LED lamp bead plate for backlight screen and preparation method of LED lamp bead plate

Abstract

The invention relates to the technical field of display equipment, in particular to an LED lamp bead plate for a backlight screen and a preparation method of the LED lamp bead plate, and the LED lamp bead plate comprises a heat dissipation substrate, a flexible circuit board, a plurality of lenses, a light reflection partition and a transparent cover plate. The heat dissipation substrate is provided with a plurality of sets of protruding parts, the flexible circuit board is laid on the heat dissipation substrate and the protruding parts, and a light-emitting chip is installed on the flexible circuit board. The lens covers the periphery of the corresponding set of protruding parts, the light-reflecting baffles are arranged on the flexible circuit board, the light-reflecting baffles are arranged between every two adjacent sets of protruding parts, and the space between every two adjacent light-reflecting baffles is filled with a transparent adhesive layer. The transparent cover plate is laid on the transparent adhesive layer. The lens is in the biconvex shape with the concave middle, the convex surface area of the lens is increased, and therefore the light-emitting angle is increased, the number of light-emitting chips can be reduced, and heat generated by the light-emitting chips is reduced. Meanwhile, the light-emitting chips are gathered on the protruding parts, the heat conduction performance of the protruding parts is improved, heat can be dissipated in a concentrated and targeted mode, and the service life of the backlight source is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to an LED lamp bead board for a backlight screen and a preparation method thereof. Background Art

[0002] As a key component in modern display technology, the performance of the backlight screen directly affects the brightness, uniformity and energy consumption of the display device. As the core part of the backlight screen, the LED lamp bead board undertakes the important task of converting electrical energy into light energy. With the continuous advancement of display technology, higher requirements are placed on the heat dissipation efficiency, light distribution uniformity and structural stability of the LED lamp bead board.

[0003] In the prior art, an intelligent LED lamp structure based on an LED backlight source includes a lamp assembly for lighting. The lamp assembly includes a lampshade, a mounting plate is provided inside the lampshade, and a plurality of rows of LED lamp bead board groups are provided at the bottom end of the mounting plate, each row of LED lamp bead board groups is provided with a plurality of LED lamp beads, and the plurality of LED lamp beads in each row of LED lamp bead board groups are connected in series. The structure is provided with a rotation switching mechanism, so that under normal working conditions, the plurality of rows of LED lamp bead board groups will work in turn at set time intervals, ensuring that within a certain period of time, there is always a row of LED lamp bead board groups in a resting state, and the LED lamp bead board groups in other rows are in a working state.

[0004] In this structure, multiple LED lamp beads are evenly laid out, and a large area needs to be fully covered to solve the problem of heat accumulation that may be caused by long-term continuous operation. If the heat generated by the light-emitting chip during operation cannot be effectively discharged, it will cause heat accumulation and affect the stability and life of the LED. Summary of the invention

[0005] In order to solve the hidden danger of untimely heat dissipation caused by heat accumulation caused by long-term continuous work and fully cover a large area, the present application provides an LED lamp bead board for a backlight screen and a preparation method thereof.

[0006] The present application provides an LED lamp bead board for a backlight screen and a preparation method thereof, which adopts the following technical solutions: On the one hand, an LED lamp bead board for a backlight screen and a preparation method thereof, comprising: The heat dissipation substrate is strip-shaped and has a plurality of protrusions spaced apart along its length direction, with each two adjacent protrusions forming a group, and the cross section of the protrusion perpendicular to the width direction of the heat dissipation substrate is trapezoidal and has three mounting surfaces; A flexible circuit board is laid on the heat dissipation substrate and the raised portion, and a light-emitting chip is installed at a position of the flexible circuit board corresponding to each of the mounting surfaces; A plurality of lenses, corresponding to each group of the raised portions one by one, the lenses are biconvex with a concave middle portion, and are arranged around the periphery of a corresponding group of the raised portions, the lenses have two raised portions and a concave portion, the raised portions correspond to the raised portions one by one, and the concave portion is located between the two raised portions; A reflective baffle is provided on the flexible circuit board, wherein the reflective baffle is provided between each two adjacent groups of the protrusions, and a transparent adhesive layer is filled between two adjacent reflective baffles; A transparent cover plate is laid on the transparent adhesive layer.

[0007] By adopting the above technical solution, the lens is double-convex with a concave middle part, which increases the convex area of ​​the lens, thereby increasing the light-emitting angle, and can reduce the number of light-emitting chips and reduce the heat generated by the light-emitting chips. At the same time, the light-emitting chips are gathered on the raised part, which improves the thermal conductivity of the raised part, can dissipate heat in a concentrated and targeted manner, and extend the service life of the backlight source. In the case where more light-emitting chips are gathered on the raised part and more heat is generated, the setting of the concave and convex parts can more effectively conduct the heat away, thereby improving the heat dissipation efficiency, reducing the operating temperature, and extending the service life of the light-emitting chips. Because the light-emitting chips are denser, the generated light can be more effectively mixed under the action of the lens, reducing the direct gap between the light rays, thereby improving the uniformity of the light, avoiding the phenomenon of local overbrightness or overdarkness, and improving the display quality of the backlight screen.

[0008] Optionally, a concave-convex portion is provided between two of the convex portions in the same group of convex portions, and the concave-convex portion is located on the flexible circuit board.

[0009] By adopting the above technical solution, the number of reflections of light on the flexible circuit board is increased, making the light output more uniform.

[0010] Optionally, the distance between two protrusions in the same group of protrusions is smaller than the distance between two adjacent groups of protrusions.

[0011] By adopting the above technical solution, the uniformity of light is improved, the phenomenon of local over-brightness or over-darkness is avoided, and the display quality of the backlight screen is improved.

[0012] Optionally, the thermal conductivity of the protrusion is greater than the thermal conductivity of the heat dissipation substrate.

[0013] By adopting the above technical solution, the light-emitting chips are concentrated on the protruding parts, and the heat generated by the light-emitting chips can be discharged through the protruding parts and the heat dissipation substrate, thereby improving the heat dissipation effect of the light-emitting chips.

[0014] Optionally, two adjacent reflective partitions are spliced ​​together to enclose a sealed space.

[0015] By adopting the above technical solution, the light spillage in the width direction of the heat dissipation substrate is reduced and the utilization rate of the light is improved.

[0016] Optionally, the reflective baffle is in an I-shape, and the sealed space is in a rectangular shape.

[0017] By adopting the above technical solution, the stability of the reflective barrier is improved, thereby maintaining the structural integrity and durability of the backlight screen.

[0018] Optionally, the angle formed between the reflective barrier side wall and the flexible circuit board is an obtuse angle.

[0019] By adopting the above technical solution, the stability of the reflective barrier is increased, while the influence on the light output of the backlight source is avoided as much as possible.

[0020] Optionally, the angle formed between the reflective barrier side wall and the flexible circuit board is 110°-130°.

[0021] By adopting the above technical solution, the thickness of the end of the reflective barrier close to the heat dissipation substrate is larger, which can reduce the light spillage at the end close to the heat dissipation substrate.

[0022] Optionally, the area of ​​the light-emitting region projected by the plurality of light-emitting chips on the same group of the raised portions on the transparent cover plate is larger than the area of ​​the region enclosed by the reflective barrier on the transparent cover plate.

[0023] By adopting the above technical solution, the direct gap between the light rays is reduced, thereby improving the uniformity of the light.

[0024] On the other hand, a method for preparing an LED lamp bead board for a backlight screen comprises the following steps: A strip-shaped heat dissipation substrate is provided, wherein a plurality of protrusions are arranged at intervals in the length direction of the heat dissipation substrate, and each two adjacent protrusions form a group, and the cross section of the protrusions perpendicular to the width direction of the heat dissipation substrate is trapezoidal and has three mounting surfaces; Providing a flexible circuit board, laying the flexible circuit board on the heat dissipation substrate and the protruding portion, and installing light-emitting chips at positions on the flexible circuit board corresponding to each of the mounting surfaces; A plurality of lenses are provided, wherein the plurality of lenses correspond one-to-one to the plurality of groups of protrusions, the lenses are in a biconvex shape with a concave middle portion, the lens cover is arranged around the periphery of a corresponding group of protrusions, the lens has two protrusions and a concave portion, the protrusions correspond one-to-one to the protrusions, and the concave portion is located between the two protrusions; A reflective baffle is formed on the flexible circuit board, wherein the reflective baffle is provided between each two adjacent groups of the protrusions, and a transparent adhesive layer is filled between each two adjacent reflective baffles; Provide a transparent cover plate and lay the transparent cover plate on the transparent adhesive layer.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. The lens is a double-convex shape with a concave middle part, which increases the convex surface area of the lens, thereby increasing the light-emitting angle, reducing the number of light-emitting chips, and reducing the heat generated by the light-emitting chips. At the same time, the light-emitting chips are concentrated on the convex part, improving the heat conduction performance of the convex part, enabling centralized and targeted heat dissipation, and extending the service life of the backlight source.

[0026] 2. Since the light-emitting chips are denser, the light generated can be more effectively mixed under the action of the lens, reducing the direct gap between the lights, thereby improving the light uniformity, avoiding the phenomenon of local over-brightness or over-darkness, and enhancing the display quality of the backlight screen.

[0027] 3. An uneven part is provided between two of the convex parts in the same group of convex parts., increasing the number of reflections of light on the flexible circuit board, making the light output more uniform. Description of the Drawings

[0028] Figure 1 is a schematic structural diagram of an LED lamp bead board for a backlight screen in an embodiment of the present application; Figure 2 is Figure 1 an enlarged schematic view of part A in

[0029] Description of the Reference Numerals: 1. Heat dissipation substrate; 2. Convex part; 3. Flexible circuit board; 4. Light-emitting chip; 5. Lens; 51. Raised part; 52. Concave part; 6. Reflective partition; 7. Transparent adhesive layer; 8. Transparent cover plate; 9. Uneven part. Detailed Embodiments

[0030] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the attached Figure 1-2 , Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0031] An embodiment of the present application discloses an LED lamp bead board for a backlight screen. Referring to Figure 1 , the LED lamp bead board for a backlight screen includes a heat dissipation substrate 1, a flexible circuit board 3, a plurality of lenses 5, a reflective partition 6, and a transparent cover plate 8.

[0032] The heat dissipation substrate 1 is strip-shaped and has a plurality of raised portions 2 spaced apart along its length direction, with each two adjacent raised portions 2 forming a group. The cross-section of the raised portion 2 perpendicular to the width direction of the heat dissipation substrate 1 is trapezoidal and has three mounting surfaces, namely a top surface and two side waist surfaces.

[0033] The flexible circuit board 3 is laid on the heat dissipation substrate 1 and the raised portion 2. Due to the raised portion 2, the flexible circuit board 3 is bent at the position of the raised portion 2, and the flexible circuit board 3 fits the heat dissipation substrate 1 and the raised portion 2. The flexible circuit board 3 is installed with light-emitting chips 4 at positions corresponding to each mounting surface. The flexible circuit board 3 has a circuit. The light-emitting chip 4 is electrically connected to the flexible circuit board 3. The heat dissipation substrate 1 and the raised portion 2 both have thermal conductivity properties. The heat generated by the light-emitting chip 4 can be discharged through the raised portion 2 and the heat dissipation substrate 1. The light-emitting chip 4 is gathered on the raised portion 2. The thermal conductivity of the raised portion 2 is greater than that of the heat dissipation substrate 1, which can improve the heat dissipation effect of the light-emitting chip 4.

[0034] There are many options for the material of the heat dissipation substrate 1, as long as it can support and install the flexible circuit board 3 and the light-emitting chip 4 and achieve a heat dissipation effect.

[0035] A plurality of lenses 5 correspond to each group of protrusions 2 one by one, and are covered on the periphery of the corresponding group of protrusions 2. Figure 2 The lens 5 has two raised portions 51 and a recessed portion 52, the raised portions 51 correspond to the raised portions 2 one by one, and the recessed portion 52 is located between the two raised portions 2. The lens 5 is a double convex shape with a recessed middle portion, which increases the convex surface area of ​​the lens 5, thereby increasing the light-emitting angle, and can reduce the number of light-emitting chips 4 and the heat generated by the light-emitting chips 4. At the same time, the light-emitting chips 4 are gathered on the raised portions 2, which improves the thermal conductivity of the raised portions 2, can dissipate heat in a concentrated and targeted manner, and extend the service life of the backlight source.

[0036] The reflective baffle 6 is arranged on the flexible circuit board 3, and a reflective baffle 6 is arranged between each two adjacent groups of protrusions 2 to reflect the light emitted from the side of the light-emitting chip 4, thereby improving the brightness of the light emitted in the light emitting direction and reducing the light spillover. A transparent adhesive layer 7 is filled between two adjacent reflective baffles 6, and a transparent cover plate 8 is laid on the transparent adhesive layer 7.

[0037] In this embodiment, two adjacent reflective baffles 6 are spliced ​​to enclose a sealed space, which reduces the light spillover in the width direction of the heat dissipation substrate 1 and improves the light utilization rate. Specifically, from a top view, the reflective baffle 6 is in an I-shape and the sealed space is rectangular, which improves the stability of the reflective baffle 6 and makes it difficult for the reflective baffle 6 to deform when subjected to external force, thereby maintaining the structural integrity and durability of the backlight screen.

[0038] The angle formed between the side wall of the reflective baffle 6 and the flexible circuit board 3 is an obtuse angle, which provides a larger contact area and stronger support, increasing the stability of the reflective baffle 6; on the other hand, when the light-emitting chip 4 emits light, the light can be emitted smoothly, and the light output of the backlight source is avoided as much as possible. When the light-emitting chip 4 emits light, the light can be more effectively concentrated in the light output direction after being reflected by the reflective baffle 6, which helps to improve the light output and brightness of the backlight source.

[0039] The angle formed between the side wall of the reflective baffle 6 and the flexible circuit board 3 is 110°-130°. The thickness of the end of the reflective baffle 6 close to the heat dissipation substrate 1 is larger, which can reduce the light spillage at the end close to the heat dissipation substrate 1, effectively control the propagation path of the light, reduce the light leakage at the bottom, and improve the light efficiency utilization rate.

[0040] A plurality of light-emitting chips 4 are correspondingly arranged in the same lens 5, and the plurality of light-emitting chips 4 are arranged on the trapezoidal raised portion 2, so that the two light-emitting chips 4 located in the middle emit light in opposite directions. On the one hand, it can achieve the effect of forced light mixing, making the light output more uniform, and at the same time greatly reduces the light mixing distance, thereby compensating for the defect of increased thickness caused by the setting of the raised portion 2.

[0041] A concave-convex portion 9 is provided between two convex portions 2 in the same group of convex portions 2, and the side of the concave-convex portion 9 facing away from the heat dissipation substrate 1 is a concave-convex surface, which increases the number of reflections of light on the flexible circuit board 3, making the light output more uniform. Multiple reflections help reduce direct irradiation of light, making the light emission softer, improving the uniformity of light, avoiding the phenomenon of local overbrightness or overdarkness, and thus improving the display quality of the backlight screen.

[0042] The concave-convex portion 9 has thermal conductivity. The concave-convex portion 9 is formed between the convex portions 2, which can increase the contact area between the concave-convex portion 9 and the air, and help the heat to be dissipated through more surfaces. Especially when more light-emitting chips 4 are gathered on the convex portion 2 and more heat is generated, the setting of the concave-convex portion 9 can more effectively conduct the heat, thereby improving the heat dissipation efficiency, reducing the operating temperature, and extending the service life of the light-emitting chip 4.

[0043] The distance between two protrusions 2 in the same group of protrusions 2 is smaller than the distance between two adjacent groups of protrusions 2. Since the light emitting chips 4 are denser, the generated light can be more effectively mixed under the action of the lens 5, reducing the direct gap between the light, thereby improving the uniformity of light, avoiding the phenomenon of local overbrightness or overdarkness, and improving the display quality of the backlight screen.

[0044] Since the distance between the protrusions 2 is smaller, heat dissipation of the protrusions 2 can be more concentrated, thereby reducing the working temperature and prolonging the service life of the LED lamp beads. In addition, the smaller distance between the protrusions 2 can also increase the number of reflections of light on the flexible circuit board 3, making the light output more uniform. This is because light has more opportunities to be reflected and mixed during the propagation process, thereby improving the uniformity of light and the overall light-emitting effect.

[0045] The area of the light-emitting region projected by the multiple light-emitting chips 4 on the same set of protrusions 2 on the transparent cover plate 8 is larger than the area of the region surrounded by the light-reflecting partitions 6 on the transparent cover plate 8. If the light-emitting region is small, it may cause the appearance of light spots or shadows, especially in high-brightness regions. By increasing the light-emitting region, this non-uniformity can be reduced, making the light distribution smoother. The light can pass through the transparent cover plate 8, thereby improving the utilization rate of light efficiency, making the brightness of the backlight screen more uniform, and improving the overall light-emitting efficiency.

[0046] The present application also discloses a method for preparing an LED lamp bead board for a backlight screen, including the following steps: Provide a strip-shaped heat dissipation substrate 1, and arrange a plurality of protrusions 2 at intervals in the length direction of the heat dissipation substrate 1. Every two adjacent protrusions 2 form a group. The cross-section of the protrusion 2 perpendicular to the width direction of the heat dissipation substrate 1 is trapezoidal and has three mounting surfaces; Provide a flexible circuit board 3, lay the flexible circuit board 3 on the heat dissipation substrate 1 and the protrusions 2, and install light-emitting chips 4 at positions corresponding to each mounting surface; Provide a plurality of lenses 5, the plurality of lenses 5 correspond to the plurality of groups of protrusions 2 one by one. The lens 5 is a double-convex shape with a middle depression. Cover the lens 5 around the corresponding set of protrusions 2. The lens 5 has two raised portions 51 and a depression portion 52. The raised portions 51 correspond to the protrusions 2 one by one, and the depression portion 52 is located between two protrusions 2; Form a light-reflecting partition 6 on the flexible circuit board 3. A light-reflecting partition 6 is provided between every two adjacent sets of protrusions 2, and a transparent adhesive layer 7 is filled between two adjacent light-reflecting partitions 6; Provide a transparent cover plate 8, and lay the transparent cover plate 8 on the transparent adhesive layer 7.

[0047] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0048] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. An LED lamp bead board for a backlight screen, characterized in that, Comprising: A heat dissipation substrate (1), which is strip-shaped and is provided with a plurality of convex portions (2) at intervals along its own length direction. Every two adjacent convex portions (2) form a group. The cross-section of the convex portion (2) perpendicular to the width direction of the heat dissipation substrate (1) is trapezoidal and has three mounting surfaces; A flexible circuit board (3), which is laid on the heat dissipation substrate (1) and the convex portions (2). Light-emitting chips (4) are installed at positions corresponding to each of the mounting surfaces on the flexible circuit board (3); A plurality of lenses (5), which correspond to each group of the convex portions (2) one by one. The lens (5) is in a double-convex shape with a middle depression, and covers the periphery of a corresponding group of the convex portions (2). The lens (5) has two raised portions (51) and a depressed portion (52). The raised portions (51) correspond to the convex portions (2) one by one, and the depressed portion (52) is located between two of the convex portions (2); A reflective partition (6), which is arranged on the flexible circuit board (3). The reflective partition (6) is arranged between every two adjacent groups of the convex portions (2). A transparent adhesive layer (7) is filled between two adjacent reflective partitions (6); A transparent cover plate (8), which is laid on the transparent adhesive layer (7).

2. The LED lamp bead board for a backlight screen according to claim 1, wherein An uneven portion (9) is arranged between two of the convex portions (2) in the same group of the convex portions (2). The uneven portion (9) is located on the flexible circuit board (3).

3. The LED lamp bead board for a backlight screen according to claim 1, characterized in that, The distance between two of the convex portions (2) in the same group of the convex portions (2) is less than the distance between two adjacent groups of the convex portions (2).

4. The LED lamp bead board for a backlight screen according to claim 1, wherein, The thermal conductivity of the convex portion (2) is greater than the thermal conductivity of the heat dissipation substrate (1).

5. The LED lamp bead board for a backlight screen according to claim 1, characterized in that, Two adjacent reflective partitions (6) are spliced to enclose a sealed space.

6. The LED lamp bead board for a backlight screen according to claim 5, characterized in that, The reflective partition (6) is in an I shape, and the sealed space is rectangular.

7. The LED lamp bead board for a backlight screen according to claim 6, characterized in that, The angle formed between the side wall of the reflective partition (6) and the flexible circuit board (3) is an obtuse angle.

8. The LED lamp bead board for a backlight screen according to claim 7, characterized in that, The angle formed between the side wall of the reflective partition (6) and the flexible circuit board (3) is 110° - 130°.

9. The LED lamp bead board for a backlight screen according to claim 1, characterized in that, The area of the light-emitting region projected by the plurality of light-emitting chips (4) on the same group of the convex portions (2) on the transparent cover plate (8) is greater than the area of the region enclosed by the reflective partition (6) on the transparent cover plate (8).

10. A preparation method of an LED lamp bead board for a backlight screen, characterized in that, Including the following steps: Providing a strip-shaped heat dissipation substrate (1), and arranging a plurality of convex portions (2) at intervals in the length direction of the heat dissipation substrate (1). Every two adjacent convex portions (2) form a group. The cross-section of the convex portion (2) perpendicular to the width direction of the heat dissipation substrate (1) is trapezoidal and has three mounting surfaces; Providing a flexible circuit board (3), laying the flexible circuit board (3) on the heat dissipation substrate (1) and the convex portions (2), and installing light-emitting chips (4) at positions corresponding to each of the mounting surfaces on the flexible circuit board (3); Provide a plurality of lenses (5), and the plurality of lenses (5) correspond to multiple groups of the convex portions (2) one by one. The lens (5) is a double-convex shape with a concave middle portion. The lens (5) is covered around a corresponding group of the convex portions (2). The lens (5) has two raised portions (51) and a recessed portion (52). The raised portions (51) correspond to the convex portions (2) one by one, and the recessed portion (52) is located between two of the convex portions (2); Form a light-reflecting partition (6) on the flexible circuit board (3). The light-reflecting partition (6) is provided between every two adjacent groups of the convex portions (2), and a transparent adhesive layer (7) is filled between two adjacent light-reflecting partitions (6); Provide a transparent cover plate (8), and lay the transparent cover plate (8) on the transparent adhesive layer (7).

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