A circuit board surface coating machine for circuit board production and its coating method

Abstract

The present invention discloses a circuit board surface coating machine for circuit board production and its coating method, which relates to the technical field of circuit board coating; it includes a base, one end of the base is provided with an adsorption mechanism, and a clamping mechanism is arranged on the base for clamping the circuit board; an operation mechanism is arranged on the base and above the clamping mechanism, and the operation mechanism includes a processing box, an installation sliding seat is arranged inside the processing box, and an adhesion mechanism, a coating mechanism, a dust removal mechanism and a UV curing mechanism are respectively arranged on the installation sliding seat; the present invention can realize the efficient coating processing operation of the circuit board, realize various processing of the circuit board in a closed space, and can detect the adhesion strength of the subsequent coating layer.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board coating, and particularly relates to a circuit board surface coater for circuit board production and a coating method thereof. Background Art

[0002] Circuit board coating refers to coating a protective layer on the surface of an electronic circuit board to protect the circuit board from environmental impacts, improve its durability, or provide certain functional characteristics. The coating can be applied to the entire circuit board or a local area, depending on the usage requirements; existing circuit board coating equipment has relatively single functions, is equipped with a long production line, cannot perform integrated processing, and subsequent detection of the adhesion strength of the coating layer is not convenient. Based on this, the present invention proposes a coater that can achieve efficient coating processing of circuit boards, perform various processing of circuit boards in a closed space, and can detect the adhesion strength of the subsequent coating layer. Summary of the Invention

[0003] Aiming at the above technical problems, the present invention can achieve efficient coating processing of circuit boards, perform various processing of circuit boards in a closed space, and can detect the adhesion strength of the subsequent coating layer.

[0004] The usage scheme of the present invention is as follows: A circuit board surface coater for circuit board production includes a base. One end of the base is provided with an adsorption mechanism, and a clamping mechanism is arranged on the base for clamping the circuit board; an operation mechanism is arranged on the base and above the clamping mechanism. The operation mechanism includes a processing box. An installation sliding seat is arranged inside the processing box, and an adhesion mechanism, a coating mechanism, a dust removal mechanism, and a UV curing mechanism are respectively arranged on the installation sliding seat.

[0005] Further, a first support plate is arranged at one end of the base, and a second support plate is arranged at the other end. The adsorption mechanism is arranged on the top of the first support plate, and the operation mechanism is arranged on the second support plate; the adsorption mechanism includes an electric cylinder one arranged on the first support plate. An adsorption installation seat is arranged on the telescopic rod of the electric cylinder one, and an adsorption part is arranged on the adsorption installation seat; an installation frame is arranged on the base for supporting and positioning the circuit board.

[0006] Further, the clamping mechanism includes a motor one, a lead screw one, and a guide rod one arranged on the base. The motor one is used to drive the lead screw one. A clamping sliding seat is movably arranged on the lead screw one and the guide rod one. The clamping sliding seat and the lead screw one form a screw pair. An angle motor is arranged on the clamping sliding seat. An angle gear is arranged on the output shaft of the angle motor, and a rotating cylinder is rotatably installed on the clamping sliding seat. The rotating cylinder meshes with the angle gear. A clamping electric cylinder one is arranged on the rotating cylinder. A clamping electric cylinder two is arranged on the telescopic rod of the clamping electric cylinder one. Clamping parts are arranged on the telescopic rods at both ends of the clamping electric cylinder two.

[0007] Further, a support mechanism is provided on the second support plate. The support mechanism includes a fifth motor and a fifth lead screw provided on the second support plate. The fifth motor is used to drive the fifth lead screw. A first limit sliding seat is slidably mounted on the second support plate. The first limit sliding seat and the fifth lead screw form a screw pair. A sixth motor and a sixth lead screw are provided on the first limit sliding seat. The sixth lead screw is driven by the sixth motor. A second limit sliding seat is slidably mounted on the first limit sliding seat. The second limit sliding seat and the sixth lead screw form a screw pair. A stabilizing electric cylinder is provided on the second limit sliding seat. Stabilizing clamping brackets are provided on the telescopic rods at both ends of the stabilizing electric cylinder.

[0008] Further, the working mechanism includes a second motor and a second lead screw provided on the second support plate. The second motor is used to drive the second lead screw. A processing sliding frame is slidably mounted on the second support plate. The processing sliding frame and the second lead screw form a screw pair. The processing box is fixedly connected to the processing sliding frame. A second electric cylinder is provided on the processing sliding frame. A scraping frame is provided on the telescopic rod of the second electric cylinder. The scraping frame is located inside the processing box.

[0009] Further, a first rotating seat and a second rotating seat are rotatably mounted on the processing box. A third guide rod and a third lead screw are connected between the first rotating seat and the second rotating seat. A third motor is provided on the first rotating seat. The third motor is used to drive the third lead screw. A mounting sliding seat is movably arranged on the third guide rod and the third lead screw. The mounting sliding seat and the third lead screw form a screw pair. A position motor is provided outside the processing box. A position gear is provided on the output shaft of the position motor. The position gear meshes with the first rotating seat. The adhesion mechanism, the coating mechanism, the dust removal mechanism, and the UV curing mechanism are provided on the mounting sliding seat.

[0010] Further, the coating mechanism includes a coating electric cylinder provided on the mounting sliding seat. A coating part is provided on the telescopic rod of the coating electric cylinder. The dust removal mechanism includes a cleaning electric cylinder provided on the mounting sliding seat. A cleaning part is provided on the telescopic rod of the cleaning electric cylinder. The UV curing mechanism includes a curing electric cylinder provided on the mounting sliding seat. An ultraviolet curing device is provided on the telescopic rod of the curing electric cylinder.

[0011] Further, the adhesion mechanism includes a detection electric cylinder on the mounting sliding seat. A support guide plate is provided on the telescopic rod of the detection electric cylinder. A winding motor and a winding cylinder are respectively provided at both ends of the support guide plate. The winding cylinder is driven by the winding motor. The winding cylinder is used for winding and collecting the adhesion tape. A fourth motor, a fourth lead screw, and a fourth guide rod are provided on the support guide plate. The fourth motor is used to drive the fourth lead screw. A rolling seat is movably arranged on the fourth lead screw and the fourth guide rod. A rolling cylinder is provided on the rolling seat. The rolling seat and the fourth lead screw form a screw pair.

[0012] A method for coating the surface of a circuit board in circuit board production uses the above-mentioned circuit board surface coater for circuit board production, and includes the following steps:

[0013] S10: Adsorb and lift the circuit board, and clamp and transfer the circuit board to the coating area through the clamping mechanism;

[0014] S20: The working mechanism moves above the circuit board to cover the surface of the circuit board.

[0015] S30: Dust removal, coating, curing, and adhesion strength detection of the circuit board are performed through the working mechanism.

[0016] The beneficial effects of the present invention compared with the prior art are as follows:

[0017] 1) Dust removal treatment can be first performed on the surface of the circuit board, that is, the cleaning cylinder is controlled to move the cleaning part, and the cleaning part performs dust removal operations; further, the angle motor can work, and the rotating cylinder flips, that is, drives the circuit board to flip, realizing the treatment of different surfaces.

[0018] 2) After coating, the curing cylinder can be controlled to move the ultraviolet curing device, and the ultraviolet curing device cures the coated surface; subsequently, the strength of the coated surface can be detected, that is, it is detected whether the coating layer is stably attached to the circuit board. Specifically, the detection cylinder is controlled to move the support guide plate, the adhesion surface on the adhesion tape faces the circuit board, and the adhesion tape is attached to the support guide plate. The winding motor is controlled to control the winding cylinder, and the adhesion surface of the adhesion tape can be converted, and the adhesion tape contacts the coated surface on the circuit board.

[0019] 3) The stable clamping frame is controlled by the stable cylinder to clamp the adhesion detection area, that is, the adhesion area is located inside the stable clamping frame. When pulling, the deformation of the circuit board can be prevented.

[0020] 4) After the processing of the circuit board is completed, the processing box can be controlled by the second cylinder to move, and the processing box performs a scraping operation on the clamping area on the clamping part, that is, the coating material remaining on the clamping area of the clamping part during coating can be removed, avoiding affecting the subsequent clamping effect after the coating material is cured. Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the base installation structure of the present invention.

[0023] Figure 3 It is a schematic diagram of the processing box installation structure of the present invention.

[0024] Figure 4 It is a schematic diagram of the clamping mechanism structure of the present invention.

[0025] Figure 5 It is a schematic diagram of the internal structure of the processing box of the present invention.

[0026] Figure 6 It is a schematic diagram of the installation sliding seat structure of the present invention.

[0027] Figure 7 Schematic diagram of the installation structure of the installation slide of the present invention from another angle.

[0028] Figure 8 Schematic diagram of the adhesion mechanism structure of the present invention.

[0029] Figure 9 Schematic diagram of the rolling cylinder structure of the present invention.

[0030] Figure 10 Schematic diagram of the support mechanism structure of the present invention.

[0031] Figure 11 Schematic diagram of the partial structure of the support mechanism of the present invention.

[0032] Reference numerals: 1 - base; 101 - first support plate; 102 - second support plate; 2 - first electric cylinder; 3 - adsorption mounting seat; 4 - adsorption part; 5 - first motor; 6 - first lead screw; 7 - first guide rod; 8 - mounting frame; 9 - second motor; 10 - second lead screw; 11 - processing slide; 12 - second electric cylinder; 13 - processing box; 14 - clamping slide; 15 - rotating cylinder; 16 - first clamping electric cylinder; 17 - angle motor; 18 - angle gear; 19 - angle seat; 20 - second clamping electric cylinder; 21 - clamping part; 22 - scraping frame; 23 - position gear; 24 - position motor; 25 - first rotating seat; 26 - third motor; 27 - second rotating seat; 28 - third guide rod; 29 - third lead screw; 30 - installation slide; 31 - curing electric cylinder; 32 - UV curing device; 33 - cleaning electric cylinder; 34 - cleaning part; 35 - coating electric cylinder; 36 - coating part; 37 - detection electric cylinder; 38 - support guide plate; 39 - winding motor; 40 - winding cylinder; 41 - adhesion tape; 42 - fourth lead screw; 43 - fourth guide rod; 44 - fourth motor; 45 - rolling seat; 46 - rolling cylinder; 47 - fifth motor; 48 - fifth lead screw; 49 - first limit slide; 50 - sixth motor; 51 - sixth lead screw; 52 - second limit slide; 53 - stabilizing electric cylinder; 54 - stabilizing clamping frame. Detailed implementation manners

[0033] Example: As Figures 1 to 11 shown, a circuit board surface coater for circuit board production includes a base 1, an adsorption mechanism is arranged at one end of the base 1, and a clamping mechanism is arranged on the base 1 for clamping a circuit board; an operation mechanism is arranged on the base 1 and above the clamping mechanism, and the operation mechanism includes a processing box 13. An installation slide 30 is arranged inside the processing box 13, and an adhesion mechanism, a coating mechanism, a dust removal mechanism, and a UV curing mechanism are respectively arranged on the installation slide 30.

[0034] One end of the base 1 is provided with a first support plate 101, and the other end is provided with a second support plate 102. The adsorption mechanism is arranged on the top of the first support plate 101, and the working mechanism is arranged on the second support plate 102; the adsorption mechanism includes an electric cylinder 1 arranged on the first support plate 101, an adsorption mounting seat 3 is arranged on the telescopic rod of the electric cylinder 1, and an adsorption part 4 is arranged on the adsorption mounting seat 3; an installation frame 8 is arranged on the base 1 for supporting and positioning the circuit board.

[0035] The clamping mechanism includes a first motor 5, a first lead screw 6 and a first guide rod 7 arranged on the base 1. The first motor 5 is used to drive the first lead screw 6. A clamping slide seat 14 is movably arranged on the first lead screw 6 and the first guide rod 7. The clamping slide seat 14 forms a screw pair with the first lead screw 6. An angle motor 17 is arranged on the clamping slide seat 14, an angle gear 18 is arranged on the output shaft of the angle motor 17, and a rotating cylinder 15 is rotatably mounted on the clamping slide seat 14. The rotating cylinder 15 meshes with the angle gear 18. A first clamping electric cylinder 16 is arranged on the rotating cylinder 15. An angle seat 19 is arranged on the telescopic rod of the first clamping electric cylinder 16. A second clamping electric cylinder 20 is arranged on the angle seat 19. Clamping parts 21 are arranged on the telescopic rods at both ends of the second clamping electric cylinder 20.

[0036] A support mechanism is arranged on the second support plate 102. The support mechanism includes a fifth motor 47 and a fifth lead screw 48 arranged on the second support plate 102. The fifth motor 47 is used to drive the fifth lead screw 48; a first limit slide seat 49 is slidably mounted on the second support plate 102. The first limit slide seat 49 forms a screw pair with the fifth lead screw 48. A sixth motor 50 and a sixth lead screw 51 are arranged on the first limit slide seat 49. The sixth lead screw 51 is driven by the sixth motor 50. A second limit slide seat 52 is slidably mounted on the first limit slide seat 49. The second limit slide seat 52 forms a screw pair with the sixth lead screw 51. A stabilizing electric cylinder 53 is arranged on the second limit slide seat 52. Stabilizing clamping frames 54 are arranged on the telescopic rods at both ends of the stabilizing electric cylinder 53.

[0037] The working mechanism includes a second motor 9 and a second lead screw 10 disposed on the second support plate 102. The second motor 9 is used to drive the second lead screw 10. A processing carriage 11 is slidably mounted on the second support plate 102. The processing carriage 11 and the second lead screw 10 form a screw pair. A processing box 13 is fixedly connected to the processing carriage 11. A second electric cylinder 12 is disposed on the processing carriage 11. A scraping frame 22 is disposed on the telescopic rod of the second electric cylinder 12. The scraping frame 22 is located inside the processing box 13. A first rotating seat 25 and a second rotating seat 27 are rotatably mounted on the processing box 13. A third guide rod 28 and a third lead screw 29 are connected between the first rotating seat 25 and the second rotating seat 27. A third motor 26 is disposed on the first rotating seat 25. The third motor 26 is used to drive the third lead screw 29. A mounting slide 30 is movably disposed on the third guide rod 28 and the third lead screw 29. The mounting slide 30 and the third lead screw 29 form a screw pair. A position motor 24 is disposed outside the processing box 13. A position gear 23 is disposed on the output shaft of the position motor 24. The position gear 23 meshes with the first rotating seat 25. The adhesion mechanism, the coating mechanism, the dust removal mechanism, and the UV curing mechanism are disposed on the mounting slide 30.

[0038] The coating mechanism includes a coating electric cylinder 35 disposed on the mounting slide 30. A coating portion 36 is disposed on the telescopic rod of the coating electric cylinder 35. The dust removal mechanism includes a cleaning electric cylinder 33 disposed on the mounting slide 30. A cleaning portion 34 is disposed on the telescopic rod of the cleaning electric cylinder 33. The UV curing mechanism includes a curing electric cylinder 31 disposed on the mounting slide 30. A UV curing device 32 is disposed on the telescopic rod of the curing electric cylinder 31. The adhesion mechanism includes a detection electric cylinder 37 on the mounting slide 30. A support guide plate 38 is disposed on the telescopic rod of the detection electric cylinder 37. A winding motor 39 and a winding cylinder 40 are respectively disposed at both ends of the support guide plate 38. The winding cylinder 40 is driven by the winding motor 39. The winding cylinder 40 is used for winding and collecting the adhesion tape 41. A fourth motor 44, a fourth lead screw 42, and a fourth guide rod 43 are disposed on the support guide plate 38. The fourth motor 44 is used to drive the fourth lead screw 42. A rolling seat 45 is movably disposed on the fourth lead screw 42 and the fourth guide rod 43. A rolling cylinder 46 is disposed on the rolling seat 45. The rolling seat 45 and the fourth lead screw 42 form a screw pair.

[0039] Working principle: The circuit board is positioned and installed on the mounting frame 8. The adsorption mounting seat 3 is controlled to move by the first electric cylinder 2. The adsorption portion 4 adsorbs and lifts the circuit board. By the operation of the first motor 5, the first lead screw 6 rotates, that is, the clamping slide 14 slides and is located on the side of the circuit board. The clamping portion 21 is controlled by the second clamping electric cylinder 20 to clamp and position the circuit board and transfer it to the coating area.

[0040] Specifically, the circuit board is located below the processing box 13. When the second motor 9 works, the second lead screw 10 rotates, that is, the processing carriage 11 drives the processing box 13 to approach the surface of the circuit board. Dust removal treatment can be carried out on the surface of the circuit board first. That is, the cleaning cylinder 33 controls the movement of the cleaning part 34, and the cleaning part 34 performs dust removal operations. Further, when the angle motor 17 works, the rotating cylinder 15 flips, that is, drives the circuit board to flip, so as to realize the treatment of different surfaces.

[0041] Further, a coating operation is carried out on the circuit board. That is, the coating cylinder 35 controls the movement of the coating part 36, and the coating part 36 performs coating operations. When the third motor 26 works, the third lead screw 29 rotates, that is, the installation slide 30 moves, and the processing position can be changed. When the position motor 24 works, the first rotating base 25 can be driven to rotate, that is, the installation slide 30 is controlled to rotate, so as to realize the conversion of various processing operations.

[0042] After the coating is completed, the ultraviolet curing device 32 can be controlled to move by the curing cylinder 31, and the ultraviolet curing device 32 cures the coated surface. Subsequently, the strength of the coated surface can be detected, that is, it is detected whether the coating layer is stably attached to the circuit board. Specifically, the detection cylinder 37 controls the movement of the support guide plate 38, the adhesion surface on the adhesion tape 41 faces the circuit board, and the adhesion tape 41 abuts against the support guide plate 38. The winding cylinder 40 is controlled by the winding motor 39, and the adhesion surface of the adhesion tape 41 can be converted. The adhesion tape 41 contacts the coated surface on the circuit board to achieve adhesion. When the fourth motor 44 works, the fourth lead screw 42 rotates, and the rolling seat 45 slides, that is, the rolling cylinder 46 rolls and compresses the adhesion tape 41 to ensure firm adhesion. Further, to prevent the deformation of the circuit board during pulling, first, when the fifth motor 47 works, the fifth lead screw 48 rotates, and the first limiting slide 49 moves. When the sixth motor 50 works, the sixth lead screw 51 rotates, and the second limiting slide 52 slides, that is, the stable clamping frame 54 extends to the upper and lower sides of the circuit board. The stable clamping frame 54 is controlled by the stable cylinder 53 to clamp the adhesion detection area, that is, the adhesion area is located inside the stable clamping frame 54. That is, during pulling, the deformation of the circuit board can be prevented, and the coated surface is adhesively pulled by the adhesion tape 41 to detect whether the coating layer is stably attached to the circuit board. After the processing of the circuit board is completed, the processing box 13 can be controlled to move by the second cylinder 12, and the processing box 13 performs a scraping operation on the clamping area on the clamping part 21, so as to remove the coating material remaining on the clamping area of the clamping part 21 during coating, and avoid affecting the subsequent clamping effect after the coating material is cured.

[0043] The present invention is not limited to the above specific embodiments. Those skilled in the art can make various changes starting from the above concepts without creative labor, and all fall within the protection scope of the present invention.

Claims

1. A circuit board surface coating machine for circuit board production, including a base (1), and an adsorption mechanism is arranged at one end of the base (1), characterized in that: A clamping mechanism is provided on the base (1) for clamping a circuit board; an operating mechanism is provided on the base (1) and above the clamping mechanism. The operating mechanism includes a processing box (13). Inside the processing box (13), an installation slide base (30) is provided. On the installation slide base (30), an adhesion mechanism, a coating mechanism, a dust removal mechanism, and a UV curing mechanism are respectively provided. The coating mechanism includes a coating electric cylinder (35) provided on the installation slide base (30). A coating part (36) is provided on the telescopic rod of the coating electric cylinder (35); the dust removal mechanism includes a cleaning electric cylinder (33) provided on the installation slide base (30). A cleaning part (34) is provided on the telescopic rod of the cleaning electric cylinder (33); the UV curing mechanism includes a curing electric cylinder (31) provided on the installation slide base (30). An ultraviolet curing device (32) is provided on the telescopic rod of the curing electric cylinder (31). The adhesion mechanism includes a detection electric cylinder (37) on the installation slide base (30). A support guide plate (38) is provided on the telescopic rod of the detection electric cylinder (37). A winding motor (39) and a winding cylinder (40) are respectively provided at both ends of the support guide plate (38). The winding cylinder (40) is driven by the winding motor (39). The winding cylinder (40) is used for winding and collecting an adhesion tape (41); on the support guide plate (38), a motor four (44), a lead screw four (42), and a guide rod four (43) are provided. The motor four (44) is used for driving the lead screw four (42); a rolling seat (45) is movably arranged on the lead screw four (42) and the guide rod four (43). A rolling cylinder (46) is provided on the rolling seat (45), and the rolling seat (45) forms a screw pair with the lead screw four (42).

2. The circuit board surface coating machine for circuit board production according to claim 1, wherein: One end of the base (1) is provided with a support plate one (101), and the other end is provided with a support plate two (102). The adsorption mechanism is provided on the top of the support plate one (101), and the operating mechanism is provided on the support plate two (102); the adsorption mechanism includes an electric cylinder one (2) provided on the support plate one (101). An adsorption mounting seat (3) is provided on the telescopic rod of the electric cylinder one (2). An adsorption part (4) is provided on the adsorption mounting seat (3); an installation frame (8) is provided on the base (1) for supporting and positioning the circuit board.

3. A circuit board surface coating machine for circuit board production according to claim 1, characterized in that: The clamping mechanism includes a motor one (5), a lead screw one (6), and a guide rod one (7) provided on the base (1). The motor one (5) is used for driving the lead screw one (6). A clamping slide base (14) is movably arranged on the lead screw one (6) and the guide rod one (7). The clamping slide base (14) forms a screw pair with the lead screw one (6). An angle motor (17) is provided on the clamping slide base (14). An angle gear (18) is provided on the output shaft of the angle motor (17). A rotating cylinder (15) is rotatably mounted on the clamping slide base (14). The rotating cylinder (15) meshes with the angle gear (18). A clamping electric cylinder one (16) is provided on the rotating cylinder (15). An angle seat (19) is provided on the telescopic rod of the clamping electric cylinder one (16). A clamping electric cylinder two (20) is provided on the angle seat (19). Clamping parts (21) are provided on the telescopic rods at both ends of the clamping electric cylinder two (20).

4. A circuit board surface coating machine for circuit board production according to claim 2, characterized in that: A support mechanism is provided on the second support plate (102). The support mechanism includes a fifth motor (47) and a fifth lead screw (48) provided on the second support plate (102). The fifth motor (47) is used to drive the fifth lead screw (48). A first limit sliding seat (49) is slidably mounted on the second support plate (102). The first limit sliding seat (49) and the fifth lead screw (48) form a screw pair. A sixth motor (50) and a sixth lead screw (51) are provided on the first limit sliding seat (49). The sixth lead screw (51) is driven by the sixth motor (50). A second limit sliding seat (52) is slidably mounted on the first limit sliding seat (49). The second limit sliding seat (52) and the sixth lead screw (51) form a screw pair. A stabilizing electric cylinder (53) is provided on the second limit sliding seat (52). Stabilizing clamping brackets (54) are provided on the telescopic rods at both ends of the stabilizing electric cylinder (53).

5. The circuit board surface coating machine for circuit board production according to claim 2, wherein: The working mechanism includes a second motor (9) and a second lead screw (10) provided on the second support plate (102). The second motor (9) is used to drive the second lead screw (10). A processing sliding frame (11) is slidably mounted on the second support plate (102). The processing sliding frame (11) and the second lead screw (10) form a screw pair. A processing box (13) is fixedly connected to the processing sliding frame (11). A second electric cylinder (12) is provided on the processing sliding frame (11). A scraping frame (22) is provided on the telescopic rod of the second electric cylinder (12). The scraping frame (22) is located inside the processing box (13).

6. A circuit board surface coating machine for circuit board production according to claim 5, characterized in that: A first rotating seat (25) and a second rotating seat (27) are rotatably mounted on the processing box (13). A third guide rod (28) and a third lead screw (29) are connected between the first rotating seat (25) and the second rotating seat (27). A third motor (26) is provided on the first rotating seat (25). The third motor (26) is used to drive the third lead screw (29). A mounting sliding seat (30) is movably arranged on the third guide rod (28) and the third lead screw (29). The mounting sliding seat (30) and the third lead screw (29) form a screw pair. A position motor (24) is provided outside the processing box (13). A position gear (23) is provided on the output shaft of the position motor (24). The position gear (23) meshes with the first rotating seat (25). The adhesion mechanism, the coating mechanism, the dust removal mechanism, and the UV curing mechanism are provided on the mounting sliding seat (30).

7. A method for coating the surface of a circuit board used in circuit board production, which uses a circuit board surface coater for circuit board production as described in any one of the above claims 1-6, characterized in that: Including the following steps: S10: Adsorb and lift the circuit board, and clamp and transfer the circuit board to the coating area through the clamping mechanism; S20: The working mechanism moves above the circuit board to cover the surface of the circuit board; S30: Dust removal, coating, curing, and adhesion strength detection of the circuit board are performed through the working mechanism.

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