Pressurizing device

Abstract

This invention provides a pressurizing device capable of changing the temperature gradient during workpiece heating and / or cooling. The pressurizing device (1) of this invention includes a first mold unit (4) and a second mold unit (5). The second mold unit includes: a plurality of heat pipes (7); a mold body (6) for fixing the plurality of heat pipes, disposed between the workpiece and the first mold unit when the workpiece is heated or cooled; and heat source units (8, 9) capable of heating or cooling corresponding heat pipes among the plurality of heat pipes. Each heat pipe has a protruding end (7a, 7b) protruding horizontally from the mold body. The heat source unit includes: a plurality of abutment portions (80b, 81b, 90b, 91b) movable relative to each protruding end and capable of abutting the corresponding protruding end; and abutment switching portions (84, 94) that switch between abutting portions abutting the protruding end and separating from the protruding end.

Description

Technical Field

[0001] This invention relates to a pressurization device. Background Technology

[0002] Conventionally, pressurizing devices are used to pressurize objects such as electronic components (hereinafter referred to as "workpieces"). For example, the pressurizing device disclosed in Patent Document 1 includes upper and lower pressurizing units, which clamp and pressurize the workpiece. This pressurizing device heats the workpiece using a heater in the lower pressurizing unit. The heater is located inside a mold. In this pressurizing device, after the workpiece is pressurized and heated, it is cooled while in contact with the mold. The mold has a structure to withstand the pressure, so as not to apply excessive pressure to the heater. Therefore, the mold has a large volume and a large heat capacity. As a result, the heating and cooling times of the workpiece become longer. That is, the rate of temperature change during heating and cooling of the workpiece becomes smaller (becomes more gradual).

[0003] On the other hand, in the pressurizing device disclosed in Patent Document 2, the lower pressurizing unit includes a heating unit that is always heated and a cooling unit that is always cooled. The heating unit and the cooling unit are configured to move relative to the upper pressurizing unit holding the workpiece, and can be switched appropriately according to the progress of the pressurizing process. Therefore, the switching time between heating and cooling using the lower pressurizing unit is shortened, and the heating and cooling time of the workpiece is also shortened. That is, the rate of temperature change during workpiece heating and cooling becomes larger (becomes steeper).

[0004] Existing technical documents

[0005] Patent documents:

[0006] Patent Document 1: Japanese Patent Application Publication No. 2004-296746.

[0007] Patent document 2: Japanese Patent Application Publication No. 2017-199812. Summary of the Invention

[0008] The problem the invention aims to solve

[0009] Thus, the temperature gradients (heating time and cooling time) of each pressurizing device during workpiece heating and cooling have opposite characteristics. However, the rate of temperature change (heating time and cooling time) during workpiece heating and cooling becomes a trend that is difficult to control.

[0010] The purpose of this invention is to provide a pressurization device capable of controlling the rate of temperature change during workpiece heating and / or cooling.

[0011] Solution for solving the problem

[0012] One aspect of the present invention is a pressurizing device for pressurizing a workpiece, wherein the pressurizing device comprises: a first mold unit disposed below the workpiece and capable of heating or cooling the workpiece; and a second mold unit capable of heating or cooling the workpiece together with the first mold unit, the second mold unit comprising: a plurality of heat pipes; a mold body portion for fixing the plurality of heat pipes, the mold body portion being disposed between the workpiece and the first mold unit when the workpiece is being heated or cooled; and a heat source unit capable of applying heat to corresponding heat pipes. The heat pipes are used for heating or cooling. Each heat pipe has a protruding end that protrudes horizontally from the main body of the mold. The heat source unit includes: a plurality of abutting portions that are movable relative to each of the protruding ends and can abut against the corresponding protruding ends; and an abutting switching portion that switches between the abutting portion abutting against the protruding end and separating from the protruding end. The abutting switching portion causes the abutting portion to abut against the protruding end when the second mold unit starts heating or cooling the workpiece, and causes the abutting portion to separate from the protruding end when the second mold unit stops heating or cooling the workpiece.

[0013] Invention Effects

[0014] According to the present invention, a pressurization device is provided that is capable of changing the temperature gradient during workpiece heating and / or cooling. Attached Figure Description

[0015] Figure 1 This is a schematic cross-sectional view of the pressurizing device, illustrating an embodiment of the pressurizing device of the present invention.

[0016] Figure 2 yes Figure 1 A schematic cross-sectional view of the device viewed from direction A.

[0017] Figure 3 This is a schematic top view of the second mold unit of the aforementioned pressurization device.

[0018] Figure 4 yes Figure 3 A schematic diagram of the first heat source unit of the second mold unit as seen from direction B.

[0019] Figure 5 yes Figure 3 A schematic diagram of the second heat source unit of the second mold unit as seen from the C-direction view above.

[0020] Figure 6 This is a schematic cross-sectional view of the pressurizing device, showing the state in which the workpiece is housed in the receiving chamber of the pressurizing device.

[0021] Figure 7This is a schematic cross-sectional view of the pressurizing device, showing the heated mold unit and the main body of the pressurizing device in the processing position.

[0022] Figure 8 yes Figure 7 A schematic cross-sectional view of the pressurization device viewed from the D direction.

[0023] Figure 9 This is a schematic cross-sectional view of the pressurizing device, showing the chamber unit of the aforementioned pressurizing device in a depressed state.

[0024] Figure 10 This is a timing diagram showing an example of the temperature changes of the workpiece, the aforementioned heating mold unit, and the aforementioned main body during workpiece heating.

[0025] Figure 11 This is a schematic cross-sectional view of the pressurizing device, showing the state in which the first clamping member of the pressurizing device has moved to the clamping position.

[0026] Figure 12 This is a schematic cross-sectional view of the pressurizing device showing the state in which the first clamping member has moved to the non-clamping position.

[0027] Figure 13 This is a schematic cross-sectional view of the pressurizing device, showing the state in which the cooling mold unit of the pressurizing device has moved to the processing position.

[0028] Figure 14 yes Figure 13 A schematic cross-sectional view of the pressurization device viewed from direction E.

[0029] Figure 15 This is a schematic cross-sectional view of the pressurization device showing the state of the aforementioned chamber unit when it has been lowered.

[0030] Figure 16 This is a timing diagram showing an example of the temperature changes of the workpiece, the aforementioned cooling mold unit, and the aforementioned main body during workpiece cooling.

[0031] Figure 17 This is a schematic cross-sectional view of the pressurizing device showing the state in which the first clamping member has moved to the clamping position.

[0032] Figure 18 This is a schematic cross-sectional view of the pressurizing device showing the state in which the first clamping member has moved to the non-clamping position.

[0033] Figure 19 This is a schematic diagram illustrating an example of the actual temperature change of a workpiece.

[0034] Figure 20 This is a schematic cross-sectional view of the pressurizing device, showing the state in which the second clamping member of the pressurizing device moves to the clamping position when the workpiece is heated.

[0035] Figure 21 This is a schematic cross-sectional view of a pressurizing device, illustrating another embodiment of the pressurizing device of the present invention.

[0036] Figure 22 yes Figure 21 A schematic cross-sectional view of the pressurization device viewed from the F direction.

[0037] Figure 23 This is a schematic top view of the heating mold unit of the aforementioned pressurization device.

[0038] Figure 24 This is a schematic top view of the cooling mold unit of the aforementioned pressurization device.

[0039] Figure 25 This is a schematic cross-sectional view of the pressurizing device, showing the state in which the first clamping member of the pressurizing device has moved to the clamping position.

[0040] Figure 26 This is a schematic cross-sectional view of a pressurizing device, showing a first modified example of the pressurizing device of the present invention.

[0041] Figure 27 (a) is a schematic top view of the second mold unit, illustrating a second modified example of the pressurizing device of the present invention. Figure 27 (b) is a schematic top view of the second mold unit, illustrating a third variation of the pressurizing device of the present invention. Figure 27 (c) is a schematic top view of the second mold unit, showing a fourth variation of the pressurizing device of the present invention.

[0042] Figure 28 (a) is a schematic top view of the second mold unit, illustrating a fifth variation of the pressurizing device of the present invention. Figure 28 (b) is Figure 28 (a) Schematic diagram of the pressurization device viewed from the G direction.

[0043] Explanation of reference numerals in the attached figures

[0044] 1: Pressurization device

[0045] 2: Control device

[0046] 4: First mold unit

[0047] 40: Heating mold unit

[0048] 40C: Heating source

[0049] 41: Cooling mold unit

[0050] 41b: Cooling source

[0051] 5: Second mold unit

[0052] 6: Main body

[0053] 7: Heat pipe

[0054] 71: Heat pipe (first heat pipe)

[0055] 72-75: Heat pipe (second heat pipe)

[0056] 7a: First end (protruding end, first protruding end)

[0057] 7b: Second end (protruding end, second protruding end)

[0058] 8: First heat source unit (heat source unit, cooling unit)

[0059] 80: First clamping component (heat source main body)

[0060] 80b: Connecting part

[0061] 80b1~80b6: Abutment section (first abutment section, second abutment section)

[0062] 81: First clamping component (heat source main body)

[0063] 81b: Abutment section

[0064] 81b1~81b6: Abutment section (first abutment section, second abutment section)

[0065] 82: Primary heat source (cooling source, heating source)

[0066] 83: Primary heat source (cooling source, heating source)

[0067] 84: First heat source moving mechanism (contact switching unit, heat source switching unit)

[0068] 9: Second heat source unit (heat source unit, heating unit)

[0069] 90: Second clamping component (heat source main body)

[0070] 90b: Connecting part

[0071] 91: Second clamping component (heat source main body)

[0072] 91b: Connecting part

[0073] 92: Second heat source (heating source, cooling source)

[0074] 93: Second heat source (heating source, cooling source)

[0075] 94: Second heat source moving mechanism (contact switching unit, heat source switching unit)

[0076] 10: Temperature measuring instrument

[0077] 21: Unit Switching Section

[0078] 1Z: Pressurization device

[0079] 4Z: Mold Unit

[0080] 40Z: Heating mold unit

[0081] 40Za: Main part

[0082] 41Z: Cooling mold unit

[0083] 41Za: Main body

[0084] 7Z: Heat pipe

[0085] A11: Area 1

[0086] A12: Area 2

[0087] Pr1: Temperature curve

[0088] Pr2: Temperature curve Detailed Implementation

[0089] The embodiments of the pressurizing device of the present invention (hereinafter referred to as "the device") are described below. In the following description, reference is made appropriately to the accompanying drawings. In the drawings, the same reference numerals are used to label the same parts and elements, and repeated descriptions are omitted. Furthermore, for ease of explanation, the dimensions of each element may be enlarged proportionally, and the scale is not limited to that shown in the drawings.

[0090] In the following descriptions and figures, unless otherwise specified, when the three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. "X-axis direction" refers to the direction along the X-axis; "+X direction" is one direction along the X-axis; and "-X direction" is another direction along the X-axis. The +X direction is an example of the first direction in this invention, and the -X direction is an example of the second direction. "Y-axis direction" refers to the direction along the Y-axis; "+Y direction" is one direction along the Y-axis; and "-Y direction" is another direction along the Y-axis. "Z-axis direction" refers to the direction along the Z-axis, which is the vertical direction. "+Z direction" is upward, and "-Z direction" is downward. "XY direction" refers to the direction along both the X-axis and Y-axis; the "XY plane" is a virtual plane parallel to the XY direction (horizontal direction). "XZ direction" refers to the direction along both the X-axis and Z-axis; the "XZ plane" is a virtual plane parallel to the XZ direction (vertical direction).

[0091] In the following description, the lower surface is the face facing downwards and parallel to the XY direction. The upper surface is the face facing upwards and parallel to the XY direction. That is, the lower and upper surfaces are planar in shape.

[0092] Pressurization device (first embodiment)

[0093] Structure of the pressurization device (first embodiment)

[0094] Figure 1 This is a schematic cross-sectional view of the device, illustrating an embodiment of the device.

[0095] Figure 2 yes Figure 1 A schematic cross-sectional view of the device viewed from direction A.

[0096] Figure 1 This shows a cut surface of device 1 along the YZ plane, where the device 1 is cut off at its central portion in the X-axis direction. Figure 6 , Figure 7 , Figure 13 as well as Figure 20 (Same as above). Figure 2 This shows a cut surface of device 1 along the XZ plane, where the device 1 is cut off at its central portion in the Y-axis direction. Figures 8-11 , Figures 14-17 , Figure 21 , Figures 24-26 (Same as above).

[0097] This device 1 clamps and pressurizes the workpiece W in a vertical direction. The device 1 includes a control device 2, a mounting plate 3, a first mold unit 4, a second mold unit 5, a base component 12, a side component 13, an upper mold 14, a frame component 15, a pressure pad 16, a first spring component 17, a second spring component 18, two sealing components 19 and 20, and a pump P. The mounting plate 3, the first mold unit 4, and the second mold unit 5 are positioned below the workpiece W, functioning as a lower pressure unit DP that applies pressure to the workpiece W from below. The base component 12, the side component 13, the upper mold 14, the frame component 15, the pressure pad 16, the first spring component 17, the second spring component 18, and the two sealing components 19 and 20 are positioned above the workpiece W, functioning as an upper pressure unit UP that applies pressure to the workpiece W from above.

[0098] Control device 2 controls the overall operation of device 1. Control device 2 includes, for example, a processor such as a CPU (Central Processing Unit), volatile memory such as RAM (Random Access Memory) which functions as the CPU's working area, non-volatile memory such as ROM (Read Only Memory) which stores various information such as control programs, and information required for the operation of device 1 (e.g., temperature curves Pr1 and Pr2 described later: reference). Figure 12 and Figure 18 ) storage section.

[0099] The mounting plate 3 is a component for mounting the workpiece W, and it is divided into the receiving chamber R (described later) (see reference). Figure 6 (The same applies below). The mounting plate 3 is made of, for example, a metal with high thermal conductivity (e.g., a copper alloy). The shape of the mounting plate 3 is rectangular along the XY axis when viewed from above, and is plate-shaped. The mounting plate 3 has an upper surface 3a and a lower surface 3b. The upper surface 3a is the mounting surface for mounting the workpiece W.

[0100] The first mold unit 4 heats and cools the workpiece W. The first mold unit 4 includes a heating mold unit 40, a cooling mold unit 41, and a first unit conveying device 42.

[0101] The heating mold unit 40 heats the workpiece W. The heating mold unit 40 is movable between a processing position below the upper pressure unit UP and a standby position that is separated from the processing position in the horizontal direction (in this embodiment, the -Y direction). The heating mold unit 40 includes a main body 40a, a heat insulation member 40b, multiple heating sources 40c, and multiple cooling sources 40d.

[0102] The main body 40a contains a heating source 40c and a cooling source 40d. The main body 40a is made of a metal with high rigidity (e.g., carbon steel). The shape of the main body 40a is rectangular along the XY direction when viewed from above, and is a cuboid shape. The main body 40a has an upper surface 40e. A heat insulation member 40b is configured to divide the main body 40a into two parts. The heat insulation member 40b inhibits the downward transfer of heat from the heating source 40c. The heating source 40c heats the workpiece W. The heating source 40c is, for example, a known straight-tube heater. The heating source 40c is arranged parallel to the Y-axis direction inside the upper half of the main body 40a. The cooling source 40d is, for example, a straight-tube flow channel for cooling the lower half of the main body 40a. The refrigerant is cooled by a cooling device (not shown, the same below) and circulates between the cooling source 40d and the cooling device. The cooling source 40d is arranged inside the lower half of the main body 40a in a manner parallel to the Y-axis direction.

[0103] The cooling mold unit 41 cools the workpiece W. The cooling mold unit 41 is movable between a processing position below the upper pressure unit UP and a standby position that is horizontally separated from the processing position (in this embodiment, the +Y direction). The cooling mold unit 41 includes a main body 41a and a plurality of cooling sources 41b.

[0104] The main body 41a protects the cooling source 41b. The main body 41a is made of, for example, a metal with high rigidity (e.g., carbon steel). The shape of the main body 41a is rectangular along the XY direction when viewed from above, and is a cuboid shape. The main body 41a has an upper surface 41c. The structure of the cooling source 41b is the same as that of the cooling source 40d. The cooling source 41b is arranged inside the main body 41a in a manner parallel to the Y-axis direction.

[0105] The first unit conveying device 42 transports the heating mold unit 40 and the cooling mold unit 41 between the processing position and their respective standby positions. The first unit conveying device 42 includes, for example, a known power source (e.g., a motor: not shown), a power transmission mechanism (e.g., gears, ball screws, etc.: not shown), and a track (not shown).

[0106] When heating or cooling workpiece W, the second mold unit 5 heats or cools workpiece W together with the first mold unit 4. Furthermore, the second mold unit 5 controls the heating time and temperature change rate of workpiece W during heating, and the cooling time and temperature change rate of workpiece W during cooling. The second mold unit 5 is separate from the first mold unit 4. The second mold unit 5 includes a main body 6, multiple heat pipes 7, a first heat source unit 8, a second heat source unit 9, multiple temperature measuring instruments 10, and a second unit conveying device 11.

[0107] The main body 6 protects the heat pipe 7. The main body 6 is made of a metal with high rigidity (e.g., carbon steel). The shape of the main body 6 is rectangular along the XY direction when viewed from above, and is cuboid in shape. The main body 6 has the strength to withstand the formal pressure described later, and has a thickness such that the heat capacity of the main body 6 is relatively small when the workpiece W is heated / cooled. The volume of the main body 6 is smaller than that of the main bodies 40a and 41a (e.g., 1 / n: n is an integer greater than 2), and the heat capacity of the main body 6 is smaller than that of the main bodies 40a and 41a. The main body 6 can move between a processing position below the upper pressure unit UP and a standby position that is horizontally separated from the processing position (in this embodiment, the -Y direction). The main body 6 is an example of a mold main body in this invention. The main body 6 has an upper surface 6a, a lower surface 6b, a plurality of (6 in this embodiment) through holes 6c, and a plurality of (3 in this embodiment) insertion holes 6d.

[0108] Figure 3This is a schematic top view of mold unit 5, part 2.

[0109] This figure shows the main body 6 in the processing position. Please refer to the following description as appropriate. Figure 1 , Figure 2 and Figure 3 .

[0110] The through hole 6c is a through hole that penetrates the main body 6 along the X-axis direction. In the following description, when distinguishing each through hole 6c, "1" to "6" will be appended to the end of their reference numerals. In the Y-axis direction, the through holes 6c1 to 6c6 are arranged at equal intervals from the +Y direction side.

[0111] The insertion hole 6d is a non-through hole that opens along the X-axis towards the +X direction side of the main body 6. In the following description, when distinguishing each insertion hole 6d, "1" to "3" will be appended to the end of their reference numerals. Insertion hole 6d1 is disposed between insertion holes 6c1 and 6c2, insertion hole 6d2 is disposed between insertion holes 6c3 and 6c4, and insertion hole 6d3 is disposed between insertion holes 6c5 and 6c6.

[0112] The heat pipe 7 is, for example, a known heat pipe containing a volatile working fluid. The heat pipe 7 is straight. The heat pipe 7 has a first end 7a and a second end 7b. The heat pipe 7 is inserted into a corresponding through-hole 6c and fixed to the main body 6. That is, when viewed from above, the heat pipe 7 is arranged parallel to the X-axis direction, orthogonally to the heating source 40c and the cooling source 41b. The first end 7a protrudes from the main body 6 in the +X direction, and the second end 7b protrudes from the main body 6 in the -X direction. The first end 7a is an example of the protruding end and the first protruding end in this invention, and the second end 7b is an example of the protruding end and the second protruding end in this invention. In the following description, when specifically distinguishing each heat pipe 7, "1" to "6" are appended to the end of their reference numerals.

[0113] Figure 4 yes Figure 3 A schematic diagram of the first heat source unit 8 viewed from direction B.

[0114] For clarity, the figure shows the abutment portion 80b, described later, with a thick solid line, and also shows a cross-section of the first end portion 7a along the YZ plane. Refer as appropriate in the following description. Figure 1 , Figure 2 and Figure 3 .

[0115] The first heat source unit 8 corresponds to the first end 7a and cools the heat pipe 7 (working fluid). That is, the first heat source unit 8 is a cooling unit for cooling the heat pipe 7. The first heat source unit 8 includes two first clamping members 80 and 81, two first heat sources 82 and 83, and a first heat source moving mechanism 84.

[0116] When the heat pipe 7 is cooled, the first clamping members 80 and 81 abut against the first end 7a of the heat pipe 7, transferring heat from the heat pipe 7 to the first heat sources 82 and 83. The first clamping members 80 and 81 are made of, for example, a metal with high thermal conductivity (e.g., a copper alloy). The shape of the first clamping members 80 and 81 is, for example, rectangular along the XY direction when viewed from above, and cuboid in length along the Y-axis direction. The first clamping member 80 has a lower surface 80a. When the heat pipe 7 is cooled, a portion of the lower surface 80a functions as an abutment portion 80b that abuts against the corresponding first end 7a. That is, the first clamping member 80 has a plurality of (six in this embodiment) abutment portions 80b. The abutment portions 80b are arranged at equal intervals in the Y-axis direction. The first clamping member 81 has an upper surface 81a. When the heat pipe 7 is cooled, a portion of the upper surface 81a functions as an abutment portion 81b that abuts against the corresponding first end 7a. That is, the first clamping member 81 has a plurality of (six in this embodiment) abutment portions 81b. The abutment portions 81b are arranged at equal intervals in the Y-axis direction. When the main body 6 is in the standby position, the abutment portions 81b are opposite to the abutment portions 80b. The first clamping members 80 and 81 are movable in the vertical direction. The first clamping members 80 and 81 are an example of the heat source main body in this invention. In the following description, when specifically distinguishing each abutment portion 80b and 81b, "1" to "6" are appended to the end of their reference numerals.

[0117] The first heat sources 82 and 83 are cooling sources for cooling heat pipe 7 via the first clamping members 80 and 81. The first heat sources 82 and 83 are, for example, flow channels for the refrigerant flowing through the first clamping members 80 and 81. The refrigerant is cooled by a cooling device and circulates between the first heat sources 82 and 83 and the cooling device. The first heat source 82 is disposed inside the first clamping member 80, and the first heat source 83 is disposed inside the first clamping member 81.

[0118] The first heat source moving mechanism 84 moves the first clamping members 80 and 81 vertically between a clamping position and a non-clamping position. The "clamping position" is the position where the first clamping members 80 and 81 clamp the first end portion 7a. The "non-clamping position" is the position where the first clamping members 80 and 81 are separated from the first end portion 7a. By moving the first clamping members 80 and 81 between the clamping position and the non-clamping position, the abutting portions 80b and 81b move relative to the first end portion 7a. That is, the first heat source moving mechanism 84 switches between the abutting portions 80b and 81b abutting against the first end portion 7a and separating from it. The first heat source moving mechanism 84 may include, for example, a known power source (e.g., a motor: not shown) and a power transmission mechanism (e.g., gears, ball screws, etc.: not shown). The first heat source moving mechanism 84 is an example of an abutting switching part in this invention.

[0119] Figure 5 yes Figure 3 A schematic diagram of the second heat source unit 9 viewed from direction C.

[0120] For ease of explanation, the figure shows the abutment portion 90b, which will be described later, with a thick solid line, and also shows a cross-section of the second end portion 7b along the YZ plane.

[0121] The second heat source unit 9 corresponds to the second end 7b and heats the heat pipe 7 (working fluid). That is, the second heat source unit 9 is a heating unit that heats the heat pipe 7. The second heat source unit 9 includes two second clamping members 90 and 91, two second heat sources 92 and 93, and a second heat source moving mechanism 94.

[0122] When the heat pipe 7 is heated, the second clamping members 90 and 91 abut against the second end 7b of the heat pipe 7, transferring heat from the second heat sources 92 and 93 to the heat pipe 7. The structures of the second clamping members 90 and 91 are the same as those of the first clamping members 80 and 81. That is, the second clamping member 90 has a lower surface 90a and a plurality of (six in this embodiment) abutting portions 90b. The second clamping member 91 has an upper surface 91a and a plurality of (six in this embodiment) abutting portions 91b. When the main body 6 is in the standby position, the abutting portions 91b are opposite to the abutting portions 90b. The second clamping members 90 and 91 are movable in the vertical direction. The second clamping members 90 and 91 are an example of the heat source main body in this invention. In the following description, when distinguishing each abutting portion 90b and 91b, "1" to "6" are appended to the end of their reference numerals.

[0123] The second heat sources 92 and 93 are heat sources that heat the heat pipe 7 via the second clamping members 90 and 91. The second heat sources 92 and 93 are, for example, known tubular heaters. The second heat source 92 is disposed inside the second clamping member 90, and the second heat source 93 is disposed inside the second clamping member 91.

[0124] The second heat source moving mechanism 94 moves the second clamping members 90 and 91 vertically between a clamping position and a non-clamping position. The "clamping position" is the position where the second clamping members 90 and 91 clamp the second end portion 7b. The "non-clamping position" is the position where the second clamping members 90 and 91 are separated from each other and the second end portion 7b. By moving the second clamping members 90 and 91 between the clamping position and the non-clamping position, the abutting portions 90b and 91b move relative to the second end portion 7b. That is, the second heat source moving mechanism 94 switches between the abutting portions 90b and 91b abutting against the second end portion 7b and separating from it. The structure of the second heat source moving mechanism 94 is the same as that of the first heat source moving mechanism 84. The second heat source moving mechanism 94 is an example of an abutting switching part in this invention.

[0125] In the through hole 6c, heat pipe 7, and abutment portions 80b, 81b, 90b, and 91b, the components with the same reference numerals for distinction correspond to each other. That is, for example, the through hole 6c1 corresponds to the heat pipe 71, and the heat pipe 71 is inserted into the through hole 6c1. The abutment portions 80b1 and 81b1 correspond to the first end 7a1 and can abut against the first end 7a1. The abutment portions 90b1 and 91b1 correspond to the second end 7b1 and can abut against the second end 7b1.

[0126] Here, the first heat source unit 8 and the second heat source unit 9 are examples of heat source units in this invention. In other words, the heat source unit in this invention includes the first heat source unit 8 and the second heat source unit 9.

[0127] Temperature measuring device 10 measures the temperature of the main body 6. Temperature measuring device 10 is, for example, a known thermocouple. Temperature measuring device 10 is inserted into a corresponding insertion hole 6d in the main body 6. In the following description, when specifically distinguishing each temperature measuring device 10, "1" to "3" are appended to the end of their reference numerals. Temperature measuring device 101 is inserted into insertion hole 6d1, temperature measuring device 102 is inserted into insertion hole 6d2, and temperature measuring device 103 is inserted into insertion hole 6d3.

[0128] The following explanation mainly refers to... Figure 1 and Figure 2 .

[0129] The second unit conveying device 11 conveys the main body 6 between the processing position and the standby position. The second unit conveying device 11 includes, for example, a known power source (e.g., a motor: not shown), a power transmission mechanism (e.g., gears, ball screws, etc.: not shown), and a track (not shown).

[0130] The base component 12 supports the upper mold 14, the first spring component 17, and the second spring component 18. When viewed from above, the base component 12 is rectangular along the XY direction, and is a cuboid shape.

[0131] Side member 13 divides the receiving chamber R, which will be described later. When viewed from below, side member 13 is rectangular in shape along the XY direction, and is frame-shaped. Side member 13 houses upper mold 14, frame member 15, and pressure pad 16. Side member 13 is supported on base member 12 via second spring member 18. Side member 13 has a lower surface 13a and through holes 13b opening on the inner and outer surfaces of side member 13.

[0132] The upper mold 14 applies pressure to the workpiece W from above via the pressure pad 16. The upper mold 14 is positioned below the base component 12 and is mounted on the base component 12. When viewed from below, the upper mold 14 is rectangular along the XY direction, and is a cuboid shape.

[0133] The frame member 15 holds the pressure pad 16. When viewed from below, the frame member 15 is rectangular along the XY axis, forming a frame shape. In the horizontal direction, the frame member 15 is configured to surround the upper mold 14. In the vertical direction, the lower end of the frame member 15 is located below the upper mold 14. The frame member 15 is supported on the base member 12 via the first spring member 17.

[0134] When pressure is applied to the workpiece W, the pressure pad 16 deforms in a manner that follows the shape of the surface of the workpiece W, applying pressure evenly to the workpiece W and dividing the receiving chamber R, which will be described later. The pressure pad 16 is held at the lower end of the frame member 15 and is disposed below the upper mold 14. The pressure pad 16 has a soft layer 16a and a heat insulation layer 16b.

[0135] The flexible layer 16a is made of, for example, a known elastomeric material with high fluidity and low resilience modulus. The flexible layer 16a is filled, for example, between two film components (not shown, the same below) disposed above and below the flexible layer 16a and surrounded by the frame component 15.

[0136] The insulation layer 16b is made of, for example, a known fibrous material with high flexibility and low thermal conductivity. The insulation layer 16b is disposed adjacent to the flexible layer 16a below the flexible layer 16a. The insulation layer 16b, for example, like the flexible layer 16a, is filled in the vertical direction between two membrane components (not shown, the same below) and surrounded by the frame component 15.

[0137] It should be noted that in this invention, when the temperature of the workpiece W is lower than the heat resistance temperature of the soft layer 16a, the pressure pad 16 may not have a heat insulation layer 16b.

[0138] The first spring component 17 supports the frame component 15 so that it can move relative to the upper mold 14 in the vertical direction. The first spring component 17 is disposed between the base component 12 and the frame component 15, and is respectively mounted on the base component 12 and the frame component 15.

[0139] The second spring component 18 supports the side component 13 so that it can move relative to the upper mold 14 and the frame component 15 in the vertical direction. The second spring component 18 is disposed between the base component 12 and the side component 13, and is respectively mounted on the base component 12 and the side component 13.

[0140] Sealing components 19 and 20 provide an airtight seal between side component 13 and frame component 15, and between mounting plate 3 and side component 13. Sealing components 19 and 20 are, for example, known O-rings. Sealing component 19 is disposed between side component 13 and frame component 15. Sealing component 20 is disposed on the lower surface 13a of side component 13.

[0141] Pump P is a known vacuum pump connected to through hole 13b.

[0142] In this embodiment, when pressurizing the workpiece W, a chamber unit CU for accommodating the workpiece W is assembled using the upper pressurizing unit UP and the mounting plate 3 (see reference). Figure 7 When assembling the chamber unit CU, the workpiece W is housed in a sealed space (hereinafter referred to as "housing chamber R") divided by the mounting plate 3, side member 13, frame member 15, pressure pad 16, and sealing members 19 and 20. Figure 6 )".

[0143] Operation of the pressurization device (first embodiment)

[0144] Next, the operation of this device 1 will be explained as follows. In the following explanation, please refer to the relevant references as appropriate. Figures 1-5 In this device 1, before the workpiece W is loaded, the heating mold unit 40 is in the processing position, the cooling mold unit 41 is in the standby position, and the upper pressure unit UP is located above the heating mold unit 40.

[0145] First, the mounting plate 3, on which the workpiece W is placed, is placed on the cooling mold unit 41. Next, the first unit conveying device 42 conveys the heating mold unit 40 to the standby position and the cooling mold unit 41 to the processing position.

[0146] Next, the control device 2 lowers the upper pressure unit UP until the sealing component 20 is in close contact with the mounting plate 3. At this time, a receiving chamber R is formed between the mounting plate 3 and the upper pressure unit UP, and the workpiece W is received in the receiving chamber R.

[0147] Figure 6 This is a schematic cross-sectional view of the device 1 showing the state in which the workpiece W is housed in the housing chamber R.

[0148] Next, control device 2 activates pump P, causing the atmosphere inside the containment chamber R to become a depressurized atmosphere. At this time, due to the vacuum pressure (containment chamber R and chamber unit CU (reference)... Figure 7 Due to the pressure difference between the external spaces (hereinafter the same), the mounting plate 3 is pressed (mounted) against the side member 13, the second spring member 18 contracts, and the mounting plate 3 and the side member 13 rise. As a result, the pressure pad 16 contacts the workpiece W, and the workpiece W is pre-pressurized by a pre-pressure corresponding to the vacuum pressure. Through pre-pressurization, the pressure pad 16 deforms according to the shape of the surface of the workpiece W, and the workpiece W is held on the mounting plate 3 and the pressure pad 16. Here, the pre-pressure is much smaller than the formal pressure described later. Thus, by mounting the mounting plate 3 on the upper pressurization unit UP, the chamber unit CU is assembled, and the workpiece W is housed in the chamber unit CU.

[0149] Next, the control device 2 raises the chamber unit CU. Then, the first unit conveying device 42 and the second unit conveying device 11 transport the heating mold unit 40 and the main body 6 to the processing position, and transport the cooling mold unit 41 to the standby position.

[0150] Figure 7 This is a schematic cross-sectional view of the device 1 showing the state in which the heating mold unit 40 and the main body 6 are in the processing position.

[0151] Figure 8 yes Figure 7 A schematic cross-sectional view of the device 1 viewed from direction D.

[0152] The first end 7a of the heat pipe 7 is located between the first clamping member 80 and the first clamping member 81, and the second end 7b is located between the second clamping member 90 and the second clamping member 91. The lower surface 6b of the main body 6 abuts against the upper surface 40e of the main body 40a of the heating mold unit 40. The heating mold unit 40 is heated to a predetermined heating temperature "T1: for example, about 400°C". Therefore, heat from the heating mold unit 40 is transferred to the main body 6, heating the main body 6 to temperature "T1". Here, in order to increase the heating rate of the workpiece W, the temperature "T1" is set to a temperature higher than the predetermined processing temperature "T2: for example, 300°C".

[0153] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body 6. At this time, the main body 6 and the heat pipe 7 are positioned between the mounting plate 3 and the heating mold unit 40.

[0154] Figure 9 This is a schematic cross-sectional view of the device 1 showing the state of the chamber unit CU in its lowered position.

[0155] Figure 10 This is a timing diagram showing an example of the temperature changes of workpiece W, heating mold unit 40, and main body 6 when workpiece W is heated.

[0156] Figure 10 An example of the temperature profile Pr1 referenced by control device 2 in the temperature control of workpiece W is also shown. In the following description, appropriate reference will be made to… Figure 10 .

[0157] Next, the control device 2 lowers the base component 12 until a predetermined pressure (hereinafter referred to as "formal pressure") is applied to the workpiece W. At this time, the upper mold 14 descends relative to the frame component 15 and the side component 13. Therefore, the upper mold 14 presses the pressure pad 16 downward, and the pressure pad 16 deforms in a manner that follows the shape of the surface of the workpiece W, applying pressure evenly to the workpiece W.

[0158] Furthermore, when the mounting plate 3 comes into contact with the main body 6, the control device 2 changes the set temperature of the heating mold unit 40 to "T2". Since the main body 40a has a large heat capacity, the temperature of the heating mold unit 40 and the main body 6 decreases slowly from temperature "T1" to temperature "T2". At this time, heat from the heating mold unit 40 is transferred to the workpiece W via the main body 6 and the mounting plate 3. The heating rate of the workpiece W increases until its temperature approaches the temperatures of the heating mold unit 40 and the main body 6 (temperatures "T1" to "T2"). As the temperature of the workpiece W approaches this temperature further, the heating rate decreases. Therefore, in this embodiment, to accelerate the heating rate, the set temperature of the heating mold unit 40 before the mounting plate 3 comes into contact is set to a temperature "T1" that is higher than temperature "T2". As temperature "T1" increases, the heating rate of the workpiece W increases, but the temperature of the workpiece W easily exceeds temperature "T2" (overheating is likely). Therefore, a second mold unit 5 is used to suppress this overheating.

[0159] Next, when the workpiece W is heated to a predetermined temperature "T3", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the clamping position. At this time, the abutting portions 80b1-80b6 and 81b1-81b6 move together and abut against the corresponding first ends 7a1-7a6. As a result, the first heat source unit 8 comes into contact with the heat pipe 7.

[0160] Temperature "T3" is preset to be lower than temperature "T2" so that the temperature of workpiece W does not exceed temperature "T2" through cooling by heat pipe 7 (described later). (Alternatively, even if the temperature of workpiece W exceeds temperature "T2", the overheating will be reduced). In this embodiment, for example, the temperature change rate of workpiece W is measured in advance. The first heat source moving mechanism 84 moves the first clamping members 80 and 81 according to the temperature change rate and the elapsed time since the mounting plate 3 came into contact with the main body 6, such that the temperature of workpiece W reaches temperature "T2" within a predetermined elapsed time.

[0161] It should be noted that in this invention, the first heat source moving mechanism 84 can also move the first clamping members 80 and 81 to the clamping position when the main body 6 is cooled to a predetermined temperature "Tx". That is, the first heat source moving mechanism 84 can also switch between separation and contact of the contact portions 80b1-80b6 and 81b1-81b6 based on the measurement results of the temperature measuring device 10. In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Tx" is preset based on the temperature change rate.

[0162] Figure 11 This is a schematic cross-sectional view of the device 1 showing the state in which the first clamping members 80 and 81 have moved to the clamping position.

[0163] When the first clamping members 80 and 81 move to the clamping position, the abutting portions 80b and 81b abut against the corresponding first end portion 7a from the vertical direction. The first clamping members 80 and 81 are pre-cooled to a predetermined temperature "Tc: for example, about 20°C" by the first heat sources 82 and 83. That is, the first clamping members 80 and 81 also function as cooling sources corresponding to the first end portion 7a. As described above, the first clamping members 80 and 81 are rectangular in shape, and all the abutting portions 80b and 81b are arranged in one first clamping member 80 or 81. That is, the heat capacity of the first clamping members 80 and 81 is relatively large. Therefore, the first clamping members 80 and 81 are difficult to heat by the heat pipe 7, and the first end portion 7a is rapidly cooled by the first clamping members 80 and 81. Therefore, the heat (transferred from the heating mold unit 40) of the main body 6 is transferred to the first clamping members 80 and 81 via the heat pipe 7. As a result, the temperature of the main body 6 is lower than the temperature of the heating mold unit 40, approaching temperature "T2". The heating rate of the workpiece W decreases rapidly between temperature "T3" and temperature "T2". At this time, compared to the case where the power supply to the heating source 40c is disconnected without cooling the heat pipe 7, the rate of temperature change of the workpiece W during heating is smaller. Then, the temperature of the workpiece W stabilizes at temperature "T2". Thus, by cooling the heat pipe 7 during the heating of the workpiece W, this device 1 controls the rate of temperature change of the workpiece W during heating. As a result, this device 1 achieves temperature control that suppresses overheating of the workpiece W while accelerating the heating rate of the workpiece W.

[0164] Next, when the temperature of the heating mold unit 40 drops to temperature "T2", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the non-clamping position. At this time, the abutment portions 80b1-80b6 and 81b1-81b6 move together and separate from the corresponding first ends 7a1-7a6. As a result, the first heat source unit 8 separates from the heat pipe 7.

[0165] Figure 12 This is a schematic cross-sectional view of the device 1 showing the state in which the first clamping members 80 and 81 have moved to the non-clamping position.

[0166] When the first clamping components 80 and 81 move to the non-clamping position, the first clamping components 80 and 81 are mechanically separated from the first end 7a. As a result, the temperature of the main body 6, the heat pipe 7, and the workpiece W is maintained at the temperature of the heating mold unit 40, i.e., temperature "T2".

[0167] It should be noted that, in this invention, the first heat source moving mechanism 84 may, for example, switch between contact and separation of the contact portions 80b and 81b relative to the first end 7a more than once based on the temperature measurement results of the temperature measuring device 10, so that the workpiece W is heated according to a predetermined temperature curve Pr1. In this case, the temperature of the workpiece W during heating further changes according to the temperature curve Pr1. As a result, the device 1 can accurately control the rate of temperature change of the workpiece W during heating according to the temperature curve Pr1. Thus, the rate of temperature change of the workpiece W during heating is controlled by the first mold unit 4 and the second mold unit 5. In other words, when heating the workpiece W, the second mold unit 5 heats the workpiece W together with the first mold unit 4.

[0168] Next, after a predetermined time, the control device 2 ends the pressurization of the workpiece W. Then, the control device 2 raises the chamber unit CU, separating the mounting plate 3 from the main body 6. Next, the first unit conveying device 42 moves the heating mold unit 40 to the standby position and the cooling mold unit 41 to the processing position. At this time, the main body 6 and the heat pipe 7 are positioned between the mounting plate 3 and the cooling mold unit 41.

[0169] Figure 13 This is a schematic cross-sectional view of the device 1 showing the state in which the cooling mold unit 41 has moved to the processing position.

[0170] Figure 14 yes Figure 13 A schematic cross-sectional view of the device 1 viewed from direction E.

[0171] The first end 7a of the heat pipe 7 is located between the first clamping member 80 and the first clamping member 81, and the second end 7b is located between the second clamping member 90 and the second clamping member 91. The lower surface 6b of the main body 6 abuts against the upper surface 41c of the main body 41a of the cooling mold unit 41. The cooling mold unit 41 is pre-cooled to a predetermined temperature "T4: for example, about 20°C". In addition, as mentioned above, the heat capacity of the main body 6 is smaller than that of the main body 41a. Therefore, heat from the main body 6 is transferred to the cooling mold unit 41, and the main body 6 is cooled to temperature "T4".

[0172] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 comes into contact with the main body 6.

[0173] Figure 15 This is a schematic cross-sectional view of the device 1 showing the state of the chamber unit CU in its lowered position.

[0174] Figure 16 This is a timing diagram showing an example of the temperature changes of workpiece W, cooling mold unit 41, and main body 6 during workpiece W cooling.

[0175] Figure 16 An example of the temperature profile Pr2 referenced by control device 2 in the temperature control of workpiece W is also shown. In the following description, appropriate reference will be made to… Figure 16 .

[0176] When the mounting plate 3 comes into contact with the main body 6, heat from the workpiece W and the mounting plate 3 is transferred to the main body 6. As a result, the workpiece W and the mounting plate 3 are rapidly cooled, while the main body 6 is rapidly heated. At this time, the main body 6 is cooled by the workpiece W, the mounting plate 3, and the cooling mold unit 41, which has a main body 41a with a larger heat capacity than the main body 6. Therefore, the temperature change rate (heating rate) of the main body 6 is smaller than the temperature change rate (cooling rate) of the workpiece W and the mounting plate 3.

[0177] Next, when the main body 6 is heated to a predetermined temperature "T5", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the clamping position. At this time, the abutting parts 80b1-80b6 and 81b1-81b6 move together and abut against the corresponding first ends 7a1-7a6. As a result, the first heat source unit 8 comes into contact with the heat pipe 7.

[0178] Temperature "T5" is preset to be lower than temperature "T6" described later, in order to prevent the temperature of the main body 6 from becoming too high. In this embodiment, the first heat source moving mechanism 84 switches between separation and contact of the contact portions 80b1 to 80b6 and 81b1 to 81b6 based on the measurement results of the temperature measuring device 10.

[0179] It should be noted that, in this invention, the first heat source moving mechanism 84 can also move the first clamping members 80 and 81 to the clamping position when the workpiece W is cooled to a predetermined temperature "Ty". In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Ty" is preset based on the temperature change rate. The first heat source moving mechanism 84 estimates the temperature of the workpiece W based on the elapsed time from when the mounting plate 3 comes into contact with the main body 6.

[0180] Figure 17 This is a schematic cross-sectional view of the device 1 showing the state in which the first clamping members 80 and 81 have moved to the clamping position.

[0181] When the first clamping members 80 and 81 move to the clamping position, the abutting portions 80b and 81b abut against the corresponding first end portion 7a from the vertical direction. As described above, the first clamping members 80 and 81 function as cooling sources corresponding to the first end portion 7a. As a result, heating of the main body 6 is suppressed, and the temperature of the main body 6 is maintained near temperature "T5" (for example, a temperature between temperature "T5" and temperature "T6"), and then slowly decreases. As a result, the decrease in the cooling rate of the workpiece W caused by the increase in temperature of the main body 6 can be suppressed. That is, the decrease in the rate of temperature change of the workpiece W can be suppressed.

[0182] Next, when the temperature of the workpiece W is cooled to a predetermined temperature "T6", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to a non-clamping position. At this time, the abutment portions 80b1-80b6 and 81b1-81b6 move together, moving away from the corresponding first ends 7a1-7a6. In this embodiment, for example, the temperature change rate of the workpiece W is measured in advance. The first heat source moving mechanism 84 moves the first clamping members 80 and 81 according to this temperature change rate and the elapsed time since the mounting plate 3 abutted against the main body 6, such that the temperature of the workpiece W reaches temperature "T6" within the predetermined elapsed time.

[0183] It should be noted that in this invention, the first heat source moving mechanism 84 can also move the first clamping members 80 and 81 to a non-clamping position when the main body 6 is cooled to a predetermined temperature "Tz". That is, the first heat source moving mechanism 84 can also switch between contact and separation of the contact parts 80b1-80b6 and 81b1-81b6 based on the measurement results of the temperature measuring device 10. In this case, for example, the temperature change rate of the workpiece W is measured in advance, and the temperature "Tz" is preset based on the temperature change rate.

[0184] Figure 18 This is a schematic cross-sectional view of the device 1 showing the state in which the first clamping members 80 and 81 have moved to the non-clamping position.

[0185] When the first clamping components 80 and 81 move to the non-clamping position, the first clamping components 80 and 81 are mechanically separated from the first end 7a. Thereafter, the temperature of the workpiece W decreases slowly, and the temperature of the cooling mold unit 41 and the main body 6 also decreases slowly to temperature "T4".

[0186] It should be noted that, in this invention, the first heat source moving mechanism 84 may, for example, switch between contact and separation of the contact portions 80b and 81b relative to the first end 7a more than once based on the temperature measurement results of the temperature measuring device 10, so that the workpiece W is cooled according to the prescribed temperature curve Pr2. In this case, the temperature of the workpiece W during cooling further changes according to the temperature curve Pr2. As a result, the device 1 can accurately control the rate of temperature change of the workpiece W during cooling according to the temperature curve Pr2. Thus, the rate of temperature change of the workpiece W during cooling is controlled by the first mold unit 4 and the second mold unit 5. In other words, when cooling the workpiece W, the second mold unit 5 cools the workpiece W together with the first mold unit 4.

[0187] Next, after a predetermined time, the control device 2 raises the chamber unit CU, separating the mounting plate 3 from the main body 6. Then, the second unit conveying device 11 moves the main body 6 to the standby position. Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 contacts the cooling mold unit 41. Then, the control device 2 stops the pump P, purifies the atmosphere of the receiving chamber R with inert gas, thereby removing the workpiece W from the chamber unit CU.

[0188] Figure 19 This is a schematic diagram illustrating an example of the actual temperature change of workpiece W.

[0189] In this figure, as an embodiment of the present invention, "Example 1" shows the temperature change when the heat pipe 7 is cooled by the device 1 during heating. As a comparative example, "Example 2" shows the temperature change when the chamber unit CU is brought into contact with the preheated heating mold unit 40. "Example 3" shows the temperature change when the heating mold unit 40 is heated after the chamber unit CU is brought into contact with the unpreheated heating mold unit 40. As shown in the figure, in "Example 1", with the same heating time as "Example 2", a different rate of temperature change than in "Example 2" is obtained (close to the rate of temperature change in "Example 3").

[0190] Thus, in this apparatus 1, when the workpiece W is heated, the main body 6 is cooled by the cooling heat pipe 7, thereby rapidly reducing the heating rate of the workpiece W. That is, the temperature change rate of the workpiece W decreases rapidly (the change is large). As a result, even if the workpiece W is rapidly heated to temperature "T3", the temperature of the workpiece W will not exceed temperature "T2". Moreover, by mechanically separating the cooling source (first clamping members 80, 81 and first heat sources 82, 83) from the heat pipe 7, the cooling of the heat pipe 7 is forcibly terminated. As a result, the thermal state of the heat pipe 7 instantly switches from a cooling state (temperature equilibrium state) to a heating state heated by the heating mold unit 40. Similarly, in this apparatus 1, when the workpiece W is cooled, the main body 6 is cooled by the cooling heat pipe 7, thereby suppressing the decrease in the cooling rate of the workpiece W caused by the temperature rise of the main body 6. That is, the decrease in the temperature change rate of the workpiece W can be suppressed. As a result, compared with the case where the heat pipe 7 is not cooled, the temperature change rate of the workpiece W is larger, and the workpiece W is rapidly cooled. Furthermore, by mechanically separating the cooling source from the heat pipe 7, the cooling of the heat pipe 7 is forcibly terminated. As a result, the thermal state of the heat pipe 7 instantly switches from a cooling state (temperature equilibrium state) to a cooling state cooled by the cooling mold unit 41. This instantaneous switching of thermal states can be achieved by mechanically separating the heat source from the heat pipe 7, but cannot be obtained by switching the heat source of the heat pipe 7 on / off.

[0191] This device 1, by cooling the workpiece W together with the first mold unit 4 and the second mold unit 5, can control the temperature change rate of the workpiece W during heating and cooling in at least two levels. Therefore, this device 1 can change the heating and cooling times of the workpiece W. Furthermore, by controlling the frequency and timing of the contact and separation of the heat source from the heat pipe 7, this device 1 can perform complex temperature control on the workpiece W and can control the temperature change rate of the workpiece W during heating (and cooling) according to the desired purpose. That is, for example, if the workpiece W is a sintering material, and a formal pressure must be applied to the workpiece W before its temperature reaches the sintering start temperature, this device 1 can handle the workpiece W by changing the temperature change rate during heating before and after the sintering start temperature. Thus, this device 1 can control the relationship between the applied pressure and temperature of the workpiece W according to its type.

[0192] It should be noted that, in this invention, when the workpiece W is heated, the second clamping components 90 and 91 can also replace the first clamping components 80 and 81 and move to the contact position.

[0193] Figure 20 This is a schematic cross-sectional view of the device 1 showing the state in which the second clamping components 90 and 91 move to the clamping position when the workpiece W is heated.

[0194] In this case, workpiece W is heated rapidly. That is, the rate of temperature change of workpiece W during heating becomes larger, and the heating time becomes shorter. When workpiece W is heated to temperature "T3", the second heat source moving mechanism 94 moves the second clamping parts 90 and 91 to the non-abutting position, and the first heat source moving mechanism 84 moves the first clamping parts 80 and 81 to the abutting position. As a result, the temperature of workpiece W does not exceed temperature "T2". This structure is particularly effective when the heating performance of the heating mold unit 40 is low.

[0195] Furthermore, in this invention, when the workpiece W is cooling, the second clamping members 90 and 91 can also move to the abutment position instead of the first clamping members 80 and 81. In this case, the workpiece W is cooled slowly. That is, the rate of temperature change of the workpiece W during cooling is smaller, and the cooling time is longer.

[0196] Furthermore, in this invention, the timing of the contacting portions 80b and 81b contacting and separating from the first end 7a is not limited to this embodiment. The timing of the contacting portions 90b and 91b contacting and separating from the second end 7b is also the same.

[0197] Summary (First Implementation)

[0198] According to the embodiments described above, the device 1 includes a first mold unit 4 and a second mold unit 5. The second mold unit 5 heats or cools the workpiece W together with the first mold unit 4. The second mold unit 5 has a main body 6, a plurality of heat pipes 7, a first heat source unit 8, and a second heat source unit 9. The main body 6 is disposed between the first mold unit 4 and the workpiece W (carrying plate 3) during heating and cooling. The first heat source unit 8 includes a plurality of abutment portions 80b and 81b and a first heat source moving mechanism 84. The second heat source unit 9 includes a plurality of abutment portions 90b and 91b and a second heat source moving mechanism 94. The first heat source moving mechanism 84 switches between the abutment portions 80b and 81b abutting against the first end 7a and separating from the first end 7a. The second heat source moving mechanism 94 switches between the abutment portions 90b and 91b abutting against the second end 7b and separating from the second end 7b. According to this structure, the device 1 can instantly switch the thermal state of the heat pipe 7 between a heating state and a cooling state. Therefore, by controlling the number and timing of the contact and separation of the heat source with the heat pipe 7, the device 1 can perform complex temperature control on the workpiece W, and can control the rate of temperature change of the workpiece W during heating and cooling according to the purpose.

[0199] Furthermore, according to the embodiment described above, the second mold unit 5 includes a temperature measuring device 10. The first heat source moving mechanism 84 and the second heat source moving mechanism 94 control the contact and separation of the contact portions 80b and 81b relative to the first end 7a, and control the contact and separation of the contact portions 90b and 91b relative to the second end 7b, based on the temperature measurement results from the temperature measuring device 10. According to this structure, the temperature (temperature change rate) of the workpiece W is controlled based on the actual temperature of the component closest to the workpiece W in the lower pressurizing unit DP, namely the main body 6. Therefore, the temperature control accuracy of the workpiece W is improved.

[0200] Furthermore, according to the embodiment described above, the first mold unit 4 includes a heating mold unit 40. The first heat source unit 8 includes first heat sources 82 and 83 for cooling heat pipes 7. The first heat source moving mechanism 84 controls the contact and separation of the contact portions 80b and 81b relative to the first end 7a, so that the workpiece W is heated according to the temperature curve Pr1. According to this structure, the device 1 can control the rate of temperature change and the heating time of the workpiece W during heating according to the temperature curve Pr1.

[0201] Furthermore, according to the embodiment described above, the first mold unit 4 includes a cooling mold unit 41. The second heat source unit 9 includes second heat sources 92 and 93 for heating heat pipes 7. The second heat source moving mechanism 94 controls the contact portions 90b and 91b to contact and separate from the second end 7b, so that the workpiece W is cooled according to the temperature curve Pr2. According to this structure, the device 1 can control the temperature change rate and cooling time of the workpiece W during cooling according to the temperature curve Pr2.

[0202] Furthermore, according to the embodiment described above, when the heat pipe 7 is cooled, the contact portions 80b and 81b abut against the first end 7a, and when the heat pipe 7 is heated, the contact portions 90b and 91b abut against the second end 7b. In other words, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 switch between the first heat source unit 8 and the second heat source unit 9 according to the heating and cooling of the heat pipe 7. That is, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 function as unit switching parts in this invention. According to this structure, the device 1 can further control the temperature change rate and heating / cooling time of the workpiece W during heating / cooling.

[0203] Furthermore, according to the embodiment described above, the second mold unit 5 includes a first heat source unit 8 corresponding to the first end 7a and a second heat source unit 9 corresponding to the second end 7b. The first heat source unit 8 is a cooling unit, and the second heat source unit 9 is a heating unit. According to this structure, if the abutting portions 80b and 81b abut against the first end 7a when the workpiece W is heated, the temperature change rate of the workpiece W during heating decreases, and the heating time increases. Conversely, if the abutting portions 80b and 81b abut against the first end 7a when the workpiece W is cooled, the temperature change rate of the workpiece W during cooling increases, and the cooling time decreases. On the other hand, if the abutting portions 90b and 91b abut against the second end 7b when the workpiece W is heated, the temperature change rate of the workpiece W during heating increases, and the heating time decreases. Conversely, if the abutting portions 90b and 91b abut against the second end 7b when the workpiece W is cooled, the temperature change rate of the workpiece W during cooling decreases, and the cooling time increases. Thus, this device 1 can control the rate of temperature change and the heating / cooling time of the workpiece W during heating / cooling.

[0204] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 moves the first clamping members 80 and 81, thereby causing the plurality of abutting portions 80b and 81b to abut against or move away from the corresponding first end 7a. The second heat source moving mechanism 94 moves the second clamping members 90 and 91, thereby causing the plurality of abutting portions 90b and 91b to abut against or move away from the corresponding second end 7b. With this structure, the structures of the first clamping members 80 and 81 and the second clamping members 90 and 91 can be simplified. Additionally, the heat capacity of the first clamping members 80 and 81 and the second clamping members 90 and 91 becomes relatively large.

[0205] Furthermore, according to the embodiment described above, the second mold unit 5 is separate from the first mold unit 4. The main body 6 is movable relative to the first mold unit 4 in the horizontal direction. When the workpiece W is not being heated or cooled, the main body 6 moves relative to it from the processing position to the standby position. With this structure, it is possible to freely choose whether to use the second mold unit 5. That is, the device 1 can heat / cool the workpiece W using only the first mold unit 4. As a result, the device 1 can change the rate of temperature change and time of workpiece W during heating / cooling by selecting whether to use the second mold unit 5. In addition, one second mold unit 5 can be used for both the heating mold unit 40 and the cooling mold unit 41. Therefore, compared with the case where each heating mold unit 40 and cooling mold unit 41 requires a dedicated second mold unit 5, the structure of the device 1 is simple. Moreover, by bringing the main body 6 into contact with the heating mold unit 40, the main body 6 can start heating from room temperature, rather than starting heating from the temperature of the heating mold unit 40.

[0206] Furthermore, according to the embodiment described above, when viewed from above, the heat pipe 7 is arranged parallel to each other in a manner orthogonal to the heating source 40c and the cooling source 41b. With this structure, the temperature uniformity of the main body 6 is improved when the heat pipe 7 is not heated or cooled by the first heat source unit 8 or the second heat source unit 9.

[0207] Pressurization device (second embodiment)

[0208] Next, focusing on the differences from the previously described embodiment (hereinafter referred to as "first embodiment"), another embodiment of the device (hereinafter referred to as "second embodiment") will be described below. In the second embodiment, the second mold unit is integrated with the first mold unit, which differs from the first embodiment. In the following description, elements identical to those in the first embodiment and elements having common functions are labeled with the same reference numerals as in the first embodiment, and their descriptions are omitted. In the following description, appropriate reference will be made to… Figure 4 and Figure 5 .

[0209] Structure of the pressurization device (second embodiment)

[0210] Figure 21 This is a schematic cross-sectional view of the device, showing the second embodiment of the device.

[0211] Figure 22 yes Figure 21 A schematic cross-sectional view of the device viewed from direction F.

[0212] This device 1Z clamps and pressurizes the workpiece W in a vertical direction. The device 1Z includes a control device 2, a mounting plate 3, a mold unit 4Z, a base component 12, a side component 13, an upper mold 14, a frame component 15, a pressure pad 16, a first spring component 17, a second spring component 18, two sealing components 19 and 20, and a pump P. The mounting plate 3 and the mold unit 4Z are positioned below the workpiece W, functioning as a lower pressure unit DPZ that applies pressure to the workpiece W from below.

[0213] The mold unit 4Z heats and cools the workpiece W. The mold unit 4Z includes a heating mold unit 40Z, a cooling mold unit 41Z, a first unit conveying device 42, multiple (six each in the second embodiment) heat pipes 7, 7Z, a first heat source unit 8, a second heat source unit 9, and multiple (three each in the second embodiment) temperature measuring instruments 10.

[0214] The heating mold unit 40Z heats the workpiece W. The heating mold unit 40Z is movable between a processing position and a standby position. The heating mold unit 40Z includes a main body 40Za, a heat insulation component 40b, multiple heating sources 40c, multiple cooling sources 40d, an upper surface 40e, multiple (six in the second embodiment) through holes 40f, and multiple (three in the second embodiment) insertion holes 40g.

[0215] The main body 40Za protects the heating source 40c, the cooling source 40d, and the heat pipe 7. The main body 40Za is made of, for example, a metal with high rigidity (e.g., carbon steel). The shape of the main body 40Za is rectangular along the XY direction when viewed from above; it is a cuboid shape. The heat insulation member 40b is configured to divide the main body 40Za into two parts. The heating source 40c is arranged parallel to the Y-axis direction inside the upper half of the main body 40Za. The cooling source 40d is arranged parallel to the Y-axis direction inside the lower half of the main body 40Za.

[0216] Figure 23 This is a schematic top view of the heating mold unit 40Z.

[0217] This diagram shows the heated mold unit 40Z in the processing position. Please refer to the following description as appropriate. Figure 21 , Figure 22 and Figure 23 .

[0218] The through hole 40f is a through hole that penetrates the main body 40Za along the X-axis direction. The through hole 40f is located above the heating source 40c and on the upper part of the main body 40Za. In the following description, when specifically distinguishing each through hole 40f, "1" to "6" will be appended to the end of their reference numerals. In the Y-axis direction, the through holes 40f1 to 40f6 are arranged at equal intervals from the +Y direction side.

[0219] The insertion hole 40g is a non-through hole that opens along the X-axis towards the main body 40Za in the +X direction. In the following description, when distinguishing each insertion hole 40g, "1" to "3" will be appended to the end of their reference numerals. Insertion hole 40g1 is disposed between insertion holes 40f1 and 40f2, insertion hole 40g2 is disposed between insertion holes 40f3 and 40f4, and insertion hole 40g3 is disposed between insertion holes 40f5 and 40f6.

[0220] The heat pipe 7 is inserted into the corresponding insertion hole 40f and fixed to the main body 40Za. That is, the main body 40Za also functions as the main body of the mold in this invention. As a result, in the vertical direction, the area in the main body 40Za where the heat pipe 7 is fixed (the upper side area) functions together with the first heat source unit 8, the second heat source unit 9, and the temperature measuring device 10 as the second mold unit 5 of the first embodiment. Similarly, the area in the main body 40Za that is lower than the area where the heat pipe 7 is fixed (the area where the heating source 40c and the cooling source 40d are arranged) functions as the first mold unit 4 of the first embodiment. That is, the mold unit 4Z includes the first mold unit 4 and the second mold unit 5 of the first embodiment. Thus, in the second embodiment, the first mold unit 4 (heating mold unit 40) and a part of the second mold unit 5 (the main body 6 and the heat pipe 7) of the first embodiment are integrated.

[0221] In the through hole 40f, heat pipe 7, and abutment portions 80b, 81b, 90b, and 91b, the components with the same reference numerals, which are used for differentiation, correspond to each other. That is, for example, the through hole 40f1 corresponds to the heat pipe 7Z1, and the heat pipe 7Z1 is inserted into the through hole 40f1. The abutment portions 80b1 and 81b1 correspond to the first end 7a1 and can abut against the first end 7a1. The abutment portions 90b1 and 91b1 correspond to the second end 7b1 and can abut against the second end 7b1.

[0222] The following explanation mainly refers to... Figure 21 and Figure 22 .

[0223] The cooling mold unit 41Z cools the workpiece W. The cooling mold unit 41Z is movable between a processing position and a standby position. The cooling mold unit 41Z includes a main body 41Za, multiple cooling sources 41b, an upper surface 41c, multiple (six in this embodiment) through holes 41d, and multiple (three in this embodiment) insertion holes 41e.

[0224] The main body 41Za protects the cooling source 41b and the heat pipe 7Z. The main body 41Za is made of, for example, a metal with high rigidity (e.g., carbon steel). The shape of the main body 41Za is rectangular along the XY direction when viewed from above, and is a cuboid shape. The cooling source 41b is arranged inside the main body 41Za in a manner parallel to the Y-axis direction.

[0225] Figure 24 This is a schematic top view of the cooling mold unit 41Z.

[0226] This figure shows the cooling mold unit 41Z in the processing position. In the following description, [the text continues with further details about its position]. Figure 24 Take appropriate reference together Figure 21 , Figure 22 .

[0227] The through hole 41d is a through hole that penetrates the main body 41Za along the X-axis direction. The through hole 41d is located above the cooling source 41b and on the upper part of the main body 41Za. In the following description, when distinguishing each through hole 41d, "1" to "6" will be appended to the end of their reference numerals. In the Y-axis direction, the through holes 41d1 to 41d6 are arranged at equal intervals from the +Y direction side.

[0228] The insertion hole 41e is a non-through hole that opens along the X-axis direction on the +X direction side of the main body 41Za. In the following description, when distinguishing each insertion hole 41e, "1" to "3" will be appended to the end of their reference numerals. Insertion hole 41e1 is disposed between insertion holes 41d1 and 41d2, insertion hole 41e2 is disposed between insertion holes 41d3 and 41d4, and insertion hole 41e3 is disposed between insertion holes 41d5 and 41d6.

[0229] The structure of heat pipe 7Z is the same as that of heat pipe 7. Heat pipe 7Z has a first end 7Za and a second end 7Zb. Heat pipe 7Z is inserted through the corresponding insertion hole 41d and fixed to the main body 41Za. That is, the main body 41Za also functions as the main body of the mold in this invention. As a result, the area in the main body 41Za where the heat pipe 7Z is fixed (the upper area) functions together with the first heat source unit 8, the second heat source unit 9, and the temperature measuring device 10 as the second mold unit 5 of the first embodiment. Similarly, the area in the main body 41Za that is lower than the area where the heat pipe 7Z is fixed (the area where the cooling source 41b is disposed) functions as the first mold unit 4 of the first embodiment. Thus, in the second embodiment, the first mold unit 4 (cooling mold unit 41Z) of the first embodiment and a part of the second mold unit 5 are integrated.

[0230] The first end 7Za protrudes from the main body 41Za in the +X direction, and the second end 7Zb protrudes from the main body 41Za in the -X direction. The first end 7Za and the second end 7Zb are examples of the protruding ends in this invention. In the following description, when distinguishing each heat pipe 7Z, "1" to "6" will be appended to the end of their reference numerals.

[0231] The following explanation mainly refers to... Figures 21-24 .

[0232] Temperature measuring devices 10 are inserted into corresponding insertion holes 40g and 41e. In the following description, when each temperature measuring device 10 is specifically distinguished, "1" to "6" will be appended to the end of its reference numerals. Temperature measuring device 101 is inserted into insertion hole 40g1, temperature measuring device 102 is inserted into insertion hole 40g2, and temperature measuring device 103 is inserted into insertion hole 40g3. Temperature measuring device 104 is inserted into insertion hole 41e1, temperature measuring device 105 is inserted into insertion hole 41e2, and temperature measuring device 106 is inserted into insertion hole 41e3.

[0233] In the through-hole 41d, the heat pipe 7Z, and the abutment portions 80b, 81b, 90b, and 91b, the components with the same numbered symbols for differentiation correspond to each other. That is, for example, the through-hole 41d1 corresponds to the heat pipe 7Z1, and the heat pipe 7Z1 is inserted into the through-hole 41d1. The abutment portions 80b1 and 81b1 correspond to the first end 7Za1 and can abut against the first end 7Za1. The abutment portions 90b1 and 91b1 correspond to the second end 7Zb1 and can abut against the second end 7Zb1.

[0234] Operation of the pressurization device (second embodiment)

[0235] Next, the operation of this device 1Z will be explained as follows. In the following explanation, please refer to the relevant references as appropriate. Figure 8 , Figure 9 as well as Figures 21-24 In this device 1Z, before the workpiece W is loaded, the heating mold unit 40Z is in the processing position and the cooling mold unit 41Z is in the retracted position.

[0236] First, the mounting plate 3, on which the workpiece W is placed, is placed on the cooling mold unit 41Z. Next, the first unit conveying device 42 conveys the heating mold unit 40Z to the standby position and the cooling mold unit 41Z to the processing position. At this time, the first heat source unit 8 and the second heat source unit 9 are not in contact with the heat pipe 7Z.

[0237] Next, as in the first embodiment, the workpiece W is housed in the chamber unit CU.

[0238] Next, the control device 2 raises the chamber unit CU, moves the heating mold unit 40Z to the processing position, and moves the cooling mold unit 41Z to the standby position. At this time, the first end 7a of the heat pipe 7 is located between the first clamping member 80 and the first clamping member 81, and the second end 7b is located between the second clamping member 90 and the second clamping member 91. The heating mold unit 40Z is preheated to a predetermined temperature "T1".

[0239] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body 40Za. At this time, the control device 2 changes the set temperature of the heating mold unit 40 to "T2". In addition, the control device 2 lowers the base component 12 to apply formal pressure to the workpiece W. Then, when the workpiece W is heated to the predetermined temperature "T3", the first heat source moving mechanism 84 moves the first clamping components 80 and 81 to the clamping position.

[0240] Figure 25 This is a schematic cross-sectional view of the device 1Z showing the state in which the first clamping components 80 and 81 have moved to the clamping position.

[0241] Next, the first heat source moving mechanism 84 switches between contacting the first end 7a and separating from it, based on the temperature measurement result from the temperature measuring device 10, so that the workpiece W is subjected to a predetermined temperature curve Pr1 (see reference). Figure 10 (The same applies below) Heating. As a result, the rate of temperature change of the workpiece W during heating varies along the temperature curve Pr1.

[0242] Next, when the temperature of the heating mold unit 40 drops to temperature "T2", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the non-clamping position. As a result, the temperature of the main body 6, the heat pipe 7, and the workpiece W is maintained at the temperature of the heating mold unit 40, i.e., temperature "T2".

[0243] Next, after a predetermined time, the control device 2 ends the pressurization of the workpiece W. Then, the control device 2 raises the chamber unit CU, separating the mounting plate 3 from the main body 40Za. Next, the first unit conveying device 42 moves the heating mold unit 40Z to the standby position and the cooling mold unit 41Z to the processing position. At this time, the first end 7Za of the heat pipe 7Z is located between the first clamping member 80 and the first clamping member 81, and the second end 7Zb is located between the second clamping member 90 and the second clamping member 91. Here, the cooling unit 50 is pre-cooled to a predetermined temperature "T4".

[0244] Next, the control device 2 lowers the chamber unit CU until the mounting plate 3 abuts against the main body 6. Then, when the main body 6 is heated to a predetermined temperature "T5", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the clamping position. Next, when the workpiece W is cooled to a predetermined temperature "T6", the first heat source moving mechanism 84 moves the first clamping members 80 and 81 to the non-clamping position. Then, similarly to the first embodiment, the control device 2 removes the workpiece W from the chamber unit CU.

[0245] Summary (Second Implementation)

[0246] According to the embodiments described above, the device 1Z includes a mold unit 4Z. The area in the mold unit 4Z that functions as the second mold unit 5 in the first embodiment is positioned between the area of ​​the first mold unit 4 in the first embodiment and the workpiece W (carrying plate 3). The mold unit 4Z includes main bodies 40Za and 41Za, multiple heat pipes 7 and 7Z, a first heat source unit 8, and a second heat source unit 9. The first heat source unit 8 includes multiple contact portions 80b and 81b and a first heat source moving mechanism 84. The second heat source unit 9 includes multiple contact portions 90b and 91b and a second heat source moving mechanism 94. The first heat source moving mechanism 84 switches between contact portions 80b and 81b abutting against the first end 7a and separating from the first end 7a. The second heat source moving mechanism 94 switches between contact portions 90b and 91b abutting against the second end 7Zb and separating from the second end 7Zb. According to this structure, similar to the first embodiment, this device 1Z can perform complex temperature control on the workpiece W, and can control the rate of temperature change of the workpiece W during heating and cooling according to the purpose.

[0247] Furthermore, according to the embodiment described above, the mold unit 4Z includes a temperature measuring device 10. The first heat source moving mechanism 84 and the second heat source moving mechanism 94, based on the temperature measurement results from the temperature measuring device 10, control the contact portions 80b and 81b to contact with and separate from the first end 7a, and control the contact portions 90b and 91b to contact with and separate from the second end 7Zb. According to this structure, similar to the first embodiment, the temperature control accuracy of the workpiece W is improved.

[0248] Furthermore, according to the embodiment described above, the first heat source moving mechanism 84 controls the contact portions 80b and 81b to abut against and separate from the first end 7a, so that the workpiece W is heated according to the temperature curve Pr1. Based on this structure, the device 1Z can control the rate of temperature change and heating time of the workpiece W during heating according to the temperature curve Pr1.

[0249] Furthermore, according to the embodiment described above, the second heat source moving mechanism 94 controls the contact portions 90b and 91b to abut against and separate from the second end portion 7Zb, so that the workpiece W is cooled according to the temperature curve Pr2. Based on this structure, the device 1Z can control the rate of temperature change and cooling time of the workpiece W during cooling according to the temperature curve Pr2.

[0250] Furthermore, according to the embodiments described above, similar to the first embodiment, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 function as unit switching units in this invention. Based on this structure, the device 1Z can further control the temperature change rate and heating / cooling time of the workpiece W during heating / cooling.

[0251] Furthermore, according to the embodiment described above, the mold unit 4Z includes a first heat source unit 8 corresponding to the first end 7a and a second heat source unit 9 corresponding to the second end 7Zb. The first heat source unit 8 is a cooling unit, and the second heat source unit 9 is a heating unit. According to this structure, the device 1Z, like the first embodiment, is able to control the temperature change rate and heating / cooling time of the workpiece W during heating / cooling.

[0252] Furthermore, according to the embodiments described above, the first heat source moving mechanism 84 causes the plurality of abutting portions 80b and 81b to abut against or move away from the corresponding first end 7a. The second heat source moving mechanism 94 causes the plurality of abutting portions 90b and 91b to abut against or move away from the corresponding second end 7Zb. With this structure, the structures of the first clamping members 80 and 81 and the second clamping members 90 and 91 can be simplified. Additionally, the heat capacity of the first clamping members 80 and 81 and the second clamping members 90 and 91 becomes relatively large.

[0253] Furthermore, in the embodiments described above, the heating mold unit 40Z includes a plurality of heating sources 40c fixed to the main body 40Za, and the cooling mold unit 41Z includes a plurality of cooling sources 41b fixed to the main body 41Za. The heat pipe 7 is positioned above the heating sources 40c, and the heat pipe 7Z is positioned above the cooling sources 41b. In the vertical direction, the area in the main body 40Za where the heating sources 40c are located functions as the first mold unit 4 of the first embodiment, and the area where the heat pipe 7 is located functions as the second mold unit 5 of the first embodiment. In the vertical direction, the area in the main body 41Za where the cooling sources 41b are located functions as the first mold unit 4 of the first embodiment, and the area where the heat pipe 7Z is located functions as the second mold unit 5 of the first embodiment. In this structure, as in the first embodiment, the movement of the second mold unit 5 is unnecessary, and the device 1Z can be miniaturized compared to the device 1 of the first embodiment.

[0254] Furthermore, according to the embodiment described above, when viewed from above, heat pipe 7 is arranged parallel to each other in a manner orthogonal to heating source 40c, and heat pipe 7Z is arranged parallel to each other in a manner orthogonal to cooling source 41b. With this structure, the temperature uniformity of the main body 6 is improved when heat pipes 7 and 7Z are not heated or cooled by the first heat source unit 8 or the second heat source unit 9.

[0255] It should be noted that in the second embodiment, the heating mold unit 40Z may not have a heat pipe 7, or the cooling mold unit 41Z may not have a heat pipe 7Z.

[0256] Alternatively, in the second embodiment, the heating mold unit 40Z may also include a main body 40a and a main body 6, and the cooling mold unit 41Z may also include a main body 41a and a main body 6. In this case, the main body 6 is fixed to the main bodies 40a and 41a, respectively. In this structure, the maintainability of the heating mold unit 40Z and the cooling mold unit 41Z is improved.

[0257] Variations

[0258] Next, focusing on the parts that differ from the first embodiment, variations of this device will be described below. In the following description of the variations, for ease of explanation, elements identical to those in the first embodiment and elements having common functions will be labeled with the same reference numerals as in the first embodiment, and their descriptions will be omitted. Each variation can also be applied to the second embodiment. In the following description, appropriate reference will be made to… Figures 1-5 .

[0259] Example 1

[0260] Figure 26 This is a schematic cross-sectional view of the device, showing a first modified example of the device.

[0261] In the first variation, the second mold unit 5 includes a main body 6, multiple heat pipes 7, a first heat source unit 8, a second heat source unit 9, multiple temperature measuring instruments 10, a second unit conveying device 11, and a unit switching device 21. The unit switching device 21 is an example of a unit switching part in this invention.

[0262] In the first variation, the second heat source unit 9 also corresponds to the first end 7a. That is, when the heat pipe 7 is heated, the second clamping members 90 and 91 abut against the first end 7a of the heat pipe 7, transferring heat from the second heat sources 92 and 93 to the heat pipe 7.

[0263] The unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 for the first end 7a. Specifically, when the heat pipe 7 is heated, the unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 so that the contact portions 80b, 81b or 90b, 91b can abut against the corresponding first end 7a. Similarly, when the heat pipe 7 is cooled, the unit switching device 21 switches between the first heat source unit 8 and the second heat source unit 9 so that the contact portions 80b, 81b or 90b, 91b can abut against the corresponding first end 7a. In this structure, the same effects as in the first embodiment can be obtained.

[0264] It should be noted that in the first modified example, the second end 7b may not protrude from the main body 6, as in the second modified example described later.

[0265] In addition, in the first modified example, the second mold unit 5 may also include a first heat source unit 8, a second heat source unit 9, and a unit switching device 21 corresponding to the second end 7b.

[0266] Modifications 2 through 4

[0267] Figure 27 (a) is a schematic top view of the second mold unit, showing a second variation of the device. Figure 27 (b) is a schematic top view of the second mold unit, showing a third variation of the device. Figure 27 (c) is a schematic top view of the second mold unit, showing the fourth variation of this device.

[0268] In the second to fourth modifications, the configuration and / or number of heat pipes 7 differ from those in the first embodiment.

[0269] like Figure 27 As shown in (a), in the second variation, only the first end 7a of the heat pipe 7 protrudes from the main body 6, while the second end 7b is disposed inside the main body 6. Furthermore, the second mold unit 5 does not have a second heat source unit 9. In this structure, when the first end 7a is heated, the second end 7b is not exposed to the atmosphere. Therefore, the second end 7b does not function like a heat sink, and the temperature of the end of the main body 6 in the X direction is not easily reduced.

[0270] It should be noted that in the second variation, the first heat source 82 can be a heating source, and the first heat source 83 can be a cooling source. In this case, when the first heat source 82 is turned on, the first heat source 83 is turned off, and when the first heat source 83 is turned on, the first heat source 82 is turned off. This on / off switching is controlled, for example, by the control device 2. That is, the control device 2 can function as a heat source switching unit in this invention. In this structure, the device 1 can heat and cool the heat pipe 7 using a first heat source unit 8. In this case, in other words, the first heat source unit 8 functions as a heating unit and a cooling unit, and also functions as a unit switching unit in this invention.

[0271] like Figure 27 As shown in (b), in the third modification, the first ends 7a2, 7a4, and 7a6 of half of the heat pipes 72, 74, and 76 protrude from the main body 6 in the +X direction, and the second ends 7b2, 7b4, and 7b6 are disposed inside the main body 6. Similarly, the second ends 7b1, 7b3, and 7b5 of half of the heat pipes 71, 73, and 75 protrude from the main body 6 in the -X direction, and the first ends 7a1, 7a3, and 7a5 are disposed inside the main body 6.

[0272] like Figure 27As shown in (c), in the fourth variation, the second mold unit 5 includes eight heat pipes 71 to 78. In the Y-axis direction, heat pipes 71 to 78 are arranged sequentially from the +Y direction. The interval between heat pipes 71 and 72 is the same as the interval between heat pipes 77 and 78, and smaller than the interval between heat pipes 72 and 73. Heat pipes 73 to 76 are arranged at equal intervals, with a greater interval than that between heat pipes 72 and 73. That is, in the Y-axis direction, the interval between adjacent heat pipes 71 and 78 narrows (uneven interval) as it approaches the end of the main body 6. In this structure, by concentrating the heat pipes 7 at the end of the main body 6 where the temperature is prone to drop, the temperature drop at that end can be suppressed.

[0273] 5th variation

[0274] Figure 28 (a) is a schematic top view of the second mold unit 5, showing the fifth variation of this device. Figure 28 (b) is Figure 28 A schematic diagram of the first heat source unit 8 in the G direction of (a).

[0275] In this figure, for ease of explanation, the first region A11 and the third region A13, which will be described later, are represented by shaded lines, and the second region A12 is represented by gray.

[0276] like Figure 28As shown, in the fifth modification, the first heat source unit 8 is physically divided into three parts: part 8A, which has contact portions 80b1 and 81b1; part 8B, which has contact portions 80b2 to 80b5 and 81b2 to 81b5; and part 8C, which has contact portions 80b6 and 81b6. Parts 8A, 8B, and 8C can operate independently. The first heat source moving mechanism 84 switches between contact and separation of parts 8A, 8B, and 8C at different / same times. That is, contact portions 80b1, 80b6, 81b1, and 81b6 can move independently of contact portions 80b2 to 80b5 and 81b2 to 81b5. When viewed from above and below, the area in the main body 6 where the heat pipe 71 is disposed is the first area A11, the area where the heat pipes 72 to 75 are disposed is the second area A12, and the area where the heat pipe 76 is disposed is the third area A13. The second mold unit 5 is equipped with five temperature measuring devices 101 to 105. Temperature measuring device 104 is disposed at the end of the main body 6 on the +Y direction side, and temperature measuring device 105 is disposed at the end of the main body 6 on the -Y direction side. Heat pipe 71 (76) is an example of the first heat pipe in the present invention, and heat pipes 72 to 75 are examples of the second heat pipe in the present invention. Abutment portions 80b1, 80b6, 81b1, and 81b6 are examples of the first abutment portions in the present invention, and abutment portions 80b2 to 80b5 and 81b2 to 81b5 are examples of the second abutment portions in the present invention. In this structure, different temperature controls and the same temperature controls can be performed in the first region A11, the second region A12, and the third region A13.

[0277] It should be noted that in the fifth variation, the number of physically divided parts in the first heat source unit 8 is not limited to "3". That is, for example, the first heat source unit 8 can also be divided into heat pipes 71 to 76 one by one. In this case, the parts corresponding to heat pipes 71, 73, and 75 can function as heating units, and the parts corresponding to heat pipes 72, 74, and 76 can function as cooling units.

[0278] In addition, in the fifth variation, part 2, 8B, can also function as a cooling unit.

[0279] Other implementation methods

[0280] It should be noted that, in various embodiments, the devices 1 and 1Z may not include the heating mold units 40 and 40Z or the cooling mold units 41 and 41Z, as well as the first unit conveying device 42. In this case, the chamber unit CU in the device 1 may not move in the vertical direction.

[0281] In addition, in the first embodiment, the second mold unit 5 may also be used only when the workpiece W is heated or cooled.

[0282] Furthermore, in each embodiment, the first heat source unit 8 can also be a heating unit, and the second heat source unit 9 can also be a cooling unit.

[0283] Furthermore, in various embodiments, both the first heat source unit 8 and the second heat source unit 9 may be heating units or cooling units.

[0284] Furthermore, in each embodiment, the number of heat pipes 7 and 7Z is not limited to "6". In this case, the number of through holes 6c, 40f, and 41d is set according to the number of heat pipes 7 and 7Z.

[0285] Furthermore, in each embodiment, the direction along which the heat pipe 7 is positioned is not limited to the X-axis direction, as long as the heat pipe 7 is arranged parallel to the horizontal direction. That is, for example, the heat pipe 7 can also be arranged along the Y-axis direction. In this case, when viewed from above, the heat pipe 7 is arranged parallel to the heating source 40c and the cooling source 41b. In this structure, when the heat pipe 7 is not heated or cooled by the first heat source unit 8 or the second heat source unit 9, the temperature uniformity of the main body 6 is improved.

[0286] Furthermore, in various embodiments, the heat pipes 7 may not be arranged at equal intervals. That is, for example, as in the fourth variation, the spacing of one part of the heat pipes 7 may be different from the spacing of another part. In addition, for example, when viewed from above, the heat pipes 7 may be concentrated at the position where the workpiece W is placed.

[0287] Furthermore, in various embodiments, the method by which the first heat source unit 8 and the second heat source unit 9 abut against the heat pipes 7 and 7Z is not limited to a clamping method. That is, for example, the first heat source unit 8 and the second heat source unit 9 may also have insertion holes for inserting (embedding) the first end 7a or the second end 7b. In this case, the first heat source moving mechanism 84 and the second heat source moving mechanism 94 are configured to move the insertion hole relative to the first end 7a or the second end 7b. The insertion hole functions as the abutment portion in this invention. Alternatively, for example, only the first clamping member 80 or the first clamping member 81 may abut against the heat pipe 7. In this case, the first heat source unit 8 may also have only one of the first clamping member 80 and the first clamping member 81. The same applies to the second heat source unit 9.

[0288] Furthermore, in various embodiments, devices 1 and 1Z may not include a temperature measuring device 10. In this structure, as long as the temperature change of the workpiece W is known, devices 1 and 1Z can perform temperature control (temperature gradient control) corresponding to the workpiece W.

[0289] Furthermore, in each embodiment, the number of temperature measuring devices 10 is not limited to "3" or "6". In this case, the number of insertion holes 6d, 40g, and 41e is set according to the number of temperature measuring devices 10.

[0290] Furthermore, in various embodiments, the temperature measuring device 10 is not limited to a thermocouple.

[0291] Furthermore, in various embodiments, the storage unit may not store temperature curves Pr1 and Pr2. That is, the first heat source moving mechanism 84 may not switch between contact and separation of the contact portions 80b and 81b relative to the first end 7a to heat the workpiece W according to temperature curve Pr1. The same applies to the second heat source moving mechanism 94.

[0292] Furthermore, in each embodiment, the storage unit may also store temperature curves different from temperature curves Pr1 and Pr2.

[0293] Furthermore, in various embodiments, the heating mold units 40, 40Z and the cooling mold units 41, 41Z can also be conveyed along the X-axis direction.

[0294] Furthermore, in the first embodiment, the main body 6 may also be transported along the X-axis direction.

[0295] Embodiments of the present invention

[0296] Next, referring to the terms and reference numerals described in each embodiment, embodiments of the present invention as understood according to the embodiments described above will be described below.

[0297] A first embodiment of the present invention is a pressurizing device (e.g., pressurizing device 1, 1Z) that pressurizes a workpiece (e.g., workpiece W), wherein the pressurizing device comprises: a first mold unit (e.g., first mold unit 4, mold unit 4Z) disposed below the workpiece and capable of heating or cooling the workpiece; and a second mold unit (e.g., second mold unit 5, mold unit 4Z) capable of heating or cooling the workpiece together with the first mold unit, the second mold unit comprising: a plurality of heat pipes (e.g., heat pipes 7, 7Z); and a mold body portion (e.g., body portion 6, body portion 40Za, 41Za) for fixing the plurality of heat pipes, wherein the mold body portion is disposed when the workpiece is heated or cooled. The workpiece is positioned between the workpiece and the first mold unit; and a heat source unit (e.g., first heat source unit 8, second heat source unit 9) capable of heating or cooling a corresponding heat pipe among a plurality of heat pipes, each heat pipe having a protruding end (e.g., first end 7a, second end 7b) protruding horizontally from the mold body portion, the heat source unit comprising: a plurality of abutting portions (e.g., abutting portions 80b, 81b, 90b, 91b) movable relative to each of the protruding ends and capable of abutting the corresponding protruding end; and an abutting switching portion (e.g., first heat source moving mechanism 84, second heat source moving mechanism 94) that switches between the abutting portion abutting the protruding end and separating from the protruding end.

[0298] Based on this structure, complex temperature control of the workpiece is possible, and the rate of temperature change during heating and cooling of the workpiece can be controlled according to the purpose.

[0299] The second embodiment of the present invention is based on the first embodiment, wherein the second mold unit is equipped with a temperature measuring device (e.g., temperature measuring device 10) capable of measuring the temperature of the mold body, and the contact switching unit switches between contact and separation of the contact unit according to the measurement result of the temperature measuring device.

[0300] Based on this structure, the temperature control accuracy of the workpiece can be improved.

[0301] The third embodiment of the present invention is based on the second embodiment, wherein the first mold unit includes a heating mold unit (e.g., heating mold unit 40, 40Z) for heating the workpiece, the heat source unit includes a cooling source (e.g., first heat source 82, 83) for cooling the heat pipe or a heating source (e.g., second heat source 92, 93) for heating the heat pipe, and the abutment switching part switches between abutment and separation of the abutment part so that the workpiece is heated according to a predetermined temperature curve (e.g., temperature curve Pr1).

[0302] Based on this structure, the rate of temperature change and heating time during workpiece heating can be controlled according to the temperature curve.

[0303] The fourth embodiment of the present invention is based on the second embodiment, wherein the first mold unit includes a cooling mold unit (e.g., cooling mold units 41, 41Z) for cooling the workpiece, the heat source unit includes a cooling source for cooling the heat pipe or a heating source for heating the heat pipe, and the contact switching part switches between contact and separation of the contact part so that the workpiece is cooled according to a predetermined temperature curve (e.g., temperature curve Pr2).

[0304] Based on this structure, the temperature change rate and cooling time of the workpiece during cooling can be controlled according to the temperature curve.

[0305] The fifth embodiment of the present invention is based on the second embodiment, wherein the first mold unit includes a heating mold unit for heating the workpiece or a cooling mold unit for cooling the workpiece, and the heat source unit includes: a heating source (e.g., a first heat source 82, a second heat source 92) for heating the heat pipe; a cooling source (e.g., a first heat source 83, a second heat source 93) for cooling the heat pipe; and a heat source switching unit (e.g., a first heat source moving mechanism 84, a second heat source switching mechanism 94) for switching between the heating source and the cooling source. The heat source switching unit switches between the heating source and the cooling source so that the workpiece is heated or cooled according to a predetermined temperature curve.

[0306] According to this structure, the device can use a first heat source unit to heat and cool the heat pipe.

[0307] The sixth embodiment of the present invention is based on the first embodiment, wherein the heat source unit includes: a heating unit (e.g., a second heat source unit 9) that heats the corresponding heat pipe; a cooling unit (e.g., a first heat source unit 8) that cools the corresponding heat pipe; and a unit switching unit (e.g., a unit switching device 21) that switches between the heating unit and the cooling unit. When the heat pipe is heated, the unit switching unit switches between the heating unit and the cooling unit so that the abutting portion of the heating unit can abut against the corresponding protruding end. When the heat pipe is cooled, the unit switching unit switches between the heating unit and the cooling unit so that the abutting portion of the cooling unit can abut against the corresponding protruding end.

[0308] Based on this structure, the device can control the rate of temperature change and the heating / cooling time of the workpiece during heating / cooling.

[0309] The seventh embodiment of the present invention is based on the first embodiment, wherein each heat pipe includes: a first protruding end (e.g., first end 7a) that protrudes from the mold body in a first horizontal direction (e.g., +X direction) and functions as the protruding end; and a second protruding end (e.g., second end 7b) that protrudes from the mold body in a second direction opposite to the first direction (e.g., -X direction) and functions as the protruding end. The heat source unit includes: a first heat source unit (e.g., first heat source unit 8) corresponding to the first protruding end; and a second heat source unit (e.g., second heat source unit 9) corresponding to the second protruding end. The first heat source unit is a heating unit for heating the corresponding heat pipe or a cooling unit for cooling the corresponding heat pipe, and the second heat source unit is either the heating unit or the cooling unit.

[0310] Based on this structure, the device can further control the temperature gradient and heating / cooling time during workpiece heating / cooling.

[0311] The eighth embodiment of the present invention is based on any one of the first to seventh embodiments, wherein the heat source unit includes a heat source main body (e.g., a first clamping member 80, 81, a second clamping member 90, 91) for arranging a plurality of the abutting parts, and the abutting switching part moves the heat source main body, thereby causing the plurality of abutting parts to abut against the protruding end together, or to move away from the protruding end together.

[0312] This structure simplifies the structure of the first clamping component and the second clamping component.

[0313] The ninth embodiment of the present invention is based on any one of the first to seventh embodiments, wherein the plurality of heat pipes include a first heat pipe (e.g., heat pipe 71) and a second heat pipe (e.g., heat pipes 72 to 75), and the plurality of abutting portions include: a first abutting portion (e.g., abutting portions 80b1, 80b6, 81b1, 81b6) corresponding to the protruding ends (e.g., first ends 7a1, 7a6) of the first heat pipe; and a second abutting portion (e.g., abutting portions 80b2 to 80b5, 81b2 to 81b5) corresponding to the protruding ends (e.g., first ends 7a2 to 7a5) of the second heat pipe, wherein the first abutting portion and the second abutting portion are each movable independently.

[0314] Based on this structure, different temperature controls can be implemented in the first heat pipe and the second heat pipe.

[0315] The tenth embodiment of the present invention is based on the ninth embodiment, wherein, when viewed from the top and bottom, the mold body has a first region (e.g., first region A11) and a second region (e.g., second region A12) that performs temperature control different from that of the first region, the first heat pipe is disposed in the first region, the second heat pipe is disposed in the second region, and the contact switching part switches between contact and separation of the first contact part and the second contact part at different times.

[0316] Based on this structure, different temperature controls can be implemented in the first and second zones.

[0317] The 11th embodiment of the present invention is based on the first embodiment, wherein the first mold unit (e.g., heating mold unit 40Z, cooling mold unit 41Z) includes a plurality of first heating sources (e.g., heating source 40c) or a plurality of first cooling sources (e.g., cooling source 41b) fixed to the mold body, and a plurality of heat pipes (e.g., heat pipes 7, 7Z) are arranged above the plurality of first heating sources or the plurality of first cooling sources. In the vertical direction, the area in the mold body in which the plurality of first heating sources or the plurality of first cooling sources are arranged functions as the first mold unit, and in the vertical direction, the area in the mold body in which the plurality of heat pipes are arranged functions as the second mold unit.

[0318] Based on this structure, complex temperature control of the workpiece is possible, and the rate of temperature change of the workpiece W during heating and cooling can be controlled according to the purpose.

[0319] The 12th embodiment of the present invention is based on the 1st embodiment, wherein the second mold unit (e.g., the second mold unit 5) is separate from the first mold unit (e.g., the first mold unit 4), and the mold body is movable relative to the first mold unit in the horizontal direction. When the workpiece is not heated or cooled, the mold body moves relative to the processing position above the first mold unit to a standby position that is horizontally separated from the processing position.

[0320] Based on this structure, this device can control the rate of temperature change and the heating / cooling time of the workpiece by selecting whether to use the second mold unit.

[0321] The 13th embodiment of the present invention is based on the 1st embodiment, wherein the first mold unit has a plurality of first heating sources (e.g., heating source 40c) or a plurality of first cooling sources (e.g., cooling source 41b), the first heating sources or the first cooling sources are linear in shape, the plurality of first heating sources are arranged parallel to each other, or the plurality of first cooling sources are arranged parallel to each other, and when viewed from the top and bottom directions, the plurality of heat pipes are arranged parallel to each other in a manner that is orthogonal to or parallel to the first heating sources or the first cooling sources.

[0322] According to this structure, the temperature uniformity of the main body is improved when the heat pipe is not heated or cooled by the first heat source unit or the second heat source unit.

Claims

1. A pressurizing device for pressurizing a workpiece, wherein, The pressurizing device has: The first mold unit, positioned below the workpiece, is capable of heating or cooling the workpiece; and The second mold unit is capable of heating or cooling the workpiece together with the first mold unit. The second mold unit includes: Multiple heat pipes; The mold body is used to fix multiple heat pipes. When the workpiece is being heated or cooled, the mold body is disposed between the workpiece and the first mold unit. as well as A heat source unit capable of heating or cooling a corresponding heat pipe among the plurality of heat pipes. Each of the heat pipes has a protruding end that extends horizontally from the main body of the mold. The heat source unit includes: Multiple abutment portions, which are movable relative to each of the protruding ends and capable of abutting against the corresponding protruding ends; and The abutment switching part switches between abutting against the protruding end and separating from the protruding end. The abutment switching part abuts against the protruding end when the second mold unit starts heating or cooling the workpiece, and separates the abutment part from the protruding end when the second mold unit stops heating or cooling the workpiece. Switching between contact and separation at the contact portion allows the workpiece to be heated or cooled according to a predetermined temperature profile.

2. The pressurizing device according to claim 1, wherein, The second mold unit is equipped with a temperature measuring device capable of measuring the temperature of the mold body. The contact switching unit switches between contact and separation based on the measurement results of the temperature measuring device.

3. The pressurizing device according to claim 2, wherein, The first mold unit includes a heating mold unit for heating the workpiece. The heat source unit includes a cooling source for cooling the heat pipe or a heating source for heating the heat pipe. The contact switching section switches between contact and separation at the contact section so that the workpiece is heated according to a predetermined temperature curve.

4. The pressurizing device according to claim 2, wherein, The first mold unit includes a cooling mold unit for cooling the workpiece. The heat source unit includes a cooling source for cooling the heat pipe or a heating source for heating the heat pipe. The contact switching section switches between contact and separation at the contact section so that the workpiece is cooled according to a predetermined temperature curve.

5. The pressurizing device according to claim 2, wherein, The first mold unit includes a heating mold unit for heating the workpiece or a cooling mold unit for cooling the workpiece. The heat source unit includes: A heating source that heats the heat pipe; Cooling source that cools the heat pipe; and A heat source switching unit that switches between the heating source and the cooling source. The heat source switching unit switches between the heating source and the cooling source so that the workpiece is heated or cooled according to a specified temperature curve.

6. The pressurizing device according to claim 1, wherein, The heat source unit includes: A heating unit that heats the corresponding heat pipe; Cooling unit, which cools the corresponding heat pipe; and The unit switching unit switches between the heating unit and the cooling unit. When the heat pipe is heated, the unit switching unit switches between the heating unit and the cooling unit so that the contact portion of the heating unit can abut against the corresponding protruding end. When the heat pipe is cooled, the unit switching unit switches between the heating unit and the cooling unit so that the abutting part of the cooling unit can abut against the corresponding protruding end.

7. The pressurizing device according to claim 1, wherein, The protruding end has: The first protruding end protrudes from the mold body in a first horizontal direction; and The second protruding end protrudes from the main body of the mold in the opposite direction to the first direction, namely the second direction. The heat source unit includes: A first heat source unit, which corresponds to the first protruding end; and The second heat source unit corresponds to the second protruding end. The first heat source unit is either a heating unit that heats the corresponding heat pipe or a cooling unit that cools the corresponding heat pipe. The second heat source unit is either the heating unit or the cooling unit.

8. The pressurizing device according to any one of claims 1 to 7, wherein, The heat source unit includes a heat source main body for arranging multiple abutment portions. The abutment switching part moves the heat source body part, thereby causing the plurality of abutment parts to abut against the protruding end together, or to move away from the protruding end together.

9. The pressurizing device according to any one of claims 1 to 7, wherein, The plurality of heat pipes include a first heat pipe and a second heat pipe. The plurality of said abutment portions include: The first abutment portion corresponds to the protruding end of the first heat pipe; and The second abutment portion corresponds to the protruding end of the second heat pipe. The first abutment and the second abutment can each move independently.

10. The pressurizing device according to claim 9, wherein, When viewed from above and below, the main body of the mold has: Area 1; and The second zone implements different temperature control than the first zone. The first heat pipe is disposed in the first region. The second heat pipe is disposed in the second region. The contact switching unit switches between contact and separation at different times for each of the first contact part and the second contact part.

11. The pressurizing device according to claim 1, wherein, The first mold unit includes a plurality of first heating sources or a plurality of first cooling sources fixed to the mold body. The plurality of heat pipes are positioned above the plurality of first heating sources or the plurality of first cooling sources. In the vertical direction, the area within the mold body that is configured with multiple first heating sources or multiple first cooling sources functions as the first mold unit. In the vertical direction, the area in the main body of the mold where multiple heat pipes are arranged functions as the second mold unit.

12. The pressurizing device according to claim 1, wherein, The second mold unit is separate from the first mold unit. The main body of the mold can move relative to the first mold unit in the horizontal direction. When the workpiece is not heated or cooled, The main body of the mold moves relative to the processing position above the first mold unit towards a standby position that is horizontally separated from the processing position.

13. The pressurizing device according to claim 1, wherein, The first mold unit has multiple first heating sources or multiple first cooling sources. The first heating source or the first cooling source is linear in shape. The plurality of the first heating sources are arranged in parallel with each other, or the plurality of the first cooling sources are arranged in parallel with each other. When viewed from above, the plurality of heat pipes are arranged parallel to each other in a manner that is orthogonal to or parallel to the first heating source or the first cooling source.

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