Liquid cooling system and temperature control method for chip aging test

Abstract

The invention relates to the technical field of chip aging tests, in particular to a liquid cooling system and temperature control method for a chip aging test, and the liquid cooling system for the chip aging test comprises a sealing cover, a heating source, a cooling fin fluid flowing cavity, a water flow port and a bottom plate. A sealing groove is formed in the bottom end of the sealing cover, and the bottom end of the sealing groove is an opening end; the heating source is arranged on the sealing cover and used for heating the sealing cover; the top end of the cooling fin is provided with a micro-channel, the micro-channel extends into the sealing groove from the cooling fin, and the bottom end of the cooling fin seals and covers the opening end of the sealing groove; the fluid flowing cavity is defined by the inner wall of the sealing groove and the end, stretching into and covering the sealing groove, of the cooling fin. The water flow opening comprises a water inlet and a water outlet and is formed in the sealing cover, and the water inlet and the water outlet are both communicated with the fluid flowing cavity; and the bottom plate is arranged at the bottom of the cooling fin, the bottom plate is used for containing a chip, and the chip is arranged between the cooling fin and the bottom plate.

Description

Technical Field

[0001] The present invention relates to the technical field of chip aging testing, and specifically to a liquid cooling system and a temperature control method for chip aging testing. Background Art

[0002] In the field of semiconductor chip manufacturing, chip aging testing is a key link to verify the reliability of chips, aiming to simulate the extreme working environment of chips to expose potential defects.

[0003] The existing problems in the chip aging test structure are as follows: In the chip aging test link, air cooling temperature control is a relatively common means. (1) The air cooling system relies on air convection heat transfer. Limited by the low thermal conductivity of air, it is relatively difficult to achieve efficient heat dissipation. Especially in the high-power chip aging test scenario, it is impossible to timely take away a large amount of heat generated by the chip, resulting in too high local temperature of the chip, causing a large temperature difference in different regions inside the chip, and relatively affecting the accuracy of test results. (2) The air cooling system realizes heat dissipation through forced convection of the fan. During operation, it generates mechanical noise as high as decibels, which not only interferes with the test environment, but also causes interference to the performance tests of chips sensitive to noise such as audio and sensors, and relatively easily leads to distortion of test data. (3) The air cooling system has a slow response speed for heating and cooling. In the high-temperature aging test scenario, it is impossible to quickly stabilize the chip temperature within the target range, and the single test cycle is relatively long, seriously affecting the test efficiency.

[0004] Therefore, there is an urgent need for a liquid cooling system and a temperature control method for chip aging testing to solve the above problems. Summary of the Invention

[0005] Based on the above, the purpose of the present invention is to provide a liquid cooling system for chip aging testing to solve the problem of difficult control of the chip surface temperature.

[0006] To solve the above technical problems, the present invention adopts the following technical solution: A liquid cooling system for chip aging testing, comprising:

[0007] A cover, the bottom end of the cover is provided with a sealing groove, and the bottom end of the sealing groove is an open end;

[0008] A heating source, arranged on the cover, and the heating source is used to heat the cover;

[0009] A heat sink, the top end of the heat sink is provided with a microchannel, the microchannel extends from the heat sink into the sealing groove, and the bottom end of the heat sink covers the open end of the sealing groove;

[0010] A fluid flow cavity, defined by the inner wall of the sealing groove and the end of the heat sink extending into and covering the sealing groove;

[0011] The water flow port, including a water inlet and a water outlet, is provided on the cover, and both the water inlet and the water outlet communicate with the fluid flow chamber;

[0012] The bottom plate is provided at the bottom of the heat sink, and the bottom plate is used to hold the chip, and the chip is arranged between the heat sink and the bottom plate.

[0013] Further, the heating source is composed of heating rods, at least one heating rod is provided, both the water inlet and the water outlet are provided at the top end of the cover, the heating rod penetrates through the upper end of the cover, and the sealing groove is provided at the lower end of the cover.

[0014] Further, the heat sink includes a mounting plate and a first group of fin bodies and a second group of fin bodies provided on the mounting plate. The mounting plate covers the open end of the sealing groove. The first group of fin bodies and the second group of fin bodies extend into the sealing groove. The first group of fin bodies includes at least one first fin body, and the second group of fin bodies includes at least one second fin body. The first fin body is parallel and staggered with the second group of fin bodies, and the microchannel is formed by the distance between the first fin body and the second group of fin bodies.

[0015] Further, the cross-section of the fluid flow chamber is set to be hexagonal. Both the water inlet and the water outlet are provided at the top end of the cover, and the water inlet and the water outlet respectively extend to the diagonal ends of the fluid flow chamber and communicate with the fluid flow chamber, and the heating source is laid flat on the upper end of the fluid flow chamber.

[0016] Further, a heat conducting pad is provided at the bottom end of the heat sink, and the heat conducting pad is used to connect with the chip.

[0017] A temperature control method for chip aging test, which is applicable to the liquid cooling system for chip aging test, uses the heating source and the coolant to perform two-way temperature control on the chip, and the steps are as follows:

[0018] S1: The coolant flows into the fluid flow chamber from the water inlet and flows out of the fluid flow chamber from the water outlet;

[0019] S2: Start the heating source to conduct temperature to the cover;

[0020] S3: The temperature is sequentially conducted from the heating source to the cover and the coolant in the fluid flow chamber to complete the first heat exchange;

[0021] S4: The flowing coolant with the temperature of the first heat exchange flows through the microchannel of the heat sink to complete the second heat exchange, and the temperature of the second heat exchange is sequentially conducted from the microchannel to the heat sink and the chip.

[0022] Further, when the coolant flows in the hexagonal fluid flow chamber, the two sides of the fluid flow chamber contract towards the middle, and the coolant on both sides converges towards the middle, accelerating the outflow of the fluid flow chamber from the water outlet.

[0023] Further, when the coolant flows in the fluid flow chamber, it flows through between the first group of fin bodies, between the second group of fin bodies, and between the first group of fin bodies and the second group of fin bodies.

[0024] Further, the chip is bonded to the heat conduction pad, and the temperature is sequentially conducted from the heating source to the cover, the coolant, the microchannel, the heat sink, and the heat conduction pad, and finally to the chip.

[0025] Further, when the heating source is started, the heating source first pre-heats or cools the coolant flowing into the water inlet, and then the coolant flows into the fluid flow chamber, and the heating source continuously heats or cools the coolant.

[0026] The beneficial effects of the present invention are as follows:

[0027] 1. In the present invention, by setting a heating source, a water flow port, a heat sink, and a liquid flow chamber, two-way stable temperature control is achieved. During the chip aging test, the temperature can be accurately controlled by adjusting the flow rate of the water flow port or the electric power of the heating source, so that the chip temperature can quickly reach and maintain within the target range, making the temperatures of all parts of the chip equal, avoiding adverse effects caused by temperature fluctuations on the chip, ensuring the stable and accurate progress of the aging test, and improving the test efficiency and reliability. By setting a microchannel, the heat dissipation area is increased, and combined with the inflow and outflow of the water flow port, the heat generated by the heating source can be quickly taken away, effectively reducing the chip temperature, ensuring that the chip is in a stable temperature environment during the aging test, improving the test accuracy and reliability, and having low energy consumption and low noise, making the test environment quieter, which is conducive to long-term monitoring and data collection work.

[0028] 2. In the present invention, by utilizing the circulating flow of the coolant in the fluid flow cavity and the microchannels, and cooperating with the conduction heating of the cover by the heating source, the two-way dynamic regulation of the chip temperature is achieved. It can quickly respond to the temperature change requirements during the chip testing process, accurately control the chip temperature to the target value, effectively avoid the test errors caused by temperature fluctuations, greatly improve the accuracy and reliability of the aging test results, and effectively reduce the number of aging tests. The two heat exchange processes optimize the heat transfer path, enabling the heat generated by the heating source to be efficiently transferred to the chip. At the same time, the coolant quickly removes the excess heat through the large-area contact between the microchannels and the heat sink, forming an efficient heat dissipation cycle and reducing the overall energy consumption during the chip testing process. In addition, this temperature control method effectively reduces the noise generated by the operation of the temperature control equipment, creating a quiet test environment, providing good conditions for the long-term and high-precision chip aging test monitoring and data acquisition work, and further improving the efficiency and quality of the chip aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0030] Figure 2 It is a three-dimensional structural sectional view of a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0031] Figure 3 It is a front view of a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0032] Figure 4 is Figure 3 a partial enlarged schematic view of the liquid cooling system and the temperature control method for chip aging testing in

[0033] Figure 5 It is an exploded view of a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0034] Figure 6 It is a bottom view of the heat sink of a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0035] Figure 7 It is a schematic diagram of the overall structure of the cover in a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0036] Figure 8 It is a step diagram of two-way temperature control of the chip using the heating source coolant in a liquid cooling system and a temperature control method for chip aging testing provided by the present invention;

[0037] Figure 9The step diagram when using a heating source for temperature control in a liquid cooling system and temperature control method for chip aging test provided by the present invention, where the temperature of the heating source is a variable and the coolant flow rate is a fixed quantity;

[0038] Figure 10 The step diagram when controlling the coolant flow rate for temperature control in a liquid cooling system and temperature control method for chip aging test provided by the present invention, where the coolant flow rate is a variable and the temperature of the heating source is a fixed quantity;

[0039] Figure 11 Test chart one of a liquid cooling system and temperature control method for chip aging test provided by the present invention;

[0040] Figure 12 For Figure 11 the continuation table of;

[0041] Figure 13 Test chart two of a liquid cooling system and temperature control method for chip aging test provided by the present invention;

[0042] Figure 14 For Figure 13 the continuation table of.

[0043] Among them, each reference numeral in the figure: 1, cover; 2, heating source; 3, heat sink; 4, first group of fin bodies; 401, first fin body; 5, second group of fin bodies; 501, second fin body; 6, spacing; 7, microchannel; 8, fluid flow cavity; 9, water flow port; 10, water inlet; 11, water outlet; 12, bottom plate; 13, thermal pad; 14, chip. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] Embodiment 1

[0046] Please refer to Figures 1-7, this design proposes an implementation method, a liquid cooling system for chip aging testing, including: a cover 1, a heating source 2, a heat sink 3, a fluid flow cavity 8, a water inlet 9, and a bottom plate 12. The cover 1 has a sealing groove at the bottom end, and the bottom end of the sealing groove is an open end; the heating source 2 is arranged on the cover 1 and is used to heat the cover 1; the heat sink 3 has a micro-channel 7 at the top end, and the micro-channel 7 extends from the heat sink 3 into the sealing groove, and the bottom end of the heat sink 3 seals the open end of the sealing groove of the cover 1; the fluid flow cavity 8 is defined by the inner wall of the sealing groove and the end of the heat sink 3 extending into and sealing the sealing groove of the cover 1; the water inlet 9 includes a water inlet 10 and a water outlet 11, which are arranged on the cover 1, and both the water inlet 10 and the water outlet 11 are communicated with the fluid flow cavity 8; the bottom plate 12 is arranged at the bottom of the heat sink 3, and the bottom plate 12 is used to hold the chip, and the chip is arranged between the heat sink 3 and the bottom plate 12.

[0047] In this embodiment, a liquid cooling system for chip aging testing is provided. By setting the heating source 2, the water inlet 9, the heat sink 3, and the liquid flow cavity, two-way stable temperature control is achieved. During chip aging testing, the temperature can be accurately controlled by adjusting the flow rate of the water inlet 9 or the electric power of the heating source 2, so that the chip temperature can quickly reach and maintain within the target range, avoiding the adverse effects of temperature fluctuations on the chip, ensuring the stable and accurate progress of the aging test, and improving the test efficiency and reliability. By setting the micro-channel 7, the heat dissipation area is increased. Combined with the inflow and outflow of the water inlet 9, the heat generated by the heating source 2 can be quickly taken away, effectively reducing the chip temperature, ensuring that the chip is in a stable temperature environment during the aging test, improving the test accuracy and reliability, and having low energy consumption and low noise, making the test environment quieter, which is conducive to long-term monitoring and data collection work.

[0048] Embodiment Two

[0049] Please refer to Figure 8 , this embodiment can be realized by manufacturing the liquid cooling system in Embodiment One. This design proposes an implementation method, a temperature control method for chip aging testing, which uses the heating source 2 and the coolant to perform two-way temperature control on the chip. The steps are as follows:

[0050] S1: The coolant flows into the fluid flow cavity 8 from the water inlet 10 and flows out of the fluid flow cavity 8 from the water outlet 11;

[0051] S2: Start the heating source 2 to conduct temperature to the cover 1;

[0052] S3: The temperature is sequentially conducted from the heating source 2 to the cover 1 and the coolant in the fluid flow cavity 8 to complete the first heat exchange;

[0053] S4: The flowing coolant at the first heat exchange temperature flows through the microchannels 7 of the heat sink 3 to complete the second heat exchange, and the temperature of the second heat exchange is conducted from the microchannels 7 to the heat sink 3 and the chip in sequence.

[0054] In this embodiment, on the one hand, by utilizing the circulating flow of the coolant in the fluid flow cavity 8 and the microchannels 7, and cooperating with the conductive heating of the cover 1 by the heating source 2, the two-way dynamic regulation of the chip temperature is realized, which can quickly respond to the temperature change requirements during the chip testing process, accurately control the chip temperature to the target value, effectively avoid the test errors caused by temperature fluctuations, and greatly improve the accuracy and reliability of the aging test results. On the other hand, the two heat exchange processes optimize the heat transfer path, enabling the heat generated by the heating source 2 to be efficiently transferred to the chip. At the same time, the coolant quickly removes the excess heat through the large-area contact between the microchannels 7 and the heat sink 3, forming an efficient heat dissipation cycle and reducing the overall energy consumption during the chip testing process. In addition, this temperature control method effectively reduces the noise generated by the operation of the temperature control equipment, creates a quiet test environment, provides good conditions for the long-term and high-precision chip aging test monitoring and data acquisition work, and further improves the efficiency and quality of the chip aging test.

[0055] Please refer to Figure 9 , in this embodiment, when using the heating source 2 for temperature control, the temperature of the heating source 2 is a variable and the coolant flow rate is a fixed value. The steps are as follows:

[0056] X1. The coolant with a fixed flow rate flows into the fluid flow cavity 8 from the water inlet 10 and flows out of the fluid flow cavity 8 from the water outlet 11.

[0057] X2. Start the heating source 2 to change the temperature of the cover 1.

[0058] X3. The temperature is conducted from the heating source 2 to the cover 1 and the coolant flowing in the fluid flow cavity 8 in sequence to complete the first heat exchange.

[0059] X4. The flowing coolant at the first heat exchange temperature flows through the microchannels 7 of the heat sink 3 to complete the second heat exchange, and the temperature of the second heat exchange is conducted from the microchannels 7 to the heat sink 3 and the chip in sequence.

[0060] In this embodiment, by differentially controlling the temperature of the heating source 2 and the coolant flow rate, a diversified and refined chip aging test temperature control system is constructed. When the temperature of the heating source 2 is a variable and the coolant flow rate is a fixed value, the power output of the heating source 2 can be flexibly adjusted according to the real-time temperature feedback during the chip testing process, accurately matching the required heating rate and target temperature of the chip, avoiding the fluid pressure fluctuations caused by frequent adjustment of the coolant flow rate, ensuring the stability of the test environment, and achieving efficient and accurate heating control.

[0061] Please refer to Figure 10 When controlling the temperature by controlling the coolant flow rate, the coolant flow rate is a variable and the temperature of the heating source 2 is a fixed value. The steps are as follows:

[0062] Y1. The coolant with variable flow rate flows into the fluid flow chamber 8 from the water inlet 10 and flows out of the fluid flow chamber 8 from the water outlet 11;

[0063] Y2. Start the heating source 2 to heat or cool the cover 1, and the temperature of the heating source 2 is a constant temperature;

[0064] Y3. The temperature is sequentially conducted from the heating source 2 to the cover 1 and the coolant flowing in the fluid flow chamber 8 to complete the first heat exchange;

[0065] Y4. The flowing coolant with the temperature of the first heat exchange flows through the microchannels 7 of the heat sink 3 to complete the second heat exchange, and the temperature of the second heat exchange is sequentially conducted from the microchannels 7 to the heat sink 3 and the chip.

[0066] In this embodiment, in the mode where the coolant flow rate is a variable and the temperature of the heating source 2 is a fixed value, by dynamically adjusting the coolant flow rate, it is possible to quickly respond to the chip heat dissipation requirements, efficiently remove the excess heat generated during chip operation while maintaining the basic heating temperature, reduce the chip heat load, reduce the test deviation caused by overheating, and effectively improve the reliability and consistency of the test results.

[0067] In this embodiment, it can also be that both the heating source 2 and the coolant flow rate are variables. When both the temperature of the heating source 2 and the coolant flow rate are variables, full-dimensional dynamic control of the chip temperature can be achieved, and an optimal temperature control scheme can be quickly constructed for the complex temperature requirements of different types of chips and different test stages, greatly expanding the application range and temperature control accuracy of the system.

[0068] Embodiment Three

[0069] Please refer to Figures 2-4 In this design, an implementation method is proposed. A liquid cooling system for chip aging test, the heating source 2 is composed of a heating rod, there is at least one heating rod, both the water inlet 10 and the water outlet 11 are arranged at the top end of the cover 1, the heating rod passes through the upper end of the cover 1, and the sealing groove is arranged at the lower end of the cover 1.

[0070] In this embodiment, a heating rod is used as the heating source 2. The number of heating rods can be flexibly increased or decreased according to the specific needs of the chip aging test, and the heating power can be accurately adjusted to achieve refined control of the chip temperature. The design of the heating rod being inserted into the upper end of the cover 1 shortens the heat conduction path, reduces heat loss, and enables heat to be quickly and efficiently conducted to the cover 1 and the coolant, effectively improving the temperature control response speed. The water inlet 10 and the water outlet 11 are arranged at the top of the cover 1, which optimizes the flow path of the coolant, so that the coolant forms a more uniform circulation flow in the fluid flow cavity 8, enhances the heat exchange efficiency, ensures that the temperature distribution on the chip surface is uniform, avoids local overheating or overcooling, and further improves the accuracy and reliability of the test results. The sealing groove is arranged at the lower end of the cover 1, and the sealing design of the heat sink 3 to the open end of the sealing groove is matched. A rubber sealing strip that is resistant to heat and coolant corrosion is embedded in the sealing groove, and the heat sink 3 and the cover 1 are fixed by evenly distributed fastening screws to ensure the sealing effect. This sealing method not only effectively prevents leakage of the coolant and ensures the stability of the system operation, but also enhances the structural strength of the system to a certain extent, while not affecting the heat exchange efficiency between the heat sink 3 and the coolant. In other embodiments, the heating source 2 can also be made of a heating sheet.

[0071] Embodiment 4

[0072] See also Figures 2-4 This embodiment can be realized by manufacturing the liquid cooling system in Example 3. This design proposes an implementation method, a temperature control method for chip aging test, starting the heating source 2, the heating source 2 first preheats or cools the coolant flowing into the water inlet 10, and the coolant then flows into the fluid flow cavity 8, and the heating source 2 continues to heat or cool the coolant.

[0073] This embodiment is based on the liquid cooling system structure of the third embodiment, and realizes efficient and accurate control of the chip temperature by preheating or cooling the coolant. First, the pretreatment of the coolant at the water inlet 10 by the heating source 2 makes the coolant adjust its temperature before entering the fluid flow cavity 8, shortening the time for the chip to reach the target temperature and effectively improving the temperature control response speed; secondly, the continuous heating or cooling of the coolant by the heating source 2 can dynamically adjust the coolant temperature according to the real-time operating state of the chip, forming a closed-loop temperature control system, realizing refined and dynamic control of the chip temperature, avoiding test errors caused by temperature fluctuations, and effectively ensuring the accuracy and reliability of the chip aging test results. Furthermore, thanks to the layout of the liquid cooling system in the third embodiment, the pretreated coolant can form a more uniform and stable temperature field in the fluid flow cavity 8, and cooperate with the heat exchange design of the microchannel 7 of the heat sink 3 to ensure that the temperature distribution on the chip surface is uniform, effectively avoiding local overheating or overcooling, providing a stable test environment for the chip, extending the service life of the chip, and improving the operating stability of the test equipment.

[0074] Example 5

[0075] Please refer to Figure 2 、 Figure 5 and Figure 6 and, this design proposes an implementation method, a liquid cooling system for chip aging test. The heat sink 3 includes a mounting plate and a first group of fin bodies 4 and a second group of fin bodies 5 arranged on the mounting plate. The mounting plate covers the opening end of the sealing groove. The first group of fin bodies 4 and the second group of fin bodies 5 extend into the sealing groove. The first group of fin bodies 4 includes at least one first fin body 401, and the second group of fin bodies 5 includes at least one second fin body 501. The first fin body 401 is parallel to and staggered with the second group of fin bodies 5. The microchannel 7 is formed by the gap 6 generated between the first fin body 401 and the second group of fin bodies 5.

[0076] In this embodiment, the heat sink 3 adopts a double-group fin body staggered structure design, specifically including the composite structure of the first group and the second group of fin bodies 5. The two groups of fin bodies are arranged in parallel and staggered, which not only effectively increases the contact area between the coolant and the heat sink 3, enables the coolant to fully absorb heat, greatly improves the heat exchange efficiency, speeds up the heat dissipation speed of the chip, ensures that the chip maintains a stable temperature range during the aging test, reduces the influence of temperature fluctuations on the test results, and improves the test accuracy. The microchannel 7 formed by the fin body gap 6 can precisely guide the flow of the coolant, promote the coolant to form a uniform and stable laminar flow state, avoid local fluid dead angles or turbulent flow phenomena, ensure the uniformity of the chip surface temperature distribution, prevent performance degradation or test failure caused by local overheating, and provide a reliable temperature environment for the chip aging test. In addition, the staggered fin bodies can also buffer the vibration generated by the fluid flow, reduce the system operation noise, and optimize the test environment. This double-group fin body staggered structure design is reasonable and can be realized by using conventional stamping or milling processes. While ensuring high-efficiency heat dissipation, it does not significantly increase the manufacturing cost, has good economy and practicability, and can flexibly adjust the number of fin bodies and the gap 6 according to the heat dissipation requirements of different chips, and is applicable to a variety of chip aging test scenarios.

[0077] Example 6

[0078] Please refer to Figure 2 、 Figure 5 and Figure 6 and, this embodiment can implement the implementation method proposed by this design, a temperature control method for chip aging test, by manufacturing the liquid cooling system in Example 5. When the coolant flows in the fluid flow chamber 8, it flows between the first group of fin bodies 4, between the second group of fin bodies 5, and between the first group of fin bodies 4 and the second group of fin bodies 5.

[0079] Based on the structure of the heat sink 3 of the liquid cooling system, this embodiment realizes efficient and precise control of the chip temperature by guiding the coolant to flow through multiple paths between the first and second groups of fin bodies 5 and their gaps. This design greatly extends the contact time between the coolant and the heat sink 3, uses a large-area heat exchange interface to quickly remove heat, ensures that the chip temperature is quickly and stably within the target range, reduces the test time and improves the efficiency. The multi-path flow mode promotes the formation of a uniform temperature field distribution of the coolant in the fluid flow cavity 8, avoids local temperature deviation, ensures uniform heating or heat dissipation of each area on the chip surface, and improves the consistency and reliability of the aging test results. In addition, the natural flow guiding characteristics of the fin bodies are used to reduce the use of additional fluid control components, reduce the system complexity and energy consumption, optimize the coolant flow resistance, make the fluid flow smoother and more stable, and reduce the noise, providing a quiet and stable test environment. This temperature control method can also flexibly adjust the coolant flow rate and velocity according to the heat load characteristics of the chip, adapt to diverse test requirements, and improve the versatility and adaptability.

[0080] Embodiment Seven

[0081] Please refer to Figure 7 , this design proposes an implementation method, a liquid cooling system for chip aging test. The cross-section of the fluid flow cavity 8 is set as a hexagon. The water inlet 10 and the water outlet 11 are both arranged at the top of the cover 1, and the water inlet 10 and the water outlet 11 respectively extend to the diagonal ends of the fluid flow cavity 8 and are communicated with the fluid flow cavity 8. The heating source 2 is laid flat on the upper end of the fluid flow cavity 8.

[0082] In this embodiment, by setting the cross-section of the fluid flow cavity 8 as a hexagon, the hexagonal cross-section enables the coolant to have uniform forces on each side when flowing in the cavity, and can form a stable spiral laminar flow, avoiding the fluid turbulence phenomenon caused by the corners of the traditional shape. This laminar flow state can make the contact time between the coolant and the heat sink 3 and the chip surface more consistent, and the heat exchange more sufficient, thus ensuring uniform distribution of the chip surface temperature. At the same time, it reduces the fluid flow blind area and turbulence phenomenon, enables the coolant to fully contact the heat sink 3 and the chip surface, significantly improves the heat exchange efficiency, quickly removes the heat generated during the chip aging test, and ensures stable and controllable chip temperature.

[0083] Embodiment Eight

[0084] Please refer to Figure 7 , this embodiment can implement the implementation method proposed by this design, a temperature control method for chip aging test, by manufacturing the liquid cooling system in Embodiment Seven. When the coolant flows in the hexagonal fluid flow cavity 8, the two sides of the fluid flow cavity 8 shrink towards the middle, and the coolant on both sides converges towards the middle, accelerating the outflow of the fluid flow cavity 8 from the water outlet 11.

[0085] In this embodiment, based on the hexagonal fluid flow chamber 8 liquid cooling system of Embodiment VII. First, both sides of the fluid flow chamber 8 contract towards the middle, effectively accelerating the flow rate of the coolant by the Venturi effect, greatly shortening the circulation period of the coolant in the chamber, accelerating the heat transfer rate, being able to quickly remove the heat generated by the chip during the aging test, effectively improving the heat dissipation efficiency of the system, ensuring that the chip temperature quickly drops to the target range, effectively avoiding chip performance degradation or test errors caused by heat accumulation, and improving the accuracy and reliability of the test results. The accelerated coolant can quickly update the fluid in the chamber, making the temperature field in the entire fluid flow chamber 8 more uniform, avoiding excessive temperature in local areas due to heat accumulation, and further improving the stability and reliability of temperature control.

[0086] Embodiment IX

[0087] Please refer to Figures 4-5 , this design proposes an implementation method, a liquid cooling system for chip aging test, a heat conduction pad 13 is provided at the bottom end of the heat sink 3, and the heat conduction pad 13 is used to connect with the chip.

[0088] In this embodiment, the setting of the heat conduction pad 13 effectively fills the tiny gap between the heat sink 3 and the chip, eliminates the thermal resistance caused by surface unevenness, greatly improves the heat conduction efficiency, enables the heat generated by the chip during the aging test to be quickly and efficiently transferred to the heat sink 3, significantly reduces the chip operating temperature, avoids performance degradation or test errors caused by heat accumulation, and effectively improves the accuracy and reliability of the aging test results.

[0089] Embodiment X

[0090] Please refer to Figures 4-5 , this embodiment can implement the implementation method proposed by this design, a temperature control method for chip aging test, by manufacturing the liquid cooling system in Embodiment IX. The chip is bonded to the heat conduction pad 13, and the temperature is sequentially conducted from the heat source 2 to the cover 1, the coolant, the microchannel 7, the heat sink 3, and the heat conduction pad 13, and finally conducted to the chip.

[0091] In this embodiment, based on the liquid cooling system with the additional heat conduction pad 13 in Embodiment IX. First, the chip is bonded to the heat conduction pad 13, cooperating with the path of the heat from the heat source 2 being conducted to the chip through multiple levels, effectively reducing the loss during the heat transfer process. Utilizing the high thermal conductivity and close fitting characteristics of the heat conduction pad 13, the heat can be quickly and efficiently conducted to the chip, effectively improving the heating response speed of the system, ensuring that the chip temperature can quickly reach the target test temperature, greatly shortening the test preparation time, and improving the aging test efficiency. At the same time, the flexible material of the heat conduction pad 13 can buffer the stress generated by the difference in thermal expansion coefficients between the chip and the heat sink 3, enhancing the reliability and stability of the temperature control method.

[0092] Please refer to Figures 11-14 , where Figure 12 is a continuation of Figure 11 's table, Figure 14 is a continuation of Figure 13 's table.

[0093] In Figure 11 and Figure 12 , the boundary conditions for the temperature control method of the liquid cooling system and the application system are: power is 750W; flow rate is 6 / 8 / 10 / 12 / 14L / MIN; ambient temperature is 26°; the material of thermal pad 13 is 0.3mm thick, 80W; the coolant is ethylene glycol 305; the initial water temperature is 25°; there is no pressure difference (the pressure difference between the front and back water pressures of the coolant); the surface temperature of chip 14 is the three-point temperature difference (the temperature difference between three local surfaces of chip 14) < 3.

[0094] From Figure 11 and Figure 12 , the conclusion can be drawn that:

[0095] When the inlet water temperature is adjusted to 10° and the flow rate is 10L / min, the highest temperature of chip 14 is 30.1°, the heating rod works at 0W, the temperature difference between the local surfaces of chip 14 is 1.9°, and the pressure difference (the pressure difference between the front and back water pressures of the coolant) is 110.6kp. The liquid cooling system and temperature control method for chip 14 aging test;

[0096] When the inlet water temperature is adjusted to 65° and the flow rate is 1L / min, the highest temperature of chip 14 is 107.9°, the heating rod works at 20W, the temperature difference between the local surfaces of chip 14 is 2.2°, and the pressure difference (the pressure difference between the front and back water pressures of the coolant) is 1.4kp. The liquid cooling system and temperature control method for chip 14 aging test;

[0097] From Figure 11 and Figure 12 , the conclusion can be drawn that: When the inlet water temperature, water flow rate, and the working wattage of the heating rod are quantified, the surface temperature of chip 14 is evenly distributed, the temperature difference between the local surfaces of chip 14 is small, and the pressure difference (the pressure difference between the front and back water pressures of the coolant) is small. Using this temperature control method, the surface temperature of chip 14 is balanced, the coolant flows smoothly, and the temperature transfer efficiency is high, ensuring stable and accurate aging tests and improving the test efficiency and reliability of the temperature control method.

[0098] In Figure 13 and Figure 14 are the relevant data charts for testing the chip 14 to be heated with a size of 74*67. Among them, Tj thermal density is the heat transferred from chip 14 to the heat sink 3 and then from the heat sink 3 to the coolant.

[0099] The thermal resistance coefficient affects the heat transfer efficiency. The calculation formula for thermal resistance is:

[0100]

[0101] From Figure 13 and Figure 14 it can be concluded that: when the quantity is the size of the chip 14 to be heated, the material parameters of the heat-conducting pad 13, the test time, the inlet temperature of the coolant, the preset test flow rate of the coolant, and the original power of the chip 14, the heat dissipation effects of the heat sink 3 and the flowing coolant on the original power chip 14 are as follows: the temperature difference of each local range of the chip 14 is small, the thermal resistance is small, the heat on the surface of the chip 14 can be transferred away quickly and efficiently, and the surface temperature of the chip 14 is effectively reduced. Using this temperature control method, not only is the heat dissipation efficiency high, but also the local temperatures of each part of the chip 14 are balanced, improving the test efficiency and reliability of the temperature control method.

[0102] The above is only a preferred embodiment of the present invention, and it is not a limitation of the present invention in any form. Although the present invention is disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, when making some changes or modifications using the above-disclosed technical content into equivalent embodiments of equivalent changes, but as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical means of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A liquid cooling system for chip aging test, characterized in that, Comprising: A cover (1), a sealing groove is provided at the bottom end of the cover (1), and the bottom end of the sealing groove is an open end; A heating source (2), arranged on the cover (1), and the heating source (2) is used to heat the cover (1); A heat sink (3), a microchannel (7) is provided at the top end of the heat sink (3), the microchannel (7) extends from the heat sink (3) into the sealing groove, and the bottom end of the heat sink (3) covers the open end of the sealing groove of the cover (1); A fluid flow cavity (8), defined by the inner wall of the sealing groove and the end of the heat sink (3) extending into and covering the sealing groove; A water flow port (9), including a water inlet (10) and a water outlet (11), arranged on the cover (1), and both the water inlet (10) and the water outlet (11) are communicated with the fluid flow cavity (8); A bottom plate (12), arranged at the bottom of the heat sink (3), and the bottom plate (12) is used to hold a chip, and the chip is arranged between the heat sink (3) and the bottom plate (12).

2. The liquid cooling system for chip aging test according to claim 1, characterized in that, The heating source (2) is composed of a heating rod, at least one heating rod is provided, both the water inlet (10) and the water outlet (11) are arranged at the top end of the cover (1), the heating rod penetrates through the upper end of the cover (1), and the sealing groove is arranged at the lower end of the cover (1).

3. The liquid cooling system for chip aging test according to claim 1 or 2, characterized in that, The heat sink (3) includes a mounting plate and a first group of fin bodies (4) and a second group of fin bodies (5) arranged on the mounting plate. The mounting plate covers the open end of the sealing groove. The first group of fin bodies (4) and the second group of fin bodies (5) extend into the sealing groove. The first group of fin bodies (4) includes at least one first fin body (401), and the second group of fin bodies (5) includes at least one second fin body (501). The first fin body (401) is parallel and staggered with the second group of fin bodies (5), and the microchannel (7) is formed by the spacing (6) generated by the first fin body (401) and the second group of fin bodies (5).

4. A liquid cooling system for chip aging test according to claim 1 or 2, characterized in that, The cross-section of the fluid flow cavity (8) is hexagonal, both the water inlet (10) and the water outlet (11) are arranged at the top end of the cover (1), and the water inlet (10) and the water outlet (11) respectively extend to the diagonal ends of the fluid flow cavity (8) and are communicated with the fluid flow cavity (8), and the heating source (2) is laid flat on the upper end of the fluid flow cavity (8).

5. The liquid cooling system for chip aging test according to claim 1 or 2, characterized in that, A heat-conducting pad (13) is provided at the bottom end of the heat sink (3), and the heat-conducting pad (13) is used to connect with the chip.

6. A temperature control method for chip aging test, applicable to the liquid cooling system for chip aging test described in any one of claims 1-5, characterized in that, Using the heating source (2) and a coolant to perform two-way temperature control on the chip, the steps are as follows: S1: The coolant flows into the fluid flow cavity (8) from the water inlet (10) and flows out of the fluid flow cavity (8) from the water outlet (11); S2: Start the heating source (2) to conduct temperature to the cover (1); S3: The temperature is sequentially conducted from the heating source (2) to the cover (1) and the coolant in the fluid flow cavity (8) to complete the first heat exchange; S4: The flowing cooling liquid at the first heat exchange temperature flows through the microchannel (7) of the heat sink (3) to complete the second heat exchange, and the temperature of the second heat exchange is sequentially conducted from the microchannel (7) to the heat sink (3) and the chip.

7. The temperature control method for chip aging test according to claim 6, wherein, When the cooling liquid flows in the hexagonal fluid flow cavity (8), the two sides of the fluid flow cavity (8) contract towards the middle, and the cooling liquid on both sides converges towards the middle, accelerating the outflow of the fluid flow cavity (8) from the water outlet (11).

8. A temperature control method for chip aging test according to claim 6 or 7, characterized in that, When the cooling liquid flows in the fluid flow cavity (8), it flows between the first group of fin bodies (4), between the second group of fin bodies (5), and between the first group of fin bodies (4) and the second group of fin bodies (5).

9. A temperature control method for chip aging test according to claim 6 or 7, characterized in that, Bond the chip to the thermal pad (13), and the temperature is sequentially conducted from the heating source (2) to the cover (1), the cooling liquid, the microchannel (7), the heat sink (3) and the thermal pad (13), and finally conducted to the chip.

10. A temperature control method for chip aging test according to claim 6 or 7, characterized in that, Start the heating source (2), the heating source (2) first pre-heats or cools the cooling liquid flowing into the water inlet (10), and then the cooling liquid flows into the fluid flow cavity (8), and the heating source (2) continuously heats or cools the cooling liquid.

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