A pressing device for processing MiniLED printed circuit boards

Abstract

The present invention provides a pressing device for processing MiniLED printed circuit boards, which belongs to the technical field of circuit board processing. It comprises an equipment box, a control module is installed on one side of the surface of the equipment box, a discharge port is provided through one side of the surface of the equipment box, and a feed port is provided through the other surfaces of the equipment box, a hot pressing device is installed on the top of the inner wall of the equipment box, an oil cylinder is installed on one side of the bottom end of the inner wall of the equipment box, a mounting frame is installed on the top of the oil cylinder, and a conveyor belt group is installed on one side of the inner wall of the top of the mounting frame, the conveyor belts in the conveyor belt group are arranged in pairs up and down, and the material of the conveyor belts in the conveyor belt group is set to be a rubber and Teflon composite material. The present invention realizes the sequential loading and stacking of the inner core plates of the multi-layer circuit board by setting a loading component, and elastically limits the inner core plates of the circuit board by a sponge roller.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a pressing device for processing a MiniLED printed circuit board. Background Art

[0002] Printed circuit boards (PCBs), a crucial component of the electronics industry, are plate-like structures composed of an insulating substrate and conductive copper foil traces, used to achieve electrical connections between electronic components. Traditionally, they are manufactured by etching copper foil to form specific circuit patterns. Lamination involves heating and pressing several separate PCB sheets together to form a single sheet. Lamination methods are generally divided into dry and wet lamination. Wet lamination involves evenly applying glue to the PCB surface before heating and laminating. PCBs are the backbone of modern electronic systems, and their quality directly impacts the performance and stability of electronic products.

[0003] However, before the existing printed circuit boards are processed and pressed, the inner core boards of the multi-layer circuit boards need to be stacked in sequence. During this process, since the inner core boards of the circuit boards themselves have a certain elasticity and curvature, small cavities exist after the inner core boards of the multi-layer circuit boards are stacked. As a result, when the inner core boards of the multi-layer circuit boards are stacked and processed and pressed, the pressing processing effect of the inner core boards of the multi-layer circuit boards is affected. Therefore, the present application provides a pressing device for MiniLED printed circuit board processing to meet the needs. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a pressing device for processing MiniLED printed circuit boards to solve the problem that before the existing printed circuit boards are processed and pressed, the inner core boards of the multi-layer circuit boards need to be stacked in sequence. In this process, since the inner core boards of the circuit boards themselves have certain elasticity and curvature, small cavities exist after the inner core boards of the multi-layer circuit boards are stacked, which affects the pressing processing effect of the inner core boards of the multi-layer circuit boards when the inner core boards of the multi-layer circuit boards are processed and pressed after being stacked.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A pressing device for processing MiniLED printed circuit boards, comprising an equipment box, a control module installed on one side of the surface of the equipment box, a discharge port provided through one side of the surface of the equipment box, a feed port provided through the other surfaces of the equipment box, a hot pressing device installed on the top of the inner wall of the equipment box, an oil cylinder installed on one side of the inner wall bottom of the equipment box, a mounting frame installed on the top of the oil cylinder, a conveyor belt group installed on one side of the inner wall of the top of the mounting frame, the conveyor belts in the conveyor belt group are arranged in pairs up and down, and the material of the conveyor belts in the conveyor belt group is set to A rubber and Teflon composite material, a motor is installed at the center of the bottom end of the inner wall of the equipment box; a loading assembly is installed on the top of the oil cylinder, and the loading assembly is used to load and stack the inner core plates of the circuit board in sequence; a smearing assembly is installed on one side of the mounting frame, and the smearing assembly is used to apply glue to the copper plates in the inner core plates of the circuit board; a smoothing assembly is installed on one side of the smearing assembly, and the smoothing assembly is used to smooth the glue accumulated near the bottom of one group of sponge rollers in the smearing assembly; the smearing assembly is located on the outside of the loading assembly, and the smoothing assembly is located on one side of the smearing assembly.

[0007] Optionally, the loading assembly includes a pressing base plate, the pressing base plate is installed on the top of the motor, a positioning frame is installed on the side of the pressing base plate, a screw is installed on one side of the pressing base plate, and a first flat gear is installed at the bottom end of the screw.

[0008] Optionally, the loading assembly also includes a gear ring, which is installed at the bottom end of the inner wall of the equipment box. The threaded sleeve on the outer surface of the screw is provided with an auxiliary pressure plate. The inner wall of the auxiliary pressure plate is in contact with the surface of the positioning frame. Multiple groups of elastic telescopic rods are installed at the bottom edge of the auxiliary pressure plate, and the bottom ends of the multiple groups of elastic telescopic rods are all installed at the edge of the positioning frame.

[0009] Optionally, a spring is installed on one side of the bottom end of the auxiliary pressure plate, and the bottom end of the spring is elastically connected to a sponge roller. The sponge material in the sponge roller is set to polyurethane material, and the number of sponge rollers is set to two groups, and both groups of sponge rollers are installed at the bottom end of the auxiliary pressure plate.

[0010] Optionally, the smearing assembly includes a motor, which is mounted on a side surface of the mounting frame, and one end of the motor is connected to a sponge roller. The number of the sponge rollers is set to two groups, and the two groups of sponge rollers are mounted on the inner wall of one side of the top of the mounting frame. One end of the sponge roller in one group of the two groups of sponge rollers extends out of the inner wall of the top of the mounting frame and is connected to the motor, and the sponge material in the sponge roller is set to melamine material.

[0011] Optionally, a first pulley set is connected between the other ends of the two sponge rollers extending out of the inner wall part of the top end of the installation frame. The surfaces of the other ends of the two sponge rollers extending out of the inner wall part of the top end of the installation frame are both sleeved with a second pulley set. One of the pulley inner walls in the two second pulley sets is sleeved with a reciprocating screw rod, and the reciprocating screw rod is installed on the inner wall of one side of the top end of the installation frame.

[0012] Optionally, sliding bases are threadedly sleeved on the outer surfaces of the two reciprocating screw rods. The bottom end of one of the two sliding bases is in contact with the top surface of one of the sponge rollers, and the top end of the other sliding base in the two sliding bases is in contact with the bottom surface of the other sponge roller. Dripping pipes are sleeved in the inner cavities of the two sliding bases, and one end part of the dripping pipe is sleeved on the inner wall of one side of the top end of the installation frame.

[0013] Optionally, the leveling component includes a rotating rod, the rotating rod is installed on one side of one of the two sliding bases, a second spur gear is installed at the top end of the rotating rod, a rack is meshed on one side of the second spur gear, and the rack is installed on the inner wall of the other side of the top end of the installation frame.

[0014] Optionally, the bottom end of the rotating rod is rotatably installed with a mounting disc, a rubber column group is installed on the side surface of the mounting disc, the number of the rubber column groups is set to be multiple groups, and the multiple rubber column groups are arranged in an equiangular circular array on the side surface of the mounting disc.

[0015] Optionally, the rubber columns in the rubber column group are arranged in a "pin" shape, and the material of the rubber columns in the rubber column group is set to nitrile rubber.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] In the above scheme, by setting a feeding component, the rotation angle of the pressing base plate is adjusted by the rotation cooperation of the pressing base plate and the motor. By changing the rotation angle of the pressing base plate and cooperating with the conveyor belt group to convey the inner core plate of the circuit board, the inner core plates of the multi-layer circuit board are sequentially loaded and stacked, thereby improving the accuracy of stacking the inner core plates of the multi-layer circuit board. At the same time, through the rotation cooperation between the screw, the first flat gear and the gear ring, the height of the auxiliary pressing plate is adjusted in real time, so that the height of the auxiliary pressing plate can synchronously adapt to the stacking height of the inner core plates of the multi-layer circuit board. At the same time, by elastically installing a spring and The sponge roller forms a buffer stroke at the bottom end of the auxiliary pressing plate. When the inner core plates of the circuit boards are inserted one by one, the sponge roller elastically limits the inner core plates of the stacked circuit boards before inserting the inner core plates of the next layer of circuit boards, thereby avoiding the existence of small cavities between the inner core plates of the stacked circuit boards. At the same time, the polyurethane material has the characteristic of high flexibility. When the inner core plates of the stacked circuit boards are further inserted into the top of the inner core plates of the stacked circuit boards, damage to the top surface of the inner core plates of the circuit boards is avoided, thereby ensuring the yield rate of the inner core plates of the multi-layer circuit boards during processing and pressing after stacking.

[0018] By setting up a smearing component, by setting up two groups of sponge rollers, and cooperating with the two groups of conveyor belts arranged up and down in the conveyor belt group, when the copper plates in the inner core plate of the multi-layer circuit board are stacked and loaded, the two groups of sponge rollers are rotated to contact the top and bottom of the copper plates, and at the same time, the rotation cooperation between the reciprocating screw rod and the sliding base is utilized to realize the reciprocating sliding of the sliding base on the top and bottom surfaces of the two groups of sponge rollers respectively. At the same time, by specially designing a cavity in the sliding base, when the dropper smears glue on the surface of the sponge roller, the sliding base contacts the top and bottom surfaces of the sponge roller. The two sets of sponge rollers are fitted at different positions to ensure that the dropper can fully apply glue to the surface of the two sets of sponge rollers. At the same time, the rotation effect between the two sets of sponge rollers can achieve the application effect on the top and bottom sides of the copper plate. At the same time, through the rotation coordination with the conveyor belt group, two-way limiting is achieved in the forward direction of the copper plate, ensuring the stability of the copper plate when stacking while ensuring the effect of applying glue to the copper plate. At the same time, the excellent non-stickiness of the rubber and Teflon composite material is used to avoid secondary adhesion of the conveyor belt group when conveying the steel plate, thereby preventing secondary damage to the glue coating on the surface of the copper plate.

[0019] By setting up a smoothing component, utilizing the linkage cooperation of the rotating rod, the second flat gear and the rack, and utilizing the reciprocating sliding force of the sliding base, the rotation effect of the mounting plate and the rubber column group is achieved, and utilizing the rotating surface formed when multiple groups of rubber column groups rotate, multiple groups of rubber column groups are passed through the contact position between one group of sponge rollers and the top surface of the copper plate in turn, and multiple groups of rubber column groups are used to break up and level the glue accumulated there, so as to avoid the glue from accumulating for a long time at the contact position between the sponge roller and the top surface of the copper plate, and to avoid the glue from sticking after long-term accumulation, resulting in poor rotation of the sponge roller, thereby avoiding interference when applying glue to the surface of the copper plate, further ensuring the application effect of the sponge roller when applying glue to the surface of the copper plate, and at the same time avoiding the glue after long-term accumulation and adhesion to cause secondary interference to the feeding and conveying of the next group of copper plates, thereby preventing the copper plates from being offset during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, further serve to explain the principles of the invention and to enable one skilled in the art to make and use the invention.

[0021] Figure 1 This is a schematic diagram of the structure of a pressing device for MiniLED printed circuit board processing;

[0022] Figure 2 A schematic diagram of the side cross-section structure of a pressing device for MiniLED printed circuit board processing;

[0023] Figure 3 It is a schematic diagram of the structure of some components of the loading component;

[0024] Figure 4 for Figure 3 A magnified view of middle A;

[0025] Figure 5 Schematic diagram of the loading component structure;

[0026] Figure 6 Schematic diagram of the auxiliary pressure plate, spring and sponge roller structure;

[0027] Figure 7 Schematic diagram of the overall structure of the smear component;

[0028] Figure 8 It is a schematic diagram of the structure of some components of the smear component;

[0029] Figure 9 Schematic diagram of the smear component structure;

[0030] Figure 10 It is a schematic diagram of a partial cross-section of the coating assembly and the sliding base;

[0031] Figure 11It is a schematic diagram of the structure of the leveling component;

[0032] Figure 12 for Figure 11 Enlarged view of middle B;

[0033] Figure 13 This is a schematic diagram of the structure of some components of the leveling component.

[0034] Reference numerals:

[0035] 1. Equipment box; 2. Control module; 3. Discharge port; 4. Feed port; 5. Hot pressing equipment; 6. Cylinder; 7. Mounting frame; 70. Conveyor belt group; 8. Motor; 9. Loading assembly; 91. Pressing base plate; 92. Positioning frame; 93. Screw; 94. First flat gear; 95. Gear ring; 96. Auxiliary pressure plate; 97. Elastic telescopic rod; 98. Spring; 99. Sponge roller; 10. Smearing assembly; 101. Motor; 102. Sponge roller; 103. First pulley group; 104. Second pulley group; 105. Reciprocating screw; 106. Sliding base; 107. Dropper; 11. Smoothing assembly; 111. Rotating rod; 112. Second flat gear; 113. Rack; 114. Mounting plate; 115. Rubber column group.

[0036] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments. DETAILED DESCRIPTION

[0037] The following describes in detail a MiniLED printed circuit board lamination device provided by the present invention, with reference to the accompanying drawings and specific embodiments. It is also noted that, for the sake of completeness, the following embodiments are optimal and preferred embodiments, and those skilled in the art may employ alternative implementations for known technologies. Furthermore, the accompanying drawings are intended only to provide a more detailed description of the embodiments and are not intended to limit the present invention.

[0038] It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiments," "some embodiments," etc. indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment will include such specific features, structures, or characteristics. Furthermore, when specific features, structures, or characteristics are described in conjunction with an embodiment, it is within the knowledge of persons skilled in the relevant art to implement such features, structures, or characteristics in conjunction with other embodiments (whether or not explicitly described).

[0039] In general, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0040] It will be understood that the meanings of “on,” “over,” and “above” in the present invention should be interpreted in the broadest manner, so that “on” means not only “directly on” something but also includes the meaning of being “on” something with intervening features or layers, and “on” or “above” means not only “on” or “above” something but also includes the meaning of being “on” or “above” something with no intervening features or layers.

[0041] Additionally, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as illustrated in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein should be similarly interpreted accordingly.

[0042] like Figures 1 to 13As shown, an embodiment of the present invention provides a pressing device for processing MiniLED printed circuit boards, including a device box 1, a control module 2 is installed on one side of the surface of the device box 1, a discharge port 3 is provided on one side of the surface of the device box 1, and a feed port 4 is provided on the other surface of the device box 1. A hot pressing device 5 is installed on the top of the inner wall of the device box 1, a cylinder 6 is installed on one side of the bottom end of the inner wall of the device box 1, a mounting frame 7 is installed on the top of the cylinder 6, and a conveyor belt group 70 is installed on one side of the inner wall of the top of the mounting frame 7. It is characterized in that the conveyor belts in the conveyor belt group 70 are arranged in pairs up and down, and the conveyor belts in the conveyor belt group 70 are arranged in pairs up and down. The material is set to be a rubber and Teflon composite material. A motor 8 is installed at the center of the bottom end of the inner wall of the equipment box 1. A loading component 9 is installed on the top of the oil cylinder 6. The loading component 9 is used to load and stack the inner core plates of the circuit board in sequence. A coating component 10 is installed on one side of the installation frame 7. The coating component 10 is used to apply glue to the copper plate in the inner core plate of the circuit board. A smoothing component 11 is installed on one side of the coating component 10. The smoothing component 11 is used to smooth the glue accumulated near the bottom of one group of sponge rollers 102 in the coating component 10. The coating component 10 is located on the outside of the loading component 9, and the smoothing component 11 is located on one side of the coating component 10.

[0043] By setting up the loading component 9, the inner core boards of the multi-layer circuit board can be loaded and stacked in sequence, thereby improving the accuracy of stacking the inner core boards of the multi-layer circuit board. By setting up the smearing component 10, the sliding base 106 is fitted when it contacts the top and bottom surfaces of the sponge roller 102 at two different positions, ensuring that the dropper 107 can fully apply glue to the surfaces of the two groups of sponge rollers 102. By setting up the leveling component 11, multiple groups of rubber column groups 115 are used to break up and level the glue accumulated here, thereby avoiding the glue from accumulating for a long time at the contact position between the sponge roller 102 and the top surface of the copper plate.

[0044] like Figures 3 to 6 As shown, the feeding assembly 9 includes a pressing base plate 91, which is mounted on the top of the motor 8, and a positioning frame 92 is mounted on the side of the pressing base plate 91. A screw 93 is mounted on one side of the pressing base plate 91, and a first flat gear 94 is mounted on the bottom end of the screw 93. The feeding assembly 9 also includes a gear ring 95, which is mounted on the bottom end of the inner wall of the equipment box 1. An auxiliary pressure plate 96 is provided on the outer surface of the screw 93, and the inner wall of the auxiliary pressure plate 96 contacts the surface of the positioning frame 92. Multiple groups of elastic telescopic rods 97 are installed at the bottom edge of the auxiliary pressure plate 96, and the bottom ends of the multiple groups of elastic telescopic rods 97 are all mounted on the edge of the positioning frame 92. A spring 98 is installed on one side of the bottom end of the auxiliary pressure plate 96, and the bottom end of the spring 98 is elastically connected to a sponge roller 99. The sponge material in the sponge roller 99 is set to polyurethane material, and the number of sponge rollers 99 is set to two groups, and the two groups of sponge rollers 99 are both mounted on the bottom end of the auxiliary pressure plate 96.

[0045] The operator first starts the multiple conveyor belt groups 70 on the inner wall of the top end of the installation frame 7 through the control module 2. At this time, the top surface of the conveyor belt at the bottom position in the conveyor belt group 70 is in the same axial direction as the pressing base plate 91. Then the operator sends the inner core plate of the circuit board into one of the conveyor belt groups 70. Under the rotation action of the two conveyor belts in the conveyor belt group 70, the two conveyor belts in the conveyor belt group 70 respectively adhere to the top and bottom ends of the inner core plate of the circuit board and rotate. Under the continuous rotation action of one of the conveyor belt groups 70, the inner core plate of the circuit board slides, and the inner core plate of the circuit board approaches and contacts the top surface of the pressing base plate 91 while sliding.

[0046] When the inner core plate of the circuit board slides close to the pressing base plate 91, the top of the inner core plate of the circuit board contacts the two groups of sponge rollers 99 at the bottom of the auxiliary pressing plate 96 in turn. Under the continuous sliding action of the inner core plate of the circuit board, the inner core plate of the circuit board contacts and pushes the sponge roller 99 to slide upward. While the sponge roller 99 slides, it pushes the spring 98 to contract. One group of conveyor belt groups 70 continues to push the inner core plate of the circuit board to slide, so that the two sides and one end of the inner core plate of the circuit board contact and slide against the inner wall of the positioning frame 92. When the inner core plate of the circuit board slides into place, the elastic action of the springs 98 on both sides of the two groups of sponge rollers 99 makes the bottom ends of the two groups of sponge rollers 99 closely contact the top surface of the inner core plate of the circuit board, thereby realizing continuous positioning of the inner core plate of the circuit board.

[0047] When the inner core board of the first layer of the circuit board is placed, the control module 2 controls the motor 8 to start. After the motor 8 is started, it drives the pressing base plate 91 to rotate 90 degrees, so that the opening of the positioning frame 92 is aligned with the next group of conveyor belt groups 70. While the pressing base plate 91 rotates, it drives the first flat gear 94 to pass through and engage the gear ring 95. Under the action of the gear ring 95, the first flat gear 94 rotates. While the first flat gear 94 rotates, it drives the screw 93 to rotate synchronously. Under the rotation action of the screw 93, the auxiliary pressure plate 96 slides in the direction of the screw 93, so that the sliding distance of the auxiliary pressure plate 96 is equal to the thickness of the inner core board of the circuit board. At the same time, in this process, through the elastic action of the spring 98, the bottom ends of the two groups of sponge rollers 99 are kept in contact with the top of the inner core of the circuit board.

[0048] At the same time, the control module 2 controls the oil cylinder 6 to start, and after the oil cylinder 6 is started, it drives the installation frame 7 to slide upward. While the installation frame 7 slides, it drives the multiple groups of conveyor belt groups 70 on the top inner wall to slide upward synchronously. The installation frame 7 drives the multiple groups of conveyor belt groups 70 on the top inner wall to slide a distance equal to the thickness of the inner core board of the circuit board, so that the top surface of the conveyor belt at the bottom position in the conveyor belt group 70 and the top surface of the inner core board of the circuit board placed on the top of the pressing base plate 91 are in the same axial direction.

[0049] By setting the rotation coordination of the pressing base plate 91 and the motor 8, the rotation angle of the pressing base plate 91 can be adjusted. By changing the rotation angle of the pressing base plate 91 and coordinating the lamination conveyance of the inner core plate of the circuit board by the conveyor belt group 70, the inner core plates of the multi-layer circuit board can be loaded and stacked in sequence, thereby improving the accuracy of stacking the inner core plates of the multi-layer circuit board.

[0050] like Figures 7 to 10 As shown, the smearing assembly 10 includes a motor 101, which is mounted on the surface of one side of the mounting frame 7, and one end of the motor 101 is connected to a sponge roller 102. The number of sponge rollers 102 is set to two groups, and the two groups of sponge rollers 102 are mounted on the inner wall of one side of the top of the mounting frame 7. One end of one of the two groups of sponge rollers 102 extends out of the inner wall of the top of the mounting frame 7 and is connected to the motor 101. The sponge material in the sponge roller 102 is set to melamine material. The other ends of the two groups of sponge rollers 102 extend out of the inner wall of the top of the mounting frame 7, and a first pulley group 103 is connected between the two groups of sponge rollers 102. The other ends of the two groups of sponge rollers 102 extend out of the inner wall of the top of the mounting frame 7. The surfaces are all sleeved with a second pulley group 104, and the inner wall of one of the two groups of second pulley groups 104 is sleeved with a reciprocating screw rod 105, which is installed on the inner wall of one side of the top of the mounting frame 7. The outer surfaces of the two groups of reciprocating screw rods 105 are threadedly sleeved with a sliding base 106, and the bottom end of one of the two groups of sliding bases 106 contacts the top surface of one group of sponge rollers 102, and the top of the other group of sliding bases 106 contacts the bottom surface of the other group of sponge rollers 102, and the internal cavity of the two groups of sliding bases 106 is sleeved with a dropper 107, and the surface of one end portion of the dropper 107 is sleeved on the inner wall of one side of the top of the mounting frame 7.

[0051] Similarly, the above steps are repeated in sequence to realize the sequential loading and stacking of the inner core plates of the multi-layer circuit board. At the same time, when the copper plates in the inner core plates of the multi-layer circuit board are loaded and stacked, when the copper plates enter the loading and stacking through one of the conveyor belt groups 70, before the copper plates are placed in the cavity between the two conveyor belts in one of the conveyor belt groups 70, the control module 2 controls the motor 101 to start. After the motor 101 is started, it drives one of the groups of sponge rollers 102 to rotate synchronously. While this group of sponge rollers 102 rotates, it drives another group of sponge rollers 102 to rotate synchronously through the first pulley group 103, so that the two groups of sponge rollers 102 respectively contact the top and bottom surfaces of the copper plates and rotate in contact.

[0052] As the sponge roller 102 rotates, the reciprocating screw 105 is driven to rotate synchronously through the second pulley set 104. Under the rotation of the reciprocating screw 105, the sliding base 106 threaded on the outer surface of the reciprocating screw 105 slides back and forth along the direction of the reciprocating screw 105. The sliding base 106 drives the dropper 107 to rotate synchronously while sliding. At the same time, the operator continuously pumps glue into the dropper 107 through the pumping equipment, so that the glue is continuously squeezed out of the dropper 107.

[0053] After the glue in the dropper 107 in the inner cavity of one set of sliding bases 106 is squeezed out, the glue drips onto the surface of one set of sponge rollers 102 under the action of gravity and the continuous pumping of the pumping device. At the same time, the reciprocating sliding effect of the sliding base 106 makes the surface of one set of sponge rollers 102 full of glue.

[0054] After the glue in the dropper 107 in the internal cavity of the other set of sliding bases 106 is squeezed out, the squeezed glue accumulates in the internal cavity of the sliding base 106 under the continuous pumping action of the pumping equipment. Since the top of this set of sliding bases 106 is in contact with the bottom surface of the other set of sponge rollers 102, the reciprocating sliding action of the sliding base 106 makes the surface of the other set of sponge rollers 102 full of glue.

[0055] When the surfaces of the two groups of sponge rollers 102 are filled with glue, the operator will feed the copper plates into the conveyor belt group 70 on one side of the two groups of sponge rollers 102 through the feeding port 4, and through the rotation of the conveyor belt group 70, the copper plates will be transported to the top position of the pressing base plate 91 for stacking.

[0056] By setting up two groups of sponge rollers 102 and cooperating with the two groups of conveyor belts arranged above and below in the conveyor belt group 70, when the copper plates in the inner core plates of the multi-layer circuit board are stacked and loaded, the two groups of sponge rollers 102 rotate to contact the top and bottom ends of the copper plates, and the sliding base 106 contacts the top and bottom surfaces of the sponge rollers 102 at two different positions for bonding, ensuring that the dropper 107 can fully apply glue to the surfaces of the two groups of sponge rollers 102.

[0057] like Figures 11 to 13As shown in the figure, the leveling component 11 includes a rotating rod 111. The rotating rod 111 is installed on one side of one of the two sliding bases 106. At the top of the rotating rod 111, a second spur gear 112 is installed. On one side of the second spur gear 112, a rack 113 is engaged. The rack 113 is installed on the other side of the inner wall at the top of the installation frame 7. At the bottom of the rotating rod 111, a mounting disc 114 is rotatably installed. On the side of the mounting disc 114, a rubber column group 115 is installed. The number of the rubber column groups 115 is set to be multiple groups. The multiple groups of rubber column groups 115 are arranged in an equiangular circular array on the side of the mounting disc 114. The rubber columns in the rubber column group 115 are arranged in a "pin" shape. The material of the rubber columns in the rubber column group 115 is set to be nitrile rubber.

[0058] At the same time, when the sliding base 106 reciprocates and applies glue to the surface of the sponge roller 102 through the dropper 107, one of the sliding bases 106 drives the rotating rod 111 and the second spur gear 112 at the top of the rotating rod 111 to slide synchronously. While the second spur gear 112 slides, it meshes with the rack 113. Under the action of the rack 113, the second spur gear 112 rotates. While the second spur gear 112 rotates, it drives the mounting disc 114 at the bottom through the rotating rod 111 to rotate synchronously. While the mounting disc 114 rotates, it drives the multiple groups of rubber column groups 115 to rotate synchronously. While the rubber column group 115 rotates, the rubber columns at the top position in the rubber column group 115 contact the surface of one of the sponge rollers 102. At the same time, while the rubber column group 115 rotates, it disperses and levels the glue accumulated at the contact position between the bottom of one of the sponge rollers 102 and the copper plate, avoiding glue accumulation.

[0059] After all the inner core boards of the circuit boards are stacked, the control module 2 controls the hot pressing device 5 to start, and the hot pressing device 5 hot presses the sequentially stacked inner core boards of the circuit boards to complete the processing and pressing of the printed circuit board.

[0060] By setting the linkage cooperation of the rotating rod 111, the second spur gear 112 and the rack 113, and using the acting force of the reciprocating sliding of the sliding base 106, the rotating effect of the mounting disc 114 and the rubber column group 115 is realized. By using the rotating surface formed when the multiple groups of rubber column groups 115 rotate, when the multiple groups of rubber column groups 115 pass through the contact position between one of the sponge rollers 102 and the top surface of the copper plate in sequence, the multiple groups of rubber column groups 115 are used to disperse and sweep the glue accumulated here, avoiding the glue from accumulating at the contact position between the sponge roller 102 and the top surface of the copper plate for a long time.

[0061] The working principle of the technical solution provided by the present invention is as follows:

[0062] The operator first starts the multiple conveyor belt groups 70 on the inner wall of the top end of the installation frame 7 through the control module 2. At this time, the top surface of the conveyor belt at the bottom position in the conveyor belt group 70 is in the same axial direction as the pressing base plate 91. Then the operator sends the inner core plate of the circuit board into one of the conveyor belt groups 70. Under the rotation action of the two conveyor belts in the conveyor belt group 70, the two conveyor belts in the conveyor belt group 70 respectively adhere to the top and bottom ends of the inner core plate of the circuit board and rotate. Under the continuous rotation action of one of the conveyor belt groups 70, the inner core plate of the circuit board slides, and the inner core plate of the circuit board approaches and contacts the top surface of the pressing base plate 91 while sliding.

[0063] When the inner core plate of the circuit board slides close to the pressing base plate 91, the top of the inner core plate of the circuit board contacts the two groups of sponge rollers 99 at the bottom of the auxiliary pressing plate 96 in turn. Under the continuous sliding action of the inner core plate of the circuit board, the inner core plate of the circuit board contacts and pushes the sponge roller 99 to slide upward. While the sponge roller 99 slides, it pushes the spring 98 to contract. One group of conveyor belt groups 70 continues to push the inner core plate of the circuit board to slide, so that the two sides and one end of the inner core plate of the circuit board contact and slide against the inner wall of the positioning frame 92. When the inner core plate of the circuit board slides into place, the elastic action of the springs 98 on both sides of the two groups of sponge rollers 99 makes the bottom ends of the two groups of sponge rollers 99 closely contact the top surface of the inner core plate of the circuit board, thereby realizing continuous positioning of the inner core plate of the circuit board.

[0064] When the inner core board of the first layer of the circuit board is placed, the control module 2 controls the motor 8 to start. After the motor 8 is started, it drives the pressing base plate 91 to rotate 90 degrees, so that the opening of the positioning frame 92 is aligned with the next group of conveyor belt groups 70. While the pressing base plate 91 rotates, it drives the first flat gear 94 to pass through and engage the gear ring 95. Under the action of the gear ring 95, the first flat gear 94 rotates. While the first flat gear 94 rotates, it drives the screw 93 to rotate synchronously. Under the rotation action of the screw 93, the auxiliary pressure plate 96 slides in the direction of the screw 93, so that the sliding distance of the auxiliary pressure plate 96 is equal to the thickness of the inner core board of the circuit board. At the same time, in this process, through the elastic action of the spring 98, the bottom ends of the two groups of sponge rollers 99 are kept in contact with the top of the inner core of the circuit board.

[0065] At the same time, the control module 2 controls the oil cylinder 6 to start, and after the oil cylinder 6 is started, it drives the installation frame 7 to slide upward. While the installation frame 7 slides, it drives the multiple groups of conveyor belt groups 70 on the top inner wall to slide upward synchronously. The installation frame 7 drives the multiple groups of conveyor belt groups 70 on the top inner wall to slide a distance equal to the thickness of the inner core board of the circuit board, so that the top surface of the conveyor belt at the bottom position in the conveyor belt group 70 and the top surface of the inner core board of the circuit board placed on the top of the pressing base plate 91 are in the same axial direction.

[0066] Similarly, the above steps are repeated in sequence to realize the sequential loading and stacking of the inner core plates of the multi-layer circuit board. At the same time, when the copper plates in the inner core plates of the multi-layer circuit board are loaded and stacked, when the copper plates enter the loading and stacking through one of the conveyor belt groups 70, before the copper plates are placed in the cavity between the two conveyor belts in one of the conveyor belt groups 70, the control module 2 controls the motor 101 to start. After the motor 101 is started, it drives one of the groups of sponge rollers 102 to rotate synchronously. While this group of sponge rollers 102 rotates, it drives another group of sponge rollers 102 to rotate synchronously through the first pulley group 103, so that the two groups of sponge rollers 102 respectively contact the top and bottom surfaces of the copper plates and rotate in contact.

[0067] As the sponge roller 102 rotates, the reciprocating screw 105 is driven to rotate synchronously through the second pulley set 104. Under the rotation of the reciprocating screw 105, the sliding base 106 threaded on the outer surface of the reciprocating screw 105 slides back and forth along the direction of the reciprocating screw 105. The sliding base 106 drives the dropper 107 to rotate synchronously while sliding. At the same time, the operator continuously pumps glue into the dropper 107 through the pumping equipment, so that the glue is continuously squeezed out of the dropper 107.

[0068] After the glue in the dropper 107 in the inner cavity of one set of sliding bases 106 is squeezed out, the glue drips onto the surface of one set of sponge rollers 102 under the action of gravity and the continuous pumping of the pumping device. At the same time, the reciprocating sliding effect of the sliding base 106 makes the surface of one set of sponge rollers 102 full of glue.

[0069] After the glue in the dropper 107 in the internal cavity of the other set of sliding bases 106 is squeezed out, the squeezed glue accumulates in the internal cavity of the sliding base 106 under the continuous pumping action of the pumping equipment. Since the top of this set of sliding bases 106 is in contact with the bottom surface of the other set of sponge rollers 102, the reciprocating sliding action of the sliding base 106 makes the surface of the other set of sponge rollers 102 full of glue.

[0070] When the surfaces of the two groups of sponge rollers 102 are filled with glue, the operator will feed the copper plates into the conveyor belt group 70 on one side of the two groups of sponge rollers 102 through the feeding port 4, and through the rotation of the conveyor belt group 70, the copper plates will be transported to the top position of the pressing base plate 91 for stacking.

[0071] At the same time, when the sliding base 106 slides back and forth and applies glue to the surface of the sponge roller 102 through the dropper 107, one group of sliding bases 106 drives the rotating rod 111 and the second flat gear 112 at the top of the rotating rod 111 to slide synchronously, and the second flat gear 112 slides and engages the rack 113. Under the action of the rack 113, the second flat gear 112 rotates. When the second flat gear 112 rotates, the mounting plate 114 at the bottom is driven to rotate synchronously through the rotating rod 111. When the mounting plate 114 rotates, it drives multiple groups of rubber column groups 115 to rotate synchronously. When the rubber column group 115 rotates, the rubber column at the top position of the rubber column group 115 contacts the surface of one group of sponge rollers 102. At the same time, when the rubber column group 115 rotates, the glue accumulated at the contact point between the bottom of one group of sponge rollers 102 and the copper plate is broken up and smoothed to avoid glue accumulation.

[0072] When all the inner core boards of the circuit boards are stacked, the control module 2 controls the hot pressing device 5 to start, and the hot pressing device 5 performs hot pressing molding on the inner core boards of the circuit boards stacked in sequence, completing the processing and pressing of the printed circuit boards.

[0073] The present invention encompasses any alternatives, modifications, equivalents, and solutions that fall within the spirit and scope of the present invention. To provide a thorough understanding of the present invention, specific details are described in detail below in connection with the preferred embodiments of the present invention, but those skilled in the art will be able to fully understand the present invention without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of the present invention, well-known methods, processes, procedures, components, and circuits have not been described in detail.

[0074] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A pressing device for processing MiniLED printed circuit boards, comprising a device housing, characterized in that: A control module is installed on one side of the surface of the equipment box, a discharge port is provided on one side of the surface of the equipment box, and a feed port is provided on the other surfaces of the equipment box. A hot pressing device is installed on the top of the inner wall of the equipment box, an oil cylinder is installed on one side of the bottom end of the inner wall of the equipment box, a mounting frame is installed on the top end of the oil cylinder, a conveyor belt group is installed on one side of the inner wall of the top end of the mounting frame, and the conveyor belts in the conveyor belt group are arranged in groups of two up and down, and a motor is installed at the center of the bottom end of the inner wall of the equipment box; A loading assembly is installed on the top of the oil cylinder, and the loading assembly is used to load and stack the inner core boards of the circuit board in sequence; A smearing assembly is installed on one side of the mounting frame, and the smearing assembly is used to apply glue to the copper plate in the inner core plate of the circuit board; A smoothing component is installed on one side of the smearing component, and the smoothing component is used to smooth the glue accumulated near the bottom of one group of sponge rollers in the smearing component; The smearing assembly is located outside the feeding assembly, and the smoothing assembly is located on one side of the smearing assembly; The smearing assembly includes a motor, which is mounted on a side surface of the mounting frame, and one end of the motor is connected to a sponge roller. The number of the sponge rollers is set to two groups, and the two groups of sponge rollers are mounted on the inner wall of one side of the top of the mounting frame. One end of one of the two groups of sponge rollers extends out of the inner wall of the top of the mounting frame and is connected to the motor. The sponge material in the sponge roller is set to be melamine material; The other ends of the two groups of sponge rollers extend out of the inner wall portion of the top of the mounting frame, and a first pulley group is connected between them. The other ends of the two groups of sponge rollers extend out of the inner wall portion of the top of the mounting frame, and a second pulley group is sleeved on the surface of each of the two groups of sponge rollers. A reciprocating screw is sleeved on the inner wall of one group of the pulleys in the two groups of the second pulley groups, and the reciprocating screw is mounted on the inner wall of one side of the top of the mounting frame; The outer surfaces of the two groups of reciprocating screw rods are threadedly sleeved with sliding bases, the bottom end of one of the two groups of sliding bases is in contact with the top surface of one group of sponge rollers, and the top end of the other group of sliding bases is in contact with the bottom surface of the other group of sponge rollers. A dropper is sleeved in the internal cavity of the two groups of sliding bases, and the surface of one end of the dropper is sleeved on the inner wall of one side of the top of the mounting frame.

2. The MiniLED printed circuit board processing pressing device according to claim 1, characterized in that: The feeding assembly includes a pressing base plate, which is installed on the top of the motor, a positioning frame is installed on the side of the pressing base plate, a screw is installed on one side of the pressing base plate, and a first flat gear is installed on the bottom end of the screw.

3. The MiniLED printed circuit board processing pressing device according to claim 2, characterized in that: The feeding assembly also includes a gear ring, which is installed at the bottom end of the inner wall of the equipment box. The threaded sleeve on the outer surface of the screw is provided with an auxiliary pressure plate. The inner wall of the auxiliary pressure plate is in contact with the surface of the positioning frame. Multiple groups of elastic telescopic rods are installed at the bottom edge of the auxiliary pressure plate, and the bottom ends of the multiple groups of elastic telescopic rods are all installed at the edge of the positioning frame.

4. The MiniLED printed circuit board processing pressing device according to claim 3, characterized in that: A spring is installed on one side of the bottom end of the auxiliary pressure plate, and the bottom end of the spring is elastically connected to a sponge roller. The sponge material in the sponge roller is set to polyurethane material. The number of the sponge rollers is set to two groups, and the two groups of sponge rollers are installed at the bottom end of the auxiliary pressure plate.

5. The MiniLED printed circuit board processing pressing device according to claim 4, characterized in that: The leveling component includes a rotating rod, the rotating rod is installed on one side of one of the two sliding bases, a second spur gear is installed at the top end of the rotating rod, a rack is engaged with one side of the second spur gear, and the rack is installed on the other side of the inner wall of the top end of the installation frame.

6. The MiniLED printed circuit board processing pressing device according to claim 5, characterized in that: An installation disk is rotatably installed at the bottom end of the rotating rod, a rubber column group is installed on the side surface of the installation disk, the number of the rubber column groups is set to be multiple groups, and the multiple groups of rubber column groups are arranged in an equiangular circumferential array on the side surface of the installation disk.

7. The MiniLED printed circuit board processing pressing device according to claim 6, characterized in that: The rubber columns in the rubber column group are arranged in a "pin" shape, and the material of the rubber columns in the rubber column group is set to nitrile rubber.

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