the isolated charging control module, its working process is as follows: The charging limit voltage input unit accesses the host computer to obtain the charging limit pulse width modulation signal HV-PWM pre-input by the user for the high-voltage capacitor C0. The charging limit pulse width modulation signal HV-PWM is converted into a corresponding voltage signal PWM-ADC by the pulse width signal conversion chip U5 and input to the comparison unit 31. The comparison unit compares the voltage signal PWM-ADC with the charging voltage of the high-voltage capacitor C0 collected by the charging voltage acquisition module 2. If the voltage signal PWM-ADC is greater than the charging voltage of the high-voltage capacitor C0, a high level is output. If the voltage signal PWM-ADC is lower than the charging voltage of the high-voltage capacitor C0, a low level is output. For the AND gate logic control chip U7, when it detects that the comparison unit outputs a high level, its output pin 4Y outputs a level signal that turns off the second control switch. At this time, the shutdown input pin SD of the high-voltage full-bridge drive chip U2 is at a high level, and it maintains its working state and continues to charge the high-voltage capacitor C0. When the AND gate logic control chip U7 detects that the comparison unit outputs a low level, its output pin 4Y outputs a level signal that turns on the second control switch. At this time, the shutdown input pin SD of the high-voltage full-bridge drive chip U2 is at a low level, and the high-voltage full-bridge drive chip U2 stops working and stops charging the high-voltage capacitor C0.

[0094] Preferably, the user can adjust the duty cycle corresponding to the charging limit pulse width modulation signal HV-PWM through the host computer, so as to realize the adjustment of the charging voltage of the high-voltage capacitor C0.

[0095] The advantages of this application are as follows:

[0096] A focused shock wave capacitor charging system powered by low-voltage DC is provided. This solution can extremely reduce the volume and cost of the entire focused shock wave capacitor charging system. In addition, the low-voltage solution is safer and more reliable.

[0097] The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0098] In addition, in each embodiment of this application, the functional units can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0099] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A focused shock wave capacitor charging system powered by low-voltage direct current, characterized in that, The described focused shock wave capacitor charging system includes a DC source, a boost charging module, a charging voltage acquisition module, and an isolated charging control module. Among them, the DC source is connected to the input end of the boost charging module. The first charging output end of the boost charging module is connected to one end of the high-voltage capacitor in the shock wave generator, and the second charging output end of the boost charging module is connected to the other end of the high-voltage capacitor. The input end of the charging voltage acquisition module is connected to the charging signal acquisition end of the boost charging module. The output end of the charging voltage acquisition module is connected to the input end of the isolated charging control module, and the output end of the isolated charging control module is connected to the charging control end of the boost charging module.

2. The focused shock wave capacitor charging system according to claim 1, wherein The boost charging module includes a Boost boost unit, a resonant full-bridge isolated boost unit, and a voltage-doubling rectification unit. Among them, the DC source is connected to the input end of the Boost boost unit. The output end of the Boost boost unit is connected to the input end of the resonant full-bridge isolated boost unit. The charging control end of the resonant full-bridge isolated boost unit is connected to the output end of the isolated charging control module. The first output end of the resonant full-bridge isolated boost unit is connected to the first input end of the voltage-doubling rectification unit. The second output end of the resonant full-bridge isolated boost unit is connected to the second input end of the voltage-doubling rectification unit. The first charging output end of the voltage-doubling rectification unit is connected to one end of the high-voltage capacitor, and the second charging output end of the voltage-doubling rectification unit is connected to the other end of the high-voltage capacitor. The charging signal acquisition end of the voltage-doubling rectification unit is connected to the input end of the charging voltage acquisition module.

3. The focused shock wave capacitor charging system according to claim 2, wherein The Boost boost unit includes a Boost boost chip, a fuse, a first inductor, a first diode, a first capacitor, a second capacitor, a third capacitor, an energy storage component, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first control switch, an eighth resistor, a ninth resistor, a tenth resistor, a second diode, and an eleventh resistor. Among them, the positive pole of the DC source is connected to one end of the fuse. The negative pole of the DC source is connected to the first power ground. The first capacitor and the second capacitor are connected in parallel between the other end of the fuse and the negative pole of the DC source. One end of the first resistor is connected to the other end of the fuse. The other end of the first resistor is connected to the first power ground through the second resistor. The other end of the fuse is connected to the anode of the first diode through the first inductor. The third capacitor and the energy storage component are connected in parallel between the cathode of the first diode and the first power ground. The cathode of the first diode is also connected to one end of the third resistor and the input end of the resonant full-bridge isolated boost unit. The other end of the third resistor is connected to the first power ground through the fourth resistor. The switching frequency setting pin of the Boost boost chip is connected to the first power ground through the fourth capacitor. The power input terminal of the Boost boost chip is respectively connected to the switching frequency setting pin through the fifth resistor, connected to the first power ground through the fifth capacitor, and connected to the other end of the fuse. The soft start time programming pin of the Boost boost chip is connected to the first power ground through the sixth capacitor and the sixth resistor. The enable pin of the Boost boost chip is connected to the other end of the first resistor. The inverting input pin of the error amplifier of the Boost boost chip is connected to the other end of the third resistor. The ground pin of the Boost boost chip is connected to the first power ground. The boost control pin of the Boost boost chip is connected to the control terminal of the first control switch through the seventh resistor. The first connection terminal of the first control switch is connected to the anode of the first diode. The second connection terminal of the first control switch is respectively connected to the first power ground through the eighth resistor, connected to the current detection pin of the Boost boost chip through the ninth resistor, and connected to the first power ground through the ninth resistor and the seventh capacitor. The regulator output pin of the Boost boost chip is connected to the first power ground through the eighth capacitor. The output pin of the error amplifier of the Boost boost chip is respectively connected to the other end of the third resistor through the ninth capacitor and the tenth resistor, and connected to the other end of the third resistor through the tenth capacitor; The anode of the second diode is connected to the other end of the fuse, and the cathode of the second diode is connected to the cathode of the first diode through the eleventh resistor.

4. The focused shock wave capacitor charging system according to claim 2, wherein The resonant full-bridge isolation boost unit includes a high-voltage full-bridge driver chip, a full-bridge component, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a resonant capacitor, a twelfth resistor, a thirteenth resistor, and a transformer component. Among them, the power supply pin of the high-voltage full-bridge driver chip is respectively connected to the first power supply and connected to the first power ground through the eleventh capacitor. The oscillator timing resistor input pin of the high-voltage full-bridge driver chip is sequentially connected to the first power ground through the twelfth resistor and the twelfth capacitor. The oscillator timing capacitor input pin of the high-voltage full-bridge driver chip is connected to the first power ground through the twelfth capacitor. The shutdown input pin of the high-voltage full-bridge driver chip is used as the charging control terminal of the boost charging module and is connected to the isolated charging control module through the thirteenth resistor. The first upper-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the first upper-bridge drive end of the full-bridge component. The power supply terminal of the full-bridge component is connected to the output terminal of the Boost boost unit. The first upper-bridge drive power input pin of the high-voltage full-bridge driver chip is respectively connected to the midpoint of the corresponding first bridge arm of the full-bridge component and the first upper-bridge loop pin of the high-voltage full-bridge driver chip through the thirteenth capacitor. The second upper-bridge drive output pin of the high-voltage full-bridge driver chip is connected to the second upper-bridge drive end of the full-bridge component. The second upper-bridge drive power input pin of the high-voltage full-bridge driver chip is respectively connected to the midpoint of the corresponding second bridge arm of the full-bridge component and the second upper-bridge loop pin of the high-voltage full-bridge driver chip through the fourteenth capacitor; The first lower-bridge drive output pin of the high-voltage full-bridge drive chip is connected to the first lower-bridge drive end of the full-bridge component, and the second lower-bridge drive output pin of the high-voltage full-bridge drive chip is connected to the second lower-bridge drive end of the full-bridge component. The ground terminal of the full-bridge component and the signal ground terminal of the high-voltage full-bridge drive chip are respectively connected to the first power ground; The midpoint of the first bridge arm of the full-bridge component is also connected to the first connection end of the primary side of the transformer component through a resonant capacitor. The midpoint of the second bridge arm of the full-bridge component is connected to the second connection end of the primary side of the transformer component. The first connection end of the secondary side of the transformer component is connected to the first input end of the voltage-doubling rectification unit, and the second connection end of the secondary side of the transformer component is connected to the second input end of the voltage-doubling rectification unit.

5. The focused shock wave capacitor charging system according to claim 4, wherein The full-bridge component includes a first upper-bridge drive switch and its corresponding first current-limiting protection component and the fifteenth capacitor, a second upper-bridge drive switch and its corresponding second current-limiting protection component and the sixteenth capacitor, a first lower-bridge drive switch and its corresponding third current-limiting protection component and the seventeenth capacitor, and a second lower-bridge drive switch and its corresponding fourth current-limiting protection component and the eighteenth capacitor. Among them, the control terminal of the first upper-bridge drive switch is connected to the first upper-bridge drive output pin of the high-voltage full-bridge drive chip through the first current-limiting protection component. The first connection end of the first upper-bridge drive switch is respectively connected to the first connection end of the second upper-bridge drive switch and one end of the fifteenth capacitor and then connected to the output end of the Boost boost unit. The second connection end of the first upper-bridge drive switch is respectively connected to the other end of the fifteenth capacitor, the first upper-bridge loop pin of the high-voltage full-bridge drive chip, and the first connection end of the first lower-bridge drive switch. The second connection end of the first upper-bridge drive switch is also connected to the first connection end of the primary side of the transformer component through a resonant capacitor; The control terminal of the second upper-bridge drive switch is connected to the second upper-bridge drive output pin of the high-voltage full-bridge drive chip through the second current-limiting protection component. The first connection end of the second upper-bridge drive switch is also connected to the second connection end of the second upper-bridge drive switch, the second upper-bridge loop pin of the high-voltage full-bridge drive chip, and the first connection end of the second lower-bridge drive switch through the sixteenth capacitor. The second connection end of the second upper-bridge drive switch is also connected to the second connection end of the primary side of the transformer component; The control terminal of the first lower-bridge drive switch is connected to the first lower-bridge drive output pin of the high-voltage full-bridge drive chip through the third current-limiting protection component. The first connection end of the first lower-bridge drive switch is connected to the second connection end of the first lower-bridge drive switch through the seventeenth capacitor. The second connection end of the first lower-bridge drive switch is also respectively connected to the signal ground terminal of the high-voltage full-bridge drive chip and the second connection end of the second lower-bridge drive switch and then connected to the first power ground; The control terminal of the second lower-bridge drive switch is connected to the second lower-bridge drive output pin of the high-voltage full-bridge drive chip through the fourth current-limiting protection component. The first connection end of the second lower-bridge drive switch is connected to the second connection end of the second lower-bridge drive switch through the eighteenth capacitor.

6. The focused shock wave capacitor charging system according to claim 4, wherein The transformer component includes a first transformer and a second transformer. Among them, the first connection end of the primary side of the first transformer is respectively connected to the first connection end of the primary side of the second transformer and to the midpoint of the first bridge arm through a resonant capacitor, and the second connection end of the primary side of the first transformer is respectively connected to the second connection end of the primary side of the second transformer and the midpoint of the second bridge arm; The first connection end of the secondary side of the first transformer is connected to the first input end of the voltage-doubling rectification unit, the second connection end of the secondary side of the first transformer is connected to the first connection end of the secondary side of the second transformer, and the second connection end of the secondary side of the second transformer is connected to the second input end of the voltage-doubling rectification unit.

7. The focused shock wave capacitor charging system according to claim 2, wherein The voltage-doubling rectification unit includes a first rectifier bridge and its corresponding nineteenth capacitor, a second rectifier bridge and its corresponding twentieth capacitor, and a second inductor. Among them, after the anode of the first rectifier bridge and the cathode of the second rectifier bridge are connected, they are used as the first input end of the voltage-doubling rectification unit and connected to the first output end of the resonant full-bridge isolation boost unit. The cathode of the first rectifier bridge is connected to one end of the nineteenth capacitor, and the anode of the second rectifier bridge is respectively connected to one end of the twentieth capacitor and the second power ground. After the other ends of the nineteenth capacitor and the twentieth capacitor are connected, they are used as the second input end of the voltage-doubling rectification unit and connected to the second output end of the resonant full-bridge isolation boost unit; The cathode of the first rectifier bridge is also connected to one end of the high-voltage capacitor through a second inductor, and the anode of the second rectifier bridge is also connected to the other end of the high-voltage capacitor. The other end of the high-voltage capacitor is used as the charging signal acquisition end of the boost charging module and connected to the input end of the charging voltage acquisition module.

8. The focused shock wave capacitor charging system according to claim 1, wherein, The charging voltage acquisition module includes an isolation acquisition chip, a twenty-first capacitor, a twenty-second capacitor, a twenty-third capacitor, a bidirectional overvoltage protection component, a transient voltage regulator diode, a first voltage division unit, a second voltage division unit, and a differential signal amplification unit. Among them, the high-voltage power supply pins of the isolation acquisition chip are respectively connected to the isolation power supply and to the second power ground through the twenty-first capacitor. The analog input pins of the isolation acquisition chip are respectively connected to the bidirectional overvoltage protection component, one end of the transient voltage regulator diode, one end of the twenty-second capacitor, one end of the first voltage division unit, and one end of the second voltage division unit. After the other end of the transient voltage regulator diode is connected to the other end of the twenty-second capacitor and the other end of the first voltage division unit, it is connected to the other end of the high-voltage capacitor. The other end of the second voltage division unit is connected to one end of the high-voltage capacitor. After the data input pin of the isolation acquisition chip is connected to the high-voltage side ground pin of the isolation acquisition chip, it is connected to the second power ground; The low-voltage power supply pins of the isolation acquisition chip are respectively connected to the second power supply and to the first power ground through the twenty-third capacitor. The first differential output pin of the isolation acquisition chip is connected to the first input end of the differential signal amplification unit, the second differential output pin of the isolation acquisition chip is connected to the second input end of the differential signal amplification unit, the low-voltage side ground pin of the isolation acquisition chip is connected to the first power ground, and the output end of the differential signal amplification unit is connected to the input end of the isolation charging control module.

9. The focused shock wave capacitor charging system according to claim 1, characterized in that, The isolation charging control module includes a comparison unit, a charging limit voltage input unit, and a charging control unit. Among them, the input end of the charging limit voltage input unit is connected to the charging limit pulse width modulation signal, the output end of the charging limit voltage input unit is connected to the non-inverting input end of the comparison unit, the inverting input end of the comparison unit is connected to the output end of the differential signal amplification unit in the charging voltage acquisition module, and the power supply end of the comparison unit is connected to the second power supply; The output end of the comparison unit is connected to the input end of the charging control unit, and the output end of the charging control unit is connected to the charging control end of the resonant full-bridge isolation boost unit in the boost charging module.

10. The focused shock wave capacitor charging system according to claim 1, wherein The focused shock wave capacitor charging system further includes a power supply module and an isolated power supply module, The input end of the power supply module is connected to the target input power supply, the first output end of the power supply module outputs the first power supply, the second output end of the power supply module outputs the second power supply, and the ground end of the power supply module is connected to the first power ground; The input end of the isolated power supply module is connected to the second power supply, the output end of the isolated power supply module outputs the isolated power supply, and the ground end of the isolated power supply module is connected to the second power ground.

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