Production control method and production equipment of nano material and device for preparing nano material
By accurately obtaining the appearance and properties of the target material, designing a non-repetitive coverage moving path, combining the spot size and pulse frequency, the problem of low target utilization and melting efficiency in liquid phase laser technology is solved, and efficient and uniform preparation of nanomaterials is achieved.
Patent Information
- Application Number
- CN202510782459.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-12
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2045-06-12
AI Technical Summary
Liquid-phase laser technology has low target utilization and melting efficiency in nanomaterial preparation, making it difficult to achieve large-scale production.
By accurately obtaining the appearance, melting properties and laser parameters of the target, designing a non-repeated coverage target movement path, combining the ease of melting, spot size and pulse frequency of the target to determine the target movement speed, balance the energy input and heat dissipation efficiency, and using a controller and a mobile platform to prepare it with lasers, light guide components and sample pools.
It improves the utilization rate and melting efficiency of the target material, ensures that the laser energy acts uniformly on the entire surface of the target material, reduces invalid repeated melting, and is suitable for efficient and uniform preparation of nanoparticles in large-scale production.
Smart Images

Figure CN120285919A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of nanomaterial preparation, and particularly relates to a production control method and production equipment for nanomaterials, and a device for preparing nanomaterials. Background Art
[0002] With the continuous improvement of the performance of laser equipment and the gradual reduction of costs, more and more industries have shown strong interest in liquid-phase laser technology, and expect to use nanomaterials prepared by liquid-phase laser to manufacture high-value-added products such as high-performance catalysts, battery materials, functional coatings, and biomedical applications.
[0003] Although laser technology has been maturely applied in industrial batch processing, the industrial application of liquid-phase laser technology in nanoparticle preparation is still in its infancy, not yet fully mature, and large-scale production has not been popularized.
[0004] Currently, the preparation of nanomaterials using liquid-phase laser technology mostly involves fixed-point ablation, which easily leads to the problems of low target utilization rate and low ablation efficiency. Summary of the Invention
[0005] Based on this, it is necessary to provide a production control method and production equipment for nanomaterials, and a device for preparing nanomaterials in view of the above technical problems.
[0006] In a first aspect, this application provides a production control method for nanomaterials, which is applied to a device for preparing nanomaterials using liquid-phase laser technology. The device includes a laser, a light guiding component, a sample cell, and a moving platform. The laser is used to generate laser with a preset spot size and a preset pulse frequency. The sample cell is arranged on the moving platform and is used to contain the solution to be reacted and the target material. The light guiding component is arranged on the optical path between the sample cell and the laser to guide the laser into the sample cell containing the solution to be reacted and the target material. The method includes:
[0007] Obtain the shape of the target material, the ablation properties of the target material, the preset spot size, and the preset pulse frequency;
[0008] Determine the target moving path according to the shape of the target material;
[0009] Determine the target moving speed according to the ablation properties of the target material, the preset spot size, and the preset pulse frequency;
[0010] Drive the moving platform to move along the target moving path at the target moving speed, and during the movement of the moving platform, control the laser to generate laser so that the laser ablates on the target material along the target moving path.
[0011] In one embodiment, determining the target moving path according to the shape of the target material includes:
[0012] When the shape of the target material is rectangular, the target movement path is determined as a Z-shaped path.
[0013] In one embodiment, the method further includes:
[0014] During the process of driving the mobile platform to move along the target movement path at the target movement speed, obtain the real-time movement speed of the mobile platform;
[0015] When the real-time movement speed of the mobile platform is less than the target movement speed, reduce the pulse frequency of the laser;
[0016] When the real-time movement speed of the mobile platform is greater than the target movement speed, increase the pulse frequency of the laser.
[0017] In one embodiment, the method further includes:
[0018] During the process of driving the mobile platform to move along the target movement path at the target movement speed, obtain the real-time spot size of the laser;
[0019] When the real-time spot size of the laser is less than the preset spot size, increase the movement speed of the mobile platform;
[0020] When the real-time spot size of the laser is greater than the preset spot size, reduce the movement speed of the mobile platform.
[0021] In one embodiment, the method further includes:
[0022] During the process of driving the mobile platform to move along the target movement path at the target movement speed, obtain the real-time pulse frequency of the laser;
[0023] When the real-time pulse frequency of the laser is less than the preset pulse frequency, reduce the movement speed of the mobile platform;
[0024] When the real-time pulse frequency of the laser is greater than the preset pulse frequency, increase the movement speed of the mobile platform.
[0025] In one embodiment, before the step of driving the mobile platform to move along the target movement path at the target movement speed, it includes:
[0026] Obtain the starting target position of the target material;
[0027] When the starting target position of the target material is aligned with the laser emission position, drive the mobile platform to move along the target movement path at the target movement speed.
[0028] In a second aspect, the present application further provides a controller, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements the steps of the method in the above embodiments.
[0029] In a third aspect, the present application also provides a device for preparing nanomaterials using a liquid-phase laser technology. The device includes:
[0030] A laser, which is used to generate laser light with a preset spot size and a preset pulse frequency;
[0031] A moving platform;
[0032] A sample cell, which is arranged on the moving platform and is used to contain the solution to be reacted and the target material;
[0033] A light guiding component, which is arranged on the optical path between the sample cell and the laser to guide the laser light into the sample cell containing the solution to be reacted and the target material;
[0034] And the controller in the above embodiments, the controller is respectively connected to the laser and the moving platform.
[0035] In a fourth aspect, the present application also provides a production equipment for nanomaterials. The production equipment includes:
[0036] A sealed cabinet body, which has an accommodation space;
[0037] And the device for preparing nanomaterials using a liquid-phase laser technology in the above embodiments, the device for preparing nanomaterials using a liquid-phase laser technology is arranged in the accommodation space.
[0038] In one of the embodiments, the production equipment further includes:
[0039] A human-machine interaction terminal, which is connected to the controller and is used to input the shape of the target material, the erosion property of the target material, the preset spot size and the preset pulse frequency.
[0040] The above production control method and production equipment for nanomaterials, and the device for preparing nanomaterials have at least the following beneficial effects:
[0041] By accurately obtaining the shape of the target material, the erosion property and the laser parameters, designing a non-repetitive covering target moving path based on the shape of the target material, avoiding local over-consumption and waste of uncovered areas caused by repeated erosion in the annular area; at the same time, combining the erosion difficulty of the target material, the spot size and the pulse frequency to jointly determine the target moving speed, balancing the energy input and the heat dissipation efficiency. The combination of the above two makes the laser energy act uniformly on the entire surface of the target material, reducing ineffective repeated erosion, increasing the erosion area per unit time while reducing material loss, thereby significantly improving the utilization rate of the target material and the erosion efficiency, and laying a foundation for the efficient and uniform preparation of nanoparticles in large-scale production. Description of the Drawings
[0042] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.
[0043] Figure 1 One of the schematic flowcharts of the production control method of nanomaterials in an embodiment;
[0044] Figure 2 The structural schematic diagram of the device for preparing nanomaterials by using the liquid-phase laser technology in an embodiment;
[0045] Figure 3 The schematic diagram of the ablation path formed on the target in an embodiment;
[0046] Figure 4 Another schematic flowchart of the production control method of nanomaterials in an embodiment;
[0047] Figure 5 Another schematic flowchart of the production control method of nanomaterials in an embodiment;
[0048] Figure 6 Another schematic flowchart of the production control method of nanomaterials in an embodiment;
[0049] Figure 7 Another schematic flowchart of the production control method of nanomaterials in an embodiment;
[0050] Figure 8 The structural schematic diagram of the production equipment of nanomaterials in an embodiment;
[0051] Figure 9 The structural schematic diagram of the production equipment of nanomaterials in another embodiment;
[0052] Figure 10 The structural block diagram of the production control device of nanomaterials in an embodiment;
[0053] Figure 11 The internal structural diagram of the controller in an embodiment. Detailed implementation manners
[0054] To facilitate the understanding of the present application, the following will describe the present application more comprehensively with reference to the relevant accompanying drawings. Embodiments of the present application are shown in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0056] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. can be used herein to describe the relationship of one element or feature shown in the figures with other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms also include different orientations of the device during use and operation. For example, if the device in the figure is flipped, an element or feature described as "under" or "beneath" or "below" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "below" can include both the upper and lower orientations. In addition, the device may also have other orientations (such as rotating 90 degrees or other orientations), and the spatial descriptors used herein are accordingly interpreted.
[0057] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediate element. In addition, in the following embodiments, "connection", if there is a transfer of electrical signals or data between the connected objects, should be understood as "electrical connection", "communication connection", etc.
[0058] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprises / include" or "has" etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.
[0059] In an exemplary embodiment, as Figure 1 shown, this application provides a production control method for nanomaterials, and this method is applied to such as Figure 2 and Figure 3Taking the device for preparing nanomaterials by using liquid-phase laser technology shown as an example, the device includes a laser 2, a light guiding component 4, a sample cell 6 and a moving platform 8. The laser 2 is used to generate laser with a preset spot size and a preset pulse frequency. The sample cell 6 is arranged on the moving platform 8. The sample cell 6 is used to contain the solution to be reacted and the target 300. The light guiding component 4 is arranged on the optical path between the sample cell 6 and the laser 2 to guide the laser into the sample cell 6 containing the solution to be reacted and the target 300. The method includes:
[0060] S102, obtaining the shape of the target, the ablation property of the target, the preset spot size and the preset pulse frequency.
[0061] S104, determining the target moving path according to the shape of the target.
[0062] S106, determining the target moving speed according to the ablation property of the target, the preset spot size and the preset pulse frequency.
[0063] S108, driving the moving platform to move along the target moving path at the target moving speed, and during the movement of the moving platform, controlling the laser to generate laser so that the laser ablates on the target along the target moving path.
[0064] Among them, the shape of the target material can refer to the physical shape, size, and surface characteristics of the target material, such as diameter, thickness, flatness, etc., and the shape of the target material will directly affect the design of the laser ablation path. For example, if the target material is a circular thin sheet, the traditional rotary displacement stage can only make it perform circular motion, resulting in the ablation path being limited to an annular area, with low ablation efficiency and low target material utilization rate. By identifying the shape of the target material (such as size, shape), the movement trajectory of the moving platform (such as the translation path length, direction) can be determined to ensure that the laser spot evenly covers the surface of the target material, avoiding local overheating or insufficient ablation. The ablation properties of the target material can refer to the response characteristics of the target material to laser energy, including physical properties such as melting point, boiling point, thermal conductivity, laser absorption rate, etc., and chemical characteristics such as whether it is prone to splash, oxidation, or composition segregation during the ablation process. Specifically, in this application, the ablation properties of the target material mainly refer to the ease of ablation of the target material. The ablation properties of the target material affect the utilization rate of the target material and the uniformity of nanoparticles. If the thermal conductivity of the target material is low, too fast movement may lead to insufficient local energy accumulation and incomplete ablation; if the thermal conductivity is high, the movement speed needs to be increased to avoid excessive ablation. Adjust the movement speed according to the ablation properties to balance the input of laser energy and the heat dissipation efficiency of the target material, ensure the stability of the ablation process, and improve the yield and uniformity of nanoparticles. The preset spot size can refer to the spot diameter formed on the surface of the target material after the laser beam output by the laser is focused by a light guiding component (such as a light guiding arm, focusing mirror). The spot size directly affects the distribution of laser energy on the surface of the target material. A small spot has a high energy density and is suitable for fine ablation; a large spot has a wide coverage area and is suitable for large-area rapid ablation. Combining the properties of the target material and the movement speed can optimize the ablation efficiency and uniformity. The preset pulse frequency can refer to the number of laser pulses output by the laser per second, reflecting the time interval of laser energy input. The pulse frequency of the laser affects the thermal accumulation effect on the surface of the target material. High-frequency pulses may cause the local temperature to rise rapidly, and the energy needs to be dispersed by increasing the movement speed to avoid excessive ablation or splash; low-frequency pulses allow a slower movement speed to ensure sufficient energy absorption. Among them, the preset spot size and preset pulse frequency of the laser can be set by the operator for the laser and the light guiding component before production preparation.
[0065] Exemplarily, the target movement path refers to the movement trajectory of the sample cell or the target under the drive of the moving platform. Its design needs to ensure that the laser spot uniformly covers the surface of the target, avoiding repeated ablation or local non-ablation, so as to improve the ablation efficiency and the uniformity of nanoparticles. For example, when the target is a circular thin sheet, if a rotary displacement stage is used, the target can only perform circular motion, resulting in the laser ablation path being limited to an annular area (the actual ablation path is a circle). This kind of path will cause the laser to repeatedly irradiate the same annular area, resulting in local over-ablation of the target, and the uncovered area cannot be effectively utilized, affecting the ablation efficiency and uniformity. By analyzing the shape of the target (such as size, shape), select a matching movement method (rotation or translation) to ensure that the laser spot forms a continuous and non-overlapping scanning trajectory on the surface of the target, avoiding energy concentration in local areas. The target movement speed refers to the movement rate of the sample cell or the target on the moving platform, which needs to be coordinated with the ablation properties of the target, the spot size and pulse frequency of the laser to balance the energy input and the heat dissipation of the target, avoiding over-ablation or insufficient ablation. For example, if the target is a high-melting-point material, its ablation requires more laser energy, and the movement speed needs to be reduced to make the laser pulse stay on the surface of the target for a longer time and the energy accumulation is more sufficient, thereby improving the ablation efficiency. On the contrary, if the target is a low-melting-point material, the movement speed needs to be increased to avoid local overheating causing the target to splash or evaporate excessively. The spot size and pulse frequency of the laser often reflect the energy density of the laser, and the size of the energy density will also affect the ablation effect. Therefore, when determining the movement speed of the moving platform, in addition to considering the ablation properties of the target, it is also necessary to comprehensively consider the preset spot size and preset pulse frequency to improve the energy utilization efficiency and the uniformity of nanoparticles.
[0066] The above production control method of nanomaterials accurately obtains the shape of the target, ablation properties and laser parameters, designs a non-repetitive covering target movement path based on the shape of the target, avoiding local over-consumption and waste of uncovered areas caused by repeated ablation in the annular area; at the same time, combines the ablation difficulty of the target, spot size and pulse frequency to jointly determine the target movement speed, balancing energy input and heat dissipation efficiency. The combination of the above two makes the laser energy act uniformly on the entire surface of the target, reduces ineffective repeated ablation, improves the ablation area per unit time while reducing material loss, thereby significantly improving the target utilization rate and ablation efficiency, laying a foundation for the efficient and uniform preparation of nanoparticles in large-scale production.
[0067] In an exemplary embodiment, as Figure 3 shown, according to the shape of the target, determine the target movement path, including:
[0068] When the shape of the target is rectangular, determine the target movement path as a Z-shaped path.
[0069] For example, when the target material is rectangular in shape, the target moving path is determined to be a Z-shaped path, because the rectangular target material has regular long sides and short sides, and the Z-shaped path can be reciprocated linearly scanned along the long axis direction of the rectangle, so that the laser spot is as follows: Figure 3 The Z-shaped trajectory shown covers the entire rectangular surface. On the one hand, the linear reciprocating motion avoids the problem of circular repeated ablation of the traditional rotary translation stage, ensuring that the laser spot covers the entire area of the rectangular target line by line in sequence and without overlap, minimizing the energy concentration and local excessive ablation on the target surface; on the other hand, the regularity of the Z-shaped path facilitates the motion control of the mobile platform, and the laser pulse can be evenly applied to each position of the rectangular target by accurately setting the translation speed and steering interval, thereby improving the uniformity of ablation and the utilization rate of the target, which is especially suitable for large-scale production scenarios of large-area rectangular targets, while ensuring ablation efficiency and reducing material loss.
[0070] In an exemplary embodiment, Figure 4 As shown, the method also includes:
[0071] S402 , in the process of driving the mobile platform to move along the target moving path at the target moving speed, obtaining the real-time moving speed of the mobile platform.
[0072] S404, when the real-time moving speed of the moving platform is less than the target moving speed, reducing the pulse frequency of the laser.
[0073] S406, when the real-time moving speed of the moving platform is greater than the target moving speed, increasing the pulse frequency of the laser.
[0074] For example, when the real-time moving speed is less than the target moving speed, the target material stays in the laser action area for a longer time, and the energy input per unit area increases, which may cause excessive ablation or spatter. At this time, reducing the pulse frequency can reduce the number of laser pulses per unit time, reduce the energy input density, and avoid local overheating; on the contrary, if the real-time moving speed is greater than the target moving speed, the target material moves too fast, which may lead to insufficient laser energy and insufficient ablation. Increasing the pulse frequency can compensate for the energy input by increasing the number of pulses to ensure the ablation effect. In this embodiment, the pulse frequency is adjusted first, rather than adjusting the laser spot size or directly adjusting the moving speed of the mobile platform. The reason is that the adjustment of the spot size requires physical adjustment of the light guide component, which is complicated to operate and cannot respond dynamically in real time, and may interrupt the production process; while directly adjusting the moving speed may destroy the pre-set target path and speed coordination relationship (such as the turning rhythm of the Z-shaped path), resulting in uneven ablation path. The pulse frequency adjustment can be adjusted in real time by the laser control system, with fast response speed and high precision, and does not affect the preset trajectory of the mobile platform, and can quickly balance the energy input while maintaining the stability of the path.
[0075] In this embodiment, the strategy of preferentially adjusting the laser pulse frequency is applicable to scenarios where real-time dynamic balancing of energy input and target moving speed is required, and high requirements are placed on production continuity and path stability. For example, when the moving platform experiences speed fluctuations due to mechanical factors during long-term continuous large-scale production, real-time adjustment of the pulse frequency can be used to quickly compensate for energy matching, avoiding production interruption or destruction of the preset path. This strategy is also applicable to production scenarios where different target materials with different ablation properties need to be frequently replaced. Without re-adjusting the moving speed and path, it can quickly adapt to the energy requirements of different target materials. Since the optimal moving speeds of different target materials may vary significantly, if the moving speed and path need to be re-adjusted every time the material is changed, it will increase the debugging time and cost. By fixing the moving path and speed and only adjusting the pulse frequency, the energy requirements of different target materials can be quickly adapted. For example, when processing refractory target materials, a lower preset moving speed is paired with low-frequency pulses; when switching to fusible target materials, the original speed is maintained, and only by increasing the pulse frequency can the energy input efficiency be improved, avoiding re-planning of the path caused by speed adjustment. This strategy is also applicable to precision preparation scenarios with high requirements for ablation uniformity and accuracy. In this scenario, the adjustment of the spot size may cause energy density fluctuations due to the accuracy limitations of optical components (such as the focal length error of the focusing lens), affecting ablation uniformity; while the adjustment of the moving speed may cause speed overshoot or lag during the acceleration and deceleration stages due to mechanical inertia, resulting in unstable quality in the starting and ending regions of ablation; and the digital adjustment of the pulse frequency has high precision and can achieve microsecond-level response of energy input, ensuring that the number of pulse actions on the surface of each section of the target material is the same, thereby improving the size uniformity and preparation accuracy of the nanoparticles.
[0076] In this embodiment, through real-time dynamic adjustment of the pulse frequency, a closed-loop feedback system of "speed - energy" is established to ensure that when the moving speed of the target material fluctuates, the laser energy input per unit area remains constant, thereby maintaining the ablation efficiency and nanoparticle uniformity, while reducing the frequent actions of mechanical components and improving the stability and service life of the equipment, which is especially suitable for the dynamic control requirements of process parameters in large-scale production.
[0077] In an exemplary embodiment, as Figure 5 shown, the method further includes:
[0078] S502, during the process of driving the moving platform to move along the target moving path at the target moving speed, obtain the real-time spot size of the laser.
[0079] S504, in the case where the real-time spot size of the laser is smaller than the preset spot size, increase the moving speed of the moving platform.
[0080] S506, in the case where the real-time spot size of the laser is larger than the preset spot size, decrease the moving speed of the moving platform.
[0081] Exemplarily, the spot size directly affects the laser energy density (the smaller the spot, the higher the energy density). It is necessary to adjust the moving speed to achieve the balance between energy input and ablation efficiency. When the real-time spot size is smaller than the preset value, the energy density increases, and the energy absorbed by the target material per unit area increases. If the original speed is maintained, it may lead to excessive ablation. At this time, increasing the moving speed can shorten the laser action time, reduce energy accumulation, and avoid local overheating or spattering. When the real-time spot size is larger than the preset value, the energy density decreases, and the energy absorbed by the target material per unit area is insufficient. If the original speed is maintained, it may lead to insufficient ablation. At this time, reducing the moving speed can extend the laser action time, compensate for energy input, and ensure thorough ablation. In this embodiment, the moving speed is preferentially adjusted rather than the pulse frequency or spot size. The reason is that the pulse frequency adjustment is mainly used to compensate for the energy matching problem caused by speed fluctuations. If the change in spot size is caused by the offset or contamination of optical components (such as focusing lenses), adjusting the frequency cannot fundamentally solve the energy density deviation; while directly adjusting the spot size requires manual adjustment of the light guiding component (such as rotating the focusing lens barrel), which is complex in operation and may introduce new optical path errors, affecting the ablation accuracy. The adjustment of the moving speed can be dynamically adjusted in real time through the control system, directly changing the relative action time between the target material and the laser, with a fast response and no physical adjustment of optical components, and can quickly restore the matching relationship between energy density and ablation efficiency. Moreover, from the perspective of the application scenario, the strategy of this embodiment is applicable to scenarios where the spot size fluctuates due to temporary offset, contamination of optical components, or changes in environmental temperature and humidity, and rapid restoration of energy matching is required. For example, during long-term continuous production, the light guiding arm or focusing lens undergoes a small displacement due to uneven heat dissipation, resulting in the spot size deviating from the preset value; when changing the target material type or solution, the change in the liquid level height causes a change in the laser refraction angle, indirectly affecting the spot size; after the equipment moves or vibrates, the optical path collimation is slightly offset, causing the spot to diverge or be abnormally focused.
[0082] In this embodiment, by adjusting the moving speed in real time, the influence of spot size fluctuation on the ablation effect can be quickly offset without interrupting production and without manual intervention in the optical path, maintaining the dynamic balance between energy density and target movement. It has the advantages of fast response speed and low operation cost. It can not only avoid product quality fluctuations caused by abnormal spots but also maintain the stability of the laser pulse frequency, especially suitable for large-scale scenarios with high requirements for production continuity and ablation accuracy, such as the batch preparation processes of nano-catalysts and battery materials.
[0083] In an exemplary embodiment, as Figure 6 shown, the method further includes:
[0084] S602, during the process of driving the moving platform to move along the target moving path at the target moving speed, obtain the real-time pulse frequency of the laser.
[0085] S604, when the real-time pulse frequency of the laser is less than the preset pulse frequency, reduce the moving speed of the moving platform.
[0086] S606, when the real-time pulse frequency of the laser is greater than the preset pulse frequency, increase the moving speed of the moving platform.
[0087] Exemplarily, the pulse frequency of the laser directly affects the laser energy input per unit time. The higher the frequency, the denser the energy input. It is necessary to adjust the moving speed to match the change in energy density. When the real-time pulse frequency is less than the preset value, the number of laser pulses per unit time decreases, and the energy input is insufficient. If the original speed is maintained, it may lead to insufficient ablation. At this time, reducing the moving speed can extend the residence time of the target material in the laser action area, increase energy accumulation, and ensure the ablation efficiency. When the real-time pulse frequency is greater than the preset value, the number of pulses per unit time increases, and the energy input is too dense. If the original speed is maintained, it may lead to local overheating or excessive ablation. At this time, increasing the moving speed can shorten the interaction time between the target material and the laser, disperse the energy input, and avoid excessive ablation. In this embodiment, the moving speed is preferentially adjusted rather than the spot size or pulse frequency. The reason is that the adjustment of the spot size requires physical adjustment of the light guiding component, which is complex to operate and cannot respond to the dynamic fluctuations of the pulse frequency in real time, and may damage the optical path stability; while directly adjusting the pulse frequency, if the real-time frequency deviates from the preset value due to a temporary failure of the laser control system (such as signal interference, hardware fluctuations), for example, after the laser has been running for a long time, the pulse frequency deviates due to the heating of internal components; or during the production process, sudden electromagnetic interference causes signal abnormalities in the laser control system, resulting in frequency fluctuations. Direct adjustment may cause system oscillation or parameter deviation; while the adjustment of the moving speed can be adjusted in real time through a digital control system, directly changing the energy action time, with a fast response speed and not involving the adjustment of optical components, and can quickly establish a new balance relationship between frequency and speed.
[0088] In this embodiment, by adjusting the moving speed in real time, the influence of pulse frequency fluctuations on the ablation effect can be quickly offset without interrupting production and without manually intervening in the laser hardware. It avoids the optical path errors or equipment losses that may be caused by frequently adjusting the spot or pulse frequency, and at the same time maintains the stability of the laser energy mode (such as a constant spot size), ensuring ablation uniformity. Its advantages lie in strong real-time response and low operating cost, especially suitable for continuous production scenarios with high requirements for equipment stability, such as automated production lines that need to run stably for a long time in the large-scale preparation of nanoparticles, which can effectively reduce the scrap rate caused by parameter fluctuations and improve production efficiency and product quality consistency.
[0089] In an exemplary embodiment, as Figure 7 shown, before the step of driving the moving platform to move along the target moving path at the target moving speed, it includes:
[0090] S702. Obtain the starting target position of the target material.
[0091] S704. When the starting target position of the target material is aligned with the laser emission position, drive the moving platform to move along the target moving path at the target moving speed.
[0092] In this embodiment, by obtaining the starting target position of the target material and aligning it with the laser emission position, it is ensured that the laser beam precisely starts ablation from the preset area of the target material, avoiding ablation area deviation or repeated adjustment caused by initial position deviation, significantly improving the positioning accuracy of the ablation process, reducing the waste of the target material edge or the disorder of the ablation path caused by the starting position error. Especially in large-scale production, it can ensure that each batch of target materials starts uniform ablation from the same position, improving the consistency of nanoparticle preparation and the standardization degree of the production process. At the same time, it reduces the debugging cost and time loss caused by improper position calibration, laying a reliable initial condition for automated continuous production.
[0093] In an exemplary embodiment, the present application also provides a controller, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements the steps of the method in the above embodiment.
[0094] In an exemplary embodiment, the present application also provides a device for preparing nanomaterials using a liquid-phase laser technique. The device includes a laser 2, a moving platform 8, a sample cell 6, a light guiding component 4, and the controller in the above embodiment. The laser 2 is used to generate a laser with a preset spot size and a preset pulse frequency; the sample cell 6 is arranged on the moving platform 8, and the sample cell 6 is used to hold the solution to be reacted and the target material 300; the light guiding component 4 is arranged on the optical path between the sample cell 6 and the laser 2 to guide the laser into the sample cell 6 where the solution to be reacted and the target material 300 are held; the controller is respectively connected to the laser 2 and the moving platform 8.
[0095] The above device for preparing nanomaterials using a liquid-phase laser technique integrates the controller in the above embodiment that can execute the production method of nanomaterials. Cooperating with the laser 2, the moving platform 8, the sample cell 6, and the light guiding component 4 can improve the utilization rate of the target material 300 and the ablation efficiency.
[0096] In an exemplary embodiment, as Figure 8 shown, the present application also provides a production equipment for nanomaterials. The production equipment includes a sealed cabinet 500 and the device for preparing nanomaterials using a liquid-phase laser technique in the above embodiment. The sealed cabinet 500 has an accommodating space, and the device for preparing nanomaterials using a liquid-phase laser technique is arranged in the accommodating space.
[0097] In this embodiment, the device for preparing nanomaterials using the liquid-phase laser technology is arranged in the accommodation space of the sealed cabinet 500, which can effectively isolate external dust, particulate matters and volatile pollutants, and prevent them from entering the device to contaminate the target, the solution or the laser optical path system. For example, in large-scale production, impurities in the air may adsorb on the surface of nanoparticles, affecting the product purity, or deposit on optical elements such as focusing mirrors, resulting in spot distortion. The independent clean space formed by the sealed cabinet 500 can significantly reduce such risks. In addition, the sealed design can also prevent the aerosol or liquid-phase splash generated during the preparation process from spreading to the external environment, maintaining the cleanliness of the production environment, and reducing the potential harm to operators. This is especially suitable for fields such as biomedicine and electronic information that have extremely high requirements for the purity of nanomaterials, ensuring the controllability of the production process and the stability of product quality.
[0098] In an exemplary embodiment, as Figure 9 shown, the production equipment further includes a human-machine interaction terminal 700. The human-machine interaction terminal 700 is connected to the controller, and the human-machine interaction terminal 700 is used to input the shape of the target, the ablation properties of the target, the preset spot size and the preset pulse frequency.
[0099] In this embodiment, through the connection between the human-machine interaction terminal 700 and the controller, a convenient parameter input interface is provided for the operator, which can intuitively and efficiently transmit the shape, ablation properties of the target and the laser parameters (preset spot size, pulse frequency) to the control system, significantly improving the usability of the production equipment. Without relying on complex code programming or hardware debugging, the operator can quickly complete parameter configuration through the terminal interface, which is especially suitable for the parameter adjustment requirements when switching between multiple types of targets in large-scale production. At the same time, the standardized input process reduces the errors in manual recording and transmitting parameters, ensuring that the system generates the target movement path and speed based on accurate data, thereby improving the accuracy and production efficiency of the ablation process, and providing a friendly operation basis for the automated and intelligent preparation of nanomaterials.
[0100] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment, but can be executed at different moments. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.
[0101] Based on the same inventive concept, an embodiment of the present application further provides a production control device for a nanomaterial for implementing the production control method of the nanomaterial involved above. The solution provided by this device for solving problems is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the production control device for the nanomaterial provided below can refer to the limitations on the production control method of the nanomaterial in the above text, and will not be elaborated here.
[0102] In an exemplary embodiment, as Figure 10 shown, a production control device for a nanomaterial is provided, including:
[0103] A parameter acquisition module 1002, configured to acquire the shape of the target, the ablation property of the target, a preset spot size, and a preset pulse frequency.
[0104] A target movement path determination module 1004, configured to determine a target movement path according to the shape of the target.
[0105] A target movement speed determination module 1006, configured to determine a target movement speed according to the ablation property of the target, the preset spot size, and the preset pulse frequency.
[0106] A drive control module 1008, configured to drive the moving platform to move along the target movement path at the target movement speed, and during the movement of the moving platform, control the laser to generate laser light so that the laser light ablates on the target along the target movement path.
[0107] In an exemplary embodiment, the above target movement path determination module 1004 includes:
[0108] A target movement path determination unit, configured to determine the target movement path as a Z-shaped path when the shape of the target is rectangular.
[0109] In an exemplary embodiment, the above production control device for a nanomaterial further includes:
[0110] A real-time movement speed acquisition module, configured to acquire the real-time movement speed of the moving platform during the process of driving the moving platform to move along the target movement path at the target movement speed.
[0111] A first laser pulse frequency adjustment unit, configured to reduce the pulse frequency of the laser when the real-time movement speed of the moving platform is less than the target movement speed.
[0112] A second laser pulse frequency adjustment unit, configured to increase the pulse frequency of the laser when the real-time movement speed of the moving platform is greater than the target movement speed.
[0113] In an exemplary embodiment, the production control device of the above-mentioned nanomaterial further includes:
[0114] A real-time spot size acquisition module, configured to acquire the real-time spot size of the laser during the process of driving the mobile platform to move along the target moving path at the target moving speed.
[0115] A first moving speed adjustment module, configured to increase the moving speed of the mobile platform when the real-time spot size of the laser is smaller than the preset spot size.
[0116] A second moving speed adjustment module, configured to decrease the moving speed of the mobile platform when the real-time spot size of the laser is larger than the preset spot size.
[0117] In an exemplary embodiment, the production control device of the above-mentioned nanomaterial further includes:
[0118] A real-time pulse frequency acquisition module, configured to acquire the real-time pulse frequency of the laser during the process of driving the mobile platform to move along the target moving path at the target moving speed.
[0119] A third moving speed adjustment module, configured to decrease the moving speed of the mobile platform when the real-time pulse frequency of the laser is smaller than the preset pulse frequency.
[0120] A fourth moving speed adjustment module, configured to increase the moving speed of the mobile platform when the real-time pulse frequency of the laser is larger than the preset pulse frequency.
[0121] In an exemplary embodiment, the production control device of the above-mentioned nanomaterial further includes:
[0122] A starting target position acquisition module, configured to acquire the starting target position of the target material.
[0123] A driving verification module, configured to drive the mobile platform to move along the target moving path at the target moving speed when the starting target position of the target material is aligned with the laser emission position.
[0124] Each module in the production control device of the above-mentioned nanomaterial can be implemented in whole or in part by software, hardware, and their combination. The above-mentioned modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above-mentioned modules.
[0125] In an exemplary embodiment, a computer device is provided. The computer device can be a controller, and its internal structure diagram can be as Figure 11As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, abbreviated as I / O), and a communication interface. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as the shape of the target, the erosion properties of the target, the preset spot size, and the preset pulse frequency. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it implements a method for controlling the production of nanomaterials.
[0126] Those skilled in the art can understand that Figure 11 the structure shown in is only a block diagram of some structures related to the solution of this application, and does not constitute a limitation on the computer device to which the solution of this application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.
[0127] In an exemplary embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the steps in the above method embodiments are implemented.
[0128] In an embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by the processor, the steps in the above method embodiments are implemented.
[0129] In an embodiment, a computer program product is provided, including a computer program. When the computer program is executed by the processor, the steps in the above method embodiments are implemented.
[0130] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, artificial intelligence (AI) processors, etc., without limitation.
[0131] In the description of this specification, the descriptions referring to terms such as "some embodiments", "other embodiments", "ideal embodiments", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiments or examples.
[0132] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.
[0133] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A production control method for nanomaterials, applied to a device for preparing nanomaterials by using a liquid-phase laser technology. The device includes a laser, a light guiding component, a sample cell, and a moving platform. The laser is used to generate laser with a preset spot size and a preset pulse frequency. The sample cell is arranged on the moving platform and is used to contain a solution to be reacted and a target material. The light guiding component is arranged on the optical path between the sample cell and the laser to introduce the laser into the sample cell containing the solution to be reacted and the target material. It is characterized in that, The method includes: Obtaining the shape of the target, the erosion property of the target, the preset spot size, and the preset pulse frequency; Determining a target movement path according to the shape of the target; Determining a target movement speed according to the erosion property of the target, the preset spot size, and the preset pulse frequency; Driving the moving platform to move along the target movement path at the target movement speed, and during the movement of the moving platform, controlling the laser to generate the laser so that the laser erodes on the target along the target movement path.
2. The production control method of the nanomaterial according to claim 1, characterized in that, The determining the target movement path according to the shape of the target includes: When the shape of the target is rectangular, determining the target movement path as a Z-shaped path.
3. The production control method of the nanomaterial according to claim 1, characterized in that, The method further includes: During the process of driving the moving platform to move along the target movement path at the target movement speed, obtaining the real-time movement speed of the moving platform; When the real-time movement speed of the moving platform is less than the target movement speed, reducing the pulse frequency of the laser; When the real-time movement speed of the moving platform is greater than the target movement speed, increasing the pulse frequency of the laser.
4. The production control method of the nanomaterial according to any one of claims 1-3, characterized in that, The method further includes: During the process of driving the moving platform to move along the target movement path at the target movement speed, obtaining the real-time spot size of the laser; When the real-time spot size of the laser is less than the preset spot size, increasing the movement speed of the moving platform; When the real-time spot size of the laser is greater than the preset spot size, reducing the movement speed of the moving platform.
5. The production control method of the nanomaterial according to any one of claims 1 to 3, characterized in that, The method further includes: During the process of driving the moving platform to move along the target movement path at the target movement speed, obtaining the real-time pulse frequency of the laser; When the real-time pulse frequency of the laser is less than the preset pulse frequency, reducing the movement speed of the moving platform; When the real-time pulse frequency of the laser is greater than the preset pulse frequency, increasing the movement speed of the moving platform.
6. The production control method of the nanomaterial according to claim 1, characterized in that, Before the step of driving the moving platform to move along the target movement path at the target movement speed, it includes: Obtaining the starting target position of the target; When the starting target position of the target is aligned with the laser emission position, driving the moving platform to move along the target movement path at the target movement speed.
7. A controller, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.
8. An apparatus for preparing nanomaterials using a liquid-phase laser technique, characterized in that, The device includes: A laser, which is used to generate a laser with a preset spot size and a preset pulse frequency; A moving platform; A sample cell, which is arranged on the moving platform and is used to contain a reaction solution to be reacted and a target; A light guiding component, which is arranged on the optical path between the sample cell and the laser to guide the laser into the sample cell containing the reaction solution to be reacted and the target; And a controller according to claim 7, the controller is respectively connected to the laser and the moving platform.
9. A production device for a nanomaterial, characterized in that, The production equipment includes: A sealed cabinet body, the sealed cabinet body having an accommodating space; And a device for preparing nanomaterials by liquid-phase laser technology as claimed in claim 8, the device for preparing nanomaterials by liquid-phase laser technology being arranged in the accommodating space.
10. The production equipment of the nanomaterial according to claim 9, characterized in that, The production equipment further comprises: A human-machine interaction terminal, the human-machine interaction terminal being connected to the controller, the human-machine interaction terminal being used for inputting the shape of the target, the ablation property of the target, the preset spot size and the preset pulse frequency.
Citation Information
Patent Citations
Nanometer array preparation system and nanometer array preparation method
CN114221208A
Method for preparing nano TiO2 particles with high catalytic performance through liquid-phase pulse laser ablation
CN114538506A
Laser material reduction processing method and laser processing equipment
CN115383313A
De-bonding device, bonding method and de-bonding method
CN119480715A
Gold nanoparticle and dispersion thereof, method for producing gold nanoparticle and nanoparticle production system
JP2009299112A
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