Heat dissipation module, power converter and electric vehicle

Abstract

The invention discloses a heat dissipation module, a power converter and an electric automobile, and relates to the technical field of heat dissipation, and the heat dissipation module comprises a plurality of groups of heat sources distributed at different positions, a radiator and a heat conduction part made of a high heat conduction material; the radiator comprises a plane radiating surface, the heat conduction piece is respectively connected with the plurality of groups of heat sources and the plane radiating surface in a heat conduction manner, and the shape of the heat conduction piece is matched with the distribution position of the plurality of groups of heat sources, so that heat generated by the plurality of groups of heat sources is conducted to the plane radiating surface. According to the technical scheme, the heat dissipation module is good in heat dissipation performance.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a heat dissipation module, a power converter, and an electric vehicle. Background Art

[0002] Currently, the power converter usually adopts a liquid cooling heat dissipation method. Since the installation heights of the various components in the power converter are different, a three-dimensional liquid cooling water channel structure needs to be provided in the power converter to contact the various components, ensuring that the components with different installation heights can be cooled. However, there is a pressure drop loss when the coolant flows in the three-dimensional liquid cooling water channel, which will affect the circulation speed of the coolant and thus affect the heat dissipation performance of the power converter. Summary of the Invention

[0003] The main object of the present invention is to provide a heat dissipation module, a power converter, and an electric vehicle, aiming to provide a heat dissipation module with better heat dissipation performance.

[0004] To achieve the above object, the heat dissipation module proposed by the present invention includes multiple groups of heat sources distributed at different positions, a radiator, and a heat conducting member formed of a high thermal conductivity material;

[0005] The radiator includes a flat heat dissipation surface. The heat conducting member is thermally connected to the multiple groups of heat sources and the flat heat dissipation surface respectively, and the shape of the heat conducting member matches the positions where the multiple groups of heat sources are distributed, so as to conduct the heat generated by the multiple groups of heat sources to the flat heat dissipation surface.

[0006] In one embodiment, the thermal conductivity of the heat conducting member is not less than 300 W / (m·K).

[0007] In one embodiment, the heat conducting member includes a first heat conducting member and a second heat conducting member. The cross-section of the first heat conducting member is π-shaped, and the cross-section of the second heat conducting member is rectangular. The first heat conducting member is thermally connected to the multiple groups of heat sources and the second heat conducting member respectively, and the surface of the second heat conducting member facing away from the first heat conducting member is thermally connected to the flat heat dissipation surface.

[0008] In one embodiment, the first heat conducting member is made of graphite aluminum; or, the first heat conducting member is a heat pipe.

[0009] In one embodiment, the second heat conducting member is made of graphite aluminum; or, the second heat conducting member is a heat pipe.

[0010] In one embodiment, the radiator is a liquid cooling radiator or an air cooling radiator.

[0011] The present application also proposes a power converter including the heat dissipation module as described in any of the foregoing embodiments.

[0012] In one embodiment, the power converter includes a circuit board disposed above the heat dissipation module, and the heat source includes a magnetic device mounted on the circuit board; the heat conducting member is formed with a mounting cavity, and an avoidance hole is formed on a surface of the heat conducting member close to the circuit board. The magnetic device is located in the mounting cavity, and the pins of the magnetic device pass through the avoidance hole and are electrically connected to the circuit board, and a heat conducting medium is filled in the gap of the mounting cavity.

[0013] In one embodiment, the heat source includes a plurality of power devices mounted on the circuit board, and the plurality of power devices are thermally connected to at least one side surface of the heat conducting member.

[0014] The present application also provides an electric vehicle, including the power converter described in any one of the foregoing embodiments.

[0015] In the technical solution of the present invention, by providing a heat conducting member formed of a high heat conducting material in the heat dissipation module, the heat conducting member forms a three-dimensional heat conducting structure and is connected to the radiator, and the heat conducting member is used for thermally connecting with multiple groups of heat sources. As the heat conduction path of multiple groups of heat sources, the heat generated by multiple groups of heat sources at different heights and different positions during operation can be transferred to the radiator through the heat conducting member with high heat conduction performance, and then heat dissipation can be performed through the planar heat dissipation surface; thus, there is no need to provide a three-dimensional liquid cooling channel structure in the heat dissipation module, and the problem of affecting the heat dissipation performance due to pressure drop loss will not occur, so that the heat dissipation module has good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0017] Figure 1 An exploded view of an embodiment of the power converter provided by the present invention;

[0018] Figure 2 is Figure 1 a cross-sectional view of the power converter in

[0019] Figure 3 A structural diagram of an embodiment of the heat dissipation module provided by the present invention with the radiator removed;

[0020] Figure 4 An exploded view of another embodiment of the power converter provided by the present invention;

[0021] Figure 5For Figure 4 Cross-sectional view of a medium-power converter;

[0022] Figure 6 Structural diagram of another embodiment of the heat dissipation module provided by the present invention with the radiator removed.

[0023] Description of the reference numerals in the drawings:

[0024] 10. Heat dissipation module; 11. Heat conducting member; 111. First heat conducting member; 1111. First side plate; 1112. Second side plate; 1113. Top plate; 1114. Connecting plate; 1115. Support protrusion; 112. Second heat conducting member; 113. Installation cavity; 20. Heat source; 201. Magnetic device; 202. Electronic component; 203. Power device;

[0025] 100. Power converter; 101. Circuit board; 102. Housing; 103. Installation space; X. First direction; Y. Second direction.

[0026] The implementation, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0029] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are for descriptive purposes only, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those skilled in the art can implement them. When the combination of technical solutions conflicts with each other or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0030] Currently, power converters usually adopt liquid cooling for heat dissipation. Since the installation heights of various devices in the power converter are different, a three-dimensional water channel structure needs to be set in the power converter to contact each device to ensure heat dissipation for different devices. However, there is a pressure drop loss when the coolant flows in the three-dimensional water channel, which will affect the circulation speed of the coolant and thus the heat dissipation efficiency of the power converter.

[0031] Based on the above considerations, the present invention proposes a heat dissipation module 10 with better heat dissipation performance.

[0032] Please refer to Figures 1 to 6 , in an embodiment of the present invention, the heat dissipation module 10 includes multiple groups of heat sources 20 distributed at different positions, a radiator, and a heat conducting member 11 formed of a high thermal conductivity material; the radiator includes a planar heat dissipation surface, the heat conducting member 11 is thermally connected to the multiple groups of heat sources 20 and the planar heat dissipation surface respectively, and the shape of the heat conducting member 11 matches the positions where the multiple groups of heat sources 20 are distributed, so as to conduct the heat generated by the multiple groups of heat sources 20 to the planar heat dissipation surface.

[0033] In the embodiments of the present application, the heat dissipation module 10 can be used to quickly dissipate heat for multiple groups of heat sources 20 provided thereon. Among them, the heat dissipation module 10 can be applied to components such as a power converter 100, an inverter, a servo driver, and other components that require heat dissipation. The heat source 20 can be electronic components 202 that generate heat during operation in devices such as the power converter 100, the inverter, and the servo driver, such as inductors, resistors, capacitors, relays, transformers, etc. The heat source 20 can also be other devices that come into contact with the heat generating devices and cause their own temperatures to rise.

[0034] The heat conducting member 11 in the heat dissipation module 10 is made of a high heat conducting material, and may include, but is not limited to, at least one material such as graphite aluminum, graphite, copper, etc.; preferably, the heat conducting coefficient of the heat conducting member 11 is not lower than that of copper, ensuring that the heat conducting member 11 has good heat conducting performance. The structural shape of the heat conducting member 11 matches the distribution positions of multiple groups of heat sources 20, so that the multiple groups of heat sources 20 can be thermally connected to the heat conducting member 11; it should be noted that the thermal connection mentioned in the embodiments of the present application means that there is contact between two components and heat transfer can occur, and the two components can be only in contact with each other, or can be connected together by means such as welding, bonding with thermal conductive adhesive, screwing, pressing with a pressing member, etc.

[0035] A radiator is an instrument that can dissipate the heat generated by other appliances during operation in a timely manner. The radiator can adopt, but is not limited to, various types such as air cooling, liquid cooling, and semiconductor refrigeration.

[0036] In the embodiments of the present application, by providing a heat conducting member 11 formed of a high heat conducting material in the heat dissipation module 10, the heat conducting member 11 forms a three-dimensional heat conducting structure for thermally connecting with multiple groups of heat sources 20. As the heat conduction path of the multiple groups of heat sources 20, the heat generated by the multiple groups of heat sources 20 at different heights and different positions during operation can be transferred to the radiator through the heat conducting member 11 with high heat conducting performance, and a planar heat dissipation surface can be provided on the radiator to dissipate heat through the planar heat dissipation surface; thus, there is no need to provide a three-dimensional liquid cooling channel structure in the heat dissipation module 10, and the problem of affecting the heat dissipation performance due to pressure drop loss will not occur, making the heat dissipation module 10 have good heat dissipation performance.

[0037] In one embodiment, the heat conducting coefficient of the heat conducting member 11 is not lower than 300 W / (m·K).

[0038] With such a setting, it is ensured that the heat conducting member 11 has high heat conducting ability, and the heat generated by the power device 203, the magnetic device 201, and other electronic components 202 can be quickly transferred to the radiator for heat dissipation, ensuring that the power converter 100 has high heat dissipation efficiency.

[0039] As an example, the value of the heat conducting coefficient of the heat conducting member 11 can be, but is not limited to, 300 W / (m·K), 350 W / (m·K), 400 W / (m·K), 450 W / (m·K), 500 W / (m·K), 800 W / (m·K), 1000 W / (m·K), 2000 W / (m·K), and other values not lower than 300 W / (m·K). The material of the heat conducting member 11 can include at least one high heat conducting material such as graphite aluminum, graphite, silver, etc.; preferably, the heat conducting coefficient of the heat conducting member 11 is not lower than that of copper, ensuring that the heat conducting member 11 has good heat conducting performance.

[0040] Please refer to Figure 2 and Figure 4 , in one embodiment, the heat conducting member 11 includes a first heat conducting member 111 and a second heat conducting member 112. The cross-section of the first heat conducting member 111 is π-shaped, and the cross-section of the second heat conducting member 112 is rectangular. The first heat conducting member 111 is thermally connected to multiple groups of heat sources 20 and the second heat conducting member 112 respectively, and one side of the second heat conducting member 112 facing away from the first heat conducting member 111 is thermally connected to a planar heat dissipation surface.

[0041] In this embodiment, the second heat conducting member 112 is arranged in a plate-like structure and has two surfaces facing each other. The first heat conducting member 111 is arranged on one of the surfaces, and the radiator is thermally connected to the other surface of the second heat conducting member 112, so that the planar heat dissipation surface of the radiator and the heat conducting member 11 have a large contact area and heat exchange area, ensuring that the heat of the heat conducting member 11 can be quickly transferred to the radiator for heat dissipation. The cross-sectional shape of the first heat conducting member 111 is set to be π-shaped, so that the first heat conducting member 111 is arranged in a three-dimensional structure to ensure that the heat conducting member 11 can contact multiple groups of heat sources 20 distributed at different positions.

[0042] Among them, the cross-sectional shape of the first heat conducting member 111 is set to be π-shaped, which means that the first heat conducting member 111 has at least two first side plates 1111 arranged opposite to each other along the first direction X. The first side plates 1111 are arranged on the second heat conducting member 112, and the first direction X is parallel to the plane of the second heat conducting member 112. In this setting, an installation cavity 113 for installing the heat source 20 is formed between the two first side plates 1111, and the surface of the first side plate 1111 facing away from the installation cavity 113 can also be used for thermally connecting with the heat source 20, so that the first side plate 1111 can be used for conducting heat for multiple groups of heat sources 20, and the layout of the heat dissipation module 10 is relatively compact, which is beneficial to reducing the overall volume.

[0043] In some embodiments, the first heat conducting member 111 may further include at least one of the second side plate 1112 and the top plate 1113 as shown in the embodiments of Figure 3 and Figure 6 . The second side plate 1112 and the top plate 1113 can be used to connect the two first side plates 1111 to make the heat conducting member 11 modularized as a whole, which is convenient for installation; or they can provide a heat conducting area for contacting the heat source 20, so that the first heat conducting member 111 can contact more heat sources 20.

[0044] Optionally, the first side plate 1111 can be directly connected to the radiator towards the bottom side of the second heat conducting member 112, for example, by welding, bonding or other connection methods; alternatively, as shown in the illustrated embodiment, the first heat conducting member 111 includes a connecting plate 1114 connected to the bottom side of the first side plate 1111. The connecting plate 1114 is disposed opposite to the second heat conducting member 112 and is connected to each other. Through the arrangement of the connecting plate 1114, the contact area between the first heat conducting member 111 and the second heat conducting member 112 is increased, thereby increasing the heat conducting area between the first heat conducting member 111 and the second heat conducting member 112, which is beneficial to improving the heat conducting efficiency between the first heat conducting member 111 and the second heat conducting member 112. In addition, the connection area between the first heat conducting member 111 and the second heat conducting member 112 is also increased, which is beneficial to improving the connection strength and the overall structural stability.

[0045] In one embodiment, the first heat conducting member 111 is made of graphite aluminum; graphite aluminum has high heat conducting performance, and its heat conducting coefficient can reach 1000 - 2000 W / (m·K), which can conduct heat away more efficiently, so that the first heat conducting member 111 has high heat conducting efficiency.

[0046] In one embodiment, the first heat conducting member 111 adopts a heat pipe. When the temperature is transferred to the evaporation area of the heat pipe, the internal working fluid (such as water, ethanol, etc.) in the heat pipe absorbs heat and quickly vaporizes, forming steam and taking away a large amount of heat energy; the steam quickly diffuses in the vacuum cavity to the condensation area with lower temperature in the heat pipe. After the steam reaches the condensation area, it releases latent heat and re-liquefies, completing the transfer of heat energy to the environment. The liquefied working fluid returns to the evaporation area to form a closed cycle.

[0047] In one embodiment, the second heat conducting member 112 is made of graphite aluminum; graphite aluminum has high heat conducting performance, and its heat conducting coefficient can reach 1000 - 2000 W / (m·K), which can conduct heat away more efficiently, so that the first heat conducting member 111 has high heat conducting efficiency.

[0048] In one embodiment, the second heat conducting member 112 adopts a heat pipe. When the temperature is transferred to the evaporation area of the heat pipe, the internal working fluid (such as water, ethanol, etc.) in the heat pipe absorbs heat and quickly vaporizes, forming steam and taking away a large amount of heat energy; the steam quickly diffuses in the vacuum cavity to the condensation area with lower temperature in the heat pipe. After the steam reaches the condensation area, it releases latent heat and re-liquefies, completing the transfer of heat energy to the environment. The liquefied working fluid returns to the evaporation area to form a closed cycle.

[0049] In one embodiment, the radiator is a liquid-cooled radiator or an air-cooled radiator.

[0050] With such a setting, the heat transferred to the radiator is quickly dissipated to the external environment by means of a liquid circulation system or air cooling with a cooling fan, which is beneficial to improving the heat dissipation efficiency of the radiator.

[0051] Please refer to Figure 1 、 Figure 2 、 Figure 4 and Figure 5 In addition, the present application also provides a power converter 100, which includes a heat dissipation module 10 as described in any of the foregoing embodiments. Since the power converter 100 adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be elaborated herein one by one. Among them, the power converter 100 can be used for at least one adjustment function such as voltage conversion and current conversion. The heat source 20 in the power converter 100 can be, but is not limited to, a power device 203, a magnetic device 201, etc. In some embodiments, the power converter 100 may further include at least one heat source 20 such as an inductor, a resistor, a capacitor, a relay, etc.

[0052] In one embodiment, the power converter 100 includes a circuit board 101, the circuit board 101 is disposed above the heat dissipation module 10, and the heat source 20 includes a magnetic device 201 mounted on the circuit board 101; the heat conducting member 11 is formed with a mounting cavity 113, and an avoidance hole is formed on the surface of the heat conducting member 11 close to the circuit board 101. The magnetic device 201 is located in the mounting cavity 113, and the pins of the magnetic device 201 pass through the avoidance hole and are electrically connected to the circuit board 101, and a heat conducting medium is filled in the gap of the mounting cavity 113.

[0053] In this embodiment, the circuit board 101 can be used to transmit signals and power, so that devices such as the magnetic device 201 and the power device 203 in the power converter 100 are electrically connected to the circuit board 101 to form a complete circuit. The magnetic device 201 is a transformer in the power converter, and generally includes an iron core, a primary winding and a secondary winding wound around the iron core. The magnetic device 201 is mainly used for voltage and current conversion; the magnetic device 201 is disposed in the mounting cavity 113 of the heat conducting member 11, and a heat conducting medium is filled in the gap of the mounting cavity 113. The heat conducting medium can be set as conductive glue, which can not only fix the magnetic device 201 in the mounting cavity 113 and connect it to the heat conducting member 11, but also enable the heat of the magnetic device 201 to be transferred to the heat conducting member 11; the heat conducting medium can also be heat conducting silicone grease, heat conducting silica gel, graphite gasket, etc.

[0054] The circuit board 101 is disposed above the heat dissipation module 10 such that the heat dissipation module 10 and the circuit board 101 are stacked, and the pins of the magnetic device 201 pass through the avoidance holes of the heat conducting member 11 and are electrically connected to the circuit board 101. With such an arrangement, it is convenient for the magnetic device 201, the power device 203, and other electronic components 202 to be connected to the circuit board 101, making the overall layout of the power converter 100 compact.

[0055] Optionally, the circuit board 101 can be connected to the heat conducting member 11 to be fixed on the heat conducting member 11; or other mounting structures can be provided in the power converter 100 to fix the circuit board 101, which is not limited herein.

[0056] Optionally, the heat conducting member 11 has at least two first side plates 1111 oppositely disposed along the first direction X, and an installation cavity 113 for installing the magnetic device 201 is formed between the two first side plates 1111. In some embodiments, the heat conducting member 11 can further include at least one of the second side plate 1112 and the top plate 1113 as shown in the illustrated embodiment. The second side plate 1112 and the top plate 1113 can not only be used to connect the two first side plates 1111 to make the heat conducting member 11 integrally modularized for easy installation, but also provide a heat conducting area for thermally connecting to multiple heat sources 20 in the power converter 100, so that the heat conducting member 11 can contact more heat sources 20.

[0057] Please refer to Figure 6 , as an example, the heat conducting member 11 includes two first side plates 1111 oppositely disposed along the first direction X and two second side plates 1112 oppositely disposed along the second direction Y. The second direction Y intersects the first direction X. An installation cavity 113 for installing the magnetic device 201 is formed by enclosing the two first side plates 1111 and the two second side plates 1112. At this time, the top of the installation cavity 113 can be hollowed out to form an avoidance hole, or a top plate 1113 can be provided on the top of the installation cavity 113, and an avoidance hole is opened on the top plate 1113.

[0058] Please refer to Figure 3 , as an example, the heat conducting member 11 includes two first side plates 1111 oppositely disposed along the first direction X and a top plate 1113 connecting the two first side plates 1111. An installation cavity 113 for installing the magnetic device 201 is formed by enclosing the two first side plates 1111 and the top plate 1113. The top plate 1113 is disposed opposite to the circuit board 101 and is provided with an avoidance hole.

[0059] In one embodiment, the circuit board 101 is in contact with the heat conducting member 11. With such an arrangement, the heat generated by the circuit board 101 during operation can also be transferred to the heat conducting member 11, and then transferred to the radiator through the heat conducting member 11 for heat dissipation, so that the heat generated by the circuit board 101 can be efficiently exported, improving the heat dissipation efficiency of the circuit board 101. Optionally, the circuit board 101 can be directly connected to the heat conducting member 11, or the circuit board 101 can be fixed to other structures and only make the circuit board 101 in contact with the heat conducting member 11.

[0060] Please refer to Figure 3 , in one embodiment, a support protrusion 1115 is provided on the side of the heat conducting member 11 facing the circuit board 101, and the circuit board 101 is connected to the support protrusion 1115.

[0061] With the above method, the circuit board 101 can be directly fixed to the heat conducting member 11, which can not only directly transfer the heat of the circuit board 101 to the heat conducting member 11, improving the heat conduction efficiency, but also no other installation structure for fixing the circuit board 101 needs to be provided in the power converter 100, simplifying the structure of the power converter 100. Moreover, the circuit board 101, the power device 203, and the magnetic device 201 are either directly provided on the heat conducting member 11 or limited by the heat conducting member 11, that is, the circuit board 101, the power device 203, and the magnetic device 201 all use the heat conducting member 11 as the installation base, which can make the relative positions of the circuit board 101, the power device 203, and the magnetic device 201 relatively stable, so that the power device 203 and the magnetic device 201 can maintain a relatively stable electrical connection relationship with the circuit board 101, ensuring the performance stability of the power converter 100.

[0062] Please refer to Figure 3 and Figure 6 , in one embodiment, the heat source 20 includes a plurality of power devices 203 mounted on the circuit board 101, and the plurality of power devices 203 are thermally connected to at least one side surface of the heat conducting member 11.

[0063] In this embodiment, the power device 203 can be set as a power tube, such as an electron tube, a diode, a triode, a thyristor, a field effect tube, etc.; it can be used for power conversion, power amplification, regulating current and voltage, etc., and can perform power control such as conduction and cut-off according to the applied drive signal. The plurality of power devices 203 can be distributed on one side surface of the heat conducting member 11, or can be distributed on different side surfaces of the heat conducting member 11.

[0064] Exemplarily, the heat conducting member 11 has two first side plates 1111 oppositely arranged along the first direction X. An installation cavity 113 for installing the magnetic device 201 is formed between the two first side plates 1111. At this time, a plurality of power devices 203 can be arranged on one side of one of the first side plates 1111 facing away from the installation cavity 113 to be thermally connected to the first side plate 1111, or a plurality of power devices 203 can be distributed on the two first side plates 1111. In some embodiments, the heat conducting member 11 further has two second side plates 1112 oppositely arranged along the second direction Y. At this time, power devices 203 can also be arranged on the surface of the second side plates 1112 facing away from the installation cavity 113. Additionally, the heat conducting member 11 can further be provided with a top plate 1113 covering the top of the installation cavity 113. At this time, some of the power devices 203 can also be distributed on the surface of the top plate 1113 facing away from the installation cavity 113, which is not limited herein.

[0065] Please refer to Figure 1 and Figure 4 , in one embodiment, the power converter 100 further includes a housing 102. The housing 102 covers the heat conducting member 11 and encloses an installation space 103 with the heat conducting member 11. The magnetic device 201, the circuit board 101, and other devices are located in the installation space 103. It can protect the devices in the installation space 103 and can also play a certain electromagnetic shielding role to avoid the influence of external electric fields or magnetic fields on the performance of the power converter 100.

[0066] Optionally, the housing 102 can be made of a material with a relatively high thermal conductivity. For example, the material of the housing 102 can include but is not limited to at least one of graphite aluminum, graphite, copper, aluminum, etc., so that the heat transferred to the housing 102 can also be dissipated quickly, improving the heat dissipation efficiency.

[0067] This application also proposes an electric vehicle including the power converter 100 in any of the foregoing embodiments. The specific structure of the power converter 100 refers to the above embodiments. Since this electric vehicle adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one.

[0068] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A heat dissipation module, characterized in that, It includes multiple groups of heat sources, a radiator, and a heat conducting member formed of a high thermal conductivity material, which are distributed at different positions; The radiator includes a flat heat dissipation surface. The heat conducting member is thermally connected to multiple groups of the heat sources and the flat heat dissipation surface respectively, and the shape of the heat conducting member matches the positions where multiple groups of the heat sources are distributed, so as to conduct the heat generated by multiple groups of the heat sources to the flat heat dissipation surface.

2. The heat dissipation module according to claim 1, wherein The thermal conductivity of the heat conducting member is not less than 300 W / (m·K).

3. The heat dissipation module according to claim 2, wherein The heat conducting member includes a first heat conducting member and a second heat conducting member. The cross-section of the first heat conducting member is π-shaped, and the cross-section of the second heat conducting member is rectangular. The first heat conducting member is thermally connected to multiple groups of the heat sources and the second heat conducting member respectively, and the surface of the second heat conducting member facing away from the first heat conducting member is thermally connected to the flat heat dissipation surface.

4. The heat dissipation module according to claim 3, characterized in that The first heat conducting member is made of graphite aluminum; or, the first heat conducting member is a heat pipe.

5. The heat dissipation module according to claim 4, wherein, The second heat conducting member is made of graphite aluminum; or, the second heat conducting member is a heat pipe.

6. The heat dissipation module according to any one of claims 1 to 5, characterized in that The radiator is a liquid-cooled radiator or an air-cooled radiator.

7. A power converter, characterized in that, It includes a heat dissipation module according to any one of claims 1 to 6.

8. The power converter according to claim 7, characterized in that, The power converter includes a circuit board, the circuit board is arranged above the heat dissipation module, and the heat source includes a magnetic device mounted on the circuit board; the heat conducting member is formed with a mounting cavity, and an avoidance hole is formed on the surface of the heat conducting member close to the circuit board. The magnetic device is located in the mounting cavity, and the pins of the magnetic device pass through the avoidance hole and are electrically connected to the circuit board, and a heat conducting medium is filled in the gap of the mounting cavity.

9. The power converter according to claim 8, wherein the heat source includes multiple power devices mounted on the circuit board, and multiple the power devices are thermally connected to at least one side surface of the heat conducting member.

10. An electric vehicle, characterized in that, It includes a power converter according to any one of claims 7 to 9.

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